WO2018043746A1

WO2018043746A1 - Photosensitive resin composition for forming organic electroluminescent element partition wall, partition wall, organic electroluminescent element, image display device and lighting

Info

Publication number: WO2018043746A1
Application number: PCT/JP2017/031824
Authority: WO
Inventors: 明日香木村; 和裕中谷; 達格土谷
Original assignee: 三菱ケミカル株式会社
Priority date: 2016-09-05
Filing date: 2017-09-04
Publication date: 2018-03-08
Also published as: KR20190046834A; TW201826025A; CN109661855A; TWI819333B; TWI826804B; JPWO2018043746A1; TWI806838B; CN115185156A; TW202141185A; TW202140680A; KR102451212B1; KR20220139427A; CN109661855B; JP7099319B2

Abstract

The present invention addresses the problem of providing a photosensitive resin composition for forming a partition wall of an organic electroluminescent element, said partition wall having high reliability due to less outgas generation during the operation of the electroluminescent element, while having a large taper angle. A photosensitive resin composition for forming an organic electroluminescent element partition wall according to the present invention contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin; and the alkali-soluble resin (C) contains an alkali-soluble resin (c) that has a partial structure represented by general formula (1). This photosensitive resin composition for forming an organic electroluminescent element partition wall additionally contains (E) a chain transfer agent. (In formula (1), R¹ represents an optionally substituted divalent hydrocarbon group having 1-4 carbon atoms; and * represents a bonding hand.)

Description

Photosensitive resin composition for forming organic electroluminescence device partition, partition, organic electroluminescence device, image display device and illumination

The present invention relates to a photosensitive resin composition used for forming a partition of an organic electroluminescent element, and more particularly, a partition composed of a photosensitive resin composition for forming an organic electroluminescent element partition and an organic electric field including the partition. The present invention relates to a light emitting element, an image display device including the organic electroluminescent element, and illumination.

Conventionally, an organic electroluminescent device included in an organic electric field display, organic electric field illumination, or the like is formed by forming a partition (bank) on a substrate, and then laminating various functional layers in a region surrounded by the partition. It is manufactured. As a method for forming such a partition easily, a method for forming by a photolithography method using a photosensitive resin composition is known.

In addition, as a method for laminating various functional layers in the region surrounded by the partition walls, first, an ink containing a material constituting the functional layer is prepared, and then the prepared ink is injected into the region surrounded by the partition walls. How to do is known. Among these methods, an ink jet method is often employed because a predetermined amount of ink is easily injected accurately into a predetermined location.

Furthermore, when the functional layer is formed using ink, the partition wall has ink repellency for the purpose of preventing the ink from adhering to the partition wall or preventing the ink injected between adjacent regions from being mixed together. It may be required to grant. In recent years, various properties in addition to ink repellency are required for the partition walls, and various photosensitive resin compositions have been developed. For example, Patent Document 1 describes that by using a specific alkali-soluble resin, a specific liquid repellent, and a specific surfactant, there is no disconnection of the electrode and it can cope with a high-resolution image.
On the other hand, Patent Document 2 uses a resin in which (meth) acrylic acid is added to bisphenol A type epoxy resin, succinic anhydride is further added, and bisphenol A type epoxy resin is further added. It is described that a coating film excellent in heat-resistant colorability can be obtained.

Japanese Unexamined Patent Publication No. 2010-061093 Japanese Unexamined Patent Publication No. 2010-150397

In recent years, in order to improve the driving life of an element, there is a demand to reduce the amount of outgas generated from the partition during light emission after the partition and the element are formed. In addition, it suppresses the decrease in luminance due to the overlap between the lower part of the partition wall and the light emitting part and the decrease in the light emission characteristics due to the contact part between the partition wall and the light emitting part, and the suitability for coating when forming the light emitting part by the ink jet method. There is a demand to increase the taper angle of the partition wall in order to ensure the above.
When the present inventors examined, it was difficult for the photosensitive resin composition for partition formation of patent document 1 to fully reduce the outgas generation amount at the time of light emitting element operation. Moreover, the taper angle of the partition obtained was small.

Patent Document 2 does not describe a partition wall, and the present inventors have examined the application of the photosensitive resin composition described in Patent Document 2 to a partition wall. The taper angle of was small.

Accordingly, an object of the present invention is to provide a photosensitive resin composition for forming a partition wall of an organic electroluminescent device that has a small amount of outgas generation during operation of the light emitting device, is highly reliable, and has a large taper angle.
In addition, the present invention provides a partition formed using the photosensitive resin composition for forming an organic electroluminescent element partition, an organic electroluminescent element including the partition, an image display apparatus including the organic electroluminescent element, and illumination. The purpose is to do.

As a result of intensive studies by the present inventors, it has been found that the above-mentioned problems can be solved by using a resin having a specific partial structure as an alkali-soluble resin and further using a chain transfer agent, and the present invention has been completed.
That is, the gist of the present invention is as follows.

<1> A photosensitive resin composition for forming an organic electroluminescent element partition comprising (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin, wherein the (C) alkali A soluble resin contains an alkali-soluble resin (c) having a partial structure represented by the following general formula (1), and further contains (E) a chain transfer agent. Photosensitive resin composition.

(In formula (1), R ¹ represents an optionally substituted divalent hydrocarbon group having 1 to 4 carbon atoms. * Represents a bond.)
<2> The photosensitive resin composition for forming an organic electroluminescent element partition according to <1>, wherein the alkali-soluble resin (c) is a resin having an ethylenically unsaturated group.
<3> The photosensitive resin composition for forming an organic electroluminescent element partition according to <1> or <2>, wherein the alkali-soluble resin (c) contains (c1) an epoxy (meth) acrylate resin.
<4> Epoxy (meth) acrylate resin in which the (c1) epoxy (meth) acrylate resin includes a repeating unit structure represented by the following formula (i), an epoxy including a partial structure represented by the following formula (ii) The organic electroluminescent element partition according to <3>, comprising at least one selected from the group consisting of (meth) acrylate resins and epoxy (meth) acrylate resins containing a partial structure represented by the following formula (iii) A photosensitive resin composition for forming.

(In formula (i), R ^a represents a hydrogen atom or a methyl group, and R ^b represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) (It may be substituted with any substituent. * Represents a bond.)

(In formula (ii), each R ^c independently represents a hydrogen atom or a methyl group. R ^d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * Represents a bond. .)

(In the formula (iii), R ^e represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or an optionally substituted 2 Represents a valent cyclic hydrocarbon group, and the benzene ring in formula (iii) may be further substituted with an arbitrary substituent. * Represents a bond.)
<5> The (c1) epoxy (meth) acrylate resin is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond to an epoxy resin, and further adding a polybasic acid or an anhydride thereof. The photosensitive resin composition for organic electroluminescent element partition formation as described in 3> or <4>.
<6> The photosensitive resin composition for forming an organic electroluminescent element partition according to any one of <1> to <5>, further comprising (D) a liquid repellent.
<7> The photosensitive resin composition for forming an organic electroluminescent element partition according to <6>, wherein the (D) liquid repellent contains a liquid repellent having a crosslinking group.
<8> The photosensitive resin composition for forming an organic electroluminescent element partition according to any one of <1> to <7>, further comprising an ultraviolet absorber.
<9> The organic electric field according to any one of <1> to <8>, wherein the acid value of the photosensitive resin composition for forming an organic electroluminescent element partition wall is 20 mgKOH / g or more based on the total solid content. Photosensitive resin composition for forming a light emitting element partition wall.
<10> A partition comprising the photosensitive resin composition for forming an organic electroluminescent element partition according to any one of <1> to <9>.
<11> An organic electroluminescence device comprising the partition wall according to <10>.
<12> An image display device comprising the organic electroluminescent element according to <11>.
<13> Illumination including the organic electroluminescent element according to <11>.

According to the present invention, it is possible to provide a photosensitive resin composition for forming a partition wall of an organic electroluminescent device having a small amount of outgas generation during operation of the light emitting device, high reliability, and a large taper angle.

FIG. 1 is an explanatory diagram of a method for evaluating the taper angle of a partition wall.

Hereinafter, the present invention will be described in detail. In addition, the following description is an example of embodiment of this invention, and this invention is not specified to these, unless the summary is exceeded.

In the present invention, “(meth) acryl” means “acryl and / or methacryl”, “(meth) acrylate” means “acrylate and / or methacrylate”, and The “total solid content” means all components other than the solvent in the photosensitive resin composition for forming an organic electroluminescent element partition wall. Furthermore, a numerical range represented by using “to” in the present invention means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.

In the present invention, the term “(co) polymer” means that both a single polymer (homopolymer) and a copolymer (copolymer) are included, and “(acid) anhydride”, “ The term “(anhydrous)... Acid” means to include both an acid and its anhydride.
In the present invention, “polybasic acid (anhydride)” means “polybasic acid and / or polybasic acid anhydride”.
In the present invention, the weight average molecular weight refers to a polystyrene equivalent weight average molecular weight (Mw) by GPC (gel permeation chromatography).

In the present invention, the partition material refers to a bank material and a wall material, and similarly, the partition wall refers to a bank and a wall.
In the present invention, the light emitting portion refers to a portion that emits light when electric energy is applied.
In the present invention, “mass” and “weight” are synonymous.
In the present invention, * in the chemical formula represents a bond.
In the present invention, “large taper angle” and “high taper angle” are synonymous, and “small taper angle” and “low taper angle” are synonymous.

[1] Photosensitive resin composition for forming organic electroluminescent element partition walls The photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the first aspect includes (A) an ethylenically unsaturated compound and (B). A photosensitive resin composition for forming an organic electroluminescent element partition comprising a photopolymerization initiator and (C) an alkali-soluble resin, wherein the (C) alkali-soluble resin is represented by the following general formula (1). It contains an alkali-soluble resin (c) having a partial structure, and further contains (E) a chain transfer agent. If necessary, it may further contain other components. For example, (D) a liquid repellent or an ultraviolet absorber may be included.

The photosensitive resin composition for forming an organic electroluminescent element partition according to the second aspect of the present invention contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin. The (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the content ratio of the (A1) acid group having an ethylenic unsaturated compound is 30% by mass in the total solid content. It is characterized by the following. If necessary, it may further contain other components. For example, it may contain (D) a liquid repellent, (E) a chain transfer agent, and an ultraviolet absorber.
Hereinafter, unless otherwise specified, the “photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention” refers to the photosensitive resin composition for forming an organic electroluminescent element partition wall according to the first aspect, and the second embodiment. Both of the photosensitive resin composition for organic electroluminescent element partition formation which concern on the aspect of this are pointed out.

In the present invention, the partition wall is, for example, for partitioning a functional layer (organic layer, light emitting portion) in an active drive organic electroluminescence device, and is for forming a functional layer in the partitioned region (pixel region). This is used for forming pixels composed of functional layers and partition walls by ejecting and drying ink, which is a material of the above.

[1-1] Components and Composition of Photosensitive Resin Composition for Forming Organic Electroluminescent Device Partitions Components and compositions constituting the photosensitive resin composition for forming organic electroluminescent device partitions of the present invention will be described.
The photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the first aspect (hereinafter sometimes simply referred to as “photosensitive resin composition according to the first aspect”) is (A) ethylene. Containing an organic unsaturated compound, (B) a photopolymerization initiator and (C) an alkali-soluble resin, further containing (E) a chain transfer agent, and usually containing a solvent. Moreover, it is preferable to use the photosensitive resin composition for organic electroluminescent element partition formation of this invention which concerns on a 1st aspect in order to form a liquid-repellent partition. From such a viewpoint, (D) liquid repellent is used. It is preferable to contain them, and as the components (A) to (C) and (E), those showing the action as a liquid repellent may be used.

The photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the second aspect (hereinafter sometimes simply referred to as “photosensitive resin composition according to the second aspect”) is (A) ethylene. Containing an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin, wherein the (A) ethylenically unsaturated compound comprises (A1) an ethylenically unsaturated compound having an acid group, (A1) The content of the ethylenically unsaturated compound having an acid group is 30% by mass or less in the total solid content, and usually contains a solvent. Moreover, it is preferable to use the photosensitive resin composition for organic electroluminescent element partition formation of this invention which concerns on a 2nd aspect in order to form a liquid-repellent partition, From such a viewpoint, (D) liquid repellent is used. It is preferable to contain them, and as the components (A) to (C), those showing the action as a liquid repellent may be used.

[1-1-1] Component (A); Ethylenically Unsaturated Compound The photosensitive resin composition for forming an organic electroluminescent element partition according to the first aspect of the present invention contains (A) an ethylenically unsaturated compound. To do. (A) It is thought that it becomes high sensitivity by including an ethylenically unsaturated compound.

As used herein, an ethylenically unsaturated compound means a compound having at least one ethylenically unsaturated bond in the molecule, but it is polymerizable, crosslinkable, and a developer for exposed and non-exposed areas associated therewith. In view of the ability to expand the difference in solubility, the compound is preferably a compound having two or more ethylenically unsaturated bonds in the molecule, and the unsaturated bond is derived from a (meth) acryloyloxy group, That is, it is more preferable that it is a (meth) acrylate compound.

In the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the first aspect, in particular, a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds in one molecule is used. It is desirable. The number of ethylenically unsaturated groups contained in the polyfunctional ethylenic monomer is not particularly limited, but is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, particularly preferably 5 or more, and preferably Is 15 or less, more preferably 10 or less, still more preferably 8 or less, and particularly preferably 7 or less. By setting it as the said lower limit or more, there exists a tendency for polymerizability to improve and to become high sensitivity, and there exists a tendency for developability to become more favorable by setting it as the said upper limit or less.

Specific examples of the ethylenically unsaturated compound include an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid; an ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid; an aliphatic polyhydroxy compound and an aromatic polyhydroxy compound And esters obtained by esterification reaction of a polyvalent hydroxy compound such as unsaturated carboxylic acid and polybasic carboxylic acid.

Examples of the ester of the aliphatic polyhydroxy compound and the unsaturated carboxylic acid include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, Acrylic acid esters of aliphatic polyhydroxy compounds such as pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate, etc. In the same way, itaconic acid ester replaced by itaconate, Maleic acid esters in which instead of the crotonic acid ester or maleate was changed to bets and the like.

Examples of the ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcin diacrylate, resorcin dimethacrylate, pyrogallol triacrylate and the like. Etc.

Esters obtained by esterification reaction of polyvalent hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polybasic carboxylic acids are not necessarily a single substance, but are representative. Specific examples include condensates of acrylic acid, phthalic acid, and ethylene glycol, condensates of acrylic acid, maleic acid, and diethylene glycol, condensates of methacrylic acid, terephthalic acid, and pentaerythritol, acrylic acid, adipic acid, Examples include butanediol and glycerin condensates.

In addition, as an example of the polyfunctional ethylenic monomer used for the photosensitive resin composition for forming an organic electroluminescent element partition according to the first aspect of the present invention, a polyisocyanate compound and a hydroxyl group-containing (meth) acrylic ester Or urethane (meth) acrylates obtained by reacting a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth) acrylic acid ester; addition reaction between a polyvalent epoxy compound and hydroxy (meth) acrylate or (meth) acrylic acid Useful are epoxy acrylates such as products; acrylamides such as ethylene bisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate.

Examples of the urethane (meth) acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U -10PA, U-33H, UA-53H, UA-32P, UA-1100H (made by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, UF-8001G (made by Kyoeisha Chemical Co., Ltd.), UV-1700B, UV -7600B, UV-7605B, UV-7630B, UV7640B (manufactured by Nippon Synthetic Chemical).

Among these, from the viewpoint of an appropriate taper angle and sensitivity, it is preferable to use ester (meth) acrylates or urethane (meth) acrylates as the (A) ethylenically unsaturated compound, and dipentaerythritol hexa (meth). Acrylate, dipentaerythritol penta (meth) acrylate, 2-tris (meth) acryloyloxymethylethylphthalic acid, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate More preferably, a dibasic acid anhydride adduct, a dibasic acid anhydride adduct of pentaerythritol tri (meth) acrylate, or the like is used.
Moreover, it is also preferable to use what is mentioned later as a 2nd aspect from a viewpoint of residue generation | occurrence | production suppression.
These may be used alone or in combination of two or more.

In the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the first aspect, the molecular weight of the (A) ethylenically unsaturated compound is not particularly limited, but from the viewpoint of sensitivity, liquid repellency, and taper angle. , Preferably 100 or more, more preferably 150 or more, further preferably 200 or more, even more preferably 300 or more, particularly preferably 400 or more, most preferably 500 or more, preferably 1,000 or less, more preferably 700 or less.

Further, the number of carbon atoms of the (A) ethylenically unsaturated compound is not particularly limited, but from the viewpoint of sensitivity, liquid repellency, and taper angle, it is preferably 7 or more, more preferably 10 or more, still more preferably 15 or more, and even more. It is preferably 20 or more, particularly preferably 25 or more, preferably 50 or less, more preferably 40 or less, still more preferably 35 or less, and particularly preferably 30 or less.

Further, from the viewpoint of sensitivity, liquid repellency, and taper angle, ester (meth) acrylates, epoxy (meth) acrylates, and urethane (meth) acrylates are preferable. Among them, pentaerythritol tetra (meth) acrylate and pentaerythritol are preferable. Tri (meth) acrylate dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate and other trifunctional or more ester (meth) acrylates, 2,2,2-tris (meth) acryloyloxymethyl ethyl phthalate Acid, adducts of tri- or higher functional esters (meth) acrylates such as dibasic acid anhydride adducts of dipentaerythritol penta (meth) acrylate are sensitive, liquid repellency, taper angle And more preferred.

The content of the (A) ethylenically unsaturated compound in the photosensitive resin composition of the present invention according to the first aspect is usually 5% by mass or more, preferably 10% by mass or more, more preferably based on the total solid content. Is 20% by mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 80% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, and further preferably 55% by mass. % Or less, particularly preferably 50% by mass or less. When it is at least the lower limit value, the sensitivity and taper angle during exposure tend to be good, and when it is at most the upper limit value, developability tends to be good.

Further, the content ratio of (A) the ethylenically unsaturated compound with respect to 100 parts by mass of (C) alkali-soluble resin is usually 15 parts by mass or more, preferably 30 parts by mass or more, more preferably 50 parts by mass or more, and further preferably 80 parts. It is at least 90 parts by mass, particularly preferably at most 150 parts by mass, preferably at most 130 parts by mass, more preferably at most 120 parts by mass, even more preferably at most 110 parts by mass. When it is at least the lower limit, the sensitivity tends to be good during exposure and the taper angle tends to be good, and when it is at most the upper limit, the developability tends to be good.

Meanwhile, the photosensitive resin composition for forming an organic electroluminescent element partition according to the second aspect of the present invention contains (A) an ethylenically unsaturated compound. (A) It is thought that it becomes high sensitivity by including an ethylenically unsaturated compound.

<(A1) ethylenically unsaturated compound having an acid group>
(A) The ethylenically unsaturated compound in the photosensitive resin composition for forming an organic electroluminescent element partition according to the second aspect of the present invention contains (A1) an ethylenically unsaturated compound having an acid group, A1) The content ratio of the ethylenically unsaturated compound having an acid group is 30% by mass or less based on the total solid content. Thus, by containing the ethylenically unsaturated compound (A1) having an acid group, the compound is excellent in solubility in a developer, so that the generation of a residue in the pixel portion (light emitting portion) is suppressed, and the inkjet coating characteristics are improved. It is thought to improve. Furthermore, by making the content rate of the said compound below the said upper limit, the outgas generation | occurrence | production derived from the acid group contained in the said compound is reduced, and it is thought that the outgas generation | occurrence | production from the partition after formation can fully be suppressed.

The ethylenically unsaturated compound means a compound having at least one ethylenically unsaturated bond in the molecule. (A1) The number of ethylenically unsaturated bonds in one molecule of the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 1 or more. From the viewpoint that the difference in developer solubility in the exposed portion can be expanded, it is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, and 5 or more. It is particularly preferred that it is usually 15 or less, preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less. When the amount is not less than the lower limit, the polymerizability is improved and the sensitivity becomes high, and the amount of outgas generation tends to decrease as the curability increases. Tend to be.

In addition, the number of acid groups (A1) in the molecule of the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 1 or more, but from the viewpoint of curability, 4 or less is preferable, and 2 The following is more preferable, and one is more preferable. There exists a tendency for a remaining-film rate to become high by setting it as the said upper limit or less.

In addition, the type of acid group (A1) that the ethylenically unsaturated compound having an acid group has is not particularly limited, and examples thereof include a carboxyl group, a phosphoric acid group, and a sulfone group, and a carboxyl group is preferable from the viewpoint of developability. . In the case of having two or more acid groups, the acid groups may be the same or different.

(A1) The molecular weight of the ethylenically unsaturated compound having an acid group is not particularly limited, but is preferably 100 or more, more preferably 200 or more, further preferably 300 or more, particularly preferably 350 or more, and 1,000 or less. Preferably, 800 or less is more preferable, and 700 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to become high, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

(A1) The chemical structure of the ethylenically unsaturated compound having an acid group is not particularly limited, but from the viewpoint of developability, for example, a compound represented by the following general formula (a1) is preferable.

In the above formula (a1), R ^a1 represents a hydrogen atom or a methyl group. R ^a2 , R ^a3 , R ^a5 and R ^a6 each independently represents an alkylene group which may have a substituent.
R ^a4 represents an n + 1 valent linking group.
R ^a7 represents an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or a divalent aromatic ring group which may have a substituent.
l and m each independently represents an integer of 0 to 12.
n represents an integer of 1 or more.

(R ^a2 , R ^a3 , R ^a5 and R ^a6 )
In the general formula (a1), R ^a2 , R ^a3 , R ^a5 and R ^a6 each independently represent an alkylene group which may have a substituent.
The alkylene group may be linear, branched, cyclic, or a combination thereof. The number of carbon atoms is not particularly limited, but is usually 1 or more, usually 4 or less, preferably 2 or less. There exists a tendency for a remaining-film rate to improve by setting it as the said upper limit or less.

Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, and a cyclohexylene group. From the viewpoint of curability, a methylene group or an ethylene group is preferable, and a methylene group is more preferable.

Examples of the substituent that the alkylene group may have include an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

(R ^a4 )
In the general formula (a1), R ^a4 represents an n + 1 valent linking group. The chemical structure of the n + 1 valent linking group is not particularly limited, and examples thereof include an n + 1 valent hydrocarbon group which may have a substituent. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and is preferably an aliphatic hydrocarbon group from the viewpoint of developability. Further, the carbon-carbon single bond in the hydrocarbon group may be interrupted with at least one selected from the group consisting of —O—, —CO— and —NH—.

Specific examples of the n + 1 valent linking group include the following.

(R ^a7 )
In the general formula (a1), an alkylene group that may have a substituent, an alkenylene group that may have a substituent, or a divalent aromatic ring group that may have a substituent. .

The alkylene group for R ^a7 may be linear, branched, cyclic, or a combination thereof. Although the carbon number is not particularly limited, it is usually 1 or more, preferably 2 or more, and usually 8 or less, preferably 6 or less, more preferably 4 or less, and further preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to improve, and there exists a tendency for a residue to reduce or the amount of outgas generation to reduce by setting it as the said upper limit or less.

Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a hexylene group, a cyclohexylene group, and the like. From the viewpoint of developability, a methylene group or an ethylene group is preferable, and ethylene is more preferable.

The alkenylene group for R ^a7 may be linear, branched, cyclic, or a combination thereof. Although the carbon number is not particularly limited, it is usually 2 or more, preferably 4 or more, and usually 8 or less, preferably 6 or less. There exists a tendency for a remaining-film rate to improve by setting it as the said lower limit or more, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkenylene group include an ethenylene group, a propenylene group, a butyleneylene group, a cyclohexenylene group, and the like. From the viewpoint of developability and curability, an ethenylene group or a cyclohexenylene group is preferable, and an ethenylene group is more preferable. .

Examples of the substituent that the alkenylene group may have include an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

Examples of the divalent aromatic ring group for R ^a7 include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, more preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, still more preferably 15 or less, and more preferably 10 or less. Particularly preferred. There exists a tendency for a remaining-film rate to improve by setting it as the said lower limit or more, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, tetracene ring, pyrene ring, benzpyrene ring, chrysene ring having two free valences, Examples include a triphenylene ring, an acenaphthene ring, a fluoranthene ring, a fluorene ring, and the like.

In addition, the aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, and an indole having two free valences. Ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, Examples include pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, sinoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolinone ring, and azulene ring. .

Among these, from the viewpoint of curability, a benzene or naphthalene ring having two free valences is preferable, and a benzene ring having two free valences is more preferable.

Examples of the substituent that the divalent aromatic ring group may have include an alkyl group, an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. . Among these, unsubstituted is preferable from the viewpoint of curability.

Among these, from the viewpoint of ensuring developability and reducing the outgas generation amount, R ^a7 is preferably an alkylene group which may have a substituent, more preferably an unsubstituted alkylene group, and an ethylene group. More preferably it is.

(L and m)
In the general formula (a1), l and m each independently represents an integer of 0 to 12. From the viewpoint of developability, it is preferably 1 or more, more preferably 2 or more, and from the viewpoint of curability, it is preferably 8 or less, more preferably 6 or less, and 4 or less. Is more preferable, and 2 or less is particularly preferable. On the other hand, it is preferably 0 from the viewpoint of reducing the outgas generation amount.

(N)
In the general formula (a1), n represents an integer of 1 or more. n is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, particularly preferably 5 or more, and preferably 6 or less. When the amount is equal to or higher than the lower limit value, the residual film ratio is increased, and as the curability is increased, the outgas generation amount tends to be reduced, and when the value is equal to or lower than the upper limit value, the residue tends to be reduced. .

Examples of (A1) an ethylenically unsaturated compound having an acid group include polyvalent hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds, and unsaturated carboxylic acids and polybasic carboxylic acids. The ester obtained by esterification reaction is mentioned, and it is not necessarily a single substance, but representative examples include condensates of acrylic acid, phthalic acid, and pentaerythritol, acrylic acid, succinic acid, and pentaerythritol. And the condensates of acrylic acid, succinic acid and dipentaerythritol.

In the photosensitive resin composition for forming an organic electroluminescent element partition according to the second aspect of the present invention, the content ratio of the (A1) ethylenically unsaturated compound having an acid group may be 30% by mass or less in the total solid content. Although not particularly limited, it is preferably 27% by mass or less, more preferably 25% by mass or less, further preferably 22% by mass or less, still more preferably 20% by mass or less, particularly preferably 15% by mass or less, and 1% by mass. % Or more, preferably 5% by mass or more, more preferably 10% by mass or more. When the amount is not more than the above upper limit value, the outgas generation amount tends to be reduced, and when it is not less than the above lower limit value, the suitability for inkjet coating tends to be improved.

Further, the content ratio of the (A1) ethylenically unsaturated compound having an acid group in the ethylenically unsaturated compound is not particularly limited, but is preferably 50% by mass or less, more preferably 45% by mass or less, and 40% by mass. % Or less is more preferable, 35% by mass or less is more preferable, 30% by mass or less is particularly preferable, 1% by mass or more is preferable, 10% by mass or more is more preferable, and 25% by mass or more is more preferable. When the amount is not more than the above upper limit value, the outgas generation amount tends to be reduced, and when it is not less than the above lower limit value, the suitability for inkjet coating tends to be improved.

<(A2) ethylenically unsaturated compound having no acid group>
The (A) ethylenically unsaturated compound in the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the second aspect is (A1) other than (A1) an ethylenically unsaturated compound having an acid group. You may contain the ethylenically unsaturated compound which does not have an acid group. The (A2) ethylenically unsaturated compound having no acid group refers to a compound other than the (A1) ethylenically unsaturated compound having an acid group among the (A) ethylenically unsaturated compounds. (A2) By containing an ethylenically unsaturated compound having no acid group, the curability is improved, the minimum exposure necessary for producing liquid repellency is reduced, and the outgas generation amount is reduced. Tend.

(A2) The number of ethylenically unsaturated bonds in one molecule of the ethylenically unsaturated compound having no acid group is not particularly limited as long as it is 1 or more, but is polymerizable, crosslinkable, and the exposed portion accompanying it Is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, from the viewpoint that the difference in developer solubility between the unexposed portion and the developer can be expanded. More preferably, it is more preferably 6 or more, and usually 15 or less, preferably 12 or less, more preferably 10 or less, more preferably 8 or less. More preferably. When the amount is not less than the lower limit, the polymerizability is improved and the sensitivity becomes high, and the amount of outgas generation tends to decrease as the curability increases. Tend to be.

(A2) The molecular weight of the ethylenically unsaturated compound having no acid group is not particularly limited, but is preferably 200 or more, more preferably 250 or more, further preferably 300 or more, and preferably 1,000 or less, 800 or less. Is more preferable, and 600 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to become high, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

(A2) An ethylenically unsaturated compound having no acid group is (meth) acryloyl from the viewpoints of polymerizability, crosslinkability, and expansion of the difference in developer solubility between exposed and non-exposed areas. A compound having an oxy group, that is, a (meth) acrylate compound is preferable.
(A2) Specific examples of the ethylenically unsaturated compound having no acid group include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids, and the like. It is done.

In addition, urethane (meth) acrylates obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth) acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth) acrylic acid ester; a polyvalent epoxy compound Acrylates such as addition reaction product of styrene and hydroxy (meth) acrylate or (meth) acrylic acid; acrylamides such as ethylene bisacrylamide; allyl esters such as diallyl phthalate; vinyl group-containing compounds such as divinyl phthalate Is useful.

Examples of the urethane (meth) acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U -10PA, U-33H, UA-53H, UA-32P, UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), UV-1700B , UV-7600B, UV-7605B, UV-7630B, UV7640B (manufactured by Nippon Synthetic Chemical).

Among these, from the viewpoint of curability, it is preferable to use ester (meth) acrylates or urethane (meth) acrylates as the ethylenically unsaturated compound having no acid group (A2), and dipentaerythritol hexa ( It is more preferable to use (meth) acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol tetra (meth) acrylate, or pentaerythritol tri (meth) acrylate.
These may be used alone or in combination of two or more.

In the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the second aspect, the content ratio of the (A2) ethylenically unsaturated compound having no acid group is not particularly limited. 50 mass% or less is preferable, 45 mass% or less is more preferable, 40 mass% or less is more preferable, 20 mass% or more is preferable, 25 mass% or more is more preferable, 30 mass% or more is further more preferable, 35 A mass% or more is particularly preferred. By setting it to the upper limit or less, there is a tendency that the ink jet coating suitability is improved, and by setting the upper limit value or more, the outgas generation amount tends to be reduced.

Further, the content ratio of the (A) ethylenically unsaturated compound (A2) having no acid group is not particularly limited, but is preferably 90% by mass or less, more preferably 80% by mass or less, 75 mass% or less is further more preferable, 50 mass% or more is preferable, 55 mass% or more is more preferable, 60 mass% or more is further more preferable, 65 mass% or more is further more preferable, 70 mass% or more is especially preferable. By setting it to the upper limit or less, there is a tendency that the ink jet coating suitability is improved, and by setting the upper limit value or more, the outgas generation amount tends to be reduced.

[1-1-2] Component (B): Photopolymerization Initiator The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention contains (B) a photopolymerization initiator. (B) A photoinitiator will not be specifically limited if it is a compound which superposes | polymerizes the ethylenically unsaturated bond which the said (A) ethylenically unsaturated compound has by an active light, A well-known photoinitiator Can be used.

In the photosensitive resin composition of the present invention, as the (B) photopolymerization initiator, a photopolymerization initiator usually used in this field can be used. Examples of such photopolymerization initiators include hexaarylbiimidazole photopolymerization initiators, acylphosphine oxide photopolymerization initiators, oxime photopolymerization initiators, acetophenone photopolymerization initiators, and benzophenone photopolymerization initiators. Agent, hydroxybenzene photopolymerization initiator, thioxanthone photopolymerization initiator, anthraquinone photopolymerization initiator, ketal photopolymerization initiator, titanocene photopolymerization initiator, halogenated hydrocarbon derivative photopolymerization initiator, organic Boronate photopolymerization initiator, onium salt photopolymerization initiator, sulfone compound photopolymerization initiator, carbamic acid derivative photopolymerization initiator, sulfonamide photopolymerization initiator, triarylmethanol photopolymerization initiator Is mentioned.

The hexaarylbiimidazole-based photopolymerization initiator is represented by the following general formula (1-1) and / or the following general formula (1-2) from the viewpoint of absorbance and sensitivity and matching properties with the absorption wavelength of the ultraviolet absorber. Preferred are hexaarylbiimidazole compounds.

In the above formulas, R ¹¹ to R ¹³ are each independently an alkyl group having 1 to 4 carbon atoms which may have a substituent, an alkoxy group having 1 to 4 carbon atoms which may have a substituent, or a halogen atom M, n and l each independently represents an integer of 0 to 5;

The carbon number of the alkyl group of R ¹¹ to R ¹³ is not particularly limited as long as it is within the range of 1 to 4, but is preferably 3 or less, more preferably 2 or less, from the viewpoint of sensitivity. The alkyl group may be linear or cyclic. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and an isopropyl group. Among them, a methyl group and an ethyl group are preferable. As the substituent that the alkyl group having 1 to 4 carbon atoms of R ¹¹ to R ¹³ may have, a monovalent non-metallic atomic group other than hydrogen is used. Preferred examples include halogen atoms (— F, —Br, —Cl, —I), a hydroxy group, and an alkoxy group.

The number of carbon atoms of the alkoxy group of R ¹¹ to R ¹³ is not particularly limited as long as it is within the range of 1 to 4, but is preferably 3 or less, more preferably 2 or less from the viewpoint of sensitivity. The alkyl group part of the alkoxy group may be a chain or a ring. Specific examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropyloxy group, and a butoxy group, and among them, a methoxy group and an ethoxy group are preferable. Examples of the substituent that the alkoxy group having 1 to 4 carbon atoms of R ¹¹ to R ¹³ may have include an alkyl group and an alkoxy group, and an alkyl group is preferable.

Examples of the halogen atom of R ¹¹ to R ¹³ include a chlorine atom, an iodine atom, a bromine atom, and a fluorine atom. Among these, from the viewpoint of ease of synthesis, a chlorine atom or a fluorine atom is preferable, and a chlorine atom is more preferable. preferable.
Among these, R ¹¹ to R ¹³ are preferably each independently a halogen atom, more preferably a chlorine atom, from the viewpoints of sensitivity and ease of synthesis.

m, n and l each independently represent an integer of 0 to 5, but from the viewpoint of ease of synthesis, at least one of m, n and l is preferably an integer of 1 or more, and m, n and l More preferably, one of them is 1 and the other two are 0.

Examples of the hexaarylbiimidazole compound represented by the general formula (1-1) and / or the general formula (1-2) include 2,2′-bis (o-chlorophenyl) -4,5,4 ′. , 5′-tetraphenylbiimidazole, 2,2′-bis (o-methylphenyl) -4,5,4 ′, 5′-tetraphenylbiimidazole, 2,2′-bis (o-chlorophenyl) -4 , 4 ′, 5,5′-tetra (o, p-dichlorophenyl) biimidazole, 2,2′-bis (o, p-dichlorophenyl) -4,4 ′, 5,5′-tetra (o, p- Dichlorophenyl) biimidazole, 2,2′-bis (o-chlorophenyl) -4,4 ′, 5,5′-tetra (p-fluorophenyl) biimidazole, 2,2′-bis (o-chlorophenyl) -4 , 4 ', 5, 5' Tetra (o, p-dibromophenyl) biimidazole, 2,2′-bis (o-bromophenyl) -4,4 ′, 5,5′-tetra (o, p-dichlorophenyl) biimidazole, 2,2 ′ -Bis (o-chlorophenyl) -4,4 ', 5,5'-tetra (p-chloronaphthyl) biimidazole and the like. Among them, hexaphenylbiimidazole compounds are preferable, and those in which the o-position of the benzene ring bonded to the 2,2′-position on the imidazole ring is substituted with a methyl group, a methoxy group, or a halogen atom are more preferable. A benzene ring bonded to the 4,4 ′, 5,5′-position on the imidazole ring is preferably unsubstituted or substituted with a halogen atom or a methoxy group.

(B) As a photopolymerization initiator, either a hexaarylbiimidazole compound represented by general formula (1-1) or a hexaarylbiimidazole compound represented by general formula (1-2) is used. Alternatively, both may be used in combination. When used in combination, the ratio is not particularly limited. Note that b-1 used in the examples has a structure satisfying the general formula (1-1).

As the acylphosphine oxide photopolymerization initiator, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide and the like can be mentioned as preferable ones. .

Examples of the oxime-based photopolymerization initiator include Japanese National Publication No. 2004-534797, Japanese Unexamined Patent Publication No. 2000-80068, Japanese Unexamined Patent Publication No. 2006-36750, Japanese Unexamined Patent Publication No. 2008-179611, Japan. Examples thereof include oxime ester compounds described in Japanese National Table 2012-526185, Japanese National Table 2012-519191, and the like. Among these, from the viewpoint of sensitivity, N-acetoxy-N- {4-acetoxyimino-4- [9-ethyl-6- (o-toluoyl) -9H-carbazol-3-yl] butan-2-yl} acetamide, N -Acetoxy-N- {3- (acetoxyimino) -3- [9-ethyl-6- (1-naphthoyl) -9H-carbazol-3-yl] -1-methylpropyl} acetamide, 4-acetoxyimino-5 -[9-Ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -5-oxopentanoic acid methyl has the product names OXE-01, OXE-02, OXE-03 ( BASF), TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Strong), NCI-831, NCI-930 (manufactured by ADEKA), etc. It can gel.

Examples of the acetophenone photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, and 1-hydroxy-1- (p-dodecylphenyl) ketone. 1-hydroxy-1-methylethyl- (p-isopropylphenyl) ketone, 1-trichloromethyl- (p-butylphenyl) ketone, α-hydroxy-2-methylphenylpropanone, 2-methyl-1- [4 -(Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1-one, 2-benzyl-2-dimethylamino- 1- (4-morpholinophenyl) butan-1-one, 4-dimethylamino Tylbenzoate, 4-dimethylaminoisoamylbenzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4-dimethylaminobenzoate, 2,5-bis (4-diethylaminobenzal) cyclohexanone, 4 -(Diethylamino) chalcone and the like.

Examples of the benzophenone photopolymerization initiator include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-carboxybenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone, Michler's ketone, and the like.

Examples of the hydroxybenzene photopolymerization initiator include 2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-benzylbenzophenone, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 4- Examples include di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate.

Examples of the thioxanthone photopolymerization initiator include thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like. Can be mentioned.

Examples of the anthraquinone photopolymerization initiator include 2-methylanthraquinone, and examples of the ketal photopolymerization initiator include benzyldimethyl ketal.

Examples of titanocene photopolymerization initiators include dicyclopentadienyl titanium dichloride, dicyclopentadienyl titanium bisphenyl, dicyclopentadienyl titanium bis (2,4-difluorophenyl), and dicyclopentadienyl titanium. Bis (2,6-difluorophenyl), dicyclopentadienyl titanium bis (2,4,6-trifluorophenyl), dicyclopentadienyl titanium bis (2,3,5,6-tetrafluorophenyl), Dicyclopentadienyl titanium bis (2,3,4,5,6-pentafluorophenyl), di (methylcyclopentadienyl) titanium bis (2,6-difluorophenyl), di (methylcyclopentadienyl) Titanium bis (2,3,4,5,6-pentaful Rofeniru), dicyclopentadienyl titanium bis [2,6-difluoro-3- (1-pyrrolyl) phenyl], and the like. Among these, from the viewpoint of sensitivity, titanium compounds having a dicyclopentadienyl structure and a bisphenyl structure are preferable, and those in which the o-position of the bisphenyl ring is substituted with a halogen atom are particularly preferable.

Halogenated hydrocarbon derivative-based photopolymerization initiators include halomethylated s-triazine derivatives such as 2,4,6-tris (monochloromethyl) -s-triazine, 2,4,6-tris ( Dichloromethyl) -s-triazine, 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl) -s-triazine, 2-n-propyl-4, 6-bis (trichloromethyl) -s-triazine, 2- (α, α, β-trichloroethyl) -4,6-bis (trichloromethyl) -s-triazine, 2-phenyl-4,6-bis (trichloro Methyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (3,4-epoxyphenyl) -4 6-bis (trichloromethyl) -s-triazine, 2- (p-chlorophenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- [1- (p-methoxyphenyl) -2,4- Butadienyl] -4,6-bis (trichloromethyl) -s-triazine, 2-styryl-4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxystyryl) -4,6-bis ( Trichloromethyl) -s-triazine, 2- (p-methoxy-m-hydroxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (pi-propyloxystyryl) -4,6 -Bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxynaphthyl)- , 6-Bis (trichloromethyl) -s-triazine, 2- (p-ethoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-ethoxycarbonylnaphthyl) -4,6- Bis (trichloromethyl) -s-triazine, 2-phenylthio-4,6-bis (trichloromethyl) -s-triazine, 2-benzylthio-4,6-bis (trichloromethyl) -s-triazine, 2,4, 6-tris (dibromomethyl) -s-triazine, 2,4,6-tris (tribromomethyl) -s-triazine, 2-methyl-4,6-bis (tribromomethyl) -s-triazine, 2- Methoxy-4,6-bis (tribromomethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazi And halomethylated s-triazine derivatives such as bis (trihalomethyl) -s-triazine are preferable from the viewpoint of sensitivity.

Examples of the organic boronate photopolymerization initiator include organic boron ammonium complexes, organic boron phosphonium complexes, organic boron sulfonium complexes, organic boron oxosulfonium complexes, organic boron iodonium complexes, and organic boron transition metal coordination complexes. Examples of the organic boron anion include n-butyl-triphenyl boron anion, n-butyl-tris (2,4,6-trimethylphenyl) boron anion, and n-butyl-tris (p-methoxyphenyl) boron. Anion, n-butyl-tris (p-fluorophenyl) boron anion, n-butyl-tris (m-fluorophenyl) boron anion, n-butyl-tris (3-fluoro-4-methylphenyl) boron anion, n- Butyl-tris (2,6-difluorophenyl) boron anion, n-butyl Ru-tris (2,4,6-trifluorophenyl) boron anion, n-butyl-tris (2,3,4,5,6-pentafluorophenyl) boron anion, n-butyl-tris (p-chlorophenyl) Alkyl-triphenyl boron anions such as boron anion and n-butyl-tris (2,6-difluoro-3-pyrrolylphenyl) boron anion are preferred from the viewpoint of sensitivity, and the counter cation includes ammonium cation and phosphonium cation. In addition, onium compounds such as sulfonium cation and iodonium cation are preferable from the viewpoint of sensitivity, and organic ammonium cations such as tetraalkylammonium are particularly preferable from the viewpoint of sensitivity.

Examples of onium salt photopolymerization initiators include ammonium salts such as tetramethylammonium bromide and tetraethylammonium bromide, diphenyliodonium hexafluoroarsenate, diphenyliodonium tetrafluoroborate, diphenyliodonium p-toluenesulfonate, diphenyliodonium camphorsulfonate, Iodonium salts such as dicyclohexyliodonium hexafluoroarsenate, dicyclohexyliodonium tetrafluoroborate, dicyclohexyliodonium p-toluenesulfonate, dicyclohexyliodonium camphorsulfonate, triphenylsulfonium hexafluoroarsenate, triphenylsulfonium tetrafluoroborate, triphenyl Sulfonium p- toluenesulfonate, triphenylsulfonium camphorsulfonate, tri-cyclohexyl hexafluoroarsenate, tri-cyclohexyl sulfonium tetrafluoroborate, tri-cyclohexyl sulfonium p- toluenesulfonate, sulfonium salts such as tri-cyclohexyl sulfonium camphorsulfonate, and the like.

