WO2018188169A1 - Recognition head - Google Patents

Recognition head Download PDF

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Publication number
WO2018188169A1
WO2018188169A1 PCT/CN2017/085488 CN2017085488W WO2018188169A1 WO 2018188169 A1 WO2018188169 A1 WO 2018188169A1 CN 2017085488 W CN2017085488 W CN 2017085488W WO 2018188169 A1 WO2018188169 A1 WO 2018188169A1
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WO
WIPO (PCT)
Prior art keywords
contact
probe
identification head
housing
outer diameter
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PCT/CN2017/085488
Other languages
French (fr)
Chinese (zh)
Inventor
王刚
段维虎
毛宏程
王波
Original Assignee
广州众诺电子技术有限公司
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Application filed by 广州众诺电子技术有限公司 filed Critical 广州众诺电子技术有限公司
Publication of WO2018188169A1 publication Critical patent/WO2018188169A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes

Definitions

  • the utility model relates to the technical field of consumables used in an imaging device, in particular to an identification head.
  • the conventional identification heads are generally one housing, and a plurality of probes are disposed in the housing, and the operation of identifying, burning, or diagnosing the chips is realized by contacting the probes with the terminals of the chips, but the existing ones are used.
  • All probe shapes of the identification head are identical in shape: the probe includes a contact for contacting the terminal 101 of the chip 100, and a mounting portion for connection to the housing.
  • the mounting portion is a hollow cylindrical shape, and the contact portion is movable relative to the hollow cylindrical portion.
  • the conventional identification head can perform operations such as identification or burning of the chip 100, the terminals of some of the chips are in the shape of a through hole, and the probe of the conventional identification head passes through the through hole to cause a contact failure. Therefore, the existing recognition head is less versatile.
  • the present invention provides an identification head of a versatile chip.
  • An identification head includes a housing, a circuit board and a probe, the circuit board is mounted in the housing, and the probe is mounted on the housing; the number of the probes is one or more; each The probes respectively include a contact portion and a mounting portion connected to the contact portion, the mounting portion is mounted to the housing; the probe is in communication with the circuit board; and the contact portions of each of the probes respectively include a connecting end and a contact end The connecting end is fixed to the contact end; the connecting end is connected to the mounting portion; the maximum outer diameter of at least one of the contact ends is greater than the maximum outer diameter of the connecting end connected thereto.
  • the maximum outer diameter of the contact end having a maximum outer diameter greater than the maximum outer diameter of the connection end to which it is connected is less than twice the distance between adjacent two probes.
  • the shape of the contact end having a maximum outer diameter larger than the maximum outer diameter of the connection end to which it is connected is a cylindrical shape, a hemispherical shape, a cylindrical shape, a truncated cone shape, or a cylindrical body having a curved surface on the side surface.
  • the mounting portion is a hollow cylindrical body and is open at least at one end; the connecting end is movably inserted into the mounting portion, and the contact portion extends outside the open end of the mounting portion.
  • the probe further comprises an elastic member; the elastic member is disposed in the contact portion and is in contact with the connecting end.
  • the identification head further comprises a positioning plate; the positioning plate is mounted in the housing, and the probe is mounted on the positioning plate.
  • the number of the positioning plates includes two or more.
  • At least one of the positioning plates is provided with a communication line, and the probe communicates with the circuit board through the communication line.
  • the housing includes a base and a cover; the base is provided with an installation space, and a peripheral wall is formed around the installation space; the circuit board is installed in the installation space; and the bayonet is opened on the peripheral wall; The positioning plate is inserted into the installation space and is engaged with the bayonet.
  • each of the positioning plates is disposed in parallel in the housing; each positioning plate is divided into Perforations are provided, the probes pass through the perforations, and the probes are respectively disposed perpendicular to the positioning plate.
  • the identification head of the present invention increases the maximum outer diameter of the contact end of the at least one probe so that it can smoothly contact the chip with the through-hole terminal, and the shape of the through hole of the terminal It can be round, polygonal, D-shaped or elliptical.
  • the identification head of the utility model can still contact the chip without the through-hole terminal, and by increasing the maximum outer diameter of one or more contact ends, the identification head can be used for more types of chips, and can also be probed.
  • the pin is in better contact with the terminal of the chip.
  • FIG. 1 is a schematic structural view of an identification head and a chip having a through hole in the prior art
  • FIG. 2 is a schematic structural view of an identification head in an embodiment of the present invention.
  • FIG. 3 is an exploded perspective view of the identification head shown in FIG. 2.
  • the embodiment provides an identification head including a housing 1, a circuit board 2, and a probe 3.
  • the circuit board 2 is mounted in the housing 1.
  • the probe 3 is mounted to the housing 1.
  • the number of the probes 3 is one or more.
