WO2018185973A1 - Procédé et dispositif de surveillance de traitement au laser - Google Patents

Procédé et dispositif de surveillance de traitement au laser Download PDF

Info

Publication number
WO2018185973A1
WO2018185973A1 PCT/JP2017/042882 JP2017042882W WO2018185973A1 WO 2018185973 A1 WO2018185973 A1 WO 2018185973A1 JP 2017042882 W JP2017042882 W JP 2017042882W WO 2018185973 A1 WO2018185973 A1 WO 2018185973A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
output signal
sensor output
laser
light
Prior art date
Application number
PCT/JP2017/042882
Other languages
English (en)
Japanese (ja)
Inventor
淳 梁瀬
雄祐 西崎
Original Assignee
株式会社アマダミヤチ
株式会社アマダホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アマダミヤチ, 株式会社アマダホールディングス filed Critical 株式会社アマダミヤチ
Priority to JP2019511061A priority Critical patent/JPWO2018185973A1/ja
Publication of WO2018185973A1 publication Critical patent/WO2018185973A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B23K26/22—Spot welding

Definitions

  • the present invention relates to a laser processing monitoring method and a monitoring apparatus used for monitoring laser processing performed by irradiating a workpiece with pulsed laser light and melting the workpiece with laser energy. More specifically, the present invention relates to a laser processing monitoring method and a monitoring apparatus that enable simple and appropriate monitoring of the influence of various factors related to the processing characteristics of laser processing.
  • Monitoring at the time of laser processing can be broadly divided into a method for monitoring the output of laser light before being incident on the workpiece, and the state of the processing location after the laser light is incident on the workpiece. There is a way to do it.
  • a method for monitoring the state of the latter processing part there are a method of directly observing the processing part itself by a method such as continuous imaging of the processing part, image analysis and monitoring, and heat and light generated at the processing part.
  • a method of monitoring the amount of infrared rays from the workpiece a method of monitoring the temperature of the surface of the workpiece, a method of monitoring the sound during processing of the workpiece, and the like.
  • the homogeneity and strength of the welded joint line (seam), groove gap, bead shape, weld pool and keyhole shape, weld surface temperature, bead surface defects, penetration depth It is an object to recognize or predict the processing characteristics related to the welding quality such as.
  • the monitoring method based on image analysis using an image sensor directly observes the shape of the weld pool as an image, and thus has an advantage of easily grasping the quality of welding quality at a glance, but is expensive in hardware and software.
  • the monitoring method that performs signal processing of plasma light generated in the vicinity of the machining location is strongly influenced by the shielding gas that is injected into the workpiece location, and accurately reflects the machining effect on the workpiece. There is a problem that it is difficult to say.
  • the monitoring method that processes the reflected light from the workpiece using a photoelectric conversion element can make hardware and software relatively simple, but the reflected light from the workpiece is processed into the workpiece. In principle, it includes simple reflected light of the laser beam before the influence occurs, that is, the laser beam before the workpiece is melted. Therefore, the influence of various factors related to the processing characteristics of laser processing is appropriately monitored. There is a problem that it is difficult.
  • Infrared radiation from the weld bead is signal-processed by converting the radiation energy into a temperature correlation value by an infrared radiation thermometer incorporating a photoelectric conversion element and displaying the intensity, but converted into a temperature correlation value.
  • the method of monitoring the sound during welding is a method of detecting and displaying the sound generated from the work site by an acoustic element, but there is a problem that external noise can be detected.
  • Patent Document 2 It has also been proposed to detect the emission intensity of a specific wavelength in the visible light from the molten pool and determine the welding state based on the detected emission intensity.
  • the method of monitoring radiated light including infrared light is a method of displaying radiant thermometer by converting the radiated light generated near the processing point into a temperature correlation value in signal processing using photoelectric conversion elements. Yes, it can be determined whether the workpiece has melted by comparing the measured temperature with the melting point, but it is impossible to capture even the subtle behavior or dynamic change of the melted part, which affects the processing effect on the workpiece. When trying to monitor closely, accuracy and reliability are low.
  • the intensity of the detected radiated light is converted into temperature on the device side and displayed.
  • the method of converting the temperature of synchrotron radiation has the merit that it is easy for the user to intuitively grasp the state of the processed part, but the energy amount actually related to the processed part increases exponentially with respect to the temperature. It is difficult for the user to grasp the fluctuation of energy related to the workpiece near the melting point of the workpiece, and it is difficult to monitor the influence of various factors related to the machining characteristics in a simple and accurate manner, especially in micro laser machining. Met.
