CN102101217A - Laser cutting device - Google Patents
Laser cutting device Download PDFInfo
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- CN102101217A CN102101217A CN2011100481154A CN201110048115A CN102101217A CN 102101217 A CN102101217 A CN 102101217A CN 2011100481154 A CN2011100481154 A CN 2011100481154A CN 201110048115 A CN201110048115 A CN 201110048115A CN 102101217 A CN102101217 A CN 102101217A
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Abstract
The invention provides a laser cutting device. The laser cutting device comprises a laser, an optical transmission system, and a vibrating mirror scanning focusing system and is characterized by also comprising a polarization transformation system positioned between the laser and the optical transmission system along the optical path propagation direction; the polarization transformation system comprises a reflector which has a 45-degree included angle with an incident light beam, and a polarization transformation mirror which is parallel and opposite to the reflector; and a light beam emitted by the laser is transformed at a 45-degree angle twice through the reflector and the polarization transformation mirror of the polarization transformation system, is subjected to polarization transformation by the polarization transformation mirror and is reflected by the optical transmission system, and enters the vibrating mirror scanning focusing system to be cut by using small focused light spots. Compared with the prior art, the device has the advantages that: by the polarization transformation system, influence of linearly polarized laser on cut line consistency of a polyester (PET) material is eliminated, and the high-accuracy and high-quality cutting effect is achieved.
Description
[technical field]
The present invention relates to a kind of laser cutting machine, especially relate to the cutting method of PET material.
[background technology]
The chemical formula of PETG is the COC6H4COOCH2CH2O English name: polyethylene terephthalate, be called for short PET.PET has the good mechanical performance is arranged, and impact strength is 3-5 a times of other films, and folding resistance is good, anti-most of solvents, good high-and low-temperature resistance performance; Gas and vapor permeability are low, existing good choke, water, oil and peculiar smell performance; Transparency height, but shielding of ultraviolet, glossiness is good; Nontoxic, tasteless, security is good.PET-ITO is meant the employing magnetron sputtering technique, sputter transparent indium tin oxide (ITO) conductive film coating and the high-tech product that obtains through The high temperature anneal on the PET base material.The thickness difference of ITO rete, the electric conductivity of film is also different with light transmission.
PET-ITO is mainly used in the touch-screen of following two fields (1) field of mobile communication, as mobile phone, computer touch screen.(2) be used for the electric conductivity requirement than higher field, as: the field such as electrode material, thin film switch that is used for transparency electrode, the electrochromic device of thin-film solar cells.In view of the application in above two big fields, PET will be more and more widely as the application of base material.For PET base material cutting method mechanical means and laser means are arranged now.The stress that the method for machine cuts produces can allow the cut edge of product form burr, influences the yield of product.
Adopt the method for laser cutting, because that the intrinsic polarization state of laser itself that laser instrument sends influences the product cutting slit width is inconsistent.This is because the layers of material of this material to be processed all belongs to organic macromolecular material, and the Laser Processing of macromolecular material is all very sensitive to any variation of width of slit or cross section generation.And the quality of joint-cutting depends on the light polarization direction with respect to cut direction.The light ratio that is the s polarization with respect to the macromolecular material cut surface is that the light of p polarization is more difficult to be absorbed by this surface, has caused the difference of cut quality in different cut direction.
[summary of the invention]
The present invention is in order to solve the inconsistent problem of cutting slit width, increased the reflection type polarization transformational structure at light channel structure, convert linearly polarized light to circularly polarized light, this is because circularly polarized light all is made up of the s polarization and the p polarization of equivalent on any beam direction, therefore at all polarizations that axially all can have identical composition, regardless of cut direction, all will remove material in uniform mode.This polarization structure is also because of satisfying two conditions: light beam polarization direction and incidence angle at 45 with plane of incidence is 45 °. laser is through the electric vector that equates in x, y direction of the circularly polarized light of the processing formation of RPR structure.
