WO2018205482A1 - Film filtrant traité à l'aide d'un laser et système de traitement laser - Google Patents

Film filtrant traité à l'aide d'un laser et système de traitement laser Download PDF

Info

Publication number
WO2018205482A1
WO2018205482A1 PCT/CN2017/103375 CN2017103375W WO2018205482A1 WO 2018205482 A1 WO2018205482 A1 WO 2018205482A1 CN 2017103375 W CN2017103375 W CN 2017103375W WO 2018205482 A1 WO2018205482 A1 WO 2018205482A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing system
lens
galvanometer
laser processing
Prior art date
Application number
PCT/CN2017/103375
Other languages
English (en)
Chinese (zh)
Inventor
陶沙
赵晓杰
Original Assignee
英诺激光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英诺激光科技股份有限公司 filed Critical 英诺激光科技股份有限公司
Publication of WO2018205482A1 publication Critical patent/WO2018205482A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
    • B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment

Definitions

  • the invention belongs to the field of environmental protection, and relates to a filter film or a filter screen processed by laser and a laser processing system for processing the filter film or the filter net.
  • Microfiltration refers specifically to the removal of particulates, bacteria and other contaminants from gas-phase and liquid-phase suspensions. It is mainly achieved by membrane separation technology.
  • the separation mechanism of the membrane is mainly sieve retention, and the solids with a size larger than the membrane pore size. Particles or particle aggregates can be widely used in wastewater, sewage treatment, food, pharmaceutical industry, desalination projects, air pollution control and other fields.
  • the fine particles in the air are seriously polluted, and the concentration of particulate matter (PM2.5) with aerodynamic equivalent diameter less than 2.5 microns in the environment is high, which seriously affects the air quality, compared with the coarser atmospheric particles. It has large area and strong activity, and it is easy to attach toxic and harmful substances such as heavy metals and microorganisms. It has a long residence time in the atmosphere and a long transportation distance, which has a great impact on human health and the atmospheric environment.
  • the existing filter membrane processing device has a complicated structure and high production cost, and at the same time, the membrane material can filter fine particles.
  • the present invention proposes a laser processing system which can be used for filtering contaminated particles of different sizes (several hundred nanometers to several hundreds of micrometers) and a laser processing system for preparing filter holes.
  • the present invention provides a filter membrane processed by laser, on which a microwell array for filtering microparticles is distributed, in which the micropores have a diameter of 0.1 ⁇ m to 1 mm.
  • the filter membrane is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel, aluminum, and the non-metal includes, but is not limited to, plastic; the filter membrane has a thickness of 1 micrometer to 2 millimeters.
  • the pores have a pore diameter of not more than 2.5 ⁇ m.
  • the present invention also provides a laser processing system for processing the filter film, the processing system comprising a laser, a beam expander, a diffractive optical element, a galvanometer unit, a lens, a carrier mechanism, which are sequentially disposed along a laser light path, Also included is a control unit that is electrically coupled to the laser, galvanometer unit, and carrier mechanism.
  • a CCD image sensor is further provided, the CCD image sensor being disposed adjacent to the galvanometer unit, the camera of the CCD image sensor being oriented toward a load plane of the carrier mechanism.
  • the laser emits a laser beam having a wavelength of less than 2000 nm.
  • the pulse width of the laser may be in the order of milliseconds, microseconds, nanoseconds, picoseconds or femtoseconds.
  • the galvanometer unit comprises an X-Y galvanometer, an angle measuring sensor and a driving mechanism for driving the X-Y galvanometer to rotate;
  • the carrier mechanism is an X-Y axis moving platform.
  • the lens may be a plano-convex lens, a lenticular lens or a flat field scanning lens.
  • a laser-processed filter membrane according to the present invention wherein the filter membrane is provided with a microwell array for filtering microparticles, and the micropore array has a diameter of 0.1 ⁇ m to 1 mm. It can filter contaminated particles of different sizes (several hundred nanometers to several hundred micrometers), and has a wide application range.
  • the prepared filter membrane (net) has a smaller pore diameter than the contaminated particles, the filter pores of the filter membrane are prepared by laser processing. The processing efficiency is high, the equipment itself has no loss, and the filter membrane with large pore density and quantity can be prepared, and the production cost is reduced, and the obtained filter membrane can be used as a mask or other filtering products as needed.
  • the filter film processed by laser according to the present invention is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel, aluminum, and the non-metal includes, but not limited to, plastic.
