WO2018105354A1 - 成膜装置およびそれを用いた成膜物の製造方法、ならびに冷却パネル - Google Patents
成膜装置およびそれを用いた成膜物の製造方法、ならびに冷却パネル Download PDFInfo
- Publication number
- WO2018105354A1 WO2018105354A1 PCT/JP2017/041326 JP2017041326W WO2018105354A1 WO 2018105354 A1 WO2018105354 A1 WO 2018105354A1 JP 2017041326 W JP2017041326 W JP 2017041326W WO 2018105354 A1 WO2018105354 A1 WO 2018105354A1
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- Prior art keywords
- target
- target holding
- cooling
- held
- film forming
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/002—Cooling arrangements
Definitions
- the present invention relates to a film forming apparatus provided with a cooling panel.
- a film forming apparatus for forming a film on the surface of a base material by sputtering or arc discharge is known.
- the target may become hot due to arc discharge or the like and melt. Therefore, the film forming apparatus generally includes a cooling unit that cools the target during film formation.
- the substrate also becomes hot during film formation. This is because when the particles of the high-energy film-forming material jumping out of the target adhere to the surface of the substrate, the substrate receives thermal energy from the particles.
- the temperature of the base material becomes high, the hardness of the film formed on the surface of the base material may decrease depending on the type of film forming material (for example, carbon).
- the type of film forming material for example, carbon
- a film forming apparatus described in Patent Document 1 includes a water-cooled cooling panel provided in a vacuum chamber.
- the cooling panel absorbs radiant heat radiated from the substrate inside the vacuum chamber during the film forming process.
- the cooling panel includes a heat transfer tube through which cooling water passes and a pair of metal heat transfer plates that sandwich the heat transfer tube from both sides.
- the pair of heat transfer tubes are connected to an external pump or the like via a connecting tube that penetrates the wall of the vacuum chamber.
- the cooling panel can cool the substrate by being cooled by cooling water continuously supplied from the outside of the vacuum chamber.
- the above-described film forming apparatus requires a dedicated cooling means for cooling the substrate separately from the cooling means for cooling the target. That is, a plurality of different cooling means are required. This makes the structure of the film forming apparatus complicated and large. Also, the cooling panel cannot be easily detached from the vacuum chamber. This makes maintenance such as cleaning of the cooling panel very difficult.
- An object of the present invention is to provide a film forming apparatus having a simple and small structure, which includes an easily detachable cooling panel.
- the inventors of the present invention focused on a target holding unit that detachably holds the target in the film forming apparatus and cools the target. Specifically, it has been conceived that a cooling panel having a heat receiving surface for receiving radiant heat from the base material is attached to the target holding portion instead of the target. This makes it possible to hold and cool the cooling panel that receives the radiant heat using the target holding portion, thereby indirectly cooling the substrate.
- a film forming apparatus a film forming chamber, a base material supporting part for supporting a base material in the film forming chamber, and the base material supporting part supported by the base material supporting part.
- At least one target having a facing surface facing the substrate, a plurality of target holding portions each detachably holding the target so that the facing surface of the target faces the substrate, and the plurality of targets
- a cooling unit that cools the holding unit and at least one cooling panel are provided.
- the at least one cooling panel has a shape capable of being detachably held by the target holding portion, and the base member in a state where the held portion is held by the target holding portion.
- a heat receiving portion having a heat receiving surface that receives the radiant heat emitted from the substrate. The held portion performs heat transfer from the heat receiving surface to the target holding portion.
- Each of the plurality of target holding portions alternatively holds the target and the held portion of the cooling panel.
- FIG. 1 is a perspective view schematically showing an overall configuration of a film forming apparatus including a film forming apparatus according to an embodiment of the present invention. It is a cross-sectional top view of the film-forming apparatus of FIG. It is a cross-sectional front view of the film-forming apparatus of FIG. It is a cross-sectional front view which shows the state by which the cooling panel was attached to the target holding
- the film forming apparatus 1 includes a film forming chamber 2 that accommodates the base material W, a base material support portion 3 that supports the base material W, at least one (two in this embodiment) target 4, and at least one.
