WO2016015421A1

WO2016015421A1 - Array substrate, organic light-emitting diode display panel and display apparatus

Info

Publication number: WO2016015421A1
Application number: PCT/CN2014/092521
Authority: WO
Inventors: 王俊然
Original assignee: 京东方科技集团股份有限公司
Priority date: 2014-07-28
Filing date: 2014-11-28
Publication date: 2016-02-04
Also published as: CN104112767A; CN104112767B

Abstract

Disclosed are an array substrate, an organic light-emitting diode display panel and a display apparatus. The array substrate comprises: an array base (10), a structure layer (1), an organic light-emitting diode layer (6) arranged on the top of the structure layer (1) and a passivation layer (3). The passivation layer (3) covers a non-light-emitting region of the organic light-emitting diode layer (6) and a side surface of the structure layer (1) in the array substrate. The array substrate can enable a display panel to have a good conductive property and water resistance property and have relatively high panel reliability.

Description

Array substrate, organic light emitting diode display panel and display device

Technical field

Embodiments of the present invention relate to an array substrate, an organic light emitting diode display panel, and a display device.

Background technique

Organic electroluminescent devices have advantageous characteristics such as active illumination, wide viewing angle, high contrast, and fast response, which are regarded as a new generation of display technology.

Organic light-emitting diode (OLED) displays can be fully colorized using WOLED (White Organic Light-Emmitting Diodes) plus COA (Color-filter on Array) or CF (Color) -filter color filter) is implemented. For example, the specific structure may include a manner of bottom emitting WOLED plus COA and a method of top emitting WOLED plus CF. The method of top emitting WOLED plus CF has the advantages of high aperture ratio and simple backplane process.

However, the method of top-emitting WOLED plus CF is because the upper electrode is a transmissive electrode. Whether it is a thin metal layer or a TCO (Transparent Conductive Oxide), the sheet resistance is too large, resulting in a large area. In an OLED display, an IR drop is easily generated to cause uneven brightness of the panel. Although the auxiliary electrode can be made on the CF cover plate, the spacer is used to overlap the upper electrode to reduce the resistance voltage drop, but in order to achieve a good electrical overlap, the upper electrode and the spacer are between the spacers. The insulating layer cannot exist, resulting in deterioration of water repellency of the display panel, resulting in a decrease in reliability of the panel.

Summary of the invention

Embodiments of the present invention provide an array substrate, an organic light emitting diode display panel, and a display device, which can obtain an array substrate with better water resistance, and can overlap the upper electrode layer by using a spacer to ensure the array substrate The water resistance and reliability of the display panel.

At least one embodiment of the present invention provides an array substrate comprising: an array substrate, a structural layer, and an organic light emitting diode layer and a passivation layer disposed on top of the structural layer. The passivation layer covers an edge of the organic light emitting diode layer in the array substrate and a side surface of the structural layer.

For example, the outer side of the array substrate may be provided with a flip chip film region or a soft plate solder region, and the passivation layer may be disposed in the organic light emitting diode layer light emitting region and the flip chip region or the soft board Between the weld zones.

For example, the passivation layer may be a single layer structure or a multilayer stack structure.

For example, the passivation layer may comprise one or a combination of silicon nitride, silicon oxide, aluminum oxide or titanium oxide.

Embodiments of the present invention also provide an organic light emitting diode display panel including any of the above array substrates.

For example, in the organic light emitting diode display panel, an upper electrode layer may be formed on the organic light emitting diode layer of the array substrate.

For example, the OLED display panel may further include a color filter substrate, wherein the color film substrate comprises a color film substrate, a color film layer is formed on one side of the color film substrate facing the array substrate, and an auxiliary electrode is formed on the color film layer. In the layer, a spacer is formed in the auxiliary electrode layer or a spacer is formed on the color filter layer, and the auxiliary electrode layer on the top of the spacer contacts the upper electrode layer.

