WO2013010876A1 - Procédé et dispositif de lissage et de polissage de surfaces de pièces par traitement au moyen de deux rayonnements énergétiques - Google Patents

Procédé et dispositif de lissage et de polissage de surfaces de pièces par traitement au moyen de deux rayonnements énergétiques Download PDF

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Publication number
WO2013010876A1
WO2013010876A1 PCT/EP2012/063588 EP2012063588W WO2013010876A1 WO 2013010876 A1 WO2013010876 A1 WO 2013010876A1 EP 2012063588 W EP2012063588 W EP 2012063588W WO 2013010876 A1 WO2013010876 A1 WO 2013010876A1
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WO
WIPO (PCT)
Prior art keywords
radiation
workpiece
machining
energetic
laser
Prior art date
Application number
PCT/EP2012/063588
Other languages
German (de)
English (en)
Inventor
Christian NÜSSER
André TEMMLER
Judith KUMSTEL
Edgar Willenborg
Valentin Morasch
Original Assignee
Fraunhofer-Ges. Zur Förderung Der Angewandten Forschung E.V.
Rheinisch Westfälische Technische Hochschule Aachen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102011113246A external-priority patent/DE102011113246A1/de
Application filed by Fraunhofer-Ges. Zur Förderung Der Angewandten Forschung E.V., Rheinisch Westfälische Technische Hochschule Aachen filed Critical Fraunhofer-Ges. Zur Förderung Der Angewandten Forschung E.V.
Priority to DE112012002989.5T priority Critical patent/DE112012002989A5/de
Publication of WO2013010876A1 publication Critical patent/WO2013010876A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing

Definitions

  • the application relates to a method for smoothing and polishing
  • the application also relates to a device for
  • Polishing methods based on the remelting of a thin surface surface layer by means of laser radiation are known.
  • the boundary layer is here by the
  • Laser radiation melted, smoothed by the surface tension and solidifies 5 then again.
  • the laser radiation is used to process surfaces
  • the method can be carried out both by continuous (cw) and by pulsed laser radiation.
  • Coarse starting roughness with a mean roughness Ra -S 10 pm are remelted with cw laser radiation. This creates a continuous melt pool, which is guided by the laser radiation over the sample.
  • a two-stage process for smoothing and polishing surfaces is disclosed in DE 103 42 750 B4.
  • a surface to be processed in a first processing stage using continuous laser radiation or pulsed laser radiation with long pulse lengths with first processing parameters one or more times successively along a processing path to a first
  • Umschmeiztiefe remelted wherein the intensity of the incident on the surface laser radiation or its interaction time with the surface or both at least one remelting process is modulated and thereby along the
  • Machining path has such a wave-like course that an existing undesirable waviness of the surface is eliminated or reduced.
  • the object of the present invention is therefore to provide a method and apparatus for smoothing and polishing workpiece surfaces by machining
  • this object is achieved by a device having the features of patent claim 15.
  • the present invention is based on the finding that the achievable with the known Umschm elzvon surface roughness can not be reduced arbitrarily, since the energetic radiation used to produce a molten bath in a surface layer of a workpiece workpiece presumably due to temporal and spatial variations in performance, the melt to vibrations stimulates and this state is frozen when cooling the melt. To this effect
  • the invention proposes to distribute the energy introduced by the energetic radiation in the workpiece on several, in particular two, beam.
  • the radiation beams are combined, at least at predetermined time intervals, so that they impinge on the surface to be smoothed in predetermined areas, the machining parameters relating to the beam bundles being coordinated such that, as a result of the total energy introduced into the surface boundary layer by the radiation beams, a melt pool is formed in the surface layer of the surface generated workpiece to be machined and maintained for a predetermined period of time.
  • the beams used in the method according to the invention have a lower intensity. This reduces the influence of irregularities in the intensity distribution of a beam on the surface of the molten bath. Thus, the effect of the process-induced excitation of the molten bath can be reduced by the energetic radiation and thereby a smoother surface of the machined workpiece can be achieved.
  • the method according to the invention can be applied particularly advantageously to the smoothing of porous surfaces.
  • processing parameters pertaining to the at least one second beam are selected such that they are separated by the at least one second beam
  • the energetic radiation may in particular be laser radiation or also electron radiation.
  • the terms "beam” and “beam” are used interchangeably herein.
  • the first beam may be continuous or pulsed laser radiation.
  • For the at least one second beam preferably continuous laser radiation is used.
  • the first beam, which is used in particular for locally melting the surface layer of the surface, is also referred to as a polishing beam.
  • the energy supplied by the at least one second beam serves to reduce the energy required to produce the molten bath by the first beam and thus to reduce excitation of the generated molten bath to vibrations by the energy acting on the surface to be smoothed by the beams.
  • the second beam causes in this case only a heating of the surface layer to be processed surface. Due to the higher temperature of the heated surface layer, the temperature difference is lower until local melting of the surface layer surface, so that for a lower power is required. As a result, the influence of the energetic radiation as a source of interference and thus the process-induced roughness decreases.
  • this is served by the at least one second
  • one of the at least two radiation beams is deflected relative to the other beam, wherein the
  • Impact region of the first beam on the workpiece surface is located within a heat affected zone of the at least one second beam. With heat-affected zone of a beam is thereby an area of the processed Workpiece meant by the effect of the beam higher
  • the machining takes place during the machining process on the surface to be machined along a continuous machining path, which preferably runs meandering, or a plurality of temporally successive discrete processing tracks, which are preferably arranged side by side and are all traversed in the same direction, so that the generated by the beam Melt bath moves along the respective processing path.
  • the bundles of rays are guided over the surface to be processed.
  • the surface to be processed can also be moved relative to the ray bundles. If necessary, several
  • Beam is located within a heat affected zone of the at least one second beam.
  • the fact that the second bundle of rays leads the first bundle of rays means that the center of the impingement of the second bundle of rays
  • Preceding beam on the workpiece surface the center of the impingement of the first beam.
  • preheating the surface layer of the surface has the added advantage of slower heating of alloying constituents having a lower melting temperature than the parent, thus avoiding explosive evaporation and reducing the risk of surface defect formation , Therefore, in the case of inhomogeneous materials, a previous remelting can be dispensed with.
  • the second beam may also be concentric with the first
  • Be bundle of rays It then preferably has a larger diameter than the first beam.
  • the second beam can cause both a preheating and a reheating of the surface layer surface.
  • the additional heating of the surface edge layer with energetic radiation has the advantage over heating of the entire workpiece, for example inductively or with a heating plate, that the introduced energy is lower. The risk of distortion of the workpiece is thereby reduced. Moreover, in the alternatives given, it is not ensured that the entire surface has the same temperature during a polishing operation, i. the initial state for the polishing process varies over the workpiece. For example, when using a heating plate, the side of the workpiece facing away from the heating plate usually has a lower temperature than the side which is in contact with the plate. In contrast, when using energetic radiation, the temperature obtained in response to the power of the energetic radiation in a surface surface layer of the workpiece is well defined.
  • a control or regulation of at least one of the first and / or the at least one second beam bundle processing parameters in response to a measurement of the heating temperature or a measurement of the surface profile can be done without contact by means of a pyrometer.
  • the processing parameters include the speed with which the beams and the surface to be smoothed are moved relative to each other, the performance of the
  • the pulse rate and the pulse duration also the diameter and the cross section of the respective beam.
  • the cross section may in particular be rectangular or circular.
  • the dimensions of the second beam on the workpiece surface are greater than or equal to the dimensions of the first beam on the workpiece surface.
  • the intensity distribution over the cross section can be adjusted.
  • the intensity distribution of the energetic radiation has a top hat profile, ie the intensity of the energetic radiation has within the
  • the regulation of the at least one processing parameter takes place online during processing, ie. H. during the same machining operation as the measurement.
  • Figure 1 shows the polishing of a workpiece surface by remelting in sectional view
  • FIG. 2 b shows a temperature distribution on the workpiece surface achieved with the arrangement according to FIG. 2 a);
  • Embodiment of the invention corresponding arrangement of two beams on a workpiece surface;
  • FIG. 3 b) shows a temperature distribution on the workpiece surface achieved with the arrangement according to FIG. 3 a);
  • Figure 4 shows an apparatus for polishing workpiece surfaces by reflow by means of laser radiation. Based on the example shown in FIG.
  • FIG. 1 shows a section of a workpiece 20 which is treated with a laser beam 10 which, as indicated by an arrow, is guided over the workpiece surface at speed v in the x-direction along a machining path, in a sectional view.
  • the workpiece surface can be seen in the untreated state.
  • Pieces workpiece surface melts the material of the workpiece 20 and there is a molten pool 28, wherein at least in continuous laser radiation due to the heat conduction, the lateral extent of the molten bath 28 is generally greater than the diameter of the laser beam 10.
