WO2018196680A1 - 多温区半导体制冷设备 - Google Patents

多温区半导体制冷设备 Download PDF

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Publication number
WO2018196680A1
WO2018196680A1 PCT/CN2018/083814 CN2018083814W WO2018196680A1 WO 2018196680 A1 WO2018196680 A1 WO 2018196680A1 CN 2018083814 W CN2018083814 W CN 2018083814W WO 2018196680 A1 WO2018196680 A1 WO 2018196680A1
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WO
WIPO (PCT)
Prior art keywords
heat
semiconductor refrigeration
hot
conducting seat
heat pipe
Prior art date
Application number
PCT/CN2018/083814
Other languages
English (en)
French (fr)
Inventor
裴玉哲
王定远
刘杰
卞伟
张立臣
王晔
赵建芳
胡成
李新远
孟令博
Original Assignee
青岛海尔智能技术研发有限公司
青岛海尔特种电冰柜有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 青岛海尔智能技术研发有限公司, 青岛海尔特种电冰柜有限公司 filed Critical 青岛海尔智能技术研发有限公司
Publication of WO2018196680A1 publication Critical patent/WO2018196680A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/003—General constructional features for cooling refrigerating machinery
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0251—Removal of heat by a gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2323/00—General constructional features not provided for in other groups of this subclass
    • F25D2323/002—Details for cooling refrigerating machinery
    • F25D2323/0021—Details for cooling refrigerating machinery using air guides

Definitions

  • the invention relates to a refrigeration device, in particular to a multi-temperature zone semiconductor refrigeration device.
  • Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration device that uses refrigeration generated by a semiconductor refrigeration chip to achieve refrigeration.
  • the semiconductor refrigeration chip includes a cold end for releasing cold and a hot end for releasing heat.
  • the cold end of the semiconductor refrigeration chip releases the cooling amount to the cooling chamber of the refrigeration device through the cold end radiator, and the semiconductor refrigeration
  • the hot end of the chip needs to dissipate heat to the outside through the hot end heat sink.
  • each semiconductor refrigeration chip correspondingly controls the cooling temperature of one temperature zone, but the hot end heat sink forms an integral heat sink through the heat pipe, although the heat dissipation area can be increased to some extent,
  • the upper semiconductor cooling chip is seriously affected by the heat of heat dissipation due to the heat increase of the heat radiating portion, and the cooling efficiency of the semiconductor cooling chip located at the upper portion is low.
  • the invention provides a multi-temperature zone semiconductor refrigeration device, which realizes improving the refrigeration efficiency of the refrigeration device and reducing the energy consumption.
  • a multi-temperature zone semiconductor refrigeration device includes a casing and a plurality of inner tanks disposed in the casing, wherein two adjacent inner tanks are connected by an adiabatic connecting member, and each of the inner tanks forms a a cooling compartment, each of the inner tanks is provided with a semiconductor refrigeration module, the semiconductor refrigeration module comprising a semiconductor refrigeration chip assembled together, a hot end heat sink and a cold end heat sink, wherein the cold end heat sink is disposed at The hot end heat sink is disposed on the back plate of the casing, and the adjacent two hot end heat sinks are spaced apart by a wind deflector, and the air deflector will
  • the backplane is divided into a plurality of independent heat dissipation regions, and each of the heat dissipation regions is provided with a heat dissipation fan.
  • the longitudinal section of the wind deflector has a herringbone structure.
  • the semiconductor refrigeration module includes an assembly module, and the assembly module includes a first heat insulation bracket, a second heat insulation bracket, a hot end heat conduction seat and a cold end heat conduction seat, and the first heat insulation bracket is fixed at the a second insulating bracket, a mounting cavity is formed between the first heat insulating bracket and the second heat insulating bracket, and the first heat insulating bracket is provided with a mounting hole that communicates with the mounting cavity.
  • the semiconductor refrigeration chip is located in the mounting hole, the cold end heat conducting seat is disposed in the mounting cavity and is in contact with a cold end surface of the semiconductor refrigeration chip, and the hot end heat conducting seat is disposed at the first partition a thermal holder is in contact with the thermal end surface of the semiconductor refrigerating chip, the cold end heat conducting seat is connected with a first heat pipe, the first heat pipe is attached to the corresponding inner casing; the cold end heat conducting seat and the The first heat pipe constitutes the cold end heat sink, and the hot end heat conducting seat constitutes the hot end heat sink.
  • the hot end heat conducting seat is provided with heat dissipating fins; or the hot end heat conducting seat is connected with a second heat pipe, and the second heat pipe is provided with heat dissipating fins.
  • an outer surface of the first heat insulating bracket is provided with a heat insulating groove around the mounting hole, and an insulating cotton is disposed in the heat insulating groove; a hot end surface of the semiconductor cooling chip protrudes outward The outer surface of the first insulated support.
