WO2018207245A1 - Dispositif de configuration de condition de réglage, et procédé de configuration de condition de réglage - Google Patents

Dispositif de configuration de condition de réglage, et procédé de configuration de condition de réglage Download PDF

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Publication number
WO2018207245A1
WO2018207245A1 PCT/JP2017/017485 JP2017017485W WO2018207245A1 WO 2018207245 A1 WO2018207245 A1 WO 2018207245A1 JP 2017017485 W JP2017017485 W JP 2017017485W WO 2018207245 A1 WO2018207245 A1 WO 2018207245A1
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Prior art keywords
production
substrate
setup
component
component mounting
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PCT/JP2017/017485
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English (en)
Japanese (ja)
Inventor
山下　幸宏
輝之 大橋
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株式会社Ｆｕｊｉ
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Priority to PCT/JP2017/017485 priority Critical patent/WO2018207245A1/fr
Priority to JP2019516761A priority patent/JP6865274B2/ja
Publication of WO2018207245A1 publication Critical patent/WO2018207245A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Definitions

  • the present specification relates to a device and a method for setting a setup condition that defines the arrangement position of a component device and a selection device of a component device such as a feeder device and a component mounter in a component mounting machine or a component mounting line. .
  • a technique for mass-producing circuit boards by performing various operations for mounting electronic components (hereinafter referred to as components) on a printed wiring board has become widespread.
  • components electronic components
  • solder printing machine There are a solder printing machine, a component mounting machine, a reflow machine, a board inspection machine, and the like as a board working machine for performing the board working. It is a common practice to connect these anti-substrate work machines to form an anti-substrate work line.
  • a component mounting line is often configured by arranging a plurality of component mounting machines.
  • a component mounting machine generally includes a substrate transfer device, a component supply device, and a component transfer device. As the component supply device, a configuration in which a plurality of feeder devices are arranged is often used.
  • the component type of the component to be mounted is switched in accordance with the switching of the substrate type, so that a setup operation for replacing the feeder device is performed as necessary. Further, in order to make the mounting work more efficient, the arrangement order of the arrangement positions of the plurality of feeder devices, in other words, the arrangement order of the supply positions of a plurality of component types is also changed.
  • the setup conditions define the feeder apparatus to be used and the arrangement order of the arrangement positions of the plurality of feeder apparatuses.
  • the method of determining the component arrangement disclosed in Patent Document 1 includes a step of specifying the frequency of production of a plurality of board types, and the production of a plurality of board types without changing the arrangement position of the component supply means (component device). A step of dividing into a plurality of possible groups, and a step of determining an arrangement position of the component supply means for each group. According to this, in the component mounting machine that produces a plurality of board types, the arrangement of the component supply means that can efficiently produce the board can be determined.
  • the board can be efficiently produced by determining the arrangement position of the component supply means in consideration of the production amount (production frequency) of a plurality of board types.
  • each substrate type has a unique life cycle trend, and the production amount (frequency of production) changes with the passage of time.
  • a substrate used for information-related equipment such as a personal computer or a mobile phone generally has a short life cycle. For this reason, even if optimal common setup conditions are set for a plurality of substrate types, there arises a problem that it becomes not optimal over time.
  • a setup condition setting device configured to set a setup condition of a component mounting machine or a component mounting line while considering a life cycle trend of a plurality of board types, and to maintain high mounting work efficiency, and Providing a setup condition setting method is a problem to be solved.
  • the present specification includes a component mounting machine that mounts an electronic component on a substrate having a component device capable of at least one of replacement and arrangement position change, or a configuration in which a plurality of the component mounting machines are arranged in a row.
  • the configuration apparatus that is selectively used according to the board type of the board and the apparatus that sets a setup condition that defines at least one of the arrangement positions to be changed according to the board type.
  • a production prediction information acquisition unit that acquires prediction information related to a subsequent production amount or production ratio of the plurality of substrate types of the substrate, and based on a characteristic change time of the production amount or the production ratio,
  • a setup condition comprising: a period delimiter for dividing the subsequent production periods into a plurality of production periods; and a condition setting unit for individually setting the setup conditions for the plurality of production periods. It discloses a constant device.
  • the present specification describes a component mounting machine for mounting electronic components on a substrate having a component device capable of at least one of replacement and change of arrangement position, or arranging a plurality of the component mounting machines in a line.
