WO2018100711A1 - Dispositif de réfrigération - Google Patents

Dispositif de réfrigération Download PDF

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Publication number
WO2018100711A1
WO2018100711A1 PCT/JP2016/085721 JP2016085721W WO2018100711A1 WO 2018100711 A1 WO2018100711 A1 WO 2018100711A1 JP 2016085721 W JP2016085721 W JP 2016085721W WO 2018100711 A1 WO2018100711 A1 WO 2018100711A1
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WO
WIPO (PCT)
Prior art keywords
refrigerant
heating element
refrigeration apparatus
heat exchanger
condenser
Prior art date
Application number
PCT/JP2016/085721
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English (en)
Japanese (ja)
Inventor
健彦 赤井
▲高▼田　茂生
Original Assignee
三菱電機株式会社
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Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2016/085721 priority Critical patent/WO2018100711A1/fr
Publication of WO2018100711A1 publication Critical patent/WO2018100711A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle

Definitions

  • the present invention relates to a refrigeration apparatus having a cooling structure for cooling a heating element.
  • the control device of the refrigeration apparatus is provided with a heating element such as a power module, and the heating element is damaged when it exceeds the upper limit temperature.
  • a refrigeration apparatus in which a heating element is cooled using a refrigerant (see, for example, Patent Document 1).
  • a compressor, a condenser, a first decompression device, and an evaporator are connected to circulate a refrigerant circuit, and a part of the refrigerant flowing out of the condenser is decompressed by the second decompression device.
  • an injection circuit that injects into the compressor, and a cooling unit that is provided in the injection circuit and that cools the heating element using the refrigerant after decompression are provided.
  • Patent Document 1 the heat generating element is cooled using the refrigerant after decompression, but the temperature of the refrigerant discharged from the compressor is lowered by passing through the condenser. Therefore, since the temperature of the refrigerant is further reduced by reducing the temperature of the refrigerant that has passed through the condenser with the second decompression device, when the heat generating body is cooled using the refrigerant, the heat generating body is overcooled and dew condensation occurs. It can happen.
  • the present invention has been made in view of the above points, and an object thereof is to provide a refrigeration apparatus capable of suppressing overcooling of a heating element.
  • a refrigeration apparatus branches from a refrigerant circuit including a compressor, a condenser, a supercooling heat exchanger, a first decompression device and an evaporator, and between the supercooling heat exchanger and the first decompression device.
  • the heating element is cooled by the refrigerant in the refrigerant circuit from the outlet of the condenser to the inlet of the first pressure reducing device, it is possible to suppress overcooling of the heating element.
  • FIG. 3 is a refrigerant circuit diagram of the refrigeration apparatus according to Embodiment 1 of the present invention. It is a perspective view of the plate type heat exchanger which comprises the supercooling heat exchanger 3 of FIG. It is the schematic of the cooling structure of the heat generating body 40 of the refrigeration apparatus which concerns on Embodiment 1 of this invention. It is the schematic which shows the other structural example of the cooling structure of the heat generating body 40 of the freezing apparatus which concerns on Embodiment 1 of this invention. It is the schematic which shows the other structural example of the cooling structure of the heat generating body 40 of the freezing apparatus which concerns on Embodiment 1 of this invention. It is the schematic of the cooling structure of the heat generating body 40 of the freezing apparatus which concerns on Embodiment 2 of this invention. It is a refrigerant circuit figure of the freezing apparatus which concerns on Embodiment 3 of this invention.
  • FIG. 1 is a refrigerant circuit diagram of a refrigeration apparatus according to Embodiment 1 of the present invention.
  • the arrows in FIG. 1 indicate the flow of the refrigerant.
  • the refrigeration apparatus includes a refrigerant circuit A in which a compressor 1, a condenser 2, a supercooling heat exchanger 3, a first decompression device 4, and an evaporator 5 are connected in order by refrigerant piping.
  • the refrigerant circuit A further includes a liquid reservoir 6 and an auxiliary heat exchanger 7 between the condenser 2 and the supercooling heat exchanger 3.