Examples of the sulfone compound photopolymerization initiator include bis (phenylsulfonyl) methane, bis (p-hydroxyphenylsulfonyl) methane, bis (p-methoxyphenylsulfonyl) methane, bis (α-naphthylsulfonyl) methane, bis ( β-naphthylsulfonyl) methane, bis (cyclohexylsulfonyl) methane, bis (tert-butylsulfonyl) methane, bis (sulfonyl) methane compounds such as phenylsulfonyl (cyclohexylsulfonyl) methane, phenylcarbonyl (phenylsulfonyl) methane, naphthylcarbonyl ( Phenylsulfonyl) methane, phenylcarbonyl (naphthylsulfonyl) methane, cyclohexylcarbonyl (phenylsulfonyl) methane, tert-butylcarbonyl (phenylsulfonyl) Carbonyl (sulfonyl) methane compounds such as methane, phenylcarbonyl (cyclohexylsulfonyl) methane, phenylcarbonyl (tert-butylcarbonyl) methane, bis (phenylsulfonyl) diazomethane, bis (p-hydroxyphenylsulfonyl) diazomethane, bis (p-methoxy) Phenylsulfonyl) diazomethane, bis (α-naphthylsulfonyl) diazomethane, bis (β-naphthylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (tert-butylsulfonyl) diazomethane, phenylsulfonyl (cyclohexylsulfonyl) diazomethane, bis (sulfonyl) ) Diazomethane, phenylcarbonyl (phenylsulfonyl) diazomethane, naphthylcarbonyl (phenylsulfoni) ) Carbonyl such as diazomethane, phenylcarbonyl (naphthylsulfonyl) diazomethane, cyclohexylcarbonyl (phenylsulfonyl) diazomethane, tert-butylcarbonyl (phenylsulfonyl) diazomethane, phenylcarbonyl (cyclohexylsulfonyl) diazomethane, phenylcarbonyl (tert-butylcarbonyl) diazomethane And (sulfonyl) diazomethane compounds.

Examples of the carbamic acid derivative-based photopolymerization initiator include benzoyl cyclohexyl carbamate, 2-nitrobenzyl cyclohexyl carbamate, 3,5-dimethoxybenzyl cyclohexyl carbamate, 3-nitrophenyl cyclohexyl carbamate, and the like.

Examples of the sulfonamide photopolymerization initiator include N-cyclohexyl-4-methylphenylsulfonamide, N-cyclohexyl-2-naphthylsulfonamide, and the like. Examples of the triarylmethanol photopolymerization initiator include Examples thereof include triphenylmethanol and tri (4-chlorophenyl) methanol.

These photopolymerization initiators may be included alone in the photosensitive resin composition, or may be included in two or more. Among these photopolymerization initiators, hexaarylbiimidazole compounds are particularly preferable because of their high absorbance, high surface curability, and high liquid repellency and a large taper angle.

As a content rate of (B) photoinitiator in the photosensitive resin composition of this invention, it is 0.01 mass% or more normally with respect to the total solid of the photosensitive resin composition, Preferably it is 0.1 mass. % Or more, more preferably 0.5% by weight or more, further preferably 1% by weight or more, particularly preferably 1.5% by weight or more, and usually 25% by weight or less, preferably 10% by weight or less, more preferably 8% by weight. It is at most 5% by mass, more preferably at most 5% by mass, particularly preferably at most 3% by mass. When the amount is not less than the lower limit, a film is not formed during development and a coating film is formed, and sufficient liquid repellency tends to occur. When the amount is not more than the upper limit, a desired pattern shape is formed. It tends to be easy to do.

Moreover, as a compounding ratio of (B) photoinitiator with respect to (A) ethylenically unsaturated compound in the photosensitive resin composition of this invention, (A) 100 mass parts of ethylenically unsaturated compounds, B) 1 mass part or more of a photoinitiator is preferable, 2 mass parts or more are more preferable, 3 mass parts or more are more preferable, 200 mass parts or less are preferable, 100 mass parts or less are more preferable, 50 mass parts or less Is more preferably 20 parts by mass or less, particularly preferably 10 parts by mass or less, and most preferably 5 parts by mass or less. There exists a tendency for it to become suitable sensitivity by setting it as the said lower limit or more, and there exists a tendency for a desired pattern shape to become easy to form by setting it as the said upper limit or less.

Further, a sensitizer may be used in combination with (B) a photopolymerization initiator. Sensitivity is improved by the sensitizer, and at the same time, the light transmittance to the inside of the photosensitive resin composition is decreased, so that the taper angle tends to be increased.

As the sensitizer, a sensitizer usually used in this field can be used. The sensitizer is characterized in that the energy obtained by absorption is transferred to the photopolymerization initiator, or electrons are exchanged with the photopolymerization initiator to efficiently promote the reaction radical polymerization reaction.

Examples of such sensitizers include unsaturated ketones represented by chalcone derivatives and dibenzalacetone, 1,2-diketone compounds represented by benzyl and camphorquinone, benzoin compounds, fluorenes, and the like. Compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, oxonol derivatives, etc. Polymethine dyes, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, azurenium compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds Products, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalyloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds Examples thereof include compounds, pyrylium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospiropyran compounds, metal arene complexes, organic ruthenium complexes, and benzophenone compounds.
These may be used alone or in combination of two or more.

Among these, thioxanthone compounds and benzophenone compounds are preferable from the viewpoint of improving sensitivity and increasing the taper angle.

Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, 4-methylthioxanthone, 2,4-dimethylthioxanthone, 2-ethylthioxanthone, 4-ethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 4-isopropyl Examples include thioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, 2,4-dichlorothioxanthone, and the like. Among these, 2,4-diethylthioxanthone is preferable from the viewpoint of improving sensitivity and increasing the taper angle.

Examples of the benzophenone compounds include benzophenone, 4,4'-bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) benzophenone, 4,4'-bis (ethylmethylamino) benzophenone, and the like. Among these, 4,4'-bis (diethylamino) benzophenone is preferable from the viewpoint of improving sensitivity and increasing the taper angle.

The content of the sensitizer in the photosensitive resin composition is usually 0.1% by mass or more, preferably 0.3% by mass or more, more preferably 0.00% by mass, based on the total solid content of the photosensitive resin composition. 5% by mass or more, more preferably 0.8% by mass or more, still more preferably 1% by mass or more, particularly preferably 1.2% by mass or more, and usually 10% by mass or less, preferably 7% by mass or less. More preferably, it is 5 mass% or less, More preferably, it is 3 mass% or less. When the value is not less than the lower limit value, the sensitivity tends to be improved and the taper angle tends to be increased. When the value is not more than the upper limit value, a desired pattern tends to be easily formed.

[1-1-3] Component (E); Chain Transfer Agent The photosensitive resin composition for forming an organic electroluminescent element partition according to the first aspect of the present invention contains (E) a chain transfer agent. (E) Inclusion of a chain transfer agent tends to increase the taper angle by improving radical deactivation in the vicinity of the surface due to oxygen inhibition or the like and enhancing surface curability.
In addition, when a liquid repellent is included, the outflow of the liquid repellent can be suppressed by increasing the surface curability, and the contact angle tends to be easily fixed near the surface.
In the photosensitive resin composition for forming an organic electroluminescent element partition wall according to the second aspect of the present invention, (E) a chain transfer agent is not essential, but from the viewpoint of increasing the taper angle, (E) chain transfer is performed. It is preferable that an agent is included.

(E) Examples of the chain transfer agent include mercapto group-containing compounds and carbon tetrachloride, and it is more preferable to use a mercapto group-containing compound because the chain transfer effect tends to be high. Since the mercapto group-containing compound has a low SH bond energy, bond cleavage is likely to occur and a chain transfer reaction is liable to occur, so that the surface curability tends to be improved.

Among (E) chain transfer agents, a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound are preferred from the viewpoint of taper angle and surface curability.

As the mercapto group-containing compound having an aromatic ring, a compound represented by the following general formula (1-3) is preferably used from the viewpoint of taper angle.

In formula (1-3), Z represents —O—, —S—, or —NH—, and R ⁶¹ , R ⁶² , R ⁶³ , and R ⁶⁴ each independently represents a hydrogen atom or a monovalent substituent. To express.
Among these, from the viewpoint of the taper angle, Z is preferably —S— or —NH—, more preferably —NH—.
From the viewpoint of the taper angle, R ⁶¹ , R ⁶² , R ⁶³ and R ⁶⁴ are each independently preferably a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxy group having 1 to 4 carbon atoms, More preferred.

Specifically, 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4 (3H) -quinazoline, β-mercaptonaphthalene And mercapto group-containing compounds having an aromatic ring such as 1,4-dimethylmercaptobenzene, and 2-mercaptobenzothiazole and 2-mercaptobenzimidazole are preferable from the viewpoint of taper angle.

On the other hand, as the aliphatic mercapto group-containing compound, hexanedithiol, decanedithiol, or a compound represented by the following general formula (1-4) is preferably used from the viewpoint of surface curability.

In formula (1-4), m represents an integer of 0 to 4, and n represents an integer of 2 to 4. R ⁷¹ and R ⁷² each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X represents an n-valent group.

In the general formula (1-4), m is preferably 1 or 2 from the viewpoint of ease of synthesis. From the viewpoint of surface curability, n is preferably 3 or 4, and more preferably 4.
Further, the alkyl group of R ⁷¹ and R ⁷² is preferably one having 1 to 3 carbon atoms from the viewpoint of surface curability. From the viewpoint of surface curability, at least one of R ⁷¹ and R ⁷² , for example, R ⁷² is preferably a hydrogen atom. In this case, R ⁷¹ is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. Preferably there is.

When n is 2, from the viewpoint of surface curability, X is preferably an alkylene group having 1 to 6 carbon atoms which may have an ether bond and / or a branched portion. From the viewpoint of surface curability and ease of synthesis, an alkylene group having 1 to 6 carbon atoms is more preferable, and an alkylene group having 4 carbon atoms is more preferable.

When n is 3, X is preferably a structure represented by the following general formula (1-5) or (1-6) from the viewpoint of surface curability and ease of synthesis.

In the formula (1-5), R ⁷³ represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a methylol group. Among R ⁷³ , an ethyl group is preferable from the viewpoint of a taper angle.

In the formula (1-6), R ⁷⁴ represents an alkylene group having 1 to 4 carbon atoms. Among R ⁷⁴ , an ethylene group is preferable from the viewpoint of a taper angle.

On the other hand, when n is 4, X is preferably a structure represented by the following general formula (1-7).

Specifically, butanediol bis (3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol bis (3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris (3- Mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), butanediol bis (3-mercaptobutyrate), ethylene glycol bis (3-mercaptobutyrate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis 3-mercaptobutyrate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione and the like.

Of these, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate) ), Pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2, 4,6 (1H, 3H, 5H) -trione is preferable, and pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate) are more preferable.

These can be used singly or in combination of two or more.

Among these, from the viewpoint of increasing the taper angle, a combination of one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzoimidazole, and 2-mercaptobenzoxazole, and a photopolymerization initiator, It is preferred to use it as a photopolymerization initiator system. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzoimidazole may be used, or 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination.
From the viewpoint of surface curability, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate).

Furthermore, it is preferable to use a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound in combination from the viewpoint of increasing the taper angle even for a partition wall having a narrow line width. This is because, in order to form a partition with a narrow line width, the illuminance per unit area is reduced by diffraction at the time of exposure by using a mask with a narrow opening, and oxygen inhibition is less than that when the line width is large. This is because the surface curability tends to be low.

In particular, when a hexaarylbiimidazole photopolymerization initiator is used as the photopolymerization initiator (B), a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound are used in combination. Is preferred. On the other hand, when an acetophenone photopolymerization initiator is used, there is a tendency that a sufficient effect can be obtained even if an aliphatic mercapto group-containing compound is used alone.

For example, one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakis (3-mercapto) It is preferable to use one or more selected from the group consisting of butyrate) and a photopolymerization initiator in combination.

The content ratio of the chain transfer agent (E) in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.025% by mass with respect to the total solid content of the photosensitive resin composition. % Or more, more preferably 0.05% by weight or more, further preferably 0.1% by weight or more, particularly preferably 1% by weight or more, and usually 5% by weight or less, preferably 4% by weight or less, more preferably 3%. It is below mass%. When it is at least the lower limit value, the taper angle tends to be large and the surface curability tends to be high, and when it is at most the upper limit value, a desired pattern tends to be easily formed.

In addition, as a chain transfer agent, when the mercapto group-containing compound having an aromatic ring and the aliphatic mercapto group-containing compound are used in combination, the content ratio includes a mercapto group having an aromatic ring. The amount of the aliphatic mercapto group-containing compound is usually 10 parts by mass or more, preferably 50 parts by mass or more, more preferably 80 parts by mass or more, and usually 400 parts by mass or less, preferably 300 parts by mass with respect to 100 parts by mass of the compound. Part or less, more preferably 200 parts by weight or less, and still more preferably 150 parts by weight or less. When it is at least the lower limit, the taper angle tends to increase, and when it is at most the upper limit, surface curability tends to be high and the contact angle tends to be high.

Moreover, as a compounding ratio of (E) chain transfer agent to (B) photopolymerization initiator in the photosensitive resin composition, (E) chain transfer agent with respect to 100 parts by mass of (B) photopolymerization initiator. 10 parts by mass or more is preferable, 25 parts by mass or more is more preferable, 50 parts by mass or more is further preferable, 80 parts by mass or more is particularly preferable, 500 parts by mass or less is preferable, 400 parts by mass or less is more preferable, and 300 parts by mass. Part or less is more preferable, 200 parts by weight or less is more preferable, and 150 parts by weight or less is particularly preferable. When it is at least the lower limit value, the taper angle tends to be large and the surface curability tends to be high, and when it is at most the upper limit value, a desired pattern tends to be easily formed.

[1-1-4] Component (C): Alkali-soluble resin The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention contains (C) an alkali-soluble resin. In the present invention, the (C) alkali-soluble resin is not particularly limited as long as it can be developed with a developer. However, an alkali developer is preferable as the developer, and therefore (C) an alkali-soluble resin is used in the present invention. .

(C) Examples of the alkali-soluble resin include various resins containing a carboxyl group or a hydroxyl group. Among them, it is preferable to have a carboxyl group, because it can obtain a partition wall with an appropriate taper angle, and can suppress the outflow of the liquid repellent due to thermal melting of the partition wall surface during post-baking and can maintain liquid repellency. It is more preferable to have a group.

(Alkali-soluble resin (c) having a partial structure represented by the general formula (1))
In the photosensitive resin composition for forming an organic electroluminescent element partition according to the first aspect of the present invention, (C) the alkali-soluble resin is an alkali-soluble resin (c) having a partial structure represented by the following general formula (1): ) (Hereinafter sometimes abbreviated as “resin (c)”).
In addition, it is preferable that resin (c) is also what has an ethylenically unsaturated group similarly to (C) alkali-soluble resin.

Thus, the thermosetting at the time of forming a partition by using the alkali-soluble resin having the partial structure represented by the general formula (1), that is, the partial structure having an acid component having a short carbon number and being easily pyrolyzed. Since most of the acid component is sometimes removed as a gas, it is considered that the amount of outgas generated when driving the organic electroluminescence device is small and the reliability is improved.

In the formula (1), R ¹ represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. * Represents a bond.

(R ¹ )
In the general formula (1), R ¹ represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. Examples of the divalent hydrocarbon group include an alkylene group and an alkenylene group.

The alkylene group may be linear or branched, but is preferably linear from the viewpoint of development solubility. The alkylene group preferably has 2 or more carbon atoms, and preferably 3 or less. When the amount is not less than the lower limit, the remaining film ratio tends to be high, and when the amount is not more than the upper limit, the amount of outgas generated during light emission of the element tends to be reduced.

Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. From the viewpoint of reducing the outgas generation amount, a methylene group or an ethylene group is preferable, and an ethylene group is more preferable.

The alkenylene group may be linear or branched, but is preferably linear from the viewpoint of development solubility. The number of carbon atoms of the alkenylene group is preferably 2 or more, and more preferably 3 or less. When the amount is not less than the lower limit, the remaining film ratio tends to be high, and when the amount is not more than the upper limit, the amount of outgas generated during light emission of the element tends to be reduced.

Specific examples of the alkenylene group include an ethenylene group, a propenylene group, and a butyleneylene group, and the ethenylene group is preferable from the viewpoint of reducing the outgas generation amount.

The substituent that the divalent hydrocarbon group having 1 to 4 carbon atoms may have is not particularly limited, and examples thereof include a halogen atom, an alkoxy group, a benzoyl group, a hydroxyl group, and the like. Therefore, it is preferably unsubstituted.

Among these, from the viewpoint of reducing the outgas generation amount, R ¹ is preferably a divalent alkylene group having 1 to 4 carbon atoms, more preferably a methylene group or an ethylene group, and further preferably an ethylene group. preferable.

The alkali-soluble resin (c) is not particularly limited as long as it has a partial structure represented by the general formula (1). From the viewpoint of development solubility, (c1) epoxy ( It is preferable to contain (meth) acrylate resin and / or (c2) acrylic copolymer resin, and it is more preferable to contain (c1) epoxy (meth) acrylate resin from the viewpoint of reducing outgas generation amount.
The (c1) epoxy (meth) acrylate resin is described in detail below.

[(C1) Epoxy (meth) acrylate resin]
(C1) The epoxy (meth) acrylate resin is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond to an epoxy resin and further adding a polybasic acid or an anhydride thereof. For example, by ring-opening addition of a carboxyl group of an unsaturated monocarboxylic acid to an epoxy group of an epoxy resin, an ethylenically unsaturated bond is added to the epoxy resin via an ester bond (—COO—). The thing which one carboxy group of the polybasic acid or its anhydride was added to the hydroxyl group produced in that case is mentioned. Moreover, what added polyhydric alcohol simultaneously when adding a polybasic acid or its anhydride is also mentioned. Furthermore, the resin obtained by reacting the carboxy group of the resin obtained by the above reaction with a compound having a functional group capable of further reaction is also included in the (c1) epoxy (meth) acrylate resin.

Thus, the (c1) epoxy (meth) acrylate resin has substantially no epoxy group in terms of chemical structure and is not limited to “(meth) acrylate”, but an epoxy compound (epoxy resin) Is a raw material, and “(meth) acrylate” is a representative example, and is thus named according to common usage.

Here, the epoxy resin includes a raw material compound before the resin is formed by thermosetting, and the epoxy resin can be appropriately selected from known epoxy resins. Moreover, the epoxy resin can use the compound obtained by making a phenolic compound and epihalohydrin react. The phenolic compound is preferably a compound having a divalent or divalent or higher phenolic hydroxyl group, and may be a monomer or a polymer.

Specifically, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, biphenyl novolac epoxy resin, trisphenol epoxy resin, phenol and dicyclopentane Polymerized epoxy resin, dihydroxyoxyfluorene type epoxy resin, dihydroxyalkyleneoxyl fluorene type epoxy resin, diglycidyl etherified product of 9,9-bis (4′-hydroxyphenyl) fluorene, 1,1-bis (4 '-Hydroxyphenyl) adamantane diglycidyl ether and the like, and those having an aromatic ring in the main chain as described above can be suitably used.

Among them, from the viewpoint of high cured film strength, bisphenol A type epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, 9,9-bis (4′-hydroxyphenyl) fluorene The diglycidyl etherified product is preferably bisphenol A type epoxy resin.

The acid having an ethylenically unsaturated bond is preferably an ethylenically unsaturated monocarboxylic acid, such as (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, and pentaerythritol tri (meth). Acrylate succinic anhydride adduct, pentaerythritol tri (meth) acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta (meth) acrylate succinic anhydride adduct, dipentaerythritol penta (meth) acrylate phthalic anhydride adduct, di Examples thereof include pentaerythritol penta (meth) acrylate tetrahydrophthalic anhydride adduct, reaction product of (meth) acrylic acid and ε-caprolactone, and the like. Among these, (meth) acrylic acid is preferable from the viewpoint of sensitivity.

Examples of the polybasic acid or its anhydride include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4 -Ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid , Benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, and anhydrides thereof. These may be used alone or in combination of two or more. Among these, from the viewpoint of introducing the partial structure represented by the general formula (1) into the resin, succinic anhydride, maleic anhydride and itaconic anhydride are preferable, and succinic anhydride is more preferable.

In addition, when adding a polybasic acid or its anhydride, the molecular weight of the (c1) epoxy (meth) acrylate resin can be increased by using a polyhydric alcohol, and branching can be introduced into the molecule. And tend to be able to balance viscosity. In addition, the rate of introduction of acid groups into the molecule can be increased, and there is a tendency that balance of sensitivity, adhesion, etc. is easily obtained.

Examples of the polyhydric alcohol include one or more polyhydric alcohols selected from trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. It is preferable that

(C1) The acid value of the epoxy (meth) acrylate resin is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, still more preferably 40 mgKOH / g or more, and even more preferably 60 mgKOH / g or more, 80 mgKOH / g or more is particularly preferred, 200 mgKOH / g or less is preferred, 180 mgKOH / g or less is more preferred, 150 mgKOH / g or less is more preferred, 120 mgKOH / g or less is even more preferred, and 100 mgKOH / g or less is particularly preferred. Residues are reduced and the taper angle tends to be increased by setting the amount to the lower limit value or more, and the outgas generation amount at the time of device light emission tends to be reduced by setting the upper limit value or less.

