WO2018205482A1 - Filtering film processed using laser and laser processing system - Google Patents

Filtering film processed using laser and laser processing system Download PDF

Info

Publication number
WO2018205482A1
WO2018205482A1 PCT/CN2017/103375 CN2017103375W WO2018205482A1 WO 2018205482 A1 WO2018205482 A1 WO 2018205482A1 CN 2017103375 W CN2017103375 W CN 2017103375W WO 2018205482 A1 WO2018205482 A1 WO 2018205482A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
processing system
lens
galvanometer
laser processing
Prior art date
Application number
PCT/CN2017/103375
Other languages
French (fr)
Chinese (zh)
Inventor
陶沙
赵晓杰
Original Assignee
英诺激光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 英诺激光科技股份有限公司 filed Critical 英诺激光科技股份有限公司
Publication of WO2018205482A1 publication Critical patent/WO2018205482A1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D46/00Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/54Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
    • B01D46/543Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment

Definitions

  • the invention belongs to the field of environmental protection, and relates to a filter film or a filter screen processed by laser and a laser processing system for processing the filter film or the filter net.
  • Microfiltration refers specifically to the removal of particulates, bacteria and other contaminants from gas-phase and liquid-phase suspensions. It is mainly achieved by membrane separation technology.
  • the separation mechanism of the membrane is mainly sieve retention, and the solids with a size larger than the membrane pore size. Particles or particle aggregates can be widely used in wastewater, sewage treatment, food, pharmaceutical industry, desalination projects, air pollution control and other fields.
  • the fine particles in the air are seriously polluted, and the concentration of particulate matter (PM2.5) with aerodynamic equivalent diameter less than 2.5 microns in the environment is high, which seriously affects the air quality, compared with the coarser atmospheric particles. It has large area and strong activity, and it is easy to attach toxic and harmful substances such as heavy metals and microorganisms. It has a long residence time in the atmosphere and a long transportation distance, which has a great impact on human health and the atmospheric environment.
  • the existing filter membrane processing device has a complicated structure and high production cost, and at the same time, the membrane material can filter fine particles.
  • the present invention proposes a laser processing system which can be used for filtering contaminated particles of different sizes (several hundred nanometers to several hundreds of micrometers) and a laser processing system for preparing filter holes.
  • the present invention provides a filter membrane processed by laser, on which a microwell array for filtering microparticles is distributed, in which the micropores have a diameter of 0.1 ⁇ m to 1 mm.
  • the filter membrane is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel, aluminum, and the non-metal includes, but is not limited to, plastic; the filter membrane has a thickness of 1 micrometer to 2 millimeters.
  • the pores have a pore diameter of not more than 2.5 ⁇ m.
  • the present invention also provides a laser processing system for processing the filter film, the processing system comprising a laser, a beam expander, a diffractive optical element, a galvanometer unit, a lens, a carrier mechanism, which are sequentially disposed along a laser light path, Also included is a control unit that is electrically coupled to the laser, galvanometer unit, and carrier mechanism.
  • a CCD image sensor is further provided, the CCD image sensor being disposed adjacent to the galvanometer unit, the camera of the CCD image sensor being oriented toward a load plane of the carrier mechanism.
  • the laser emits a laser beam having a wavelength of less than 2000 nm.
  • the pulse width of the laser may be in the order of milliseconds, microseconds, nanoseconds, picoseconds or femtoseconds.
  • the galvanometer unit comprises an X-Y galvanometer, an angle measuring sensor and a driving mechanism for driving the X-Y galvanometer to rotate;
  • the carrier mechanism is an X-Y axis moving platform.
  • the lens may be a plano-convex lens, a lenticular lens or a flat field scanning lens.
  • a laser-processed filter membrane according to the present invention wherein the filter membrane is provided with a microwell array for filtering microparticles, and the micropore array has a diameter of 0.1 ⁇ m to 1 mm. It can filter contaminated particles of different sizes (several hundred nanometers to several hundred micrometers), and has a wide application range.
  • the prepared filter membrane (net) has a smaller pore diameter than the contaminated particles, the filter pores of the filter membrane are prepared by laser processing. The processing efficiency is high, the equipment itself has no loss, and the filter membrane with large pore density and quantity can be prepared, and the production cost is reduced, and the obtained filter membrane can be used as a mask or other filtering products as needed.
  • the filter film processed by laser according to the present invention is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel, aluminum, and the non-metal includes, but not limited to, plastic.
  • the filter membrane has a thickness of 1 micrometer to 2 millimeters, and the filter membrane has a wide selection of materials, and the filter membranes of different materials can be applied to different filtration occasions.
  • a laser processing system for processing the filter film according to the present invention comprising a laser, a beam expander, a diffractive optical element, a galvanometer unit, a lens, and a carrier mechanism which are sequentially disposed along a laser beam path, and further includes A control unit electrically coupled to the laser, the galvanometer unit, and the carrier mechanism.