Specifically provide a kind of laser cutting device, it comprises: laser instrument, optical transmission system, vibration mirror scanning focusing system; It is characterized in that: this laser cutting device also comprises along the polarization conversion system of the light path direction of propagation between laser instrument and optical transmission system, and this polarization conversion system comprises with an incident light and becomes the reflective mirrors of 45 degree and the polarization conversion mirror parallel and relative with this reflective mirror; The light beam that described laser instrument penetrates is earlier through the reflective mirror of polarization conversion system and the direction conversion of twice 45 degree of polarization conversion mirror with through polarization conversion mirror polarisation transformation, enter the laser galvanometer scanning focusing system by the optical transmission system reflection again, utilize the small light spot after focusing on to cut.
Wherein, described laser instrument is the laser instrument of infrared band.
Wherein, described laser wavelength is:: 9.3um, 9.4um or 10.6um.
Wherein, described optical transmission system comprises: first speculum, beam expanding lens and second speculum.
Wherein, described vibration mirror scanning focusing system comprises galvanometer module and f-theta scanning mirror.
Wherein, the scanning lens of described f-theta scanning mirror is the scanning lens of the heart far away.
Wherein, also comprise fixing to be cut of two navigation systems, it is respectively CCD navigation system and vacuum absorbing platform system.
Wherein, described vacuum absorbing platform system configuration has dust exhaust apparatus.
Wherein, the diameter of the small light spot after the described focusing is less than 120um.
Wherein, described to be cut is the PET material.
Laser cutting device provided by the invention forms circularly polarized light by polarization conversion system, has guaranteed to stitch wide uniformity, perfect processing effect; Low-loss optic path system improves the utilization rate of laser; The vibration mirror scanning focusing system that runs up has improved the speed of cutting; High-precision galvanometer scanning system, CCD navigation system have guaranteed the high accuracy of workpiece size; Dispose dust exhaust apparatus in the vacuum absorbing platform system, the dust exhaust apparatus of being joined has been taken away the dust that produces, thereby has avoided dust to the pollution of environment and the injury that human body is produced.
[description of drawings]
The invention will be further described in conjunction with embodiment with reference to the accompanying drawings.
Fig. 1 is the structural representation of embodiment of the invention laser cutting device;
Fig. 2 is the work schematic diagram of the polarization conversion system of embodiment of the invention PET laser cutting machine;
Fig. 3 is the workflow schematic diagram of embodiment of the invention laser cutting device.
[specific embodiment]
The present invention is in order to solve the inconsistent problem of cutting slit width, increased the reflection type polarization transformational structure at light channel structure, convert linearly polarized light to circularly polarized light, this is because circularly polarized light all is made up of the s polarization and the p polarization of equivalent on any beam direction, therefore at all polarizations that axially all can have identical composition, regardless of cut direction, all will remove material in uniform mode.This polarization structure is also because of satisfying two conditions: light beam polarization direction and incidence angle at 45 with plane of incidence is 45 °. laser is through the electric vector that equates in x, y direction of the circularly polarized light of the processing formation of RPR structure.The present invention is further described below in conjunction with description of drawings and the specific embodiment.
As shown in Figure 1, it is for the structural representation of laser cutting machine of the present invention, this laser cutting device 100 comprises laser instrument 10, optical transmission system 30, vibration mirror scanning focusing system 40, this laser cutting device also comprises along the polarization conversion system 20 of the light path direction of propagation between laser instrument 10 and optical transmission system 30, and this polarization conversion system 20 comprises that one becomes the reflective mirrors 201 and the polarization conversion mirror 202 parallel and relative with this reflective mirror 201 of 45 degree with incident light a; The light beam that described laser instrument 10 penetrates is earlier through the reflective mirror 201 of polarization conversion system 20 and the 202 twice 45 degree directions conversions of polarization conversion mirror with through polarization conversion mirror 202 polarisation transformations, enter laser galvanometer scanning focusing system 40 by optical transmission system 30 reflections again, utilize the small light spot after focusing on to cut.
