WO2018218594A1 - 用于太阳能光电板的封装胶 - Google Patents

用于太阳能光电板的封装胶 Download PDF

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WO2018218594A1
WO2018218594A1 PCT/CN2017/086810 CN2017086810W WO2018218594A1 WO 2018218594 A1 WO2018218594 A1 WO 2018218594A1 CN 2017086810 W CN2017086810 W CN 2017086810W WO 2018218594 A1 WO2018218594 A1 WO 2018218594A1
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solar photovoltaic
parts
encapsulant
packaging adhesive
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PCT/CN2017/086810
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朱桂林
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苏州佳亿达电器有限公司
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Priority to CN201780001758.9A priority patent/CN107735473A/zh
Publication of WO2018218594A1 publication Critical patent/WO2018218594A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to a package hot melt adhesive, in particular to an encapsulant for bonding tempered glass and a battery sheet in a solar photovoltaic panel assembly process.
  • the main body of the power generation is a crystalline silicon cell.
  • the cell sheet In order to protect the cell, it is necessary to cover the cell sheet with a transparent tempered glass, and the tempered glass and the cell sheet are encapsulated.
  • EVA resin is mainly used as the package hot melt adhesive, but the EVA is exposed to air and is prone to aging and yellowing, which affects the light transmittance, thereby affecting the power generation efficiency, and when exposed to the air for a long time, EVA The bond strength with tempered glass and battery sheets is also greatly reduced, thereby affecting the life of the photovoltaic panel assembly.
  • an object of the present invention to provide an encapsulant for a solar photovoltaic panel which has high light transmittance, excellent aging resistance, weather resistance and high bond strength.
  • An encapsulant for solar photovoltaic panels comprising the following parts by weight:
  • the encapsulant for solar photovoltaic panels wherein the ethylene-hydroxyethyl acrylate copolymer has a vinyl monomer content of 33 to 35 wt%, and the balance is a vinyl acetate monomer.
  • the encapsulant for solar photovoltaic panels wherein the ethylene-hydroxyethyl acrylate copolymer has a number average molecular weight of 16,000 to 20,000 g/mol.
  • the encapsulant for a solar photovoltaic panel wherein the polymethacryl
  • the acid ethyl ester has a number average molecular weight of 30,000 to 35,000 g/mol.
  • the encapsulant for a solar photovoltaic panel wherein the polyimide has a number average molecular weight of 23,000 to 26,000 g/mol.
  • the encapsulant for solar photovoltaic panels wherein the polyethylene glycol has a number average molecular weight of 4000 to 5000 g/mol.
  • the encapsulant for solar photovoltaic panels further comprises 0.2 to 0.3 parts by weight of cerium oxide.
  • the encapsulant for solar photovoltaic panels further comprises 0.2 to 0.3 parts by weight of magnesium oxide.
  • the invention has the beneficial effects that the weathering performance of the encapsulant is improved by introducing polyimide into the polyethyl methacrylate system; at the same time, ethylene-hydroxyethyl acrylate copolymer, polyethylene glycol and sodium oxalate are used as Auxiliary modifiers not only can synergistically improve the weatherability and stability of the encapsulant, but also effectively improve the bonding strength of the encapsulant during long-term exposure to the outdoors, reduce the impact of the encapsulant itself on the transmittance, and ensure photovoltaic Board power generation efficiency and service life.
  • the present invention proposes an encapsulant for a solar photovoltaic panel according to an embodiment, comprising the following parts by weight:
  • the content of the ethylene monomer is preferably 33 to 35 wt%, and the balance is a vinyl acetate monomer.
  • the number average molecular weight of the ethylene-hydroxyethyl acrylate copolymer is preferably from 16,000 to 20,000 g/mol.
  • the number average molecular weight of the polyethyl methacrylate is preferably from 30,000 to 35,000 g/mol.
  • the number average molecular weight of the polyimide is preferably 23,000 to 26,000 g/mol.
  • the number average molecular weight of the polyethylene glycol is preferably from 4,000 to 5,000 g/mol.
  • cerium oxide it is also preferable to include 0.2 to 0.3 parts by weight of cerium oxide.
  • magnesium oxide it is also preferable to include 0.2 to 0.3 parts by weight of magnesium oxide.
  • Table 1 lists the specific composition of the encapsulant of different embodiments and its performance parameters:
  • Ultimate tolerance UV irradiation time / 25W, 20 ° C means: at 20 ° C, 25W UV intensity, the package adhesive meets no yellowing, no hard, no cracking, the bond strength is less than 5% The longest exposure time.
  • the table below is the same.
  • Table 2 lists the specific composition and performance parameters of the different proportions of the encapsulant:

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Photovoltaic Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

一种用于太阳能光电板的封装胶，包括以下重量份的材料：聚甲基丙烯酸乙酯50重量份；聚酰亚胺50重量份；乙烯-丙烯酸羟乙酯共聚物10～12重量份；聚乙二醇5～6重量份和草酸钠2～3重量份。通过在聚甲基丙烯酸乙酯体系中引入聚酰亚胺，提高了封装胶的耐候性能；同时，乙烯-丙烯酸羟乙酯共聚物、聚乙二醇和草酸钠作为辅助改性助剂，不仅可以协同提高封装胶的耐候性和稳定性，还能有效提高封装胶在长期暴露于户外时的粘结强度，减小封装胶本身对透光率的影响，保证光伏板的发电效率和使用寿命。

Description

用于太阳能光电板的封装胶 技术领域
本发明涉及一种封装热熔胶，具体涉及一种用于在太阳能光电板装配工艺中粘结钢化玻璃与电池片的封装胶。
背景技术
在太阳能光伏板中，发电主体是晶体硅电池片，为了保护这种电池片，需要在电池片上盖一次透明的钢化玻璃，而连接这种钢化玻璃与电池片的就是封装胶。在现有技术中，主要采用EVA树脂作为这种封装热熔胶，但EVA暴露在空气中易老化发黄，会影响透光率，从而影响发电效率，并且，长期暴露于空气中时，EVA与钢化玻璃、电池片的粘结强度也会大大下降，从而影响光伏板组件的寿命。
发明内容
针对现有技术的不足之处，本发明的目的在于提供一种用于太阳能光电板的封装胶，其具有高透光性、优异的耐老化性、耐候性以及高粘结强度。
本发明的技术方案概述如下：
一种用于太阳能光电板的封装胶，包括以下重量份的材料：
Figure PCTCN2017086810-appb-000001
优选的是，所述的用于太阳能光电板的封装胶，其中，所述乙烯-丙烯酸羟乙酯共聚物中，乙烯单体的含量为33～35wt％，其余为醋酸乙烯酯单体。
优选的是，所述的用于太阳能光电板的封装胶，其中，所述乙烯-丙烯酸羟乙酯共聚物的数均分子量为16000～20000g/mol。
优选的是，所述的用于太阳能光电板的封装胶，其中，所述聚甲基丙烯 酸乙酯的数均分子量为30000～35000g/mol。
优选的是，所述的用于太阳能光电板的封装胶，其中，所述聚酰亚胺的数均分子量为23000～26000g/mol。
优选的是，所述的用于太阳能光电板的封装胶，其中，所述聚乙二醇的数均分子量为4000～5000g/mol。
优选的是，所述的用于太阳能光电板的封装胶，其中，还包括0.2～0.3重量份的氧化钡。
优选的是，所述的用于太阳能光电板的封装胶，其中，还包括0.2～0.3重量份的氧化镁。
本发明的有益效果是：本案通过在聚甲基丙烯酸乙酯体系中引入聚酰亚胺，提高了封装胶的耐候性能；同时，乙烯-丙烯酸羟乙酯共聚物、聚乙二醇和草酸钠作为辅助改性助剂，不仅可以协同提高封装胶的耐候性和稳定性，还能有效提高封装胶在长期暴露于户外时的粘结强度，减小封装胶本身对透光率的影响，保证光伏板的发电效率和使用寿命。
具体实施方式
下面结合实施例对本发明做进一步的详细说明，以令本领域技术人员参照说明书文字能够据以实施。
本案提出一实施例的用于太阳能光电板的封装胶，包括以下重量份的材料：
Figure PCTCN2017086810-appb-000002
其中，乙烯-丙烯酸羟乙酯共聚物中，乙烯单体的含量优选为33～35wt％，其余为醋酸乙烯酯单体。
其中，乙烯-丙烯酸羟乙酯共聚物的数均分子量优选为16000～20000g/mol。
其中，聚甲基丙烯酸乙酯的数均分子量优选为30000～35000g/mol。
其中，聚酰亚胺的数均分子量优选为23000～26000g/mol。
其中，聚乙二醇的数均分子量优选为4000～5000g/mol。
其中，还可优选包括0.2～0.3重量份的氧化钡。
其中，还可优选包括0.2～0.3重量份的氧化镁。
表一列出不同实施例的封装胶的具体组成及其性能参数：
表一
Figure PCTCN2017086810-appb-000003
Figure PCTCN2017086810-appb-000004
*极限耐受紫外照射时间/25W,20℃是指：在20℃下，25W的紫外强度下照射，封装胶满足不发黄，不发硬，不开裂，粘结强度降幅小于5％所能承受的最长照射时间。下表同。
表二列出不同对比例的封装胶的具体组成及其性能参数：
表二
Figure PCTCN2017086810-appb-000005
Figure PCTCN2017086810-appb-000006
尽管本发明的实施方案已公开如上，但其并不仅仅限于说明书和实施方式中所列运用，它完全可以被适用于各种适合本发明的领域，对于熟悉本领域的人员而言，可容易地实现另外的修改，因此在不背离权利要求及等同范围所限定的一般概念下，本发明并不限于特定的细节。