  • the system can monitor the laser drilling process in real time with high reliability, high processing efficiency and high precision, and is suitable for industrial mass production of filtration membranes.
  • FIG. 1 is a schematic view showing the structure of a laser processing system according to a second embodiment of the present invention.
  • the embodiment provides a filter membrane processed by laser, wherein the filter membrane is distributed with a micropore array for filtering microparticles of different particle sizes, wherein the micropore array has a diameter of 0.1 ⁇ m to 1 mm. Preferably, it is 2-500 ⁇ m. According to different requirements, the micropores can be processed into different pore diameters by laser processing. In the embodiment, the pore diameter of the micropores is preferably not more than 2.5 ⁇ m, which is suitable for filtering micro particles such as PM2.5. Its filtering effect is good, and it does not need to be superimposed on multiple layers when used.
  • the material of the filter film may be metal or non-metal material, wherein the metal material may be selected from conventional materials such as stainless steel or aluminum, and the non-metal material may be selected from plastic.
  • the thickness of the filter film is 1 micrometer to 2 millimeters, according to requirements. Choose a different thickness.
  • the filter membrane may be a filter mesh having different aperture meshes made by laser, and may function as a filter particulate.
  • the embodiment provides a laser processing system for processing the filter film (mesh), as shown in FIG. 1, comprising a laser 1 arranged sequentially along a laser beam path, and a beam expander 2 for changing a diameter of a laser beam. a diffractive optical element (DOE) 7, a galvanometer unit 3 for deflecting the laser beam, a lens 4 for focusing the laser beam, and a carrier mechanism 5 with the carrier plane of the carrier mechanism 5 facing the lens 4
  • the light exiting surface further includes a control unit 6 electrically connected to the laser 1, the galvanometer unit 3 and the carrier mechanism 4.
  • the diffractive optical element 7 is disposed between the beam expanding device 2 and the galvanometer unit 3, and functions to diffract the laser beam into a plurality of parallel beams, and can simultaneously form a plurality of micropores on the filter film or directly form micropores.
  • the array improves the efficiency of laser drilling.
  • the control unit 6 is a control terminal of a conventional computer, a mobile phone, etc.;
  • the laser 1 is a semiconductor laser, and the laser beam emits a wavelength of 266-1064 nm;
  • the beam expander 2 is a laser beam expander, and the beam expansion factor is 1-10 times, used to change the beam diameter and divergence angle of the laser beam to make the laser focusing effect better;
  • the galvanometer unit 3 includes a set of XY galvanometers, which can be rotated in the X and Y directions, respectively.
  • the laser beam is reflected to achieve a deflection effect on the laser
  • the galvanometer is connected with an angle measuring sensor for measuring the deflection angle of the X and Y galvanometers and transmitting the measured information to the control unit 6, and further comprising driving the XY a drive mechanism for rotating the galvanometer, wherein the drive mechanism is a conventional servo motor;
  • the lens 4 may be a plano-convex lens, a lenticular lens or a normal scanning lens to perform focusing on the laser beam;
  • the carrier mechanism 5 For the XY axis moving platform, the movement of the workpiece to be perforated filter film can be driven in the X and Y directions under the control of the control unit 6.
  • a CCD image sensor is further disposed, and the CCD image sensor is disposed adjacent to the galvanometer unit, and the camera of the image sensor faces the loading plane of the loading mechanism 5 to monitor the laser drilling process in real time.
  • the embodiment further provides a laser drilling system using the filter film (net) of the embodiment 1 for laser drilling, which comprises the following steps:
  • the filter film (mesh) workpiece to be processed on the load plane of the loading mechanism 5 setting the laser focus position and laser processing parameters, and setting the pulse width and power of the laser according to the thickness and material of the filter film (net).
  • the pulse width of the laser can be set to the millisecond, microsecond, nanosecond, picosecond or femtosecond level according to different filter membranes.
  • the filter membrane (net) is made of plastic material and has a thickness of 5 -60 ⁇ m;

Abstract

Disclosed is a filtering film processed using a laser. A micropore array for filtering microparticles is distributed on the filtering film, the diameters of the micropores being 0.1 micrometer to 1 millimeter. Further disclosed is a laser processing system for processing the filtering film, the system comprising a laser device (1), a beam expanding device (2), a diffraction optical element (7), a galvanometer unit (3), a lens (4), an object carrying mechanism (5) and a corresponding control unit (6) provided in sequence. By means of the selection of laser processing parameters, with the aid of the galvanometer and the object carrying mechanism, a micropore array with pore diameters ranging from hundreds of nanometers to hundreds of micrometers can be manufactured on a filtering film made of a selected material. Said system can be used for processing the filtering film, being high in working efficiency, low in production cost and large in micropore density, and having no tool consumption and good filtering effect.