  • the refrigeration apparatus further includes an injection circuit B that branches from between the supercooling heat exchanger 3 and the first decompression device 4 and is connected to the compressor 1 via the second decompression device 8 and the supercooling heat exchanger 3. I have.
  • the refrigeration apparatus further includes a condenser fan 20 that blows air to the condenser 2 and an evaporator fan 21 that blows air to the evaporator 5.
  • the compressor 1 sucks refrigerant and compresses the refrigerant to a high temperature and high pressure state.
  • the compressor 1 is composed of a positive displacement compressor whose operating frequency can be varied by an inverter.
  • the compressor 1 is not limited to the one driven by variable operation frequency, and may be a constant speed.
  • the condenser 2 exchanges heat between the high-temperature and high-pressure refrigerant discharged from the compressor 1 and the air supplied from the condenser fan 20 to radiate the heat of the refrigerant.
  • the condenser 2 is constituted by, for example, a cross fin type fin-and-tube heat exchanger constituted by a heat transfer tube and a large number of fins.
  • the liquid reservoir 6 is a container for storing excess refrigerant liquefied in the refrigerant circuit A.
  • the auxiliary heat exchanger 7 is a heat exchanger provided auxiliary to the refrigerant downstream of the condenser 2, and is, for example, a cross fin type fin-and-tube heat exchanger composed of a heat transfer tube and a large number of fins. Constitute.
  • the supercooling heat exchanger 3 has a first flow path 3a and a second flow path 3b, and performs heat exchange between the refrigerant flowing into the first flow path 3a and the refrigerant flowing into the second flow path 3b.
  • the refrigerant flowing out of the liquid reservoir 6 in the refrigerant circuit A passes through the first flow path 3a.
  • the refrigerant decompressed by the second decompression device 8 in the injection circuit B passes through the second flow path 3b.
  • the supercooling heat exchanger 3 is preferably configured by a plate heat exchanger as shown in FIG.
  • FIG. 2 is a perspective view of a plate heat exchanger constituting the subcooling heat exchanger 3 of FIG.
  • the plate-type heat exchanger constituting the subcooling heat exchanger 3 has a plurality of heat transfer plates 31 stacked, and a first flow path 3a and a second flow path 3b are formed in a space formed between the heat transfer plates 31. It has the structure formed alternately.
  • a reinforcing side plate 32 and a reinforcing side plate 33 are arranged on the outermost surface in the stacking direction of the assembly in which the heat transfer plates 31 are stacked.
  • Both the side plate 32 and the side plate 33 are formed in a plate shape, and the outer peripheral surface of the side plate 32 is a flat flat surface, and is used as a mounting surface for a heating element 40 described later.
  • the supercooling heat exchanger 3 is not limited to a plate heat exchanger. Although the attachment property of the heating element 40 is lowered, the supercooling heat exchanger 3 may also use, for example, a double tube heat exchanger that performs heat exchange inside and outside the double tube.
  • the first decompression device 4 expands the refrigerant by decompressing it.
  • the first decompression device 4 adjusts the flow rate of the refrigerant flowing in the refrigerant circuit A.
  • the first pressure reducing device 4 may be composed of an electronic expansion valve capable of variably adjusting the opening of the throttle by a stepping motor (not shown).
  • other types may be used as long as they have a similar function, such as a mechanical expansion valve adopting a diaphragm for the pressure receiving portion, a temperature expansion valve, a capillary tube, or the like. Good.
  • the evaporator 5 exchanges heat between the low-temperature and low-pressure refrigerant decompressed by the first decompression device 4 and the air supplied from the evaporator fan 21.
  • the evaporator 5 is good to comprise, for example with the cross fin type fin and tube type heat exchanger comprised with the heat exchanger tube and many fins.
  • the second decompression device 8 decompresses and expands the refrigerant, and adjusts the flow rate of the refrigerant flowing through the injection circuit B.
  • the second pressure reducing device 8 may be constituted by an electronic expansion valve capable of adjusting the opening of the throttle by a stepping motor (not shown).
