WO2020019856A1 - Light panel, backlight module and display apparatus - Google Patents

Abstract

A light panel, comprising: a substrate; multiple light source chips, the multiple light source chips being arranged on the substrate in an array; an adhesive layer, the adhesive layer covering the multiple light source chips; a light-emitting layer, the light-emitting layer being arranged on a side, away from the multiple light source chips, of the adhesive layer, and the light-emitting layer being configured to be excited by light emitted by the multiple light source chips to generate excitation light; and a water-oxygen barrier layer, the water-oxygen barrier layer being arranged on a side, away from the adhesive layer, of the light-emitting layer.

Description

Light board, backlight module and display device

This application claims the priority and rights of the Chinese patent application filed with the Chinese Patent Office on July 27, 2018, with application number 201810845522.X, and entitled "A kind of light board, backlight module and display device". Incorporated by reference in this application.

Technical field

The present disclosure relates to the field of optoelectronic devices, and in particular, to a light board, a backlight module, and a display device.

Background technique

The size of a single side of a Mini-LED (Mini-Light Emitting Diode) chip is between 100-200 μm. The Mini-LED chip is used in a direct-lit backlight module, which can achieve area dimming, which will be more side-by-side than normal. The backlight module has better light transmission uniformity, higher contrast and more light and dark details. In a backlit TV using Mini-LED chips, the distance between two adjacent Mini-LED chips is small and the light is mixed uniformly. It can remove the thick traditional TV backlight film, reduce the light mixing distance, and realize ultra-thin module design. The module thickness is comparable to the thickness of an OLED module.

Summary of the Invention

In a first aspect, some embodiments of the present disclosure provide a light board, including:

A substrate; a plurality of light source chips, the plurality of light source chips being arranged on the substrate in an array manner; a colloid layer, the colloid layer covering the plurality of light source chips; a light emitting layer, the light emitting layer being provided on the colloid A side away from the plurality of light source chips, the light emitting layer is configured to generate excitation light by being excited by light emitted from the plurality of light source chips; a water-oxygen barrier layer, the water-oxygen barrier layer is disposed on the The light emitting layer is on a side far from the colloid layer.

In a second aspect, some embodiments of the present disclosure provide a backlight module, including: a back plate; a light plate, the light plate is disposed on the back plate, and the light plate is the above-mentioned light plate.

According to a third aspect, some embodiments of the present disclosure provide a display device including the above-mentioned backlight module.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings in the following description are only Some of the disclosed embodiments can be obtained by those skilled in the art based on these drawings without paying any creative work.

1 is a schematic structural diagram of a light board according to some embodiments of the present disclosure;

2 is a schematic structural diagram of an LED chip in the lamp board shown in FIG. 1;

FIG. 3 is a first simulation view of light emission uniformity of a lamp board according to some embodiments of the present disclosure; FIG.

FIG. 4 is a light emission uniformity curve diagram I of a lamp board according to some embodiments of the present disclosure; FIG.

FIG. 5 is a second simulation diagram of the light emission uniformity of a lamp board according to some embodiments of the present disclosure; FIG.

FIG. 6 is a second light emission uniformity curve diagram 2 of a lamp board according to some embodiments of the present disclosure; FIG.

FIG. 7 is a third simulation diagram of the light emission uniformity of the lamp board according to some embodiments of the present disclosure; FIG.

FIG. 8 is a light emission uniformity curve diagram III of a lamp board according to some embodiments of the present disclosure; FIG.

FIG. 9 is another schematic structural diagram of a light board according to some embodiments of the present disclosure; FIG.

10 is a schematic structural diagram of a backlight module according to some embodiments of the present disclosure;

FIG. 11 is a schematic diagram of a display device according to some embodiments of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person having ordinary skill in the art without making creative efforts fall within the protection scope of the present disclosure.

In the description of this disclosure, it needs to be understood that the terms "center", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inside", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply The device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

Some embodiments of the present disclosure provide a light board. As shown in FIG. 1, the lamp board includes a substrate 10, a plurality of light source chips 11, a colloid layer 12, a light emitting layer 13, and a water-oxygen barrier layer 14.