  • the cold-end heat-conducting seat is provided with a avoidance notch
  • the first heat-insulating bracket, the second heat-insulating bracket and the hot-end heat-conducting seat are respectively provided with through holes, and the bolts are disposed in corresponding In the through hole, the bolt passes through a region formed by the avoidance notch.
  • the cold end heat conducting seat comprises a first heat conducting plate and a second heat conducting plate connected together, and the first heat pipe is sandwiched between the first heat conducting plate and the second heat conducting plate.
  • the inner surface of the first heat conducting plate is provided with a first mounting groove disposed laterally, and the inner surface of the second heat conducting plate is provided with a second mounting groove disposed longitudinally, and the first heat pipe is divided into a horizontal flat a heat pipe and a longitudinal flat heat pipe, the transverse flat heat pipe is disposed in the first installation groove, the longitudinal flat heat pipe is disposed in the second installation groove, and the lateral flat heat pipe and the longitudinal flat heat pipe are mutually contact.
  • an inner surface of the first heat insulating bracket is provided with a first pipe groove for mounting the first heat pipe, and an edge of the second heat insulating bracket is provided with a gap for the first heat pipe to pass through or Through hole or second tube groove.
  • the semiconductor refrigeration module includes a plurality of the semiconductor refrigeration chips, and the assembly module is configured with the hot end heat conduction seat and the cold end heat conduction seat corresponding to the semiconductor refrigeration chip, and
  • the first heat insulating bracket is provided with the mounting hole corresponding to the semiconductor cooling chip.
  • the advantages and positive effects of the present invention are: by providing an air deflector between two adjacent hot end heat sinks, and using the air guiding effect of the air deflector to make the back panel of the box shell A relatively independent heat dissipating area is formed for each hot end heat sink.
  • the heat released by the hot end heat sink located below is guided to the outside through the air deflector without entering the upper heat dissipating area, thereby avoiding
  • the semiconductor refrigeration module disposed in the upper inner casing is affected by the heat dissipation of the lower semiconductor refrigeration module, thereby reducing the heat dissipation efficiency, ensuring that the heat dissipation of the semiconductor refrigeration module at different locations does not affect each other, thereby improving the refrigeration efficiency of the refrigeration device and reducing energy consumption.
  • the cold-end heat-conducting seat is installed by using a mounting cavity formed between the two heat-insulating brackets, so that the cold-end heat-conducting seat and the hot-end heat-conducting seat are effectively insulated by the heat-insulating bracket, thereby greatly reducing the cold-end heat-conducting seat and The amount of heat exchange between the hot-end heat-conducting seats effectively reduces the loss of cooling capacity to improve the cooling efficiency of the refrigeration equipment and reduce energy consumption.
  • the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulating bracket, ensuring good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conducting seat while ensuring good thermal end face and hot end heat conducting seat of the semiconductor refrigeration chip. Contact to ensure rapid heat dissipation and improve reliability.
  • FIG. 1 is a schematic structural view of an embodiment of a multi-temperature zone semiconductor refrigeration device according to the present invention
  • FIG. 2 is an assembled view of a liner and a cold end heat sink in an embodiment of a multi-temperature zone semiconductor refrigeration device according to the present invention
  • FIG. 3 is a schematic structural view of an air deflector in an embodiment of a multi-temperature zone semiconductor refrigeration device according to the present invention.
  • FIG. 4 is a schematic structural view of a semiconductor refrigeration module according to the present invention.
  • FIG. 5 is a schematic front view showing the structure of a first heat insulation support in a semiconductor refrigeration module according to the present invention
  • FIG. 6 is a schematic view showing the reverse structure of a first heat insulating bracket in a semiconductor refrigeration module of the present invention
  • FIG. 7 is a front structural view of a second heat insulating bracket of a semiconductor refrigeration module according to the present invention.
  • FIG. 8 is a schematic view showing the reverse structure of a second heat insulating bracket in the semiconductor refrigeration module of the present invention.
  • FIG. 9 is a schematic structural view of a first heat conducting plate in a semiconductor refrigeration module of the present invention.
  • FIG. 10 is a schematic structural view of a second heat conducting plate in a semiconductor refrigeration module according to the present invention.
  • FIG. 11 is an exploded view of a semiconductor refrigeration module of the present invention.
  • the multi-temperature zone semiconductor refrigeration device of the present embodiment includes a casing 200 and a plurality of liners 100 disposed in the casing, and the two adjacent liners 100 pass between The heat insulating connecting members 101 are connected, and each of the inner tanks 100 forms a refrigerating compartment, and each of the inner tanks 100 is provided with a semiconductor refrigerating module, and the semiconductor refrigerating module includes the semiconductor refrigerating chip 1 assembled together.
  • a hot end heat sink and a cold end heat sink the cold end heat sink being disposed on the inner tank 100, the hot end heat sink being disposed on a back plate of the case 200, adjacent to the two heats
  • the end heat sinks are spaced apart by a wind deflector 300.
