WO2018212181A1 - Élément de vibration de cristal de diapason, procédé de fabrication d'élément de vibration de cristal de diapason, et vibreur à cristal de diapason - Google Patents

Élément de vibration de cristal de diapason, procédé de fabrication d'élément de vibration de cristal de diapason, et vibreur à cristal de diapason Download PDF

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Publication number
WO2018212181A1
WO2018212181A1 PCT/JP2018/018767 JP2018018767W WO2018212181A1 WO 2018212181 A1 WO2018212181 A1 WO 2018212181A1 JP 2018018767 W JP2018018767 W JP 2018018767W WO 2018212181 A1 WO2018212181 A1 WO 2018212181A1
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WIPO (PCT)
Prior art keywords
base
connecting portion
fork type
type crystal
tuning
Prior art date
Application number
PCT/JP2018/018767
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English (en)
Japanese (ja)
Inventor
有彌 井田
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株式会社村田製作所
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Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2019518804A priority Critical patent/JP6819945B2/ja
Publication of WO2018212181A1 publication Critical patent/WO2018212181A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz

Definitions

  • the present invention relates to a tuning fork type crystal vibrating element that operates based on the piezoelectric effect of quartz, a manufacturing method thereof, and a tuning fork type crystal resonator.
  • tuning fork type crystal resonator a tuning fork type crystal vibrating element in which a pair of vibrating arms are extended in parallel from the base of the base material is used.
  • a crystal resonator is used for a timing device or a vibration gyro sensor mounted on an electronic device such as a mobile computer, a portable game machine, a mobile phone, an IC card, and a communication base station.
  • tuning fork type crystal resonators and tuning fork type crystal resonator elements incorporated therein are required to be downsized and improved in reliability.
  • Patent Document 1 discloses a resonator element including a base, a pair of vibrating arms extending from the base, and a support arm extending in parallel with the vibrating arms.
  • the vibration piece described in Patent Document 1 has a cut so as to indicate constriction on both main surfaces of the base for the purpose of reducing loss of vibration energy.
  • the vibration arm should be in contact with the vibration arm when displaced beyond the normal amplitude range.
  • the support arm has a receiving portion at the tip.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a tuning fork type crystal resonator element that can be reduced in size while improving impact resistance, a method for manufacturing the same, and a tuning fork type crystal resonator. It is.
  • a tuning fork type crystal resonator element includes a base, a plurality of vibrating arm portions extending in a first direction from the base and arranged in a second direction intersecting the first direction, and at least one receiving portion
  • the base includes a connecting portion provided to fix the roots of the plurality of vibrating arm portions in common, a support portion provided at a distance from the connecting portion in the first direction, and a connecting portion.
  • the support portion, the connection portion and the support portion are connected to each other, the width in the second direction is smaller than the connection portion and the support portion, and the receiving portion is in the first direction. It is provided between the connection part and the support part.
  • a tuning fork type crystal resonator element includes a base, a plurality of vibrating arms extending in the first direction from the base and arranged in a second direction intersecting the first direction, and at least one receiving portion. And a base portion is provided so as to commonly fix the roots of the plurality of vibrating arm portions, and a support portion provided at a distance from the connection portion in the first direction, The connecting part and the support part are provided so as to connect the connecting part and the support part, and the width in the second direction is smaller than the connecting part and the support part.
  • a method for manufacturing a tuning-fork type crystal resonator element comprising: preparing a quartz substrate; providing a photoresist layer on the quartz substrate; patterning the photoresist layer; And a step of etching the quartz crystal substrate by wet etching based on the photoresist layer formed to form a quartz piece, the quartz piece extending from the base in the first direction and intersecting the first direction.
  • a tuning fork crystal resonator includes a base member, a lid member that forms an internal space between the base member, a tuning fork crystal resonator element housed in the internal space, and a tuning fork type A tuning fork type quartz crystal vibrating element including a base and a plurality of vibrating arms extending in the first direction and extending in the second direction intersecting the first direction. At least one receiving portion, and the base portion is provided at a distance from the connecting portion in the first direction and a connecting portion provided so as to fix the roots of the plurality of vibrating arm portions in common.
  • a support portion and a narrow portion that is provided so as to connect the connection portion and the support portion between the connection portion and the support portion, and whose width in the second direction is smaller than that of the connection portion and the support portion,
  • the receiving part is provided between the connecting part and the support part in the first direction. It is and the holding member is fixed to the base member supporting portion.
  • the present invention it is possible to provide a tuning fork crystal resonator element that can be reduced in size while improving impact resistance, a method for manufacturing the same, and a tuning fork crystal resonator.
  • FIG. 1 is an exploded perspective view schematically showing a configuration of a tuning fork type crystal resonator.
  • FIG. 2 is a cross-sectional view schematically showing a cross-sectional configuration along the line II-II of the tuning fork type crystal resonator shown in FIG.
  • FIG. 3 is a plan view schematically showing the configuration of the tuning fork type crystal resonator element according to the first embodiment.
  • 4 is a cross-sectional view schematically showing a cross-sectional configuration along the line IV-IV of the tuning-fork type crystal vibrating element shown in FIG.
  • FIG. 5 is an enlarged plan view showing the structure of the base portion of the tuning fork type crystal resonator element more specifically.
  • FIG. 1 is an exploded perspective view schematically showing a configuration of a tuning fork type crystal resonator.
  • FIG. 2 is a cross-sectional view schematically showing a cross-sectional configuration along the line II-II of the tuning fork type crystal resonator shown in
  • FIG. 6 is a plan view schematically showing a configuration of a tuning fork type crystal resonator element according to the second embodiment.
  • FIG. 7 is a plan view schematically showing a configuration of a tuning-fork type crystal resonator element according to the third embodiment.
  • FIG. 8 is a flowchart showing manufacturing steps of the tuning-fork type crystal vibrating element according to the fourth embodiment.
