CN214123908U

CN214123908U - Flexible packaging heat radiation structure of Mini LED

Info

Publication number: CN214123908U
Application number: CN202022639708.5U
Authority: CN
Inventors: 温质康; 乔小平; 苏智昱
Original assignee: Fujian Huajiacai Co Ltd
Current assignee: Fujian Huajiacai Co Ltd
Priority date: 2020-11-16
Filing date: 2020-11-16
Publication date: 2021-09-03
Anticipated expiration: 2030-11-16

Abstract

The utility model relates to the technical field of Mini LED, in particular to a flexible packaging heat dissipation structure of Mini LED, which comprises a glass substrate and more than two LED lamp beads, a TFT driving device layer, an organic silica gel layer, a first water oxygen barrier layer, an organic buffer layer and a second water oxygen barrier layer are sequentially stacked on one side face of a glass substrate, an LED lamp bead comprises an LED chip and two electrode PIN PINs, the two electrode PIN PINs are embedded in the organic silica gel layer, one end of each electrode PIN extends out of the organic silica gel layer to be in contact with the first water oxygen barrier layer, a gap is arranged between the two electrode PIN PINs, water oxygen absorption particles are filled in the gap, a heat dissipation column is connected to each electrode PIN PIN, therefore, the temperature inside the panel can be uniformly and effectively diffused, the stability of the metal oxide TFT driver is improved, the service life of devices is prolonged, and the display effect with higher resolution and flexibility is realized.

Description

Flexible packaging heat radiation structure of Mini LED

Technical Field

The utility model relates to a Mini LED technical field, in particular to Mini LED's flexible packaging heat radiation structure.

Background

Mini LED (also called Mini Light Emitting Diode) is a sub-millimeter LED with a grain size of about 50 μm to 200 μm, and has the characteristics of being Light and thin, low power consumption, good flexibility, high flexibility, good color gamut range, fine adjustment of Light-adjusting partition energy, higher HDR, high contrast, and realization of narrow-frame full-screen display devices, and has become the key focus of market attention.

The Mini LED chip production comprises the processes of epitaxial wafer manufacturing, electrode manufacturing, chip manufacturing, testing and the like. Mini LED requires the LED die size to be reduced

And (3) a range. The backlight source technology adopts a flip-chip packaging mode, so that the problem that the traditional side-entry backlight needs a lens secondary optical design is avoided, uniform light mixing is realized, and a higher contrast effect is achieved; in addition, the backlight of the Mini LED realizes dynamic regional dimming through array driving, higher and more precise color modulation is realized, the contrast of an LCD screen is higher, and the picture display effect is improved;

mini LED is high in backlight brightness, and is higher than OLED power consumption, and along with the reduction of chip size, positive and negative electrodes cover most areas on the surface of a chip, and the LED chip emits light and heat for a long time, so that heat is easily concentrated in the glass substrate and cannot be dissipated, and a lower TFT driving device layer runs at a high temperature state for a long time, and the service life of a TFT driver and the stability of supply current are influenced.

At present, a Mini LED screen is mostly driven by a metal oxide TFT, but the metal oxide TFT adopts an IGZO film as an active layer, the IGZO film is sensitive to water and oxygen, in the packaging process of the Mini LED screen, the LED lamp beads are packaged by coating silica gel after being solidified, the water and oxygen blocking capability of the silica gel is poor, and the IGZO film is easy to cause device failure due to water and oxygen infection.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: a flexible packaging heat dissipation structure of a Mini LED is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be:

the utility model provides a Mini LED's flexible packaging heat radiation structure, includes glass substrate and two LED lamp pearls more than stack gradually on glass substrate's a side and be equipped with TFT drive device layer, organic silica gel layer, first water oxygen barrier layer, organic buffer layer and second water oxygen barrier layer, LED lamp pearl includes LED chip and two electrode PIN feet, the one end of LED chip contacts with two electrode PIN feet respectively, with the other end that the one end of LED chip is relative runs through first water oxygen barrier layer, organic buffer layer and second water oxygen barrier layer in proper order, two electrode PIN foot all inlays establishes in organic silica gel layer and the one end of electrode PIN foot stretches out organic silica gel layer and first water oxygen barrier layer contact, two be equipped with the clearance between the electrode PIN foot, it has water oxygen absorption particle, every to be connected with a heat dissipation post on the electrode PIN foot, the one end that the electrode PIN foot was kept away from to the heat dissipation post passes first water oxygen barrier layer and organic buffer layer to second water oxygen barrier layer in proper order In the water oxygen barrier layer.