Description

一种利用激光加工的过滤膜及激光加工系统  Filter film and laser processing system using laser processing
技术领域Technical field
本发明属于环保领域,涉及一种利用激光加工的过滤膜或过滤网及加工该过滤膜或过滤网的激光加工系统。The invention belongs to the field of environmental protection, and relates to a filter film or a filter screen processed by laser and a laser processing system for processing the filter film or the filter net.
背景技术Background technique
近年来全球空气污染、水污染现象日益加重,为了缓解气体或液体污染物对人们的不良影响,过滤技术得到了研究人员和环保型企业的重视和发展,其中微滤技术和产品,尤其是能过滤微米至纳米尺度污染物的过滤膜(网)的需求量不断加大。微滤具体是指从气相和液相悬浮液中截留微粒、细菌和其它污染物的方法,主要采用膜分离技术实现,过滤膜的分离机理主要是筛分截留,将尺寸大于滤膜孔径的固体颗粒或颗粒聚集体截留,可广泛应用于废水、污水处理、食品、药品工业、海水淡化工程、空气污染治理等领域。In recent years, global air pollution and water pollution have become more and more serious. In order to alleviate the adverse effects of gas or liquid pollutants on people, filtration technology has been valued and developed by researchers and environmentally friendly enterprises, among which microfiltration technology and products, especially The demand for filtration membranes (nets) for filtering micron to nanoscale contaminants continues to increase. Microfiltration refers specifically to the removal of particulates, bacteria and other contaminants from gas-phase and liquid-phase suspensions. It is mainly achieved by membrane separation technology. The separation mechanism of the membrane is mainly sieve retention, and the solids with a size larger than the membrane pore size. Particles or particle aggregates can be widely used in wastewater, sewage treatment, food, pharmaceutical industry, desalination projects, air pollution control and other fields.
特别是近几年空气中细颗粒物污染严重,环境中空气动力学当量直径小于2.5微米的颗粒物(PM2.5)浓度居高不下,严重影响了空气质量,与较粗的大气颗粒相比,其面积大、活性强,易附带如重金属、微生物等有毒、有害物质,其在大气中停留时间长、输送距离远,对人体健康和大气环境影响很大。而现有过滤膜加工装置结构较为复杂,生产成本高,同时膜材料可过滤的微粒很有限。Especially in recent years, the fine particles in the air are seriously polluted, and the concentration of particulate matter (PM2.5) with aerodynamic equivalent diameter less than 2.5 microns in the environment is high, which seriously affects the air quality, compared with the coarser atmospheric particles. It has large area and strong activity, and it is easy to attach toxic and harmful substances such as heavy metals and microorganisms. It has a long residence time in the atmosphere and a long transportation distance, which has a great impact on human health and the atmospheric environment. However, the existing filter membrane processing device has a complicated structure and high production cost, and at the same time, the membrane material can filter fine particles.
发明内容Summary of the invention
为解决上述技术问题,本发明提出一种利用激光加工的、可用于过滤不同尺寸(几百纳米至几百微米)污染颗粒的过滤膜(网)及用于制备过滤孔的激光加工系统。In order to solve the above technical problems, the present invention proposes a laser processing system which can be used for filtering contaminated particles of different sizes (several hundred nanometers to several hundreds of micrometers) and a laser processing system for preparing filter holes.
本发明的技术方案为:The technical solution of the present invention is:
本发明提供一种利用激光加工的过滤膜,所述过滤膜上分布有用于过滤微颗粒的微孔阵列,所述微孔阵列中,微孔的直径为0.1微米-1毫米。The present invention provides a filter membrane processed by laser, on which a microwell array for filtering microparticles is distributed, in which the micropores have a diameter of 0.1 μm to 1 mm.
作为优选,所述过滤膜的材质为金属或非金属,所述金属包括但不限于不锈钢、铝,所述非金属包括但不限于塑料;所述过滤膜的厚度为1微米-2毫米。Preferably, the filter membrane is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel, aluminum, and the non-metal includes, but is not limited to, plastic; the filter membrane has a thickness of 1 micrometer to 2 millimeters.
作为优选,所述微孔的孔径不大于2.5μm。Preferably, the pores have a pore diameter of not more than 2.5 μm.
本发明还提供一种用于加工所述过滤膜的激光加工系统,所述加工系统包括沿激光光路顺次设置的激光器、扩束装置、衍射光学元件、振镜单元、透镜、载物机构,还包括与所述激光器、振镜单元和载物机构电连接的控制单元。The present invention also provides a laser processing system for processing the filter film, the processing system comprising a laser, a beam expander, a diffractive optical element, a galvanometer unit, a lens, a carrier mechanism, which are sequentially disposed along a laser light path, Also included is a control unit that is electrically coupled to the laser, galvanometer unit, and carrier mechanism.
作为优选,还包括CCD图像传感器,所述CCD图像传感器与所述振镜单元相邻设置,所述CCD图像传感器的摄像头朝向所述载物机构的载物平面。Preferably, a CCD image sensor is further provided, the CCD image sensor being disposed adjacent to the galvanometer unit, the camera of the CCD image sensor being oriented toward a load plane of the carrier mechanism.
作为优选,所述激光器发出的激光束波长小于2000nm。Preferably, the laser emits a laser beam having a wavelength of less than 2000 nm.
作为优选,所述激光的脉宽可为毫秒、微秒、纳秒、皮秒或飞秒级别。Preferably, the pulse width of the laser may be in the order of milliseconds, microseconds, nanoseconds, picoseconds or femtoseconds.
作为优选,所述振镜单元包括X-Y振镜、角度测量传感器和驱动所述X-Y振镜转动的驱动机构;Preferably, the galvanometer unit comprises an X-Y galvanometer, an angle measuring sensor and a driving mechanism for driving the X-Y galvanometer to rotate;
作为优选,所述载物机构为X-Y轴移动平台。Preferably, the carrier mechanism is an X-Y axis moving platform.
