CN102030468B - Laser cutting device and laser cutting method - Google Patents
Laser cutting device and laser cutting method Download PDFInfo
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- CN102030468B CN102030468B CN200910308011.5A CN200910308011A CN102030468B CN 102030468 B CN102030468 B CN 102030468B CN 200910308011 A CN200910308011 A CN 200910308011A CN 102030468 B CN102030468 B CN 102030468B
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Abstract
The invention relates to a laser cutting device which comprises a laser generating unit, a cooling nozzle, a first image pick-up unit, a second image pick-up unit and an image processing unit. The laser generating unit is used for generating a laser beam. The cooling nozzle is used for generating a cooling medium. The first image pick-up unit comprises a first light source and a first image sensor, and the second image pick-up unit comprises a second light source and a second image sensor. The first light source and the second light source can selectively emit light beams, the light beams emitted by the first light source and the second light source are respectively irradiated on a blind crack from both opposite sides of the blind crack, and the first image sensor and the second image sensor are used for correspondingly sensing the light beams emitted by the first light source or the second light source and reflected on the blind crack to obtain the image of the blind crack. The image processing unit is used for comparing the image of the blind crack with the image of a pre-stored reference blind crack to detect whether the blind crack reaches the preset depth or not.
Description
Technical field
The present invention relates to a kind of laser cutting device, relate in particular to the laser cutting device that a kind of counter plate cuts, and a kind of laser cutting method that adopts this laser cutting device.
Background technology
At flat display apparatus, in the manufacturing processed as liquid-crystal display (Liquid Crystal Display, LCD), usually need to a large panel, cut as glass substrate etc., to obtain a plurality of small panel of desired size.Above-mentioned cutting process generally includes following steps: according to the dimensional requirement of small panel, large panel is heated; Heating region is carried out cooling producing blind crackle (blink crack), adopt machinery or manual mode to isolate required small panel.
In prior art, when large panel is cut, need to confirm whether described blind crackle reaches predetermined depth, for example, this blind crackle need to reach the predetermined degree of depth usually, otherwise, when adopting machinery or manual mode to isolate this small panel, this small panel easily produces burr or other cutting indentation (laser mark), causes its precision lower, is difficult to reach the industrial production needs.
In view of this, provide the laser cutting device of the better cutting accuracy of a kind of tool, and a kind of laser cutting method of this laser cutting device that adopts is real in necessary.
Summary of the invention
The below will illustrate a kind of laser cutting device with embodiment, and a kind of laser cutting method that adopts this laser cutting device, adopt this laser cutting device and this laser cutting method can make the object of cutting gained have better cutting accuracy.
A kind of laser cutting device is used for making panel to be processed to produce blind crackle, to isolate a plurality of sub-panels by the blind crackle of this panel.This panel comprises a substrate, and is formed on the filter layer a plurality of spaced apart on this substrate, and this substrate has a work surface, and these a plurality of filter layers are formed on this work surface, forms a cutting groove between adjacent two filter layers.This laser cutting device comprises a laser generation unit, cooling jet, first image pickup unit, second an image pickup unit, and an image process unit.This laser generation unit produces a laser beam and shines this work surface by this cutting groove along a pre-determined direction, to form a heating zone on this work surface.This cooling jet produces the heat-eliminating medium that is used for spraying this heating zone, so that this substrate forms a blind crackle along this pre-determined direction.This first image pickup unit comprises first light source and first image sensor, and this second image pickup unit comprises a secondary light source and second image sensor.This first, second light source is selectively launched light beam, the light beam of this first, second light source emission is respectively by relative this blind crackle of both sides irradiation of this blind crackle, this the first image sensor sensing is by the light beam of the first light source emission and generation reflection on this blind crackle, and this second image sensor sensing is by the light beam of secondary light source emission and generation reflection on this blind crackle.This first, second corresponding sensing first of image sensor or secondary light source is launched and the light beam of reflection occurs on this blind crackle, obtaining the image of this blind crackle, and generation is corresponding to the electrical signal of this blind crackle image.The prestore image of a blind crackle of benchmark of this image process unit, and accept this electrical signal with the image of this blind crackle of benchmark that prestores relatively and this first, second image sensor image of the blind crackle that senses of one wherein, whether reach the predetermined depth predetermined depth to detect this blind crackle.And
A kind of laser cutting method, it is used for making panel to be processed to produce blind crackle, to isolate a plurality of sub-panels by the blind crackle of this panel.This panel comprises a substrate, and is formed on the filter layer a plurality of spaced apart on this substrate, and this substrate has a work surface, and these a plurality of filter layers are formed on this work surface, forms a cutting groove between adjacent two filter layers.This laser cutting method comprises: utilize laser beam to shine this work surface by this cutting groove along a pre-determined direction, to form a heating zone on this work surface; This heating zone is carried out cooling so that this substrate forms a blind crackle along this pre-determined direction; By this blind crackle emission one light beam of a side direction wherein in this blind crackle relative both sides, with this blind crackle of irradiation unobstructedly; Sensing is by the light beam that reflects on this blind crackle, to obtain the image of this blind crackle; The image of the blind crackle of benchmark that the image and of this blind crackle is prestored compares, and whether reaches predetermined depth to detect this blind crackle.