The beneficial effects of the utility model reside in that:

by arranging more than two LED lamp beads, each LED lamp bead comprises an LED chip and two electrode PIN feet, the other end, opposite to one end of the LED chip, sequentially penetrates through a first water oxygen barrier layer, an organic buffer layer and a second water oxygen barrier layer, the two electrode PIN feet are embedded in the organic silica gel layer, one ends of the electrode PIN feet extend out of the organic silica gel layer to be contacted with the first water oxygen barrier layer, a gap is formed between the two electrode PIN feet, water oxygen absorption particles are filled in the gap, each electrode PIN foot is connected with a heat dissipation column, one end, far away from the electrode PIN feet, of each heat dissipation column sequentially penetrates through the first water oxygen barrier layer and the organic buffer layer to the second water oxygen barrier layer, so that the temperature inside a panel can be uniformly and effectively dissipated, the stability and the service life of a device of a metal oxide TFT driver are improved, and a higher resolution and a flexible display effect are realized; the first water oxygen barrier layer and the second water oxygen barrier layer are used for preventing external water oxygen from entering the inside of the Mini LED display, oxidizing and corroding an electrode bonding pad (namely an electrode PIN foot) of an LED chip and a TFT driving device layer, the organic buffer layer is used as a neutral layer to relieve stress concentration of upper and lower laminated layers, fill up defects in an inorganic film, prolong a water oxygen diffusion path and realize flexible display of high brightness and high contrast of the Mini LED; the flexible packaging heat dissipation structure of the Mini LED can improve the heat dissipation speed of the Mini LED display, stabilize the working environment of the Mini LED display, improve the capability of isolating water and oxygen of the Mini LED display by adopting flexible film packaging, and realize the high brightness and high contrast flexible display of the Mini LED display.

Drawings

Fig. 1 is a schematic structural diagram of a flexible packaging heat dissipation structure of a Mini LED according to the present invention;

description of reference numerals:

1. a glass substrate; 2. a TFT drive device layer; 3. an organic silica gel layer; 4. a first water oxygen barrier layer; 5. an organic buffer layer; 6. a second water oxygen barrier layer; 7. an LED chip; 8. an electrode PIN; 9. water oxygen absorbing particles; 10. a heat-dissipating stud.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1, the present invention provides a technical solution:

From the above description, the beneficial effects of the present invention are:

Further, the height of the heat dissipation column ranges from 2 μm to 4 μm.

From the above description, it can be known that setting the height range of the heat dissipation pillar to 2 μm-4 μm can uniformly and effectively dissipate the temperature inside the panel, further improve the stability and device lifetime of the metal oxide TFT driver, and achieve a higher resolution and flexible display effect.

Further, the shape of the water and oxygen absorbing particles is circular, and the diameter range of the water and oxygen absorbing particles is

As can be seen from the above description, the water and oxygen absorbing particles are used for absorbing water and oxygen permeating into the LED lamp bead, preventing the water and oxygen from corroding the electrode pad (i.e. the electrode PIN) and the lower TFT driving device layer, stabilizing the lower metal oxide TFT driving device, and setting the diameter range of the water and oxygen absorbing particles as

The brightness uniformity of the whole display screen can be further improved.

Further, the height range of the electrode PIN foot is 1.5-2.5 μm, and the thickness range of the organic silica gel layer is 1-2 μm.

Further, the thickness of the first water oxygen barrier layer ranges from 0.1 μm to 0.2 μm.

