WO2018139512A1 - 光計測装置 - Google Patents

光計測装置 Download PDF

Info

Publication number
WO2018139512A1
WO2018139512A1 PCT/JP2018/002212 JP2018002212W WO2018139512A1 WO 2018139512 A1 WO2018139512 A1 WO 2018139512A1 JP 2018002212 W JP2018002212 W JP 2018002212W WO 2018139512 A1 WO2018139512 A1 WO 2018139512A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
fixed
projection
optical
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/002212
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
大智 渡邊
敢人 宮崎
里美 片寄
渡邉　啓
優生 倉田
笠原　亮一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, Olympus Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to CN201880006783.0A priority Critical patent/CN110199174B/zh
Priority to DE112018000511.9T priority patent/DE112018000511T5/de
Publication of WO2018139512A1 publication Critical patent/WO2018139512A1/ja
Priority to US16/517,736 priority patent/US20190339069A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/011—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  in optical waveguides, not otherwise provided for in this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0011—Arrangements for eliminating or compensation of measuring errors due to temperature or weight
    • G01B5/0014—Arrangements for eliminating or compensation of measuring errors due to temperature or weight due to temperature
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/50—Phase-only modulation

Definitions

  • the present invention relates to an optical measurement device that projects an image by projecting pattern light.
  • the "fringe scanning method” is used to calculate the irregularity information on the surface of the object by projecting a laser interference fringe onto the object and capturing and analyzing the projected image of the interference fringe.
  • This technology is known.
  • the fringe scanning method the depth and height of the irregularities at each point are obtained from the amount of scanning of the interference fringes and the change in the light intensity at each point of the projected image.
  • the scanning amount of the interference fringes is controlled by changing the phase difference between two or more light beams that cause interference.
  • the scanning amount of the projected interference fringes is controlled by changing one phase of the branched optical waveguide using the electro-optic effect or the like (see, for example, Patent Document 1).
  • a special material such as lithium niobate is required.
  • a phase modulator can be configured only with a general quartz-based material formed on a silicon substrate.
  • deformation such as warpage occurs due to a difference in thermal expansion coefficient between the substrate and the optical waveguide, and the projection position of the interference fringes may change. If the projection position of the interference fringe changes due to a factor different from the phase change of the optical waveguide, it leads to a decrease in measurement accuracy.
  • the present invention has been made in such a situation, and one of exemplary purposes of an aspect thereof is to provide an optical measurement device that suppresses a decrease in measurement accuracy due to deformation due to heat.
  • An optical measurement device includes an optical projection unit that projects pattern light and an imaging unit that captures an object on which the pattern light is projected.
  • the light projection unit and the imaging unit are fixed to each other via an attachment surface that intersects both the projection axis direction of the light projection unit and the imaging axis direction of the imaging unit.
  • FIG. 1 It is a figure which shows typically the structure of the optical measuring device which concerns on 1st Example. It is a top view which shows the structure of the front-end
  • An optical measurement device includes an optical projection unit that projects pattern light and an imaging unit that captures an object on which the pattern light is projected.
  • the light projection unit and the imaging unit are fixed to each other via an attachment surface that intersects both the projection axis direction of the light projection unit and the imaging axis direction of the imaging unit.
  • the position of the mounting surface is caused by the deformation caused by the difference in thermal expansion coefficient. Even if changes, the change in the relative position of the projection unit and the imaging unit can be reduced. Even if the mounting surface is warped due to heat, the projection axis and the imaging axis are separated because the displacement amount in the direction along the mounting surface is smaller than the displacement amount in the direction intersecting the mounting surface. The change in the relative position in the direction can be reduced. As a result, even if deformation due to heat occurs, a change in position in the imaging direction with respect to the position where the pattern light is projected can be reduced to suppress a decrease in measurement accuracy.
  • the light projection part may have a mounting surface.
  • the imaging unit may be fixed to the mounting surface.
  • the optical measurement device may further include a housing that houses the light projection unit and the imaging unit.
  • the light projection unit may be fixed to the housing.
  • the imaging unit may be fixed to the housing via the light projection unit.
  • the optical projection unit may include an optical circuit unit including a substrate and a plurality of phase-modulable waveguides provided on the substrate, and the imaging unit may be fixed to the optical circuit unit.
  • the light projection unit further includes a projection lens that projects a pattern light onto an object by causing a plurality of light beams emitted from a plurality of waveguides to interfere with each other, and a lens holding unit that holds the projection lens.
  • the lens holding part may be fixed.
  • the optical circuit unit may have a side surface provided with a plurality of waveguide exits, and the imaging unit may be fixed to the side surface.
  • the optical circuit unit may have a side surface on which the exits of the plurality of waveguides are provided, and the imaging unit and the lens holding unit may be fixed to the side surface.
  • the optical circuit unit has a first side surface on which the exits of the plurality of waveguides are provided, and a second side surface provided at a position shifted in the projection axis direction with respect to the first side surface, and the imaging unit on the second side surface May be fixed.
  • the optical circuit unit has a first side surface on which the exits of the plurality of waveguides are provided, and a second side surface provided at a position shifted in the projection axis direction with respect to the first side surface, and the lens is held on the first side surface.
  • the image capturing unit may be fixed to the second side surface.
  • the optical measuring device may further include a fixing member having a mounting surface. Both the light projection unit and the imaging unit may be attached to the attachment surface.
  • the fixing member may have light transmittance.
  • the light projection unit may project the pattern light onto the object through the fixed member.
  • the imaging unit may image the target object through the fixed member.
  • the optical measurement device may further include a housing that houses the light projection unit and the imaging unit.
  • the fixing member may be fixed to the housing.
  • the light projection unit and the imaging unit may be fixed to the housing via a fixing member.
  • the optical projection unit may include an optical circuit unit including a substrate and a plurality of phase-modulable waveguides provided on the substrate, and the optical circuit unit may be fixed to the mounting surface of the fixing member.
