WO2018198995A1 - Feuille d'alliage de cuivre et son procédé de fabrication - Google Patents

Feuille d'alliage de cuivre et son procédé de fabrication Download PDF

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WO2018198995A1
WO2018198995A1 PCT/JP2018/016389 JP2018016389W WO2018198995A1 WO 2018198995 A1 WO2018198995 A1 WO 2018198995A1 JP 2018016389 W JP2018016389 W JP 2018016389W WO 2018198995 A1 WO2018198995 A1 WO 2018198995A1
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mass
copper alloy
grain boundary
alloy sheet
heat treatment
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PCT/JP2018/016389
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English (en)
Japanese (ja)
Inventor
岳己 磯松
翔一 檀上
樋口　優
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古河電気工業株式会社
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Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to KR1020197016834A priority Critical patent/KR102499442B1/ko
Priority to JP2019514474A priority patent/JP7145847B2/ja
Priority to CN201880028035.2A priority patent/CN110573635B/zh
Publication of WO2018198995A1 publication Critical patent/WO2018198995A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0221—Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
    • C21D8/0226—Hot rolling
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a copper alloy sheet material applied to, for example, lead frames, connectors, terminal materials, relays, switches, sockets and the like for in-vehicle components and electrical / electronic devices, and a manufacturing method thereof.
  • Copper alloy sheet materials are widely used in applications such as lead frames, connectors, terminal materials, relays, switches, sockets, etc. for in-vehicle components and electrical / electronic devices.
  • the characteristic items required for the copper alloy sheet used for such applications include tensile strength, yield strength (yield stress), bending workability, conductivity, fatigue characteristics, and the like.
  • the plate material since electric / electronic parts are generally formed by pressing or bending a plate material, the plate material must have excellent press punching workability.
  • the press punching process if the press punching process is inferior, the shape of the cut surface when the press punching process is performed becomes unstable.
  • the arrangement intervals between the terminals formed in a row cannot be made uniform, and variations occur, and variations in size and shape tend to occur among the terminals. Since this is not desirable in manufacturing on-vehicle components and electrical / electronic components, the copper alloy sheet material must also have excellent press punching workability.
  • terminals used for high current applications are required to be formed of a copper alloy material having high conductivity.
  • Cu-Ni-Si alloys which are high-strength copper alloys strengthened mainly by precipitation strengthening and work hardening, have been widely used as copper alloy materials for electrical and electronic equipment and automobiles. Has been.
  • the Cu—Ni—Si alloy has a conductivity of about 50% IACS at the maximum, and when it is energized with a large current, the amount of heat generated by resistance increases, and heat reduces the spring property of the contact portion and fixes the terminal. Since the function of the terminal may be remarkably lowered due to deterioration of the mold or the like, it is not suitable for use as a terminal material for large current.
  • Patent Document 1 a Cu—Co—Si alloy is used instead of a Cu—Ni—Si alloy, and the frequency of equiaxed grains and twin grain boundaries is controlled in the recrystallized structure. It is disclosed that bending workability and conductivity can be improved. However, Patent Document 1 does not discuss any press punching workability.
  • An object of the present invention is to provide a copper alloy sheet using a Cu—Co—Si based alloy, having high strength and high electrical conductivity, and having excellent press punching workability.
  • a method for producing the copper alloy sheet according to any one of (1) to (4) above A copper alloy material having the above alloy composition is cast into a casting step [Step 1], a first face grinding step [Step 2], a homogenization heat treatment step [Step 3], a hot rolling step [Step 4], and a water cooling step [Step 5]. ], Second face milling step [step 6], first cold rolling step [step 7], solution heat treatment step [step 8], aging heat treatment step [step 9], second cold rolling step [step 10]. And an annealing step [Step 11] are sequentially performed.
  • a method for producing the copper alloy sheet according to any one of (1) to (4) above A copper alloy material having the above alloy composition is cast into a casting step [Step 1], a first face grinding step [Step 2], a homogenization heat treatment step [Step 3], a hot rolling step [Step 4], and a water cooling step [Step 5]. ], Second face milling step [step 6], first cold rolling step [step 7], solution heat treatment step [step 8], second cold rolling step [step 10], aging heat treatment [step 9], A method for producing a copper alloy sheet material, comprising sequentially performing a third cold rolling step [Step 12] and an annealing step [Step 11].