  • the infrared light emitted from the part to be processed will generate a lot of noise components, especially when the metal melts.
  • the present invention solves the above-described problems of the prior art, and provides a laser processing monitoring method and a laser monitoring apparatus that enable simple and accurate monitoring of laser processing involving melting of a metal workpiece.
  • the laser processing monitoring method of the present invention is a laser processing monitoring method that involves irradiating a metal workpiece with a laser beam and causing the workpiece to melt, wherein the workpiece is irradiated during the laser beam irradiation.
  • a first step of receiving radiated light generated from near the processing point and photoelectrically converting radiated light in a predetermined wavelength band included in the radiated light to generate an analog sensor output signal representing the intensity of the radiated light A second step, a third step of converting the waveform of the sensor output signal into digital waveform data without impairing the intensity change, and visualizing and displaying the waveform of the sensor output signal based on the waveform data.
  • a fourth step is a laser processing monitoring method that involves irradiating a metal workpiece with a laser beam and causing the workpiece to melt, wherein the workpiece is irradiated during the laser beam irradiation.
  • the laser processing monitoring device of the present invention is a laser monitoring device for irradiating a metal workpiece with laser light to monitor laser processing accompanied by melting of the workpiece, and during the irradiation of the laser light Receiving the radiated light generated near the processing point of the workpiece, photoelectrically converting the radiated light in a predetermined wavelength band included in the radiated light, and outputting an analog sensor output signal representing the intensity of the radiated light.
  • the waveform of the sensor signal representing the intensity of the radiated light in a predetermined wavelength band included in the radiated light generated from the vicinity of the processing point of the metal workpiece during laser processing is visualized without losing the intensity change. Since it is displayed, it is possible to perform simple and accurate monitoring of the processing state of laser processing, the quality of processing, and the like from the displayed waveform itself.
  • the laser processing monitoring method or the laser processing monitoring apparatus of the present invention it is possible to easily and accurately monitor laser processing that involves melting of a metal workpiece to be welded by the configuration and operation as described above. .
  • FIG. 1 shows the overall configuration of a laser processing apparatus incorporating a laser processing monitoring apparatus according to an embodiment of the present invention.
  • This laser processing apparatus irradiates a given workpiece W with CW laser light or pulsed laser light LB, and melts the workpiece W with laser energy to perform desired laser processing or laser melting processing.
  • And includes a laser oscillator 10, a laser power source 12, a control unit 14, a guide light generation unit 15, transmission optical fibers 16 and 17, a head 18, an operation panel 20, and a monitor unit 25.
  • the monitor unit 25 is a laser monitoring apparatus in this embodiment, and mainly includes the control unit 14, the operation panel 20, the sensor signal processing unit 22, the sensor unit 26 of the head 18, and the like.
  • the laser oscillator 10 is composed of, for example, a YAG laser, a fiber laser, or a semiconductor laser.
  • power or an excitation signal is supplied from the laser power source 12 under the control of the control unit 14.
  • the supplied laser beam oscillates and outputs a laser beam LB having a wavelength specific to the medium.
  • the laser beam LB oscillated and output by the laser oscillator 10 is transmitted to the head 18 through the optical fiber 16.
  • the head 18 has two cylindrical units, that is, a lower emission unit 24 and an upper sensor unit 26 that are coaxially connected in two vertical stages, and is installed or arranged, for example, directly above the workpiece W. Is done.
  • the emission unit 24 is optically connected to the laser oscillator 10 via the transmission optical fiber 16, and a collimator lens 28, a dichroic mirror 30, an optical lens 32, and a protective glass 34 are provided at predetermined positions in the unit. ing.
  • the laser beam LB propagating through the optical fiber 16 exits in the horizontal direction with a certain spread angle from the end surface of the optical fiber 16 in the emission unit 24, passes through the collimating lens 28, and becomes parallel light.
  • the optical path is bent vertically downward by the dichroic mirror 30, passes through the optical lens 32, and converges and enters the vicinity of the processing point P of the metal workpiece W. Then, the vicinity of the processing point P is melted and solidified by the laser energy of the laser beam LB, and a weld nugget and a weld joint is formed there.
  • the weld joint is optional, such as a butt joint, a T-shaped joint, an L-shaped joint, or a lap joint, and is selected by the user.