  • the air deflector 300 divides the backboard into a plurality of independent heat dissipation regions, and each of the heat dissipation regions is provided with a heat dissipation fan 400.
  • the multi-temperature zone semiconductor refrigeration device of the embodiment is provided with a wind deflector 300 on the back plate to space the adjacent two hot-end heat sinks.
  • the hot-end heat sink located below is released.
  • the heat is moved upward and guided to the outside through the air deflector 300, and the air deflector 300 can effectively block the lower hot air from rising into the upper hot end heat sink to generate heat, thereby avoiding the lower part of the upper hot end heat sink.
  • a phenomenon in which the cooling efficiency is lowered due to the influence of hot air and the cooling performance is lowered.
  • the wind deflector 300 may be a double-arc, curved or straight plate.
  • the longitudinal cross-section of the wind deflector 300 is a herringbone structure, that is, the wind deflector 300 includes two curved plates disposed away from each other. A double curved structure is formed.
  • the air deflector is disposed between the adjacent two hot-end heat sinks, and the air-conducting plate is used to guide the air, so that the back plate of the casing heats off for each hot end.
  • the device forms a relatively independent heat-dissipating area. During operation, the heat released by the hot-end heat sink located below is guided to the outside through the air deflector without entering the upper heat-dissipating area, thereby avoiding the semiconductor of the upper inner tank.
  • the cooling module is affected by the heat dissipation of the lower semiconductor refrigeration module, which causes the heat dissipation efficiency to be reduced, ensuring that the heat dissipation of the semiconductor refrigeration module at different locations does not affect each other, thereby improving the refrigeration efficiency of the refrigeration device and reducing the energy consumption.
  • the semiconductor refrigeration module includes a semiconductor refrigeration chip 1 and a first heat pipe 2, and the semiconductor refrigeration chip 1 includes a cold end face and a release release cooling amount.
  • the hot end face of the heat further includes an assembly module 3 including a first heat insulation bracket 31, a second heat insulation bracket 32, a hot end heat conduction seat 33 and a cold end heat conduction seat 34, the first heat insulation bracket A first recess 311 is defined in the inner surface of the first recess 311, and a mounting hole 312 is formed in the first recess 311.
  • the inner surface of the second thermal shield 32 is provided with a second recess 321
  • the first heat insulating bracket 31 is fixed on the second heat insulating bracket 32
  • a mounting cavity is formed between the first recess 311 and the second recess 321
  • the semiconductor refrigerating chip 1 is located in the mounting hole 312, and the cold end heat conducting seat 34 is disposed in the mounting cavity and is in contact with the cold end surface of the semiconductor refrigerating chip 1, and the hot end heat conducting seat 33 is disposed at the
  • the first heat insulating bracket 31 is connected to the thermal end surface of the semiconductor refrigeration chip 1
  • the first heat pipe 2 is connected to the cold end of heat conducting housing 34.
  • the cold end heat conducting seat 34 and the first heat pipe 2 constitute a cold end heat sink, and the hot end heat conducting seat 33 constitutes a hot end heat sink, and for the hot end heat conducting seat 33, in order to improve heat dissipation efficiency, the hot end heat conducting seat 33 may be A fin structure is disposed, or the hot end heat conducting seat is connected to the second heat pipe, and the second heat pipe is provided with heat dissipating fins.
  • the semiconductor refrigerating chip 1 is embedded in the mounting hole 312 of the first heat insulating bracket 31, and the periphery of the semiconductor refrigerating chip 1 is wrapped by the first heat insulating bracket 31, and An insulated bracket 31 separates the hot end heat conducting seat 33 from the cold end heat conducting seat 34, which can effectively reduce the amount of heat transfer between the hot end heat conducting seat 33 and the cold end heat conducting seat 34, thereby reducing the cold end heat conducting seat 34.
  • the cold-end heat-conducting seat 34 is wrapped in a heat-insulating mounting cavity formed by the first heat insulating bracket 31 and the second heat insulating bracket 32, and the cold-end heat conducting seat 34 conducts the semiconductor.
  • the cooling capacity generated by the refrigerating chip 1 can be quickly transmitted to the required area through the heat pipe 2, thereby reducing the amount of cold loss of the cold-end heat-conducting seat 34, and more effectively reducing the energy consumption and improving the cooling efficiency.
  • the outer surface of the first heat insulating bracket 31 is provided with a heat insulating groove 313 around the mounting hole 312, and the heat insulating groove 313 is provided with heat insulating cotton (not labeled); the heat of the semiconductor refrigeration chip 1
  • the end surface protrudes outward from the outer surface of the first heat insulating bracket 31.
  • the heat insulating groove 313 can be provided with heat insulating cotton on the periphery of the semiconductor refrigeration chip 1 , so that the heat insulating ring formed by the heat insulating cotton can further reduce the cold amount of the cold end surface of the semiconductor refrigeration chip 1 and can be lost.
