WO2018192196A1 - 防着板及其表面处理方法、材料回收方法以及薄膜沉积设备 - Google Patents

防着板及其表面处理方法、材料回收方法以及薄膜沉积设备 Download PDF

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Publication number
WO2018192196A1
WO2018192196A1 PCT/CN2017/106116 CN2017106116W WO2018192196A1 WO 2018192196 A1 WO2018192196 A1 WO 2018192196A1 CN 2017106116 W CN2017106116 W CN 2017106116W WO 2018192196 A1 WO2018192196 A1 WO 2018192196A1
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Prior art keywords
carrier layer
substrate
plating material
solution
plating
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PCT/CN2017/106116
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English (en)
French (fr)
Inventor
徐鹏
潘晟恺
乔永康
刘杰
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京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/779,231 priority Critical patent/US20200340103A9/en
Publication of WO2018192196A1 publication Critical patent/WO2018192196A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5873—Removal of material

Definitions

  • the present disclosure relates to the field of thin film deposition, and more particularly to an anti-plate and a surface treatment method thereof, a material recovery method, and a thin film deposition apparatus.
  • a plating material from a plating material source is deposited on an inner wall of a reaction chamber, in addition to being deposited on a desired region (for example, a substrate), when a film is formed After the thickness reaches a certain level, the film peels off from the inner wall. In order to prevent the above phenomenon, it is necessary to cover the inner wall of the reaction chamber.
  • the anti-sliding plate is maintained, for example, maintenance of disassembly, replacement, and cleaning.
  • this maintenance work leads to a decrease in production efficiency and an increase in cost.
  • Embodiments of the present disclosure provide an anti-plate and a surface treatment method thereof, a material recovery method, and a thin film deposition apparatus.
  • an anti-slip plate comprising a substrate and a carrier layer on the substrate for carrying a plating material, wherein the carrier layer is capable of being peeled off from the substrate.
  • the material of the carrier layer comprises an organic material.
  • the organic material comprises rubber.
  • the carrier layer has a dense, uniform structure.
  • the plating material comprises an organic material.
  • a thin film deposition apparatus comprising any of the anti-slip sheets described in the first aspect of the present disclosure.
  • a surface treatment method for preventing a panel comprising the steps of: providing a substrate; and forming a carrier layer for carrying a plating material on the substrate, wherein the carrier layer It can be peeled off from the substrate.
  • the material of the carrier layer includes an organic material
  • forming the carrier layer on the substrate includes coating a solution containing the organic substance on a surface of the substrate; and heating the substrate to evaporate The solvent in the solution.
  • the organic material comprises rubber and the solution comprises an inorganic glue or an organic glue.
  • a material recovery method for recovering a plating material adhered to a carrier layer of any of the anti-plates described in the first aspect of the present disclosure comprising the steps of: The carrier layer is peeled off from the anti-slip sheet; and the carrier layer is processed to recover the plating material.
  • the treating comprises immersing the carrier layer in a solvent capable of dissolving the plating material to form a solution in which the plating material is dissolved; and subjecting the solution to a distillation process to obtain the Plating material.
  • the material of the carrier layer and the plating material each comprise an organic material, the material of the carrier layer having a boiling point different from the boiling point of the plating material.
  • the material of the carrier layer comprises rubber and the solvent comprises cyclohexanone, butyl acetate or butanone.
  • the treating comprises immersing the carrier layer in a solvent that only dissolves the carrier layer to form a solution; and filtering the solution to obtain the plating material.
  • the material of the carrier layer comprises rubber and the solvent comprises acetone.
  • the processing includes physically separating the plating material on the carrier layer.
  • FIG. 1 schematically illustrates a cross-sectional view of an exemplary anti-slip plate in accordance with an embodiment of the present disclosure
  • FIG. 2 schematically illustrates a cross-sectional view of an exemplary thin film deposition apparatus in accordance with an embodiment of the present disclosure
  • FIG. 3 is a flow chart schematically showing a surface treatment method of an anti-sliding plate according to an embodiment of the present disclosure
  • Figure 4 schematically shows a flow chart of a method of material recovery.
