WO2018234192A1 - Système et procédé pour usiner une surface - Google Patents

Système et procédé pour usiner une surface Download PDF

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Publication number
WO2018234192A1
WO2018234192A1 PCT/EP2018/065985 EP2018065985W WO2018234192A1 WO 2018234192 A1 WO2018234192 A1 WO 2018234192A1 EP 2018065985 W EP2018065985 W EP 2018065985W WO 2018234192 A1 WO2018234192 A1 WO 2018234192A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
workpiece
generating device
laser radiation
khz
Prior art date
Application number
PCT/EP2018/065985
Other languages
German (de)
English (en)
Inventor
Günter Flachenecker
Wolfgang Schade
Thomas Gimpel
Christoph GERHARD
Wolfgang Viöl
Daniel Tasche
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
HAWK Hochschule für angewandte Wissenschaft und Kunst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., HAWK Hochschule für angewandte Wissenschaft und Kunst filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority to DE112018003114.4T priority Critical patent/DE112018003114A5/de
Publication of WO2018234192A1 publication Critical patent/WO2018234192A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1423—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
    • B23K26/348—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding in combination with arc heating, e.g. TIG [tungsten inert gas], MIG [metal inert gas] or plasma welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Definitions

  • the invention relates to an apparatus for processing a surface of a workpiece with a Plasmaer ⁇ generating means and a laser beam generating means which are adapted to at least act on a partial area of the surface of the workpiece to laser radiation and plasma. Furthermore, the concerns
  • Invention a method for machining a surface of a workpiece with such a device.
  • laser radiation to the material ⁇ removal and for processing the surface of a work piece ⁇ .
  • continuous wave lasers or pulsed laser radiation with a pulse duration of a few nanoseconds or more are generally used.
  • the effect of laser radiation is usually due to the fact that the upper ⁇ surface is heated locally at the point of incidence of the laser radiation and evaporation of the material of the workpiece thereby.
  • comparatively powerful lasers with output powers of a few watts to a few kilowatts are required.
  • This laser radiation has the advantage that the material removal is not based on thermal effects. Rather, the energy input from the laser radiation is stopped before a noticeable heating of the surface of the workpiece occurs. This can damage the surrounding crystal structure can be avoided, so that the surface quality of the machined workpiece can be improved.
  • the invention is therefore based on the object of specifying a method and a device for material processing, which on the one hand avoids thermal damage to the workpiece to be machined and on the other hand enables rapid processing.
  • a device for processing a surface of a workpiece which combines pulsed laser radiation with the action of a plasma.
  • the removal rate of very short laser pulses can be considerably increased if the surface is exposed to a plasma before, during or after the action of the laser radiation.
  • the workpiece may be any material that Contain or consist of alloy.
  • the workpiece may be any material that Contain or consist of alloy.
  • the workpiece may be any material that Contain or consist of alloy.
  • the workpiece may be any material that Contain or consist of alloy.
  • the workpiece may be any material that Contain or consist of alloy.
  • the workpiece may be any material that Contain or consist of alloy.
  • the workpiece may be any material
  • the workpiece may contain or consist of an insulator or a dielectric, for example glass, ceramic or plastic.
  • the workpiece can be homogeneous be constructed, so consist of a material, or have a coating which is processed by the proposed method.
  • the workpiece can be monocrystalline. In other embodiments of the invention, the workpiece may be polycrystalline or amorphous.
  • Machining the surface of the workpiece may be to remove material from the surface. This can be full-surface
  • the surface can be prepared for subsequent processing steps,
  • a microstructured elec ⁇ tronic or mechanical or electromechanical By a removal of material with the inventive method from a semi-finished
  • Such a micromechanical and / or microelectronic component can be used for example for energy generation, energy storage, as a sensor for pressure or acceleration or in microfluidics (lab-on-chip) or in micro-optics.