  • the configuration apparatus that is selectively used according to the board type of the board, and a method for setting a setup condition that defines at least one of the arrangement positions to be changed according to the board type And obtaining prediction information related to the production amount or production ratio of the plurality of substrate types of the substrate after the present, and based on characteristic change time points of the production amount or the production ratio, Disclosed is a setup condition setting method in which the setup conditions for each of the production periods are individually set by dividing into production periods.
  • a plurality of production types or production ratios of a plurality of substrate types are divided into a plurality of production periods based on characteristic changes in production quantities or production ratios after the present.
  • FIG. 1 is a plan view schematically showing the configuration of the component mounting line 6.
  • the X-axis direction extending in the left and right direction in FIG.
  • the Y-axis direction extending vertically in FIG. 1 is the line width direction.
  • the component mounting line 6 is configured by arranging six component mounting machines 1 in series. On the upstream side of the component mounting line 6, a solder printer 61 and a print inspection machine 62 are arranged in a line.
  • a board appearance inspection machine 63 and a reflow machine 64 are arranged in the downstream of the component mounting line 6.
  • a substrate-to-substrate work line composed of ten substrate-to-substrate work machines is configured.
  • FIG. 2 is a plan view showing the configuration of the component mounting machine 1 constituting the component mounting line 6.
  • the component mounting machine 1 is configured by arranging a substrate transfer device 2, two component supply devices (3 ⁇ / b> A, 3 ⁇ / b> B), a component transfer device 4, and the like on a base 51.
  • the substrate transport device 2 includes a first guide rail 21 and a second guide rail 22, a pair of conveyor belts, a clamp device, and the like.
  • the first guide rail 21 and the second guide rail 22 are assembled to the base 51 so as to extend in the X direction across the upper center of the base 51 and to be parallel to each other.
  • the second guide rail 22 is movable so that the separation distance can be adjusted according to the width of the substrate K.
  • a pair of conveyor belts arranged in parallel to each other are arranged in parallel inside the first guide rail 21 and the second guide rail 22 facing each other.
  • the pair of conveyor belts conveys the substrate K placed by rotating.
  • a clamp device that pushes up the substrate K and clamps it at the mounting position is disposed below the conveyor belt at the center of the base 51.
  • the first component supply device 3A is provided on one side surface (lower side in FIG. 1) of the component mounting machine 1 in the line width direction.
  • the second component supply device 3 ⁇ / b> B is provided on the other side surface (the upper side in FIG. 1) of the component mounting machine 1 in the line width direction.
  • the first component supply device 3A includes a plurality of feeder devices 31 that are detachably arranged.
  • the feeder device 31 is a component device that can be replaced and whose arrangement position can be changed. In the example of FIG. 2, 18 feeder devices 31 are arranged in a line.
  • the feeder device 31 includes a main body 32, a supply reel 33 provided at the rear portion of the main body 32, and a component take-out portion 34 provided at the tip of the main body 32.
  • a carrier tape (not shown) in which a large number of components are enclosed at a predetermined pitch is wound and held on the supply reel 33.
  • the carrier tape is pulled out at a predetermined pitch, the components are released from the enclosed state, and are sequentially fed into the component take-out portion 34.
  • the second component supply device 3B is also configured by 18 feeder devices 31 being detachably arranged.
  • the first component supply device 3A and the second component supply device 3B are detachably mounted on the machine base 51.
  • the first component supply device 3A and the second component supply device 3B have compatibility that can be installed anywhere on one side and the other side of the six component mounting machines 1.
  • 3A of 1st component supply apparatuses and the 2nd component supply apparatus 3B may have another component apparatuses other than the feeder apparatus 31 mentioned above.
  • a tray type or dicing sheet type pallet apparatus can be exemplified.
  • a tray-type pallet apparatus supplies parts using a pallet on which a tray for holding a plurality of parts is placed.
  • a dicing sheet type pallet apparatus supplies die parts using a pallet on which dicing sheets for holding a plurality of parts are stretched.
  • the component transfer device 4 includes a fixed rail 41, a moving table 42, a mounting head 44, a suction nozzle 45, a substrate recognition camera 46, and the like.
  • the fixed rail 41 is disposed above the substrate transport apparatus 2 and extends in the Y-axis direction.
