CN112467015A - Flexible Mini LED packaging structure and preparation method thereof - Google Patents
Flexible Mini LED packaging structure and preparation method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Abstract
The invention relates to the technical field of Mini LED, in particular to a flexible Mini LED packaging structure and a preparation method thereof, wherein the flexible Mini LED packaging structure comprises a TFT driving device layer and more than two LED lamp beads, wherein a glass substrate, a reflecting layer, an organic buffer layer and a water-oxygen barrier layer are sequentially stacked on one end surface of the TFT driving device layer; the water oxygen barrier layer is provided with more than two focusing convex transparent layers, the focusing convex transparent layers are correspondingly arranged above the gap between every two adjacent LED lamp beads, the brightness of the Mini LED display is improved, the shadow area at the splicing seam is reduced, and the brightness uniformity of the whole display screen is improved.
Description
Technical Field
The invention relates to the technical field of Mini LEDs, in particular to a flexible Mini LED packaging structure and a preparation method thereof.
Background
Mini LED (also called Mini Light Emitting Diode) is a sub-millimeter Light Emitting Diode, and has the characteristics of being Light and thin, low in power consumption, good in flexibility, high in flexibility, good in color gamut range, capable of finely adjusting dimming partition energy, achieving higher HDR and high contrast, and capable of realizing a narrow-frame full-screen display device, and has become the key focus of market attention.
The Mini LED backlight source technology adopts a flip-chip packaging mode, so that the problem that the traditional side-entry backlight needs a lens secondary optical design is avoided, uniform light mixing is realized, and a higher contrast effect is achieved; the backlight of the Mini LED realizes dynamic regional dimming through array driving, realizes higher and fine color mixing, ensures that the contrast of an LCD screen is higher, compared with an OLED display, the Mini LED has the advantages of lower cost, longer service life and no screen burning phenomenon, and the Mini LED can be more widely applied in the display panel industry along with the continuous maturity of the Mini LED technology;
the Mini LED has high backlight brightness, and has high power consumption compared with the OLED, a reflecting film is adhered on a metal plate of a backlight source at present, and light irradiated on the metal plate by the LED is reflected to an LCD substrate through the emitting film, so that the light utilization rate of the LED is improved, and more fine high-brightness dimming is realized; however, the reflective film is high in manufacturing cost, the reflective film increases the product cost and increases the process steps, and the Mini LED display screen is inversely spliced together through small-distance LED lamp beads, splicing seams cannot be avoided, the display effect is influenced by the splicing seams, and the splicing gaps or the future development trend is reduced;
at present, a Mini LED screen is mostly driven by a metal oxide TFT, but the metal oxide TFT adopts an IGZO film as an active layer, the IGZO film is sensitive to water and oxygen, in the packaging process of the Mini LED display screen, LED lamp beads are packaged by coating silica gel after being solidified, the water and oxygen blocking capability of the silica gel is poor, the side edges of the LED lamp beads are easily corroded by water vapor, and the active layer IGZO film in the lower layer TFT drive easily causes device failure due to water and oxygen infection.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a flexible Mini LED packaging structure and a preparation method thereof are provided.
In order to solve the above technical problems, a first technical solution adopted by the present invention is:
the utility model provides a flexible Mini LED's packaging structure, includes TFT drive device layer and LED lamp pearl more than two range upon range of glass substrate, reflection stratum, organic buffer layer and the water oxygen barrier layer of being equipped with in proper order on the terminal surface on TFT drive device layer, more than two LED lamp pearl equidistant inlays to be established in organic buffer layer, a terminal surface and the contact of water oxygen barrier layer of LED lamp pearl, with another terminal surface relative with the reflection stratum contact of a terminal surface of LED lamp pearl, adjacent two be equipped with water oxygen absorption particle between the LED lamp pearl, water oxygen absorption particle inlays to be established in organic buffer layer, be equipped with the protruding layer of passing through of focus more than two on the terminal surface that organic buffer layer was kept away from to water oxygen barrier layer, the protruding layer of passing through of focus corresponds the clearance top that sets up between two adjacent LED lamp pearls.