  • the sensor unit 26 is optically connected to the guide light generating unit 15 via the transmission optical fiber 17, and a dichroic mirror 36, an optical lens 38, an infrared sensor 40, and an amplifier 42 are provided in the unit.
  • a wavelength filter or a band-pass filter 44 that transmits only light LM having a wavelength in a specific band and blocks other light is disposed in the preceding stage, and a photoelectric conversion element is disposed in the subsequent stage.
  • a photodiode 46 is arranged.
  • the visible light guide light MB propagating through the optical fiber 17 from the guide light generating unit 15 is emitted vertically by the dichroic mirror 36 when the sensor unit 26 exits in the horizontal direction with a certain spread angle from the end face of the optical fiber 17.
  • the optical path is bent downward, and the vicinity of the processing point P of the workpiece W is irradiated through the optical lens 38, the dichroic mirror 30 in the emission unit 24, the optical lens 32, and the like.
  • electromagnetic waves (light) having a broadband wavelength are emitted from the vicinity of the processing point P of the workpiece W.
  • the light that has passed through the optical lens 32 and dichroic mirror 30 in the output unit 24 further passes through the optical lens 38 and dichroic mirror 36 in the sensor unit 26.
  • the light LM having a wavelength component in a predetermined band selected by the band pass filter 44 is incident on the light receiving surface of the photodiode 46.
  • the photodiode 46 photoelectrically converts the received light LM and generates a sensor output signal CS as a current output.
  • the sensor output signal CS of this current output is converted into a voltage signal by the current-voltage conversion circuit 100 (FIG. 13), and then amplified by the amplifier 42 with a gain designated by the control unit 14.
  • the voltage sensor output signal CS output from the amplifier 42 is converted into a current signal by the voltage-current conversion circuit 102 (FIG. 13), and is transmitted to the sensor signal processing unit 22 via the sensor cable 48.
  • the transmission wavelength band set in the band-pass filter 44 of the infrared sensor 40 is comprehensively taken into consideration in terms of sensitivity, versatility, cost, etc. in the monitoring method using a single photodiode 46.
  • a plurality of types of materials that can be selected for the workpiece W and a wide variety of processing forms are selected as the most suitable band for capturing the influence of predetermined factors on the welding characteristics near the processing point as the intensity or change of the radiant energy. .
  • a well-known black body radiation spectrum distribution as shown in FIG. 2 can be suitably used.
  • the graph of FIG. 2 there is a certain relationship between the spectrum of the electromagnetic wave radiated by the black body and the surface temperature.
  • the peak of the radiant energy shifts to a short wavelength, and when the temperature is low, It shifts to wavelength and the peak radiant energy changes exponentially with changes in temperature.
  • the wavelength of the peak point of the energy density emitted from a black body at a temperature of 1500 ° C. is about 1800 nm.
  • FIG. 3 shows the results of measurement from various angular positions and analysis of the spectrum distribution using a spectrum analyzer.
  • the display waveform of the spectrum analyzer shows each peak value as a relative intensity without distinguishing with time the detected light intensity of 1000 nm or more. Although the waveform shown showed different intensity depending on the angular position at the time of measurement, a certain characteristic was obtained.
  • the intensity (radiant energy density) of infrared rays emitted from the melted portion of the stainless steel is characterized by a sharp mountain shape over a band of about 1000 nm to 1100 nm and a broad mountain shape over a band of about 1200 nm to 2500 nm. It has. Paying attention to the characteristics of the latter broad mountain shape, the wavelength of the peak point is about 1800 nm, which is approximately approximate to the wavelength (about 1800 nm) of the peak point of the energy density emitted from the black body at a temperature of 1500 ° C.
  • the melting point of each of the metals is used as an index, so that the single photodiode 46 is used with reference to the graph of FIG. A practically optimal transmission wavelength band in the monitoring method can be determined.
  • the melting points of iron-based metal, copper-based metal, and aluminum-based metal, which are main materials for laser melting are approximately 1500 ° C., 1000 ° C., and 600 ° C., respectively.
  • the band of 1.3 ⁇ m (1300 nm) to 2.5 ⁇ m (2500 nm) is the transmission wavelength band of the infrared sensor 40.
  • a photodiode whose sensitivity corresponds fully to the selected transmission wavelength band may be used (in this case no separate filter is required), but a photodiode 46 that detects a wider transmission wavelength band is used. May be.
  • a band-pass filter 44 that transmits only the radiated light in the band of 1300 nm or more may be provided on the front side of the photodiode 46, and the radiated light in the band longer than 2500 nm is similarly 2500 nm or less.
  • a band-pass filter 44 that transmits only the radiated light in the band may be provided.
