WO2018164125A1 - Stretchable wiring body and stretchable substrate - Google Patents

Abstract

This stretchable wiring body 30 is provided with: a conductor part 40 which contains a binder 41 and conductive particles 42 that are dispersed in the binder 41; and a soft resin 50 which is embedded in the binder 41, and which is relatively softer than the binder 41. The conductive particles 42 are not covered by the soft resin 50.

Description

Elastic wiring body and elastic substrate

The present invention relates to a stretchable wiring body and a stretchable substrate.
For the designated countries that are allowed to be incorporated by reference, the contents described in Japanese Patent Application No. 2017-045481 filed in Japan on March 9, 2017 are incorporated herein by reference. As part of

As a stretchable substrate, a stretchable base material and a conductive pattern formed on the stretchable base material and containing conductive fine particles and an elastomer are known, and the elastomer is not crosslinked with a crosslinking agent ( For example, see Patent Document 1).

JP 2014-236103 A

Generally, in a stretchable substrate, if the conductive pattern cannot follow the deformation of the stretchable base material, there is a problem in that the conductor pattern is cracked and the conductivity of the conductor pattern is lowered.

On the other hand, it is conceivable to suppress the occurrence of cracks in the conductor pattern due to deformation of the stretchable base material by imparting high flexibility without crosslinking the elastomer with a cross-linking agent as in the stretchable substrate. However, in this case, since the Young's modulus of the elastomer is lowered, there is a problem that the durability is poor.

The problem to be solved by the present invention is to provide a stretchable wiring body and a stretchable substrate capable of improving durability while suppressing a decrease in conductivity.

[1] A stretchable wiring body according to the present invention includes a binder, a conductor portion including conductive particles dispersed in the binder, and a soft resin embedded in the binder and relatively softer than the binder. The conductive particles are stretchable wiring bodies that are not covered with the soft resin.

[2] In the above invention, the following expression (1) may be satisfied.
D> L (1)
However, in said Formula (1), D is a particle size of the said electroconductive particle, L is the length of the said soft resin.

[3] In the above invention, the shape of the soft resin may be granular.

[4] In the above invention, the soft resin may be dispersed in the binder.

[5] A stretchable substrate according to the present invention is a stretchable substrate comprising the stretchable wiring body and a stretchable base material provided with the conductor portion.

[6] In the above invention, at least a part of the soft resin may be a protrusion from which a part of the stretchable substrate protrudes.

According to the present invention, since the soft resin can follow the deformation of the wiring body, the occurrence of cracks in the conductor portion can be suppressed. Thereby, the fall of the electroconductivity of a conductor part can be suppressed.

Also, since the soft resin is embedded in the binder, it is difficult to expose to the outside. For this reason, deterioration of the soft resin can be suppressed, and the durability of the entire stretchable substrate can be improved.

FIG. 1 is a perspective view showing a stretchable substrate for connecting external circuits according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the stretchable substrate cut in the height direction along the extending direction. FIG. 3 is a partially enlarged view of a conductor portion and a soft resin according to an embodiment of the present invention. FIG. 4 is a diagram for explaining the particle size of the particles. FIG. 5A is a partially enlarged view of the conductor portion according to the comparative example, showing a state before the stretchable substrate is stretched, and FIG. 5B is a partially enlarged view of the conductor portion according to the comparative example. Yes, shows a state after the stretchable substrate is stretched. 6A is a partially enlarged view of a conductor portion according to an embodiment of the present invention, showing a state before the stretchable substrate is stretched, and FIG. 6B is an embodiment of the present invention. It is the elements on larger scale of the conductor part which concerns on a form, and shows the state after extending | stretching an elastic board | substrate. FIG. 7 is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention cut in the height direction. FIG. 8A is a plan view showing a stretchable substrate according to another embodiment of the present invention, and FIG. 8B is a modification of the stretchable substrate according to another embodiment of the present invention. FIG. FIG. 9 is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention cut in the height direction. FIG. 10A is a plan view showing a stretchable substrate according to another embodiment of the present invention, and FIG. 10B is a modification of the stretchable substrate according to another embodiment of the present invention. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a stretchable substrate that connects external circuits according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the stretchable substrate cut in the height direction along the extending direction. FIG. 3 is a partially enlarged view of a conductor portion and a soft resin according to an embodiment of the present invention, and FIG. 4 is a diagram for explaining the particle size of particles.

