WO2018157814A1 - 触控屏的制作方法、触控屏和显示装置 - Google Patents

触控屏的制作方法、触控屏和显示装置 Download PDF

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Publication number
WO2018157814A1
WO2018157814A1 PCT/CN2018/077523 CN2018077523W WO2018157814A1 WO 2018157814 A1 WO2018157814 A1 WO 2018157814A1 CN 2018077523 W CN2018077523 W CN 2018077523W WO 2018157814 A1 WO2018157814 A1 WO 2018157814A1
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WIPO (PCT)
Prior art keywords
substrate
touch screen
transparent conductive
adhesive layer
peelable adhesive
Prior art date
Application number
PCT/CN2018/077523
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English (en)
French (fr)
Inventor
陈荣龙
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/323,431 priority Critical patent/US10969888B2/en
Publication of WO2018157814A1 publication Critical patent/WO2018157814A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G5/00—Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
    • G09G5/003—Details of a display terminal, the details relating to the control arrangement of the display terminal and to the interfaces thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices

Definitions

  • Embodiments of the present disclosure relate to a method of manufacturing a touch screen, a touch screen, and a display device.
  • the OGS touch panel for example, a touch made of an ITO (Indium Tin Oxide) conductive film is directly formed on a base substrate (for example, a glass substrate) included in the protective substrate of the OGS touch panel.
  • the sensor is controlled.
  • the protective substrate serves the dual function of protecting and carrying the touch sensor.
  • the OGS touch screen has the following advantages: simple structure, light, thin, and good light transmission; and, due to the elimination of a glass substrate and the corresponding bonding process, it is beneficial to reduce production cost and improve product yield. .
  • the embodiment of the present disclosure provides a method for manufacturing a touch screen, a touch screen, and a display device.
  • the embodiment of the present disclosure can simplify the process of the touch screen.
  • a method for fabricating a touch screen includes the steps of: forming a black border on a substrate; forming a peelable adhesive layer in a visible region of the substrate on which the black border is formed; and separating the black border and the peelable layer Forming a metal layer on the adhesive layer; peeling off the first portion of the peelable adhesive layer and the metal layer in the visible region; and peeling off the peelable adhesive layer and the metal layer in the first portion of the visible region Photolithography is performed on the substrate to prepare a touch screen.
  • the photolithography is performed on a substrate on which the first portion of the peelable adhesive layer and the metal layer located in the visible region is peeled off, and the touch screen is formed by: peeling off the peelable adhesive Forming a transparent conductive material on the substrate of the first portion of the layer and the metal layer in the visible region; etching the transparent conductive material on the substrate on which the transparent conductive material is formed and the second portion of the metal layer in the region of the black border Etching, forming transparent conductive bridges, transparent conductive leads, and metal leads.
  • the etching of the transparent conductive material and the etching of the second portion of the metal layer are performed in the same photolithography process.
  • the photolithography is performed on the substrate on which the first portion of the peelable adhesive layer and the metal layer located in the visible region is peeled off, and the resulting touch screen further comprises: completing the transparent An insulating layer is formed on the substrate after etching of the conductive material and etching of the second portion of the metal layer.
  • the photolithography is performed on the substrate on which the first portion of the peelable adhesive layer and the metal layer located in the visible region is peeled off, and the method further comprises: forming an insulating layer An electrode layer is formed in the visible region of the substrate to produce a touch screen.
  • the electrode layer includes a plurality of discrete electrode patterns and a continuous electrode pattern between the discrete electrode patterns, and adjacent discrete electrode patterns are electrically connected through the transparent conductive bridge points.
  • a lead connection bridge adjacent to the metal lead is also formed by etching of the transparent conductive material, the lead connection bridge will be a discrete electrode pattern and a metal lead adjacent to the lead connection bridge Electrical connection.
  • the continuous electrode pattern is in contact with a side surface of the transparent conductive lead and a side surface of the metal lead.
  • an orthographic projection of the transparent conductive lead on the substrate coincides with an orthographic projection of the metal lead on the substrate.
  • the transparent conductive material is in direct contact with the second portion of the metal layer.
  • the forming the peelable adhesive layer in the visible region of the substrate formed with the black frame comprises: forming a peelable layer in the visible region of the substrate formed with the black frame by using a screen printing process Adhesive layer.
  • the thickness of the peelable adhesive layer is greater than the height of the black border.
  • the first portion of the peelable adhesive layer and the metal layer in the visible region within the visible region includes: adhering an adhesive strip on the metal layer in the visible region;
  • the adhesive strip is used to separate the peelable adhesive layer in the visible region from the substrate, thereby peeling off the peelable adhesive layer and the metal layer in the visible region.
  • the adhesion between the adhesive strip and the metal layer is greater than the adhesion between the peelable adhesive layer and the substrate, and the bond between the metal layer and the peelable adhesive layer The force is greater than the bond between the peelable adhesive layer and the substrate.
  • the adhesion between the peelable adhesive layer and the substrate is less than the bond between the metal layer and the black border.
  • At least one embodiment of the present disclosure provides a method of fabricating a touch screen, comprising: forming a peelable adhesive layer in a visible region of a substrate; forming a metal layer on the substrate on which the peelable adhesive layer is formed, the metal The layer includes a first portion on the peelable adhesive layer in the visible region and a second portion in the bezel region outside the visible region of the substrate; the peelable adhesive layer and the metal layer in the peeling visible region are visible a first portion in the region; forming a transparent conductive material on the substrate from which the first portion of the peelable adhesive layer and the metal layer is peeled off in the visible region, the transparent conductive material being located in the visible region and the bezel region; and at the same time A second portion of the transparent conductive material and the metal layer located in the bezel region is patterned in a photolithography process to form transparent conductive bridge dots, transparent conductive leads, and metal leads.
  • At least one embodiment of the present disclosure further provides a touch screen, which is fabricated according to the method for fabricating the touch screen in any of the above embodiments.
  • At least one embodiment of the present disclosure further provides a touch screen including: a substrate having a visible area and a bezel area outside the visible area; and a first touch electrode located in the visible area And comprising a plurality of discrete electrode patterns and transparent conductive bridges between adjacent discrete electrode patterns and electrically connecting adjacent discrete electrode patterns; a second touch electrode located in the visible region, The first touch electrodes intersect; and a plurality of leads located in the frame region are electrically connected to the first touch electrodes and the second touch electrodes, respectively.
  • each lead includes a metal lead and a transparent conductive lead that are stacked and directly in contact with each other, an orthographic projection of the metal lead on the substrate and a positive of the transparent conductive lead on the substrate The projections coincide.
  • the touch screen further includes an insulating layer, and the insulating layer includes a portion between the intersection of the first touch electrode and the second touch electrode to change the first touch The electrode and the second touch electrode are insulated.
  • At least one embodiment of the present disclosure further provides a display device including the touch screen in any of the above embodiments.
  • FIG. 1 is a schematic structural diagram of a touch screen according to an embodiment of the present disclosure
  • FIG. 2 is a flow chart of a method for fabricating a touch screen according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural view of forming a black frame on a substrate according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural view of forming a peelable adhesive layer in a visible region according to an embodiment of the present disclosure
  • FIG. 5 is a schematic structural view of forming a metal layer on a black frame and a peelable adhesive layer according to an embodiment of the present disclosure
  • FIG. 6 is a schematic structural view of a peelable adhesive layer in a peeling visible region and a metal layer in a visible region in an embodiment of the present disclosure
  • FIG. 7 is a flowchart of a method for fabricating a touch screen according to another embodiment of the present disclosure.
  • FIG. 8 is a schematic structural view of forming a transparent conductive material on a substrate according to an embodiment of the present disclosure
  • FIG. 9 is a schematic structural view of forming a photoresist on a transparent conductive material according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic structural view of etching a transparent conductive material according to an embodiment of the present disclosure
  • FIG. 11 is a schematic structural view of etching a metal layer according to an embodiment of the present disclosure.
  • FIG. 12 is a schematic structural view of a stripping photoresist according to an embodiment of the present disclosure.
  • FIG. 13 is a schematic structural view of forming an insulating layer on a substrate according to an embodiment of the present disclosure
  • 14a is a schematic structural view 1 of forming an electrode layer on a substrate according to an embodiment of the present disclosure
  • FIG. 14b is a second structural diagram of forming an electrode layer on a substrate according to an embodiment of the present disclosure.
