WO2018150709A1 - 基板処理装置及び振動検出方法 - Google Patents

基板処理装置及び振動検出方法 Download PDF

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Publication number
WO2018150709A1
WO2018150709A1 PCT/JP2017/045144 JP2017045144W WO2018150709A1 WO 2018150709 A1 WO2018150709 A1 WO 2018150709A1 JP 2017045144 W JP2017045144 W JP 2017045144W WO 2018150709 A1 WO2018150709 A1 WO 2018150709A1
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WIPO (PCT)
Prior art keywords
vibration
unit
substrate
processing apparatus
predetermined
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PCT/JP2017/045144
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English (en)
French (fr)
Japanese (ja)
Inventor
成規 谷澤
隆雄 松本
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2018150709A1 publication Critical patent/WO2018150709A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a substrate processing apparatus and a vibration detection method for processing a substrate.
  • the substrate processing apparatus described in Patent Document 1 includes a spin chuck.
  • the spin chuck holds the substrate.
  • the spin chuck includes four holding members.
  • the four holding members are attached to the spin base.
  • two holding members are fixed, and the other two holding members (hereinafter may be referred to as “movable holding members”) are movable.
  • the movable holding member moves to the substrate side, the four holding members come into contact with the peripheral edge of the substrate.
  • the substrate is held by the four holding members while having a substantially horizontal posture.
  • the substrate may fall off due to the rotation of the spin chuck.
  • the substrate processing apparatus detects the position of the movable holding member moved to the substrate side. Then, the substrate processing apparatus detects that the substrate is properly held or not properly held based on the position of the movable holding member.
  • the various causes are, for example, that the holding member is deteriorated or the substrate is warped.
  • the deterioration of the holding member is, for example, that the holding member is corroded by a chemical or that the holding member is worn.
  • the various causes are, for example, that the fixing member such as a bolt is loose and the spin chuck is located at a different position from the proper position.
  • the substrate processing apparatus described in Patent Document 1 detects that the substrate is properly held or not properly held based on the position of the movable holding member. Can occur.
  • the present invention has been made in view of the above problems, and a purpose of the present invention is to provide a substrate processing apparatus and vibration capable of reducing false detection when detecting that the substrate is properly held or not properly held. It is to provide a detection method.
  • the substrate processing apparatus processes a substrate.
  • the substrate processing apparatus includes a rotation unit, a drive unit, a storage unit, and a first detection unit.
  • the rotating part can hold the substrate.
  • the driving unit drives the rotating unit to rotate the rotating unit.
  • the accommodating portion accommodates the rotating portion and the driving portion.
  • a 1st detection part detects the vibration containing the vibration of the said rotation part via the said drive part.
  • the drive unit is disposed between the rotation unit and the first detection unit. The first detection unit faces the drive unit.
  • the first detection unit detects the vibration while the rotation unit is rotating and outputs a vibration signal representing the vibration.
  • the substrate processing apparatus preferably includes a determination unit and an execution unit.
  • the determination unit determines whether or not the level of the vibration signal exceeds a predetermined vibration range.
  • the execution unit executes a predetermined process according to an affirmative determination by the determination unit.
  • the predetermined process includes a process of issuing an alarm and / or a process of controlling the driving unit to stop the rotation of the rotating unit.
  • the substrate processing apparatus of the present invention preferably further includes a storage unit.
  • the storage unit preferably stores a first predetermined value indicating a value at one end of the predetermined vibration range and a second predetermined value indicating a value at the other end of the predetermined vibration range.
  • the vibration signal preferably includes a vibration component in a first direction with respect to a predetermined base level and a vibration component in a second direction opposite to the first direction with respect to the base level.
  • the first predetermined value is determined in correspondence with the vibration component in the first direction
  • the second predetermined value is determined in correspondence with the vibration component in the second direction.
  • the determination unit determines whether or not the number of times that the level of the vibration signal has determined exceeds the predetermined vibration range is a predetermined number or more within a predetermined time.
  • the predetermined number preferably indicates a plurality.
  • the execution unit preferably executes the predetermined process according to an affirmative determination by the determination unit.
  • the predetermined vibration range varies depending on the number of rotations of the rotating unit per unit time.
  • the vibration signal includes a vibration component in a first direction with respect to a predetermined base level, and a vibration component in a second direction opposite to the first direction with respect to the base level. It is preferable to contain. It is preferable that the substrate processing apparatus further includes a storage unit.
  • the storage unit preferably stores a first threshold value and a second threshold value for comparison with the level of the vibration component.
  • the second threshold value is preferably larger than the first threshold value.
  • the determination unit preferably determines whether or not an absolute value of the level of the vibration component is larger than the first threshold value, and determines whether or not the absolute value is larger than the second threshold value. When it is determined that the absolute value is greater than the first threshold value and the absolute value is determined to be equal to or less than the second threshold value, the execution unit performs the first process as the predetermined process. It is preferable to carry out.
  • the first process includes a process of stopping the rotation of the rotating unit after the process being performed on the substrate is completed.
  • the execution unit executes a second process different from the first process as the predetermined process. It is preferable to do.
  • the second process includes a process of immediately stopping the rotation of the rotating unit in response to the determination that the absolute value is larger than the second threshold.
  • the substrate processing apparatus of the present invention further includes a second detection unit.
  • the second detection unit preferably detects the vibration including the vibration of the rotating unit via the driving unit.
  • the driving unit is preferably disposed between the rotating unit and the second detecting unit.
  • the second detection unit faces the drive unit, and the detection sensitivity of the first detection unit is higher than the detection sensitivity of the second detection unit.
  • the first detection unit detects the vibration during a period in which the rotation unit is rotating, outputs a first vibration signal representing the vibration
  • the second detection unit Preferably, the vibration is detected during a period in which the rotating unit is rotating, and a second vibration signal representing the vibration is output.
  • the substrate processing apparatus preferably further includes a determination unit and an execution unit.
  • the determination unit preferably determines whether or not the level of the first vibration signal exceeds the first vibration range, and determines whether or not the level of the second vibration signal exceeds the second vibration range.
  • the execution unit preferably determines a process to be executed after the determination based on a combination of the determination result for the first vibration signal and the determination result for the second vibration signal, and executes the determined process.
  • the first vibration signal includes a vibration component in a first direction with respect to a predetermined first base level and a first component opposite to the first direction with respect to the first base level. It is preferable that a vibration component in two directions is included.
  • the second vibration signal includes a vibration component in a third direction with respect to a predetermined second base level, and a vibration component in a fourth direction opposite to the third direction with respect to the second base level. It is preferable.
  • the substrate processing apparatus further includes a storage unit.
  • the storage unit may store a third threshold value for comparison with the level of the vibration component of the first vibration signal and a fourth threshold value for comparison with the level of the vibration component of the second vibration signal. preferable.
  • the determination unit determines whether or not the absolute value of the level of the vibration component of the first vibration signal is larger than the third threshold, and the absolute value of the level of the vibration component of the second vibration signal is It is preferable to determine whether or not it is larger than the fourth threshold value.
  • the execution unit performs a third process as the process to be executed after the determination. Is preferably performed.
  • the execution unit performs the following as the processing to be executed after the determination: It is preferable to execute four processes.
  • the absolute value is determined to be equal to or less than the third threshold value and the absolute value is determined to be greater than the fourth threshold value
  • the execution unit performs a fifth process as the process to be executed after the determination. Is preferably performed.
  • each of the third process, the fourth process, and the fifth process includes a process for issuing an alarm and / or a rotation of the rotating unit by controlling the driving unit. It is preferable to include the process which stops.
  • the third process includes a process of stopping the rotation of the rotating unit after the process being performed on the substrate is completed.
  • the fourth process is responsive to determining that the absolute value is greater than the third threshold and determining that the absolute value is greater than the fourth threshold. It is preferable to include a process of immediately stopping the rotation of the rotating unit.
  • the fifth process immediately stops the rotation of the rotating unit in response to determining that the absolute value is equal to or less than the third threshold value and that the absolute value is greater than the fourth threshold value. It is preferable that the process to include is included.
  • the substrate processing apparatus of the present invention further includes a third detection unit. It is preferable that a 3rd detection part detects the vibration of the said accommodating part.
  • the housing part preferably has a base part on which the driving part is installed and a wall part.
  • the third detector is preferably attached to the wall.
  • the first detection unit detects the vibration including the vibration of the rotating unit and outputs a first vibration signal during a period in which the rotating unit is rotating.
  • the third detection unit preferably detects the vibration of the storage unit and outputs a third vibration signal during a period in which the rotation unit is rotating.
  • the substrate processing apparatus preferably further includes a determination unit and an execution unit.
  • the determination unit preferably determines whether or not the level of the first vibration signal exceeds a third vibration range, and determines whether or not the level of the third vibration signal exceeds a fourth vibration range.
  • the execution unit preferably determines a process to be executed after the determination based on a combination of the determination result for the first vibration signal and the determination result for the third vibration signal, and executes the determined process.
  • the first vibration signal includes a vibration component in a first direction with respect to a predetermined first base level and a first component opposite to the first direction with respect to the first base level. It is preferable that a vibration component in two directions is included.
  • the third vibration signal includes a vibration component in a fifth direction with respect to a predetermined third base level, and a vibration component in a sixth direction opposite to the fifth direction with respect to the third base level. It is preferable.
  • the substrate processing apparatus further includes a storage unit.
  • the storage unit may store a fifth threshold value for comparing with the level of the vibration component of the first vibration signal and a sixth threshold value for comparing with the level of the vibration component of the third vibration signal. preferable.
  • the determination unit determines whether or not the absolute value of the level of the vibration component of the first vibration signal is larger than the fifth threshold, and the absolute value of the level of the vibration component of the third vibration signal is It is preferable to determine whether or not it is larger than the sixth threshold value.
  • the execution unit performs a sixth process as the process executed after the determination. Is preferably performed.
  • the execution unit performs the following as the processing to be executed after the determination: It is preferable to execute 7 processes.
  • the absolute value is determined to be equal to or less than the fifth threshold value and the absolute value is determined to be greater than the sixth threshold value
  • the execution unit performs an eighth process as the process executed after the determination. Is preferably performed.
  • each of the sixth process, the seventh process, and the eighth process includes a process for issuing an alarm and / or a rotation of the rotating unit by controlling the driving unit. It is preferable to include the process which stops.
  • the sixth process includes a process of stopping the rotation of the rotating unit after the process being performed on the substrate is completed.
  • the seventh process is responsive to the determination that the absolute value is greater than the fifth threshold and that the absolute value is greater than the sixth threshold. It is preferable to include a process of immediately stopping the rotation of the rotating unit. In the eighth process, in response to the determination that the absolute value is equal to or less than the fifth threshold value and that the absolute value is greater than the sixth threshold value, the rotation of the rotating unit is immediately stopped. It is preferable that the process to include is included.
  • the first detection unit is attached to an outer surface of the storage unit so as to face the driving unit via the storage unit.
  • the first detection unit is attached to a portion of the driving unit exposed from the housing unit.
  • the vibration detection method detects vibration of a substrate processing apparatus for processing a substrate.
  • the vibration detection method includes a rotation step of rotating a rotation unit capable of holding the substrate, and a detection step of detecting vibration including vibration of the rotation unit via a drive unit that drives the rotation unit. Including.
  • the vibration is detected at a predetermined position during a period in which the rotating unit is rotating.
  • the rotating part and the driving part are accommodated in an accommodating part.
  • the driving unit is disposed between the rotating unit and the predetermined position.
  • the predetermined position indicates a position facing the driving unit.
  • the rotation unit is rotated in a state where the substrate is not present in the rotation unit.
  • the vibration detection method detects vibration of a substrate processing apparatus that processes a substrate.
  • the vibration detection method includes a rotation step of rotating a rotation unit capable of holding the substrate in a state where the substrate does not exist in the rotation unit, and a period during which the rotation unit is rotating. And a detecting step for detecting vibration including vibration.
  • the present invention it is possible to reduce false detection when detecting that the substrate is properly held or that the substrate is not properly held.
  • FIG. 1 is a side view showing a substrate processing system according to Embodiment 1.
  • FIG. It is side surface sectional drawing which shows the processing apparatus which concerns on Embodiment 1.
  • FIG. It is a bottom view which shows the processing apparatus which concerns on Embodiment 1.
  • FIG. (A) is a figure which shows the waveform of a vibration signal when the vibration signal from the detection part which concerns on Embodiment 1 is vibrating within the predetermined vibration range.
  • (B) is a figure which shows the waveform of a vibration signal when the vibration signal from the detection part which concerns on Embodiment 1 vibrates exceeding the predetermined vibration range.
  • FIG. 5 is a flowchart illustrating a vibration detection method executed by the substrate processing apparatus according to the first embodiment.
  • 4 is a flowchart illustrating vibration analysis processing executed by the substrate processing apparatus according to the first embodiment. It is a figure which shows the waveform of the vibration signal which the substrate processing apparatus which concerns on the 1st modification of Embodiment 1 analyzes.