  • the filter membrane has a thickness of 1 micrometer to 2 millimeters, and the filter membrane has a wide selection of materials, and the filter membranes of different materials can be applied to different filtration occasions.
  • a laser processing system for processing the filter film according to the present invention comprising a laser, a beam expander, a diffractive optical element, a galvanometer unit, a lens, and a carrier mechanism which are sequentially disposed along a laser beam path, and further includes A control unit electrically coupled to the laser, the galvanometer unit, and the carrier mechanism.
  • the system can monitor the laser drilling process in real time with high reliability, high processing efficiency and high precision, and is suitable for industrial mass production of filtration membranes.
  • FIG. 1 is a schematic view showing the structure of a laser processing system according to a second embodiment of the present invention.
  • the embodiment provides a filter membrane processed by laser, wherein the filter membrane is distributed with a micropore array for filtering microparticles of different particle sizes, wherein the micropore array has a diameter of 0.1 ⁇ m to 1 mm. Preferably, it is 2-500 ⁇ m. According to different requirements, the micropores can be processed into different pore diameters by laser processing. In the embodiment, the pore diameter of the micropores is preferably not more than 2.5 ⁇ m, which is suitable for filtering micro particles such as PM2.5. Its filtering effect is good, and it does not need to be superimposed on multiple layers when used.
  • the material of the filter film may be metal or non-metal material, wherein the metal material may be selected from conventional materials such as stainless steel or aluminum, and the non-metal material may be selected from plastic.
  • the thickness of the filter film is 1 micrometer to 2 millimeters, according to requirements. Choose a different thickness.
  • the filter membrane may be a filter mesh having different aperture meshes made by laser, and may function as a filter particulate.
  • the embodiment provides a laser processing system for processing the filter film (mesh), as shown in FIG. 1, comprising a laser 1 arranged sequentially along a laser beam path, and a beam expander 2 for changing a diameter of a laser beam. a diffractive optical element (DOE) 7, a galvanometer unit 3 for deflecting the laser beam, a lens 4 for focusing the laser beam, and a carrier mechanism 5 with the carrier plane of the carrier mechanism 5 facing the lens 4
  • the light exiting surface further includes a control unit 6 electrically connected to the laser 1, the galvanometer unit 3 and the carrier mechanism 4.
  • the diffractive optical element 7 is disposed between the beam expanding device 2 and the galvanometer unit 3, and functions to diffract the laser beam into a plurality of parallel beams, and can simultaneously form a plurality of micropores on the filter film or directly form micropores.
  • the array improves the efficiency of laser drilling.
  • the control unit 6 is a control terminal of a conventional computer, a mobile phone, etc.;
  • the laser 1 is a semiconductor laser, and the laser beam emits a wavelength of 266-1064 nm;
  • the beam expander 2 is a laser beam expander, and the beam expansion factor is 1-10 times, used to change the beam diameter and divergence angle of the laser beam to make the laser focusing effect better;
  • the galvanometer unit 3 includes a set of XY galvanometers, which can be rotated in the X and Y directions, respectively.
  • the laser beam is reflected to achieve a deflection effect on the laser
  • the galvanometer is connected with an angle measuring sensor for measuring the deflection angle of the X and Y galvanometers and transmitting the measured information to the control unit 6, and further comprising driving the XY a drive mechanism for rotating the galvanometer, wherein the drive mechanism is a conventional servo motor;
  • the lens 4 may be a plano-convex lens, a lenticular lens or a normal scanning lens to perform focusing on the laser beam;
  • the carrier mechanism 5 For the XY axis moving platform, the movement of the workpiece to be perforated filter film can be driven in the X and Y directions under the control of the control unit 6.
  • a CCD image sensor is further disposed, and the CCD image sensor is disposed adjacent to the galvanometer unit, and the camera of the image sensor faces the loading plane of the loading mechanism 5 to monitor the laser drilling process in real time.
  • the embodiment further provides a laser drilling system using the filter film (net) of the embodiment 1 for laser drilling, which comprises the following steps:
  • the filter film (mesh) workpiece to be processed on the load plane of the loading mechanism 5 setting the laser focus position and laser processing parameters, and setting the pulse width and power of the laser according to the thickness and material of the filter film (net).
  • the pulse width of the laser can be set to the millisecond, microsecond, nanosecond, picosecond or femtosecond level according to different filter membranes.
  • the filter membrane (net) is made of plastic material and has a thickness of 5 -60 ⁇ m;