  • a method for producing the copper alloy sheet according to any one of (1) to (4) above A copper alloy material having the above alloy composition is cast into a casting step [Step 1], a first face grinding step [Step 2], a homogenization heat treatment step [Step 3], a hot rolling step [Step 4], and a water cooling step [Step 5]. ], A second face milling step [Step 6], a first cold rolling step [Step 7], an aging heat treatment step [Step 9], and a second cold rolling step [Step 10]. A method for producing an alloy sheet.
  • a copper alloy sheet material that uses a Cu—Co—Si based alloy, has high strength and high conductivity, and is excellent in press punching workability.
  • FIG. 1 is a typical crystal orientation distribution diagram of a copper alloy sheet material measured by EBSD and obtained from ODF (orientation distribution function) analysis.
  • it is indicated by Euler angles in three directions, ie, a direction RD parallel to the rolling direction and a sheet width direction TD, which are orthogonal to the two axes in the rolling surface, and a normal direction ND of the rolling surface.
  • the azimuth rotation is denoted as ⁇ , the ND axis azimuth rotation as ⁇ 1 , and the TD axis azimuth rotation as ⁇ 2 .
  • FIG. 2 is a partial perspective view schematically showing the copper alloy sheet according to the embodiment of the present invention in a state where a cut surface after press punching is visible.
  • the copper alloy sheet according to the present invention has an alloy composition containing 0.3 to 1.9% by mass of Co and 0.1 to 0.5% by mass of Si, with the balance being Cu and inevitable impurities.
  • the total of the special grain boundary ⁇ 7 grain boundary and ⁇ 9 grain boundary with respect to all crystal grain boundaries obtained from the results measured by the method is 1.5% or more, ⁇ 9 / ⁇ 7 is 1.0 to 5.0,
  • the “copper alloy sheet” is obtained by processing a copper alloy material (before processing and having a predetermined alloy composition) into a plate shape, having a specific thickness and being stable in shape. This means something with a spread in the direction of the cage plane, and in the broad sense includes strips.
  • the thickness of the plate material is not particularly limited, but is preferably 0.05 to 1.0 mm, more preferably 0.06 to 0.8 mm.
  • the copper alloy sheet according to the present invention contains Co and Si as essential components.
  • Co 0.3 to 1.9% by mass
  • Co is finely precipitated in the Cu matrix (matrix) as a second phase particle precipitate made of a single substance or a compound with Si, for example, with a size of about 50 to 500 nm.
  • This precipitate is an important component that acts to precipitate and harden by suppressing dislocation movement, and further suppresses grain growth and raises the material strength by refining crystal grains, and also improves bending workability. is there.
  • the Co content needs to be 0.3% by mass or more.
  • Co has a lower rate of decrease in conductivity when dissolved than Ni, but when the Co content exceeds 1.9% by mass, the decrease in conductivity becomes significant, exceeding 50% IACS. Since the conductivity cannot be obtained, the Co content needs to be 1.9% by mass or less.
  • the conductivity is about 38% IACS, but the Co content is 0.3%.
  • the copper alloy sheet material of the present invention in the range of ⁇ 1.9 mass% has a high value of 60% IACS or higher in electrical conductivity.
  • the tensile strength of the copper alloy sheet of the present invention depends on the production conditions, but by adopting specific production conditions, a copper alloy made of a Cu-Ni-Si alloy can be obtained at about 600 MPa after aging precipitation. High strength equivalent to that of plate material can be obtained.
  • the Co content is preferably in the range of 0.8 to 1.6% by mass.
  • Si 0.1-0.5% by mass
  • Si is finely precipitated in the Cu matrix (matrix) as precipitates of second phase particles made of a compound together with Co, Cr, and the like.
  • This precipitate is an important component having the effect of precipitating and hardening by suppressing dislocation movement, and further suppressing the grain growth and increasing the material strength by refining crystal grains.
  • it is necessary to make the Si content 0.1% by mass or more.
  • the Si content exceeds 0.5% by mass, the decrease in conductivity becomes remarkable, and the conductivity exceeding 50% IACS cannot be obtained. Therefore, the Si content is reduced to 0.5% by mass or less.
