WO2018149009A1 - Method for manufacturing top-emitting oled display device and structure thereof - Google Patents

Method for manufacturing top-emitting oled display device and structure thereof Download PDF

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Publication number
WO2018149009A1
WO2018149009A1 PCT/CN2017/076771 CN2017076771W WO2018149009A1 WO 2018149009 A1 WO2018149009 A1 WO 2018149009A1 CN 2017076771 W CN2017076771 W CN 2017076771W WO 2018149009 A1 WO2018149009 A1 WO 2018149009A1
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emission type
top emission
auxiliary electrode
light emitting
layer
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PCT/CN2017/076771
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French (fr)
Chinese (zh)
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郝鹏
张育楠
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深圳市华星光电技术有限公司
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Publication of WO2018149009A1 publication Critical patent/WO2018149009A1/en

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00Manufacture or treatment of nanostructures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/824Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a method and a structure for fabricating a top emission type OLED display device.
  • OLED Organic Light Emitting Diode
  • OLED products are mainly used in small-sized mobile phones, tablet (Pad) screens, and larger TV (TV) screens.
  • Bottom OLEDs are limited by the aperture ratio, making it difficult to achieve high resolution. More and more practitioners are turning to the development of top-emitting OLEDs in the hope of achieving higher resolutions.
  • the cathode of the Top OLED uses a thinner transparent metal to connect to the edge circuit of the screen. Due to the need to balance the light transmittance, the thickness of the transparent cathode is thin, resulting in poor electrical conductivity.
  • the screen size is large, the center of the screen is far away from the electrode interface, and the long-distance current transmission causes the driving voltage to rise greatly, which is easy to cause a large difference in driving voltage between the edge of the screen and the OLED component at the center of the screen, that is, there is a voltage drop. (IR drop) problem, only relying on the correction of the drive circuit, it is difficult to effectively improve the IR drop, the screen will appear dark defects in the center. Therefore, it is necessary to improve the cathode of the Top OLED, improve the conductivity, and narrow the gap of the driving voltage.
  • One of the methods for improving the cathode of the Top OLED is to add an auxiliary electrode or an auxiliary wire on the transparent metal cathode of the Top OLED to increase the conductivity of the cathode layer to reduce the problem caused by the IR drop.
  • the direct fabrication of the auxiliary electrode on the transparent metal cathode is affected by a number of limitations: First, the metal material used as the transparent cathode is easily oxidized, and it is necessary to isolate the contamination of water, oxygen and other highly oxidizing substances; The organic luminescent material layer in the OLED will deteriorate at a higher temperature, which directly affects the performance of the OLED device, and its withstand process temperature generally does not exceed 80 °C.
  • the industry's focus on the solution is to add a transparent electrode similar to Indium Tin Oxide (ITO), which has a high process temperature, generally exceeding 150 ° C, which will destroy the organic light-emitting material layer in the OLED;
  • ITO Indium Tin Oxide
  • nano-silver pastes sintered at room temperature have been available, the solute of nano-silver pastes is generally water-based (for ease of evaporation), which oxidizes the transparent cathode material of the OLED.
  • An object of the present invention is to provide a method for fabricating a top emission type OLED display device, which can avoid damage to the organic light emitting material layer and the cathode by the existing auxiliary electrode process, enhance the conductivity of the cathode, and reduce the IR drop of the large size OLED display device. .
  • Another object of the present invention is to provide a top emission type OLED display device structure which has good cathode conductivity and low IR drop.
  • the present invention first provides a method for fabricating a top emission type OLED display device, comprising the following steps:
  • Step S1 providing a TFT array substrate
  • Step S2 preparing a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate;
  • Each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each of the top emission type OLEDs has a light emitting region, and a non-light emitting region other than the light emitting region;
  • Step S3 providing a package cover plate, and preparing an auxiliary electrode on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
  • Step S4 coating a single layer of nano gold spheres on the auxiliary electrode
  • Step S5 the auxiliary electrode and the nano gold ball prepared on the package cover plate are oriented toward the TFT array substrate, and the package cover plate and the TFT array substrate are packaged, so that the nano gold ball conduction auxiliary electrode and the top emission type OLED are transparent. cathode.
  • the TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; the anode of the top emission type OLED is prepared on the flat layer and Contacting the driving TFT; the step S4 applies a single-layer nano-gold ball on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT.
  • the step S2 prepares a top emission type OLED by an evaporation process or an inkjet printing process.
  • the step S2 further includes preparing a pixel defining layer between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer; the pixel defining layer has a via hole exposing a portion of the anode, the top emitting The area of the OLED corresponding to the via is a light-emitting area, and the other areas are non-light-emitting areas.
  • the step S3 adopts a yellow light process to prepare a metal wire, and the metal wire is used as an auxiliary electrode; Or use screen printing nano silver paste, nano silver paste as auxiliary electrode; or use inkjet printing nano silver paste, nano silver paste as auxiliary electrode.
  • the nano gold spheres include plastic microparticles, a nickel layer plated on the outer surface of the plastic microparticles, and a gold layer plated on the outer surface of the nickel layer; the step S4 uniformly mixes the nanogold spheres in a resin solvent or a package water absorbing material for coating. cloth.
  • the invention also provides a top emission type OLED display device structure, comprising:
  • each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each top emission type The OLED has a light emitting region, and a non-light emitting region other than the light emitting region;
  • An auxiliary electrode disposed on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
  • the nanogold ball conducts the auxiliary electrode and the transparent cathode of the top emission type OLED.
  • the TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; the anode of the top emission type OLED is prepared on the flat layer and Contact with the driving TFT; the nano gold ball is coated on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT.
  • the top emission type OLED display device structure further includes a pixel defining layer disposed between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer; the pixel defining layer has a via hole exposing a part of the anode
  • the area of the top emission type OLED corresponding to the via hole is a light emitting area, and the other areas are non-light emitting areas.
  • the auxiliary electrode is a metal wire or a nano silver paste; the nano gold ball includes plastic microparticles, a nickel layer plated on the outer surface of the plastic microparticles, and a gold layer plated on the outer surface of the nickel layer.
  • the invention also provides a method for fabricating a top emission type OLED display device, comprising the following steps:
  • Step S1 providing a TFT array substrate
  • Step S2 preparing a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate;
  • Each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each of the top emission type OLEDs has a light emitting region, and a non-light emitting region other than the light emitting region;
  • Step S3 providing a package cover plate, and preparing an auxiliary electrode on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
  • Step S4 coating a single layer of nano gold spheres on the auxiliary electrode
  • Step S5 the auxiliary electrode and the nano gold ball prepared on the package cover plate are oriented toward the TFT array substrate, and the package cover plate and the TFT array substrate are packaged, so that the nano gold ball conduction auxiliary electrode and the top emission type OLED are transparent.
  • the TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; and an anode of the top emission type OLED is prepared in a flat layer And contacting the driving TFT; the step S4 coating a single layer of nano gold balls on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT;
  • the step S2 adopts an evaporation process or an inkjet printing process to prepare a top emission type OLED.
  • the present invention provides a method for fabricating a top emission type OLED display device, wherein an auxiliary electrode is prepared on a portion of a package cover corresponding to a non-light emitting region of a top emission type OLED, and is coated on the auxiliary electrode
  • the nano gold ball after encapsulating the cover plate and the TFT array substrate, the nano gold ball conducting auxiliary electrode and the transparent cathode of the top emission type OLED can avoid damage to the organic light emitting material layer and the cathode by the auxiliary electrode process, and enhance The conductivity of the cathode reduces the IR drop of large OLED display devices.
  • the invention provides a top emission type OLED display device structure, wherein an auxiliary electrode is disposed on a package cover plate, and a single layer of nano gold balls is coated on the auxiliary electrode, and the auxiliary electrode and the top emission type OLED are guided by the nano gold ball.
  • the transparent cathode can enhance the conductivity of the cathode and reduce the IR drop of the large-sized OLED display device.