  • 14c is a schematic structural view 3 of forming an electrode layer on a substrate according to an embodiment of the present disclosure
  • 15 is a flow chart of peeling a peelable adhesive layer in a visible region and a metal layer in a visible region in a method for fabricating a touch screen according to an embodiment of the present disclosure
  • FIG. 16 is a flowchart of a method for fabricating a touch screen according to still another embodiment of the present disclosure.
  • the manufacturing process of the OGS touch screen requires at least 5 masks, respectively: making a black matrix (BM) The first mask, the second mask for the ITO bridge, the third mask for the metal trace, the fourth mask for the insulating layer (such as OC), and the ITO The fifth mask of the ITO Pattern.
  • BM black matrix
  • the inventor of the present application noticed that in the above-mentioned manufacturing process, due to the high price of the high-generation quartz reticle, the product development and production cost are high; and, the ITO bridge point manufacturing process and the metal lead manufacturing process It is a key process in the touch screen manufacturing process, and is also a high-fat process with poor electrical function.
  • the ITO bridge point fabrication process and the metal lead fabrication process need to be separately lithographic, which will increase the electrical function. The probability of occurrence of defects will also increase the burden of lithography process equipment.
  • FIG. 1 it is a schematic structural diagram of a touch screen according to an embodiment of the present disclosure.
  • the border area of the touch screen is provided with a black border 1 , and the area enclosed by the black border 1 is a visible area 2 .
  • the black border 1 is a black matrix border or a black ink border or other type of shading border.
  • the black border 1 is a closed loop structure.
  • the black border 1 may also be a non-closed structure.
  • at least one side of the touch screen is not provided with a black border 1.
  • the manufacturing method of the touch screen includes the following steps 11-15.
  • Step 11 Form a black border on the substrate.
  • Step 12 Forming a peelable adhesive layer in the visible region of the substrate on which the black frame is formed.
  • Step 13 Form a metal layer on the black border and the peelable adhesive layer.
  • Step 14 Peeling the first portion of the peelable adhesive layer and the metal layer in the visible region within the visible region.
  • Step 15 performing photolithography on the substrate on which the first portion of the peelable adhesive layer and the metal layer located in the visible region is peeled off, thereby producing a touch screen.
  • the method for manufacturing the touch screen provided by the embodiment of the present disclosure first forms a peelable adhesive layer only in the visible region of the substrate on which the black frame is formed, and then forms a metal layer on both the black frame and the peelable adhesive layer, and then peels off. a second portion of the peelable adhesive layer and the metal layer in the visible region located in the visible region and retaining the metal layer at the black border 1 (ie, a metal layer remaining in the border region), so that the touch can be made
  • the manufacturing process of the control panel is reduced from the above five mask processes to four mask processes (ie, reducing one mask process), thereby simplifying the process process, effectively improving the mask process throughput, and reducing product development and production costs.
  • the bonding between the metal layer and the peelable adhesive layer in the visible region (for example, the metal layer directly bonds with the peelable adhesive layer) is utilized.
  • the peelable adhesive layer directly removes the metal layer in the visible region, and does not need to remove the metal layer in the visible region by exposure and etching processes, thereby effectively avoiding metal residue in the visible region caused by exposure and etching processes.
  • Step 11 Form a black border on the substrate.
  • FIG. 3 is a schematic structural view of forming a black frame on a substrate according to an embodiment of the present disclosure, in which a material for forming a black frame (for example, a black matrix material) may be formed (eg, deposited) on the substrate 3. And patterning the material for forming the black border by a mask process (ie, a photomask process) to form a black border 1.
  • the black border 1 is mainly used to block the light in the frame area of the substrate 3 and the arrangement of the metal lines in the frame area. In this step 11, the area enclosed by the black border 1 is the visible area 2.
  • Step 12 Forming a peelable adhesive layer in the visible region of the substrate on which the black frame is formed.
  • FIG. 4 is a schematic structural view of forming a peelable adhesive layer in a visible region according to an embodiment of the present disclosure, forming a peelable adhesive layer 201 in the visible region 2 of the substrate 3 on which the black frame 1 is formed, and The peeling adhesive layer 201 is located outside the frame area where the black border 1 is located.
  • a peelable adhesive layer 201 is disposed throughout the viewing zone 2 such that the peelable adhesive layer 201 extends to the inner edge of the black border 1 (i.e., near the edge of the viewing zone 2).
  • the peelable adhesive layer 201 can be easily peeled off from the substrate 3.
  • the peelable adhesive layer 201 may be formed in the visible region 2 of the substrate 3 on which the black frame 1 is formed by a screen printing process, which is convenient for forming a peelable adhesive layer in the visible region 2. 201, also facilitating the formation of a uniform peelable adhesive layer 201. In other embodiments, the peelable adhesive layer 201 may also be formed in the visible region 2 by other means, and is not limited to the screen printing process.
  • the thickness of the peelable adhesive layer 201 is different from the thickness of the black bezel 1 (the thickness here refers to the dimension in the direction perpendicular to the bearing surface of the substrate 3), so as to peel off the peelable adhesive layer in the visible region 2 and The metal layer in viewport 2.
  • the thickness of the peelable adhesive layer 201 is greater than the height (ie, thickness) of the black border 1, so that the first portion of the metal layer 202 at the boundary of the visible region 2 is There is a limit between the second portion of the metal layer 202 at the boundary of the black border 1 (the boundary is close to the visible area 2) (see FIG. 5), so as to peel off the peelable adhesive layer 201 in the visible area 2 and to be located The first portion of the metal layer 202 within the viewing zone 2.
  • the thickness of the peelable adhesive layer 201 is smaller than the height of the black border 1 such that the first portion of the metal layer 202 at the boundary of the visible region 2 and the second portion of the metal layer 202 at the boundary of the black border 1
  • the portion has a limit to facilitate stripping the peelable adhesive layer 201 in the viewing zone 2 and the first portion of the metal layer 202 located in the viewing zone 2.
  • both the peelable adhesive layer 201 and the black bezel 1 are in direct contact with the substrate 3, as shown in FIG.
  • Step 13 A metal layer is formed on both the black frame and the peelable adhesive layer.
  • FIG. 5 is a schematic structural view of forming a metal layer on a black frame and a peelable adhesive layer according to an embodiment of the present disclosure, in which a metal frame or a metal sputtering process may be used in the black frame 1 and the peelable adhesive.
  • the metal layer 202 is simultaneously formed on the layer 201, that is, the metal layer 202 can be formed on the black frame 1 and the peelable adhesive layer 201 by the same process, which simplifies the manufacturing process of the touch screen.
  • the metal layer for forming the metal wiring may be made of, for example, aluminum, aluminum alloy, copper, copper alloy, molybdenum (Mo), tantalum, molybdenum-niobium alloy or the like.
  • the metal layer may be a layer structure or a multilayer structure.
  • the metal layer 202 is directly formed on the black bezel 1 and the peelable adhesive layer 201, so that the metal layer 202 is in direct contact with both the black bezel 1 and the peelable adhesive layer 201.
  • Step 14 Stripping the peelable adhesive layer in the visible area and the metal layer in the visible area.
  • FIG. 6 is a schematic structural view of a peelable adhesive layer and a metal layer in a peeling visible region according to an embodiment of the present disclosure
  • the peelable adhesive layer 201 can be easily separated from the substrate 3 , it is located in the peelable adhesive.
  • the metal layer 202 on the layer 201 is also peeled off from the substrate 3 as the peelable adhesive layer 201 is peeled off from the substrate 3, thereby obtaining a structure as shown in FIG.
  • the manufacturing method of the touch screen provided by the embodiment of the present disclosure can directly remove the metal layer in the visible region by using the strippable glue, and can effectively avoid the metal residue in the visible region caused by the exposure and etching processes.
  • the step 14 of peeling the peelable adhesive layer and the metal layer in the visible region may include: adhering an adhesive strip on the metal layer in the visible region (for example The adhesive strip is in direct contact with the metal layer) and the adhesive strip is located outside the border area where the black border is located; the adhesive strip is lifted to separate the peelable adhesive layer in the visible area from the substrate, thereby peeling off the visible area
  • the adhesive layer and the metal layer can be peeled off.