  • FIG. 9 is a view showing a cross section along the electric axis of the quartz substrate in the step of cutting the quartz substrate shown in FIG.
  • FIG. 1 is an exploded perspective view schematically showing a configuration of a tuning fork type crystal resonator.
  • FIG. 2 is a cross-sectional view schematically showing a cross-sectional configuration along the line II-II of the tuning fork type crystal resonator shown in FIG.
  • FIG. 3 is a plan view schematically showing the configuration of the tuning fork type crystal resonator element according to the first embodiment.
  • first direction D1, the second direction D2, and the third direction D3 shown in the drawing are, for example, directions orthogonal to each other.
  • the first direction D1, the second direction D2, and the third direction D3 may be directions that intersect each other at an angle other than 90 °.
  • the first direction D1, the second direction D2, and the third direction D3 are not limited to the arrow direction (positive direction) shown in FIG. 1, but also include the direction opposite to the arrow (negative direction).
  • the tuning fork type crystal resonator 1 is a kind of crystal resonator (Quartz Crystal Resonator Unit). Further, the tuning fork type crystal resonator element 10 is a kind of crystal resonator element (Quartz Crystal Resonator), and an excitation portion excited according to an applied voltage corresponds to a parallel arm portion in a tuning fork shape.
  • the crystal resonator element is a piezoelectric resonator element that uses a quartz piece (Quartz Crystal Element) as a piezoelectric body that vibrates according to an applied voltage.
  • the tuning fork crystal resonator 1 includes a tuning fork crystal resonator element 10, a lid member 20, a base member 30, and a bonding member 40.
  • the base member 30 and the lid member 20 are holders for housing the tuning fork type crystal resonator element 10.
  • the lid member 20 has a concave shape, specifically, a box shape having an opening
  • the base member 30 has a flat plate shape.
  • the shapes of the lid member 20 and the base member 30 are not limited to the above.
  • the base member may have a concave shape, and both the lid member and the base member have a concave shape having openings on the sides facing each other. It may be.
  • the tuning fork type crystal resonator element 10 includes a crystal piece 11.
  • the crystal piece 11 is a Z plate crystal piece. Specifically, in a Cartesian coordinate system composed of an X axis, a Y axis, and a Z axis, a surface specified by the X axis and the Y axis by rotating clockwise around the Z axis in the range of 0 degrees to 5 degrees. (Hereinafter referred to as “XY plane”, the same applies to surfaces specified by other axes or other directions) is the principal surface of the Z-plate crystal piece, and is parallel to the Z axis. Is the thickness of the Z-plate crystal piece.
  • the Z plate crystal piece is formed, for example, by etching a quartz substrate obtained by cutting and polishing an ingot of an artificial quartz (Synthetic Quartz Crystal).
  • the X axis, the Y axis, and the Z axis are crystal axes of quartz, respectively.
  • the X axis corresponds to the electrical axis
  • the Y axis corresponds to the mechanical axis
  • the Z axis corresponds to the optical axis.
  • the X axis is a polar axis having a positive direction.
  • a direction parallel to the + X axis is referred to as a + X axis direction.
  • the crystal piece 11 may be applied with a different cut other than the Z-plate crystal piece.
  • the tuning fork type crystal resonator element 10 is determined so that the Y axis is parallel to the first direction D1, the X axis is parallel to the second direction D2, and the Z axis is parallel to the third direction D3.
  • the X-axis direction that is the polar axis
  • the + X-axis direction is the positive direction of the second direction D2
  • the -X-axis direction is the negative direction of the second direction D2.
  • the first direction D1 only needs to be along the Y-axis direction, and for example, the first direction D1 may be inclined within a range of ⁇ 5 degrees to +5 degrees from the Y-axis direction.
  • the second direction D2 may be tilted in the range of ⁇ 5 degrees to +5 degrees from the X-axis direction
  • the third direction D3 may be tilted in the range of ⁇ 5 degrees to +5 degrees from the Z-axis direction.
  • the tuning-fork type crystal vibrating element 10 made of a Z-plate crystal piece 11 has a base 50 and a vibrating arm 60 extending from the base 50 in the second direction D2.
  • the base 50 has a front surface (first main surface) 50 a on the side facing the lid member 20, and a back surface (second main surface) 50 b on the side facing the base member 30.
  • the base 50 includes a connecting portion 51, a support portion 52, and a narrow portion 53 that are arranged in a direction parallel to the first main surface 50 a.
  • the connecting portion 51 is provided at the base of the vibrating arm portion 60 and commonly fixes the vibrating arm portions 60 arranged in the second direction D2.
  • the support portion 52 is provided at a distance from the connecting portion 51 in the first direction D1.
  • the narrow portion 53 is provided between the connecting portion 51 and the support portion 52 so as to connect the connecting portion 51 and the support portion 52.
  • the connecting portion 51 has a facing surface 51 a that faces the support portion 52, and the supporting portion 52 has a facing surface 51 b that faces the connecting portion 51.
  • the narrow portion 53 is connected to the central portion of the opposing surface 51 a of the connecting portion 51, and is connected to the central portion of the opposing surface 52 a of the support portion 52.
  • the narrow portion 53 has a constricted portion 53a having a minimum width in the second direction D2 when the first main surface 50a is viewed in plan.
  • the constricted portion 53 a is located in the central portion of the narrow portion 53 in the first direction D1.
  • the width of the connecting portion 51 in the second direction D2 is W1
  • the width of the support portion 52 in the second direction D2 is W2
  • the width of the narrow portion 53 in the second direction D2 is W3.
  • the width W3 is the width at the constricted portion 53a of the narrow portion 53.
  • the width W3 is smaller than the width W1 and the width W2 (W3 ⁇ W1, W3 ⁇ W2).