  • the monitor unit (laser processing monitoring device) 25 in this embodiment detects all the emitted light generated in the band of 1300 nm to 2500 nm as the wavelength band suitable for the metal workpiece, and displays the detected intensity of the emitted light as it is. Therefore, it is possible to detect with high sensitivity the amount of energy that exponentially increases in relation to the processed part.
  • monitoring of synchrotron radiation from the processing point for differences in the material of the welded material, the presence or absence of fine gaps in the welded part, and differences in the tens of watts or 10 millisecond units on the laser machine side Can be grasped by the waveform.
  • the width of the radiated light band to be detected is referred to the radiation spectrum distribution from the black body in FIG. It is also possible to detect all radiation emitted from an arbitrary width. For example, the entire width of the wavelength band of at least 300 nm may be detected from the light generated at the processing site.
  • a wavelength bandwidth of 1800 to 2100 nm is selected and detected as a wavelength bandwidth of at least 300 nm, from FIG. 2, the peak of the emitted light generated from the black body at 1500 ° C. and the radiation generated from the black body at 700 ° C.
  • the intensity of light on the left side of the spot that falls to the left of the light peak is monitored.
  • a problem of detection accuracy may occur because the radiation light in a region falling from the peak value of the radiation light generated from the black spot at 700 ° C. may occur, but the wavelength band to be detected has a predetermined width, It is possible to monitor the synchrotron radiation region including the temperature near the melting point of aluminum and the temperature near the melting point of stainless steel.
  • the sensor output signal CS transmitted from the sensor unit 26 to the sensor signal processing unit 22 via the sensor cable 48 is subjected to current-voltage conversion by the first-stage current-voltage converter 104 (FIG. 13) in the sensor signal processing unit 22.
  • the sensor output signal CS converted into a voltage signal is converted into a digital signal by the A / D converter 50.
  • the arithmetic processing unit 52 provided in the sensor signal processing unit 22 includes a hardware or middleware arithmetic processing device, preferably an FPGA (Feed Programmable Gate Array), which can perform specific arithmetic processing at high speed.
  • the instantaneous voltage value of the sensor output signal CS is converted into a count value (relative value) representing the intensity of the emitted light, and the converted value is generated as digital waveform data DCS .
  • the generated waveform data DCS is stored in the data memory 54.
  • Arithmetic processing unit 52 based on the waveform data D CS, via the control unit 14 displays a waveform of the sensor output signal CS on the display of the monitoring panel 20, or the determination also perform processing quality determination to be described later The result is displayed together with the waveform of the sensor output signal CS.
  • the control unit 14 converts the waveform data DCS and determination result data supplied from the arithmetic processing unit 52 into video signals, and displays the waveform of the sensor output signal CS, determination result information, etc. on the display (display unit 20a) of the monitoring panel 20. The image of is displayed.
  • the monitor unit (laser processing monitoring device) 25 in this embodiment is not the return light (reflected light) of the laser light irradiated during laser processing, but the emitted light when the workpiece itself reaches the molten state.
  • the change in the amount of radiated light during processing is converted into a unique count value for the instantaneous integrated value in a specific band, and It is possible to visualize the influence of machining on the workpiece by converting various changes into count values and displaying them.
  • the operation panel 20 includes, for example, a display unit 20a formed of a liquid crystal display and a keyboard type or touch panel type input unit 20b, and displays various setting screens and monitor screens under display control of the control unit 14. .
  • a display unit 20a formed of a liquid crystal display and a keyboard type or touch panel type input unit 20b
  • a laser output waveform corresponding to the setting condition of the pulsed laser beam LB can be displayed on the display of the display unit 20a.
  • monitor screens as shown in FIG. 4 to FIG. 6 and FIG. 8 to FIG. Visualize and display fine sensor output signal waveforms.
  • the control unit 14 turns on the guide light generation unit 15 to collect the guide light MB on the workpiece W. Irradiate with light.
  • the processing point P can be accurately positioned and the optical axes of the monitoring system and the laser processing system can be accurately adjusted.
  • the pulse laser beam LB When the pulse laser beam LB is oscillated and output from the laser oscillator 10 under predetermined conditions under the control of the control unit 14, the pulse laser beam LB is transmitted to the emission unit 24 of the head 18 via the optical fiber 16. Then, the output unit 24 collects and irradiates near the processing point P of the workpiece W. Thereby, the vicinity of the processing point P absorbs the laser energy of the pulse laser beam LB and melts instantaneously, and electromagnetic waves (mainly infrared rays) of thermal radiation are emitted from the melted portion.
  • electromagnetic waves mainly infrared rays
