WO2018230041A1 - 接着剤組成物の硬化方法および接着構造体の製造方法 - Google Patents

接着剤組成物の硬化方法および接着構造体の製造方法 Download PDF

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Publication number
WO2018230041A1
WO2018230041A1 PCT/JP2018/005480 JP2018005480W WO2018230041A1 WO 2018230041 A1 WO2018230041 A1 WO 2018230041A1 JP 2018005480 W JP2018005480 W JP 2018005480W WO 2018230041 A1 WO2018230041 A1 WO 2018230041A1
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WO
WIPO (PCT)
Prior art keywords
adhesive composition
adherend
curing
wavelength
laser light
Prior art date
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PCT/JP2018/005480
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English (en)
French (fr)
Inventor
威和 小森
佐藤　大輔
恭司 北村
陽介 達野
優希 法元
Original Assignee
オムロン株式会社
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Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to CN201880023991.1A priority Critical patent/CN110494520B/zh
Priority to US16/607,373 priority patent/US11773296B2/en
Priority to EP18817977.4A priority patent/EP3640310B1/en
Publication of WO2018230041A1 publication Critical patent/WO2018230041A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4835—Heat curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114—Single butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B29C66/434—Joining substantially flat articles for forming corner connections, fork connections or cross connections
    • B29C66/4342—Joining substantially flat articles for forming corner connections, e.g. for making V-shaped pieces
    • B29C66/43421—Joining substantially flat articles for forming corner connections, e.g. for making V-shaped pieces with a right angle, e.g. for making L-shaped pieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B29C66/434—Joining substantially flat articles for forming corner connections, fork connections or cross connections
    • B29C66/4344—Joining substantially flat articles for forming fork connections, e.g. for making Y-shaped pieces
    • B29C66/43441—Joining substantially flat articles for forming fork connections, e.g. for making Y-shaped pieces with two right angles, e.g. for making T-shaped pieces, H-shaped pieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B29C66/7428—Transition metals or their alloys
    • B29C66/74281—Copper or alloys of copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
    • B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
    • B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
    • B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Definitions

  • the present invention relates to a method for curing an adhesive composition and a method for producing an adhesive structure. More specifically, the present invention relates to a method for curing an adhesive composition in which the adhesive composition is cured by heat generated by laser light irradiation, and a method for manufacturing an adhesive structure using the method for curing such an adhesive composition.
  • Patent Document 1 discloses a capsule type curing containing an epoxy resin, a core containing a curing agent, and a shell covering the core. Disclosed is a resin composition curing method including a step of directly and / or indirectly irradiating a resin composition containing an agent, a filler, and a colorant with laser light.
  • Patent Document 1 a color material that is a photothermal conversion material that absorbs laser light and generates heat is absorbed in the resin composition that is an adhesive composition. Therefore, the irradiation of the laser beam causes absorption and heat generation of the laser beam mainly on and near the surface of the resin composition, and the resin composition is cured from the surface side to the inside. Curing of the composition on the adherend side may be insufficient, and adhesion between the resin composition and the adherend may be insufficient.
  • this invention aims at solving the said problem and providing the hardening method of the adhesive composition with high adhesiveness of an adhesive composition and a to-be-adhered body, and the manufacturing method of an adhesion structure. .
  • a method for curing an adhesive composition according to an aspect of the present invention is in contact with the surface of a first adherend including at least a first photothermal conversion material that generates heat by absorbing laser light having a first wavelength.
  • the first adherend includes a metal part, and the metal part can be heated in the step of curing the adhesive composition.
  • the adhesive composition can include a second photothermal conversion material that changes into a material that generates heat by absorbing laser light of the first wavelength by heating.
  • the adhesive composition includes a third photothermal conversion material that generates heat by absorbing laser light having a second wavelength different from the first wavelength, and is bonded.
  • the adhesive composition and the first adherend can be irradiated with laser light having the first wavelength and laser light having the second wavelength.
  • the surface of the first adherend and the second adherend including at least the first photothermal conversion material on the surface
  • the adhesive composition, the first adherend, and the second adherend are irradiated with laser light of the first wavelength.
  • the adhesive composition can be cured. Thereby, a 1st to-be-adhered body and a 2nd to-be-adhered body are adhere
  • the adhesive composition in the step of arranging the adhesive composition, the surface of the first adherend and the surface of the third adherend that transmits laser light of the first wavelength.
  • the adhesive composition in the step of arranging the adhesive composition so as to be in contact with both and curing the adhesive composition, the third adherend, the adhesive composition, and the first adherend are irradiated with laser light of the first wavelength.
  • the adhesive composition can be cured. Thereby, a 1st to-be-adhered body and a 3rd to-be-adhered body are adhere
  • the method for producing an adhesive structure according to another aspect of the present invention includes, for example, an adhesive composition on the first adherend by the method for curing an adhesive composition according to the above [1] to [4].
  • a first bonded structure to which objects are bonded is manufactured. Thereby, the 1st adhesion structure with high adhesiveness of the 1st adherend and adhesive composition is obtained.
  • the method for producing an adhesive structure according to another aspect of the present invention includes, for example, a first adherend with an adhesive composition interposed therebetween by the method for curing an adhesive composition according to [5] above. And a second adherend are manufactured. Thereby, the 2nd adhesion structure with high adhesiveness of the 1st adherend and the 2nd adherend and adhesive composition is obtained.
  • the method for producing an adhesive structure according to another aspect of the present invention includes, for example, the first adherend with the adhesive composition interposed by the method for curing an adhesive composition according to [6] above. And a third adherend are manufactured. Thereby, the 3rd adhesion structure with high adhesiveness of at least the 1st adherend and adhesive composition of the 1st adherend and the 3rd adherend is obtained.
  • FIG. 1 is a schematic sectional drawing which shows an example with the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 2 is a schematic cross-sectional view showing an example of a conventional method for curing an adhesive composition.
  • FIG. 3 is a schematic cross-sectional view showing another example of a method for curing an adhesive composition according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing another example of a method for curing an adhesive composition according to an embodiment of the present invention.
  • FIG. 5 is a schematic sectional drawing which shows another example of the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 1 is a schematic sectional drawing which shows an example with the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 2 is a schematic cross-sectional view showing an example of a conventional method for curing an adhesive composition.
  • FIG. 3 is a schematic cross-sectional view showing another example of a method
  • FIG. 6 is a schematic sectional drawing which shows another example of the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 7 is a schematic sectional drawing which shows another example of the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 8 is a schematic sectional drawing which shows another example of the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 9 is a schematic sectional drawing which shows another example of the hardening method of the adhesive composition concerning a certain aspect of this invention.
  • FIG. 10A is a schematic view showing an example of an adhesive structure according to another aspect of the present invention.
  • 10B is a partially enlarged view showing an example of a part of the adhesive structure shown in FIG. 10A.
  • FIG. 10C is a partially enlarged view showing an example of another part of the bonded structure shown in FIG. 10A.
  • FIG. 11 is a schematic sectional drawing which shows another example of the hardening method of the adhesive composition concerning a
  • the first example of the method for curing an adhesive composition includes a first photothermal conversion material 11 that absorbs laser light L1 having a first wavelength and generates heat.
  • the first photothermal conversion material in which the first wavelength laser beam L1 transmitted through the adhesive composition 4 is included in the surface of the first adherend 1 and in the vicinity thereof. 11 is absorbed and generates heat (the first light-to-heat conversion material 11h in FIG. 1 indicates the heat-generated first light-to-heat conversion material 11), and thus the adhesive composition 4 is cured from the interface side with the first adherend 1. .
  • the degree of cure of the adhesive composition 4 on the interface side with the first adherend 1 is increased, the adhesiveness between the adhesive composition 4 and the first adherend 1 is stably increased.
  • the first wavelength laser beam L1 is absorbed to generate heat. Since the 1-heat-to-heat conversion material 11 is included in the adhesive composition 4R, the first wavelength laser light L1 irradiated to the adhesive composition 4R is included in the exposed surface of the adhesive composition 4R and in the vicinity thereof. Since the first photothermal conversion material 11 absorbs and generates heat (the first photothermal conversion material 11h in FIG. 2 indicates the generated first photothermal conversion material 11), the adhesive composition 4R is cured from the exposed surface side.
  • the curing method of the adhesive composition of the first example has at least the surface of the first photothermal conversion material 11 that generates heat by absorbing the laser light L1 having the first wavelength.
  • the adhesive composition 4 is cured from the interface side with the first adherend 1 by using the first adherend 1 and the adhesive composition 4 that transmits the laser light L1 having the first wavelength.