  • Each of the probes 3 includes a contact portion 31 and a mounting portion 32 connected to the contact portion 31, and the mounting portion 32 is attached to the housing 1.
  • the contact portion 31 can be used when it is required to communicate with the chip 100 through the identification head. It can be used to contact the terminal 101 of the chip 100.
  • the probe 3 is in communication with the circuit board. After the probe 3 is in contact with the terminal 101 of the chip 100, the chip 100 can exchange data with the circuit board 2 in the identification head through the probe 3.
  • the housing 1 includes a base 11 and a cover 12 .
  • the base 11 is provided with an installation space 110, and a peripheral wall 111 is formed around the installation space 110.
  • the circuit board 2 is mounted in the installation space 110.
  • a bayonet 113 is opened on the peripheral wall 111.
  • a portion of the mounting portion 32 is inserted into the mounting space 110, and a remaining portion extends through the peripheral wall 111 of the mounting space 110 outside the mounting space 110.
  • the contact portion 31 of each of the probes 3 includes a connection end 311 and a contact end 312.
  • the connection end 311 can be used to connect with the mounting portion 32, which can be used to contact the terminal 101 of the chip 100.
  • the connection end 311 is fixed to the contact end 312.
  • the connecting end 311 is connected to the mounting portion 32.
  • the maximum outer diameter of at least one of the contact ends 312 is greater than the maximum outer diameter of the connection end 311 connected thereto; specifically, the maximum outer diameter of the contact end 312 is greater than or equal to the aperture of the circular hole of the chip 100 shown in FIG.
  • the aperture may be about 5 mm.
  • the maximum outer diameter of the contact end 312 having a maximum outer diameter greater than the maximum outer diameter of the connecting end 311 to which it is connected is less than twice the spacing between adjacent two probes 3.
  • the spacing between the two probes 3 can range from about 3 to 8 mm. In this way, a gap can be formed between the contact end 312 and the adjacent probe 3 to prevent the contact end 312 from coming into contact with the adjacent probe 3 to cause a short circuit.
  • the shape of the contact end 312 whose maximum outer diameter is larger than the maximum outer diameter of the connecting end 311 connected thereto is a spherical shape, a hemispherical shape, a cylindrical shape, a truncated cone shape or a side mask.
  • the columnar body having the curved surface 313 on the side may be as shown in FIG. 2, the side surface of the contact end 312 and the end surface for contacting the chip 100 are smoothly connected by the curved surface 313, and the outer diameter of the curved surface 313 is
  • the direction in which the side faces are directed to the end face for contact with the chip 100 is sequentially decreased, and the direction can be referred to the F direction in FIG.
  • the mounting portion 32 is connected to the contact portion 31 in a movable manner.
  • the mounting portion 32 is a hollow columnar body and is open at least at one end.
  • one end of the opening of the mounting portion 32 extends outside the installation space 110.
  • the connecting end 311 is inserted into the mounting portion 32 in a movable manner, and the contact portion 31 extends outside the open end of the mounting portion 32.
  • the identification head After the probe 3 is in contact with the chip 100, the identification head is moved in the direction of the chip 100 by an external force, so that the connection end 311 can slide inside the mounting portion 32, so that the length of the probe 3 is shortened, so that The length of the probe 3 that is in contact with the chip 100 is shortened to a larger extent, and the probe 3 that is in contact with the chip 3 is also better contacted with the chip 100.
  • the probe further includes an elastic member (not shown); the elastic member is disposed in the contact portion 31 and is in contact with the connecting end 311. Specifically, when the probe 3 is shortened, the elastic member is in a compressed state, and when the external force is revoked, the probe 3 can be automatically reset to the original state by the elastic member.
  • the elastic member may be a spring. Contact of the connecting end 311 of the contact portion 31 by the elastic member makes it possible for the contact end 312 to better contact the terminal 101 on the chip 100 when the probe 3 comes into contact with the chip 100.
  • the identification head of the embodiment may further include a positioning plate 4.
  • the positioning plate 4 is mounted in the housing 1 , and the probe is mounted on the positioning plate 4 .
  • the probe 3 can be positioned on the housing 1 through the positioning plate 4 to prevent the probe 3 from loosening after a certain period of use.
  • the number of the positioning plates 4 includes two or more. At least one of the positioning plates 4 is provided with a communication line, and the probe 3 communicates with the circuit board 2 through the communication line.
  • the communication line is electrically connected to the probe 3 and the circuit board 2 so that signals can be transmitted between the communication line, the probe 3 and the circuit board 2.
  • Each of the positioning plates 4 is disposed in parallel in the housing 1 . Perforations are respectively formed in each of the positioning plates 4.
  • the probe 3 passes through the perforations of the respective positioning plates.
  • the mounting portion 32 passes through the perforations of the respective positioning plates, and the mounting portion 32 is fixedly coupled to the positioning plate 4.