  • the moving table 42 is movably loaded below the fixed rail 41 and moves in the X-axis direction and the Y-axis direction.
  • a support base 43 is detachably provided on the movable table 42.
  • the support base 43 is provided with a mounting head 44 and a substrate recognition camera 46.
  • the mounting head 44 has a suction nozzle 45 on the lower side.
  • the mounting head 44 includes a single nozzle head having one suction nozzle 45 and a multi-nozzle head having a plurality of suction nozzles 45 rotatably.
  • the suction nozzle 45 sucks components from the feeder device 31 and attaches them to the substrate K.
  • a plurality of types of suction nozzles 45 having different nozzle outer diameters and lower end suction opening sizes are used in accordance with the size of the component.
  • the mounting head 44 and the suction nozzle 45 are replaceable components.
  • the substrate recognition camera 46 reads the fiducial mark of the positioned substrate K and recognizes an error in the mounting position of the substrate K. This error is reflected in the position control when the suction nozzle 45 mounts a component.
  • the component mounting machine 1 further includes a first component recognition camera 52 on a base 51 between the board transfer device 2 and the first component supply device 3A. Moreover, the component mounting machine 1 has the 2nd components recognition camera 53 on the base 51 between the board
  • the first component recognition camera 52 and the second component recognition camera 53 image the component sucked by the suction nozzle 45, and detect the suction position of the component, the shift of the rotation angle, the bending of the lead, and the like.
  • a host computer 70 is provided to manage the operation status of the board work line including the component mounting line 6.
  • the host computer 70 is communicatively connected to a substrate working machine (six component mounting machines 1, solder printing machine 61, print inspection machine 62, board appearance inspection machine 63, and reflow machine 64).
  • the host computer 70 holds job data for each substrate type of the substrate K.
  • the job data is data describing detailed methods and procedures of the board work performed by each board work machine.
  • the host computer 70 transmits job data and various commands to each of the substrate work machines, and receives information related to the operation status from the substrate work machines.
  • the host computer 70 can access the production planning server 8.
  • the production plan server 8 centrally manages information such as the production amount and production time of each substrate type of the substrate K.
  • the production plan server 8 provides managed information to a manufacturing department that produces the substrate K, a procurement department that procures raw materials for the substrate K, and the like.
  • the description shifts to the setup condition setting device 7 of the first embodiment.
  • the setting device 7 individually sets each setup condition for a plurality of production periods after the present in a component mounting line 6 configured by arranging a plurality of component mounting machines 1 in a row.
  • the setting device 7 includes a production prediction information acquisition unit 71, a period delimiter 72, a condition setting unit 73, and a notification unit 75 that are realized by the software function of the host computer 70.
  • the condition setting unit 73 includes an optimization calculation unit 74. The functions of the production prediction information acquisition unit 71, the period delimiter 72, the condition setting unit 73, the optimization calculation unit 74, and the notification unit 75 will be described in detail in conjunction with the subsequent operation description.
  • the setup conditions are explained.
  • the component mounting line 6 since the component type of the component to be mounted is switched corresponding to the switching of the substrate type, a setup operation for replacing the feeder device 31 is performed as necessary. Further, in order to make the mounting work more efficient, the arrangement order of the arrangement positions of the plurality of feeder devices 31, in other words, the arrangement order of the supply positions of a plurality of component types is also changed.
  • the suction nozzle 45 of the component transfer device 4 sucks a component from the feeder device 31 and then moves to the first component recognition camera 52 or the second component recognition camera 53, and then the substrate K Move to. Therefore, in the feeder device 31 near the center of the component supply device (3A, 3B), the moving distance of the suction nozzle 45 is shortened. For this reason, mounting work can be made more efficient by arranging frequently used component types in the vicinity of the center of the component supply devices (3A, 3B).
  • a setup condition is to define a plurality of feeder devices 31 to be used and to define the order in which they are arranged.
  • the mounting head 44 and the suction nozzle 45 of the component transfer device 4 may be replaced in the setup operation.
  • a multi-nozzle head having a large number of suction nozzles 45 is advantageous for the mounting head 44 of the component transfer apparatus 4 that mounts only small chip components.
  • a large suction nozzle 45 is required.
  • the selection of the mounting head 44 and the suction nozzle 45 that are components of the component transfer device 4 is also defined in the setup conditions.