  • the Si content is preferably in the range of 0.2 to 0.5% by mass.
  • the copper alloy sheet material of the present invention further includes, as optional components, 0.05 to 1.0% by mass of Cr and 0.05 to 0.7% by mass of Ni. %, Fe 0.02 to 0.5 mass%, Mg 0.01 to 0.3 mass%, Mn 0.01 to 0.5 mass%, Zn 0.01 to 0.15 mass%, and Zr may contain at least one component selected from the group consisting of 0.01 to 0.15% by mass.
  • Cr 0.05 to 1.0% by mass
  • Cr is finely precipitated in the Cu matrix (matrix) as a compound or simple substance, for example, in the form of a precipitate having a size of about 50 to 500 nm.
  • This precipitate is a component having an action of precipitating and hardening by suppressing dislocation movement, and further suppressing the grain growth and increasing the material strength by refining the crystal grains and improving the bending workability.
  • the Cr content is preferably 0.05% by mass or more.
  • Cr content is set to 0.05 to 1.0% by mass.
  • Ni is finely precipitated in the matrix (matrix) of Cu as a compound or simple substance, for example, in the form of a precipitate having a size of about 50 to 500 nm.
  • This precipitate is a component having an action of precipitating and hardening by suppressing dislocation movement, and further suppressing the grain growth and increasing the material strength by refining the crystal grains and improving the bending workability.
  • the Ni content is preferably 0.05% by mass or more. Moreover, if Ni content is 0.7 mass% or less, the fall of electrical conductivity will not be remarkable and there will be no tendency for the electrical conductivity exceeding 50% IACS not to be obtained. Therefore, the Ni content is 0.05 to 0.7% by mass.
  • Fe 0.02-0.5% by mass
  • Fe is a component having an effect of improving product characteristics such as conductivity, strength, stress relaxation characteristics, and plating properties.
  • the Fe content is preferably 0.02% by mass or more.
  • the Fe content is set to 0.02 to 0.5% by mass.
  • Mg 0.01 to 0.3% by mass
  • Mg is a component having an effect of improving the stress relaxation resistance.
  • the Mg content is preferably 0.01% by mass or more. Further, if the Mg content is 0.3% by mass or less, the conductivity does not tend to decrease. Therefore, the Mg content is set to 0.01 to 0.3% by mass.
  • Mn dissolves in the matrix phase to improve wire drawing workability, suppresses rapid development of grain boundary reactive precipitation, and enables control of discontinuous precipitation cell structure caused by grain boundary reactive precipitation. It is a component having the action of In order to exert such an effect, the Mn content is preferably 0.01% by mass or more. Moreover, if content of Mn is 0.5 mass% or less, there exists no possibility that the fall of electrical conductivity or the deterioration of bending workability may arise. Therefore, the Mn content is set to 0.01 to 0.5% by mass.
  • Zn 0.01 to 0.15% by mass
  • Zn is a component that has an effect of improving bending workability and improving adhesion and migration characteristics of Sn plating and solder plating.
  • the Zn content is preferably 0.01% by mass or more.
  • Zn content is set to 0.01 to 0.15% by mass.
  • Zr 0.01 to 0.15 mass%
  • Zr is a component having an effect of mainly refining crystal grains and improving strength and bending workability.
  • the Zr content is preferably set to 0.01 mass or more.
  • Zr content is set to 0.01 to 0.15% by mass.
  • Total content when containing at least two optional additional components In the case where at least two optional additive components selected from the group consisting of Cr, Ni, Fe, Mg, Mn, Zn and Zr are contained, the total content is preferably 1.5% by mass or less. This is because if the total content is 1.5% by mass or less, press punching workability and electrical conductivity are not greatly reduced. For this reason, the said total content shall be 1.5 mass% or less.
  • the balance consists of Cu and inevitable impurities other than the essential components and optional components described above.
  • the “inevitable impurities” referred to here are mostly metal products that are present in raw materials or inevitably mixed in the manufacturing process, and are essentially unnecessary, but are trace amounts, It is an acceptable impurity because it does not affect the product characteristics.
  • the “orientation density” here is also expressed as a crystal orientation distribution function (ODF), where the random crystal orientation distribution is set to 1, and the number of times of accumulation is greater than that. It is used to quantitatively analyze the abundance ratio of the crystal orientation of the texture and the dispersion state.