  • the heat of the hot end face of the semiconductor refrigeration chip 1 is reduced to enter the mounting cavity to minimize the loss of the cooling capacity; and the thermal end face of the semiconductor refrigerating chip 1 is slightly higher than the outer surface of the first heat insulating support 31, on the one hand, the semiconductor refrigeration
  • the hot end face of the chip 1 and the hot end heat conducting seat 33 can be in good contact with heat transfer.
  • the hot end face of the semiconductor refrigerating chip 1 is separated from the mounting hole 312, so that heat can be reduced from the mounting hole 312 into the mounting cavity, or Effectively reduce the loss of cold.
  • the outer surface of the first heat insulating bracket 31 is further provided with a wiring groove 314, and the wiring groove 314 is in communication with the mounting hole 312.
  • the semiconductor refrigeration module of the present embodiment includes a plurality of the semiconductor refrigeration chips 1 according to the cooling capacity of the refrigeration device, and the assembly module 3 is provided with the hot-end heat conduction seat 33 corresponding to the semiconductor refrigeration chip 1. And the cold end heat conducting seat 34, and the first heat insulating bracket 31 is provided with the mounting hole 312 corresponding to the semiconductor cooling chip 1.
  • the cold end heat conducting seat 34 is provided with a avoidance notch 340, the first heat insulating bracket 31,
  • the second heat insulating bracket 32 and the hot end heat conducting seat 33 are respectively provided with through holes (not labeled), and the bolts 35 are bored in the corresponding through holes, and the bolts 35 pass through the avoiding gaps.
  • the area formed by 340 Specifically, in the assembly process, the hot end heat conducting seat 33, the first heat insulating bracket 31, the cold end heat conducting seat 34 and the second heat insulating bracket 32 are sequentially assembled and fixed by bolts 35, and the bolts 35 are passed through.
  • the notch 340 avoids the cold end heat conducting seat 34, so that heat exchange between the hot end heat conducting seat 33 and the cold end heat conducting seat 34 by the bolts 35 can be avoided.
  • the inner surface of the first heat insulating bracket 31 is provided with a first pipe groove 316 and a first pipe groove 317 for mounting the first heat pipe 2, and an edge of the second heat insulating bracket 32 is provided for The notch or through hole 322 or the second pipe groove through which the first heat pipe 2 passes is described. Specifically, the heat pipe 2 passes through the first pipe groove 316 and the first pipe groove 317 and the through hole 322 to pass through the assembly module 3 to facilitate the arrangement of the heat pipe 2 on the inner liner 100 of the refrigeration device.
  • the outer surface of the first heat insulating bracket 31 is provided with a plurality of positioning baffles 315 around the outer side of the mounting hole 312, and the hot end heat conducting seat 33 is disposed in multiple blocks. Between the positioning baffles 315.
  • the hot-end heat-conducting seat 33 can be conveniently positioned by the positioning baffle 315, and the hot-end heat-conducting seat 33 can be accurately contacted with the semiconductor refrigerating chip 1.
  • the cold end heat conducting seat 34 includes a first heat conducting plate 341 and a second heat conducting plate 342 connected together, and the first heat pipe 2 is sandwiched between the first heat conducting plate 341 and the second heat conducting plate Between 342.
  • the inner surface of the first heat conducting plate 341 is provided with a first mounting groove 3411 disposed laterally
  • the inner surface of the second heat conducting plate 342 is provided with a second mounting groove 3421 disposed longitudinally.
  • a lateral flat heat pipe and a longitudinal flat heat pipe disposed in the first mounting groove 3411
  • the longitudinal flat heat pipe is disposed in the second mounting groove 3421
  • the transverse flat heat pipe and the The longitudinal flat heat pipes are in contact with each other.
  • the flat heat pipe can effectively increase the contact area between the heat pipe and the cold end heat conducting seat 34.
  • the flat heat pipe can effectively increase the contact area with the inner tank 100 to provide heat exchange efficiency.
  • the lateral flat heat pipe and the longitudinal flat heat pipe are in contact with each other, so that the heat pipe temperature distribution at different positions is uniform, and the temperature difference is reduced to improve the temperature uniformity.
  • the cold end heat conducting seat is installed by using the mounting cavity formed between the two heat insulating brackets, so that the cold end heat conducting seat and the hot end heat conducting seat are effectively insulated by the heat insulating bracket, thereby greatly reducing the cold end heat conducting seat.
  • the amount of heat exchange between the hot-end heat-conducting seat and the hot-end heat-conducting seat effectively reduces the loss of cooling capacity to improve the cooling efficiency of the refrigeration equipment and reduce energy consumption.