(C1) The weight average molecular weight (Mw) of the epoxy (meth) acrylate resin is not particularly limited, but is usually 1,000 or more, preferably 2,000 or more, more preferably 3,000 or more, and further preferably 4,000 or more. More preferably, it is 5,000 or more, particularly preferably 6,000 or more, most preferably 7,000 or more, and usually 30,000 or less, preferably 20,000 or less, more preferably 15,000 or less. More preferably, it is 10,000 or less. When the amount is not less than the lower limit, the amount of outgas generated during light emission tends to be reduced, and when the amount is not more than the upper limit, the residue tends to be reduced.

(C) The content ratio of the (c1) epoxy (meth) acrylate resin contained in the alkali-soluble resin is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, and further preferably 70% by mass or more, 80 mass% or more is still more preferable, 90 mass% or more is especially preferable, and it is 100 mass% or less normally. There exists a tendency for the outgas generation amount to reduce by setting it as the said lower limit or more.

(C1) The epoxy (meth) acrylate resin can be synthesized by a conventionally known method. Specifically, the epoxy resin is dissolved in an organic solvent, and in the presence of a catalyst and a thermal polymerization inhibitor, the acid or ester compound having an ethylenically unsaturated bond is added to cause addition reaction, and further a polybasic acid or its A method of continuing the reaction by adding an anhydride can be used.

Here, examples of the organic solvent used in the reaction include one or more organic solvents such as methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate.

Examples of the catalyst include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine, and tertiary amines such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride. One kind or two or more kinds of quaternary ammonium salts, phosphorus compounds such as triphenylphosphine, and stibins such as triphenylstibine are included.
Furthermore, examples of the thermal polymerization inhibitor include one or more of hydroquinone, hydroquinone monomethyl ether, methyl hydroquinone and the like.

The acid or ester compound having an ethylenically unsaturated bond is usually 0.7 to 1.3 chemical equivalents, preferably 0.9 to 1.1 chemical equivalents, relative to one chemical equivalent of the epoxy group of the epoxy resin. The amount can be. The temperature during the addition reaction is usually 60 to 150 ° C., preferably 80 to 120 ° C. Further, the polybasic acid or its anhydride is used in an amount of usually 0.1 to 1.2 chemical equivalents, preferably 0.2 to 1.1, based on 1 chemical equivalent of the hydroxyl group generated in the addition reaction. The amount can be a chemical equivalent.

(C1) The epoxy (meth) acrylate resin may include a partial structure other than the partial structure represented by the general formula (1), and from the viewpoint of reducing the amount of outgas generated during device light emission, the following formula: An epoxy (meth) acrylate resin containing a repeating unit structure represented by (i), an epoxy (meth) acrylate resin containing a partial structure represented by the following formula (ii), and a moiety represented by the following formula (iii) It is preferable to contain at least one selected from the group consisting of epoxy (meth) acrylate resins containing a structure.

(C1) The epoxy (meth) acrylate resin is an epoxy (meth) acrylate resin (c1-1) containing a repeating unit represented by the following formula (i) from the viewpoint of reducing the outgas generation amount at the time of device light emission. Is preferred. One reason is that it has a rigid main skeleton and is difficult to decompose against heat.

In formula (i), R ^a represents a hydrogen atom or a methyl group, and R ^b represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with an arbitrary substituent. * Represents a bond.

(R ^b )
In the formula (i), R ^b represents a divalent hydrocarbon group which may have a substituent.
Examples of the divalent hydrocarbon group include a divalent aliphatic group, a divalent aromatic ring group, a group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups. Can be mentioned.

Examples of the divalent aliphatic group include linear, branched, and cyclic groups. Among these, a linear one is preferable from the viewpoint of development solubility, and a cyclic one is preferable from the viewpoint of reducing penetration of the developer into the exposed portion. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, 20 or less, more preferably 15 or less, and even more preferably 10 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferable from the viewpoint of reducing residues.
Specific examples of the divalent branched aliphatic group include the above-mentioned divalent linear aliphatic group, a side chain of a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group. And a structure having a group, an iso-butyl group, a sec-butyl group, a tert-butyl group, and the like.
The number of rings of the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less. There exists a tendency for a remaining-film rate to improve by setting it as the said lower limit or more, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less. Specific examples of the divalent aliphatic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, a cyclododecane ring, and the like, by removing two hydrogen atoms. Group. Among these, a group obtained by removing two hydrogen atoms from the adamantane ring is preferable from the viewpoint of development adhesion.

Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; a carboxyl group and the like. Among these, unsubstituted is preferable from the viewpoint of ease of synthesis.

In addition, examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, 20 or less, more preferably 15 or less, and even more preferably 10 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, and an indole having two free valences. Ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, Examples include pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, sinoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolinone ring, and azulene ring. . Among these, from the viewpoint of photocurability, a benzene ring or naphthalene ring having two free valences is preferable, and a benzene ring having two free valences is more preferable.

Examples of the substituent that the divalent aromatic ring group may have include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among these, unsubstituted is preferable from the viewpoint of curability.

In addition, as a group in which one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked, one or more of the above divalent aliphatic groups and the above divalent aromatic group are used. And a group in which one or more cyclic groups are linked.
The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, usually 10 or less, preferably 5 or less, and more preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, usually 10 or less, preferably 5 or less, and more preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the group in which one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked include groups represented by the following formulas (iA) to (iE), etc. Is mentioned. Among these, a group represented by the following formula (iA) is preferable from the viewpoint of the rigidity of the skeleton and the hydrophobicity of the film.

As described above, the benzene ring in formula (i) may be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, either one or two or more.
Among these, unsubstituted is preferable from the viewpoint of curability.

The repeating unit structure represented by the formula (i) is preferably a repeating unit structure represented by the following formula (i-1) from the viewpoint of development solubility. The repeating unit structure represented by the formula (i-1) includes a partial structure represented by the general formula (1) in the formula.

In formula (i-1), R ^a and R ^b have the same meaning as in formula (i). R ¹ has the same meaning as that of the formula (1). * Represents a bond. The benzene ring in formula (i-1) may be further substituted with an arbitrary substituent.

The repeating unit structure represented by the formula (i-1) contained in one molecule of the epoxy (meth) acrylate resin (c1-1) may be one type or two or more types.

Further, the number of the repeating unit structure represented by the formula (i) contained in one molecule of the epoxy (meth) acrylate resin (c1-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more. 3 or more is more preferable, 10 or less is preferable, and 8 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Further, the number of the repeating unit structure represented by the formula (i-1) contained in one molecule of the epoxy (meth) acrylate resin (c1-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more. More preferably, 3 or more is more preferable, 10 or less is preferable, and 8 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the epoxy (meth) acrylate resin (c1-1) are given below.

On the other hand, the (c1) epoxy (meth) acrylate resin is an epoxy (meth) acrylate resin (c1-2) containing a partial structure represented by the following formula (ii) from the viewpoint of development adhesion. preferable.

In formula (ii), each R ^c independently represents a hydrogen atom or a methyl group. R ^d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * Represents a bond.

(R ^d )
In the formula (ii), R ^d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain.
Examples of the cyclic hydrocarbon group include an aliphatic ring group and an aromatic ring group.

The number of rings that the aliphatic ring group has is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, and a cyclododecane ring. Among these, an adamantane ring is preferable from the viewpoint of development adhesion.

On the other hand, the number of rings of the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less, preferably 4 or less. Is more preferable. When the amount is not less than the lower limit, the residue tends to be reduced, and when the amount is not more than the upper limit, the development adhesion tends to be improved.

Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 10 or more, particularly preferably 12 or more, and preferably 40 or less, preferably 30 or less. More preferably, it is more preferably 20 or less, and particularly preferably 15 or less. When the amount is not less than the lower limit, the residue tends to be reduced, and when the amount is not more than the upper limit, the development adhesion tends to be improved.

Specific examples of the aromatic ring in the aromatic ring group include benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, tetracene ring, pyrene ring, benzpyrene ring, chrysene ring, triphenylene ring, acenaphthene ring, fluoranthene ring, Examples include fluorene ring. Among these, a fluorene ring is preferable from the viewpoint of patterning characteristics.

Further, the divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited. For example, a divalent aliphatic group, a divalent aromatic ring group, one or more And a group in which one or more divalent aromatic ring groups are linked to each other.

Examples of the divalent aliphatic group include linear, branched, and cyclic groups. Among these, a linear one is preferable from the viewpoint of development solubility, and a cyclic one is preferable from the viewpoint of reducing penetration of the developer into the exposed portion. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, 25 or less, more preferably 20 or less, and even more preferably 15 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the divalent linear aliphatic group include a methylene group, an ethylene group, an n-propylene group, an n-butylene group, an n-hexylene group, and an n-heptylene group. Among these, a methylene group is preferable from the viewpoint of residues.
Specific examples of the divalent branched aliphatic group include the above-mentioned divalent linear aliphatic group, a side chain of a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group. And a structure having a group, an iso-butyl group, a sec-butyl group, a tert-butyl group, and the like.

The number of rings that the divalent cyclic aliphatic group has is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the divalent aliphatic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, a cyclododecane ring, and the like, by removing two hydrogen atoms. Group. Among these, a group obtained by removing two hydrogen atoms from the adamantane ring is preferable from the viewpoint of development adhesion.

In addition, examples of the divalent aromatic ring group include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, 30 or less, more preferably 20 or less, and even more preferably 15 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the group in which one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked include groups represented by the above formulas (iA) to (iE), etc. Is mentioned. Among these, from the viewpoint of reducing residues, the group represented by the formula (iC) is preferable.

The bonding mode of the cyclic hydrocarbon group which is a side chain with respect to these divalent hydrocarbon groups is not particularly limited. For example, one hydrogen atom of an aliphatic group or an aromatic ring group is substituted with the side chain. And a mode in which a cyclic hydrocarbon group which is a side chain including one of the carbon atoms of the aliphatic group is formed.

In addition, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-1) from the viewpoint of development adhesion.

In formula (ii-1), R ^c has the same meaning as in formula (ii). R ^α represents a monovalent cyclic hydrocarbon group which may have a substituent. n is an integer of 1 or more. The benzene ring in formula (ii-1) may be further substituted with an arbitrary substituent.

(R ^α )
In the formula (ii-1), R ^α represents a monovalent cyclic hydrocarbon group which may have a substituent.
Examples of the cyclic hydrocarbon group include an aliphatic ring group and an aromatic ring group.

The number of rings that the aliphatic ring group has is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 6 or less, preferably 4 or less, more preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

On the other hand, the number of rings of the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, 30 or less, more preferably 20 or less, and even more preferably 15 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the aromatic ring in the aromatic ring group include benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, fluorene ring and the like. Among these, a fluorene ring is preferable from the viewpoint of development adhesion.

Examples of the substituent that the cyclic hydrocarbon group may have include a hydroxy group, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, Examples thereof include alkyl groups having 1 to 5 carbon atoms such as amyl group and iso-amyl group; alkoxy groups having 1 to 5 carbon atoms such as methoxy group and ethoxy group; hydroxyl group; nitro group; cyano group; Among these, unsubstituted is preferable from the viewpoint of ease of synthesis.

N represents an integer of 1 or more, preferably 2 or more, and more preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Among these, R ^α is preferably a monovalent aliphatic ring group, and more preferably an adamantyl group, from the viewpoint of strong film curing degree and electrical characteristics.

As described above, the benzene ring in formula (ii-1) may be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, either one or two or more. Among these, unsubstituted is preferable from the viewpoint of curability.

Specific examples of the partial structure represented by the formula (ii-1) are given below.

The partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-2) from the viewpoint of development adhesion.

In formula (ii-2), R ^c has the same meaning as in formula (ii). ^Rβ represents a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (ii-2) may be further substituted with an arbitrary substituent.

(R ^β )
In the formula (ii-2), R ^β represents a divalent cyclic hydrocarbon group which may have a substituent.
Examples of the cyclic hydrocarbon group include an aliphatic ring group and an aromatic ring group.

The number of rings that the aliphatic ring group has is not particularly limited, but is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
Moreover, carbon number of an aliphatic cyclic group is 4 or more normally, 6 or more are preferable, 8 or more are more preferable, 40 or less are preferable, 35 or less are more preferable, and 30 or less are more preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
Specific examples of the aliphatic ring in the aliphatic ring group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, an adamantane ring, and a cyclododecane ring. Among these, an adamantane ring is preferable from the viewpoint of development adhesion.

On the other hand, the number of rings of the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. Further, the carbon number of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, further preferably 10 or more, more preferably 40 or less, more preferably 30 or less, and further preferably 20 or less. Preferably, 15 or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Examples of the substituent that the cyclic hydrocarbon group may have include a hydroxy group, a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, Examples thereof include alkyl groups having 1 to 5 carbon atoms such as amyl group and iso-amyl group; alkoxy groups having 1 to 5 carbon atoms such as methoxy group and ethoxy group; hydroxyl group; nitro group; cyano group; Among these, unsubstituted is preferable from the viewpoint of simplicity of synthesis.

Among these, from the viewpoint of curability, it is preferable that R ^beta is a divalent aliphatic cyclic group, and more preferably a divalent adamantane ring group.
On the other hand, from the viewpoint of developing adhesiveness, it is preferred that R ^beta is a divalent aromatic ring group, and more preferably a divalent fluorene ring group.

As described above, the benzene ring in formula (ii-2) may be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, either one or two or more. Among these, unsubstituted is preferable from the viewpoint of curability.

Specific examples of the partial structure represented by the formula (ii-2) are given below.

On the other hand, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-3) from the viewpoint of curability. The partial structure represented by the formula (ii-3) includes the partial structure represented by the general formula (1) in the formula.

In formula (ii-3), R ^c and R ^d have the same meaning as in formula (ii). R ¹ has the same meaning as the formula (1).

The partial structure represented by the formula (ii-3) contained in one molecule of the epoxy (meth) acrylate resin (c1-2) may be one type or two or more types.

The number of partial structures represented by the formula (ii) contained in one molecule of the epoxy (meth) acrylate resin (c1-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, Moreover, 20 or less is preferable, 15 or less is more preferable, and 10 or less is further more preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

On the other hand, the (c1) epoxy (meth) acrylate resin is an epoxy (meth) acrylate resin (c1-3) containing a partial structure represented by the following formula (iii) from the viewpoint of reducing the outgas amount during device emission. ) Is preferable.

In formula (iii), R ^e represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent which may have a substituent. Represents a cyclic hydrocarbon group. The benzene ring in formula (iii) may be further substituted with an arbitrary substituent. * Represents a bond.

(Γ)
In the formula (iii), γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent.

The alkylene group may be linear or branched, but is preferably linear from the viewpoint of development solubility and is preferably branched from the viewpoint of development adhesion. Although the carbon number is not particularly limited, it is usually 1 or more, preferably 2 or more, and usually 6 or less, preferably 4 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group, and a heptylene group, and an ethylene group or a propylene group is preferable from the viewpoint of compatibility between development adhesion and development solubility. A propylene group is more preferable.

Examples of the substituent that the alkylene group may have include an alkoxy group having 1 to 5 carbon atoms such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxyl group. Among these, unsubstituted is preferable from the viewpoint of ease of synthesis.

Examples of the divalent cyclic hydrocarbon group include a divalent aliphatic ring group and a divalent aromatic ring group.

On the other hand, the number of rings of the aromatic ring group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. Further, the carbon number of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, further preferably 10 or more, more preferably 40 or less, more preferably 30 or less, and further preferably 20 or less. Preferably, 15 or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.
Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferable from the viewpoint of development adhesion.

Of these, from the viewpoint of reducing residues, γ is preferably an alkylene group which may have a substituent, and more preferably a dimethylmethylene group.

As described above, the benzene ring in formula (iii) may be further substituted with an arbitrary substituent. Examples of the substituent include a hydroxy group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, either one or two or more. Among these, unsubstituted is preferable from the viewpoint of curability.

On the other hand, the partial structure represented by the formula (iii) is preferably a partial structure represented by the following formula (iii-1) from the viewpoint of development solubility. The partial structure represented by the formula (iii-1) includes the partial structure represented by the general formula (1) in the formula.

In formula (iii-1), R ^e and γ have the same meaning as in formula (iii). R ¹ has the same meaning as that of the formula (1). * Represents a bond. The benzene ring in formula (iii-1) may be further substituted with an arbitrary substituent.

Further, the number of the repeating unit structure represented by the formula (iii) contained in one molecule of the epoxy (meth) acrylate resin (c1-3) is not particularly limited, but is preferably 1 or more, more preferably 5 or more. 10 or more is more preferable, 18 or less is preferable, and 15 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

In addition, the number of the repeating unit structure represented by the formula (iii-1) contained in one molecule of the epoxy (meth) acrylate resin (c1-3) is not particularly limited, but is preferably 1 or more, and more preferably 3 or more. More preferably, 5 or more is more preferable, 18 or less is preferable, and 15 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the epoxy (meth) acrylate resin (c1-3) are given below.

[(C2) Acrylic copolymer resin]
Next, (c2) the acrylic copolymer resin will be described in detail. (C2) The acrylic copolymer resin is not particularly limited as long as it has a partial structure represented by the general formula (1), but from the viewpoint of curability, it has an ethylenically unsaturated group in the side chain. Preferably there is.

(C2) Although the partial structure containing the side chain which has an ethylenically unsaturated group contained in acrylic copolymer resin is not specifically limited, From a viewpoint of development solubility, for example, the part represented by the following general formula (I) A structure is preferred.

In formula (I), R ^A represents a hydrogen atom or a methyl group. R ^B represents an alkenyl group which may have a substituent or a group represented by the following general formula (II). * Represents a bond.

In formula (II), R ^C represents an alkenyl group which may have a substituent. α represents an alkylene group which may have a substituent, an arylene group which may have a substituent, or an alkenylene group which may have a substituent. * Represents a bond to the carbonyl carbon.

(R ^B )
In the formula (I), R ^B represents an alkenyl group which may have a substituent or a group represented by the general formula (II).

Examples of the alkenyl group for R ^B include a linear, branched or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, preferably 20 or less, more preferably 16 or less, further preferably 12 or less, and still more preferably 8 or less. , Particularly preferably 6 or less, and most preferably 4 or less. There exists a tendency for image development adhesiveness to improve by setting it as the said lower limit or more, and there exists a tendency for sclerosis | hardenability to improve by setting it as the said upper limit or less.

Specific examples of the alkenyl group include ethenyl group, propenyl group, butyenyl group, cyclohexenyl group and the like. Among these, from the viewpoint of curability, an ethenyl group or a propenyl group is preferable, and an ethenyl group is more preferable.

Examples of the substituent that the alkenyl group may have include an alkyl group, an alkenyl group, an alkynyl group, a hydroxy group, a carboxyl group, a chloro group, a bromo group, a fluoro group, an alkoxy group, a hydroxyalkyl group, a thiol group, A sulfone group etc. are mentioned. Among these, from the viewpoint of developability, an alkyl group or an alkenyl group is preferable, and an alkyl group is more preferable. When it has two or more substituents, the substituents may be linked to form a ring.

The R ^B, in view of curability and developability Among these, preferred are ethenyl group or a propenyl group, and more preferably an ethenyl group.

( ^RC )
In the formula (II), R ^C represents an alkenyl group which may have a substituent.

Examples of the alkenyl group for R ^C include linear, branched or cyclic alkenyl groups. The number of carbon atoms is preferably 2 or more, preferably 20 or less, more preferably 16 or less, further preferably 12 or less, and still more preferably 8 or less. , Particularly preferably 6 or less, and most preferably 4 or less. There exists a tendency for image development adhesiveness to improve by setting it as the said lower limit or more, and there exists a tendency for sclerosis | hardenability to improve by setting it as the said upper limit or less.

Thus, R ^C represents an alkenyl group which may have a substituent, and among these, from the viewpoint of developability, it is preferably an ethenyl group or a propenyl group, and more preferably an ethenyl group. .

(Α)
In the formula (II), α represents an alkylene group which may have a substituent, an arylene group which may have a substituent, or an alkenylene group which may have a substituent.

Examples of the alkylene group for α include a linear, branched, or cyclic alkylene group. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, and preferably 22 or less, more preferably 20 or less, and even more preferably 18 or less, It is more preferably 16 or less, particularly preferably 14 or less, and most preferably 12 or less. There exists a tendency for adhesiveness to improve by setting it as the said lower limit or more, and there exists a tendency for sclerosis | hardenability to improve by setting it as the said upper limit or less.

Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a cyclohexylene group, a methylcyclohexylene group, a bicyclo [2.2.1] heptane group, and a methylbicyclo [2.2.1] heptane group. Can be mentioned. Among these, from the viewpoint of curability, an ethylene group, a cyclohexylene group or a methylcyclohexylene group is preferable, and an ethylene group is more preferable.

Examples of the substituent that the alkylene group may have include an alkenyl group, an alkynyl group, a hydroxy group, a carboxyl group, a chloro group, a bromo group, a fluoro group, an alkoxy group, a hydroxyalkyl group, a thiol group, and a sulfide group. Is mentioned. Of these, alkenyl is preferred from the viewpoint of development adhesion. Moreover, when it has two or more substituents, substituents may connect and may form the ring.

In addition, examples of the arylene group for α include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is preferably 6 or more, preferably 24 or less, more preferably 22 or less, further preferably 20 or less, and still more preferably 18 or less, It is particularly preferably 16 or less, and most preferably 14 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a single ring or a condensed ring, such as a benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, tetracene ring, pyrene. A ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, a fluorene ring, and the like.

The aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. For example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, Imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzoisoxazole ring, benzoisothiazole Ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, sinoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolino Ring, azulene ring, and the like. Among these, from the viewpoint of developability, a benzene ring or a naphthalene ring is preferable, and a benzene ring is more preferable.