  • the manufacturing method of the touch screen removes the peelable glue in the visible area 2 by lifting the adhesive strip (not shown) having a large viscosity on the metal layer 202 in the visible area 2.
  • the layer 201 and the metal layer 202 are separated from the substrate 3, thereby peeling off the peelable adhesive layer 201 and the metal layer 202 in the visible region 2.
  • the adhesive force between the adhesive strip and the metal layer is greater than the adhesion between the peelable adhesive layer and the substrate, and the bond between the metal layer and the peelable adhesive layer The force is greater than the adhesion between the peelable adhesive layer and the substrate to ensure that the adhesive strip completely separates the peelable adhesive layer from the substrate, thereby peeling off the peelable adhesive layer and the metal layer in the visible region.
  • the adhesion between the peelable adhesive layer and the substrate is less than the adhesion between the portion of the metal layer at the black border (the second portion) and the black border to avoid the metal layer at the black border.
  • the second part falls off the black border.
  • Step 15 Perform photolithography on the substrate from which the peelable adhesive layer and the metal layer are peeled off to prepare a touch screen.
  • the subsequent photolithography process is continued to form transparent conductive bridges, transparent conductive leads, metal leads, insulating layers, electrode layers, etc., thereby producing a touch screen.
  • the peelable adhesive layer is formed in the visible region of the substrate on which the black frame is formed, and then formed on the black frame and the peelable adhesive layer.
  • the metal layer, and then peeling off the peelable adhesive layer in the visible region and the portion of the metal layer located in the visible region can reduce the manufacturing method of the touch screen from 5 mask processes to 4 mask processes (reducing a mask) Process), which simplifies the process technology, effectively increases the production capacity of the mask process, and reduces product development and production costs.
  • the manufacturing method of the touch screen includes the following steps 21 to 27.
  • Step 21 Using a first mask, a black border is formed on the substrate.
  • Step 22 forming a peelable adhesive layer in the visible region of the substrate on which the black frame is formed.
  • Step 23 Form a metal layer on the black border and the peelable adhesive layer.
  • Step 24 Peeling the first portion of the peelable adhesive layer and the metal layer in the visible region in the visible region.
  • Step 25 forming a transparent conductive material on the substrate from which the first portion of the peelable adhesive layer and the metal layer are peeled off; forming a transparent conductive material in the same photolithography process (using the second photomask in the photolithography process)
  • the substrate is etched by a transparent conductive material and etched by a metal layer to form transparent conductive bridges, transparent conductive leads, and metal leads.
  • Step 26 forming an insulating layer on the lithographic substrate by using a third photomask.
  • Step 27 forming a touch panel by forming an electrode layer in a visible region of the substrate on which the insulating layer is formed by using the fourth mask.
  • the manufacturing method of the touch screen provided by the embodiment of the present disclosure can reduce the five mask processes to four mask processes (ie, reduce one mask process), thereby simplifying the process and effectively Improve reticle process capacity and reduce product development and production costs.
  • Step 21, step 22, step 23, and step 24 may refer to steps 11-14 described above, and details are not described herein again.
  • Step 25 forming a transparent conductive material on the first portion of the substrate in the visible region in which the peelable adhesive layer and the metal layer are peeled off in the visible region; and performing the substrate on which the transparent conductive material is formed in the same photolithography process Etching of the transparent conductive material and etching of the metal layer form transparent conductive bridge dots, transparent conductive leads, and metal leads.
  • FIG. 8 is a schematic structural view of forming a transparent conductive material on a substrate according to an embodiment of the present disclosure, depositing a transparent conductive material 203, such as indium tin oxide (ITO), on the substrate 3 from which the peelable adhesive layer and the metal layer are peeled off.
  • a transparent conductive material 203 such as indium tin oxide (ITO)
  • ITO indium tin oxide
  • IZO Indium zinc oxide
  • IGZO indium gallium zinc oxide
  • a transparent conductive material 203 is deposited in the visible region 2 and on the black frame 1.
  • the first portion of the transparent conductive material 203 located in the visible region 2 is in direct contact with the substrate 3.
  • a first portion of the transparent conductive material 203 that is located within the viewing zone 2 is in direct contact with a second portion of the metal layer 202 that is located in the bezel region.
  • the first portion of the transparent conductive material 203 and the side surfaces of the second portion of the metal layer 202 that are adjacent to each other are in direct contact.
  • the thickness of the first portion of the transparent conductive material 203 located in the visible region 2 is greater than the thickness of the black border 1 to facilitate realization of the first portion of the transparent conductive material 203 and the second portion of the metal layer 202. Direct contact between the two.
  • the second portion of the transparent conductive material 203 located within the bezel region is in direct contact with the second portion of the metal layer 202 that is located in the bezel region.
  • FIG. 9 is a schematic structural view of forming a photoresist on a transparent conductive material according to an embodiment of the present disclosure
  • FIG. 10 is a schematic structural view of etching a transparent conductive material according to an embodiment of the present disclosure
  • FIG. 11 is a structure for etching a metal layer according to an embodiment of the present disclosure
  • FIG. 12 is a schematic structural view of a stripping resist according to an embodiment of the present disclosure.
  • a photoresist material ie, a photoresist material
  • a photoresist material is directly formed on the transparent conductive material 203; then, the photoresist material is exposed through a mask (ie, a photomask), and then exposed to the photoresist.
  • the photoresist material is subjected to development processing to form a photoresist 204 on the transparent conductive material 203 as shown in FIG.
  • the transparent conductive material 203 in the visible region 2 and the transparent conductive material 203 on the black frame 1 are etched to make the first portion of the transparent conductive material 203 located in the visible region 2 transparent.
  • Conductive bridge 205 and the second portion of transparent conductive material 203 on black bezel 1 form transparent conductive leads 206 (four transparent conductive leads 206 are shown in FIG. 10).
  • the photoresist 204 protects the transparent conductive material 203 in the visible region 2 covered by the photoresist 204 and the transparent conductive material 203 and the metal layer 202 on the black frame 1 covered by the photoresist 204.
  • the photoresist 204 serves as an etch mask.
  • the first portion of the transparent conductive material 203 located in the visible region 2 is etched to form a lead connection bridge 203b (two lead connection bridges 203b are shown in FIG. 10), and the lead connection bridge 203b is The second portion of the metal layer 202 that is located in the bezel region is electrically connected (eg, the sides of the two are in direct contact to achieve electrical connection therebetween).
  • metal leads 207 are shown in FIG. 11 (four metal leads 207 are shown in FIG. 11).
  • the transparent conductive bridge 205 and the transparent conductive lead 206 are used as an etch mask, or the photoresist 204 is used as an etch mask.
  • the orthographic projection of the transparent conductive leads 206 on the substrate 3 substantially coincides with the orthographic projection of the metal leads 207 on the substrate 3.
  • the etching process of the transparent conductive bridge for example, ITO Bridge
  • the metal lead Metal Trace
  • Step 26 Forming an insulating layer on the lithographic substrate after completion of step 25.
  • FIG. 13 is a schematic structural view of forming an insulating layer on a substrate according to an embodiment of the present disclosure
  • an insulating material is deposited on the basis of the structure shown in FIG. 12 to form an insulating layer 208.
  • the insulating material is an inorganic insulating material such as SiN x or SiO 2 or other inorganic insulating material; for example, the insulating material may also be an organic insulating material or a laminated structure of an organic insulating material and an inorganic insulating material.
  • the insulating layer 208 covers the transparent conductive bridge 205 and exposes the opposite side surfaces of the transparent conductive bridge 205.
  • the insulating layer 208 also exposes the side surface of the lead connection bridge 203b close to the transparent conductive bridge point 205.
  • the insulating layer 208 covers the metal leads 207 on the black bezel 1 to prevent oxidation of the metal leads 207.
  • the insulating layer 208 is filled into the spaces between adjacent metal leads 207 to avoid short circuits between adjacent metal leads 207.
  • Step 27 forming an electrode layer in the visible region of the substrate on which the insulating layer is formed, and thus, after step 21 to step 27, a touch screen is produced.
  • FIG. 14a to FIG. 14c are schematic structural views of forming an electrode layer on a substrate according to the embodiment of the present disclosure, on the basis of the structure shown in FIG. 13, in the visible area 2 of the substrate on which the insulating layer 208 is formed.