  • Positioning the probe 3 by a plurality of positioning plates 4 makes the probe 3 more stable, preventing the probe 3 from loosening after a certain period of use.
  • Each of the probes 3 is disposed perpendicular to the positioning plate 4, respectively.
  • the positioning plate 4 is inserted into the installation space 110 and is engaged with the bayonet 113.
  • the identification head of the present invention increases the maximum outer diameter of the contact end 312 of the at least one probe 3 so that it can smoothly contact the chip 100 having the through-hole terminal 101.
  • the shape of the through hole of the terminal 101 may be a circle, a polygon, a D shape, an ellipse or the like.
  • the identification head of the present invention can of course still be in contact with the chip 100 in which the through-hole terminal 101 is not present, by increasing the maximum outer diameter of one or more of the contact ends 312 to increase the contact end 312 and
  • the contact area when the terminal 101 of the chip 100 contacts may be such that the contact end 312 of the probe 3 is connected to the terminal 101 of the chip 100. Touch better.
  • the present invention thus enables the identification head to be used in more types of chips 100 by increasing the maximum outer diameter of one or more contact ends 312, and also allows the probes 3 to be in better contact with the terminals 101 of the chip 100. Furthermore, by increasing the maximum outer diameter of the contact end 312 of the partial probe 3, the corresponding probe 3 and the other probes 3 are stored in a difference in shape, avoiding contact between the probe 3 and the terminal 101 of the chip 100. The phenomenon of reversal occurs, which further improves the practicality of the recognition head. It should be noted that the identification head of the present invention can be used alone as an identification head, or can be connected to a multi-function chip burner or identifier.

Abstract

A Recognition head, comprising a housing (1), a circuit board (2), and probes (3). The circuit board (2) is mounted in the housing (1). The probes (3) are mounted on the housing (1). There are one or more probes (3). Each probe (3) separately comprises a contact portion (31) and a mounting portion (32) connected to the contact portion (31). The mounting portion (32) is mounted on the housing (1). The probes (3) are communicated with the circuit board (2). The contact portion (31) of each probe (3) separately comprises a connecting end (311) and a contact end (312). The connecting end (311) is fixedly connected to the contact end (312). The connecting end (311) is connected to the mounting portion (32). The maximum outer diameter of at least one contact end (312) is greater than that of the connecting end (311) connected thereto. According to the recognition head, by increasing the maximum outer diameter of the contact end (321) of at least one probe (3), the recognition head can be applied to more types of chips, and the probes (3) are in better contact with the chip terminals.

Description

识别头Identification head 技术领域Technical field
本实用新型涉及应用于成像设备使用的耗材的技术领域,具体涉及一种识别头。The utility model relates to the technical field of consumables used in an imaging device, in particular to an identification head.
背景技术Background technique
参照图1,现有的识别头通常都是一个壳体,在壳体设置多个探针,通过探针与芯片的端子接触实现对芯片进行识别、烧录或者诊断等操作,但是现有的识别头的所有探针形状都是相同的,其形状为:所述探针包括用于与芯片100的端子101接触的接触部,及用于与壳体连接的安装部。所述安装部为空心的圆柱形,接触部可以相对空心圆柱形的部分活动。Referring to FIG. 1, the conventional identification heads are generally one housing, and a plurality of probes are disposed in the housing, and the operation of identifying, burning, or diagnosing the chips is realized by contacting the probes with the terminals of the chips, but the existing ones are used. All probe shapes of the identification head are identical in shape: the probe includes a contact for contacting the terminal 101 of the chip 100, and a mounting portion for connection to the housing. The mounting portion is a hollow cylindrical shape, and the contact portion is movable relative to the hollow cylindrical portion.
现有的识别头虽然可以对芯片100进行识别或烧录等操作,但是部分芯片的端子为通孔状的情况,现有的识别头的探针会穿过通孔导致出现接触不良的现象。因此,现有的识别头的通用性较差。Although the conventional identification head can perform operations such as identification or burning of the chip 100, the terminals of some of the chips are in the shape of a through hole, and the probe of the conventional identification head passes through the through hole to cause a contact failure. Therefore, the existing recognition head is less versatile.
实用新型内容Utility model content
为解决上述问题,本实用新型提供一种通用性好的芯片的识别头。In order to solve the above problems, the present invention provides an identification head of a versatile chip.