  • the semiconductor refrigeration chip is embedded in the mounting hole of the first heat insulating bracket, ensuring good contact between the cold end surface of the semiconductor refrigeration chip and the cold end heat conducting seat while ensuring good thermal end face and hot end heat conducting seat of the semiconductor refrigeration chip. Contact to ensure rapid heat dissipation and improve reliability.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种多温区半导体制冷设备，包括箱壳(200)和设置在箱壳(200)中的多个内胆(100)，相邻两个内胆(100)之间通过绝热连接件(101)连接，每个内胆(100)形成一制冷间室，其特征在于，每个内胆(100)配置有半导体制冷模组，半导体制冷模组包括组装在一起的半导体制冷芯片(1)、热端散热器和冷端散热器，冷端散热器设置在内胆(100)上，热端散热器设置在箱壳(200)的背板上，相邻两个热端散热器之间通过导风板(300)间隔开，导风板(300)将背板分割成多个独立的散热区域，每个散热区域中设置有散热风扇(400)。该制冷设备可提高制冷设备的制冷效率并降低能耗。

Description

多温区半导体制冷设备 技术领域
本发明涉及制冷设备，尤其涉及一种多温区半导体制冷设备。
 背景技术
目前，随着半导体制冷技术的发展，采用半导体制冷芯片进行制冷的制冷设备被广泛使用，中国专利号2014107111772公开了一种半导体制冷设备，采用半导体制冷芯片产生的冷量实现制冷。而半导体制冷芯片包括释放冷量的冷端和释放热量的热端，在运行过程中，半导体制冷芯片的冷端通过冷端散热器将冷量释放到制冷设备的制冷间室中，而半导体制冷芯片的热端需要通过热端散热器将热量散发至外部。上述专利公开了双温区的制冷设备，每个半导体制冷芯片对应控制一个温区的制冷温度，但是，热端散热器通过热管形成一个整体散热器，虽然一定程度上能够增大散热面积，但在实际过程中发现，由于散热部分热量上升，导致上部的半导体制冷芯片受散热热量影响严重，位于上部的半导体制冷芯片制冷效率较低。
 技术问题
如何设计一种制冷效率高的制冷设备是本发明所要解决的技术问题。
 技术解决方案
本发明提供了一种多温区半导体制冷设备，实现提高制冷设备的制冷效率并降低能耗。
为达到上述技术目的，本发明采用以下技术方案实现：
一种多温区半导体制冷设备，包括箱壳和设置在所述箱壳中的多个内胆，相邻两个所述内胆之间通过绝热连接件连接，每个所述内胆形成一制冷间室，每个所述内胆配置有半导体制冷模组，所述半导体制冷模组包括组装在一起的半导体制冷芯片、热端散热器和冷端散热器，所述冷端散热器设置在所述内胆上，所述热端散热器设置在所述箱壳的背板上，相邻两个所述热端散热器之间通过导风板间隔开，所述导风板将所述背板分割成多个独立的散热区域，每个所述散热区域中设置有散热风扇。
进一步的，所述导风板的纵截面为人字形结构。
进一步的，所述半导体制冷模组包括组装模块，所述组装模块包括第一隔热支架、第二隔热支架、热端导热座和冷端导热座，所述第一隔热支架固定在所述第二隔热支架上，所述第一隔热支架与所述第二隔热支架之间形成安装腔体，所述第一隔热支架开设有连通所述安装腔体的安装孔，所述半导体制冷芯片位于所述安装孔中，所述冷端导热座设置在所述安装腔体中并与所述半导体制冷芯片的冷端面接触，所述热端导热座设置在所述第一隔热支架上并与所述半导体制冷芯片的热端面接触，所述冷端导热座连接有第一热管，所述第一热管贴在对应所述内胆上；所述冷端导热座和所述第一热管构成所述冷端散热器，所述热端导热座构成所述热端散热器。
进一步的，所述热端导热座上设置有散热翅片；或者，所述热端导热座连接有第二热管，所述第二热管上设置有散热翅片。
进一步的，所述第一隔热支架的外表面绕所述安装孔设置有隔热槽，所述隔热槽中设置有隔热棉；所述半导体制冷芯片的热端面向外凸出于所述第一隔热支架的外表面。
进一步的，所述冷端导热座上设置有避让缺口，所述第一隔热支架、所述第二隔热支架和所述热端导热座上分别设置有通孔，螺栓穿设在对应的所述通孔中，所述螺栓穿过所述避让缺口所形成的区域。