  • the light projection unit projects a pattern light onto an object by causing a substrate and an optical circuit unit having a plurality of phase-modulable waveguides provided on the substrate to interfere with a plurality of light beams emitted from the plurality of waveguides.
  • You may include a projection lens and the lens holding part holding a projection lens.
  • the optical circuit unit may be fixed to the mounting surface of the fixing member via the lens holding unit.
  • the optical circuit unit may have a side surface that intersects the projection axis direction, and the lens holding unit may be fixed to the side surface.
  • a plurality of waveguide exits may be provided on the side surface of the optical circuit unit.
  • FIG. 1 is a diagram schematically illustrating a configuration of an optical measurement device 100 according to the first embodiment.
  • the optical measurement device 100 includes a light projection unit 20, an imaging unit 30, a light source 38, and a control unit 40.
  • the optical measurement device 100 is incorporated in an endoscope scope 10 having a distal end portion 12, an insertion portion 14, and a connection portion 16, and the three-dimensional shape of a target site in the lumen is made by directing the distal end portion 12 toward an object. Used to measure The optical measuring device 100 is used to measure an object by a three-dimensional measuring method called a “fringe scanning method”.
  • the front end portion 12 is a portion that accommodates the light projection portion 20 and the imaging portion 30, and an outer surface is constituted by a hard casing 18 made of metal or the like.
  • a cover glass 32 is provided at the tip of the housing 18.
  • the insertion portion 14 is formed of a flexible member, and the direction of the distal end portion 12 can be adjusted by bending the vicinity of the distal end portion 12. Therefore, the endoscope scope 10 is configured as a flexible mirror, and the distal end portion 12 is less flexible than the insertion portion 14.
  • An optical fiber 34, a wiring cable 36, and the like are inserted inside the insertion portion 14.
  • the connection unit 16 is a plug or the like for connecting the endoscope scope 10 to the light source 38 or the control unit 40.
  • the light projection unit 20 projects pattern light such as the interference fringe pattern 90 onto the object.
  • a cover glass 32 is provided at the distal end portion 12, and the light projection unit 20 projects pattern light through the cover glass 32.
  • the light projection unit 20 includes an optical circuit unit 22, a projection lens 24, and a lens holding unit 26.
  • the optical circuit unit 22 is a so-called planar optical integrated circuit (PLC), and for example, a waveguide structure is formed on a silicon substrate using a quartz-based material.
  • the optical circuit unit 22 is coupled to the optical fiber 34 via the fiber block 28.
  • the optical circuit unit 22 includes a plurality of phase-modulable waveguides, and generates pattern light by causing interference between a plurality of light beams emitted from the plurality of waveguides.
  • the optical circuit unit 22 can project a plurality of types of pattern light having different bright and dark positions of the interference fringe pattern 90 by changing the phase difference between the plurality of waveguides.
  • the projection lens 24 shapes a plurality of light beams emitted from the optical circuit unit 22 so that the interference fringe pattern 90 is formed in a desired region.
  • the lens holding unit 26 holds the projection lens 24 so that the projection lens 24 is disposed at a desired position with respect to the optical circuit unit 22.
  • the lens holding unit 26 holds the projection lens 24 so as to be an off-axis system in which the optical axis of the projection lens 24 is shifted with respect to the optical circuit unit 22.
  • the projection axis A of the light projection unit 20 and the imaging axis B of the imaging unit 30 intersect each other.
  • the angle ⁇ formed by the projection axis A and the imaging axis B is about 1 ° to 30 °, although it depends on the distance from the tip 12 to the measurement object.
  • the imaging unit 30 images an object on which the interference fringe pattern 90 is projected, and generates an interference fringe image based on the pattern light.
  • the imaging unit 30 receives light from the object on which the interference fringe pattern 90 is projected through the cover glass 32.
  • the imaging unit 30 captures an object on which a plurality of types of pattern light having different bright and dark positions of the interference fringe pattern 90 is projected, and generates a plurality of types of interference fringe images corresponding to the plurality of types of pattern light.
  • the imaging unit 30 is fixed to the optical circuit unit 22 and is electrically connected to a wiring unit 48 provided in the optical circuit unit 22.
  • the wiring unit 48 is connected to the wiring cable 36, and the interference fringe image captured by the imaging unit 30 is transmitted to the control unit 40 via the wiring cable 36.
  • the light source 38 outputs coherent light for generating the interference fringe pattern 90, for example, a single wavelength laser beam.
  • the output light from the light source 38 is input to the optical circuit unit 22 through the optical fiber 34.
  • the light source 38 includes a solid-state laser source such as a semiconductor laser element.
  • the light source 38 may include a control mechanism that controls the drive current, the operating temperature, and the like of the light emitting element, and controls the output intensity and output wavelength of the light source 38 to be constant.
  • the control mechanism may include a light receiving element and a driving element for realizing feedback driving according to the output intensity of the light source 38 and a temperature adjusting element such as a Peltier element for adjusting the temperature of the light source 38.
  • a temperature adjusting element such as a Peltier element for adjusting the temperature of the light source 38.
  • the control unit 40 controls the operation of the light projection unit 20 and acquires an interference fringe image captured by the imaging unit 30.
  • the control unit 40 controls the phase difference between the plurality of waveguides provided in the optical circuit unit 22 and scans the interference fringe pattern 90.
  • the control unit 40 acquires a plurality of types of interference fringe images corresponding to each of a plurality of types of pattern light from the imaging unit 30, and generates a distance image or a three-dimensional display image based on the plurality of types of interference fringe images.
  • a phase distribution image is first generated.
  • the phase distribution image is obtained by imaging the initial phase value at the position of each pixel of the interference fringe image.
  • the phase distribution image can be calculated based on a known algorithm from the phase values of the plurality of types of pattern light and the pixel values of the plurality of interference fringe images.
  • a distance image or a three-dimensional display image can be obtained by geometrically deriving the three-dimensional shape of the object from the arrangement of the light projection unit 20 and the imaging unit 30 and the phase distribution image.
  • FIG. 2 is a top view showing the configuration of the distal end portion 12 of FIG. 1 in more detail, and corresponds to a partially enlarged view of FIG.
  • the direction in which the imaging axis B extends (also referred to as the imaging axis direction) is the z direction
  • the direction in which the projection axis A and the imaging axis B are separated is the x direction
  • the direction orthogonal to both the x direction and the z direction is defined as the y direction.
  • the optical circuit unit 22 includes a substrate 60, an input waveguide 41 provided on the substrate 60, a branching unit 42, a first waveguide 43, a second waveguide 44, a first phase modulator 45, and a second phase modulator. 46 and a wiring portion 48.