  • the light passing through the optical lens 32 in the emission unit 24, the dichroic mirror 30 and the optical lens 38 in the sensor unit 26, and the dichroic mirror 36 as described above is the band pass filter 44 of the infrared sensor 40. Is incident on.
  • the light LM in a specific wavelength band (1300 to 2500 nm) that has passed through the band pass filter 44 is photoelectrically converted by the photodiode 46, and a sensor output signal CS of current output is generated.
  • the sensor output signal CS is subjected to the analog signal processing (current-voltage conversion, amplification, voltage-current conversion, current transmission) as described above and is taken into the sensor signal processing unit 22.
  • the sensor output signal CS is subjected to the digital signal processing (current-voltage conversion, analog-digital conversion, voltage-count value conversion) as described above, and the waveform data of the sensor output signal CS.
  • D CS is generated, and the waveform data D CS for one pulse is stored in the data memory 54.
  • the value of the waveform data D CS on the time axis corresponds to the instantaneous value of the radiant energy density of the photoelectric conversion emission light LM (intensity).
  • a photodiode with high light receiving sensitivity such as an InGaAs photodiode with electronic cooling
  • the advantage of using an InGaAs photodiode with electronic cooling is that the thermal effect on the detection element (photodiode itself) due to radiation detection is very small due to electron cooling, and is proportional to the light intensity of the received radiation LM.
  • the sensor output signal CS of current output can be suitably generated.
  • the sensor output signal CS is also output as a weak small signal. Therefore, as described above, the sensor output signal CS is converted into a voltage signal by the current-voltage conversion circuit 100 and then converted into a signal having a magnitude that can sufficiently reduce the influence of noise by the amplifier 42.
  • this analog sensor output signal CS is transmitted as a voltage signal from the sensor unit 26 to the sensor signal processing unit 22 separated by several meters or more via the sensor cable 48 (voltage transmission),
  • the signal level is greatly attenuated by the voltage drop, and the waveform is distorted or susceptible to noise. Therefore, the sensor output signal CS is converted into a current signal by the voltage-current conversion circuit 102 in the sensor unit 26 and then transmitted to the sensor signal processing unit 22 via the sensor cable 48. Attenuation, waveform distortion, noise influence, and the like can be suppressed.
  • the laser apparatus used in this example is AMADA MIYACHI pulse fiber laser welder ML-3030AS.
  • the workpiece W was formed by arranging two stainless steel plates (SUS304) W 1 and W 2 having a thickness of 1.0 mm side by side, and butt welding was performed using a pulsed laser beam. In this butt welding, when the spot diameter of the laser beam is 0.3 mm, the laser output is 500 W, the pulse width is 45 milliseconds, and there is no gap between the workpieces W 1 and W 2 (a) And 0.
  • FIG. 4 shows a monitoring display waveform of the sensor output signal obtained in this example.
  • the portion where the waveform is drawn in a zigzag indicates that the metal melted at the portion to be processed and that the turbulence of the radiation from the wave front of the molten pool was detected.
  • the point in time when the waveform that rises to the right on the time axis reaches the apex (the point just before the fall) is the point at which the irradiation of the laser beam is stopped.
  • the former (a) has a higher detection start point immediately after the start of the waveform rise, and the waveform fall is lower. It has a characteristic that it is gentle.
  • the latter (b) has a characteristic that the detection start point immediately after the start of the rise of the waveform is low and the fall of the waveform is quick.
  • a phenomenon occurs in which the amount of molten metal that forms the molten pool decreases, and the difference in the amount of molten metal appears as a difference in the amount of radiated light in the radiation detected from the vicinity of the molten pool, and the detection start point immediately after the rise of the waveform
  • the amount of molten metal decreases due to the phenomenon that the evaporated metal stops together with the transmitted light that passes through the gap, so that the falling edge of the waveform is detected quickly when there is a gap. ing.
  • the laser apparatus used in this example is AMADA MIYACHI pulse fiber laser welder ML-3030AS.
  • the workpiece W was formed by stacking two stainless steel plates (SUS304) W 1 and W 2 having a thickness of 0.3 mm, and lap welding was performed using a pulsed laser beam. In this lap welding, the spot diameter of the laser beam is 0.3 mm, the laser output is 500 W, the pulse width is 45 milliseconds, and there is no gap between the workpieces (W 1 , W 2 ) (a) and the workpiece.
  • FIG. 5 shows a monitoring display waveform of the sensor output signal obtained in this example.
  • the portion where the waveform is drawn in a zigzag indicates that the metal melted in the processed portion and that the radiated light disturbance from the wave front of the molten pool was detected.
  • the point in time when the waveform that rises to the right on the time axis reaches the apex (the point just before the fall) is the point at which the irradiation of the laser beam is stopped.