  • the orientation density is based on the EBSD and X-ray diffraction measurement results, and the crystal orientation distribution analysis by the series expansion method based on three or more kinds of positive point map measurement data such as (100), (110), (112) positive point map Calculated by the method.
  • the special grain boundaries ⁇ 7 and ⁇ 9 are called special grain boundaries and are crystal grain boundaries that form a corresponding lattice. When there is no simple orientation relationship between crystal grains, ⁇ is large and a grain boundary that does not have special properties is called a random grain boundary.
  • ⁇ -fiber refers to the fact that the crystal orientation group that develops when pure copper is rolled and recrystallized is connected like a fiber when shown on the ODF map. The orientation density of ⁇ -fiber changes depending on the frequency of rolling and recrystallization.
  • the present inventors have intensively studied the relationship with the rolling texture.
  • the alloy composition is limited to the above range, the ratio of the total amount of the special grain boundary ⁇ 7 grain boundary and ⁇ 9 grain boundary in the total grain boundary is 1.5% or more, and ⁇ 9 / ⁇ 7 is 1.0 to
  • ⁇ 7 and ⁇ 9 of the special grain boundaries have relatively low grain boundary energy compared to other special grain boundaries, and the ratio of the total amount of the special grain boundaries ⁇ 7 grain boundary and ⁇ 9 grain boundary in the total crystal grain boundary is This is because, if it is 1.5% or more, even in the case of processing that is locally heavily loaded such as press processing, it is easy to deform against external force, and excellent press punching workability can be obtained stably.
  • the ⁇ 9 grain boundary has a greater contribution to press punching workability than the ⁇ 7 grain boundary.
  • the ⁇ 7 grain boundary is superior to other special grain boundaries, although it contributes less to press punching workability than the ⁇ 9 grain boundary.
  • each of the ⁇ 7 and ⁇ 9 grain boundaries has a lower grain boundary energy than the other special grain boundaries, and is considered to contribute to press punchability during processing. For this reason, by limiting ⁇ 9 / ⁇ 7 to 1.0 to 5.0, excellent press punchability can be exhibited.
  • high strength can be obtained in addition to press punchability. It is possible to obtain excellent strength by manufacturing with the manufacturing method described later.
  • FIG. 1 is a typical crystal orientation distribution diagram of a copper alloy sheet measured by EBSD and obtained from an ODF (orientation distribution function) analysis, which is a biaxial orthogonal direction in a rolling plane, The Euler angles in the three directions of the parallel direction RD and the sheet width direction TD and the normal direction ND of the rolled surface are shown, that is, the RD axis orientation rotation is ⁇ , the ND axis orientation rotation is ⁇ 1 , and the TD axis orientation shows the rotating [Phi 2.
  • the EBSD method was used for the analysis of the rolling texture in the present invention.
  • the EBSD method is an abbreviation for Electron Backscatter Diffraction, and is a crystal orientation analysis technique using reflected electron Kikuchi line diffraction that occurs when a sample is irradiated with an electron beam in a scanning electron microscope (SEM).
  • SEM scanning electron microscope
  • a sample area of 800 ⁇ m ⁇ 1600 ⁇ m containing 200 or more crystal grains was scanned and measured in 0.1 ⁇ m steps.
  • the measurement area and the scanning step may be determined according to the size of crystal grains of the sample.
  • the orientation difference the orientation difference between adjacent measurement points of 10 ° or more is regarded as a crystal grain boundary.
  • analysis software OIM Analysis (trade name) manufactured by TSL Solutions was used.
  • Information obtained in the analysis of crystal grains by EBSD includes information up to a depth of several tens of nm at which the electron beam penetrates the sample. Further, the measurement location in the plate thickness direction is preferably near the position of 1/8 to 1/2 times the plate thickness t from the sample surface.
  • the crystal orientation display method includes a crystal plane index (h k l) perpendicular to the Z axis (parallel to the rolling plane (XY plane)) and a vertical axis (parallel to the YZ plane) to the X axis.
  • index [u v w] of the crystal direction it is expressed in the form of (h k l) [u v w].
