CN102416528A - Device and method for etching copper conducting film on glass substrate ink by using pulse laser - Google Patents
Device and method for etching copper conducting film on glass substrate ink by using pulse laser Download PDFInfo
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- CN102416528A CN102416528A CN2011104502874A CN201110450287A CN102416528A CN 102416528 A CN102416528 A CN 102416528A CN 2011104502874 A CN2011104502874 A CN 2011104502874A CN 201110450287 A CN201110450287 A CN 201110450287A CN 102416528 A CN102416528 A CN 102416528A
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Abstract
The invention relates to a device and a method for etching a copper conducting film on glass substrate ink by using pulse laser. An optical gate and a beam expander are arranged at the output end of a high-frequency pulse laser in turn; a 1/2 wave plate and a Glan prism are arranged at the output end of the beam expander in turn; a high-reflectivity lens is arranged at the output end of the Glan prism; a total reflection mirror is arranged at the output end of the high-reflectivity lens; a vibrating mirror field lens system is arranged at the output end of the total reflection mirror; the output end of the vibrating mirror field lens system is opposite to a four-axis high-accuracy platform; a charge coupled device (CCD) contrapuntal observation system is arranged above the four-axis high-accuracy platform; a plasma air blowing system is arranged on one side of the four-axis high-accuracy platform, and a dust collection system is arranged on the other side of the four-axis high-accuracy platform; a real-time power monitoring probe is also arranged at the output end of the high-reflectivity lens and is connected with the vibrating mirror field lens system through a communication system and a control system; and the high-frequency pulse laser is used for etching lines of a copper conducting film layer in an invisible area of a black ink substrate on glass.
Description
Technical field
The present invention relates to the devices and methods therefor of copper conducting film on a kind of pulse laser etching glass substrate printing ink, belong to the laser micro-machining technology field.
Background technology
Capacitive touch screen generally is made up of cover-plate glass, reach the standard grade the conduction sensor film and the conduction sensor film that rolls off the production line etc.Wherein mainly acting as of cover-plate glass protected following capacitive sensing rete, and simultaneously at cover-plate glass dorsal edge process black printing ink, the effect of the printing ink around this mainly contains following 3 effects, and first plays beauty function; Second plays the purpose of the edge circuit that covers the invisible range territory; The 3rd can make things convenient for print product sign figures symbol.The substrate of general conduction sensor film has two kinds in PET and glass.Wherein, though the PET sensor film is thinner, light transmittance is relatively poor, causes the screen display poor effect; And glass sensor film substrate light transmittance is high, and sense of touch is better, and adopting the glass sensor film is touch-screen manufacturer overall development trend.But because single glass-based version thickness is bigger, stack up, be unfavorable for that touch-screen develops to light, thin direction so two-layer sensor film is added cover-plate glass thickness.Touch-screen manufacturer adopts cover-plate glass and last induction conductive film layer is integrated now, saves a sensor film glass, has saved consumables costs such as an applying processing procedure operation and OCA glue, improves the whole yield of technology.Though after having adopted new processing procedure, the operation of processing that makes reduces with cost and reduces, and has increased the difficulty of affected technology, wherein is embodied in: how the circuit in making invisible range territory becomes and originally processes key factor on printing ink.
Traditional copper conductive film layer circuit manufacturing method of reaching the standard grade mainly contains two kinds of processes such as wet chemical etching and gold-tinted etching.Wherein in the process of wet chemical etching conductive rete; It is long that operation is designed into the completion etch period; Need input tool and consumables cost higher, require simultaneously to produce and drop into more manpower on the line, floor space is bigger; Waste liquid environmental pollutions such as wastewater and waste acid are comparatively serious, and the whole process flow energy waste is more serious.And the gold-tinted etching technics needs early investment bigger; With high costs, comparatively narrow for material chosen property, need to cooperate different photoresists; Be not suitable for the preparation method of all conductive film layers on the market; It is bigger to add the regular maintenance expense, and consumptive material and human cost are brought the increase of whole production cost, and the application restriction is comparatively serious.Simultaneously, the two high-temperature such as all need toast and handle, and has problems such as harmomegathus for black ink on glass, and this also is the technological difficulties that this technology is proceeded down.