  • FIG. 1 is a flow chart showing a method of fabricating a top emission type OLED display device of the present invention
  • FIG. 2 is a schematic cross-sectional view showing the structure of a top emission type OLED display device of the present invention
  • FIG. 3 is a top plan view of a TFT array substrate in a top emission type OLED display device structure of the present invention
  • FIG. 4 is a bottom view of a package cover in a top emission type OLED display device structure of the present invention.
  • FIG. 5 is a schematic cross-sectional view showing a nano gold sphere in a structure of a top emission type OLED display device of the present invention.
  • the present invention first provides a method for fabricating a top emission type OLED display device, comprising the following steps:
  • step S1 the TFT array substrate 1 is provided.
  • the TFT array substrate 1 includes a plurality of switching TFTs T1 distributed in a matrix, a plurality of driving TFTs T2 connected to the switching TFT T1, and a cover TFT TFT T1 and a driving TFT T2.
  • Flat layer 18 the switching TFT T1 and the driving TFT T2 are both disposed on the base substrate 11; the switching TFT T1 includes a first gate 121 and a gate insulating layer disposed in this order from bottom to top. 13.
  • the driving TFT T2 includes a second gate 122 and a gate disposed in order from bottom to top.
  • the second source 163 and the second drain 164 are respectively in contact with the two sides of the second active layer 142, and the first drain 162 of the switching TFT T1 is in contact with the driving TFT T2.
  • Step S2 A plurality of top emission type OLEDs 3 distributed in a matrix form are prepared on the TFT array substrate 1.
  • each of the top emission type OLEDs 3 includes an anode 31, an organic light emitting material layer 32, and a transparent cathode 33 stacked in this order from bottom to top; each of the top emission type OLEDs 3 has a light emitting area A1 and a light emitting unit. Non-light-emitting area A2 other than area A1.
  • the step S2 prepares the top emission type OLED 3 by an evaporation process or an inkjet printing (IJP) process according to an existing top emission type OLED process.
  • IJP inkjet printing
  • the anode 31 of the top emission type OLED 3 is formed on the flat layer 18 and is in contact with the second drain 164 of the driving TFT T2.
  • the step S2 further includes preparing a pixel defining layer 2 between the anode 31 and the organic luminescent material layer 32 and between the flat layer 18 and the organic luminescent material layer 32.
  • the pixel defining layer 2 has a via hole 21 exposing a portion of the anode 31, the region of the top emission type OLED 3 corresponding to the via hole 21 being the light emitting region A1, and the other regions being the non-light emitting region A2.
  • Step S3 in conjunction with FIG. 3 and FIG. 4, a package cover 5 is provided, on which an auxiliary electrode 7 is prepared corresponding to a portion of the non-light-emitting region A2 of the top emission type OLED 3.
  • the step 3 is on the package cover 5 corresponding to the non-light-emitting area A2 of the top emission type OLED 3
  • the auxiliary electrode 7 is partially prepared, instead of directly preparing the auxiliary electrode on the transparent cathode of the top emission type OLED as in the prior art, without being limited by the process temperature, and there is no cathode or organic light emitting material layer which pollutes or destroys the top emission type OLED.
  • the process selection of the step 3 can be diversified, specifically, a yellow light process can be used to prepare a metal wire, such as a nano silver wire, and the metal wire is used as an auxiliary electrode 7; a screen printing nano silver paste can be used to nanometer Silver paste is used as the auxiliary electrode 7; inkjet printing nano silver paste can also be used, and nano silver paste is used as the auxiliary electrode 7. Regardless of the process used, damage to the organic light-emitting material layer 32 and the transparent cathode 33 can be avoided.
  • Step S4 in conjunction with FIG. 4, a single layer of nanogold balls 9 is coated on the auxiliary electrode 7.
  • the nano gold ball 9 includes plastic microparticles 91, a nickel layer 92 plated on the outer surface of the plastic microparticles 91, and a gold layer 93 plated on the outer surface of the nickel layer 92.
  • the nano gold spheres 9 are uniformly mixed in a resin solvent or a package water absorbing material for coating.
  • step S4 a single-layer nano-gold ball 9 is coated on the auxiliary electrode 7 corresponding to the position of the switching TFT T1 and the driving TFT T2.
  • the particle size of the nano gold sphere 9 should be carefully designed to ensure that the nano-gold ball 9 can realize the auxiliary electrode 7 and the top emission type OLED 3 after the package step 5 and the TFT array substrate 1 are packaged in the subsequent step S5.
  • the conduction of the transparent cathode 33 does not affect the underlying device due to too much pressure.
  • Step S5 in conjunction with FIG. 2 to FIG. 4, the auxiliary electrode 7 and the nano gold ball 9 prepared on the package cover 5 are oriented toward the TFT array substrate 1, and the package cover 5 and the TFT array substrate 1 are packaged to make nano
  • the gold ball 9 turns on the auxiliary electrode 7 and the transparent cathode 33 of the top emission type OLED 3.
  • the conduction of the auxiliary electrode 7 and the transparent cathode 33 of the top emission type OLED 3 by the nano gold ball 9 can enhance the conductivity of the transparent cathode 33, improve the conductivity of the transparent cathode 33, and reduce the IR drop of the large-sized OLED display device.
  • the present invention also provides a top emission type OLED display device structure.
  • the top emission type OLED display device structure includes:
  • the TFT array substrate 1 includes, in particular, a plurality of switching TFTs T1 distributed in a matrix, a plurality of driving TFTs T2 connected to the switching TFT T1, and a flat covering the switching TFT T1 and the driving TFT T2. Further, according to the conventional design, the switching TFT T1 and the driving TFT T2 are both disposed on the base substrate 11; the switching TFT T1 includes a first gate 121 and a gate which are sequentially disposed from bottom to top.
  • the driving TFT T2 includes a second gate sequentially disposed from bottom to top 122, the gate insulating layer 13, the second active layer 142, the etch stop layer 15, the second source 163 and the second drain 164, and the protective layer 17; wherein, the first source 161 and the first drain 162 Contacting the two sides of the first active layer 141 respectively, the second source 163 and the second drain 164 are respectively in contact with the two sides of the second active layer 142, and the switching TFT T1 The first drain 162 is in contact with the second gate 122 connected to the driving TFT T2;
  • each of the top emission type OLEDs 3 includes an anode 31, an organic light emitting material layer 32, and a transparent cathode 33 which are sequentially stacked from bottom to top.
  • Each top emission type OLED 3 has a light emitting area A1, and a non-light emitting area A2 other than the light emitting area A1;
  • a pixel defining layer 2 disposed between the anode 31 and the organic light emitting material layer 32 and between the flat layer 18 and the organic light emitting material layer 32; specifically, the pixel defining layer 2 has a via hole 21 exposing a portion of the anode 31
  • the area of the top emission type OLED 3 corresponding to the via hole 21 is the light emitting area A1, and the other area is the non-light emitting area A2;
  • the package cover 5 is a pair of the TFT array substrate 1; specifically, the material of the package cover 5 is preferably glass;
  • auxiliary electrode 7 disposed on a portion of the package cover 5 corresponding to the non-light-emitting region A2 of the top emission type OLED 3; specifically, the auxiliary electrode 7 is a metal wire or a nano silver paste;
  • the nano gold spheres 9 include plastic microparticles 91, a nickel layer 92 plated on the outer surface of the plastic microparticles 91, and A gold layer 93 plated on the outer surface of the nickel layer 92; the nano gold ball 9 is coated on the auxiliary electrode 7 corresponding to the position of the switching TFT T1 and the driving TFT T2.
  • the nano gold ball 9 turns on the auxiliary electrode 7 and the transparent cathode 33 of the top emission type OLED 3, can enhance the conductivity of the transparent cathode 33, improve the conductivity of the transparent cathode 33, and reduce the IR drop of the large-sized OLED display device. . It is to be noted that since the auxiliary electrode 7 is disposed on the package cover 5 corresponding to the non-light-emitting area A2 of the top emission type OLED 3, instead of being directly disposed on the transparent cathode of the top emission type OLED as in the prior art.
  • the process of the auxiliary electrode 7 is not limited by the process temperature, and there is no problem of polluting or destroying the cathode and the organic light-emitting material layer of the top emission type OLED, thereby avoiding damage to the organic light-emitting material layer and the cathode.
