CN203636207U - Vacuum pulse laser etching device - Google Patents
Vacuum pulse laser etching device Download PDFInfo
- Publication number
- CN203636207U CN203636207U CN201320893352.5U CN201320893352U CN203636207U CN 203636207 U CN203636207 U CN 203636207U CN 201320893352 U CN201320893352 U CN 201320893352U CN 203636207 U CN203636207 U CN 203636207U
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- vacuum
- pulse laser
- galvanometer
- etching
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- 238000010329 laser etching Methods 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000000428 dust Substances 0.000 claims abstract description 14
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 238000004891 communication Methods 0.000 claims abstract description 6
- 238000012544 monitoring process Methods 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 24
- 238000000034 method Methods 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 8
- 230000007547 defect Effects 0.000 abstract description 2
- 238000007664 blowing Methods 0.000 abstract 2
- 239000010408 film Substances 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003631 wet chemical etching Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Abstract
The utility model discloses a vacuum pulse laser etching device. The vacuum pulse laser etching device comprises a vacuum platform used for adsorbing film materials, a laser device and a galvanometer. A beam expander is arranged between the laser device and the galvanometer. A CCD image sensor is arranged above the vacuum platform, an air blowing device is arranged on one side of the vacuum platform, a dust collecting device is arranged on the other side of the vacuum platform, a grating ruler used for monitoring the positions of the film materials is arranged in the middle of the vacuum platform, and an adsorption hole is formed in the vacuum platform and connected with the vacuum pump; the laser device and the galvanometer are connected with an industrial personal computer through communication modules. According to the vacuum pulse laser etching device, the high-frequency short-pulse laser device is adopted for conducting laser etching, the low-amplitude galvanometer is used for completing film material etching, generated dust is collected through the air blowing system and the dust collecting system, therefore, the defects that in the prior art, the cost is high, the efficiency is low, the processing limit is large and pollution is great are avoided, the etching process is simplified and the precision is improved.
Description
Technical field
The utility model relates to a kind of etching device of conductive film, relates in particular to a kind of vacuum type pulse laser etching device.
Background technology
On conductive film layer on traditional touch-screen, circuit manufacturing method mainly contains the process such as wet chemical etching and gold-tinted etching.Wherein in the process of wet chemical etching conductive rete, it is long that operation has been designed into time of etching, and to need the tool, consumptive material and the human cost that drop into be higher; Waste water and the spent acid etc. producing in production process is in addition also comparatively serious to the pollution of environment, and whole technological process has also caused the waste of the energy.Gold-tinted etching technics is to need early investment larger, with high costs, selective also comparatively narrow for material, be not suitable for the preparation method of all conductive film layers on market, add regular maintenance, consumptive material and human cost also larger, thereby cause the whole sharply increase manufacturing a finished product, application is also just limited by very large.
In addition, the live width that the conductive film layer circuit on traditional etching touch-screen is realized the most carefully can only reach 80um, and yields is lower, linear inhomogeneous, changes different batches product comparatively loaded down with trivial details, needs chemical medicinal liquid to clean, contaminated environment; The net tension value that stretches tight is less, and finished-product material wearability, chemical proofing are poor, easy aging embrittlement.In this mode of printing complex procedures, production, need more consumptive material, producing line needs more manpower to safeguard, limitation is larger.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of vacuum type pulse laser etching device, can utilize pulse laser to focus on the hot spot that laser beam is focused to hundreds of nanometer to 20 micron by optical fiber, after focusing on, hot spot reaches the removal energy value of material, by the accurate rapid scanning of high-velocity scanning galvanometer system, simplify etching process, reduce costs and improve precision.
The utility model is to solve the problems of the technologies described above the technical scheme adopting to be to provide a kind of vacuum type pulse laser etching device, comprise vacuum platform, laser instrument and galvanometer for adsorbed film material, between described laser instrument and galvanometer, be provided with beam expanding lens, the top of described vacuum platform is provided with ccd image sensor, one side of described vacuum platform is provided with blowning installation, opposite side is provided with dust collect plant, the grating scale that is provided with monitoring film material position in the middle of described vacuum platform, described vacuum platform is provided with adsorption hole and is connected with vavuum pump; Described laser instrument, galvanometer are connected with industrial computer by communication module.
Above-mentioned vacuum type pulse laser etching device, wherein, described ccd image sensor be positioned at film material directly over.
Above-mentioned vacuum type pulse laser etching device, wherein, described laser wavelength scope is 190nm-1100nm, and pulsewidth scope is 1ps-200ns, and frequency range is 10KHz-100MHz.
Above-mentioned vacuum type pulse laser etching device, wherein, described vavuum pump is composite molecular pump.