  • the shape of the base 50 is confined in the second direction D2 by the narrow portion 53 when the first main surface 50a of the base 50 is viewed in plan. Since the base 50 has a constricted shape, the propagation of vibration in the base 50 can be suppressed.
  • the width W2 is larger than the width W1 (W1 ⁇ W2).
  • the magnitude relationship between the width W1 and the width W2 is not limited to this, and the width W1 may be equal to or greater than the width W2.
  • the vibrating arm 60 also has a surface (first main surface) 60a on the side facing the lid member 20, and a back surface (second main surface) 60b on the side facing the base member 30.
  • the vibrating arm portion 60 is a general term for the first vibrating arm portion 61 and the second vibrating arm portion 62 that extend from the connecting portion 51 of the base portion 50 in the first direction D1 and are aligned in the second direction D2.
  • the first vibrating arm portion 61 is located on the positive side of the second vibrating arm portion 62 in the second direction D2.
  • Each of the first vibrating arm portion 61 and the second vibrating arm portion 62 is provided with a bottomed first groove 63a along the first direction D1 in the first main surface 60a, and in the first direction on the second main surface 60b.
  • a bottomed second groove 63b along D1 is provided.
  • the first groove 63a and the second groove 63b are opposed in the third direction D3.
  • the tuning fork type crystal resonator element 10 further includes a receiving portion 70 between the connecting portion 51 and the support portion 52 of the base portion 50.
  • the receiving part 70 regulates the displacement of the pair of vibrating arm parts 60 when the pair of vibrating arm parts 60 exceeds a desired amplitude range.
  • the receiving portion 70 is a general term for the first receiving portion 71 and the second receiving portion 72 that extend from the facing surface 52 a of the support portion 52.
  • the first receiving portion 71 and the second receiving portion 72 are provided so as to sandwich the narrow portion 53 in the second direction D2.
  • the first receiving portion 71 is preferably separated from the narrow portion 53 so as not to inhibit the vibration of the vibrating arm portion 60.
  • the first receiving portion 71 is an end on the positive direction side in the second direction D2 of the facing surface 52a of the support portion 52.
  • the second receiving portion 72 is also away from the narrow portion 53.
  • the second receiving portion 72 is connected to an end portion on the negative direction side in the second direction D ⁇ b> 2 of the facing surface 52 a of the support portion 52. It faces the end of the surface 51a.
  • the first receiving part 71 and the second receiving part 72 are opposed to the first vibrating arm part 61 and the second vibrating arm part 62, respectively, in the first direction D1.
  • the first receiving portion 71 has a contact surface 71 a on the side facing the facing surface 51 a of the connecting portion 51.
  • the second receiving portion 72 has a contact surface 72 a on the side facing the facing surface 51 a of the connecting portion 51.
  • the distance between the contact surfaces 71 a and 72 a of the receiving portions 71 and 72 and the facing surface 51 a of the connecting portion 51 is smaller than the distance between the facing surface 51 a of the connecting portion 51 and the facing surface 52 a of the support portion 52.
  • the tuning fork type crystal vibrating element 10 when a driving voltage is applied to each of the first vibrating arm 61 and the second vibrating arm 62 by an excitation electrode (not shown), the first vibrating arm 61 and the second vibrating arm 62 are applied.
  • the parts 62 vibrate so as to approach or separate from each other in the direction indicated by the arrow in the drawing at the tip of the vibrating arm part 60. In other words, the vibrating arm portion 60 is excited in the arc direction starting from the connecting portion 51.
  • the tuning fork type crystal resonator element 10 When the tuning fork type crystal resonator element 10 is left stationary, or when the first vibrating arm portion 61 and the second vibrating arm portion 62 vibrate in an amplitude range by excitation, the opposing surface 51a of the connecting portion 51 and the first receiver The contact surface 71a of the part 71 is separated, and the opposing surface 51a of the connecting part 51 and the contact surface 72a of the second receiving part 72 are also separated.
  • the contact surface 71a of the first receiving portion 71 or the contact surface 72a of the second receiving portion 72 is connected to the connecting portion 51. In contact with the opposite surface 51a.
  • the opposing surface 51a of the connecting portion 51 and the first receiving portion 51a comes into contact, and the first receiving part 71 regulates the displacement of the first vibrating arm part 61.
  • the second receiving portion 72 is moved to the second vibrating arm portion 62. Regulate the displacement of.
  • the deformation stress is concentrated on the narrow portion 53 (particularly the constricted portion 53a).
  • the first receiving portion 71 and the second receiving portion 72 reduce the deformation stress applied to the narrow portion 53 by restricting the displacement of the first vibrating arm portion 61 and the second vibrating arm portion 62, and the narrow portion 53. Suppresses damage.
  • the case where the first vibrating arm portion 61 or the second vibrating arm portion 62 is greatly displaced in the second direction D2 refers to a case where an impact is applied to the crystal piece 11 due to vibration or dropping during transportation, for example.
  • the shape of the lid member 20 has a concave shape and is a box shape opened toward the first main surface 32a of the base member 30.
  • the lid member 20 is joined to the base member 30 to provide an internal space 26 surrounded by the lid member 20 and the base member 30.
  • the tuning fork type crystal resonator element 10 is accommodated in the internal space 26.
  • the shape of the lid member 20 is not particularly limited as long as the tuning fork type crystal resonator element 10 can be accommodated.
  • the lid member 20 has a rectangular shape when the main surface of the top surface portion 21 is viewed in plan view. .
  • the shape of the lid member 20 is defined by, for example, a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a height parallel to the third direction D3.
  • the material of the lid member 20 is not particularly limited, but is made of a conductive material such as metal. By including the conductive material, an electromagnetic shielding function capable of shielding at least a part of electromagnetic waves entering and exiting the internal space 26 through the lid member 20 is obtained.
  • the lid member 20 has an inner surface 24 and an outer surface 25.