With respect to prior art, laser cutting device provided by the present invention detects blind crackle and whether reaches predetermined depth by first an image pickup unit, second an image pickup unit and an image process unit are set, with the generation of the blind crackle of accurate control, make and separate that the sub-panel of gained has better cutting accuracy after panel.In addition, this first, second light source is selectively launched the light beam that exposes to this blind crackle, the light beam that the corresponding sensing of this first, second image sensor is reflected by this blind crackle, thereby can overcome the defective that the light beam that is emitted on blind crackle can't detect due to the absorption of filter layer or barrier effect, adopt the laser cutting method of this laser cutting device therefore to have sensing range widely.
Description of drawings
Fig. 1 is the structural representation that laser cutting device counter plate that first embodiment of the invention provides cuts.
Fig. 2 is the front view of laser cutting device shown in Figure 1.
Fig. 3 is the vertical view of laser cutting device shown in Figure 1.
Fig. 4 is the sectional view of the first image pickup unit of comprising of laser cutting device shown in Figure 1.
Fig. 5 is the sectional view of another embodiment of laser cutting device shown in Figure 1 the first image pickup unit of comprising.
Fig. 6 is the front view of the laser cutting device that provides of second embodiment of the invention.
Fig. 7 is the vertical view of the laser cutting device that provides of second embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, so that the embodiment of the present invention is described in further detail.
See also Fig. 1, a kind of laser cutting device 100 that first embodiment of the invention provides, it is used for making panel 10 to be processed to produce blind crackle BC, isolates a plurality of substrate 10B with the blind crackle BC by this panel 10.This panel 10 comprises a substrate 10B, and a plurality of filter layer 10A spaced apart.Particularly, this substrate 10B has a work surface 101, and these a plurality of filter layer 10A are formed on this work surface 101, and this substrate 10B can be a glass substrate, and these a plurality of filter layer 10A can be respectively chromatic filter layer 10A.In addition, form a cutting groove 10C between adjacent two filter layer 10A, these two filter layers are to having two relative sides 102 by cutting groove 10C, and these two sides 102 are respectively perpendicular to this work surface 101.Described laser cutting device 100 comprises a laser generation unit 11, cooling jet 13, first image pickup unit 15, second an image pickup unit 17, and an image process unit 19.
This laser generation unit 11 is for generation of a laser beam, and shines this work surface 101 by this cutting groove 10C, to form a heating zone H on this this work surface 101.This laser beam shines this work surface 101 along a pre-determined direction X usually, and in the present embodiment, this pre-determined direction X is parallel to this side 102, and this heating zone H is positioned at the junction of this work surface 101 and this side 102.
This cooling jet 13 for generation of heat-eliminating medium to spray this heating zone H.This heat-eliminating medium can be water coolant, helium, nitrogen, or carbon dioxide.Be understandable that, when heat-eliminating medium acts on the H of this heating zone, this heating zone H will produce thermal stresses due to temperature head jumpy, this panel 10 under the effect of this thermal stresses by this work surface 101 inwardly and split along this pre-determined direction X, thereby form a blind crackle BC.In the present embodiment, this blind crackle BC and this side 102 are in the same plane.
This first image pickup unit 15 comprises first light source 150 at least, and first image sensor 152.This second image pickup unit 17 comprises a secondary light source 170 at least, and second image sensor 172.