Laser beam is in polarization conversion system 20, incident light a is at first to the reflective mirror 201 of polarization conversion system 20, then through reflexing to polarization conversion mirror 202, at this moment 202 pairs of linearly polarized lights of polarization conversion mirror carry out polarization conversion, laser is converted to circularly polarized light by original first polarised light, because polarization conversion mirror 202 has 45 degree reflexs, reflexes to optics conducting system 30 when making the light beam polarization conversion.Emergent light b and incident a light cocurrent and parallel through polarization conversion system 20.
In the present embodiment, described polarization conversion system 20 is reflective polarizer.This is because laser power provided by the invention is bigger, needs the damage threshold height, the polarizer that the life-span is longer; And reflective polarizer helps the design of light channel structure, and with respect to the transmission-type polarizer, the laser of residual reflection is to the injury of human body after the transmission that can avoid existing.
In the present embodiment, laser instrument 10 is laser instruments of infrared band.
In the present embodiment, laser instrument 10 emitted optical maser wavelengths are preferably: 9.3um, 9.4um or 10.6um, particularly preferred wavelength are 10.6um.
In the present embodiment, described optical transmission system 30 comprises first speculum 301, beam expanding lens 302 and second speculum 303.
In the present embodiment, described vibration mirror scanning focusing system 40 comprises galvanometer module 401 and f-theta scanning mirror 402.Further, the scanning lens of f-theta scanning mirror 402 is the scanning lens of the heart far away.This camera lens can be the chief ray of image space perpendicular to cut surface, and it is enough big to have avoided focusing on the tapering that cuts generation, has guaranteed that cutting section is vertical, smooth, guarantees cutting accuracy.
Laser cutting device also comprises fixing to be cut of two navigation systems, and it is respectively CCD navigation system 50 and vacuum absorbing platform system 60, to guarantee the high accuracy of workpiece size.Further, dispose dust exhaust apparatus in the vacuum absorbing platform system 60, the dust exhaust apparatus of being joined has been taken away the dust that produces, thereby has avoided dust to the pollution of environment and the injury that human body is produced.
The described Optical Maser System 10 of the embodiment of the invention comprises laser oscillator, Laser Power Devices, cooling-water machine (figure does not show).
As shown in Figure 3, it is for the workflow schematic diagram of PET laser cutting machine of the present invention.The embodiment of the invention comprises a process operation software 70, laser instrument 10 emission laser in the present embodiment, the laser instrument 10 output energy and the setting of cutting pattern, the setting of procedure, vibration mirror scanning focusing system 40, the location of CCD navigation system 50 and vacuum absorbing platform system 60 pairs of processing model and absorption are controlled by process operation software 70 unified coordinations.
In the present embodiment, the concrete coordination control procedure of process operation software 70 is as follows: (1) at first is provided with 71 to carrying out procedure documenting 72 and machined parameters; (2) import then on the process operation software 70 and compile.Process operation software 70 is coordinated control CCD navigation system 50, Optical Maser System 10 and vibration mirror scanning focusing system 40.Process operation software 70 has at first been controlled CCD navigation system 50 and has been carried out the target location, reads sample processing two-dimensional position coordinate.Process operation software 70 makes its emission laser by the laser parameter input Optical Maser System 10 that has set then, laser after the emission is converted to the laser of circular polarization state through polarization conversion system 20, and 30 collimation transmission enter vibration mirror scanning focusing system 40 and carry out the scanning focused of laser through the optic path system again.
Meanwhile, the position coordinates that process operation software 70 feeds back CCD navigation system 50 is defeated by vibration mirror scanning focusing system 40, and galvanometer scanning system 40 scans processing according to the machining coordinate that reads then, the precision when improving cutting.At last, the laser after utilization focuses on begins to process 80 to the sample of relevant position.
After the above-mentioned parameter setting finished, the process of present embodiment was as follows:
Optical Maser System 10 is launched a laser beam, at first is incident to the reflective mirror 201 of polarization conversion system 20, reflexes to 202 pairs of linearly polarized lights of polarization conversion mirror then and carries out polarization conversion, reflexes to optics conducting system 30 simultaneously.Emergent light b and incident a light cocurrent and parallel through polarization conversion system 20.