For example, a first sealant may be filled between the color filter substrate and the array substrate, and the passivation layer may be sealed by the first sealant.

For example, the organic light emitting diode display panel may further include: a second encapsulant disposed on a periphery of the first encapsulant for sealing the first encapsulant.

For example, the viscosity of the first sealant is less than the viscosity of the second sealant.

For example, the organic light emitting diode display panel may further include: a metal trace disposed at a bottom of the spacer and in contact with the auxiliary electrode layer.

For example, the metal trace is a metal such as aluminum, molybdenum or silver or an alloy thereof.

For example, the auxiliary electrode layer may be a transparent conductive film.

For example, the upper electrode layer includes at least one of a silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer on the metal layer covered with a transparent conductive film.

Embodiments of the present invention also provide a display device including any of the above-described organic light emitting diode display panels.

DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will be made for the drawings of the embodiments. It is apparent that the drawings in the following description are merely illustrative of some embodiments of the invention and are not intended to limit the invention.

1 is a schematic structural view of an array substrate according to an embodiment of the present invention;

2 is a schematic view showing the position of a passivation layer according to an embodiment of the present invention;

3A is a schematic structural view of an organic light emitting diode display panel according to an embodiment of the present invention;

3B is a schematic structural view of an organic light emitting diode display panel according to another embodiment of the present invention;

FIG. 4 is a schematic structural view of an organic light emitting diode display panel according to another embodiment of the present invention.

Reference mark:

1-structural layer; 10-array substrate; 2-color film substrate; 20-color film layer; 3-passivation layer; 4- spacer; 5-auxiliary electrode layer; 6-organic light-emitting diode layer; Trace; 8-clad film area or soft board soldering area; 9-anisotropic conductive film; 11-side of structural layer; 15-first sealant; 16-second sealant; 61-organic light emitting diode layer Edge (OLED non-light-emitting region); 62-light-emitting region of the organic light-emitting diode layer.

detailed description

The present invention will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict.

Many specific details are set forth in the following description in order to provide a thorough understanding of the invention, but the invention may be practiced otherwise. It is apparent that the described embodiments are part of the embodiments of the invention, and not all of the embodiments.

FIG. 1 is a schematic view showing the structure of an array substrate according to an embodiment of the present invention.

As shown in FIG. 1, an array substrate according to an embodiment of the present invention includes: an array substrate 10, a structural layer 1, an organic light emitting diode layer 6 disposed on the top of the structural layer 1, and a passivation layer 3 covering the array substrate. The edge 61 of the intermediate organic light emitting diode layer 6 and the side 11 of the structural layer 1.

It should be noted that, for example, the first encapsulant is filled between the array substrate and the color filter substrate, and the array substrate includes the array substrate 10, the structural layer 1, and the organic light emitting diode layer 6. Structural layer 1 is not A single layer, but a collection of layers that implement the functionality of the array substrate.

The structural layer 1 may include: a gate electrode, a gate insulating layer, an active layer, an etch barrier layer, a source drain layer, a resin insulating layer, a pixel electrode layer (the pixel electrode layer may serve as an anode), and a pixel defining layer, as needed Multiple layers, but are not limited to this. The passivation layer 3 covers the edge of the organic light emitting diode layer 6, forming a non-light emitting region of the organic light emitting diode layer 6, while covering both sides of the structural layer 1. The organic light emitting diode layer is disposed at the passivation layer, that is, the edge of the organic light emitting diode layer is a non-light emitting region, and the rest (where the organic light emitting diode layer is not provided with a passivation layer) may be a light emitting region. By covering the passivation layer 3 on the edge of the organic light emitting diode layer 6 (ie, the non-light emitting region) and the side of the structural layer 1, it is ensured that the full color is achieved by using the WOLED, and the upper electrode layer is overlapped by the spacer 4. At the same time as 18, the probability of moisture infiltrating from the side of the sealing structure is reduced. This ensures that the display panel composed of the array substrate has good water blocking performance and high panel reliability.

