WO2018196278A1 - 触控基板及其制作和驱动方法、触控显示装置 - Google Patents

触控基板及其制作和驱动方法、触控显示装置 Download PDF

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Publication number
WO2018196278A1
WO2018196278A1 PCT/CN2017/103959 CN2017103959W WO2018196278A1 WO 2018196278 A1 WO2018196278 A1 WO 2018196278A1 CN 2017103959 W CN2017103959 W CN 2017103959W WO 2018196278 A1 WO2018196278 A1 WO 2018196278A1
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WIPO (PCT)
Prior art keywords
touch
pressure
substrate
sensor
sensing unit
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PCT/CN2017/103959
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English (en)
French (fr)
Inventor
杨清
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/779,233 priority Critical patent/US11327611B2/en
Priority to EP17897205.5A priority patent/EP3617855A4/en
Priority to JP2019547154A priority patent/JP6997204B2/ja
Publication of WO2018196278A1 publication Critical patent/WO2018196278A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/0418—Control or interface arrangements specially adapted for digitisers for error correction or compensation, e.g. based on parallax, calibration or alignment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0448—Details of the electrode shape, e.g. for enhancing the detection of touches, for generating specific electric field shapes, for enhancing display quality

Definitions

  • At least one embodiment of the present disclosure relates to a touch substrate, a method of fabricating the same, and a touch display device.
  • 3D touch brought by IPhone, and its application is widely used to increase the pressure detection to achieve more touch functions. At the same time, through the judgment of the pressure, different levels of pressure feedback are output. To give consumers a better touch experience. It can be predicted that 3D touch will be more and more applied to consumer electronics.
  • At least one embodiment of the present disclosure relates to a touch substrate, a method of fabricating and driving the same, and a touch display device capable of increasing a change in impedance generated by pressure to facilitate detection of a pressure change by the detected chip.
  • a pressure sensor disposed on the base substrate and including at least one pressure sensing unit, the pressure sensing unit including a plurality of extending portions extending in the first direction and sequentially connecting the plurality of extending portions At least one connection.
  • At least one embodiment of the present disclosure further provides a method for fabricating a touch substrate, including:
  • the pressure sensor including at least one pressure sensing unit, the pressure sensing unit including a plurality of extensions extending in the first direction and sequentially connecting the plurality of extensions At least one connection.
  • At least one embodiment of the present disclosure further provides a driving method for any of the above touch substrates, including:
  • the change of the resistance value of the pressure sensing unit under the external force causes a voltage difference between the pressure sensing unit to change, and the pressure signal is outputted by the voltage difference to determine the magnitude of the touch pressure.
  • At least one embodiment of the present disclosure further provides a touch display device, including any one of the touch substrates described in the embodiments of the present disclosure.
  • FIG. 1 is a schematic diagram of a touch display device
  • FIG. 2 is a schematic diagram of a pressure sensor of a touch substrate according to an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a pressure sensor of a touch substrate according to another embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram of a pressure sensor of a touch substrate connected to a first detecting chip according to an embodiment of the present disclosure
  • FIG. 5 is a schematic diagram of a pressure sensor of a touch substrate according to another embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of a pressure sensor of a touch substrate according to another embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram of a pressure sensor of a touch substrate according to another embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram of a touch sensor in a touch substrate and its connection with a second detecting chip
  • FIG. 9 is a schematic diagram showing the same layer arrangement of a pressure sensor and a touch sensor of a touch substrate according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of a touch substrate including a plurality of pressure sensors according to an embodiment of the present disclosure
  • FIG. 11A is a schematic diagram showing the electrical connection and detection principle of a plurality of pressure sensors included in a touch substrate and a first detecting chip according to an embodiment of the present invention
  • FIG. 11B is a schematic diagram of a touch flow of a touch substrate according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic diagram showing the electrical connection between a pressure sensor and a touch sensor formed in the same layer in the touch substrate and the same detection chip according to an embodiment of the present disclosure
  • FIG. 13 is a schematic diagram of a touch substrate
  • FIG. 14 is a schematic diagram of a touch substrate according to an embodiment of the present disclosure.
  • FIG. 15 is a schematic diagram of a touch substrate according to another embodiment of the present disclosure.
  • FIG. 16A is a nine-point schematic diagram of a touch substrate according to an embodiment of the present disclosure.
  • FIG. 16B is a schematic diagram of a pressure compensation method of a touch substrate according to an embodiment of the present disclosure.
  • FIG. 17 is a schematic diagram of a touch substrate according to an embodiment of the present disclosure.
  • Figure 18 is a schematic view showing the design of a lead overlap.
  • the implementation requires the addition of an additional pressure sensor (Force sensor) and its driver circuit (Driver IC) and peripheral circuits. In addition to increasing costs, it also brings about an increase in thickness, which is contrary to the wishes of consumers.
  • the touch display device includes an array substrate 07 and an opposite substrate 03 opposite to the same, and the array substrate 07 and the opposite substrate 03 form a liquid crystal cell, and the liquid crystal cell can be filled with liquid crystal (not shown).
  • the pressure sensor 010 is disposed on the pressure touch carrier 011, and a protective layer 012 is disposed on a side of the pressure touch carrier 011 away from the pressure sensor 010.
  • the pressure sensor 010 is connected to the first detecting chip 013 through a first flexible circuit board (FPC) 014.
  • the touch sensor includes a first sensor 04 and a second sensor 02.
  • One of the first sensor 04 and the second sensor 02 is a touch driving sensor (Tx), and the other is a touch sensing sensor (Rx).
  • First sensor 04 and the second sensor 02 are connected to the second detecting chip 05 through a second flexible circuit board (FPC) 06.
  • the touch display device further includes an upper polarizer 01 and a lower polarizer 09.
  • the pressure touch carrier 011 may include a base material of a glass material or a polyethylene terephthalate (PET) material.
  • PET polyethylene terephthalate
  • the touch display device shown in FIG. 1 has a touch sensor and a pressure sensor separately designed to increase the thickness of the device, and the assembly and process are more complicated.
  • the substrate is deformed under pressure to change the impedance of the pressure sensor.
  • the impedance change caused by external force deformation is small.
  • At least one embodiment of the present disclosure provides a touch substrate, as shown in FIG. 2, including:
  • the base substrate 111 is made of, for example, glass material or polyethylene terephthalate (PET) material;
  • the pressure sensor 10 is disposed on the base substrate 111 and includes at least one pressure sensing unit 100.
  • the pressure sensing unit 100 includes a plurality of extending portions 101 extending in the first direction X and sequentially connecting the plurality of extending portions 101. At least one connection portion 102. At least one includes one or more, and a plurality includes at least two.
  • the touch sensing substrate 100 includes a plurality of extending portions 101 extending in the first direction X, and the plurality of extending portions 101 are sequentially connected through one or more connecting portions 102, thereby The number of the extensions 101 per unit area of the pressure sensing unit can be increased, and the impedance change caused by the pressure can be increased to facilitate the detection of the pressure change by the detected chip.
  • the pressure sensing unit 100 includes a linear portion, for example, a linear portion including a square waveform.
  • the plurality of connecting portions 102 connect the plurality of extending portions 101 extending in the first direction X into a line of a square waveform.