Examples of the substituent that the arylene group may have include an alkyl group, an alkenyl group, an alkynyl group, a hydroxy group, a carboxyl group, a chloro group, a bromo group, a fluoro group, an alkoxy group, a hydroxyalkyl group, a thiol group, A sulfone group etc. are mentioned. Among these, from the viewpoint of developability, a hydroxy group or a carboxyl group is preferable, and a carboxyl group is more preferable. Moreover, when it has two or more substituents, substituents may connect and may form the ring.

Specific examples of the arylene group having a substituent include a carboxylbenzene ring group.

In addition, examples of the alkenylene group in α include a linear, branched, or cyclic alkenylene group. The number of carbon atoms is preferably 2 or more, preferably 22 or less, more preferably 20 or less, further preferably 18 or less, and still more preferably 16 or less. Of 14 or less, and most preferably 12 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkenylene group include an ethenylene group, a propenylene group, a cyclohexenylene group, a methylethenylene group, and the like. Among these, from the viewpoint of developability, an ethenylene group and a cyclohexenylene group are preferable, and an ethenylene group is more preferable.

Examples of the substituent that the alkenylene group may have include an alkyl group, an alkenyl group, an alkynyl group, a hydroxy group, a carboxyl group, a chloro group, a bromo group, a fluoro group, an alkoxy group, a hydroxyalkyl group, a thiol group, Examples thereof include a sulfide group. Among these, from the viewpoint of developability, an alkyl group or an alkenyl group is preferable, and an alkyl group is more preferable. Moreover, when it has two or more substituents, substituents may connect and may form the ring.

As described above, α represents an alkylene group which may have a substituent, an arylene group which may have a substituent, or an alkenylene group which may have a substituent. From the viewpoint of properties, an alkylene group or an alkenylene group is preferable, and an alkylene group is more preferable.

The repeating unit structure represented by the formula (I) is preferably a repeating unit structure represented by the following formula (I-1) from the viewpoint of developability. The repeating unit structure represented by the formula (I-1) includes a partial structure represented by the general formula (1) in the formula.

In formula (I-1), R ^A and R ^B have the same meanings as in formula (I). R ¹ has the same meaning as that of the formula (1).

The repeating unit structure represented by the formula (I) is preferably a repeating unit structure represented by the following formula (I-2) from the viewpoint of sensitivity.

In formula (I-2), R ^A and R ^B have the same meanings as in formula (I).

(C2) The content ratio of the partial structure represented by the general formula (I) contained in the acrylic copolymer resin is not particularly limited, but is preferably 5 mol% or more, more preferably 20 mol% or more, and 30 mol% or more. Is more preferably 50 mol% or more, particularly preferably 70 mol% or more, most preferably 80 mol% or more, more preferably 99 mol% or less, more preferably 97 mol% or less, and 95 mol% or less. Is more preferable. When the amount is not less than the lower limit, the residue tends to be reduced, and when the amount is not more than the upper limit, the development adhesion tends to be improved.

(C2) The content of the partial structure represented by the general formula (I-1) contained in the acrylic copolymer resin is not particularly limited, but is preferably 1 mol% or more, more preferably 5 mol% or more, and 10 mol % Or more is more preferable, 15 mol% or more is further more preferable, 20 mol% or more is particularly preferable, 99 mol% or less is preferable, 60 mol% or less is more preferable, 40 mol% or less is further preferable, and 30 mol% is more preferable. % Or less is particularly preferable. When the amount is not less than the lower limit, the sensitivity tends to increase and the residue tends to be reduced. When the amount is not more than the upper limit, the development adhesion tends to be improved.

(C2) The content of the partial structure represented by the general formula (I-2) contained in the acrylic copolymer resin is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, and 20 mol % Or more is more preferable, 30 mol% or more is more preferable, 40 mol% or more is particularly preferable, 50 mol% or more is most preferable, 99 mol% or less is preferable, 90 mol% or less is more preferable, and 80 mol% is more preferable. % Or less is more preferable, and 70 mol% or less is particularly preferable. The sensitivity tends to be increased by setting it to the lower limit value or more, and the developability tends to be improved by setting the upper limit value or less.

(Partial structure represented by general formula (I ′))
(C2) When the acrylic copolymer resin includes a partial structure represented by the general formula (I), the other partial structures included are not particularly limited. From the viewpoint of development adhesion, for example, the following general formula (I It is preferable that the partial structure represented by ') is included.

In the above formula (I ′), R ^D represents a hydrogen atom or a methyl group, and R ^E represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or a substituent. An alkenyl group that may be present.

(R ^E )
In the formula (I ′), R ^E represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or an alkenyl group which may have a substituent.

^Examples of the alkyl group in R ^E include a linear, branched or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, still more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, It is more preferably 16 or less, still more preferably 14 or less, and particularly preferably 12 or less. By setting it as the said lower limit or more, film | membrane intensity | strength becomes high and there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoint of film strength, a dicyclopentanyl group or a dodecanyl group is preferable, and a dicyclopentanyl group is more preferable.
The substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , An acryloyl group, a methacryloyl group, and the like. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.

Examples of the aryl group in R ^E include a monovalent aromatic hydrocarbon ring group and a monovalent aromatic heterocyclic group. The number of carbon atoms is preferably 6 or more, preferably 24 or less, more preferably 22 or less, still more preferably 20 or less, and particularly preferably 18 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

The aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. For example, a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, Imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzoisoxazole ring, benzoisothiazole Ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, sinoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolino Ring, azulene ring, and the like. Among these, from the viewpoint of curability, a benzene ring or a naphthalene ring is preferable, and a benzene ring is more preferable.

The substituents that the aryl group may have include methyl group, ethyl group, propyl group, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligo group, Examples thereof include an ethylene glycol group, a phenyl group, and a carboxyl group, and a hydroxy group and an oligoethylene glycol group are preferable from the viewpoint of developability.

^Examples of the alkenyl group for R ^E include linear, branched, or cyclic alkenyl groups. The number of carbon atoms is preferably 2 or more, preferably 22 or less, more preferably 20 or less, further preferably 18 or less, and still more preferably 16 or less. 14 or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Examples of the substituent that the alkenyl group may have include methyl group, ethyl group, propyl group, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligo group Examples thereof include an ethylene glycol group, a phenyl group, and a carboxyl group, and a hydroxy group and an oligoethylene glycol group are preferable from the viewpoint of developability.

Thus, R ^E represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or an alkenyl group which may have a substituent. Among these, From the viewpoint of developability, an alkyl group or alkenyl is preferable, and an alkyl group is more preferable.

(C2) The content ratio of the partial structure represented by the general formula (I ′) contained in the acrylic copolymer resin is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, and 1 0.5 mol% or more is more preferable, 2 mol% or more is particularly preferable, 90 mol% or less is preferable, 70 mol% or less is more preferable, 50% mol or less is more preferable, and 30 mol% or less is more preferable. 10 mol% or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

(Partial structure represented by general formula (I ''))
(C2) When the acrylic copolymer resin includes the partial structure represented by the general formula (I), the partial structure included in the other is represented by the following general formula (I ″) from the viewpoint of heat resistance and film strength. It is preferable that the partial structure represented is included.

In the above formula (I ″), R ^F represents a hydrogen atom or a methyl group, R ^G represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxy group, A carboxyl group, a halogen atom, an optionally substituted alkoxy group, a thiol group, or an optionally substituted alkyl sulfide group is represented. t represents an integer of 0 to 5.

(R ^G )
In the formula (I ″), ^RG has an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxy group, a carboxyl group, a halogen atom, and a substituent. Represents an optionally substituted alkoxy group, thiol group, or optionally substituted alkyl sulfide group.

^Examples of the alkyl group in R ^G include a linear, branched or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, still more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, It is more preferably 16 or less, still more preferably 14 or less, and particularly preferably 12 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoint of development adhesion, a dicyclopentanyl group or a dodecanyl group is preferable, and a dicyclopentanyl group is more preferable.
The substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , An acryloyl group, a methacryloyl group, and the like. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.

^Examples of the alkenyl group in R ^G include a linear, branched or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, preferably 22 or less, more preferably 20 or less, further preferably 18 or less, and still more preferably 16 or less. 14 or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkenyl group include ethenyl group, propenyl group, butyryl group, cyclohexenyl group and the like. Among these, from the viewpoint of curability, an ethenyl group or a propenyl group is preferable, and an ethenyl group is more preferable.
Examples of the substituent that the alkenyl group may have include methyl group, ethyl group, propyl group, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligo group Examples thereof include an ethylene glycol group, a phenyl group, and a carboxyl group, and a hydroxy group and an oligoethylene glycol group are preferable from the viewpoint of developability.

Examples of the halogen atom in ^RG include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and among these, a fluorine atom is preferable from the viewpoint of liquid repellency.

^Examples of the alkoxy group in R ^G include a linear, branched or cyclic alkoxy group. The number of carbon atoms is preferably 1 or more, preferably 20 or less, more preferably 18 or less, further preferably 16 or less, and still more preferably 14 or less. , 12 or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

In addition, as the substituent that the alkoxy group may have, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , An acryloyl group, a methacryloyl group, and the like. From the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.

Examples of the alkyl sulfide group in ^RG include a linear, branched or cyclic alkyl sulfide group. The number of carbon atoms is preferably 1 or more, preferably 20 or less, more preferably 18 or less, further preferably 16 or less, and still more preferably 14 or less. , 12 or less is particularly preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

Specific examples of the alkyl sulfide group include a methyl sulfide group, an ethyl sulfide group, a propyl sulfide group, and a butyl sulfide group. Among these, a methyl sulfide group or an ethyl sulfide group is preferable from the viewpoint of developability.

In addition, as the substituent that the alkyl group in the alkyl sulfide group may have, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl Group, carboxyl group, acryloyl group, methacryloyl group and the like, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferable.

Thus, ^RG is an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxy group, a carboxyl group, a halogen atom, an alkoxy group, a hydroxyalkyl group, a thiol group, Alternatively, an alkyl sulfide group which may have a substituent is represented, and among these, from the viewpoint of developability, a hydroxy group or a carboxyl group is preferable, and a carboxyl group is more preferable.

(T)
In the formula (I ″), t represents an integer of 0 to 5. From the viewpoint of developability, t is preferably 2 or less, more preferably 1 or less, and even more preferably 0.

(C2) The content ratio of the partial structure represented by the general formula (I '') contained in the acrylic copolymer resin is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, and 3 mol % Or more is more preferable, 5 mol% or more is particularly preferable, 90 mol% or less is preferable, 70 mol% or less is more preferable, 50 mol% or less is further preferable, 30 mol% or less is more preferable, 20 mol % Or less is particularly preferable, and 10 mol% or less is most preferable. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

(Partial structure represented by general formula (I ′ ″))
(C2) When the acrylic copolymer resin includes the partial structure represented by the general formula (I), the other partial structure is represented by the following general formula (I ′ ″) from the viewpoint of developability. The partial structure is preferred.

In the above formula (I ′ ″), R ^H represents a hydrogen atom or a methyl group.

(C2) The content of the partial structure represented by the general formula (I ′ ″) contained in the acrylic copolymer resin is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, 30 More preferably, it is 90 mol% or less, more preferably 80 mol% or less, still more preferably 70 mol% or less, and particularly preferably 50 mol% or less. When the amount is not less than the lower limit, the residue tends to be reduced, and when the amount is not more than the upper limit, the development adhesion tends to be improved. On the other hand, from the viewpoint of reducing the outgas generation amount, 0 mol%, that is, it is preferable not to include the partial structure represented by the general formula (I ′ ″).

(C2) The acid value of the acrylic copolymer resin is not particularly limited, but is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, still more preferably 30 mgKOH / g or more, still more preferably 40 mgKOH / g or more, and 50 mgKOH / g g or more is particularly preferred, 100 mgKOH / g or less is preferred, 90 mgKOH / g or less is more preferred, 70 mgKOH / g or less is more preferred, and 60 mgKOH / g or less is even more preferred. When the amount is not less than the lower limit, the residue tends to be reduced, and when the amount is not more than the upper limit, the development adhesion tends to be improved.

(C2) The weight average molecular weight (Mw) of the acrylic copolymer resin is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, further preferably 3,000 or more, and still more preferably 4,000. As described above, it is particularly preferably 5,000 or more, and usually 30,000 or less, preferably 20,000 or less, more preferably 15,000 or less, and still more preferably 10,000 or less. Especially preferably, it is 7,000 or less. By setting it as the said lower limit or more, there exists a tendency for image development adhesiveness to improve, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

(C) The content ratio of (c2) acrylic copolymer resin contained in the alkali-soluble resin is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, and more preferably 15% by mass or more from the viewpoint of developability. Is more preferable, 20 mass% or more is particularly preferable, 100 mass% or less is preferable, 80 mass% or less is more preferable, and 50 mass% or less is more preferable. When it is at least the lower limit, the development solubility tends to be good, and when it is at most the upper limit, the taper angle tends to be large.

(C) The alkali-soluble resin may contain either (c1) an epoxy (meth) acrylate resin or (c2) an acrylic copolymer resin, or both of them. Furthermore, resins other than (c1) and (c2) may be included. For example, (C) the alkali-soluble resin itself may be provided with liquid repellency by including an alkali-soluble resin having a fluorine atom-containing functional group.

The content ratio of the (C) alkali-soluble resin in the photosensitive resin composition of the present invention according to the first aspect is usually 5% by mass or more, preferably 10% by mass or more, more preferably based on the total solid content. 20% by mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50% by mass. It is as follows. When the amount is not less than the lower limit, the developability tends to be improved, and when the amount is not more than the upper limit, the amount of outgas generated during light emission of the element tends to be reduced.

The content ratio of (A) ethylenically unsaturated compound and (C) alkali-soluble resin in the total solid content is usually 5% by mass or more, preferably 10% by mass or more, more preferably, based on the total solid content. 30% by mass or more, more preferably 50% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 85% by mass or more, and usually 99% by mass or less. Preferably it is 97 mass% or less, More preferably, it is 95 mass% or less. When the amount is not less than the lower limit, the curability tends to be improved, and when the amount is not more than the upper limit, the amount of outgas generated during light emission of the element tends to be reduced.

The blending ratio of (C) alkali-soluble resin to (A) ethylenically unsaturated compound in the photosensitive resin composition is (C) alkali-soluble with respect to 100 parts by mass of (A) ethylenically unsaturated compound. 50 parts by mass or more of the resin is preferable, 60 parts by mass or more is more preferable, 70 parts by mass or more is further preferable, 80 parts by mass or more is particularly preferable, 400 parts by mass or less is preferable, 300 parts by mass or less is more preferable, 200 The amount is more preferably equal to or less than mass parts, and particularly preferably equal to or less than 100 mass parts. There exists a tendency for image development adhesiveness to improve by setting it as the said lower limit or more, and there exists a tendency for sclerosis | hardenability to improve by setting it as the said upper limit or less.

On the other hand, (C-1) a carboxyl group-containing (co) polymer suitably used as (C) an alkali-soluble resin in the photosensitive resin composition for forming an organic electroluminescent element partition according to the second aspect of the present invention (C-2) A carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, and (C-3) a carboxyl group-containing and ethylenically unsaturated group-containing resin will be described in detail.

[1-1-4-a] (C-1) Carboxyl group-containing (co) polymer [1-1-4-a-1] Carboxyl group-containing (co) polymer (1)
Specific examples of carboxyl group-containing (co) polymers include, for example, (meth) acrylic acid, crotonic acid, isocrotonic acid, maleic acid, maleic anhydride, itaconic acid, citraconic acid and the like. Saturated carboxylic acids and styrenes such as styrene, α-methylstyrene, hydroxystyrene, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (Meth) acrylate, dodecyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, isobornyl (meth) acrylate, hydroxymethyl (meth) acrylate, hydroxyethyl (Meth) acrylates such as (meth) acrylate, glycidyl (meth) acrylate, benzyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N- (meth) acryloylmorpholine, (meth) acrylonitrile (Meth) acrylonitriles such as (meth) acrylamide, (meth) acrylamide, N-methylol (meth) acrylamide, N, N-dimethyl (meth) acrylamide, (meth) acrylamides such as N, N-dimethylaminoethyl (meth) acrylamide, Examples thereof include copolymers with vinyl compounds such as vinyl acetate.

Of these, (meth) acrylate- (meth) acrylic acid copolymer and styrene- (meth) acrylate- (meth) acrylic acid copolymer are preferable from the viewpoint of sensitivity. In the (meth) acrylate- (meth) acrylic acid copolymer, a copolymer comprising 5 to 80 mol% of (meth) acrylate and 20 to 95 mol% of (meth) acrylic acid is more preferable. A copolymer comprising 10 to 70 mol% of (meth) acrylate and 30 to 90 mol% of (meth) acrylic acid is particularly preferred. In the styrene- (meth) acrylate- (meth) acrylic acid copolymer, a copolymer comprising 3 to 60 mol% of styrene, 10 to 70 mol% of (meth) acrylate, and 10 to 60 mol% of (meth) acrylic acid. A polymer is more preferred, and a copolymer comprising 5 to 50 mol% styrene, 20 to 60 mol% (meth) acrylate, and 15 to 55 mol% (meth) acrylic acid is particularly preferred.

[1-1-4-a-2] Carboxyl group-containing (co) polymer (2)
Moreover, it replaces with the said unsaturated carboxylic acid, the compound which added the polybasic acid (anhydride) to hydroxyalkyl (meth) acrylate, the said styrene, (meth) acrylic acid ester, (meth) acrylonitrile. And copolymers with (meth) acrylamides, vinyl compounds and the like.

Examples of the hydroxyalkyl (meth) acrylate include hydroxymethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxybutyl (meth) acrylate, and the like, and polybasic acid (anhydride) includes succinic acid ( Anhydride), adipic acid (anhydride), phthalic acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), maleic acid (anhydride), etc. As succinic acid [2- (meth) acryloylethyl] ester, adipic acid [2- (meth) acryloylethyl] ester, phthalic acid [2- (meth) acryloylethyl] ester, hexahydrophthalic acid [2- ( (Meth) acryloylethyl] ester, maleic acid [2- (meth) acryloylethyl] Stealth, succinic acid [2- (meth) acryloylpropyl] ester, adipic acid [2- (meth) acryloylpropyl] ester, phthalic acid [2- (meth) acryloylpropyl] ester, hexahydrophthalic acid [2- (meta ) Acryloylpropyl] ester, maleic acid [2- (meth) acryloylpropyl] ester, succinic acid [2- (meth) acryloylbutyl] ester, adipic acid [2- (meth) acryloylbutyl] ester, phthalic acid [2- (Meth) acryloylbutyl] ester, hexahydrophthalic acid [2- (meth) acryloylbutyl] ester, maleic acid [2- (meth) acryloylbutyl] ester and the like.

These carboxyl group-containing (co) polymers preferably have an acid value of 50 to 500 mgKOH / g from the viewpoint of development solubility, and have a weight average molecular weight (Mw) in terms of polystyrene from the viewpoint of development solubility. It is preferably 1,000 to 300,000.

[1-1-4-b] (C-2) Carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain [1-1-4-b-1] unsaturated carboxylic acid and two kinds Copolymers with the above compounds having an ethylenically unsaturated group As carboxyl group-containing (co) polymers having an ethylenically unsaturated group in the side chain, for example, allyl (meth) acrylate, 3-allyloxy-2-hydroxy A compound having two or more ethylenically unsaturated groups such as propyl (meth) acrylate, cinnamyl (meth) acrylate, crotonyl (meth) acrylate, methallyl (meth) acrylate, N, N-diallyl (meth) acrylamide, or Vinyl (meth) acrylate, 1-chlorovinyl (meth) acrylate, 2-phenylvinyl (meth) acrylate, 1-propenyl (meta ) A compound having two or more ethylenically unsaturated groups such as acrylate, vinyl crotonate, and vinyl (meth) acrylamide, and an unsaturated carboxylic acid such as (meth) acrylic acid, or an unsaturated carboxylic acid ester Examples thereof include a copolymer obtained by copolymerizing such that the ratio of the former compound having an ethylenically unsaturated group to the whole is 10 to 90 mol%, preferably about 30 to 80 mol%.

The acid value of the copolymer of the unsaturated carboxylic acid and the compound having two or more types of ethylenically unsaturated groups is preferably 30 to 250 mgKOH / g from the viewpoint of development solubility, and has a weight average molecular weight. (Mw) is preferably 1,000 to 300,000 from the viewpoint of development solubility.

[1-1-4-b-2] Epoxy group-containing unsaturated compound-modified carboxyl group-containing (co) polymer Further, as a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, for example, Modification by reacting a carboxyl group-containing (co) polymer with an epoxy group-containing unsaturated compound and adding an epoxy group of the epoxy group-containing unsaturated compound to a part of the carboxyl group of the carboxyl group-containing (co) polymer. Modified carboxyl group-containing (co) polymers.

As the carboxyl group-containing (co) polymer, from the viewpoint of sensitivity, the above-mentioned carboxyl group-containing (co) polymer (meth) acrylate- (meth) acrylic acid copolymer and styrene- (meth) acrylate are used. -(Meth) acrylic acid copolymers are preferred.

The epoxy group-containing unsaturated compounds include allyl glycidyl ether, glycidyl (meth) acrylate, α-ethyl glycidyl (meth) acrylate, glycidyl crotonate, glycidyl isocrotonate, crotonyl glycidyl ether, monoalkyl itaconic acid Aliphatic epoxy group-containing unsaturated compounds such as glycidyl esters, monoalkyl monoglycidyl esters of fumaric acid, and maleic acid alkyl monoglycidyl esters, and 3,4-epoxycyclohexylmethyl (meth) acrylate, 2,3-epoxycyclopentylmethyl And alicyclic epoxy group-containing unsaturated compounds such as (meth) acrylate and 7,8-epoxy [tricyclo [5.2.1.0] dec-2-yl] oxyethyl (meth) acrylate.