  • the laser apparatus used in this example is AMADA MIYACHI pulse fiber laser welder ML-3030AS.
  • the workpiece W was formed by stacking two sheet materials W 1 and W 2 of stainless steel SUS304 having a thickness of 0.3 mm without gaps, and lap welding was performed using a pulsed laser beam of a rectangular wave.
  • the laser beam spot diameter was 0.3 mm
  • the laser output and pulse width were parameters. That is, for the laser output, values in six steps were selected in increments of 50 W from 300 W to 550 W, and values in three steps of 25 ms, 35 ms, and 45 ms were selected for the pulse width.
  • a monitoring display waveform of the sensor output signal obtained in this embodiment is shown in FIG.
  • the radiated light intensity indicated by the waveform of the sensor output signal increases proportionally as the laser output set value of the laser light increases, and the waveform of the sensor output signal increases as the laser output set value increases. It is shown that the start of the fall is delayed, and further, as the pulse width is increased, the radiation light intensity (particularly the maximum peak value immediately before the fall) displayed by the waveform of the sensor output signal becomes higher. I can take it. This indicates that the emitted light from the workpiece in laser processing is accurately detected in units of tens of watts and in units of 10 milliseconds.
  • the laser apparatus used in this example is AMADA MIYACHI fiber laser welder ML-6811C.
  • a typical workpiece W assumes a case where a recess (notch) is formed by laminating and welding a plate material having a notch and a flat material, and the depth of the recess (notch) is defined as a gap. It was.
  • Sample (1) is for showing a basic waveform when CW laser irradiation is monitored by the processing monitoring apparatus according to this embodiment, and in FIG. This indicates that the metal is melted at the processing location, and that the radiation turbulence from the molten pool wavefront is detected.
  • Sample (2) is obtained by assuming that there is a 3.0mm gap on the back side of a portion (middle portion of the x-direction) of the stainless steel plate W 1 of the front side in the seam welding.
  • a hollow or protruding portion in the middle of the waveform seen for each of the three stages of laser output (200 W, 400 W, 600 W) is monitoring laser irradiation to a place where there is a space on the back side of the workpiece. The detection signal at the time is shown.
  • the reason why the protrusion is generated at 200 W while the recess is generated between 600 W and 400 W can be explained by the relationship between the energy of the irradiation laser and the heat drawing at the processing site. That is, in the case of 200 W, since the laser irradiation energy is generally low, the radiant light is weakened due to the influence of heat drawn toward the metal material on the back side in the lap welding, but the back side metal material in the middle part. It is difficult to draw heat because it is an air layer, and the emitted light is strongly generated by the heat.
  • Sample (3) the sample (4) is, 2.0 mm each on the back of a portion of the stainless steel plate W 1 of the front side in the seam welding (intermediate portion in the x direction), a case where there is a gap of 1.0mm It is assumed. As shown in FIGS. 10 and 11, both sample (3) and sample (4) did not change much when compared with sample (2) at 200 W, but at 400 W and 600 W. In contrast, when the air layer was reduced to 2.0 mm and 1.0 mm, the intensity of the detected indentation, that is, the intensity of the detected radiated light, tended to increase conversely. . This is considered to be because it becomes more difficult for heat to be drawn from the metal layer because the gap of the air layer becomes shorter.
  • the radiation light generated from the vicinity of the processing point of the workpiece (metal) in laser welding is received by the infrared sensor 40 in the sensor unit 24, and the predetermined light included in the radiation light is received.
  • Signal processing system provided in the sensor unit 24 and the sensor signal processing unit 22 connected via the sensor cable 48 to generate an analog sensor output signal CS by photoelectrically converting the radiated light component (LM) in the wavelength band of ( Figure 13) into a digital waveform data D CS waveforms of the sensor output signal CS without impairing the intensity change by monitoring panel 20 the waveform of the sensor output signal CS on the basis of the waveform data D CS display (20a ) Visualized and displayed above, and the displayed waveform (for example, FIGS.
  • Laser welding processing can be monitored, monitoring of the influence of certain factors related to the processing state or processing quality of the laser welding process, monitoring of the quality of the laser welding process, etc. Simple and accurate monitoring can be made possible.
  • the sensor unit 26 is connected to the emission unit 24 in the above-described embodiment, it is possible to adopt a configuration in which the sensor unit 26 is separated from the emission unit 24 and is arranged in the vicinity of the emission unit 24 as an independent unit. It is.
  • the laser processing method and laser processing apparatus of the present invention are not limited to laser spot welding, but can also be applied to other laser processing that involves melting, such as laser cutting, laser brazing, laser hardening, and laser surface modification.