  • the degree of cure of the adhesive composition 4 on the interface side with the first adherend 1 can be increased, and the adhesiveness between the adhesive composition 4 and the first adherend 1 can be enhanced.
  • the first photothermal conversion material 11 is not particularly limited as long as it is a material that generates heat by absorbing the laser light L1 having the first wavelength, and is at least one color material selected from the group consisting of inorganic pigments, organic pigments, and dyes.
  • inorganic pigment black-based, red-based, blue-based, green-based, and yellow-based inorganic pigments are preferable, and examples thereof include carbon black, red lead, ultramarine blue, cobalt green, and yellow lead.
  • organic pigment black, red, blue, green, and yellow organic pigments are preferable, and examples include aniline black, lake red C, phthalocyanine blue, phthalocyanine green, and first yellow.
  • the dye include direct dyes, acid dyes, basic dyes, disperse dyes, and reactive dyes.
  • the 1st photothermal conversion material 11 may be metal bodies, such as iron, copper, and gold, or metal powder.
  • the first wavelength means a specific wavelength, and is preferably the wavelength of light at which the photothermal conversion material exhibits maximum absorption.
  • the first adherend 1 is not particularly limited as long as it includes at least the first light-to-heat conversion material 11 described above, and further includes a resin such as PBT (polybutylene terephthalate) or PET (polyethylene terephthalate). It may be included.
  • a resin such as PBT (polybutylene terephthalate) or PET (polyethylene terephthalate). It may be included.
  • the adhesive composition 4 is not particularly limited as long as it is an adhesive composition that transmits the first-wavelength laser light L1, but it suppresses absorption of the first-wavelength laser light L1 in the adhesive composition 4.
  • the transmittance of the adhesive composition 4 having a thickness of 0.5 mm is preferably 30% or more, and 50%. The above is more preferable, and 80% or more is more preferable.
  • the transmittance is measured by the amount of light entering the power meter receiver when the adhesive composition having a thickness of 0.5 mm sandwiched between the glass plates is irradiated with laser light, and the glass plate and the adhesive composition are When there is not, it is set as a percentage when the amount of light entering the power meter receiver is 100%.
  • the adhesive composition 4 includes a resin and a curing agent, and is cured by heat generated by the first photothermal conversion material 11 included in at least the surface of the first adherend 1 absorbing the laser light L1 having the first wavelength. To do.
  • the resin contained in the adhesive composition 4 is not particularly limited as long as it is a resin that is cured by reacting with the curing agent by the heat described above, and an epoxy resin or the like is preferable.
  • the curing agent contained in the adhesive composition 4 is not particularly limited as long as it is a curing agent that reacts with the resin by the heat and cures, but from the viewpoint of curing the epoxy resin at a low temperature in a short time, an amine compound, It is preferable to include at least one compound selected from the group consisting of imidazole compounds and thiol compounds.
  • the second to fourth examples of the method of curing the adhesive composition according to the present embodiment are the same as the first example, but the first adherend 1 is a metal part.
  • the metal portion 1 m is heated.
  • the heat of the first photothermal conversion material 11 on the surface of the first adherend 1 and in the vicinity thereof the first photothermal conversion of FIGS. 3 to 5.
  • the metal portion 1 m is also heated, so that the adhesive composition 4 is cured from the interface side between the first adherend 1 and the metal portion 1 m. Promoted.
  • the method for heating the metal portion 1m is not particularly limited, and well-known methods such as application of magnetism and irradiation with laser light are preferable.
  • first photothermal conversion material 11h represents the first photothermal conversion material 11 that has generated heat
  • the metal portion 1m is simultaneously heated by irradiation with the laser light L1 having the first wavelength.
  • the surface of the first adherend 1 and the heat generation of the first photothermal conversion material 11 in the vicinity thereof (FIG.
  • the first photothermal conversion material 11h of 4 shows the first photothermal conversion material 11 which has generated heat) by the laser light L1 having the first wavelength, and at the same time, the metal portion 1m is heated magnetically and / or by another laser light ML. This is a method performed by application and / or irradiation.
  • the adhesive composition of the fourth example shown in FIG. 5 in the step of curing the adhesive composition 4, first, as shown in FIG. It hardens
  • the surface of the first adherend 1 is irradiated with the laser beam L1 having the first wavelength from the interface side of the first adherend 1 of the adhesive composition 4. It is a method of curing.
  • the first photothermal conversion material 11h in FIG. 5 represents the first photothermal conversion material 11 that has generated heat.
  • the adhesive composition 4 in addition to the configuration of the first example, the adhesive composition 4 emits laser light having the first wavelength by heating. It includes the second light-to-heat conversion material 12 that changes to a material that absorbs and generates heat.
  • the heat generation region is internalized from the interface side of the adhesive composition 4 with the first adherend 1 by the second photothermal conversion material 12 in the adhesive composition 4.
  • the first photothermal conversion material 11h in FIG. 6 shows the first photothermal conversion material 11 that has generated heat, and the second photothermal conversion material 12h absorbs the laser light of the first wavelength by heating and generates heat.
  • the second photothermal conversion material 12 transmits or hardly absorbs the laser beam having the first wavelength at room temperature (for example, 25 ° C.), but absorbs the laser beam L1 having the first wavelength by heating to a certain temperature or higher.
  • room temperature for example, 25 ° C.
  • thermochromic material refers to a material that changes color when heated to a predetermined temperature or higher.
  • Thermal Color OI-220 manufactured by Recording Materials Research Laboratory Co., Ltd. To black. The temperature at which the color changes is adjustable.
  • the sixth example of the method for curing an adhesive composition according to the present embodiment includes an adhesive composition 4 having a wavelength different from that of the first wavelength.
  • the first wavelength laser is applied to the adhesive composition 4 and the first adherend 1. Irradiate light L1 and laser light L2 of the second wavelength.
  • the surface of the first adherend 1 and the vicinity of the first photothermal conversion material in the vicinity thereof by the first wavelength laser beam L1 (the first photothermal conversion of FIG. 7).
  • the material 11h In addition to the heat-generated first light-to-heat conversion material 11, the material 11h generates heat from the exposed surface of the adhesive composition 4 by the laser light L2 of the second wavelength and the third light-to-heat conversion material 13 in the vicinity thereof (FIG. 7). Since the third light-to-heat conversion material 13h indicates the heat-generated third light-to-heat conversion material 13, the adhesive composition 4 is cured from both the interface side with the first adherend 1 and the exposed surface side. However, in the sixth example, in order to ensure the hardening of the adhesive composition 4 on the interface side, the hardening of the adhesive composition 4 on the interface side is given priority over the hardening of the exposed surface side.
  • the intensity of the laser light L1 having one wavelength needs to be larger than the intensity of the laser light L2 having the second wavelength.
  • the degree of cure of the adhesive composition 4 on the interface side and the exposed surface side with the first adherend 1 is increased, so that the adhesiveness between the adhesive composition 4 and the first adherend 1 is higher.
  • the third photothermal conversion material 13 is not particularly limited as long as it is a material that transmits the laser light L1 having the first wavelength and generates heat by absorbing the laser light L2 having the second wavelength, and a near-infrared absorbing material or the like is preferable. It is mentioned in.
  • An example of the near-infrared absorbing material is FDN-002 manufactured by Yamada Chemical Co., Ltd., which transmits laser light having a wavelength of 1064 nm and absorbs laser light having a wavelength of 808 nm.
  • the seventh example of the method for curing the adhesive composition according to the present embodiment is the first adherend in the step of arranging the adhesive composition 4 in addition to the configuration of the first example.
  • the adhesive composition 4 is cured by irradiating the adhesive composition 4, the first adherend 1, and the second adherend 2 with the laser light L ⁇ b> 1 having the first wavelength.
  • the surface of the first adherend 1 and the heat generation of the first photothermal conversion material in the vicinity thereof by the laser light L1 having the first wavelength (the first adherence in FIG. 9).
  • the first photothermal conversion material 11h included in the body 1 represents the first photothermal conversion material 11 that has generated heat), and the first photothermal heat of the surface of the second adherend 2 and the vicinity thereof by the laser light L1 having the first wavelength. Because of the heat generation of the conversion material (the first photothermal conversion material 11h included in the second adherend 2 in FIG. 9 represents the generated first photothermal conversion material 11), the adhesive composition 4 is the first adherend 1 From the interface side with the second adherend 2.