- a cooling unit 6 that cools the plurality of target holding units 5.
- the film forming apparatus 1 is an apparatus for forming the substrate W with particles of a film forming material released from the target 4 by a film forming technique such as arc ion plating.
- the target holding unit 5 has a configuration capable of holding the target 4 and the cooling panel 7 alternatively.
- the film forming chamber 2 is a hollow box surrounding the space 2a that can accommodate the substrate W.
- the film forming chamber 2 has a plurality of side walls 2b.
- the target holding portions 5 are respectively attached to a pair of opposing side walls 2b among the plurality of side walls 2b.
- two target holding portions 5 are attached to each side wall 2b side by side.
- the arrangement of the target holding portion according to the present invention is not limited to this. Further, the number of target holding units 5 is appropriately set in consideration of the dimensions of the film forming chamber 2 and the base material W on which the film is formed.
- the base material support part 3 has a configuration for supporting the base material W.
- the substrate support 3 shown in FIGS. 1 to 3 is a rotary table that is rotatably mounted inside the film forming chamber 2, and the substrate W can rotate or revolve around a vertical axis as a rotation center. In this way, the substrate W is supported.
- the shape and dimensions of the substrate W to be formed may be any as long as the film can be formed on the surface of the substrate W.
- the substrate W may have a rod shape, a plate shape, or other various shapes.
- the material of the substrate W is not particularly limited in the present invention, and any material that can be formed into a film such as a steel material, a resin material, or the like may be used.
- Each target 4 includes a material of a film formed on the surface of the substrate W, for example, a material such as aluminum, titanium, or carbon.
- the material constituting the target 4 is not particularly limited.
- Each of the targets 4 according to the present embodiment has a target body 4d and a held portion 4b held by the target holding portion 5, as shown in FIG.
- the target body 4d has a columnar shape as shown in FIG. 1, and one of the axially opposite end faces of the target body 4d is based on the state in which the held portion 4b is held by the target holding portion 5.
- the base material facing surface 4c facing the material W is configured.
- the held portion 4b has an annular convex portion 4a, and the convex portion 4a is opposed to the base material from the outer peripheral surface of the end portion on the opposite side to the base material facing surface 4c in both axial ends of the target body 4d. It protrudes in the direction along the surface 4c, that is, radially outward.
- the shape of the target according to the present invention is not limited.
- the shape may be a shape other than a cylinder, such as a rectangular flat plate.
- each cooling panel 7 includes a held portion 7 d held by the target holding portion 5, a heat receiving portion 7 b having a heat receiving surface 7 e that receives radiant heat from the base material W, and the covered portion. And a connecting portion 7c that connects the holding portion 7d and the heat receiving portion 7b.
- the cooling panel 7 is made of a material having good thermal conductivity, for example, a material such as aluminum or copper.
- the held portion 7d has a shape that can be detachably held by the target holding portion 5 similarly to the held portion 4b of the target 4 (see FIG. 5). Specifically, the held portion 7d is different from the normal direction X of the heat receiving surface 7e than the outer peripheral surface of the connecting portion 7c (in this embodiment, the direction along the heat receiving surface 7e, that is, the radial direction of the connecting portion 7c). ) Along the projection 7a protruding outward.
- the convex portion 7a has an annular shape when viewed from the normal direction X.
- the held portion 7d is held by the target holding portion 5 so that the heat receiving surface 7e of the heat receiving portion 7b faces the substrate W.
- the heat receiving surface 7e is a surface that can receive the radiant heat emitted from the substrate W while facing the substrate W in a state where the held portion 7d is held by the target holding portion 5.
- the heat receiving surface 7e according to the present embodiment is a flat surface.
- the heat receiving surface 7e may be a surface other than a flat surface, for example, a surface curved so that the normal direction X of the heat receiving surface 7e faces the substrate W.