  • (A) And (b) is a figure which shows the 1st predetermined vibration range and 2nd predetermined vibration range which concern on the 2nd modification of Embodiment 1.
  • 10 is a flowchart showing a vibration analysis process executed by the substrate processing apparatus according to a second modification of the first embodiment.
  • 10 is a flowchart illustrating vibration analysis processing executed by the substrate processing apparatus according to a third modification of the first embodiment.
  • 10 is a flowchart illustrating a vibration detection method executed by a substrate processing apparatus according to a fourth modification of the first embodiment.
  • A) is side surface sectional drawing which shows a part of processing apparatus which concerns on the 5th modification of Embodiment 1.
  • FIG. (B) is a bottom view which shows the processing apparatus which concerns on a 5th modification.
  • (A) is side surface sectional drawing which shows a part of processing apparatus of the substrate processing system which concerns on Embodiment 2 of this invention.
  • FIG. 10 is a flowchart illustrating vibration analysis processing executed by the substrate processing apparatus according to the second embodiment. It is side surface sectional drawing which shows the processing apparatus of the substrate processing system which concerns on Embodiment 3 of this invention.
  • A) is a figure which shows the 3rd vibration range which concerns on Embodiment 3.
  • FIG. (B) is a figure which shows the 4th vibration range which concerns on Embodiment 3.
  • FIG. 10 is a flowchart illustrating vibration analysis processing executed by the substrate processing apparatus according to the third embodiment.
  • FIG. 1 is a plan view showing the substrate processing system 100.
  • the substrate processing system 100 includes an indexer unit U1, a processing unit U2, and a computer unit U3.
  • the computer unit U3 controls the indexer unit U1 and the processing unit U2.
  • the indexer unit U1 includes a plurality of substrate containers C and an indexer robot IR.
  • the processing unit U2 includes a plurality of processing devices 1, a transport robot CR, and a delivery unit PS.
  • Each of the substrate containers C stores a plurality of substrates W stacked.
  • the substrate W has a substantially disk shape.
  • the indexer robot IR takes out one unprocessed substrate W from any one of the plurality of substrate containers C and delivers the substrate W to the delivery unit PS.
  • the delivery unit PS receives the substrate W and delivers it to the transport robot CR.
  • the transfer robot CR receives the substrate W and carries the substrate W into any one of the plurality of processing apparatuses 1.
  • the processing apparatus 1 processes the unprocessed substrate W.
  • the processing apparatus 1 employs a single wafer type that processes the substrates W one by one.
  • the processing apparatus 1 processes the substrate W using a processing liquid or a processing gas.
  • the processing apparatus 1 processes the substrate W using a contact member such as a brush and a liquid such as water.
  • the processing apparatus 1 processes the substrate W using electromagnetic waves such as ultraviolet rays.
  • the processing apparatus 1 processes the substrate W using a processing liquid.
  • the transfer robot CR takes out the processed substrate W from the processing apparatus 1 and delivers the substrate W to the delivery unit PS.
  • the delivery unit PS receives the substrate W and delivers it to the indexer robot IR.
  • the indexer robot IR receives the substrate W and stores the substrate W in any one of the plurality of substrate containers C.
  • FIG. 2 is a side view showing the substrate processing system 100.
  • the processing unit U2 includes a plurality of groups GP (four groups GP in the first embodiment).
  • Each group GP includes a predetermined number of processing devices 1 (three processing devices 1 in the first embodiment).
  • a predetermined number of processing apparatuses 1 are stacked in a straight line along the vertical direction.
  • the plurality of groups are arranged so as to face each other.
  • FIG. 3 is a side sectional view showing the processing apparatus 1.
  • the processing apparatus 1 and the computer unit U3 constitute a substrate processing apparatus SP.
  • the substrate processing apparatus SP processes the substrate W.
  • the processing apparatus 1 includes a detection unit SN (first detection unit), a chamber 3 (accommodating unit), a spin unit 5, a first nozzle 9a, a second nozzle 9b, a third nozzle 9c, and a first nozzle.
  • the second guard 13b, the third guard 13c, the first guard driving unit 15a, the second guard driving unit 15b, the third guard driving unit 15c, and a plurality of bolts 23 are included.
  • the chamber 3 is substantially box-shaped, and includes a spin unit 5, first nozzle 9a to third nozzle 9c, first nozzle arm 10a to third nozzle arm 10c, first nozzle arm driving unit 11a to third nozzle arm driving unit. 11c, the first guard 13a to the third guard 13c, and the first guard driver 15a to the third guard driver 15c.
  • the chamber 3 accommodates the elements 5, 9a to 9c, 10a to 10c, 11a to 11c, 13a to 13c, and 15a to 15c, so that the processing apparatus 1 can be easily stacked as shown in FIG. The replacement and repair for each processing apparatus 1 can be facilitated.
  • the chamber 3 includes a base portion 3a, a side wall portion 3b (wall portion), and a top wall portion 3c (wall portion).
  • the base portion 3a has a substantially plate shape and is substantially parallel to the horizontal direction.
  • the side wall portion 3b has a substantially rectangular tube shape and is substantially parallel to the vertical direction.
  • the top wall 3c is substantially plate-shaped and is substantially parallel to the horizontal direction.
  • the spin unit 5 holds the substrate W and rotates the substrate W.
  • the spin unit 5 includes a first drive unit 5a (drive unit), a shaft 5b, a spin chuck 5c (rotation unit), a second drive unit 5d, and a cover member 5e.
  • the first drive unit 5a includes a motor body 17a and a case 17b that houses the motor body 17a. Accordingly, the first drive unit 5a is a motor.
  • the spin chuck 5 c includes a substantially disc-shaped spin base 19 and a plurality of holding members 21.
  • the first drive unit 5a is disposed between the spin chuck 5c and the detection unit SN. And the 1st drive part 5a is installed in the base part 3a. Specifically, the first drive unit 5 a is attached to the base unit 3 a by a plurality of bolts 23. Moreover, since the 1st drive part 5a is supported by the base part 3a, the installation state of the 1st drive part 5a is stable. Therefore, the spin chuck 5c can be stably rotated.
  • the first drive unit 5a drives the spin chuck 5c to rotate the spin chuck 5c around the rotation axis AX of the first drive unit 5a. Specifically, the motor main body 17a rotates the shaft 5b to rotate the spin base 19 connected to the shaft 5b.
  • the spin chuck 5c can hold the substrate W.
  • a plurality of holding members 21 (at least three holding members 21) are disposed on the upper surface of the spin base 19 so as to surround the rotation axis AX.
  • the plurality of holding members 21 hold the substrate W. Since the spin base 19 is substantially parallel to the horizontal direction, the substrate W is held while having a substantially horizontal posture.
  • the second drive unit 5d includes a drive source such as a motor or an air cylinder, and a motion conversion mechanism. Then, the second drive unit 5 d drives the motion conversion mechanism by the drive source, and converts the up-and-down motion into the rotational motion of the holding member 21.
  • the spin chuck 5c is driven by the first drive unit 5a and rotates around the rotation axis AX while holding the substrate W. As a result, the substrate W rotates together with the spin chuck 5c. On the other hand, the spin chuck 5c can be driven by the first drive unit 5a to rotate around the rotation axis AX in a state where the substrate W is not present in the spin chuck 5c.
  • the cover member 5e has a substantially cylindrical shape and surrounds the first drive unit 5a.
  • the cover member 5e suppresses that a process liquid adheres to the 1st drive part 5a.
  • the cover member 5e is indicated by a two-dot chain line for simplification of the drawing.
  • the detection unit SN detects the vibration vb via the first drive unit 5a. Specifically, the detection unit SN detects the vibration vb while the spin chuck 5c is rotating, and outputs a vibration signal Sv representing the vibration vb.
  • the vibration vb includes a vibration sv of the spin chuck 5c and a vibration dv caused directly by the rotation operation of the first drive unit 5a itself.
  • the vibration vb is detected as acceleration. Therefore, the vibration signal Sv is an acceleration signal representing the vibration vb.
  • the acceleration signal is represented by, for example, a unit “Gee (G)” based on standard gravity, or a voltage value “volt (V)” proportional to the acceleration.
  • the detection unit SN includes an acceleration sensor.
  • the acceleration sensor is, for example, a capacitance type contact type acceleration sensor or a piezoresistive type contact type acceleration sensor.
  • the acceleration sensor is, for example, a non-contact acceleration sensor that employs an optical method.
  • the acceleration sensor can employ, for example, a mechanical displacement measuring method, a method using vibration, or a semiconductor method.
  • the detection unit SN is disposed outside the chamber 3 and faces the first drive unit 5a.
  • the outside of the chamber 3 indicates that it is not inside the chamber 3, and includes, for example, the outer surface of the chamber 3.
  • the detection unit SN is attached to the outer surface of the chamber 3 (specifically, the base unit 3a) so as to face the first driving unit 5a via the chamber 3.
  • the detection unit SN is preferably opposed to the first drive unit 5a on the rotation axis AX. Note that a part of the detection unit SN may face the first drive unit 5a.
  • the detection unit SN detects the vibration vb including the vibration sv of the spin chuck 5 c during the period in which the spin chuck 5 c is rotating. Then, the vibration sv of the spin chuck 5c changes depending on the holding state of the substrate W by the spin chuck 5c. Therefore, the holding state of the substrate W by the spin chuck 5c can be detected by analyzing the vibration vb (specifically, the vibration signal Sv) including the vibration sv. In this specification, the detection of the holding state of the substrate W indicates that the substrate W is properly held by the spin chuck 5c or that the substrate W is not properly held by the spin chuck 5c.
  • the reason why the holding state of the substrate W can be detected by analyzing the vibration vb is as follows.
  • the holding member 21 if the holding member 21 is deteriorated or the substrate W is warped, the holding member 21 cannot properly hold the substrate W, and the center of gravity of the substrate W may be eccentric with respect to the rotation axis AX. .
  • the vibration sv of the rotating spin chuck 5c becomes larger than when there is no eccentricity.
  • the vibration vb increases. That is, abnormal vibration occurs. Therefore, by analyzing the vibration vb, it can be detected that the center of gravity of the substrate W is eccentric.
  • the center of gravity of the substrate W is eccentric, there is a high possibility that the substrate W is not properly held. Therefore, the fact that the eccentricity of the center of gravity of the substrate W has been detected is not properly held by the spin chuck 5c. It shows that.
  • the spin chuck 5c may be located at a position different from the spin chuck specified position.
  • the spin chuck specified position indicates a specific position when the spin chuck 5c is installed on the base portion 3a and is determined with respect to the chamber 3. If the spin chuck 5c is positioned at a position different from the spin chuck specified position, the holding member 21 may not hold the substrate W properly even when the substrate W is placed on the spin chuck 5c at the substrate specified position. obtain.
  • the substrate defining position indicates a specific position when the substrate W is placed on the spin chuck 5 c and is determined with respect to the chamber 3.
  • the vibration sv of the rotating spin chuck 5c becomes larger than when the installation state is good. As the vibration sv increases, the vibration vb increases. That is, abnormal vibration occurs. Therefore, by analyzing the vibration vb, it is possible to detect that the installation state of the spin chuck 5c is not good. If the installation state of the spin chuck 5c is not good, there is a high possibility that the substrate W is not properly held. Therefore, detecting that the installation state of the spin chuck 5c is not good means that the substrate W is appropriate for the spin chuck 5c. Is not held.
  • the holding state of the substrate W can be detected by analyzing the vibration vb including the vibration sv of the spin chuck 5c, the holding state of the substrate W is detected based on the position of the holding member 21. In comparison with this, it is possible to reduce false detection when detecting that the substrate W is properly held or not properly held.
  • the first drive unit 5a is disposed between the spin chuck 5c and the detection unit SN, and the detection unit SN faces the first drive unit 5a. Therefore, the detection unit SN faces the drive units other than the first drive unit 5a (the first nozzle arm drive unit 11a to the third nozzle arm drive unit 11c and the first guard drive unit 15a to the third guard drive unit 15c). Not. As a result, it is possible to suppress the vibrations of the drive units 11a to 11c and 15a to 15c other than the first drive unit 5a from being superimposed as noise on the vibration signal Sv representing the vibration vb. If the superposition of noise can be suppressed, the analysis accuracy of the vibration signal Sv is improved. Therefore, when detecting the holding state of the substrate W, the detection reliability can be improved.
  • the spin chuck 5c before rotating the spin chuck in the state where the substrate W exists, the spin chuck 5c is rotated in the state where the substrate W does not exist in the spin chuck 5c, and the vibration vb is analyzed. it can. As a result, the cause of the abnormal vibration vb can be narrowed down from a plurality of causes.
  • the cause of the abnormal vibration vb is either that the spin chuck 5c is not properly installed or that the substrate W is eccentric. Therefore, when the spin chuck 5c is rotated in the absence of the substrate W, the cause of the abnormal vibration of the vibration vb is highly likely that the spin chuck 5c is not properly installed. Therefore, by rotating the spin chuck 5c in the state where the substrate W is not present and detecting the installation state of the spin chuck 5c, the spin chuck 5c can be favorably installed in advance.