  • an auxiliary electrode is prepared on a portion of the package cover corresponding to the non-light emitting region of the top emission type OLED, and the nano gold ball is coated on the auxiliary electrode.
  • the nano gold ball conducts the auxiliary electrode and the transparent cathode of the top emission type OLED, thereby avoiding damage to the organic light emitting material layer and the cathode by the auxiliary electrode process, and enhancing the conductivity of the cathode. , reducing the IR drop of large-size OLED display devices.
  • the top emission type OLED display device structure of the invention the auxiliary electrode is disposed on the package cover plate, and a single layer of nano gold spheres is coated on the auxiliary electrode, and the auxiliary electrode of the nano gold ball is connected to the transparent cathode of the top emission type OLED It can enhance the conductivity of the cathode and reduce the IR drop of the large-sized OLED display device.

Abstract

Provided are a method for manufacturing a top-emitting OLED display device and a structure thereof. The method for manufacturing a top-emitting OLED display device comprises: preparing an auxiliary electrode (7) on a portion, corresponding to a non-light-emitting area (A2) of a top-emitting OLED (3), of a packaging cover plate (5); coating a golden nanosphere (9) on the auxiliary electrode (7); and after the packaging cover plate (5) and a TFT array substrate (1) are paired and packaged, the golden nanosphere (9) conducting the auxiliary electrode (7) and a transparent cathode (33) of the top-emitting OLED (3). The present invention can prevent the damage of a manufacture procedure of an auxiliary electrode to an organic light-emitting material layer and a cathode, enhance the conductivity of the cathode and reduce an IR drop of a large-size OLED display device.

Description

顶发射型OLED显示器件的制作方法及结构Top emission type OLED display device manufacturing method and structure 技术领域Technical field
本发明涉及显示技术领域,尤其涉及一种顶发射型OLED显示器件的制作方法及结构。The present invention relates to the field of display technologies, and in particular, to a method and a structure for fabricating a top emission type OLED display device.
背景技术Background technique
有机发光二极管(Organic Light Emitting Diode,OLED)显示器件以其自发光、全固态、高对比度等优点,成为近年来最具潜力的新型显示器件。Organic Light Emitting Diode (OLED) display devices have become the most promising new display devices in recent years due to their advantages of self-luminescence, solid state, and high contrast.
目前应用OLED的产品主要分在小尺寸的手机、平板电脑(Pad)屏幕和较大尺寸的电视(TV)屏幕等。Currently, OLED products are mainly used in small-sized mobile phones, tablet (Pad) screens, and larger TV (TV) screens.
在大尺寸OLED显示器件应用方向,市面上的产品大多采用底发射型(Bottom)结构,将OLED的阴极采用较厚的金属层。但随着分辨率的增长,Bottom OLED会受到开口率的限制,难以实现高分辨率。越来越多的从业者将精力转向顶发射型(Top)OLED的开发,以期望实现更高的分辨率。In the application direction of large-size OLED display devices, most of the products on the market use a bottom emission type (Bottom) structure, and the cathode of the OLED adopts a thick metal layer. However, as the resolution increases, Bottom OLEDs are limited by the aperture ratio, making it difficult to achieve high resolution. More and more practitioners are turning to the development of top-emitting OLEDs in the hope of achieving higher resolutions.
Top OLED的阴极使用较薄的透明金属,实现与屏幕边缘电路的连接。由于需兼顾透光率,透明阴极厚度较薄,导致导电能力差。在屏幕尺寸较大时,屏幕中心区域由于离电极接口较远,长距离的电流传输使其驱动电压上升较大,易造成屏幕边缘和屏幕中心的OLED元件的驱动电压差距大,即有电压降(IR drop)的问题,仅依靠对驱动电路做修正,难以有效改善IR drop,屏幕会出现中心亮度较暗的缺陷。因此,需对Top OLED的阴极进行改善,提升导电率,缩小驱动电压的差距。The cathode of the Top OLED uses a thinner transparent metal to connect to the edge circuit of the screen. Due to the need to balance the light transmittance, the thickness of the transparent cathode is thin, resulting in poor electrical conductivity. When the screen size is large, the center of the screen is far away from the electrode interface, and the long-distance current transmission causes the driving voltage to rise greatly, which is easy to cause a large difference in driving voltage between the edge of the screen and the OLED component at the center of the screen, that is, there is a voltage drop. (IR drop) problem, only relying on the correction of the drive circuit, it is difficult to effectively improve the IR drop, the screen will appear dark defects in the center. Therefore, it is necessary to improve the cathode of the Top OLED, improve the conductivity, and narrow the gap of the driving voltage.
对Top OLED的阴极进行改善的方法之一是在Top OLED的透明金属阴极之上增设辅助电极或辅助导线,来增加阴极层的导电率,以减少IR drop所带来的问题。但是,在透明金属阴极上直接制作辅助电极受到多个局限因素的影响:首先,用做透明阴极的金属材料极易被氧化,需隔绝水、氧及其它氧化性强的物质的污染;其次,OLED中的有机发光材料层在较高温度下会变质,直接影响到OLED器件的表现,其耐受制程温度一般不超过80℃。而目前业界聚焦的解决方案,其一是增设类似于氧化铟锡(Indium Tin Oxide,ITO)的透明电极,其制程温度较高,一般超过150℃,会破坏OLED中的有机发光材料层;另一种是采用纳米银线,但同样会受到纳米 银线烧结温度较高的困扰。虽然目前已有室温烧结的纳米银浆问世,但纳米银浆的溶质一般采用水基(为便于蒸发去除),会将OLED的透明阴极材料氧化。One of the methods for improving the cathode of the Top OLED is to add an auxiliary electrode or an auxiliary wire on the transparent metal cathode of the Top OLED to increase the conductivity of the cathode layer to reduce the problem caused by the IR drop. However, the direct fabrication of the auxiliary electrode on the transparent metal cathode is affected by a number of limitations: First, the metal material used as the transparent cathode is easily oxidized, and it is necessary to isolate the contamination of water, oxygen and other highly oxidizing substances; The organic luminescent material layer in the OLED will deteriorate at a higher temperature, which directly affects the performance of the OLED device, and its withstand process temperature generally does not exceed 80 °C. At present, the industry's focus on the solution is to add a transparent electrode similar to Indium Tin Oxide (ITO), which has a high process temperature, generally exceeding 150 ° C, which will destroy the organic light-emitting material layer in the OLED; One is to use nano silver wire, but it will also be nano The silver wire has a higher sintering temperature. Although nano-silver pastes sintered at room temperature have been available, the solute of nano-silver pastes is generally water-based (for ease of evaporation), which oxidizes the transparent cathode material of the OLED.
发明内容Summary of the invention
本发明的目的在于提供一种顶发射型OLED显示器件的制作方法,能够避免现有辅助电极制程对有机发光材料层与阴极的损伤,增强阴极的导电率,降低大尺寸OLED显示器件的IR drop。An object of the present invention is to provide a method for fabricating a top emission type OLED display device, which can avoid damage to the organic light emitting material layer and the cathode by the existing auxiliary electrode process, enhance the conductivity of the cathode, and reduce the IR drop of the large size OLED display device. .
本发明的另一目的在于提供一种顶发射型OLED显示器件结构,其阴极导电性能较好,IR drop较低。Another object of the present invention is to provide a top emission type OLED display device structure which has good cathode conductivity and low IR drop.