一种识别头,包括壳体、电路板及探针,所述电路板安装于壳体内,所述探针安装于壳体;所述探针的数量为一个或者一个以上;各 所述探针分别包括接触部及与接触部连接的安装部,所述安装部安装于壳体;所述探针与线路板连通;各所述探针的接触部分别包括连接端与接触端,该连接端与接触端固接;所述连接端与安装部连接;至少一个所述接触端的最大外径大于与其连接的连接端的最大外径。An identification head includes a housing, a circuit board and a probe, the circuit board is mounted in the housing, and the probe is mounted on the housing; the number of the probes is one or more; each The probes respectively include a contact portion and a mounting portion connected to the contact portion, the mounting portion is mounted to the housing; the probe is in communication with the circuit board; and the contact portions of each of the probes respectively include a connecting end and a contact end The connecting end is fixed to the contact end; the connecting end is connected to the mounting portion; the maximum outer diameter of at least one of the contact ends is greater than the maximum outer diameter of the connecting end connected thereto.
优选地,最大外径大于与其连接的连接端的最大外径的接触端的最大外径小于相邻两个探针之间间距的两倍。Preferably, the maximum outer diameter of the contact end having a maximum outer diameter greater than the maximum outer diameter of the connection end to which it is connected is less than twice the distance between adjacent two probes.
优选地,最大外径大于与其连接的连接端的最大外径的接触端的形状为圆球状、半球状、圆柱状、圆台状或者侧面具有弧面的柱状体。Preferably, the shape of the contact end having a maximum outer diameter larger than the maximum outer diameter of the connection end to which it is connected is a cylindrical shape, a hemispherical shape, a cylindrical shape, a truncated cone shape, or a cylindrical body having a curved surface on the side surface.
优选地,所述安装部为中空的柱状体且至少一端开口;所述连接端以可活动的方式穿插于安装部内,且所述接触部延伸于安装部开口端的外部。Preferably, the mounting portion is a hollow cylindrical body and is open at least at one end; the connecting end is movably inserted into the mounting portion, and the contact portion extends outside the open end of the mounting portion.
优选地,所述探针还包括弹性件;所述弹性件设置于接触部内,且与所述连接端接触。Preferably, the probe further comprises an elastic member; the elastic member is disposed in the contact portion and is in contact with the connecting end.
优选地,该识别头还包括定位板;所述定位板安装于壳体内,所述探针安装于所述定位板。Preferably, the identification head further comprises a positioning plate; the positioning plate is mounted in the housing, and the probe is mounted on the positioning plate.
优选地,所述定位板的数量包括两个或者两个以上。Preferably, the number of the positioning plates includes two or more.
优选地,至少一个所述定位板上设置有通信线路,所述探针通过所述通信线路与所述电路板连通。Preferably, at least one of the positioning plates is provided with a communication line, and the probe communicates with the circuit board through the communication line.
优选地,所述壳体包括底座与盖体;所述底座设置有安装空间,并在安装空间周边形成有周壁;所述电路板安装于安装空间内;所述周壁上开设有卡口;所述定位板穿插于安装空间内并与卡口卡接。Preferably, the housing includes a base and a cover; the base is provided with an installation space, and a peripheral wall is formed around the installation space; the circuit board is installed in the installation space; and the bayonet is opened on the peripheral wall; The positioning plate is inserted into the installation space and is engaged with the bayonet.
优选地,所述各所述定位板平行地设置于壳体内;各定位板上分 别开设有穿孔,所述探针穿过所述穿孔,各探针分别与所述定位板垂直设置。Preferably, each of the positioning plates is disposed in parallel in the housing; each positioning plate is divided into Perforations are provided, the probes pass through the perforations, and the probes are respectively disposed perpendicular to the positioning plate.
本实用新型的有益效果:The beneficial effects of the utility model:
与现有技术,本实用新型所述识别头通过将至少一个探针的接触端最大外径增大,使得其能顺利的与具有通孔状端子的芯片良好接触,所述端子的通孔形状可为圆形、多边形、D字形或者椭圆形等。当然实用新型所述识别头仍然能与不存在通孔端子的芯片接触,通过增大一个或者多个接触端的最大外径,使得该识别头能通用于更多类型的芯片,并且还能使得探针与芯片的端子接触更好。Compared with the prior art, the identification head of the present invention increases the maximum outer diameter of the contact end of the at least one probe so that it can smoothly contact the chip with the through-hole terminal, and the shape of the through hole of the terminal It can be round, polygonal, D-shaped or elliptical. Of course, the identification head of the utility model can still contact the chip without the through-hole terminal, and by increasing the maximum outer diameter of one or more contact ends, the identification head can be used for more types of chips, and can also be probed. The pin is in better contact with the terminal of the chip.
附图说明DRAWINGS
图1为现有技术中识别头及具有通孔芯片的结构示意图;1 is a schematic structural view of an identification head and a chip having a through hole in the prior art;
图2为本实用新型的实施例中一种识别头结构示意图;2 is a schematic structural view of an identification head in an embodiment of the present invention;
图3为图2所示识别头的分解示意图。3 is an exploded perspective view of the identification head shown in FIG. 2.
