WO2016192298A1 - 传冷装置及具有该传冷装置的半导体制冷箱 - Google Patents

传冷装置及具有该传冷装置的半导体制冷箱 Download PDF

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Publication number
WO2016192298A1
WO2016192298A1 PCT/CN2015/093661 CN2015093661W WO2016192298A1 WO 2016192298 A1 WO2016192298 A1 WO 2016192298A1 CN 2015093661 W CN2015093661 W CN 2015093661W WO 2016192298 A1 WO2016192298 A1 WO 2016192298A1
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Prior art keywords
heat
semiconductor refrigeration
cooling device
cooling
heat pipes
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PCT/CN2015/093661
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English (en)
French (fr)
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裴玉哲
王定远
高希成
刘杰
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青岛海尔智能技术研发有限公司
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Publication of WO2016192298A1 publication Critical patent/WO2016192298A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors

Definitions

  • the invention relates to the technical field of refrigerators, and in particular to a cooling device and a semiconductor refrigeration box having the same.
  • thermoelectric refrigerators also known as thermoelectric refrigerators.
  • the utility model utilizes a semiconductor refrigeration sheet to realize refrigeration through heat pipe heat dissipation and conduction technology and automatic variable pressure flow control technology, and does not require refrigeration working medium and mechanical moving parts, and solves the application problems of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical vibration.
  • the existing semiconductor refrigerators generally adopt a small-capacity single-temperature zone due to heat exchange, noise, cost and other factors, and the application is mainly a special small refrigeration box such as a vehicle or a medical device.
  • the cooling device transmits only the cooling amount of the semiconductor refrigerating sheet to the storage compartment. The inventors of the present application found that the temperature distribution in the storage compartment of the conventional semiconductor refrigerating refrigerator is not uniform enough.
  • An object of the first aspect of the present invention is to overcome at least one of the deficiencies of the prior art semiconductor refrigerators, and to provide a cooling device for a semiconductor refrigeration box capable of uniformizing a temperature distribution in a storage space of a semiconductor refrigeration box.
  • a cooling device for a semiconductor refrigeration box comprising:
  • each of the heat pipes having an upper section and a lower section at a distance from the upper section, each upper section of the heat pipe being configured to directly or indirectly be associated with a cold source Thermally connecting to absorb the cooling capacity of the cold source and transfer it out, and to the lower section of each of the heat pipes;
  • An upper fin set that is thermally or directly or indirectly connected to an upper section of each of the heat pipes.
  • each of the heat pipes is a sintered heat pipe.
  • the cooling device further comprises: a cooling substrate for thermal contact with the cold source; and an upper portion of each of the heat pipes abuts or is embedded in the cooling substrate.
  • a plurality of fins in the upper fin group are disposed in parallel with respect to the guide A vertical side of the cold substrate.
  • the cooling device further comprises: an upper fan configured to perform forced convection cooling on the cooling amount on the upper fin group.
  • the cooling device further comprises: a lower fin set thermally or directly or indirectly connected to a lower section of each of the heat pipes.
  • a plurality of fins in the lower fin set are mounted in parallel to the lower section of the one or more heat pipes.
  • the cooling device further includes: a lower fan configured to perform forced convection cooling on the cooling amount on the lower fin group.
  • the number of the heat pipes is plural, and the plurality of heat pipes extend in parallel in a vertical direction.
  • a semiconductor refrigeration box comprising:
  • a cabinet having one or more storage spaces defined therein;
  • One or more semiconductor refrigeration systems each of which includes one or more semiconductor refrigeration fins thereof, and supplies a cold amount of cold end of each semiconductor refrigeration fin in the semiconductor refrigeration system to a storage space Cooling device;
  • the cooling device of each of the semiconductor refrigeration systems is any of the above-described cooling devices.
  • the cooling device and the semiconductor refrigeration box of the present invention have an upper fin group thermally connected to an upper portion of each heat pipe, so that the cooling capacity of the cold source can be simultaneously transmitted into the storage space at the upper end and the lower end of each heat pipe. In order to make the temperature distribution in the storage space uniform.
  • cooling device and the semiconductor refrigeration box of the present invention further have a lower fin group thermally connected to the lower portion of each heat pipe, the temperature distribution in the storage space is further made uniform.
  • the semiconductor refrigeration box of the present invention has a plurality of storage spaces and a plurality of semiconductor refrigeration systems, the storage capacity of the semiconductor refrigeration box is significantly improved, and the temperatures in each storage space can be made equal or unequal, Thereby, there are a plurality of temperature zones in the semiconductor refrigeration box.