Abstract

La présente invention concerne un dispositif de surveillance de traitement au laser qui est un dispositif de surveillance d'une machine de traitement au laser qui effectue un traitement au laser souhaité par rayonnement d'un faisceau laser LB sur une pièce métallique W donnée et fusion de la pièce W au moyen d'énergie laser, le dispositif de surveillance de traitement au laser comprenant: un oscillateur laser 10; une source d'énergie laser 12; une unité de commande 14; une unité de génération de lumière de guidage 15; des fibres optiques de transmission 16, 17; une tête 18 (unité d'émission 24, unité de capteur 26); un panneau d'actionnement 20; et une unité de surveillance 25. L'unité de surveillance 25 est un dispositif de surveillance laser dans un mode de réalisation de la présente invention, et est configurée pour comprendre principalement l'unité de commande 14, le panneau d'actionnement 20, une unité de traitement de signal de capteur 22 et l'unité de capteur 26, par exemple.
PCT/JP2017/042882 2017-04-04 2017-11-29 Procédé et dispositif de surveillance de traitement au laser WO2018185973A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019511061A JPWO2018185973A1 (ja) 2017-04-04 2017-11-29 レーザ加工監視方法及びレーザ加工監視装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017074739 2017-04-04
JP2017-074739 2017-04-04

Publications (1)

Publication Number Publication Date
WO2018185973A1 true WO2018185973A1 (fr) 2018-10-11

Family

ID=63712415

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/042882 WO2018185973A1 (fr) 2017-04-04 2017-11-29 Procédé et dispositif de surveillance de traitement au laser

Country Status (2)

Country Link
JP (1) JPWO2018185973A1 (fr)
WO (1) WO2018185973A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021013937A (ja) * 2019-07-10 2021-02-12 国立研究開発法人理化学研究所 レーザ加工装置
JP2021030295A (ja) * 2019-08-29 2021-03-01 パナソニックＩｐマネジメント株式会社 レーザ加工装置および光学調整方法
WO2021059825A1 (fr) * 2019-09-25 2021-04-01 株式会社アマダウエルドテック Procédé et dispositif de surveillance de traitement au laser
WO2023218701A1 (fr) * 2022-05-10 2023-11-16 パナソニックＩｐマネジメント株式会社 Procédé de détermination de condition d'usinage et dispositif de détermination