  • FIG. 3 is a flowchart showing the operation flow of the setup condition setting device 7.
  • the production prediction information acquisition unit 71 of the setting device 7 acquires, from the production plan server 8, prediction information related to the production amount of the plurality of substrate types of the substrate K from the current now to the prediction end time end. .
  • the production prediction information acquisition unit 71 may acquire prediction information input and set by the worker.
  • FIG. 4 is a diagram schematically illustrating prediction information of the production amount V after the current now of a plurality of substrate types of the substrate K.
  • the horizontal axis in FIG. 4 is the time with the current now as the origin, and the vertical axis is the production amount V for each substrate type.
  • the production amount V is represented by a production amount per unit period, for example, a production amount per week or a production amount per month.
  • FIG. 4 shows temporal transitions of the production amount VA of the A substrate type, the production amount VB of the B substrate type, and the production amount VC of the C substrate type.
  • the production volume VA, the production volume VB, and the production volume VC are in order from the larger side.
  • the life cycle of the A substrate type tends to decline.
  • the life cycle of the B substrate type tends to rise, and the life cycle of the C substrate type tends to be level with the creation time.
  • the period delimiter 72 of the setting device 7 extracts a characteristic change time point of the production amount.
  • the characteristic change time is the time when the magnitude relationship between the production amounts of the two types of substrate types is switched.
  • the period delimiter 72 first extracts the first change time point T1 where the production amount VB of the B substrate type exceeds the production amount VA of the A substrate type.
  • the production volume after the first change time T1 is the order of production volume VB, production volume VA, and production volume VC from the larger side. After the first change time T1, the life cycle of the C substrate type progresses to rise.
  • the period delimiter 72 extracts the second change time T2 when the production amount VC of the C substrate type exceeds the production amount VA of the A substrate type.
  • the production volume after the second change time T2 is in the order of production volume VB, production volume VC, and production volume VA from the larger side.
  • the life cycle of the B substrate type tends to be flat in the maturity period.
  • the period delimiter 72 extracts a third change point T3 in which the production amount VC of the C substrate type exceeds the production amount VB of the B substrate type.
  • the production volume after the third change time T3 is the order of production volume VC, production volume VB, and production volume VA from the larger side. There is no point in time when the magnitude relationship changes between the third change time T3 and the prediction end time end.
  • the period delimiter 72 divides the present and subsequent periods into four production periods (P1, P2, P3, P4) based on the three change points (T1, T2, T3). Specifically, the period delimiter 72 sets the first production period P1 from the current now to the first change time T1 and the second production period P2 from the first change time T1 to the second change time T2. Further, the period delimiter 72 sets the third production period P3 from the second change time T2 to the third change time T3, and sets the fourth production period P4 from the third change time T3 to the predicted end time end.
  • the period delimiter 72 may obtain four production periods (P1, P2, P3, P4) at a time at the current time, or obtain only the first production period P1 and the second production period P2. Also good.
  • the period separator 72 obtains the second change time T2 and the third production period P3 around the end of the first production period P1, and the third change time T3 around the end of the second production period P2.
  • a fourth production period P4 is obtained. The latter method is effective when the error in the production amount prediction information is large and the prediction accuracy at the second change time T2 or the third change time T3 at the current now is low.
  • the optimization calculation unit 74 of the condition setting unit 73 performs an optimization calculation for each of the obtained production periods (P1 to P4). Specifically, for the first production period P1, the optimization calculation unit 74 increases the mounting work efficiency of the A board type with the largest production amount VA with the highest priority, and mounts the second B board type with the production amount VB. The setup conditions are optimized under the condition that the work efficiency is the second priority and the mounting operation of the C board type can be performed. Similarly, for the second production period P2, the optimization calculation unit 74 increases the mounting work efficiency of the B board type having the largest production amount VB with the highest priority, and the mounting work of the second A board type having the production quantity VA. The setup conditions are optimized under the condition that the efficiency is the second priority and the mounting operation of the C board type can be performed.
  • the optimization calculation unit 74 performs the same optimization calculation for the third production period P3 and the fourth production period P4. As a result, the mounting work efficiency increases in all production periods (P1, P2, P3, P4).
  • Various known techniques can be applied as a specific method of the optimization calculation. Examples of known techniques include those disclosed by the present applicant in International Publication Nos. 2016/103472 and 2016/139793.