为实现上述目的,本发明首先提供一种顶发射型OLED显示器件的制作方法,包括如下步骤:To achieve the above object, the present invention first provides a method for fabricating a top emission type OLED display device, comprising the following steps:
步骤S1、提供TFT阵列基板;Step S1, providing a TFT array substrate;
步骤S2、在所述TFT阵列基板上制备出呈矩阵式分布的多个顶发射型OLED;Step S2, preparing a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate;
每一顶发射型OLED包括自下至上依次层叠的阳极、有机发光材料层、及透明阴极;每一顶发射型OLED具有发光区域、及除发光区域以外的及非发光区域;Each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each of the top emission type OLEDs has a light emitting region, and a non-light emitting region other than the light emitting region;
步骤S3、提供封装盖板,在封装盖板上对应顶发射型OLED的非发光区域的部分制备辅助电极;Step S3, providing a package cover plate, and preparing an auxiliary electrode on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
步骤S4、在所述辅助电极上涂布单层纳米金球;Step S4, coating a single layer of nano gold spheres on the auxiliary electrode;
步骤S5、使制备在封装盖板上的辅助电极与纳米金球朝向TFT阵列基板,对组封装盖板与TFT阵列基板并进行封装,使得纳米金球导通辅助电极与顶发射型OLED的透明阴极。Step S5, the auxiliary electrode and the nano gold ball prepared on the package cover plate are oriented toward the TFT array substrate, and the package cover plate and the TFT array substrate are packaged, so that the nano gold ball conduction auxiliary electrode and the top emission type OLED are transparent. cathode.
所述TFT阵列基板包括呈矩阵式分布的多个开关TFT、与开关TFT对应连接的多个驱动TFT、以及覆盖开关TFT与驱动TFT的平坦层;顶发射型OLED的阳极制备在平坦层上并与驱动TFT接触;所述步骤S4在辅助电极上对应避开开关TFT与驱动TFT的位置涂布单层纳米金球。The TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; the anode of the top emission type OLED is prepared on the flat layer and Contacting the driving TFT; the step S4 applies a single-layer nano-gold ball on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT.
所述步骤S2采用蒸镀工艺或喷墨打印工艺制备顶发射型OLED。The step S2 prepares a top emission type OLED by an evaporation process or an inkjet printing process.
所述步骤S2还包括制备位于阳极与有机发光材料层之间、及平坦层与有机发光材料层之间的像素定义层;所述像素定义层具有暴露出部分阳极的过孔,所述顶发射型OLED对应于所述过孔的区域为发光区域,其它区域为非发光区域。The step S2 further includes preparing a pixel defining layer between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer; the pixel defining layer has a via hole exposing a portion of the anode, the top emitting The area of the OLED corresponding to the via is a light-emitting area, and the other areas are non-light-emitting areas.
所述步骤S3采用黄光制程制备金属线,以所述金属线作为辅助电极; 或者采用丝网印刷纳米银浆,以纳米银浆作为辅助电极;再或者采用喷墨打印纳米银浆,以纳米银浆作为辅助电极。The step S3 adopts a yellow light process to prepare a metal wire, and the metal wire is used as an auxiliary electrode; Or use screen printing nano silver paste, nano silver paste as auxiliary electrode; or use inkjet printing nano silver paste, nano silver paste as auxiliary electrode.
所述纳米金球包括塑料微粒子、镀在塑料微粒子外表面的镍层、及镀在镍层外表面的金层;所述步骤S4将纳米金球均匀混合于树脂溶剂或封装吸水材料中进行涂布。The nano gold spheres include plastic microparticles, a nickel layer plated on the outer surface of the plastic microparticles, and a gold layer plated on the outer surface of the nickel layer; the step S4 uniformly mixes the nanogold spheres in a resin solvent or a package water absorbing material for coating. cloth.
本发明还提供一种顶发射型OLED显示器件结构,包括:The invention also provides a top emission type OLED display device structure, comprising:
TFT阵列基板;TFT array substrate;
设在所述TFT阵列基板上的呈矩阵式分布的多个顶发射型OLED;每一顶发射型OLED包括自下至上依次层叠的阳极、有机发光材料层、及透明阴极;每一顶发射型OLED具有发光区域、及除发光区域以外的及非发光区域;a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate; each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each top emission type The OLED has a light emitting region, and a non-light emitting region other than the light emitting region;
与TFT阵列基板对组的封装盖板;a package cover plate with a pair of TFT array substrates;
于封装盖板上对应顶发射型OLED的非发光区域的部分设置的辅助电极;An auxiliary electrode disposed on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
以及涂布在所述辅助电极上的单层纳米金球;And a single layer of nanogold spheres coated on the auxiliary electrode;
所述纳米金球导通辅助电极与顶发射型OLED的透明阴极。The nanogold ball conducts the auxiliary electrode and the transparent cathode of the top emission type OLED.
所述TFT阵列基板包括呈矩阵式分布的多个开关TFT、与开关TFT对应连接的多个驱动TFT、以及覆盖开关TFT与驱动TFT的平坦层;顶发射型OLED的阳极制备在平坦层上并与驱动TFT接触;所述纳米金球涂布在辅助电极上对应避开开关TFT与驱动TFT的位置。The TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; the anode of the top emission type OLED is prepared on the flat layer and Contact with the driving TFT; the nano gold ball is coated on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT.
所述顶发射型OLED显示器件结构还包括设在阳极与有机发光材料层之间、及平坦层与有机发光材料层之间的像素定义层;所述像素定义层具有暴露出部分阳极的过孔,所述顶发射型OLED对应于所述过孔的区域为发光区域,其它区域为非发光区域。The top emission type OLED display device structure further includes a pixel defining layer disposed between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer; the pixel defining layer has a via hole exposing a part of the anode The area of the top emission type OLED corresponding to the via hole is a light emitting area, and the other areas are non-light emitting areas.
所述辅助电极为金属线或纳米银浆;所述纳米金球包括塑料微粒子、镀在塑料微粒子外表面的镍层、及镀在镍层外表面的金层。The auxiliary electrode is a metal wire or a nano silver paste; the nano gold ball includes plastic microparticles, a nickel layer plated on the outer surface of the plastic microparticles, and a gold layer plated on the outer surface of the nickel layer.
本发明还提供一种顶发射型OLED显示器件的制作方法,包括如下步骤:The invention also provides a method for fabricating a top emission type OLED display device, comprising the following steps:
步骤S1、提供TFT阵列基板;Step S1, providing a TFT array substrate;
步骤S2、在所述TFT阵列基板上制备出呈矩阵式分布的多个顶发射型OLED;Step S2, preparing a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate;
每一顶发射型OLED包括自下至上依次层叠的阳极、有机发光材料层、及透明阴极;每一顶发射型OLED具有发光区域、及除发光区域以外的非发光区域; Each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each of the top emission type OLEDs has a light emitting region, and a non-light emitting region other than the light emitting region;
步骤S3、提供封装盖板,在封装盖板上对应顶发射型OLED的非发光区域的部分制备辅助电极;Step S3, providing a package cover plate, and preparing an auxiliary electrode on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
步骤S4、在所述辅助电极上涂布单层纳米金球;Step S4, coating a single layer of nano gold spheres on the auxiliary electrode;
步骤S5、使制备在封装盖板上的辅助电极与纳米金球朝向TFT阵列基板,对组封装盖板与TFT阵列基板并进行封装,使得纳米金球导通辅助电极与顶发射型OLED的透明阴极;Step S5, the auxiliary electrode and the nano gold ball prepared on the package cover plate are oriented toward the TFT array substrate, and the package cover plate and the TFT array substrate are packaged, so that the nano gold ball conduction auxiliary electrode and the top emission type OLED are transparent. cathode;
其中,所述TFT阵列基板包括呈矩阵式分布的多个开关TFT、与开关TFT对应连接的多个驱动TFT、以及覆盖开关TFT与驱动TFT的平坦层;顶发射型OLED的阳极制备在平坦层上并与驱动TFT接触;所述步骤S4在辅助电极上对应避开开关TFT与驱动TFT的位置涂布单层纳米金球;The TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; and an anode of the top emission type OLED is prepared in a flat layer And contacting the driving TFT; the step S4 coating a single layer of nano gold balls on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT;
其中,所述步骤S2采用蒸镀工艺或喷墨打印工艺制备顶发射型OLED。Wherein, the step S2 adopts an evaporation process or an inkjet printing process to prepare a top emission type OLED.
