TWI356160B - System for measuring and monitoring vibration - Google Patents

System for measuring and monitoring vibration Download PDF

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TWI356160B
TWI356160B TW94130340A TW94130340A TWI356160B TW I356160 B TWI356160 B TW I356160B TW 94130340 A TW94130340 A TW 94130340A TW 94130340 A TW94130340 A TW 94130340A TW I356160 B TWI356160 B TW I356160B
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laser
monitoring system
vibration
vibration measuring
light
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TW94130340A
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TW200712455A (en
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Yang Chang Chien
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Hon Hai Prec Ind Co Ltd
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13.56160 .100年09月30日修正赛換頁 六、發明說明: 【發明所屬之技術領域】 [0001]本發明係關於一種測量及監控系統,尤係關於一種振動 之測量及監控系統。 【先前技術】 [〇〇〇2]振動測量及監測覆蓋了機械、電子、建築、地質等廣泛 領域,在研究材料之特性方面也有很大之應用背景β特 別疋隨著3C產品小型化 '輕量化之發展趨勢,製造3C產 品之精密模具及精密加工技術需要以高速主轴進行低切 削量之快速切削,而主軸本身軸承之摩擦或偏心將會導 致向速精密主軸產生振動,進而影響精密加工之精度。 另外,這些包括咼速旋轉軸之機器具有固有之共振頻率 ,當機器旋轉部件之工作頻率與機器之固有頻率吻合時 ,就會增加機器及旋轉部件之振動,甚至會發生故障, 導致可能之破壞,這包括加工精度不夠、機械斷裂、甚 至人身傷害。為了提局機器之加工精度、減少射機器的 損害及對人身之傷害,就必須對機器旋轉部件之振動進 订測量或監測,使機器在超出可接受振動極限戒共振點 附近時可以關閉或暫停機器,或由一種控制設備於機器 超出不同設定限制範圍時執行不同之動作,讓振動恢復 至可接受之限制範圍内。從而保證加工產品的精度且避 免工作於共振點的附近,進而避免損壞或是避免發生進 一步的損壞。 []目則,常用之振動測量裝置係採用測量線圈於磁場中運 動而產生之電動勢大小來判斷振動之結構,由於磁場本 094130340 表單編號A0101 第3頁/共17頁 1003358718-0 丄356160 100年.09月.30 日修jggg· 身之不均勻分佈很難消除,且一些設備或儀器工作過程 中亦會產生一些磁場分佈,因此存在測量振動之頻帶不 夠寬’振幅之動態範圍小,特別係於測量微弱振動訊號. „ 時靈敏度低,使得其應用領域受到很大限制。 · [0004] 一種習知轴承振動加速度測量之訊號的拾取裝置的結構 ,如第六圖所示,其用以拾取軸承2〇之振動,其由加速 度计21、測力彈簧22、傳動桿23、底座24、端蓋25、套 筒26等結構組成,傳動桿21與軸承26的非轉動部分相接 觸,在振動測量時’被測轴承2〇的内圈被驅動軸(圖未示 )驅動旋轉,歸20外圈受麵負載之作用保持靜止,轴 · 承20外圈外徑表面控向振動通過傳動桿傳入加速度計 21並轉變成電荷量*電_出,⑽分析其振動。 [0005] 上述測量方法均係接觸式測量,其需要與被測物體相接 觸才能有效感知被測物之振動狀態,故,其無法直接量 測高速旋轉物體如精密機械加工之高迷旋轉軸之振動。 【發明内容】 [0006] 黎於以上内容,有必要提供—種非接觸振動測量及監控 · [0007] 量或監控,其包括:一雷射光’、之振動.仃 宙射光源系、统,該雷射光源系 統可發射-雷射光束;-域測系統,該光感㈣統與上 述雷射祕相狀置,該光感„'統與上料射系統相 對設置,用以感測上述雷㈣統發出之 光感測系統之光強度變化,上述祐π私 《破測物部分阻斷雷射光 源系統及光感測系統之間之光走·— 094130340 測 1003358718-0 表單編號Α0101 第4頁/共Π頁 理系統接收光感 1 13.5616013.56160. The change of the revision game on September 30, 100. 6. Description of the invention: [Technical field of the invention] [0001] The present invention relates to a measurement and monitoring system, and more particularly to a vibration measurement and monitoring system. [Prior Art] [〇〇〇2] Vibration measurement and monitoring covers a wide range of fields such as mechanics, electronics, construction, and geology. It also has a large application background in the study of the properties of materials. Specially, it is miniaturized with 3C products. Quantitative development trend, precision molds and precision machining technology for manufacturing 3C products require high-speed spindles for fast cutting with low cutting capacity, while the friction or eccentricity of the bearings of the spindle itself will cause vibration of the speed-precision spindle, which will affect the precision machining. Precision. In addition, these machines including idle rotating shafts have inherent resonant frequencies. When the operating frequency of the rotating parts of the machine matches the natural frequency of the machine, it will increase the vibration of the machine and rotating parts, and even cause malfunctions, resulting in possible damage. This