  • the goal of the optimization calculation is not limited only to improving the mounting work efficiency. For example, you may add to the goal to reduce the effort of a setup operation. Specifically, if the arrangement order of the feeder devices 31 is partially taken over, the number of position changes can be reduced. Further, if the general-purpose suction nozzle 45 is frequently used, the number of nozzle replacements can be reduced. By adopting these measures, it is possible to reduce the labor of the setup work.
  • the condition setting unit 73 individually sets optimized setup conditions for a plurality of production periods (P1 to P4).
  • the notification unit 75 notifies the set setup condition. Examples of specific notification means of the notification unit 75 include notification by display using an unillustrated display device, notification to an operator's mobile terminal using an unillustrated communication device, and the like.
  • the notification unit 75 notifies all setup conditions of all production periods (P1, P2, P3, P4) and all change points (T1, T2, T3) at a time. In this case, a prior notice is given except for the setup conditions of the first production period P1.
  • the operator can perform the current setup work according to the setup conditions of the first production period P1. Further, the operator can systematically perform the next setup work with reference to the setup conditions of the first change time T1 and the second production period P2. The operator can also systematically perform the setup work corresponding to the third production period P3 and the fourth production period P4.
  • the notification unit 75 notifies the setup conditions of the first production period P1 and notifies the setup conditions of the first change time T1 and the second production period P2 in advance. In accordance with the passage of time thereafter, the notification unit 75 sequentially notifies in advance the setup conditions of the next and subsequent change points (T2, T3) and the next and subsequent production periods (P3, P4). In this case, the worker can perform the current setup work corresponding to the first production period P1. Further, the operator can systematically perform the next setup work corresponding to the second production period P2.
  • the notification unit 75 notifies only the setup conditions of the first production period P1. After this, when the first change time point T1 arrives or approaches, the notification unit 75 notifies the setup condition of the second production period P2. Each time a subsequent change time point (T2, T3) arrives or approaches, the notification unit 75 notifies the setup conditions for the subsequent production periods (P3, P4). In this case, the worker can perform the current setup work corresponding to the first production period P1. Then, since notifications corresponding to the subsequent production periods (P2, P3, P4) are sequentially received, the operator can perform the next setup work without delay. In this method, it is difficult to plan and execute the setup work, but it is effective when the prediction accuracy at the time of change (T1, T2, T3) is low.
  • the setup conditions are appropriately set so that the mounting work efficiency is increased in each production period (P1, P2, P3, P4) in accordance with the rise of the life cycle of multiple substrate types and the trend of decline. it can. Therefore, high mounting work efficiency is maintained throughout a plurality of production periods (P1, P2, P3, P4). Furthermore, the operator can systematically perform setup work corresponding to a plurality of production periods (P1, P2, P3, P4). On the other hand, in the general prior art, the setup work is not performed unless the combination of the substrate types is changed, so that the mounting work efficiency gradually decreases.
  • the period delimiter 72 extracts characteristic change time points by focusing on the change in the production ratio (RA, RB, RC), not the production amount (VA, VB, VC) for each substrate type.
  • the characteristic change time is a time when the production ratio (RA, RB, RC) of a certain substrate type increases or decreases by the threshold change amount ⁇ R.
  • FIG. 5 is a flowchart illustrating an operation flow of the period delimiter 72 according to the second embodiment.
  • FIG. 6 is a diagram illustrating the characteristic change time point in the second embodiment.
  • the time transitions of the production amount VA of the A substrate type, the production amount VB of the B substrate type, and the production amount VC of the C substrate type shown in FIG. 6 are the same as those in FIG.
  • the production ratio RA (t) of the A board type, the production ratio RB (t) of the B board type, and the production ratio RC (t) of the C board type at an arbitrary time t are calculated using the following equations.
  • RA (t) VA / (VA + VB + VC)
  • RB (t) VB / (VA + VB + VC)
  • RC (t) VC / (VA + VB + VC)
  • the production volume VA, the production volume VB, and the production volume VC are values at the time point t.
  • the setting device 7 executes the operation flow of FIG.
  • the period delimiter 72 executes the detailed operation flow shown in FIG. 5 in step S2.
  • the period delimiter 72 calculates the current now production ratio RA (now), the production ratio RB (now), and the production ratio RC (now), and sets them as reference ratios for subsequent increase / decrease changes. .