本发明的有益效果:本发明提供的一种顶发射型OLED显示器件的制作方法,在封装盖板上对应顶发射型OLED的非发光区域的部分制备辅助电极,在所述辅助电极上涂布纳米金球,对组封装盖板与TFT阵列基板并进行封装后,纳米金球导通辅助电极与顶发射型OLED的透明阴极,能够避免辅助电极制程对有机发光材料层与阴极的损伤,增强阴极的导电率,降低大尺寸OLED显示器件的IR drop。本发明提供的一种顶发射型OLED显示器件结构,将辅助电极设置在封装盖板上,并在辅助电极上涂布单层纳米金球,通过纳米金球导通辅助电极与顶发射型OLED的透明阴极,能够增强阴极的导电率,降低大尺寸OLED显示器件的IR drop。Advantageous Effects of Invention The present invention provides a method for fabricating a top emission type OLED display device, wherein an auxiliary electrode is prepared on a portion of a package cover corresponding to a non-light emitting region of a top emission type OLED, and is coated on the auxiliary electrode The nano gold ball, after encapsulating the cover plate and the TFT array substrate, the nano gold ball conducting auxiliary electrode and the transparent cathode of the top emission type OLED can avoid damage to the organic light emitting material layer and the cathode by the auxiliary electrode process, and enhance The conductivity of the cathode reduces the IR drop of large OLED display devices. The invention provides a top emission type OLED display device structure, wherein an auxiliary electrode is disposed on a package cover plate, and a single layer of nano gold balls is coated on the auxiliary electrode, and the auxiliary electrode and the top emission type OLED are guided by the nano gold ball. The transparent cathode can enhance the conductivity of the cathode and reduce the IR drop of the large-sized OLED display device.
附图说明DRAWINGS
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。The detailed description of the present invention and the accompanying drawings are to be understood,
附图中,In the drawings,
图1为本发明的顶发射型OLED显示器件的制作方法的流程图;1 is a flow chart showing a method of fabricating a top emission type OLED display device of the present invention;
图2为本发明的顶发射型OLED显示器件结构的剖面示意图;2 is a schematic cross-sectional view showing the structure of a top emission type OLED display device of the present invention;
图3为本发明的顶发射型OLED显示器件结构中TFT阵列基板的俯视示意图;3 is a top plan view of a TFT array substrate in a top emission type OLED display device structure of the present invention;
图4为本发明的顶发射型OLED显示器件结构中封装盖板的仰视示意图;4 is a bottom view of a package cover in a top emission type OLED display device structure of the present invention;
图5为本发明的顶发射型OLED显示器件结构中纳米金球的剖面示意图。 FIG. 5 is a schematic cross-sectional view showing a nano gold sphere in a structure of a top emission type OLED display device of the present invention.
具体实施方式detailed description
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。In order to further clarify the technical means and effects of the present invention, the following detailed description will be made in conjunction with the preferred embodiments of the invention and the accompanying drawings.
请参阅图1,结合图2至图4,本发明首先提供一种顶发射型OLED显示器件的制作方法,包括如下步骤:Referring to FIG. 1 , in conjunction with FIG. 2 to FIG. 4 , the present invention first provides a method for fabricating a top emission type OLED display device, comprising the following steps:
步骤S1、提供TFT阵列基板1。In step S1, the TFT array substrate 1 is provided.
具体地,如图2所示,所述TFT阵列基板1包括呈矩阵式分布的多个开关TFT T1、与开关TFT T1对应连接的多个驱动TFT T2、以及覆盖开关TFT T1与驱动TFT T2的平坦层18。进一步地,按照现有的常规设计,所述开关TFT T1与驱动TFT T2均设置在衬底基板11上;所述开关TFT T1包括自下至上依次设置的第一栅极121、栅极绝缘层13、第一有源层141、蚀刻阻挡层15、第一源极161与第一漏极162、及保护层17;所述驱动TFT T2包括自下至上依次设置的第二栅极122、栅极绝缘层13、第二有源层142、蚀刻阻挡层15、第二源极163与第二漏极164、及保护层17;其中,第一源极161与第一漏极162分别接触连接第一有源层141的两侧,第二源极163与第二漏极164分别接触连接第二有源层142的两侧,开关TFT T1的第一漏极162接触连接驱动TFT T2的第二栅极122。Specifically, as shown in FIG. 2, the TFT array substrate 1 includes a plurality of switching TFTs T1 distributed in a matrix, a plurality of driving TFTs T2 connected to the switching TFT T1, and a cover TFT TFT T1 and a driving TFT T2. Flat layer 18. Further, according to the conventional design, the switching TFT T1 and the driving TFT T2 are both disposed on the base substrate 11; the switching TFT T1 includes a first gate 121 and a gate insulating layer disposed in this order from bottom to top. 13. The first active layer 141, the etch stop layer 15, the first source 161 and the first drain 162, and the protective layer 17; the driving TFT T2 includes a second gate 122 and a gate disposed in order from bottom to top. a first insulating layer 161 and a second drain 164, and a protective layer 17; wherein the first source 161 and the first drain 162 are respectively in contact with each other On both sides of the first active layer 141, the second source 163 and the second drain 164 are respectively in contact with the two sides of the second active layer 142, and the first drain 162 of the switching TFT T1 is in contact with the driving TFT T2. Two gates 122.
步骤S2、在所述TFT阵列基板1上制备出呈矩阵式分布的多个顶发射型OLED 3。Step S2: A plurality of top emission type OLEDs 3 distributed in a matrix form are prepared on the TFT array substrate 1.
结合图2与图3,每一顶发射型OLED 3包括自下至上依次层叠的阳极31、有机发光材料层32、及透明阴极33;每一顶发射型OLED 3具有发光区域A1、及除发光区域A1以外的非发光区域A2。2 and FIG. 3, each of the top emission type OLEDs 3 includes an anode 31, an organic light emitting material layer 32, and a transparent cathode 33 stacked in this order from bottom to top; each of the top emission type OLEDs 3 has a light emitting area A1 and a light emitting unit. Non-light-emitting area A2 other than area A1.
具体地,该步骤S2按照现有的顶发射型OLED制程方式采用蒸镀工艺或喷墨打印(Ink-jet Printing,IJP)工艺制备所述顶发射型OLED 3。Specifically, the step S2 prepares the top emission type OLED 3 by an evaporation process or an inkjet printing (IJP) process according to an existing top emission type OLED process.
所述顶发射型OLED 3的阳极31制备在平坦层18上并与驱动TFT T2的第二漏极164接触。The anode 31 of the top emission type OLED 3 is formed on the flat layer 18 and is in contact with the second drain 164 of the driving TFT T2.
进一步地,所述步骤S2还包括制备位于阳极31与有机发光材料层32之间、及平坦层18与有机发光材料层32之间的像素定义层2。所述像素定义层2具有暴露出部分阳极31的过孔21,所述顶发射型OLED 3对应于所述过孔21的区域为发光区域A1,其它区域为非发光区域A2。Further, the step S2 further includes preparing a pixel defining layer 2 between the anode 31 and the organic luminescent material layer 32 and between the flat layer 18 and the organic luminescent material layer 32. The pixel defining layer 2 has a via hole 21 exposing a portion of the anode 31, the region of the top emission type OLED 3 corresponding to the via hole 21 being the light emitting region A1, and the other regions being the non-light emitting region A2.
步骤S3、结合图3与图4,提供封装盖板5,在封装盖板5上对应顶发射型OLED 3的非发光区域A2的部分制备辅助电极7。Step S3, in conjunction with FIG. 3 and FIG. 4, a package cover 5 is provided, on which an auxiliary electrode 7 is prepared corresponding to a portion of the non-light-emitting region A2 of the top emission type OLED 3.