The second technical scheme adopted by the invention is as follows:
a preparation method of a flexible Mini LED packaging structure comprises the following steps:
step S1, providing a glass substrate, and covering a TFT driving device layer on the glass substrate;
step S2, forming a reflecting layer, and covering one end face of the glass substrate far away from the TFT driving device layer;
s3, forming more than two LED lamp beads, wherein the more than two LED lamp beads are arranged on one side surface of the reflecting layer away from the glass substrate at equal intervals;
step S4, adding water and oxygen absorption particles into a gap between two adjacent LED lamp beads, and forming an organic buffer layer in the gap between the two adjacent LED lamp beads;
step S5, forming a water oxygen barrier layer and covering the surface of the organic buffer layer; the water-oxygen barrier layer is respectively contacted with more than two LED lamp beads;
step S6, forming a focusing convex layer and covering the surface of the water oxygen barrier layer; the focusing convex layer is correspondingly arranged above a gap between every two adjacent LED lamp beads.
The invention has the beneficial effects that:
more than two LED lamp beads are embedded in the organic buffer layer at equal intervals, and water and oxygen absorption particles are added into gaps among the LED lamp beads, so that the water and oxygen absorption particles can absorb water and oxygen permeating into the LED lamp beads, and the LED lamp beads are protected and the service life of the LED lamp beads is prolonged; the organic buffer layer can relieve stress concentration between the upper lamination layer and the lower lamination layer, has the function of isolating water and oxygen, improves the stability of the metal oxide TFT and the service life of devices, and realizes a flexible display effect with higher brightness; set up the protruding layer of focus more than two on the terminal surface of keeping away from organic buffer layer at water oxygen barrier layer, the protruding layer of focus corresponds the clearance top that sets up between two adjacent LED lamp pearls, has improved the luminance of Mini LED display, reduces the shadow area of concatenation seam department, improves the luminance homogeneity of whole display screen.
Drawings
Fig. 1 is a schematic structural diagram of a flexible Mini LED package structure according to the present invention;
fig. 2 is a flowchart illustrating steps of a method for manufacturing a flexible Mini LED package structure according to the present invention;
fig. 3 is a schematic process flow diagram of a manufacturing method of a flexible Mini LED package structure according to the present invention;
description of reference numerals:
1. a TFT drive device layer; 2. LED lamp beads; 3. a glass substrate; 4. a reflective layer; 5. an organic buffer layer; 6. a water oxygen barrier layer; 7. water oxygen absorbing particles; 8. and focusing the convex transparent layer.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a technical solution provided by the present invention:
the utility model provides a flexible Mini LED's packaging structure, includes TFT drive device layer and LED lamp pearl more than two range upon range of glass substrate, reflection stratum, organic buffer layer and the water oxygen barrier layer of being equipped with in proper order on the terminal surface on TFT drive device layer, more than two LED lamp pearl equidistant inlays to be established in organic buffer layer, a terminal surface and the contact of water oxygen barrier layer of LED lamp pearl, with another terminal surface relative with the reflection stratum contact of a terminal surface of LED lamp pearl, adjacent two be equipped with water oxygen absorption particle between the LED lamp pearl, water oxygen absorption particle inlays to be established in organic buffer layer, be equipped with the protruding layer of passing through of focus more than two on the terminal surface that organic buffer layer was kept away from to water oxygen barrier layer, the protruding layer of passing through of focus corresponds the clearance top that sets up between two adjacent LED lamp pearls.