On the laser ablation substrate of glass on the printing ink copper conductive film layer technology be to utilize pulse laser laser beam to be focused to 10 microns to 90 microns hot spot through optical focusing system; Hot spot after the focusing; Reach the removal energy threshold of material, through the accurate scanning fast of high-velocity scanning galvanometer system, thereby the circuit of realizing copper conductive film layer on the touch-screen is made purpose; The invisible range territory that makes like this is narrower, and practicality is stronger.Simultaneously; The optical maser wavelength that adopts is higher to the conductive film layer absorptivity; But it is higher to face mask layer reflectivity under the conductive film layer; So can not injure the black ink below the conductive film layer in the etching process, we just can avoid can seeing institute's etching invisible range territory circuit composing from the cover-plate glass front like this.
Summary of the invention
The devices and methods therefor that the purpose of this invention is to provide copper conducting film on a kind of pulse laser etching glass substrate printing ink, be intended to overcome traditional gold-tinted expose to the sun have that system complex, working (machining) efficiency are low in the processing such as photograph, soda acid wet quarters, big, the easy generation consumptive material of occupation of land face man, deficiency such as yield is low and selectivity is not strong.
The object of the invention is realized through following technical scheme:
The device of copper conducting film on the pulse laser etching glass substrate printing ink, characteristics are: the output of high-frequency pulse laser instrument is furnished with optical gate, and the output of optical gate is provided with beam expanding lens; The output of beam expanding lens is furnished with 1/2 wave plate; The output of 1/2 wave plate is furnished with Glan prism, and the output of Glan prism is furnished with the high reflectance eyeglass, and the output of high reflectance eyeglass is furnished with completely reflecting mirror; The output of completely reflecting mirror is furnished with galvanometer field mirror system; The output of galvanometer field mirror system is right against four high accuracy platforms, and the top of said four high accuracy platforms is furnished with CCD contraposition observing system, and a side of said four high accuracy platforms is furnished with the plasma scavenger system; The opposite side of four high accuracy platforms is equipped with dust-precipitating system; The output of high reflectance eyeglass also is furnished with the real-time monitoring probe of power, and monitoring probe links to each other with the control system through communication system, and galvanometer field mirror system links to each other with the control system through communication system.
Further, the device of copper conducting film on the above-mentioned pulse laser etching glass substrate printing ink, said high-frequency pulse laser instrument are that wavelength is that 196nm～1064nm, pulsewidth are at 10ps～200ns, the repetition rate pulse laser more than 50KHz.
Apparatus of the present invention realize the method for copper conducting film on the pulse laser etching glass substrate printing ink; Laser spot focuses on the upper surface that is positioned at rapidoprint before the processing; The laser that the high-frequency pulse laser instrument sends is by optical gate gauge tap light; Through beam expanding lens light beam is carried out coaxial expansion bundle behind the optical gate control laser beam, improve the angle of divergence of beam propagation, make beam path alignment; Light beam gets into 1/2 wave plate Glan prism behind the beam expanding lens beam-expanding collimation; Laser through Glan prism gets into galvanometer field mirror system successively behind high reflectance eyeglass and total reflection eyeglass adjustment route; Laser is at the real-time monitoring probe of refract light ingoing power behind the high reflectance eyeglass simultaneously; The variable power of the real-time monitoring probe monitoring of power refract light; The real-time monitoring probe of power is transferred to the control system through communication system with result of detection, when laser power fluctuation surpasses amplitude so that when influence processing effect, it stops the control of control system processing; Light beam carries out data communication through communication system and control system after arriving galvanometer field mirror system, and scanning patter is converted into data signal, and figure is transformed to be needed on the rapidoprint of etching, and rapidoprint passes through vacuum suction on four high accuracy platforms; The control system takes and grasps through the location target that CCD contraposition observing system will import, control processing according to the identification and the importing of manuscript; The dust that etching produces produces air-flow by the plasma scavenger system, collects dust by dust-precipitating system.