该步骤3是在封装盖板5上对应顶发射型OLED 3的非发光区域A2的 部分制备辅助电极7,而不是像现有技术那样直接在顶发射型OLED的透明阴极上制备辅助电极,不受制程温度的限制,不存在污染或破坏顶发射型OLED的阴极与有机发光材料层的问题,因此该步骤3的制程选择可多样化,具体可采用黄光制程制备金属线,如纳米银线,以所述金属线作为辅助电极7;可采用丝网印刷纳米银浆,以纳米银浆作为辅助电极7;还可采用喷墨打印纳米银浆,以纳米银浆作为辅助电极7。无论采用何种制程,都能够避免对有机发光材料层32与透明阴极33的损伤。The step 3 is on the package cover 5 corresponding to the non-light-emitting area A2 of the top emission type OLED 3 The auxiliary electrode 7 is partially prepared, instead of directly preparing the auxiliary electrode on the transparent cathode of the top emission type OLED as in the prior art, without being limited by the process temperature, and there is no cathode or organic light emitting material layer which pollutes or destroys the top emission type OLED. Therefore, the process selection of the step 3 can be diversified, specifically, a yellow light process can be used to prepare a metal wire, such as a nano silver wire, and the metal wire is used as an auxiliary electrode 7; a screen printing nano silver paste can be used to nanometer Silver paste is used as the auxiliary electrode 7; inkjet printing nano silver paste can also be used, and nano silver paste is used as the auxiliary electrode 7. Regardless of the process used, damage to the organic light-emitting material layer 32 and the transparent cathode 33 can be avoided.
步骤S4、结合图4,在所述辅助电极7上涂布单层纳米金球9。Step S4, in conjunction with FIG. 4, a single layer of nanogold balls 9 is coated on the auxiliary electrode 7.
具体地,请参阅图5,所述纳米金球9包括塑料微粒子91、镀在塑料微粒子91外表面的镍层92、及镀在镍层92外表面的金层93。该步骤4将纳米金球9均匀混合于树脂溶剂或封装吸水材料中进行涂布。Specifically, referring to FIG. 5, the nano gold ball 9 includes plastic microparticles 91, a nickel layer 92 plated on the outer surface of the plastic microparticles 91, and a gold layer 93 plated on the outer surface of the nickel layer 92. In step 4, the nano gold spheres 9 are uniformly mixed in a resin solvent or a package water absorbing material for coating.
进一步地,该步骤S4在辅助电极7上对应避开开关TFT T1与驱动TFT T2的位置涂布单层纳米金球9。所述纳米金球9的粒径应经过缜密设计,保证后续步骤S5对组封装盖板5与TFT阵列基板1并进行封装后,纳米金球9既可以实现辅助电极7与顶发射型OLED 3的透明阴极33的导通,又不会因压力太大而影响下方器件。Further, in step S4, a single-layer nano-gold ball 9 is coated on the auxiliary electrode 7 corresponding to the position of the switching TFT T1 and the driving TFT T2. The particle size of the nano gold sphere 9 should be carefully designed to ensure that the nano-gold ball 9 can realize the auxiliary electrode 7 and the top emission type OLED 3 after the package step 5 and the TFT array substrate 1 are packaged in the subsequent step S5. The conduction of the transparent cathode 33 does not affect the underlying device due to too much pressure.
步骤S5、结合图2至图4,使制备在封装盖板5上的辅助电极7与纳米金球9朝向TFT阵列基板1,对组封装盖板5与TFT阵列基板1并进行封装,使得纳米金球9导通辅助电极7与顶发射型OLED 3的透明阴极33。Step S5, in conjunction with FIG. 2 to FIG. 4, the auxiliary electrode 7 and the nano gold ball 9 prepared on the package cover 5 are oriented toward the TFT array substrate 1, and the package cover 5 and the TFT array substrate 1 are packaged to make nano The gold ball 9 turns on the auxiliary electrode 7 and the transparent cathode 33 of the top emission type OLED 3.
通过纳米金球9导通辅助电极7与顶发射型OLED 3的透明阴极33,能够增强透明阴极33的导电率,提高所述透明阴极33的导电能力,降低大尺寸OLED显示器件的IR drop。The conduction of the auxiliary electrode 7 and the transparent cathode 33 of the top emission type OLED 3 by the nano gold ball 9 can enhance the conductivity of the transparent cathode 33, improve the conductivity of the transparent cathode 33, and reduce the IR drop of the large-sized OLED display device.
基于同一发明构思,本发明还提供一种顶发射型OLED显示器件结构。请同时参阅图2至图4,所述顶发射型OLED显示器件结构包括:Based on the same inventive concept, the present invention also provides a top emission type OLED display device structure. Please refer to FIG. 2 to FIG. 4 simultaneously, the top emission type OLED display device structure includes:
TFT阵列基板1;具体地,所述TFT阵列基板1包括呈矩阵式分布的多个开关TFT T1、与开关TFT T1对应连接的多个驱动TFT T2、以及覆盖开关TFT T1与驱动TFT T2的平坦层18;进一步地,按照现有的常规设计,所述开关TFT T1与驱动TFT T2均设置在衬底基板11上;所述开关TFT T1包括自下至上依次设置的第一栅极121、栅极绝缘层13、第一有源层141、蚀刻阻挡层15、第一源极161与第一漏极162、及保护层17;所述驱动TFT T2包括自下至上依次设置的第二栅极122、栅极绝缘层13、第二有源层142、蚀刻阻挡层15、第二源极163与第二漏极164、及保护层17;其中,第一源极161与第一漏极162分别接触连接第一有源层141的两侧,第二源极163与第二漏极164分别接触连接第二有源层142的两侧,开关TFT T1的 第一漏极162接触连接驱动TFT T2的第二栅极122;The TFT array substrate 1 includes, in particular, a plurality of switching TFTs T1 distributed in a matrix, a plurality of driving TFTs T2 connected to the switching TFT T1, and a flat covering the switching TFT T1 and the driving TFT T2. Further, according to the conventional design, the switching TFT T1 and the driving TFT T2 are both disposed on the base substrate 11; the switching TFT T1 includes a first gate 121 and a gate which are sequentially disposed from bottom to top. a pole insulating layer 13, a first active layer 141, an etch barrier layer 15, a first source 161 and a first drain 162, and a protective layer 17; the driving TFT T2 includes a second gate sequentially disposed from bottom to top 122, the gate insulating layer 13, the second active layer 142, the etch stop layer 15, the second source 163 and the second drain 164, and the protective layer 17; wherein, the first source 161 and the first drain 162 Contacting the two sides of the first active layer 141 respectively, the second source 163 and the second drain 164 are respectively in contact with the two sides of the second active layer 142, and the switching TFT T1 The first drain 162 is in contact with the second gate 122 connected to the driving TFT T2;
设在所述TFT阵列基板1上的呈矩阵式分布的多个顶发射型OLED 3;每一顶发射型OLED 3包括自下至上依次层叠的阳极31、有机发光材料层32、及透明阴极33;每一顶发射型OLED 3具有发光区域A1、及除发光区域A1以外的非发光区域A2;A plurality of top emission type OLEDs 3 arranged in a matrix on the TFT array substrate 1; each of the top emission type OLEDs 3 includes an anode 31, an organic light emitting material layer 32, and a transparent cathode 33 which are sequentially stacked from bottom to top. Each top emission type OLED 3 has a light emitting area A1, and a non-light emitting area A2 other than the light emitting area A1;
设在阳极31与有机发光材料层32之间、及平坦层18与有机发光材料层32之间的像素定义层2;具体地,所述像素定义层2具有暴露出部分阳极31的过孔21,所述顶发射型OLED 3对应于所述过孔21的区域为发光区域A1,其它区域为非发光区域A2;a pixel defining layer 2 disposed between the anode 31 and the organic light emitting material layer 32 and between the flat layer 18 and the organic light emitting material layer 32; specifically, the pixel defining layer 2 has a via hole 21 exposing a portion of the anode 31 The area of the top emission type OLED 3 corresponding to the via hole 21 is the light emitting area A1, and the other area is the non-light emitting area A2;
与TFT阵列基板1对组的封装盖板5;具体地,所述封装盖板5的材质优选玻璃;The package cover 5 is a pair of the TFT array substrate 1; specifically, the material of the package cover 5 is preferably glass;
于封装盖板5上对应顶发射型OLED 3的非发光区域A2的部分设置的辅助电极7;具体地,所述辅助电极7为金属线或纳米银浆;An auxiliary electrode 7 disposed on a portion of the package cover 5 corresponding to the non-light-emitting region A2 of the top emission type OLED 3; specifically, the auxiliary electrode 7 is a metal wire or a nano silver paste;
以及涂布在所述辅助电极7上的单层纳米金球9;具体地,请参阅图5,所述纳米金球9包括塑料微粒子91、镀在塑料微粒子91外表面的镍层92、及镀在镍层92外表面的金层93;所述纳米金球9涂布在辅助电极7上对应避开开关TFT T1与驱动TFT T2的位置。And a single layer of nano gold spheres 9 coated on the auxiliary electrode 7; specifically, referring to FIG. 5, the nano gold spheres 9 include plastic microparticles 91, a nickel layer 92 plated on the outer surface of the plastic microparticles 91, and A gold layer 93 plated on the outer surface of the nickel layer 92; the nano gold ball 9 is coated on the auxiliary electrode 7 corresponding to the position of the switching TFT T1 and the driving TFT T2.