  • a laser beam generating device for material removal, which is set up to emit pulsed laser radiation having a pulse length of less than about 100 fs.
  • a laser beam generating device may, in some embodiments of the invention, include a titanium sapphire laser or a fiber laser.
  • this laser beam generating device may comprise further components, for example light-focusing or -defocussing elements or mirrors, around the beam spot to focus or to direct to a predeterminable place or part ⁇ surface of the surface of the workpiece.
  • the upper ⁇ surface quality of the machined surface with the laser beam and / or the removal rate can be increased considerably if at the same time, acts on the part surface before or after the impingement of the laser beam, a plasma.
  • the plasma is generated according to the invention with a plasma generating device, so that in one embodiment of the
  • the Invention acts directly on the surface of the workpiece.
  • the plasma may be located above the surface of the workpiece, so that the plasma does not act directly on the work ⁇ piece, but this continues to get in contact with charged particles and / or photons from the plasma.
  • the plasma may be a non-thermal plasma, ie the plasma generation device selectively heats the electron gas, so that the ion bodies of the plasma remain comparatively cold.
  • the plasma generator may include an ECR source.
  • the plasma generating device may use a dielectrically impeded discharge. In this case, the electric field is through
  • Electrode gap which, however, do not allow high currents due to the Di ⁇ electrics in the discharge gap. As a result, too high an energy input into the surface of the workpiece is avoided, which leads to a Destruction of the microstructure generated by the laser radiation could result.
  • the laser beam generating device may be configured to emit pulsed laser radiation at a repetition rate of about 5 kHz to about 35 kHz, or from about 8 kHz to about 20 kHz, or from about 10 kHz to about 15 kHz.
  • pulsed laser radiation can be phase-locked coupled with a likewise pulsed plasma generating device, so that the time lead or lag of the laser ⁇ radiation and the plasma can be synchronized.
  • the laser radiation then always hits the surface at the same time relative to the plasma.
  • the laser radiation can be delivered unsynchronized to the plasma generating device. In this case, several laser pulses can interact within a plasma cycle with the surface of the workpiece.
  • the laser radiation may hit the surface in time after the plasma.
  • the plasma can excite the surface of the workpiece and / or remove loosely adhering particles or adsorbates, whereupon the laser radiation strikes the correspondingly excited or cleaned or otherwise prepared surface.
  • the laser radiation may impinge on the surface of the workpiece at the same time as the plasma.
  • the plasma can additionally bring about a focusing of the laser radiation, so that smaller structures can be produced.
  • the laser radiation from the surface of the workpiece removed particles directly in the
  • the laser radiation may act on the surface in time prior to the plasma. This can be done by the laser beam
  • ablated material is deposited again on the surface of the substrate and subsequently etched through the plasma, so that this is finally and permanently removed.
  • the laser radiation may have a pulse length less than about 80 fs or less than about 50 fs or less than about 40 fs
  • Laser pulses of said length or duration ensure that the workpiece is not thermal
  • the laser beam generating device is configured to emit pulsed laser radiation having a pulse energy of from about 50 yy to about 250 yy, or from about 80 yy to about 150 yy, or from about 90 yy to about 120 yy.
  • pulsed laser radiation having a pulse energy of from about 50 yy to about 250 yy, or from about 80 yy to about 150 yy, or from about 90 yy to about 120 yy.
  • the plasma generating device may be configured to
  • the plasma generating device may be configured to provide a
  • the plasma generating device thus has a small space and allows the simple implementation of the method according to the invention.
  • At least one electrode of the plasma generating device may be provided with a bore through which the laser radiation of the laser beam generating device can be confocally directed to the plasma on the surface of the workpiece.
  • the plasma may contain or consist of an inert gas.
  • the working gas of the plasma may be a noble gas.
  • the working gas of the plasma may be or contain argon.
  • An inert gas may in some embodiments of the invention have the advantage of avoiding unwanted layer deposition from the plasma on the surface of the workpiece.