  • the pressure sensing unit 100 includes a "z" shaped portion.
  • a strip-shaped electrode can be used to form a linear portion.
  • n extensions 101 are connected by one connection portion 102, and n extensions 101 may be sequentially connected by n-1 connection portions 102.
  • the pressure sensor 10 includes a pressure sensing unit 100 as an example.
  • the pressure sensor 10 may further include a plurality of pressure sensing units 100.
  • the pressure sensor 10 includes a plurality of pressure sensing units 100, Improve the effect and accuracy of pressure touch.
  • adjacent connecting portions 102 in the second direction Y are located on different sides (different ends) 1111 and 1112 of the same surface of the substrate 111, And respectively connected to both ends of the same extension portion 101, the second direction Y is perpendicular to the first direction X.
  • the connecting portion 102 includes a first connecting portion 1021 on a first side 1111 of the base substrate 111 and a second connecting portion 1022 on a second side 1112 of the base substrate 111, a first side 1111 and a second side 1112 is provided on both sides of the base substrate 111.
  • the first side 1111 can be adjacent to one side of the base substrate 111
  • the second side 1112 can be adjacent to the other side of the base substrate 111, the two sides being opposite.
  • the first connecting portion 1022 and the second connecting portion 1022 adjacent in the second direction Y are respectively connected to both ends of the same extending portion 101.
  • the pressure sensing unit 100 further includes an enclosing portion 103, and the surrounding portion 103 is adjacent to the two connecting portions 102 on the same side of the substrate 111.
  • One of the electrical connections is insulated from the other, and the enclosure 103 is located on a side remote from the binding zone 108. Therefore, when the pressure sensor is formed in the same layer as other structures (for example, formed in the same layer as Tx and Rx), the micro opening on the first side of the substrate substrate is designed to facilitate the internal Tx, and the Rx is protected by the pressure sensor.
  • the surrounding portion 103 may be formed in the same layer as the extending portion 101 and/or the connecting portion 102, or may be formed in different layers.
  • the touch sensing substrate further includes a first detecting chip 1041 configured to detect a change in resistance value or a change in voltage value of the pressure sensor 10, as shown in FIG. Check the pressure.
  • the two ends 1100 and 2100 of each pressure sensing unit 100 of the pressure sensor 10 are respectively connected to the two ends of the first detecting chip 1041 through the lead 151, and the voltage change caused by the impedance change is detected by the first detecting chip 1041. , thus generating a signal of pressure and feeding back to the system.
  • the change in the resistance value of the pressure sensing unit 100 can cause the voltage value at both ends to change, and the pressure can be detected by detecting a change in the voltage value caused by the change in the resistance value.
  • the extension portion 101 may be in a zigzag shape to further improve the touch effect and accuracy.
  • the connecting portion 102 may also be a fold line shape to further improve the touch effect and accuracy.
  • the enclosing portion 103 may also have a polygonal shape.
  • the connecting portion 102 can also take other forms.
  • the connecting portion 102 can connect the ends of the different sides of the adjacent extending portions 101 such that the plurality of extending portions 101 are connected end to end to form a line.
  • the pressure sensing unit 100 can include a linear portion.
  • the pressure sensing unit 100 includes a linear portion that is a line shape.
  • the pressure sensing unit 100 shown in FIG. 7 can further improve touch precision and touch effect.
  • the linear portion of the pressure sensing unit 100 can be The two ends are respectively connected to the two ends of the first detecting chip 1041.
  • a touch substrate according to an embodiment of the present disclosure further includes a touch sensor 156 that can be configured to detect a pressed (touch) position.
  • the touch sensor 156 is disposed on the base substrate 111.
  • the touch sensor 156 includes a plurality of touch sensing units 1560.
  • the plurality of touch sensing units 1560 are connected to the second detecting chip 1042 through respective leads 161.
  • the detection chip 1042 is configured to detect a change in the capacitance value of the touch sensor 156 to detect a pressed position.
  • the touch sensing unit 1560 includes a first touch sensing unit 105 and a second touch sensing unit 106.
  • One of the first touch sensing unit 105 and the second touch sensing unit 106 is a touch driving unit.
  • the other is a touch sensing unit.
  • the touch driving unit can be configured to receive a touch driving signal, and the touch sensing unit can be configured to output a touch sensing signal, thereby detecting a pressing (touch) position.
  • the second touch sensing unit 106 of each row in the horizontal direction can be electrically connected or applied with the same signal, and can be used as a touch driving unit (Tx), and the vertical first touch sensing unit 105 can be used as Touch sensing unit (Rx).
  • each touch driving unit is insulated from each other, and each touch sensing unit is insulated from each other.
  • the touch dead zone 171 can be as shown by the dashed box in FIG.
  • the pressure sensor adopts a method of detecting a resistance change, and does not interfere with the operation of the touch sensor, so that the time-division driving is not required, so that the report rate of the touch sensor can be improved.
  • it can also be driven in a time-sharing manner.
  • the pressure sensor can be grounded (GND attribute).
  • the touch sensor 156 and the pressure sensor 10 may be disposed in the same layer, and the extension portion 101 is disposed between adjacent touch sensing units 1560 .
  • a pressure sensor and a touch sensor are fabricated on the surface of the base substrate 111 such that one base substrate 111 integrates functional layers such as a touch sensor and a pressure sensor.
  • the base substrate 111 may include, for example, a glass substrate.
  • the pressure sensing unit 100 and the touch sensing unit 1560 do not overlap in a direction perpendicular to the base substrate 111.
  • the touch sensor 156 can be formed of a transparent conductive material
  • the pressure sensor 10 can be formed of a transparent conductive material.
  • the transparent conductive material includes indium tin oxide (ITO), but is not limited thereto.
  • the touch sensor 156 and the pressure sensor 10 are disposed on the same layer, which can save the carrier material (substrate substrate) required for the pressure sensor fabrication, integrate the product, have higher physical strength, and can reduce the space required by the pressure sensor. Reduce the thickness of the end product.
  • the extension portion 101 of the pressure sensor is interposed between Tx and Rx, and the Tx of the second detection chip 1042 transmits a driving signal required by the touch sensor, and Rx is responsible for picking up and dropping.
  • Rx is responsible for picking up and dropping.
  • Fx is used to collect the pressure (Force) signal generated by the pressure.
  • the Any-Pen function can be conveniently implemented by using a combination of a pressure sensor and a touch sensor (the same layer setting), and only one ordinary conductive pen is needed. , the original handwriting can be realized. Of course, finger touch can also be used.
  • the lead of the touch sensing unit 1560 and the lead 151 of the pressure sensing unit 100 may be disposed in the same layer as the touch sensor 156 and the pressure sensor 10.
  • the pressure sensor 10 includes a plurality of pressure sensing units 100, and two pressure sensing units 100 are illustrated in FIG. 10, but the pressure sensing unit 100 may For more.
  • Each of the pressure sensing units 100 can be sequentially arranged in the same direction.
  • the plurality of pressure sensing units 100 may be sequentially arranged in a second direction Y opposite to the extending direction (first direction X) of the extending portion 101.
  • each of the pressure sensing units is connected to the first detecting chip 1041 through respective leads.
  • the first pressure sensing unit 1001 and the second pressure sensing unit 1002 are each connected to the first detecting chip 1041 through respective leads.