所述纳米金球9导通辅助电极7与顶发射型OLED 3的透明阴极33,能够增强透明阴极33的导电率,提高所述透明阴极33的导电能力,降低大尺寸OLED显示器件的IR drop。值得注意的是,由于所述辅助电极7设置在封装盖板5上对应顶发射型OLED 3的非发光区域A2的部分,而不是像现有技术那样直接设置在顶发射型OLED的透明阴极上,辅助电极7的制程便不受制程温度的限制,不存在污染或破坏顶发射型OLED的阴极与有机发光材料层的问题,避免损伤有机发光材料层与阴极。The nano gold ball 9 turns on the auxiliary electrode 7 and the transparent cathode 33 of the top emission type OLED 3, can enhance the conductivity of the transparent cathode 33, improve the conductivity of the transparent cathode 33, and reduce the IR drop of the large-sized OLED display device. . It is to be noted that since the auxiliary electrode 7 is disposed on the package cover 5 corresponding to the non-light-emitting area A2 of the top emission type OLED 3, instead of being directly disposed on the transparent cathode of the top emission type OLED as in the prior art. The process of the auxiliary electrode 7 is not limited by the process temperature, and there is no problem of polluting or destroying the cathode and the organic light-emitting material layer of the top emission type OLED, thereby avoiding damage to the organic light-emitting material layer and the cathode.
综上所述,本发明的顶发射型OLED显示器件的制作方法,在封装盖板上对应顶发射型OLED的非发光区域的部分制备辅助电极,在所述辅助电极上涂布纳米金球,对组封装盖板与TFT阵列基板并进行封装后,纳米金球导通辅助电极与顶发射型OLED的透明阴极,能够避免辅助电极制程对有机发光材料层与阴极的损伤,增强阴极的导电率,降低大尺寸OLED显示器件的IR drop。本发明的顶发射型OLED显示器件结构,将辅助电极设置在封装盖板上,并在辅助电极上涂布单层纳米金球,通过纳米金球导通辅助电极与顶发射型OLED的透明阴极,能够增强阴极的导电率,降低大尺寸OLED显示器件的IR drop。In summary, in the method for fabricating the top emission type OLED display device of the present invention, an auxiliary electrode is prepared on a portion of the package cover corresponding to the non-light emitting region of the top emission type OLED, and the nano gold ball is coated on the auxiliary electrode. After encapsulating the cover plate and the TFT array substrate, the nano gold ball conducts the auxiliary electrode and the transparent cathode of the top emission type OLED, thereby avoiding damage to the organic light emitting material layer and the cathode by the auxiliary electrode process, and enhancing the conductivity of the cathode. , reducing the IR drop of large-size OLED display devices. The top emission type OLED display device structure of the invention, the auxiliary electrode is disposed on the package cover plate, and a single layer of nano gold spheres is coated on the auxiliary electrode, and the auxiliary electrode of the nano gold ball is connected to the transparent cathode of the top emission type OLED It can enhance the conductivity of the cathode and reduce the IR drop of the large-sized OLED display device.
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明后附的权利要求的保护范围。 As described above, those skilled in the art can have the technology according to the present invention. The various modifications and variations of the present invention are intended to be included within the scope of the appended claims.

Claims (14)

  1. 一种顶发射型OLED显示器件的制作方法,包括如下步骤:A method for fabricating a top emission type OLED display device includes the following steps:
    步骤S1、提供TFT阵列基板;Step S1, providing a TFT array substrate;
    步骤S2、在所述TFT阵列基板上制备出呈矩阵式分布的多个顶发射型OLED;Step S2, preparing a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate;
    每一顶发射型OLED包括自下至上依次层叠的阳极、有机发光材料层、及透明阴极;每一顶发射型OLED具有发光区域、及除发光区域以外的非发光区域;Each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each of the top emission type OLEDs has a light emitting region, and a non-light emitting region other than the light emitting region;
    步骤S3、提供封装盖板,在封装盖板上对应顶发射型OLED的非发光区域的部分制备辅助电极;Step S3, providing a package cover plate, and preparing an auxiliary electrode on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
    步骤S4、在所述辅助电极上涂布单层纳米金球;Step S4, coating a single layer of nano gold spheres on the auxiliary electrode;
    步骤S5、使制备在封装盖板上的辅助电极与纳米金球朝向TFT阵列基板,对组封装盖板与TFT阵列基板并进行封装,使得纳米金球导通辅助电极与顶发射型OLED的透明阴极。Step S5, the auxiliary electrode and the nano gold ball prepared on the package cover plate are oriented toward the TFT array substrate, and the package cover plate and the TFT array substrate are packaged, so that the nano gold ball conduction auxiliary electrode and the top emission type OLED are transparent. cathode.
  2. 如权利要求1所述的顶发射型OLED显示器件的制作方法,其中,所述TFT阵列基板包括呈矩阵式分布的多个开关TFT、与开关TFT对应连接的多个驱动TFT、以及覆盖开关TFT与驱动TFT的平坦层;顶发射型OLED的阳极制备在平坦层上并与驱动TFT接触;所述步骤S4在辅助电极上对应避开开关TFT与驱动TFT的位置涂布单层纳米金球。The method of fabricating a top emission type OLED display device according to claim 1, wherein the TFT array substrate comprises a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a cover switching TFT And a flat layer of the driving TFT; the anode of the top emission type OLED is prepared on the flat layer and in contact with the driving TFT; and the step S4 applies a single layer of nano gold spheres on the auxiliary electrode corresponding to the position of avoiding the switching TFT and the driving TFT.
  3. 如权利要求1所述的顶发射型OLED显示器件的制作方法,其中,所述步骤S2采用蒸镀工艺或喷墨打印工艺制备顶发射型OLED。The method of fabricating a top emission type OLED display device according to claim 1, wherein the step S2 is performed by using an evaporation process or an inkjet printing process to prepare a top emission type OLED.
  4. 如权利要求1所述的顶发射型OLED显示器件的制作方法,其中,所述步骤S2还包括制备位于阳极与有机发光材料层之间、及平坦层与有机发光材料层之间的像素定义层;所述像素定义层具有暴露出部分阳极的过孔,所述顶发射型OLED对应于所述过孔的区域为发光区域,其它区域为非发光区域。The method of fabricating a top emission type OLED display device according to claim 1, wherein the step S2 further comprises preparing a pixel defining layer between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer. The pixel defining layer has a via hole exposing a portion of the anode, the region of the top emission type OLED corresponding to the via hole is a light emitting region, and the other regions are non-light emitting regions.
  5. 如权利要求1所述的顶发射型OLED显示器件的制作方法,其中,所述步骤S3采用黄光制程制备金属线,以所述金属线作为辅助电极;或者采用丝网印刷纳米银浆,以纳米银浆作为辅助电极;再或者采用喷墨打印纳米银浆,以纳米银浆作为辅助电极。The method of fabricating a top emission type OLED display device according to claim 1, wherein the step S3 uses a yellow light process to prepare a metal line, the metal line is used as an auxiliary electrode, or a screen printing nano silver paste is used. The nano silver paste is used as an auxiliary electrode; or the nano silver paste is printed by inkjet, and the nano silver paste is used as an auxiliary electrode.