进一步的，所述冷端导热座包括连接在一起的第一导热板和第二导热板，所述第一热管夹在所述第一导热板和所述第二导热板之间。
进一步的，所述第一导热板的内表面开设有横向设置的第一安装槽，所述第二导热板的内表面开设有纵向设置的第二安装槽，所述第一热管分为横向扁平热管和纵向扁平热管，所述横向扁平热管设置在所述第一安装槽中，所述纵向扁平热管设置在所述第二安装槽中，并且，所述横向扁平热管与所述纵向扁平热管相互接触。
进一步的，所述第一隔热支架的内表面设置有用于安装所述第一热管的第一管槽，所述第二隔热支架的边缘设置有用于所述第一热管穿过的缺口或贯通孔或第二管槽。
进一步的，所述半导体制冷模组包括多个所述半导体制冷芯片，所述组装模块配置有与所述半导体制冷芯片对应的所述热端导热座和所述冷端导热座，并且，所述第一隔热支架开设有与所述半导体制冷芯片对应所述安装孔。
 有益效果
与现有技术相比，本发明的优点和积极效果是：通过在相邻的两个热端散热器之间设置导风板，利用导风板的间隔导风作用，使得箱壳的背板针对每个热端散热器形成相对独立的散热区域，在运行过程中，位于下方的热端散热器释放的热量上升经由导风板引导至外部而不会进入到上部的散热区域中，从而避免上部内胆配置的半导体制冷模组受下部半导体制冷模组的散热影响而导致散热效率降低，确保不同部位处的半导体制冷模块散热互不影响，实现提高制冷设备的制冷效率并降低能耗。
采用两个隔热支架之间形成的安装腔体来安装冷端导热座，使得冷端导热座与热端导热座被隔热支架有效的隔热间隔开，从而可以大大降低冷端导热座与热端导热座之间产生的热交换量，有效的减少冷量的散失，以提高制冷设备的制冷效率并降低能耗。与此同时，半导体制冷芯片嵌在第一隔热支架的安装孔中，在确保半导体制冷芯片的冷端面与冷端导热座良好接触的同时，确保半导体制冷芯片的热端面与热端导热座良好接触，确保热量快速散发，提高使用可靠性。
 附图说明
图1为本发明多温区半导体制冷设备实施例的结构示意图；
图2为本发明多温区半导体制冷设备实施例中内胆与冷端散热器的组装图；
图3为本发明多温区半导体制冷设备实施例中导风板的结构示意图；
 
图4为本发明半导体制冷模组的结构示意图;
图5为本发明半导体制冷模组中第一隔热支架的正面结构示意图；
图6为本发明半导体制冷模组中第一隔热支架的反面结构示意图；
图7为本发明半导体制冷模组第二隔热支架的正面结构示意图；
图8为本发明半导体制冷模组中第二隔热支架的反面结构示意图；
图9为本发明半导体制冷模组中第一导热板的结构示意图；
图10为本发明半导体制冷模组中第二导热板的结构示意图；
图11为本发明半导体制冷模组的爆炸图。
 本发明的最佳实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1-图3所示，本实施例多温区半导体制冷设备，包括箱壳200和设置在所述箱壳中的多个内胆100，相邻两个所述内胆100之间通过绝热连接件101连接，每个所述内胆100形成一制冷间室，其每个所述内胆100配置有半导体制冷模组，所述半导体制冷模组包括组装在一起的半导体制冷芯片1、热端散热器和冷端散热器，所述冷端散热器设置在所述内胆100上，所述热端散热器设置在所述箱壳200的背板上，相邻两个所述热端散热器之间通过导风板300间隔开，所述导风板300将所述背板分割成多个独立的散热区域，每个所述散热区域中设置有散热风扇400。
具体而言，本实施例多温区半导体制冷设备在背板上设置导风板300来间隔开相邻的两个热端散热器，在实际运行过程中，位于下方的热端散热器释放的热量向上移动并经由导风板300引导输出至外部，导风板300能够有效的阻挡下部的热空气上升进入到上部的热端散热器中产生热影响，从而避免因上部热端散热器受下部热空气影响而出现散热性能下降而导致制冷效率下降的现象发生。在导风板300的作用下，能够有效的减少高位置处的半导体制冷模组受下方热端散热器产生的热影响，保障了多温区的制冷一致性。其中，所述导风板300可以为双弧形、弧形或直板型板体，例如：导风板300的纵截面为人字形结构，即导风板300包括两个背向设置的弧形板形成的双弧形结构。
本实施例多温区半导体制冷设备，通过在相邻的两个热端散热器之间设置导风板，利用导风板的间隔导风作用，使得箱壳的背板针对每个热端散热器形成相对独立的散热区域，在运行过程中，位于下方的热端散热器释放的热量上升经由导风板引导至外部而不会进入到上部的散热区域中，从而避免上部内胆配置的半导体制冷模组受下部半导体制冷模组的散热影响而导致散热效率降低，确保不同部位处的半导体制冷模块散热互不影响，实现提高制冷设备的制冷效率并降低能耗。