  • the electronic expansion valve other types may be used as long as they have a similar function, such as a mechanical expansion valve adopting a diaphragm for the pressure receiving portion, a temperature expansion valve, a capillary tube, or the like. Good.
  • the refrigeration apparatus further includes a heating element temperature sensor 11 that detects the temperature of the heating element 40 described later, and a refrigerant temperature sensor 12 that detects the temperature of the refrigerant that has flowed out of the first flow path 3a of the supercooling heat exchanger 3. And a discharge temperature sensor 13 for detecting the temperature discharged from the compressor 1 and a control device 50.
  • the control device 50 is configured to acquire the detected temperature detected by these temperature sensors and the operation content instructed by the user of the refrigeration apparatus.
  • control apparatus 50 is based on detected temperature and the content of operation, the operation method of the compressor 1, the opening degree of the 1st decompression device 4, the opening degree of the 2nd decompression device 8, the rotation speed of the condenser fan 20, and evaporation
  • the rotational speed of the fan 21 is controlled.
  • the control device 50 can be configured by hardware such as a circuit device that realizes the function, or can be configured by an arithmetic device such as a microcomputer or a CPU and software executed thereon.
  • refrigerant used in the refrigeration apparatus there is no particular limitation on the type of refrigerant used in the refrigeration apparatus, and any refrigerant can be used.
  • a natural refrigerant such as carbon dioxide (CO 2 ), hydrocarbon, or helium may be employed, or a refrigerant that does not contain chlorine, such as an alternative refrigerant such as R407C and R404A, as well as R410A. Good.
  • the refrigeration apparatus configured as described above is installed in, for example, a showcase installed indoors, and is used as a cooling apparatus that cools a storage space in which products are arranged.
  • at least the evaporator 5 and the evaporator fan 21 are disposed in the cooling chamber 60 communicating with the storage space, and other components are disposed in, for example, the machine chamber 70 provided in the lower portion of the storage space, and the heat source device is installed.
  • the first pressure reducing device 4 is disposed in the cooling chamber 60, but may be disposed on the machine chamber 70 side.
  • the high-temperature and high-pressure gas refrigerant discharged from the compressor 1 reaches the condenser 2 and is condensed and liquefied by heat exchange with the air from the condenser fan 20 to become a high-pressure and low-temperature refrigerant.
  • the high-pressure and low-temperature refrigerant that has been condensed and liquefied becomes a saturated liquid state, and a part of the saturated liquid is stored in the liquid reservoir 6.
  • the liquid refrigerant flowing out of the liquid reservoir 6 and flowing into the first flow path 3a of the supercooling heat exchanger 3 exchanges heat with the low-temperature refrigerant flowing through the second flow path 3b of the supercooling heat exchanger 3, To be cooled.
  • a part of the refrigerant supercooled by the supercooling heat exchanger 3 is bypassed from the refrigerant circuit A to the injection circuit B.
  • the remaining refrigerant is decompressed by the first decompression device 4 to become a two-phase refrigerant and sent to the evaporator 5.
  • the two-phase refrigerant sent to the evaporator 5 evaporates by heat exchange with the air from the evaporator fan 21 and becomes a low-pressure gas refrigerant. Then, the low-pressure gas refrigerant is sucked into the compressor 1.
  • the refrigerant bypassed from the refrigerant circuit A to the injection circuit B is decompressed by the second decompression device 8 and becomes a low-temperature two-phase refrigerant.
  • the two-phase refrigerant flows into the second flow path 3b of the supercooling heat exchanger 3, exchanges heat with the refrigerant in the first flow path 3a of the supercooling heat exchanger 3, and is then injected into the compression chamber of the compressor 1.
  • the discharge temperature of the compressor 1 may become too high depending on the operating conditions, and the discharge temperature can be lowered by injecting the refrigerant that has passed through the injection circuit B into the compressor 1.
  • the heating element 40 that is provided in the refrigeration apparatus and generates heat is cooled with the refrigerant in the refrigerant circuit A from the outlet of the condenser 2 to the inlet of the first decompression device 4.