作为优选,所述透镜可以为平凸透镜、双凸透镜或平场扫描透镜。Preferably, the lens may be a plano-convex lens, a lenticular lens or a flat field scanning lens.
本发明的上述技术方案相比现有技术具有以下优点:The above technical solution of the present invention has the following advantages over the prior art:
(1)本发明所述的利用激光加工的过滤膜,所述过滤膜上分布有用于过滤微颗粒的微孔阵列,所述微孔阵列中,微孔的直径为0.1微米-1毫米。能过滤不同尺寸(几百纳米至几百微米)的污染颗粒,应用范围广,当制得的过滤膜(网)孔径小于污染颗粒效果更佳;同时该过滤膜的过滤孔由激光加工制得,加工效率高、设备本身无损耗,可以制备孔密度大、数量多的过滤膜,降低了生产成本,制得的过滤膜可根据需要用作口罩或其它过滤产品上。(1) A laser-processed filter membrane according to the present invention, wherein the filter membrane is provided with a microwell array for filtering microparticles, and the micropore array has a diameter of 0.1 μm to 1 mm. It can filter contaminated particles of different sizes (several hundred nanometers to several hundred micrometers), and has a wide application range. When the prepared filter membrane (net) has a smaller pore diameter than the contaminated particles, the filter pores of the filter membrane are prepared by laser processing. The processing efficiency is high, the equipment itself has no loss, and the filter membrane with large pore density and quantity can be prepared, and the production cost is reduced, and the obtained filter membrane can be used as a mask or other filtering products as needed.
(2)本发明所述的利用激光加工的过滤膜,所述过滤膜的材质为金属或非金属,所述金属包括但不限于不锈钢、铝,所述非金属包括但不限于塑料,所述过滤膜的厚度为1微米-2毫米,所述过滤膜材质选用广泛,不同材质的过滤膜可应用于不同的过滤场合。(2) The filter film processed by laser according to the present invention, the filter film is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel, aluminum, and the non-metal includes, but not limited to, plastic. The filter membrane has a thickness of 1 micrometer to 2 millimeters, and the filter membrane has a wide selection of materials, and the filter membranes of different materials can be applied to different filtration occasions.
(3)本发明所述的用于加工所述过滤膜的激光加工系统,包括沿激光光路顺次设置的激光器、扩束装置、衍射光学元件、振镜单元、透镜、载物机构,还包括与所述激光器、振镜单元和载物机构电连接的控制单元。该系统可实时监控激光钻孔过程,可靠性高、加工效率和精度高,适用于过滤膜的工业化批量生产。(3) A laser processing system for processing the filter film according to the present invention, comprising a laser, a beam expander, a diffractive optical element, a galvanometer unit, a lens, and a carrier mechanism which are sequentially disposed along a laser beam path, and further includes A control unit electrically coupled to the laser, the galvanometer unit, and the carrier mechanism. The system can monitor the laser drilling process in real time with high reliability, high processing efficiency and high precision, and is suitable for industrial mass production of filtration membranes.
附图说明DRAWINGS
为了使本发明的内容更容易被清楚的理解,下面根据本发明的具体实施例并结合附图,对本发明作进一步详细的说明,其中In order to make the content of the present invention easier to understand, the present invention will be further described in detail below with reference to the accompanying drawings
图1是本发明实施例2所述的激光加工系统的结构示意图。1 is a schematic view showing the structure of a laser processing system according to a second embodiment of the present invention.
图中附图标记表示为:1-激光器;2-扩束装置;3-振镜单元;4-透镜;5-载物机构;6-控制单元;7-衍射光学元件。Reference numerals in the figures are denoted as: 1-laser; 2-expansion beam device; 3-galvanometer unit; 4-lens; 5-load mechanism; 6-control unit; 7-diffractive optical element.
具体实施方式detailed description
实施例1Example 1
本实施例提供一种利用激光加工的过滤膜,所述过滤膜上分布有用过过滤不同粒径的微颗粒的微孔阵列,所述微孔阵列中,微孔的直径为0.1μm-1mm,优选为2-500μm,根据不同的需求,可将微孔用激光加工为不同孔径,本实施例中,所述微孔的孔径优选为不大于2.5μm,适宜于过滤PM2.5等微型颗粒,其过滤效果好,在使用时,无需多层叠加使用。所述过滤膜的材质可以为金属或者非金属材料,其中金属材料可以选择为不锈钢或者铝等常规材质,非金属材料可以选用塑料,所述过滤膜的厚度为1微米-2毫米,可根据需求选用不同的厚度。作为可变换的实施方式,所述过滤膜也可以为具有激光制作的不同孔径网孔的过滤网,起到过滤微粒的作用即可。The embodiment provides a filter membrane processed by laser, wherein the filter membrane is distributed with a micropore array for filtering microparticles of different particle sizes, wherein the micropore array has a diameter of 0.1 μm to 1 mm. Preferably, it is 2-500 μm. According to different requirements, the micropores can be processed into different pore diameters by laser processing. In the embodiment, the pore diameter of the micropores is preferably not more than 2.5 μm, which is suitable for filtering micro particles such as PM2.5. Its filtering effect is good, and it does not need to be superimposed on multiple layers when used. The material of the filter film may be metal or non-metal material, wherein the metal material may be selected from conventional materials such as stainless steel or aluminum, and the non-metal material may be selected from plastic. The thickness of the filter film is 1 micrometer to 2 millimeters, according to requirements. Choose a different thickness. As a transformable embodiment, the filter membrane may be a filter mesh having different aperture meshes made by laser, and may function as a filter particulate.
实施例2Example 2