Substantive distinguishing features and obvious improvement that technical scheme of the present invention is outstanding are mainly reflected in:
The present invention is through using high-frequency pulse laser as lasing light emitter; Copper conducting film and ITO in the touch-screen product are carried out laser-induced thermal etching; Make copper conducting film and ito thin film material reach the purpose that erosion removes in the effect gasified of high-frequency pulsed light device; Adopt the reflecting material of the optical maser wavelength of selecting for use to come laser total reflection is damaged with the protection black ink as protective layer on the printing ink; The etching of accomplishing copper conducting film and ito thin film material through the mobile splicing and the etching of small breadth galvanometer of high accuracy platform; The dust that produces processes touch-screen electronic product pollution-free, that linearity is stable, function is intact through scavenger system and big flow laying dust system control of dust.
Description of drawings
Below in conjunction with accompanying drawing technical scheme of the present invention is described further:
Fig. 1: light path system sketch map of the present invention.
The specific embodiment
The present invention uses laser-induced thermal etching electronic product copper conducting film and ito thin film material, adopts high-frequency pulse laser, and material processed is the copper film and the ITO material of high conductivity, and laser focuses on copper film and the ito thin film material, thereby reaches etch effect.
The rapidoprint rete is respectively substrate of glass, black ink, total reflection medium film, ITO and copper conducting film from the bottom up.When the upper surface of high-frequency pulse laser focusing, when device carries out etching, after reaching the removal energy threshold of material in copper film; Copper film and ito thin film material reach the purpose that erosion removes in the effect gasified of high-frequency pulse laser, when copper film and ITO be etched complete after, high-frequency pulsed laser action is when the total reflection medium film of this optical maser wavelength; According to the total reflection medium film characteristic; Laser is by total reflection, and like this, black ink is avoided damage below the protection reflectance coating.
As shown in Figure 1, the device of copper conducting film on the pulse laser etching glass substrate printing ink, high-frequency pulse laser instrument 1 are that wavelength is that 196nm～1064nm, pulsewidth are at 10ps～200ns, the repetition rate pulse laser more than 50KHz; The output of high-frequency pulse laser instrument 1 is furnished with optical gate 2; The output of optical gate 2 is provided with beam expanding lens 3, and the output that the output of beam expanding lens 3 is furnished with 1/2 wave plate, 4,1/2 wave plates 4 is furnished with Glan prism 5; The output of Glan prism 5 is furnished with high reflectance eyeglass 6; The output of high reflectance eyeglass 6 is furnished with completely reflecting mirror 10, and the output of completely reflecting mirror 10 is furnished with galvanometer field mirror system 8, and the output of galvanometer field mirror system 8 is right against four high accuracy platforms 14; The top of said four high accuracy platforms 14 is furnished with CCD contraposition observing system 11; The opposite side that one side of said four high accuracy platforms 14 is furnished with 12, four high accuracy platforms 14 of plasma scavenger system is equipped with dust-precipitating system 13, and the output of high reflectance eyeglass 6 also is furnished with the real-time monitoring probe 7 of power; Monitoring probe 7 links to each other with control system 17 through communication system 16, and galvanometer field mirror system 8 links to each other with control system 17 through communication system 16.