  • FIG. 1 is a schematic front view of a cooling device according to an embodiment of the present invention.
  • FIG. 2 is a schematic right side view of a cooling device according to an embodiment of the present invention.
  • FIG. 3 is a schematic front view of a semiconductor refrigeration box in accordance with one embodiment of the present invention.
  • FIG. 4 is a schematic right side view of a semiconductor refrigeration box in accordance with one embodiment of the present invention.
  • Figure 5 is a schematic rear elevational view of a semiconductor refrigeration box in accordance with one embodiment of the present invention.
  • Figure 6 is a schematic right side view of a semiconductor refrigeration box in accordance with one embodiment of the present invention.
  • Figure 7 is a schematic rear view of a semiconductor refrigeration box in accordance with one embodiment of the present invention.
  • the cooling device 32 for the semiconductor refrigeration box 100 provided by the embodiment of the present invention may include one or more heat pipes 322 for transferring the cooling capacity of the cold source.
  • each heat pipe 322 can have an upper section and a lower section at a distance from the upper section.
  • the upper section of each heat pipe 322 is configured to be thermally coupled, directly or indirectly, to a source of cold to absorb the cold source and transfer it out and to the lower section of each heat pipe 322.
  • the cooling device 32 of the embodiment of the present invention may further include an upper fin group 323 that is directly or indirectly thermally coupled to an upper portion of each heat pipe 322 for transfer into the storage space 21 of the semiconductor refrigeration box 100. Cooling capacity.
  • the upper fin group 323 of the cooling device 32 and the lower portion of each heat pipe 322 can be transferred into a storage space 21 of the semiconductor refrigeration box 100. Cooling capacity. Due to the multi-directionality of the heat transfer of the heat pipe 322, when the cold source stops providing the cooling capacity, the cooling device 32 can also utilize each heat pipe 322 to evenly distribute the indoor temperature of each storage compartment of the semiconductor refrigeration box 100, preventing the cold air from being completely present. In the lower portion of the storage space 21, all of the hot air is in the upper portion of the storage space 21, causing a large temperature difference between the upper and lower chambers of the storage compartment.
  • each of the heat pipes 322 may be a sintered heat pipe, and the internal cavity is filled with a refrigerant such as carbon dioxide or a superconducting medium, and a sintered metal powder structure may be attached to the inner wall to improve the cooling efficiency.
  • the number of the heat pipes 322 is plural, and the plurality of heat pipes 322 extend in parallel in the vertical direction.
  • the heat pipes 322 may be three, and each of the heat pipes 322 may have a length of 60 cm and a diameter of 8 mm.
  • the cooling device 32 may further include a lower fin set 324 that is thermally coupled directly or indirectly to the lower section of each heat pipe 322 to further increase the cooling efficiency.
  • the cooling device 32 in order to facilitate thermal connection with a cold source, in some embodiments of the present invention, the cooling device 32 may Further included is a cooling substrate 321 for thermal contact with a cold source.
  • the upper section of each heat pipe 322 abuts or is embedded in the cooling substrate 321 .
  • an upper section of each heat pipe 322 is embedded in the cooling substrate 321 .
  • the cold source may be one or more semiconductor refrigerating sheets 31, one of which has a vertical side contact heat exchange with the cold end of the one or more semiconductor refrigerating sheets 31.
  • the contact surface of the cold-conducting substrate 321 and the semiconductor refrigerating sheet 31 may be coated with a thermal grease.
  • the cooling substrate 321 may be a thermally conductive block made of an aluminum material.
  • the plurality of fins in the upper fin group 323 of the cooling device 32 are disposed in parallel with each other on one vertical side of the cooling substrate 321 .
  • the other vertical side of the cooling substrate 321 opposite the vertical side can be used to exchange heat with the cold source.
  • the plurality of fins in the lower fin set 324 are mounted in parallel to the lower section of the one or more heat pipes 322 in parallel so that each fin of the lower fin set 324 is in contact with each heat pipe 322 heat.
  • the cooling device 32 in the embodiment of the present invention further includes two fans, an upper fan 325 and a lower fan 326.
  • the upper fan 325 can be configured to forcibly convectively cool the amount of cooling on the upper fin set 323.
  • the lower fan 326 can be configured to perform forced convection cooling of the amount of cooling on the lower fin set 324.
  • both the upper fan 325 and the lower fan 326 may be axial fans mounted on the upper fin set 323 and the lower fin set 324, respectively.