  • the input waveguide 41, the branching section 42, the first waveguide 43 and the second waveguide 44 are waveguide structures formed on the substrate 60.
  • the input waveguide 41 is coupled to the optical fiber 34 via the fiber block 28.
  • the light input to the input waveguide 41 is branched into the first waveguide 43 and the second waveguide 44 at the branch portion 42.
  • the first waveguide 43 extends linearly from the branch portion 42 toward the first exit port 43a
  • the second waveguide 44 extends linearly from the branch portion 42 toward the second exit port 44a. To do.
  • the first waveguide 43 and the second waveguide 44 extend linearly in the z direction and are spaced apart in the x direction. That is, the first waveguide 43 and the second waveguide 44 extend in the z direction so as to be parallel to each other.
  • the input waveguide 41, the branching section 42, the first waveguide 43, and the second waveguide 44 are arranged side by side in the z direction.
  • the length of the input waveguide 41 in the z direction is about 0.5 mm
  • the length of the branch portion 42 in the z direction is about 1 mm
  • the length of the first waveguide 43 and the second waveguide 44 in the z direction Is about 2.5 mm.
  • the length of the substrate 60 in the z direction is about 4 mm.
  • the distance between the first emission port 43aa and the second emission port 44a is about 50 ⁇ m to 100 ⁇ m.
  • the input waveguide 41, the branching section 42, the first waveguide 43, and the second waveguide 44 are not limited to the illustrated structure, and may be configured by other structures.
  • the branching unit 42 may be a directional coupler, a multimode interference coupler, or a star coupler, in addition to the Y branching waveguide as illustrated.
  • the input waveguide 41, the first waveguide 43, and the second waveguide 44 may not be entirely configured in a straight line, and may be configured to include a curved portion.
  • the first phase modulator 45 is provided along the first waveguide 43 and controls the phase of light passing through the first waveguide 43 by changing the optical path length of the first waveguide 43.
  • the second phase modulator 46 is provided along the second waveguide 44, and controls the phase of light passing through the second waveguide 44 by changing the optical path length of the second waveguide 44.
  • the first phase modulator 45 and the second phase modulator 46 control the phases of the waveguides 43 and 44 by the electro-optic effect or the thermo-optic effect.
  • the first phase modulator 45 and the second waveguide 44 are heaters, for example, and change the phase of the corresponding waveguides 43 and 44 by heating the waveguides 43 and 44.
  • the first phase modulator 45 and the second phase modulator 46 are electrically connected to the wiring unit 48 and operate based on a control signal from the control unit 40.
  • the light phase-modulated by the first waveguide 43 is emitted from the first emission port 43a, and the light phase-modulated by the second waveguide 44 is emitted from the second emission port 44a.
  • the first emission port 43 a and the second emission port 44 a are provided on the side surface 22 c of the optical circuit unit 22.
  • the side surface 22c is a surface that is configured by a plane (xy plane) orthogonal to the z direction and intersects both the direction in which the projection axis A extends (also referred to as the projection axis direction) and the imaging axis direction.
  • the projection lens 24 is fixed by being fitted into the holding groove 27 of the lens holding portion 26.
  • the holding groove 27 is a groove that extends in the x direction and the z direction and is engraved in a cross shape, and assists the positioning of the projection lens 24 in the three directions x, y, and z.
  • the shape of the holding groove 27 is defined such that the projection lens 24 is disposed at a predetermined position with respect to the first emission port 43a and the second emission port 44a.
  • the shape of the holding groove 27 is determined so that, for example, the projection lens 24 is disposed at a position shifted in the x direction with respect to the virtual wave source 47 that is an intermediate point between the first emission port 43a and the second emission port 44a.
  • the virtual wave source 47 refers to a virtual light source of pattern light such as the interference fringe pattern 90, and refers to a point that can be regarded as optically radiating pattern light from the virtual wave source 47.
  • the lens holding unit 26 is attached to the side surface 22c of the optical circuit unit 22, and is adjacent to the optical circuit unit 22 in the z direction. Therefore, the lens holding unit 26 is fixed to the optical circuit unit 22 and is fixed to an attachment surface that intersects both the projection axis direction and the imaging axis direction.
  • the lens holding part 26 is preferably made of a material having a low coefficient of thermal expansion, and is made of a glass material such as quartz glass.
  • the lens holding unit 26 is attached to the side surface 22c of the optical circuit unit 22 by adhesion or fusion using an adhesive.
  • the imaging unit 30 includes an imaging element 50 and an imaging lens 52.
  • the imaging lens 52 forms an image of the object on which the interference fringe pattern 90 is projected on the imaging element 50.
  • the image sensor 50 is an image sensor such as a CCD or CMOS sensor, and outputs an image signal based on the captured interference fringe image.
  • the imaging element 50 is electrically connected to the wiring unit 48 of the optical circuit unit 22, and an image signal based on the interference fringe image is transmitted to the control unit 40 via the wiring cable 36.
  • the imaging unit 30 is attached to the side surface 22c of the optical circuit unit 22, and is adjacent to the optical circuit unit 22 in the z direction.
  • the imaging unit 30 is fixed to the optical circuit unit 22 and is fixed to a mounting surface that intersects both the projection axis direction and the imaging axis direction. In the present embodiment, the imaging unit 30 is fixed to a mounting surface orthogonal to the imaging axis direction.
  • the imaging unit 30 is attached to the side surface 22c of the optical circuit unit 22 by adhesion or fusion using an adhesive.
  • a joint portion with the side surface 22 c of the optical circuit unit 22 may be made of a glass material such as quartz glass.
  • the imaging unit 30 is arranged side by side with the projection lens 24 and the lens holding unit 26 in the x direction. Note that no fixing member is provided between the lens holding unit 26 and the imaging unit 30, and the relative positions of the lens holding unit 26 and the imaging unit 30 are determined based on the side surface 22 c of the optical circuit unit 22.
  • the fiber block 28 and the optical fiber 34 are attached to the side surface 22d opposite to the side surface 22c of the optical circuit unit 22 to which the lens holding unit 26 and the imaging unit 30 are attached.
  • the fiber block 28 and the optical fiber 34 are attached to the side surface 22d of the optical circuit unit 22 by adhesion or fusion using an adhesive.
  • FIG. 3 is a side view schematically showing the configuration of the light projection unit 20 and shows the configuration when the light projection unit 20 is viewed in the x direction.
  • the optical circuit unit 22 includes a substrate 60 and a clad layer 62 provided on the upper surface 60 a of the substrate 60.
  • the substrate 60 is, for example, a silicon wafer, and the cladding layer 62 is made of a material mainly composed of silicon oxide (SiO 2 ).
  • the waveguide structure of the optical circuit unit 22 is provided in the cladding layer 62.