  • the cause of the abnormal vibration of the vibration vb is likely to be the eccentricity of the substrate W. .
  • the eccentricity of the substrate W is highly likely due to the deterioration of the holding member 21 or the warpage of the substrate W, the cause of the abnormal vibration vb is narrowed down to the deterioration of the holding member 21 or the warpage of the substrate W. Can do. Therefore, for example, the holding member 21 can be maintained, repaired, or replaced, or the substrate W can be replaced.
  • the cause of the vibration vb becoming abnormal vibration can be narrowed down from among a plurality of causes. Therefore, in the processing device 1, maintenance, repair, Alternatively, the exchange can be performed quickly.
  • the first nozzle 9a discharges a first processing liquid (for example, sulfuric acid-containing liquid) toward the rotating substrate W.
  • a first processing liquid for example, sulfuric acid-containing liquid
  • the first nozzle arm driving unit 11a drives the first nozzle arm 10a to rotate the first nozzle arm 10a around an axis extending along a substantially vertical direction.
  • the first nozzle arm drive unit 11a has a drive source such as a motor and a rotation mechanism, and the rotation mechanism is driven by the drive source to rotate the first nozzle arm 10a.
  • the 1st nozzle arm drive part 11a is attached to the base part 3a.
  • the second nozzle 9b discharges a second processing liquid (for example, a rinsing liquid) toward the rotating substrate W.
  • the third nozzle 9c discharges a third processing liquid (for example, an organic solvent) toward the rotating substrate W.
  • the second nozzle arm 10b and the third nozzle arm 10c have the same configuration and function as the first nozzle arm 10a.
  • the 2nd nozzle arm drive part 11b and the 3rd nozzle arm drive part 11c have the structure and function similar to the 1st nozzle arm drive part 11a, and are attached to the base part 3a.
  • the first guard 13a receives the first processing liquid scattered from the substrate W.
  • the first guard 13a is substantially cylindrical and surrounds the spin chuck 5c around the rotation axis AX.
  • the first guard 13a is located at the standby position.
  • the standby position indicates the position of the first guard 13a when the upper end of the first guard 13a is positioned below the holding member 21.
  • the first guard 13a is connected to the first guard driving unit 15a.
  • the 1st guard drive part 15a is attached to the base part 3a.
  • the 1st guard drive part 15a drives the 1st guard 13a, and raises or descends the 1st guard 13a along the raising / lowering direction UD.
  • the ascending / descending direction UD is substantially parallel to the vertical direction.
  • the first guard driving unit 15a raises the first guard 13a from the standby position to the guard position.
  • the guard position indicates the position of the first guard 13 a when the upper end of the first guard 13 a is positioned above the holding member 21. Then, after all the processing of the substrate W is completed, the first guard driving unit 15a lowers the first guard 13a from the guard position to the standby position.
  • the 1st guard drive part 15a has drive sources, such as a motor, and a raising / lowering mechanism, drives a raising / lowering mechanism with a drive source, and raises or descends the 1st guard 13a.
  • drive sources such as a motor
  • a raising / lowering mechanism drives a raising / lowering mechanism with a drive source, and raises or descends the 1st guard 13a.
  • the second guard 13b receives the second processing liquid scattered from the substrate W.
  • the third guard 13 c receives the third processing liquid scattered from the substrate W.
  • the second guard 13b and the third guard 13c have the same configuration and function as the first guard 13a.
  • the 2nd guard drive part 15b and the 3rd guard drive part 15c have the structure and function similar to the 1st guard drive part 15a, and are attached to the base part 3a.
  • FIG. 4 is a bottom view showing the processing apparatus 1.
  • the bottom surface 3A of the base portion 3a has a first region 3aa and a second region 3ab.
  • the bottom surface 3A is an outer surface of the inner surface and the outer surface of the base portion 3a.
  • region 3aa shows the area
  • the second region 3ab indicates a region of the bottom surface 3A excluding the first region 3aa.
  • the second region 3ab faces the first nozzle arm driving unit 11a to the third nozzle arm driving unit 11c and the first guard driving unit 15a to the third guard driving unit 15c.
  • the detection unit SN is attached to the first region 3aa of the base unit 3a.
  • the plurality of bolts 23 surround the detection unit SN on the first region 3aa.
  • predetermined position SP1 the position where the detection unit SN is arranged may be referred to as “predetermined position SP1”.
  • the first driving unit 5a is disposed between the spin chuck 5c and the predetermined position SP1.
  • the predetermined position SP ⁇ b> 1 indicates a position facing the first drive unit 5 a outside the chamber 3.
  • the predetermined position SP1 indicates a position on the first area 3aa.
  • the first region 3aa to which the detection unit SN is attached is opposed to the drive units 11a to 11c and 15a to 15c other than the first drive unit 5a. Different from the second region 3ab. Therefore, the vibrations of the drive units 11a to 11c and 15a to 15c other than the first drive unit 5a may be attenuated before reaching the first region 3aa. As a result, the detection unit SN can be prevented from detecting vibrations of the drive units 11a to 11c and 15a to 15c other than the first drive unit 5a as noise.
  • the detection unit SN is attached to the outer surface of the chamber 3 (specifically, the first region 3aa). Accordingly, it is possible to prevent the processing liquids (first processing liquid to third processing liquid) discharged inside the chamber 3 from splashing the detection unit SN. As a result, the deterioration of the detection unit SN can be suppressed, and the reliability of the detection unit SN can be maintained.
  • the computer unit U3 includes a control unit 51, a storage unit 53, and an output unit 55.
  • the control unit 51 executes the computer program stored in the storage unit 53, and performs the spin unit 5, the first nozzle arm driving unit 11a to the third nozzle arm driving unit 11c, and the first guard driving unit 15a to the third guard.
  • the drive unit 15c is controlled.
  • the control unit 51 includes a processor such as a CPU (Central Processing Unit), for example.
  • the storage unit 53 includes a storage device and stores data and computer programs.
  • the storage unit 53 includes, for example, a memory such as a semiconductor memory, and may include a hard disk drive.
  • the storage unit 53 may include a removable medium.
  • the output unit 55 displays an image based on the image data generated by the control unit 51 and / or outputs a sound based on the audio data generated by the control unit 51.
  • the output unit 55 includes a display and / or a speaker.
  • the control unit 51 includes a determination unit 51a and an execution unit 51b. Specifically, the processor of the control unit 51 executes the computer program stored in the storage device of the storage unit 53, and functions as the determination unit 51a and the execution unit 51b.
  • the determination unit 51a receives the vibration signal Sv representing the vibration vb from the detection unit SN and analyzes the vibration signal Sv during the rotation period of the spin chuck 5c. Specifically, the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds a predetermined vibration range RG, and detects the holding state of the substrate W.
  • the analysis of the vibration signal Sv will be described with a specific example.
  • FIG. 5A shows the waveform of the vibration signal Sv when the vibration signal Sv vibrates within the predetermined vibration range RG.
  • FIG. 5B shows the waveform of the vibration signal Sv when the vibration signal Sv vibrates beyond the predetermined vibration range RG.
  • the horizontal axis indicates time
  • the vertical axis indicates the level (G or V) of the vibration signal Sv.
  • the spin chuck 5c is stopped in the period T1.
  • the spin chuck 5c is accelerated.
  • the spin chuck 5c is rotating at a constant rotational speed.
  • the rotation speed of the spin chuck 5c is represented by the number of rotations of the spin chuck 5c per unit time.
  • the spin chuck 5c is decelerated.
  • the spin chuck 5c is stopped.
  • the periods T1 to T5 are similarly defined in the present specification.
  • the determination unit 51a analyzes the vibration signal Sv received in the period T3.
  • the vibration signal Sv includes a vibration component in a first direction D1 (eg, plus direction) with respect to a predetermined base level BL (eg, zero level) and a second direction opposite to the first direction D1 with respect to the base level BL. D2 (for example, minus direction) vibration component.
  • the base level BL may be an allowable vibration level before the spin chuck 5c rotates.
  • the vibration component in the first direction D1 and the vibration component in the second direction may be collectively referred to as “vibration component Sc”.
  • the storage unit 53 stores a first predetermined value A1 indicating a value at one end of the predetermined vibration range RG and a second predetermined value A2 indicating a value at the other end of the predetermined vibration range RG.
  • the first predetermined value A1 is determined corresponding to the vibration component in the first direction D1.
  • the second predetermined value A2 is determined corresponding to the vibration component in the second direction D2.
  • the absolute value of the first predetermined value A1 and the absolute value of the second predetermined value A2 are the same.
  • the first predetermined value A1 indicates the first threshold value TH1 for comparison with the level of the vibration component Sc
  • the storage unit 53 stores the first threshold value TH1.
  • the predetermined vibration range RG is determined experimentally and / or empirically in consideration of the installation environment of the processing apparatus 1.
  • the predetermined vibration range RG is constant without depending on the rotation speed of the spin chuck 5c.
  • the predetermined vibration range RG may be different according to the rotation speed of the spin chuck 5c. That is, the first predetermined value A1, the second predetermined value A2, and the first threshold value TH1 may be different according to the rotation speed of the spin chuck 5c.
  • the larger the rotational speed of the spin chuck 5c the larger the predetermined vibration range RG (for example, the first threshold value TH1) is set. Since the magnitude of the vibration vb varies depending on the rotation speed of the spin chuck 5c, the detection accuracy of the holding state of the substrate W can be improved by setting the predetermined vibration range RG for each rotation speed of the spin chuck 5c.
  • the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds a predetermined vibration range RG. For the vibration signal Sv shown in FIG. 5A, the determination unit 51a determines that the level of the vibration signal Sv is within the predetermined vibration range RG. The determination that the level of the vibration signal Sv is within the predetermined vibration range RG corresponds to the detection that the substrate W is properly held on the spin chuck 5c.
  • the determination unit 51a determines that the level of the vibration signal Sv exceeds the predetermined vibration range RG.
  • the determination that the level of the vibration signal Sv exceeds the predetermined vibration range RG corresponds to the detection that the substrate W is not properly held on the spin chuck 5c.
  • the level of the vibration signal Sv exceeds the predetermined vibration range RG there is a high possibility that the substrate W is not properly held because the substrate W is eccentric or the installation state of the spin chuck 5c is not good. Because.
  • the execution unit 51b executes a predetermined process in accordance with an affirmative determination by the determination unit 51a.
  • the affirmative determination indicates that the level of the vibration signal Sv exceeds the predetermined vibration range RG.
  • the predetermined process includes a process for controlling the output unit 55 to issue an alarm and / or a process for controlling the first drive unit 5a to stop the rotation of the spin chuck 5c.
  • the output unit 55 issues an alarm using an image or sound.
  • the alarm includes, for example, a notification that the substrate W is not properly held by the spin chuck 5c.
  • the alarm includes, for example, a notification that the rotation of the spin chuck 5c is stopped.
  • the user can recognize by an alarm that the substrate W is not properly held, and can take an appropriate measure for the processing apparatus 1. Further, by stopping the rotation of the spin chuck 5c, it is possible to suppress the substrate W from dropping from the spin chuck 5c because the substrate W is not properly held.
  • the determination unit 51 a determines whether or not the level of the vibration signal Sv exceeds the predetermined vibration range RG, and the substrate W Detecting the holding state of Accordingly, it is possible to reduce erroneous detection of the holding state of the substrate W compared to the case where the holding state of the substrate W is detected based on the position of the holding member 21. As a result, it is possible to suppress the execution unit 51b from erroneously executing a predetermined process (for example, alarm or rotation stop), so that a series of steps for processing the substrate W can be smoothly executed.
  • a predetermined process for example, alarm or rotation stop
  • the predetermined vibration range RG is a range from the first predetermined value A1 corresponding to the first direction D1 to the second predetermined value corresponding to the second direction D2. Therefore, when any one of the vibration component in the first direction D1 and the vibration component in the second direction D2 exceeds the predetermined vibration range RG, it is detected that the substrate W is not properly held. As a result, the detection omission that the substrate W is not properly held can be reduced.
  • FIG. 6 (a), 6 (c), and 6 (e) are plan views showing the spin chuck 5c.
  • the plurality of holding members 21 (four holding members 21 in the first embodiment) are arranged on the predetermined circumference of the upper surface of the spin base 19 at regular intervals.
  • the predetermined circumference corresponds to the periphery of the substrate W.
  • Each of the holding members 21 includes a substantially cylindrical contact portion P, for example.
  • the holding member FC is fixed to the spin base 19 and cannot be rotated.
  • the holding member MC is rotatably supported by the spin base 19.
  • the holding member MC is driven by the second drive unit 5d (FIG. 3) and rotates around an axis substantially parallel to the rotation axis AX.
  • the holding member MC is located at the closed position.
  • the closed position indicates the position of the holding member MC when the contact portion P is closest to the rotation axis AX.
  • the holding member MC is located in the open position.