Claims (8)

  1. 一种用于太阳能光电板的封装胶，包括以下重量份的材料：
    Figure PCTCN2017086810-appb-100001
  2. 根据权利要求1所述的用于太阳能光电板的封装胶，其特征在于，所述乙烯-丙烯酸羟乙酯共聚物中，乙烯单体的含量为33～35wt％，其余为醋酸乙烯酯单体。
  3. 根据权利要求1所述的用于太阳能光电板的封装胶，其特征在于，所述乙烯-丙烯酸羟乙酯共聚物的数均分子量为16000～20000g/mol。
  4. 根据权利要求1所述的用于太阳能光电板的封装胶，其特征在于，所述聚甲基丙烯酸乙酯的数均分子量为30000～35000g/mol。
  5. 根据权利要求1所述的用于太阳能光电板的封装胶，其特征在于，所述聚酰亚胺的数均分子量为23000～26000g/mol。
  6. 根据权利要求1所述的用于太阳能光电板的封装胶，其特征在于，所述聚乙二醇的数均分子量为4000～5000g/mol。
  7. 根据权利要求1所述的用于太阳能光电板的封装胶，其特征在于，还包括0.2～0.3重量份的氧化钡。
  8. 根据权利要求7所述的用于太阳能光电板的封装胶，其特征在于，还包括0.2～0.3重量份的氧化镁。
PCT/CN2017/086810 2017-06-01 2017-06-01 用于太阳能光电板的封装胶 WO2018218594A1 (zh)

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CN107735473A (zh) * 2017-06-01 2018-02-23 苏州佳亿达电器有限公司 用于太阳能光电板的封装胶
CN114989748A (zh) * 2022-07-05 2022-09-02 苏州地枢新材料科技有限公司 一种发光地砖安装使用的粘黏剂及其制备方法和应用

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CN106457787A (zh) * 2014-05-15 2017-02-22 凸版印刷株式会社 阻气性包装材料
CN107735473A (zh) * 2017-06-01 2018-02-23 苏州佳亿达电器有限公司 用于太阳能光电板的封装胶

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