  • the inner surface 24 is a surface on the inner space 26 side
  • the outer surface 25 is a surface opposite to the inner surface 24.
  • the lid member 20 is connected to the top surface portion 21 facing the first main surface 32 a of the base member 30 and the outer edge of the top surface portion 21 and extends in a direction intersecting the main surface of the top surface portion 21.
  • the lid member 20 has a facing surface 23 that faces the first main surface 32a of the base member 30 at the concave opening end (the end of the side wall 22 on the side close to the base member 30).
  • the facing surface 23 extends in a frame shape so as to surround the periphery of the tuning fork type crystal resonator element 10.
  • the base member 30 holds the tuning-fork type crystal resonator element 10 so that it can be excited.
  • the base member 30 has a flat plate shape.
  • the base member 30 has a long side parallel to the first direction D1, a short side parallel to the second direction D2, and a thickness parallel to the third direction D3.
  • the base member 30 has a base 31.
  • the base 31 has a first main surface 32a (front surface) and a second main surface 32b (back surface) that face each other.
  • the base 31 is a sintered material such as insulating ceramic (alumina).
  • the base 31 is preferably made of a heat resistant material.
  • the base member 30 has electrode pads 33a and 33b provided on the first main surface 32a and external electrodes 35a, 35b, 35c and 35d provided on the second main surface 32b.
  • the electrode pads 33 a and 33 b are terminals for electrically connecting the base member 30 and the tuning fork type crystal resonator element 10.
  • the external electrodes 35a, 35b, 35c, and 35d are terminals for electrically connecting a circuit board (not shown) and the tuning fork type crystal resonator 1.
  • the electrode pad 33a is electrically connected to the external electrode 35a via a via electrode 34a extending in the third direction D3, and the electrode pad 33b is an external electrode via the via electrode 34b extending in the third direction D3. It is electrically connected to 35b.
  • the via electrodes 34a and 34b are formed in via holes that penetrate the base 31 in the third direction D3.
  • the external electrodes 35c and 35d may be dummy electrodes through which an electric signal or the like is not input / output, or may be ground electrodes that improve the electromagnetic shielding function of the lid member 20 by supplying a ground potential to the lid member 20.
  • the external electrodes 35c and 35d may be omitted.
  • the conductive holding members 36 a and 36 b are provided between the first main surface 32 a of the base member 30 and the second main surface 50 b of the base 50 of the tuning fork type crystal resonator element 10. Specifically, the conductive holding members 36 a and 36 b fix the support portion 52 of the base portion 50 to the base member 30. The conductive holding members 36 a and 36 b electrically connect the tuning fork type crystal vibrating element 10 to the pair of electrode pads 33 a and 33 b of the base member 30. Further, the conductive holding members 36 a and 36 b hold the tuning fork type crystal resonator element 10 on the first main surface 32 a of the base member 30 so as to be excited.
  • the conductive holding members 36a and 36b are electrically conductive to a filler and a holding member for maintaining a distance between a resin material including a thermosetting resin, an ultraviolet curable resin, and the like, and a base member and a crystal vibrating element, or for increasing strength. And conductive particles for imparting properties.
  • the member for holding the tuning fork type crystal resonator element on the base member may be insulative. At this time, the tuning fork type crystal resonator element may be electrically connected to the electrode pad by a conduction means such as a wire bond.
  • a sealing member 37 is provided on the first main surface 32 a of the base member 30.
  • the shape of the sealing member 37 is a rectangular frame shape when the first main surface 32 a is viewed in plan.
  • the electrode pads 33 a and 33 b are disposed inside the sealing member 37, and the sealing member 37 is provided so as to surround the tuning fork type crystal resonator element 10. Yes.
  • the sealing member 37 is made of a conductive material. For example, by forming the sealing member 37 with the same material as the electrode pads 33a and 33b, the sealing member 37 can be provided simultaneously in the step of providing the electrode pads 33a and 33b.
  • the joining member 40 is provided over the entire circumference of the lid member 20 and the base member 30. Specifically, the joining member 40 is provided on the sealing member 37 and is formed in a rectangular frame shape. The sealing member 37 and the joining member 40 are sandwiched between the facing surface 23 of the side wall portion 22 of the lid member 20 and the first main surface 32 a of the base member 30.
  • the tuning fork type crystal resonator element 10 is surrounded by the lid member 20 and the base member 30 (inside space ( Cavity) 26 is sealed.
  • the internal space 26 preferably has an atmospheric pressure lower than the atmospheric pressure, and more preferably in a vacuum state. According to this, it is possible to reduce a variation with time of frequency characteristics of the tuning fork type crystal resonator 1 due to oxidation of a first excitation electrode 81 and a second excitation electrode 82 which will be described later.
  • the sealing member 37 may be provided in a discontinuous frame shape
  • the joining member 40 may be provided in a discontinuous frame shape.
  • FIG. 4 is a cross-sectional view schematically showing a cross-sectional configuration along the line IV-IV of the tuning-fork type crystal vibrating element shown in FIG.
  • a first excitation electrode 81 and a second excitation electrode 82 are provided on the surfaces of the first vibrating arm portion 61 and the second vibrating arm portion 62, respectively.
  • the first excitation electrode 81 is provided on each side surface of the first vibrating arm portion 61 and the second vibrating arm portion 62. Both side surfaces are a pair of side surfaces that connect the first main surface 60a and the second main surface 60b. That is, the first excitation electrode 81 is opposed to sandwich the first vibrating arm portion 61 and the second vibrating arm portion 62 in the second direction D2.
  • the second excitation electrode 82 is provided in each of the first groove 63a and the second groove 63b on the first main surface 60a and the second main surface 60b.
  • the second excitation electrode 82 is also provided outside the first groove 63a and the second groove 63b.
  • the first excitation electrode 81 and the second excitation electrode 82 are electrodes made of a metal film having a multilayer structure in which, for example, nickel (Ni) or chromium (Cr) is used as a base layer and gold (Au) is used as an outermost layer.