  • R ⁇ L / s, where R is the resistance, ⁇ is the resistivity of the conductor, L is the length of the conductor, and s is the cross-sectional area of the conductor.
  • pressure is applied to the touch sensor, and the pressure causes the touch substrate to be deformed, and the deformation causes the impedance of the sensing unit to increase.
  • the magnitude of the pressure is judged and graded, and the information including the magnitude of the pressure is output to the system end, and the system side gives a response corresponding to the pressure level. Thereby, the detection of the touch pressure level can be achieved.
  • the grounding of one end of the pressure sensing unit 100 is taken as an example, but it may be a reference voltage of other values, which is not limited thereto.
  • Both ends of the pressure sensing unit 100 can be respectively connected to different pins of the first detecting chip 1041 to implement signal transmission.
  • one end and the other end of the linear portion of the pressure sensing unit 100 are respectively connected to different pins of the first detecting chip 1041 to obtain a voltage difference change of the pressure sensing unit 100 under external force pressing.
  • the first detecting chip 1041 and the second detecting chip 1042 are integrated structures, and the lead wires and pressure sensing of the plurality of touch sensing units 1560 are provided.
  • the lead wires of the unit 100 are connected to the same detecting chip 104.
  • each touch sensing unit can adopt a special-shaped structure to increase the coupling area, which is beneficial to the improvement of the touch effect.
  • FIG. 13 shows the first touch driving unit 1061 and the second touch driving unit 1062.
  • the third touch driving unit 1063 the first touch sensing unit 1051 , the second touch sensing unit 1052 , the third touch sensing unit 1053 , and the ground line 107 .
  • an extension portion 101 is disposed between adjacent touch sensing units 1560, extending from a first side to a second side of the substrate, and from the substrate. One side of the substrate extends to the other side.
  • a ground line 107 may be disposed on the periphery of the pressure sensor 10 .
  • the connecting portion (connecting portion) of the extending portion 101 may be formed in the same process as the touch sensor 156, or may be formed by a flexible bonding board (Bonding FPC) for external bonding.
  • Bonding FPC flexible bonding board
  • the binding end can be changed to the GND genus by the FPC.
  • the utility model does not need to change the mask of the pressure sensor, and directly becomes an ordinary touch sensor, realizing the dual-purpose design of the pressure sensor.
  • the use of a touch sensor may result in inconsistent pressure signal output when the same position of the touch substrate is pressed at the same pressure.
  • the same pressure presses on the periphery of the screen and presses on the center of the screen. Due to different shape variables caused by different positions, the pressure signal detected by the pressure sensor may not accurately feedback the pressure. Therefore, it is necessary to have a different position, and the same pressure has the same pressure signal feedback mechanism.
  • the touch substrate is pressed by the robot with the same pressure, and the pressure signal measured by the pressure sensor is recorded when the various positions of the screen are pressed (for example, 9-point test), thereby determining the compensation coefficient of each point.
  • the first detecting chip performs position compensation on the pressure signal in the first detecting chip according to the actual touch position, and the pressed actual position can be detected by the touch sensor 156.
  • Table 1 The same pressure, press the 9-point output pressure signal size
  • the node of each touch sensor 156 is estimated to have a compensation coefficient when the pressure is pressed.
  • the pressure signal compensation mechanism flow is as follows.
  • the touch sensor detects the position of the press.
  • the pressure sensor detects the pressure and outputs a pressure signal (first pressure signal).
  • the first detecting chip compensates the pressure signal (the first pressure signal) according to the pressing position and then outputs an accurate pressure signal (the compensated pressure signal, the corrected pressure signal, and the second pressure signal).
  • the system outputs the report point and the pressure value feedback according to the coordinates output by the first detecting chip and the corrected pressure signal.
  • the touch substrate can include a processor, a memory, and computer program instructions stored in the memory to implement a pressure signal compensator. As shown in Figure 16B, the following steps are performed while the computer program instructions are being executed by the processor:
  • Compensating the pressure signal according to the pressing position to obtain a corrected pressure signal comprises: compensating the pressure signal when pressed at different positions, so that different positions of the pressure sensor output the same pressure signal under the same pressure pressing;
  • the corrected pressure signal is output.
  • the problem that the pressure signal output is inconsistent at different positions is pressed, and the pressure signal compensation unit 131 is further included, and the pressure signal compensation unit 131 is configured.
  • the pressure signal is compensated when pressed at different positions, so that different positions of the pressure sensor 10 output the same pressure touch signal under the same pressure press.
  • the touch dead zone 171 can be as shown in FIG. 8
  • the actual pressed position can be fitted according to the capacitance value of the capacitance node around the touch position. (May be offset from actual coordinates, but within the range allowed by the consumer experience).
  • the magnitude of the pressure value at the pressing position can also be corrected by the pressure signal compensation mechanism according to the fitted position.
  • the touch sensor output position When the touch dead zone is pressed, the touch sensor output position is deviated from the actual position, thereby causing the position output to be inaccurate. For example, the touch sensor output position is left or right, up or down, compared to the actual pressed position.
  • the position fitting unit 141 is configured to fit the actual pressing position according to the pressing position output by the touch sensor 156 when the touch dead zone of the visible area is pressed. For example, on the basis of this, compensation can also be performed by the pressure signal compensation unit 131. The output of the pressure signal can be made more accurate due to the actual pressing position.
  • the pressure signal compensation unit 131 and the pressing position fitting unit 141 can be respectively connected to the system end 109 to implement signal transmission.
  • the first detecting chip 1041 and the second detecting chip 1041 may also be respectively connected to the system end 109 to implement signal transmission.
  • system side 109 can include a processor 1091.
  • the touch substrate provided by an embodiment of the present disclosure may not be provided with the pressure signal compensation unit 131 or the pressing position fitting unit 141.
  • At least one embodiment of the present disclosure provides a method for fabricating a touch substrate, including:
  • a pressure sensor 10 is formed on the base substrate 111, the pressure sensor 10 including at least one pressure sensing unit 100 including a plurality of extensions 101 extending in the first direction X and sequentially bringing the plurality of extensions 101 At least one connecting portion 102 is connected.
  • the adjacent connecting portions 102 in the second direction Y are located on different sides of the base substrate 111, and are respectively connected to both ends of the same extending portion 101, and second The direction Y is perpendicular to the first direction X.
  • the pressure sensing unit 100 further includes an enclosing portion 103 electrically connected to one of two adjacent connecting portions 102 on the same side of the substrate 111 And insulated from each other, the enclosure 103 is located on a side away from the binding zone 108.
  • the method for fabricating a touch substrate according to an embodiment of the present disclosure further includes forming a touch sensor 156 on the base substrate 111.
  • the touch sensor 156 includes a plurality of touch sensing units 1560, a touch sensor 156, and a pressure sensor. 10 is disposed in the same layer, and the extending portion 101 is disposed between the adjacent touch sensing units 1560.
  • the method for fabricating a touch substrate according to an embodiment of the present disclosure further includes providing a first detecting chip 1041 and a second detecting chip 1042.
  • the first detecting chip 1041 is configured to detect a change in resistance value of the pressure sensor 10. Or the voltage value changes to detect the magnitude of the pressure, and the second detecting chip 1042 is configured to detect a change in the capacitance value of the touch sensor 156 to detect the pressing position.