- the connecting portion 7c connects the heat receiving portion 7b having the heat receiving surface 7b and the held portion 7d, whereby the target holding portion via the connecting portion 7c and the held portion 7d from the heat receiving surface 7e. Heat transfer to 5 is possible.
- the target holding part 5 has a configuration capable of selectively detachably holding the target 4 and the cooling panel 7.
- the target holding unit 5 includes a backing plate 11 that is a main body unit and a fixing unit.
- the fixing portion is a portion that alternatively fixes the target 4 or the cooling panel 7 to the backing plate 11.
- the backing plate 11 has a contact surface 11a, a refrigerant passage 11b, and a plurality of screw holes 11c.
- the contact surface 11 a is a surface that faces the substrate W and can contact the held portion 4 b of the target 4 or the held portion 7 d of the cooling plate 7.
- the refrigerant passage 11b is formed in the backing plate 11 and allows a refrigerant such as cooling water to flow.
- the plurality of screw holes 11 c are formed around the contact surface 11 a and open toward the base material W.
- the backing plate 11 is made of a material having good thermal conductivity, such as copper.
- the fixing portion includes a pressing member 12 having a plurality of screw insertion holes 12 a and a plurality of screws 13.
- the plurality of screws 13 are inserted into the plurality of screw insertion holes 12a of the pressing member 12 and screwed into the plurality of screw holes 11c of the backing plate 11 while penetrating the pressing member 12, respectively.
- the pressing member 12 is fixed to the periphery of the backing plate 11.
- the pressing member 12 is composed of, for example, a plurality of arc-shaped members (for example, a pair of semi-arc-shaped members in which a ring is divided into two).
- the pressing member 12 may be a single member that is continuous in an annular shape.
- the pressing member 12 has an inner diameter that is larger than the outer diameter of the target body 4d of the target 4 and smaller than the outer diameter of the annular convex portion 4a.
- the target 4 is attached to the target holding unit 5 as follows. As shown in FIG. 5, the target main body 4 d of the target 4 is disposed inside the pressing member 12, and the held portion 4 b of the target 4 is positioned behind the pressing member 12, that is, the pressing member.
- the pressing member 12 is placed on the backing plate 11 at a position around the contact surface 11 a of the backing plate 11 by a plurality of screws 13 in a state farther from the base material W than the base material W (position on the left side in FIG. 5). Fixed. At this time, while the pressing member 12 is engaged with the convex portion 4a of the target 4 shown in FIG. 5, the held portion 4b of the target 4 is pressed against the contact surface 11a of the backing plate 11, thereby the held portion 4b.
- the cooling panel 7 can be attached to the target holding unit 5. That is, as shown in FIG. 4, the connecting portion 7 c of the cooling panel 7 is disposed inside the pressing member 12, and the held portion 7 d of the cooling panel 7 is positioned behind the pressing member 12. In a certain state, the pressing member 12 is fixed to the backing plate 11 at a position around the contact surface 11 a of the backing plate 11 with a plurality of screws 13, whereby the pressing member 12 is protruded 7 a of the cooling panel 7. The held portion 7d of the cooling panel 7 can be pressed against and fixed to the contact surface 11a of the backing plate 11 while being engaged.
- the heat receiving surface 7e has an area larger than the area of the part facing the substrate of the target holding unit 5, that is, the part facing the substrate W when the cooling panel 7 is not present, when viewed from the normal direction X. .
- the substrate facing portion is the contact surface 11 a of the backing plate 11 that constitutes the target holding unit 5.
- the vertical dimension D1 of the heat receiving surface 7e is set to a dimension (for example, twice or more) sufficiently larger than the vertical width D2 of the contact surface 11a.
- the cooling unit 6 has a configuration in which a coolant such as cooling water for cooling the target holding unit 5 is continuously supplied to the target holding unit 5.
- the cooling unit 6 communicates with the upstream end and the downstream end of the refrigerant passage 11b inside the backing plate 11, and continuously supplies a refrigerant such as cooling water to the refrigerant passage 11b.