  • the production ratio RA (now) of the A substrate type of now, the production ratio RB (now) of the B substrate type, and the production ratio RC (now) of the C substrate type are as follows.
  • the period separator 72 pays attention to the next time point t.
  • the period delimiter 72 calculates the production ratio RA (t), the production ratio RB (t), and the production ratio RC (t) at time t. Further, the period delimiter 72 uses the following expression including an absolute value symbol to calculate the change amount ⁇ A of the production ratio of the A board type, the change quantity ⁇ B of the production ratio of the B board type, and the production ratio of the C board type. Each change amount ⁇ C is calculated.
  • ⁇ A
  • ⁇ B
  • ⁇ C
  • the period delimiter 72 determines whether the maximum value among the change amount ⁇ A, the change amount ⁇ B, and the change amount ⁇ C is greater than or equal to the threshold change amount ⁇ X. For example, 0.2 can be set as the threshold change amount ⁇ X, and the threshold change amount ⁇ X is not limited thereto.
  • the period delimiter 72 stores this time t as the first change time T11. Further, in the next step S16, the period delimiter 72 uses the production ratio RA (T11), the production ratio RB (T11), and the production ratio RC (T11) at the first change time point T11 as the reference ratios for subsequent changes.
  • the period delimiter 72 returns the execution of the operation flow to step S12, and tries extraction after the second change time T12.
  • the period delimiter 72 stores the time point t as the second change time point T12.
  • the period delimiter 72 uses the production ratio RA (T12), the production ratio RB (T12), and the production ratio RC (T12) at the second change time T12 as a basis for subsequent increase / decrease changes. Update to ratio.
  • the reference ratio is similarly updated.
  • step S17 the period delimiter 72 determines whether or not the prediction end time end has been reached. If the predicted end time “end” has not been reached, the period delimiter 72 returns the execution of the operation flow to step S12 and continues the operation. If the predicted end time end has been reached, the period delimiter 72 ends the operation flow and returns to step S3 in FIG.
  • the change amount ⁇ A, the change amount ⁇ B, and the change amount ⁇ C are smaller than the threshold change amount ⁇ R of 0.2. Therefore, the loop constituted by Step S12, Step S13, Step S14, and Step S17 is repeated from the current now to the first change time T11.
  • the production volume VA 4000
  • the production volume VB 2700
  • the production volume VC 800
  • the next production ratios RA (T11), RB (T11), and RC (T11) are calculated.
  • the RA (T11) 4000 / 7500 ⁇ 0.53
  • RC (T11) 800 / 7500 ⁇ 0.11
  • the execution of the operation flow is advanced from step S14 to step S15, and the first change time T11 is extracted.
  • the values of the production ratio RA (T11), the production ratio RB (T11), and the production ratio RC (T11) described above are updated to the reference ratio for the subsequent increase / decrease change.
  • the production volume VA 2300
  • the production volume VB 3700
  • the production volume VC 1000
  • RA (T12) 2300 / 7000 ⁇ 0.33
  • RB (T12) 3700 / 7000 ⁇ 0.53
  • RC (T12) 1000 / 7000 ⁇ 0.14
  • the production volume VA 1300
  • the production volume VB 4100
  • the production volume VC 2800
  • the following production ratios RA (T13), RB (T13), RC ( T13) is calculated.
  • RA (T13) 1300 / 8200 ⁇ 0.16
  • RB (T13) 4100 / 8200 ⁇ 0.50
  • RC (T13) 2800 / 8200 ⁇ 0.34
  • step S15 of the operation flow is executed three times, and three change points (T11, T12, T13) are stored.
  • the period delimiter 72 finally sets the first production period P11 from the current now to the first change time T11 and the second production period P12 from the first change time T11 to the second change time T12. Further, the period delimiter 72 sets the third production time P13 from the second change time T12 to the third change time T13, and sets the fourth production time P14 from the third change time T13 to the predicted end time end.
  • the optimization calculating unit 74 performs optimization in consideration of the production ratio RA (t), the production ratio RB (t), and the production ratio RC (t) within each production period (P11, P12, P13, P14). It is preferable to perform an operation.