  • the first detecting chip 1041 and the second detecting chip 1042 are integrated, and the lead wires of the plurality of touch sensing units 1560 and the pressure sensing unit 100 are The lead wires are connected to the same detecting chip 104.
  • a method for fabricating a touch substrate according to an embodiment of the present disclosure further includes providing a pressure signal compensation unit 131 configured to compensate a pressure signal when pressed at different positions to make the pressure sensor 10 The same pressure touch signal is output under the same pressure press at different positions.
  • the method for fabricating a touch substrate according to an embodiment of the present disclosure further includes a pressing position fitting unit 141 configured to be configured according to the touch sensor when the touch dead zone of the visible area is pressed.
  • the pressed position of the output of 156 fits the actual pressing position.
  • At least one embodiment of the present disclosure further provides a driving method of a touch substrate, including:
  • the change of the resistance value of the pressure sensing unit 100 under the external force causes the voltage difference between the pressure sensing unit 100 to change, and the pressure signal is outputted by the voltage difference to determine the magnitude of the touch pressure.
  • a method for driving a touch substrate includes a pressure signal compensation step after the voltage difference is changed and before the pressure signal is output, wherein the pressure signal compensation step includes: when the different positions are pressed The pressure signal is compensated so that the same pressure feedback signal is output at different positions of the pressure sensor under the same pressure press.
  • the driving method of the touch substrate according to an embodiment of the present disclosure further includes providing a driving signal to the touch sensor 156 to change a capacitance value of the touch sensor 156 to detect a pressing position.
  • the driving method of the touch substrate according to an embodiment of the present disclosure further includes a pressing position fitting step before the pressure signal compensation, wherein the touch substrate further includes a touch sensor configured to obtain a pressing position.
  • the pressing position fitting step includes fitting an actual pressing position according to a pressing position output by the touch sensor when the touch dead zone of the visible area is pressed.
  • a touch display device includes any touch substrate according to an embodiment of the present disclosure.
  • the touch display device may be a liquid crystal display device or an organic light emitting diode display device, which is not limited thereto.
  • the same or similar parts in the touch substrate provided by the embodiment of the present disclosure may be referred to each other in the same manner as in the touch substrate and the method for driving the touch substrate.
  • the pressure sensing unit in the pressure sensor may be referred to as a pressure electrode
  • the touch sensing unit in the touch sensor may be referred to as a touch electrode.
  • “same layer” refers to a layer structure formed by forming a film layer for forming a specific pattern by the same film forming process, and then forming the pattern by one patterning process using the same mask.
  • a patterning process may include multiple exposure, development, or etching processes, and the particular pattern in the resulting layer structure may be continuous or discontinuous, and these particular patterns may also be at different heights. Or have different thicknesses.
  • the electrical connection of the two structures can be avoided by bridging. That is, one of the structures is continuously formed within the layer, the other structure is broken at the overlap, and the disconnected portion is electrically connected by the bridge of the other layer. For example, as shown in FIG.
  • the lead 161 of the touch sensing unit is divided into a first portion 1611 and a second portion 1612 at a position overlapping the connecting portion 102, and the connecting portion 102
  • the first layer 1611 and the second portion 1612 are electrically connected by the conductive portion 191 through the insulating layer 181 and the lead wires 161 of the touch sensing unit are insulated from each other.
  • the conductive portion 191 is made of a conductive material.
  • FIG. 18 is merely an exemplary illustration, and the design of the overlap is not limited to the structure shown in FIG.
  • the structure shown in FIG. 18 can be adopted, so that the second touch driving unit 1062
  • the lead wire is electrically insulated from the first touch sensing unit 1051.
  • the leads located in the display area may be formed using a transparent conductive material.
  • the leads located outside the display area may be formed of a metal or an alloy.
  • the touch substrate and/or the touch display device of the embodiments of the present disclosure may further include one or more processors and one or more memories.
  • the processor can process the data signals and can include various computing structures, such as a Complex Instruction Set Computer (CISC) architecture, a Structured Reduced Instruction Set Computer (RISC) architecture, or a structure that implements a combination of multiple instruction sets.
  • the memory can hold instructions and/or data executed by the processor.
  • the instructions and/or data may include code for implementing some or all of the functions of one or more components, components, and devices described in the embodiments of the invention.
  • the memory includes dynamic random access memory (DRAM), static random access memory (SRAM), flash memory, optical memory, or other memory well known to those skilled in the art.
  • a display device may include code and programs stored in a memory; the processor may execute the code and program to implement some of the functions (or components), units, display devices, or all of the functions described above.
  • certain units such as a pressure signal compensation unit, a press position fitting unit may be hardware devices for implementing some or all of the functions of the various components (components), units as described above.
  • each part (component) may be a circuit board or a combination of a plurality of circuit boards for implementing the functions as described above.
  • the one circuit board or a combination of the plurality of circuit boards may include: (1) one or more processors; (2) one or more non-transitory computers connected to the processor Read memory; and (3) firmware executable by the processor to be stored in the memory.