  • Chromium has high adhesion to the crystal piece, so that the excitation electrode can be prevented from being peeled off by continuous operation for a long period of time. Since gold has high chemical stability, fluctuations in vibration characteristics due to oxidation of the excitation electrode can be suppressed.
  • the first excitation electrode 81 and the second excitation electrode 82 are electrically connected to the external electrode 35a and the external electrode 35b through the conductive holding member 36a and the conductive holding member 36b, respectively.
  • the first excitation electrode 81 and the second excitation electrode 82 form an electric field inside the first vibrating arm portion 61 and the second vibrating arm portion 62, each side surface of the first vibrating arm portion 61 and the second vibrating arm portion 62. Expands and contracts based on the magnitude of the electric field voltage.
  • an alternating electric field having a specific frequency between the first excitation electrode 81 and the second excitation electrode 82 the first vibrating arm portion 61 and the second vibrating arm portion 62 become a pair of vibrating arm portions 60 in FIG. 3. Oscillate at the resonance frequency so as to approach and separate from each other in the direction of the arrow shown at the tip of the.
  • FIG. 5 is an enlarged plan view showing the structure of the base portion of the tuning fork type crystal resonator element more specifically.
  • the connection part 51 of the base 50, the support part 52, and the narrow part 53 shall be provided by cutting a quartz substrate by the wet etching mentioned later.
  • an etching residue is formed on the end face of the crystal piece 11 as shown in FIG. 5, but in the other drawings, the illustration of the etching residue is omitted in order to simplify the explanation.
  • Quartz has the characteristic that the etching rate differs depending on the crystal orientation in chemical etching such as wet etching. For this reason, etching residues of different sizes may be generated on the end face of the crystal piece 11 processed by wet etching.
  • the etching residue is a fin-like portion that is thinner than the base 50.
  • the etching residue L1 is formed on the + X axis direction side of the end surface of the base 50 extending in the Y axis direction. Therefore, the etching residue L1 extends along the + X-axis direction from the connecting portion 51 and the support portion 52 when the first main surface 50a of the base portion 50 is viewed in plan.
  • the etching residue is not substantially formed on the end surface extending in the Y-axis direction on the ⁇ X-axis direction side.
  • the etching residues L21 and L22 are formed between the narrow portion 53 and the first receiving portion 71.
  • the etching residue L21 extends from the end surfaces of the narrow portion 53 and the support portion 52
  • the etching residue L22 extends from the end surfaces of the first receiving portion 71 and the support portion 52.
  • the etching residues L31 and L32 are formed between the narrow portion 53 and the second receiving portion 72.
  • the etching residue L31 extends from the end surfaces of the narrow portion 53 and the support portion 52, and the etching residue L32 extends from the end surfaces of the second receiving portion 72 and the support portion 52. ing.
  • the etching residue L21 extends to the vicinity of the connecting portion 51, and thus the etching residue L21 is larger than the etching residue L31.
  • the narrow portion 53 has higher impact resistance against displacement along the + X-axis direction than impact resistance against displacement along the ⁇ X-axis direction of the connecting portion 51.
  • the narrow portion 53 may have a lower impact resistance against the displacement along the + X-axis direction than the impact resistance against the displacement along the ⁇ X-axis direction of the connecting portion 51.
  • the etching residue L22 can be formed relatively larger than the etching residue L21 in a substantially U-shaped (crotch-shaped) region surrounded by the narrow portion 53, the first receiving portion 71, and the support portion 52.
  • the etching residue L31 can be formed relatively larger than the etching residue L32.
  • the etching residue L31 may be formed to be relatively larger than the etching residue L21.
  • Etching residue is not substantially formed on the contact surface 71 a of the first receiving portion 71 and the contact surface 72 a of the second receiving portion 72.
  • the etching residue is not substantially formed on the facing surface 51 a of the connecting portion 51. Accordingly, when the vibrating arm portion 60 is greatly displaced so as to exceed the normal amplitude range, the receiving portion 70 is opposed to the contact surface 71a, 72a having substantially no etching residue, even in the end surface of the connecting portion 51, having substantially no etching residue. Receiving surface 51a.
  • FIG. 6 is a plan view schematically showing a configuration of a tuning fork type crystal resonator element according to the second embodiment.
  • the difference from the tuning-fork type crystal resonator element 10 according to the first embodiment is that the receiving portion 170 is composed of one first receiving portion 171.
  • the first receiving portion 171 is connected to a region on the positive direction side in the second direction D ⁇ b> 2 with respect to the narrow portion 153 in the facing surface 152 a of the support portion 152.
  • the first receiving portion 171 extends along the first direction D1 toward the connecting portion 151.
  • the position of the receiving portion 170 is not limited to the above, and the receiving portion 170 may be provided in a region on the negative direction side in the second direction D2 relative to the narrow portion 153 in the facing surface 152a of the support portion 152. According to this, the big displacement to the 2nd direction D2 negative direction side of the 2nd vibration arm part 162 can be controlled.
  • an anisotropic etching residue is generated on the end face of the tuning fork type quartz vibrating element due to the etching anisotropy based on the crystal orientation of the quartz, so that the first vibrating arm unit and the second vibrating arm unit are machined.
  • the balance of strength is broken. Therefore, in the case of using one receiving part, it is possible to calculate or measure the balance of the mechanical strength of the tuning-fork type crystal vibrating element and to arrange the receiving part so as to receive the displacement in the direction where the mechanical strength is low. desirable.
  • FIG. 7 is a plan view schematically showing a configuration of a tuning-fork type crystal resonator element according to the third embodiment.
  • the receiving portion 270 is connected to the facing surface 251a of the connecting portion 251 and extends along the first direction D1 toward the support portion 252.