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)

Abstract

L'invention concerne un film filtrant traité à l'aide d'un laser. Un réseau de micropores pour filtrer des microparticules est réparti sur le film filtrant, les diamètres des micropores allant de 0,1 micromètre à 1 millimètre. L'invention concerne en outre un système de traitement laser pour traiter le film filtrant, le système comprenant un dispositif laser (1), un dispositif d'expansion de faisceau (2), un élément optique de diffraction (7), une unité de galvanomètre (3), une lentille (4), un mécanisme de transport d'objet (5) et une unité de commande correspondante (6) disposés en séquence. Par la sélection de paramètres de traitement laser, à l'aide du galvanomètre et du mécanisme de transport d'objet, un réseau de micropores ayant des diamètres de pores allant de centaines de nanomètres à des centaines de micromètres peut être fabriqué sur un film filtrant conçu dans un matériau sélectionné. Ledit système peut être utilisé pour traiter le film filtrant, à rendement élevé, à faible coût de production et à grande densité de micropores, sans utilisation d'outils et avec un bon effet de filtration.
PCT/CN2017/103375 2017-05-11 2017-09-26 Film filtrant traité à l'aide d'un laser et système de traitement laser WO2018205482A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710331982.6 2017-05-11
CN201710331982.6A CN106944751A (zh) 2017-05-11 2017-05-11 一种利用激光加工的过滤膜及激光加工系统

Publications (1)

Publication Number Publication Date
WO2018205482A1 true WO2018205482A1 (fr) 2018-11-15

Family

ID=59478578

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/103375 WO2018205482A1 (fr) 2017-05-11 2017-09-26 Film filtrant traité à l'aide d'un laser et système de traitement laser

Country Status (2)

Country Link
CN (1) CN106944751A (fr)
WO (1) WO2018205482A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106944751A (zh) * 2017-05-11 2017-07-14 英诺激光科技股份有限公司 一种利用激光加工的过滤膜及激光加工系统
CN107745188A (zh) * 2017-09-30 2018-03-02 深圳信息职业技术学院 一种皮秒激光加工设备
CN107876968A (zh) * 2017-12-26 2018-04-06 英诺激光科技股份有限公司 一种用于平行加工的激光加工设备
CN108211817B (zh) * 2017-12-29 2020-08-18 广东工业大学 一种铝金属过滤膜的制造方法
CN112516804A (zh) * 2019-09-18 2021-03-19 无锡华润微电子有限公司 Pm2.5防护设备、pm2.5过滤膜及其制备方法
CN113750823B (zh) * 2021-07-19 2022-11-25 青岛科技大学 一种天然生物质材料油水分离膜及其制备方法和用途