  • argon plasma in particular can efficiently remove unwanted adhesions from the surface by etching.
  • between about 200 and about 8000 individual pulses of laser radiation may impinge on a partial surface of the surface of the workpiece. In other embodiments of the invention, between about 400 and about 2000 individual pulses may impinge on a partial surface of the surface. This causes a larger number of single pulses of laser radiation a larger
  • the partial area irradiated by the laser radiation is determined by relative
  • Moving the workpiece and the laser beam generating ⁇ device varies. In this way, either a larger area can be edited or a
  • Structuring of the surface can be made by exposing some surfaces of the laser radiation and other surfaces of the laser radiation are not exposed to or to a greater or lesser extent.
  • the relative displacement takes place in such a way that first a first partial area is irradiated with a prescribable number of pulses and subsequently a second partial area is irradiated with a prescribable number of pulses, the second partial area partially overlapping with the first partial area ,
  • the surface areas are repeatedly run over by the laser beam, which can bring about improved surface quality and / or greater removal of material.
  • the overlap of the first sub-area and the second sub-area may be between about 30% and about 70%, or between about 45% and about 55% of the diameter of the sub-area.
  • Figure 1 is a schematic representation of a
  • FIG. 2 shows the ablation depth of a known one
  • FIG. 3 shows the ablation depth and the line width of one with a known method
  • Embodiment machined surface Embodiment machined surface.
  • FIGS. 4A and 4B show the resulting surface quality of a known machining method and the machining method according to the invention in a first exemplary embodiment in comparison.
  • FIG. 5 shows the ablation depth of a known one
  • FIGS. 6A and 6B show the resulting surface finish of the known method and of the
  • Figure 1 shows schematically an apparatus for processing a surface of a workpiece according to the present invention.
  • the device 1 contains a laser beam generating device 3 and a plasma generating device 4.
  • the laser beam 35 and the plasma 45 can act on the partial surface 25 of a surface 21 of a workpiece 2 at the same time or with a time offset. This may effect a material modification or, in some embodiments, a material removal.
  • the workpiece 2 may, for example, contain a metal or an alloy or a semiconductor material.
  • the workpiece 2 may be a be microelectronic or a micromechanical device, wherein at least some steps of its
  • the workpiece 2 is a flat plate or a wafer in the illustrated embodiment. In other execution ⁇ embodiments of the invention, the workpiece 2 can also have a different geometry. The illustrated embodiment of the workpiece 2 is therefore to be understood as exemplary only.
  • the workpiece 2 is located on a counter electrode 41, which is made of a conductive material, for example ⁇ a metal or an alloy. At least the side of the counterelectrode 41 facing the working electrode 44 is provided with a dielectric or an insulator 42. This prevents that between the working electrode 44 and the counter electrode 41, a hot arc is ignited, which causes a high energy input into the workpiece 2 and could destroy it. If the workpiece 2 contains or consists of an insulator, for example glass, ceramic or plastic, the insulator 42 may also be dispensed with in some embodiments of the invention.
  • the counter electrode 41, the optional insulator 42 and the workpiece 2 are located on a manipulator 5, with which the relative position between the laser beam generating device 3 and the plasma generating device 4 on the one hand and the workpiece 2 on the other can be changed.
  • the manipulator 5 may be at least one linear drive in some embodiments of the invention, so that the workpiece ⁇ piece 2 is displaceable in one direction.
  • two linear drives may be used to separate the face 25 in two dimensions to move on the surface 21 of the workpiece 2.
  • three linear drives or a hexapod can be used, so that in addition the focus position and / or the angle of incidence of the laser beam 35 can be varied.
  • the work piece 2 opposite a working electrode 44 is arranged.
  • this is a tapered hollow mold with an opening, so that the laser beam 35 confocally through the
  • Working electrode 44 can be directed onto the surface 21 of the workpiece 2.