进一步的，为了更有效的提高制冷效率，如图1-图11所示，半导体制冷模组包括半导体制冷芯片1和第一热管2，所述半导体制冷芯片1包括释放冷量的冷端面和释放热量的热端面，还包括组装模块3，所述组装模块3包括第一隔热支架31、第二隔热支架32、热端导热座33和冷端导热座34，所述第一隔热支架31的内表面上设置有第一凹槽311，所述第一凹槽311中开设有贯穿所述第一隔热支架31的安装孔312，所述第二隔热支架32的内表面设置有第二凹槽321，所述第一隔热支架31固定在所述第二隔热支架32上，所述第一凹槽311和所述第二凹槽321之间形成安装腔体，所述半导体制冷芯片1位于所述安装孔312中，所述冷端导热座34设置在所述安装腔体中并与所述半导体制冷芯片1的冷端面接触，所述热端导热座33设置在所述第一隔热支架31上并与所述半导体制冷芯片1的热端面接触，所述第一热管2连接所述冷端导热座34。其中，冷端导热座34和第一热管2构成冷端散热器，而热端导热座33构成热端散热器，而针对热端导热座33为了提高散热效率，可以在热端导热座33上设置翅片结构，或者，热端导热座连接有第二热管，所述第二热管上设置有散热翅片。
具体而言，本实施例半导体制冷模组将半导体制冷芯片1嵌入在第一隔热支架31的安装孔312中，半导体制冷芯片1的外围被第一隔热支架31包裹住，并且，通过第一隔热支架31将热端导热座33和冷端导热座34间隔开，可以有效的减少热端导热座33和冷端导热座34之间产生的热传递量，从而减少冷端导热座34的冷量损失，与此同时，冷端导热座34包裹在由第一隔热支架31和第二隔热支架32形成的具有隔温功能的安装腔体中，冷端导热座34传导的半导体制冷芯片1产生的冷量能够最大限度的通过热管2快速的传递到所需要的区域，从而减少冷端导热座34自身冷量散失量，更有效的降低能耗提高制冷效率。
优选的，第一隔热支架31的外表面绕所述安装孔312设置有隔热槽313，所述隔热槽313中设置有隔热棉（未标记）；所述半导体制冷芯片1的热端面向外凸出于所述第一隔热支架31的外表面。具体的，通过隔热槽313能够在半导体制冷芯片1的外围设置隔热棉，从而通过隔热棉形成的保温圈进一步的减少半导体制冷芯片1冷端面的冷量向外散失，同时，也可以减少半导体制冷芯片1热端面的热量进入到安装腔体中，最大限度的减少冷量的损失；而半导体制冷芯片1热端面略高出第一隔热支架31的外表面，一方面使得半导体制冷芯片1热端面与热端导热座33能够良好的接触传热，另一方面，半导体制冷芯片1热端面脱离出安装孔312，能够减少热量从安装孔312传入到安装腔体中，也可以有效的减少冷量的损失。其中，为了便于电路布线连接，第一隔热支架31的外表面还设置有布线槽314，所述布线槽314与所述安装孔312连通。另外，根据制冷设备的制冷量需要，本实施例半导体制冷模组包括多个所述半导体制冷芯片1，所述组装模块3配置有与所述半导体制冷芯片1对应的所述热端导热座33和所述冷端导热座34，并且，所述第一隔热支架31开设有与所述半导体制冷芯片1对应所述安装孔312。
进一步的，为了更有效的减少因组装造成热端导热座33和冷端导热座34之间产生的热传递，冷端导热座34上设置有避让缺口340，所述第一隔热支架31、所述第二隔热支架32和所述热端导热座33上分别设置有通孔（未标记），螺栓35穿设在对应的所述通孔中，所述螺栓35穿过所述避让缺口340所形成的区域。具体的，在组装过程中，通过螺栓35将热端导热座33、第一隔热支架31、冷端导热座34和所述第二隔热支架32依次组装固定在一起，而螺栓35通过避让缺口340避让开冷端导热座34，从而可以避免热端导热座33和冷端导热座34之间通过螺栓35产生热交换。其中，所述第一隔热支架31的内表面设置有用于安装所述第一热管2的第一管槽316和第一管槽317，所述第二隔热支架32的边缘设置有用于所述第一热管2穿过的缺口或贯通孔322或第二管槽。具体的，热管2通过第一管槽316和第一管槽317与贯通孔322配合穿出组装模块3，以方便热管2布置在制冷设备的内胆100上。另外，为了便于快速定位安装热端导热座33，第一隔热支架31的外表面绕所述安装孔312的外侧设置有多块定位挡板315，所述热端导热座33设置在多块所述定位挡板315之间。在组装时，通过定位挡板315能够方便的定位安装热端导热座33，并确保热端导热座33能够准确的与半导体制冷芯片1接触良好。