  • An electrode layer 209 is formed.
  • the electrode layer 209 includes a plurality of discrete electrode patterns 209a and a continuous electrode pattern 209b between adjacent discrete electrode patterns 209a, with adjacent discrete electrode patterns 209a passing therebetween
  • the transparent conductive bridges 205 are electrically connected, and the continuous electrode pattern 209b is insulated from the transparent conductive bridges 205 by the insulating layer 208.
  • the electrode layer 209 further includes a pattern 209c on the lead connection bridge 203b, and the pattern 209c is insulated from the continuous electrode pattern 209b.
  • the first touch electrode 001, the second touch electrode 002, and the first touch electrode 001 and the second touch electrode 002 are respectively connected by the manufacturing method provided by the embodiment of the present disclosure.
  • the first touch electrode 001 includes a transparent conductive bridge 205 and a discrete electrode pattern 209a electrically connected thereto
  • the second touch electrode 002 includes a continuous electrode pattern 209b
  • the second touch electrode 002 and the first The extending directions of the touch electrodes 001 intersect and are insulated from each other by the insulating layer 208 at the intersection.
  • the first touch electrode 001 is electrically connected to the lead 003 and the second touch electrode 002 is electrically connected to the lead 003 ′, thereby obtaining a touch screen. .
  • each lead (see 003 and 003') includes a metal lead 207 and a transparent conductive lead 206 that are stacked and in direct contact, due to the second portion of the metal layer 202 located in the bezel area.
  • the etching and etching of the second portion of the transparent conductive material 203 located in the bezel area is completed in the same photolithography process, so the orthographic projection of the metal lead 207 on the substrate 3 and the orthographic projection of the transparent conductive lead 206 on the substrate 3 Approximately coincident.
  • the discrete electrode pattern 209a of the first touch electrode 001 is electrically connected to the lead connection bridge 203b (for example, the mutually adjacent side surfaces of the two are in direct contact to achieve electrical connection therebetween, so that the first touch electrode 001 is electrically connected to the metal lead 207 through the lead connection bridge 203b. That is, the lead connection bridge 203b electrically connects the discrete electrode pattern 209a and the metal lead 207 adjacent thereto.
  • the continuous electrode pattern 209b of the second touch electrode 002 is electrically connected to the lead 003', for example, by directly contacting the side surface of the transparent conductive lead 206 and the side surface of the metal lead 207 to achieve the lead 003. 'Electrical connection.
  • the electrode layer 209 includes a plurality of first touch electrodes 001 and a plurality of second touch electrodes 002 (illustrated by taking a second touch electrode 002 in FIG. 14a as an example), each of which The first touch electrode 001 includes a plurality of discrete electrode patterns 209a and a plurality of transparent conductive bridge points 205 (illustrated by taking one transparent conductive bridge point 205 in FIGS. 14a to 14c as an example).
  • the electrode layer 209 can be fabricated by depositing a transparent conductive material and performing a photolithography process on the transparent conductive material.
  • the electrode layer 209 is made of indium tin oxide, indium zinc oxide, indium gallium zinc oxide or a similar transparent conductive material.
  • the manufacturing method includes: forming a peelable adhesive layer in a visible region of the substrate; and forming a peelable adhesive layer.
  • the fabrication method provided by the embodiments of the present disclosure may be used to fabricate an OGS touch screen.
  • the method before forming the peelable adhesive layer, the method further includes forming a black border in the frame region of the substrate.
  • the manufacturing method provided by the embodiment of the present disclosure can be used to make an On-cell touch screen (covering a surface touch screen), in which case no black border needs to be formed in the frame area of the substrate.
  • the adhesive force between the peelable adhesive layer and the substrate is smaller than the portion of the metal layer and the substrate located in the frame region. The adhesion between the two portions of the metal layer located in the bezel region during the process of peeling off the first portion of the metal layer in the visible region away from the substrate.
  • the embodiment of the present disclosure further provides a touch screen, which is produced according to the method for manufacturing the touch screen in any of the above embodiments.
  • the touch screen produced by the method for manufacturing the touch screen provided by the embodiment of the present disclosure has the advantages of stable structure and high yield.
  • the touch screen includes: a substrate 3 having a visible area 2 and a frame area outside the visible area 2; a first touch electrode 001 located in the visible area 2, comprising a plurality of discrete electrode patterns 209a and a transparent conductive bridge point 205 between adjacent discrete electrode patterns 209a and electrically connecting adjacent discrete electrode patterns 209a; a second touch electrode 002 located in the visible area 2 intersecting with the first touch electrode 001; a plurality of leads 003 located in the frame area of the substrate 3, respectively, and the first touch electrode 001 and the second touch The control electrode 002 is electrically connected.
  • each lead 003 includes a metal lead 207 and a transparent conductive lead 206 which are stacked and directly in contact with each other.
  • the touch screen further includes an insulating layer 208, and the insulating layer 208 is disposed between the first touch electrode 001 and the second touch electrode 002.
  • the first touch electrode 001 and the second touch electrode 002 are insulated.
  • the touch screen provided by the embodiment of the present disclosure is an OGS touch screen.
  • a black border is also disposed in the frame area outside the visible area 2 of the substrate 3. 1, it is located between the metal lead 207 and the substrate 3.
  • the touch screen provided by the embodiment of the present disclosure is an On-cell touch screen (covering a surface touch screen).
  • no black border is set in the border area outside the visible area 2 of the substrate 3. .
  • the embodiment of the present disclosure further provides a display device including the touch screen in any one of the above embodiments.
  • the display device is an OGS touch display device, which includes a display panel and a touch screen.
  • the display panel includes an opposite array substrate and an opposite substrate, and a sealing structure connecting the array substrate and the opposite substrate, and the opposite substrate is located. Between the array substrate and the touch screen.
  • the display device is an On-cell touch display device, which includes a display panel including an opposite array substrate and an opposite substrate, and a sealing structure connecting the array substrate and the opposite substrate, and the opposite substrate serves as a touch screen.
  • the substrate is in the middle, and the first touch electrode, the second touch electrode and the lead in the touch screen are formed on a side of the opposite substrate away from the array substrate.
  • the peelable adhesive layer is formed in the visible region of the substrate on which the black frame is formed, and then the metal layer is formed on the black frame and the peelable adhesive layer, and then the visible region is peeled off.
  • the peelable adhesive layer and the metal layer in the visible area enable the touch screen manufacturing method to be reduced from 5 mask processes to 4 mask processes (ie, reducing a mask process), thereby simplifying the process and effectively improving the process.
  • Photomask process capacity reduces product development and production costs.