  • the hollow mold may be adapted to receive a working gas 46, which subsequently flows through the working electrode 44 and is thereby flooded in the discharge gap and forms the essential constituent of the plasma 45.
  • an insulating body 43 is additionally present, which surrounds the working electrode 44 approximately concentric. In this case, that will
  • Working gas for example, a noble gas such as argon, introduced via the gas supply 46, so that the working gas flows in the gap between the working electrode 44 and the insulating body 43 and from there to the discharge gap is fed to form the plasma 45.
  • a noble gas such as argon
  • a high voltage source having a first pole 471 and a second pole 472. Each pole is connected to the working electrode 44 and the counter electrode 41.
  • the second pole 472 may be at a ground potential and the first pole 471 may supply a high voltage to the working electrode 44.
  • the voltage source in some embodiments of the invention, may generate a voltage between about 4 kV and about 15 kV, or between about 8 kV and about 14 kV, or between about 9 kV and about 12 kV.
  • the high voltage can be a
  • the repetition rate of the pulsed voltage may be between about 5 kHz and about 9 kHz, with individual high voltage pulses having a duration between about 20 ys and about 200 ys, or between about 70 ys and about 90 ys. Since the elec ⁇ tric field in the discharge gap by the ignition of a
  • Discharge filament of the plasma 45 breaks, can ignite several discharges within a high voltage pulse.
  • the effective discharge frequency of the plasma 45 may be greater than the nominally applied pulse frequency of the high voltage in a factor of approximately 3 to a factor of 6.
  • Fig. 1 shows a laser beam generating device 3 which includes, for example, a titanium sapphire laser adapted to emit laser radiation having a pulse length of less than about 100 fs or less than about 80 fs or less than about 50 fs or less about 40 fs.
  • the energy of individual pulses may be between about 50 yJ to about 250 yJ.
  • the laser beam generating device 3 may further include focusing elements 31, for example a lens with which the beam diameter of the laser radiation 35 can be reduced.
  • focusing elements 31 for example a lens with which the beam diameter of the laser radiation 35 can be reduced.
  • a lens system of a plurality of focusing and defocusing elements may also be used.
  • a reflective optical system can be considered, if this is more advantageous than the transmission optics illustrated with light ⁇ refractive elements.
  • the laser beam generating device 3 and the plasma generation direction 4 are also operated unsynchronized, so there is no fixed temporal correlation between the action of the plasma 45 and the laser radiation 35.
  • FIG. 2 shows the cross section or the ablation depth of a line which has been produced by linear displacement of the workpiece 2 in the device 1.
  • a line can be introduced into the surface 21 of the workpiece 2.
  • FIG. 2 shows in curve A the use of a short-pulse laser known per se, and in curve B the simultaneous use according to the invention of the laser with a plasma which is in a pulsed, dielectrically impeded manner
  • Discharge was generated.
  • the field strength in the discharge gap was about 1.1 kV / mm at a repetition rate of 7 kHz and a pulse duration of 80 ys.
  • the ordinate shows the ablation depth in microns, whereas on the
  • Varying the feed rate were at the local coordinate ⁇ 300 ym about 400 laser pulses to a part surface 25 applied. This corresponds to the leftmost maximum of the ablation depth. From left to right, the number of laser pulses applied to a single sub-area 25 decreases from 200 to 133, 100 and 80. As FIG. 2 shows, the ablation depth runs approximately linearly with the number of applied laser pulses.
  • Figure 3 shows in the left part of the image once the ablation depth against the deposited in a partial surface 25 Radiation ⁇ energy, which is equivalent to the number on ⁇ impinging laser pulses.
  • Radiation ⁇ energy which is equivalent to the number on ⁇ impinging laser pulses.
  • the ablation depth with the number of laser pulses is approximately linear increases.
  • no significant difference in ablation depth occurs through the activation of the plasma.