From the above description, the beneficial effects of the present invention are:
more than two LED lamp beads are embedded in the organic buffer layer at equal intervals, and water and oxygen absorption particles are added into gaps among the LED lamp beads, so that the water and oxygen absorption particles can absorb water and oxygen permeating into the LED lamp beads, and the LED lamp beads are protected and the service life of the LED lamp beads is prolonged; the organic buffer layer can relieve stress concentration between the upper lamination layer and the lower lamination layer, has the function of isolating water and oxygen, improves the stability of the metal oxide TFT and the service life of devices, and realizes a flexible display effect with higher brightness; set up the protruding layer of focus more than two on the terminal surface of keeping away from organic buffer layer at water oxygen barrier layer, the protruding layer of focus corresponds the clearance top that sets up between two adjacent LED lamp pearls, has improved the luminance of Mini LED display, reduces the shadow area of concatenation seam department, improves the luminance homogeneity of whole display screen.
Further, the shape of the water and oxygen absorbing particles is circular, and the diameter range of the water and oxygen absorbing particles is
As can be seen from the above description, the water and oxygen absorbing particles are used for absorbing water and oxygen permeating into the LED lamp bead, preventing the water and oxygen from corroding the electrode pad and the lower reflecting layer, stabilizing the lower metal oxide TFT driving device, and setting the diameter range of the water and oxygen absorbing particles as
The brightness uniformity of the whole display screen can be further improved.
Further, the thickness of the water-oxygen barrier layer ranges from 0.15 μm to 0.3 μm.
From the above description, the water and oxygen barrier layer is beneficial to isolating external water and oxygen from invading into the display device and protecting the good display of the Mini LED display screen, and the brightness uniformity of the whole display screen can be further improved by setting the thickness range of the water and oxygen barrier layer to be 0.15-0.3 μm.
Furthermore, the focusing convex transparent layer is in a convex lens shape, the length and width ranges of the focusing convex transparent layer are both 0.3mm-0.6mm, and the thickness range of the focusing convex transparent layer is 0.5 μm-1.5 μm.
According to the description, the focusing convex transparent layer has the effects of weakening the weak display points of the splicing seams in the Mini LED display screen, reducing the shadow area of the splicing seams and improving the brightness uniformity of the whole display screen, wherein the weak display points are obvious in the splicing seams, the light reflected by the reflecting layer and the light of the LED lamp beads are partially focused at the splicing seams, the length and width ranges of the focusing convex transparent layer are set to be 0.3-0.6 mm, the thickness range of the focusing convex transparent layer is set to be 0.5-1.5 mu m, and the brightness uniformity of the whole display screen can be further improved.
Further, the thickness of the reflecting layer ranges from 0.1 μm to 0.2 μm.
As is apparent from the above description, setting the thickness range of the reflective layer to 0.1 μm to 0.2 μm can further improve the luminance of the display and protect the stability of the TFT driving.
Referring to fig. 2, another technical solution provided by the present invention:
a preparation method of a flexible Mini LED packaging structure comprises the following steps:
step S1, providing a glass substrate, and covering a TFT driving device layer on the glass substrate;
step S2, forming a reflecting layer, and covering one end face of the glass substrate far away from the TFT driving device layer;
s3, forming more than two LED lamp beads, wherein the more than two LED lamp beads are arranged on one side surface of the reflecting layer away from the glass substrate at equal intervals;
step S4, adding water and oxygen absorption particles into a gap between two adjacent LED lamp beads, and forming an organic buffer layer in the gap between the two adjacent LED lamp beads;
step S5, forming a water oxygen barrier layer and covering the surface of the organic buffer layer; the water-oxygen barrier layer is respectively contacted with more than two LED lamp beads;
step S6, forming a focusing convex layer and covering the surface of the water oxygen barrier layer; the focusing convex layer is correspondingly arranged above a gap between every two adjacent LED lamp beads.