Please consult together Fig. 2 and Fig. 3, the both sides that this first, second image pickup unit 15,17 sets up this laser generation unit 11 separately.Particularly, this first, second light source 150,170 is selectively launched the light beam that exposes to this blind crackle BC, wherein, the light beam of the first light source 150 emission by this blind crackle BC wherein a side (as the left side of blind crackle BC in Fig. 2) expose to this blind crackle BC, the light beam of secondary light source 170 emissions exposes to this blind crackle BC by the relative opposite side of this blind crackle BC (right side of crackle BC as blind in this).This light beam can reflect at this blind crackle BC place, and wherein, be reflected onto with this first light source 150 by the light beam of the first light source 150 emissions and be positioned on first image sensor 152 of the same side, and by 152 sensings of this first image sensor; Be reflected onto with this secondary light source 170 by the light beam of secondary light source 170 emission and be positioned on second image sensor 172 of the same side, and by 172 sensings of this second image sensor.
Please consult together Fig. 4, in the present embodiment, this first image pickup unit 15 also includes first lens barrel 154, first prismatic lens 156 (cubic lens), and at least one first eyeglass 158.This first image sensor 152, the first prismatic lens 156 and at least one the first eyeglass 158 are housed in this first lens barrel 154.This at least one first eyeglass 158 has an optical axis M.This first light source 150 connects the sidewall of this first lens barrel 154, and the light beam of its emission also shines this blind crackle BC by the first lens barrel 154 outgoing after these the first prismatic lens 156 reflections and the first eyeglass 158 transmissions.After this light beam was by blind crackle BC reflection, this first eyeglass 158 and first this first image sensor 152 of the rear arrival of prismatic lens 156 were crossed in its transmission, and by 152 sensings of this first image sensor.The structure of this second image pickup unit 17 and this first image pickup unit 15 are similar, it can include second a lens barrel (not shown), second a prismatic lens (not shown), and at least one second eyeglass (not shown), and this at least one second eyeglass has an optical axis N.
Please consult Fig. 5 again, be understandable that, this first image pickup unit 15 also can have other change embodiment, and for example, this first image pickup unit 15 can include only first lens barrel 154 and at least one the first eyeglass 158.This first image sensor 152 and this first eyeglass 158 are housed in this first lens barrel 154, and this first light source 150 arranges around this first lens barrel 154.But this blind crackle BC of light beam direct irradiation of these the first light source 150 emissions.After this light beam was by blind crackle BC reflection, this first image sensor 152 of the rear arrival of this first eyeglass 158 was crossed in its transmission, and by 152 sensings of this first image sensor.The structure of this second image pickup unit 17 equally can be similar with this first image pickup unit 15, and it can include only second a lens barrel (not shown) and at least one the second eyeglass (not shown).
This first, second image sensor sensing 152,172 corresponding sensings are by first or secondary light source 150,170 emissions and the light beam of reflection occurs on this blind crackle BC, obtaining the image of this blind crackle BC, and produce electrical signal corresponding to this blind crackle BC image.Particularly, this first, second image sensor 152,172 can be respectively electric charge coupling sensor (ChargeCoupled Device, CCD) or complementary metal oxide semiconductor (ComplementaryMetal-Oxide-Semiconductor, CMOS) sensor.
This blind crackle BC is formed on substrate 10B, in order to receive the light beam that is reflected by this blind crackle BC, optical axis M, N and blind crackle BC perpendicular to the angle α 1 on the projection plane of blind crackle BC and work surface 101, α 2 respectively more than or equal to 10 the degree and less than or equal to 80 the degree, as shown in Figure 2.Preferably, optical axis M, N and blind crackle BC spend more than or equal to 30 respectively and are less than or equal to 90 degree at angle β 1, β 2 on take work surface 101 as the projection plane, as shown in Figure 3.
This image process unit 19 is electrically connected to this first, second image sensor sensing 152,172 respectively, and this image process unit 19 prestores the image of a blind crackle of benchmark, and the blind crackle of this benchmark is a desirable blind crackle, and it has the suitable degree of depth.During work, the electrical signal that these image process unit 19 these the first image sensor sensings 152 of reception or the second image sensor sensing 172 produce, and the image of the blind crackle BC that senses of the image of this blind crackle of benchmark that prestores and this first image sensor sensing 152 or the second image sensor sensing 172 relatively, whether reach degree of depth predetermined depth to detect this blind crackle BC.