  • an element or layer when referred to as being “on” another element or layer, it may be directly on the other element or layer, or A component or layer; when a component or layer is referred to as being “under” another component or layer, it may be directly under the other component or layer, or there may be at least one intermediate component or layer; A layer is referred to as being "between” two elements or two layers, which may be a single element or layer between the two elements or two layers, or more than one intermediate element or layer may be present.
  • FIG. 1 schematically illustrates a cross-sectional view of an exemplary guard panel 10 in accordance with an embodiment of the present disclosure.
  • the anti-sliding plate 10 may include a substrate 101 and a carrier layer 102 on the substrate 101 for carrying a plating material, the carrier layer 102 being capable of being peeled off from the substrate 101.
  • the cleaning of the anti-sliding plate can be completed by means of tearing.
  • the embodiment of the present disclosure is not particularly limited as to the material of the carrier layer 102 as long as the carrier layer 102 formed of the material can be easily peeled off from the substrate 101 and is thermally stable at the deposition temperature of the plating material.
  • the material of the carrier layer 102 is selected such that it does not generate additional gas during plating.
  • the material of the carrier layer 102 may include organic matter including, but not limited to, rubber.
  • the carrier layer 102 may have a dense uniform structure and be capable of completely covering the substrate 101, thereby effectively preventing the surface of the substrate 101 from coming into contact with the plating material.
  • the carrier layer 102 has a thickness of between about 30 [mu]m and 100 [mu]m, optionally about 30 [mu]m. It can be understood that the thickness of the carrier layer 102 can be appropriately selected by those skilled in the art according to actual needs.
  • the plating material may include an organic substance such as organic light emission material.
  • the cleaning operation of the blade is completed, thereby simplifying the maintenance step and reducing the cleaning cost.
  • FIG. 2 schematically illustrates a cross-sectional view of an exemplary thin film deposition apparatus 20 in accordance with an embodiment of the present disclosure.
  • the thin film deposition apparatus 20 may include a reaction chamber 201 and a guard 10 according to the above-described embodiments of the present disclosure.
  • the anti-sliding plate 10 covers the inner wall of the reaction chamber 201.
  • thin film deposition apparatus 20 may further include a substrate 202 and a source of plating material 203.
  • the plating material from the plating material source 203 is deposited on the substrate 10 in addition to being deposited on the substrate 202.
  • the anti-sliding plate 10 is detached, and then the bearing layer on the surface thereof is peeled off. Since the cleaning method of the anti-board is simpler and faster, it does not need to be performed off-site. In practical applications, this can save on the reliance of the board maintenance operation on the additional backup board, further saving costs.
  • Embodiments of the present disclosure also provide a method of surface treatment of a plate.
  • FIG. 3 schematically shows a flow chart of a surface treatment method of a slab according to the above-described embodiment of the present disclosure. As shown in FIG. 3, the method of an embodiment of the present disclosure may include the following steps:
  • S302 forming a carrier layer for carrying a plating material on the substrate, wherein the carrier layer can be peeled off from the substrate.
  • the material of the substrate against the plate is not particularly limited, and may be a metal such as aluminum or aluminum alloy, or may be any other suitable material. Further, the embodiment of the present disclosure has no limitation on the shape of the anti-sliding plate, and an appropriate shape can be arbitrarily selected according to actual needs.
  • a carrier layer may be formed on a substrate by dissolving an organic substance in a solvent to form a solution containing the organic substance; coating the solution on a surface of the substrate; heating the substrate to evaporate the solvent in the solution, Finally, a carrier layer containing the organic substance is formed on the substrate.
  • a solution for forming a carrier layer may be applied by spraying.
  • the organic substance may include a rubber, and the rubber is dissolved in a suitable solvent to form a solution.
  • the solution may include an inorganic glue or an organic glue.
  • the application of OLED display devices is increasingly widespread.
  • the OLED display device generally includes an organic layer such as a hole injection layer, a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer, and the like.
  • these organic layers are usually formed using a physical vapor deposition apparatus such as a vacuum evaporation apparatus. Since the organic materials used for OLEDs are expensive and the material loss during deposition leads to high manufacturing costs, it is urgent to properly recycle and utilize organic materials.