  • the input waveguide 41, the branch portion 42, the first waveguide 43, and the second waveguide 44 are realized by a core portion provided inside the cladding layer 62.
  • the first phase modulator 45 and the second phase modulator 46 are provided on the cladding layer 62.
  • a wiring portion 48 (not shown in FIG. 3) is also provided on the cladding layer 62.
  • the substrate 60 is fixed to the carrier base 66 via the first adhesive layer 64.
  • the carrier base 66 is provided on the lower surface 60 b side opposite to the upper surface 60 a of the substrate 60.
  • the carrier base 66 is fixed to the housing 18 via the second adhesive layer 68. Therefore, the optical circuit unit 22 is fixed to the housing 18 via the carrier base 66.
  • a second adhesive layer 68 is provided on the lower surface 66 b opposite to the substrate 60 with the carrier base 66 interposed therebetween, and is fixed to the housing 18 by the lower surface 66 b of the carrier base 66.
  • the method of fixing the carrier base 66 is not particularly limited, and the carrier base 66 may be fixed to the housing 18 on the side surface of the carrier base 66. Further, the substrate 60 may be fixed to the housing 18 via the first adhesive layer 64 without using the carrier base 66.
  • the carrier base 66 at least one of a metal material, a resin material, and a ceramic material can be used.
  • a glass epoxy substrate or an aluminum (Al) substrate can be used.
  • the material of the first adhesive layer 64 and the second adhesive layer 68 is not particularly limited, and at least one of a resin material and a metal material can be used.
  • an adhesive tape, a resin adhesive, a silver (Ag) paste, solder, or the like can be used as the first adhesive layer 64 and the second adhesive layer 68.
  • the lens holding unit 26 is fixed to the side surface 22 c of the optical circuit unit 22.
  • the lens holding unit 26 is fixed to the side surface of the substrate 60, for example.
  • the lens holding unit 26 may be fixed only to the side surface of the substrate 60, or may be fixed to both side surfaces of the substrate 60 and the clad layer 62.
  • the lens holding portion 26 is not directly fixed to the carrier base 66 or the casing 18, and when the substrate 60 and the cladding layer 62 are deformed or displaced due to warpage or the like, the deformation or displacement Displaces following. The same applies to the imaging unit 30 that is not shown in FIG.
  • the optical circuit unit 22 branches the light from the light source 38 into the first waveguide 43 and the second waveguide 44.
  • the control unit 40 drives the first phase modulator 45 and the second phase modulator 46 to control the phase difference between the first waveguide 43 and the second waveguide 44.
  • the projection lens 24 causes the pattern light to be projected onto the object by interfering with the two phase-modulated light beams emitted from the first emission port 43a and the second emission port 44a.
  • the imaging unit 30 captures an interference fringe image of the object on which the pattern light is projected.
  • the controller 40 changes the light / dark position of the interference fringe pattern 90 by changing the phase difference between the first waveguide 43 and the second waveguide 44.
  • the imaging unit 30 generates a plurality of types of interference fringe images corresponding to a plurality of types of interference fringe patterns 90 having different light and dark positions.
  • the control unit 40 analyzes a plurality of types of captured interference fringe images and derives a three-dimensional shape of the target object.
  • the inside of the housing 18 is heated by the driving heat of the optical circuit unit 22 and the imaging unit 30.
  • heat is generated mainly by driving the first phase modulator 45 and the second phase modulator 46.
  • heat is generated by driving a semiconductor element such as a transistor included in the imaging element 50. Since the components provided inside the housing 18 are fixed to each other, deformation such as warpage may occur due to a difference in thermal expansion coefficient between the components. In particular, since the optical circuit section 22 has a shape that is long in the z direction in which the waveguide extends and has a small thickness in the y direction, warpage is likely to occur due to a difference in thermal expansion coefficient between the substrate 60 and the cladding layer 62.
  • the fringe scanning method derives the depth or height of the object surface based on the angle ⁇ formed by the projection axis A and the imaging axis B.
  • FIG. 4 is a diagram schematically showing a change in the projection axis A when the optical circuit unit 82 according to the comparative example is warped.
  • the optical circuit portion 82 and the lens holding portion 86 are attached to the upper surface 88a of the carrier base 88, and the upper surface 88a which is a plane in the direction along the projection axis A is the attachment surface.
  • an imaging unit (not shown) is also attached to the upper surface 88 a of the carrier base 88.
  • the optical circuit portion 82 Since the optical circuit portion 82 has a thermal expansion coefficient of the clad layer smaller than that of the substrate, when heated by driving heat, the substrate is warped so that the substrate extends relatively large and protrudes downward. As a result, the side surface 82c of the optical circuit unit 82 where the virtual wave source 87 is located is inclined obliquely, and the side surface 82c is displaced upward. On the other hand, since the lens holding portion 86 is disposed away from the optical circuit portion 82, the amount of deformation due to heat is smaller than that of the optical circuit portion 82. As a result, the direction of the projection axis A1 that connects the virtual wave source 87 and the center of the projection lens 84 is directed away from the projection axis A before deformation.
  • the side surface 82c of the optical circuit unit 82 is used as a reference, the side surface 82c is directed upward, whereas the projection axis A1 after deformation is directed downward, so that the projection axes A and A1 viewed from the side surface 82c are , Changes greatly before and after deformation.
  • the positional relationship between the projection axis A1 and the imaging axis B may be maintained even after thermal deformation.
  • the imaging unit is attached to the carrier base 88 independently of the optical circuit unit 82, the deformation mode of the optical circuit unit 82 and the deformation mode of the imaging unit are probably not the same.
  • the positional relationship between the projection axis A1 and the imaging axis B is shifted due to thermal deformation, which affects the measurement accuracy of the fringe scanning method.
  • an error of about 1 mm is caused in the three-dimensional shape measurement of the object only by shifting the position of the virtual wave source 87 by 1 ⁇ m. If the deformation of the optical circuit unit 82 is larger, a larger measurement error may be caused.
  • FIG. 5 is a diagram schematically illustrating a change in the projection axis A when the optical circuit unit 22 according to the embodiment is warped.
  • the optical circuit portion 22 is warped, the side surface 22c is inclined, and the optical circuit portion 22 is displaced upward (y direction).
  • the lens holding unit 26 is also displaced in the y direction following the deformation of the side surface 22c, so that the position of the projection lens 24 with respect to the position of the side surface 22c of the optical circuit unit 22 does not change much.
  • the direction of the projection axis A2 based on the position of the side surface 22c of the optical circuit unit 22 is not much different from the direction of the projection axis A before deformation.
  • the position of the imaging unit 30 with respect to the position of the side surface 22c of the optical circuit unit 22 does not change much.