Above-mentioned laser behind polarization is through first speculum 301 of optics conducting system 30, and reflection enters beam expanding lens 302 again, and the laser beam that expands after restrainting enters galvanometer scanning system 40 through second speculum 303.
Laser beam is focused into a small light spot after through vibration mirror scanning focusing system 40, and that utilizes then that this small light spot treats cutting member 80 locates to carry out cutting processing.
In the present embodiment, the diameter of the small light spot after the focusing is less than 120um.
In cutting process, the described CCD navigation system 50 of the embodiment of the invention remains unchanged with the relative position of vibration mirror scanning focusing system 40; Described vacuum absorbing platform system 60 has guaranteed that by vacuum adsorption method the relative position of sample and laser cutting device 100 remains unchanged.
After machining, see that the cutting effect of model is further adjusted better parameter, till the model best results that processes.After optimal parameter is set and to be finished, just can reuse this parameter identical to be cut 80 is processed.
The Optical Maser System 10 of the described laser cutting device quality light beam of embodiment of the invention quality can reach the good cutting effect that gets; The polarization conversion system 20 that forms circularly polarized light has guaranteed to stitch wide uniformity, perfect processing effect; Low-loss optic path system 30 improves the utilization rate of laser; The vibration mirror scanning focusing system 40 that runs up has improved the speed of cutting; High-precision galvanometer scanning system 40, CCD navigation system 50 have guaranteed the high accuracy of workpiece size; Dispose dust exhaust apparatus in the vacuum absorbing platform system 60, the dust exhaust apparatus of being joined has been taken away the dust that produces, thereby has avoided dust to the pollution of environment and the injury that human body is produced.
In the present embodiment, described to be cut is the PET material, is to concern that according to certain thickness pressing forms by materials such as diaphragm, OCA, mould release membrance, PET FILM, and its thickness is less than or equal to 1mm.
The present invention's enforcement is not limited to the disclosed mode of above most preferred embodiment, and is all based on above-mentioned mentality of designing, simply deduces and replace, and the concrete laser cutting device that obtains all belongs to enforcement of the present invention.
Claims (10)
1. a laser cutting device comprises laser instrument, optical transmission system, vibration mirror scanning focusing system; It is characterized in that: this laser cutting device also comprises along the polarization conversion system of the light path direction of propagation between laser instrument and optical transmission system, and this polarization conversion system comprises with an incident light and becomes the reflective mirrors of 45 degree and the polarization conversion mirror parallel and relative with this reflective mirror; The light beam that described laser instrument penetrates is earlier through the reflective mirror of polarization conversion system and the direction conversion of twice 45 degree of polarization conversion mirror with through polarization conversion mirror polarisation transformation, enter the vibration mirror scanning focusing system by the optical transmission system reflection again, utilize the small light spot after focusing on to cut.
2. laser cutting device according to claim 1 is characterized in that: described laser instrument is the laser instrument of infrared band.
3. laser cutting device according to claim 1 is characterized in that: described laser wavelength is: 9.3um, 9.4um or 10.6um.
4. laser cutting device according to claim 1 is characterized in that: described optical transmission system comprises first speculum, beam expanding lens and second speculum.
5. laser cutting device according to claim 1 is characterized in that: described vibration mirror scanning focusing system comprises galvanometer module and f-theta scanning mirror.
6. laser cutting device according to claim 5 is characterized in that: the scanning lens of described f-theta scanning mirror is the scanning lens of the heart far away.
7. laser cutting device according to claim 1 is characterized in that: also comprise fixing to be cut of two navigation systems, it is respectively CCD navigation system and vacuum absorbing platform system.
8. laser cutting device according to claim 7 is characterized in that: described vacuum absorbing platform system configuration has dust exhaust apparatus.
9. laser cutting device according to claim 1 is characterized in that: the diameter of the small light spot after the described focusing is less than 120um.