From the above description, the water and oxygen barrier layer is beneficial to isolating external water and oxygen from invading into the display device and protecting the good display of the Mini LED display screen, and the brightness uniformity of the whole display screen can be further improved by setting the thickness range of the first water and oxygen barrier layer to be 0.1-0.2 μm.

Referring to fig. 1, a first embodiment of the present invention is:

a flexible packaging heat dissipation structure of a Mini LED comprises a glass substrate 1 and more than two LED lamp beads, wherein a TFT driving device layer 2, an organic silica gel layer 3, a first water oxygen barrier layer 4, an organic buffer layer 5 and a second water oxygen barrier layer 6 are sequentially stacked on one side face of the glass substrate 1, each LED lamp bead comprises an LED chip 7 and two electrode PIN PINs 8, one end of each LED chip 7 is respectively contacted with the two electrode PIN PINs 8, the other end opposite to one end of each LED chip 7 sequentially penetrates through the first water oxygen barrier layer 4, the organic buffer layer 5 and the second water oxygen barrier layer 6, the two electrode PIN PINs 8 are embedded in the organic silica gel layer 3, one end of each electrode PIN PIN 8 extends out of the organic silica gel layer 3 to be contacted with the first water oxygen barrier layer 4, a gap is arranged between the two electrode PIN PINs 8, and water oxygen absorption particles 9 are filled in the gap, every be connected with a heat dissipation post 10 on the electrode PIN foot 8, the one end that electrode PIN foot 8 was kept away from to heat dissipation post 10 passes in first water oxygen barrier layer 4 and organic buffer layer 5 to second water oxygen barrier layer 6 in proper order.

The height of the heat dissipation pillar 10 is in the range of 2 μm to 4 μm, preferably 3 μm, and the material rating is not limited to silver, but may be other transparent metal oxides (e.g., ITO, AZO, etc.).

The shape of the water and oxygen absorbing particles 9 is circular, and the diameter range of the water and oxygen absorbing particles 9 is

The particles may have a size of

Or

Or

Or

Preferably, it is

The back surface of the LED lamp bead array-type distributed glass substrate 1 is positioned above the water and oxygen absorption particles 9, the electrode PIN 8 of the LED chip 7 is connected with the corresponding driving electrode, and the nano water and oxygen absorption particles 9 are used for independently absorbing the water and oxygen in the LED chip 7 at the corresponding position to independently protect the corresponding LED chip 7 from continuously spreading the water and oxygen all around.

The height range of the electrode PIN foot 8 is 1.5-2.5 μm, preferably 2 μm;

the thickness range of the organic silica gel layer 3 is 1-2 μm, preferably 1.5 μm, and the organic silica gel layer 3 can be obtained by spray deposition through an IJP (ink jet printing) machine.

The thickness of the first water oxygen barrier layer 4 ranges from 0.1 μm to 0.2 μm, and is preferably 0.15 μm; the first water oxygen barrier layer 4 may be obtained by PECVD (chemical vapor deposition);

the thickness of the second water oxygen barrier layer 6 ranges from 0.1 μm to 0.2 μm, and is preferably 0.15 μm; the second water oxygen barrier layer 6 may be obtained by PECVD (chemical vapor deposition);

the material of the first water oxygen barrier layer 4 is the same as that of the second water oxygen barrier layer 6, and the material is not limited to SiN_x、SiO₂SiNC and Al₂O₃And the like inorganic compounds; the first water oxygen barrier layer 4 and the second water oxygen barrier layer 6 are used for preventing external water oxygen from entering the inside of the Mini LED display, oxidizing and corroding the electrode bonding pad of the LED chip 7 and the TFT driving device layer 2 on the front surface of the glass substrate 1, the organic buffer layer 5 is used as a neutral layer to relieve stress concentration of the upper lamination layer and the lower lamination layer, fill up defects inside the inorganic thin film, prolong the water oxygen diffusion path and realize flexible display of high brightness and high contrast of the Mini LED.

The thickness of the organic buffer layer 5 is in the range of 1 μm to 2 μm, preferably 1.5 μm, and the material thereof is not limited to PI (i.e., polyimide).

