WO2018223659A1 - Anneau de dépôt et ensemble mandrin - Google Patents

Anneau de dépôt et ensemble mandrin Download PDF

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Publication number
WO2018223659A1
WO2018223659A1 PCT/CN2017/117140 CN2017117140W WO2018223659A1 WO 2018223659 A1 WO2018223659 A1 WO 2018223659A1 CN 2017117140 W CN2017117140 W CN 2017117140W WO 2018223659 A1 WO2018223659 A1 WO 2018223659A1
Authority
WO
WIPO (PCT)
Prior art keywords
deposition ring
ring
annular body
chuck assembly
deposition
Prior art date
Application number
PCT/CN2017/117140
Other languages
English (en)
Chinese (zh)
Inventor
李新颖
张禄禄
李冰
赵梦欣
边国栋
Original Assignee
北京北方华创微电子装备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 北京北方华创微电子装备有限公司 filed Critical 北京北方华创微电子装备有限公司
Publication of WO2018223659A1 publication Critical patent/WO2018223659A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a deposition ring and a chuck assembly using the same, and more particularly to a deposition ring and chuck assembly for use in a sputtering apparatus for integrated circuit fabrication.
  • PVD physical vapor deposition
  • the commonly used technology is magnetron sputtering.
  • a typical sputtering device is shown in Figure 1.
  • the device has a reaction chamber.
  • the body 1, the target 4, the insulating material 2, the insulating material 2 and the target 4 form a chamber and are filled with deionized water 3.
  • the DC power source applies a bias voltage to the target 4, causing it to become a negative pressure with respect to the grounded reaction chamber 1, so that argon gas is discharged to generate plasma, and the negative bias can simultaneously supply positively charged argon ions. Attracted to the target 4.
  • the susceptor 9 is disposed in the reaction chamber 1 for fixing, supporting and transferring the wafer 10 and achieving temperature control. In order to avoid the movement or misalignment of the wafer 10 during the process, the susceptor 9 tends to use a high temperature electrostatic chuck structure.
  • a deposition ring 11 is provided to protect the electrostatic chuck from contamination by the film material; when the deposition ring 11 is treated by sand blasting, the contaminant is more likely to adhere to the deposition ring. 11 does not fall off, thus ensuring the durability of the process; the additional design requirements of the deposition ring 11 are also convenient to disassemble, easy to replace, and can be regularly cleaned.
  • Figure 2 illustrates an electrostatic chuck assembly used in prior art sputtering equipment. It includes an insulating layer 201, a susceptor 202, a deposition ring 203, and a pressure ring 204.
  • the insulating layer 201 is used to support the wafer, and the pedestal 202 is used to support the insulating layer 201, and at the same time, the RF bias can be connected, and the temperature of the wafer can be controlled.
  • Figure 3 is an enlarged view of Figure 2 at I.
  • an annular projection 2041 is provided on the pressure ring 204, which causes a gap G between the pressure ring 204 and the deposition ring 203.
  • FIG. 4 and 5 show partial cross-sectional and perspective views, respectively, of the deposition ring 203 of FIG.
  • the bottom surface of the deposition ring 203 is a flat surface and directly falls on the base 202; and the top surface is formed with a groove 2031, and the groove 2031 is sandblasted to increase the particle layer.
  • the deposition area prevents particle contamination of the wafer and also extends the cleaning cycle of the deposition ring 203.
  • the present invention is directed to at least one of the technical problems existing in the prior art, and provides a deposition ring and a chuck assembly using the same, which at least reduces the risk of displacement and shedding of the deposition ring.
  • a solution to the above objects of the present invention is to provide a deposition ring for use with a pressure ring and a base in a chuck assembly.
  • the deposition ring includes: an annular body having an upper surface and a lower surface; an annular groove formed on the upper surface; wherein the deposition ring further includes a snap portion for the depositing A ring is snapped onto the base to secure the deposition ring to the base.
  • a chuck assembly including a pressure ring, a base, and a deposition ring for use with the pressure ring and the base, the deposition ring including an upper surface and a lower surface An annular body of the surface; and an annular groove formed in the upper surface; wherein the deposition ring further includes a snap portion for snapping the deposition ring to the base; the chuck assembly Also included is a snap member including a lower side portion connected to the base, an upper side portion engaged with the catch portion, and a lower side portion and the upper side portion connecting the lower side portion and the upper side portion Middle part.