  • the first adherend and the second adherend can be bonded with the adhesive composition interposed therebetween, and the interface side with the first adherend 1 and the second adherend 2 Since the degree of cure of the adhesive composition 4 on the interface side increases, the adhesiveness between the adhesive composition 4 and the first adherend 1 and the second adherend 2 increases.
  • the second adherend 2 is not particularly limited as long as it includes the first photothermal conversion material 11 at least on the surface thereof, and includes a resin such as PBT (polybutylene terephthalate) or PET (polyethylene terephthalate). It may be a thing.
  • the second adherend 2 may have the same or different chemical composition as the first adherend 1.
  • the eighth example of the method of curing the adhesive composition according to the present embodiment is the first adherend in the step of arranging the adhesive composition 4 in addition to the configuration of the first example.
  • the step of arranging the adhesive composition 4 so as to be in contact with both the surface of 1 and the surface of the third adherend 3 that transmits the laser light L1 having the first wavelength, and curing the adhesive composition 4, the third The adhesive composition 4 is cured by irradiating the adherend 3, the adhesive composition 4, and the first adherend 1 with the laser light L ⁇ b> 1 having the first wavelength.
  • the adhesive composition 4 is cured from the interface side with the first adherend 1. Accordingly, the first adherend and the third adherend can be bonded with the adhesive composition interposed therebetween, and the degree of cure of the adhesive composition 4 on the interface side with the first adherend 1 can be adhered. Therefore, the adhesiveness between the adhesive composition 4 and the first adherend 1 is increased.
  • the third adherend 3 is not particularly limited as long as it is an adherend that transmits the laser light L1 having the first wavelength, but suppresses absorption of the laser light L1 having the first wavelength in the third adherend 3.
  • the transmittance of the third adherend 3 having a thickness of 0.5 mm is preferably 30% or more, 50% or more is more preferable, and 80% or more is more preferable.
  • the transmittance is measured by the amount of light entering the power meter receiver when the third adherend having a thickness of 0.5 mm sandwiched between the glass plates is irradiated with laser light.
  • the percentage when the amount of light entering the power meter receiver is 100% when there is no body.
  • the third adherend 3 include resins having no color such as PBT (polybutylene terephthalate), PA (polyamide), and PET (polyethylene terephthalate).
  • the first example of the manufacturing method of the adhesive structure according to the present embodiment is the first to sixth examples of the curing method of the adhesive composition according to the first embodiment.
  • the first bonded structure 101 in which the adhesive composition 4 is bonded to the first adherend 1 is manufactured.
  • the manufacturing method of the adhesive structure of the first example since the curing rate of the adhesive composition 4 on the interface side with the first adherend 1 is increased, the first adherend 1 and the adhesive composition 4 are used. 1st adhesion structure 101 with high adhesiveness is obtained.
  • the second example of the manufacturing method of the adhesive structure according to the present embodiment interposes the adhesive composition 4 by the seventh example of the curing method of the adhesive composition according to the first embodiment.
  • the second bonded structure 102 in which the first adherend 1 and the second adherend 2 are bonded is manufactured.
  • the manufacturing method of the adhesive structure of the second example since the curing rate of the adhesive composition 4 on the interface side with the first adherend 1 and the interface side with the second adherend 2 is increased, A second adhesive structure 102 having high adhesion between the first adherend 1 and the second adherend 2 and the adhesive composition 4 is obtained.
  • the third example of the method for manufacturing an adhesive structure according to the present embodiment is the eighth example of the method for curing the adhesive composition according to the first embodiment, with the adhesive composition 4 interposed.
  • a third bonded structure 103 in which the first adherend 1 and the third adherend 3 are bonded is manufactured.
  • the manufacturing method of the adhesive structure of the third example since the curing rate of the adhesive composition 4 on the interface side with the first adherend 1 is increased, the first adherend 1 and the adhesive composition 4 are increased. Thus, the third bonded structure 103 having high adhesiveness is obtained.
  • FIG. 10A is a schematic perspective view of the second adhesive structure 102
  • FIG. 10B is a portion of the first adherend 1 and the second adherend 2 that are bonded via the adhesive composition 4.
  • FIG. 10C is a partially enlarged view of the first adherend 1 and the terminal electrode 5 bonded with the adhesive composition 4 interposed therebetween.
  • Example 1 Referring to FIG. 11, at the end of a 1 mm thick PBT (polybutylene terephthalate) plate (first adherend 1) containing 0.5% by mass of carbon black (first photothermal conversion material 11). A groove having a depth of 0.5 mm was formed. Next, 100 parts by mass of a bisphenol A type epoxy resin (jER828 manufactured by Mitsubishi Chemical Corporation), 5 parts by mass of an epoxy resin imidazole adduct compound (Amicure (registered trademark) PN-23 manufactured by Ajinomoto Fine Techno Co.), 20 parts by mass on the groove.
  • jER828 manufactured by Mitsubishi Chemical Corporation
  • an epoxy resin imidazole adduct compound Amicure (registered trademark) PN-23 manufactured by Ajinomoto Fine Techno Co.
  • capsule-type curing agent Novacure (registered trademark) HX-3722 manufactured by Asahi Kasei E-materials Co., Ltd.
  • silica-containing adhesive composition 4 20 parts by mass of silica-containing adhesive composition 4 are disposed, and laser light with a wavelength of 808 nm is provided on the side surface thereof.
  • the PBT (polybutylene terephthalate) plate having a thickness of 0.5 mm that passes therethrough was disposed so as to be in contact with the main surface.
  • Laser light having a wavelength of 808 nm (first wavelength) is applied to the adhesive composition 4 and the first adherend 1 from the direction perpendicular to the main surface of the first adherend 1 (laser light source: JOLD- manufactured by Jena Optic Japan).
  • the laser light irradiation conditions were as follows: the interface between the adhesive composition and the first adherend was heated to 130 ° C. by irradiating with a laser output of 2 W for 1 second, and then irradiated with a laser output of 0.8 W for 130 seconds. The temperature was maintained.
  • the curing rate at a depth of 0.5 mm of the cured adhesive composition 4 (that is, the interface on the first adherend side of the resin composition) is extremely high at 92%, and the first adherend 1 and the adhesive composition 4 and the 3rd adhesion structure 103 with high adhesiveness were obtained.
  • the curing rate was determined by comparing the absorbance peak areas of the specific functional groups of the adhesive composition before and after curing.
  • the curing rate is expressed by the following formula using the peak area of the specific functional group.
  • Curing rate (%) (Glycidyl group absorbance peak area after curing / Methylene group absorbance peak area after curing) / (Glycidyl before curing) Group absorbance peak area / methylene group absorbance peak area before curing) It is represented by For the measurement of the absorbance peak area, FT-IR (system 2000 manufactured by Perkin Elmer) with golden diamond ATR was used. The absorbance area of the glycidyl groups and methylene groups, respectively, was employed and the absorbance peak area of glycidyl group (near the absorption position 910 cm -1) and a methylene group (near the absorption position 2900 cm -1). In general, it is said that the reaction is sufficiently performed if the cured state is 80%.
  • the cured composition at a depth of 0.5 mm (that is, the interface on the first adherend side of the resin composition) of the adhesive composition 4 after curing is as extremely low as 27%, and the first adherend 1 and the adhesive composition Adhesive structure 100 with No. 4 was unstable and low in adhesion (FIG. 2).
  • Example 2 Referring to FIG. 3, a 1 mm thick PBT (polybutylene terephthalate) plate (first adherend 1) containing 0.5% by mass of carbon black (first photothermal conversion material 11) is coated with a metal portion. A 1 m copper metal part (width 0.8 mm ⁇ thickness 0.2 mm ⁇ height 4.7 mm) was installed.
  • the first adherend 1 and its metal part 1m are irradiated with laser light having a wavelength of 365 nm (third wavelength) to the adhesive composition 4 and the first adherend 1 and its metal part 1m from an oblique 45 ° direction. did.
  • the irradiation condition of the laser beam is as follows: the interface between the adhesive composition and the metal part 1m of the first adherend 1 is heated to 130 ° C. by irradiating with a laser output of 12 W for 40 seconds, and then irradiated with a laser output of 10 W. Hold at 130 ° C. for 30 seconds.
  • the first adherend including a metal portion 1 m having a very high curing rate of 90% at a depth of 0.5 mm of the adhesive composition 4 after curing (that is, the interface between the first adherend and its metal portion). 1 and the adhesive composition 4 were stable, and the 1st adhesion structure 101 with high adhesiveness was obtained.