Abstract

一种触控基板及其制作和驱动方法、触控显示装置。该触控基板包括：衬底基板(111)，设置在所述衬底基板(111)上的压力传感器(10)，压力传感器(10)包括至少一个压力传感单元(100)，所述压力传感单元(100)包括多个沿第一方向(X)延伸的延伸部(101)和使所述多个延伸部(101)顺次相连的至少一个连接部(102)。该触控基板能够使压力产生的阻抗变化增大，以利于被侦测芯片侦测到压力变化。

Description

触控基板及其制作和驱动方法、触控显示装置
相关申请的交叉引用
本专利申请要求于2017年4月28日递交的中国专利申请第201710296329.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本公开的示例的一部分。
技术领域
本公开至少一实施例涉及一种触控基板及其制作方法、触控显示装置。
背景技术
当前由IPhone带来的3D(Force Touch)触控，及其应用俞来广泛，通过增加压力大小的检测，实现更多的触控功能，同时通过压力的大小的判断，输出不同层次的压力反馈，给消费者带来更好的触控体验。可以预判3D触控其在消费电子上的应用会越来越多。
发明内容
本公开的至少一实施例涉及一种触控基板及其制作和驱动方法、触控显示装置，能够使压力产生的阻抗变化增大，以利于被侦测芯片侦测到压力变化。
本公开的至少一实施例提供一种触控基板，包括：
衬底基板，
压力传感器，设置在所述衬底基板上，并包括至少一个压力传感单元，所述压力传感单元包括多个沿第一方向延伸的延伸部和使所述多个延伸部顺次相连的至少一个连接部。
本公开的至少一实施例还提供一种触控基板的制作方法，包括：
在衬底基板上形成压力传感器，所述压力传感器包括至少一个压力传感单元，所述压力传感单元包括多个沿第一方向延伸的延伸部和使所述多个延伸部顺次相连的至少一个连接部。
本公开的至少一实施例还提供一种上述任一触控基板的驱动方法，包括：
给所述压力传感器提供驱动信号；
所述压力传感单元在外力作用下电阻值变化导致所述压力传感单元两端电压差变化，由所述电压差变化输出压力信号以确定触控压力的大小。
本公开的至少一实施例还提供一种触控显示装置，包括本公开实施例所述的任一项触控基板。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为一种触控显示装置示意图；
图2为本公开一实施例提供的触控基板的压力传感器的示意图；
图3为本公开另一实施例提供的触控基板的压力传感器的示意图；
图4为本公开一实施例提供的触控基板的压力传感器与第一侦测芯片相连的示意图；
图5为本公开另一实施例提供的触控基板的压力传感器的示意图；
图6为本公开另一实施例提供的触控基板的压力传感器的示意图；
图7为本公开另一实施例提供的触控基板的压力传感器的示意图；
图8为触控基板中的触控传感器及其与第二侦测芯片相连的示意图；
图9为本公开一实施例提供的触控基板的压力传感器和触控传感器同层设置的示意图；
图10为本公开一实施例提供的触控基板包括多个压力传感器的示意图；
图11A为本公开一实施例提供的触控基板包括的多个压力传感器与第一侦测芯片电连接以及侦测原理的示意图；
图11B为本公开一实施例提供的触控基板的触控流程的示意图；
图12为本公开一实施例提供的触控基板中同层形成的压力传感器和触控传感器与同一侦测芯片电连接的示意图；
图13为一种触控基板的示意图；
图14为本公开一实施例提供的触控基板的示意图；
图15为本公开另一实施例提供的触控基板的示意图；
图16A为本公开一实施例提供的触控基板的九点示意图；
图16B为本公开一实施例提供的触控基板的压力补偿方法示意图；
图17为本公开一实施例提供的触控基板示意图；
图18为一种引线交叠处设计示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
解析IPhone的Force Touch功能，其实现需增加额外的压力传感器(Force sensor)及其驱动电路(Driver IC)和外围电路。除增加成本之外，还带来厚度的增加，这是与消费者意愿相违背的。
如图1所示，触控显示装置包括阵列基板07和与其对盒的对置基板03，阵列基板07和对置基板03形成液晶盒，液晶盒内可填充液晶(图中未示出)，压力传感器010设置在压力触控载材011上，并且在压力触控载材011远离压力传感器010的一侧设置有防护层012。压力传感器010通过第一柔性电路板(FPC)014连接至第一侦测芯片013。触控传感器(Touch sensor)包括第一传感器04和第二传感器02，第一传感器04和第二传感器02其中一个为触控驱动传感器(Tx)，另一个为触控感应传感器(Rx)。第一传感器 04和第二传感器02通过第二柔性电路板(FPC)06连接至第二侦测芯片05。触控显示装置还包括上偏光片01和下偏光片09。压力触控载材011可以包括玻璃材质或聚对苯二甲酸乙二醇酯(PET)材质的衬底基板。在阵列基板07上，还可设置驱动IC08。
图1所示的触控显示装置，其触控传感器与压力传感器分开设计，增加了装置的厚度，也使得组装及工艺更为复杂。
压力作用下使衬底基板产生形变，从而使压力传感器的阻抗发生变化。通常外力形变产生的阻抗变化很小。
本公开至少一实施例提供一种触控基板，如图2所示，包括：
衬底基板111，其材质例如包括玻璃材质或聚对苯二甲酸乙二醇酯(PET)材质；
压力传感器10，设置在衬底基板111上，并包括至少一个压力传感单元100，压力传感单元100包括多个沿第一方向X延伸的延伸部101和使多个延伸部101顺次相连的至少一个连接部102。至少一个包括一个或多个，多个包括至少两个。
本公开至少一实施例提供的触控基板，因压力传感单元100包括多个沿第一方向X延伸的延伸部101，多个延伸部101通过一个或多个连接部102顺次相连，从而，可利于提高压力传感单元的单位面积内的延伸部101的条数，能够使压力产生的阻抗变化增大，以利于被侦测芯片侦测到压力变化。
根据本公开一实施例提供的触控基板，如图2所示，压力传感单元100包括线型部分，例如包括呈方波形的线型部分。多个连接部102将多个沿第一方向X延伸的延伸部101连接成方波形的线。例如，压力传感单元100包括“z”字型部分。例如，可采用条形的电极形成线型部分。
例如，相邻两个延伸部101通过一个连接部102相连，n个延伸部101可通过n-1个连接部102顺次相连。
图2中以压力传感器10包括一个压力传感单元100为例进行说明，压力传感器10还可以包括多个压力传感单元100，当压力传感器10包括多个压力传感单元100的情况下，可以提高压力触控的效果和精度。
根据本公开一实施例提供的触控基板，如图2所示，在第二方向Y上相邻的连接部102位于衬底基板111的同一表面的不同侧(不同端)1111、1112， 并分别与同一延伸部101的两端相连，第二方向Y垂直于第一方向X。
如图2所示，连接部102包括位于衬底基板111第一侧1111的第一连接部1021和位于衬底基板111第二侧1112的第二连接部1022，第一侧1111和第二侧1112分设于衬底基板111的两侧。例如，第一侧1111可靠近衬底基板111的一条边，第二侧1112可靠近衬底基板111的另一条边，该两条边相对。第二方向Y上相邻的第一连接部1022和第二连接部1022分别与同一延伸部101的两端相连。