The stretchable substrate 10 shown in FIG. 1 is a stretchable wiring substrate that electrically connects external circuits 100 such as a rigid substrate and a flexible printed wiring board (FPC). Such a stretchable substrate 10 is not particularly limited. For example, the stretchable substrate 10 is applied to a portion requiring flexibility and stretchability, such as a movable portion such as an industrial robot, a bent portion, and an internal wiring of a laptop personal computer. The As shown in FIG. 2, the stretchable substrate 10 includes a stretchable base material 20 and a stretchable wiring body 30.

The stretchable base material 20 is a plate-like member formed in a rectangular shape having stretchability. As the stretchable base material 20, for example, an elastic sheet (elastomer sheet) or a fabric made of fibers can be used. As the elastomer, for example, natural rubber, styrene butadiene rubber, butadiene rubber, chloroprene rubber, butyl rubber, nitrile rubber, ethylene propylene rubber, acrylic rubber, urethane rubber, silicone rubber, or fluorine rubber can be used. Other elastomer materials may be used. Examples of the fiber that can be used include rayon, nylon, polyester, acrylic, polyurethane, vinylon, polyethylene, Nafion (registered trademark), aramid, and cotton.

The Young's modulus of the stretchable substrate 20 is preferably 0.1 to 35 MPa. The maximum elongation of the stretchable substrate 20 is preferably 5 to 50%. The maximum elongation means the maximum value of the elongation rate that can be elastically deformed in each configuration. Further, the elongation at break of the stretchable substrate 20 is preferably 50% or more. Further, the thickness of the stretchable substrate 20 is preferably 20 to 300 μm.

The stretchable wiring body 30 has stretchability and is provided on the stretchable base material 20 as shown in FIG. As shown in FIG. 3, the stretchable wiring body 30 includes a conductor portion 40 and a soft resin 50.

The conductor part 40 is composed of an arbitrary pattern such as a linear pattern or a curved pattern, and is provided on the stretchable base material 20 (specifically, the main surface 21). The conductor portion 40 includes a binder 41 and conductive particles 42. The binder 41 is a binder resin, which binds the plurality of conductive particles 42 included in the conductor portion 40 and stabilizes the conductive particles 42 so as not to be condensed again when the stretchable substrate 10 is deformed. Therefore, it is contained in the conductor part 40. The conductor portion 40 preferably has elasticity like the elastic substrate 20, and in this case, it is preferable to use a synthetic resin or an elastomer as the binder 41. As a result, even when the elastic substrate 10 is deformed by an external force such as stretching or bending, the original shape can be obtained by removing the external force.

As the binder 41, polyester resin, polyurethane resin, acrylic resin, acrylic rubber, urethane rubber, nitrile rubber, silicone rubber, fluororubber, a composite of two or more of these can be used. Such a binder 41 may be a crosslinkable resin composition or an uncrosslinkable resin composition.

The Young's modulus of the binder 41 is preferably 1 to 35 MPa. The maximum elongation of the binder 41 is preferably 5 to 50%. Further, the breaking elongation of the binder 41 is preferably 50% or more.

The conductive particles 42 are dispersed in the binder 41. As the conductive particles 42, a metal material such as gold, silver, platinum, ruthenium, lead, tin, zinc, bismuth, or a metal material thereof, or a non-metallic material such as carbon can be used. The shape of the conductive particles 42 is preferably a scaly or irregular shape. The proportion of the conductive particles 42 in the stretchable wiring body 30 is preferably 50% or more. The presence ratio in the stretchable wiring body 30 refers to the ratio of the area that occupies the total cross-sectional area of the stretchable wiring body 30 in a cross section obtained by cutting the stretchable wiring body 30 along the height direction. .

The particle size D of the conductive particles 42 is preferably 0.5 to 20 μm. The particle diameter of the conductive particles 42 is an average particle diameter, and means the average value of the diameters D of virtual circles C circumscribing the conductive particles 42 as shown in FIG.

The soft resin 50 is a resin composition that is relatively softer than the binder 41. The soft resin 50 is provided to improve the stretchability of the conductor portion 40 so that the conductor portion 40 can follow the deformation of the stretchable base material 20.