includes insufficient machining accuracy, mechanical breakage, and even personal injury. In order to improve the machining accuracy of the machine, reduce the damage of the shooting machine and damage to the human body, it is necessary to make a measurement or monitoring of the vibration of the rotating parts of the machine, so that the machine can be closed or suspended when it exceeds the acceptable vibration limit or the resonance point. The machine, or a control device, performs different actions when the machine exceeds different set limits, allowing the vibration to return to acceptable limits. This ensures the accuracy of the processed product and avoids working near the resonance point, thus avoiding damage or avoiding further damage. [] Objective, the commonly used vibration measuring device uses the magnitude of the electromotive force generated by measuring the movement of the coil in the magnetic field to determine the structure of the vibration. Since the magnetic field 094130340 Form No. A0101 Page 3 of 17 page 1003358718-0 丄356160 100 years .09月.30日修jggg· The uneven distribution of the body is difficult to eliminate, and some equipment or instruments will also generate some magnetic field distribution during the working process. Therefore, the frequency band for measuring vibration is not wide enough. The dynamic range of the amplitude is small, especially In the measurement of weak vibration signals, the sensitivity is low, which makes the application field very limited. [0004] The structure of a pickup device for measuring the vibration acceleration measurement of a bearing, as shown in the sixth figure, is used for picking up The vibration of the bearing 2 is composed of an accelerometer 21, a force measuring spring 22, a transmission rod 23, a base 24, an end cover 25, a sleeve 26 and the like. The transmission rod 21 is in contact with the non-rotating portion of the bearing 26, and is vibrating. During the measurement, the inner ring of the bearing 2〇 is driven to rotate by the drive shaft (not shown), and the outer ring of the 20 outer ring is kept stationary by the surface load. The vibration is transmitted to the accelerometer 21 through the transmission rod and converted into a charge amount*Electrical_out, and (10) the vibration is analyzed. [0005] The above measurement methods are all contact measurement, which needs to be in contact with the measured object to effectively sense the measured object. The vibration state, therefore, it is not possible to directly measure the vibration of a high-speed rotating object such as a high-precision rotating shaft of precision machining. [Invention] [0006] In the above content, it is necessary to provide a kind of non-contact vibration measurement and monitoring. [0007] quantity or monitoring, which includes: a laser light, a vibration, a system of light sources, a laser source system, a laser beam system, a laser beam system, a laser beam system, a field measuring system, and a light sensing system. The laser is in a secret state, and the light sense is set relative to the upper shot system to sense the light intensity change of the light sensing system emitted by the above-mentioned lightning (four), and the above-mentioned Light between the laser light source system and the light sensing system · 094130340 Measure 1003358718-0 Form number Α 0101 Page 4 / Π page system receiving light 1 1.56160