  • equivalent orientation under the cubic symmetry of the copper alloy such as (1 3 2) [6 -4 3] and (2 3 1) [3 -4 6]
  • a parenthesis representing the generic name is used, and ⁇ h k l ⁇ ⁇ u v w> is used.
  • Typical crystal orientations include Brass orientation ⁇ 011 ⁇ ⁇ 211>, S orientation ⁇ 123 ⁇ ⁇ 634>, Copper orientation ⁇ 112 ⁇ ⁇ 111>, Goss orientation ⁇ 110 ⁇ ⁇ 001>, RDW orientation ⁇ 012 ⁇ ⁇ 100. >, BR orientation ⁇ 236 ⁇ ⁇ 385> and the like.
  • the component is an alloy-type texture, which is a structure obtained by controlling the additive elements Co and Si within a specified range. The presence of ⁇ -fiber within a specified range can significantly improve press punching workability.
  • the tensile strength in the rolling parallel direction is preferably 500 MPa or more. If the tensile strength in the rolling parallel direction is 500 MPa or more, there is no tendency for the strength of the plate material to be insufficient when the terminal is formed from a thin plate or narrowed plate material, and sufficient contact pressure at the leaf spring portion of the terminal This is because there is no possibility that it cannot be secured.
  • the electrical conductivity exceeds 50% IACS. If the electrical conductivity exceeds 50% IACS, the resistance heating value will not be large even when energized with a large current, and the function of the terminal will be reduced due to a decrease in the spring property of the contact part due to heat or deterioration of the mold for fixing the terminal. This is because there is no risk of significant decrease.
  • the shear plane and the fractured surface specified by observing the cut surface by press punching with a scanning electron microscope (SEM) are the difference between the maximum value tmax and the minimum value tmin of the total dimension measured in the plate thickness direction.
  • ⁇ t is preferably 30% or less of the plate thickness T.
  • FIG. 2 is a partial perspective view of a copper alloy sheet according to a representative embodiment.
  • the copper alloy sheet 1 shown in FIG. 2 shows a state in which a press punching process is performed by lowering an upper die (punch) while being fixed on a lower die (die) (not shown), A surface (cut) 2 is provided. Further, the cut surface 2 is configured in the order of the sag 3, the sheared surface 4 and the fracture surface 5 from the upper surface 1 a side of the pressed copper alloy sheet material 1.
  • a so-called burr 6 is also formed, which is a thin fin-like portion protruding outward from the regular cross-sectional shape.
  • the present inventors pay particular attention to the fluctuation height ⁇ t of the boundary line 7 between the sag (surface) 3 and the shearing face 4, and this fluctuation height ⁇ t, that is, a predetermined thickness with respect to the plate thickness T of the copper alloy sheet material 1. More specifically, the cut surface 2 formed by press punching was observed with a scanning electron microscope (SEM). As a result, the present inventors control the difference ⁇ t between the maximum value tmax and the minimum value tmin of the total dimension obtained by measuring the specified shear surface 4 and fracture surface 5 in the plate thickness direction to 30% or less of the plate thickness T. As a result, it has been found that the press punching processability is remarkably improved.
  • the fluctuation height ⁇ t exceeds 30% of the plate thickness T, the press punching processability is inferior, and there is a tendency that the distance between the terminals formed continuously and the variation in the size and shape of the terminals increase.
  • the cut surface 2 formed by the press punching process has generation
  • the hot rolling step (step 4) was performed under the conditions of ⁇ 1100 ° C., rolling number of 4 times or more, and total processing rate of 60% or more, followed by rapid cooling by the water cooling step (step 5). Thereafter, in order to remove the oxide film on the surface, a second chamfering step (step 6) is performed in which both the front and back surfaces of the hot-rolled material are each cut to a thickness of 0.5 mm or more.
  • step 7) After performing the first cold rolling step (step 7) under the conditions of the rolling number of times of 2 times or more and the total processing rate of 50% or more, the heating rate is 1 to 150 ° C./second, the ultimate temperature is 800 to 1000 ° C., A solution heat treatment step (step 8) is performed at a holding time of 1 to 300 seconds and a cooling rate of 1 to 200 ° C./second, and then an aging heat treatment step at an ultimate temperature of 300 to 650 ° C. and a holding time of 0.2 to 15 hours (Step 9) is performed.