please refer to Fig. 6 and Fig. 7, a kind of laser cutting device 200 that second embodiment of the invention provides, the laser cutting device 100 that itself and the first embodiment provide is similar, include first an image pickup unit 25 and one the second image pickup unit 27, and image process unit 29, wherein, this the first image pickup unit 25 comprises first light source 250, first image sensor 252, first lens barrel 254, and at least one first eyeglass 258, and this first image sensor 252 and this first eyeglass 258 are housed in this first lens barrel 254, the first eyeglass 258 has an optical axis M, this the second image pickup unit 27 comprises a secondary light source 270, second image sensor 272, a lens barrel 274, and at least one second eyeglass 278, and this second image sensor 272 and this second eyeglass 278 are housed in this second lens barrel 274, and the second eyeglass 278 has an optical axis N.This laser cutting device 200 is compared with laser cutting device 100, and difference is: this first light source 250 was arranged with this first lens barrel in 254 minutes, and this secondary light source 270 also divides with this second lens barrel 274 and is arranged.
Light beam and the blind crackle BC of optical axis M and the first light source 250 emissions have respectively an angle α 1, α 3 on the projection plane perpendicular to blind crackle BC and work surface 101, light beam and the blind crackle BC of optical axis N and secondary light source 270 emissions have respectively an angle α 2, α 4 on the projection plane perpendicular to blind crackle BC and work surface 101, described angle α 1, α 2, α 3 and α 4 are respectively more than or equal to 10 degree and less than or equal to 80 degree.
Light beam and the blind crackle BC of optical axis M and the first light source 250 emissions have respectively an angle β 1, β 3 on the projection plane of work surface 101, light beam and the blind crackle BC of optical axis N and secondary light source 270 emissions have respectively an angle β 2, β 4 on the projection plane of work surface 101, described angle β 1, β 2, β 3 and β 4 are respectively more than or equal to 30 degree and less than or equal to 90 degree.
Third embodiment of the invention provides a kind of employing laser cutting method that the first described laser cutting device 100 counter plates 10 of embodiment cut, and this laser cutting method comprises the following steps (1) ~ (6).
(1) along utilizing laser beam to shine this work surface by this cutting groove along a pre-determined direction, to form a heating zone on this work surface.
As shown in Figure 1, heating zone H is positioned at the junction that H is positioned at this work surface 101 and this side 102.
(2) this heating zone is carried out cooling so that this substrate forms a blind crackle along this pre-determined direction.
When cooling jet 13 during along heating zone H shower cooling medium, this substrate 10B is upper forms blind crackle BC.Be understandable that, as shown in Figure 2, this blind crackle BC is can be respectively in the same plane with two adjacent chromatic filter layer 10A corresponding two relative sides 102.For example, this blind crackle BC can be positioned at the side 102 in cutting groove 10C left side, or is positioned at the side 102 on cutting groove 10C right side.
(3) by this blind crackle emission one light beam of a side direction wherein in this blind crackle relative both sides, with this blind crackle of irradiation unobstructedly.
For the blind crackle BC that is positioned at cutting groove 10C right side, when exposing to this blind crackle BC due to the light beam of secondary light source 170 emission by the right side of blind crackle BC, this light beam easily is subjected to the absorption of chromatic filter layer and black matrix" (not shown) in chromatic filter layer 10A or blocks, make the second image sensor 172 be difficult to sense the light beam that blind crackle BC reflects, therefore, can adopt the first light source 150 emission light beams.The light beam of these the first light source 150 emissions can be exposed to by the left side of blind crackle BC this blind crackle BC, and therefore, the light beam of the first light source 150 emissions reflection can occur on blind crackle BC and accurately sensed by the first image sensor 152.On the contrary, when blind crackle BC is positioned at the left side of cutting groove 10C, can adopt secondary light source 170 emission light beams.This light beam can be exposed to by the right side of blind crackle BC this blind crackle BC, and this light beam reflection occurs on blind crackle BC and accurately sensed by the second image sensor 172.
(4) sensing is by the light beam that reflects on this blind crackle, to obtain the image of this blind crackle.
When blind crackle BC is positioned at the right side of cutting groove 10C, adopt the first image sensor 152 to obtain the image of this blind crackle BC; When blind crackle BC is formed on the left side that is positioned at cutting groove 10C, adopt the second image sensor 172 to obtain the image of this blind crackle BC.
The image of the blind crackle of benchmark that image and that (5) will this blind crackle prestores compares, and whether reaches predetermined depth to detect this blind crackle.