本实施例提供一种用于加工所述过滤膜(网)的激光加工系统,其如图1所示,包括沿激光光路顺次设置的激光器1、用于改变激光光束直径的扩束装置2、衍射光学元件(DOE)7、用于使激光束偏转的振镜单元3、用于聚焦激光束的透镜4和载物机构5,所述载物机构5的载物平面朝向所述透镜4的出光面,还包括与所述激光器1、振镜单元3和载物机构4电连接的控制单元6。所述衍射光学元件7设置于扩束装置2与振镜单元3之间,起到将激光束衍射成为多条平行光束的作用,可以同时在过滤膜上形成多个微孔或者直接形成微孔阵列,提高了激光打孔的效率。The embodiment provides a laser processing system for processing the filter film (mesh), as shown in FIG. 1, comprising a laser 1 arranged sequentially along a laser beam path, and a beam expander 2 for changing a diameter of a laser beam. a diffractive optical element (DOE) 7, a galvanometer unit 3 for deflecting the laser beam, a lens 4 for focusing the laser beam, and a carrier mechanism 5 with the carrier plane of the carrier mechanism 5 facing the lens 4 The light exiting surface further includes a control unit 6 electrically connected to the laser 1, the galvanometer unit 3 and the carrier mechanism 4. The diffractive optical element 7 is disposed between the beam expanding device 2 and the galvanometer unit 3, and functions to diffract the laser beam into a plurality of parallel beams, and can simultaneously form a plurality of micropores on the filter film or directly form micropores. The array improves the efficiency of laser drilling.
其中,所述控制单元6为常规计算机、手机等控制终端;所述激光器1为半导体激光器,其发出的激光束波长为266-1064nm;扩束装置2为激光扩束镜,其扩束倍数为1-10倍,用于改变激光束的光束直径和发散角,使激光聚焦效果更好;所述振镜单元3包括一套X-Y振镜,这套镜片可以分别在X、Y轴方向转动,对激光束起到反射作用,实现对激光的偏转效果,振镜连接有角度测量传感器,用于测量X、Y振镜的偏转角度并将测得的信息传送给控制单元6,还包括驱动X-Y振镜转动的驱动机构,所述驱动机构为常规的伺服电机;所述透镜4可以采用平凸透镜、双凸透镜或平常扫描透镜,起到对激光束的聚焦作用即可;所述载物机构5为X-Y轴移动平台,可在控制单元6的调控下沿X、Y方向带动待打孔过滤膜工件移动。The control unit 6 is a control terminal of a conventional computer, a mobile phone, etc.; the laser 1 is a semiconductor laser, and the laser beam emits a wavelength of 266-1064 nm; the beam expander 2 is a laser beam expander, and the beam expansion factor is 1-10 times, used to change the beam diameter and divergence angle of the laser beam to make the laser focusing effect better; the galvanometer unit 3 includes a set of XY galvanometers, which can be rotated in the X and Y directions, respectively. The laser beam is reflected to achieve a deflection effect on the laser, and the galvanometer is connected with an angle measuring sensor for measuring the deflection angle of the X and Y galvanometers and transmitting the measured information to the control unit 6, and further comprising driving the XY a drive mechanism for rotating the galvanometer, wherein the drive mechanism is a conventional servo motor; the lens 4 may be a plano-convex lens, a lenticular lens or a normal scanning lens to perform focusing on the laser beam; the carrier mechanism 5 For the XY axis moving platform, the movement of the workpiece to be perforated filter film can be driven in the X and Y directions under the control of the control unit 6.
更进一步地,还包括一CCD图像传感器,所述CCD图像传感器与所述振镜单元相邻设置,图像传感器的摄像头朝向载物机构5的载物平面,实时监控激光打孔的过程。Further, a CCD image sensor is further disposed, and the CCD image sensor is disposed adjacent to the galvanometer unit, and the camera of the image sensor faces the loading plane of the loading mechanism 5 to monitor the laser drilling process in real time.
本实施例还提供一种利用实施例1所述的过滤膜(网)的激光加工系统进行激光打孔的方法,其包括如下步骤:The embodiment further provides a laser drilling system using the filter film (net) of the embodiment 1 for laser drilling, which comprises the following steps:
S1、采用控制单元6制作加工图形,设置待打孔的孔径和孔间距,并将该图形信息导入至激光器1终端;S1, using the control unit 6 to make a processing pattern, setting the aperture and hole spacing to be punched, and introducing the graphic information to the terminal of the laser 1;
S2、将待加工过滤膜(网)工件置于载物机构5的载物平面,设置激光焦点位置和激光加工参数,根据过滤膜(网)的厚度和材质设定激光的脉宽、功率、波长等参数,激光的脉宽可根据过滤膜的不同设置为毫秒、微秒、纳秒、皮秒或飞秒级别,本实施例中,所述过滤膜(网)采用塑料材质,厚度为5-60μm;S2, placing the filter film (mesh) workpiece to be processed on the load plane of the loading mechanism 5, setting the laser focus position and laser processing parameters, and setting the pulse width and power of the laser according to the thickness and material of the filter film (net). For the parameters such as the wavelength, the pulse width of the laser can be set to the millisecond, microsecond, nanosecond, picosecond or femtosecond level according to different filter membranes. In this embodiment, the filter membrane (net) is made of plastic material and has a thickness of 5 -60 μm;
S3、开启激光器1,进行激光打孔,同时启动CCD图像传感器,对激光打孔过程全程实时监控,在激光打孔的过程中控制所述载物机构5在X、Y轴方向移动,以对工件的不同位置进行打孔加工。S3, turning on the laser 1, performing laser drilling, simultaneously starting the CCD image sensor, real-time monitoring of the laser drilling process, and controlling the loading mechanism 5 to move in the X and Y directions during the laser drilling process, Punching is performed at different positions of the workpiece.
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。It is apparent that the above-described embodiments are merely illustrative of the examples, and are not intended to limit the embodiments. Other variations or modifications of the various forms may be made by those skilled in the art in light of the above description. There is no need and no way to exhaust all of the implementations. Obvious changes or variations resulting therefrom are still within the scope of the invention.