  • a heat-affected zone 26 of the laser beam 10 in addition to the molten bath 28 and the area around the impingement of the laser beam 10, in which an edge layer 22 of the workpiece 20 is heated by the action of the laser beam 10.
  • the heat-affected zone 26 and the molten bath 28 move with the laser beam 10 during a machining operation. This results in a remelt layer 24 of material that has been melted and solidifies again.
  • two laser beams are superposed for the smoothing and polishing of surfaces such that the surface is preheated with a preferably continuous laser beam and the surface is smoothed and polished with a further laser beam 10.
  • the dimensions of the laser beam for preheating in this case are greater than or equal to the dimensions of the jet 10 for polishing, which is on the workpiece surface within the
  • Heat affected zone of the laser beam is located for heating.
  • the surface edge layer 22 may be reheated with a third laser beam (not shown) that lags the beam 10 for polishing to further extend the life of the melt, and thus the time available for roughness to flow out.
  • the preferred power of the laser beams depends on the material of the
  • the parameters used for the preheat and reheat third laser beams are selected so that the energy introduced into the workpiece by these beams heats the edge layer 22 of the workpiece to a temperature that is below the melt temperature of the workpiece.
  • the values for the power of a jet serving for heating are in the range of 50 to 1000 W, for the beam diameter in the range of 100 to 1000 ⁇ and for the velocity v in the range of 5 to 10000 mm / s.
  • the parameters used for the polishing beam 10 are selected such that the energy introduced into the workpiece by the polishing beam 10, in conjunction with the energy introduced into the workpiece by the preheat beam, forms a molten bath 28 in the edge layer 22 of the
  • the values for the power of a beam 10 to be polished are in the range of 10 to 1000 W, for the beam diameter in the range of 50 to 500 ⁇ m and for the velocity v in the range of 5 to 10000 mm s. Reheating by means of laser radiation is preferably used when using a pulsed polishing beam 10.
  • Figure 2 a shows the Auf Hughesbe rich a polishing beam 10 'and a Vormérmstrahls 12' on a surface of a workpiece to be treated according to a preferred embodiment of the invention.
  • Both laser beams 10 'and 12' have a circular cross section with a top hat profile and move over the workpiece surface at the same velocity v 'as indicated by the thick arrow.
  • the radius R 2 'of the impingement area of the preheat beam 12' is four times the radius R, "of the impingement area of the polishing beam 10." Preferred values for the radii are 125 pm for R, "and 500 pm for R 2 '.
  • the center M 2 'of the impact area of the preheat beam 12' is about R 2 72 in the direction of movement with respect to the center M, "of the impact area of
  • Polishing jet 10 'offset so that the preheat beam 12' the polishing jet 10 'leads, wherein the polishing beam 10' is located within the impingement of the Vorracermstrahls 12 '.
  • Both laser beams 10 'and 12' are continuous, with the power of the preheat beam 12 'in this example being 200W while the power of the polishing beam 10' here is 60W.
  • the speed 'in this case has the value 100 mm / s.
  • the temperature distribution at the surface of the workpiece produced with these parameters is shown in FIG. 2b).
  • the temperature range in which the alloy used in this example melts for the workpiece is approximately between 1400 and 1460 ° C.
  • FIG. 1 Another preferred embodiment of the invention is shown in FIG. 1
  • FIG. 3 a shows the impact areas of a polishing jet 10 "and a preheat jet 12" on a surface of a workpiece to be treated.
  • the two laser beams 10 "and 12" again have a circular cross-section with a top hat profile and move at speed v "over the workpiece surface, with the preheat beam 12" continuous while the polishing beam 10 "is pulsed R 2 "of the impingement area of the preheat beam 12" is twice the radius R "of the impingement area of the polishing beam 10".
  • the center M 2 " of the impingement area of the preheat beam 12 " is 3R 2 " / 4 in the direction of movement from the center M " the impact area of the polishing beam 10 "offset, so that the impact areas of the two laser beams 10 "and 12" touch tangentially.
  • the impact area of the polishing jet 10 is in the heat-affected zone of the preheat jet 12" without disturbing the melt pool generated in the surface boundary layer by direct action of the preheat jet 12
  • Preferred values for the radii are 125 ⁇ for R" and 250 ⁇ for R 2 "and 375 ⁇ m for the distance of the centers M," and M 2 "from each other
  • the laser power of the continuous preheat beam 12" is in the range of 50 to 160 W and that of the pulsed polishing beam 10 "in the range of 10 to 50 W at a pulse duration in the range of 100 to 1000 ns.
  • the speed v "in this embodiment example is 1000 mm / s. Particularly good results were achieved with a laser power of the preheat beam 12 "of 130 W and a laser power of the polishing beam 10" of 20 W with a pulse duration of 1 50 ns.
  • the temperature distribution at the surface of the workpiece produced with these parameters is shown for the range y> 0 in FIG. 3b).
  • the temperature distribution for negative y-values results from reflection on the x-axis.
  • the coordinate system is chosen such that its origin coincides with the center M 2 "of the impact area of the
  • the alloy used for the workpiece is the same as in the example of Figure 2, i.e. the melting range is approximately between 1400 and 1460 ° C.
  • a device 50 for polishing workpiece surfaces by means of energetic radiation will be explained with reference to the schematic diagram of FIG.
  • a first laser 52 emits laser radiation 10, which is preferably pulsed and, for example, has the wavelength 1064 nm.
  • a second laser 54 emits laser radiation 12, which is preferably continuous and has, for example, the wavelength 1030 nm.
  • the radiation emitted by the two lasers 52 and 54 should differ in terms of their wavelength at least by 5 to 10 nm, so that the two beam paths by means of a
  • Wavelength multiplexer can be combined to form a beam path.
  • Optical cables 56 and 57 serve to couple the laser beams 10 and 12 into an optical structure.
  • the optical structure comprises on the input side for each laser beam 10 and 12, respectively, a collimating optics 58 and 59, represented by a lens, for parallelizing the laser beams 10 and 12.
  • the laser beams are in the beam path 10 and 12 are each a continuously movable zoom telescope 60 and 61, through which the respective diameter of the laser beams 10 and 12 is adjustable.
  • Two mirrors 64 and 65 which can be tilted one-dimensionally by means of piezoactuators 62 and 63, enable a fast two-dimensional deflection of the first laser beam 10, whereby it is displaced relative to the second laser beam 12 on a surface of a workpiece 20 to be machined.
  • a wavelength division multiplexer 66 is coated such that it has a large transmission for laser radiation of the first laser 52 and at least on one side high reflectivity for laser radiation of the second laser 54, and arranged at an intersection of the two beam paths so that it
  • the two superimposed laser beams 10 and 12 hit a mirror 68, by means of which they are directed to a laser scanner system 70.
  • the laser scanner system 70 is a 3-D laser scanner system that allows both adjustment of the focus of the superimposed beams 10 and 12 and their deflection in two directions.
  • the superimposed laser beams 10 and 12 can also be moved over surfaces having a three-dimensional shape.
  • An F-theta lens 72 shown as a lens, is arranged at an exit of the optical structure, which serves to focus the radiation exiting from the laser scanner system 70 onto the workpiece surface.
  • the device 50 also includes a controller 74 with outputs for
  • the workpiece 20 is shown enlarged again in the dashed circle 80, so that it can be seen that the central axis of the first laser beam 10 with respect to the Center axis of the second laser beam 1 2 is offset in the processing plane by the distance d xy , which is a function of the tilt angle of the piezo actuators 62 and 63.
  • a device according to the invention may also be constructed in such a way that the second laser beam 12 is deflected relative to the first laser beam 10. Then the two piezo actuators 62 and 63 would have to be arranged with the one-dimensionally tiltable mirrors 64 and 65 in the beam path of the second laser beam 12. Furthermore, instead of two one-dimensionally tiltable mirrors, it would also be possible to use a mirror which can be tilted about two axes, as long as a substantially constant deflection of the two laser beams relative to one another is to be achieved or a movement of the two
  • Laser beams 10 and 12 should be made relative to each other at a comparatively low speed.
  • both laser beams 10 and 1 2 are to be pulsed continuously or both, it is also conceivable as a further alternative to use only one laser and to divide the radiation emitted by it into two beams 10 and 12 by means of a beam splitter.