  • the open position indicates the position of the holding member MC when the contact portion P is farthest from the rotation axis AX, and is a standby position of the holding member MC.
  • the holding member MC is located at the holding position.
  • the holding position indicates the position of the holding member MC when the contact portion P comes into contact with the peripheral edge portion of the substrate W located at the substrate specified position.
  • the contact portion P of the holding member MC and the contact portion P of the holding member FC that are located at the holding position come into contact with the peripheral edge portion of the substrate W, and the substrate W is held.
  • the spin chuck 5c includes a plurality of position detection units PSN corresponding to the plurality of holding members MC, respectively.
  • the position detection unit PSN detects the position of the holding member MC.
  • the position detection unit PSN includes a resin arm 31, a metal detected member 33, a first magnetic sensor 35, a second magnetic sensor 37, and a third magnetic sensor. 39.
  • the arm 31 rotates together with the holding member MC.
  • the arm 31 is located below the upper surface of the spin base 19.
  • the detected member 33 is attached to the tip of the arm 31.
  • the first magnetic sensor 35, the second magnetic sensor 37, and the third magnetic sensor 39 are positioned below the arm 31 and the detected member 33 with a space from the arm 31 and the detected member 33.
  • the first magnetic sensor 35 detects the detected member 33 and outputs a detection signal.
  • the third magnetic sensor 39 detects the detected member 33 and outputs a detection signal.
  • the second magnetic sensor 37 detects the detected member 33 and outputs a detection signal.
  • each of the second magnetic sensors 37 detects the detected member 33 indicates that the substrate W is properly held.
  • the fact that the at least one first magnetic sensor 35 detects the detected member 33 indicates that the substrate W is not properly held. This is because if the substrate W is eccentric without properly holding the substrate W, the holding member MC is positioned at the closed position, and the first magnetic sensor 35 detects the detected member 33.
  • the holding state of the substrate W is determined based on the position of the holding member MC. Detected. Accordingly, it is possible to further reduce false detection when detecting that the substrate W is properly held or not properly held.
  • FIG. 7 is a flowchart illustrating the vibration detection method according to the first embodiment.
  • the vibration detection method includes steps S1 to S15, and detects the vibration of the substrate processing apparatus SP. Steps S1 to S15 constitute a main routine.
  • step S1 the control unit 51 controls the transport robot CR so that the substrate W is placed on the spin chuck 5c.
  • step S3 the control unit 51 controls the second drive unit 5d so that the holding member MC rotates from the open position to the holding position.
  • step S5 the control unit 51 detects the holding state of the substrate W based on the position of the holding member MC detected by the position detection unit PSN (FIG. 6).
  • step S5 when the control unit 51 receives a detection signal indicating that the detected member 33 has been detected from at least one first magnetic sensor 35 (No in step S5), the substrate W is appropriately held. Therefore, the process proceeds to step S7.
  • step S5 when the control unit 51 receives a detection signal indicating that the detection target member 33 has been detected from each of all the second magnetic sensors 37 (Yes in step S5), the substrate W is appropriately held. Is tentatively indicated, the process proceeds to step S9.
  • step S7 the control unit 51 executes the specific process and ends the process.
  • the specific process is a warning. Therefore, the control unit 51 controls the output unit 55 so as to issue an alarm.
  • step S9 rotation step
  • the control unit 51 controls the first drive unit 5a so that the spin chuck 5c starts to rotate. That is, the spin chuck 5c is rotated.
  • step S11 the control unit 51 executes a vibration analysis process. Specifically, the control unit 51 analyzes the vibration signal Sv, detects the holding state of the substrate W, and executes a predetermined process based on the detection result.
  • step S13 the control unit 51 determines whether or not all the processing steps are completed.
  • all the processing steps include a first processing step, a second processing step, a third processing step, and a fourth processing step.
  • the rotating substrate W is processed by discharging the first processing liquid from the first nozzle 9a.
  • the rotating substrate W is processed by discharging the second processing liquid from the second nozzle 9b.
  • the rotating substrate W is processed by discharging the third processing liquid from the third nozzle 9c.
  • the rotation speed of the spin chuck in the first processing step to the third processing step is the same.
  • the rotation speed of the spin chuck 5c is set higher than the rotation speed of the spin chuck 5c in the third processing step, and the substrate W is dried.
  • the control unit 51 executes the vibration analysis process (process S11) in parallel with the execution of the first process process to the fourth process process.
  • step S13 the process proceeds to step S11.
  • the vibration analysis process step S11 is repeated until the control unit 51 makes a positive determination (Yes in step S13).
  • step S13 the process proceeds to step S15.
  • step S15 the control unit 51 controls the first drive unit 5a so that the spin chuck 5c stops rotating. As a result, the spin chuck 5c stops. Then, the process ends.
  • FIG. 8 is a flowchart showing the vibration analysis process executed in step S11 of FIG.
  • the first threshold value TH1 is used to determine whether or not the level of the vibration signal Sv exceeds the predetermined vibration range RG.
  • the vibration analysis process includes steps S20 to S27.
  • step S20 detection step
  • the detection unit SN detects the vibration vb including the vibration sv of the spin chuck 5c via the first drive unit 5a.
  • step S20 the detection unit SN detects vibration at the predetermined position SP1 during the period in which the spin chuck 5c is rotating.
  • step S21 the determination unit 51a receives the vibration signal Sv including the vibration component Sc from the detection unit SN.
  • step S23 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is larger than the first threshold value TH1, and detects the holding state of the substrate W.
  • a negative determination indicates that the level of the vibration signal Sv is within the predetermined vibration range RG, and corresponds to detecting that the substrate W is appropriately held.
  • step S23 the process proceeds to step S25.
  • the affirmative determination indicates that the level of the vibration signal Sv exceeds the predetermined vibration range RG, and corresponds to detecting that the substrate W is not properly held.
  • step S25 the execution unit 51b controls the output unit 55 so as to issue an alarm.
  • step S27 the execution unit 51b controls the first drive unit 5a so as to stop the rotation of the spin chuck 5c. Then, the process ends.
  • the holding state of the substrate W is detected before the spin chuck 5c is rotated (step S5). Therefore, it can be detected at an early stage of a series of processes for processing the substrate W that the substrate W is not properly held (No in step S5). As a result, it is possible to reduce processing waste.
  • the holding state of the substrate W can be easily detected by using the first threshold value TH1 (step S23).
  • the first threshold value TH1 (predetermined vibration range RG) in the vibration analysis process executed in parallel with the fourth process step is the vibration analysis process executed in parallel with the first process step to the third process step.
  • the first threshold TH1 (predetermined vibration range RG) is preferably set. This is because the rotation speed of the spin chuck 5c in the fourth processing step is larger than the rotation speed of the spin chuck 5c in the first processing step to the third processing step, and normal vibration increases in the fourth processing step.
  • FIG. 3 is referred to when describing the control unit 51, the determination unit 51a, the execution unit 51b, the storage unit 53, and the output unit 55.
  • FIG. 9 shows the waveform of the vibration signal Sv output from the detection unit SN.
  • the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the vibration signal Sv.
  • the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds a predetermined vibration range RG.
  • a timer is started. Then, the timer starts measuring the predetermined time Tc.
  • the predetermined time Tc indicates the time from time t0 to time t1.
  • the determination unit 51a determines whether or not the number Na of times that the level of the vibration signal Sv has exceeded the predetermined vibration range RG is equal to or greater than the predetermined number Nb within the predetermined time Tc starting from the start of the timer. To do.
  • the number Na indicates the number of times that abnormal vibration is detected.
  • the predetermined number Nb indicates a plurality (for example, an integer of 2 or more). The determination that the number of times Na is equal to or greater than the predetermined number Nb within the predetermined time Tc indicates that abnormal vibration continues to occur.
  • the predetermined time Tc and the predetermined number Nb are determined experimentally and / or empirically in consideration of the installation environment of the processing apparatus 1.
  • the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds a predetermined vibration range RG every time the vibration signal Sv is received at a constant interval. Alternatively, for example, the determination unit 51a determines whether or not the extreme value EV of the vibration signal Sv exceeds a predetermined vibration range RG. The number of times Na indicates the number of times that the extreme value EV has been determined to exceed the predetermined vibration range RG. The extreme value EV is a local maximum value or minimum value of the vibration signal Sv.
  • the execution unit 51b executes a predetermined process (for example, alarm generation or rotation stop).
  • a positive determination indicates that the number of times Na is equal to or greater than the predetermined number Nb within the predetermined time Tc, and corresponds to detecting that the substrate W is not properly held.
  • the determination unit 51a determines that the number of times Na is less than the predetermined number Nb within the predetermined time Tc as a negative determination
  • the determination unit 51a resets the timer. A negative determination corresponds to detecting that the substrate W is appropriately held.
  • the first modification it is determined whether or not the number Na of abnormal vibrations detected is equal to or greater than the predetermined number Nb within the predetermined time Tc. Detecting the holding state of Accordingly, erroneous detection based on sudden abnormal vibration or noise can be reduced, and the detection reliability can be further improved when detecting the holding state of the substrate W.
  • the holding state of the substrate W can be easily detected using the first threshold value TH1.
  • the determination unit 51a determines whether or not the absolute value of the level of the vibration component Sc is larger than the first threshold value TH1. Then, the determination unit 51a determines whether or not the number Na of times that the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1 is equal to or greater than the predetermined number Nb within the predetermined time Tc. The holding state of W is detected.
  • a substrate processing apparatus SP according to a second modification of the first embodiment will be described with reference to FIGS. 3, 7, 10, and 11.
  • the embodiment described with reference to FIGS. 1 to 8 is that the first predetermined vibration range RG1 and the second predetermined vibration range RG2 are determined in order to detect the holding state of the substrate W. Different from 1.
  • the configuration of the substrate processing apparatus SP according to the second modification is the same as the configuration of the substrate processing apparatus SP according to the first embodiment.
  • the point in which the 2nd modification differs from Embodiment 1 is mainly explained.
  • 10 (a) and 10 (b) show a first predetermined vibration range RG1 and a second predetermined vibration range RG2 according to the second modification.
  • the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the vibration signal Sv.
  • the storage unit 53 includes a first predetermined value A1 indicating a value at one end of the first predetermined vibration range RG1, a second predetermined value A2 indicating a value at the other end of the first predetermined vibration range RG1, and a second predetermined vibration range.
  • a third predetermined value A3 indicating the value at one end of RG2 and a fourth predetermined value A4 indicating the value at the other end of the second predetermined vibration range RG2 are stored.
  • the first predetermined value A1 and the third predetermined value A3 are determined corresponding to the vibration component in the first direction D1.
  • the second predetermined value A2 and the fourth predetermined value A4 are determined corresponding to the vibration component in the second direction D2.
  • the absolute value of the first predetermined value A1 and the absolute value of the second predetermined value A2 are the same, and the absolute value of the third predetermined value A3 and the absolute value of the fourth predetermined value A4 are the same. is there.
  • the absolute value of the third predetermined value A3 is larger than the absolute value of the first predetermined value A1. Accordingly, the second predetermined vibration range RG2 is larger than the first predetermined vibration range RG1.
  • the first predetermined value A1 indicates a first threshold value TH1 for comparison with the level of the vibration component Sc
  • the third predetermined value A3 is a second threshold value for comparison with the level of the vibration component Sc.
  • the threshold value TH2 is shown.
  • the storage unit 53 stores a first threshold value TH1 and a second threshold value TH2.
  • the second threshold value TH2 is larger than the first threshold value TH1.
  • the first predetermined vibration range RG1 and the second predetermined vibration range RG2 are determined experimentally and / or empirically while considering the installation environment of the processing apparatus 1.
  • the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds the first predetermined vibration range RG1, and determines whether or not the level of the vibration signal Sv exceeds the second predetermined vibration range RG2.
  • the determination unit 51a determining that the level of the vibration signal Sv is within the first predetermined vibration range RG1 corresponds to detecting that the substrate W is properly held on the spin chuck 5c.
  • the determination unit 51a has the level of the vibration signal Sv exceeding the first predetermined vibration range RG1, and the level of the vibration signal Sv is the second predetermined vibration. It determines with it being in the range RG2. Such a determination is referred to as a “first determination”.
  • the determination unit 51a making the first determination corresponds to detecting that the substrate W is not properly held on the spin chuck 5c.
  • the degree of inappropriate holding state of the substrate W is relatively small, and the degree of urgency is also relatively low. This is because the level of the vibration signal Sv is within the second predetermined vibration range RG2, and the abnormal vibration is relatively small.
  • the execution unit 51b executes the first process as a predetermined process according to the first determination.
  • the first process includes, for example, a process for issuing a first alarm.
  • the first alarm includes, for example, notification of contents corresponding to a relatively low degree of urgency.
  • the first process includes, for example, a process of stopping the rotation of the spin chuck 5c after the process being executed on the substrate W is completed. This is because the degree of inappropriate holding of the substrate W is relatively small, so that the processing being executed can be completed. Moreover, it is for suppressing the extension of the processing time by re-execution of the process in execution.