  • embodiments of the present disclosure also provide a material recovery method for recovering a plating material attached on a carrier layer of a sheet according to the above embodiment of the present disclosure.
  • Figure 4 schematically shows a flow chart of a method of material recovery. As shown in FIG. 4, the method of an embodiment of the present disclosure may include the following steps:
  • the carrier layer can be peeled off from the control panel by tearing.
  • a method of processing a carrier layer may include: dipping a carrier layer into a solvent capable of dissolving a plating material to form a solution in which a plating material is dissolved; and distilling the solution at a specific temperature Process to obtain a plating material.
  • the material of the carrier layer may include an organic material such as rubber.
  • the plating material may include an organic substance such as an organic luminescent material.
  • the solvent may include cyclohexanone, butyl acetate or butanone.
  • the material of the carrier layer has a boiling point that is different from the boiling point of the plating material. Therefore, the plating material can be obtained by distillation.
  • the plating material obtained by the distillation method has high purity, and the obtained plating material can be directly reused for the thin film deposition process, thereby improving the utilization ratio of the plating material.
  • a method of processing a carrier layer may include immersing a carrier layer in a solvent that only dissolves the carrier layer to form a solution; and then filtering the solution to obtain a plating material.
  • the material of the carrier layer may include an organic material such as rubber.
  • the plating material may include an organic substance such as an organic luminescent material.
  • the solvent may include acetone.
  • the carrier layer of the material is immersed in an acetone solvent to form a solution, wherein the acetone only dissolves the rubber and does not dissolve the plating material; then the solution is filtered to filter out the undissolved plating. The material is then subjected to a drying process to obtain a plating material.