  • the direction of both the projection axis A and the imaging axis B viewed from the side surface 22c of the optical circuit unit 22 can be prevented from changing, and the change in the positional relationship between the projection axis A and the imaging axis B can be suppressed.
  • a change in the angle ⁇ formed by the imaging axis B can be reduced. Thereby, the fall of the measurement accuracy resulting from the deformation
  • FIG. 6 and 7 are diagrams schematically illustrating a configuration of an optical measurement device 200 according to the second embodiment.
  • FIG. 6 is a top view and corresponds to FIG. 2 described above.
  • FIG. 7 is a side view and corresponds to FIG. 3 described above.
  • the light projection unit 120 and the imaging unit 130 are attached to the main surface 132c of the cover glass 132, and the main surface 132c of the cover glass 132 serves as an attachment surface serving as a reference for the attachment position.
  • the present embodiment will be described focusing on differences from the first embodiment described above.
  • the optical measurement device 200 includes an optical projection unit 120 and an imaging unit 130.
  • the light projection unit 120 and the imaging unit 130 are provided inside the housing 118 of the distal end portion 12 of the endoscope scope.
  • a cover glass 132 that intersects both the projection axis A and the imaging axis B is attached to the casing 118.
  • the light projection unit 120 and the imaging unit 130 are fixed to the main surface 132 c of the cover glass 132.
  • the main surface 132c of the cover glass 132 is an attachment surface that intersects both the projection axis direction and the imaging axis direction. It can be said that the cover glass 132 is a fixing member for positioning the light projection unit 120 and the imaging unit 130.
  • the light projection unit 120 includes an optical circuit unit 122, a projection lens 24, and a lens holding unit 26.
  • the optical circuit unit 122 includes a substrate 160 and a clad layer 162 on the upper surface 160 a of the substrate 160.
  • the clad layer 162 is provided with a waveguide structure similar to that of the first embodiment described above.
  • the wiring unit 148 is electrically connected to the first phase modulator 45 and the second phase modulator 46, and is connected to the control unit 40 via the first wiring cable 136.
  • the lens holding part 26 is attached to the main surface 132c of the cover glass 132.
  • the lens holding part 26 is attached to the main surface 132c of the cover glass 132 by adhesion or fusion using an adhesive.
  • the lens holding portion 26 is attached to the side surface 122c of the optical circuit portion 122, as in the first embodiment.
  • the optical circuit unit 122 is fixed only to the lens holding unit 26. That is, in the present embodiment, the carrier base 66 as in the first embodiment is not provided, and a member for fixing between the lower surface 160b of the substrate 160 and the housing 118 is not provided. As a result, the optical circuit unit 122 is fixed to the cover glass 132 via the lens holding unit 26.
  • the image pickup unit 130 includes the image pickup device 50 and the image pickup lens 52 as in the first embodiment.
  • the image sensor 50 is electrically connected to the second wiring cable 137, and an image signal is transmitted to the control unit 40 via the second wiring cable 137.
  • the imaging unit 130 is fixed to the main surface 132c of the cover glass 132, and is attached so that the main surface 132c of the cover glass 132 and the imaging axis B are orthogonal to each other.
  • the projection axis A and the imaging axis B due to thermal deformation are fixed.
  • the change in relative position can be reduced.
  • the lens holding unit 26 and the imaging unit 130 are fixed to a fixing member (cover glass 132) made of a glass material having a small coefficient of thermal expansion, the amount of change in the relative position of the projection lens 24 and the imaging lens 52 is changed. Can be reduced.
  • the lens holding unit 26 is fixed to the side surface 122c of the optical circuit unit 122, the positional relationship between the side surface 122c and the lens holding unit 26 can be fixed even when the optical circuit unit 122 is warped. As a result, a change in the relative position between the virtual wave source 47 and the projection lens 24 provided on the side surface 122c of the optical circuit unit 122 can be reduced. Therefore, also in the present embodiment, a change in the relative position between the projection axis A and the imaging axis B due to thermal deformation can be reduced, and a decrease in measurement accuracy due to thermal deformation can be suppressed.
  • FIG. 8 is a diagram schematically illustrating the configuration of the optical measurement apparatus 300 according to the third embodiment.
  • the present embodiment is common to the second embodiment described above in that the light projection unit 220 and the imaging unit 130 are attached to the main surface 132c of the cover glass 132.
  • the optical circuit unit 222 and the projection included in the light projection unit 220 are the same.
  • the fixing method of the lens 224 is different from the above-described embodiment.
  • the present embodiment will be described focusing on differences from the above-described embodiments.
  • the optical measurement device 300 includes a light projection unit 220 and an imaging unit 130.
  • the light projection unit 220 and the imaging unit 130 are provided inside the housing 118 of the distal end portion 12 of the endoscope scope.
  • the light projection unit 220 and the imaging unit 130 are fixed to the main surface 132 c of the cover glass 132.
  • the light projection unit 220 includes an optical circuit unit 222, a projection lens 224, a first holding member 264, a second holding member 266, a third holding member 268, and a fourth holding member 270.
  • the optical circuit unit 222 is fixed to the third holding member 268 and is fixed to the inside of the second holding member 266 via the third holding member 268.
  • the optical circuit unit 222 is joined to the third holding member 268 at the side surface 222c where the exit of the waveguide is provided.
  • the projection lens 224 is sandwiched and fixed between the first holding member 264 and the second holding member 266.
  • the first holding member 264 has a bottom surface 234a fixed to the main surface 132c of the cover glass 132, and an opening 234b for passing pattern light is provided at the center of the bottom surface 234a.
  • An engaging part 234c for fixing the second holding member 266 is provided on the opposite side of the bottom surface 234a.
  • the engaging portion 234c is provided so as to protrude in the z direction, and a threading structure for screwing with the first end 266a of the second holding member 266 is provided on the inner periphery thereof.
  • the second holding member 266 is a cylindrical member and accommodates the optical circuit unit 222 therein.
  • a first recess 266 c for receiving the projection lens 224 is provided at the first end 266 a of the second holding member 266.
  • the second end 266b opposite to the first end 266a is provided with a second recess 266d for accommodating the optical circuit unit 222.
  • the first recess 266c and the second recess 266d communicate with each other via an internal space extending in the axial direction (z direction).
  • the third holding member 268 is a flat plate member having optical transparency.
  • the optical circuit unit 222 is attached to the third holding member 268, and the side surface 222 c of the optical circuit unit 222 is joined to the third holding member 268.
  • the third holding member 268 is fitted into the bottom of the second recess 266d and is sandwiched between the second holding member 266 and the fourth holding member 270.
  • the fourth holding member 270 is a ring-shaped member, and is screwed with a threading structure provided at the bottom of the second recess 266d to fix the third holding member 268.
