WO2018170958A1 - 双面铝基电路板及其制备方法 - Google Patents

双面铝基电路板及其制备方法 Download PDF

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Publication number
WO2018170958A1
WO2018170958A1 PCT/CN2017/079964 CN2017079964W WO2018170958A1 WO 2018170958 A1 WO2018170958 A1 WO 2018170958A1 CN 2017079964 W CN2017079964 W CN 2017079964W WO 2018170958 A1 WO2018170958 A1 WO 2018170958A1
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Prior art keywords
aluminum
double
circuit board
aluminum material
based circuit
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PCT/CN2017/079964
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English (en)
French (fr)
Inventor
赵坤
黄饮智
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深圳亚信昌科技有限公司
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Publication of WO2018170958A1 publication Critical patent/WO2018170958A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming

Definitions

  • the present invention relates to the technical field of circuit board manufacturing processes, and more particularly to a double-sided aluminum-based circuit board and a method of fabricating the same.
  • LED industry is one of the most watched industries in recent years.
  • LED products have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, and no mercury, and environmental benefits.
  • usually only about 20% of the input power of LED high-power products can be converted into light, and the remaining 80% of the energy is converted into heat.
  • the junction temperature of the LED will be too high, which will affect the product life cycle, luminous efficiency and stability.
  • LED is a semiconductor light-emitting diode. It is a light-emitting device made of semiconductor material to directly convert electrical energy into light energy and electric signal into optical signal. It is characterized by low power consumption, high brightness, colorful color, vibration resistance and longevity. Long (normal light 8 to 100,000 hours), cold light source and other advantages, is the real "green lighting.” In the future of the 21st century, lighting products with LED as a new light source will inevitably replace white woven lamps and become another revolution in human lighting.
  • the ceramic substrate refers to a special process plate in which a copper foil is directly bonded to a surface of an alumina (Al 2 O 3 ) or aluminum nitride (AlN) ceramic substrate (single or double sided) at a high temperature.
  • the ultra-thin composite substrate produced has excellent electrical insulation properties, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current carrying current. ability. Therefore, ceramic substrates have become the basic material for high-power power electronic circuit structure technology and interconnection technology.
  • the LED lamp bead bracket part on the market is mainly a double-sided ceramic substrate, but this material has the following disadvantages:
  • the process uses laser drilling and laser forming efficiency is low;
  • the double-sided high-temperature sintering silver line or the silver line has low reflectivity, resulting in low brightness of the lamp bead and insufficient energy saving.
  • the technical problem to be solved by the present invention is to overcome the defects of the prior art, and to provide a method for preparing a double-sided aluminum-based circuit board, comprising the following steps:
  • the step (2) further includes a process of plating a ceramic on the oxidized insulating layer to increase the insulating property
  • the method of electroplating copper in the step (3) is vacuum plating, electroless plating or magnetron sputtering plating;
  • the step (3) further includes a process of re-electroplating or electroplating copper to increase the thickness of the copper layer.
  • the step of plating the copper in the step (3) further includes a process of water plating.
  • the thickness of the copper layer on the hole wall of the line via is ⁇ 10 um.
  • the step (4) further includes a process of the OSP.
  • the step (4) further includes a process of electroplating gold, silver, tin or titanium.
  • the process of OSP or the process of electroplating gold, silver, tin or titanium also includes a secondary etch process.
  • a secondary etching process is performed either after plating.
  • the aluminum material has a thickness of at least 0.05 mm; the die-formed line vias have a pore size of at least 0.05 mm.
  • the present invention also provides a double-sided aluminum-based circuit board prepared by the steps described.
  • the invention is to solve the problem that the preparation method of the double-sided ceramic substrate of the prior art is expensive, the operation is fragile, the process adopts laser drilling, the laser forming efficiency is low, the double-sided high-temperature sintering silver or the silver line has low reflectance, and the lamp is caused.
  • the technology of the invention adopts the mold stamping process with high efficiency and cost saving; and the aluminum substrate has high thermal conductivity, which is one to twenty times that of the traditional double-sided ceramic substrate; lowering the product operating temperature, improving the product carrying power and reliability, and prolonging the service life of the product
  • the same type of lamp bead is different because of the bracket, after the package is completed, the cost of the process is 20% lower than that of the double-sided ceramic bracket, which is more conducive to the promotion of the LED lamp; the product volume is reduced, the hardware and assembly cost are reduced; Fragile ceramic substrate for better mechanical durability.