  • FIG. 1 is a schematic view of a sputtering apparatus of the prior art
  • FIG. 2 is a schematic view of an electrostatic chuck assembly of the prior art
  • FIG. 3 is a schematic view of a prior art deposition ring with a pressure ring and a base;
  • Figure 4 is a partial enlarged cross-sectional view of the deposition ring shown in Figure 3;
  • Figure 5 is a perspective view of the deposition ring shown in Figure 3;
  • FIG. 6 is a cross-sectional view of a chuck assembly including a base, a deposition ring, and a pressure ring, in accordance with one embodiment of the present invention
  • Figure 7 is a partial enlarged view of Figure 6, more clearly showing the cooperation of the deposition ring with the base and the pressure ring;
  • Figure 8 is a cross-sectional view of the deposition ring of Figure 6 at the snap portion
  • Figure 9 is a perspective view of a deposition ring and its snap portion, in accordance with one embodiment
  • Figure 12 is a perspective view of a snap member of a chuck assembly in accordance with one embodiment of the present invention.
  • Figure 13 illustrates a pre-installation state of a snap fastener in accordance with one embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a chuck assembly including a base 40, a deposition ring 50 and a pressure ring 60, in accordance with one embodiment of the present invention.
  • Figure 7 is a partial enlarged view of the area II of Figure 6, which more clearly shows the cooperation of the deposition ring 50 with the base 40 and the pressure ring 60;
  • Figure 8 is the deposition ring 50 of Figure 6 at the snap portion Sectional view.
  • the deposition ring 50 is used in conjunction with the pressure ring 60 and the base 40.
  • the deposition ring 50 includes: an annular body 51 having an upper surface 52 and a lower surface 53; an annular groove 55 formed in the upper surface 52; further, the deposition ring 50 further includes a snap portion 58, the snap portion 58 is used to snap the deposition ring 50 to the base 40 to secure the deposition ring 50 to the base 40.
  • the number of the engaging portions 58 is two, and the two engaging portions 58 may be disposed on opposite sides of the deposition ring 50 along the circumferential direction of the deposition ring 50 (for example, the left and right in FIG. 6 Sides; alternatively, the number of the engaging portions 58 is two or more, and is disposed along the circumference of the surrounding base 40.
  • the deposition ring 50 Since the deposition ring 50 is snapped onto the susceptor 40, the rise of the pressure ring 60 does not bring up the deposition ring 50 even when a slight adhesion of the deposition ring 50 and the pressure ring 60 occurs. Thereby, the risk of displacement and shedding of the deposition ring 50 can be reduced, the working time of the deposition ring 50 is prolonged, and the process result is improved.
  • the deposition ring 50 further includes a projection 56 formed on the upper surface 52, the projection 56 mating with the pressure ring 60, for example, on the lower surface of the pressure ring 60.
  • a recess recessed toward the upper surface thereof is provided at a position corresponding to the projection 56, and the position of the deposition ring 50 and the pressure ring 60 is concentrically arranged by the engagement of the projection 56 with the recess.
  • the deposition ring 50 and the pressure ring 60 can be positioned concentric, and on the other hand the particles can be prevented from entering the deposition ring 50 and the pressure ring 60 radially outward of the protrusion 56.
  • the present invention expands the gap width there by reducing the thickness of the deposition ring 50 (i.e., the slit is in the drawing)
  • the width in the vertical direction in fact, reducing the thickness of the deposition ring 50 can also be understood as increasing the height of the projection 56 in the vertical direction.
  • the deposition ring 50 further includes a recess 57 formed on the upper surface 52 at a radially outer side of the protrusion 56, the recess 57 and the protrusion 56 being in the deposition ring 50 and pressing A labyrinth structure is formed between the rings 60, that is, the recesses 57 and the projections 56 are disposed such that the height of the upper surface of the deposition ring 50 is staggered to form a labyrinth structure, thereby preventing the sputtered particles from reaching an undesired area.