  • FIG. 3 is a schematic front view of a semiconductor refrigeration box 100 in accordance with one embodiment of the present invention.
  • an embodiment of the present invention further provides a semiconductor refrigeration box 100, which generally includes a case 20 and a semiconductor refrigeration system 30.
  • One or more storage spaces 21 are defined within the housing 20.
  • the number of semiconductor refrigeration systems 30 may be one or more, each semiconductor refrigeration system 30 including its own one or more semiconductor refrigeration fins 31, and the cold end of each of the semiconductor refrigeration fins 31 within the semiconductor refrigeration system 30.
  • the cooling device of each semiconductor refrigeration system 30 is the cooling device 32 of any of the above embodiments.
  • each semiconductor refrigeration system 30 can be independently cooled to make the corresponding storage space 21 within a predetermined range of temperature range, so that the temperatures in the plurality of storage spaces 21 are equal or unequal, That is, the plurality of semiconductor refrigeration systems 30 may form a plurality of temperature zones in the semiconductor refrigeration box 100 to store articles and the like corresponding to the respective temperature zones.
  • a plurality of storage spaces 21 are juxtaposed in a lateral direction.
  • a plurality of semiconductor refrigeration systems 30 may be juxtaposed in the lateral direction at the rear of the casing 20 so that each half The cooling device 32 of the conductor refrigeration system 30 supplies the cold amount of the cold end of each of the semiconductor refrigeration fins 31 in the semiconductor refrigeration system 30 to the storage space 21 in front of the semiconductor refrigeration system 30.
  • FIG. 4 is a schematic right side view of a semiconductor refrigeration box 100 in accordance with one embodiment of the present invention.
  • mounting holes may be formed in the rear wall of each storage space 21 to mount one or more semiconductor refrigeration sheets 31 of a corresponding semiconductor refrigeration system 30.
  • each of the cooling devices 32 is disposed in a storage space 21.
  • a duct cover may be disposed in each of the storage spaces 21 such that the air duct cover forms a duct with the rear wall of the storage space 21, and the cooling device 32 is installable. In the air duct.
  • FIG. 5 is a schematic rear view of a semiconductor refrigeration box 100 in accordance with one embodiment of the present invention.
  • the semiconductor refrigeration cabinet 100 of the embodiment of the present invention may further include a first heat sink 40 configured to dissipate heat from the hot end of each of the semiconductor refrigeration fins 31 in each semiconductor refrigeration system 30 to the surrounding environment.
  • the first heat sink 40 includes a plurality of first heat conductive substrates 41 and a plurality of first heat dissipation heat pipes 42 extending in the horizontal direction.
  • the front surface of each of the first thermally conductive substrates 41 is thermally coupled to the hot end of each of the semiconductor refrigerating sheets 31 in a semiconductor refrigeration system 30 to absorb heat.
  • the front surface of each of the first thermally conductive substrates 41 may be in contact with the hot end of each of the semiconductor refrigerating sheets 31 in a semiconductor refrigeration system 30.
  • the contact surface of each of the first thermal conductive substrates 41 and the semiconductor refrigerating sheet 31 may be coated with thermal grease.
  • each of the first heat conductive substrates 41 may be a heat conductive block made of an aluminum material.
  • Each of the first heat dissipation heat pipes 42 passes through the plurality of first heat conduction substrates 41 to transfer heat absorbed in each of the first heat conduction substrates 41.
  • each of the first heat dissipation heat pipes 42 may be a sintered heat pipe, and the inner cavity thereof may be filled with deionized water or the like, and a sintered metal powder structure may be attached to the inner wall to improve heat dissipation efficiency.
  • Each of the first heat dissipation heat pipes 42 may be a long heat pipe having a diameter of 10 mm; and the number of the first heat dissipation heat pipes 42 may be 3 to 8, preferably 4 or 5.
  • the first heat dissipation fin group 43 is disposed on each of the sections of the first heat dissipation heat pipe 42 located between each of the two adjacent first heat conduction substrates 41. And/or a second heat dissipating fin group 44 is disposed on the end sections of the plurality of first heat dissipating heat pipes 42 on both sides of the plurality of first heat conducting base bodies 41.
  • the first heat radiating fin group 43 and the second heat radiating fin group 44 each have a plurality of fins disposed at correspondingly spaced intervals.
  • Each of the fins has a through-hole for inserting the first heat-dissipating heat pipe 42 to mount the fins to each of the first heat-dissipating heat pipes 42.