  • connection bridge eg, ITO Bridge
  • metal trace Metal Trace

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Abstract

一种触控屏的制作方法、触控屏和显示装置，包括在基板(3)上形成黑边框(1)；在形成有黑边框(1)的基板(3)的可视区(2)内形成可剥离胶层(201)；在黑边框(1)和可剥离胶层(201)上形成金属层(202)；剥离可视区(2)内的可剥离胶层(201)和金属层(202)的位于可视区(2)内的第一部分；在剥离了可剥离胶层(201)和金属层(202)的第一部分的基板(3)上进行光刻，制作得到触控屏。该制作方法简化了触控屏的制作工艺。

Description

触控屏的制作方法、触控屏和显示装置
本申请要求于2017年3月2日递交的中国专利申请第201710119812.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开实施例涉及一种触控屏的制作方法、触控屏和显示装置。
背景技术
在OGS(One glass solution)触控屏的结构中，例如，在OGS触控屏的保护基板包括的衬底基板(例如玻璃基板)上直接形成有由ITO(Indium Tin Oxide)导电膜制作的触控传感器，在这种情况下，保护基板起到保护和承载触控传感器的双重作用。从技术层面来看，OGS触控屏具备以下优势：结构简单，轻、薄、透光性好；并且，由于省掉一片玻璃基板以及相应的贴合工序，利于降低生产成本、提高产品良率。
发明内容
本公开实施例提出一种触控屏的制作方法、触控屏和显示装置，本公开实施例可以简化触控屏的制程工艺。
本公开至少一个实施例提供的触控屏的制作方法，包括以下步骤：在基板上形成黑边框；在形成有黑边框的基板的可视区内形成可剥离胶层；在黑边框和可剥离胶层上形成金属层；剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分；在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏。
在本公开的一些实施例中，所述在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏包括：在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上形成透明导电材料；对形成有透明导电材料的基板进行透明导电材料的蚀刻和金属层的位于黑边框 所在区域内的第二部分的蚀刻，形成透明导电桥点、透明导电引线和金属引线。
在本公开的一些实施例中，所述透明导电材料的蚀刻和所述金属层的第二部分的蚀刻在同一次光刻工艺中进行。
在本公开的一些实施例中，所述在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏还包括：在完成所述透明导电材料的蚀刻和所述金属层的第二部分的蚀刻后的基板上形成绝缘层。
在本公开的一些实施例中，所述在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏还包括：在形成有绝缘层的基板的可视区内形成电极层，以制作得到触控屏。
在本公开的一些实施例中，所述电极层包括多个离散电极图案和位于所述离散电极图案之间的连续电极图案，相邻的离散电极图案通过所述透明导电桥点电连接。
在本公开的一些实施例中，通过所述透明导电材料的蚀刻还形成靠近所述金属引线的引线连接桥，所述引线连接桥将与所述引线连接桥相邻的离散电极图案和金属引线电连接。
在本公开的一些实施例中，所述连续电极图案与所述透明导电引线的侧表面和所述金属引线的侧表面接触。
在本公开的一些实施例中，所述透明导电引线在所述基板上的正投影与所述金属引线在所述基板上的正投影重合。
在本公开的一些实施例中，所述透明导电材料与所述金属层的第二部分直接接触。
在本公开的一些实施例中，所述在形成有黑边框的基板的可视区内形成可剥离胶层包括：采用网版印刷工艺在形成有黑边框的基板的可视区内形成可剥离胶层。
在本公开的一些实施例中，所述可剥离胶层的厚度大于黑边框的高度。
在本公开的一些实施例中，所述剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分包括：在可视区内的金属层上粘附粘贴条；揭起所述粘贴条，使可视区内的可剥离胶层与基板分离，从而剥离可视区内的可剥 离胶层和金属层。
在本公开的一些实施例中，所述粘贴条与金属层之间的粘结力大于可剥离胶层与基板之间的粘结力，所述金属层与可剥离胶层之间的粘结力大于可剥离胶层与基板之间的粘结力。
在本公开的一些实施例中，可剥离胶层与基板之间的粘结力小于金属层与黑边框之间的粘结力。
本公开的至少一个实施例提供一种触控屏的制作方法，其包括：在基板的可视区内形成可剥离胶层；在形成有可剥离胶层的基板上形成金属层，所述金属层包括位于可视区内的可剥离胶层上的第一部分以及位于基板的可视区外的边框区内的第二部分；剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分；在剥离了可视区内的可剥离胶层和金属层的第一部分的基板上形成透明导电材料，所述透明导电材料位于可视区和边框区内；以及在同一次光刻工艺中对所述透明导电材料和金属层的位于边框区内的第二部分进行图案化处理，以形成透明导电桥点、透明导电引线和金属引线。
本公开的至少一个实施例还提供一种触控屏，所述触控屏根据上述任意一个实施例中的触控屏的制作方法制作得到。
本公开的至少一个实施例还提供一种触控屏，其包括：基板，其具有可视区和位于所述可视区外的边框区；位于所述可视区内的第一触控电极，其包括多个离散电极图案和位于相邻的离散电极图案之间且电连接相邻的离散电极图案的透明导电桥点；位于所述可视区内的第二触控电极，其与所述第一触控电极相交；以及位于所述边框区内的多个引线，其分别与所述第一触控电极和所述第二触控电极电连接。在该触控屏中，每个引线都包括层叠设置且直接接触的金属引线和透明导电引线，所述金属引线在所述基板上的正投影与所述透明导电引线在所述基板上的正投影重合。
在本公开的一些实施例中，触控屏还包括绝缘层，所述绝缘层包括位于所述第一触控电极和所述第二触控电极交叉位置之间的部分以将第一触控电极和第二触控电极绝缘。
本公开的至少一个实施例还提供一种显示装置，包括上述任意一个实施例中的触控屏。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为本公开实施例的触控屏的结构示意图；
图2为本公开一个实施例的触控屏的制作方法的流程图；
图3为本公开实施例在基板上形成黑边框的结构示意图；
图4为本公开实施例在可视区内形成可剥离胶层的结构示意图；
图5为本公开实施例在黑边框和可剥离胶层上形成金属层的结构示意图；
图6为本公开实施例剥离可视区内的可剥离胶层和可视区内的金属层的结构示意图；
图7为本公开另一个实施例的触控屏的制作方法的流程图；
图8为本公开实施例在基板上形成透明导电材料的结构示意图；
图9为本公开实施例在透明导电材料上形成光阻的结构示意图；
图10为本公开实施例对透明导电材料进行蚀刻的结构示意图；
图11为本公开实施例对金属层进行蚀刻的结构示意图；
图12为本公开实施例剥离光阻的结构示意图；
图13为本公开实施例在基板上形成绝缘层的结构示意图；
图14a为本公开实施例在基板上形成电极层的结构示意图一；
图14b为本公开实施例在基板上形成电极层的结构示意图二；
图14c为本公开实施例在基板上形成电极层的结构示意图三；
图15为本公开实施例的触控屏的制作方法中剥离可视区内的可剥离胶层和可视区内的金属层的流程图；
图16为本公开再一个实施例的触控屏的制作方法的流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描 述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
以OGS触控屏中的触控传感器采用ITO桥点(ITO Bridge)连接相邻的ITO图案的结构为例，OGS触控屏的制作工艺最少需要5道光罩，分别为：制作黑矩阵(BM)的第一道光罩、制作ITO桥点(ITO Bridge)的第二道光罩、制作金属引线(Metal Trace)的第三道光罩、制作绝缘层(例如OC)的第四道光罩以及制作ITO图案(ITO Pattern)的第五道光罩。
在研究中，本申请的发明人注意到，在上述制作工艺中，由于高世代线石英光罩价格较高，造成产品开发及生产成本偏高；而且，ITO桥点制作工艺和金属引线制作工艺是触控屏制作工艺中的关键制程，也是电性功能不良的高发制程，在上述5道光罩制作工艺中ITO桥点制作工艺和金属引线制作工艺需要分开进行光刻，这会增加电性功能不良的发生几率，同时也会增加光刻工艺设备稼动负担。