  • the contact surface 271a of the first receiving portion 271 and the contact surface 272a of the second receiving portion 272 are opposed to the facing surface 252a of the support portion 252 with a gap in the first direction D1.
  • a first receiving portion 271 is provided at an end portion on the positive direction side in the second direction D2, and a second receiving portion 272 is provided at an end portion on the negative direction side in the second direction D2. Yes.
  • the first receiving portion 271 restricts a large displacement of the first vibrating arm portion 261 by receiving the opposing surface 252a of the support portion 252 with the contact surface 271a, and the second receiving portion 272 has the opposing surface 252a of the support portion 252 as the contact surface.
  • the second receiving portion 272 has the opposing surface 252a of the support portion 252 as the contact surface.
  • FIG. 8 is a flowchart showing manufacturing steps of the tuning-fork type crystal vibrating element according to the fourth embodiment.
  • FIG. 9 is a view showing a cross section along the electric axis of the quartz substrate in the step of cutting the quartz substrate shown in FIG.
  • the fourth embodiment corresponds to a manufacturing process of a crystal piece 911 applicable to the tuning fork type crystal resonator element according to each of the above embodiments.
  • a tuning fork type crystal resonator element is completed through a process of providing an electrode such as an excitation electrode.
  • the quartz substrate 910 is a plate-like member cut out from a single crystal of artificial quartz so that the XY plane becomes the first principal surface 910a and the second principal surface 910b, and is a quartz wafer, for example.
  • the quartz substrate 910 is not limited to a quartz wafer as long as it has a plurality of element regions where a quartz piece of a tuning fork type quartz vibrating element can be formed and a collective element of tuning fork type quartz vibrating elements can be formed.
  • the quartz substrate 910 may be, for example, a rectangular plate member cut from a quartz wafer.
  • the quartz substrate 910 is cut into a flat plate shape, the surface thereof is flattened by a polishing process such as chemical mechanical polishing.
  • a polishing process such as chemical mechanical polishing.
  • a photoresist layer is provided (S12).
  • the first metal layer 912a is provided on the first main surface 910a of the crystal substrate 910 so that the first metal layer 912a and the second metal layer 912b sandwich the crystal substrate 910, and the second main surface 910b is provided on the second main surface 910b.
  • a second metal layer 912b is provided.
  • the first metal layer 912a and the second metal layer 912b correspond to a corrosion-resistant film against an etching solution (for example, ammonium fluoride or buffered hydrofluoric acid) used when the crystal substrate 910 is etched, and improve the etching processing accuracy. .
  • an etching solution for example, ammonium fluoride or buffered hydrofluoric acid
  • the first metal layer 912a and the second metal layer 912b for example, a multilayer film having a chromium (Cr) layer and a gold (Au) layer is used.
  • the Cr layer improves the adhesion of the first metal layer 912a and the second metal layer 912b to the quartz substrate 910 as a base layer.
  • the Au layer improves the corrosion resistance of the first metal layer 912a and the second metal layer 912b as the outermost layer.
  • the method for forming the first metal layer 912a and the second metal layer 912b is not particularly limited.
  • the first metal layer 912a and the second metal layer 912b are provided by dry plating (dry process) such as vapor deposition or sputtering, or wet plating (wet process) such as electrolytic plating. It is done.
  • a first photoresist layer 913a is provided on the first metal layer 912a so that the first photoresist layer 913a and the second photoresist layer 913b sandwich the quartz crystal substrate 910, and the second metal layer A second photoresist layer 913b is provided on 912b.
  • the first photoresist layer 913a and the second photoresist layer 913b respectively apply a photoresist solution containing a photoresist material on the first metal layer 912a and the second metal layer 912b, and volatilize the solvent by heating.
  • the film is formed.
  • the photoresist solution coating method is, for example, a spin coating method.
  • the photoresist material is a positive photosensitive resin in which the solubility of the exposed portion is increased from the viewpoint of improving the processing accuracy of the pattern obtained by developing the first photoresist layer 913a and the second photoresist layer 913b. Is desirable.
  • the coating method of a photoresist solution is not specifically limited, For example, the spray coating method etc. may be sufficient.
  • the photoresist layer is exposed (S13).
  • the first photoresist layer 913a and the second photoresist layer 913b are irradiated with light such as ultraviolet light through a photomask on which the external pattern of the plurality of crystal pieces 911 is drawn.
  • the exposure apparatus used for the exposure is a single-sided exposure apparatus that exposes only one of the first photoresist layer 913a and the second photoresist layer 913b. Note that a double-sided exposure apparatus capable of exposing both at the same time may be used.
  • the photoresist layer is developed (S14).
  • the exposed portion is developed by immersing the first photoresist layer 913a and the second photoresist layer 913b in a developer. Dissolved in the liquid and removed.
  • the outer shape pattern of the crystal piece 911 is patterned on the first photoresist layer 913a and the second photoresist layer 913b. In other words, parts of the first metal layer 912a and the second metal layer 912b are exposed based on the outer shape pattern of the crystal piece 911, respectively.
  • step S15 the quartz substrate is cut by wet etching (S15).
  • step S15 first, the first metal layer 912a and the second metal layer 912b exposed based on the outer shape pattern of the crystal piece 911 are etched. Thereby, a part of the quartz substrate 910 is exposed based on the external pattern of the quartz piece 911.
  • the first metal layer 912a and the second metal layer 912b are etched by, for example, wet etching of a Cr layer using a cerium-based etching solution and wet etching of an Au layer using an iodine-based etching solution.
  • step S15 next, the exposed portion of the quartz substrate 910 is cut so as to penetrate.
  • the quartz substrate 910 is etched by wet etching using a hydrofluoric acid-based etching solution to form a quartz piece 911 of a tuning fork type quartz vibrating element.
  • the quartz substrate 910 is processed into an aggregate substrate having a plurality of quartz pieces 911.