When said apparatus is used on the etching glass substrate printing ink copper conducting film; Laser spot focuses on the upper surface that is positioned at rapidoprint before the processing; The laser that high-frequency pulse laser instrument 1 sends is by optical gate 2 gauge tap light; Carry out coaxial expansion bundle through 3 pairs of light beams of beam expanding lens behind the optical gate 2 control laser beams, improve the angle of divergence of beam propagation on the one hand, reach the purpose of beam path alignment; In addition on the one hand, laser beams coaxial is expanded bundle, make that focusing back hot spot is littler, thereby realize the purpose of laser stabilization etching; Light beam gets into 1/2 wave plate 4 and Glan prism 5 behind beam expanding lens 3 beam-expanding collimations; Can realize that the certain limit laser power is adjustable; Thereby technology had very high guiding significance; Laser through Glan prism 5 gets into galvanometer field mirror system 8 successively after high reflectance eyeglass 6 and total reflection eyeglass 10 are adjusted routes, laser is at the real-time monitoring probe 7 of the refract light ingoing power that certain minor proportions is arranged behind high reflectance eyeglass 6 simultaneously, and the real-time monitoring probe 7 of power is monitored the variable power of refract lights; The variable power that can reflect laser in the whole system; The real-time monitoring probe 7 of power is transferred to control system 17 through communication system 16 with result of detection, when laser power fluctuation surpasses amplitude so that when influence processing effect, it stops 17 controls of control system processing; After light beam arrives galvanometer field mirror system 8; Carry out data communication through communication system 16 with control system 17; Scanning patter is converted into data signal, figure is transformed on the rapidoprint that needs etching 15, rapidoprint 15 passes through vacuum suction on four high accuracy platforms 14; Control system 17 takes and grasps through the location target that CCD contraposition observing system 11 will import, control processing according to the identification and the importing of manuscript; The dust that etching produces produces air-flow by plasma scavenger system 12, collects dust by dust-precipitating system 13.Plasma scavenger system 12 is started working with dust-precipitating system 13 simultaneously, makes process stable.In process,, stable to guarantee processing effect through coaxial CCD observing system 9 and monitor 18 real-time monitored processing situation coaxial with galvanometer.When galvanometer field mirror system 8 behind the good current graphic element of etching, platform moves next unit, high-frequency pulse laser begin again processing, so repeatedly, finally realize the etching of whole machining process breadth.Use the invisible range territory copper conductive film layer circuit etching of high-frequency pulse laser, thereby realize that circuit is made on the high-precision touch-screen of high efficiency black ink substrate on glass.
At process black printing ink on glass the invisible range territory is covered, on printing ink, from bottom to top distinguish total reflection medium film, ITO conducting film, the copper conducting film of optical maser wavelength that sputter is adopted simultaneously.Like this; At the high-frequency pulse laser instrument to conductive film layer (copper film; ITO) add man-hour; When after high-frequency pulse laser is accomplished the conductive film layer etching, being delivered to the total reflection medium film surface of the optical maser wavelength that adopts, by total reflection medium film high-frequency pulse laser is all reflected, one deck black ink sustains damage under the protection total reflection medium film.When another side is observed, circuit is covered by black ink on the conductive film layer, has reached technological requirement like this.
Simultaneously, the mode that can take to strengthen ink printing thickness realizes this technology, the printing ink of promptly thickening in printing on glass, and then print ITO and copper film on the printing ink.Like this, (copper film ITO) adds man-hour to conductive film layer at the high-frequency pulse laser instrument; When after high-frequency pulse laser is accomplished the conductive film layer etching, being delivered on the black ink; Certain thickness printing ink is sustained damage, do the time spent downwards when laser, laser facula is away from focus; The power density of laser declines to a great extent, and is difficult to remove again the printing ink of lower floor.Like this, though removed certain thickness printing ink, lower floor's printing ink is not removed, and when when another side is observed, circuit is still covered by black ink on the conductive film layer, reaches technological requirement.
Utilize the light path focusing system of specially treated, use high-frequency pulse laser, circuit on the conductive film layer is carried out etching, to obtain thin more stable live width.
Behind the high-frequency pulse laser process beam expanding lens collimator and extender, import galvanometer system, after psychological field mirror far away focuses on, make focal beam spot in the 10um-100um scope, realize that graphic element of the disposable processing of single galvanometer is with interior high accuracy, high-velocity scanning.
Copper conductive film layer material is placed on the higher absorption platform of flatness precision on the touch-screen of substrate of glass, places the absorption of product final vacuum and opens, and guarantees that product is not shifted in process.
Carry out the CCD location: contain CCD and grab the target function automatically; Only need set up template for the first time; The figure that imports sample target position in bitmap layer target position and the platform coordinate is provided with one by one is corresponding, and follow-up same batch products is directly grabbed target automatically can accomplish the location.