  • the method of obtaining a plating material by filtration improves the utilization ratio of the plating material and has high operability, and since the recovered plating material contains a small amount of impurities, further purification treatment is required.
  • the method of processing the carrier layer may include physically separating the plating material on the carrier layer, such as by peeling off the plating material from the carrier layer by physical methods such as scraping or raking. A plating material is obtained.
  • the method of obtaining the plating material by physical separation improves the utilization ratio of the plating material and the process is simple, but the recovered plating material has many impurity components and requires further purification treatment.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)

Abstract

一种防着板(10)，其中，包括：基板(101)；以及位于基板(101)上的用于承载镀覆材料的承载层(102)，其中承载层(102)能够从基板(101)剥离。还公开了一种薄膜沉积设备(20)，一种防着板(10)的表面处理办法以及一种材料回收方法。

Description

防着板及其表面处理方法、材料回收方法以及薄膜沉积设备
本申请要求于2017年4月18日递交的中国专利申请第201710252592.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及薄膜沉积领域，尤其涉及一种防着板及其表面处理方法、材料回收方法以及薄膜沉积设备。
背景技术
在采用物理气相沉积方法的薄膜沉积设备中，来自镀敷材料源的镀敷材料除了沉积在希望的区域(例如，基板)上之外，还会沉积在反应腔的内壁上，当形成的膜的厚度达到一定程度后，该膜便从内壁上剥落。为防止上述现象的发生，需要在反应腔的内壁覆盖防着板。当防着板上形成的膜的厚累积到一定程度时，对防着板进行维护，例如，拆卸、更换和清洁的维护等。然而，该维护工作导致生产效率的降低和成本的增加。
发明内容
本公开实施例提供了一种防着板及其表面处理方法、材料回收方法以及薄膜沉积设备。
在本公开的第一方面中，提供一种防着板，其包括基板以及位于所述基板上的用于承载镀敷材料的承载层，其中，所述承载层能够从所述基板剥离。
在一个实施例中，所述承载层的材料包括有机物。
在一个实施例中，所述有机物包括橡胶。
在一个实施例中，所述承载层具有致密均匀的结构。
在一个实施例中，所述镀敷材料包括有机物。
在本公开的第二方面中，提供一种薄膜沉积设备，其包括在本公开的第一方面中描述的任意一种防着板。
在本公开的第三方面中，提供一种防着板的表面处理方法，包括以下步骤：提供基板；以及在所述基板上形成用于承载镀敷材料的承载层，其中，所述承载层能够从所述基板剥离。
在一个实施例中，所述承载层的材料包括有机物，在所述基板上形成所述承载层包括在所述基板的表面上涂覆包含所述有机物的溶液；以及加热所述基板以蒸发所述溶液中的溶剂。
在一个实施例中，所述有机物包括橡胶，所述溶液包括无机胶水或有机胶水。
在本公开的第四方面中，提供一种材料回收方法，用于回收在本公开的第一方面中描述的任意一种防着板的承载层上附着的镀敷材料，包括以下步骤：将所述承载层从所述防着板上剥离；以及处理所述承载层以回收所述镀敷材料。
在一个实施例中，所述处理包括将所述承载层浸入能够溶解所述镀敷材料的溶剂中以形成溶解有所述镀敷材料的溶液；以及对所述溶液进行蒸馏处理以获得所述镀敷材料。
在一个实施例中，所述承载层的材料和所述镀敷材料均包括有机物，所述承载层的材料的沸点与所述镀敷材料的沸点不同。
在一个实施例中，所述承载层的材料包括橡胶，所述溶剂包括环己酮、乙酸丁酯或丁酮。
在一个实施例中，所述处理包括将所述承载层浸入仅溶解所述承载层的溶剂中以形成溶液；以及对所述溶液进行过滤处理以获得所述镀敷材料。