具体实施方式detailed description
下面,结合附图以及具体实施方式,对本实用新型做进一步描述:Hereinafter, the present invention will be further described in conjunction with the drawings and specific embodiments:
参照图2与图3,本实施例提供一种识别头包括壳体1、电路板2及探针3。所述电路板2安装于壳体1内。所述探针3安装于壳体1。所述探针3的数量为一个或者一个以上。各所述探针3分别包括接触部31及与接触部31连接的安装部32,所述安装部32安装于壳体1。当需要通过识别头与芯片100进行通信时,可将所述接触部31 可用于与芯片100的端子101接触。所述探针3与线路板连通,所述探针3在与芯片100的端子101接触之后,芯片100可通过探针3与识别头内的电路板2进行数据交换。Referring to FIG. 2 and FIG. 3, the embodiment provides an identification head including a housing 1, a circuit board 2, and a probe 3. The circuit board 2 is mounted in the housing 1. The probe 3 is mounted to the housing 1. The number of the probes 3 is one or more. Each of the probes 3 includes a contact portion 31 and a mounting portion 32 connected to the contact portion 31, and the mounting portion 32 is attached to the housing 1. The contact portion 31 can be used when it is required to communicate with the chip 100 through the identification head. It can be used to contact the terminal 101 of the chip 100. The probe 3 is in communication with the circuit board. After the probe 3 is in contact with the terminal 101 of the chip 100, the chip 100 can exchange data with the circuit board 2 in the identification head through the probe 3.
所述壳体1包括底座11与盖体12。所述底座11设置有安装空间110,并在安装空间110周边形成有周壁111。所述电路板2安装于安装空间110内。所述周壁111上开设有卡口113。所述安装部32的部分穿插于安装空间110内,剩余部分穿过安装空间110的周壁111延伸于安装空间110外部。The housing 1 includes a base 11 and a cover 12 . The base 11 is provided with an installation space 110, and a peripheral wall 111 is formed around the installation space 110. The circuit board 2 is mounted in the installation space 110. A bayonet 113 is opened on the peripheral wall 111. A portion of the mounting portion 32 is inserted into the mounting space 110, and a remaining portion extends through the peripheral wall 111 of the mounting space 110 outside the mounting space 110.
各所述探针3的接触部31包括连接端311与接触端312。所述连接端311可用于与安装部32连接,所述接触端312可用于与芯片100的端子101接触。该连接端311与接触端312固接。所述连接端311与安装部32连接。至少一个所述接触端312的最大外径大于与其连接的连接端311的最大外径;具体地,所述接触端312的最大外径大于或等于图1中所示芯片100圆孔的孔径,所述孔径可为5mm左右。The contact portion 31 of each of the probes 3 includes a connection end 311 and a contact end 312. The connection end 311 can be used to connect with the mounting portion 32, which can be used to contact the terminal 101 of the chip 100. The connection end 311 is fixed to the contact end 312. The connecting end 311 is connected to the mounting portion 32. The maximum outer diameter of at least one of the contact ends 312 is greater than the maximum outer diameter of the connection end 311 connected thereto; specifically, the maximum outer diameter of the contact end 312 is greater than or equal to the aperture of the circular hole of the chip 100 shown in FIG. The aperture may be about 5 mm.
作为优选方案,最大外径大于与其连接的连接端311的最大外径的接触端312的最大外径小于相邻两个探针3之间间距的两倍。两个探针3之间的间距取值范围可为3-8mm左右。如此可以使得该接触端312与相邻探针3之间有间隙,防止该接触端312子与相邻探针3接触出现短路的情况。Preferably, the maximum outer diameter of the contact end 312 having a maximum outer diameter greater than the maximum outer diameter of the connecting end 311 to which it is connected is less than twice the spacing between adjacent two probes 3. The spacing between the two probes 3 can range from about 3 to 8 mm. In this way, a gap can be formed between the contact end 312 and the adjacent probe 3 to prevent the contact end 312 from coming into contact with the adjacent probe 3 to cause a short circuit.
作为优选方案,最大外径大于与其连接的连接端311的最大外径的接触端312的形状为圆球状、半球状、圆柱状、圆台状或者侧面具 有弧面313的柱状体。侧面具有弧面313的柱状体可如图2所示,所述接触端312的侧面与用于与芯片100接触的端面通过弧面313平滑过渡连接,且所述弧面313的外径由所述侧面指向用于与芯片100接触的端面的方向顺次递减,该方向可参照图3中的F方向。Preferably, the shape of the contact end 312 whose maximum outer diameter is larger than the maximum outer diameter of the connecting end 311 connected thereto is a spherical shape, a hemispherical shape, a cylindrical shape, a truncated cone shape or a side mask. A columnar body having a curved surface 313. The columnar body having the curved surface 313 on the side may be as shown in FIG. 2, the side surface of the contact end 312 and the end surface for contacting the chip 100 are smoothly connected by the curved surface 313, and the outer diameter of the curved surface 313 is The direction in which the side faces are directed to the end face for contact with the chip 100 is sequentially decreased, and the direction can be referred to the F direction in FIG.