  • step 10 After performing the second cold rolling step (step 10) under the condition that the number of rolling is 2 times or more and the total processing rate is 5% or more, annealing is performed at an ultimate temperature of 200 to 600 ° C. and a holding time of 1 to 3600 seconds. A process (process 11) is performed. In this way, the copper alloy sheet material of the present invention is produced.
  • the aging heat treatment process (process 9) is performed after the second cold rolling process (process 10) is performed, and then further
  • the number of times of rolling is two times or more
  • the third cold rolling step (step 12) may be performed under conditions of a total processing rate of 10% or more, and then the annealing step (step 11) may be performed. It is possible to produce the copper alloy sheet of the present invention.
  • the aging heat treatment step (step 9) is performed without performing the solution heat treatment step (step 8), and then the second A cold rolling step (step 10) may be performed, and the copper alloy sheet material of the present invention can also be produced by such a method.
  • the copper alloy material contains 0.3 to 1.9% by mass of Co and 0.1 to 0.5% by mass of Si. Further, if necessary, 0.05 to 1.0% by mass of Cr and Ni 0.05 to 0.7 mass%, Fe 0.02 to 0.5 mass%, Mg 0.01 to 0.3 mass%, Mn 0.01 to 0.5 mass%, Zn 0. It contains at least one component selected from the group consisting of 01 to 0.15% by mass and Zr from 0.01 to 0.15% by mass, and the balance has an alloy composition consisting of Cu and inevitable impurities.
  • a homogenization heat treatment step (step 3), a hot rolling step (step 4), and an aging heat treatment step (step 9), which are particularly common steps among the structures constituting the manufacturing methods A to C described above. It is important to control. That is, the temperature increase rate in the homogenization heat treatment step is 10 to 110 ° C./second, the holding temperature is 950 to 1250 ° C., the cooling start temperature in the hot rolling step (step 4) is 680 to 850 ° C., and the cooling rate is 20 to It is necessary to set the temperature to 130 ° C./second, the temperature reached in the aging heat treatment step (step 9) to 450 to 650 ° C., and the holding time to 500 to 20000 seconds. Further, in order to sufficiently develop the rolling texture and control the orientation density of ⁇ -fiber within an appropriate range, the aging heat treatment step (step 9) needs to be heat-treated within the above range.
  • the heating rate in the homogenization heat treatment step (step 3) is 10 ° C./second or more or 110 ° C./second or less, or the holding temperature is 950 ° C. or more, the crystallization product produced during casting is sufficiently dissolved and produced. In a copper alloy sheet, a satisfactory level of strength and electrical conductivity can be obtained.
  • the holding temperature in the homogenization heat treatment step (step 3) is 1250 ° C. or lower, the vicinity of the crystal grain boundary partially becomes a liquid phase and cracks during hot rolling are likely to occur, and there is no case where it cannot be produced. Because.
  • the cooling start temperature in the hot rolling step (step 4) is 680 ° C.
  • the cooling start temperature in the hot rolling step (step 4) is 850 ° C. or lower or the cooling rate is 130 ° C./second or lower, the formation of the rolled structure becomes sufficient, which adversely affects the press punchability after the final step. There is no.
  • the temperature reached in the aging heat treatment step (step 9) is 450 ° C. or higher or the holding time is 500 seconds or longer, the amount of aging precipitation is insufficient and the strength and conductivity do not tend to be insufficient.
  • the temperature reached in the aging heat treatment step (step 9) is 650 ° C. or less or 20000 seconds or less, the strength of the precipitate does not tend to be insufficient due to coarsening of the precipitate.
  • the target structure and characteristics are obtained by appropriately controlling the conditions of the homogenization heat treatment step (step 3), the hot rolling step (step 4) and the aging heat treatment step (step 9). Is obtained.
  • Inventive Examples 1 to 16 and Comparative Examples 1 to 9 each contain Co and Si, and optional additional components to be added as necessary, so that the compositions shown in Table 1 are obtained, with the balance being Cu and inevitable impurities.
  • the resulting copper alloy material was melted in a high-frequency melting furnace and cast (step 1) to obtain an ingot.
  • the heating rate and holding shown in Table 2 are performed.