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108392A (ja) * 1993-10-13 1995-04-25 Seishin Kigyo:Kk 基板穿孔方法、装置および穿孔加工された基板
JP2006086436A (ja) * 2004-09-17 2006-03-30 Seiko Epson Corp 半導体装置の製造方法、電気光学装置及び電子デバイス
CN202185678U (zh) * 2011-07-27 2012-04-11 苏州德龙激光有限公司 超短脉冲激光制作金属薄膜群孔的装置
CN203817621U (zh) * 2013-12-03 2014-09-10 张立国 一种激光分束振镜扫描加工装置
CN105664725A (zh) * 2016-03-28 2016-06-15 杭州青澜环保科技有限公司 一种软性扁平过滤膜元件及制作方法
CN106475685A (zh) * 2016-12-07 2017-03-08 常州英诺激光科技有限公司 一种提高材料激光标刻品质和效率的装置及标刻方法
CN106944751A (zh) * 2017-05-11 2017-07-14 英诺激光科技股份有限公司 一种利用激光加工的过滤膜及激光加工系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4712264B2 (ja) * 1999-12-08 2011-06-29 バクスター・インターナショナル・インコーポレイテッド 微小多孔性フィルター膜、微小多孔性フィルター膜を作製するための方法、および微小多孔性フィルター膜を使用する分離器
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
US6817708B2 (en) * 2002-10-29 2004-11-16 Xerox Corporation Conical or cylindrical laser ablated filter
CN101980083B (zh) * 2010-09-13 2013-02-20 长春理工大学 激光干涉光刻技术制作过滤膜网孔结构的方法
KR101550008B1 (ko) * 2014-05-16 2015-09-07 한국과학기술원 레이저 간섭 리소그래피를 이용한 표면 플라즈모닉 컬러 필터의 제조 방법
CN204771159U (zh) * 2014-06-23 2015-11-18 三菱电机株式会社 激光加工装置
CN105688447B (zh) * 2016-01-21 2018-02-06 北京理工大学 一种可实现高效率油水分离的滤网及其飞秒激光制备方法
CN205309586U (zh) * 2016-01-29 2016-06-15 孙树峰 一种飞秒激光加工航空发动机叶片气膜孔的装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108392A (ja) * 1993-10-13 1995-04-25 Seishin Kigyo:Kk 基板穿孔方法、装置および穿孔加工された基板
JP2006086436A (ja) * 2004-09-17 2006-03-30 Seiko Epson Corp 半導体装置の製造方法、電気光学装置及び電子デバイス
CN202185678U (zh) * 2011-07-27 2012-04-11 苏州德龙激光有限公司 超短脉冲激光制作金属薄膜群孔的装置
CN203817621U (zh) * 2013-12-03 2014-09-10 张立国 一种激光分束振镜扫描加工装置
CN105664725A (zh) * 2016-03-28 2016-06-15 杭州青澜环保科技有限公司 一种软性扁平过滤膜元件及制作方法
CN106475685A (zh) * 2016-12-07 2017-03-08 常州英诺激光科技有限公司 一种提高材料激光标刻品质和效率的装置及标刻方法
CN106944751A (zh) * 2017-05-11 2017-07-14 英诺激光科技股份有限公司 一种利用激光加工的过滤膜及激光加工系统

Also Published As

Publication number Publication date
CN106944751A (zh) 2017-07-14

Similar Documents

Publication Publication Date Title
WO2018205482A1 (fr) Film filtrant traité à l'aide d'un laser et système de traitement laser
JP7437323B2 (ja) レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
Sugioka Progress in ultrafast laser processing and future prospects
US20020023903A1 (en) Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
JP2022518898A (ja) レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
JPH04354532A (ja) マルチビーム微粒子操作方法
JP2007069257A (ja) レーザ加工装置とその加工方法及びデブリ回収機構とその回収方法
WO1992002331A1 (fr) Machine d'usinage a laser yag permettant un usinage precis d'une couche mince
KR20150121334A (ko) 멀티 모달 레이저 가공 장치
CN102653030A (zh) 一种多功能激光加工头
CN207656101U (zh) 一种利用激光加工的过滤膜及激光加工系统
JP2006521930A (ja) 位置決め方法、装置及びその製品
DE102021212640A1 (de) Spanntisch und laserbearbeitungsvorrichtung
TWI459066B (zh) 改善景深之光學裝置與系統
TW202146140A (zh) 促進雷射加工工件的導引檢測之雷射加工設備以及其操作之方法
EP0953877B1 (fr) Procédé pour la production de pochoirs sérigraphiques et dispositif d'exposition associé
TWI261687B (en) Apparatus and method for fabricating 3D nano/micro structures
JP2016190270A (ja) 分散したパターンを有するマスクを介したレーザーアブレーションツール
CN202539806U (zh) 一种多功能激光加工头
JP2008062298A (ja) 微細穴材の製造方法、微細穴材ならびにそれを備えた分離膜。
CN109534286A (zh) 一种材料表面嵌套纳米结构及其制备方法
CN109911848B (zh) 一种精密操控和传递纳米线的装置及方法
CN113146060A (zh) 多光束快速蚀刻大幅面导电薄膜的激光加工装置及其方法
KR100505148B1 (ko) 펠리클 프레임 박판 가공용 고정 지그
JP2000288760A (ja) セラミックグリーンシートの加工方法及び加工装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17909018

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 24.04.2020)

122 Ep: pct application non-entry in european phase

Ref document number: 17909018

Country of ref document: EP

Kind code of ref document: A1