Abstract

L'invention concerne un procédé permettant de lisser et de polir des surfaces de pièces en les traitant avec un rayonnement énergétique, dans lequel un premier faisceau (10') de rayons énergétiques est dirigé pendant une durée prédéfinie sur une surface à lisser d'une pièce à traiter au cours d'un processus de traitement, et dans lequel au moins un deuxième faisceau (12') de rayons énergétiques est combiné avec le premier faisceau (10') au moins à intervalles prédéterminés de manière à rencontrer chaque zone prédéfinie de la surface à lisser, les paramètres de traitement relatifs au premier et audit au moins deuxième faisceau de rayons (10', 12') étant adaptés les uns aux autres de façon à créer un bain de fusion dans une couche superficielle associée à la surface à lisser de la pièce à traiter et à le maintenir pour une durée prédéfinie. L'invention a en outre pour objet un dispositif permettant de la mise en œuvre du procédé.
PCT/EP2012/063588 2011-07-15 2012-07-11 Procédé et dispositif de lissage et de polissage de surfaces de pièces par traitement au moyen de deux rayonnements énergétiques WO2013010876A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE112012002989.5T DE112012002989A5 (de) 2011-07-15 2012-07-11 Verfahren und Vorrichtung zum Glätten und Polieren von Werkstückoberflächen durch Bearbeitung mit energetischer Strahlung