  • Each of the first heat radiating fin group 43 and the second heat radiating fin group 44 is provided with a plurality of through holes, such as circular through holes, for allowing airflow therethrough to promote better air circulation heat dissipation.
  • the spacing between each two adjacent fins in each of the first heat dissipating fin sets 43 is less than between each of the two adjacent fins in each of the second heat dissipating fin sets 44. Pitch.
  • the spacing between each two adjacent fins in each of the first heat dissipating fin sets 43 is 1.5 mm to 5 mm; the spacing between each two adjacent fins in each of the second heat dissipating fin sets 44 5mm to 20mm.
  • the first heat sink 40 may further include at least one first heat dissipation fan 45, each of the first heat dissipation fans 45 configured to perform forced convection heat dissipation on the heat of the first heat dissipation fin group 43.
  • Each of the first heat dissipation fans 45 may be an axial flow fan disposed on a first heat dissipation fin group 43.
  • the casing 20 is disposed in a double-temperature zone structure in a left-right division manner, and the space sizes of the two left and right storage spaces 21 may be the same or different.
  • the working mode of the first heat dissipating device 40 may be: when the storage space 21 of the semiconductor refrigerating box 100 needs to be accelerated, that is, the semiconductor refrigerating sheet 31 needs to be accelerated to dissipate heat for high-power heat dissipation, each of the first cooling fans 45
  • each of the first heat dissipating fans 45 can be turned off, so that the first heat dissipating fin group 43 and the second heat dissipating fin group 44 are both Natural heat dissipation is performed, and noise of the semiconductor refrigeration box 100 can be reduced.
  • FIG. 6 is a schematic right side view of a semiconductor refrigeration box 100 in accordance with one embodiment of the present invention
  • FIG. 7 is a schematic rear view of a semiconductor refrigeration box 100 in accordance with one embodiment of the present invention.
  • the semiconductor refrigeration box 100 of the embodiment of the present invention may further include a plurality of second heat sinks 50 each configured to dissipate heat from the hot end of each of the semiconductor refrigeration fins 31 in a semiconductor refrigeration system 30 to the surrounding environment.
  • a plurality of second heat sinks 50 can be used in place of the first heat sink 40 for heat dissipation of the plurality of semiconductor refrigeration systems 30.
  • the plurality of second heat sinks 50 can also be used for heat dissipation of the plurality of semiconductor refrigeration systems 30 simultaneously with the first heat sinks 40.
  • each of the second heat dissipating devices 50 may include a second thermal conductive substrate 51 and a plurality of second heat dissipating heats.
  • each of the second thermal conductive substrate 51 of each of the second heat sinks 50 is thermally coupled to the hot end of each of the semiconductor refrigerating sheets 31 in a semiconductor refrigeration system 30 to absorb heat.
  • the front surface of each of the second thermally conductive substrates 51 is in heat exchange contact with the hot end of each of the semiconductor refrigerating sheets 31 in the semiconductor refrigeration system 30.
  • each of the second thermally conductive bases 51 may be a thermally conductive block made of an aluminum material.
  • each of the second heat dissipation heat pipes 52 abuts or is embedded in the second heat conduction substrate 51 to exchange heat with the second heat conduction substrate 51.
  • Each of the second heat dissipation heat pipes 52 may be a sintered heat pipe, and the inner cavity thereof may be filled with deionized water or the like, and a sintered metal powder structure may be attached to the inner wall to improve heat dissipation efficiency.
  • the number of the second heat dissipation heat pipes 52 may be 3 to 4, and each of the second heat dissipation heat pipes 52 has a length of 35 cm and a diameter of 10 mm.
  • the third heat dissipating fin group 53 may have a plurality of fins disposed correspondingly in parallel, and disposed on the plurality of second heat dissipating heat pipes 52.
  • the second heat dissipating fan 54 may be an axial fan, and is mounted on the third heat dissipating fin group 53 and configured to perform forced convection heat dissipation on heat transferred from the plurality of second heat dissipating heat pipes 52 to the third heat dissipating fin group 53.
  • the semiconductor refrigeration box 100 further includes a closure device for closing the plurality of storage spaces 21 from the front side of the housing 20.
  • the closing device may be a first door body rotatably mounted to the casing 20 for closing the plurality of storage spaces 21 from the front side of the casing 20.
  • the closure device may also include a plurality of second door bodies, each of which is rotatably mounted to the casing 20 for closing the storage space 21 from the front side of a storage space 21.