如图1所示，其为本公开实施例的触控屏的结构示意图，所述触控屏的边框区设置有黑边框1，所述黑边框1围成的区域为可视区2。
例如，黑边框1为黑矩阵边框或者黑色油墨边框或者其它类型的遮光边框。例如，如图1所示，黑边框1为闭合的环形结构。在其它实施例中，黑边框1也可以为非闭合结构，例如，在无边框或窄边框触控屏中，触控屏的至少一侧未设置黑边框1。
作为本公开的一个实施例，如图2所示，所述触控屏的制作方法包括以下步骤11-15。
步骤11：在基板上形成黑边框。
步骤12：在形成有黑边框的基板的可视区内形成可剥离胶层。
步骤13：在黑边框和可剥离胶层上形成金属层。
步骤14：剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分。
步骤15：在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏。
本公开实施例提供的触控屏的制作方法通过先只在形成有黑边框的基板的可视区内形成可剥离胶层，然后在黑边框和可剥离胶层上都形成金属层，再剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分且保留金属层的位于黑边框1处的第二部分(即保留边框区内的金属层)，这样可以使触控屏的制作工艺由上述的5道光罩工艺减少至4道光罩工艺(即减少一道光罩工艺)，从而简化制程工艺，有效提升光罩制程产能，降低产品开发及生产成本。而且，在本公开实施例提供的触控屏的制作方法中，由于可视区内的金属层与可剥离胶层之间的粘结(例如金属层与可剥离胶层直接粘结)，利用可剥离胶层直接去除可视区内的金属层，无需通过曝光、刻蚀工艺去除可视区内的金属层，可以有效避免曝光、蚀刻工艺造成的可视区内的金属残留。
下面结合图3至图6对图2所述的触控屏的制作方法进行详细描述。
步骤11：在基板上形成黑边框。
例如，参考图3，其为本公开实施例在基板上形成黑边框的结构示意图，在该步骤11中，可在基板3上形成(例如沉积)用于形成黑边框的材料(例如黑矩阵材料)，并通过掩膜工艺(即光罩工艺)对用于形成黑边框的材料进行图案化处理以形成黑边框1。黑边框1主要用于遮挡基板3的边框区内的光线、以及边框区内的金属线的排布。在该步骤11中，黑边框1围成的区域为可视区2。
步骤12：在形成有黑边框的基板的可视区内形成可剥离胶层。
例如，参考图4，其为本公开实施例在可视区内形成可剥离胶层的结构示意图，在形成有黑边框1的基板3的可视区2内形成可剥离胶层201，并且可剥离胶层201位于黑边框1所在的边框区之外。
例如，整个可视区2中都设置有可剥离胶层201，从而可剥离胶层201延伸至黑边框1的内边缘(即靠近可视区2的边缘)。
例如，基板3为玻璃基板或石英基板并且可剥离胶层201与基板3直接接触，那么可剥离胶层201可以容易地与基板3剥离开来。
作为本公开的一个实施例，可以采用网版印刷工艺在形成有黑边框1的基板3的可视区2内形成可剥离胶层201，这样既便于在可视区2内形成可剥离胶层201，也有利于形成均匀一致的可剥离胶层201。在其它实施例中，也可以采用其他方式在可视区2内形成可剥离胶层201，并不限于网版印刷工艺。
例如，可剥离胶层201的厚度与黑边框1的厚度不同(这里的厚度指沿垂直于基板3的承载面方向上的尺寸)，以便于剥离可视区2内的可剥离胶层和可视区2内的金属层。
作为本公开的又一个实施例，如图4所示，可剥离胶层201的厚度大于黑边框1的高度(即，厚度)，使金属层202的位于可视区2边界处的第一部分与金属层202的位于黑边框1边界(该边界靠近可视区2)处的第二部分之间具有界限(参见图5)，以便于剥离可视区2内的可剥离胶层201和位于可视区2内的金属层202的第一部分。
作为本公开的再一个实施例，可剥离胶层201的厚度小于黑边框1的高度，使可视区2边界处的金属层202的第一部分与黑边框1边界处的金属层202的第二部分具有界限，以便于剥离可视区2内的可剥离胶层201和位于可视区2内的金属层202的第一部分。
例如，在可剥离胶层201的厚度与黑边框1的厚度不同的情况下，可剥离胶层201与黑边框1都与基板3直接接触，如图4所示。
步骤13：在黑边框和可剥离胶层上都形成金属层。
例如，参考图5，其为本公开实施例在黑边框和可剥离胶层上形成金属层的结构示意图，在该步骤中，可以采用金属沉积或者金属溅射工艺在黑边框1和可剥离胶层201上同时形成金属层202，即可以采用同一工艺在黑边框1和可剥离胶层201上形成金属层202，这样简化了触控屏的制作工艺。
在该步骤13中，用于形成金属引线的金属层可采用的材料例如为铝、铝合金、铜、铜合金、钼(Mo)、铌、钼铌合金或者类似金属。金属层可以为 一层结构或者多层结构。
例如，如图5所示，金属层202直接形成在黑边框1和可剥离胶层201上，从而金属层202与黑边框1和可剥离胶层201都直接接触。
步骤14：剥离可视区内的可剥离胶层和可视区内的金属层。
例如，参考图6，其为本公开实施例剥离可视区内的可剥离胶层和金属层的结构示意图，由于可剥离胶层201可以容易地与基板3剥离开来，所以位于可剥离胶层201上的金属层202随着可剥离胶层201与基板3剥离也从基板3上剥离下来，从而得到如图6所示的结构。可见，本公开实施例提供的触控屏的制作方法利用可剥胶直接去除可视区内的金属层，可以有效避免曝光、蚀刻工艺造成的可视区内的金属残留。
作为本公开的一个实施例，如图15所示，所述剥离可视区内的可剥离胶层和金属层的步骤14可以包括：在可视区内的金属层上粘附粘贴条(例如粘贴条与金属层直接接触)并且使粘贴条位于黑边框所在的边框区之外；揭起所述粘贴条，使可视区内的可剥离胶层与基板分离，从而剥离可视区内的可剥离胶层和金属层。
因此，本公开实施例提供的触控屏的制作方法通过揭起可视区2内的金属层202上的粘度较大的粘贴条(未示出)，将可视区2内的可剥离胶层201和金属层202与基板3分离，从而剥离可视区2内的可剥离胶层201和金属层202。
作为本公开的再一个实施例，所述粘贴条与金属层之间的粘结力大于可剥离胶层与基板之间的粘结力，所述金属层与可剥离胶层之间的粘结力大于可剥离胶层与基板之间的粘结力，以保证粘贴条完整地将可剥离胶层与基板分离，从而剥离可视区内的可剥离胶层和金属层。
例如，可剥离胶层与基板之间的粘结力小于金属层的位于黑边框处的部分(上述第二部分)与黑边框之间的粘结力，以避免位于黑边框处的金属层的第二部分从黑边框上脱落。
步骤15：在剥离了可剥离胶层和金属层的基板上进行光刻，制作得到触控屏。
例如，在如图6所示结构的基础上，继续后续的光刻工艺，以形成透明导电桥点、透明导电引线、金属引线、绝缘层、电极层等，从而制作得到触 控屏。
由此可见，在本公开实施例提供的触控屏的制作方法中，通过先在形成有黑边框的基板的可视区内形成可剥离胶层，然后在黑边框和可剥离胶层上形成金属层，再剥离可视区内的可剥离胶层和金属层的位于可视区内的部分，可以使触控屏的制作方法由5道光罩工艺减少至4道光罩工艺(减少一道光罩工艺)，从而简化制程工艺，有效提升光罩制程产能，降低产品开发及生产成本。
作为本公开实施例的另一个实施例，如图7所示，所述触控屏的制作方法包括以下步骤21至步骤27。
步骤21：利用第一光罩，在基板上形成黑边框。
步骤22：在形成有黑边框的基板的可视区内形成可剥离胶层。
步骤23：在黑边框和可剥离胶层上形成金属层。
步骤24：剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分。
步骤25：在剥离了可剥离胶层和金属层的第一部分的基板上形成透明导电材料；在同一次光刻工艺(在该光刻工艺中采用第二光罩)中对形成有透明导电材料的基板进行透明导电材料的蚀刻和金属层的蚀刻，形成透明导电桥点、透明导电引线和金属引线。
步骤26：利用第三光罩，在光刻后的基板上形成绝缘层。
步骤27：利用第四光罩，在形成有绝缘层的基板的可视区内形成电极层，制作得到触控屏。
从以上步骤21至步骤27可以看出，本公开实施例提供的触控屏的制作方法可以将5道光罩工艺减少至4道光罩工艺(即减少一道光罩工艺)，从而简化制程工艺，有效提升光罩制程产能，降低产品开发及生产成本。
下面结合图8至图14c对图7所述的触控屏的制作方法进行详细描述。
步骤21、步骤22、步骤23、步骤24可分别参考前文所述的步骤11-14，在此不再赘述。
步骤25：在剥离了可视区内的可剥离胶层和金属层的位于可视区内的第一部分基板上形成透明导电材料；在同一次光刻工艺中对形成有透明导电材料的基板进行透明导电材料的蚀刻和金属层的蚀刻，形成透明导电桥点、透 明导电引线和金属引线。