  • the optical circuit unit 222 and the projection lens 224 are fixed by the cylindrical second holding member 266, a change in the relative position between the optical circuit unit 222 and the projection lens 224 due to thermal deformation can be reduced.
  • the optical circuit unit 222 is fixed to the second holding member 266 with reference to the side surface 222c of the optical circuit unit 222 from which the pattern light is emitted, even when the optical circuit unit 222 is warped due to thermal deformation. The displacement of the side surface 222c can be suppressed, and the change in the positional relationship between the side surface 222c and the projection lens 224 can be reduced.
  • the light projection unit 220 is fixed to the mounting surface (the main surface 132c of the cover glass 132) that intersects both the projection axis direction and the imaging axis direction, the projection axis A and the imaging axis B A change in relative position can be reduced, and a decrease in measurement accuracy due to thermal deformation can be suppressed.
  • FIG. 9 is a top view schematically showing the configuration of the optical measurement apparatus 400 according to the first modification.
  • a projection lens is not provided in the light projection unit 320, and pattern light emitted from a plurality of waveguides of the optical circuit unit 322 is projected onto an object without passing through the lens.
  • the optical circuit unit 322 is fixed to the main surface 332c of the cover glass 332 in which the side surface 322c where the emission ports of the plurality of waveguides are provided is fixed to the housing 318.
  • the optical circuit unit 322 is fixed to a mounting surface orthogonal to the projection axis A.
  • the imaging unit 330 is attached to the main surface 332c of the cover glass 332 as in the above-described embodiment, and is fixed to an attachment surface orthogonal to the imaging axis B. Also in this modification, the same effect as the above-mentioned Example can be produced.
  • FIG. 10 is a top view schematically showing the configuration of the optical measurement apparatus 500 according to the second modification.
  • the projection axis A and the imaging axis B intersect each other by attaching the light projection unit 320 obliquely to the cover glass 332.
  • the light projection unit 320 is fixed to the main surface 332 c of the cover glass 332 via the mediating member 470.
  • the mediating member 470 has a first surface 470 a that is fixed to the side surface 322 c of the optical circuit portion 322, and a second surface 470 b that is fixed to the main surface 332 c of the cover glass 332.
  • the first surface 470a of the mediating member 470 is inclined with respect to the second surface 470b, and the inclination angle corresponds to the intersection angle of the projection axis A and the imaging axis B. Also in this modification, the same effect as the above-mentioned Example can be produced.
  • FIG. 11 is a top view schematically showing the configuration of the optical measurement device 600 according to the third modification.
  • This modification is configured such that the optical circuit portion 522 serves as a reference for the mounting position, as in the first embodiment described above. That is, the light projection unit 520 and the imaging unit 530 are not fixed to the cover glass 332, and no attachment member or mediation member is provided between the light projection unit 520 and the imaging unit 530.
  • the optical circuit unit 522 includes a first side surface 522c provided with an exit of a plurality of waveguides, a second side surface 522d to which the imaging unit 530 is attached, and a third side surface 522e to which the optical fiber 34 and the wiring cable 36 are connected.
  • the first side surface 522c and the second side surface 522d are provided on the opposite side of the third side surface 522e, and are provided at positions shifted from each other in the z direction.
  • the first side surface 522c and the second side surface 522d are provided so as to be parallel to each other, and intersect or orthogonal to both the projection axis direction and the imaging axis direction.
  • the imaging unit 530 is fixed with reference to the side surface that intersects both the projection axis direction and the imaging axis direction of the optical circuit unit 522, the same effect as the above-described embodiment can be achieved.
  • FIG. 12 is a top view schematically showing the configuration of the optical measurement apparatus 700 according to the fourth modification.
  • the projection axis A and the imaging axis B intersect each other by attaching the imaging unit 530 to the optical circuit unit 522 so as to be inclined.
  • the imaging unit 530 is fixed to the second side surface 522d of the optical circuit unit 522 via the mediating member 670.
  • the mediating member 670 has a first surface fixed to the second side surface 522d of the optical circuit unit 522 and a second surface fixed to the imaging unit 530, and the second surface is inclined with respect to the first surface. It is configured as follows. Also in this modification, since the imaging unit 530 is fixed with reference to the side surface that intersects both the projection axis direction and the imaging axis direction of the optical circuit unit 522, the same effect as the above-described embodiment can be achieved.
  • the second side surface 522d is configured such that the second side surface 522d is inclined with respect to the first side surface 522c of the optical circuit portion 522, and the inclined second side surface 522d is provided.
  • the imaging unit 530 may be fixed.
  • the optical measuring device is a flexible endoscope
  • the endoscope may be a rigid endoscope that is configured so that the insertion portion does not have flexibility.
  • the endoscope apparatus may be used for medical purposes or may be used for industrial purposes.
  • the optical measurement device according to the present embodiment may not be incorporated in the endoscope.
  • the above-described embodiments and modifications may be applied not only to the fringe scanning method but also to a measurement technique using the structured illumination method.
  • the optical circuit unit in which the phase modulator is provided in each of the first and second waveguides branched from Y is shown.
  • the phase modulator may be provided only in one of the first waveguide and the second waveguide.
  • a ball lens is used as the projection lens
  • a plano-convex lens may be used as the projection lens, or a concave lens may be used.
  • the projection lens may be configured by a combination of a plurality of lenses including a concave lens or a convex lens.
  • the lens holding unit 26 and the imaging unit 30 are attached to the same side surface 22c of the optical circuit unit 22 .
  • the first side surface and the second side surface that are displaced in the z direction are provided in the optical circuit unit, the lens holding unit is attached to the first side surface, and the imaging unit is It may be attached to the second side. That is, each of the lens holding unit and the imaging unit may be attached to different side surfaces of the optical circuit unit.
  • SYMBOLS 18 Housing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
PCT/JP2018/002212 2017-01-25 2018-01-25 光計測装置 Ceased WO2018139512A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201880006783.0A CN110199174B (zh) 2017-01-25 2018-01-25 光计测装置
DE112018000511.9T DE112018000511T5 (de) 2017-01-25 2018-01-25 Optische messvorrichtung
US16/517,736 US20190339069A1 (en) 2017-01-25 2019-07-22 Optical measurement apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-011686 2017-01-25
JP2017011686A JP6785674B2 (ja) 2017-01-25 2017-01-25 光計測装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/517,736 Continuation US20190339069A1 (en) 2017-01-25 2019-07-22 Optical measurement apparatus