  • Example 3 Referring to FIG. 8, on a PBT (polybutylene terephthalate) plate (first adherend 1) having a thickness of 1 mm containing 0.5% by mass of carbon black (first photothermal conversion material 11), 100 5 parts by mass of bisphenol A type epoxy resin (jER828, manufactured by Mitsubishi Chemical Corporation), 5 parts by mass of epoxy resin imidazole adduct compound (Ajinomoto Fine-Techno Amicure (registered trademark) PN-23), 20 parts by mass of capsule-type curing agent ( Asahi Kasei E-material Co., Ltd.
  • the irradiation condition of the laser beam is as follows: the interface between the first adherend 1 and the second adherend 2 of the adhesive composition is heated to 130 ° C. by irradiating with a laser output of 2 W for 1 second, and then the laser output is 0. The temperature was maintained at 130 ° C. for 30 seconds with 8 W irradiation. The curing rate at a depth of 0.5 mm of the cured adhesive composition 4 (that is, the interface on the first adherend side of the resin composition and the interface on the second adherend side of the resin composition) is as extremely high as 95%. As a result, a second adhesive structure 102 in which the first adherend 1 and the second adherend 2 and the adhesive composition 4 were stable and had high adhesiveness was obtained.
  • Example 4 Referring to FIG. 9, on a 1 mm thick PBT (polybutylene terephthalate) plate (first adherend 1) containing 0.8% by mass of carbon black (first photothermal conversion material 11), 100 5 parts by mass of bisphenol A type epoxy resin (jER828, manufactured by Mitsubishi Chemical Corporation), 5 parts by mass of epoxy resin imidazole adduct compound (Ajinomoto Fine-Techno Amicure (registered trademark) PN-23), 20 parts by mass of capsule-type curing agent ( Novacure (registered trademark) HX-3722 manufactured by Asahi Kasei E-Materials Co., Ltd.) and an adhesive composition 4 containing 20 parts by mass of silica are disposed, and carbon black (first photothermal conversion material 11) is not included on the upper surface.
  • PBT polybutylene terephthalate
  • the PBT (polybutylene terephthalate) plate (third adherend 3) having a thickness of 0.5 mm was placed so that the main surface of the natural material was in contact.
  • the third adherend 3, the adhesive composition 4, and the first adherend 1 were irradiated with laser light having a wavelength of 808 nm (first wavelength) from a direction perpendicular to the main surface of the first adherend 1.
  • the laser light irradiation conditions were as follows: the interface of the adhesive composition with the first adherend was heated to 130 ° C. by irradiating at a laser output of 8 W for 1 second, and then irradiated at a laser output of 2 W for 30 seconds. Retained.
  • the cured composition at a depth of 0.5 mm of the adhesive composition 4 after curing (that is, the interface on the first adherend side of the resin composition) is extremely high at 91%, and the first adherend 1 and the adhesive composition 4 and the 3rd adhesion structure 103 with high adhesiveness were obtained.

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Abstract

接着剤組成物の硬化方法は、第１波長のレーザ光（Ｌ１）を吸収して発熱する第１光熱変換材（１１）を少なくとも表面に含む第１被着体（１）の表面に接するように、第１波長のレーザ光（Ｌ１）を透過する接着剤組成物（４）を配置する工程と、接着剤組成物（４）および第１被着体（１）に第１波長のレーザ光（Ｌ１）を照射することにより接着剤組成物（４）を硬化させる工程と、を含む。接着構造体の製造方法は、上記の接着剤組成物の硬化方法により、第１被着体（１）に接着剤組成物（４）が接着された第１接着構造体（１０１）を製造する。これにより、接着剤組成物と被着体と接着性が安定して高い接着剤組成物の硬化方法および接着構造体の製造方法が提供される。

Description

接着剤組成物の硬化方法および接着構造体の製造方法
　本発明は、接着剤組成物の硬化方法および接着構造体の製造方法に関する。より具体的には、接着剤組成物をレーザ光の照射による発熱により硬化させる接着剤組成物の硬化方法およびかかる接着剤組成物の硬化方法を用いた接着構造体の製造方法に関する。
　電子部品などを短時間で接着する方法として、特開２０１５－１７４９１１号公報（特許文献１）は、エポキシ樹脂と、硬化剤を含有するコアと上記コアを被覆するシェルとを含有するカプセル型硬化剤と、フィラーと、色材と、を含有する樹脂組成物に対し、直接的および／または間接的にレーザ光を照射する工程を含む樹脂組成物の硬化方法を開示する。
特開２０１５－１７４９１１号公報
　しかしながら、特開２０１５－１７４９１１号公報（特許文献１）に開示の樹脂組成物の硬化方法は、接着剤組成物である樹脂組成物にレーザ光を吸収し発熱する光熱変換材である色材が含まれていることから、上記レーザ光の照射により樹脂組成物の表面およびその近傍で主に上記レーザ光の吸収および発熱が起こり、樹脂組成物がその表面側から内部に硬化が進むため、樹脂組成物の被着体側の硬化が不十分になり、樹脂組成物と被着体との接着が不十分となるおそれがある。
　そこで、本発明は、上記問題点を解決して、接着剤組成物と被着体との接着性が高い接着剤組成物の硬化方法および接着構造体の製造方法を提供することを目的とする。