  • the photoresist layer is removed (S16).
  • the first metal layer 912a and the first photoresist layer 913a remain on the first main surface 910a of the quartz substrate 910, and the second metal layer 912b on the second main surface 910b.
  • the second photoresist layer 913b remains.
  • the residue of the first photoresist layer 913a and the second photoresist layer 913b is removed from the quartz substrate 910 by cleaning with a solvent, and then the residue of the first metal layer 912a and the second metal layer 912b is removed.
  • step S15 since the single crystal of artificial quartz has a different etching speed (etching rate) depending on the crystal orientation, an etching residue L1 is formed on the crystal piece 911 formed by etching.
  • the etching residue L1 extends outward from the first main surface 911a with a different size depending on the crystal axis direction.
  • the cross section of the crystal piece 911 parallel to the XZ plane has a first main surface 911a, a second main surface 911b, and an etching residue L1.
  • the first main surface 911a and the second main surface 911b correspond to portions covered by the first metal layer 912a and the second metal layer 912b as the quartz substrate 910, respectively.
  • the etching residue L1 corresponds to an end surface connecting the end portions of the first main surface 911a and the second main surface 911b in the + X-axis direction (electrical axis positive direction).
  • the crystal substrate 910 is etched in the direction in which the crystal plane is formed, for example. Specifically, the quartz substrate 910 is etched so that the first end surface 911c is formed so as to approach the crystal surface from the first main surface 910a, and is etched so as to approach the crystal surface from the second main surface 910b. As a result, the second end face 911d is formed. The first end surface 911c is inclined with respect to the first main surface 911a and the second end surface 911d is inclined with respect to the second main surface 911b, following the inclination of the crystal plane with respect to the + X axis direction of the crystal.
  • the etching residue L1 is connected to the first main surface 911c connected to the first main surface 911a so as to form an obtuse angle on the crystal piece 911 side, and the second end surface connected to the second main surface 911b so as to form an obtuse angle on the crystal piece 911 side. And an end face 911d.
  • the first end surface 911c and the second end surface 911d are tips of the etching residue L1 in the + X-axis direction and are connected to form an angle ⁇ 1 on the crystal piece 911 side.
  • the ends of the first main surface 911a and the second main surface 911b in the ⁇ X-axis direction are connected by a third end surface 911e substantially orthogonal to the first main surface 911a and the second main surface 911b.
  • the length of the third end surface 911e in the XZ plane is smaller than the sum of the lengths of the first end surface 911c and the second end surface 911d in the XZ plane. Since the angle formed by the tip of the etching residue L1 is ⁇ 1, the end surface having the etching residue L1 is an end surface where the other etching residue is not substantially generated (for example, the opposing surface 51a of the connecting portion 51 and the contact surface 71a of the receiving portion 70). , 72a), and is easily damaged by an external impact.
  • One base 70, and the base 50 is spaced from the connecting part 51 in the first direction D1 by a connecting part 51 provided to fix the roots of the plurality of vibrating arm parts 60 in common.
  • the connection part 51 and the support part 52 may be connected between the support part 52 provided in the space and the connection part 51 and the support part 52, and the width in the second direction D2 is the connection part 51 and the support part.
  • the tuning fork crystal resonator element 10 provided between the connecting portion 51 and the support portion 52 in the first direction D1 is provided.
  • the crystal resonator element can be made smaller than the configuration in which the receiving portion and the vibrating arm portion are arranged in the second direction.
  • the base and the receiving portion come into contact with each other, and large displacement of the vibrating arm that exceeds the normal amplitude range as a crystal vibrating element can be regulated. .
  • the impact resistance of the crystal resonator element is improved, and damage to the vibrating arm portion and the base portion can be suppressed.
  • the vibrating arm portion is mechanically connected to the support portion via a narrow portion having a small vibration propagation region. Therefore, vibration leakage from the connecting portion to the support portion is reduced, and attenuation of vibration energy in the vibrating arm portion can be suppressed.
  • the receiving part 70 may be connected to one of the connecting part 51 and the supporting part 52 and may extend toward the other. According to this, since a complicated structure or the like for providing the receiving portion is unnecessary, the tuning fork type crystal vibrating element can be reduced in size.
  • the receiving unit 70 may be connected to the support unit 52. According to this, it is possible to suppress the influence on the vibration characteristics of the tuning-fork type crystal resonator element by providing the receiving portion.
  • the support portion 52 may be a fixed portion to which the tuning fork type crystal resonator element 10 is fixed. According to this, vibration leakage from the vibrating arm portion to the cage such as the base member or the lid member of the tuning fork type crystal resonator can be suppressed through the fixing portion. Further, the impact resistance of the tuning fork type crystal vibrating element is improved by connecting the receiving part to the fixed part.
  • the connecting portion 51 and the support portion 52 have opposing surfaces 51a and 52a that face each other in the first direction D1, and the narrow portion 53 is connected to the central portion of the opposing surface 51a of the connecting portion 51 in the second direction D2.
  • the receiving portion 70 may be connected to the facing surface 52a of the support portion 52 and face the end portion of the facing surface 51a of the connecting portion 51 in the second direction D2. According to this, interference with a receiving part and a narrow part can be suppressed.
  • the connecting portion 251 and the support portion 252 have facing surfaces 251a and 252a that face each other in the first direction D1, and the narrow portion 253 is connected to the central portion in the second direction D2 of the facing surface 251a of the connecting portion 251.
  • the receiving portion 270 may be connected to the end portion in the second direction D2 of the facing surface 251a of the connecting portion 251 and may face the facing surface 252a of the support portion 252. According to this, interference with a receiving part and a narrow part can be suppressed.
  • the receiving part 70 may be provided in at least two places so as to sandwich the narrow part 53 in the second direction D2. According to this, even if the direction of the large displacement of the vibrating arm part is the positive direction or the negative direction of the second direction, it can be regulated by the receiving part.