作为优选的方案,为了使得识别头多个探针3均能与芯片100接触的更为稳固,所述安装部32与接触部31以可活动的方式连接。具体地,所述安装部32为中空的柱状体且至少一端开口。优选的,所述安装部32开口的一端延伸于安装空间110的外部。所述连接端311以可活动的方式穿插于安装部32内,且所述接触部31延伸于安装部32开口端的外部。当所述探针3与芯片100接触之后,通过外力推动识别头朝着芯片100的方向运动,可以使得所述连接端311在安装部32内部滑动,从而使得探针3的长度缩短,如此可以使得与芯片100先接触的探针3长度缩短更大,保证后接触的探针3也能更好的与芯片100接触。As a preferred solution, in order to make the identification head plurality of probes 3 more stable in contact with the chip 100, the mounting portion 32 is connected to the contact portion 31 in a movable manner. Specifically, the mounting portion 32 is a hollow columnar body and is open at least at one end. Preferably, one end of the opening of the mounting portion 32 extends outside the installation space 110. The connecting end 311 is inserted into the mounting portion 32 in a movable manner, and the contact portion 31 extends outside the open end of the mounting portion 32. After the probe 3 is in contact with the chip 100, the identification head is moved in the direction of the chip 100 by an external force, so that the connection end 311 can slide inside the mounting portion 32, so that the length of the probe 3 is shortened, so that The length of the probe 3 that is in contact with the chip 100 is shortened to a larger extent, and the probe 3 that is in contact with the chip 3 is also better contacted with the chip 100.
为了使得所述探针3在缩短之后能自动复位,所述探针还包括弹性件(图中未示出);所述弹性件设置于接触部31内,且与所述连接端311接触。具体的,当所述探针3缩短时所述弹性件呈压缩状态,当外力被撤销时,可通过弹性件使得探针3自动复位至原始状态。所述弹性件可为弹簧。通过弹性件与接触部31的连接端311接触可以使得当探针3与芯片100接触时,两者接触端312更好地与芯片100上的端子101接触。In order to allow the probe 3 to be automatically reset after being shortened, the probe further includes an elastic member (not shown); the elastic member is disposed in the contact portion 31 and is in contact with the connecting end 311. Specifically, when the probe 3 is shortened, the elastic member is in a compressed state, and when the external force is revoked, the probe 3 can be automatically reset to the original state by the elastic member. The elastic member may be a spring. Contact of the connecting end 311 of the contact portion 31 by the elastic member makes it possible for the contact end 312 to better contact the terminal 101 on the chip 100 when the probe 3 comes into contact with the chip 100.
由于当探针3与芯片100接触时,通常会存在一定的推力,从而 在使用一段时间之后探针3容易松动。作为优选方案,为了防止探针3松动,本实施例的识别头还可以包括定位板4。所述定位板4安装于壳体1内,所述探针安装于所述定位板4。可通过定位板4将探针3定位于壳体1上,防止探针3在使用一定时间后出现松动的情况。优选地,所述定位板4的数量包括两个或者两个以上。至少一个所述定位板4上设置有通信线路,所述探针3通过所述通信线路与所述电路板2连通。所述通信线路与探针3及电路板2均导通,使得信号可以在通信线路、探针3及电路板2之间传输。Since when the probe 3 is in contact with the chip 100, there is usually a certain thrust, thereby The probe 3 is easily loosened after a period of use. As a preferred solution, in order to prevent the probe 3 from loosening, the identification head of the embodiment may further include a positioning plate 4. The positioning plate 4 is mounted in the housing 1 , and the probe is mounted on the positioning plate 4 . The probe 3 can be positioned on the housing 1 through the positioning plate 4 to prevent the probe 3 from loosening after a certain period of use. Preferably, the number of the positioning plates 4 includes two or more. At least one of the positioning plates 4 is provided with a communication line, and the probe 3 communicates with the circuit board 2 through the communication line. The communication line is electrically connected to the probe 3 and the circuit board 2 so that signals can be transmitted between the communication line, the probe 3 and the circuit board 2.