- the target holding unit 5 is cooled.
- the film forming apparatus 1 it is possible to manufacture a film by forming a film on the surface of the substrate W by the following procedure, for example.
- the film forming apparatus 1 is prepared (preparation process).
- the target 4 is attached to the target holding unit 5 of the plurality of target holding units 5, and to which target holding unit 5 the cooling panel 7 is attached is determined. That is, a first target holding part that should hold the target 4 and a second target holding part that should hold the cooling panel 7 are selected from the plurality of target holding parts 5 (selection step). .
- At least one target holding unit 5 among the plurality of target holding units 5 may be selected as the target holding unit. Any number of target holding units 5 among the other target holding units 5 can be selected as target holding units for holding the cooling panel 7. That is, when the number of target holding units 5 is N, the number of cooling panels 7 can be set in a range from 0 to N-1.
- the number of targets 4 and cooling panels 7 is determined in consideration of the cooling of the substrate W and the film formation efficiency of the substrate W. Specifically, when priority is given to cooling of the substrate W, the number of targets 4 is suppressed and the number of cooling panels 7 is increased, and when priority is given to film formation efficiency of the substrate W, the number of cooling panels 7 is increased. Is suppressed and the number of targets 4 is increased.
- the film forming apparatus 1 having four target holding parts 5 shown in FIGS. 1 to 3
- the film forming apparatus 1 having four target holding parts 5 shown in FIGS. 1 to 3
- two target holding parts 5 fixed to 2b are selected as first target holding parts for holding the target 4, respectively, and two target holding parts 5 fixed to the other side wall 2b are used for cooling panel 7 respectively. It is selected as the second target holding unit to be held.
- the target 4 is attached (that is, held) to the target holding unit 5 selected as the first target holding unit among the plurality of target holding units 5 and selected as the second target holding unit.
- the cooling panel 7 is attached (that is, held) to the target holding unit 5. Thereafter, a film forming process described below is performed.
- the pressure inside the film forming chamber 2 is reduced to a state close to a vacuum state, and a voltage is applied to the target holding unit 5 that holds the target 4.
- a voltage is applied to the target holding unit 5 that holds the target 4.
- particles of the film forming material are released from the facing surface 4c of the target 4, and the surface of the substrate W is formed.
- the target holding unit 5 is cooled to an appropriate temperature, for example, about 25 ° C. by the cooling water supplied from the cooling unit 6, so that the target 4 is about 50 to 60 ° C. via the target holding unit 5. Until cooled. This prevents the target 4 from melting.
- the cooling panel 7 absorbs the radiant heat released from the substrate W while being cooled by the cooling water supplied from the cooling unit 6 via the target holding unit 5, thereby cooling the substrate W.
- the said cooling suppresses the temperature rise of the base material W and suppresses malfunctions, such as a fall of the hardness of films
- suppression of the temperature rise of the base material W also makes it possible to suppress a decrease in hardness and distortion of the base material W itself due to the temperature increase.
- a film forming process can be performed in a state where all the target holding units 5 hold the target 4. In this way, film formation using a large number of targets 4 at the same time can shorten the film formation time.
- the film forming apparatus 1 of the present embodiment configured as described above uses the function of the cooling unit 6 that cools the target holding unit 5, so that the substrate W is mediated not only by the cooling of the target 4 but also by the cooling panel 7. It makes it possible to perform cooling. This simplifies the structure of the film forming apparatus and enables the film forming apparatus to be miniaturized.
- each target holding unit 5 that selectively holds the target 4 and the cooling panel 7 is cooled by the cooling unit 6, so that the target holding unit selected as the first target holding unit is used.
- the target 4 held by 5 is cooled through the target holding unit 5.
- the heat receiving surface 7e of the cooling panel 7 held by the target holding unit 5 selected as the second target holding unit receives the radiant heat emitted from the base material W while facing the base material W. Radiant heat received by the cooling panel 7 is transmitted to the target holding unit 5 cooled by the cooling unit 6.