  • the heating element 40 includes, for example, a wide gap semiconductor such as SiC, GaN, or diamond.
  • An example of the heating element 40 including a wide gap semiconductor is a power module.
  • a power module comprises the inverter of the compressor 1, for example.
  • the refrigerant in the refrigerant circuit A from the outlet of the condenser 2 to the inlet of the first decompression device 4 is higher in temperature than the refrigerant decompressed by the second decompression device 8 in the injection circuit B. For this reason, the cooling of the heating element 40 with the refrigerant in the refrigerant circuit A from the outlet of the condenser 2 to the inlet of the first pressure reducing device 4 can suppress the cooling of the heating element 40 too much.
  • FIG. 3 is a schematic diagram of the cooling structure of the heating element 40 of the refrigeration apparatus according to Embodiment 1 of the present invention.
  • the heating element 40 is attached to the supercooling heat exchanger 3.
  • the heating element 40 is detachably attached to the flat side plate 33 of the supercooling heat exchanger 3 by screwing or the like via the heat transfer member 41.
  • the heat transfer member 41 may be a plate having good heat transfer properties such as an aluminum plate.
  • the heating element 40 may be attached directly to the supercooling heat exchanger 3.
  • it is only necessary that the heating element 40 is attached to the supercooling heat exchanger 3 so as to be thermally connected to the supercooling heat exchanger 3.
  • the supercooling heat exchanger 3 corresponds to the refrigerant device of the present invention.
  • the refrigerant of the refrigerant circuit A flowing out of the condenser 2 flows into the first flow path 3a of the supercooling heat exchanger 3, and the refrigerant of the injection circuit B flows into the second flow path 3b.
  • the refrigerant amount of the refrigerant circuit A is larger than the refrigerant amount of the injection circuit B.
  • the temperature of the side plate 33 of the supercooling heat exchanger 3 to which the heating element 40 is attached is dominated by the temperature of the refrigerant in the refrigerant circuit A flowing into the first flow path 3a, for example, 35 ° C. to 45 ° C. at the maximum. Degree.
  • the temperature of the heating element 40 rises to about 80 ° C. to 125 ° C., for example. Therefore, the heating element 40 can be cooled by thermally connecting the heating element 40 to the supercooling heat exchanger 3.
  • the refrigeration apparatus detects a temperature that changes due to cooling of the heating element 40, and controls the condenser fan 20 based on the detected temperature by the control apparatus 50 so that the detected temperature becomes a target value. Yes.
  • the rotational speed of the condenser fan 20 is increased, and if the refrigerant temperature is lower than the target value, the rotational speed of the condenser fan 20 is decreased.
  • the “temperature changing due to cooling of the heating element 40” is, for example, the temperature of the heating element 40, the temperature of the refrigerant flowing out from the first flow path 3a of the supercooling heat exchanger 3, and the discharge from the compressor 1. And the like, which can be detected by the heating element temperature sensor 11, the refrigerant temperature sensor 12, and the discharge temperature sensor 13 in this order. Any of these heating element temperature sensor 11, refrigerant temperature sensor 12, and discharge temperature sensor 13 corresponds to the control temperature sensor of the present invention.
  • control device 50 increases the opening of the second decompression device 8 or sets the rotation speed of the condenser fan 20. Control is performed to raise the temperature of the heating element 40 below the set temperature.
  • the set temperature is set to about 90 ° C., for example.
  • the heating element 40 is cooled by the refrigerant from the outlet of the condenser 2 to the inlet of the first pressure reducing device 4, the heating element 40 is overcooled. Can be suppressed. As a result, condensation of the heating element 40 can be suppressed.
  • the heating element 40 when cooling the heating element 40 with the refrigerant from the outlet of the condenser 2 to the inlet of the refrigerant circuit A of the first decompression device 4, specifically, the heating element 40 is attached to the supercooling heat exchanger 3 and cooled. I did it.
  • the refrigeration apparatus is conventionally provided with a supercooling heat exchanger 3, and the heating element 40 is cooled by using the supercooling heat exchanger 3 which is a conventional refrigerant device. No additional circuit or device is required. For this reason, cooling of the heat generating body 40 is realizable at low cost and space saving.