The substrate 10 may be made of a material with better water and oxygen barrier properties, such as an aluminum substrate.

The plurality of light source chips 11 are arranged on the substrate 10 in an array manner. Each of the plurality of light source chips 11 may be an LED chip, such as a Mini-LED chip, with a rated voltage of about 3V and an operating current of 20-50 mA. The size of a single side of the Mini-LED chip is generally controlled at 100-200 μm, and the size of a typical Mini-LED chip is length (200 μm) × width (100 μm) × height (80 μm).

In some embodiments, as shown in FIG. 2, the structure of the LED chip includes: an optical light emitting film system 116, a substrate 111, an epitaxial light emitting layer 112, a DBR reflective layer (distributed Bragg reflection, Distributed Bragg reflectors) 115, and N electrodes 113 and P electrodes 114 located in the same plane. The DBR reflective layer 115 can avoid the loss of backscattered light. The DBR reflective layer 115 is not limited to being disposed under the epitaxial light emitting layer 112, and there are other optional positions for the setting position, such as between the substrate 111 and the epitaxial light emitting layer 112. This disclosure is not limited. The optical light emitting film system 116 has an anti-reflection effect, and the structure of the LED chip may not include the optical light emitting film system 116.

The colloid layer 12 covers the plurality of light source chips 11 for protecting the plurality of light source chips 11. The colloid layer 12 is a transparent colloid layer, and can transmit light emitted by the plurality of light source chips 11. The colloid layer 12 is generally made of a material with good light transmission and curability, such as epoxy resin.

The light-emitting layer 13 is disposed on a side of the colloid layer 12 remote from the light source chips 11. The light-emitting layer 13 is configured to be excited by light emitted from the light source chips 11 to generate excitation light. Some of the plurality of light source chips 11 are configured to emit light of a first wavelength, and some of the plurality of light source chips 11 are configured to emit light of a second wavelength. The first wavelength and the second wavelength may be the same or different. For example, when the first wavelength is the same as the second wavelength, both the light of the first wavelength and the light of the second wavelength may be blue light. For example, when the first wavelength is different from the second wavelength, the light of the first wavelength is blue and the light of the second wavelength is red; or the light of the first wavelength is blue and the light of the second wavelength is green.

The excitation light includes at least one kind of light different from the light of the first wavelength and the light of the second wavelength. For example, when the light of the first wavelength and the light of the second wavelength are both blue light, the excitation light may include red light and green light; when the light of the first wavelength and light of the second wavelength are both ultraviolet light, The excitation light may include blue light, red light, and green light. For example, when the light of the first wavelength is blue light and the light of the second wavelength is red light, the excitation light includes green light; when the light of the first wavelength is blue light and the light of the second wavelength is green light, the The excitation light includes red light. The excitation light is mixed with light of a first wavelength and light of a second wavelength emitted by the plurality of light source chips 11 to form mixed light.

The light emitting layer 13 includes a quantum dot material or a fluorescent material. In some embodiments, when the plurality of light source chips 11 each generate blue light (the peak wavelength range of blue light is in the range of 440 nm to 470 nm), correspondingly, the quantum dot material included in the light emitting layer 13 is a red-green quantum dot mixed material. The red quantum dot material in the blue excitation light emitting layer 13 emits red light having a peak wavelength range of 610 nm to 650 nm; and the green quantum dot material in the blue excitation light emitting layer 13 emits green light having a peak wavelength range of 520 to 550 nm; The red, green, and blue primary colors are mixed to form a mixed light, such as white light. In some embodiments, when the plurality of light source chips 11 generate ultraviolet light, the quantum dot material included in the light emitting layer 13 is a red-green-blue quantum dot mixed material.

When the light emitting layer 13 is manufactured, the quantum dot material is mixed in a colloid (such as epoxy resin), and then the colloid mixed with the quantum dot material is coated on the colloid layer 12 away from the light source chips. One side of 11 (that is, the colloid in which the quantum dot material is mixed is coated on the light exit side of the colloid layer 12).