在一个实施例中，所述承载层的材料包括橡胶，所述溶剂包括丙酮。
在一个实施例中，所述处理包括对所述承载层上的所述镀敷材料进行物理分离。
附图说明
本文中描述的附图用于仅对所选择的实施例的说明的目的，并不是所有可能的实施方式，并且不旨在限制本申请的范围，其中：
图1示意性示出了根据本公开实施例的示例性防着板的截面图；
图2示意性示出了根据本公开实施例的示例性薄膜沉积设备的截面图；
图3示意性示出了根据本公开实施例的防着板的表面处理方法的流程图；
图4示意性示出了材料回收方法的流程图。
贯穿这些附图的各个视图，相应的参考编号指示相应的部件或特征。
具体实施方式
首先需要说明的是，除非上下文中另外明确地指出，否则在本文和所附权利要求中所使用的词语的单数形式包括复数，反之亦然。因而，当提及单数时，通常包括相应术语的复数。相似地，措辞“包含”和“包括”将解释为包含在内而不是独占性地。同样地，术语“包括”和“或”应当解释为包括在内的，除非本文中明确禁止这样的解释。在本文中使用术语“示例”之处，特别是当其位于一组术语之后时，所述“示例”仅仅是示例性的和阐述性的，且不应当被认为是独占性的或广泛性的。
此外，在附图中，为了清楚起见夸大了各层的厚度及区域。应当理解的是，术语“纵向”、“径向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的组件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开实施例的限制。此外，当元件或层被称为在另一元件或层“上”时，它可以直接在该另一元件或层上，或者可以存在中间的 元件或层；同样，当元件或层被称为在另一元件或层“下”时，它可以直接在该另一元件或层下，或者可以存在至少一个中间的元件或层；当元件或层被称为在两元件或两层“之间”时，其可以为该两元件或两层之间的唯一的元件或层，或者可以存在一个以上的中间元件或层。
现将参照附图更全面地描述示例性的实施例。
图1示意性示出了根据本公开实施例的示例性防着板10的截面图。如图1所示，防着板10可包括基板101以及位于基板101上的用于承载镀敷材料的承载层102，该承载层102能够从基板101上剥离。当需要清洁防着板时，只需要将承载层102从基板101上剥离，例如可以通过撕取的方式，即可完成对防着板的清洁。
如上所述，当需要清洁防着板时，只需要将承载层从基板上剥离即可完成清洁，因此不需要采用复杂的化学或物理的清洁方式。这种清洁方式可以减少对防着板本身的伤害，提升防着板的使用寿命。此外，由于防着板的清洁方式更加简便和快捷，因此不需要异地进行。在实际应用中，这能够节省防着板维护操作对于附加的备用防着板的依赖，进一步节约了费用。
本公开的实施例对于承载层102的材料没有特别的限制，只要该材料形成的承载层102能够从基板101容易地剥离并且在镀敷材料的沉积温度下是热稳定的即可。可选地，为了降低对反应腔内气氛的潜在影响，承载层102的材料选择为其不会在镀敷期间产生额外的气体。在一个示例实施例中，承载层102的材料可以包括有机物，该有机物包括但不限于橡胶。
在一个示例实施例中，承载层102可具有致密均匀的结构并且能够完全覆盖基板101，从而有效避免基板101的表面与镀敷材料接触。
在一个示例实施例中，承载层102的厚度为大约30μm～100μm，可选地为大约30μm。可以理解，本领域的技术人员可以根据实际需要适宜地选择承载层102的厚度。
根据本公开的一个实施例，镀敷材料可以包括有机物，例如有机发光 材料。
根据本公开的实施例，将承载层从基板上剥离后，便完成防着板的清洁操作，因此简化了维护步骤并降低了清洁费用。
图2示意性示出了根据本公开实施例的示例性薄膜沉积设备20的截面图。如图2所示，薄膜沉积设备20可包括反应腔201以及根据本公开的上述实施例的防着板10。其中，防着板10覆盖在反应腔201的内壁上。
在一个示例实施例中，薄膜沉积设备20还可包括基板202和镀敷材料源203。来自镀敷材料源203的镀敷材料除了沉积在基板202上之外，还会沉积在防着板10上。当防着板10上的镀敷材料的厚度累积到一定程度时，对防着板10进行拆卸，然后剥离其表面的承载层。由于防着板的清洁方式更加简便和快捷，因此不需要异地进行。在实际应用中，这能够节省防着板维护操作对于附加的备用防着板的依赖，进一步节约了费用。
本公开的实施例还提供一种防着板的表面处理方法。
图3示意性示出一种根据本公开的上述实施例的防着板的表面处理方法的流程图。如图3所示，本公开的实施例的方法可包括以下步骤：
S301：提供基板；
S302：在基板上形成用于承载镀敷材料的承载层，其中，承载层能够从基板剥离。
以下将对前述这些步骤进行进一步描述。由于本实施例提供的表面处理方法用于制作前述实施例中的防着板，因此在上述实施例中对相同部件的解释说明也适用于本实施例，在以下的描述中将省略重复的描述。
在S301中，对防着板的基板的材料没有特别限定，可以是诸如铝或者铝合金等的金属，也可以是任何其它适宜的材料。此外，本公开的实施例对防着板的形状没有限制，可以根据实际需要任意选择适宜的形状。