  • the qualified rate of the finished product is high, and the aluminum substrate obtained by the production has high reliability.
  • the double-sided aluminum-based circuit board provided by the present invention has a broader market prospect.
  • the method of electroplating copper in the step (3) is vacuum plating, electroless plating or magnetron sputtering.
  • vacuum plating is a physical deposition phenomenon. That is, argon gas is injected under vacuum, argon gas strikes the target, and the target separation component is adsorbed by the conductive product to form a uniform smooth surface layer.
  • electroless plating is a new type of metal surface treatment technology, which is attracting people's attention because of its simple process, energy saving and environmental protection. Electroless plating has a wide range of applications, with a uniform gold plating layer and good decorative properties. In terms of protective performance, it can improve the corrosion resistance and service life of the product; in terms of functionality, it can improve the special functions such as wear resistance, lubrication and other properties of the workpiece, thus becoming a development of surface treatment technology in the world.
  • Magnetron sputtering can expose its surface with an equal probability, so that a uniform, dense, and adherent metal film can be plated on the surface of each microparticle.
  • the step of plating the copper in the step (3) further comprises a process of water plating.
  • vacuum sputtering is more environmentally friendly. And sputtering can mask some flaws.
  • the process of OSP or the process of electroplating gold, silver, tin, and titanium further includes a secondary etching process.
  • OSP is a process that meets the requirements of the RoHS Directive for printed circuit board (PCB) copper foil surface treatment.
  • OSP is the abbreviation of Organic Solderability Preservatives.
  • Chinese translation is organic solder mask, also known as copper protector, also known as Preflux in English.
  • OSP chemically grows an organic film on a clean bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. It is used to protect the copper surface from rust (oxidation or vulcanization) in the normal environment.
  • the protective film must be very It is easy to be quickly removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder in a very short time to become a firm solder. point.
  • water plating may be performed on the basis of electroplating copper, and the upper and lower lines and the through holes of each line are formed to be electrically connected, and the thickness of the copper layer on the wall of the line through hole is ⁇ 10 um.
  • the method for preparing a double-sided aluminum-based circuit board provided by the present invention has many advantages and values as described above, and it is true that no similar method has been disclosed or used in similar products.
  • the utility model has the advantages of enhanced performance compared with the prior art, and is therefore more suitable for practical use and has a wide industrial value.
  • the term “comprising” or “including” may be used in the various embodiments of the present disclosure to indicate the existence of the disclosed function, operation or element, and does not limit one or more functions, operations or elements. increase.
  • the terms “comprising,” “having,” “,” It should not be understood that the existence or addition of one or more features, numbers, steps, operations, components or components of one or more other features, numbers, steps, operations, components, components or combinations of the foregoing are excluded. Or the possibility of a combination of the foregoing.
  • the expression “or” or “at least one of A or / and B” package Includes any combination or combination of the texts listed at the same time.
  • the expression “A or B” or “at least one of A or / and B” may include A, may include B, or may include both A and B.
  • Expressions used in various embodiments of the present disclosure may modify various constituent elements in various embodiments, but the corresponding constituent elements may not be limited.
  • the above statements do not limit the order and/or importance of the elements.
  • the above statements are only used for the purpose of distinguishing one element from another.
  • the first user device and the second user device indicate different user devices, although both are user devices.
  • a first element could be termed a second element, and a second element could be termed a first element, without departing from the scope of the various embodiments of the present disclosure.
  • the first constituent element can be directly connected to the second constituent element and can be “connected” between the first constituent element and the second constituent element.
  • the third component On the contrary, when a constituent element is “directly connected” to another constituent element, it is understood that there is no third constituent element between the first constituent element and the second constituent element.
  • a method for preparing a double-sided aluminum-based circuit board comprising the following steps:
  • the technology of the invention adopts the mold stamping process with high efficiency and cost saving; and the aluminum substrate has high heat dissipation coefficient, which is one to twenty times that of the traditional double-sided ceramic substrate; lowering the operating temperature of the product, improving the power density and reliability of the product, and prolonging the product
  • the service life is the same as the energy saving purpose.
  • the lamp of the same type is different from the bracket.
  • the cost of the process is 20% lower than that of the double-sided ceramic bracket, which is more conducive to the promotion of the LED lamp; the product volume is reduced, and the hardware and assembly cost are reduced. Replace the fragile ceramic substrate for better mechanical durability.