The water-oxygen barrier layer 14 is disposed on a side of the light-emitting layer 13 away from the colloid layer 12, that is, the water-oxygen barrier layer 14 is disposed on a light-emitting side of the light-emitting layer 13. The water-oxygen barrier layer 14 protects the light-emitting layer 13 from above the light-emitting layer 13. The water-oxygen barrier layer 14 is a water-oxygen barrier layer deposited on the light-emitting layer 13. For example, the water-oxygen barrier layer 14 can be formed by depositing silicon dioxide or aluminum trioxide on the light-emitting layer 13 by evaporation or sputtering. Compared with the method in which a water and oxygen barrier film is firstly fabricated on a PET (Polyethylene terephthalate) substrate, and then the water and oxygen barrier film is attached to the light emitting layer 23 together with the PET substrate. Water and oxygen barrier layer. In some embodiments of the present disclosure, the water and oxygen barrier layer 14 formed by a deposition method has a smaller thickness and a denser material structure, so that the lamp board has a smaller thickness.

In some embodiments of the present disclosure, the water and oxygen barrier layer 14 is provided only on the upper surface of the light emitting layer 13 away from the colloidal layer 12, and there is no need to provide a water and oxygen barrier layer on the upper and lower surfaces of the light emitting layer 13, so further Reduced thickness of light board.

In some embodiments, as shown in FIG. 1, the distance between the surface where the substrate 10 is in contact with the plurality of light source chips 11 and the surface where the light-emitting layer 13 is in contact with the transparent colloid layer 12 is h1, in the same row or the same column The distance between two adjacent light source chips 11 is P. As shown in FIG. 1, the distance P between two adjacent light source chips 11 may be the distance between the centers of two adjacent light source chips. h1 satisfies the following conditions: 120 μm ≦ h1 ≦ 6 mm; P satisfies the following conditions: 200 μm ≦ P ≦ 10 mm. Among them, since the light emitting power of the Mini-LED chip is small (the rated voltage is about 3V, the working current is 20-50mA), its temperature is low, and it has little effect on the thermal stability of the quantum dot material in the light-emitting layer. The distance h1 between the surface in contact with the plurality of light source chips 11 and the surface in contact with the light-emitting layer 13 and the colloidal layer 12 may be selected to be a small value, for example, the minimum value of h1 may be 120 μm.

The light intensity of the Mini-LED chip has a Lambertian distribution. The smaller the light exit angle θ, the higher the optical power per unit area. The light output angle θ indicates an included angle between the emitted light and a direction perpendicular to the plane where the multiple light source chips are located. As shown in FIG. 1, the light angle is an included angle between the emitted light and the vertical direction. That is, as shown in FIG. 1, when each Mini-LED chip is a blue light LED chip, the quantum dot material located directly above a certain Mini-LED chip is more susceptible to high-intensity blue light, and the material located at a position where the light emission angle is large. The quantum dot material (for example, a quantum dot material at a spaced position between two adjacent Mini-LED chips) is irradiated with a low blue light intensity, so the light received by the light emitting layer 13 also varies with the light intensity of each Mini-LED chip. The Lambertian distribution of ZnO exhibits non-uniformity, which in turn causes non-uniformity of the excitation light.

For this reason, in some embodiments of the present disclosure, a reasonable ratio of the ratio h1 / P between the distance h1 of each Mini-LED chip and the light-emitting layer 13 and the distance P between the centers of two adjacent Mini-LED chips is set. Value, the light at the space between two adjacent Mini-LED chips can be superimposed in the light-emitting layer 13, thereby increasing the light intensity at the space between two adjacent Mini-LED chips and weakening the Mini-LED. The unevenness of Lambertian distribution of chip light intensity improves the uniformity of excitation light.

For example, when the distance h1 between each Mini-LED chip and the light-emitting layer 13 is set to be large, or when the distance P between the centers of two adjacent Mini-LED chips is set to be small, The light rays of two adjacent Mini-LED chips have a large overlapping area at the interval position between the two adjacent Mini-LED chips, so the light at the interval positions between two adjacent Mini-LED chips The strength can be increased, which can further improve the light emitting uniformity of the lamp plate. When the distance h1 between each Mini-LED chip and the light-emitting layer 13 is set to be small, or when the distance P between the centers of two adjacent Mini-LED chips is set to be large, the adjacent The light of the two Mini-LED chips has a small overlapping area at the interval position between the two adjacent Mini-LED chips, so the light intensity at the interval position between the two adjacent Mini-LED chips cannot be It is effectively increased, and it is difficult to improve the uniformity of light emission of the lamp plate.