  • the process being executed is, for example, any one of the first to fourth process steps.
  • the first process includes, for example, a process of controlling the transport robot CR so that a new substrate W is not carried into the processing apparatus 1. This is because the carrying-in work is prohibited, and a working time for maintenance, repair, or replacement of the part that caused the improper holding of the substrate W is secured.
  • the determination unit 51a determines that the level of the vibration signal Sv exceeds the second predetermined vibration range RG2. Such a determination is referred to as a “second determination”.
  • the determination unit 51a making the second determination corresponds to detecting that the substrate W is not properly held on the spin chuck 5c.
  • the second determination is made, the degree of improper holding state of the substrate W is relatively large and the degree of urgency is also relatively high. This is because the level of the vibration signal Sv exceeds the second predetermined vibration range RG2, and abnormal vibration is relatively large.
  • the execution unit 51b executes a second process different from the first process as a predetermined process according to the second determination.
  • the second process includes, for example, a process for issuing a second alarm.
  • the second alarm includes, for example, notification of contents corresponding to a relatively high degree of urgency.
  • the second process includes, for example, a process of immediately stopping the rotation of the spin chuck 5c in response to the second determination. This is because the degree of inappropriate holding of the substrate W is relatively large and the degree of urgency is high.
  • At least one of the first guard driving unit 15a to the third guard driving unit 15c is set so that at least one of the first guard 13a to the third guard 13c does not descend from the guard position.
  • the first predetermined vibration range RG1 and the second predetermined vibration range RG2 are provided in order to detect the holding state of the substrate W. Therefore, an appropriate measure (first process or second process) can be taken in accordance with the degree of the improper holding state of the substrate W.
  • the vibration detection method according to the second modification includes steps S1 to S15.
  • the substrate processing apparatus SP according to the second modification executes the vibration analysis process shown in FIG. 11 in the vibration analysis process of step S11.
  • the first threshold value TH1 and the second threshold value are used to determine whether or not the level of the vibration signal Sv exceeds the first predetermined vibration range RG1 or the second predetermined vibration range RG2.
  • the threshold value TH2 is used.
  • FIG. 11 is a flowchart showing a vibration analysis process according to the second modification. As shown in FIG. 11, the vibration analysis process includes steps S40 to S53. Step S40 and step S41 are the same as step S20 and step S21 shown in FIG. 8, respectively.
  • step S43 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is larger than the first threshold value TH1, and detects the holding state of the substrate W.
  • step S43 If the determination is negative (No in step S43), the process returns to the main routine.
  • a negative determination indicates that the level of the vibration signal Sv is within the first predetermined vibration range RG1, and corresponds to detecting that the substrate W is appropriately held.
  • step S43 the process proceeds to step S45.
  • the affirmative determination indicates that the level of the vibration signal Sv exceeds the first predetermined vibration range RG1, and corresponds to detecting that the substrate W is not properly held.
  • step S45 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is larger than the second threshold value TH2, and detects the holding state of the substrate W.
  • step S45 the process proceeds to step S47.
  • a negative determination indicates that the level of the vibration signal Sv is within the second predetermined vibration range RG2, and corresponds to detecting that the degree of inappropriate holding state of the substrate W is relatively small.
  • step S47 the execution unit 51b controls the output unit 55 so as to issue the first alarm.
  • step S49 the execution unit 51b controls the first drive unit 5a so as to stop the rotation of the spin chuck 5c after completion of the processing being performed on the substrate W. Then, the process ends.
  • step S45 the process proceeds to step S51.
  • the affirmative determination indicates that the level of the vibration signal Sv exceeds the second predetermined vibration range RG2, and corresponds to detecting that the degree of inappropriate holding state of the substrate W is relatively large.
  • step S51 the execution unit 51b controls the output unit 55 so as to issue the second alarm.
  • step S53 the execution unit 51b controls the first drive unit 5a to immediately stop the rotation of the spin chuck 5c in response to an affirmative determination (Yes in step S45).
  • the determination unit 51a determines that the absolute value of the level of the vibration component Sc is greater than the first threshold value TH1, and the absolute value. Is determined to be equal to or less than the second threshold value TH2, the execution unit 51b executes the first process as a predetermined process (step S47, step S49). Accordingly, when the degree of the improper holding state of the substrate W is relatively small, it is possible to take appropriate measures according to the degree.
  • the execution unit 51b executes the second process as a predetermined process. (Step S51, Step S53). Accordingly, when the degree of improper holding state of the substrate W is relatively large, it is possible to take appropriate measures according to the degree.
  • a substrate processing apparatus SP according to a third modification of the first embodiment will be described with reference to FIGS. 3, 7, 10, and 12.
  • the third modification is different from the first embodiment described with reference to FIGS. 1 to 8 in that the first modification and the second modification are combined.
  • the configuration of the substrate processing apparatus SP according to the third modification is the same as the configuration of the substrate processing apparatus SP according to the first embodiment.
  • the difference between the third modification example, the first modification example, and the second modification example will be mainly described.
  • the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds the first predetermined vibration range RG1, and whether or not the level of the vibration signal Sv exceeds the second predetermined vibration range RG2. Determine whether.
  • the predetermined number Nb indicates a plurality (for example, an integer of 2 or more).
  • the determination unit 51a uses the first threshold value TH1 and the second threshold value TH2 to determine the level of the vibration signal Sv. It is determined whether or not the first predetermined vibration range RG1 or the second predetermined vibration range RG2 is exceeded.
  • the vibration detection method according to the third modification includes steps S1 to S15.
  • the substrate processing apparatus SP according to the third modification executes the vibration analysis process shown in FIG. 12 in the vibration analysis process of step S11.
  • FIG. 12 is a flowchart showing a vibration analysis process according to the third modification.
  • the vibration analysis process includes steps S60 to S75.
  • Step S60 and step S61 are the same as step S20 and step S21 shown in FIG. 8, respectively.
  • Step S69 to step S75 are the same as step S47 to step S53 shown in FIG. 11, respectively.
  • step S63 the determination unit 51a determines whether or not the absolute value of the level of the vibration component Sc is larger than the first threshold value TH1, and detects the holding state of the substrate W.
  • a negative determination indicates that the level of the vibration signal Sv is within the first predetermined vibration range RG1, and corresponds to detecting that the substrate W is appropriately held.
  • step S63 the process proceeds to step S65.
  • a positive determination indicates that the level of the vibration signal Sv exceeds the first predetermined vibration range RG1.
  • step S65 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc is larger than the second threshold value TH2, and detects the holding state of the substrate W.
  • step S65 Following negative determination (No in step S65), the process proceeds to step S67.
  • a negative determination indicates that the level of the vibration signal Sv is within the second predetermined vibration range RG2.
  • step S67 the determination unit 51a determines whether or not an affirmative determination of a predetermined number Nb or more is made within the predetermined time Tc (Yes in step S63).
  • step S67 If the determination is negative (No in step S67), the process returns to the main routine.
  • a negative determination corresponds to detecting that the substrate W is appropriately held.
  • step S67 the process proceeds to step S69.
  • the affirmative determination indicates that the level of the vibration signal Sv is within the second predetermined vibration range RG2, and the number of times Na is a predetermined number Nb or more within the predetermined time Tc, and a relatively small abnormal vibration exceeding the first predetermined vibration range RG1. This is equivalent to detecting that this has occurred continuously. That is, a positive determination corresponds to detecting that the substrate W is not properly held. The degree of inappropriate holding state of the substrate W is relatively small.
  • step S67 on the condition that relatively small abnormal vibration continues (Yes in step S67), it is detected that the substrate W is not properly held. Therefore, erroneous detection of the holding state of the substrate W can be suppressed when a relatively small abnormal vibration occurs in a single shot.
  • a process progresses to process S73.
  • the positive determination indicates that the level of the vibration signal Sv exceeds the second predetermined vibration range RG2, and corresponds to detecting that the substrate W is not properly held.
  • the degree of inappropriate holding state of the substrate W is relatively large.
  • the process proceeds to steps S73 and S75, and the second process similar to the second modification is performed. The Therefore, the second process can be performed quickly when the inappropriate holding state of the substrate W is relatively large.
  • a substrate processing apparatus SP according to a fourth modification of the first embodiment will be described with reference to FIGS. 3, 8, and 13.
  • the fourth modification is different from the first embodiment described with reference to FIGS. 1 to 8 in that the spin chuck 5c is rotated in a state where the substrate W is not present on the spin chuck 5c.
  • the configuration of the substrate processing apparatus SP according to the fourth modification is the same as the configuration of the substrate processing apparatus SP according to the first embodiment.
  • the difference between the fourth modification and the first embodiment will be mainly described.
  • the detection unit SN detects the vibration vb including the vibration sv of the spin chuck 5c during the period in which the spin chuck 5c is rotating. On the other hand, when the spin chuck 5c is rotated in the absence of the substrate W, the cause of the abnormal vibration of the vibration vb is highly likely that the spin chuck 5c is not properly installed.
  • the installation state of the spin chuck 5c can be detected by rotating the spin chuck 5c with the substrate W not present on the spin chuck 5c and analyzing the vibration vb.
  • the detection of the installation state of the spin chuck 5c indicates that the spin chuck 5c is properly installed or that the spin chuck 5c is not properly installed.
  • the fourth modification is effective for the inspection of the substrate processing system 100, the substrate processing apparatus SP, or the processing apparatus 1 before shipment.
  • the spin chuck 5 c is rotated in a state where the substrate W is not present, and the installation state of the spin chuck 5 c is detected.
  • the processing apparatus 1 can be shipped after the spin chuck 5c is properly installed.
  • the bolt 23 is tightened to improve the installation of the first drive unit 5a connected to the spin chuck 5c.
  • a connecting portion between the spin base 19 and the shaft 5b is provided.
  • FIG. 13 is a flowchart showing a vibration detection method according to the fourth modification. As shown in FIG. 13, the vibration detection method includes steps S141 to S147, and detects the vibration of the substrate processing apparatus SP.
  • step S141 rotation step
  • the control unit 51 controls the first driving unit 5a so that the spin chuck 5c starts rotating in a state where the substrate W is not present in the spin chuck 5c. To do.
  • step S143 the control unit 51 executes vibration analysis processing as preprocessing. Specifically, the determination unit 51a determines whether or not the level of the vibration signal Sv exceeds a predetermined vibration range RG (FIG. 5A), detects the installation state of the spin chuck 5c, and determines the detection result. Based on this, a predetermined process is executed.
  • a predetermined vibration range RG FIG. 5A
  • step S23 the determination unit 51a determines whether or not the absolute value of the level of the vibration component Sc is larger than the first threshold value TH1, and the spin chuck 5c. Detects the installation status of.
  • a negative determination indicates that the level of the vibration signal Sv is within the predetermined vibration range RG, and corresponds to detecting that the spin chuck 5c is well installed.
  • an affirmative determination indicates that the level of the vibration signal Sv exceeds the predetermined vibration range RG, and corresponds to detecting that the spin chuck 5c is not properly installed.
  • step S145 the control unit 51 determines whether or not the vibration analysis processing as the preprocessing is completed.
  • step S145 the control unit 51 advances the process to step S143.
  • step S145 the control unit 51 advances the process to step S147.
  • step S147 the control unit 51 controls the first drive unit 5a so that the spin chuck 5c stops rotating. As a result, the spin chuck 5c stops. Then, the process ends.
  • the spin chuck 5 c is rotated without the substrate W (step S ⁇ b> 141). As a result, the installation state of the spin chuck 5c can be detected.
  • the position of the detection unit SN is not particularly limited as long as the detection unit SN can detect the vibration sv of the spin chuck 5c or the vibration including the vibration sv.
  • the detection unit SN may not be located at the predetermined position SP1.
  • the fifth modification is different from the first embodiment described with reference to FIGS. 1 to 8 in that the detection unit SN is attached to the first drive unit 5a.
  • the configuration of the substrate processing apparatus SP according to the fifth modification is the same as the configuration of the substrate processing apparatus SP according to the first embodiment.
  • the difference between the fifth modification and the first embodiment will be mainly described.
  • FIG. 14A is a side sectional view showing a part of the processing apparatus 1 according to the fifth modification.
  • FIG. 14B is a bottom view showing the processing apparatus 1 according to the fifth modification.
  • the detection unit SN is arranged outside the chamber 3 and faces the first drive unit 5a.
  • the first drive unit 5a is disposed between the spin chuck 5c and the detection unit SN.
  • the detection unit SN is attached to a portion 41 (hereinafter referred to as “exposed portion 41”) exposed from the chamber 3 in the first drive unit 5a. More specifically, the detection unit SN is attached to the bottom surface 41 a of the exposed portion 41. Moreover, as shown to Fig.14 (a) and FIG.14 (b), the exposed part 41 protrudes from 1st area
  • the detection part SN is preferably attached to the exposed part 41 on the rotation axis AX.
  • the position where the detection unit SN is arranged may be described as “predetermined position SP2”.