From the above description, the beneficial effects of the present invention are:
more than two LED lamp beads are embedded in the organic buffer layer at equal intervals, and water and oxygen absorption particles are added into gaps among the LED lamp beads, so that the water and oxygen absorption particles can absorb water and oxygen permeating into the LED lamp beads, and the LED lamp beads are protected and the service life of the LED lamp beads is prolonged; the organic buffer layer can relieve stress concentration between the upper lamination layer and the lower lamination layer, has the function of isolating water and oxygen, improves the stability of the metal oxide TFT and the service life of devices, and realizes a flexible display effect with higher brightness; set up the protruding layer of focus more than two on the terminal surface of keeping away from organic buffer layer at water oxygen barrier layer, the protruding layer of focus corresponds the clearance top that sets up between two adjacent LED lamp pearls, has improved the luminance of Mini LED display, reduces the shadow area of concatenation seam department, improves the luminance homogeneity of whole display screen.
Further, the shape of the water and oxygen absorbing particles is circular, and the diameter range of the water and oxygen absorbing particles is
As can be seen from the above description, the water and oxygen absorbing particles are used for absorbing water and oxygen permeating into the LED lamp bead, preventing the water and oxygen from corroding the electrode pad and the lower reflecting layer, and stabilizing the lower metal oxideTFT drive device by setting the diameter range of water-oxygen absorbing particles to
The brightness uniformity of the whole display screen can be further improved.
Further, the thickness of the water-oxygen barrier layer ranges from 0.15 μm to 0.3 μm.
From the above description, the water and oxygen barrier layer is beneficial to isolating external water and oxygen from invading into the display device and protecting the good display of the Mini LED display screen, and the brightness uniformity of the whole display screen can be further improved by setting the thickness range of the water and oxygen barrier layer to be 0.15-0.3 μm.
Furthermore, the focusing convex transparent layer is in a convex lens shape, the length and width ranges of the focusing convex transparent layer are both 0.3mm-0.6mm, and the thickness range of the focusing convex transparent layer is 0.5 μm-1.5 μm.
According to the description, the focusing convex transparent layer has the effects of weakening the weak display points of the splicing seams in the Mini LED display screen, reducing the shadow area of the splicing seams and improving the brightness uniformity of the whole display screen, wherein the weak display points are obvious in the splicing seams, the light reflected by the reflecting layer and the light of the LED lamp beads are partially focused at the splicing seams, the length and width ranges of the focusing convex transparent layer are set to be 0.3-0.6 mm, the thickness range of the focusing convex transparent layer is set to be 0.5-1.5 mu m, and the brightness uniformity of the whole display screen can be further improved.
Further, the thickness of the reflecting layer ranges from 0.1 μm to 0.2 μm.
As is apparent from the above description, setting the thickness range of the reflective layer to 0.1 μm to 0.2 μm can further improve the luminance of the display and protect the stability of the TFT driving.
Referring to fig. 1, a first embodiment of the present invention is:
a flexible Mini LED packaging structure comprises a TFT driving device layer 1 and more than two LED lamp beads 2, a glass substrate 3, a reflecting layer 4, an organic buffer layer 5 and a water-oxygen barrier layer 6 are sequentially laminated on one end face of the TFT driving device layer 1, more than two LED lamp beads 2 are embedded in the organic buffer layer 5 at equal intervals, one end face of each LED lamp bead 2 is in contact with the water-oxygen barrier layer 6, the other end face opposite to one end face of the LED lamp beads 2 is contacted with the reflecting layer 4, water and oxygen absorption particles 7 are arranged between two adjacent LED lamp beads 2, the water and oxygen absorption particles 7 are embedded in the organic buffer layer 5, more than two focusing convex layers 8 are arranged on one end surface of the water and oxygen barrier layer 6 far away from the organic buffer layer 5, the focusing convex layer 8 is correspondingly arranged above the gap between every two adjacent LED lamp beads 2.
The thickness of the reflecting layer 4 ranges from 0.1 μm to 0.2 μm, preferably 0.15 μm, and the material of the reflecting layer 4 is not inferior to aluminum, chromium and platinum; this reflection stratum 4 plays as the reflection stratum 4 of LED lamp pearl 2, shines into the light of TFT drive direction with LED lamp pearl 2, and the reflection toward opposite direction can improve the luminance of display to the stability of protection TFT drive.