10. laser cutting device according to claim 7 is characterized in that: described to be cut is the PET material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100481154A CN102101217A (en) | 2011-02-28 | 2011-02-28 | Laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100481154A CN102101217A (en) | 2011-02-28 | 2011-02-28 | Laser cutting device |
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| CN102101217A true CN102101217A (en) | 2011-06-22 |
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| CN2011100481154A Pending CN102101217A (en) | 2011-02-28 | 2011-02-28 | Laser cutting device |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102566012A (en) * | 2012-03-16 | 2012-07-11 | 南京波长光电科技有限公司 | Telecentric scanning lens |
| CN102689098A (en) * | 2012-06-27 | 2012-09-26 | 上海致凯捷激光科技有限公司 | Integral laser cutting head |
| CN102773612A (en) * | 2012-06-07 | 2012-11-14 | 江阴德力激光设备有限公司 | Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof |
| CN103592775A (en) * | 2013-11-15 | 2014-02-19 | 深圳市大族激光科技股份有限公司 | Optical isolation system and optical isolator |
| CN105215556A (en) * | 2015-09-25 | 2016-01-06 | 江苏秦拓微电子设备科技有限公司 | The new technology that laser cuts film is carried out to the various films that crystal column surface pastes |
| CN105234562A (en) * | 2015-10-13 | 2016-01-13 | 深圳英诺激光科技有限公司 | Automatic laser cutting and decarbonizing system and method for polyimide film (PI) cover film |
| CN105269730A (en) * | 2015-09-02 | 2016-01-27 | 成都莱普科技有限公司 | New technology for removing flash of semiconductor package body through lasers |
| CN105537780A (en) * | 2016-02-25 | 2016-05-04 | 成都亨通兆业精密机械有限公司 | Automatic laser cutting machine |
| CN105562925A (en) * | 2016-01-28 | 2016-05-11 | 广东正业科技股份有限公司 | CO2 laser cutting device and optical path transmission method thereof |
| CN106073893A (en) * | 2016-07-20 | 2016-11-09 | 合肥安博罗医疗器械有限公司 | A kind of CO2laser therapeutic apparatus |
| CN106493473A (en) * | 2015-09-06 | 2017-03-15 | 武汉吉事达激光设备有限公司 | A kind of glass and the process of PET laminated materials disposable laser cutting |
| CN107052579A (en) * | 2017-03-29 | 2017-08-18 | 苏州镭缘激光科技有限公司 | A kind of continuous timesharing laser soldering device |
| CN107309556A (en) * | 2016-04-14 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | A kind of laser hole drilling system and method |
| CN107398453A (en) * | 2016-05-19 | 2017-11-28 | 宁德新能源科技有限公司 | Pole piece cleaning device |
| CN108581189A (en) * | 2018-06-01 | 2018-09-28 | 业成科技（成都）有限公司 | Laser cutting method |
| CN108789886A (en) * | 2018-05-31 | 2018-11-13 | 中国科学院西安光学精密机械研究所 | A kind of cutting splitting method of transparent hard brittle material |
| CN109065469A (en) * | 2018-06-08 | 2018-12-21 | 成都莱普科技有限公司 | A kind of IC chip optics sampling observation machine of band laser cutting function |
| CN111872554A (en) * | 2020-07-14 | 2020-11-03 | 深圳市睿达科技有限公司 | Welding control method |
| CN112296524A (en) * | 2020-09-23 | 2021-02-02 | 燕山大学 | Workpiece microstructure processing method and diamond microstructure workpiece |
| CN114609774A (en) * | 2022-03-23 | 2022-06-10 | 北方民族大学 | Novel laser deflection scanning device and control method |
| CN114985912A (en) * | 2022-06-15 | 2022-09-02 | 苏州瀚光精密设备有限公司 | Cutting equipment of two light paths |
| WO2023130873A1 (en) * | 2022-01-04 | 2023-07-13 | 上海名古屋精密工具股份有限公司 | Laser processing method for superhard material, and apparatus and machine tool using same |