The utility model contrast prior art has following beneficial effect: the vacuum type pulse laser etching device that the utility model provides, adopt high-frequency short-pulse laser to carry out laser-induced thermal etching as lasing light emitter, complete the etching of film material by the etching of small breadth galvanometer, the dust producing is through scavenger system and dust-precipitating system control of dust, thereby can avoid prior art cost high, efficiency is low, processing limitation is large and pollute the defects such as large.In addition, the utility model, by repeatedly mobile splicing, uses laser-induced thermal etching live width can be easy to just to accomplish that 20um is even thinner; Equipment operating is simple, can realize a people and control simultaneously and operate multiple devices, and human cost greatly reduces, and efficiency is also higher; And laser-induced thermal etching has noncontact, nonpollution environment, the advantage such as easy to control.
Brief description of the drawings
Fig. 1 is the utility model vacuum type pulse laser etching device structural representation.
In figure:
1 vacuum platform 2 laser instrument 3 beam expanding lens
4 galvanometer 5CCD imageing sensor 6 blowning installations
7 dust collect plant 8 industrial computer 9 communication modules
Detailed description of the invention
Below in conjunction with drawings and Examples, the utility model will be further described.
Fig. 1 is the utility model vacuum type pulse laser etching device structural representation.
Refer to Fig. 1, the vacuum type pulse laser etching device that the utility model provides comprises the vacuum platform 1 for adsorbed film material, laser instrument 2 and galvanometer 4, between described laser instrument 2 and galvanometer 4, be provided with beam expanding lens 3, the top of described vacuum platform 1 is provided with ccd image sensor 5 (Charge-coupled Device, Chinese full name: charge coupled cell), one side of described vacuum platform 1 is provided with blowning installation 6, opposite side is provided with dust collect plant 7, in the middle of described vacuum platform 1, be provided with the grating scale (not shown) of monitoring film material position, on described vacuum platform 1, establishing platform adsorption hole is connected with vavuum pump (not shown), described laser instrument 2, galvanometer 4 are connected with industrial computer 8 by communication module 9.Described adsorption hole is evenly distributed by array way; Each adsorption hole is that aperture is the circular hole of 0.5mm～4mm, and the spacing between adjacent two adsorption holes is 2mm～20mm.
The vacuum type pulse laser etching device that the utility model provides, described vavuum pump is preferably composite molecular pump: described ccd image sensor 5 be preferably positioned at film material directly over; Described laser instrument 2 wave-length coverages are 190nm-1100nm, and pulsewidth scope is 1ps-200ns, and frequency range is 10KHz-100MHz.
The utility model also provides a kind of control method of the pulse laser etching device for above-mentioned transparent conductive film, specifically comprises the steps:
Step S1: film material to be processed is fixed on vacuum platform 1 by vacuum suction, and pulse laser etching apparatus comprises high-frequency short-pulse laser, beam expanding lens, galvanometer and field lens.Film material to be processed top is furnished with CCD contraposition observing system, and material one side to be processed is furnished with blowning installation 6, and opposite side is provided with dust collect plant 7, and laser instrument 2 is connected industrial computer 8 with galvanometer 4 by communication module 9.The utility model uses the conductive film layer on high-frequency short-pulse laser etching ito thin film, the ITO conductive material of rapidoprint taking PET film as substrate, Laser Focusing on ito thin film material, thereby reach etch effect.
Step S2: the laser that laser instrument 2 is sent coaxially expands light beam through beam expanding lens 3, the spot size of controlling after focusing on is 190nm-22um.When pulse laser etching device of the present utility model is used for the conductive film layer on etching ito thin film, before processing, laser spot focuses on the upper surface that is positioned at film material, the laser that high frequency short-pulse laser sends coaxially expands light beam through beam expanding lens 3, improve on the one hand the angle of divergence of beam propagation, reached the object of beam path alignment; On the other hand, laser beams coaxial is expanded, make to focus on rear hot spot less, thereby realize the object of laser stabilization etching.
Step S3: after beam expanding lens 3 beam-expanding collimations, light beam arrives galvanometer 4, galvanometer 4 focuses the light beam in film material to be processed surface, scanning patter is converted into data signal, and graphics carries out etching on the surface of material to be processed, and film material to be processed adsorbs fixing by vacuum platform 1.
Target, then controlled working are taken and captured to step S4:CCD imageing sensor 5 contraposition observing systems by the location mark of importing.
Step S5: the dust that etching produces produces air-flow by blowning installation 6, and collect dust by dust collect plant 7, make process stable, but the good 110mm x110mm of high-frequency short-pulse laser etching or 140mm x114mm or 170mm x170mm with interior unit after, platform movement is to next unit, laser instrument 2 starts processing again, so repeatedly, finally realizes the etching of whole processing breadth.