  • the predetermined position SP2 is the same as the predetermined position SP1 described with reference to FIG. However, the predetermined position SP2 indicates a position on the exposed portion 41 (specifically, a position on the bottom surface 41a).
  • the detection unit SN faces the first drive unit 5 a, and thus the embodiment described with reference to FIGS. 3 and 4. 1, it is possible to suppress the vibration of the drive unit other than the first drive unit 5a from being superimposed as noise on the vibration signal Sv representing the vibration vb.
  • the detection unit SN is attached to the exposed portion 41 of the first drive unit 5a. Therefore, the detection unit SN can directly detect the vibration vb. As a result, since the detection accuracy of the vibration vb can be improved, the detection reliability can be further improved when detecting the holding state of the substrate W. Furthermore, the exposed part 41 protrudes from the base part 3a. Therefore, it can suppress that the vibration of drive parts other than the 1st drive part 5a is transmitted to detection part SN via the base part 3a. As a result, the detection unit SN can be further suppressed from detecting vibrations of drive units other than the first drive unit 5a as noise.
  • the detection unit SN is attached to the exposed unit 41. Accordingly, it is possible to prevent the processing liquids (first processing liquid to third processing liquid) discharged inside the chamber 3 from splashing the detection unit SN. As a result, the deterioration of the detection unit SN can be suppressed, and the reliability of the detection unit SN can be maintained.
  • FIG. 1 A substrate processing system 100 according to a second embodiment of the present invention will be described with reference to FIG. 1, FIG. 2, FIG. 7, and FIGS.
  • the substrate processing system 100 according to the second embodiment is different from the substrate processing system 100 according to the first embodiment in that the first processing unit SN1 with high sensitivity and the second detection unit SN2 with low sensitivity are included.
  • the configuration of the substrate processing system 100 according to the second embodiment is the same as the configuration of the substrate processing system 100 according to the first embodiment.
  • the processing apparatus 1 which concerns on Embodiment 2 is described as "processing apparatus 1A.” Therefore, the substrate processing system 100 according to the second embodiment includes the processing apparatus 1A instead of the processing apparatus 1 according to the first embodiment.
  • the difference between the second embodiment and the first embodiment will be mainly described.
  • FIG. 15A is a side sectional view showing a part of the processing apparatus 1A of the substrate processing system 100 according to the second embodiment.
  • the processing device 1A includes a first detection unit SN1 and a second detection unit SN2 instead of the detection unit SN of the processing device 1 illustrated in FIG.
  • the other configuration of the processing apparatus 1A is the same as the configuration of the processing apparatus 1 shown in FIG.
  • the processing apparatus 1A and the computer unit U3 constitute a substrate processing apparatus SP.
  • the detection sensitivity of the first detection unit SN1 is higher than the detection sensitivity of the second detection unit SN2.
  • the detection sensitivity of the first detection unit SN1 is represented by the resolution of the first detection unit SN1 (hereinafter referred to as “first resolution”).
  • the detection sensitivity of the second detection unit SN2 is represented by the resolution of the second detection unit SN2 (hereinafter referred to as “second resolution”). Since the detection sensitivity of the first detection unit SN1 is higher than the detection sensitivity of the second detection unit SN2, the first resolution is higher than the second resolution.
  • Each of the first detection unit SN1 and the second detection unit SN2 detects the vibration vb including the vibration sv of the spin chuck 5c via the first driving unit 5a. Specifically, the first detection unit SN1 detects the vibration vb during the period when the spin chuck 5c is rotating, and outputs a first vibration signal Sv1 representing the vibration vb. The second detection unit SN2 detects the vibration vb while the spin chuck 5c is rotating, and outputs a second vibration signal Sv2 representing the vibration vb.
  • each of the first vibration signal Sv1 and the second vibration signal Sv2 is an acceleration signal representing the vibration vb.
  • each of the first detection unit SN1 and the second detection unit SN2 includes an acceleration sensor.
  • the first vibration signal Sv1 has a vibration component in the first direction D1 (for example, plus direction) with respect to a predetermined first base level BL1 (for example, zero level), and a first value with respect to the first base level BL1. And a vibration component in a second direction D2 (for example, a negative direction) opposite to the direction D1.
  • the vibration component in the first direction D1 and the vibration component in the second direction D2 may be collectively referred to as “vibration component Sc1” in some cases.
  • the second vibration signal Sv2 includes a vibration component in a third direction D3 (for example, plus direction) with respect to a predetermined second base level BL2 (for example, zero level) and a third component with respect to the second base level BL2. And a vibration component in a fourth direction D4 (for example, a negative direction) opposite to the direction D3.
  • a vibration component in the third direction D3 and the vibration component in the fourth direction D4 may be collectively referred to as “vibration component Sc2”.
  • first base level BL1 and the second base level BL2 are not limited to the zero level, and may be vibration levels that are allowable before the spin chuck 5c rotates.
  • Each of the first detection unit SN1 and the second detection unit SN2 is disposed outside the chamber 3 and faces the first drive unit 5a.
  • the first drive unit 5a is disposed between the spin chuck 5c and the first detection unit SN1, and is disposed between the spin chuck 5c and the second detection unit SN2.
  • the first detection unit SN1 and the second detection unit SN2 are attached to the outer surface of the chamber 3 (specifically, the base unit 3a) so as to face the first driving unit 5a via the chamber 3. It is preferable that the first detection unit SN1 and the second detection unit SN2 are arranged symmetrically with respect to the rotation axis AX while facing the first drive unit 5a. The first detection unit SN1 and the second detection unit SN2 are close to each other. In addition, a part of 1st detection part SN1 and / or a part of 2nd detection part SN2 may oppose the 1st drive part 5a.
  • FIG. 15B is a bottom view showing the processing apparatus 1A. As shown in FIG. 15B, the first detection unit SN1 and the second detection unit SN2 are attached to the first region 3aa of the base unit 3a. The plurality of bolts 23 surround the first detection unit SN1 and the second detection unit SN2 on the first region 3aa.
  • first predetermined position FPS the position where the first detection unit SN1 is arranged
  • second predetermined position SPS the position where the second detection unit SN2 is arranged
  • the first drive unit 5a is disposed between the spin chuck 5c and the first predetermined position FPS, and is disposed between the spin chuck 5c and the second predetermined position SPS.
  • each of the first predetermined position FPS and the second predetermined position SPS indicates a position facing the first driving unit 5 a outside the chamber 3.
  • each of the first predetermined position FPS and the second predetermined position SPS indicates a position on the first region 3aa.
  • each of the first detection unit SN1 and the second detection unit SN2 detects the vibration vb including the vibration sv of the spin chuck 5c.
  • the vibration sv of the spin chuck 5c changes depending on the holding state of the substrate W. Therefore, by analyzing the first vibration signal Sv1 and the second vibration signal Sv2, the holding state of the substrate W can be detected as in the first embodiment. Further, in the second embodiment, compared to the case where the holding state of the substrate W is detected based on the position of the holding member 21, the detection error is detected when the holding state of the substrate W is detected as in the first embodiment. Can be reduced.
  • Embodiment 2 since 1st detection part SN1 and 2nd detection part SN2 are arrange
  • a relatively small abnormal vibration included in the vibration vb is detected by the first detection unit SN1 having a high detection sensitivity, and included in the vibration vb by the second detection unit SN2 having a low detection sensitivity.
  • a relatively large abnormal vibration can be detected. That is, the characteristics of the first detection unit SN1 and the second detection unit SN2 can be effectively utilized.
  • the cost of the processing apparatus 1A can be reduced as compared with the case where two first detection units SN1 with high detection sensitivity are provided. . This is because the second detection unit SN2 having a low detection sensitivity is often cheaper than the first detection unit SN1 having a high detection sensitivity.
  • the second embodiment when any one of the first detection unit SN1 and the second detection unit SN2 does not function normally, vibration from the detection unit functioning normally.
  • the holding state of the substrate W can be detected by analyzing the signal. Therefore, it is possible to avoid a situation where the holding state of the substrate W cannot be detected at all.
  • the determination unit 51a determines whether or not the level of the first vibration signal Sv1 exceeds the first vibration range R1, and detects the holding state of the substrate W. Further, the determination unit 51a determines whether or not the level of the second vibration signal Sv2 exceeds the second vibration range R2, and detects the holding state of the substrate W.
  • the execution part 51b determines the process performed after determination based on the combination of the determination result with respect to 1st vibration signal Sv1, and the determination result with respect to 2nd vibration signal Sv2, and performs the determined process.
  • any of the third process, the fourth process, and the fifth process is determined as a process to be executed after the determination by the determination unit 51a.
  • Each of the third process, the fourth process, and the fifth process controls the output unit 55 to issue an alarm and / or controls the first drive unit 5a to stop the rotation of the spin chuck 5c. Processing to include.
  • all processes may be different, some processes may be different, or all processes may be the same.
  • the third process is the same as the first process according to the second modification of the first embodiment, and each of the fourth process and the fifth process is the same as the second process according to the second modification of the first embodiment. It is the same.
  • the second embodiment after the determination based on the combination of the determination result for the first vibration signal Sv1 and the determination result for the second vibration signal Sv2. Processing to be executed is determined. Accordingly, an accurate measure (the normal / abnormal) reflecting the detection result of the holding state of the substrate W based on the two detection units (the first detection unit SN1 and the second detection unit SN2) and the state (normal / abnormal) of the two detection units. (3rd process, 4th process, or 5th process) can be taken.
  • the first vibration range R1 and the second vibration range R2 will be described in relation to the resolution of the first detection unit SN1 and the second detection unit SN2.
  • the first resolution is “m (G or V)”
  • the second resolution is “2 m (G or V)”
  • FIG. 16 (a) shows the first vibration range R1.
  • the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the first vibration signal Sv1.
  • the first vibration signal Sv1 is omitted, and the vibration vb to be detected by the first detection unit SN1 is described.
  • the vertical axis is marked with a scale corresponding to the first resolution.
  • FIG. 16B shows the second vibration range R2.
  • the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the second vibration signal Sv2.
  • the second vibration signal Sv2 is omitted, and the vibration vb to be detected by the second detection unit SN2 is described.
  • the vertical axis is marked with a scale corresponding to the second resolution.
  • the waveform of the vibration vb input to the first detection unit SN1 is the same as the waveform of the vibration vb input to the second detection unit SN2. This is because both the first detection unit SN1 and the second detection unit SN2 are attached to the first region 3aa (FIG. 15B).
  • the first resolution range R1 and the second vibration range R2 are determined in consideration of the first resolution and the second resolution, so that the high-resolution first detection unit SN1 and the low-resolution second detection unit SN2 are effective. Can be used effectively.
  • a first vibration range R1 is defined for the first vibration signal Sv1.
  • the storage unit 53 stores a first specific value B1 indicating a value at one end of the first vibration range R1 and a second specific value B2 indicating a value at the other end of the first vibration range R1.
  • the first specific value B1 is determined corresponding to the vibration component in the first direction D1 of the first vibration signal Sv1.
  • the second specific value B2 is determined corresponding to the vibration component in the second direction D2 of the first vibration signal Sv1.
  • the absolute value of the first specific value B1 and the absolute value of the second specific value B2 are the same.
  • the first specific value B1 indicates a third threshold value TH3 for comparison with the level of the vibration component Sc1 of the first vibration signal Sv1, and the storage unit 53 stores the third threshold value TH3. .
  • the third threshold value TH3 is set to a value equal to or higher than the first resolution “m (G)”. This is because the first resolution is the lowest signal level that can be output by the first detector SN1.
  • a second vibration range R2 is defined for the second vibration signal Sv2.
  • the storage unit 53 stores a third specific value B3 indicating a value at one end of the second vibration range R2 and a fourth specific value B4 indicating a value at the other end of the second vibration range R2.
  • the third specific value B3 is determined corresponding to the vibration component in the third direction D3 of the second vibration signal Sv2.
  • the fourth specific value B4 is determined corresponding to the vibration component in the fourth direction D4 of the second vibration signal Sv2.
  • the absolute value of the third specific value B3 and the absolute value of the fourth specific value B4 are the same.
  • the third specific value B3 indicates a fourth threshold value TH4 for comparison with the level of the vibration component Sc2 of the second vibration signal Sv2, and the storage unit 53 stores the fourth threshold value TH4. .
  • the fourth threshold value TH4 is set to a value equal to or higher than the second resolution “2m (G)”. This is because the second resolution is the lowest value of the signal level that can be output by the second detector SN2.
  • the first vibration range R1 and the second vibration range R2 are determined experimentally and / or empirically in consideration of the installation environment of the processing apparatus 1A.
  • the third threshold value TH3 for the first detection unit SN1 is smaller than the fourth threshold value TH4 for the second detection unit SN2. Since the first resolution of the first detection unit SN1 is higher than the second resolution of the second detection unit SN2, the first detection unit SN1 having a high resolution is configured by making the third threshold value TH3 smaller than the fourth threshold value TH4. This is to make effective use.