100年.09月· 30日按正替換頁 測系統輸出之電流訊號且經轉換處理計算旋轉軸之位置 ,再結合時間之量測,計算處理出被測物之振動結構。 [0008] 相較習知技術,所述振動測量及監控系統利用雷射光之 光束受到物體遮蔽後,產生光強度變化,利用光感測器 測得光強度變化而輸出之電流訊號的改變,即可結合時 間的量測計算出物體的振動量。其採用光學非接觸式測 量,被測物體一旋轉轴始終不接觸測量系統,可避免使 被測物體一旋轉軸表面會因摩擦而導致受損,且可對高 速運動物體進行振動量測。且其未利用常規壓電傳感器 ,其可抗電磁幹擾及強輻射、測試頻率寬、精度高,應 用領域大大擴展。 [0009] 另外,因光束傳播速度快,其對振動變化的響應快,進 而能測量到的振動頻帶寬。 [0010] 再次,因光感測系統可測知的強度變化範圍大,因而可 測量之振幅的動態範圍大,且振動訊號甚至微弱振動訊 號引起的光強度變化均能被光接受元件所接收,故靈敏 度高。 【實施方式】 [0011] 請參閱第一圖及第二圖,本發明較佳實施方式之振動測 量及監控系統1用以測量或監控一旋轉軸10之振動結構, 該振動測量及監控系統1包括:一雷射光源系統11、一光 感測系統1 2及一處理系統(圖未示)以及一結果輸出裝置( 圖未示)。雷射光源系統11用以發出平行之雷射光束13, 其由雷射光源111及複數透鏡112構成,該雷射光源111 通常爲氣體雷射器,如氦-氖雷射器,其發出之雷射光束 094130340 表單編號 A0101 第 5 頁/共 Π 頁. 1003358718-0 1356160 100年09月.30日梭正替^頁 爲高斯光束。光感測系統1 2與雷射光源系統1 1相對設置 ,其藉由光感測器121感測入射至其表面之光強度分佈並 轉換為電流訊號輸出。處理系統可為電腦系統或微處理 器,其接收光感測系統12輸出之電流訊號經轉換處理計 算旋轉軸之位置(詳後述),再結合時間之量測,計算處 理出轉軸之振動結構。結果輸出裝置用以將所測量旋轉 軸的振動結構輸出,其可為一顯示介面或列印設備,亦 可為自動報警系統,處理系統中設定其正常振動範圍, 當被測物體振動超出設定範圍即通過自動報警系統給操 作人員警示或由控制裝置自動調節。 胃 [0012] 工作時,使被測量旋轉軸10垂直與光束13置於雷射光源 系統11及光感測系統12之間,開啟該振動測量及監控系 統1,雷射光源系統11發出雷射光束13,該雷射光束13部 分為旋轉軸10所阻斷。當旋轉軸10轉動時,旋轉軸10於 其徑向振動,使光束13被旋轉轴10所阻斷之部分發生變 化,從而入射至光感測系統12之光強發生變化,光感測 系統12將光強之變化訊號轉變成電流訊號輸給處理系統 _ ,處理系統處理計算出轉軸之位置,並結合時間之量測 得出轉軸之振動結構並藉由輸出裝置輸出。 [0013] 可以理解,如非特殊需要,亦可省去結果輸出裝置,而 由控制設備直接根據測量或監控結果控制機器之運轉, 另,本發明振動測量及監控系統亦可對其他非旋轉軸之 振動進行測量及監控。 [0014] 請參第三圖至第五圖,所述振動測量及監控方法係應用 雷射刀緣法原理,以下就本振動測量及監控方法之實現 094130340 表單編號A0101 第6頁/共17頁 1003358718-0 13.56160 100^.09^ 30 a 原理進賴細説m射^基本之橫向電磁模態震 蕩,則產生之光束強度為高斯空間分佈形態,如此之雷 射光束13稱為高斯光束,其電場分佈,如第三圖所示, 若以數學模型來表示,則可寫成: [0015] -x,exp(-W{zy W%)] (a) [0016] exp. (b) (Eq-l) # [0017] ---(c) 細 PhM;: /:> * f. ·, [0018] 上式等號後第一項(a)為一振幅因數(Ampiitude factor),其表示振幅r值而改變之關係;而第二項(b )為光波沿轴向(longitudinal) z之相位變化關係; 第三項(c)則為表示光波沿徑向(Radial) r之相位變 化關係。 [0019] 其中 ’ r=(x2+y2)0·5, W〇為束腰半徑(Beam waist ra-dius),EQ為束腰處之電場強度,.¾為波長,j為虛數符 號。在該平面上,光波波前(Wave front)之曲率半徑 R(0) — 〇〇,為一平面且光束之直徑最小(z)和R (z )分別為距束腰半徑(Beam waist)距離為z之平面上 之光點半徑(Spot size或Beam size)及其波前之 曲率半徑,且波數k=.u=.,若把原點(z = 0)設於腰部則 1003358718-0 094130340 表單编號A0101 第7頁/共17頁 1356160 [0020] [0021] [0022] 100年.09月· 30日俊正替100 years, September, and 30th, according to the positive replacement page, the current signal outputted by the system is measured and the position of the rotating shaft is calculated by the conversion process. Then, combined with the measurement of the time, the vibration structure of the measured object is calculated and processed. [0008] Compared with the prior art, the vibration measuring and monitoring system uses a beam of laser light to be shielded by an object to generate a change in light intensity, and the change of the current signal outputted by the light sensor is measured by the light sensor, that is, The amount of vibration of the object can be calculated in conjunction with the measurement of time. It adopts optical non-contact measurement, and the rotating axis of the measured object does not touch the measuring system at all times, which can prevent the surface of the rotating object from being damaged due to friction, and can measure the vibration of high-speed moving objects. Moreover, it does not utilize a conventional piezoelectric sensor, which is resistant to electromagnetic interference and strong radiation, has a wide test frequency, and has high precision, and the application field is greatly expanded. [0009] In addition, since the beam propagation speed is fast, its response to the vibration change is fast, and the vibration frequency bandwidth which can be measured can be measured. [0010] Again, since the intensity range of the intensity that can be detected by the light sensing system is large, the dynamic range of the measurable amplitude is large, and the light intensity change caused by the vibration signal or even the weak vibration signal can be received by the light receiving element. Therefore, the sensitivity is high. [Embodiment] Referring to the first and second figures, the vibration measuring and monitoring system 1 of the preferred embodiment of the present invention is used to measure or monitor the vibration structure of a rotating shaft 10, and the vibration measuring and monitoring system 1 The invention comprises: a laser light source system 11, a light sensing system 12 and a processing system (not shown) and a result output device (not shown). The laser source system 11 is for emitting a parallel laser beam 13 which