根据本公开一实施例提供的触控基板，如图3和4所示，压力传感单元100还包括包围部103，包围部103与位于衬底基板111同一侧的相邻两个连接部102中的一个电连接，且与另一个彼此绝缘，包围部103位于远离绑定区108的一侧。从而，在压力传感器与其他结构(例如与Tx，Rx同层形成)同层形成时，衬底基板第一侧的微小开口设计，利于内部Tx，Rx被压力传感器保护起来。例如，包围部103可与延伸部101和/或连接部102同层形成，也可不同层形成。
根据本公开一实施例提供的触控基板，如图4所示，还包括第一侦测芯片1041，第一侦测芯片1041被配置来侦测压力传感器10的电阻值变化或电压值变化以检测压力大小。通过引线151将压力传感器10中每个压力传感单元100的两端1100、2100分别接至第一侦测芯片1041的两端，阻抗变化导致的电压变化被第一侦测芯片1041侦测到，从而产生压力大小的信号，反馈给系统端。压力传感单元100的电阻值变化可使得其两端的电压值变化，可通过侦测因电阻值变化导致的电压值变化以检测压力大小。
例如，如图5所示，延伸部101可以为折线形，以进一步提高触控效果和精度。例如，如图6所示，连接部102也可以为折线形，以进一步提高触控效果和精度。例如，为了提高触控基板的消隐效果，包围部103也可以采用折线形。
连接部102也可以采用其他形式，例如，如图7所示，连接部102可以连接相邻的延伸部101的不同侧的端，使得多个延伸部101首尾依次相连形成一条线。例如，压力传感单元100可包括线型部分。例如，如图7所示，压力传感单元100包括折线形的线型部分。图7所示的压力传感单元100可进一步提高触控精度和触控效果。例如，可将压力传感单元100的线型部分 的两端分别接至第一侦测芯片1041的两端。
根据本公开一实施例提供的触控基板，如图8所示，还包括触控传感器156，触控传感器156可被配置来进行按压(触摸)位置的检测。触控传感器156设置在衬底基板111上，触控传感器156包括多个触控传感单元1560，多个触控传感单元1560通过各自的引线161与第二侦测芯片1042相连，第二侦测芯片1042被配置来侦测触控传感器156的电容值变化以检测按压位置。触控传感单元1560包括第一触控传感单元105和第二触控传感单元106，第一触控传感单元105和第二触控传感单元106之一为触控驱动单元，另一个为触控感应单元。触控驱动单元可被配置为接受触控驱动信号，触控感应单元可被配置为输出触控感应信号，从而，可侦测按压(触摸)位置。例如，横向的每一行的第二触控传感单元106可电连接在一起或被施加相同的信号，可作为触控驱动单元(Tx)，竖向的第一触控传感单元105可作为触控感应单元(Rx)。例如，各触控驱动单元彼此绝缘，各触控感应单元彼此绝缘。因为每个触控传感器156的节点，都要从触控基板内部，通过引线将Tx,Rx引到边缘的绑定区上，这部分引线会占用部分可视区域，以致产生触控盲区171，触控盲区171可如图8中的虚线框所示。
根据本公开一实施例提供的触控基板，因压力传感器采用侦测电阻变化的方式，与触控传感器的工作不干涉，可以不用进行分时驱动，所以可以提高触控传感器的报点率。当然，也可以分时驱动，当进行触控传感器扫描时，压力传感器可接地(GND属性)。
根据本公开一实施例提供的触控基板，为了节省工艺，如图9所示，触控传感器156和压力传感器10可同层设置，延伸部101设置在相邻触控传感单元1560之间。例如，将压力传感器与触控传感器制作于衬底基板111的表面，从而一个衬底基板111集成了触控传感器、压力传感器等功能层。衬底基板111例如可包括玻璃基板。例如，如图9所示，在垂直于衬底基板111的方向上，压力传感单元100和触控传感单元1560不重叠。例如，触控传感器156可采用透明导电材料形成，压力传感器10可采用透明导电材料形成。例如，透明导电材料包括氧化铟锡(ITO)，但不限于此。当压力传感器10采用如图2-6任一所示的结构时，利于触控传感器156和压力传感器10的同层设置。
同层设置触控传感器156和压力传感器10，可以节省压力传感器制作所需的载材(衬底基板)，使产品一体化，拥有更高的物理强度，同时能够减去压力传感器所需空间，降低终端产品的厚度。
同层设置触控传感器156和压力传感器10的情况下，压力传感器的延伸部101穿插在Tx，Rx之间，第二侦测芯片1042的Tx发送触控传感器所需驱动信号，Rx负责接送触控传感器信号，Fx用于收集压力作用产生的压力(Force)信号。
根据本公开一实施例提供的触控基板，因采用压力传感器与触控传感器二合一(同层设置)的设计，可以很方便的实现Any-Pen功能，只需一支普通可导电的笔，即可实现原笔迹书写。当然，也可以采用手指触控。
例如，触控传感单元1560的引线和压力传感单元100的引线151可以与触控传感器156和压力传感器10同层设置。
根据本公开一实施例提供的触控基板，如图10所示，压力传感器10包括多个压力传感单元100，图10中示出两个压力传感单元100，但压力传感单元100可以为更多个。每个压力传感单元100可沿着同一方向依次排布。例如，多个压力传感单元100可沿着与其延伸部101的延伸方向(第一方向X)相反的第二方向Y依次排布。
根据本公开一实施例提供的触控基板，如图11A所示，各压力传感单元均通过各自的引线连接至第一侦测芯片1041。例如，第一压力传感单元1001和第二压力传感单元1002均通过各自的引线连接至第一侦测芯片1041。
根据导体电阻计算公式，R＝ρL/s，其中，R为电阻，ρ为导体的电阻率，L为导体的长度，s为导体的横截面积。压力导致触控基板发生形变，压力传感单元100的长度变长，导致阻抗增大。
对于较大尺寸的触控基板，我们可以将压力传感器分为2组或更多，兼顾灵敏度(△R)的同时，可以降低驱动电压(VDDIN)。
以其中一组计算，假如压力施加后压力传感单元产生的阻抗变化为ΔR，压力施加前，第一压力传感单元1001的阻值的Rf1，第二压力传感单元1002的阻值的Rf2，则：
Figure PCTCN2017103959-appb-000001
Figure PCTCN2017103959-appb-000002
根据本公开一实施例提供的触控基板，如图11B所示，对触控传感器施加压力，可压力导致触控基板发生形变，形变导致控传感单元阻抗增大，第一侦测芯片对压力大小进行判断分级，输出包含压力大小的信息给系统端，系统端给予对应压力级数的响应。从而，可实现触控压力大小的检测。
本公开的实施例中，以压力传感单元100的一端接地为例进行说明，但其也可以为其他数值的参考电压，对此不作限定。压力传感单元100的两端可分别与第一侦测芯片1041的不同引脚相连，以实现信号传输。例如，压力传感单元100的线型部分的一端和另一端分别与第一侦测芯片1041的不同引脚相连，以可获得在外力按压下，压力传感单元100的电压差变化。
根据本公开一实施例提供的触控基板，如图12所示，第一侦测芯片1041和第二侦测芯片1042为一体结构，多个触控传感单元1560的引出线和压力传感单元100的引出线连接至同一个侦测芯片104。从而使得触控产品结构更为简单。使产品结构及制作流程工艺大为简化，从而提高效益。为了图示清晰，图12中未完全示出各个触控传感单元1560与侦测芯片104的连接关系。
如图13所示，各触控传感单元可采用异形结构，以增加耦合面积，利于触控效果的提升，图13示出了第一触控驱动单元1061、第二触控驱动单元1062、第三触控驱动单元1063、第一触控感应单元1051、第二触控感应单元1052、第三触控感应单元1053以及接地线107。
根据本公开一实施例提供的触控基板，如图14所示，延伸部101设置在相邻触控传感单元1560之间，从衬底基板第一侧延伸至第二侧，从衬底基板一侧延伸至另一侧。
根据本公开一实施例提供的触控基板，如图15所示，为了利于消除静电，在压力传感器10外围还可以设置接地线107。