Laser carries out etching according to design configuration, blows and dust-precipitating system etched opening simultaneously, guarantees that the dust that etching produces all sucks in the dust-precipitating system, to improve the process repeatability and the stability of high-frequency pulse laser etching conductive film layer.
After galvanometer processed current graphic element, platform moved next unit, and high-frequency impulse laser begins processing again, so repeatedly, finally realizes the etching of whole machining process breadth.
Kinematic system is the four axes motion mode; Use monitoring of grating chi and feedback position information; Can reach high-precision location operation operation; Monitor the real-time laser power monitoring stable case of probe in real time through power, through observing processing effect, to obtain the stable machining effect with the coaxial CCD of galvanometer.
What need understand is: the above only is a preferred implementation of the present invention; For those skilled in the art; Under the prerequisite that does not break away from the principle of the invention, can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (3)
1. the device of copper conducting film on the pulse laser etching glass substrate printing ink; It is characterized in that: the output of high-frequency pulse laser instrument (1) is furnished with optical gate (2); The output of optical gate (2) is provided with beam expanding lens (3); The output of beam expanding lens (3) is furnished with 1/2 wave plate (4); The output of 1/2 wave plate (4) is furnished with Glan prism (5), and the output of Glan prism (5) is furnished with high reflectance eyeglass (6), and the output of high reflectance eyeglass (6) is furnished with completely reflecting mirror (10); The output of completely reflecting mirror (10) is furnished with galvanometer field mirror system (8); The output of galvanometer field mirror system (8) is right against four high accuracy platforms (14), and the top of said four high accuracy platforms (14) is furnished with CCD contraposition observing system (11), and a side of said four high accuracy platforms (14) is furnished with plasma scavenger system (12); The opposite side of four high accuracy platforms (14) is equipped with dust-precipitating system (13); The output of high reflectance eyeglass (6) also is furnished with the real-time monitoring probe of power (7), and monitoring probe (7) links to each other with control system (17) through communication system (16), and galvanometer field mirror system (8) links to each other with control system (17) through communication system (16).
2. the device of copper conducting film on the pulse laser etching glass substrate printing ink according to claim 1 is characterized in that: said high-frequency pulse laser instrument (1) is that wavelength is that 196nm～1064nm, pulsewidth are at 10ps～200ns, the repetition rate pulse laser more than 50KHz.
3. utilize the said device of claim 1 to realize the method for copper conducting film on the pulse laser etching glass substrate printing ink; It is characterized in that: laser spot focuses on the upper surface that is positioned at rapidoprint before the processing; The laser that high-frequency pulse laser instrument (1) sends is by optical gate (2) gauge tap light; Through beam expanding lens (3) light beam is carried out coaxial expansion bundle behind optical gate (2) the control laser beam, improve the angle of divergence of beam propagation, make beam path alignment; Light beam gets into 1/2 wave plate (4) and Glan prism (5) behind beam expanding lens (3) beam-expanding collimation; Laser through Glan prism (5) gets into galvanometer field mirror system (8) successively behind high reflectance eyeglass (6) and total reflection eyeglass (10) adjustment route; Laser is at the real-time monitoring probe of refract light ingoing power (7) behind high reflectance eyeglass (6) simultaneously; The variable power of the real-time monitoring probe of power (7) monitoring refract light; The real-time monitoring probe of power (7) is transferred to control system (17) through communication system (16) with result of detection; When laser power fluctuation surpasses amplitude so that when influence processing effect, control system (17) controls it and stops to process; After light beam arrives galvanometer field mirror system (8); Carry out data communication through communication system (16) with control system (17); Scanning patter is converted into data signal; The figure conversion is being needed on the rapidoprint of etching (15), and rapidoprint (15) passes through vacuum suction on four high accuracy platforms (14); Control system (17) takes and grasps through the location target that CCD contraposition observing system (11) will import, control processing according to the identification and the importing of manuscript; The dust that etching produces produces air-flow by plasma scavenger system (12), collects dust by dust-precipitating system (13).