The Mini LED's of this scheme design flexible packaging heat radiation structure possesses the hi-lite, can adjust the subregion of adjusting luminance more meticulously, improves the contrast of display screen to possess the function of isolated water oxygen and the absorptive function of water oxygen, add the structure of heat dissipation post 10, can distribute the inside temperature of panel effectively evenly and improve metal oxide TFT drive device's stability and device life-span, realize higher resolution and flexible display effect.

To sum up, the utility model provides a flexible packaging heat dissipation structure of Mini LED, through setting up more than two LED lamp pearls, LED lamp pearl includes LED chip and two electrode PIN feet, the other end that one end of LED chip is relative runs through first water oxygen barrier layer, organic buffer layer and second water oxygen barrier layer in proper order, two electrode PIN feet are all inlayed and are established in the organic silica gel layer and one end of electrode PIN foot stretches out the organic silica gel layer and contacts with first water oxygen barrier layer, be equipped with the clearance between two electrode PIN feet, it absorbs the granule to fill in the clearance, be connected with a heat dissipation post on each electrode PIN foot, the one end that the heat dissipation post is kept away from electrode PIN foot passes through first water oxygen barrier layer and organic buffer layer to in the second water oxygen barrier layer in proper order, so make the temperature of panel inside that can evenly effectively distribute, the stability and the device life-span of metal oxide TFT driver have been improved, the display effect of higher resolution and flexibility is realized; the first water oxygen barrier layer and the second water oxygen barrier layer are used for preventing external water oxygen from entering the inside of the Mini LED display, oxidizing and corroding an electrode bonding pad (namely an electrode PIN foot) of an LED chip and a TFT driving device layer, the organic buffer layer is used as a neutral layer to relieve stress concentration of upper and lower laminated layers, fill up defects in an inorganic film, prolong a water oxygen diffusion path and realize flexible display of high brightness and high contrast of the Mini LED; the flexible packaging heat dissipation structure of the Mini LED can improve the heat dissipation speed of the Mini LED display, stabilize the working environment of the Mini LED display, improve the capability of isolating water and oxygen of the Mini LED display by adopting flexible film packaging, and realize the high brightness and high contrast flexible display of the Mini LED display.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. A Mini LED flexible packaging heat dissipation structure is characterized by comprising a glass substrate and more than two LED lamp beads, wherein a TFT driving device layer, an organic silica gel layer, a first water oxygen barrier layer, an organic buffer layer and a second water oxygen barrier layer are sequentially stacked on one side face of the glass substrate, each LED lamp bead comprises an LED chip and two electrode PIN PINs, one end of each LED chip is respectively contacted with the two electrode PIN PINs, the other end opposite to one end of each LED chip sequentially penetrates through the first water oxygen barrier layer, the organic buffer layer and the second water oxygen barrier layer, the two electrode PIN PINs are embedded in the organic silica gel layer, one ends of the electrode PIN PINs extend out of the organic silica gel layer to be contacted with the first water oxygen barrier layer, a gap is arranged between the two electrode PIN PINs, water oxygen absorption particles are filled in the gap, and each electrode PIN PIN is connected with a heat dissipation column, one end of the heat dissipation column, which is far away from the PIN foot of the electrode, sequentially penetrates through the first water oxygen barrier layer and the organic buffer layer to the second water oxygen barrier layer.

2. The flexible packaging and heat dissipation structure of Mini LED as recited in claim 1, wherein the height of said heat dissipation pillar is in the range of 2 μm to 4 μm.

3. The flexible packaging and heat dissipating structure of Mini LED as claimed in claim 1, wherein the water and oxygen absorbing particles are circular in shape and have a diameter in the range of

4. The flexible packaging and heat dissipation structure of the Mini LED as recited in claim 1, wherein the height of the PIN is in the range of 1.5 μm to 2.5 μm, and the thickness of the silicone gel layer is in the range of 1 μm to 2 μm.

5. The flexible packaging and heat dissipation structure of a Mini LED as recited in claim 1, wherein the first water and oxygen barrier layer has a thickness in the range of 0.1 μm to 0.2 μm.