Then, these epoxy group-containing unsaturated compounds can be obtained by reacting 5 to 90 mol%, preferably about 30 to 70 mol%, of the carboxyl group of the carboxyl group-containing (co) polymer. In addition, reaction can be implemented by a well-known method.

The acid value of the epoxy group-containing unsaturated compound-modified carboxyl group-containing (co) polymer is preferably 30 to 250 mgKOH / g from the viewpoint of developability, and from the viewpoint of developability, the weight average molecular weight (Mw ) Is preferably 1,000 to 300,000.

[1-1-4-b-3] Unsaturated carboxylic acid-modified epoxy group and carboxyl group-containing (co) polymer Further, as a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, for example, , Unsaturated carboxylic acid such as (meth) acrylic acid, the above-mentioned aliphatic epoxy group-containing unsaturated compound or alicyclic epoxy group-containing unsaturated compound, or unsaturated carboxylic acid ester or styrene, etc. The copolymer obtained by copolymerizing the carboxyl group-containing unsaturated compound to a proportion of 10 to 90 mol%, preferably about 30 to 80 mol%, is added to the copolymer such as (meth) acrylic acid. Modified epoxy group and carboxyl group-containing (co) polymer modified by reacting saturated carboxylic acid and adding carboxyl group of unsaturated carboxylic acid to epoxy group of the copolymer The body is mentioned.

The acid value of the unsaturated carboxylic acid-modified epoxy group and carboxyl group-containing (co) polymer is preferably 30 to 250 mg KOH / g from the viewpoint of developability, and from the viewpoint of developability, the weight average molecular weight ( Mw) is preferably 1,000 to 300,000.

[1-1-4-b-4] Acid-modified epoxy group-containing (co) polymer In addition, as a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, an epoxy group-containing (meth) acrylate And an ethylenically unsaturated compound, an ethylenically unsaturated monocarboxylic acid is added to at least a part of the epoxy group of the copolymer, and at least a part of the hydroxyl groups generated by the addition are added. Examples include acid-modified epoxy group-containing (co) polymers obtained by adding a basic acid (anhydride).

Specifically, a copolymer of 5 to 99 mol% of an epoxy group-containing (meth) acrylate such as glycidyl (meth) acrylate and usually 2 to 95 mol% of an ethylenically unsaturated compound such as (meth) acrylic acid ester. Is added to ethylenically unsaturated monocarboxylic acid to usually 10 to 100 mol% of the epoxy group contained in the copolymer, and polybasic acid is usually added to 10 to 100 mol% of the hydroxyl group formed upon addition. An acid-modified epoxy group-containing (co) polymer obtained by adding (anhydride) is exemplified.

Here, the copolymerization ratio of the epoxy group-containing (meth) acrylate in the copolymer is not particularly limited, but is usually 5 mol% or more, preferably 20 mol% or more, more preferably 40 mol% or more, and still more preferably 60 mol%. It is at least mol%, more preferably at least 80 mol%, particularly preferably at least 90 mol%, and usually at most 99 mol%, preferably at most 98 mol%, more preferably at most 95 mol%. When the amount is not less than the lower limit value, the sensitivity tends to be high, and when the value is not more than the upper limit value, there is a tendency that appropriate development solubility is obtained.

On the other hand, the copolymerization ratio of the ethylenically unsaturated compound in the copolymer is not particularly limited, but is usually 1 mol% or more, preferably 3 mol% or more, more preferably 5 mol% or more, and usually 90 mol% or less. , Preferably 70 mol% or less, more preferably 50 mol% or less, still more preferably 30 mol% or less, and particularly preferably 10 mol% or less. When the amount is not less than the lower limit value, the sensitivity tends to be high, and when the value is not more than the upper limit value, there is a tendency that appropriate development solubility is obtained.

Examples of the epoxy group-containing (meth) acrylate include aliphatic epoxy group-containing (meth) acrylates such as glycidyl (meth) acrylate and α-ethylglycidyl (meth) acrylate; 3,4-epoxycyclohexylmethyl (meth) acrylate, 2, Alicyclic epoxy group-containing (meth) acrylates such as 3-epoxycyclopentylmethyl (meth) acrylate and 7,8-epoxy [tricyclo [5.2.1.0] dec-2-yl] oxyethyl (meth) acrylate Can be mentioned.

Here, as the ethylenically unsaturated compound, it is preferable to use, for example, one or more of mono (meth) acrylates having a partial structure represented by the following formula (α).

In formula (α), R ^1d to R ^4d each independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R ^5d and R ^6d each independently represent a hydrogen atom or 1 to 10 carbon atoms. Represents an alkyl group. R ^5d and R ^6d may be linked to form a ring. The ring formed by linking R ^5d and R ^6d is preferably an aliphatic ring, which may be either saturated or unsaturated, and the ring preferably has 5 to 6 carbon atoms.

The carbon number of the alkyl group in R ^1d to R ^4d is preferably 8 or less, more preferably 5 or less. There exists a tendency for it to become suitable image development solubility by setting it as the said upper limit or less.
Among these, from the viewpoint of solubility, R ^1d to R ^4d are preferably hydrogen atoms.

The carbon number of the alkyl group in R ^5d and R ^6d is preferably 8 or less, more preferably 5 or less. There exists a tendency which shows appropriate solubility by setting it as the said lower limit or more, and there exists a tendency for hydrophilicity to be hold | maintained by setting it as the said upper limit or less.
Among these, from the viewpoint of development solubility, R ^5d and R ^6d are preferably hydrogen atoms, or R ^5d and R ^6d are connected to form an aliphatic ring having 5 to 6 carbon atoms. .

Among the above formula (α), mono (meth) acrylates having a structure represented by the following formula (α-a), (α-b), or (α-c) are preferable. By introducing these partial structures, it is possible to increase the heat resistance and strength of mono (meth) acrylate. In addition, 1 type may be used for these mono (meth) acrylates and it may use 2 or more types together by arbitrary combinations and a ratio.

As the mono (meth) acrylate having a partial structure represented by the above formula (α), various known ones can be used, and those represented by the following formula (β) in particular from the viewpoint of curability. Is preferred.

In formula (β), R ^9d represents a hydrogen atom or a methyl group, and R ^10d represents a partial structure of the formula (α).

When the mono (meth) acrylate having a partial structure represented by the formula (α) is contained, the copolymerization ratio is usually 1 mol% or more, preferably 2 mol% or more, and usually 70 mol% or less. Preferably it is 50 mol% or less, More preferably, it is 30 mol% or less, More preferably, it is 10 mol% or less, Most preferably, it is 5 mol% or less. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to become high, and there exists a tendency for a residue to decrease by setting it as the said upper limit or less.

On the other hand, as the ethylenically unsaturated compound, an ethylenically unsaturated compound other than the mono (meth) acrylate having the partial structure represented by the above formula (α) (hereinafter referred to as “other ethylenically unsaturated compound”) For example, styrenes such as α-, o-, m-, p-alkyl, nitro, cyano, amide, ester derivatives of styrene, butadiene, 2,3-dimethylbutadiene, isoprene, chloroprene, etc. Dienes of (meth) acrylic acid methyl, (meth) acrylic acid ethyl, (meth) acrylic acid-n-propyl, (meth) acrylic acid-iso-propyl, (meth) acrylic acid-n-butyl, (meth ) Acrylic acid-sec-butyl, (meth) acrylic acid-tert-butyl, (meth) acrylic acid pentyl, (meth) acrylic acid neopen Chill, isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, dodecyl (meth) acrylate, cyclopentyl (meth) acrylate, (meth) acryl Cyclohexyl acid, 2-methylcyclohexyl (meth) acrylate, dicyclohexyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, allyl (meth) acrylate, propargyl (meth) acrylate, (meta ) Phenyl acrylate, naphthyl (meth) acrylate, anthracenyl (meth) acrylate, anthraninonyl (meth) acrylate, piperonyl (meth) acrylate, salicyl (meth) acrylate, furyl (meth) acrylate, ( (Meth) furfuryl acrylate, Tetrahydrofuryl (meth) acrylate, pyranyl (meth) acrylate, benzyl (meth) acrylate, phenethyl (meth) acrylate, cresyl (meth) acrylate, (meth) acrylic acid-1,1,1-trifluoroethyl Perfluoroethyl (meth) acrylate, perfluoro-n-propyl (meth) acrylate, perfluoro-iso-propyl (meth) acrylate, triphenylmethyl (meth) acrylate, cumyl (meth) acrylate (Meth) acrylic acid esters such as (meth) acrylic acid 3- (N, N-dimethylamino) propyl, (meth) acrylic acid-2-hydroxyethyl, (meth) acrylic acid-2-hydroxypropyl, (Meth) acrylic acid amide, (meth) acrylic acid N, N-dimethylamide, (meth) acrylic acid N (Meth) acrylic acid amides such as N-diethylamide, (meth) acrylic acid N, N-dipropylamide, (meth) acrylic acid N, N-di-iso-propylamide, (meth) acrylic acid anthracenyl amide , (Meth) acrylic acid anilide, (meth) acryloylnitrile, acrolein, vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinyl pyrrolidone, vinyl pyridine, vinyl acetate and other vinyl compounds, diethyl citraconic acid , Unsaturated maleic acid diesters such as diethyl maleate, diethyl fumarate and diethyl itaconate, monomaleimides such as N-phenylmaleimide, N-cyclohexylmaleimide, N-laurylmaleimide, N- (4-hydroxyphenyl) maleimide N- (meth) acryloyl Examples also include radically polymerizable compounds such as phthalimide.

Among these, in order to impart more excellent heat resistance and strength, it is possible to use at least one selected from styrene, benzyl (meth) acrylate and monomaleimide as the other ethylenically unsaturated compound. It is valid. In this case, from the viewpoint of heat resistance, the copolymerization ratio of at least one selected from styrene, benzyl (meth) acrylate and monomaleimide is usually 1 mol% or more, preferably 3 mol% or more, and usually 70 mol. % Or less, preferably 50 mol% or less, more preferably 30 mol% or less, still more preferably 10 mol% or less.

As an ethylenically unsaturated monocarboxylic acid to be added to an epoxy group contained in a copolymer of an epoxy group-containing (meth) acrylate and an ethylenically unsaturated compound, a known one can be used, and a curable viewpoint Therefore, (meth) acrylic acid is preferable. The amount of the ethylenically unsaturated monocarboxylic acid added to the epoxy group contained in the copolymer is usually 10 mol% or more, preferably 30 mol% or more, more preferably 50 mol% of the epoxy group contained in the copolymer. It is at least mol%, more preferably at least 70 mol%, and usually at most 100 mol%. There exists a tendency which can improve sclerosis | hardenability by making the addition ratio of ethylenically unsaturated monocarboxylic acid more than the said lower limit. In addition, a well-known method can be employ | adopted as a method of adding ethylenically unsaturated monocarboxylic acid to the said copolymer.

The polybasic acid (anhydride) to be added to the hydroxyl group produced when ethylenically unsaturated monocarboxylic acid is added to the copolymer is not particularly limited, and known ones can be used. Examples include acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), succinic acid (anhydride), trimellitic acid (anhydride), and the like. From the viewpoint of reducing the outgas generation amount, succinic acid (anhydride) is preferable. On the other hand, tetrahydrophthalic acid (anhydride) is preferable from the viewpoint of improving the remaining film ratio and reducing the residue. A polybasic acid (anhydride) may be used individually by 1 type, and may use 2 or more types together by arbitrary combinations and a ratio. By adding such a component, alkali solubility can be imparted to the copolymer.

The amount of polybasic acid (anhydride) added is usually 5 mol% or more, preferably 10 mol% or more of the hydroxyl group produced when ethylenically unsaturated monocarboxylic acid is added to the copolymer. . Moreover, it is 100 mol% or less normally, Preferably it is 90 mol% or less, More preferably, it is 80 mol% or less. There exists a tendency which can provide developability by setting it as the said lower limit or more, and there exists a tendency to suppress that a development advances too much and film | membrane dissolution by setting it as the said upper limit or less. In addition, a well-known method can be arbitrarily employ | adopted as a method of adding a polybasic acid (anhydride) to the hydroxyl group produced | generated when an ethylenically unsaturated monocarboxylic acid is added to the said copolymer.

In the modified product of the above epoxy group-containing (co) polymer with ethylenically unsaturated monocarboxylic acid and polybasic acid (anhydride), a part of the carboxyl group generated after addition of polybasic acid (anhydride) Photosensitivity can be further improved by adding a glycidyl (meth) acrylate or a glycidyl ether compound having an ethylenically unsaturated group. Moreover, developability can also be improved by adding the glycidyl ether compound which does not have an ethylenically unsaturated group to some carboxyl groups produced | generated after polybasic acid (anhydride) addition. Further, both of these may be added after the addition of the polybasic acid (anhydride).

Examples of the modified product of the above-mentioned epoxy group-containing (co) polymer with ethylenically unsaturated monocarboxylic acid and polybasic acid (anhydride) include, for example, Japanese Patent Laid-Open No. 8-297366 and Japanese Patent Laid-Open No. Examples thereof include resins described in JP-A-2001-89533.

The weight average molecular weight (Mw) of the acid-modified epoxy group-containing (co) polymer is not particularly limited, but is usually 3,000 or more, preferably 5,000 or more, and usually 100,000 or less, preferably 50. 5,000 or less, more preferably 30,000 or less, even more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. There exists a tendency which can improve compatibility by setting it as the said lower limit or more, and there exists a tendency which can ensure solubility by setting it as the said upper limit or less. The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] is preferably 2.0 to 5.0 from the viewpoint of curability.

The acid value of the acid-modified epoxy group-containing (co) polymer is not particularly limited, but is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, further preferably 20 mgKOH / g or more, and 150 mgKOH / g or less. Is preferable, 100 mgKOH / g or less is more preferable, and 50 mgKOH / g or less is more preferable. There exists a tendency which can ensure solubility by setting it as the said lower limit or more, and there exists a tendency which can improve a film reduction by setting it as the said upper limit or less.

[1-1-4-c] (C-3) Carboxyl group and ethylenically unsaturated group-containing resin [1-1-4-c-1] acid-modified epoxy resin As carboxyl group and ethylenically unsaturated group-containing resin For example, a carboxyl group- and ethylenically unsaturated group-containing epoxy resin obtained by adding a polybasic acid (anhydride) to an ethylenically unsaturated group monocarboxylic acid adduct of an epoxy resin, that is, a so-called epoxy (meth) acrylate resin Is mentioned. That is, an ethylenically unsaturated bond is added to the epoxy resin via an ester bond (—COO—) by ring-opening addition of the carboxy group of the ethylenically unsaturated monocarboxylic acid to the epoxy group of the epoxy resin. In addition, one in which one carboxy group of a polybasic acid (anhydride) is added to the hydroxyl group generated at that time.

Here, the epoxy resin includes a raw material compound before the resin is formed by thermosetting, and the epoxy resin can be appropriately selected from known epoxy resins. Specifically, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, biphenyl novolac epoxy resin, trisphenol epoxy resin, polymerization of phenol and dicyclopentane Epoxy resin, dihydroxyoxyfluorene type epoxy resin, dihydroxyalkyleneoxyl fluorene type epoxy resin, diglycidyl etherified product of 9,9-bis (4′-hydroxyphenyl) fluorene, 1,1-bis (4′-hydroxy) And phenyl) adamantane diglycidyl ether. Among them, from the viewpoint of high cured film strength, bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, 9,9-bis (4′-hydroxyphenyl) fluorene Diglycidyl etherified compounds are preferable, and bisphenol A epoxy resin is more preferable.

Examples of the ethylenically unsaturated monocarboxylic acid include (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and the like, and pentaerythritol tri (meth) acrylate succinic anhydride adduct , Pentaerythritol tri (meth) acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta (meth) acrylate succinic anhydride adduct, dipentaerythritol penta (meth) acrylate phthalic anhydride adduct, dipentaerythritol penta (meth) Examples thereof include acrylate tetrahydrophthalic anhydride adducts, reaction products of (meth) acrylic acid and ε-caprolactone, and the like. Among these, (meth) acrylic acid is preferable from the viewpoint of sensitivity.

Examples of the polybasic acid (anhydride) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, and 3-ethyltetrahydrophthalic acid. 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyro Examples include merit acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, and anhydrides thereof. Of these, succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride is preferred from the viewpoint of image reproducibility, developability, and reduction of outgas generation, and succinic anhydride or tetrahydrophthalic acid is preferred. An acid anhydride is more preferable, and a succinic anhydride is still more preferable.

The acid value of the acid-modified epoxy resin in the present invention is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, further preferably 30 mgKOH / g or more, and preferably 200 mgKOH / g or less, 180 mgKOH / g g or less is more preferred, 150 mgKOH / g or less is more preferred, 100 mgKOH / g or less is more preferred, and 80 mgKOH / g or less is particularly preferred. There exists a tendency which can improve adhesiveness by setting it as the said lower limit or more, and there exists a tendency which can improve solubility by setting it as the said upper limit or less.

Further, the weight average molecular weight (Mw) of the acid-modified epoxy resin is not particularly limited, but is usually 1,000 or more, preferably 2,000 or more, more preferably 3,000 or more, further preferably 4,000 or more, and more Preferably it is 5,000 or more, Especially preferably, it is 6,000 or more, Usually, 30,000 or less, Preferably it is 20,000 or less, More preferably, it is 15,000 or less, More preferably, it is 10,000 or less. There exists a tendency which can improve adhesiveness by setting it as the said lower limit or more, and there exists a tendency which can maintain appropriate solubility by setting it as the said upper limit or less.

The acid-modified epoxy resin can be synthesized by a conventionally known method. Specifically, the epoxy resin is dissolved in an organic solvent, and in the presence of a catalyst and a thermal polymerization inhibitor, the ethylenically unsaturated monocarboxylic acid is added to cause addition reaction, and further a polybasic acid (anhydride) is added. The method of continuing the reaction can be used.

Here, examples of the organic solvent used in the reaction include one or more organic solvents such as methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of the catalyst include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine, and tertiary amines such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride. One kind or two or more kinds of quaternary ammonium salts, phosphorus compounds such as triphenylphosphine, and stibins such as triphenylstibine are included. Furthermore, examples of the thermal polymerization inhibitor include one or more of hydroquinone, hydroquinone monomethyl ether, methyl hydroquinone and the like.

The amount of the ethylenically unsaturated monocarboxylic acid used is usually 0.7 to 1.3 chemical equivalents, preferably 0.9 to 1.1 chemical equivalents relative to one chemical equivalent of the epoxy group of the epoxy resin. The amount can be. The temperature during the addition reaction is usually 60 to 150 ° C., preferably 80 to 120 ° C. Further, the polybasic acid (anhydride) is used in an amount of usually 0.1 to 1.2 chemical equivalents, preferably 0.2 to 1.1, based on 1 chemical equivalent of the hydroxyl group generated in the addition reaction. The amount can be a chemical equivalent.

Specific examples of the acid-modified epoxy resin in the present invention are shown below. The acid-modified epoxy resin may include one type of resin, or may include two or more types of resins.

In formula (C1-1), R ¹¹¹ each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹¹¹ represents an integer of 0 to 20.

In formula (C1-2), R ¹²¹ each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹²¹ represents an integer of 0 to 20.

In formula (C1-3), R ¹³¹ independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and m ¹³¹ and n ¹³¹ each independently represents an integer of 0 to 20. In addition, ^m131 and ⁿ¹³¹ mean the number of repeating units, and do not indicate that it is a block copolymer. γ represents a single bond, —CO—, —CH ₂ —, —C (CH ₃ ) ₂ —, a group represented by the following formula (γ), or a group represented by the following formula (δ). δ represents a hydrogen atom or a polybasic acid residue.

In formula (C1-4), each R ¹⁴¹ independently represents an alkyl group or a halogen atom, and each p independently represents an integer of 0 to 4.

In formula (C1-6), R ¹⁶¹ each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹⁶¹ represents an integer of 0 to 20.

In the formulas (C1-1) to (C1-6), A represents a group represented by the following general formula (ε).

In the formula (ε), R ¹⁷¹ represents a hydrogen atom or a methyl group, R ¹⁷² represents an alkylene group, and m ¹⁷¹ represents an integer of 0 to 10. Δ represents a hydrogen atom or a polybasic acid residue.

[1-1-4-c-2] Modified Phenol Resin As a carboxyl group- and ethylenically unsaturated group-containing resin, for example, a polybasic acid (anhydride) is added to an ethylenically unsaturated group-containing epoxy compound adduct of a phenol resin. And phenolic resins containing carboxyl groups and ethylenically unsaturated groups. That is, the epoxy group of an epoxy compound containing an ethylenically unsaturated group is ring-opened and added to the phenolic hydroxyl group of the phenol resin, thereby adding an ethylenically unsaturated bond to the phenol resin via an ester bond (—COO—). In addition, one in which one carboxy group of a polybasic acid (anhydride) is added to the hydroxyl group generated at that time.

Here, as the phenol resin, for example, phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, o-ethylphenol, m-ethylphenol, p-ethylphenol Propylphenol, n-butylphenol, tert-butylphenol, 1-naphthol, 2-naphthol, 4,4′-biphenyldiol, bisphenol-A, pyrocatechol, resorcinol, hydroquinone, pyrogallol, 1,2,4-benzenetriol, At least one of phenols such as benzoic acid, 4-hydroxyphenylacetic acid, salicylic acid, phloroglucinol and the like is reacted with acid catalyst, for example, formaldehyde, paraformaldehyde, acetaldehyde, paraaldehyde, propiona In place of an aldehyde such as dehydr, benzaldehyde, salicylaldehyde, furfural, etc., or a novolac resin polycondensed with at least one of ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and the acid catalyst in the polycondensation Resole resins and the like that are polycondensed in the same manner except that an alkali catalyst is used. Here, the condensation reaction of the phenols and aldehydes is carried out in the absence of a solvent or in a solvent.