This soft resin 50 is an elastomer and has elasticity. As such a soft resin 50, the same material as the above-mentioned binder 41 can be used. For example, the binder 41 and the soft resin 50 may be made of the same material. In this case, a plasticizer or the like is added to the soft resin 50 to make the soft resin 50 softer than the binder 41.

The Young's modulus of the soft resin 50 is preferably relatively lower than the Young's modulus of the binder 41. The Young's modulus of such a soft resin 50 is preferably 0.1 to 20 MPa.

This soft resin 50 is embedded in the binder 41. In the present embodiment, the shape of the soft resin 50 is granular. The granular soft resin 50 is dispersed in the binder. The shape of the granular soft resin 50 may be, for example, a one-sided or indefinite shape, similar to the conductive particles 42. The length L of the soft resin 50 is preferably 0.5 to 10 μm in an unloaded state. The length L of the soft resin 50 means an average value of the longest length of the soft resin 50. In this embodiment, since the soft resin 50 is granular, the particle size of the soft resin particles is used as the length L of the soft resin 50.

From the viewpoint of suppressing the occurrence of cracks in the conductor portion 40 and the propagation and progress of the generated cracks, the relationship between the particle diameter D of the conductive particles 42 and the length L of the soft resin 50 is expressed by the following equation (2). It is preferable to set so as to satisfy.
D> L (2)

In the binder 41, the conductive particles 42 and the soft resin 50 are separated and dispersed without aggregating with each other. For this reason, the conductive particles 42 are not covered with the soft resin 50. The conductive particles 42 and the soft resin 50 may be in contact with each other, but the outer periphery of the conductive particles 42 is not completely covered with the soft resin 50. From the viewpoint of improving the stretchability of the conductor portion 40 and suppressing the decrease in conductivity of the conductor portion 40, the proportion of the soft resin 50 in the stretchable wiring body 30 is preferably 1 to 50%. .

Such a conductor portion 40 is formed by applying a conductive paste on the main surface 21 of the stretchable base material 20 and curing it. Specific examples of such a conductive paste include the binder 41, the conductive particles 42, and the soft resin 50 described above, water, a solvent, and various additives (for example, an anti-aging agent, a flame retardant, a softening agent, etc. ) Can be exemplified. Examples of the solvent contained in the conductive paste include butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, dipropylene glycol monobutyl ether, diethylene glycol monoethyl ether, cyclohexanone, isophorone, and terpineol.

In addition, examples of the method for applying the conductive paste include a dispensing method, an ink jet method, and a screen printing method. Alternatively, a slit coating method, a bar coating method, a blade coating method, a dip coating method, a spray coating method, a spin coating method, and the like can be given. Examples of the method for curing the conductive paste include heat treatment, irradiation with energy rays such as infrared rays, ultraviolet rays, and laser beams. Moreover, you may perform only drying as a hardening process of an electrically conductive paste.

The operation of the stretchable wiring body 30 and the stretchable substrate 10 of this embodiment will be described. FIG. 5A is a partially enlarged view of a conductor portion according to a comparative example, showing a state before the stretchable substrate is stretched, and FIG. 5B is a partially enlarged view of the conductor portion according to the comparative example, The state after extending | stretching an elastic board | substrate is shown. 6A is a partially enlarged view of a conductor portion according to an embodiment of the present invention, showing a state before the stretchable substrate is stretched, and FIG. 6B is an embodiment of the present invention. It is the elements on larger scale of the conductor part which concerns on a form, and shows the state after extending | stretching an elastic board | substrate.

In the stretchable substrate 110 according to the first comparative example, as shown in FIG. 5A, the conductor portion 140 includes the binder resin 141 and the conductive particles 142. When an external force is applied to the stretchable substrate 110, in the conductor portion 140, the occurrence of cracks in the conductor portion 140 can be suppressed by expanding and contracting the binder resin 141 following the deformation of the stretchable substrate 110. It becomes possible.

Here, when the Young's modulus increases, the resin composition such as the binder tends to decrease the maximum elongation and the breaking elongation, and the rigidity tends to improve. On the other hand, the Young's modulus Accordingly, the maximum elongation and the breaking elongation tend to be improved, and the rigidity tends to be lowered accordingly. If the Young's modulus of the binder 141 is lowered to improve the stretchability of the conductor part 140 in order to make the conductor part 140 easily follow the deformation of the stretchable substrate 110, the rigidity of the binder 141 decreases, and as a result, the conductor The durability of the entire portion 140 is reduced. On the other hand, if the Young's modulus of the binder 141 is increased to improve the rigidity of the binder 141 in order to improve the durability of the entire stretchable substrate 110, the stretchability of the binder 141 is impaired, and FIG. As shown in B), the conductor part 140 cannot follow the deformation of the stretchable substrate 110, and the conductor part 140 is cracked.