  • the heating element 40 is attached to the supercooling heat exchanger 3 via the heat transfer member 41, not only can the heat of the heating element 40 be transmitted to the supercooling heat exchanger 3 via the heat transfer member 41. Since heat is also radiated from the heat transfer member 41 itself, the heating element 40 can be effectively cooled.
  • the heating element 40 or the heat transfer member 41 is utilized by using the planar portion of the side plate 32 disposed on the outermost surface of the plate heat exchanger. Can be easily attached. Further, by making the plate heat exchanger and the heating element 40 or the heat transfer member 41 detachable by screwing or the like, the heating element 40 can be detached from the plate heat exchanger. By making the heating element 40 removable from the plate heat exchanger in this way, it is possible to make the heating element 40 excellent in serviceability such as maintenance.
  • the refrigerant pipe is sandwiched and fixed from both sides by a plate-like member, and the heating element 40 is attached to the outer surface of the plate-like member. It was necessary and the mounting structure was messy. On the other hand, mounting structure becomes simple by comprising the supercooling heat exchanger 3 with a plate-type heat exchanger.
  • the “temperature changing due to cooling of the heating element 40” is detected by any one of the heating element temperature sensor 11, the refrigerant temperature sensor 12, and the discharge temperature sensor 13, and the detected temperature becomes a target value.
  • the condenser fan 20 was controlled. For this reason, the cooling capacity can be adjusted without changing the cooling structure, and the configuration for cooling the heating element 40 is simplified.
  • the opening of the second decompression device 8 is increased, or the rotation speed of the condenser fan 20 is increased to increase the heating element. Control was performed to lower the temperature of 40 below the set temperature. For this reason, the temperature of the heat generating body 40 can be lowered below the set temperature without changing the cooling structure.
  • the heating element 40 includes a wide gap semiconductor.
  • Wide-gap semiconductors have a high heat-resistant temperature of about 400 ° C. and can be operated at high temperatures. For this reason, the effect which cools the heat generating body 40 containing a wide gap semiconductor with a refrigerant
  • the refrigeration apparatus may be modified as follows in addition to the configuration shown in FIG. In this case, the same effect can be obtained.
  • FIG. 4 is a schematic diagram illustrating another configuration example of the cooling structure of the heating element 40 of the refrigeration apparatus according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic diagram illustrating another configuration example of the cooling structure of the heating element 40 of the refrigeration apparatus according to Embodiment 1 of the present invention.
  • the refrigeration apparatus includes an electrical component box 80 that houses electrical components.
  • the electrical component box 80 has a large amount of heat generation such as a DC reactor or AC reactor, a coiled part, various substrates, etc., and cannot be directly attached to the heat transfer member 41 or the supercooling heat exchanger 3.
  • a body 40 is also arranged.
  • a control device 50 is also arranged in the electrical component box 80.
  • the electrical component box 80 is replaced with the heat-transfer member 41 or the supercooling heat exchanger. 3 may be used to cool the heating element 40.
  • the supercooling heat is generated in the contact wall 40a of the electrical component box 80 with the heat transfer member 41 or the supercooling heat exchanger 3.
  • a heating element 40 is disposed in a region facing the exchanger 3. Thereby, the heat of the heat generating body 40 can be efficiently radiated.
  • Embodiment 2 As the configuration in which the heating element 40 is cooled with the refrigerant from the outlet of the condenser 2 to the inlet of the refrigerant circuit A of the first decompression device 4, the cooling is performed by the supercooling heat exchanger 3. explained.
  • the second embodiment another configuration will be described.
  • the second embodiment will be described mainly with respect to points different from the first embodiment, and the configuration not described in the second embodiment is the same as that of the first embodiment.
  • FIG. 6 is a schematic diagram of the cooling structure of the heating element 40 of the refrigeration apparatus according to Embodiment 2 of the present invention.