Based on the above principles, some embodiments of the present disclosure simulate the light emission uniformity of the lamp board under three typical values of h1 / P.

Figures 3 and 4 provide simulation diagrams of the light-emitting uniformity of the lamp plate when h1 / P = 0.4, where Figure 3 shows the power distribution per unit area of the lamp plate, the horizontal axis is X (unit mm), and the vertical axis is Z (unit mm), the unit of power distribution is W / ㎡; Figure 4 shows the horizontal and vertical power curves of the lamp panel, where the horizontal axis is the horizontal coordinate X or the vertical coordinate Z (unit mm), and the vertical axis is the power ( Unit W).

Figures 5 and 6 provide simulation diagrams of the light-emitting uniformity of the lamp board when h1 / P = 0.6, where Figure 5 shows the power distribution per unit area of the lamp board, the horizontal axis is X (unit mm), and the vertical axis is Z (unit mm), the power distribution unit is W / ㎡; Figure 6 shows the horizontal and vertical power curve of the lamp board, where the horizontal axis is the horizontal coordinate X or the vertical coordinate Z (unit mm), and the vertical axis is the power ( Unit W).

Figures 7 and 8 provide simulation diagrams of the uniformity of light emission of the lamp board when h1 / P = 0.8, where Figure 7 shows the power distribution per unit area of the lamp board, the horizontal axis is X (unit mm), and the vertical axis Is Z (unit mm), and the power distribution unit is W / ㎡; Figure 8 shows the horizontal and vertical power curves of the lamp panel, where the horizontal axis is the horizontal coordinate X or the vertical coordinate Z (unit mm), and the vertical axis is the power (Unit W).

The following analyzes the results of simulating the light emission uniformity of the lamp board under three typical values of h1 / P.

As shown in Figures 3 and 4, when h1 / P = 0.4, the value of h1 is small and the value of P is large. At this time, because the two adjacent light source chips 11 are far away, the light emitting layer 13 The light overlapping area corresponding to the spaced position between two adjacent light source chips 11 is relatively small. Therefore, the light emitting layer 13 is generated in the area corresponding to the spaced position between the two adjacent light source chips 11. The intensity of the excitation light is small. As shown in FIG. 4, from the light intensity distribution on the vertical cross section of the light board passing through the center of the corresponding light source chip and the light intensity distribution on the horizontal cross section, it can be seen that the excitation light at 0 mm, 10 mm, 20 mm, and 30 mm exists. Obvious illuminance wave peaks, there are obvious illuminance wave troughs at the excitation light at 5mm, 15mm, 25mm, 35mm. Among them, there is a large difference in power distribution between the peaks and troughs (the gap is close to 3000W / ㎡), and the unevenness of the excitation light is serious.

As shown in FIG. 5 and FIG. 6, when h1 / P = 0.6, it means that the value of h1 becomes larger and / or the value of P becomes smaller. At this time, between the light emitting layer 13 and two adjacent light source chips 11 The overlapping area of the light corresponding to the interval position becomes larger, and because the range of the superimposed power of the excitation light becomes larger, as shown in Fig. 6, the illuminance peaks of the excitation light at 0mm, 10mm, 20mm, 30mm and At 25mm and 35mm, the gap between the illumination intensity troughs of the excitation light becomes smaller, and the unevenness of the excitation light is reduced (the difference is close to 2000W / ㎡).

As shown in FIG. 7 and FIG. 8, when h1 / P = 0.8, it is equivalent to further increasing the value of h1 and / or further decreasing the value of P. At this time, the two light source chips 11 adjacent to each other in the light-emitting layer 13 The overlapping area of the light corresponding to the spaced position between them is further enlarged. As the range of the superimposed power of the excitation light continues to increase, as shown in Fig. 8, the illuminance peaks of the excitation light at 0mm, 10mm, 20mm, and 30mm and the The gap between the illumination intensity troughs of the excitation light at 5mm, 15mm, 25mm, and 35mm is further reduced (the gap is close to 1500W / ㎡), the unevenness of the excitation light is further reduced, and the excitation light distribution in the region of 0-30mm can be equivalent to Evenly distributed.