LED lamp bead 2 is inversely installed on reflecting layer 4 through huge energy transfer technology, and electrode pads of LED lamp bead 2 are connected with corresponding driving electrodes, then water oxygen absorption particles 7 are added between gaps of LED lamp bead 2, the shape of water oxygen absorption particles 7 is circular, and the diameter range of water oxygen absorption particles 7 is
Preferably, it is
The water and oxygen absorbing particles 7 are used for absorbing water and oxygen permeating into the LED lamp bead 2, preventing the water and oxygen from corroding electrode pads and a lower reflecting layer 4 and stabilizing a lower metal oxide TFT driving device, the material of the water and oxygen absorbing particles 7 is not limited to graphene and aluminum powder, an organic buffer layer 5 is coated on the basis of the above through IJP (ink jet printing), and the thickness of the organic buffer layer 5 ranges from 2 micrometers to 6 micrometers, and is preferably 4 micrometers; through UV solid forming, the organic buffer layer 5 is beneficial to fixing the LED lamp beads 2, relieving stress concentration between the upper lamination layer and the lower lamination layer and realizing flexible display of a display screen, and the material of the organic buffer layer 5 is not limited to organic silica gel and organic resin.
By PECVD (chemical vapor deposition)) Depositing a water oxygen barrier layer 6 on a machine table, wherein the thickness range of the water oxygen barrier layer 6 is 0.15-0.3 μm, and preferably 0.2 μm; the water oxygen barrier layer 6 is favorable for isolating external water oxygen from invading the display device and protecting good display of the Mini LED display screen, and the material of the water oxygen barrier layer 6 is not limited to SiNx、SiO2And Al2O3(ii) a Finally, printing a focusing convex-transparent layer 8 by IJP (ink jet printing) on the basis of the above, wherein the focusing convex-transparent layer 8 is in the shape of a convex lens, the length and width of the focusing convex-transparent layer 8 are both in the range of 0.3mm to 0.6mm, preferably 0.4mm, and the thickness of the focusing convex-transparent layer 8 is in the range of 0.5 μm to 1.5 μm, preferably 1 μm; the focusing convex transparent layer 8 has the effects that the display of the splicing seams in the Mini LED display screen is weakened to be dark, the display weakness of the splicing seams is obvious, the light reflected by the reflecting layer 4 and the light of the LED lamp beads 2 are partially focused at the splicing seams, the shadow area of the splicing seams is reduced, the brightness uniformity of the whole display screen is improved, the shape of the focusing convex transparent layer 8 is similar to that of a convex lens, and the focusing convex transparent layer is only coated above the splicing seams.
The packaging structure of the flexible Mini LED of this scheme design can overcome present Mini LED when the luminous chip is solid brilliant, and traditional silica gel can't completely cut off water oxygen, send LED lamp pearl 2 electrode oxidation, resistance grow, current fluctuation and LED lamp pearl 2 problem dark on the part to LED lamp pearl 2 adopts the array concatenation together, and the concatenation seam display effect is poor, the inhomogeneous problem of luminance is solved to this structure.
Referring to fig. 2 and fig. 3, a second embodiment of the present invention is:
referring to fig. 2, a method for manufacturing a flexible Mini LED package structure includes the following steps:
step S1, providing a glass substrate 3, and covering the glass substrate 3 with a TFT driving device layer 1;
step S2, forming a reflecting layer 4, and covering one end face, far away from the TFT driving device layer 1, of the glass substrate 3;
step S3, more than two LED lamp beads 2 are formed, and the more than two LED lamp beads 2 are arranged on one side surface of the reflecting layer 4 away from the glass substrate 3 at equal intervals;
step S4, adding water and oxygen absorption particles 7 into a gap between two adjacent LED lamp beads 2, and forming an organic buffer layer 5 in the gap between two adjacent LED lamp beads 2;
step S5, forming a water oxygen barrier layer 6, and covering the surface of the organic buffer layer 5; the water oxygen barrier layer 6 is respectively contacted with more than two LED lamp beads 2;
step S6, forming a focusing convex layer 8 which covers the surface of the water oxygen barrier layer 6; the focusing convex layer 8 is correspondingly arranged above the gap between every two adjacent LED lamp beads 2.