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102011107416 2011-07-15
DE102011107416.7 2011-07-15
DE102011113246.9 2011-09-13
DE102011113246A DE102011113246A1 (de) 2011-09-13 2011-09-13 Verfahren und Vorrichtung zum Strukturieren von Oberflächen durch Bearbeitung mit energetischer Strahlung

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Publication Number Publication Date
WO2013010876A1 true WO2013010876A1 (fr) 2013-01-24

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DE (1) DE112012002989A5 (fr)
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Cited By (4)

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Publication number Priority date Publication date Assignee Title
EP3406392A1 (fr) * 2017-05-22 2018-11-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Procédé de réduction du frottement de surfaces glissantes et/ou roulantes les unes par rapport aux autres
CN109514076A (zh) * 2018-12-18 2019-03-26 北京工业大学 一种皮秒-纳秒激光复合异步抛光陶瓷的工艺方法
CN109996644A (zh) * 2016-11-21 2019-07-09 通用电气公司 通过在线激光扫描器控制粉末床的熔化池的冷却速率的方法及直接金属激光熔化制造系统
CN115213426A (zh) * 2021-04-16 2022-10-21 广州汽车集团股份有限公司 激光熔化成型方法及系统

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JP2004052074A (ja) * 2002-07-23 2004-02-19 Toyota Motor Corp レーザ焼入方法および装置
DE10342750B4 (de) 2003-09-16 2008-06-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Glätten und Polieren oder zum Strukturieren von Oberflächen mit Laserstrahlung
DE102008045533A1 (de) * 2008-09-03 2010-03-04 Innovavent Gmbh Verfahren und Vorrichtung zum Ändern der Struktur einer Halbleiterschicht

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JP2001044120A (ja) * 1999-08-04 2001-02-16 Mitsubishi Electric Corp レーザ熱処理方法およびレーザ熱処理装置
JP2004052074A (ja) * 2002-07-23 2004-02-19 Toyota Motor Corp レーザ焼入方法および装置
DE10342750B4 (de) 2003-09-16 2008-06-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Glätten und Polieren oder zum Strukturieren von Oberflächen mit Laserstrahlung
DE102008045533A1 (de) * 2008-09-03 2010-03-04 Innovavent Gmbh Verfahren und Vorrichtung zum Ändern der Struktur einer Halbleiterschicht

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109996644A (zh) * 2016-11-21 2019-07-09 通用电气公司 通过在线激光扫描器控制粉末床的熔化池的冷却速率的方法及直接金属激光熔化制造系统
JP2019536635A (ja) * 2016-11-21 2019-12-19 ゼネラル・エレクトリック・カンパニイ 直接金属レーザ溶接の冷却速度制御のためのインラインレーザスキャナ
JP2021000662A (ja) * 2016-11-21 2021-01-07 ゼネラル・エレクトリック・カンパニイ 粉末床の溶融プールの冷却速度を制御する方法
CN109996644B (zh) * 2016-11-21 2022-03-08 通用电气公司 通过在线激光扫描器控制粉末床的熔化池的冷却速率的方法及直接金属激光熔化制造系统
JP7052974B2 (ja) 2016-11-21 2022-04-12 ゼネラル・エレクトリック・カンパニイ 粉末床の溶融プールの冷却速度を制御する方法
EP3862128B1 (fr) * 2016-11-21 2023-05-31 General Electric Company Procédé de controle du taux de refroidissement d'un bain de fusion d'un lit de poudre, et système de fabrication par fusion directe de métal par laser avec un scanner laser "in-line"
EP3406392A1 (fr) * 2017-05-22 2018-11-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Procédé de réduction du frottement de surfaces glissantes et/ou roulantes les unes par rapport aux autres
CN109514076A (zh) * 2018-12-18 2019-03-26 北京工业大学 一种皮秒-纳秒激光复合异步抛光陶瓷的工艺方法
CN115213426A (zh) * 2021-04-16 2022-10-21 广州汽车集团股份有限公司 激光熔化成型方法及系统

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