Claims (10)

  1. 一种利用激光加工的过滤膜,其特征在于,所述过滤膜上分布有用于过滤微颗粒的微孔阵列,所述微孔阵列中,微孔的直径为0.1微米-1毫米。 A filter membrane processed by laser, characterized in that a microporous array for filtering microparticles is distributed on the filter membrane, and the pores have a diameter of 0.1 μm to 1 mm.
  2. 根据权利要求1所述的利用激光加工的过滤膜,其特征在于,所述过滤膜的材质为金属或非金属,所述金属包括但不限于不锈钢、铝;所述非金属包括但不限于塑料,所述过滤网的厚度为1微米-2毫米。The filter film processed by laser according to claim 1, wherein the filter film is made of metal or non-metal, and the metal includes, but is not limited to, stainless steel or aluminum; and the non-metal includes but is not limited to plastic. The filter has a thickness of from 1 micron to 2 mm.
  3. 根据权利要求2所述的利用激光加工的过滤膜,其特征在于,所述微孔的孔径不大于2.5μm。The filter film processed by laser according to claim 2, wherein the pores have a pore diameter of not more than 2.5 μm.
  4. 一种用于加工权利要求1-3任一项所述的过滤膜的激光加工系统,其特征在于,所述加工系统包括沿激光光路顺次设置的激光器、扩束装置、衍射光学元件、振镜单元、透镜、载物机构,所述载物机构的载物平面朝向所述透镜的出光面,还包括与所述激光器、振镜单元和载物机构电连接的控制单元。A laser processing system for processing the filter membrane according to any one of claims 1 to 3, characterized in that the processing system comprises a laser, a beam expanding device, a diffractive optical element, a vibration, which are sequentially disposed along a laser beam path a mirror unit, a lens, and a carrier mechanism, wherein a load plane of the carrier mechanism faces a light exit surface of the lens, and further includes a control unit electrically connected to the laser, the galvanometer unit, and the load mechanism.
  5. 根据权利要求4所述的激光加工系统,其特征在于,还包括CCD图像传感器,所述CCD图像传感器与所述振镜单元相邻设置,所述CCD图像传感器的摄像头朝向所述载物机构的载物平面。A laser processing system according to claim 4, further comprising a CCD image sensor, said CCD image sensor being disposed adjacent to said galvanometer unit, said camera of said CCD image sensor facing said carrier mechanism Load plane.
  6. 根据权利要求5所述的激光加工系统,其特征在于,所述激光器发出的激光束波长小于2000nm。A laser processing system according to claim 5, wherein said laser emits a laser beam having a wavelength of less than 2000 nm.
  7. 根据权利要求6所述的激光加工系统,其特征在于,所述激光的脉宽可为毫秒、微秒、纳秒、皮秒或飞秒级别。The laser processing system of claim 6 wherein said laser has a pulse width in the order of milliseconds, microseconds, nanoseconds, picoseconds or femtoseconds.
  8. 根据权利要求7所述的激光加工系统,其特征在于,所述振镜单元包括X-Y振镜、角度测量传感器和驱动所述X-Y振镜转动的驱动机构。The laser processing system according to claim 7, wherein said galvanometer unit comprises an X-Y galvanometer, an angle measuring sensor, and a driving mechanism that drives said X-Y galvanometer rotation.
  9. 根据权利要求8所述的激光加工系统,其特征在于,所述载物机构为X-Y轴移动平台。The laser processing system of claim 8 wherein said carrier mechanism is an X-Y axis moving platform.
  10. 根据权利要求9所述的激光加工系统,其特征在于,所述透镜可以为平凸透镜、双凸透镜或平场扫描透镜。The laser processing system of claim 9 wherein said lens is a plano-convex lens, a lenticular lens or a flat field scanning lens.
PCT/CN2017/103375 2017-05-11 2017-09-26 Filtering film processed using laser and laser processing system WO2018205482A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710331982.6 2017-05-11
CN201710331982.6A CN106944751A (en) 2017-05-11 2017-05-11 A kind of filter membrane and laser-processing system using Laser Processing