The shape of the water oxygen absorbing particles 7 is circular, and the diameter range of the water oxygen absorbing particles 7 is
Preferably 100 μm.
The thickness of the water oxygen barrier layer 6 is in the range of 0.15 μm to 0.3 μm, preferably 0.2 μm.
The focusing convex transparent layer 8 is in a convex lens shape, the length and width ranges of the focusing convex transparent layer 8 are both 0.3mm-0.6mm, preferably 0.4mm, and the thickness range of the focusing convex transparent layer 8 is 0.5 μm-1.5 μm, preferably 1 μm.
The thickness of the reflective layer 4 is in the range of 0.1 μm to 0.2 μm, preferably 0.15 μm.
Referring to fig. 3, a specific embodiment of the method for manufacturing the flexible Mini LED package structure includes:
the method comprises the following steps: preparing a metal oxide TFT driving device (namely a TFT driving device layer 1) on the front side of a glass substrate 3, and then preparing a reflecting layer 4 on the back side of the glass substrate 3, wherein the material of the reflecting layer 4 is not inferior to aluminum, chromium and platinum; the reflecting layer 4 is used as the reflecting layer 4 of the LED lamp bead 2, so that the LED lamp bead 2 irradiates light in the TFT driving direction and reflects the light in the opposite direction, the brightness of the display can be improved, and the stability of TFT driving is protected;
step two: the LED lamp beads 2 are inversely arranged on the reflecting layer 4 on the reverse side of the glass substrate 3 through a giant energy transfer technology, electrode pads of the LED lamp beads 2 are connected with corresponding driving electrodes, water and oxygen absorption particles 7 are added between gaps of the LED lamp beads 2, the water oxygen absorption particles 7 are used for absorbing water oxygen permeating into the LED lamp beads 2, preventing the water oxygen from corroding the electrode bonding pad and the lower reflecting layer 4, stabilizing the lower metal oxide TFT driving device, the water oxygen absorbing particle 7 material is not limited to graphene and aluminum powder, and on the basis of the above, a layer of organic buffer layer 5 is coated by IJP (ink jet printing), subjected to UV curing, the organic buffer layer 5 is beneficial to fixing the LED lamp bead 2 and relieving the stress concentration between the upper lamination layer and the lower lamination layer, the material of the organic buffer layer 5 is not limited to organic silica gel and organic resin;
step three: depositing a water oxygen barrier layer 6 on the basis of the second step by a PECVD (chemical vapor deposition) machine, wherein the water oxygen barrier layer 6 is favorable for isolating external water oxygen from invading the display device and protecting good display of the Mini LED display screen, and the material of the water oxygen barrier layer 6 is not limited to SiNx、SiO2And Al2O3(ii) a And finally, printing a focusing convex transparent layer 8 through IJP (ink jet printing), wherein the focusing convex transparent layer 8 is used for weakening the display weakness of the splicing seam in the Mini LED display screen, the display weakness of the splicing seam is obvious, the light reflected by the reflecting layer 4 and the light of the LED lamp beads 2 are partially focused at the splicing seam, the dark shadow area at the splicing seam is reduced, the brightness uniformity of the whole display screen is improved, and the focusing convex transparent layer 8 is similar to a convex lens in shape and is only coated above the splicing seam.