在S302中，可以通过如下方法在基板上形成承载层：将有机物溶解于溶剂中，形成包含该有机物的溶液；将该溶液涂覆在基板的表面上；加热该基板以蒸发溶液中的溶剂，最终在基板上形成含有该有机物的承载层。 根据本公开的一个实施例，可通过喷涂来施加用于形成承载层的溶液。
根据本公开的一个示例实施例，有机物可包括橡胶，将橡胶溶于适宜的溶剂中形成溶液。根据本公开的一个实施例，该溶液可包括无机胶水或有机胶水。
在基板上形成用于承载镀敷材料的承载层后，当需要清洁防着板时，只需要将承载层从基板上剥离即可完成清洁。这种清洁防着板的方式，不需要异地清洁防着板，因此比传统清洁方式更经济和快捷，节约成本并增加生产率。
OLED显示装置的应用日益广泛。OLED显示装置一般包括诸如空穴注入层、空穴传输层、电子阻挡层、发光层、空穴阻挡层、电子传输层、电子注入层等的有机层。在OLED的制造过程中，通常采用诸如真空蒸镀设备等的物理气相沉积设备来形成这些有机层。由于用于OLED的有机材料价格昂贵，沉积时的材料损失导致制造成本居高不下，因此迫切需要对有机材料进行合理回收和利用。
为此，本公开的实施例还提供一种材料回收方法，用于回收在根据本公开的上述实施例的防着板的承载层上附着的镀敷材料。
图4示意性示出了材料回收方法的流程图。如图4所示，本公开的实施例的方法可包括以下步骤：
S401：将承载层从防着板上剥离；
S402：处理承载层以回收镀敷材料。
在S401中，可以通过撕取的方式将承载层从防着板上剥离。
在S402中，在一个示例实施例中，处理承载层的方法可包括：将承载层浸入到能够溶解镀敷材料的溶剂中以形成溶解有镀敷材料的溶液；对溶液在特定温度下进行蒸馏处理，以获得镀敷材料。
在一个示例实施例中，承载层的材料可包括有机物，诸如橡胶。镀敷材料可包括有机物，诸如有机发光材料。溶剂可以包括环己酮、乙酸丁酯或丁酮。
在一个示例实施例中，承载层的材料的沸点与所述镀敷材料的沸点不同。因此，可通过蒸馏的方式获得镀敷材料。
如上所述，通过蒸馏的方法获得的镀敷材料纯度高，可以将得到的镀敷材料直接再次用于薄膜沉积工艺，进而提升了镀敷材料的利用率。
在S402中，在另一个示例实施例中，处理承载层的方法可包括：将承载层浸入仅溶解该承载层的溶剂中以形成溶液；然后对溶液进行过滤处理以获得镀敷材料。
在一个示例实施例中，承载层的材料可包括有机物，诸如橡胶。镀敷材料可包括有机物，诸如有机发光材料。溶剂可包括丙酮。
根据本公开的一个实施例，将材料为橡胶的承载层浸入丙酮溶剂以形成溶液，其中丙酮只能溶解橡胶，不能溶解镀敷材料；然后对该溶液进行过滤处理，过滤出没有溶解的镀敷材料，再对镀敷材料进行干燥处理，最终获得镀敷材料。
应当理解，只要能够溶解承载层而不能溶解镀敷材料的其它溶剂都可以应用于本公开的实施例。
如上所述，通过过滤获得镀敷材料的方法提升了镀敷材料的利用率且可操作性高，由于回收的镀敷材料中含有少量的杂质，需要进一步的提纯处理。
在S402中，在又一个示例实施例中，处理承载层的方法可包括对承载层上的镀敷材料进行物理分离，例如通过刮落或揉搓等物理方法将镀敷材料从承载层上剥离以获得镀敷材料。
如上所述，通过物理分离来获得镀敷材料的方法提升了镀敷材料的利用率且过程简单，但是回收得到的镀敷材料杂质成分多，需要进一步的提纯处理。
需要说明的是，本公开中描绘的流程图仅仅是一个例子。在不脱离本公开精神的情况下，可以存在该流程图或其中描述的步骤的很多变型。例如，所述步骤可以以不同的顺序进行，或者可以添加、删除或者修改步骤。
以上为了说明和描述的目的提供了实施例的前述描述。其并不旨在是穷举的或者限制本申请。特定实施例的各个元件或特征通常不限于特定的实施例，但是，在合适的情况下，这些元件和特征是可互换的并且可用在所选择的实施例中，即使没有具体示出或描述。同样也可以以许多方式来改变。这种改变不能被认为脱离了本申请，并且所有这些修改都包含在本申请的范围内。

Claims (15)

  1. 一种防着板，其中，包括：
    基板；以及
    位于所述基板上的用于承载镀敷材料的承载层，其中
    所述承载层能够从所述基板剥离。
  2. 根据权利要求1所述的防着板，其中，所述承载层的材料包括有机物。
  3. 根据权利要求2所述的防着板，其中，所述有机物包括橡胶。
  4. 根据权利要求1所述的防着板，其中，所述承载层具有致密均匀的结构。
  5. 根据权利要求1所述的防着板，其中，所述镀敷材料包括有机物。
  6. 一种薄膜沉积设备，其中，包括根据权利要求1-5中任一项所述的防着板。
  7. 一种防着板的表面处理方法，其中，包括以下步骤：
    提供基板；以及
    在所述基板上形成用于承载镀敷材料的承载层，其中，所述承载层能够从所述基板剥离。
  8. 根据权利要求7所述的方法，其中，所述承载层的材料包括有机物，在所述基板上形成所述承载层包括在所述基板的表面上涂覆包含所述有机物的溶液；以及加热所述基板以蒸发所述溶液中的溶剂。
  9. 根据权利要求8所述的方法，其中，所述有机物包括橡胶，所述溶液包括无机胶水或有机胶水。
  10. 一种材料回收方法，用于回收在根据权利要求1-5中任一项所述的防着板的承载层上附着的镀敷材料，其中，包括以下步骤：