　［１］本発明のある態様にかかる接着剤組成物の硬化方法は、第１波長のレーザ光を吸収して発熱する第１光熱変換材を少なくとも表面に含む第１被着体の表面に接するように第１波長のレーザ光を透過する接着剤組成物を配置する工程と、接着剤組成物および第１被着体に第１波長のレーザ光を照射することにより接着剤組成物を硬化させる工程と、を含む。これにより、接着剤組成物と第１被着体との接着性が高くなる。
　［２］本態様の接着剤組成物の硬化方法において、第１被着体は金属部分を含み、接着剤組成物を硬化させる工程において、金属部分を加熱することができる。これにより、接着剤組成物と第１被着体との接着が促進され、接着性がより高くなる。
　［３］本態様の接着剤組成物の硬化方法において、接着剤組成物は、加熱により第１波長のレーザ光を吸収して発熱する材料に変化する第２光熱変換材を含むことができる。これにより、接着剤組成物と第１被着体との接着性がより高くなる。
　［４］本態様の接着剤組成物の硬化方法において、接着剤組成物は、第１波長とは波長の異なる第２波長のレーザ光を吸収して発熱する第３光熱変換材を含み、接着剤組成物を硬化させる工程において、接着剤組成物および第１被着体に第１波長のレーザ光および第２波長のレーザ光を照射することができる。これにより、接着剤組成物と第１被着体との接着性がより高くなる。
　［５］本態様の接着剤組成物の硬化方法においては、接着剤組成物を配置する工程において、第１被着体の表面および第１光熱変換材を少なくとも表面に含む第２被着体の表面の両方に接するように接着剤組成物を配置し、接着剤組成物を硬化させる工程において、接着剤組成物、第１被着体および第２被着体に第１波長のレーザ光を照射することにより接着剤組成物を硬化させることができる。これにより、接着剤組成物を介在させて第１被着体と第２被着体とが接着される。
　［６］本態様の接着剤組成物の硬化方法においては、接着剤組成物を配置する工程において、第１被着体の表面および第１波長のレーザ光を透過する第３被着体の表面の両方に接するように接着剤組成物を配置し、接着剤組成物を硬化させる工程において、第３被着体、接着剤組成物および第１被着体に第１波長のレーザ光を照射することにより接着剤組成物を硬化させることができる。これにより、接着剤組成物を介在させて第１被着体と第３被着体とが接着される。
　［７］本発明の別の態様にかかる接着構造体の製造方法は、たとえば、上記［１］～［４］に記載の接着剤組成物の硬化方法により、第１被着体に接着剤組成物が接着された第１接着構造体を製造する。これにより、第１被着体と接着剤組成物との接着性が高い第１接着構造体が得られる。
　［８］本発明の別の態様にかかる接着構造体の製造方法は、たとえば、上記［５］に記載の接着剤組成物の硬化方法により、接着剤組成物を介在させて第１被着体と第２被着体とが接着された第２接着構造体を製造する。これにより、第１被着体および第２被着体と接着剤組成物との接着性が高い第２接着構造体が得られる。
　［９］本発明の別の態様にかかる接着構造体の製造方法は、たとえば、上記［６］に記載の接着剤組成物の硬化方法により、接着剤組成物を介在させて第１被着体と第３被着体とが接着された第３接着構造体を製造する。これにより、第１被着体および第３被着体の少なくとも第１被着体と接着剤組成物との接着性が高い第３接着構造体が得られる。
　上記のように、本発明の上記態様によれば、接着剤組成物と被着体との接着性が高い接着剤組成物の硬化方法および接着構造体の製造方法を提供することができる。
図１は、本発明のある態様にかかる接着剤組成物の硬化方法のある例を示す概略断面図である。 図２は、従来の接着剤組成物の硬化方法のある例を示す概略断面図である。 図３は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図４は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図５は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図６は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図７は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図８は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図９は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。 図１０Ａは、本発明の別の態様にかかる接着構造体のある例を示す概略図である。 図１０Ｂは、図１０Ａに示す接着構造体のある部分の例を示す部分拡大図である。 図１０Ｃは、図１０Ａに示す接着構造体の別の部分の例を示す部分拡大図である。 図１１は、本発明のある態様にかかる接着剤組成物の硬化方法の別の例を示す概略断面図である。
　＜実施形態１：接着剤組成物の硬化方法＞
　［第１例］
　図１を参照して、本実施形態にかかる接着剤組成物の硬化方法の第１例は、第１波長のレーザ光Ｌ１を吸収して発熱する第１光熱変換材１１を少なくとも表面に含む第１被着体１の表面に接するように、第１波長のレーザ光Ｌ１を透過する接着剤組成物４を配置する工程と、接着剤組成物４および第１被着体１に第１波長のレーザ光Ｌ１を照射することにより接着剤組成物４を硬化させる工程と、を含む。第１例の接着剤組成物の硬化方法によれば、接着剤組成物４を透過した第１波長のレーザ光Ｌ１が第１被着体１の表面およびその近傍に含まれる第１光熱変換材１１に吸収されて発熱するため（図１の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）、接着剤組成物４は第１被着体１との界面側から硬化する。これにより、第１被着体１との界面側の接着剤組成物４の硬化度が高くなるため、接着剤組成物４と第１被着体１との接着性が安定して高くなる。
　さらに、第１例の接着剤組成物の硬化方法によれば、接着剤組成物４により接着したい部分のみを加熱して硬化させることができるため、製品全体を加熱する必要がなくなり、製品内部において熱により膨張した空気を逃がすための２次封止用穴が不要となる。
　図２を参照して、特開２０１５－１７４９１１号公報（特許文献１）などに開示される従来の接着剤組成物の硬化方法においては、第１波長のレーザ光Ｌ１を吸収して発熱する第１光熱変換材１１が接着剤組成物４Ｒに含まれていることから、接着剤組成物４Ｒに照射された第１波長のレーザ光Ｌ１が接着剤組成物４Ｒの露出面およびその近傍に含まれる第１光熱変換材１１に吸収されて発熱するため（図２の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）、接着剤組成物４Ｒはその露出面側から硬化する。これにより、接着剤組成物４の露出面側に硬化膜４ｃが形成されるため、第１被着体１との界面側の接着剤組成物４の硬化度が低くなるため、接着剤組成物４Ｒと第１被着体１との接着性が低くなる。
　上記の従来の接着剤組成物の硬化方法に対して、第１例の接着剤組成物の硬化方法は、第１波長のレーザ光Ｌ１を吸収して発熱する第１光熱変換材１１を少なくとも表面に含む第１被着体１と第１波長のレーザ光Ｌ１を透過する接着剤組成物４とを用いることにより、接着剤組成物４を第１被着体１との界面側から硬化させて、第１被着体１との界面側の接着剤組成物４の硬化度を高めて、接着剤組成物４と第１被着体１との接着性を高めることができる。
　（第１光熱変換材）
　第１光熱変換材１１は、第１波長のレーザ光Ｌ１を吸収して発熱する材料であれば特に制限はなく、無機顔料、有機顔料、および染料からなる群から選ばれる少なくとも１種類の色材が好適に挙げられる。無機顔料としては、黒色系、赤色系、青色系、緑色系、黄色系の無機顔料が好ましく、たとえば、カーボンブラック、鉛丹、ウルトラマリン青、コバルトグリーン、黄鉛などが好適に挙げられる。有機顔料としては、黒色系、赤色系、青色系、緑色系、黄色系の有機顔料が好ましく、たとえば、アニリンブラック、レーキレッドＣ、フタロシアニンブルー、フタロシアニングリーン、ファーストイエローなどが好適に挙げられる。染料としては、直接染料、酸性染料、塩基性染料、分散染料、反応染料などの染料が好適に挙げられる。また、第１光熱変換材１１は、鉄、銅、金などの金属体または金属粉であってもよい。ここで、第１波長とは、ある特定の波長を意味し、光熱変換材が最大の吸収を示す光の波長であることが好ましい。
　（第１被着体）
　第１被着体１は、上記の第１光熱変換材１１を少なくとも表面に含むものであれば特に制限はなく、ＰＢＴ（ポリブチレンテレフタテート）、ＰＥＴ（ポリエチレンテレフタレート）などの樹脂などをさらに含むものでもよい。
　（接着剤組成物）
　接着剤組成物４は、第１波長のレーザ光Ｌ１を透過する接着剤組成物であれば特に制限はないが、接着剤組成物４内における第１波長のレーザ光Ｌ１の吸収を抑制して、第１被着体１の表面への第１波長のレーザ光Ｌ１の透過を高くする観点から、厚さ０．５ｍｍの接着剤組成物４における透過率が、３０％以上が好ましく、５０％以上がより好ましく、８０％以上がさらに好ましい。ここで、透過率は、ガラス板に挟まれた厚さ０．５ｍｍの接着剤組成物にレーザ光を照射したときにパワーメータ受光器に入る光量により測定し、ガラス板および接着剤組成物が無い場合にパワーメータ受光器に入る光量を１００％としたときの百分率とする。接着剤組成物４は、樹脂と硬化剤とを含み、第１被着体１の少なくとも表面に含まれる第１光熱変換材１１が第１波長のレーザ光Ｌ１を吸収して発生する熱により硬化する。