  • the closing device may also be a folding door body and is mounted on the box body 20.
  • the folding door body may have a plurality of door body units, each door body unit for closing the storage space 21 from the front side of one storage space 21, and each two adjacent door body units are pivotally connected.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

一种传冷装置及具有该传冷装置的半导体制冷箱。传冷装置（32）包括一根或多根热管（322），热管（322）具有上部区段和下部区段，上部区段配置成直接或间接地与冷源热连接，以吸收冷源的冷量并传递到热管（322）的下部区域；和上部翅片组（323），其与热管（322）的上部区段直接或间接地热连接。

Description

传冷装置及具有该传冷装置的半导体制冷箱 技术领域
本发明涉及冰箱技术领域，特别是涉及一种传冷装置及具有该传冷装置的半导体制冷箱。
背景技术
半导体制冷冰箱，也称之为热电冰箱。其利用半导体制冷片通过热管散热及传导技术和自动变压变流控制技术实现制冷，无需制冷工质和机械运动部件，解决了介质污染和机械振动等传统机械制冷冰箱的应用问题。然而，现有的半导体冰箱由于受到冷热端换热、噪音、成本等因素，一般采用小容量单温区，应用中也主要是车载、医疗等特殊小型制冷箱。而且，现有的半导体制冷冰箱中，传冷装置仅仅将半导体制冷片的冷量传递到储物间室内。本申请的发明人发现，现有半导体制冷冰箱的储物间室内的温度分布不够均匀。
发明内容
本发明第一方面的一个目的旨在克服现有的半导体冰箱的至少一个缺陷，提供一种用于半导体制冷箱的传冷装置，其能够使半导体制冷箱的储物空间内的温度分布均匀。
本发明第二方面的一个目的是要提供一种具有上述传冷装置的半导体制冷箱。
根据本发明的第一方面，本发明提供了一种用于半导体制冷箱的传冷装置，该传冷装置包括：
一根或多根热管，每根所述热管具有上部区段和与所述上部区段相距一距离的下部区段，每根所述热管的上部区段配置成直接或间接地与一冷源热连接，以吸收所述冷源的冷量并传递出，且传递到每根所述热管的下部区段；和
上部翅片组，其与每根所述热管的上部区段直接或间接地热连接。
可选地，每根所述热管为烧结热管。
可选地，所述传冷装置进一步包括：导冷基体，其用于与所述冷源热接触；且每根所述热管的上部区段抵靠于或嵌入所述导冷基体中。
可选地，所述上部翅片组中的多个翅片相对应平行间隔地设置于所述导 冷基体的一个竖向侧面。
可选地，所述传冷装置进一步包括：上部风机，配置成对所述上部翅片组上的冷量进行强制对流散冷。
可选地，所述传冷装置进一步包括：下部翅片组，其与每根所述热管的下部区段直接或间接地热连接。
可选地，所述下部翅片组中的多个翅片相对应平行间隔地安装于所述一根或多根热管的下部区段。
可选地，所述传冷装置进一步包括：下部风机，配置成对所述下部翅片组上的冷量进行强制对流散冷。
可选地，所述热管的数量为多根，多根所述热管沿竖直方向平行延伸。
根据本发明的第二方面，本发明提供了一种半导体制冷箱，其包括：
箱体，其内限定有一个或多个储物空间；和
一个或多个半导体制冷系统，每个所述半导体制冷系统包括其自身的一个或多个半导体制冷片，以及将该半导体制冷系统内每个半导体制冷片冷端的冷量供应到一个储物空间的传冷装置；且
每个所述半导体制冷系统的传冷装置为上述任一种传冷装置。
本发明的传冷装置及半导体制冷箱由于具有与每根热管的上部区段热连接的上部翅片组，可使冷源的冷量在每根热管的上端和下端同时向储物空间内传递，以使储物空间内的温度分布均匀。
进一步地，由于本发明的传冷装置及半导体制冷箱还具有与每根热管的下部区段热连接的下部翅片组，进一步使储物空间内的温度分布均匀。
进一步地，由于本发明的半导体制冷箱具有多个储物空间和多个半导体制冷系统，显著提高了半导体制冷箱的储物容量，而且能够使每个储物空间内的温度相等或不等，从而使半导体制冷箱内具有多个温区。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的传冷装置的示意性主视图；