  • the method of dividing the production period (P11, P12, P13, P14) is different from that in the first embodiment, but the same operations and effects are produced. That is, high mounting work efficiency is maintained throughout a plurality of production periods (P11, P12, P13, P14). Further, the operator can systematically perform setup work corresponding to a plurality of production periods (P11, P12, P13, P14).
  • the production amounts of a plurality of substrate types are not essential, and only the production ratio may be used as the prediction information.
  • the characteristic change time point may be a time point when the production amount or production ratio of a certain substrate type increases or decreases across a threshold value. For example, in FIG. 6, when a threshold value of 30% is set and the production ratio RA (t) of the A board type decreases to less than 30%, and the production ratio RB (t) of the B board type and the C board type The time points at which the production ratio RC (t) increases by more than 30% can be set as the change time points, respectively. Further, when the prediction information changes, it can be configured to automatically restart and perform the correction calculation.
  • the setup condition setting device 7 can be separated from the host computer 70. Furthermore, the setup condition setting device 7 can also be implemented as a setup condition setting method. Further, the number of component mounting machines 1 constituting the component mounting line 6 may be other than six, and the setting device 7 may target a single component mounting machine 1. Furthermore, the line configuration of the substrate-to-board work line is not limited. The first and second embodiments can have various other applications and modifications.
  • Component mounting machine 2 Board transfer device 3A: First component supply device 3B: Second component supply device 31: Feeder device 4: Component transfer device 6: Component mounting line 7: Setup work setting device 70: Host computer 71: Production prediction information acquisition part 72: Period delimiter part 73 Condition setting part 74: Optimization calculation part 75: Notification part 8: Production planning server T1, T11: First change point T2, T12: Second change point T3, T13 : Third change point P1, P11: First production period P2, P12: Second production period P3, P13: Third production period P4, P14: Fourth production period

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  • Supply And Installment Of Electrical Components (AREA)

Abstract

Dans un dispositif de montage de composants qui comprend des dispositifs de composant qui peuvent être remplacés et/ou réarrangés et qui monte des composants électroniques sur un substrat, ou dans une ligne de montage de composants configurée par agencement de multiples dispositifs de montage de composants, ce dispositif de configuration de condition de réglage configure une condition de réglage pour spécifier des dispositifs de composant, qui sont utilisés de façon sélective en fonction du type de substrat et/ou des positions d'agencement, qui changent en fonction du type de substrat. Le dispositif comprend : une unité d'acquisition d'informations de prévision de production qui acquiert des informations de prévision concernant le taux de production ou le rapport de production actuel et futur de multiples types de substrats ; une unité de séparation de période qui sépare le présent et le futur en de multiples périodes de production sur la base d'un point de changement caractéristique du taux de production ou du rapport de production ; et une unité de configuration de condition qui configure individuellement les conditions de réglage des multiples périodes de production.
PCT/JP2017/017485 2017-05-09 2017-05-09 Dispositif de configuration de condition de réglage, et procédé de configuration de condition de réglage WO2018207245A1 (fr)

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PCT/JP2017/017485 WO2018207245A1 (fr) 2017-05-09 2017-05-09 Dispositif de configuration de condition de réglage, et procédé de configuration de condition de réglage
JP2019516761A JP6865274B2 (ja) 2017-05-09 2017-05-09 セットアップ条件の設定装置、およびセットアップ条件の設定方法

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09223896A (ja) * 1996-02-16 1997-08-26 Sharp Corp 電子部品実装機の部品管理システム
JP2000059090A (ja) * 1998-08-03 2000-02-25 Yamaha Motor Co Ltd 実装機における段取りタイミングの管理方法及び同装置
JP2016042523A (ja) * 2014-08-18 2016-03-31 パナソニックＩｐマネジメント株式会社 部品配置の決定方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5535032B2 (ja) * 2010-10-27 2014-07-02 株式会社日立ハイテクインスツルメンツ 部品装着システム、部品装着設定装置、部品装着設定プログラム、及び部品装着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09223896A (ja) * 1996-02-16 1997-08-26 Sharp Corp 電子部品実装機の部品管理システム
JP2000059090A (ja) * 1998-08-03 2000-02-25 Yamaha Motor Co Ltd 実装機における段取りタイミングの管理方法及び同装置
JP2016042523A (ja) * 2014-08-18 2016-03-31 パナソニックＩｐマネジメント株式会社 部品配置の決定方法

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