  • the heating element 40 is cooled by the refrigerant from the outlet of the condenser 2 to the inlet of the first pressure reducing device 4, and the heating element 40 is attached to the liquid reservoir 6 to cool the heating element 40.
  • the structure for attaching the heating element 40 to the liquid reservoir 6 may be such that the heating element 40 may be directly attached to the liquid reservoir 6 or may be attached via the heat transfer member 41 as described in the first embodiment. .
  • the heating element 40 may be configured to be thermally connected to the liquid reservoir 6.
  • the liquid reservoir 6 corresponds to the refrigerant device of the present invention, like the supercooling heat exchanger 3.
  • the second embodiment configured as described above can achieve the same effects as the first embodiment. That is, since the heating element 40 is cooled by the refrigerant from the outlet of the condenser 2 to the inlet of the first decompression device 4, the cooling of the heating element 40 can be suppressed. As a result, condensation of the heating element 40 can be suppressed.
  • the refrigeration apparatus is conventionally provided with a liquid reservoir 6, and the heat generator 40 is cooled by using the liquid reservoir 6 which is a conventional refrigerant device, a circuit dedicated to cooling the heat generator or a heat generator. No additional cooling equipment is required. For this reason, cooling of the heat generating body 40 is realizable at low cost and space saving.
  • the modification of the first embodiment shown in FIGS. 4 and 5 can be applied. That is, the electrical component box 80 may be attached to the liquid reservoir 6 directly or via the heat transfer member 41.
  • Embodiment 3 Although the refrigeration apparatus of the first embodiment and the second embodiment is a form in which the entire refrigeration apparatus is installed indoors, the third embodiment is such that the condenser 2 and the condenser fan 20 are installed outdoors. It is a thing.
  • the third embodiment will be described mainly with respect to differences from the first and second embodiments, and the configuration not described in the third embodiment is the same as the first and second embodiments.
  • FIG. 7 is a refrigerant circuit diagram of the refrigeration apparatus according to Embodiment 3 of the present invention.
  • the condenser 2 and the condenser fan 20 are disposed inside the casing of the outdoor unit 100 and installed outdoors.
  • Other devices constituting the refrigeration apparatus are arranged indoors separately from the outdoor unit 100.
  • the heat of the heating element 40 is transmitted to the refrigerant in the refrigerant circuit A and carried to the condenser 2. And since the condenser 2 is installed outdoors, the heat of the heating element 40 is not accumulated indoors but is exhausted from the condenser 2 to the outdoors.
  • FIG. 7 shows a configuration in which the heating element 40 is cooled by the supercooling heat exchanger 3, it is cooled by the liquid reservoir 6 or the like from the outlet of the condenser 2 of the refrigerant circuit A to the inlet of the first pressure reducing device 4. What is necessary is just to be set as the structure cooled with the refrigerant
  • the same effects as in the first and second embodiments can be obtained, and the condenser 2 and the condenser fan 20 are installed outdoors, so the following effects are obtained. That is, the heat of the heating element 40 can be exhausted from the condenser 2 to the outside. As a result, the heat of the heating element 40 does not stay in the machine room 70 and the heat exchange efficiency of the condenser 2 does not decrease, so that the machine room 70 is cooled compared to the case where the condenser 2 is installed in the machine room 70. Can reduce the capacity of the refrigeration equipment. Moreover, since the heat of the heating element 40 is not discharged indoors, the ability of the air conditioner to cool the indoors can be reduced.
  • the heat discharged from the heating element 40 in the electrical component box 80 is exhausted to the outside of the electrical component box 80 due to heat radiation of the electrical component box 80, and is easily trapped in the machine room 70.
  • the electrical component box 80 has an intake port and an exhaust port and includes a fan inside, the heat of the electrical component box 80 is forcibly exhausted to the outside of the electrical component box 80, and the same In addition, it is easy to stay inside the machine room 70.
  • the electrical component box 80 is thermally connected to the supercooling heat exchanger 3 or the liquid reservoir 6, and the heat of the electrical component box 80 is transferred to the refrigerant in the refrigerant circuit A to be exhausted from the condenser 2 to the outside.