In summary, according to the flexible Mini LED packaging structure and the preparation method thereof provided by the invention, more than two LED lamp beads are embedded in the organic buffer layer at equal intervals, and the water and oxygen absorption particles are added in the gap between the LED lamp beads, so that the water and oxygen absorption particles can absorb the water and oxygen permeating into the LED lamp beads, thereby protecting the LED lamp beads and prolonging the service life of the LED lamp beads; the organic buffer layer can relieve stress concentration between the upper lamination layer and the lower lamination layer, has the function of isolating water and oxygen, improves the stability of the metal oxide TFT and the service life of devices, and realizes a flexible display effect with higher brightness; set up the protruding layer of focus more than two on the terminal surface of keeping away from organic buffer layer at water oxygen barrier layer, the protruding layer of focus corresponds the clearance top that sets up between two adjacent LED lamp pearls, has improved the luminance of Mini LED display, reduces the shadow area of concatenation seam department, improves the luminance homogeneity of whole display screen.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a packaging structure of flexible Mini LED, its characterized in that includes TFT drive device layer and LED lamp pearl more than two range upon range of glass substrate, reflection stratum, organic buffer layer and the water oxygen barrier layer of being equipped with in proper order on the terminal surface on TFT drive device layer, more than two LED lamp pearl equidistant inlays to be established in organic buffer layer, a terminal surface and the contact of water oxygen barrier layer of LED lamp pearl, with another terminal surface relative with the reflection stratum contact of a terminal surface of LED lamp pearl, adjacent two be equipped with water oxygen absorption granule between the LED lamp pearl, water oxygen absorption granule inlays to be established in organic buffer layer, be equipped with the protruding layer of focusing more than two on the terminal surface that organic buffer layer was kept away from to water oxygen barrier layer, the protruding layer of focusing corresponds the clearance top that sets up between two adjacent LED lamp pearls.
2. The flexible Mini LED package structure of claim 1, wherein the water and oxygen absorbing particles are circular in shape and have a diameter in the range of
3. The flexible Mini LED package structure of claim 1, wherein the water and oxygen barrier layer has a thickness in the range of 0.15 μm to 0.3 μm.
4. The flexible Mini LED package structure of claim 1, wherein the focusing convex transparent layer is in the shape of a convex lens, the length and width of the focusing convex transparent layer are both in the range of 0.3mm to 0.6mm, and the thickness of the focusing convex transparent layer is in the range of 0.5 μm to 1.5 μm.
5. The flexible Mini LED package structure of claim 1, wherein the reflective layer has a thickness in the range of 0.1 μm to 0.2 μm.
6. The method for preparing the packaging structure of the flexible Mini LED according to claim 1, comprising the following steps:
step S1, providing a glass substrate, and covering a TFT driving device layer on the glass substrate;
step S2, forming a reflecting layer, and covering one end face of the glass substrate far away from the TFT driving device layer;
s3, forming more than two LED lamp beads, wherein the more than two LED lamp beads are arranged on one side surface of the reflecting layer away from the glass substrate at equal intervals;
step S4, adding water and oxygen absorption particles into a gap between two adjacent LED lamp beads, and forming an organic buffer layer in the gap between the two adjacent LED lamp beads;
step S5, forming a water oxygen barrier layer and covering the surface of the organic buffer layer; the water-oxygen barrier layer is respectively contacted with more than two LED lamp beads;
step S6, forming a focusing convex layer and covering the surface of the water oxygen barrier layer; the focusing convex layer is correspondingly arranged above a gap between every two adjacent LED lamp beads.
7. The method for preparing the packaging structure of the flexible Mini LED according to claim 6, wherein the water and oxygen absorbing particles are circular in shape and have a diameter in the range of
8. The method for preparing the packaging structure of the flexible Mini LED according to claim 6, wherein the water and oxygen barrier layer has a thickness ranging from 0.15 μm to 0.3 μm.
9. The method for preparing the packaging structure of the flexible Mini LED according to claim 6, wherein the focusing convex transparent layer is in a shape of a convex lens, the length and width of the focusing convex transparent layer are both 0.3mm-0.6mm, and the thickness of the focusing convex transparent layer is 0.5 μm-1.5 μm.
10. The method for preparing the packaging structure of the flexible Mini LED according to claim 6, wherein the thickness of the reflective layer is in the range of 0.1 μm to 0.2 μm.
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