所述各所述定位板4平行地设置于壳体1内。各定位板4上分别开设有穿孔。所述探针3穿过各个定位板的所述穿孔。优选的,所述安装部32穿过各个定位板的所述穿孔,并且安装部32与所述定位板4固定连接。通过多个定位板4对探针3进行定位使得探针3更为稳固,防止在使用一定时间后探针3出现松动的现象。各探针3分别与所述定位板4垂直设置。所述定位板4穿插于安装空间110内并与卡口113卡接。Each of the positioning plates 4 is disposed in parallel in the housing 1 . Perforations are respectively formed in each of the positioning plates 4. The probe 3 passes through the perforations of the respective positioning plates. Preferably, the mounting portion 32 passes through the perforations of the respective positioning plates, and the mounting portion 32 is fixedly coupled to the positioning plate 4. Positioning the probe 3 by a plurality of positioning plates 4 makes the probe 3 more stable, preventing the probe 3 from loosening after a certain period of use. Each of the probes 3 is disposed perpendicular to the positioning plate 4, respectively. The positioning plate 4 is inserted into the installation space 110 and is engaged with the bayonet 113.
综上所述,本实用新型所述识别头通过将至少一个探针3的接触端312最大外径增大,使得其能顺利的与具有通孔端子101的芯片100良好接触。所述端子101的通孔形状可为圆形、多边形、D字形或者椭圆形等。本实用新型所述的识别头当然仍然能与不存在通孔端子101的芯片100接触,通过将其中的一个或者多个接触端312子的最大外径增大相当于增大了接触端312与芯片100的端子101接触时的接触面积,可以使得探针3的接触端312与芯片100的端子101接 触的更好。因此本实用新型通过增大一个或者多个接触端312的最大外径,使得该识别头能通用于更多类型的芯片100,并且还能使得探针3与芯片100的端子101接触更好。此外通过将部分探针3的接触端312子的最大外径增大,使得相应的探针3与其他探针3在外形上存储差别,避免在将探针3与芯片100的端子101接触时出现接反的现象,进而提高识别头的实用性。需要说明的是,本实用新型所述的识别头可以单独作为识别头使用,也可以连接于具有多功能的芯片烧录器或者识别器上使用。In summary, the identification head of the present invention increases the maximum outer diameter of the contact end 312 of the at least one probe 3 so that it can smoothly contact the chip 100 having the through-hole terminal 101. The shape of the through hole of the terminal 101 may be a circle, a polygon, a D shape, an ellipse or the like. The identification head of the present invention can of course still be in contact with the chip 100 in which the through-hole terminal 101 is not present, by increasing the maximum outer diameter of one or more of the contact ends 312 to increase the contact end 312 and The contact area when the terminal 101 of the chip 100 contacts may be such that the contact end 312 of the probe 3 is connected to the terminal 101 of the chip 100. Touch better. The present invention thus enables the identification head to be used in more types of chips 100 by increasing the maximum outer diameter of one or more contact ends 312, and also allows the probes 3 to be in better contact with the terminals 101 of the chip 100. Furthermore, by increasing the maximum outer diameter of the contact end 312 of the partial probe 3, the corresponding probe 3 and the other probes 3 are stored in a difference in shape, avoiding contact between the probe 3 and the terminal 101 of the chip 100. The phenomenon of reversal occurs, which further improves the practicality of the recognition head. It should be noted that the identification head of the present invention can be used alone as an identification head, or can be connected to a multi-function chip burner or identifier.
对本领域的技术人员来说,可根据以上描述的技术方案以及构思,做出其它各种相应的改变以及形变,而所有的这些改变以及形变都应该属于本实用新型权利要求的保护范围之内。 Various other changes and modifications may be made by those skilled in the art in light of the above-described technical solutions and concepts, and all such changes and modifications are intended to fall within the scope of the appended claims.

Claims (10)

  1. 一种识别头,包括壳体、电路板及探针,所述电路板安装于壳体内,所述探针安装于壳体;所述探针的数量为一个或者一个以上;各所述探针分别包括接触部及与接触部连接的安装部,所述安装部安装于壳体;所述探针与线路板连通;其特征在于:各所述探针的接触部分别包括连接端与接触端,该连接端与接触端固接;所述连接端与安装部连接;至少一个所述接触端的最大外径大于与其连接的连接端的最大外径。An identification head comprising a housing, a circuit board and a probe, the circuit board being mounted in the housing, the probe being mounted on the housing; the number of the probes being one or more; each of the probes Each includes a contact portion and a mounting portion connected to the contact portion, the mounting portion is mounted to the housing; the probe is in communication with the circuit board; and the contact portions of the probes respectively include a connecting end and a contact end The connecting end is fixed to the contact end; the connecting end is connected to the mounting portion; the maximum outer diameter of at least one of the contact ends is greater than the maximum outer diameter of the connecting end connected thereto.
  2. 根据权利要求1所述的识别头,其特征在于:最大外径大于与其连接的连接端的最大外径的接触端的最大外径小于相邻两个探针之间间距的两倍。The identification head according to claim 1, wherein a maximum outer diameter of the contact end having a maximum outer diameter greater than a maximum outer diameter of the connection end to which it is connected is less than twice a distance between adjacent two probes.