又进一步的，所述冷端导热座34包括连接在一起的第一导热板341和第二导热板342，所述第一热管2夹在所述第一导热板341和所述第二导热板342之间。具体的，第一导热板341的内表面开设有横向设置的第一安装槽3411，所述第二导热板342的内表面开设有纵向设置的第二安装槽3421，所述第一热管2分为横向扁平热管和纵向扁平热管，所述横向扁平热管设置在所述第一安装槽3411中，所述纵向扁平热管设置在所述第二安装槽3421中，并且，所述横向扁平热管与所述纵向扁平热管相互接触。具体的，采用扁平热管能够有效的增大热管与冷端导热座34的接触面积，同时，扁平热管还能够有效的增大与内胆100之间的接触面积，提供热交换效率。并且，横向扁平热管与所述纵向扁平热管相互接触，使得不同位置处的热管温度分布均匀，缩小温差提高均温性。
通过采用两个隔热支架之间形成的安装腔体来安装冷端导热座，使得冷端导热座与热端导热座被隔热支架有效的隔热间隔开，从而可以大大降低冷端导热座与热端导热座之间产生的热交换量，有效的减少冷量的散失，以提高制冷设备的制冷效率并降低能耗。与此同时，半导体制冷芯片嵌在第一隔热支架的安装孔中，在确保半导体制冷芯片的冷端面与冷端导热座良好接触的同时，确保半导体制冷芯片的热端面与热端导热座良好接触，确保热量快速散发，提高使用可靠性。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明个实施例技术方案的精神和范围。

Claims (1)

  1. 一种多温区半导体制冷设备，包括箱壳和设置在所述箱壳中的多个内胆，相邻两个所述内胆之间通过绝热连接件连接，每个所述内胆形成一制冷间室，其特征在于，每个所述内胆配置有半导体制冷模组，所述半导体制冷模组包括组装在一起的半导体制冷芯片、热端散热器和冷端散热器，所述冷端散热器设置在所述内胆上，所述热端散热器设置在所述箱壳的背板上，相邻两个所述热端散热器之间通过导风板间隔开，所述导风板将所述背板分割成多个独立的散热区域，每个所述散热区域中设置有散热风扇。
    2. 根据权利要求1所述的多温区半导体制冷设备，其特征在于，所述导风板的纵截面为人字形结构。
    3. 根据权利要求1所述的多温区半导体制冷设备，其特征在于，所述半导体制冷模组包括组装模块，所述组装模块包括第一隔热支架、第二隔热支架、热端导热座和冷端导热座，所述第一隔热支架固定在所述第二隔热支架上，所述第一隔热支架与所述第二隔热支架之间形成安装腔体，所述第一隔热支架开设有连通所述安装腔体的安装孔，所述半导体制冷芯片位于所述安装孔中，所述冷端导热座设置在所述安装腔体中并与所述半导体制冷芯片的冷端面接触，所述热端导热座设置在所述第一隔热支架上并与所述半导体制冷芯片的热端面接触，所述冷端导热座连接有第一热管，所述第一热管贴在对应所述内胆上；所述冷端导热座和所述第一热管构成所述冷端散热器，所述热端导热座构成所述热端散热器。
    4. 根据权利要求3所述的多温区半导体制冷设备，其特征在于，所述热端导热座上设置有散热翅片；或者，所述热端导热座连接有第二热管，所述第二热管上设置有散热翅片。
    5. 根据权利要求3所述的多温区半导体制冷设备，其特征在于，所述第一隔热支架的外表面绕所述安装孔设置有隔热槽，所述隔热槽中设置有隔热棉；所述半导体制冷芯片的热端面向外凸出于所述第一隔热支架的外表面。
    6. 根据权利要求3所述的多温区半导体制冷设备，其特征在于，所述冷端导热座上设置有避让缺口，所述第一隔热支架、所述第二隔热支架和所述热端导热座上分别设置有通孔，螺栓穿设在对应的所述通孔中，所述螺栓穿过所述避让缺口所形成的区域。
    7. 根据权利要求3所述的多温区半导体制冷设备，其特征在于，所述冷端导热座包括连接在一起的第一导热板和第二导热板，所述第一热管夹在所述第一导热板和所述第二导热板之间。
    8. 根据权利要求7所述的多温区半导体制冷设备，其特征在于，所述第一导热板的内表面开设有横向设置的第一安装槽，所述第二导热板的内表面开设有纵向设置的第二安装槽，所述第一热管分为横向扁平热管和纵向扁平热管，所述横向扁平热管设置在所述第一安装槽中，所述纵向扁平热管设置在所述第二安装槽中，并且，所述横向扁平热管与所述纵向扁平热管相互接触。
    9. 根据权利要求3所述的多温区半导体制冷设备，其特征在于，所述第一隔热支架的内表面设置有用于安装所述第一热管的第一管槽，所述第二隔热支架的边缘设置有用于所述第一热管穿过的缺口或贯通孔或第二管槽。
    10. 根据权利要求3所述的多温区半导体制冷设备，其特征在于，所述半导体制冷模组包括多个所述半导体制冷芯片，所述组装模块配置有与所述半导体制冷芯片对应的所述热端导热座和所述冷端导热座，并且，所述第一隔热支架开设有与所述半导体制冷芯片对应所述安装孔。
PCT/CN2018/083814 2017-04-28 2018-04-19 多温区半导体制冷设备 WO2018196680A1 (zh)

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