  • FIG. 9A is a perspective view of a deposition ring and a snap portion thereof according to an embodiment
  • FIG. 9B is an enlarged view of a P region of FIG. 9A.
  • the engaging portion 58 is formed in the annular body 51.
  • the shaped passage 58A is a section of a pipe communicating between the opening end and the end opening of the section, and the sectional shape in the vertical direction is similar to the figure obtained by flipping the letter L 180 degrees in the vertical direction, which is referred to as " The specific direction is that it extends upward from the opening end opening of the lower surface of the annular body 51 and then rotates toward the radially outer side of the annular body 51 until reaching the end of the outer surface of the annular body 51. End opening.
  • said The angle of the shaped passage 58A is 70° to 85°, that is, the horizontal section thereof is slightly inclined downward. This makes it easier to catch the corresponding component of the chuck assembly (i.e., the snap member 80 of Fig. 7, which will be described later in detail).
  • the horizontal section of the shaped passage 58A may also not necessarily extend to the outer surface of the annular body 51, that is, no termination end opening is provided, such that The shape of the shaped passage 58A is such that it extends upward from the lower surface of the annular body 51 and then rotates toward the radially outer side of the annular body 51.
  • said The horizontal section of the shaped passage 58A may also be extended to extend radially outward of the annular body 51 to extend toward the radially inner side of the annular body 51, ie, The shaped passage 58A is turned 180 degrees in the horizontal direction and becomes Shaped channel.
  • the engaging portion 58 is formed on the lower side of the annular body 51.
  • Shape hook 58B said The cross-sectional shape of the hook 58B in the vertical direction is similar to the figure obtained by flipping the letter L 180 degrees in the horizontal direction, which is referred to as " The specific direction is that it extends downward along the lower side of the annular body 51 and then rotates toward the radially inner side of the annular body 51, and can catch the corresponding snap member 80B.
  • said The hook 58B has an included angle of 70° to 85°, that is, its horizontal section is slightly inclined upward, and specifically, the one end of the horizontal section at the radially outer side of the annular body 51 is slightly lower than the radially inner side of the annular body 51. One end.
  • the engaging portion 58 is a sawtooth row 58C arranged in the vertical direction formed on the lower side of the annular body 51, in the sawtooth row 58C At least a portion of the serrations are oriented so as to be inclined upward from the serrated end toward the serrated tip so as to give an upwardly supporting force to the corresponding snap member 80C, thereby engaging the catch 80C. In order to provide greater support to the catch member 80C, preferably all of the serrations in the array of serrations are oriented to be inclined upward from the serrated tip toward the serrated tip.
  • the deposition rings of the present invention can all be snapped onto the pedestal to avoid sticking.
  • the present invention also provides a chuck assembly, which will be described in detail below with reference to the accompanying drawings.
  • the chuck assembly includes a pressure ring 60, a base 70, and a deposition ring 50 for use with the pressure ring 60 and the base 70, the deposition ring 50 including an annular body 51 having an upper surface 52 and a lower surface 53; An annular groove 55 of the upper surface 52; wherein the deposition ring 50 further includes at least two snap portions 58 for snapping into the base 70; the chuck assembly further includes a snap member 80.
  • the latching member 80 includes a lower side portion 801 connected to the base 70, an upper side portion 803 that is engaged with the engaging portion 58, and a connecting the lower side portion 801 and the upper side portion.
  • the deposition ring 50 is snapped to the base 40 using the snap member 80, even if a slight sticking occurs between the pressure ring 60 and the deposition ring 50, the rise of the pressure ring 60 does not occur.
  • the deposition ring 50 is brought up. Thereby, the risk of displacement and shedding of the deposition ring 50 can be reduced, and the working time of the deposition ring 50 can be prolonged.
  • the deposition ring 50 further includes a protrusion 56 formed on the upper surface 52, and is disposed to be recessed toward the upper surface thereof at a position of the lower surface of the pressure ring 60 corresponding to the protrusion 56.