  3. 根据权利要求1或2所述的识别头,其特征在于:最大外径大于与其连接的连接端的最大外径的接触端的形状为圆球状、半球状、圆柱状、圆台状或者侧面具有弧面的柱状体。The identification head according to claim 1 or 2, wherein the contact end having a maximum outer diameter larger than a maximum outer diameter of the connection end connected thereto is spherical, hemispherical, cylindrical, round, or curved on the side. Columnar body.
  4. 根据权利要求1或2所述的识别头,其特征在于:所述安装部为中空的柱状体且至少一端开口;所述连接端以可活动的方式穿插于安装部内,且所述接触部延伸于安装部开口端的外部。The identification head according to claim 1 or 2, wherein the mounting portion is a hollow cylindrical body and at least one end is open; the connecting end is movably inserted in the mounting portion, and the contact portion extends Outside the open end of the mounting section.
  5. 根据权利要求4所述的识别头,其特征在于:所述探针还包括弹性件;所述弹性件设置于接触部内,且与所述连接端接触。The identification head according to claim 4, wherein the probe further comprises an elastic member; the elastic member is disposed in the contact portion and is in contact with the connecting end.
  6. 根据权利要求1或2所述的识别头,其特征在于:该识别头还包括定位板;所述定位板安装于壳体内,所述探针安装于所述定位板。The identification head according to claim 1 or 2, wherein the identification head further comprises a positioning plate; the positioning plate is mounted in the housing, and the probe is mounted on the positioning plate.
  7. 根据权利要求6所述的识别头,其特征在于:所述定位板的 数量包括两个或者两个以上。The identification head according to claim 6, wherein: said positioning plate The number includes two or more.
  8. 根据权利要求7所述的识别头,其特征在于:至少一个所述定位板上设置有通信线路,所述探针通过所述通信线路与所述电路板连通。The identification head according to claim 7, wherein at least one of said positioning plates is provided with a communication line, and said probe communicates with said circuit board through said communication line.
  9. 根据权利要求6所述的识别头,其特征在于:所述壳体包括底座与盖体;所述底座设置有安装空间,并在安装空间周边形成有周壁;所述电路板安装于安装空间内;所述周壁上开设有卡口;所述定位板穿插于安装空间内并与卡口卡接。The identification head according to claim 6, wherein the housing comprises a base and a cover; the base is provided with an installation space, and a peripheral wall is formed around the installation space; the circuit board is installed in the installation space a bayonet is formed on the peripheral wall; the positioning plate is inserted into the installation space and is engaged with the bayonet.
  10. 根据权利要求6所述的识别头,其特征在于:所述各所述定位板平行地设置于壳体内;各定位板上分别开设有穿孔,所述探针穿过各定位板的所述穿孔,各探针分别与所述定位板垂直设置。 The identification head according to claim 6, wherein each of the positioning plates is disposed in parallel in the housing; each of the positioning plates is respectively provided with a through hole, and the probe passes through the through hole of each positioning plate. Each probe is disposed perpendicular to the positioning plate.
PCT/CN2017/085488 2017-04-13 2017-05-23 Recognition head WO2018188169A1 (en)

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CN201720383216.XU CN206945760U (en) 2017-04-13 2017-04-13 Identify head

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201359614Y (en) * 2009-02-26 2009-12-09 沈芳珍 Testing probe needle
CN202083776U (en) * 2011-05-24 2011-12-21 珠海天威技术开发有限公司 Testing needle plate for printing consumable chips and testing machine
CN202210138U (en) * 2011-08-12 2012-05-02 珠海天威技术开发有限公司 Test machine, code writing machine and code writing/test all-in-one used for printing consumable chip
CN203759064U (en) * 2013-12-23 2014-08-06 深圳深爱半导体股份有限公司 Probe box
US9222961B1 (en) * 2014-07-29 2015-12-29 Chung Hua University Vertical probe card and method for manufacturing the same
CN205561733U (en) * 2016-04-21 2016-09-07 东莞市誉铭新精密技术股份有限公司 Degree of depth detection mechanism's probe facility

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201359614Y (en) * 2009-02-26 2009-12-09 沈芳珍 Testing probe needle
CN202083776U (en) * 2011-05-24 2011-12-21 珠海天威技术开发有限公司 Testing needle plate for printing consumable chips and testing machine
CN202210138U (en) * 2011-08-12 2012-05-02 珠海天威技术开发有限公司 Test machine, code writing machine and code writing/test all-in-one used for printing consumable chip
CN203759064U (en) * 2013-12-23 2014-08-06 深圳深爱半导体股份有限公司 Probe box
US9222961B1 (en) * 2014-07-29 2015-12-29 Chung Hua University Vertical probe card and method for manufacturing the same
CN205561733U (en) * 2016-04-21 2016-09-07 东莞市誉铭新精密技术股份有限公司 Degree of depth detection mechanism's probe facility

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