Further, in order to make the conductor part 140 follow the deformation of the stretchable substrate 110 easily, when the Young's modulus of the binder 141 is lowered and the stretchability of the conductor part 140 is improved, the extension of the conductor part 140 is performed in the entire region. It occurs evenly. For this reason, in the state where the elastic substrate 110 is deformed, the conductive particles 142 are separated from each other, or the contact resistance between the conductive particles 142 is increased, so that the conductivity of the conductor portion 140 is lowered.

In contrast to this comparative example, in this embodiment, a soft resin 50 that is relatively softer than the binder 41 is embedded in the binder 41 as shown in FIG. In this case, since the soft resin 50 can follow the deformation of the stretchable substrate 10, the stretchability of the conductor portion 40 can be improved. On the other hand, by embedding the soft resin 50 in the binder 41, the soft resin 50 is hardly exposed to the outside of the stretchable substrate 10. For this reason, since deterioration of the soft resin 50 inferior in durability can be suppressed, the durability of the entire stretchable wiring body 30 can be improved.

Further, in the present embodiment, as shown in FIG. 6B, the soft resin 50 is deformed in preference to the binder 41 with respect to the deformation of the stretchable substrate 10, so that the entire area of the conductor portion 40 is expanded. It is possible to suppress stretching evenly. Thereby, when the elastic substrate 10 is deformed, it is possible to prevent the conductivity of the conductor portion 40 from being lowered.

In the present embodiment, the conductive particles 42 are not covered with the soft resin 50. For this reason, even if an external force is applied to the stretchable substrate 10, the conductor portion 40 is deformed, and the arrangement of the conductive particles 42 is changed, the conductive particles 42 can contact each other. In this case, since a new conduction path is generated in the conductor portion 40, the conductivity of the conductor portion 40 can be improved.

In this embodiment, the relationship between the diameter D of the conductive particles 42 and the diameter L of the soft resin 50 satisfies the above formula (2). For this reason, generation | occurrence | production of the crack in the conductor part 40 along the surface of the soft resin 50, propagation of the crack which generate | occur | produced, and progress can be suppressed.

Further, in the present embodiment, since the soft resin 50 is granular, the stretchability of the conductor portion 40 can be easily exhibited regardless of the direction of the external force applied to the stretchable wiring body 30.

In this embodiment, the granular soft resin 50 is dispersed in the binder 41. In this case, since the granular soft resin 50 exists in the whole conductor part 40, stretchability can be provided to the whole stretchable wiring body 30. FIG.

The “elastic substrate 10” in the present embodiment corresponds to an example of the “elastic substrate” in the present invention, and the “elastic substrate 20” in the present embodiment corresponds to an example of the “elastic substrate” in the present invention. In this embodiment, the “stretchable wiring body 30” corresponds to an example of the “stretchable wiring body” in the present invention, and the “conductor portion 40” in the present embodiment corresponds to an example of the “conductor portion” in the present invention. The “binder 41” in the present embodiment corresponds to an example of the “binder” in the present invention, and the “conductive particle 42” in the present embodiment corresponds to an example of the “conductive particle” in the present invention. The “soft resin 50” in the form corresponds to an example of the “soft resin” in the present invention.

FIG. 7 is a cross-sectional view of a stretchable substrate according to another embodiment of the present invention cut in the height direction, and FIG. 8A is a plan view showing the stretchable substrate according to another embodiment of the present invention. FIG. 8B is a plan view showing a modified example of the stretchable substrate according to another embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the structure similar to the above-mentioned embodiment, repeated description is abbreviate | omitted, and the description made in the above-mentioned embodiment is used.

In the stretchable substrate 10B shown in FIG. 7, the stretchable wiring body 30B includes a first region 301 in which the soft resin 50 is present and a second proportion in which the soft resin 50 is present in a low ratio compared to the first region 301. The area 302 is included.