例如，参考图8，其为本公开实施例在基板上形成透明导电材料的结构示意图，在剥离了可剥离胶层和金属层的基板3上沉积透明导电材料203，例如氧化铟锡(ITO)、氧化铟锌(IZO)、氧化铟镓锌(IGZO)或类似透明导电材料，即在可视区2内和黑边框1上均沉积透明导电材料203。
例如，如图8所示，透明导电材料203的位于可视区2内的第一部分与基板3直接接触。
例如，如图8所示，透明导电材料203的位于可视区2内的第一部分与金属层202的位于边框区的第二部分直接接触。例如，透明导电材料203的第一部分和金属层202的第二部分的相互靠近的侧表面直接接触。
例如，如图8所示，透明导电材料203的位于可视区2内的第一部分的厚度大于黑边框1的厚度，以利于实现透明导电材料203的第一部分和金属层202的第二部分之间的直接接触。
例如，透明导电材料203的位于边框区内的第二部分与金属层202的位于边框区的第二部分直接接触。
图9为本公开实施例在透明导电材料上形成光阻的结构示意图，图10为本公开实施例对透明导电材料进行蚀刻的结构示意图，图11为本公开实施例对金属层进行蚀刻的结构示意图，图12为本公开实施例剥离光阻的结构示意图。下面结合图9至图12对利用同一光刻工艺(即同一光罩工艺)对透明导电材料203和金属层202进行图案化处理以形成透明导电桥点、透明导电引线和金属引线的方式进行说明。
在形成透明导电材料203之后，在透明导电材料203上直接形成光阻材料(即光刻胶材料)；然后，通过掩膜版(即光罩)对光阻材料进行曝光，之后对曝光后的光阻材料进行显影处理，以在透明导电材料203上形成光阻204，如图9所示。
然后，如图10所示，对可视区2内的透明导电材料203和黑边框1上的透明导电材料203进行蚀刻，以使透明导电材料203的位于可视区2内的第一部分形成透明导电桥点205并且使透明导电材料203的位于黑边框1上的第二部分形成透明导电引线206(图10中示出了四个透明导电引线206)。在该蚀刻过程中，光阻204对被光阻204覆盖的可视区2内的透明导电材料 203及被光阻204覆盖的黑边框1上的透明导电材料203和金属层202起保护作用。
例如，在对透明导电材料203进行蚀刻的过程中，光阻204作为蚀刻掩膜。
例如，如图10所示，透明导电材料203位于可视区2内的第一部分被蚀刻后还形成引线连接桥203b(图10中示出了两个引线连接桥203b)，引线连接桥203b与金属层202的位于边框区的第二部分电连接(例如二者的侧面直接接触以实现二者的电连接)。
随后，继续对金属层202的位于边框区的第二部分进行蚀刻，以形成金属引线207，如图11所示(图11中示出了四个金属引线207)。
例如，在对金属层202的第二部分进行蚀刻的过程中，以透明导电桥点205和透明导电引线206为蚀刻掩膜，或者以光阻204为蚀刻掩膜。在这种情况下，透明导电引线206在基板3上的正投影与金属引线207在基板3上的正投影大致重合。
最后，剥离可视区2和黑边框1所在的边框区内的光阻204，如图12所示。
在该步骤25中，在可视区内的可剥离胶层和金属层的位于可视区内的第一部分被剥离后，透明导电桥点(例如ITO Bridge)的蚀刻工艺和金属引线(Metal Trace)的蚀刻工艺在同一次光刻工艺(即同一次光罩工艺)中完成，无需将两个蚀刻工艺分别在不同的光刻工艺中进行，从而降低电性功能不良的发生几率，同时也减轻光刻工艺设备稼动负担。
步骤26：在完成步骤25中的光刻后的基板上形成绝缘层。
例如，参考图13，其为本公开实施例在基板上形成绝缘层的结构示意图，在如图12所示结构的基础上沉积绝缘材料，以形成绝缘层208。
例如，绝缘材料为无机绝缘材料，例如SiN x或者SiO 2或者其它无机绝缘材料；例如，绝缘材料也可以为有机绝缘材料，或者为有机绝缘材料与无机绝缘材料的叠层结构。
在该步骤26中，如图13所示，绝缘层208覆盖透明导电桥点205并且暴露出透明导电桥点205的相对的侧表面。
例如，如图13所示，在形成有引线连接桥203b的情况下，绝缘层208 还暴露出引线连接桥203b的靠近透明导电桥点205的侧表面。
例如，如图13所示，绝缘层208覆盖黑边框1上的金属引线207，以防止金属引线207氧化。
例如，如图13所示，绝缘层208填充到相邻的金属引线207之间的空隙中，以避免相邻的金属引线207之间发生短路。
步骤27：在形成有绝缘层的基板的可视区内形成电极层，这样，经过步骤21至步骤27后制作得到触控屏。
例如，参考图14a至图14c，其为本公开实施例在基板上形成电极层的结构示意图，在如图13所示结构的基础上，在形成有绝缘层208的基板的可视区2内形成电极层209。例如，如图14a至图14c所示，电极层209包括多个离散电极图案209a和位于相邻的离散电极图案209a之间的连续电极图案209b，相邻的离散电极图案209a通过二者之间的透明导电桥点205电连接，连续电极图案209b通过绝缘层208与透明导电桥点205绝缘。例如，电极层209还包括位于引线连接桥203b上的图案209c，并且图案209c与连续电极图案209b绝缘。
如图14a至图14c所示，通过本公开实施例提供的制作方法得到第一触控电极001、第二触控电极002、以及分别与第一触控电极001和第二触控电极002连接的引线003和003’，第一触控电极001包括透明导电桥点205和与其电连接的离散电极图案209a，第二触控电极002包括连续电极图案209b，第二触控电极002与第一触控电极001的延伸方向相交并且在交叉处通过绝缘层208彼此绝缘，第一触控电极001与引线003电连接且第二触控电极002与引线003’电连接，从而制作得到触控屏。
例如，如图14a和图14b所示，每个引线(参见003和003’)包括层叠设置且直接接触的金属引线207和透明导电引线206，由于对金属层202的位于边框区的第二部分的蚀刻和对透明导电材料203的位于边框区的第二部分的蚀刻在同一次光刻工艺中完成，因此金属引线207在基板3上的正投影与透明导电引线206在基板3上的正投影大致重合。
例如，如图14a所示，在通过透明导电材料203的蚀刻还形成靠近金属引线207的引线连接桥203b的情况下，第一触控电极001的离散电极图案209a与引线连接桥203b电连接(例如二者的相互靠近的侧表面直接接触以 实现二者之间的电连接)，从而第一触控电极001通过引线连接桥203b与金属引线207电连接。也就是说，引线连接桥203b将与其相邻的离散电极图案209a和金属引线207电连接。
例如，如图14b所示，第二触控电极002的连续电极图案209b与引线003’电连接，例如通过与透明导电引线206的侧表面和金属引线207的侧表面直接接触以实现与引线003’的电连接。
需要说明的是，图14a至图14c所示的结构仅用于示例性说明。在实际应用中，例如，电极层209包括多个第一触控电极001和多个第二触控电极002((图14a中以一个第二触控电极002为例进行说明))，每个第一触控电极001包括多个离散电极图案209a和多个透明导电桥点205(图14a至14c中以一个透明导电桥点205为例进行说明)。
例如，电极层209可以通过沉积透明导电材料、并且对该透明导电材料进行光刻工艺制作得到。
例如，电极层209采用氧化铟锡、氧化铟锌、氧化铟镓锌或类似透明导电材料制作。
本公开的至少一个实施例提供另一种触控屏的制作方法，如图16所示，该制作方法包括：在基板的可视区内形成可剥离胶层；在形成有可剥离胶层的基板上形成金属层，金属层包括位于可视区内的可剥离胶层上的第一部分以及位于基板的可视区外的边框区内的第二部分；剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分；在剥离了可视区内的可剥离胶层和金属层的第一部分的基板上形成透明导电材料，透明导电材料位于可视区和边框区内；以及在同一次光刻工艺中对透明导电材料和金属层的位于边框区内的第二部分进行图案化处理，以形成透明导电桥点、透明导电引线和金属引线。
例如，本公开实施例提供的制作方法可以用于制作OGS触控屏，在这种情况下，在形成可剥离胶层之前，该方法还包括在基板的边框区内形成黑边框。
例如，本公开实施例提供的制作方法可以用于制作On-cell触控屏(覆盖表面式触控屏)，在这种情况下，在基板的边框区内无需形成黑边框。
例如，在边框区内无黑边框且可剥离胶层和金属层都与基板直接接触的 情况下，可剥离胶层与基板之间的粘结力小于金属层与基板的位于边框区的部分之间的粘结力，以避免剥离金属层在可视区内的第一部分的过程中金属层的位于边框区内的第二部分脱离基板。
本公开实施例提供的如图16所示制作方法中的各步骤可参考图2和图7所示制作方法中的各步骤，重复之处不再赘述。