- the cooling unit 6 that cools the target holding unit 5 that holds the cooling panel 7 can cool the substrate W via the cooling panel 7. Therefore, it is not necessary to provide a dedicated cooling means for cooling the substrate W separately from the cooling means for cooling the target 4, so that the structure of the film forming apparatus 1 is simplified and the film forming apparatus 1 Miniaturization is possible.
- the cooling panel 7 that is detachably attached to the target holding unit 5 can have a simple structure that does not include a cooling mechanism such as a cooling water circulation pipe, so that the cooling panel 7 that is extremely easy to attach and detach is formed. It becomes possible to install in a wide range in the chamber 2.
- each target holding unit 5 is cooled by the cooling unit 6, radiant heat from the base material W is generated by the target holding unit 5 in a state where neither the target 4 nor the cooling panel 7 is attached, that is, in the non-holding state.
- the backing plate 11 is firmly fixed to the film forming chamber 2 by welding or the like, it is difficult to replace and maintain it compared to the cooling panel 7.
- the cooling panel 7 that can be attached to and detached from the target holding unit 5 as in the above-described embodiment can be easily removed from the target holding unit 5 and replaced or maintained (for example, shot with a film attached by film formation processing) Cleaning work to be removed by blasting or the like.
- the heat receiving surface 7e of the cooling panel 7 of the film forming apparatus 1 has an area larger than the area of the portion of the target holding unit 5 facing the substrate W, the radiant heat released from the substrate W is generated. It is possible to absorb efficiently. That is, the amount of heat received, which is the amount of heat received by the heat receiving surface 7e from the substrate W, is large, and the cooling effect of the substrate W is high.
- the cooling panel 7 having the heat receiving surface 7e having a large area can reduce adhesion of the film forming material particles to the target holding unit 5 during the film forming process.
- a cooling unit 6 that continuously supplies a coolant such as cooling water for cooling the target holding unit 5 to the target holding unit 5 and a cooling unit 6 that is formed inside the target holding unit 5 to distribute the refrigerant.
- a coolant such as cooling water continuously supplied from the cooling unit 6 to the target holding unit 5 passes through the refrigerant passage 11b inside the target holding unit 5 during the film forming process.
- the cooling state of the target holding unit 5 and the cooling panel 7 held by the target holding unit 5 can be stably maintained.
- the cooling panel 7 is cooled by contact with the target holding unit 5 cooled by the refrigerant and does not need to be supplied with the refrigerant. Therefore, the cooling panel 7 can be easily attached to and detached from the target holding unit 5. Can have.
- the held portion 7d of the cooling panel 7 protrudes in a direction different from the normal direction X of the heat receiving surface 7e (the direction along the heat receiving surface 7e in FIG. 4).
- the target holding part 5 is engaged with the backing plate 11 which is a main body part in which the refrigerant passage 11b is formed and the convex part 7a to press the held part 7d against the backing plate 11.
- It has the pressing member 12 and the screw 13 which are the fixing
- the fixing portion according to the present invention is not limited to the one including the pressing member 12 and the screw 13.
- the fixing portion is, for example, a combination of the convex portion 7 a of the cooling panel 7 and a groove formed in the backing plate 11, and the groove is relative to the backing plate 11. It may have a shape that can be engaged with the convex portion 7a of the cooling panel 7 by simple rotation or horizontal movement.
- the number of targets 4 and cooling panels 7 attached to the target holding unit 5 can be arbitrarily changed. Therefore, as shown in FIGS. 1 to 3, a plurality of targets 4 and cooling panels 7 are mixed at a predetermined ratio using a single film forming apparatus 1, and the cooling panel 7 cools the substrate W.
- a film forming process in which only a plurality of targets 4 are formed without using the cooling panel 7 is also performed as shown in FIGS. It is possible. Accordingly, it is not necessary to prepare a plurality of types of film forming apparatuses having different numbers of cooling panels (that is, different required cooling performances).