  • Ablation depth is thus the amount of removed material increased by the inventive combination of short pulse laser radiation and plasma.
  • FIG. 4 shows scanning electron micrographs of the line engraved in the surface 21 of the workpiece 2.
  • 4A shows the result after the action of the short-pulse laser according to the prior art
  • FIG. 4B shows the combination of laser radiation and plasma according to the present invention.
  • the surface quality in the method according to the invention is significantly better, expressed as less roughness.
  • the inventive method can provide significantly improved surface quality.
  • a workpiece 2 is machined from an aluminum alloy, once with a known short-pulse laser and on the other with the combination of the invention
  • Short pulse laser and plasma Processing takes place in each case such that the irradiated part by the laser radiation ⁇ area is varied by relative displacement of the workpiece at constant laser beam generating means and the plasma generating apparatus.
  • the relative Displacement is carried out in such a way that initially a first partial area is irradiated with a prescribable number of pulses and subsequently a second partial area is irradiated with a prescribable number of pulses, the second partial area overlapping the first partial area by 50% of the diameter of the partial area 25 ,
  • the diameter of the surface 25 is used as the beam diameter of
  • Figure 5 shows the depth of ablation to the place where 5500 laser pulses were radiated on a single surface portion 25 in the left part of the figure, whereas 1600 laser pulses were radiated on a single part ⁇ surface 25 in the right part, before the workpiece 2
  • FIG. 5 also shows the ablation depth, which can be achieved with a short-pulse laser according to the prior art.
  • Curve B shows the ablation depth which results in the inventive combination of laser radiation and plasma, wherein the plasma is generated as described above by means of a dielectrically impeded discharge.
  • the short-pulse laser alone is not able to effect a significant material removal. Only the combination according to the invention with a plasma ensures a removal of material of about 20 ⁇ m or about 250 ⁇ m as a function of the energy introduced by the laser radiation.
  • FIG. 6 again shows scanning electron microscopic images
  • Figure 6B shows a workpiece 2, which was treated according to the invention with plasma and laser radiation
  • Figure 6A a Workpiece which has been treated exclusively with laser radiation.
  • the method according to the invention in accordance with the second embodiment becomes a roughening of the surface, which can advantageously be used, for example, in the production of solar absorbers for solar cells or solar collectors.
  • the height and diameter of the individual structures formed amount to about 10 ym to about 20 ym, so that long-wave infrared radiation can be absorbed with great efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un système (1) permettant d'usiner une surface (21) d'une pièce (2), ledit système comprenant un dispositif générateur de plasma (4) et un dispositif générateur de faisceau laser (3), lesdits dispositifs étant destinés à solliciter au moins une surface partielle (25) de ladite surface (21) de la pièce (2) avec un faisceau laser (35) et du plasma (45), le dispositif générateur de faisceau laser (3) étant conçu de manière à fournir un faisceau laser (35) pulsé, lequel présente une longueur d'impulsions inférieure à environ 100 fs ou inférieure à environ 80 fs ou inférieure à environ 50 fs ou inférieure à environ 30 fs. L'invention concerne en outre un procédé d'usinage d'une surface (21) d'une pièce (2) au moyen d'un dispositif générateur de plasma (4) et d'un dispositif générateur de faisceau laser (3).
PCT/EP2018/065985 2017-06-19 2018-06-15 Système et procédé pour usiner une surface WO2018234192A1 (fr)

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DE112018003114.4T DE112018003114A5 (de) 2017-06-19 2018-06-15 Vorrichtung und verfahren zur bearbeitung einer oberfläche

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DE102017210167.9 2017-06-19
DE102017210167.9A DE102017210167A1 (de) 2017-06-19 2017-06-19 Vorrichtung und Verfahren zur Bearbeitung einer Oberfläche

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CN112869209A (zh) * 2019-11-29 2021-06-01 西北农林科技大学 一种采后苹果果柄激光切除装置

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