  • the deposition ring 50 further includes a recess 57 formed on the radially outer side of the protrusion 56 formed on the upper surface 52 of the deposition ring 50, the recess 57 cooperating with the protrusion 56 formed on the lower surface of the pressure ring 60 to A labyrinth structure is formed between the deposition ring 50 and the pressure ring 60.
  • the engaging portion 58 is formed in the annular body 51.
  • Shape channel 58A the The shape of the shaped passage 58A is such that it extends upward from the opening end opening of the lower surface of the annular body 51 and then rotates toward the radially outer side of the annular body 51 until reaching the outer surface of the annular body 51.
  • the intermediate portion 802 of the latching member 80 is in the vertical direction, and the upper side portion 803 of the latching member 80 can enter the Shape channel 58A.
  • FIG. 13 there is shown a pre-installation state of a snap fastener in accordance with one embodiment of the present invention.
  • the shaped passage 58A is engaged, firstly pressing the snap member 80 so that the intermediate portion 802 is inclined radially inward to enter The vertical section of the shaped passage 58A; then, after the upper side portion 803 of the fastener 80 is brought into position, the pressing is released. Under the elastic force of the intermediate portion 802, the upper side portion 803 of the snap member 80 enters the The horizontal section of the shaped passage 58A catches the deposition ring 50 to the engaged state shown in FIG.
  • said The angle of the shaped passage 58A is 70° to 85°, that is, the horizontal section thereof is slightly inclined downward.
  • the engaging portion 58 is formed on the lower side of the annular body 51.
  • Shape hook 58B said The shape of the hook 58B extends downward along the lower side of the annular body 51 and then rotates toward the radially inner side of the annular body 51. Accordingly, the upper side of the snap member 80B has the upper side. A strip-shaped opening with a hook.
  • the The hook 58B has an included angle of 70° to 85°, that is, its horizontal section is slightly inclined upward.
  • the engaging portion 58A is a sawtooth row 58C which is formed in a vertical direction with the lower side of the annular body 51, and the upper surface of the sawtooth of the sawtooth row 58C Parallel to the horizontal plane.
  • the upper side of the latching member 80C has a corresponding row of serrations, and the row of serrations of the latching member 80 can engage with the serrated row 58C of the latching portion 58.
  • a separate snap member is used to connect the deposition ring and the base, it will be understood by those skilled in the art that the snap member may be integrally formed with one of the deposition ring and the base, and then the card The other end of the fastener is snapped to the other side.
  • the lower side portion 801 of the snap member 80 is a curved piece having circumferentially opposite sides of the curved piece having mounting holes 8011 through which the snap member 80 is detachably Mounted to the base 40.
  • Such a curved lower side design has a shape that fits a partial contour of the base 40, and the locking member 50 can be securely mounted to the base 40 after being mounted to the base 40 through the mounting holes on both sides. .
  • the snap member 80 of Figure 13 is mounted to the base 40 and then snapped onto the deposition ring 50; it is contemplated that the snap member can also be designed to be mounted to the deposition ring and snapped onto the base.
  • a pin structure can also be used to prevent the deposition ring from being pulled up by the pressure ring due to adhesion.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un anneau de dépôt (50) et un ensemble mandrin utilisant ce dernier. L'anneau de dépôt (50) est utilisé dans l'ensemble mandrin en coopération avec un anneau de pression (60) et une base (40), et comprend : un corps annulaire (51) présentant une surface supérieure (52) et une surface inférieure (53); et une rainure annulaire (55) formée sur la surface supérieure (52). L'anneau de dépôt (50) comprend en outre une partie de serrage (58) destinée au serrage sur la base (40). Grâce au serrage de l'anneau de dépôt sur la base, le risque de déplacement et de détachement de l'anneau de dépôt peut être réduit, ce qui permet d'augmenter le temps de travail efficace de l'anneau de dépôt et de l'ensemble mandrin.
PCT/CN2017/117140 2017-06-08 2017-12-19 Anneau de dépôt et ensemble mandrin WO2018223659A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710430202.3 2017-06-08
CN201710430202.3A CN109023287B (zh) 2017-06-08 2017-06-08 沉积环及卡盘组件