  • the qualified rate of the finished product is high, and the aluminum substrate obtained by the production has high reliability.
  • the double-sided aluminum-based circuit board provided by the present invention has a broader market prospect.
  • the method of electroplating copper in the step (3) is vacuum plating, electroless plating or magnetron sputtering.
  • vacuum plating is a physical deposition phenomenon. That is, argon gas is injected under vacuum, argon gas strikes the target, and the target separation component is adsorbed by the conductive product to form a uniform smooth surface layer.
  • electroless plating is a new type of metal surface treatment technology, which is attracting people's attention because of its simple process, energy saving and environmental protection. Electroless plating has a wide range of applications, with a uniform gold plating layer and good decorative properties. In terms of protective performance, it can improve the corrosion resistance and service life of the product; in terms of functionality, it can improve the special functions such as wear resistance, lubrication and other properties of the workpiece, thus becoming a development of surface treatment technology in the world.
  • Magnetron sputtering can expose its surface with an equal probability, so that a uniform, dense, and adherent metal film can be plated on the surface of each microparticle.
  • the method further comprises: plating a ceramic on the oxidized insulating layer to increase the insulation process;
  • the method of electroplating copper in the step (3) is vacuum plating, electroless plating or magnetron sputtering plating;
  • the step (3) further includes a process of re-electroplating or electroplating copper to increase the thickness of the copper layer.
  • the thickness of the copper layer on the hole wall of the line via hole is ⁇ 10 ⁇ m.
  • step (4) further includes a process of the OSP.
  • OSP is a process that meets the requirements of the RoHS Directive for printed circuit board (PCB) copper foil surface treatment.
  • OSP is the abbreviation of Organic Solderability Preservatives.
  • Chinese translation is organic solder mask, also known as copper protector, also known as Preflux in English.
  • OSP chemically grows an organic film on a clean bare copper surface. This film has anti-oxidation, thermal shock resistance and moisture resistance. It is used to protect the copper surface from rust (oxidation or vulcanization) in the normal environment.
  • the protective film must be very It is easily removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder into a firm solder joint in a very short time.
  • water plating may be performed on the basis of electroplating copper, and the upper and lower lines and the through holes of each line are formed to be electrically connected, and the thickness of the copper layer on the wall of the line through hole is ⁇ 10 um.