- a film forming apparatus having a simple and small structure, which includes an easily detachable cooling panel.
- the film forming apparatus includes at least one film forming chamber, a base material supporting part that supports the base material inside the film forming chamber, and a facing surface that faces the base material supported by the base material supporting part.
- At least one target a plurality of target holding parts each detachably holding the target such that the opposing surface of the target faces the base material, and a cooling part that cools the plurality of target holding parts
- the at least one cooling panel has a shape capable of being detachably held by the target holding portion, and the base member in a state where the held portion is held by the target holding portion.
- a heat receiving portion having a heat receiving surface that receives the radiant heat emitted from the substrate.
- the held portion performs heat transfer from the heat receiving surface to the target holding portion.
- Each of the plurality of target holding portions alternatively holds the target and the held portion of the cooling panel.
- the film forming apparatus it is possible to cool not only the target but also the base material by using the function of the cooling unit for cooling the target holding unit. This simplifies the structure of the film forming apparatus and makes it possible to reduce the size of the film forming apparatus.
- each of the plurality of target holding units selectively holds the target and the cooling panel and is cooled by the cooling unit, so that when the target is held, the target is held by the target holding unit itself.
- cooling can be performed by cooling
- the substrate can be cooled through the cooling panel when the held portion of the cooling panel is held. That is, the target holding unit holds the held portion of the cooling panel so that the heat receiving surface of the cooling panel faces the base material and receives radiant heat emitted from the base material.
- the received radiant heat can be transmitted to the target holding part cooled by the cooling part. This enables a cooling unit that cools the target holding unit to cool the substrate through the cooling panel.
- the structure of the film forming apparatus is simplified and the film forming apparatus can be downsized. become. Further, since the held part of the cooling panel is detachably held by the target holding part, the cooling panel can be easily replaced and maintained as compared with the target holding part.
- the heat receiving surface has an area larger than an area of a portion of the target holding portion facing the substrate and facing the substrate.
- the heat receiving surface of the cooling panel having such a large area can efficiently absorb the radiant heat emitted from the base material, and the particles of the film forming material adhere to the target holding portion during the film forming process. Can be reduced.
- the cooling unit has a configuration in which a coolant for cooling the target holding unit is continuously supplied to the target holding unit, and the refrigerant supplied to the target holding unit passes inside the target holding unit. It is preferable that a refrigerant passage that allows the above is formed.
- the refrigerant passage allows the refrigerant that is continuously supplied from the cooling unit to the target holding unit to pass through the inside of the target holding unit, thereby holding the target holding unit and the target holding unit during the film forming process. It is possible to stably maintain the cooling state of the cooling panel.
- the cooling panel that receives the radiant heat from the base material is cooled through the target holding part cooled by the refrigerant, and it is not necessary to pass the refrigerant through the cooling panel, so that it can be easily attached to and detached from the target holding part. It is possible to have the structure
- the held portion of the cooling panel has a protruding portion that protrudes in a direction different from the normal direction of the heat receiving surface, and the target holding portion includes a main body portion in which the refrigerant passage is formed, and the protruding portion. It is preferable to include a fixing portion that is engaged and fixed to the main body portion while pressing the held portion against the main body portion.
- the target holding portion is a main body portion cooled by the refrigerant passing through the refrigerant passage, and a main body portion that is cooled as described above while engaging the convex portion of the held portion of the cooling panel.
- the method includes a preparation step of preparing the film forming apparatus, and selecting at least one first target holding section and at least one second target holding section from among a plurality of target holding sections in the film forming apparatus.
- a selection step of holding the target in the first target holding unit and holding the cooling panel in the second target holding unit; and film formation discharged from the facing surface of the target held in the first target holding unit The surface of the base material is formed by particles of material, and the cooling panel held by the second target holding unit is cooled by the cooling unit via the second target holding unit, and the cooling panel allows the cooling panel to cool the cooling panel.