is composed of a laser source 111 and a plurality of lenses 112, which are typically gas lasers, such as krypton-rhenium lasers, which emit Laser beam 094130340 Form No. A0101 Page 5 of Π page. 1003358718-0 1356160 On September 30, 30, the shuttle is a Gaussian beam. The light sensing system 12 is disposed opposite to the laser light source system 11 and senses the light intensity distribution incident on the surface thereof by the light sensor 121 and converts it into a current signal output. The processing system can be a computer system or a microprocessor, and the current signal outputted by the light sensing system 12 is converted to calculate the position of the rotating shaft (described later), and combined with the measurement of the time, the vibration structure of the rotating shaft is calculated. The output device is configured to output the vibration structure of the measured rotating shaft, which may be a display interface or a printing device, or an automatic alarm system, and the normal vibration range is set in the processing system, when the measured object vibrates beyond the setting range. That is, the operator is alerted by the automatic alarm system or automatically adjusted by the control device. The stomach [0012] is operated such that the measured rotating shaft 10 is vertically and the light beam 13 is placed between the laser light source system 11 and the light sensing system 12, the vibration measuring and monitoring system 1 is turned on, and the laser light source system 11 emits a laser. The beam 13 is partially blocked by the axis of rotation 10. When the rotating shaft 10 rotates, the rotating shaft 10 vibrates in the radial direction thereof, so that the portion of the light beam 13 blocked by the rotating shaft 10 changes, so that the light intensity incident on the light sensing system 12 changes, and the light sensing system 12 changes. The change signal of the light intensity is converted into a current signal to the processing system _, and the processing system processes the position of the rotating shaft, and measures the vibration structure of the rotating shaft in combination with the time and outputs it through the output device. [0013] It can be understood that, if not required, the result output device can be omitted, and the control device directly controls the operation of the machine according to the measurement or monitoring result. In addition, the vibration measuring and monitoring system of the present invention can also be used for other non-rotating axes. The vibration is measured and monitored. [0014] Please refer to the third to fifth figures, the vibration measurement and monitoring method is applied to the principle of the laser knife edge method, and the following is the realization of the vibration measurement and monitoring method 094130340 Form No. A0101 Page 6 of 17 1003358718-0 13.56160 100^.09^ 30 a The principle depends on the basic transverse electromagnetic mode oscillation, and the resulting beam intensity is a Gaussian spatial distribution. The laser beam 13 is called a Gaussian beam. The electric field distribution, as shown in the third figure, if expressed in a mathematical model, can be written as: [0015] -x, exp(-W{zy W%)] (a) [0016] exp. (b) (Eq -l) # [0017] ---(c) Fine PhM;: /:> * f. ·, [0018] The first term (a) after the equal sign is an amplitude factor (Ampiitude factor) Indicates the relationship between the amplitude r and the change; the second term (b) is the phase change of the optical wave along the axial direction z; the third term (c) is the phase change of the optical wave along the radial direction (Radial) r relationship. Wherein ' r = (x2 + y2) 0 · 5, W 〇 is the waist waist ra-dius, EQ is the electric field strength at the waist, .3⁄4 is the wavelength, and j is the imaginary symbol. On this plane, the radius of curvature of the wave front (R) is (, which is a plane and the diameters of the beams are the smallest (z) and R (z) are the distances from the waist of the beam. The radius of the spot on the plane of z (Spot size or Beam size) and the radius of curvature of the wavefront, and the wave number k=.u=., if the origin (z = 0) is set at the waist, 1003358718-0 094130340 Form No. A0101 Page 7 / Total 17 Page 1356160 [0022] [0022] 100 years. September 30th 30th