  • heat radiation of the electrical component box 80 in the machine room 70 can be suppressed, and a large amount of heat can be exhausted outdoors.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

L'invention concerne un dispositif de réfrigération grâce auquel un surfusion d'un corps générant de la chaleur et la formation de givre peuvent être supprimés. Ce dispositif de réfrigération comprend : un circuit de fluide frigorigène (A) pourvu d'un compresseur (1), d'un condenseur (2), d'un échangeur de chaleur de surfusion (3), d'un premier dispositif de décompression (4), et d'un évaporateur (5); et un circuit d'injection (B) qui se branche entre l'échangeur de chaleur de surfusion et le premier dispositif de décompression et qui est relié au compresseur par l'intermédiaire d'un second dispositif de décompression (8) et de l'échangeur de chaleur de surfusion. Le dispositif de réfrigération est en outre pourvu d'un corps de génération de chaleur (40) pour générer de la chaleur et une structure de refroidissement pour refroidir le corps de génération de chaleur par utilisation d'un fluide frigorigène dans le circuit de fluide frigorigène à partir d'une sortie du condenseur à une entrée du premier dispositif de décompression.
PCT/JP2016/085721 2016-12-01 2016-12-01 Dispositif de réfrigération WO2018100711A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4184077A4 (fr) * 2020-07-15 2023-09-13 Mitsubishi Electric Corporation Dispositif à cycle frigorifique

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Publication number Priority date Publication date Assignee Title
JPS5650966U (fr) * 1979-09-26 1981-05-06
JPH038921Y2 (fr) * 1985-02-08 1991-03-06
JPH0634208A (ja) * 1992-07-21 1994-02-08 Mitsubishi Electric Corp 空気調和機の電気品箱冷却装置
WO2011077720A1 (fr) * 2009-12-22 2011-06-30 ダイキン工業株式会社 Dispositif de refrigeration
WO2013057832A1 (fr) * 2011-10-21 2013-04-25 トヨタ自動車株式会社 Dispositif de refroidissement et procédé de commande pour un dispositif de refroidissement
JP2014102050A (ja) * 2012-11-21 2014-06-05 Daikin Ind Ltd 冷凍装置
JP2014105943A (ja) * 2012-11-28 2014-06-09 Daikin Ind Ltd 空気調和機、及び空気調和機の中継ユニット
JP2014126296A (ja) * 2012-12-26 2014-07-07 Daikin Ind Ltd 冷凍装置
JP2014206301A (ja) * 2013-04-11 2014-10-30 株式会社日本自動車部品総合研究所 冷却装置
WO2016147275A1 (fr) * 2015-03-13 2016-09-22 三菱電機株式会社 Dispositif de congélation

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650966U (fr) * 1979-09-26 1981-05-06
JPH038921Y2 (fr) * 1985-02-08 1991-03-06
JPH0634208A (ja) * 1992-07-21 1994-02-08 Mitsubishi Electric Corp 空気調和機の電気品箱冷却装置
WO2011077720A1 (fr) * 2009-12-22 2011-06-30 ダイキン工業株式会社 Dispositif de refrigeration
WO2013057832A1 (fr) * 2011-10-21 2013-04-25 トヨタ自動車株式会社 Dispositif de refroidissement et procédé de commande pour un dispositif de refroidissement
JP2014102050A (ja) * 2012-11-21 2014-06-05 Daikin Ind Ltd 冷凍装置
JP2014105943A (ja) * 2012-11-28 2014-06-09 Daikin Ind Ltd 空気調和機、及び空気調和機の中継ユニット
JP2014126296A (ja) * 2012-12-26 2014-07-07 Daikin Ind Ltd 冷凍装置
JP2014206301A (ja) * 2013-04-11 2014-10-30 株式会社日本自動車部品総合研究所 冷却装置
WO2016147275A1 (fr) * 2015-03-13 2016-09-22 三菱電機株式会社 Dispositif de congélation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4184077A4 (fr) * 2020-07-15 2023-09-13 Mitsubishi Electric Corporation Dispositif à cycle frigorifique

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