　接着剤組成物４に含まれる樹脂は、上記の熱により硬化剤と反応して硬化する樹脂であれば特に制限はなく、エポキシ樹脂などが好適に挙げられる。接着剤組成物４に含まれる硬化剤は、上記の熱により樹脂と反応して硬化する硬化剤であれば特に制限はないが、エポキシ樹脂を低温短時間で硬化させる観点から、アミン系化合物、イミダゾール系化合物、およびチオール系化合物からなる群から選ばれる少なくとも１種類の化合物を含むことが好ましい。また、接着剤組成物４の上記の熱による硬化反応を制御する観点から、上記の硬化剤を含有するコアと上記コアを被覆するシェルとを含むカプセル型硬化剤を用いることが好ましい。
　［第２例～第４例］
　図３～図５を参照して、本実施形態にかかる接着剤組成物の硬化方法の第２例～第４例は、第１例の構成に加えて、第１被着体１は金属部分１ｍを含み、上記の接着剤組成物４を硬化させる工程において、金属部分１ｍを加熱する。第２例～第４例の接着剤組成物の硬化方法によれば、第１被着体１の表面およびその近傍の第１光熱変換材１１の発熱（図３～図５の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）に加えて金属部分１ｍも加熱されるため、接着剤組成物４の第１被着体１および金属部分１ｍとの界面側からの硬化が促進される。これにより、第１被着体１との界面側の接着剤組成物４の硬化度がより高くなるため、接着剤組成物４と第１被着体１および金属部分１ｍとの接着性がより高くなる。ここで、金属部分１ｍを加熱する方法は、特に制限はなく、磁気の印加、レーザ光の照射などの公知の方法が好適に挙げられる。
　図３に示す第２例の接着剤組成物の硬化方法は、接着剤組成物４を硬化させる工程において、第１被着体１の表面およびその近傍の第１光熱変換材１１の発熱（図３の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）および金属部分１ｍの加熱を上記第１波長のレーザ光Ｌ１の照射により同時に行なう方法である。
　図４に示す第３例の接着剤組成物の硬化方法は、接着剤組成物４を硬化させる工程において、第１被着体１の表面およびその近傍の第１光熱変換材１１の発熱（図４の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）を上記第１波長のレーザ光Ｌ１により行なうと同時に、金属部分１ｍの加熱を磁気および／または別のレーザ光ＭＬの印加および／または照射などにより行なう方法である。
　図５に示す第４例の接着剤組成物の硬化方法は、接着剤組成物４を硬化させる工程において、まず、図５（Ａ）に示すように、金属部分１ｍに磁気および／または別のレーザ光ＭＬを印加および／または照射することにより接着剤組成物４の金属部分１ｍとの界面側から硬化させる（図５（Ａ））。次いで、図５（Ｂ）に示すように、第１被着体１の表面に上記第１波長のレーザ光Ｌ１を照射することにより接着剤組成物４の第１被着体１の界面側から硬化させる方法である。ここで、図５の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す。
　［第５例］
　図６を参照して、本実施形態にかかる接着剤組成物の硬化方法の第５例は、第１例の構成に加えて、接着剤組成物４は、加熱により第１波長のレーザ光を吸収して発熱する材料に変化する第２光熱変換材１２を含む。第５例の接着剤組成物の硬化方法によれば、接着剤組成物４中の第２光熱変換材１２により発熱領域が接着剤組成物４の第１被着体１との界面側から内部に順次形成されるため（図６の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示し、第２光熱変換材１２ｈは加熱により第１波長のレーザ光を吸収して発熱した第２光熱変換材１２を示す）、接着剤組成物４の第１被着体１との界面側からの硬化が促進される。これにより、第１被着体１との界面側の接着剤組成物４の硬化度がより高くなるため、接着剤組成物４と第１被着体１との接着性がより高くなる。
　（第２光熱変換材）
　第２光熱変換材１２は、室温（たとえば２５℃）では第１波長のレーザ光を透過するかまたはほとんど吸収しないが、一定温度以上に加熱することにより第１波長のレーザ光Ｌ１を吸収して発熱する材料に変化する材料であれば特に制限はなく、サーモクロミック材料などが好適に挙げられる。サーモクロミック材料とは、所定の温度以上に加熱することにより色が変化する材料をいい、たとえば（株）記録素材総合研究所製サーマルカラーＯＩ－２２０は、２２０℃以上に加熱することにより、白色から黒色に変化する。変色する温度は調節可能である。
　［第６例］
　図７を参照して、本実施形態にかかる接着剤組成物の硬化方法の第６例は、第１例の構成に加えて、接着剤組成物４は、第１波長とは波長の異なる第２波長のレーザ光Ｌ２を吸収して発熱する第３光熱変換材１３を含み、接着剤組成物４を硬化させる工程において、接着剤組成物４および第１被着体１に第１波長のレーザ光Ｌ１および第２波長のレーザ光Ｌ２を照射する。第６例の接着剤組成物の硬化方法によれば、第１波長のレーザ光Ｌ１による第１被着体１の表面およびその近傍の第１光熱変換材の発熱（図７の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）に加えて、第２波長のレーザ光Ｌ２による接着剤組成物４の露出面およびその近傍の第３光熱変換材１３の発熱（図７の第３光熱変換材１３ｈは発熱した第３光熱変換材１３を示す）のため、接着剤組成物４は第１被着体１との界面側および露出面側の両側から硬化する。ただし、第６例においては、接着剤組成物４の界面側の硬化を確実にするために、接着剤組成物４の界面側の硬化が露出面側の硬化に比べて優先するように、第１波長のレーザ光Ｌ１の強度が第２波長のレーザ光Ｌ２の強度に比べて大きくする必要がある。これにより、第１被着体１との界面側および露出面側の接着剤組成物４の硬化度が高くなるため、接着剤組成物４と第１被着体１との接着性がより高くなる。
　（第３光熱変換材）
　第３光熱変換材１３は、第１波長のレーザ光Ｌ１を透過するとともに、第２波長のレーザ光Ｌ２を吸収して発熱する材料であれば特に制限はなく、近赤外吸収材料などが好適に挙げられる。近赤外線吸収材料としては、たとえば、１０６４ｎｍの波長のレーザ光を透過し８０８ｎｍの波長のレーザ光を吸収する山田化学工業（株）製ＦＤＮ―００２がある。
　［第７例］
　図８を参照して、本実施形態にかかる接着剤組成物の硬化方法の第７例は、第１例の構成に加えて、接着剤組成物４を配置する工程において、第１被着体１の表面および第１光熱変換材１１を少なくとも表面に含む第２被着体２の表面の両方に接するように接着剤組成物４を配置し、接着剤組成物４を硬化させる工程において、接着剤組成物４、第１被着体１および第２被着体２に第１波長のレーザ光Ｌ１を照射することにより接着剤組成物４を硬化させる。第７例の接着剤組成物の硬化方法によれば、第１波長のレーザ光Ｌ１による第１被着体１の表面およびその近傍の第１光熱変換材の発熱（図９の第１被着体１に含まれる第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）に加えて、第１波長のレーザ光Ｌ１による第２被着体２の表面およびその近傍の第１光熱変換材の発熱（図９の第２被着体２に含まれる第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）のため、接着剤組成物４は第１被着体１との界面側および第２被着体２との界面側から硬化する。これにより、接着剤組成物を介在させて第１被着体と第２被着体とを接着させることができるとともに、第１被着体１との界面側および第２被着体２との界面側の接着剤組成物４の硬化度が高くなるため、接着剤組成物４と第１被着体１および第２被着体２との接着性が高くなる。
　（第２被着体）
　第２被着体２は、上記の第１光熱変換材１１を少なくとも表面に含むものであれば特に制限はなく、ＰＢＴ（ポリブチレンテレフタテート）、ＰＥＴ（ポリエチレンテレフタレート）などの樹脂などを含むものでもよい。ここで、第２被着体２は、第１被着体１と化学組成が同一であっても異なっていてもよい。
　［第８例］
　図９を参照して、本実施形態にかかる接着剤組成物の硬化方法の第８例は、第１例の構成に加えて、接着剤組成物４を配置する工程において、第１被着体１の表面および第１波長のレーザ光Ｌ１を透過する第３被着体３の表面の両方に接するように接着剤組成物４を配置し、接着剤組成物４を硬化させる工程において、第３被着体３、接着剤組成物４および第１被着体１に第１波長のレーザ光Ｌ１を照射することにより接着剤組成物４を硬化させる。第８例の接着剤組成物の硬化方法によれば、第１波長のレーザ光Ｌ１による第１被着体１の表面およびその近傍の第１光熱変換材の発熱（図９の第１光熱変換材１１ｈは発熱した第１光熱変換材１１を示す）のため、接着剤組成物４は第１被着体１との界面側から硬化する。これにより、接着剤組成物を介在させて第１被着体と第３被着体とを接着させることができるとともに、第１被着体１との界面側の接着剤組成物４の硬化度が高くなるため、接着剤組成物４と第１被着体１との接着性が高くなる。
　（第３被着体）
　第３被着体３は、第１波長のレーザ光Ｌ１を透過する被着体であれば特に制限はないが、第３被着体３内における第１波長のレーザ光Ｌ１の吸収を抑制して、第１被着体１の表面への第１波長のレーザ光Ｌ１の透過を高くする観点から、厚さ０．５ｍｍの第３被着体３における透過率が、３０％以上が好ましく、５０％以上がより好ましく、８０％以上がさらに好ましい。ここで、透過率は、ガラス板に挟まれた厚さ０．５ｍｍの第３被着体にレーザ光を照射したときにパワーメータ受光器に入る光量により測定し、ガラス板および第３被着体が無い場合にパワーメータ受光器に入る光量を１００％としたときの百分率とする。第３被着体３としては、たとえば、ＰＢＴ（ポリブチレンテレフタテート）、ＰＡ（ポリアミド）、ＰＥＴ（ポリエチレンテレフタレート）などの色彩のない樹脂が挙げられる。