  • the base 50, the vibrating arm portion 60, and the receiving portion 70 are provided by crystal, and the receiving portion 70 is a contact surface that contacts the connecting portion 51 or the support portion 52 when the vibrating arm portion 60 exceeds a desired amplitude range.
  • 71a and 72a may be provided, and the contact surfaces 71a and 72a of the receiving part 70 may extend along the electric axis of the crystal. According to this, the etching residue formed on the contact surface of the receiving portion is small. For this reason, the particles generated due to the damage of the etching residue when the receiving part comes into contact with the base part can be suppressed.
  • the base 50 the plurality of vibrating arms 60 extending from the base 50 in the first direction D1 and arranged in the second direction D2 intersecting the first direction D1, and at least one receiving member.
  • the base 50 is provided with a connecting portion 51 provided so as to fix the roots of the plurality of vibrating arm portions 60 in common, and spaced from the connecting portion 51 in the first direction D1.
  • the connecting portion 51 and the supporting portion 52 are provided so as to connect the connecting portion 51 and the supporting portion 52, and the width in the second direction D2 is larger than that of the connecting portion 51 and the supporting portion 52.
  • the receiving portion 70 vibrates by contacting the connecting portion 51 or the supporting portion 52 in the first direction D1 when the plurality of vibrating arm portions 60 exceed a desired amplitude range.
  • Tuning fork type that regulates displacement of arm 60 Crystal vibrating element 10, is provided. Even in such an embodiment, the same effect as described above can be obtained.
  • a step of preparing a quartz substrate 910 a step of providing photoresist layers 913a and 913b on the quartz substrate 910, a step of patterning the photoresist layers 913a and 913b, and patterning
  • the crystal substrate 910 is etched by wet etching on the basis of the photoresist layers 913a and 913b, and the crystal piece 911 is formed.
  • the crystal piece 911 includes the base 50 and the base 50 in the first direction D1.
  • a plurality of vibrating arm portions 60 arranged in the second direction D2 intersecting the extending first direction D1 and at least one receiving portion 70 are provided, and the base 50 has a common root of the plurality of vibrating arm portions 60 in common.
  • the connecting part 51 provided so as to be fixed, and the supporting part provided at a distance from the connecting part 51 in the first direction D1. 2 and the connecting portion 51 and the support portion 52 are provided so as to connect the connecting portion 51 and the support portion 52, and the width in the second direction D2 is smaller than the connecting portion 51 and the support portion 52.
  • the receiving part 70 is provided with a method for manufacturing a tuning-fork type crystal vibrating element provided between the connecting part 51 and the support part 52 in the first direction D1. Even in such an embodiment, the same effect as described above can be obtained.
  • the first direction D1 may extend along the mechanical axis Y of the crystal constituting the crystal piece 911, and the second direction D2 may extend along the electrical axis X of the crystal. . According to this, it is possible to form the end surfaces of the connecting portion and the receiving portion that face each other (the opposing surface of the connecting portion and the contact surface of the receiving portion) so that substantially no etching residue is generated.
  • the base member 30, the lid member 20 that forms the internal space 26 between the base member 30, the tuning-fork type crystal resonator element 10 accommodated in the internal space 26, and the tuning fork Conductive holding members 36a and 36b for holding the quartz crystal resonator element 10 on the base member 30, and the tuning fork crystal resonator element 10 extends in the first direction D1 from the base 50 and the first direction D1.
  • a plurality of vibrating arm portions 60 arranged in the intersecting second direction D2 and at least one receiving portion 70 are provided, and the base 50 is provided so as to fix the roots of the plurality of vibrating arm portions 60 in common.
  • the receiving portion 70 is provided between the connecting portion 51 and the support portion 52 in the first direction D1, and is electrically conductive.
  • the tuning fork type crystal resonator 1 in which the support portion 52 is fixed to the base member 30 is provided. Even in such an embodiment, the same effect as described above can be obtained.
  • a tuning fork type crystal resonator element As described above, according to one aspect of the present invention, it is possible to provide a tuning fork type crystal resonator element, a manufacturing method thereof, and a tuning fork type crystal resonator that can be reduced in size while improving impact resistance.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

La présente invention est pourvue de : une partie de base (50) ; une pluralité de parties de bras de vibration (60) s'étendant depuis la partie de base (50) dans une première direction (D1), les parties de bras de vibration (60) étant agencées dans une deuxième direction (D2) qui croise la première direction (D1) ; et au moins une partie de réception (70). La partie de base (50) est pourvue de : une partie de liaison (51) disposée de façon à fixer, en commun, les racines de la pluralité de parties de bras de vibration (60) ; une partie de support (52) disposée de façon à être espacée dans la première direction (D1) par rapport à la partie de liaison (51) ; et une partie de faible largeur (53) disposée entre la partie de liaison (51) et la partie de support (52) de façon à relier la partie de liaison (51) et la partie de support (52), la partie de faible largeur (53) ayant une largeur plus faible dans la deuxième direction (D2) que la partie de liaison (51) et la partie de support (52). La partie de réception (70) est disposée entre la partie de liaison (51) et la partie de support (52) dans la première direction (D1).
PCT/JP2018/018767 2017-05-16 2018-05-15 Élément de vibration de cristal de diapason, procédé de fabrication d'élément de vibration de cristal de diapason, et vibreur à cristal de diapason WO2018212181A1 (fr)

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Cited By (1)

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JP2012151639A (ja) * 2011-01-19 2012-08-09 Seiko Epson Corp 振動片、圧電デバイス、電子機器
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JP2010087575A (ja) * 2008-09-29 2010-04-15 Nippon Dempa Kogyo Co Ltd 圧電デバイス
JP2012151639A (ja) * 2011-01-19 2012-08-09 Seiko Epson Corp 振動片、圧電デバイス、電子機器
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