From the analysis of the simulation results above, it can be known that when h1 / P = 0.6, the light intensity of the light receiving surface of the light-emitting layer 13 (that is, the surface of the light-emitting layer 13 near the transparent colloid layer 12) is relatively uniform, and the minimum value of the light intensity is / Maximum = 7000 / 9200≈76%> 75%. In general, when the uniformity of the illuminance of the light received by the light receiving surface is greater than 75%, the light passes through the light emitting layer 13 (which may include quantum dots QD (quantum dots)). The display after the material) or the diffusion layer 18 (as shown in FIG. 10 will be described later) will be more uniform, which is basically acceptable to the human eye. Therefore, h1 and P satisfy the following conditions: h1 / P≥0.6.

In some embodiments of the present disclosure, as shown in FIG. 9, the light board further includes a packaging structure 15. The packaging structure 15 is disposed on the substrate 10 around the outer sides of the transparent colloid layer 12, the light-emitting layer 13, and the water-oxygen barrier layer 14. In some embodiments, the packaging structure 15 is in direct contact with the outer sides of the transparent colloid layer 12, the light-emitting layer 13, and the water-oxygen barrier layer 14. The packaging structure 15 is a colloid with high water-oxygen barrier properties, and the gap between the molecular chains is small (so as to play the role of water-oxygen barrier). The encapsulation structure 15 includes a water-oxygen barrier material. For example, the colloid of the encapsulation structure 15 is mixed with particles having a water-oxygen barrier function, such as silicon dioxide, and metal particles, such as aluminum, that react with oxygen.

The water-oxygen barrier layer 14 and the packaging structure 15 package a plurality of light source chips 11, the colloidal layer 12, and the light-emitting layer 13. Since the package structure 15 includes a water-oxygen barrier material, the water-oxygen barrier layer 14 and the packaging structure 15 achieves a water-oxygen barrier to the light-emitting layer 13.

In addition, as shown in FIG. 9, the height of the packaging structure 15 is h3, and the thickness between the surface where the substrate 10 is in contact with the plurality of light source chips 11 and the surface where the light emitting layer 13 is in contact with the water and oxygen barrier layer 14 is h2, h3 And h2 satisfy the following conditions: h3≥h2. In this way, it is ensured that the light-emitting layer 13 is in a water-oxygen barrier environment sealed by the water-oxygen barrier layer 14, the packaging structure 15, and the substrate 10.

In some embodiments, as shown in FIG. 9, the water-oxygen barrier layer 14 is further provided with a protective layer 17, and the packaging structure 15 is disposed around the outer side of the protective layer 17. The protective layer 17 may be formed of epoxy resin or silicone.

In some embodiments, as shown in FIG. 9, a light diffusion layer 18 is further provided between the transparent colloid layer 12 and the light-emitting layer 13, and the light diffusion layer 18 is configured to emit light from the multiple light source chips 11. The light diffuses to the light emitting layer 13.

The light diffusion layer 18 is made of a transparent material mixed with scattering particles. The transparent material includes any one of the following materials: epoxy resin and colloidal silica; the scattering particles include any one of the following materials: titanium dioxide and Silicon dioxide.

In some embodiments, the distance between the surface where the substrate 10 is in contact with the plurality of light source chips 11 and the surface where the light diffusion layer 18 and the colloid layer 12 are in contact is h4. Two adjacent ones in the same row or column The distance between the centers of the light source chips is P, and h4 and P satisfy the following conditions: h4 / P≥0.6. At this time, the distance between the surface where the substrate 10 is in contact with the plurality of light source chips 11 and the surface where the light diffusion layer 18 and the light emitting layer 13 are in contact is h4. Since the light emitting layer 13 is disposed on the light diffusion layer 18 Away from the colloidal layer 12, so the distance h3 between each Mini-LED chip and the light-emitting layer 13 is greater than the distance h4. When h4 / P≥0.6, it can be guaranteed that h3 / P> 0.6, so it can guarantee all The uniformity of the light emission of the lamp board is described so that the uniformity can reach a level acceptable to the human eye.