  • the step (4) further includes a process of electroplating gold, silver, tin, and titanium.
  • the process of OSP or the process of electroplating gold, silver, tin, and titanium further includes a secondary etching process.
  • a secondary etching process is performed after the plating.
  • the aluminum material has a thickness of at least 0.05 mm; the through hole of the die stamped by the mold has a diameter of at least 0.05 mm.
  • the present invention also provides a double-sided aluminum-based circuit board prepared by the steps described in any of the above.
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • Electrolytic copper plating is performed on the anodized aluminum material, so that the upper and lower lines and the line conduction holes of each line form a line conduction; after the electroless copper plating, the process of water plating is further included; the thickness of the copper layer of the line is 23 um;
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • the anodized aluminum material is subjected to magnetron sputtering copper plating, so that the upper and lower lines and the line conduction holes of each line form a line conduction; the electroless copper plating further includes a water plating process; the thickness of the copper layer of the line is 28um;
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • the anodized aluminum material is subjected to magnetron sputtering copper plating, so that the upper and lower lines and the line conduction holes of each line form a line conduction; the electroless copper plating further includes a water plating process; the thickness of the copper layer of the line is 28um;
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • the ceramic plated aluminum material is subjected to magnetron sputtering copper plating, so that the upper and lower lines and the line conduction holes of each line form a line conduction; the electroless copper plating further includes a water plating process; the thickness of the copper layer of the line is 28um;
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • the anodized aluminum material is subjected to magnetron sputtering copper plating, so that the upper and lower lines and the line conduction holes of each line form a line conduction; the electroless copper plating further includes a water plating process; the thickness of the copper layer of the line is 28um;
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • the anodized aluminum material is subjected to magnetron sputtering copper plating, so that the upper and lower lines and the line conduction holes of each line form a line conduction; the electroless copper plating further includes a water plating process; the thickness of the copper layer of the line is 28um;
  • a method for preparing a double-sided aluminum-based circuit board comprising the steps of:
  • the anodized aluminum material is subjected to magnetron sputtering copper plating, so that the upper and lower lines and the line conduction holes of each line form a line conduction; the electroless copper plating further includes a water plating process; the thickness of the copper layer of the line is 28um;

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

提供了一种双面铝基电路板及其制备方法，包括以下步骤：(1)用模具对铝材进行冲压，在铝材上形成上下线路导通孔；(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；如果有高绝缘性的要求，可以在氧化绝缘层上再进行电镀陶瓷；(3)将阳极氧化后的铝材进行电镀铜，使得上下两面线路与每个线路导通孔形成线路导通；(4)进行线路蚀刻处理。采用模具冲压工艺效率高、节约成本；导热系数高，为传统双面陶瓷基板的一至二十倍；降低产品运行温度，有效提高产品承载功率和可靠性，延长产品使用寿命，达到节能目的，更有利于LED灯推广。

Description

双面铝基电路板及其制备方法
本申请要求于2017年03月23日提交中国专利局的申请号为CN201710178696.0、名称为“双面铝基电路板及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及线路板制作工艺的相关技术领域，更具体地说，涉及一种双面铝基电路板及其制备方法。
背景技术
随着全球环保意识的抬头，节能省电已成为当今的趋势。LED产业是近年来最受瞩目的产业之一。发展至今，LED产品已具有节能、省电、高效率、反应时间快、寿命周期长、且不含汞、具有环保效益等优点。然而通常LED高功率产品输入功率只有约为20％能转换成光，剩下80％的电能均转换为热能。
一般而言，LED发光时所产生的热能若无法导出，将会使LED结面温度过高，进而影响产品生命周期、发光效率和稳定性。
LED全称为半导体发光二极管，采用半导体材料制成的，以直接将电能转化为光能，电号转换成光信号的发光器件；其特点是功耗低、高亮度、色彩艳丽、抗振动、寿命长(正常发光8～10万小时)、冷光源等优点，是真正的“绿色照明”。以LED为新光源的灯饰产品在21世纪的将来，必然取代白织灯，成为人类照明的又一次革命。
陶瓷基板是指铜箔在高温下直接键合到氧化铝(Al2O3)或氮化铝(AlN)陶瓷 基片表面(单面或双面)上的特殊工艺板。所制成的超薄复合基板具有优良电绝缘性能，高导热特性，优异的软钎焊性和高的附着强度，并可像PCB板一样能刻蚀出各种图形，具有很大的载流能力。因此，陶瓷基板已成为大功率电力电子电路结构技术和互连技术的基础材料。
目前市场上LED灯珠支架部分主要是双面陶瓷基板，但是该种材质具有以下缺点：
1、造价昂贵；
2、操作中易碎；
3、工艺采用激光打孔、激光成型效率低下；
4、双面高温烧结银线路或化银线路反射率低、造成灯珠亮度低、不够节能。
发明内容
有鉴于此，本发明要解决的技术问题在于克服现有技术的缺陷，提供了一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对铝材进行冲压，在铝材上形成上下线路导通孔；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行电镀铜，使得上下两面线路与每个线路导通孔形成线路导通；
(4)进行线路蚀刻处理。
在某些实施方式中，所述步骤(2)之后还包括在氧化绝缘层上电镀陶瓷，增加绝缘性的过程；
所述步骤(3)中电镀铜的方法为真空电镀、化学镀或磁控溅射镀；
所述步骤(3)之后还包括再化学电镀或电镀铜以增加铜层厚度的过程。
在某些实施方式中，所述步骤(3)中电镀铜后还包括水镀的过程。
在某些实施方式中，所述线路导通孔的孔壁上的线路铜层厚度≥10um。
在某些实施方式中，所述步骤(4)之后还包括OSP的过程。
在某些实施方式中，所述步骤(4)之后还包括电镀金、银、锡或钛的过程。
在某些实施方式中，OSP的过程或电镀金、银、锡或钛的过程后还包括二次蚀刻处理。
在某些实施方式中，或者在电镀后进行二次蚀刻处理。
在某些实施方式中，所述的铝材厚度至少为0.05mm；模具冲压而成的线路导通孔的孔径至少为0.05mm。
本发明还提供了一种双面铝基电路板，由所述的步骤制备而成。
本发明提供的双面铝基电路板的制备方法相对于现有技术的有益效果是：
本发明是为了解决现有技术的双面陶瓷基板的制备方法造价昂贵、操作中易碎、工艺采用激光打孔、激光成型效率低下、双面高温烧结银或化银线路反射率低、造成灯珠亮度低、不够节能的问题。
本发明技术采用模具冲压工艺效率高、节约成本；且铝基板的导热系数高，为传统双面陶瓷基板的一至二十倍；降低产品运行温度，提高产品承载功率和可靠性，延长产品使用寿命，达到节能目的；同款灯珠因支架不同，封装完毕后，本工艺成本比双面陶瓷支架低20％以上，更有利于LED灯推广；缩小了产品体积，降低硬体及装配成本；取代易碎的陶瓷基板，获得更好的机械耐久力。成品合格率高，生产所得的铝基板信赖性高。
基于以上特点，本发明提供的双面铝基电路板具有更为广阔的市场前景。
进一步的，所述步骤(3)中电镀铜的方法为真空电镀、化学镀或磁控溅射镀。
可以理解的是，真空电镀是一种物理沉积现象。即在真空状态下注入氩气，氩气撞击靶材，靶材分离成分子被导电的货品吸附形成一层均匀光滑的表面层。
可以理解的是，化学镀是一种新型的金属表面处理技术，该技术以其工艺简便、节能、环保日益受到人们的关注。化学镀使用范围很广，镀金层均匀、装饰性好。在防护性能方面，能提高产品的耐蚀性和使用寿命；在功能性方面，能提高加工件的耐磨导电性、润滑性能等特殊功能，因而成为全世界表面处理技术的一个发展。
磁控溅射镀能等概率地暴露其表面，从而在每个微颗粒表面都能镀上均匀、致密、附着力好的金属薄膜。
进一步的，所述步骤(3)中电镀铜后还包括水镀的过程。
可以理解的是，真空溅镀较为环保。而且溅镀可以掩盖一些瑕疵。
进一步的，OSP的过程或电镀金、银、锡、钛的过程后还包括二次蚀刻处理。
可以理解的是，OSP是印刷电路板(PCB)铜箔表面处理的符合RoHS指令要求的一种工艺。OSP是Organic Solderability Preservatives的简称，中译为有机保焊膜，又称护铜剂，英文亦称之Preflux。简单地说，OSP就是在洁净的裸铜表面上，以化学的方法长出一层有机皮膜。这层膜具有防氧化，耐热冲击，耐湿性，用以保护铜表面于常态环境中不再继续生锈(氧化或硫化等)；但在后续的焊接高温中，此种保护膜又必须很容易被助焊剂所迅速清除，如此方可使露出的干净铜表面得以在极短的时间内与熔融焊锡立即结合成为牢固的焊 点。