　＜実施形態２：接着構造体の製造方法＞
　［第１例］
　図１および図３～図７を参照して、本実施形態にかかる接着構造体の製造方法の第１例は、実施形態１にかかる接着剤組成物の硬化方法の第１例～第６例のいずれかの例により、第１被着体１に接着剤組成物４が接着された第１接着構造体１０１を製造する。第１例の接着構造体の製造方法によれば、接着剤組成物４の第１被着体１との界面側の硬化率が高くなるため、第１被着体１と接着剤組成物４との接着性が高い第１接着構造体１０１が得られる。
　［第２例］
　図８を参照して、本実施形態にかかる接着構造体の製造方法の第２例は、実施形態１にかかる接着剤組成物の硬化方法の第７例により、接着剤組成物４を介在させて第１被着体１と第２被着体２とが接着された第２接着構造体１０２を製造する。第２例の接着構造体の製造方法によれば、接着剤組成物４の第１被着体１との界面側および第２被着体２との界面側の硬化率が高くなるため、第１被着体１および第２被着体２と接着剤組成物４との接着性が高い第２接着構造体１０２が得られる。
　［第３例］
　図９を参照して、本実施形態にかかる接着構造体の製造方法の第３例は、実施形態１の接着剤組成物の硬化方法の第８例により、接着剤組成物４を介在させて第１被着体１と第３被着体３とが接着された第３接着構造体１０３を製造する。第３例の接着構造体の製造方法によれば、接着剤組成物４の第１被着体１との界面側の硬化率が高くなるため、第１被着体１と接着剤組成物４との接着性が高い第３接着構造体１０３が得られる。
　本実施形態にかかる接着構造体の製造方法により得られる第２接着構造体１０２としては、たとえば、図１０Ａから図１０Ｃに示すような接着剤組成物４を介在させてベース（第１被着体１）とケース（第２被着体２）が接着されたリレー部品などが挙げられる。ここで、図１０Ａは第２接着構造体１０２の概略斜視図であり、図１０Ｂは接着剤組成物４を介在して接着している第１被着体１および第２被着体２の部分拡大断面図であり、図１０Ｃは接着剤組成物４を介在して接着している第１被着体１と端子電極５との部分拡大図である。
　（実施例１）
　図１１を参照して、０．５質量％のカーボンブラック（第１光熱変換材１１）を含む厚さ１ｍｍのＰＢＴ（ポリブチレンテレフタテート）板（第１被着体１）の端部に深さ０．５ｍｍの溝を形成した。次いで、上記溝上に、１００質量部のビスフェノールＡ型エポキシ樹脂（三菱化学社製ｊＥＲ８２８）、５質量部のエポキシ樹脂イミダゾールアダクト化合物（味の素ファインテクノ社製アミキュア（登録商標）ＰＮ－２３）、２０質量部のカプセル型硬化剤（旭化成イーマテリアル社製ノバキュア（登録商標）ＨＸ－３７２２）、および２０質量部のシリカが配合された接着剤組成物４を配置し、その側面に波長８０８ｎｍのレーザ光を透過する厚さ０．５ｍｍのＰＢＴ（ポリブチレンテレフタテート）板の主面が接するように配置した。第１被着体１の主面に垂直な方向から上記接着剤組成物４および第１被着体１に、波長８０８ｎｍ（第１波長）のレーザ光（レーザ光源：イエナオプティックジャパン社製ＪＯＬＤ－３２－ＣＰＢＮ－１Ｌ）を照射した。レーザ光の照射条件は、レーザ出力２Ｗで１秒照射することにより接着剤組成物の第１被着体との界面を１３０℃まで昇温した後、レーザ出力０．８Ｗの照射で３０秒間１３０℃を保持した。硬化後の接着剤組成物４の深さ０．５ｍｍ（すなわち、樹脂組成物の第１被着体側の界面）における硬化率が９２％と極めて高く、第１被着体１と接着剤組成物４とが安定して接着性が高い第３接着構造体１０３が得られた。ここで、硬化率は、硬化前後の接着剤組成物の特定官能基の吸光度ピーク面積を比較することによって求めた。なお、硬化率は、特定官能基のピーク面積を用いて以下の式
　　硬化率（％）＝（硬化後のグリシジル基吸光度ピーク面積／硬化後のメチレン基の吸光度ピーク面積）／（硬化前のグリシジル基吸光度ピーク面積／硬化前のメチレン基の吸光度ピーク面積)
で表される。吸光度ピーク面積の測定については、ゴールデンダイヤモンドＡＴＲを付属したＦＴ－ＩＲ（パーキンエルマー社製ｓｙｓｔｅｍ２０００）を利用した。グリシジル基およびメチレン基の吸光度面積については、それぞれ、グリシジル基（吸収位置９１０ｃｍ-1付近）およびメチレン基（吸収位置２９００ｃｍ-1付近）の吸光度ピーク面積を採用した。一般的には、８０％の硬化状態であれば、十分に反応しているとされている。
　（比較例１）
　第１被着体としてカーボンブラックを含まない透明な厚さ１ｍｍのＰＢＴ（ポリブチレンテレフタテート）板を用いたこと、接着剤組成物として１００質量部のビスフェノールＡ型エポキシ樹脂（三菱化学社製ｊＥＲ８２８）、５質量部のエポキシ樹脂イミダゾールアダクト化合物（味の素ファインテクノ社製アミキュア（登録商標）ＰＮ－２３）、２０質量部のカプセル型硬化剤（旭化成イーマテリアル社製ノバキュア（登録商標）ＨＸ－３７２２）、２０質量部のシリカ、および１質量部のカーボンブラックが配合された接着剤組成物を用いたこと、接着剤組成物内の温度を１３０℃まで昇温させたこと以外は、実施例１と同様にして接着剤組成物を硬化させた。硬化後の接着剤組成物４の深さ０．５ｍｍ（すなわち、樹脂組成物の第１被着体側の界面）における硬化率が２７％と極めて低く、第１被着体１と接着剤組成物４との接着構造体１００は接着性が不安定で低かった（図２）。
　（実施例２）
　図３を参照して、０．５質量％のカーボンブラック（第１光熱変換材１１）を含む厚さ１ｍｍのＰＢＴ（ポリブチレンテレフタテート）板（第１被着体１）に、金属部分１ｍとして純銅の金属部品（幅０．８ｍｍ×厚さ０．２ｍｍ×高さ４．７ｍｍ）を設置した。第１被着体１の上に、１００質量部のビスフェノールＡ型エポキシ樹脂（三菱化学社製ｊＥＲ８２８）、５質量部のエポキシ樹脂イミダゾールアダクト化合物（味の素ファインテクノ社製アミキュア（登録商標）ＰＮ－２３）、２０質量部のカプセル型硬化剤（旭化成イーマテリアル社製ノバキュア（登録商標）ＨＸ－３７２２）、および２０質量部のシリカが配合された接着剤組成物４を配置した。第１被着体１とその金属部分１ｍに斜め４５°方向から上記接着剤組成物４と第１被着体１およびその金属部分１ｍとに、波長３６５ｎｍ（第３波長）のレーザ光を照射した。レーザ光の照射条件は、レーザ出力１２Ｗで４０秒照射することにより接着剤組成物と第１被着体１の金属部分１ｍとの界面を１３０℃まで昇温した後、レーザ出力１０Ｗの照射で３０秒間１３０℃を保持した。硬化後の接着剤組成物４の深さ０．５ｍｍ（すなわち、第１被着体およびその金属部分との界面）における硬化率が９０％と極めて高く、金属部分１ｍを含む第１被着体１と接着剤組成物４とが安定して接着性が高い第１接着構造体１０１が得られた。
　（実施例３）
　図８を参照して、０．５質量％のカーボンブラック（第１光熱変換材１１）を含む厚さ１ｍｍのＰＢＴ（ポリブチレンテレフタテート）板（第１被着体１）上に、１００質量部のビスフェノールＡ型エポキシ樹脂（三菱化学社製ｊＥＲ８２８）、５質量部のエポキシ樹脂イミダゾールアダクト化合物（味の素ファインテクノ社製アミキュア（登録商標）ＰＮ－２３）、２０質量部のカプセル型硬化剤（旭化成イーマテリアル社製ノバキュア（登録商標）ＨＸ－３７２２）、および２０質量部のシリカが配合された接着剤組成物４を配置し、その側面に０．５質量％のカーボンブラック（第１光熱変換材１１）を含む厚さ０．５ｍｍのＰＢＴ（ポリブチレンテレフタテート）板（第２被着体２）の主面が接するように配置した。第１被着体１の斜め４５°方向から上記接着剤組成物４および第１被着体１および第２被着体２に、波長８０８ｎｍ（第１波長）のレーザ光を照射した。レーザ光の照射条件は、レーザ出力２Ｗで１秒照射することにより接着剤組成物の第１被着体１および第２被着体２との界面を１３０℃まで昇温した後、レーザ出力０．８Ｗの照射で３０秒間１３０℃を保持した。硬化後の接着剤組成物４の深さ０．５ｍｍ（すなわち、樹脂組成物の第１被着体側の界面と樹脂組成物の第２被着体側の界面）における硬化率が９５％と極めて高く、第１被着体１および第２被着体２と接着剤組成物４とが安定して接着性が高い第２接着構造体１０２が得られた。
　（実施例４）
　図９を参照して、０．８質量％のカーボンブラック（第１光熱変換材１１）を含む厚さ１ｍｍのＰＢＴ（ポリブチレンテレフタテート）板（第１被着体１）上に、１００質量部のビスフェノールＡ型エポキシ樹脂（三菱化学社製ｊＥＲ８２８）、５質量部のエポキシ樹脂イミダゾールアダクト化合物（味の素ファインテクノ社製アミキュア（登録商標）ＰＮ－２３）、２０質量部のカプセル型硬化剤（旭化成イーマテリアル社製ノバキュア（登録商標）ＨＸ－３７２２）、および２０質量部のシリカが配合された接着剤組成物４を配置し、その上面にカーボンブラック（第１光熱変換材１１）を含まないナチュラル材の厚さ０．５ｍｍのＰＢＴ（ポリブチレンテレフタテート）板（第３被着体３）の主面が接するように配置した。第１被着体１の主面に垂直な方向から上記第３被着体３および接着剤組成物４および第１被着体１に、波長８０８ｎｍ（第１波長）のレーザ光を照射した。レーザ光の照射条件は、レーザ出力８Ｗで１秒照射することにより接着剤組成物の第１被着体との界面を１３０℃まで昇温した後、レーザ出力２Ｗの照射で３０秒間１３０℃を保持した。硬化後の接着剤組成物４の深さ０．５ｍｍ（すなわち、樹脂組成物の第１被着体側の界面）における硬化率が９１％と極めて高く、第１被着体１と接着剤組成物４とが安定して接着性が高い第３接着構造体１０３が得られた。