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106051A (ja) * 1996-06-18 1998-01-13 Nissan Motor Co Ltd レーザ溶接の品質検査方法およびその装置
JP2003320467A (ja) * 2002-05-02 2003-11-11 Nissan Motor Co Ltd レーザー溶接部の品質モニタリング方法およびその装置
JP2011240361A (ja) * 2010-05-18 2011-12-01 Omron Corp レーザ加工装置およびレーザ加工装置の異常監視方法
WO2013153599A1 (fr) * 2012-04-09 2013-10-17 三菱電機株式会社 Unité de sortie analogique de séquenceur
WO2013171848A1 (fr) * 2012-05-15 2013-11-21 トヨタ自動車株式会社 Procédé de soudage, dispositif de soudage et procédé de fabrication de batterie
JP2017056464A (ja) * 2015-09-14 2017-03-23 トヨタ自動車株式会社 レーザ溶接装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH106051A (ja) * 1996-06-18 1998-01-13 Nissan Motor Co Ltd レーザ溶接の品質検査方法およびその装置
JP2003320467A (ja) * 2002-05-02 2003-11-11 Nissan Motor Co Ltd レーザー溶接部の品質モニタリング方法およびその装置
JP2011240361A (ja) * 2010-05-18 2011-12-01 Omron Corp レーザ加工装置およびレーザ加工装置の異常監視方法
WO2013153599A1 (fr) * 2012-04-09 2013-10-17 三菱電機株式会社 Unité de sortie analogique de séquenceur
WO2013171848A1 (fr) * 2012-05-15 2013-11-21 トヨタ自動車株式会社 Procédé de soudage, dispositif de soudage et procédé de fabrication de batterie
JP2017056464A (ja) * 2015-09-14 2017-03-23 トヨタ自動車株式会社 レーザ溶接装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021013937A (ja) * 2019-07-10 2021-02-12 国立研究開発法人理化学研究所 レーザ加工装置
JP7367958B2 (ja) 2019-07-10 2023-10-24 国立研究開発法人理化学研究所 レーザ加工装置
JP2021030295A (ja) * 2019-08-29 2021-03-01 パナソニックＩｐマネジメント株式会社 レーザ加工装置および光学調整方法
JP7262081B2 (ja) 2019-08-29 2023-04-21 パナソニックＩｐマネジメント株式会社 レーザ加工装置および光学調整方法
WO2021059825A1 (fr) * 2019-09-25 2021-04-01 株式会社アマダウエルドテック Procédé et dispositif de surveillance de traitement au laser
JP2021049549A (ja) * 2019-09-25 2021-04-01 株式会社アマダウエルドテック レーザ加工監視方法及びレーザ加工監視装置
CN114450120A (zh) * 2019-09-25 2022-05-06 株式会社天田焊接技术 激光加工监视方法及激光加工监视装置
WO2023218701A1 (fr) * 2022-05-10 2023-11-16 パナソニックＩｐマネジメント株式会社 Procédé de détermination de condition d'usinage et dispositif de détermination

Also Published As

Publication number Publication date
JPWO2018185973A1 (ja) 2020-02-13

Similar Documents

Publication Publication Date Title
CN102294549B (zh) 焊接系统及焊接方法
WO2018185973A1 (fr) Procédé et dispositif de surveillance de traitement au laser
JP5043881B2 (ja) レーザ溶接モニタ装置及びレーザ溶接モニタ方法
JP5849985B2 (ja) 溶接部の検査装置とその検査方法
CN108778606B (zh) 在激光焊接时的热裂纹识别
JP5054297B2 (ja) レーザーショック処理を監視するシステム及び方法
CN102323216B (zh) 焊接检查方法及其设备
JP5947740B2 (ja) 溶接部の検査装置とその検査方法
US6399915B1 (en) Method and apparatus for determining quality of welding at weld between working material pieces
Sun et al. Sensor systems for real-time monitoring of laser weld quality
Zhang et al. Coaxial monitoring of the fibre laser lap welding of Zn-coated steel sheets using an auxiliary illuminant
JP5842851B2 (ja) 溶接部の検査装置とその検査方法
JP2006247681A (ja) レーザ加工用モニタリング装置
JP2013535340A (ja) ファイバーレーザのフォーカス最適化方法及び材料加工装置、ファイバーレーザのフォーカス変化の測定方法
JP2015530251A (ja) レーザビームを用いた被加工物の加工装置
JP4757557B2 (ja) レーザ加工ヘッド
Sibillano et al. Study on the correlation between plasma electron temperature and penetration depth in laser welding processes
JP2006292424A (ja) 光ファイバモニタ装置およびレーザ加工システム
JP6688021B2 (ja) レーザ溶接監視装置とレーザ溶接監視方法
US20220347789A1 (en) Laser processing monitoring method and laser processing monitoring device
JPWO2017199904A1 (ja) 成分組成計測システム及び成分組成計測方法
JP4210560B2 (ja) レーザ溶接モニタリング方法およびレーザ溶接モニタリング装置
CN113714635A (zh) 激光加工装置
JP2003320467A (ja) レーザー溶接部の品質モニタリング方法およびその装置
Steen et al. Laser automation and in-process sensing

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17904953

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2019511061

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17904953

Country of ref document: EP

Kind code of ref document: A1