Publications (1)

Publication Number Publication Date
WO2018139512A1 true WO2018139512A1 (ja) 2018-08-02

Family

ID=62977918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/002212 Ceased WO2018139512A1 (ja) 2017-01-25 2018-01-25 光計測装置

Country Status (5)

Country Link
US (1) US20190339069A1 (enExample)
JP (1) JP6785674B2 (enExample)
CN (1) CN110199174B (enExample)
DE (1) DE112018000511T5 (enExample)
WO (1) WO2018139512A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021009057A (ja) * 2019-06-28 2021-01-28 株式会社サキコーポレーション 形状測定装置、形状測定装置の形状測定方法および形状測定装置の形状測定プログラム
WO2024121941A1 (ja) * 2022-12-06 2024-06-13 オリンパスメディカルシステムズ株式会社 干渉縞投影光学系、形状測定装置、及び形状測定方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111121651A (zh) * 2018-10-31 2020-05-08 财团法人工业技术研究院 光学测量稳定性控制系统
JP7319084B2 (ja) * 2019-04-26 2023-08-01 株式会社キーエンス 光学式変位計
DE102020203857A1 (de) * 2020-03-25 2021-09-30 Micro-Epsilon Optronic Gmbh Optische Positionierhilfe für einen Abstandssensor, Abstandsmesssystem und entsprechendes Verfahren