Publications (1)

Publication Number Publication Date
WO2018205482A1 true WO2018205482A1 (en) 2018-11-15

Family

ID=59478578

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/103375 WO2018205482A1 (en) 2017-05-11 2017-09-26 Filtering film processed using laser and laser processing system

Country Status (2)

Country Link
CN (1) CN106944751A (en)
WO (1) WO2018205482A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106944751A (en) * 2017-05-11 2017-07-14 英诺激光科技股份有限公司 A kind of filter membrane and laser-processing system using Laser Processing
CN107745188A (en) * 2017-09-30 2018-03-02 深圳信息职业技术学院 A kind of picosecond laser process equipment
CN107876968A (en) * 2017-12-26 2018-04-06 英诺激光科技股份有限公司 A kind of laser process equipment for parallel processing
CN108211817B (en) * 2017-12-29 2020-08-18 广东工业大学 Manufacturing method of aluminum metal filtering membrane
CN112516804A (en) * 2019-09-18 2021-03-19 无锡华润微电子有限公司 PM2.5 protective equipment, PM2.5 filtering membrane and preparation method thereof
CN113750823B (en) * 2021-07-19 2022-11-25 青岛科技大学 Natural biomass material oil-water separation membrane and preparation method and application thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108392A (en) * 1993-10-13 1995-04-25 Seishin Kigyo:Kk Base plate piercing method and device and base plate subjected to piercing
JP2006086436A (en) * 2004-09-17 2006-03-30 Seiko Epson Corp Method of manufacturing semiconductor apparatus, electro-optical device and electronic device
CN202185678U (en) * 2011-07-27 2012-04-11 苏州德龙激光有限公司 Device for manufacturing metal film group hole through ultrashort pulse laser
CN203817621U (en) * 2013-12-03 2014-09-10 张立国 Laser beam splitting and galvanometer scanning processing device
CN105664725A (en) * 2016-03-28 2016-06-15 杭州青澜环保科技有限公司 Soft flat filter membrane element and method for manufacturing same
CN106475685A (en) * 2016-12-07 2017-03-08 常州英诺激光科技有限公司 The device of a kind of raising material laser marking quality and efficiency and marking method
CN106944751A (en) * 2017-05-11 2017-07-14 英诺激光科技股份有限公司 A kind of filter membrane and laser-processing system using Laser Processing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU780338B2 (en) * 1999-12-08 2005-03-17 Baxter International Inc. Microporous filter membrane, method of making microporous filter membrane and separator employing microporous filter membranes
US6720519B2 (en) * 2001-11-30 2004-04-13 Matsushita Electric Industrial Co., Ltd. System and method of laser drilling
US6817708B2 (en) * 2002-10-29 2004-11-16 Xerox Corporation Conical or cylindrical laser ablated filter
CN101980083B (en) * 2010-09-13 2013-02-20 长春理工大学 Method for preparing filter membrane mesh structure by laser interference photoetching technology
KR101550008B1 (en) * 2014-05-16 2015-09-07 한국과학기술원 Method of manufacturing surface plasmonic color filter using laser interference lithography
CN204771159U (en) * 2014-06-23 2015-11-18 三菱电机株式会社 Laser machining device
CN105688447B (en) * 2016-01-21 2018-02-06 北京理工大学 A kind of filter screen and its femtosecond laser preparation method of achievable high efficiency water-oil separating
CN205309586U (en) * 2016-01-29 2016-06-15 孙树峰 Device in femto second laser processing aeroengine blade air film hole