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Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102566012A (en) * | 2012-03-16 | 2012-07-11 | 南京波长光电科技有限公司 | Telecentric scanning lens |
| CN102773612A (en) * | 2012-06-07 | 2012-11-14 | 江阴德力激光设备有限公司 | Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof |
| CN102773612B (en) * | 2012-06-07 | 2015-06-10 | 江阴德力激光设备有限公司 | Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof |
| CN102689098A (en) * | 2012-06-27 | 2012-09-26 | 上海致凯捷激光科技有限公司 | Integral laser cutting head |
| CN102689098B (en) * | 2012-06-27 | 2015-01-14 | 上海致凯捷激光科技有限公司 | Integral laser cutting head |
| CN103592775B (en) * | 2013-11-15 | 2016-07-06 | 大族激光科技产业集团股份有限公司 | Optical isolator |
| CN103592775A (en) * | 2013-11-15 | 2014-02-19 | 深圳市大族激光科技股份有限公司 | Optical isolation system and optical isolator |
| CN105269730A (en) * | 2015-09-02 | 2016-01-27 | 成都莱普科技有限公司 | New technology for removing flash of semiconductor package body through lasers |
| CN106493473A (en) * | 2015-09-06 | 2017-03-15 | 武汉吉事达激光设备有限公司 | A kind of glass and the process of PET laminated materials disposable laser cutting |
| CN105215556A (en) * | 2015-09-25 | 2016-01-06 | 江苏秦拓微电子设备科技有限公司 | The new technology that laser cuts film is carried out to the various films that crystal column surface pastes |
| CN105234562A (en) * | 2015-10-13 | 2016-01-13 | 深圳英诺激光科技有限公司 | Automatic laser cutting and decarbonizing system and method for polyimide film (PI) cover film |
| CN105562925A (en) * | 2016-01-28 | 2016-05-11 | 广东正业科技股份有限公司 | CO2 laser cutting device and optical path transmission method thereof |
| CN105537780A (en) * | 2016-02-25 | 2016-05-04 | 成都亨通兆业精密机械有限公司 | Automatic laser cutting machine |
| CN107309556A (en) * | 2016-04-14 | 2017-11-03 | 大族激光科技产业集团股份有限公司 | A kind of laser hole drilling system and method |
| CN107398453A (en) * | 2016-05-19 | 2017-11-28 | 宁德新能源科技有限公司 | Pole piece cleaning device |
| CN106073893A (en) * | 2016-07-20 | 2016-11-09 | 合肥安博罗医疗器械有限公司 | A kind of CO2laser therapeutic apparatus |
| CN107052579A (en) * | 2017-03-29 | 2017-08-18 | 苏州镭缘激光科技有限公司 | A kind of continuous timesharing laser soldering device |
| CN108789886A (en) * | 2018-05-31 | 2018-11-13 | 中国科学院西安光学精密机械研究所 | A kind of cutting splitting method of transparent hard brittle material |
| CN108581189A (en) * | 2018-06-01 | 2018-09-28 | 业成科技（成都）有限公司 | Laser cutting method |
| CN109065469A (en) * | 2018-06-08 | 2018-12-21 | 成都莱普科技有限公司 | A kind of IC chip optics sampling observation machine of band laser cutting function |
| CN109065469B (en) * | 2018-06-08 | 2020-10-16 | 成都莱普科技有限公司 | Take laser cutting function's IC chip optics to take out machine of examining |
| CN111872554A (en) * | 2020-07-14 | 2020-11-03 | 深圳市睿达科技有限公司 | Welding control method |
| CN112296524A (en) * | 2020-09-23 | 2021-02-02 | 燕山大学 | Workpiece microstructure processing method and diamond microstructure workpiece |
| CN112296524B (en) * | 2020-09-23 | 2022-04-29 | 燕山大学 | Workpiece microstructure processing method and diamond microstructure workpiece |
| WO2023130873A1 (en) * | 2022-01-04 | 2023-07-13 | 上海名古屋精密工具股份有限公司 | Laser processing method for superhard material, and apparatus and machine tool using same |
| CN114609774A (en) * | 2022-03-23 | 2022-06-10 | 北方民族大学 | Novel laser deflection scanning device and control method |
| CN114985912A (en) * | 2022-06-15 | 2022-09-02 | 苏州瀚光精密设备有限公司 | Cutting equipment of two light paths |
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Application publication date: 20110622 |