　今回開示された実施の形態および実施例はすべての点で例示であって、制限的なものではないと考えられるべきである。本発明の範囲は上記した実施の形態および実施例ではなく請求の範囲によって示され、請求の範囲と均等の意味、および範囲内でのすべての変更が含まれることが意図される。
　１　第１被着体、１ｍ　金属部分、２　第２被着体、３　第３被着体、４，４Ｒ　接着剤組成物、４ｃ　硬化膜、１１，１１ｈ　第１光熱変換材、１２，１２ｈ　第２光熱変換材、１３，１３ｈ　第３光熱変換材、１００　接着構造体、１０１　第１接着構造体、１０２　第２接着構造体、１０３　第３接着構造体、Ｌ１　第１波長のレーザ光、Ｌ２　第２波長のレーザ光、ＭＬ　磁気および／または別のレーザ光。

Claims (9)

  1. 　第１波長のレーザ光を吸収して発熱する第１光熱変換材を少なくとも表面に含む第１被着体の前記表面に接するように前記第１波長のレーザ光を透過する接着剤組成物を配置する工程と、
    　前記接着剤組成物および前記第１被着体に前記第１波長のレーザ光を照射することにより前記接着剤組成物を硬化させる工程と、を含む接着剤組成物の硬化方法。
  2. 　前記第１被着体は金属部分を含み、前記接着剤組成物を硬化させる工程において、前記金属部分を加熱する請求項１に記載の接着剤組成物の硬化方法。
  3. 　前記接着剤組成物は、加熱により前記第１波長のレーザ光を吸収して発熱する材料に変化する第２光熱変換材を含む請求項１に記載の接着剤組成物の硬化方法。
  4. 　前記接着剤組成物は、前記第１波長とは波長の異なる第２波長のレーザ光を吸収して発熱する第３光熱変換材を含み、
    　前記接着剤組成物を硬化させる工程において、前記接着剤組成物および前記第１被着体に前記第１波長のレーザ光および前記第２波長のレーザ光を照射する請求項１に記載の接着剤組成物の硬化方法。
  5. 　前記接着剤組成物を配置する工程において、前記第１被着体の前記表面および前記第１光熱変換材を少なくとも表面に含む第２被着体の前記表面の両方に接するように前記接着剤組成物を配置し、
    　前記接着剤組成物を硬化させる工程において、前記接着剤組成物、前記第１被着体および前記第２被着体に前記第１波長のレーザ光を照射することにより前記接着剤組成物を硬化させる、請求項１から請求項４のいずれか１項に記載の接着剤組成物の硬化方法。
  6. 　前記接着剤組成物を配置する工程において、前記第１被着体の前記表面および前記第１波長のレーザ光を透過する第３被着体の表面の両方に接するように前記接着剤組成物を配置し、
    　前記接着剤組成物を硬化させる工程において、前記第３被着体、前記接着剤組成物および前記第１被着体に前記第１波長のレーザ光を照射することにより前記接着剤組成物を硬化させる、請求項１から請求項４のいずれか１項に記載の接着剤組成物の硬化方法。
  7. 　請求項１から請求項４のいずれか１項に記載の接着剤組成物の硬化方法により、前記第１被着体に前記接着剤組成物が接着された第１接着構造体を製造する接着構造体の製造方法。
  8. 　請求項５に記載の接着剤組成物の硬化方法により、前記接着剤組成物を介在させて前記第１被着体と前記第２被着体とが接着された第２接着構造体を製造する接着構造体の製造方法。
  9. 　請求項６に記載の接着剤組成物の硬化方法により、前記接着剤組成物を介在させて前記第１被着体と前記第３被着体とが接着された第３接着構造体を製造する接着構造体の製造方法。
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Publication number Priority date Publication date Assignee Title
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6363773A (ja) * 1986-09-04 1988-03-22 Nippon Telegr & Teleph Corp <Ntt> 接着方法
US20030201059A1 (en) * 2002-04-24 2003-10-30 Holman Thomas J. Selective manipulation of material for medical devices and methods and devices made therefrom
US20060105493A1 (en) * 2004-11-15 2006-05-18 Osram Opto Semiconductors Gmbh Encapsulation of organic devices
JP2011235604A (ja) * 2010-05-13 2011-11-24 Hamamatsu Photonics Kk 熱硬化性樹脂接合方法
WO2014156905A1 (ja) * 2013-03-25 2014-10-02 大日本印刷株式会社 電池用包装材料
JP2015125185A (ja) * 2013-12-25 2015-07-06 シャープ株式会社 携帯端末及びその製造方法
JP2015174911A (ja) 2014-03-14 2015-10-05 オムロン株式会社 樹脂組成物の硬化方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002166653A (ja) * 2000-12-04 2002-06-11 Dainippon Printing Co Ltd 感熱記録層、感熱記録体、感熱記録層転写シート、感熱記録層貼付用ラベル、感熱記録層の適用方法、および記録方法
US20080014532A1 (en) 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
JP2008308525A (ja) * 2007-06-12 2008-12-25 Toyo Ink Mfg Co Ltd レーザー光感光性感圧式接着剤組成物及びその利用
CN101679729B (zh) * 2007-06-13 2012-04-25 胜技高分子株式会社 复合成形品
JP5342286B2 (ja) * 2008-05-16 2013-11-13 日東電工株式会社 シート接合体の製造方法及びシート接合体
JP6046329B2 (ja) * 2010-01-08 2016-12-14 早川ゴム株式会社 レーザー光を用いた接合方法
CN101788713A (zh) * 2010-01-19 2010-07-28 武汉凌云光电科技有限责任公司 半导体激光胶水固化装置及应用方法
AU2011254776B2 (en) * 2010-05-18 2015-04-02 Basf Se Laser-transparent polyester
WO2012104006A1 (en) 2011-02-03 2012-08-09 Merck Patent Gmbh Laser-markable and laser-weldable polymers
JP5736331B2 (ja) * 2012-03-02 2015-06-17 早川ゴム株式会社 レーザー光を用いた接合方法
US9412702B2 (en) * 2013-03-14 2016-08-09 Intel Corporation Laser die backside film removal for integrated circuit (IC) packaging
CN105968566B (zh) * 2016-05-31 2018-08-28 广东顺德华焯机械科技有限公司 用于透光塑料激光透射焊接的吸收剂的制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6363773A (ja) * 1986-09-04 1988-03-22 Nippon Telegr & Teleph Corp <Ntt> 接着方法
US20030201059A1 (en) * 2002-04-24 2003-10-30 Holman Thomas J. Selective manipulation of material for medical devices and methods and devices made therefrom
US20060105493A1 (en) * 2004-11-15 2006-05-18 Osram Opto Semiconductors Gmbh Encapsulation of organic devices
JP2011235604A (ja) * 2010-05-13 2011-11-24 Hamamatsu Photonics Kk 熱硬化性樹脂接合方法
WO2014156905A1 (ja) * 2013-03-25 2014-10-02 大日本印刷株式会社 電池用包装材料
JP2015125185A (ja) * 2013-12-25 2015-07-06 シャープ株式会社 携帯端末及びその製造方法
JP2015174911A (ja) 2014-03-14 2015-10-05 オムロン株式会社 樹脂組成物の硬化方法

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