= (Eq-2} 观ύ: ' Σ^, J ^)=0+( 41¾ 穿: ;(Eq-3) 上式中,= (Eq-2} Guanlan: ' Σ^, J ^)=0+( 413⁄4 wear: ;(Eq-3) In the above formula,

iJ:^定義為雷利範面(Rayleigh^丁 range ),束腰(Waist)處距離為、(2=^)之平面上其光 點面積正好為束腰面積(Waist area)之兩倍 且其波曲率半徑R為最小。 當光束傳播距離Z>>ZR時,RSiz,WK 1 ,高斯光束 近似一位於腰部之點光源發出之光,其法發散角(Di一 vergence angle)可近似為: 卜:4__1」·响_4) 由此可見W〇及4決定了高斯光束之所有性質。 由於光波之電場變化甚快,故於檢測上皆以光強度之方 式處理。而通常檢測系統係檢測到光之強度分佈而不是 振幅,因此由( Eq-l)式和其公耗複數相乘而得光之強 度分佈,以直角坐標表之如下:iJ:^ is defined as Rayleigh's face, and the distance at the waist (Waist) is (2=^), and the spot area is exactly twice the waist area (Waist area). The wave radius of curvature R is the smallest. When the beam travels by a distance Z>>ZR, the RSiz, WK1, Gaussian beam approximates a light emitted by a point source located at the waist, and its divergence angle can be approximated as follows: Bu: 4__1"·响_ 4) It can be seen that W〇 and 4 determine all the properties of the Gaussian beam. Since the electric field of the light wave changes very quickly, it is processed in the manner of light intensity in the detection. In general, the detection system detects the intensity distribution of light rather than the amplitude. Therefore, the intensity distribution of light is obtained by multiplying (Eq-l) and its common consumption complex number, as shown in the Cartesian coordinate table as follows:

[0023] [0024] [0025] [0026][0025] [0025] [0026]

094130340 表單編號Α0101 第8頁/共17頁 1003358718-0 [0027]094130340 Form NumberΑ0101 Page 8 of 17 1003358718-0 [0027]

1356160 > I1356160 > I

[0028] :2取,八HO-八)] ~~W- 100年09i· 30日按正替換頁 (Eq-5) _《中X。’ Υ。疋光束之中心;為光束中心點之光強 度;WS光束截面半徑(spot—Size或beam size), 是高斯光束之半徑,定義成:光強度丨自中心點向兩邊 -2 w 降至S之e (約為〇. 1353倍)時,兩點間跨越距離之一半[0028] : 2 fetch, eight HO-eight)] ~~W- 100 years 09i · 30th press positive replacement page (Eq-5) _ "Zhong X. ‘ Υ. The center of the beam; the intensity of the light at the center of the beam; the radius of the WS beam (spot-Size or beam size), which is the radius of the Gaussian beam, defined as: the intensity of the light from the center point to the sides - 2 w to S e (about 〇. 1353 times), one half of the distance between two points

[0〇3〇]請同時參閱第一圖與第四圖,假定掃描之方向是χ軸,則 未被旋轉軸ίο遮避之部分雷射光束13,經由感測器121所 接受之光強度信號為: [0031] [0032] ..(Eq-6)[0〇3〇] Please refer to the first and fourth figures at the same time, assuming that the direction of the scan is the x-axis, the portion of the laser beam 13 that is not obscured by the axis of rotation ίο, the light intensity received by the sensor 121 The signal is: [0031] [0032] .. (Eq-6)

[0033] %2(χ^:χύ)ΐ W^: :ik [0034] 其中Xa為旋轉軸10邊緣於x坐標轴所在位置。 [0035] 由上式(Eq-6)可得到整個雷射光束區域之光強度分佈 曲線如第五(A)圖所示。今考慮兩個位置之相應差值, 亦即所對應之光強度信號差為: 094130340 表單編號A0101 第9頁/共17·[頁 〜:’ 1003358718-0 [0036] [0037]1356160 (Eq-7) 上式(Eq-7)之結果相當於第五(B)圖中類似狹縫區域 部分之光強度作積分。 [0038] 若將S(xa)除上雷射總能量引起之信號S( 〇〇);即全部雷射 光束13未被遮斷(xa 4 之總能量信號,則可將 S(xa)做正規化處理,得一無因次量光強度信號,抵抗因 環境撓動造成量測信號之變化為: [0039][0033] %2(χ^:χύ)ΐ W^: :ik [0034] where Xa is the position of the axis of the rotation axis 10 at the x coordinate axis. The light intensity distribution curve of the entire laser beam region can be obtained by the above formula (Eq-6) as shown in the fifth (A) diagram. Now consider the corresponding difference between the two positions, that is, the corresponding light intensity signal difference is: 094130340 Form No. A0101 Page 9 / Total 17 · [Page ~: '1003358718-0 [0036] [0037] 1356160 (Eq- 7) The result of the above formula (Eq-7) is equivalent to the integration of the light intensity of the portion of the slit region in the fifth (B) diagram. [0038] If S(xa) is divided by the signal S(〇〇) caused by the total energy of the laser; that is, all the laser beams 13 are not interrupted (the total energy signal of xa 4, then S(xa) can be made The normalization process produces a dimensionless light intensity signal that resists changes in the measured signal due to environmental deflection: [0039]

(Eq-8)(Eq-8)