- a film forming process for absorbing radiant heat released from the substrate is formed by particles of material, and the cooling panel held by the second target holding unit is cooled by the cooling unit via the second target holding unit, and the cooling panel allows the cooling panel to cool the cooling panel.
- the film forming efficiency and the substrate cooling performance in the film forming apparatus are changed. It is possible to change the balance. Therefore, it is not necessary to prepare a plurality of types of film forming apparatuses in which the number of targets used and the number of cooling panels are different, that is, the balance is different from each other.
- the film forming chamber a base material supporting portion that supports the base material inside the film forming chamber, and at least one target having a facing surface facing the base material, each detachably hold the target.
- a cooling panel that is selectively held by the target holding unit of the film forming apparatus including a plurality of target holding units and a cooling unit that cools the plurality of target holding units.
- the cooling panel has a held portion having a shape that can be detachably held by the target holding portion, and faces the base material in a state where the held portion is held by the target holding portion.
- a heat receiving portion having a heat receiving surface that receives radiant heat emitted from the substrate, and the held portion transmits the radiant heat received by the heat receiving surface to the target holding portion that holds the held portion. It is hold
- the held portion of the cooling panel holds the target and the cooling panel alternatively in a target holding portion in a film forming apparatus including a plurality of target holding portions and a cooling portion that cools the target holding portion. Make it possible.
- the held portion is held by the target holding portion, thereby enabling the heat receiving surface of the cooling panel to receive the radiant heat emitted from the substrate while facing the substrate, and By transmitting radiant heat to the target holding part cooled by the cooling part, the cooling part can cool the base material via the cooling panel. This eliminates the need for the film forming apparatus to have a dedicated cooling means for cooling the substrate separately from the cooling means for cooling the target, thereby simplifying and reducing the structure of the film forming apparatus. Make it possible to do.
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Abstract
Description
Claims (6)
- 成膜チャンバと、
当該成膜チャンバの内部において基材を支持する基材支持部と、
当該基材支持部に支持される前記基材に対向する対向面を有する少なくとも1つのターゲットと、
それぞれが前記ターゲットを当該ターゲットの対向面が前記基材に対向するように着脱自在に保持する複数のターゲット保持部と、
前記複数のターゲット保持部を冷却する冷却部と、
少なくとも1つの冷却パネルと、を備え、
前記少なくとも1つの冷却パネルは、前記ターゲット保持部に着脱自在に保持されることが可能な形状を有する被保持部と、当該被保持部が前記ターゲット保持部に保持された状態で前記基材に対向して当該基材から放出される輻射熱を受ける受熱面を有する受熱部と、を有し、
前記被保持部は、前記受熱面から前記ターゲット保持部への伝熱を行い、前記複数のターゲット保持部のそれぞれは、前記ターゲットと前記冷却パネルの前記被保持部とを択一的に保持する、成膜装置。 - 前記受熱面は、前記ターゲット保持部の基材対向部分であって前記基材に対向する部分の面積よりも大きい面積を有する、請求項1に記載の成膜装置。