  • the third threshold TH3 for the first detection unit SN1 is preferably smaller than the second resolution “2m (G)” of the second detection unit SN2.
  • the third threshold value TH3 so as to correspond to the level of the vibration vb that cannot be detected by the low-resolution second detection unit SN2 and that can be detected by the high-resolution first detection unit SN1, the high-resolution first detection unit SN2 This is for more effectively utilizing the one detection unit SN1.
  • the fourth threshold value TH4 for the second detection unit SN2 is preferably set to the same value as the second resolution “2m (G)” of the second detection unit SN2. This is to effectively utilize the low-resolution second detection unit SN2 by setting the fourth threshold value TH4 to the lowest value “2m (G)” that can be output by the second detection unit SN2.
  • the vibration detection method according to the second embodiment includes steps S1 to S15 as shown in FIG.
  • the substrate processing apparatus SP according to the second embodiment executes the vibration analysis process shown in FIG. 17 in the vibration analysis process of step S11.
  • the third threshold value TH3 is used to determine whether or not the level of the first vibration signal Sv1 exceeds the first vibration range R1.
  • the fourth threshold TH4 is used to determine whether or not the level of the second vibration signal Sv2 exceeds the second vibration range R2.
  • FIG. 17 is a flowchart showing a vibration analysis process according to the second embodiment. As shown in FIG. 17, the vibration analysis process includes steps S80 to S101.
  • step S80 the first detection unit SN1 detects the vibration vb including the vibration sv of the spin chuck 5c via the first drive unit 5a.
  • step S80 the first detection unit SN1 detects vibration at the first predetermined position FPS (predetermined position) during the period in which the spin chuck 5c is rotating.
  • step S81 the determination unit 51a receives the first vibration signal Sv1 including the vibration component Sc1 from the first detection unit SN1.
  • step S82 the second detection unit SN2 detects the vibration vb including the vibration sv of the spin chuck 5c via the first drive unit 5a.
  • step S82 the second detection unit SN2 detects vibration at the second predetermined position SPS (predetermined position) during the period in which the spin chuck 5c is rotating.
  • step S83 the determination unit 51a receives the second vibration signal Sv2 including the vibration component Sc2 from the second detection unit SN2.
  • step S85 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc1 is larger than the third threshold value TH3, and detects the holding state of the substrate W.
  • step S85 the process proceeds to step S87.
  • the affirmative determination indicates that the first vibration signal Sv1 exceeds the first vibration range R1, and corresponds to detecting that the substrate W is not properly held.
  • step S87 the determination unit 51a determines whether or not the absolute value of the level of the vibration component Sc2 is greater than the fourth threshold value TH4, and detects the holding state of the substrate W.
  • step S87 the process proceeds to step S89.
  • a negative determination indicates that the second vibration signal Sv2 is within the second vibration range R2, and corresponds to detecting that the degree of the holding state of the substrate W is relatively small.
  • step S89 the execution unit 51b controls the output unit 55 so as to issue a third alarm (corresponding to a third process).
  • the third alarm is the same as the first alarm according to the second modification of the first embodiment.
  • step S91 the execution unit 51b controls the first drive unit 5a so as to stop the rotation of the spin chuck 5c after completion of the process being performed on the substrate W (corresponding to the third process). Accordingly, it is possible to suppress the dropping of the substrate W while suppressing the extension of the processing time due to the re-execution of the processing being executed.
  • step S87 the process proceeds to step S93.
  • the affirmative determination indicates that the second vibration signal Sv2 exceeds the second vibration range R2, and corresponds to detecting that the degree of inappropriate holding state of the substrate W is relatively large.
  • step S93 the execution unit 51b controls the output unit 55 so as to issue a fourth alarm (corresponding to a fourth process).
  • the fourth alarm is the same as the second alarm according to the second modification of the first embodiment.
  • step S95 the execution unit 51b controls the first drive unit 5a so as to immediately stop the rotation of the spin chuck 5c in response to an affirmative determination (Yes in step S87) (corresponding to a fourth process). This is because the degree of inappropriate holding of the substrate W is relatively large and the degree of urgency is high.
  • step S85 the process proceeds to step S97.
  • a negative determination indicates that the first vibration signal Sv1 is within the first vibration range R1, and corresponds to detecting that the substrate W is properly held.
  • step S97 the determination unit 51a determines whether or not the absolute value of the level of the vibration component Sc2 is greater than the fourth threshold value TH4.
  • step S97 If the determination is negative (No in step S97), the process returns to the main routine.
  • step S97 the process proceeds to step S99.
  • the affirmative determination corresponds to detection that the first detection unit SN1 and / or the second detection unit SN2 are not functioning normally. Since the fourth threshold value TH4 is greater than the third threshold value TH3, the absolute value of the level of the vibration component Sc1 is equal to or lower than the third threshold value TH3 (No in step S85), and the absolute value of the level of the vibration component Sc2 is the fourth value. This is because it is logically impossible that the value is larger than the threshold value (Yes in step S97).
  • step S99 the execution unit 51b controls the output unit 55 so as to issue a fifth alarm (corresponding to a fifth process).
  • the fifth alarm includes, for example, a notification that the first detection unit SN1 and / or the second detection unit SN2 are not functioning normally.
  • step S101 the execution unit 51b controls the first drive unit 5a so as to immediately stop the rotation of the spin chuck 5c in response to an affirmative determination (Yes in step S97) (corresponding to a fifth process). This is because the first detection unit SN1 and / or the second detection unit SN2 are not functioning normally and the degree of urgency is high.
  • the execution unit 51b executes the third process as a process to be executed after the determination (step S89, step S91). Therefore, when the degree of inappropriate holding state of the substrate W by the spin chuck 5c is relatively small, it is possible to take appropriate measures according to the degree.
  • the execution unit 51b executes the fourth process as a process to be executed after the determination (step S93, step S95). Therefore, when the degree of inappropriate holding state of the substrate W by the spin chuck 5c is relatively large, it is possible to take an appropriate measure corresponding to the degree.
  • the fourth process it is determined that the absolute value of the level of the vibration component Sc1 is larger than the third threshold value TH3, and the absolute value of the level of the vibration component Sc2 is greater than the fourth threshold value TH4.
  • the execution part 51b performs a 5th process as a process performed after determination (process S99, process S101). Therefore, when the first detection unit SN1 and / or the second detection unit SN2 are not functioning properly, appropriate measures can be taken.
  • the absolute value of the level of the vibration component Sc1 is determined to be equal to or less than the third threshold value TH3, and the absolute value of the level of the vibration component Sc1 is greater than the fourth threshold value TH4.
  • the process of immediately stopping the rotation of the spin chuck 5c is included. Accordingly, when the first detection unit SN1 and / or the second detection unit SN2 are not functioning normally, an emergency stop is performed, and the first detection unit SN1 and / or the second detection unit SN2 is inspected, repaired, or replaced. can do.
  • FIG. 3 A substrate processing system 100 according to a third embodiment of the present invention will be described with reference to FIGS. 1, 2, 7, and 18 to 20.
  • FIG. The substrate processing system 100 according to the third embodiment is different from the substrate processing system 100 according to the first embodiment in that it includes a third detection unit SN3 located on the side wall 3b of the chamber 3.
  • the configuration of the substrate processing system 100 according to the third embodiment is the same as the configuration of the substrate processing system 100 according to the first embodiment.
  • the processing apparatus 1 which concerns on Embodiment 3 is described as "processing apparatus 1B.” Therefore, the substrate processing system 100 according to the third embodiment includes a processing apparatus 1B instead of the processing apparatus 1 according to the first embodiment.
  • the differences between the third embodiment and the first embodiment will be mainly described.
  • FIG. 18 is a side sectional view showing the processing apparatus 1B of the substrate processing system 100 according to the third embodiment.
  • the processing device 1B further includes a third detection unit SN3 in addition to the configuration of the processing device 1 illustrated in FIG.
  • the other configuration of the processing apparatus 1B is the same as that of the processing apparatus 1 shown in FIG.
  • the processing apparatus 1B and the computer unit U3 constitute a substrate processing apparatus SP.
  • the third detection unit SN3 detects the chamber vibration cv during the period when the spin chuck 5c is rotating, and outputs a third vibration signal Sv3 representing the vibration cv.
  • the third detection unit SN3 is attached to the side wall 3b (wall) of the chamber 3.
  • the third detection unit SN3 is attached to a substantially central portion in the vertical direction of the side wall portion 3b, or is attached to the upper side by a substantially central portion in the vertical direction of the side wall portion 3b. This is because the vibration cv of the chamber 3 is larger at the substantially central portion or the position above the substantially central portion than the position below the substantially central portion, and the vibration cv is easy to detect.
  • the third detection unit SN3 may be attached to the top wall (wall) of the chamber 3.
  • the vibration cv of the chamber 3 can be detected by the third detection unit SN3. Therefore, by analyzing the vibration cv, it is possible to take an appropriate measure according to the degree of the vibration cv of the chamber 3. For example, in a situation where the vibration cv of the chamber 3 becomes large, there is a high possibility that the entire processing apparatus 1B vibrates greatly. Therefore, when it is detected that the vibration cv of the chamber 3 is large, for example, the processing apparatus 1B can be urgently stopped.
  • the vibration cv is detected as acceleration.
  • the third vibration signal Sv3 is an acceleration signal representing the vibration cv.
  • the third detection unit SN3 includes an acceleration sensor.
  • the arrangement, configuration, and operation of the first detection unit SN1 are the same as the arrangement, configuration, and operation of the detection unit SN according to the first embodiment. However, in the description of the detection unit SN according to the first embodiment, “vibration signal Sv” is replaced with “first vibration signal Sv1”. That is, the first detection unit SN1 detects the vibration vb during the period when the spin chuck 5c is rotating, and outputs the first vibration signal Sv1 representing the vibration vb. The first vibration signal Sv1 is analyzed in the same manner as the vibration signal Sv of the first embodiment, and the holding state of the substrate W is detected.
  • vibration signal Sv in the first embodiment, “base level BL” is read as “first base level BL1”, and “vibration component Sc” is read as “vibration component Sc1”. That is, the first vibration signal Sv1 has a vibration component in the first direction D1 with respect to a predetermined first base level BL1, and a second direction D2 opposite to the first direction D1 with respect to the first base level BL1. Including vibration components.
  • the vibration component in the first direction D1 and the vibration component in the second direction may be collectively referred to as “vibration component Sc1” in some cases.
  • the processing apparatus 1B includes the first detection unit SN1 that is the same as the detection unit SN according to the first embodiment, and thus, by analyzing the first vibration signal Sv1 as in the first embodiment, the substrate The holding state of W can be detected. Further, in the third embodiment, compared to the case where the holding state of the substrate W is detected based on the position of the holding member 21, the detection error is detected when the holding state of the substrate W is detected as in the first embodiment. Can be reduced. In addition, the third embodiment has the same effect as the first embodiment due to the first detection unit SN1 similar to the detection unit SN of the first embodiment.
  • the determination unit 51a determines whether or not the level of the first vibration signal Sv1 exceeds the third vibration range R3, and detects the holding state of the substrate W. Further, the determination unit 51a determines whether or not the level of the third vibration signal Sv3 exceeds the fourth vibration range R4, and detects the vibration state of the chamber 3. The detection of the vibration state of the chamber 3 indicates that the vibration of the chamber 3 is abnormal or that the vibration of the chamber 3 is normal.
  • the execution part 51b determines the process performed after determination based on the combination of the determination result with respect to 1st vibration signal Sv1, and the determination result with respect to 3rd vibration signal Sv3, and performs the determined process.
  • any of the sixth process, the seventh process, and the eighth process is determined as a process to be executed after the determination by the determination unit 51a.
  • Each of the sixth process, the seventh process, and the eighth process controls the output unit 55 to issue an alarm and / or controls the first drive unit 5a to stop the rotation of the spin chuck 5c. Processing to include.
  • all processes may be different, some processes may be different, or all processes may be the same.
  • the sixth process is the same as the first process according to the second modification of the first embodiment, and each of the seventh process and the eighth process is the same as the second process according to the second modification of the first embodiment. It is the same.
  • FIG. 19A shows the third vibration range R3.
  • the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the first vibration signal Sv1.
  • a third vibration range R3 is defined for the first vibration signal Sv1.
  • the storage unit 53 stores a fifth specific value B5 indicating a value at one end of the third vibration range R3 and a sixth specific value B6 indicating a value at the other end of the third vibration range R3.
  • the fifth specific value B5 is determined corresponding to the vibration component in the first direction D1 of the first vibration signal Sv1.
  • the sixth specific value B6 is determined corresponding to the vibration component in the second direction D2 of the first vibration signal Sv1.
  • the absolute value of the fifth specific value B5 and the absolute value of the sixth specific value B6 are the same.
  • the fifth specific value B5 indicates a fifth threshold value TH5 for comparison with the level of the vibration component Sc1 of the first vibration signal Sv1, and the storage unit 53 stores the fifth threshold value TH5. .