本公开实施例还提供一种触控屏，所述触控屏根据上述任意一个实施例中的触控屏的制作方法制作得到。通过本公开实施例提供的触控屏的制作方法制作得到的触控屏具有结构稳定、良品率高的优点。
本公开的至少一个实施例还提供一种触控屏，如图14a至图14c所示，该触控屏包括：基板3，其具有可视区2和位于可视区2外的边框区；位于可视区2内的第一触控电极001，其包括多个离散电极图案209a和位于相邻的离散电极图案209a之间且电连接相邻的离散电极图案209a的透明导电桥点205；位于可视区2内的第二触控电极002，其与第一触控电极001相交；位于基板3的边框区内的多个引线003，其分别与第一触控电极001和第二触控电极002电连接。在该触控屏中，每个引线003都包括层叠设置且直接接触的金属引线207和透明导电引线206，金属引线207在基板3上的正投影与透明导电引线206在基板3上的正投影重合。
在本公开的一些实施例中，如图14a至图14c所示，触控屏还包括绝缘层208，绝缘层208包括位于第一触控电极001和第二触控电极002交叉位置之间的部分以将第一触控电极001和第二触控电极002绝缘。
例如，本公开实施例提供的触控屏为OGS触控屏，在这种情况下，如图14a至图14c所示，基板3的可视区2之外的边框区中还设置有黑边框1，其位于金属引线207和基板3之间。
例如，本公开实施例提供的触控屏为On-cell触控屏(覆盖表面式触控屏)，在这种情况下，基板3的可视区2之外的边框区中未设置黑边框。
本公开以上任一实施例提供的触控屏中的各组成部分的设置方式以及制作方式可参考以上任一实施例提供的制作方法中相关描述，重复之处不再赘述。
本公开实施例还提供一种显示装置，其包括上述任意一个实施例中的触控屏。
例如，该显示装置为OGS触控显示装置，其包括显示面板和触控屏，显示面板包括相对的阵列基板和对置基板、以及连接阵列基板和对置基板的密封结构，并且对置基板位于阵列基板和触控屏之间。
例如，该显示装置为On-cell触控显示装置，其包括显示面板，显示面板包括相对的阵列基板和对置基板、以及连接阵列基板和对置基板的密封结构，对置基板作为触控屏中的基板，并且触控屏中的第一触控电极、第二触控电极和引线形成在对置基板的远离阵列基板的一侧。
由此可见，在本公开实施例中，通过先在形成有黑边框的基板的可视区内形成可剥离胶层，然后在黑边框和可剥离胶层上形成金属层，再剥离可视区内的可剥离胶层和可视区内的金属层，使得触控屏的制作方法可以由5道光罩工艺减少至4道光罩工艺(即减少一道光罩工艺)，从而简化制程工艺，有效提升光罩制程产能，降低产品开发及生产成本。
在本公开实施例提供的制作方法中，连接桥(例如ITO Bridge)蚀刻工艺和金属引线(Metal Trace)蚀刻工艺在同一次光刻工艺(即同一次光罩制程)中完成，无需将这两个蚀刻工艺分开在不同的光刻工艺中进行，从而降低电性功能不良的发生几率，同时也减轻光刻工艺设备稼动负担。而且利用可剥离胶层直接去除可视区内的金属层，可以有效避免采用曝光、蚀刻工艺造成的可视区内的金属残留。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。

Claims (20)

  1. 一种触控屏的制作方法，包括：
    在基板上形成黑边框；
    在形成有黑边框的基板的可视区内形成可剥离胶层；
    在黑边框和可剥离胶层上形成金属层；
    剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分；
    在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏。
  2. 根据权利要求1所述的触控屏的制作方法，其中，所述在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏包括：
    在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上形成透明导电材料；
    对形成有透明导电材料的基板进行透明导电材料的蚀刻和金属层的位于黑边框所在区域内的第二部分的蚀刻，形成透明导电桥点、透明导电引线和金属引线。
  3. 根据权利要求2所述的触控屏的制作方法，其中，所述透明导电材料的蚀刻和所述金属层的第二部分的蚀刻在同一次光刻工艺中进行。
  4. 根据权利要求2或3所述的触控屏的制作方法，其中，所述在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏还包括：
    在完成所述透明导电材料的蚀刻和所述金属层的第二部分的蚀刻后的基板上形成绝缘层。
  5. 根据权利要求4所述的触控屏的制作方法，其中，所述在剥离了可剥离胶层和金属层的位于可视区内的第一部分的基板上进行光刻，制作得到触控屏还包括：
    在形成有绝缘层的基板的可视区内形成电极层，以制作得到触控屏。
  6. 根据权利要求5所述的触控屏的制作方法，其中，所述电极层包括多个离散电极图案和位于所述离散电极图案之间的连续电极图案，相邻的离散 电极图案通过所述透明导电桥点电连接。
  7. 根据权利要求6所述的触控屏的制作方法，其中，通过所述透明导电材料的蚀刻还形成靠近所述金属引线的引线连接桥，所述引线连接桥将与所述引线连接桥相邻的离散电极图案和金属引线电连接。
  8. 根据权利要求6或7所述的触控屏的制作方法，其中，所述连续电极图案与所述透明导电引线的侧表面和所述金属引线的侧表面接触。
  9. 根据权利要求2-8中任一项所述的触控屏的制作方法，其中，所述透明导电引线在所述基板上的正投影与所述金属引线在所述基板上的正投影重合。
  10. 根据权利要求2-9中任一项所述的触控屏的制作方法，其中，所述透明导电材料与所述金属层的第二部分直接接触。
  11. 根据权利要求1-10中任一项所述的触控屏的制作方法，其中，所述在形成有黑边框的基板的可视区内形成可剥离胶层包括：
    采用网版印刷工艺在形成有黑边框的基板的可视区内形成可剥离胶层。
  12. 根据权利要求1-11中任一项所述的触控屏的制作方法，其中，所述可剥离胶层的厚度大于黑边框的高度。
  13. 根据权利要求1-12中任一项所述的触控屏的制作方法，其中，所述剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分包括：
    在可视区内的金属层上粘附粘贴条；以及
    揭起所述粘贴条，使可视区内的可剥离胶层与基板分离，从而剥离可视区内的可剥离胶层和可视区内的金属层。
  14. 根据权利要求13所述的触控屏的制作方法，其中，所述粘贴条与金属层之间的粘结力大于可剥离胶层与基板之间的粘结力，所述金属层与可剥离胶层之间的粘结力大于可剥离胶层与基板之间的粘结力。
  15. 根据权利要求14所述的触控屏的制作方法，其中，可剥离胶层与基板之间的粘结力小于金属层与黑边框之间的粘结力。
  16. 一种触控屏的制作方法，包括：
    在基板的可视区内形成可剥离胶层；
    在形成有可剥离胶层的基板上形成金属层，其中，所述金属层包括位于可视区内的可剥离胶层上的第一部分以及位于基板的可视区外的边框区内的 第二部分；
    剥离可视区内的可剥离胶层和金属层的位于可视区内的第一部分；
    在剥离了可视区内的可剥离胶层和金属层的第一部分的基板上形成透明导电材料，其中，所述透明导电材料位于可视区和边框区内；以及
    在同一次光刻工艺中对所述透明导电材料和金属层的位于边框区内的第二部分进行图案化处理，以形成透明导电桥点、透明导电引线和金属引线。
  17. 一种触控屏，其中，所述触控屏根据权利要求1-15中任意一项所述的触控屏的制作方法或者根据权利要求16所述的触控屏的制作方法制作得到。
  18. 一种触控屏，包括：
    基板，其具有可视区和位于所述可视区外的边框区；
    位于所述可视区内的第一触控电极，其包括多个离散电极图案和位于相邻的离散电极图案之间且电连接相邻的离散电极图案的透明导电桥点；
    位于所述可视区内的第二触控电极，其与所述第一触控电极相交；以及
    位于所述边框区内的多个引线，其分别与所述第一触控电极和所述第二触控电极电连接，
    其中，每个引线都包括层叠设置且直接接触的金属引线和透明导电引线，所述金属引线在所述基板上的正投影与所述透明导电引线在所述基板上的正投影重合。
  19. 根据权利要求18所述的触控屏，还包括绝缘层，其中，所述绝缘层包括位于所述第一触控电极和所述第二触控电极交叉位置之间的部分以将第一触控电极和第二触控电极绝缘。
  20. 一种显示装置，其包括权利要求17所述的触控屏或权利要求18或19所述的触控屏。
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