图2是根据本发明一个实施例的传冷装置的示意性右视图；
图3是根据本发明一个实施例的半导体制冷箱的示意性主视图；
图4是根据本发明一个实施例的半导体制冷箱的示意性右视图；
图5是根据本发明一个实施例的半导体制冷箱的示意性后视图；
图6是根据本发明一个实施例的半导体制冷箱的示意性右视图；
图7是根据本发明一个实施例的半导体制冷箱的示意性后视图。
具体实施方式
图1是根据本发明一个实施例的传冷装置32的示意性主视图。如图1所示，本发明实施例提供的用于半导体制冷箱100的传冷装置32可包括一根或多根热管322，用于传递冷源的冷量。具体地，每根热管322可具有上部区段和与上部区段相距一距离的下部区段。每根热管322的上部区段配置成直接或间接地与一冷源热连接，以吸收冷源的冷量并传递出，且传递到每根热管322的下部区段。特别地，本发明实施例的传冷装置32还可包括上部翅片组323，其与每根热管322的上部区段直接或间接地热连接，以向半导体制冷箱100的储物空间21内传递冷量。
在本发明实施例中，当冷源提供冷量时，该传冷装置32的上部翅片组323和每根热管322的下部区段均可向半导体制冷箱100的一个储物空间21内传递冷量。由于热管322传热的多方向性，当冷源停止提供冷量时，传冷装置32也可利用每根热管322使半导体制冷箱100的各个储物间室内温度分布均匀，防止冷空气全部处于该储物空间21的下部，热空气全部处于该储物空间21的上部，造成该储物间室内的上下温差较大。
在本发明实施例中，每根热管322可为烧结热管，其内部空腔内灌注有二氧化碳、超导介质等制冷剂，其内壁上可附着有烧结的金属粉末结构，以提高传冷效率。热管322的数量为多根，多根热管322沿竖直方向平行延伸。例如，热管322可为3根，每根热管322的长度可为60cm，直径为8mm。
在本发明的一些实施例中，传冷装置32可进一步包括下部翅片组324，其与每根热管322的下部区段直接或间接地热连接，以进一步提高传冷效率。
图2是根据本发明一个实施例的传冷装置32的示意性右视图。如图2所示，为了便于与冷源热连接，在本发明的一些实施例中，传冷装置32可 进一步包括导冷基体321，其用于与冷源热接触。每根热管322的上部区段抵靠于或嵌入导冷基体321中。例如，每根热管322的上部区段嵌入该导冷基体321中。冷源可为一个或多个半导体制冷片31，该导冷基体321的一个竖向侧面与一个或多个半导体制冷片31的冷端接触换热。进一步地，导冷基体321与半导体制冷片31的接触面可涂抹导热硅脂。优选地，导冷基体321可为由铝材料制成的导热块。
在本发明实施例一些实施例中，该传冷装置32的上部翅片组323中的多个翅片相对应平行间隔地设置于导冷基体321的一个竖向侧面。而且，导冷基体321的与该竖向侧面相对的另一竖向侧面可用于与冷源接触换热。下部翅片组324中的多个翅片相对应平行间隔地安装于一根或多根热管322的下部区段，以使下部翅片组324中的每个翅片与每根热管322接触换热。
为了提高散冷效率，本发明实施例中的传冷装置32还包括两个风机，分别为上部风机325和下部风机326。上部风机325可配置成对上部翅片组323上的冷量进行强制对流散冷。下部风机326可配置成对下部翅片组324上的冷量进行强制对流散冷。在该实施例中，上部风机325和下部风机326均可为轴流风机，分别安装于上部翅片组323和下部翅片组324上。
图3是根据本发明一个实施例的半导体制冷箱100的示意性主视图。如图3所示，本发明实施例还提供了一种半导体制冷箱100，该半导体制冷箱100一般性可包括箱体20和半导体制冷系统30。该箱体20内限定有一个或多个储物空间21。半导体制冷系统30的数量可为一个或多个，每个半导体制冷系统30包括其自身的一个或多个半导体制冷片31，以及将该半导体制冷系统30内每个半导体制冷片31冷端的冷量供应到一个储物空间21的传冷装置。特别地，每个半导体制冷系统30的传冷装置为上述任一实施例中的传冷装置32。
在本发明的一些实施例中，储物空间21可为多个，半导体制冷系统30的数量也为多个。在本发明实施例中，每个半导体制冷系统30可独立制冷，以使相应的储物空间21处于一预定范围温度范围内，从而使多个储物空间21内的温度相等或不等，也就是说，多个半导体制冷系统30可使该半导体制冷箱100内形成多个温区，以保存与各个温区相对应的物品等。