    将所述承载层从所述防着板上剥离；以及
    处理所述承载层以回收所述镀敷材料。
  11. 根据权利要求10所述的方法，其中，所述处理包括将所述承载层 浸入能够溶解所述镀敷材料的溶剂中以形成溶解有所述镀敷材料的溶液；以及
    对所述溶液进行蒸馏处理以获得所述镀敷材料。
  12. 根据权利要求11所述的方法，其中，所述承载层的材料和所述镀敷材料均包括有机物，所述承载层的材料的沸点与所述镀敷材料的沸点不同。
  13. 根据权利要求12所述的方法，其中，所述承载层的材料包括橡胶，所述溶剂包括环己酮、乙酸丁酯或丁酮。
  14. 根据权利要求10所述的方法，其中，所述处理包括将所述承载层浸入仅溶解所述承载层的溶剂中以形成溶液；以及
    对所述溶液进行过滤处理以获得所述镀敷材料。
  15. 根据权利要求14所述的方法，其中，所述承载层的材料包括橡胶，所述溶剂包括丙酮。
PCT/CN2017/106116 2017-04-18 2017-10-13 防着板及其表面处理方法、材料回收方法以及薄膜沉积设备 WO2018192196A1 (zh)

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CN107043919A (zh) * 2017-04-18 2017-08-15 合肥鑫晟光电科技有限公司 防着板及其表面处理方法、材料回收方法以及薄膜沉积设备
CN107513683A (zh) * 2017-08-31 2017-12-26 深圳市华星光电技术有限公司 一种气相沉积防着板及其制作方法
CN109811341B (zh) * 2019-01-11 2021-07-09 东南大学 一种可擦除贵金属的基底及其应用
CN112680749B (zh) * 2020-12-21 2021-09-28 江苏时代华宜电子科技有限公司 一种基于真空溅射腔室的贵金属回收工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101435A (ja) * 2003-09-26 2005-04-14 Matsushita Electric Ind Co Ltd 真空処理装置用の防着板及び真空処理装置
CN201826007U (zh) * 2010-10-14 2011-05-11 北京京东方光电科技有限公司 一种防着板和薄膜沉积设备
CN103270187A (zh) * 2010-12-27 2013-08-28 夏普株式会社 蒸镀装置和回收装置
CN205529010U (zh) * 2016-03-21 2016-08-31 南京中电熊猫液晶材料科技有限公司 溅镀防着板降低peeling结构
CN106222617A (zh) * 2016-08-26 2016-12-14 武汉华星光电技术有限公司 用于镀膜设备的防着板结构及其制造方法、镀膜设备
CN107043919A (zh) * 2017-04-18 2017-08-15 合肥鑫晟光电科技有限公司 防着板及其表面处理方法、材料回收方法以及薄膜沉积设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100460558C (zh) * 1999-12-28 2009-02-11 东芝株式会社 真空成膜装置用部件及使用该部件的真空成膜装置及其觇板装置
CN103290355B (zh) * 2012-02-14 2016-03-02 金文焕 物理气相沉积的反应室腔体零件的清洁方法
KR101268916B1 (ko) * 2012-09-10 2013-05-29 신상규 유기발광재료의 회수방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005101435A (ja) * 2003-09-26 2005-04-14 Matsushita Electric Ind Co Ltd 真空処理装置用の防着板及び真空処理装置
CN201826007U (zh) * 2010-10-14 2011-05-11 北京京东方光电科技有限公司 一种防着板和薄膜沉积设备
CN103270187A (zh) * 2010-12-27 2013-08-28 夏普株式会社 蒸镀装置和回收装置
CN205529010U (zh) * 2016-03-21 2016-08-31 南京中电熊猫液晶材料科技有限公司 溅镀防着板降低peeling结构
CN106222617A (zh) * 2016-08-26 2016-12-14 武汉华星光电技术有限公司 用于镀膜设备的防着板结构及其制造方法、镀膜设备
CN107043919A (zh) * 2017-04-18 2017-08-15 合肥鑫晟光电科技有限公司 防着板及其表面处理方法、材料回收方法以及薄膜沉积设备

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