The first region 301 is, for example, a region where a difference in stretchability is likely to occur between the stretchable substrate 20 and the conductor portion 40 such as the vicinity of the main surface 21 of the stretchable substrate 20 (for example, the stretchable substrate 20 And the conductor portion 40). The second region 302 is arranged corresponding to a region in which the difference in stretchability hardly occurs in the region other than the first region 301 in the conductor portion 40. In this embodiment, the 1st area | region 301 and the 2nd area | region 302 are laminated | stacked in order from the side near the elastic base material 20 along the height direction of the elastic wiring body 30B.

In particular, in the present embodiment, by setting the existence ratio of the soft resin 50 in the second region 302 to 0%, that is, because the soft resin 50 does not exist in the second region 302, The existing ratio of the soft resin 50 is lower than the existing ratio of the soft resin 50 in the first region 301. Note that the proportion of the soft resin 50 in the second region 302 may be set to be higher than 0% and lower than the proportion of the soft resin 50 in the first region 301.

The soft resin 50 is dispersed on the main surface 21 of the stretchable base material 20. In the present embodiment, as shown in FIG. 8 (A), the plurality of soft resins 50 are evenly arranged in the entire area of the main surface 21 of the stretchable base material 20, but the present invention is not particularly limited thereto. The soft resin 50 corresponds only to a region where the conductor portion 40 is provided on the main surface 21 of the stretchable base material 20 as in the stretchable substrate 10C (stretchable wiring body 30C) shown in FIG. It may be arranged.

Such a stretchable substrate 10B can be manufactured by the following method. That is, first, a solution composed of the soft resin 50 mixed with water or a solvent and various additives is applied onto the main surface 21 of the stretchable base material 20, and the solution is dried. And the above-mentioned conductive paste is apply | coated on the main surface 21 with which the soft resin 50 remained, the said conductive paste is hardened, and the conductor part 40 is formed. Thus, the stretchable substrate 10B can be obtained.

Thus, in this embodiment, since the conductive paste in which the soft resin 50 is not dispersed can be used as the conductive paste for forming the conductor portion 40, various wide-ranging according to the demand for the stretchable substrate 10 can be used. Can be easily used.

In the present embodiment, since the soft resin 50 is disposed corresponding to the interface between the stretchable base material 20 and the conductor portion 40 that easily causes a difference in extensibility, the difference in extensibility is caused at these interfaces. The resulting crack is less likely to occur. Thereby, the durability of the stretchable substrate 10B can be improved.

In the present embodiment, the soft resin is not dispersed in the binder 41 of the conductor portion 40, but is not particularly limited thereto. That is, the soft resin 50 may be disposed corresponding to the interface between the stretchable base material 20 and the conductor portion 40, and the granular soft resin may be dispersed in the binder 41 of the conductor portion 40.

FIG. 9 is a sectional view of a stretchable substrate according to another embodiment of the present invention cut in the height direction, and FIG. 10A is a plan view showing the stretchable substrate according to another embodiment of the present invention. FIG. 10B is a plan view showing a modified example of the stretchable substrate according to another embodiment of the present invention. In addition, the same code | symbol is attached | subjected to the structure similar to the above-mentioned embodiment, repeated description is abbreviate | omitted, and the description made in the above-mentioned embodiment is used.

In the stretchable substrate 10D shown in FIG. 9, the soft resin 50B of the stretchable wiring body 30D is formed in a prismatic shape having a substantially square cross-sectional shape. The soft resin 50 </ b> B is directly provided on the main surface 21 of the stretchable base material 20 and protrudes toward the side away from the main surface 21.

As shown in FIG. 10A, the plurality of soft resins 50B are arranged in a zigzag shape (zigzag shape) in plan view. In addition, the arrangement | sequence method of the some soft resin 50B is not specifically limited above, You may arrange in a grid | lattice form or may arrange at random. In the present embodiment, the plurality of soft resins 50B are evenly distributed over the entire upper surface 21 (main surface 21). However, the present invention is not particularly limited thereto, and the plurality of soft resins 50 are illustrated in FIG. Like the stretchable substrate 10E (stretchable wiring body 30E) shown in FIG. 9, the stretchable substrate 20 may be disposed only in a region where the conductor portion 40 is provided on the main surface 21 of the stretchable base material 20. In addition, on the upper surface 21, regions having different arrangement densities of the soft resin 50 </ b> B may be mixed and arranged.