在本发明的一些实施例中，多个储物空间21沿横向方向并列设置。多个半导体制冷系统30可沿横向方向并列设置于箱体20的后部，以使每个半 导体制冷系统30的传冷装置32将该半导体制冷系统30内每个半导体制冷片31冷端的冷量供应到该半导体制冷系统30前方的储物空间21。
图4是根据本发明一个实施例的半导体制冷箱100的示意性右视图。如图4所示，每个储物空间21的后壁上可开设有安装孔，以安装一个相应的半导体制冷系统30的一个或多个半导体制冷片31。则每个传冷装置32设置于一个储物空间21内。在一些进一步的实施方式中，可在每个储物空间21内设置一风道盖板，以使风道盖板与该储物空间21的后壁形成一风道，传冷装置32可安装于该风道中。
图5是根据本发明一个实施例的半导体制冷箱100的示意性后视图。本发明实施例的半导体制冷箱100可进一步包括第一散热装置40，配置成将每个半导体制冷系统30内每个半导体制冷片31热端的热量散发到周围环境。
具体地，第一散热装置40包括多个第一导热基体41和沿水平方向延伸的多根第一散热热管42。每个第一导热基体41的前表面与一个半导体制冷系统30内每个半导体制冷片31的热端热连接，以吸收热量。例如，每个第一导热基体41的前表面可与一个半导体制冷系统30内每个半导体制冷片31的热端接触抵靠。进一步地，每个第一导热基体41与半导体制冷片31的接触面可涂抹导热硅脂。优选地，每个第一导热基体41可为由铝材料制成的导热块。
每根第一散热热管42均穿过多个第一导热基体41，以将每个第一导热基体41中吸收的热量传递出。在本发明实施例中，每根第一散热热管42可为烧结热管，其内部空腔内可灌注有去离子水等，其内壁上可附着有烧结的金属粉末结构，以提高散热效率。每根第一散热热管42可为直径为10mm的长热管；且第一散热热管42的数量可为3至8根，优选为4根、5根。
为了进一步提高散热效率，多根第一散热热管42的位于每两个相邻的第一导热基体41之间的区段上均设置有第一散热翅片组43。和/或，多根第一散热热管42的位于多个第一导热基体41的两侧的端部区段上均设置有第二散热翅片组44。第一散热翅片组43和第二散热翅片组44均具有多个相对应平行间隔设置的翅片。每个翅片上具有用于穿设第一散热热管42的穿管孔，以使翅片安装于每根第一散热热管42。第一散热翅片组43和第二散热翅片组44的每个翅片上均开设有允许气流通过的多个通孔，例如圆形通孔，以促进更好的空气流通散热。
在本发明的一些实施例中，每个第一散热翅片组43中每两个相邻翅片之间的间距小于每个第二散热翅片组44中每两个相邻翅片之间的间距。例如，每个第一散热翅片组43中每两个相邻翅片之间的间距为1.5mm至5mm；每个第二散热翅片组44中每两个相邻翅片之间的间距5mm至20mm。
在本发明的一些实施例中，第一散热装置40还可包括至少一个第一散热风机45，每个第一散热风机45配置成对一个第一散热翅片组43上的热量进行强制对流散热。每个第一散热风机45可为轴流风机，设置于一个第一散热翅片组43上。
在本发明的一些实施例中，储物空间21可为两个，箱体20内按照左右分割方式设置为双温区结构，左右两个储物空间21的空间大小可相同或不同。则半导体制冷系统30为两个，第一散热装置40的第一导热基体41的数量为两个。由于第一导热基体41的数量为两个，且第一散热翅片组43和第一散热风机45均可为一个，第二散热翅片组44为两个，从而使第一散热装置40的外形像一个张开翅膀的蝴蝶。第一散热装置40工作模式可为：当半导体制冷箱100的储物空间21需要加快制冷，即半导体制冷片31需要加快散热，以用于大功率的热量散热时，每个第一散热风机45可开启，进行自然散热的具有大翅片间距的第二散热翅片组44、进行第一散热风机45强制散热的具有小翅片间距的第一散热翅片组43共同作用。当半导体制冷箱100的储物空间21需要稳定制冷，即半导体制冷片31需要稳定散热时，可关闭各个第一散热风机45，使第一散热翅片组43和第二散热翅片组44均进行自然散热，且能够降低半导体制冷箱100的噪音。