The weight average molecular weight (Mw) of these novolak resins and resol resins is usually 1,000 to 20,000, preferably 1,000 to 10,000, and more preferably 1,000 to 8,000. . When the weight average molecular weight is at least the lower limit value, the image strength tends to be ensured, and when the weight average molecular weight is at the upper limit value or less, developability tends to be ensured.

Examples of the ethylenically unsaturated group-containing epoxy compound include glycidyl (meth) acrylate, (3,4-epoxycyclohexyl) methyl (meth) acrylate, glycidyloxy (poly) alkylene glycol (meth) acrylate, and methyl glycidyl (meth). Acrylate, (3,4-epoxycyclohexyl) vinyl and the like. Of these, glycidyl (meth) acrylate and (3,4-epoxycyclohexyl) methyl (meth) acrylate are particularly preferable.

A known method can be used for the reaction of the novolak resin, the resole resin, etc. with the ethylenically unsaturated group-containing epoxy compound. For example, tertiary amines such as triethylamine and benzylmethylamine, quaternary ammonium salts such as dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride and benzyltriethylammonium chloride, pyridine, triphenylphosphine, etc. By using the above as a catalyst and reacting in an organic solvent at a reaction temperature of 50 to 150 ° C. for several to several tens of hours, an ethylenically unsaturated group-containing epoxy compound can be added to a novolac resin, a resole resin or the like.

The amount of the catalyst used is preferably 0.01 to 10% by mass, particularly preferably 0.3 to 5%, based on the reaction raw material mixture (total of novolak resin, resol resin and ethylenically unsaturated group-containing epoxy compound). % By mass. In order to prevent polymerization during the reaction, one or more polymerization inhibitors (eg, methoquinone, hydroquinone, methylhydroquinone, p-methoxyphenol, pyrogallol, tert-butylcatechol, dibutylhydroxytoluene, phenothiazine, etc.) Is preferably used in an amount of 0.01 to 10% by mass, particularly preferably 0.03 to 5% by mass, based on the reaction raw material mixture.
A preferred ratio of adding an ethylenically unsaturated group-containing epoxy compound to a phenolic hydroxyl group such as a novolak resin or a resole resin is 1 to 99 mol%. This ratio can be adjusted by the amount of the ethylenically unsaturated group-containing epoxy compound added to the phenolic hydroxyl group.

As the polybasic acid (anhydride), for example, known ones can be used, such as maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylendomethylenetetrahydrophthalic acid, chlorend Acid, methyltetrahydrophthalic acid, 5-norbornene-2,3-dicarboxylic acid, dibasic carboxylic acid such as methyl-5-norbornene-2,3-dicarboxylic acid or its anhydride, trimellitic acid, pyromellitic acid, Examples thereof include polybasic carboxylic acids such as benzophenone tetracarboxylic acid and biphenyl tetracarboxylic acid or anhydrides thereof. Among these, tetrahydrophthalic anhydride or succinic anhydride is preferable. These may be used alone or in combination of two or more.

The addition rate of the polybasic acid (anhydride) is usually 10 to 100 mol%, preferably 20 to 100 mol%, based on the hydroxyl group of the reaction product of the novolak resin, resol resin, etc. and the ethylenically unsaturated group-containing epoxy compound. 30 to 100 mol% is preferred. By making this addition rate within the above range, developability tends to be easily secured.

[1-1-4-d] Other alkali-soluble resin In addition, a weak alkaline alkaline compound developer in the case where a partition wall is to be provided on an organic electric field element of a substrate that easily deteriorates against an alkaline developer. Alternatively, in the case of using a developer containing no alkaline compound, examples of the alkali-soluble resin include polyvinyl alcohol or the [1-1-4-a-1] carboxyl group-containing (co) polymer (1). A vinyl alcohol copolymer obtained by copolymerizing 0.1 to 40 mol%, preferably 1 to 30 mol% of a comonomer (preferably vinyl acetate or the like), or the above [1-1-4-a -1] Modified poly-polymers introduced with 0.1 to 40 mol%, preferably 1 to 30 mol% of the copolymer mentioned in the carboxyl group-containing (co) polymer (1) by an esterification reaction Vinyl alcohol is preferably used.

Further, for the purpose of forming an appropriate taper angle and maintaining liquid repellency, the ethylenically unsaturated monocarboxylic acids (preferred examples) mentioned in the above [1-1-4-c-1] acid-modified epoxy resins are mentioned. , (Meth) acrylic acid, a reaction product of (meth) acrylic acid and ε-caprolactone, etc.) or a polybasic acid (anhydride) (preferably, tetrahydrophthalic anhydride, etc.) by esterification reaction. Modified polyvinyl alcohol introduced in an amount of 0.1 to 30 mol%, preferably 0.5 to 20 mol%, or a (meth) acryloyl (oxy) group or (meth) described in Japanese Patent Application Laid-Open No. 2008-45047 A compound having an acrylamide group and an aldehyde group (preferred examples include 4-acryloyloxybutanal) or a dialkyl acetate Modified polyvinyl having 0.1 to 30 mol%, preferably 0.5 to 20 mol%, of a group-containing compound (preferred example is N- (2,2-dimethoxyethyl) methacrylamide) introduced by a formal reaction Alcohol or the like is preferably used.

(C) Among the above-mentioned alkali-soluble resins, (C-2) a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, or (C -3) A carboxyl group and ethylenically unsaturated group-containing resin is preferred, (C-3) a carboxyl group and ethylenically unsaturated group-containing resin is more preferred, and an acid-modified epoxy resin is more preferred. Moreover, what was mentioned as (C) alkali-soluble resin in a 1st aspect can also be used.

The weight average molecular weight (Mw) of the above (C) alkali-soluble resin is not particularly limited, but is preferably 2,000 or more, more preferably 3,000 or more, further preferably 5,000 or more, and particularly preferably 7,000 or more. Preferably, 50,000 or less is preferable, 30,000 or less is more preferable, 20,000 or less is more preferable, and 10,000 or less is particularly preferable. By setting it to the lower limit value or more, there is a tendency to suppress excessive development and dissolution of the film, and by setting it to the upper limit value or less, there is a tendency to exhibit appropriate development solubility.

The acid value of the (C) alkali-soluble resin is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, more preferably 30 mgKOH / g or more, and preferably 200 mgKOH / g or less, 150 mgKOH / g. The following is more preferable, 100 mgKOH / g or less is further preferable, 70 mgKOH / g or less is further more preferable, and 50 mgKOH / g or less is particularly preferable. There exists a tendency which can suppress a residue by setting it as the said lower limit or more, and there exists a tendency for a high remaining film rate to be obtained by setting it as the said upper limit or less.

The content ratio of the (C) alkali-soluble resin in the photosensitive resin composition of the present invention according to the second aspect is usually 5% by mass or more, preferably 10% by mass or more, more preferably based on the total solid content. 20% by mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50% by mass. It is as follows. When it is at least the lower limit, moderate development solubility and sensitivity tend to be obtained, and when it is at most the upper limit, moderate development solubility and sensitivity tend to be obtained.

The content ratio of (A) ethylenically unsaturated compound and (C) alkali-soluble resin in the total solid content is usually 5% by mass or more, preferably 10% by mass or more, more preferably, based on the total solid content. 30% by mass or more, more preferably 50% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 85% by mass or more, and usually 99% by mass or less. Preferably it is 97 mass% or less, More preferably, it is 95 mass% or less. When it is at least the lower limit, moderate development solubility and sensitivity tend to be obtained, and when it is at most the upper limit, moderate development solubility and sensitivity tend to be obtained.

The blending ratio of (C) alkali-soluble resin to (A) ethylenically unsaturated compound in the photosensitive resin composition is (C) alkali-soluble with respect to 100 parts by mass of (A) ethylenically unsaturated compound. 50 parts by mass or more of the resin is preferable, 60 parts by mass or more is more preferable, 70 parts by mass or more is further preferable, 80 parts by mass or more is particularly preferable, 400 parts by mass or less is preferable, 300 parts by mass or less is more preferable, 200 The amount is more preferably equal to or less than mass parts, and particularly preferably equal to or less than 100 mass parts. When the amount is not less than the lower limit value, the substrate adhesion tends to be strong, and when the value is not more than the upper limit value, the curability becomes high and the minimum exposure amount required for producing liquid repellency becomes low. Tend.

[1-1-5] Component (D); Liquid Repellent Agent The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention may contain (D) a liquid repellent agent. In particular, when an organic electroluminescent device is produced by an ink jet method, it is preferable to contain (D) a liquid repellent, and (D) it can impart liquid repellency to the surface of the partition wall by containing the liquid repellent. It is considered that the obtained partition wall can prevent color mixing for each light emitting portion (pixel) of the organic layer.

Examples of the liquid repellent include a silicone-containing compound and a fluorine-based compound, and preferably include a liquid repellent having a crosslinking group (hereinafter sometimes referred to as “crosslinking group-containing liquid repellent”). Examples of the crosslinking group include an epoxy group or an ethylenically unsaturated group, and an ethylenically unsaturated group is preferable from the viewpoint of suppressing the outflow of the liquid repellent component of the developer.
When the crosslinkable group-containing liquid repellent is used, when the formed coating film is exposed, the cross-linking reaction on the surface can be accelerated, and the liquid repellent is less likely to flow out during the development process. Can be considered to exhibit high liquid repellency.

When a fluorine-based compound is used as the liquid repellent, the fluorine compound tends to be aligned on the surface of the partition wall and function to prevent ink bleeding and color mixing. More specifically, the group having a fluorine atom tends to function to repel ink and prevent ink bleeding and color mixing due to the ink entering the adjacent region beyond the partition wall.

Specific examples of the crosslinkable group-containing liquid repellent, particularly the ethylenically unsaturated group-containing fluorine-based compound include, for example, perfluoroalkylsulfonic acid, perfluoroalkylcarboxylic acid, perfluoroalkylalkylene oxide adduct, perfluoroalkyltrialkylammonium. Salt, oligomer containing perfluoroalkyl group and hydrophilic group, oligomer containing perfluoroalkyl group and lipophilic group, oligomer containing perfluoroalkyl group and hydrophilic group and new oil group, urethane containing perfluoroalkyl group and hydrophilic group, Fluorine-containing organic compounds such as perfluoroalkyl esters and perfluoroalkyl phosphates can be mentioned. Commercially available products of these fluorine-containing compounds include “Megafuck F116”, “Megafuck F120”, “Megafuck F142D”, “Megafuck F144D”, “Megafuck F150”, “Megafuck F160”, manufactured by DIC, “Mega Fuck F171”, “Mega Fuck F172”, “Mega Fuck F173”, “Mega Fuck F177”, “Mega Fuck F178A”, “Mega Fuck F178K”, “Mega Fuck F179”, “Mega Fuck F183”, “Mega Fuck F183” Fuck F184, Mega Fuck F191, Mega Fuck F812, Mega Fuck F815, Mega Fuck F824, Mega Fuck F833, Mega Fuck RS101, Mega Fuck RS102, Mega Fuck RS105 , "Me “Fuck RS201”, “Megafuck RS202”, “Megafuck RS301”, “Megafuck RS303” “Megafuck RS304”, “Megafuck RS401”, “Megafuck RS402”, “Megafuck RS501”, “Megafuck RS502” , “Megafuck RS-72-K”, “DEFENSA MCF300”, “DEFENSA MCF310”, “DEFENSA MCF312”, “DEFENSA MCF323”, “FLORAD FC430”, “FLORARD FC431”, “FC-4430” manufactured by 3M Japan , “FC4432”, “Asahi Guard AG710”, “Surflon S-382”, “Surflon SC-101”, “Surflon SC-102”, “Surflon SC-1” manufactured by Asahi Glass Co., Ltd. 3 ”,“ Surflon SC-104 ”,“ Surflon SC-105 ”,“ Surflon SC-106 ”,“ OPTOOL DAC-HP ”manufactured by Daikin Industries, Ltd., and other commercially available fluorine-containing organic compounds are used. be able to.

Thus, in the case of using a fluorine-based compound as the liquid repellent, the fluorine atom content in the liquid repellent is not particularly limited, but is preferably 1% by mass or more, more preferably 5% by mass or more, and 50% by mass or less. Is preferable, and 25 mass% or less is more preferable. By setting it to the lower limit value or more, there is a tendency that the outflow to the pixel portion can be suppressed.

The molecular weight of the liquid repellent is not particularly limited, and may be a low molecular weight compound or a high molecular weight substance. The high molecular weight liquid repellent is preferable because the flow of the liquid repellent due to post-baking is suppressed, and thus the outflow of the liquid repellent from the bank can be suppressed. From this viewpoint, the number average molecular weight of the liquid repellent is 100. The above is preferable, 500 or more is more preferable, 100,000 or less is preferable, and 10,000 or less is more preferable.

The content ratio of (D) the liquid repellent in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.1% by mass or more, and usually 1% by mass or less, based on the total solid content. , Preferably 0.5% by mass or less, more preferably 0.3% by mass or less. There exists a tendency which shows high liquid repellency by setting it as the said lower limit or more, and there exists a tendency which can suppress the outflow to a pixel part by setting it as the said upper limit or less.

On the other hand, in the photosensitive resin composition for forming a partition wall of the present invention, a surfactant may be used together with (D) the liquid repellent, and a surfactant may be used instead of (D) the liquid repellent. The surfactant can be used for the purpose of improving the coating property of the photosensitive resin composition for forming a partition wall and improving the developability of the coating film, among which a fluorine-based or silicone-based surfactant is preferable. .
In particular, at the time of development, a silicone-based surfactant is preferable because it has an action of removing the residue of the photosensitive resin composition from the unexposed area and also has a function of expressing wettability. A surfactant is more preferred.

As the fluorosurfactant, a compound having a fluoroalkyl or fluoroalkylene group at least at any one of the terminal, main chain and side chain is suitable. Specifically, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctyl hexyl ether, octaethylene glycol di ( 1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,2,2- Tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8,9, Examples include 9,10,10-decafluorododecane and 1,1,2,2,3,3-hexafluorodecane. As these commercial products, for example, “BM-1000” and “BM-1100” manufactured by BM Chemie, “Megafuck F142D”, “Megafuck F172”, “Megafuck F173”, “Megafuck F183” manufactured by DIC ”,“ Megafuck F470 ”,“ Megafuck F475 ”,“ FC430 ”manufactured by 3M Japan,“ DFX-18 ”manufactured by Neos, and the like.

Examples of the silicone surfactant include “DC3PA”, “SH7PA”, “DC11PA”, “SH21PA”, “SH28PA”, “SH29PA”, “8032Additive”, “SH8400” manufactured by Toray Dow Corning, Commercial products such as “BYK323” and “BYK330” manufactured by Big Chemie may be mentioned.
Surfactants may include those other than fluorosurfactants and silicone surfactants, and other surfactants include nonionic, anionic, cationic, amphoteric surfactants and the like. It is done.

Examples of the nonionic surfactant include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, Glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbit fatty acid esters, polyoxy And ethylene sorbite fatty acid esters. Examples of these commercially available products include polyoxyethylene surfactants such as “Emulgen 104P” and “Emulgen A60” manufactured by Kao Corporation.

Examples of the anionic surfactant include alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate esters, and higher alcohol sulfates. Ester salts, aliphatic alcohol sulfates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate esters, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, special Examples thereof include polymer surfactants. Among these, special polymer surfactants are preferable, and special polycarboxylic acid type polymer surfactants are more preferable. Commercially available products can be used as such anionic surfactants, such as “Emar 10” manufactured by Kao Corporation for alkyl sulfates, and “Perex NB-L” manufactured by Kao Corporation for alkylnaphthalene sulfonates. Specific polymer surfactants include “Homogenol L-18” and “Homogenol L-100” manufactured by Kao Corporation.

Furthermore, the cationic surfactants include quaternary ammonium salts, imidazoline derivatives, alkylamine salts, and the like, and the amphoteric surfactants include betaine-type compounds, imidazolium salts, imidazolines, amino acids. Etc. Of these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Examples of commercially available products include “Acetamine 24” manufactured by Kao Corporation for alkylamine salts, and “Cotamine 24P” and “Cotamin 86W” manufactured by Kao Corporation for quaternary ammonium salts.

Further, the surfactant may be used in combination of two or more kinds, for example, silicone surfactant / fluorine surfactant, silicone surfactant / special polymer surfactant, fluorine surfactant. / Special polymer surfactant combinations and the like. Of these, a combination of silicone surfactant / fluorine surfactant is preferable. In this silicone surfactant / fluorine surfactant combination, for example, “DFX-18” manufactured by Neos, “BYK-300” or “BYK-330” manufactured by Big Chemie / “S-” manufactured by AGC Seimi Chemical Co., Ltd. 393 ”, Shin-Etsu Silicone“ KP340 ”/ DIC“ F-478 ”or“ F-475 ”, Toray Dow Corning“ SH7PA ”/ Daikin“ DS-401 ”, NUC“ L ” -77 "/" FC4430 "manufactured by 3M Japan.

[1-1-6] Polymerization inhibitor The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention may contain a polymerization inhibitor. It is considered that the taper angle of the obtained partition wall can be increased because it contains a polymerization inhibitor and inhibits radical polymerization.
Examples of the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, 2,6-di-tert-butyl-4-cresol (BHT) and the like. Among these, hydroquinone or methoxyphenol is preferable from the viewpoint of the ability to inhibit polymerization, and methylhydroquinone is more preferable.

The polymerization inhibitor preferably contains one or more kinds. Usually, when the (C) alkali-soluble resin is produced, a polymerization inhibitor may be contained in the resin, which may be used as the polymerization inhibitor of the present invention, or the polymerization inhibitor in the resin. In addition, the same or different polymerization inhibitor may be added during the production of the photosensitive resin composition.

The content of the polymerization inhibitor in the photosensitive resin composition is usually 0.0005% by mass or more, preferably 0.001% by mass or more, more preferably 0.005% by mass or more with respect to the total solid content of the photosensitive resin composition. It is 01 mass% or more, and is generally 0.3 mass% or less, preferably 0.2 mass% or less, more preferably 0.1 mass% or less. There exists a tendency which can make a taper angle large by setting it as the said lower limit or more, and there exists a tendency which can maintain a high sensitivity by setting it as the said upper limit or less.

[1-1-7] Ultraviolet Absorber The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention may contain an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing a specific wavelength of a light source used for exposure by the ultraviolet absorber. By adding an ultraviolet absorber, effects such as improving the taper angle shape after development and eliminating the residue remaining in the non-exposed area after development can be obtained. As the ultraviolet absorber, from the viewpoint of inhibiting the light absorption of the initiator, for example, a compound having an absorption maximum between wavelengths of 250 nm to 400 nm can be used.
Examples of the ultraviolet absorber include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and derivatives thereof, dinaphthalene compounds, phenanthroline compounds, dyes, and the like.
These ultraviolet absorbers can be used alone or in combination of two or more.

Among these, from the viewpoint of increasing the taper angle, benzotriazole compounds and / or hydroxyphenyltriazine compounds are preferable, and benzotriazole compounds are particularly preferable.

Among the benzotriazole compounds, a benzotriazole compound described by the following general formula (Z1) is preferable from the point of taper shape.

In the above formula (Z1), R ^1e and R ^2e are each independently a hydrogen atom, an alkyl group which may have a substituent, a group represented by the following general formula (Z2), or the following general formula (Z3 ) Represents a group represented by R ^3e represents a hydrogen atom or a halogen atom.

In the above formula (Z2), R ^4e represents an alkylene group which may have a substituent, and R ^5e represents an alkyl group which may have a substituent.

In the above formula (Z3), R ^6e represents an alkylene group which may have a substituent, and R ^7e represents a hydrogen atom or a methyl group.

(R ^1e and R ^2e )
In Formula (Z1), R ^1e and R ^2e are each independently a hydrogen atom, an alkyl group which may have a substituent, a group represented by General Formula (Z2), or General Formula (Z3). Represents the group represented.

Examples of the alkyl group include linear, branched or cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, further preferably 4 or more, preferably 10 or less, more preferably 6 or less, More preferably, it is 4 or less.

Specific examples of the alkyl group include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tert-butyl group and the like. Of these, a tert-butyl group is preferred.
The substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.

(R ^3e )
In the formula (Z1), R ^3e represents a hydrogen atom or a halogen atom.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
Among these, from the viewpoint of synthesis, R ^3e is preferably a hydrogen atom.

(R ^4e )
In the formula (Z2), R ^4e represents an alkylene group which may have a substituent.
Examples of the alkylene group include linear, branched or cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less.

Specific examples of the alkylene group include methylene group, ethylene group, propylene group, propylene group, butylene group and the like. Among these, an ethylene group is preferable.
In addition, as the substituent that the alkylene group may have, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.

Among these, it is preferable that R ^4e is an ethylene group.

(R ^5e )
In the formula (Z2), an alkyl group which may have a substituent is represented.
Examples of the alkyl group include linear, branched or cyclic alkyl groups. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, still more preferably 7 or more, and is preferably 15 or less, more preferably 10 or less, More preferably, it is 9 or less.

Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, and a nonyl group.
The substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.
Among these, from the viewpoint of a tapered shape, R ^5e is preferably a heptyl group, an octyl group, or a nonyl group.

(R ^6e )
In the formula (Z3), R ^6e represents an alkylene group which may have a substituent.
Examples of the alkylene group include linear, branched or cyclic alkylene groups. The carbon number is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less.

Among these, from the viewpoint of a tapered shape, R ^1e is a tert-butyl group, R ^2e is a group represented by the above formula (Z2) (where R ^4e is an ethylene group, R ^5e is an alkyl group having 7 to 9 carbon atoms) , R ^3e is a hydrogen atom, or R ^1e is a hydrogen atom, R ^2e is a group represented by the above formula (Z3) (where R ^6e is an ethylene group, R ^7e is a methyl group), and R ^3e is a hydrogen atom Wherein R ^1e is a tert-butyl group, R ^2e is a group represented by the above formula (Z2) (where R ^4e is an ethylene group, R ^5e is an alkyl group having 7 to 9 carbon atoms), R ^3e A compound in which is a hydrogen atom is more preferred.