2 shows only the flip chip region or the soft board pad 8 on the side of the array substrate 10. The other side of the array substrate 10 may also be provided with a flip chip region or a soft plate pad 8. For example, the outer side of the array substrate 10 is provided with a chip-on-film area (COF) or a soft-plate-welded area (FPC) 8, which is disposed on the anisotropic conductive film (ACF) 9, and the anisotropic conductive film 9 is disposed on the array. On the substrate 10. At this time, the passivation layer 3 is disposed between the light-emitting region 62 of the organic light-emitting diode layer 6 and the flip-chip film region or the soft-plate solder region 8.

Since the passivation layer 3 is between the light-emitting region of the organic light-emitting diode layer 6 and the flip-chip film region or the soft-plate solder region 8, it can be ensured that the passivation layer 3 is in the first encapsulant and does not cover the organic light-emitting diode layer 6. Light emitting area.

For example, the passivation layer 3 may be a single layer structure or a multilayer stack structure.

For example, the passivation layer 3 may be one or a combination of silicon nitride, silicon oxide, aluminum oxide, and or titanium oxide.

As shown in FIG. 3A and FIG. 3B, another embodiment of the present invention further provides an organic light emitting diode display panel comprising the array substrate of any of the above embodiments.

For example, an upper electrode layer 18 may be formed on the organic light emitting diode layer 6 of the array substrate, and the upper electrode layer 18 is a thin electrode layer disposed on the upper surface of the array organic light emitting diode layer 6.

For example, the organic light emitting diode display panel may further include a color filter substrate, wherein the color filter substrate includes the color film substrate 2. A color film layer 20 is formed on one side of the color filter substrate 2 facing the array substrate, an auxiliary electrode layer 5 is formed on the color film layer 20, and a spacer 4 is formed in the auxiliary electrode layer 5 (as shown in FIG. 3A). Or a spacer 4 is formed on the color filter layer 20 (as shown in FIG. 3B), and the auxiliary electrode layer 5 on the top of the spacer 4 contacts the upper electrode layer 18 of the array substrate as shown in FIG. 3A.

For example, FIG. 3A shows that the first encapsulant 15 can be filled between the color filter substrate 2 and the array substrate, and the passivation layer 3 is sealed by the first encapsulant 15. For example, FIG. 3A illustrates an organic light emitting diode display panel according to another embodiment of the present invention, which may further include a second encapsulant 16 disposed on the periphery of the first encapsulant 15 for sealing the first encapsulant 15.

For example, the viscosity of the first sealant 15 may be less than the viscosity of the second sealant 16.

Only one side of the color film substrate 2 and the array substrate is filled with a sealant in FIG. 3A, and the other side is also filled with a sealant, and the sealant herein may be, for example, a first sealant or a first sealant and Second sealant.

The second sealant is disposed outside the first sealant to further ensure the sealing performance of the display panel, and the surface uniformity of the first sealant can be improved. Moreover, since the first sealant directly contacts the organic light emitting diode layer 6, the organic light emitting diode layer 6 is damaged due to the tension of the contact surface during the curing process. By setting the viscosity of the first sealant to be smaller than the viscosity of the second sealant, it can be ensured that the contact surface of the first sealant and the organic light emitting diode layer 6 has only a small tension during the curing process, thereby reducing the organic light emitting diode layer. 6 damage. At the same time, the second sealant adopts a relatively large viscosity, which can ensure strong water repellency to the outside and improve the overall sealing performance.

As shown in FIG. 4, a metal trace 7 may be added to the structure of FIG. 3A. For example, the organic light emitting diode display panel may further include a metal trace 7 disposed at the bottom of the spacer 4 and in contact with the auxiliary electrode layer 5. .

For example, the metal trace 7 may be made of a metal such as aluminum, molybdenum or silver or an alloy thereof.

By providing the metal traces 7 at the bottom of the spacer 4, the conductivity of the auxiliary electrode layer 5 can be increased, and the resistance drop of the front surface of the OLED display panel can be lowered.