图6是根据本发明一个实施例的半导体制冷箱100的示意性右视图，图7是根据本发明一个实施例的半导体制冷箱100的示意性后视图。本发明实施例的半导体制冷箱100还可包括多个第二散热装置50，每个第二散热装置50配置成将一个半导体制冷系统30内每个半导体制冷片31热端的热量散发到周围环境。例如，在一些实施方式中，多个第二散热装置50可代替第一散热装置40用于多个半导体制冷系统30的散热。在一些替代性实施例方式中，多个第二散热装置50也可与第一散热装置40同时用于多个半导体制冷系统30的散热。
在本发明的一些实施例中，如图6和图7所示，该实施例的半导体制冷箱100中，每个第二散热装置50可包括第二导热基体51、多根第二散热热 管52、第三散热翅片组53和第二散热风机54。
具体地，每个第二散热装置50的第二导热基体51与一个半导体制冷系统30内每个半导体制冷片31的热端热连接，以吸收热量。例如，每个第二导热基体51的前表面与一个半导体制冷系统30内每个半导体制冷片31的热端接触换热。优选地，每个第二导热基体51可为由铝材料制成的导热块。
每根第二散热热管52的下端抵靠于或嵌入第二导热基体51中，以与第二导热基体51接触换热。每根第二散热热管52可为烧结热管，其内部空腔内可灌注有去离子水等，其内壁上可附着有烧结的金属粉末结构，以提高散热效率。进一步地，第二散热热管52的数量可为3到4根，每根第二散热热管52的长度在35cm内，直径为10mm。
第三散热翅片组53可具有多个相对应平行间隔设置的翅片，设置于多根第二散热热管52上。第二散热风机54可为轴流风机，安装于第三散热翅片组53上，配置成对从多根第二散热热管52传至第三散热翅片组53的热量进行强制对流散热。
在本发明的一些实施例中，半导体制冷箱100还包括用以自箱体20的前侧封闭多个储物空间21的封闭装置。具体地，该封闭装置可为第一门体，其可转动地安装于箱体20，用以自箱体20的前侧封闭多个储物空间21。可选地，该封闭装置也可包括多个第二门体，每个第二门体可转动地安装于箱体20，用以自一个储物空间21的前侧封闭该储物空间21。可选地，该封闭装置也可为折叠门体，安装于箱体20。折叠门体可具有多个门体单元，每个门体单元用以自一个储物空间21的前侧封闭该储物空间21，且每两个相邻的门体单元枢转连接。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种用于半导体制冷箱的传冷装置，包括：
    一根或多根热管，每根所述热管具有上部区段和与所述上部区段相距一距离的下部区段，每根所述热管的上部区段配置成直接或间接地与一冷源热连接，以吸收所述冷源的冷量并传递出，且传递到每根所述热管的下部区段；和
    上部翅片组，其与每根所述热管的上部区段直接或间接地热连接。
  2. 根据权利要求1所述的传冷装置，其中
    每根所述热管为烧结热管。
  3. 根据权利要求1所述的传冷装置，进一步包括：
    导冷基体，其用于与所述冷源热接触；且
    每根所述热管的上部区段抵靠于或嵌入所述导冷基体中。
  4. 根据权利要求3所述的传冷装置，其中
    所述上部翅片组中的多个翅片相对应平行间隔地设置于所述导冷基体的一个竖向侧面。
  5. 根据权利要求1所述的传冷装置，进一步包括：
    上部风机，配置成对所述上部翅片组上的冷量进行强制对流散冷。
  6. 根据权利要求1所述的传冷装置，进一步包括：
    下部翅片组，其与每根所述热管的下部区段直接或间接地热连接。
  7. 根据权利要求6所述的传冷装置，其中
    所述下部翅片组中的多个翅片相对应平行间隔地安装于所述一根或多根热管的下部区段。
  8. 根据权利要求6所述的传冷装置，进一步包括：
    下部风机，配置成对所述下部翅片组上的冷量进行强制对流散冷。
  9. 根据权利要求1所述的传冷装置，其中
    所述热管的数量为多根，多根所述热管沿竖直方向平行延伸。
  10. 一种半导体制冷箱，包括：
    箱体，其内限定有一个或多个储物空间；和
    一个或多个半导体制冷系统，每个所述半导体制冷系统包括其自身的一个或多个半导体制冷片，以及将该半导体制冷系统内每个半导体制冷片冷端的冷量供应到一个储物空间的传冷装置；且
    每个所述半导体制冷系统的传冷装置为根据权利要求1至9中任一项所述的传冷装置。
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