  • FIG. 19B shows the fourth vibration range R4.
  • the horizontal axis indicates time, and the vertical axis indicates the level (G or V) of the third vibration signal Sv3.
  • a fourth vibration range R4 is defined for the third vibration signal Sv3.
  • the third vibration signal Sv3 includes a vibration component in a fifth direction D5 (eg, plus direction) with respect to a predetermined third base level BL3 (eg, zero level) and a fifth component with respect to the third base level BL3.
  • a vibration component in a sixth direction D6 (for example, a negative direction) opposite to the direction D5.
  • the third base level BL3 is not limited to the zero level, and may be an allowable vibration level before the spin chuck 5c rotates.
  • the vibration component in the fifth direction D5 and the vibration component in the sixth direction D6 may be collectively referred to as “vibration component Sc3”.
  • the storage unit 53 stores a seventh specific value B7 indicating a value at one end of the fourth vibration range R4 and an eighth specific value B8 indicating a value at the other end of the fourth vibration range R4.
  • the seventh specific value B7 is determined corresponding to the vibration component in the fifth direction D5 of the third vibration signal Sv3.
  • the eighth specific value B8 is determined corresponding to the vibration component in the sixth direction D6 of the third vibration signal Sv3.
  • the absolute value of the seventh specific value B7 and the absolute value of the eighth specific value B8 are the same.
  • the seventh specific value B7 indicates a sixth threshold value TH6 for comparison with the level of the vibration component Sc3 of the third vibration signal Sv3, and the storage unit 53 stores the sixth threshold value TH6. .
  • the third vibration range R3 and the fourth vibration range R4 are determined experimentally and / or empirically in consideration of the installation environment of the processing apparatus 1B.
  • the vibration detection method according to the third embodiment includes steps S1 to S15.
  • the substrate processing apparatus SP according to the third embodiment executes the vibration analysis process shown in FIG. 20 in the vibration analysis process of step S11.
  • the fifth threshold value TH5 is used to determine whether or not the level of the first vibration signal Sv1 exceeds the third vibration range R3.
  • the sixth threshold value TH6 is used to determine whether or not the level of the third vibration signal Sv3 exceeds the fourth vibration range R4.
  • FIG. 20 is a flowchart showing the vibration analysis process according to the third embodiment. As shown in FIG. 20, the vibration analysis process includes steps S110 to S131.
  • step S110 the first detection unit SN1 detects the vibration vb including the vibration sv of the spin chuck 5c via the first drive unit 5a.
  • step S110 the first detection unit SN1 detects vibration at the predetermined position SP1 during the period in which the spin chuck 5c is rotating.
  • step S111 the determination unit 51a receives the first vibration signal Sv1 including the vibration component Sc1 from the first detection unit SN1.
  • step S112 the third detection unit SN3 detects the vibration cv of the chamber 3.
  • step S112 the third detection unit SN3 detects vibration at a specific position during the period in which the spin chuck 5c is rotating. The specific position indicates a position on the side wall 3b or the top wall 3c.
  • step S113 the determination unit 51a receives the third vibration signal Sv3 including the vibration component Sc3 from the third detection unit SN3.
  • step S115 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc1 is greater than the fifth threshold value TH5, and detects the holding state of the substrate W.
  • step S115 the process proceeds to step S117.
  • the affirmative determination indicates that the first vibration signal Sv1 exceeds the third vibration range R3, and corresponds to detecting that the substrate W is not properly held.
  • step S117 the determination unit 51a determines whether the absolute value of the level of the vibration component Sc3 is larger than the sixth threshold value TH6, and detects the vibration state of the chamber 3.
  • step S117 In accordance with a negative determination (No in step S117), the process proceeds to step S119.
  • a negative determination indicates that the third vibration signal Sv3 is within the fourth vibration range R4 and corresponds to the detection that the vibration cv of the chamber 3 is normal.
  • step S119 the execution unit 51b controls the output unit 55 so as to issue a sixth alarm (corresponding to a sixth process).
  • the sixth alarm is the same as the first alarm according to the second modification of the first embodiment.
  • step S121 the execution unit 51b controls the first drive unit 5a so as to stop the rotation of the spin chuck 5c after completion of the process being performed on the substrate W (corresponding to a sixth process). Accordingly, it is possible to suppress the dropping of the substrate W while suppressing the extension of the processing time due to the re-execution of the processing being executed.
  • step S117 the process proceeds to step S123.
  • the affirmative determination indicates that the third vibration signal Sv3 exceeds the fourth vibration range R4 and corresponds to detecting that the vibration cv of the chamber 3 is abnormal.
  • An abnormal vibration cv of the chamber 3 corresponds to a large vibration of the chamber 3 and indicates a large vibration of the entire processing apparatus 1B.
  • step S123 the execution unit 51b controls the output unit 55 so as to issue a seventh alarm (corresponding to a seventh process).
  • the seventh alarm includes, for example, a notification that the chamber 3 is greatly vibrating.
  • step S125 the execution unit 51b controls the first drive unit 5a so as to immediately stop the rotation of the spin chuck 5c in response to an affirmative determination (Yes in step S117) (corresponding to a seventh process). This is because the vibration of the entire processing apparatus 1B is large and the degree of urgency is high.
  • step S115 the process proceeds to step S127.
  • a negative determination indicates that the first vibration signal Sv1 is within the third vibration range R3, and corresponds to detecting that the substrate W is properly held.
  • step S127 the determination unit 51a determines whether or not the absolute value of the level of the vibration component Sc3 is greater than the sixth threshold value TH6.
  • step S127 the process returns to the main routine.
  • step S127 the process proceeds to step S129.
  • the affirmative determination indicates that the third vibration signal Sv3 exceeds the fourth vibration range R4 and corresponds to detecting that the vibration cv of the chamber 3 is abnormal.
  • step S129 the execution unit 51b controls the output unit 55 so as to issue the eighth alarm (corresponding to the eighth process).
  • the eighth alarm is the same as the seventh alarm.
  • step S131 the execution unit 51b controls the first drive unit 5a so as to immediately stop the rotation of the spin chuck 5c in response to an affirmative determination (Yes in step S127) (corresponding to an eighth process). This is because the vibration of the entire processing apparatus 1B is large and the degree of urgency is high.
  • the determination unit 51a determines that the absolute value of the level of the vibration component Sc1 is greater than the fifth threshold value TH5, and the vibration component Sc3.
  • the execution unit 51b executes the sixth process as a process to be executed after the determination (step S119, step S121). That is, an appropriate measure can be taken when the substrate W is not properly held. As a result, the substrate W can be prevented from dropping off.
  • the execution unit 51b executes the seventh process as a process to be executed after the determination (step S123, step S125). That is, an appropriate measure can be taken when the substrate W is not properly held and the vibration cv of the chamber 3 is abnormal. As a result, it is possible to prevent the substrate W from falling off and to prevent damage to the movable part of the processing apparatus 1B.
  • the seventh process it is determined that the absolute value of the level of the vibration component Sc1 is larger than the fifth threshold value TH5, and the absolute value of the level of the vibration component Sc3 is greater than the sixth threshold value TH6.
  • the absolute value of the level of the vibration component Sc1 is larger than the fifth threshold value TH5
  • the absolute value of the level of the vibration component Sc3 is greater than the sixth threshold value TH6.
  • the execution unit 51b executes the eighth process as a process to be executed after the determination (step S129, step S131). That is, an appropriate measure can be taken when the vibration cv of the chamber 3 is abnormal. As a result, it is possible to prevent the substrate W from falling off and to prevent damage to the movable part of the processing apparatus 1B.
  • the absolute value of the level of the vibration component Sc1 is determined to be equal to or less than the third threshold value TH3, and the absolute value of the level of the vibration component Sc3 is greater than the sixth threshold value TH6.
  • the process of immediately stopping the rotation of the spin chuck 5c is included. Accordingly, it is possible to immediately avoid the substrate W from falling off.
  • Each of detection units SN, SN1, SN2, and SN3 according to Embodiment 1 (including modifications) to Embodiment 3 may include a speed sensor, and may detect vibration vb as a speed. Therefore, the vibration signals Sv, Sv1, Sv2, and Sv3 are speed signals representing vibration.
  • the speed sensor is, for example, a non-contact type sensor that uses the principle of eddy current.
  • each of the detection units SN, SN1, SN2, and SN3 may include a displacement sensor and detect the vibration vb as a displacement. Therefore, the vibration signals Sv, Sv1, Sv2, and Sv3 are displacement signals that represent vibration.
  • the displacement sensor is, for example, a non-contact type sensor that uses the principle of eddy current.
  • the displacement sensor is a non-contact type sensor using, for example, laser light, ultrasonic waves, or infrared rays.
  • each of the detection units SN, SN1, and SN2 may be separated from the base unit 3a or the first drive unit 5a as long as it faces the first drive unit 5a, and is located inside the chamber 3. You may do it.
  • the detection unit SN3 may be separated from the chamber 3 or may be located inside the chamber 3.
  • the predetermined vibration range RG (first threshold TH1) and the first predetermined vibration range RG1 (first threshold TH1) , Second predetermined vibration range RG2 (second threshold TH2), first vibration range R1 (third threshold TH3), second vibration range R2 (fourth threshold TH4), third vibration range R3 (fifth threshold TH5),
  • the fourth vibration range R4 (sixth threshold value TH6) may be different depending on the rotation speed of the spin chuck 5c, as in the first embodiment.
  • the absolute value of the value A1 may be different from the absolute value of the value A2, the absolute value of the value A3 and the absolute value of the value A4 may be different, and the absolute value of the value B1 and the absolute value of the value B2
  • the absolute value of the value B3 may be different from the absolute value of the value B4
  • the absolute value of the value B5 and the absolute value of the value B6 may be different
  • the value B7 The absolute value and the absolute value of the value B8 may be different (FIGS. 5, 10, 16, and 19).
  • the determination unit 51a according to the first embodiment (including modifications) to the third embodiment may analyze the vibration vb based on a velocity signal calculated by integrating the acceleration signal once.
  • the vibration vb may be analyzed based on a displacement signal calculated by integrating the acceleration signal twice.
  • the first to third modifications according to the first embodiment can be applied to each of the first detection unit SN1 and the second detection unit SN2 according to the second embodiment, and the first detection unit according to the third embodiment. It can be applied to each of SN1 and third detection unit SN3.
  • the fifth modification according to the first embodiment can be applied to each of the first detection unit SN1 and the second detection unit SN2 according to the second embodiment, and can be applied to the first detection unit SN1 according to the third embodiment.
  • the third detection unit SN3 according to the third embodiment may be provided in the processing apparatus 1A according to the second embodiment.
  • the first to third modification examples according to the first embodiment can be applied to step S143 in FIG. Further, the steps S141 to S147 in FIG. 13 can be executed before the step S1 in FIG. Then, different vibration analysis processes may be executed in step S143 and step S11. Further, as the vibration range for detecting the holding state of the substrate W, different vibration ranges may be set in step S143 and step S11, and as a threshold for comparing with the level of the vibration component, step S143 and step S11 are performed. A different threshold may be set in S11.
  • the present invention relates to a substrate processing apparatus and a vibration detection method for processing a substrate, and has industrial applicability.
  • Processing device 3 Chamber (accommodating part) 3a Base part 3b Side wall part (wall part) 3c Top wall (wall) 5a 1st drive part (drive part) 5c Spin chuck (rotating part) 51a determination unit 51b execution unit 53 storage unit SP substrate processing apparatus SN detection unit (first detection unit) SN1 first detection unit SN2 second detection unit SN3 third detection unit W substrate

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PCT/JP2017/045144 2017-02-17 2017-12-15 基板処理装置及び振動検出方法 WO2018150709A1 (ja)

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Citations (4)

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JP2001330620A (ja) * 2000-03-14 2001-11-30 Omron Corp 振動・衝撃警報装置
JP2006237456A (ja) * 2005-02-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板飛散防止方法
JP2015005567A (ja) * 2013-06-19 2015-01-08 株式会社荏原製作所 基板処理装置
JP2015070015A (ja) * 2013-09-27 2015-04-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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JP2003086564A (ja) * 2001-09-14 2003-03-20 Mitsubishi Electric Corp 遠心乾燥装置および半導体装置の製造方法ならびに半導体製造装置
JP2010153769A (ja) * 2008-11-19 2010-07-08 Tokyo Electron Ltd 基板位置検出装置、基板位置検出方法、成膜装置、成膜方法、プログラム及びコンピュータ可読記憶媒体

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Publication number Priority date Publication date Assignee Title
JP2001330620A (ja) * 2000-03-14 2001-11-30 Omron Corp 振動・衝撃警報装置
JP2006237456A (ja) * 2005-02-28 2006-09-07 Dainippon Screen Mfg Co Ltd 基板処理装置および基板飛散防止方法
JP2015005567A (ja) * 2013-06-19 2015-01-08 株式会社荏原製作所 基板処理装置
JP2015070015A (ja) * 2013-09-27 2015-04-13 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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