For example, the auxiliary electrode layer 5 is a transparent conductive film, and can be made of an oxide of a metal such as In, Sn, Zn, and Cd and a composite multi-oxide thin film material thereof, such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). .

For example, the upper electrode layer may include at least one of the following: a silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer on the metal layer covered with a transparent conductive film.

Another embodiment of the present invention further provides a display device, which may include the organic light emitting diode display panel of any of the above embodiments.

The display device of the embodiment of the present invention may be, for example, an electronic paper, a mobile phone, a watch, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like, and any product or component having a display function.

In view of the related art, when the electrodes are overlapped by means of a spacer, it is difficult to ensure the water blocking performance of the display panel and the reliability of the panel. According to the technical solution of the embodiment of the present invention, the full color can be realized by using the WOLED, and the electrodes are overlapped by the spacer, and the display panel has good electrical conductivity and water blocking performance, and the high panel is trusted. degree.

In addition, those skilled in the art should know that the organic light emitting diode display panel of the embodiment of the present invention may further include other structures and components according to actual needs, and the organic light emitting diode display panel manufacturing method may further include other steps and details, but only Regardless of the improvement of the present invention, it will not be described herein.

The above is only an exemplary embodiment of the present invention, and is not intended to limit the scope of the present invention. The scope of the present invention is defined by the appended claims.

The present application claims the priority of the Chinese Patent Application No. 201410363074.1 filed on Jul. 28, 2014, the entire disclosure of which is hereby incorporated by reference.

Claims

An array substrate comprising: an array substrate, a structural layer, and an organic light emitting diode layer and a passivation layer disposed on top of the structural layer,

The passivation layer covers an edge of the organic light emitting diode layer in the array substrate and a side surface of the structural layer.
The array substrate according to claim 1, wherein an outer side of the array substrate is provided with a flip chip film region or a soft plate pad region, and the passivation layer is disposed on a light emitting region of the organic light emitting diode layer and the capping layer Between the crystalline film regions or the soft plate lands.
The array substrate according to claim 1 or 2, wherein the passivation layer is a single layer structure or a multilayer stack structure.
The array substrate according to any one of claims 1 to 3, wherein the passivation layer comprises one or a combination of silicon nitride, silicon oxide, aluminum oxide or titanium oxide.
An organic light emitting diode display panel comprising the array substrate according to any one of claims 1 to 4.
The OLED display panel according to claim 5, wherein an upper electrode layer is formed on the organic light emitting diode layer of the array substrate.
The OLED display panel of claim 6, further comprising a color filter substrate,

Wherein, the color filter substrate comprises a color film substrate, a color film layer is formed on one surface of the color film substrate facing the array substrate, an auxiliary electrode layer is formed on the color film layer, and the auxiliary electrode layer is formed in the auxiliary film layer A spacer is formed on the spacer or the color film layer, and an auxiliary electrode layer on top of the spacer contacts the upper electrode layer.
The OLED display panel according to claim 7, wherein a first sealant is filled between the color filter substrate and the array substrate, and the passivation layer is sealed by the first sealant.
The OLED display panel of claim 8, further comprising:

a second encapsulant disposed on a periphery of the first encapsulant for sealing the first encapsulant.
The OLED display panel of claim 9, wherein the viscosity of the first encapsulant is less than the viscosity of the second encapsulant.
The OLED display panel according to any one of claims 7 to 10, further comprising include:

A metal trace disposed at the bottom of the spacer and in contact with the auxiliary electrode layer.
The organic light emitting diode display panel according to any one of claims 7 to 11, wherein the auxiliary electrode layer is a transparent conductive film.
The organic light emitting diode display panel according to any one of claims 7 to 12, wherein the upper electrode layer comprises at least one of the following:

A silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer covered with a transparent conductive film on the metal layer.
A display device comprising the organic light emitting diode display panel according to any one of claims 5 to 13.