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498776A (en) * 1982-08-23 1985-02-12 General Motors Corporation Electro-optical method and apparatus for measuring the fit of adjacent surfaces
JPH041505A (ja) * 1990-04-18 1992-01-07 Matsushita Electric Ind Co Ltd ワークの３次元位置計測方法とワークの捕捉方法
JPH0587543A (ja) * 1990-10-23 1993-04-06 Olympus Optical Co Ltd 計測内視鏡
JP2002122416A (ja) * 2000-10-16 2002-04-26 Sumitomo Osaka Cement Co Ltd 三次元形状測定装置
JP2003214824A (ja) * 2002-01-24 2003-07-30 Fuji Mach Mfg Co Ltd 物体形状認識方法及び装置
JP2014102073A (ja) * 2011-03-10 2014-06-05 Sanyo Electric Co Ltd 物体検出装置および情報取得装置
WO2016006049A1 (ja) * 2014-07-09 2016-01-14 一般社団法人日本建設機械施工協会 コンクリート構造物のひび割れ調査方法およびひび割れ調査システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0933393A (ja) * 1995-07-19 1997-02-07 Sumitomo Electric Ind Ltd 光導波路型回折格子の測定装置
JPH1027376A (ja) * 1996-07-12 1998-01-27 Nikon Corp 光情報検出装置
CN2323388Y (zh) * 1997-12-27 1999-06-09 中国科学院长春物理研究所 集成光学声光矩阵乘法器组件
JP2009008900A (ja) * 2007-06-28 2009-01-15 Nec Corp シリコン構造体
JP2009020356A (ja) * 2007-07-12 2009-01-29 Nec Corp シリコン構造体
JP2009031150A (ja) * 2007-07-27 2009-02-12 Omron Corp 三次元形状計測装置、三次元形状計測方法、三次元形状計測プログラム、および記録媒体
WO2010132802A2 (en) * 2009-05-14 2010-11-18 Andover Photonics, Inc. Shape measurement using microchip based fringe projection
JP5313983B2 (ja) * 2010-09-07 2013-10-09 日本電信電話株式会社 光モジュール
JP5390562B2 (ja) * 2011-06-22 2014-01-15 日本電信電話株式会社 平面型光波回路
JP5582267B1 (ja) * 2014-01-17 2014-09-03 株式会社東光高岳 連続走査型計測装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498776A (en) * 1982-08-23 1985-02-12 General Motors Corporation Electro-optical method and apparatus for measuring the fit of adjacent surfaces
JPH041505A (ja) * 1990-04-18 1992-01-07 Matsushita Electric Ind Co Ltd ワークの３次元位置計測方法とワークの捕捉方法
JPH0587543A (ja) * 1990-10-23 1993-04-06 Olympus Optical Co Ltd 計測内視鏡
JP2002122416A (ja) * 2000-10-16 2002-04-26 Sumitomo Osaka Cement Co Ltd 三次元形状測定装置
JP2003214824A (ja) * 2002-01-24 2003-07-30 Fuji Mach Mfg Co Ltd 物体形状認識方法及び装置
JP2014102073A (ja) * 2011-03-10 2014-06-05 Sanyo Electric Co Ltd 物体検出装置および情報取得装置
WO2016006049A1 (ja) * 2014-07-09 2016-01-14 一般社団法人日本建設機械施工協会 コンクリート構造物のひび割れ調査方法およびひび割れ調査システム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021009057A (ja) * 2019-06-28 2021-01-28 株式会社サキコーポレーション 形状測定装置、形状測定装置の形状測定方法および形状測定装置の形状測定プログラム
JP7456736B2 (ja) 2019-06-28 2024-03-27 株式会社サキコーポレーション 形状測定装置、形状測定装置の形状測定方法および形状測定装置の形状測定プログラム
WO2024121941A1 (ja) * 2022-12-06 2024-06-13 オリンパスメディカルシステムズ株式会社 干渉縞投影光学系、形状測定装置、及び形状測定方法

Also Published As

Publication number Publication date
JP6785674B2 (ja) 2020-11-18
DE112018000511T5 (de) 2019-10-02
JP2018119865A (ja) 2018-08-02
CN110199174B (zh) 2021-09-03
US20190339069A1 (en) 2019-11-07
CN110199174A (zh) 2019-09-03

Similar Documents

Publication Publication Date Title
WO2018139512A1 (ja) 光計測装置
EP3160324B1 (en) Mounting system for optics
CN102326114A (zh) 光轴调整装置、光轴调整方法及投射型显示装置
US10499023B2 (en) Projection device and a method of manufacturing a projection device
KR20040095721A (ko) 투영노광장치
JP6831709B2 (ja) 縞投影装置および縞投影装置の制御方法
KR20160097299A (ko) 이미징 모듈 및 이미징 디바이스
JP5759499B2 (ja) 光アセンブリ
US20250314877A1 (en) Method and system for using characterization light to detect fiber position in a fiber scanning projector
US8934161B2 (en) Method of manufacturing optical scanning apparatus and optical scanning apparatus
JP6574101B2 (ja) 内視鏡システム
JP4514316B2 (ja) 半導体レーザモジュールの製造方法
KR102830714B1 (ko) 전자 광학 시스템을 조절, 조립 및/또는 테스트하기 위한 장치, 방법 및 이러한 장치의 용도
JP7424477B2 (ja) ３次元計測システム
WO2012176623A1 (ja) 物体検出装置および情報取得装置
JP2019203926A (ja) 接続装置
JP2014240958A (ja) 光モジュール
JP6089644B2 (ja) 光素子接続方法及び光素子接続装置
TWI312083B (en) Efficient coupling of light into light guides
JP4213439B2 (ja) レンズブロック
TWI742473B (zh) 結構光發射模組及圖像採集裝置
JP6984561B2 (ja) 干渉縞間隔可変光回路及び縞投影装置
JP2014199861A (ja) パターン描画装置およびパターン描画方法
JPWO2020065841A1 (ja) 光走査装置、撮像装置、光走査装置の調整装置及び光走査装置の調整方法
US9547126B2 (en) Optical waveguide sheet, optical unit, and method for manufacturing the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18743957

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 18743957

Country of ref document: EP

Kind code of ref document: A1