  • a homogenization heat treatment step (step 3) is performed under temperature conditions, and then a hot rolling step (step 4) is performed under the conditions of the cooling start temperature and cooling rate shown in Table 2, followed by a water cooling step (step 5). ). Thereafter, in order to remove the oxide film on the surface, a second chamfering step (step 6) is performed in which both the front and back surfaces of the hot-rolled material are each cut to a thickness of 0.5 mm. Thereafter, after performing the first cold rolling step (step 7) so that the total processing rate becomes 50% or more, each step according to any one of the manufacturing methods A to C shown in Table 2 is sequentially performed, An alloy sheet was produced. Table 2 shows the ultimate temperature and holding time in the aging heat treatment step (step 9).
  • Table 2 also shows the ratio of fluctuation height ⁇ t / plate thickness T.
  • Each copper alloy sheet produced was evaluated for the following characteristics. (Measurement and analysis of crystal orientation by EBSD measurement) The measurement was performed under the conditions of a measurement area of 64 ⁇ 10 4 ⁇ m 2 (800 ⁇ m ⁇ 800 ⁇ m) and a scan step of 0.1 ⁇ m by the EBSD method. The scan step was performed in 0.1 ⁇ m steps to measure fine crystal grains. In the analysis, an inverse pole figure IPF (Inverse Pole Figure) was confirmed from the EBSD measurement result of 64 ⁇ 10 4 ⁇ m 2 in the analysis. The electron beam was generated from thermionic electrons from the W filament of the scanning electron microscope. The probe diameter at the time of measurement is about 0.015 ⁇ m.
  • OIM5.0 (trade name) manufactured by TSL Solutions was used as the measuring device for the EBSD method.
  • the ⁇ 9 / ⁇ 7 ratio the ⁇ 7 grain boundary and the ⁇ 9 grain boundary were calculated from the CBSD (Coincidence Site Lattice) on the measurement surface using the analysis software (OIM Analysis).
  • ODF Orientation Distribution Functions
  • Each prepared copper alloy sheet is adjusted so that the clearance between the upper mold (punch) and the lower mold (die) is 5.0% of the sheet thickness T, punched, and length dimension: 3.0 mm. , Width dimension: 1.0 mm, and the length dimension is punched so as to be perpendicular to the rolling direction to prepare a sample.
  • the length dimension Observe an orthogonal cut surface (a surface parallel to the width dimension).
  • the sample after pressing is fixed and observed with a SEM at 100 to 500 times. For SEM observation, SEMEDX TypeM manufactured by Hitachi, Ltd. was used.
  • the difference ⁇ t between the maximum value tmax and the minimum value tmin of the total dimension measured in the plate thickness direction was measured. .
  • the measured ⁇ t is 30% or less of the plate thickness T, “ ⁇ ” is assumed that the press punching workability is at an acceptable level, and the press punching workability is at an acceptable level when it exceeds 30% of the plate thickness T. It is shown in Table 2 as “x” as being unacceptable.
  • a copper alloy sheet material that uses a Cu—Co—Si based alloy, has high strength and high conductivity, and is excellent in press punching workability.

Abstract

La présente invention concerne une feuille d'alliage de cuivre qui est fabriquée au moyen d'un alliage à base de Cu-Co-Si et possède une excellente aptitude au traitement par poinçonnage à la presse tout en ayant une résistance élevée et une conductivité élevée. La feuille d'alliage de cuivre a une composition d'alliage comprenant de 0,3 à 1,9 % en masse de Co, de 0,1 à 0,5 % en masse de Si, et le reste étant Cu et des impuretés inévitables, la proportion, dans le joint de grain cristallin total, de la quantité totale de joint de grain Σ7 et de joint de grain Σ9, qui sont des joints de grain spéciaux, est de 1,5 % ou plus, la proportion étant obtenue à partir du résultat de mesure par un procédé EBSD, le rapport Σ9/Σ7 étant de 1,0 à 5,0, et la densité d'orientation d'une fibre α (Φ1 = 0°-45°) est dans la plage de 3,0 à 25,0.
PCT/JP2018/016389 2017-04-26 2018-04-23 Feuille d'alliage de cuivre et son procédé de fabrication WO2018198995A1 (fr)

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