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| CN2011104502874A CN102416528A (en) | 2011-12-29 | 2011-12-29 | Device and method for etching copper conducting film on glass substrate ink by using pulse laser |
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| CN2011104502874A CN102416528A (en) | 2011-12-29 | 2011-12-29 | Device and method for etching copper conducting film on glass substrate ink by using pulse laser |
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| CN102416528A true CN102416528A (en) | 2012-04-18 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102632335A (en) * | 2012-04-25 | 2012-08-15 | 肖和平 | Laser processing method of surface layer high-reflectivity material |
| CN102717193A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for manufacturing silicon solar cell electrode printing screen through laser |
| CN102717190A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for pulse laser etching of conducting film on organic glass |
| CN102773610A (en) * | 2012-06-07 | 2012-11-14 | 江阴德力激光设备有限公司 | Device and method for labeling ultraviolet laser in transparent material |
| CN103056527A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for laser etching of conducting film layers on touch on lens (TOL) and one glass solution (OGS) touch components |
| CN103586586A (en) * | 2013-10-22 | 2014-02-19 | 苏州镭明激光科技有限公司 | Pulse laser etching device used for transparent electroconductive thin film and control method of pulse laser etching device |
| CN104216577A (en) * | 2013-05-29 | 2014-12-17 | 比亚迪股份有限公司 | Method for manufacturing capacitive screen |
| CN106782770A (en) * | 2016-11-29 | 2017-05-31 | 东莞理工学院 | A kind of laser-induced thermal etching OGS touch screen conductive film |
| CN106925899A (en) * | 2015-12-31 | 2017-07-07 | 辰炜电子股份有限公司 | Laser cutting apparatus and its method |
| CN107414308A (en) * | 2016-05-23 | 2017-12-01 | 蓝思科技（长沙）有限公司 | A kind of method that form processing is carried out using laser |
| CN117697166A (en) * | 2024-02-06 | 2024-03-15 | 中国工程物理研究院激光聚变研究中心 | Method for etching organic film on surface of metal film by utilizing laser |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102632335A (en) * | 2012-04-25 | 2012-08-15 | 肖和平 | Laser processing method of surface layer high-reflectivity material |
| CN102717193A (en) * | 2012-06-07 | 2012-10-10 | 江阴德力激光设备有限公司 | Device and method for manufacturing silicon solar cell electrode printing screen through laser |
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| CN103056527A (en) * | 2012-12-28 | 2013-04-24 | 苏州德龙激光股份有限公司 | Device and method for laser etching of conducting film layers on touch on lens (TOL) and one glass solution (OGS) touch components |
| CN104216577A (en) * | 2013-05-29 | 2014-12-17 | 比亚迪股份有限公司 | Method for manufacturing capacitive screen |
| CN103586586A (en) * | 2013-10-22 | 2014-02-19 | 苏州镭明激光科技有限公司 | Pulse laser etching device used for transparent electroconductive thin film and control method of pulse laser etching device |
| CN106925899A (en) * | 2015-12-31 | 2017-07-07 | 辰炜电子股份有限公司 | Laser cutting apparatus and its method |
| CN107414308A (en) * | 2016-05-23 | 2017-12-01 | 蓝思科技（长沙）有限公司 | A kind of method that form processing is carried out using laser |
| CN107414308B (en) * | 2016-05-23 | 2019-04-09 | 蓝思科技（长沙）有限公司 | A method of form processing is carried out using laser |
| CN106782770A (en) * | 2016-11-29 | 2017-05-31 | 东莞理工学院 | A kind of laser-induced thermal etching OGS touch screen conductive film |
| CN117697166A (en) * | 2024-02-06 | 2024-03-15 | 中国工程物理研究院激光聚变研究中心 | Method for etching organic film on surface of metal film by utilizing laser |
| CN117697166B (en) * | 2024-02-06 | 2024-04-19 | 中国工程物理研究院激光聚变研究中心 | Method for etching organic film on surface of metal film by utilizing laser |
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Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant before: Suzhou Delphi Laser Co., Ltd. |
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Application publication date: 20120418 |