The conductor portion 40 is formed by applying and curing a conductive paste so as to cover the soft resin 50B. Thus, the soft resin 50B having a prismatic shape is embedded in the binder 41. As shown in FIG. 9, the length L of the soft resin 50B is preferably smaller than the height H of the conductor portion 40 (see FIG. 2) (H> L). Further, the length L of the soft resin 50B is preferably smaller than the particle size D (see FIG. 4) of the conductive particles 42 (D> L). In addition, since the soft resin 50B of this embodiment has a sufficiently large aspect ratio, the length of the soft resin 50B in the height direction is approximated to the length L of the soft resin 50B.

Such a soft resin 50B may be formed by applying and curing a soft resin composition on the main surface 21 using a method such as a dispensing method, an inkjet method, or a screen printing method. Alternatively, the soft resin 50B may be formed by pressing a plate (not shown) against the main surface 21 of the stretchable base material 20 using an imprint method. In this case, the soft resin 50B is a protrusion from which a part of the stretchable base material 20 protrudes, and the stretchable base material 20 and the soft resin 50B are integrated.

In such a stretchable substrate 10D, an arrangement of a plurality of soft resins 50B can be set in advance. Here, when the proportion of the soft resin 50 in the stretchable wiring body 30D is increased, the stretchability of the conductor portion 40 tends to be improved accordingly, and the durability of the conductor portion 40 tends to be lowered. On the other hand, if the proportion of the soft resin 50 in the binder 41 is decreased, the stretchability of the conductor portion 40 tends to decrease accordingly, and the durability of the conductor portion 40 tends to improve. is there. In this case, for example, in the region where the deformation amount of the stretchable substrate 10D is large, the conductor portion 40 is required to have high stretchability. Therefore, while the soft resin 50B is present in a large amount, Since the conductor portion 40 is required to have durability higher than the stretchability, the soft resin 50B is present in a small amount. Thereby, in the elastic substrate 10D, both the elasticity and durability of the conductor part 40 can be improved as required.

In the present embodiment, the soft resin is not dispersed in the binder 41 of the conductor portion 40, but is not particularly limited thereto. That is, the soft resin 50 </ b> B may be directly provided on the main surface 21 of the stretchable base material 20, and the granular soft resin may be dispersed in the binder 41 of the conductor portion 40. In this case, the soft resin 50B which is at least a part of the soft resin may be a protrusion from which a part of the stretchable base material 20 protrudes.

The embodiment described above is described for easy understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

For example, in the above-described embodiment, the conductor portion 40 is directly provided on the stretchable base material 20. However, the present invention is not particularly limited thereto, and an intervening layer exists between the stretchable base material 20 and the conductor portion 40. You may do it. As a material constituting this intervening layer, for example, a polyester resin, a polyurethane resin, an acrylic resin, a silicon resin, or the like can be used. One or a plurality of such intervening layers may be laminated between the stretchable base material 20 and the conductor portion 40.

DESCRIPTION OF SYMBOLS 10 ... Elastic substrate 20 ... Elastic base material 21 ... Main surface 30 ... Elastic wiring body 301 ... 1st area | region 302 ... 2nd area | region 40 ... Conductor part 41 ... Binder 42 ... Conductive particle 50 ... Soft resin

Claims (6)

1. A conductor and a conductive part containing conductive particles dispersed in the binder;
   Embedded in the binder, and a soft resin that is relatively softer than the binder,
   The conductive particles are stretchable wiring bodies not covered with the soft resin.
2. The stretchable wiring body according to claim 1,
   A stretchable wiring body that satisfies the following formula (1).
   D> L (1)
   However, in said Formula (1), D is a particle size of the said electroconductive particle, L is the length of the said soft resin.
3. The stretchable wiring body according to claim 1 or 2,
   The flexible resin is a stretchable wiring body having a granular shape.
4. The stretchable wiring body according to claim 3,
   An elastic wiring body in which the soft resin is dispersed in the binder.
5. The stretchable wiring body according to any one of claims 1 to 4,
   A stretchable substrate comprising: a stretchable base material provided with the conductor portion.
6. The stretchable substrate according to claim 5,
   A stretchable substrate, wherein at least a part of the soft resin is a protrusion from which a part of the stretchable base material protrudes.

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