如图14、15所示，延伸部101的接续部分(连接部)，可以是和触控传感器156同一工艺制作，也可以是外接绑定用的柔性电路板(Bonding FPC)形成。
若无需压力传感功能，则可绑定端用FPC将压力传感单元改为GND属 性，无需变更压力传感器的掩模板(Mask)，直接变为普通的触控传感器，实现压力传感器的两用设计。
采用触控传感器可能会带来采用相同压力按压触控基板的不同位置处时，压力信号输出不一致。
如图16A所示，整机条件下，相同压力对屏幕四周按压和对屏幕中央按压，因不同位置引起的形变量不同，其压力传感器侦测到的压力信号可能不能准确的反馈压力的大小。所以需要有一个不同位置，相同压力就有相同压力信号反馈的机制。
以机械手分别以相同的压力按压触控基板，记录按压屏幕各个位置时(例如9点测试)，压力传感器测得的压力信号大小，以此确定每个点的补偿系数。然后第一侦测芯片根据实际触控位置在第一侦测芯片内对压力信号进行位置补偿，其按压实际位置可由触控传感器156侦测。
假如相同压力，按压以上9点输出的压力信号大小如下表一所示。
表一：相同压力，按压9点输出的压力信号大小
点位 1 2 3 4 5 6 7 8 9
压力大小 100 100 100 100 100 100 100 100 100
压力信号 50 60 50 60 100 60 50 60 50
以此估算，每个触控传感器156的节点，对应的压力按压时的补偿系数。
例如，压力信号补偿机制流程如下。
(1)手指按压。
(2)触控传感器侦测按压的位置。
(3)压力传感器侦测压力大小，输出压力信号(第一压力信号)。
(4)第一侦测芯片根据按压位置对压力信号(第一压力信号)进行补偿设定然后输出准确的压力信号(补偿后的压力信号，修正后压力信号，第二压力信号)。
(5)系统根据第一侦测芯片输出的坐标和修正后压力信号，输出报点和压力值反馈。
例如，触控基板可包括处理器、存储器和存储在存储器中的计算机程序指令以实现压力信号补偿机。如图16B所示，在计算机程序指令被处理器运行时执行以下步骤：
提取触控传感器侦测的按压位置和压力传感器侦测的压力信号；
根据按压位置对压力信号进行补偿得到修正后的压力信号；补偿方法包括：在不同位置被按压时对压力信号进行补偿，以使压力传感器的不同位置处在相同压力按压下输出相同压力信号；
输出修正后的压力信号。
根据本公开一实施例提供的触控基板，如图17所示，为了解决相同压力，按压不同位置处压力信号大小输出不一致的问题，还包括压力信号补偿单元131，压力信号补偿单元131被配置来在不同位置被按压时对压力信号进行补偿，以使压力传感器10的不同位置处在相同压力按压下输出相同压力触控信号。
单层触控(如图8或9所示)时，存在触控盲区，触控盲区171可如图8所示，可根据触控位置周围电容节点电容值变化，拟合出实际的按压位置(可能与实际坐标有偏移，但在消费者体验允许的范围内)。此时按压位置的压力值大小，也可根据拟合的位置，通过压力信号补偿机制进行修正。
触控盲区被按压时，触控传感器输出位置与实际位置有偏差，从而造成位置输出不准确。例如，触控传感器输出位置与实际按压位置相比，偏左或偏右，偏上或偏下。
根据本公开一实施例提供的触控基板，如图17所示，为了解决触控盲区被按压时，触控传感器输出位置与实际位置有偏差而造成的位置输出不准确的问题，还包括按压位置拟合单元141，按压位置拟合单元141被配置来在可视区域的触控盲区被按压时，根据触控传感器156输出的按压位置拟合出实际的按压位置。例如，在此基础上，还可通过压力信号补偿单元131进行补偿。因实际按压位置的获得，可以使得压力信号的输出更为准确。
根据本公开一实施例提供的触控基板，如图17所示，压力信号补偿单元131和按压位置拟合单元141可分别与系统端109相连，以实现信号传输。例如，第一侦测芯片1041和第二侦测芯片1041也可分别与系统端109相连，以实现信号传输。例如，系统端109可包括处理器1091。
当然，本公开一实施例提供的触控基板，也可以不设置压力信号补偿单元131或按压位置拟合单元141，对此不作限定。
本公开至少一实施例提供一种触控基板的制作方法，包括：
在衬底基板111上形成压力传感器10，压力传感器10包括至少一个压力传感单元100，压力传感单元100包括多个沿第一方向X延伸的延伸部101和使多个延伸部101顺次相连的至少一个连接部102。
根据本公开一实施例提供的触控基板的制作方法，在第二方向Y上相邻的连接部102位于衬底基板111的不同侧，并分别与同一延伸部101的两端相连，第二方向Y垂直于第一方向X。
根据本公开一实施例提供的触控基板的制作方法，压力传感单元100还包括包围部103，包围部103与位于衬底基板111同一侧的相邻两个连接部102中的一个电连接，且与另一个彼此绝缘，包围部103位于远离绑定区108的一侧。
根据本公开一实施例提供的触控基板的制作方法，还包括在衬底基板111上形成触控传感器156，触控传感器156包括多个触控传感单元1560，触控传感器156和压力传感器10同层设置，延伸部101设置在相邻触控传感单元1560之间。
根据本公开一实施例提供的触控基板的制作方法，还包括设置第一侦测芯片1041和第二侦测芯片1042，第一侦测芯片1041被配置来侦测压力传感器10的电阻值变化或电压值变化以检测压力大小，第二侦测芯片1042被配置来侦测触控传感器156的电容值变化以检测按压位置。
根据本公开一实施例提供的触控基板的制作方法，第一侦测芯片1041和第二侦测芯片1042为一体结构，多个触控传感单元1560的引出线和压力传感单元100的引出线连接至同一个侦测芯片104。
根据本公开一实施例提供的触控基板的制作方法，还包括设置压力信号补偿单元131，压力信号补偿单元131被配置来在不同位置被按压时对压力信号进行补偿，以使压力传感器10的不同位置处在相同压力按压下输出相同压力触控信号。
根据本公开一实施例提供的触控基板的制作方法，还包括设置按压位置拟合单元141，按压位置拟合单元141被配置来在可视区域的触控盲区被按压时，根据触控传感器156输出的按压位置拟合出实际的按压位置。
本公开至少一实施例还提供一种触控基板的驱动方法，包括：
给压力传感器10提供驱动信号；
压力传感单元100在外力作用下电阻值变化导致压力传感单元100两端电压差变化，由电压差变化输出压力信号以确定触控压力的大小。
根据本公开一实施例提供的触控基板的驱动方法，在获知电压差变化后并在输出压力信号前，还包括压力信号补偿步骤，其中，压力信号补偿步骤包括：在不同位置被按压时对压力信号进行补偿，以使压力传感器的不同位置处在相同压力按压下输出相同压力触控信号。
根据本公开一实施例提供的触控基板的驱动方法，还包括给触控传感器156提供驱动信号，使触控传感器156的电容值变化以检测按压位置。
根据本公开一实施例提供的触控基板的驱动方法，在压力信号补偿前，还包括按压位置拟合步骤，其中，触控基板还包括触控传感器，触控传感器被配置来获取按压位置，按压位置拟合步骤包括：在可视区域的触控盲区被按压时，根据触控传感器输出的按压位置拟合出实际的按压位置。
本公开至少一实施例提供的触控显示装置，包括本公开实施例所述的任一触控基板。
例如，触控显示装置可以为液晶显示装置，也可以为有机发光二极管显示装置，对此不作限定。
本公开实施例提供的触控基板的制作方法、触控基板的驱动方法中与本公开实施例提供的触控基板中相同或相似的地方可相互参见，在此不再赘述。本公开实施例中，压力传感器中的压力传感单元可称作压力电极，触控传感器中的触控传感单元可称作触控电极。