对铜层厚度要求比较高时，可在电镀铜的基础上进行水镀，形成上下两面线路与每个线路导通孔形成线路导通，线路导通孔壁上的线路铜层厚度≥10um。
综上所述，本发明提供的双面铝基电路板的制备方法其具有上述诸多的优点及价值，并在同类产品中未见有类似的方法公开发表或使用而确属创新，产生了好用且实用的效果，较现有的技术具有增进的多项功效，从而较为适于实用，并具有广泛的产业价值。
具体实施方式
在下文中，更全面地描述本公开的各种实施例。本公开可具有各种实施例，并且可在其中做出调整和改变。因此，将参照在实施例中示出的特定情形更详细地描述本公开。然而，应理解：不存在将本公开的各种实施例限于在此公开的特定实施例，而是应将本公开理解为涵盖落入本公开的各种实施例的精神和范围内的所有调整、等同物和/或可选方案。
在下文中，可在本公开的各种实施例中使用的术语“包括”或“可包括”指示所公开的功能、操作或元件的存在，并且不限制一个或更多个功能、操作或元件的增加。此外，如在本公开的各种实施例中所使用，术语“包括”、“具有”及其同源词仅意在表示特定特征、数字、步骤、操作、元件、组件或前述项的组合，并且不应被理解为首先排除一个或更多个其它特征、数字、步骤、操作、元件、组件或前述项的组合的存在或增加一个或更多个特征、数字、步骤、操作、元件、组件或前述项的组合的可能性。
在本公开的各种实施例中，表述“或”或“A或/和B中的至少一个”包 括同时列出的文字的任何组合或所有组合。例如，表述“A或B”或“A或/和B中的至少一个”可包括A、可包括B或可包括A和B二者。
在本公开的各种实施例中使用的表述(诸如“第一”、“第二”等)可修饰在各种实施例中的各种组成元件，不过可不限制相应组成元件。例如，以上表述并不限制所述元件的顺序和/或重要性。以上表述仅用于将一个元件与其它元件区别开的目的。例如，第一用户装置和第二用户装置指示不同用户装置，尽管二者都是用户装置。例如，在不脱离本公开的各种实施例的范围的情况下，第一元件可被称为第二元件，同样地，第二元件也可被称为第一元件。
应注意到：如果描述将一个组成元件“连接”到另一组成元件，则可将第一组成元件直接连接到第二组成元件，并且可在第一组成元件和第二组成元件之间“连接”第三组成元件。相反地，当将一个组成元件“直接连接”到另一组成元件时，可理解为在第一组成元件和第二组成元件之间不存在第三组成元件。
在本公开的各种实施例中使用的术语仅用于描述特定实施例的目的并且并非意在限制本公开的各种实施例。如在此所使用，单数形式意在也包括复数形式，除非上下文清楚地另有指示。除非另有限定，否则在这里使用的所有术语(包括技术术语和科学术语)具有与本公开的各种实施例所属领域普通技术人员通常理解的含义相同的含义。所述术语(诸如在一般使用的词典中限定的术语)将被解释为具有与在相关技术领域中的语境含义相同的含义并且将不被解释为具有理想化的含义或过于正式的含义，除非在本公开的各种实施例中被清楚地限定。
提供了一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对铝材进行冲压，在铝材上形成上下线路导通孔；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行电镀铜，使得上下两面线路与每个线路导通孔形成线路导通；
(4)进行线路蚀刻处理。
上述，本发明技术采用模具冲压工艺效率高、节约成本；且铝基板的散热系数高，为传统双面陶瓷基板的一至二十倍；降低产品运行温度，提高产品功率密度和可靠性，延长产品使用寿命，达到节能目的；同款灯珠因支架不同，封装完毕后，本工艺成本比双面陶瓷支架低20％以上，更有利于LED灯推广；缩小了产品体积，降低硬体及装配成本；取代易碎的陶瓷基板，获得更好的机械耐久力。成品合格率高，生产所得的铝基板信赖性高。
基于以上特点，本发明提供的双面铝基电路板具有更为广阔的市场前景。
进一步的，所述步骤(3)中电镀铜的方法为真空电镀、化学镀或磁控溅射镀。
上述，可以理解的是，真空电镀是一种物理沉积现象。即在真空状态下注入氩气，氩气撞击靶材，靶材分离成分子被导电的货品吸附形成一层均匀光滑的表面层。
可以理解的是，化学镀是一种新型的金属表面处理技术，该技术以其工艺简便、节能、环保日益受到人们的关注。化学镀使用范围很广，镀金层均匀、装饰性好。在防护性能方面，能提高产品的耐蚀性和使用寿命；在功能性方面，能提高加工件的耐磨导电性、润滑性能等特殊功能，因而成为全世界表面处理技术的一个发展。
磁控溅射镀能等概率地暴露其表面，从而在每个微颗粒表面都能镀上均匀、致密、附着力好的金属薄膜。
进一步的，所述步骤(2)之后还包括在氧化绝缘层上电镀陶瓷，增加绝缘性的过程；
所述步骤(3)中电镀铜的方法为真空电镀、化学镀或磁控溅射镀；
所述步骤(3)之后还包括再化学电镀或电镀铜，以增加铜层厚度的过程。
进一步的，所述线路导通孔的孔壁上的线路铜层厚度≥10um。
进一步的，所述步骤(4)之后还包括OSP的过程。
上述，可以理解的是，OSP是印刷电路板(PCB)铜箔表面处理的符合RoHS指令要求的一种工艺。OSP是Organic Solderability Preservatives的简称，中译为有机保焊膜，又称护铜剂，英文亦称之Preflux。简单地说，OSP就是在洁净的裸铜表面上，以化学的方法长出一层有机皮膜。这层膜具有防氧化，耐热冲击，耐湿性，用以保护铜表面于常态环境中不再继续生锈(氧化或硫化等)；但在后续的焊接高温中，此种保护膜又必须很容易被助焊剂所迅速清除，如此方可使露出的干净铜表面得以在极短的时间内与熔融焊锡立即结合成为牢固的焊点。
对铜层厚度要求比较高时，可在电镀铜的基础上进行水镀，形成上下两面线路与每个线路导通孔形成线路导通，线路导通孔壁上的线路铜层厚度≥10um。
进一步的，所述步骤(4)之后还包括电镀金、银、锡、钛的过程。
进一步的，OSP的过程或电镀金、银、锡、钛的过程后还包括二次蚀刻处理。
进一步的，或者在电镀后进行二次蚀刻处理。
进一步的，所述的铝材厚度至少为0.05mm；模具冲压而成的线路导通孔的孔径至少为0.05mm。
本发明还提供了一种双面铝基电路板，由任意一项所述的步骤制备而成。
为了便于理解本发明，下面结合实施例来进一步说明本发明的技术方案。申请人声明，本发明通过上述实施例来说明本发明的详细工艺设备和工艺流程，但本发明并不局限于上述详细工艺设备和工艺流程，即不意味着本发明应依赖上述详细工艺设备和工艺流程才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。
实施例1
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.06mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.06mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行真空电镀铜，使得上下两面线路与每个线路导通孔形成线路导通；线路铜层厚度为21um；