- 前記冷却部は、前記ターゲット保持部を冷却する冷媒を当該ターゲット保持部に連続的に供給する構成を有し、
前記ターゲット保持部の内部には、当該ターゲット保持部に供給される前記冷媒の通過を許容する冷媒通路が形成されている、請求項1に記載の成膜装置。 - 前記冷却パネルの前記被保持部は、前記受熱面の法線方向と異なる方向に突出する凸部を有し、前記ターゲット保持部は、前記冷媒通路が形成された本体部と、前記凸部に係合して前記被保持部を前記本体部に押し当てた状態で当該本体部に固定する固定部と、を有する、請求項3に記載の成膜装置。
- ターゲットから放出された粒子により基材の表面を成膜して成膜物を製造する方法であって、
請求項1~4のいずれかに記載された成膜装置を用意する用意工程と、
前記成膜装置における複数のターゲット保持部の中から少なくとも一つの第1ターゲット保持部及び少なくとも一つの第2ターゲット保持部を選定して前記第1ターゲット保持部にターゲットを保持させるとともに前記第2ターゲット保持部に前記冷却パネルを保持させる選定工程と、
前記第1ターゲット保持部に保持される前記ターゲットの前記対向面から放出される成膜材料の粒子によって前記基材の表面を成膜するとともに、前記第2ターゲット保持部に保持される前記冷却パネルを当該第2ターゲット保持部を介して前記冷却部によって冷却しながら当該冷却パネルによって前記基材から放出される輻射熱を吸収する成膜工程と、を含む、成膜物の製造方法。 - 成膜チャンバと、成膜チャンバの内部において基材を支持する基材支持部と、前記基材に対向する対向面を有する少なくとも1つのターゲットと、それぞれが前記ターゲットを着脱自在に保持する複数のターゲット保持部と、前記複数のターゲット保持部を冷却する冷却部と、を備えた成膜装置の前記ターゲット保持部に前記ターゲットと択一的に保持される冷却パネルであって、
前記ターゲット保持部に着脱自在に保持されることが可能な形状を有する被保持部と、
当該被保持部が前記ターゲット保持部に保持された状態で前記基材に対向して当該基材から放出される輻射熱を受ける受熱面を有する受熱部と、を備え、
前記被保持部は、前記受熱面が受ける前記輻射熱を当該被保持部を保持する前記ターゲット保持部に伝熱するように前記ターゲット保持部に保持される、冷却パネル。
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US16/467,174 US10907246B2 (en) | 2016-12-07 | 2017-11-16 | Film-forming apparatus, method for producing film-formed product using same, and cooling panel |
MX2019006575A MX2019006575A (es) | 2016-12-07 | 2017-11-16 | Aparato de formacion de pelicula metodo para la fabricacion de un producto formado de pelicula usando dicho aparato y un panel de enfriamiento. |
BR112019011611A BR112019011611A2 (pt) | 2016-12-07 | 2017-11-16 | aparelho para formação de película, método para fabricação de produto formado de película usando o mesmo, e painel de resfriamento |
CN201780075888.7A CN110114505B (zh) | 2016-12-07 | 2017-11-16 | 成膜装置、使用该成膜装置的成膜物的制造方法以及冷却板 |
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JP2006291308A (ja) | 2005-04-12 | 2006-10-26 | Sumitomo Heavy Ind Ltd | 成膜装置及び成膜方法 |
US20070240982A1 (en) * | 2005-10-17 | 2007-10-18 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Arc ion plating apparatus |
JP4684372B1 (ja) * | 2010-04-27 | 2011-05-18 | 株式会社シンクロン | 半導体発光素子基板の製造方法 |
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2016
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- 2017-11-16 WO PCT/JP2017/041326 patent/WO2018105354A1/ja active Application Filing
- 2017-11-16 CN CN201780075888.7A patent/CN110114505B/zh active Active
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Patent Citations (5)
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JPH07109562A (ja) * | 1993-10-08 | 1995-04-25 | Anelva Corp | Pzt薄膜の作製方法 |
JP2002001099A (ja) * | 2000-06-20 | 2002-01-08 | Matsushita Electric Ind Co Ltd | プラズマ処理方法及び装置 |
JP2005325428A (ja) * | 2004-05-17 | 2005-11-24 | Shibaura Mechatronics Corp | 真空処理装置および光ディスクの製造方法 |
JP2012012663A (ja) * | 2010-06-30 | 2012-01-19 | Fujifilm Corp | 成膜装置および太陽電池 |
JP2015224348A (ja) * | 2014-05-26 | 2015-12-14 | 株式会社神戸製鋼所 | ダイヤモンドライクカーボン膜の成膜方法 |
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US10907246B2 (en) | 2021-02-02 |
BR112019011611A2 (pt) | 2019-10-15 |
CN110114505B (zh) | 2021-05-25 |
JP6588418B2 (ja) | 2019-10-09 |
CN110114505A (zh) | 2019-08-09 |
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