Referring to FIG. 10, some embodiments of the present disclosure further provide a backlight module, including: a back plate 1101;

The light plate 1102 is disposed on the back plate 1101. The light plate 1102 is the light plate described above.

Referring to FIG. 11, some embodiments of the present disclosure provide a display device 1000 including the above-mentioned backlight module. A liquid crystal display panel is disposed on a light emitting side of the backlight module. The display device 1000 may be a display device such as an electronic paper, a mobile phone, a television, a digital photo frame, and the like.

The above is only a specific implementation of the present disclosure, but the scope of protection of the present disclosure is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present disclosure. It should be covered by the protection scope of this disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (17)

1. A light board includes:

   Substrate

   A plurality of light source chips arranged on the substrate in an array manner;

   A colloidal layer covering the plurality of light source chips;

   A light emitting layer disposed on a side of the colloidal layer remote from the plurality of light source chips, the light emitting layer being configured to be excited by light emitted by the plurality of light source chips to generate excitation light;

   A water-oxygen barrier layer, which is disposed on a side of the light-emitting layer away from the colloid layer.
2. The light panel according to claim 1, wherein:

   Some light source chips of the plurality of light source chips are configured to emit light of a first wavelength, and other light source chips of the plurality of light source chips are configured to emit light of a second wavelength. The two wavelengths are the same or different;

   The excitation light includes at least one kind of light different from the light of the first wavelength and the light of the second wavelength;

   Light of a first wavelength and light of a second wavelength, and the excitation light emitted by the plurality of light source chips are mixed to form mixed light.
3. The lamp panel according to claim 1, wherein the water-oxygen barrier layer is a water-oxygen barrier layer deposited on the light-emitting layer.
4. The light panel according to claim 1, wherein:

   A distance between a surface where the substrate is in contact with the plurality of light source chips and a surface where the light emitting layer is in contact with the colloid layer is h1;

   The distance between the centers of two adjacent light source chips is P;

   Then h1 and P satisfy the following conditions: h1 / P≥0.6.
5. The light panel according to claim 4, wherein:

   The h3 satisfies the following conditions: 120 μm ≦ h1 ≦ 6mm;

   The P satisfies the following conditions: 200 μm ≦ P ≦ 10 mm.
6. The light board according to claim 1, further comprising a packaging structure provided on the substrate around the outer sides of the colloid layer, the light emitting layer, and the water and oxygen barrier layer.
7. The lamp board according to claim 6, wherein the packaging structure is in direct contact with outer sides of the colloid layer, the light-emitting layer, and the water-oxygen barrier layer.
8. The light board according to claim 6 or 7, wherein the packaging structure comprises a water-oxygen barrier material.
9. The lamp board according to claim 1, further comprising: a protective layer disposed on the water-oxygen barrier layer.
10. The light board according to claim 1, further comprising: a light diffusion layer disposed between the colloid layer and the light emitting layer,

    Wherein, the light diffusion layer is configured to diffuse light emitted from the plurality of light source chips, and allow the diffused light to enter the light emitting layer.
11. The light board according to claim 10, wherein the light diffusion layer is made of a transparent material mixed with scattering particles.
12. The light board according to claim 11, wherein the transparent material comprises any one of the following combinations: epoxy resin and silicone colloid.
13. The light panel according to claim 11, wherein the scattering particles include any one of the following materials: titanium dioxide and silicon dioxide.
14. The light panel according to claim 10, wherein:

    The distance between the surface where the substrate is in contact with the plurality of light source chips and the surface where the light diffusion layer is in contact with the colloid layer is h4;

    The distance between the centers of two adjacent light source chips is P;

    Then h4 and P satisfy the following conditions: h4 / P≥0.6.
15. The light board according to any one of claims 1-9, wherein a size of a single side of each of the light source chips is 100-200 μm.
16. A backlight module includes:

    Backplane

    The light board is disposed on the back plate, and the light board is the light board according to any one of claims 1-15.
17. A display device includes:

    Display panel; and

    The backlight module according to claim 16.

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