When the image of the blind crackle BC that obtains matches with the blind crackle of benchmark that prestores, show that this blind crackle BC reaches predetermined depth, can isolate required sub-panel this moment along this blind crackle BC.On the contrary, when the image of the blind crackle BC that obtains fails to coincide with the blind crackle of benchmark that prestores, show that this blind crackle BC fails to reach predetermined depth, operator's capable of regulating cutting condition, for example, the power of laser beam, the speed that laser beam moves along pre-determined direction X etc. are so that this blind crackle BC reaches predetermined depth.
When this blind crackle BC reaches predetermined depth, can adopt machinery or manual mode to be isolated a plurality of sub-panels that comprise respectively a chromatic filter layer 10A by this panel 10.Be understandable that, the operator also can further cut each sub-panel, for example, adopts complete disconnected cutting, makes sub-panel form and runs through the crackle of its upper and lower surface, thereby isolate the less a plurality of sub-panels of size by this sub-panel.
Be understandable that, the operator also can adopt the second described laser cutting device 200 counter plates 10 of embodiment to cut.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection domain of claim of the present invention.
Claims (8)
1. laser cutting device, be used for making panel to be processed to produce blind crackle, to isolate a plurality of sub-panels by the blind crackle of this panel, this panel comprises a substrate, and be formed on filter layer a plurality of spaced apart on this substrate, and this substrate has a work surface, and these a plurality of filter layers are formed on this work surface, form a cutting groove between adjacent two filter layers, this laser cutting device comprises:
A laser generation unit, it produces a laser beam and shines this work surface by this cutting groove along a pre-determined direction, to form a heating zone on this work surface;
A cooling jet, it produces the heat-eliminating medium that is used for spraying this heating zone, so that this substrate forms a blind crackle along this pre-determined direction;
A first image pickup unit, it comprises first light source and first image sensor, and this first image pickup unit comprises that also first lens barrel and at least one the first eyeglass, this at least one first eyeglass and this first image sensor are housed in the first lens barrel;
a second image pickup unit, it comprises a secondary light source and second image sensor, this the second image pickup unit also comprises second lens barrel and at least one the second eyeglass, this at least one second eyeglass and this second image sensor are housed in the second lens barrel, at least one is first years old, the second eyeglass has respectively an optical axis, these two optical axises and blind crackle spend more than or equal to 10 respectively perpendicular to the angle on the projection plane of blind crackle and work surface and be less than or equal to 80 the degree, and these two optical axises and blind crackle are spent more than or equal to 30 respectively and are less than or equal to 90 at the angle on take work surface as the projection plane and spend,
this is first years old, secondary light source is selectively launched light beam, this is first years old, the light beam of secondary light source emission is respectively by relative this blind crackle of both sides irradiation of this blind crackle, this the first image sensor sensing is by the light beam of the first light source emission and generation reflection on this blind crackle, and this second image sensor sensing is by the light beam of secondary light source emission and generation reflection on this blind crackle, this is first years old, the corresponding sensing first of the second image sensor or the light beam that secondary light source is launched and generation is reflected on this blind crackle, to obtain the image of this blind crackle, and generation is corresponding to the electrical signal of this blind crackle image,
An image process unit, the image of its blind crackle of benchmark that prestores, and accept this electrical signal with the image of this blind crackle of benchmark that prestores relatively and this first, second image sensor image of the blind crackle that senses of one wherein, whether reach predetermined depth to detect this blind crackle.
2. laser cutting device as claimed in claim 1, is characterized in that, this first, second light source arranges around this first, second lens barrel respectively.
3. laser cutting device as claimed in claim 1, it is characterized in that, this the first image pickup unit comprises that further one is housed in this first lens barrel and the first prismatic lens between this second image sensor and this at least one second eyeglass, this the second image pickup unit comprises that further one is housed in this second lens barrel and the second prismatic lens between this first image sensor and this at least one first eyeglass, the light beam that this first light source connects the sidewall of this first lens barrel and its emission successively after this first prismatic lens and this at least one first eyeglass refraction or transmission by this first lens barrel outgoing, the light beam that this secondary light source connects the sidewall of this second lens barrel and its emission successively after this second prismatic lens and this at least one second eyeglass refraction or transmission by this second lens barrel outgoing.
4. laser cutting device as claimed in claim 1, it is characterized in that, the light beam of this first, second light source emission and blind crackle are spent spend more than or equal to 10 respectively perpendicular to the angle on the projection plane of blind crackle and work surface and be less than or equal to 80, and this two light beam and blind crackle are spent more than or equal to 30 respectively and are less than or equal to 90 at the angle on take work surface as the projection plane and spend.