(4)进行线路蚀刻处理。
实施例2
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.08mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.07mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行化学镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为23um；
(4)进行线路蚀刻处理。
实施例3
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.1mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.1mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行磁控溅射镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为28um；
(4)进行线路蚀刻处理；
(5)进行OSP。
实施例4
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.5mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.5mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行磁控溅射镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为28um；
(4)进行线路蚀刻处理；
(5)电镀金；
(6)进行二次线路蚀刻处理。
实施例5
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.1mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.1mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层后进行磁控溅射镀陶瓷；
(3)将镀完陶瓷的铝材进行磁控溅射镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为28um；
(4)进行线路蚀刻处理；
(5)电镀银；
(6)进行二次线路蚀刻处理。
实施例6
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.5mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.4mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行磁控溅射镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为28um；
(4)进行线路蚀刻处理；
(5)电镀锡；
(6)进行二次线路蚀刻处理。
实施例7
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.5mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.4mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行磁控溅射镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为28um；
(4)进行线路蚀刻处理；
(5)电镀钛；
(6)进行二次线路蚀刻处理。
实施例8
一种双面铝基电路板的制备方法，包括以下步骤：
(1)用模具对厚度为0.5mm铝材进行冲压，在铝材上形成上下线路导通孔，孔径为0.5mm；
(2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
(3)将阳极氧化后的铝材进行磁控溅射镀铜，使得上下两面线路与每个线路导通孔形成线路导通；化学镀铜后还包括水镀的过程；线路铜层厚度为28um；
(4)进行线路蚀刻处理；
(5)进行化镀银。

Claims (10)

  1. 双面铝基电路板的制备方法，其特征在于：包括以下步骤：
    (1)用模具对铝材进行冲压，在铝材上形成上下线路导通孔；
    (2)将冲压好的铝材进行阳极氧化处理，在铝材上形成氧化铝绝缘层；
    (3)将阳极氧化后的铝材进行电镀铜，使得上下两面线路与每个线路导通孔形成线路导通；
    (4)进行线路蚀刻处理。
  2. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：
    所述步骤(2)之后还包括在氧化绝缘层上电镀陶瓷，增加绝缘性的过程；
    所述步骤(3)中电镀铜的方法为真空电镀、化学镀或磁控溅射镀；
    所述步骤(3)之后还包括再化学电镀或电镀铜以增加铜层厚度的过程。
  3. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：所述步骤(3)中电镀铜后还包括水镀的过程。
  4. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：所述线路导通孔的孔壁上的线路铜层厚度≥10um。
  5. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：所述步骤(4)之后还包括有机保焊膜的过程，所述有机保焊膜又称护铜剂。
  6. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：所述步骤(4)之后还包括电镀金、银、锡或钛的过程。
  7. 根据权利要求5或6所述的双面铝基电路板的制备方法，其特征在于：有机保焊膜的过程或电镀金、银、锡或钛的过程后还包括二次蚀刻处理。
  8. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：在 电镀后进行二次蚀刻处理。
  9. 根据权利要求1所述的双面铝基电路板的制备方法，其特征在于：所述的铝材厚度至少为0.05mm；模具冲压而成的线路导通孔的孔径至少为0.05mm。
  10. 一种双面铝基电路板，其特征在于：由权利要求1～9中任意一项所述的步骤制备而成。
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