[0040] 藉由以上所述數學模型,通過被測轉轴阻斷光源與光感 測器之間之光束,造成感測器表面光強度變化,利用光 感測器測知光強度變化輸出變化之電流訊號,再經過 ADC(類比-數位轉換器 ’Analog-Digital CQnvei^e]^ 轉換後以電腦或微處理器經Eq-7、Eq-8計算到轉轴位置 ,結合時間轴之測量,則可以得到轉軸之振動量。 [0041] 综上所述,本發明確已符合發明專利要件,麦依法提出 專利申請》惟,以上所述者僅為本發明之較佳實施例, 舉凡熟悉本案技藝之人士’於援依本案發明精神所作之 等效修飾或變化,皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 [0042] 第一圖係本發明振動測量及監控系統較佳實施方式之示 意圖; [0043] 094130340 第二圖係本發明振動測量及監控系統之雷射光源系統較 表單編號A0101 第10頁/共17頁 1003358Ή8-0 13,56160 1:00年.09月 30日核正_頁 佳實施方式示意圖; [0044] 第三圖係本發明振動測量及監控系統較佳實施方式振動 抑描不意圖, r [0045] 第四圖係高斯雷射光束之場分佈特性圖; [0046] 第五(Α)圖係高斯雷射光東之光強度分佈曲線圖; [0047] 第五(Β)圖係高斯雷射光束之光強度積分區域示意圖; [0048] 第六圖係習知振動測量示意圖。 • 【主要元件符號說明】 [0049] 振動測量及監控系統:1 [0050] 旋轉軸:10 [0051] 雷射光源系統:11 [0052] 雷射光源:111 [0053] 複數透鏡:112 φ [0054] 光感測系統:12 [0055] 光感測器:121 [0056] 光束:13 094130340 表單編號Α0101 第11頁/共17頁 1003358718-0[0040] With the mathematical model described above, the light beam between the light source and the light sensor is blocked by the measured rotating shaft, causing a change in the light intensity of the surface of the sensor, and the light intensity change output is detected by the light sensor. The current signal is converted by the ADC (analog-digital converter 'Analog-Digital CQnvei^e]^ to the position of the shaft by computer or microprocessor via Eq-7, Eq-8, combined with the measurement of the time axis. The vibration amount of the rotating shaft can be obtained. [0041] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and those skilled in the art are familiar with the present invention. Equivalent modifications or changes made by the person in the spirit of the invention shall be included in the following patent application. [Simplified illustration] [0042] The first figure is preferably the vibration measuring and monitoring system of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [0043] 094130340 The second figure is a laser light source system of the vibration measuring and monitoring system of the present invention. Form No. A0101 Page 10 of 17 Page 1003358Ή8-0 13,56160 1:00年.09月30 Japanese nuclear BRIEF DESCRIPTION OF THE DRAWINGS [0044] The third figure is a vibration suppression and monitoring system of the present invention. FIG. 4 is a field distribution characteristic diagram of a Gaussian laser beam; 0046] The fifth (Α) graph is a light intensity distribution curve of the Gaussian laser light; [0047] The fifth (Β) graph is a schematic diagram of the light intensity integral region of the Gaussian laser beam; [0048] Schematic diagram of vibration measurement. • [Main component symbol description] [0049] Vibration measurement and monitoring system: 1 [0050] Rotary axis: 10 [0051] Laser source system: 11 [0052] Laser source: 111 [0053] Complex lens :112 φ [0054] Light sensing system: 12 [0055] Light sensor: 121 [0056] Light beam: 13 094130340 Form number Α 0101 Page 11 / Total 17 pages 1003358718-0

Claims (1)