The utility model utilizes the light path focusing system of precision optical system processing, adopts high-frequency short-pulse laser, and touch-screen upper conductive film sandwich circuit is carried out to etching, to obtain thin more stable live width, and does not damage substrate.Laser instrument 2 is after beam expanding lens 3 collimator and extenders, focus on by field lens, make focal beam spot in 10um left and right, wherein the disposable range of work of galvanometer 4 is in 110mm x110mm or 140mm x140mm or 170mm x170mm, high-precision scanning galvanometer head has upper time accuracy and scans at a high speed, not affected by environment temperature drift, in guarantee, the uniformity of time service scanning, realizes industrial stability volume production requirement.Vacuum platform 1 flatness precision is very high, and ito thin film is fixed on vacuum platform 1 by vacuum suction, can ensure that ito thin film is placed fine, and product is not shifted in process; Carry out CCD location, and system contains CCD and automatically grabs target function, only need in software, to set up for the first time module, by corresponding the image of importing bitmap layer target position and sample target position in platform coordinate are arranged one by one, follow-up same batch products can directly be grabbed target and location automatically.Laser instrument 2 carries out etching according to design configuration, blows and dust-precipitating system etched opening simultaneously, guarantees that the dust that etching produces all sucks in dust-precipitating system, to improve repeatability and the stability of laser instrument etching ITO and silver-colored sizing process.The etching of galvanometer head is processed after breadth well, and platform movement is next breadth unit extremely, then starts to repeat processing, so repeatedly, finally realizes the etching of whole processing breadth.System motion is X-Y-Z three-shaft linkage mode, uses grating scale monitoring feedback position information, can reach high-precision positioning action operation.
Although the utility model discloses as above with preferred embodiment; so it is not in order to limit the utility model; any those skilled in the art; not departing from spirit and scope of the present utility model; when doing a little amendment and perfect, therefore protection domain of the present utility model is worked as with being as the criterion that claims were defined.
Claims (4)
1. a vacuum type pulse laser etching device, it is characterized in that, comprise the vacuum platform (1) for adsorbed film material, laser instrument (2) and galvanometer (4), between described laser instrument (2) and galvanometer (4), be provided with beam expanding lens (3), the top of described vacuum platform (1) is provided with ccd image sensor (5), one side of described vacuum platform (1) is provided with blowning installation (6), opposite side is provided with dust collect plant (7), in the middle of described vacuum platform (1), be provided with the grating scale of monitoring film material position, described vacuum platform (1) is provided with adsorption hole and is connected with vavuum pump, described laser instrument (2), galvanometer (4) are connected with industrial computer (8) by communication module (9).
2. vacuum type pulse laser etching device as claimed in claim 1, is characterized in that, described ccd image sensor (5) be positioned at film material directly over.
3. vacuum type pulse laser etching device as claimed in claim 1, is characterized in that, described laser instrument (2) wave-length coverage is 190nm-1100nm, and pulsewidth scope is 1ps-200ns, and frequency range is 10KHz-100MHz.
4. vacuum type pulse laser etching device as claimed in claim 1, is characterized in that, described vavuum pump is composite molecular pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320893352.5U CN203636207U (en) | 2013-12-25 | 2013-12-25 | Vacuum pulse laser etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320893352.5U CN203636207U (en) | 2013-12-25 | 2013-12-25 | Vacuum pulse laser etching device |
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| Publication Number | Publication Date |
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| CN203636207U true CN203636207U (en) | 2014-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201320893352.5U Expired - Lifetime CN203636207U (en) | 2013-12-25 | 2013-12-25 | Vacuum pulse laser etching device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104237997A (en) * | 2014-09-22 | 2014-12-24 | 苏州德龙激光股份有限公司 | Device and method for carrying out laser machining on light guide board inside glass |
| CN105269147A (en) * | 2015-10-15 | 2016-01-27 | 哈尔滨工业大学 | Three-dimensional vacuum laser machining device and method for carrying out laser machining through device |
| CN106735963A (en) * | 2017-01-09 | 2017-05-31 | 西安电子科技大学 | A kind of machining beams space propagation pointing accuracy detection means |
| CN106903438A (en) * | 2015-12-22 | 2017-06-30 | 武汉奇致激光技术股份有限公司 | The light path design control system and control method of laser etching machine |
| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
-
2013
- 2013-12-25 CN CN201320893352.5U patent/CN203636207U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104237997A (en) * | 2014-09-22 | 2014-12-24 | 苏州德龙激光股份有限公司 | Device and method for carrying out laser machining on light guide board inside glass |
| CN105269147A (en) * | 2015-10-15 | 2016-01-27 | 哈尔滨工业大学 | Three-dimensional vacuum laser machining device and method for carrying out laser machining through device |
| CN105269147B (en) * | 2015-10-15 | 2017-03-22 | 哈尔滨工业大学 | Three-dimensional vacuum laser machining device and method for carrying out laser machining through device |
| CN106903438A (en) * | 2015-12-22 | 2017-06-30 | 武汉奇致激光技术股份有限公司 | The light path design control system and control method of laser etching machine |
| CN106735963A (en) * | 2017-01-09 | 2017-05-31 | 西安电子科技大学 | A kind of machining beams space propagation pointing accuracy detection means |
| CN106735963B (en) * | 2017-01-09 | 2018-08-21 | 西安电子科技大学 | A kind of machining beams space propagation pointing accuracy detection device |
| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140611 |
|
| CX01 | Expiry of patent term | ||
| DD01 | Delivery of document by public notice |
Addressee: SUZHOU LUMI LASER TECHNOLOGY CO.,LTD. Person in charge of patents Document name: Notice of Termination of Patent Rights |
|
| DD01 | Delivery of document by public notice |