Publications (1)

Publication Number Publication Date
WO2018223659A1 true WO2018223659A1 (fr) 2018-12-13

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PCT/CN2017/117140 WO2018223659A1 (fr) 2017-06-08 2017-12-19 Anneau de dépôt et ensemble mandrin

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CN (1) CN109023287B (fr)
TW (1) TWI668797B (fr)
WO (1) WO2018223659A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115074690B (zh) * 2022-06-24 2023-10-13 北京北方华创微电子装备有限公司 半导体工艺设备及其承载装置

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH09202969A (ja) * 1996-01-26 1997-08-05 Applied Materials Inc ウエハ加熱器用成膜防護具
JP2000273626A (ja) * 1999-03-24 2000-10-03 Advanced Display Inc 薄膜の成膜装置およびこれを用いて薄膜が形成された液晶表示装置
US20030075433A1 (en) * 2001-10-19 2003-04-24 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for self-aligning a cover ring in a sputter chamber
TW200523383A (en) * 2004-01-02 2005-07-16 Promos Technologies Inc Deposition ring and substrate support apparatus using the same
CN101089220A (zh) * 2005-10-31 2007-12-19 应用材料股份有限公司 用于衬底处理室的处理配件和靶材
TW200925327A (en) * 2007-08-24 2009-06-16 Applied Materials Inc Deposition ring and cover ring to extend process components life and performance for process chambers
CN103069542A (zh) * 2010-08-20 2013-04-24 应用材料公司 延长寿命的沉积环

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7670436B2 (en) * 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US20070283884A1 (en) * 2006-05-30 2007-12-13 Applied Materials, Inc. Ring assembly for substrate processing chamber
CN207176067U (zh) * 2017-06-08 2018-04-03 北京北方华创微电子装备有限公司 沉积环及卡盘组件

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09202969A (ja) * 1996-01-26 1997-08-05 Applied Materials Inc ウエハ加熱器用成膜防護具
JP2000273626A (ja) * 1999-03-24 2000-10-03 Advanced Display Inc 薄膜の成膜装置およびこれを用いて薄膜が形成された液晶表示装置
US20030075433A1 (en) * 2001-10-19 2003-04-24 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for self-aligning a cover ring in a sputter chamber
TW200523383A (en) * 2004-01-02 2005-07-16 Promos Technologies Inc Deposition ring and substrate support apparatus using the same
CN101089220A (zh) * 2005-10-31 2007-12-19 应用材料股份有限公司 用于衬底处理室的处理配件和靶材
TW200925327A (en) * 2007-08-24 2009-06-16 Applied Materials Inc Deposition ring and cover ring to extend process components life and performance for process chambers
CN103069542A (zh) * 2010-08-20 2013-04-24 应用材料公司 延长寿命的沉积环

Also Published As

Publication number Publication date
TW201903953A (zh) 2019-01-16
CN109023287B (zh) 2024-05-17
CN109023287A (zh) 2018-12-18
TWI668797B (zh) 2019-08-11

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