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07108392A (en) * 1993-10-13 1995-04-25 Seishin Kigyo:Kk Base plate piercing method and device and base plate subjected to piercing
JP2006086436A (en) * 2004-09-17 2006-03-30 Seiko Epson Corp Method of manufacturing semiconductor apparatus, electro-optical device and electronic device
CN202185678U (en) * 2011-07-27 2012-04-11 苏州德龙激光有限公司 Device for manufacturing metal film group hole through ultrashort pulse laser
CN203817621U (en) * 2013-12-03 2014-09-10 张立国 Laser beam splitting and galvanometer scanning processing device
CN105664725A (en) * 2016-03-28 2016-06-15 杭州青澜环保科技有限公司 Soft flat filter membrane element and method for manufacturing same
CN106475685A (en) * 2016-12-07 2017-03-08 常州英诺激光科技有限公司 The device of a kind of raising material laser marking quality and efficiency and marking method
CN106944751A (en) * 2017-05-11 2017-07-14 英诺激光科技股份有限公司 A kind of filter membrane and laser-processing system using Laser Processing

Also Published As

Publication number Publication date
CN106944751A (en) 2017-07-14

Similar Documents

Publication Publication Date Title
WO2018205482A1 (en) Filtering film processed using laser and laser processing system
JP7437323B2 (en) Laser processing equipment, how to operate it, and how to process workpieces with it
Voisiat et al. Picosecond-laser 4-beam-interference ablation as a flexible tool for thin film microstructuring
US6555781B2 (en) Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
CN104959730B (en) Rotary table femtosecond laser direct-write methods and device
CN112867578A (en) Laser processing apparatus, method of operating the same, and method of processing workpiece using the same
JP2007069257A (en) Device and method for laser beam machining, and mechanism and method for recovering debris
WO1992002331A1 (en) Yag laser working machine for precision working of thin film
KR20150121334A (en) Multi modal laser machining system
CN101131470A (en) Diaphragm ultraviolet laser micromachining system used for scanning electron microscope and method thereof
CN207656101U (en) A kind of filter membrane and laser-processing system using laser processing
DE10343323A1 (en) Stamp lithography method and device and stamp for the stamp lithograph
CN203636207U (en) Vacuum pulse laser etching device
TWI459066B (en) Apparatus and system for improving depth of focus
JP4692897B2 (en) Method for producing fine hole material, fine hole material and separation membrane provided with the same.
JP2016190270A (en) Laser ablation tooling via distributed patterned mask
CN202539806U (en) Multifunctional laser machining bit
CN109534286A (en) A kind of material surface nesting nanostructure and preparation method thereof
CN109911848B (en) Device and method for precisely controlling and transmitting nanowires
DE102006003604A1 (en) Process for microstructuring solid surfaces
CN216911056U (en) Particle size sorting device for micro-nano particles
CN113511625B (en) Fat and thin stripe structure and preparation method thereof
CN219616959U (en) Laser rotary-cut drilling equipment for carrier plate material
CN220838485U (en) Experimental tablet laser drilling machine
CN214921443U (en) Laser processing device for multi-beam fast etching large-breadth conductive film

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17909018

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 24.04.2020)

122 Ep: pct application non-entry in european phase

Ref document number: 17909018

Country of ref document: EP

Kind code of ref document: A1