1356160 _.__ 100年.09月· 30日孩正替&頁 七、申請專利範圍: 1 . 一種振動測量及監控系統,用以對一被測物之振動進行測 量或監控,其包括: 一雷射光源系統,該雷射光源系統可發封一雷射光束; 一光感測系統,該光感測系統與上述雷射系統相對設置, 用以感測上述雷射系統發出之雷射光束傳輸至光感測系統 之光強度變化,該光強度變化為 ,其中 dx1356160 _.__ 100 years. September 30th 30th Child's Correction & Page 7 Scope of Application: 1. A vibration measurement and monitoring system for measuring or monitoring the vibration of a measured object, including: a laser light source system capable of emitting a laser beam; a light sensing system disposed opposite the laser system for sensing a laser emitted by the laser system The change in light intensity transmitted by the beam to the light sensing system, where the light intensity changes to, where dx ,X代表坐標軸,xa代表被測物在X坐標軸所在位置,χΟ 是光束的中心,W為光束截面半徑,上述被測物部分阻斷 雷射光源系統及光感測系統之間之光束; 一處理系統接收光感測系統輸出之訊號經轉換處理計算被 測物之位置,再結合時間之量測,計算處理出被測物之振 動結構。 2 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該振動測量及監控系統進一步包括一結果輸出裝置。 3 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該雷射光源系統由雷射光源與複數透鏡構成。 4 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該雷射光源係氣體雷射器。 5 .如申請專利範圍第1項或第4項所述之振動測量及監控系統 ,其中該雷射光源係氦-氖雷射器。 6 .如申請專利範圍第1項所述之振動測量及監控系統,其申 該雷射光束為平行光束。 094130340 表單编號A0101 第12頁/共17頁 1003358718-0 13.56160 100年.09月·30日修正替換頁 7 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該雷射光束為高斯光束。 8 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該光感測系統包括一光感測器。 9 .如申請專利範圍第8項所述之振動測量及監控系統,其中 該光感測器爲光敏二極體。 1〇 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該處理系統爲一電腦系統。 11 .如申請專利範圍第1項所述之振動測量及監控系統,其中 該處理系統爲一微處理器。 12 .如申請專利範圍第2項所述之振動測量及監控系統,其中 該結果輸出裝置爲一顯示介面。 13 .如申請專利範圍第2項所述之振動測量及監控系統,其中 該結果輸出裝置爲一列印設備。 14 .如申請專利範圍第2項所述之振動測量及監控系統,其中 該結果輸出裝置爲一報警系統。 094130340 表單編號Α0101 第13頁/共17頁 1003358718-0X represents the coordinate axis, xa represents the position of the object under the X coordinate axis, χΟ is the center of the beam, W is the beam section radius, and the above-mentioned object is partially blocked by the beam between the laser source system and the light sensing system. A processing system receives the signal outputted by the light sensing system, calculates the position of the measured object through conversion processing, and combines the measurement of the time to calculate and process the vibration structure of the measured object. 2. The vibration measuring and monitoring system of claim 1, wherein the vibration measuring and monitoring system further comprises a result output device. 3. The vibration measuring and monitoring system of claim 1, wherein the laser light source system is composed of a laser light source and a plurality of lenses. 4. The vibration measuring and monitoring system of claim 1, wherein the laser source is a gas laser. 5. The vibration measuring and monitoring system of claim 1 or 4, wherein the laser source is a 氦-氖 laser. 6. The vibration measuring and monitoring system of claim 1, wherein the laser beam is a parallel beam. 094130340 Form No. A0101 Page 12 of 17 1003358718-0 13.56160 100 years. September 30th, 30th revised replacement page 7. The vibration measuring and monitoring system according to claim 1, wherein the laser beam It is a Gaussian beam. 8. The vibration measuring and monitoring system of claim 1, wherein the light sensing system comprises a light sensor. 9. The vibration measuring and monitoring system of claim 8, wherein the photo sensor is a photosensitive diode. The vibration measuring and monitoring system of claim 1, wherein the processing system is a computer system. 11. The vibration measuring and monitoring system of claim 1, wherein the processing system is a microprocessor. 12. The vibration measuring and monitoring system of claim 2, wherein the result output device is a display interface. 13. The vibration measuring and monitoring system of claim 2, wherein the result output device is a printing device. 14. The vibration measuring and monitoring system of claim 2, wherein the result output device is an alarm system. 094130340 Form No. Α0101 Page 13 of 17 1003358718-0
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TWI689708B (en) * 2018-12-24 2020-04-01 財團法人工業技術研究院 Vibration sensor with monitoring function and vibration signal monitoring method thereof

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TWI689708B (en) * 2018-12-24 2020-04-01 財團法人工業技術研究院 Vibration sensor with monitoring function and vibration signal monitoring method thereof
US11193819B2 (en) 2018-12-24 2021-12-07 Industrial Technology Research Institute Vibration sensor with monitoring function and vibration signal monitoring method thereof

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