5. laser cutting device as claimed in claim 1, is characterized in that, this first, second image sensor comprises respectively any one in electric charge coupling sensor and CMOS sensor.
6. laser cutting method as the described laser cutting device of claim 1-5 any one, be used for making panel to be processed to produce blind crackle, to isolate a plurality of sub-panels by the blind crackle of this panel, this panel comprises a substrate, and be formed on filter layer a plurality of spaced apart on this substrate, and this substrate has a work surface, and these a plurality of filter layers are formed on this work surface, form a cutting groove between adjacent two filter layers, this laser cutting method comprises:
Put the position of described the first image pickup unit and described the second image pickup unit, so that two optical axises of first, second eyeglass and blind crackle spending more than or equal to 10 respectively perpendicular to the angle on the projection plane of blind crackle and work surface and be less than or equal to 80 degree, and these two optical axises and blind crackle are spent more than or equal to 30 respectively and are less than or equal to 90 at the angle on take work surface as the projection plane and spend;
Utilize laser beam to shine this work surface by this cutting groove along a pre-determined direction, to form a heating zone on this work surface;
This heating zone is carried out cooling so that this substrate forms a blind crackle along this pre-determined direction;
By this blind crackle emission one light beam of a side direction wherein in this blind crackle relative both sides, with this blind crackle of irradiation unobstructedly;
Sensing is by the light beam that reflects on this blind crackle, to obtain the image of this blind crackle;
The image of the blind crackle of benchmark that the image and of this blind crackle is prestored compares, and whether reaches predetermined depth to detect this blind crackle.
7. laser cutting method as claimed in claim 6, is characterized in that, cooling material carried out in this heating zone adopt any one in water coolant, helium, nitrogen and carbon dioxide.
8. laser cutting method as claimed in claim 6, is characterized in that, adjacent two filter layers have corresponding to two of this cutting groove relative sides, and this blind crackle is in the same plane with these two sides respectively.
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| CN200910308011.5A CN102030468B (en) | 2009-09-30 | 2009-09-30 | Laser cutting device and laser cutting method |
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| CN102515494B (en) * | 2011-12-05 | 2014-04-09 | 深圳市华星光电技术有限公司 | Cutting device and method of glass substrate |
| TW201628751A (en) * | 2014-11-20 | 2016-08-16 | 康寧公司 | Feedback-controlled laser cutting of flexible glass substrates |
| CN106112282A (en) * | 2016-07-13 | 2016-11-16 | 京东方科技集团股份有限公司 | A kind of for CO2the decision method of the crackle of cut and system |
| TWI670135B (en) | 2017-11-15 | 2019-09-01 | 財團法人金屬工業研究發展中心 | Method and device for laser preheating control |
| CN109834468B (en) * | 2017-11-29 | 2020-12-08 | 财团法人金属工业研究发展中心 | Laser preheating control method and laser preheating control device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1117421A (en) * | 1994-04-26 | 1996-02-28 | 松下电器产业株式会社 | Laser working apparatus and laser working method |
| CN1701899A (en) * | 2004-05-26 | 2005-11-30 | 山崎马扎克公司 | Focus adjuster for laser beam machine |
| CN1747820A (en) * | 2003-01-10 | 2006-03-15 | 三星钻石工业股份有限公司 | Brittle material substrate scribing device and scribing method, and automatic analysis line |
| CN201015816Y (en) * | 2005-05-25 | 2008-02-06 | 普雷茨特两合公司 | Device for monitoring the laser processing course and the laser processing head |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003106821A (en) * | 2001-09-28 | 2003-04-09 | Pearl Kogyo Kk | Groove depth-measuring/recording method and system |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1117421A (en) * | 1994-04-26 | 1996-02-28 | 松下电器产业株式会社 | Laser working apparatus and laser working method |
| CN1747820A (en) * | 2003-01-10 | 2006-03-15 | 三星钻石工业股份有限公司 | Brittle material substrate scribing device and scribing method, and automatic analysis line |
| CN1701899A (en) * | 2004-05-26 | 2005-11-30 | 山崎马扎克公司 | Focus adjuster for laser beam machine |
| CN201015816Y (en) * | 2005-05-25 | 2008-02-06 | 普雷茨特两合公司 | Device for monitoring the laser processing course and the laser processing head |
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