  6. 如权利要求1所述的顶发射型OLED显示器件的制作方法,其中,所述纳米金球包括塑料微粒子、镀在塑料微粒子外表面的镍层、及镀在镍 层外表面的金层;所述步骤S4将纳米金球均匀混合于树脂溶剂或封装吸水材料中进行涂布。The method of fabricating a top emission type OLED display device according to claim 1, wherein the nano gold spheres comprise plastic microparticles, a nickel layer plated on an outer surface of the plastic microparticles, and nickel plating a gold layer on the outer surface of the layer; the step S4 uniformly coating the nano gold spheres in a resin solvent or a package water absorbing material for coating.
  7. 一种顶发射型OLED显示器件结构,包括:A top emission type OLED display device structure, comprising:
    TFT阵列基板;TFT array substrate;
    设在所述TFT阵列基板上的呈矩阵式分布的多个顶发射型OLED;每一顶发射型OLED包括自下至上依次层叠的阳极、有机发光材料层、及透明阴极;每一顶发射型OLED具有发光区域、及除发光区域以外的非发光区域;a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate; each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each top emission type The OLED has a light emitting region and a non-light emitting region other than the light emitting region;
    与TFT阵列基板对组的封装盖板;a package cover plate with a pair of TFT array substrates;
    于封装盖板上对应顶发射型OLED的非发光区域的部分设置的辅助电极;An auxiliary electrode disposed on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
    以及涂布在所述辅助电极上的单层纳米金球;And a single layer of nanogold spheres coated on the auxiliary electrode;
    所述纳米金球导通辅助电极与顶发射型OLED的透明阴极。The nanogold ball conducts the auxiliary electrode and the transparent cathode of the top emission type OLED.
  8. 如权利要求7所述的顶发射型OLED显示器件结构,其中,所述TFT阵列基板包括呈矩阵式分布的多个开关TFT、与开关TFT对应连接的多个驱动TFT、以及覆盖开关TFT与驱动TFT的平坦层;顶发射型OLED的阳极制备在平坦层上并与驱动TFT接触;所述纳米金球涂布在辅助电极上对应避开开关TFT与驱动TFT的位置。The top emission type OLED display device structure according to claim 7, wherein the TFT array substrate comprises a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a cover switching TFT and a driving A flat layer of the TFT; an anode of the top emission type OLED is prepared on the flat layer and in contact with the driving TFT; and the nano gold ball is coated on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT.
  9. 如权利要求7所述的顶发射型OLED显示器件结构,还包括设在阳极与有机发光材料层之间、及平坦层与有机发光材料层之间的像素定义层;所述像素定义层具有暴露出部分阳极的过孔,所述顶发射型OLED对应于所述过孔的区域为发光区域,其它区域为非发光区域。The top emission type OLED display device structure according to claim 7, further comprising a pixel defining layer disposed between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer; the pixel defining layer has an exposure A via of a portion of the anode is formed, the region of the top emission type OLED corresponding to the via is a light emitting region, and the other regions are non-light emitting regions.
  10. 如权利要求7所述的顶发射型OLED显示器件结构,其中,所述辅助电极为金属线或纳米银浆;所述纳米金球包括塑料微粒子、镀在塑料微粒子外表面的镍层、及镀在镍层外表面的金层。The top emission type OLED display device structure according to claim 7, wherein the auxiliary electrode is a metal wire or a nano silver paste; the nano gold ball comprises plastic microparticles, a nickel layer plated on an outer surface of the plastic microparticles, and plating A layer of gold on the outer surface of the nickel layer.
  11. 一种顶发射型OLED显示器件的制作方法,包括如下步骤:A method for fabricating a top emission type OLED display device includes the following steps:
    步骤S1、提供TFT阵列基板;Step S1, providing a TFT array substrate;
    步骤S2、在所述TFT阵列基板上制备出呈矩阵式分布的多个顶发射型OLED;Step S2, preparing a plurality of top emission type OLEDs arranged in a matrix on the TFT array substrate;
    每一顶发射型OLED包括自下至上依次层叠的阳极、有机发光材料层、及透明阴极;每一顶发射型OLED具有发光区域、及除发光区域以外的非发光区域;Each of the top emission type OLEDs includes an anode, an organic light emitting material layer, and a transparent cathode stacked in this order from bottom to top; each of the top emission type OLEDs has a light emitting region, and a non-light emitting region other than the light emitting region;
    步骤S3、提供封装盖板,在封装盖板上对应顶发射型OLED的非发光区域的部分制备辅助电极; Step S3, providing a package cover plate, and preparing an auxiliary electrode on a portion of the package cover corresponding to the non-light-emitting region of the top emission type OLED;
    步骤S4、在所述辅助电极上涂布单层纳米金球;Step S4, coating a single layer of nano gold spheres on the auxiliary electrode;
    步骤S5、使制备在封装盖板上的辅助电极与纳米金球朝向TFT阵列基板,对组封装盖板与TFT阵列基板并进行封装,使得纳米金球导通辅助电极与顶发射型OLED的透明阴极;Step S5, the auxiliary electrode and the nano gold ball prepared on the package cover plate are oriented toward the TFT array substrate, and the package cover plate and the TFT array substrate are packaged, so that the nano gold ball conduction auxiliary electrode and the top emission type OLED are transparent. cathode;
    其中,所述TFT阵列基板包括呈矩阵式分布的多个开关TFT、与开关TFT对应连接的多个驱动TFT、以及覆盖开关TFT与驱动TFT的平坦层;顶发射型OLED的阳极制备在平坦层上并与驱动TFT接触;所述步骤S4在辅助电极上对应避开开关TFT与驱动TFT的位置涂布单层纳米金球;The TFT array substrate includes a plurality of switching TFTs distributed in a matrix, a plurality of driving TFTs correspondingly connected to the switching TFTs, and a flat layer covering the switching TFTs and the driving TFTs; and an anode of the top emission type OLED is prepared in a flat layer And contacting the driving TFT; the step S4 coating a single layer of nano gold balls on the auxiliary electrode corresponding to the position of the switching TFT and the driving TFT;
    其中,所述步骤S2采用蒸镀工艺或喷墨打印工艺制备顶发射型OLED。Wherein, the step S2 adopts an evaporation process or an inkjet printing process to prepare a top emission type OLED.
  12. 如权利要求11所述的顶发射型OLED显示器件的制作方法,其中,所述步骤S2还包括制备位于阳极与有机发光材料层之间、及平坦层与有机发光材料层之间的像素定义层;所述像素定义层具有暴露出部分阳极的过孔,所述顶发射型OLED对应于所述过孔的区域为发光区域,其它区域为非发光区域。The method of fabricating a top emission type OLED display device according to claim 11, wherein the step S2 further comprises preparing a pixel defining layer between the anode and the organic light emitting material layer and between the flat layer and the organic light emitting material layer. The pixel defining layer has a via hole exposing a portion of the anode, the region of the top emission type OLED corresponding to the via hole is a light emitting region, and the other regions are non-light emitting regions.
  13. 如权利要求11所述的顶发射型OLED显示器件的制作方法,其中,所述步骤S3采用黄光制程制备金属线,以所述金属线作为辅助电极;或者采用丝网印刷纳米银浆,以纳米银浆作为辅助电极;再或者采用喷墨打印纳米银浆,以纳米银浆作为辅助电极。The method of fabricating a top emission type OLED display device according to claim 11, wherein the step S3 uses a yellow light process to prepare a metal line, the metal line is used as an auxiliary electrode, or a screen printing nano silver paste is used. The nano silver paste is used as an auxiliary electrode; or the nano silver paste is printed by inkjet, and the nano silver paste is used as an auxiliary electrode.
  14. 如权利要求11所述的顶发射型OLED显示器件的制作方法,其中,所述纳米金球包括塑料微粒子、镀在塑料微粒子外表面的镍层、及镀在镍层外表面的金层;所述步骤S4将纳米金球均匀混合于树脂溶剂或封装吸水材料中进行涂布。 The method of fabricating a top emission type OLED display device according to claim 11, wherein the nano gold spheres comprise plastic microparticles, a nickel layer plated on an outer surface of the plastic microparticles, and a gold layer plated on an outer surface of the nickel layer; In step S4, the nano gold spheres are uniformly mixed in a resin solvent or a package water absorbing material for coating.
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