在本公开的实施例中，“同层”指的是采用同一成膜工艺形成用于形成特定图形的膜层，然后利用同一掩模板通过一次构图工艺形成的层结构。根据特定图形的不同，一次构图工艺可能包括多次曝光、显影或刻蚀工艺，而形成的层结构中的特定图形可以是连续的也可以是不连续的，这些特定图形还可能处于不同的高度或者具有不同的厚度。
本公开实施例提供的触控基板和触控基板的制作方法中，若同层形成的不同结构中，若有交叠之处，可通过搭桥的方式避免两个结构的电连接。即，其中一个结构在该层内连续形成，另一结构在交叠处断开，并通过另一层的桥接部使得该断开部分电连接。例如，如图18所示，触控传感单元的引线161在与连接部102交叠处分为第一部分1611和第二部分1612，连接部102 通过绝缘层181与触控传感单元的引线161彼此绝缘，第一部分1611和第二部分1612通过导电部191电连接。导电部191为可导电材料制成。图18只是示例性的说明，交叠处的设计不限于图18所示的结构。例如，图13-15中第二触控驱动单元1062的引线与第一触控感应单元1051的交叠位置处，即可采用如图18所示的结构，以使得第二触控驱动单元1062的引线和第一触控感应单元1051电绝缘。
例如，本公开的实施例中，位于显示区的引线可以采用透明导电材料形成。而位于显示区外的引线可采用金属或合金形成。
本公开实施例的触控基板和/或触控显示装置还可以包括一个或多个处理器以及一个或多个存储器。处理器可以处理数据信号，可以包括各种计算结构，例如复杂指令集计算机(CISC)结构、结构精简指令集计算机(RISC)结构或者一种实行多种指令集组合的结构。存储器可以保存处理器执行的指令和/或数据。这些指令和/或数据可以包括代码，用于实现本发明实施例描述的一个或多个部(部件)、单元、装置的一些功能或全部功能。例如，存储器包括动态随机存取存储器(DRAM)、静态随机存取存储器(SRAM)、闪存(flash memory)、光存储器(optical memory)，或其他的本领域技术人员熟知的存储器。
在本公开的一些实施例中，显示装置可包括存储在存储器中的代码和程序；处理器可以执行该代码和程序以实现如上所述的部(部件)、单元、显示装置的一些功能或全部功能。
在本公开的一些实施例中，某种单元例如压力信号补偿单元、按压位置拟合单元可以是硬件器件，用来实现如上所述的各部(部件)、单元的一些或全部功能。例如，各部(部件)、各单元可以是一个电路板或多个电路板的组合，用于实现如上所述的功能。在本公开的实施例中，该一个电路板或多个电路板的组合可以包括：(1)一个或多个处理器；(2)与处理器相连接的一个或多个非暂时的计算机可读的存储器；以及(3)处理器可执行的存储在存储器中的固件。
例如，一个或多个单元的一些功能或全部功能可以采用软件、硬件、固件或其任意组合方式来实现。
有以下几点需要说明：
(1)除非另作定义，本公开实施例以及附图中，同一附图标记代表同一含义。
(2)本公开实施例附图中，只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(3)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”，或者可以存在中间元件。
(4)在不冲突的情况下，本公开的同一实施例及不同实施例中的特征可以相互组合。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (16)

  1. 一种触控基板，包括：
    衬底基板，
    压力传感器，设置在所述衬底基板上，并包括至少一个压力传感单元，所述压力传感单元包括多个沿第一方向延伸的延伸部和使所述多个延伸部顺次相连的至少一个连接部。
  2. 根据权利要求1所述的触控基板，其中，在第二方向上相邻的连接部位于所述衬底基板的同一表面的不同侧，并分别与同一延伸部的两端相连，所述第二方向垂直于所述第一方向。
  3. 根据权利要求1或2所述的触控基板，其中，所述压力传感单元包括呈方波形或折线形的线型部分。
  4. 根据权利要求2所述的触控基板，其中，所述压力传感单元还包括包围部，所述包围部与位于所述衬底基板同一侧的相邻两个连接部中的一个电连接，且与另一个彼此绝缘，所述包围部位于远离绑定区的一侧。
  5. 根据权利要求1-4任一项所述的触控基板，还包括触控传感器，其中，所述触控传感器设置在所述衬底基板上，所述触控传感器包括多个触控传感单元，所述触控传感器和所述压力传感器同层设置，所述延伸部设置在相邻触控传感单元之间。
  6. 根据权利要求5所述的触控基板，还包括第一侦测芯片和第二侦测芯片，其中，所述第一侦测芯片被配置来侦测所述压力传感器的电阻值变化或电压值变化以检测压力大小，所述第二侦测芯片被配置来侦测所述触控传感器的电容值变化以检测按压位置。
  7. 根据权利要求6所述的触控基板，其中，所述第一侦测芯片和所述第二侦测芯片为一体结构，所述多个触控传感单元的引出线和所述压力传感单元的引出线连接至同一个侦测芯片。
  8. 根据权利要求5-7任一项所述的触控基板，还包括处理器；
    存储器；和
    存储在所述存储器中的计算机程序指令，在所述计算机程序指令被所述处理器运行时执行以下步骤：
    提取所述触控传感器侦测的按压位置和所述压力传感器侦测的压力信号；
    根据所述按压位置对所述压力信号进行补偿得到修正后的压力信号；以使得在不同位置被按压时对所述压力信号进行补偿，以使所述压力传感器的不同位置处在相同压力按压下输出相同压力信号；
    输出所述修正后的压力信号。
  9. 一种触控基板的制作方法，包括：
    在衬底基板上形成压力传感器，所述压力传感器包括至少一个压力传感单元，所述压力传感单元包括多个沿第一方向延伸的延伸部和使所述多个延伸部顺次相连的至少一个连接部。
  10. 根据权利要求9所述的触控基板的制作方法，其中，在第二方向上相邻的连接部位于所述衬底基板的同一表面的不同侧，并分别与同一延伸部的两端相连，所述第二方向垂直于所述第一方向。
  11. 根据权利要求10所述的触控基板的制作方法，还包括形成所述压力传感单元的包围部，其中，所述包围部与位于所述衬底基板同一侧的相邻两个连接部中的一个电连接，且与另一个彼此绝缘，所述包围部位于远离绑定区的一侧。
  12. 根据权利要求9所述的触控基板的制作方法，还包括在形成所述压力传感器的同时形成触控传感器，其中，所述触控传感器包括多个触控传感单元，所述延伸部形成在相邻触控传感单元之间。
  13. 权利要求5-8任一项所述的触控基板的驱动方法，包括：
    给所述压力传感器提供驱动信号；
    所述压力传感单元在外力作用下电阻值变化导致所述压力传感单元两端电压差变化，由所述电压差变化输出压力信号以确定触控压力的大小；在获知所述电压差变化后并在输出所述压力信号前，还包括压力信号补偿步骤，其中，所述压力信号补偿步骤包括：在不同位置被按压时对压力信号进行补偿，以使所述压力传感器的不同位置处在相同压力按压下输出相同压力触控信号。
  14. 权利要求5-8任一项所述的触控基板的驱动方法，其中，驱动所述压力传感器进行触控压力检测的同时，驱动所述触控传感器进行触控位置的 检测。
  15. 权利要求5-8任一项所述的触控基板的驱动方法，其中，分时驱动所述压力传感器和所述触控传感器，驱动所述触控传感器进行触控位置检测时，所述压力传感器接地。
  16. 一种触控显示装置，包括权利要求1-8任一项所述的触控基板。
PCT/CN2017/103959 2017-04-28 2017-09-28 触控基板及其制作和驱动方法、触控显示装置 WO2018196278A1 (zh)

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