Specific examples of the benzotriazole compound include 2- (5-methyl-2-hydroxyphenyl) benzotriazole, 2- (2-hydroxy-5-tert-butylphenyl) -2H-benzotriazole, octyl-3 [3 -Tert-butyl-4-hydroxy-5- (5-chloro-2H-benzotriazol-2-yl) phenyl] propionate and 2-ethylhexyl-3- [3-tert-butyl-4-hydroxy-5- (5 -Chloro-2H-benzotriazol-2-yl) phenyl] propionate, 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2- (3 -Tert-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2- (3,5-di-tert-amyl-2-hydroxyphenyl) benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, benzenepropanoic acid, 3- (2H-benzo Triazol-2-yl) -5- (1,1-dimethylethyl) -4-hydroxy, C7-9 side chain and linear alkyl ester compounds, 2- (2H-benzotriazol-2-yl) -4, 6-bis (1-methyl-1-phenylethyl) phenol, 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1-phenylethyl) -4- (1,1,3 3-tetramethylbutyl) phenol. Among these, from the viewpoint of taper angle and exposure sensitivity, 3- (2H-benzotriazol-2-yl) -5- (1,1-dimethylethyl) -4-hydroxy, C7-9 side chain and linear alkyl Ester compounds are preferred.

Examples of commercially available benzotriazole compounds include, for example, Sumisorb 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry), TINUVIN PS, TINUVIN99-2, TINUVIN109, TINUVIN384-2, TINUVIN326, TINUVIN900, TINUVIN928, TINUVIN1130 (manufactured by BASF), EVERSORB70, EVERSORB71, EVERSORB72, EVERSORB74, 75 EVERSORB74, 75 80, EVERSORB81 (manufactured by Yongkou Chemical Industries, Taiwan), Tomisorb 100, Tomisorb 600 (manufactured by API Corporation), SEESORB701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, SEESORB 709 (manufactured by Cipro Kasei 93) Manufactured) and the like.

Examples of triazine compounds include 2- [4,6-di (2,4-xylyl) -1,3,5-triazin-2-yl] -5-octyloxyphenol, 2- [4,6-bis ( 2,4-Dimethylphenyl) -1,3,5-triazin-2-yl] -5- [3- (dodecyloxy) -2-hydroxypropoxy] phenol, 2- (2,4-dihydroxyphenyl) -4 , 6-Bis (2,4-dimethylphenyl) -1,3,5-triazine and (2-ethylhexyl-glycidic acid ester reaction product, 2,4-bis "2-hydroxy-4-butoxyphenyl"- 6- (2,4-dibutoxyphenyl) -1,3-5-triazine, etc. Of these, hydroxyphenyl triazine compounds are preferred from the viewpoint of taper angle and exposure sensitivity.
Examples of commercially available triazine compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF).

Other UV absorbers include, for example, Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORB10, EVERSORB11, EVERSORB12 (manufactured by Eikko Chemical Industries, Ltd.), Tomissorb 800 (manufactured by API Corporation), SESORB100, SESORB101, SESORB101S, SEESORB102, SEESORB102, SEESORB102 Benzophenone compounds such as SEESORB105, SEESORB106, SEESORB107, and SEESORB151 (manufactured by Cypro Kasei); Sumisorb 400 (manufactured by Sumitomo Chemical); benzoate compounds such as phenyl salicylate; 2-ethylhexyl cinnamate, 2-ethylhexyl paramethoxycinnamate, and isopropyl methoxycinnamate , Cinnamic acid derivatives such as isoamyl methoxycinnamate; α Naphthol, β-naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6- Naphthalene derivatives such as dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene; anthracene, 9,10-dihydroxyanthracene Anthracene and its derivatives such as: azo dyes, benzophenone dyes, amino ketone dyes, quinoline dyes, anthraquinone dyes, diphenyl cyanoacrylate dyes, triazine dyes, p-aminobenzoic acid And dyes such as perfume acid dyes. Among these, from the viewpoint of exposure sensitivity, cinnamic acid derivatives and naphthalene derivatives are preferably used, and cinnamic acid derivatives are particularly preferably used.

The content ratio of the ultraviolet absorber in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.05% by mass or more, more preferably 0.1% by mass with respect to the total solid content. Or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, and usually 15% by mass or less, preferably 10% by mass or less, more preferably 5% by mass or less, and further preferably 3% by mass. % Or less. The taper angle tends to be increased by setting it to the lower limit value or more, and the sensitivity tends to be increased by setting the upper limit value or less.

Moreover, (B) As a compounding ratio with respect to a photoinitiator, (B) As a compounding quantity of the ultraviolet absorber with respect to 100 mass parts of photoinitiators, it is 1 mass part or more normally, Preferably it is 10 mass parts or more, More preferably 30 parts by mass or more, more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, and usually 500 parts by mass or less, preferably 300 parts by mass or less, more preferably 200 parts by mass or less, still more preferably 150 parts by mass. It is as follows. The taper angle tends to be increased by setting it to the lower limit value or more, and the sensitivity tends to be increased by setting the upper limit value or less.

[1-1-8] Thermal Polymerization Initiator Furthermore, the photosensitive resin composition for forming an organic electroluminescent element partition of the present invention may contain a thermal polymerization initiator. By containing a thermal polymerization initiator, there is a tendency that the degree of crosslinking of the film can be increased. Specific examples of such a thermal polymerization initiator include azo compounds, organic peroxides, hydrogen peroxide, and the like. These may be used alone or in combination of two or more.

When a thermal polymerization initiator is used in combination with the photopolymerization initiator in the hope of improving sensitivity and increasing the crosslink density of the film, the total content of these is the photopolymerization initiator in the photosensitive resin composition described above. The combined proportion of the photopolymerization initiator and the thermal polymerization initiator is preferably a thermal polymerization initiator with respect to 100 parts by mass of the photopolymerization initiator from the viewpoint of sensitivity. The amount is preferably 5 to 300 parts by mass.

[1-1-9] Amino Compound The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention may contain an amino compound in order to promote thermosetting. In this case, the content ratio of the amino compound in the photosensitive resin composition is usually 40% by mass or less, preferably 30% by mass or less, based on the total solid content of the photosensitive resin composition. Moreover, it is 0.5 mass% or more normally, Preferably it is 1 mass% or more. There exists a tendency which can maintain storage stability by setting it as the said upper limit or less, and there exists a tendency which can ensure sufficient thermosetting by setting it as the said lower limit or more.

Examples of the amino compound include an amino compound having at least two methylol groups as functional groups and alkoxymethyl groups obtained by condensation condensation with alcohols having 1 to 8 carbon atoms. Specifically, for example, melamine resin obtained by polycondensation of melamine and formaldehyde; benzoguanamine resin obtained by polycondensation of benzoguanamine and formaldehyde; glycoluril resin obtained by polycondensation of glycoluril and formaldehyde; urea and formaldehyde Examples include polycondensed urea resins; resins obtained by copolycondensation of two or more of melamine, benzoguanamine, glycoluril, urea and the like with formaldehyde; modified resins obtained by alcohol condensation modification of methylol groups of the above-described resins. These may be used alone or in combination of two or more. Among the amino compounds, melamine resins and modified resins thereof are preferable, modified resins having a methylol group modification ratio of 70% or more are more preferable, and modified resins of 80% or more are particularly preferable.

Specific examples of the amino compound include melamine resins and modified resins thereof, for example, “Cymel” (registered trademark) 300, 301, 303, 350, 736, 738, 370, 771, 325, 327 manufactured by Cytec Corporation, 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, 1158, and “Nicarac” (registered trademark) MW-390, MW-100LM manufactured by Sanwa Chemical Co., Ltd. MX-750LM, MW-30M, MX-45, MX-302 and the like. Examples of the benzoguanamine resin and modified resins thereof include “Cymel” (registered trademark) 1123, 1125, and 1128 manufactured by Cytec Corporation. Examples of the glycoluril resin and its modified resin include “Cymel” (registered trademark) 1170, 1171, 1174, and 1172 manufactured by Cytec, and “Nikarak” (registered trademark) MX manufactured by Sanwa Chemical Co., Ltd. -270 and the like. Examples of the urea resin and its modified resin include “UFR” (registered trademark) 65 and 300 manufactured by Cytec, and “Nicarak” (registered trademark) MX-290 manufactured by Sanwa Chemical Co., Ltd. It is done.

[1-1-10] Colorant The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention may contain a colorant for the purpose of coloring the partition. As the colorant, known colorants such as pigments and dyes can be used. For example, when using a pigment, a known dispersant or dispersion aid may be used in combination so that the pigment can be stably present in the photosensitive resin composition without agglomeration. In particular, by coloring the liquid repellent partition wall black, there is an effect that a clear pixel display can be obtained. In addition to black dyes, black pigments, carbon black, titanium black, and the like as black colorants, mixing with organic pigments and coloring them black is also effective as an effect of imparting low conductivity. The content of the colorant is usually 60% by mass or less, preferably 40% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoints of plate making properties and color characteristics.
On the other hand, for the purpose of reducing the amount of outgas generated from the partition wall, it is desirable to make the partition wall transparent, and the content ratio of the colorant in that case is preferably based on the total solid content of the photosensitive resin composition. It is 10 mass% or less, More preferably, it is 5 mass% or less, Most preferably, it is 0 mass%.

[1-1-11] Coatability improver, development improver The photosensitive resin composition for forming an organic electroluminescent element partition according to the present invention includes a coatability improver and a developer for improving coatability and development solubility. An improver may be included. As the coatability improver or development improver, for example, known cationic, anionic, nonionic, fluorine-based, and silicone-based surfactants can be used. Further, as the development improver, known ones such as organic carboxylic acids or anhydrides thereof can be used. Moreover, the content rate is 20 mass% or less normally with respect to the total solid of the photosensitive resin composition from a viewpoint of a sensitivity, Preferably it is 10 mass% or less.

[1-1-12] Silane Coupling Agent A silane coupling agent is preferably added to the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention in order to improve adhesion to the substrate. Various types of silane coupling agents such as epoxy, methacrylic, amino, and imidazole can be used, and epoxy and imidazole silane coupling agents are particularly preferable from the viewpoint of improving adhesion. The content is usually 20% by mass or less, preferably 15% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoint of adhesion.

[1-1-13] Phosphate adhesion improver A phosphoric acid adhesion improver is added to the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention in order to improve adhesion to a substrate. It is also preferable. As the phosphate-based adhesion improver, (meth) acryloyloxy group-containing phosphates are preferable, and those represented by the following general formulas (Va), (Vb), and (Vc) are particularly preferable.

In the general formulas (Va), (Vb), and (Vc), R ⁸ represents a hydrogen atom or a methyl group, r and r ′ are each independently an integer of 1 to 10, and s is 1, 2, or 3. .

[1-1-14] Inorganic Filler Further, the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention further has a moderate interaction with an alkali-soluble resin as well as an improvement in strength as a cured product ( An inorganic filler may be contained for the purpose of improving the flatness and taper angle of the coating film by forming the matrix structure. Examples of such inorganic fillers include talc, silica, alumina, barium sulfate, magnesium oxide, and those obtained by surface treatment with various silane coupling agents.

The average particle size of these inorganic fillers is usually 0.005 to 20 μm, preferably 0.01 to 10 μm. Here, the average particle diameter referred to in the present embodiment is a value measured with a laser diffraction / scattering particle size distribution measuring apparatus such as manufactured by Beckman Coulter. Among these inorganic fillers, silica sol and silica sol-modified product are particularly preferably blended because they tend to be excellent in the effect of improving the taper angle as well as the dispersion stability. When the photosensitive resin composition for forming an organic electroluminescent element partition of the present invention contains these inorganic fillers, the content thereof is usually 5% by mass or more, preferably from the viewpoint of sensitivity, based on the total solid content, preferably 5% by mass or more. Is 10% by mass or more, usually 80% by mass or less, preferably 70% by mass or less.

[1-1-15] Solvent The photosensitive resin composition for forming an organic electroluminescent element partition of the present invention usually contains a solvent, and is used in a state where each of the aforementioned components is dissolved or dispersed in the solvent (hereinafter referred to as “the solvent”) And a photosensitive resin composition containing a solvent may be referred to as a “photosensitive resin composition solution”). Although there is no restriction | limiting in particular as the solvent, For example, the organic solvent described below is mentioned.

That is, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-tert-butyl ether, Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethylpentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol , Triethylene glycol Glycol monoalkyl ethers such as nomethyl ether, triethylene glycol monoethyl ether, tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, di Glycol dialkyl ethers such as propylene glycol dimethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl Ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, di Glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, 3-methoxy-1-butyl acetate; ethylene glycol dia Sette Glycol diacetates such as 1,3-butylene glycol diacetate and 1,6-hexanol diacetate; alkyl acetates such as cyclohexanol acetate; amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, Ethers such as diamyl ether, ethyl isobutyl ether, dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone , Ketones such as methyl hexyl ketone, methyl nonyl ketone, methoxymethyl pentanone; methanol, ethanol, pro Mono- or polyhydric alcohols such as diol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethylpentanol, glycerin, benzyl alcohol; n-pentane , N-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, dodecane and other aliphatic hydrocarbons; cyclohexane, methylcyclohexane, methylcyclohexene, bicyclohexyl and other alicyclic hydrocarbons; benzene, toluene, Aromatic hydrocarbons such as xylene and cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutyrate, ethylene Recall acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3- Chain or cyclic esters such as methyl methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate and γ-butyrolactone; 3-methoxypropionic acid, 3-ethoxypropionic acid, etc. Alkoxy carboxylic acids; halogenated hydrocarbons such as butyl chloride and amyl chloride; ether ketones such as methoxymethylpentanone; nitriles such as acetonitrile and benzonitrile: tetrahydrofuran, dimethyl Tetrahydrofuran, tetrahydrofuran and the like, such as dimethoxy tetrahydrofuran.

Commercially available solvents corresponding to the above include mineral spirits, Valsol # 2, Apco # 18 solvent, Apco thinner, Soal Solvent No. 1 and no. 2, Solvesso # 150, Shell TS28, Solvent, Carbitol, Ethylcarbitol, Butylcarbitol, Methylcellosolve, Ethylcellosolve, Ethylcellosolve acetate, Methylcellosolve acetate, Diglyme (all trade names) and the like.

The solvent is capable of dissolving or dispersing each component in the photosensitive resin composition, and is selected according to the method of using the photosensitive resin composition of the present invention. It is preferable to select one having a boiling point in the range of 60 to 280 ° C. under atmospheric pressure (101.25 hPa). More preferred are those having a boiling point of 70 ° C. or higher and 260 ° C. or lower. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

These solvents can be used alone or in combination of two or more. These solvents have a total solid content in the photosensitive resin composition solution of usually 10% by mass or more, preferably 15% by mass or more, more preferably 20% by mass or more, and usually 90% by mass or less, preferably Is preferably used in an amount of 50% by mass or less, more preferably 40% by mass or less, and still more preferably 30% by mass or less. When it is at least the lower limit, a coating film tends to be obtained even for a high film thickness, and when it is at most the upper limit, there is a tendency for appropriate coating uniformity to be obtained.

[1-2] Physical Properties of Photosensitive Resin Composition for Forming Organic Electroluminescent Device Partitions The physical properties of the photosensitive resin composition for forming organic electroluminescent device partitions of the present invention include, for example, acid value. Although the acid value with respect to the total solid content of the photosensitive resin composition for forming an organic electroluminescent element partition is not particularly limited, it is preferably 20 mgKOH / g or more, more preferably 22 mgKOH / g or more, further preferably 24 mgKOH / g or more, 26 mgKOH / g is more preferably 28 mgKOH / g or more, usually 60 mgKOH / g or less, preferably 55 mgKOH / g or less, more preferably 50 mgKOH / g or less, further preferably 40 mgKOH / g or less, 35 mgKOH / g Particularly preferred is g or less. When the amount is not less than the lower limit, the solubility in the developer is high, and the taper angle tends to be large because the unexposed portion can be sufficiently dissolved and removed. Tends to be good.

[1-3] Method for Preparing Photosensitive Resin Composition for Forming Organic Electroluminescent Device Partition The photosensitive resin composition for forming an organic electroluminescent device partition of the present invention is prepared by mixing the above components with a stirrer. Is done. In addition, you may filter using a membrane filter etc. so that the prepared photosensitive resin composition may become uniform.

[2] Partition Wall and Partition Wall Forming Method The photosensitive resin composition of the present invention can be used to form a partition wall, particularly a partition wall for partitioning an organic layer (light emitting part) of an organic electroluminescence device.
The method for forming the partition (bank) using the photosensitive resin composition for forming an organic electroluminescent element partition described above is not particularly limited, and a conventionally known method can be adopted. As a method for forming the partition, for example, a photosensitive resin composition for forming an organic electroluminescent element partition is applied on a substrate to form a photosensitive resin composition layer, and the photosensitive resin composition layer is exposed. And an exposure step. A specific example of such a method for forming the partition wall is a photolithography method.

In the photolithography method, a photosensitive resin composition for forming an organic electroluminescent element partition is applied to the entire surface of a substrate where a partition is formed to form a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate.

In the coating process in which a photosensitive resin composition is applied onto a substrate in a photolithography method, a contact transfer type coating device such as a roll coater, a reverse coater, a bar coater, or a spinner (rotary type) is formed on a substrate on which a partition wall is to be formed. The photosensitive resin composition is applied using a non-contact type coating apparatus such as a coating apparatus or a curtain flow coater, and the solvent is removed by drying as necessary to form a photosensitive resin composition layer.

Next, in the exposure step, using a negative mask, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light, and the photosensitive resin composition layer is partially coated according to the pattern of the partition walls. To expose. For the exposure, a light source that emits ultraviolet rays such as a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. The amount of exposure varies depending on the composition of the photosensitive resin composition, but is preferably about 10 to 400 mJ / cm ² , for example.

Next, in the developing step, the photosensitive resin composition layer exposed according to the pattern of the partition is developed with a developer to form the partition. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Specific examples of the developer include organic ones such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. Can be mentioned. An antifoaming agent or a surfactant can also be added to the developer.

After that, post-baking is applied to the developed partition wall and cured by heating. Post baking is preferably performed at 150 to 250 ° C. for 15 to 60 minutes.

The substrate used for forming the partition wall is not particularly limited, and is appropriately selected according to the type of the organic electroluminescence element manufactured using the substrate on which the partition wall is formed. Suitable materials for the substrate include glass and various resin materials. Specific examples of the resin material include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonates; poly (meth) methacrylic resins; polysulfones; Among these substrate materials, glass and polyimide are preferable because of excellent heat resistance. Moreover, according to the kind of organic electroluminescent element manufactured, you may provide transparent electrode layers, such as ITO and ZnO, in advance on the surface of the board | substrate with which a partition is formed.

[3] Organic electroluminescent device The organic electroluminescent device of the present invention includes a partition composed of the above-described photosensitive resin composition for forming an organic electroluminescent device partition.
Various optical elements are manufactured using a substrate having a partition pattern manufactured by the method described above. The method of forming the organic electroluminescent element is not particularly limited, but preferably, after forming a partition pattern on the substrate by the above method, ink is injected into a region surrounded by the partition on the substrate to form pixels or the like. An organic electroluminescent element is manufactured by forming an organic layer.

Examples of the type of organic electroluminescent element include a bottom emission type and a top emission type.
In the bottom emission type, for example, a partition is formed on a glass substrate on which transparent electrodes are stacked, and a hole transport layer, a light emitting layer, an electron transport layer, and a metal electrode layer are stacked in an opening surrounded by the partition. The On the other hand, in the top emission type, for example, a partition is formed on a glass substrate on which a metal electrode layer is stacked, and an electron transport layer, a light emitting layer, a hole transport layer, and a transparent electrode layer are stacked in an opening surrounded by the partition. Is produced.

Note that examples of the light emitting layer include organic electroluminescent layers as described in Japanese Patent Application Laid-Open No. 2009-146691 and Japanese Patent No. 5734681. Further, quantum dots as described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may be used.

When the taper angle of the partition wall is small and the bottom of the partition wall has a trailing shape as shown in FIG. 1, no light is emitted even if a vapor deposition layer is formed on the upper portion of the partition wall. In addition, when the light emitting layer is manufactured by the ink jet method, the organic layer forming ink is repelled by the skirt portion of the partition wall, so that the region surrounded by the partition wall may not be uniformly covered with the organic layer forming ink. is there. On the other hand, by forming a good shape with a large taper angle and no skirting, it is possible to emit light within the region surrounded by the partition walls, and in the ink jet method, it is more uniform with the ink for forming the organic layer. Can be coated. Thereby, for example, the problem of halation in the organic EL display element can be solved.

As the solvent used when forming the ink for forming the organic layer, water, an organic solvent, and a mixed solvent thereof can be used. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Specific examples of the organic solvent include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, 3-phenoxytoluene, etc. Is mentioned. In addition, a surfactant, an antioxidant, a viscosity modifier, an ultraviolet absorber, and the like can be added to the ink.

As a method for injecting ink into the region surrounded by the partition walls, an ink jet method is preferable because a small amount of ink can be easily injected into a predetermined location. The ink used for forming the organic layer is appropriately selected according to the type of the organic electroluminescent element to be produced. When the ink is injected by an ink jet method, the viscosity of the ink is not particularly limited as long as the ink can be discharged well from the ink jet head, but is preferably 4 to 20 mPa · s, and more preferably 5 to 10 mPa · s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, or the like.

[4] Image display device The image display device of the present invention includes the organic electroluminescence device described above. As long as the organic electroluminescent element is included, the type and structure of the image display device are not particularly limited. For example, the active display organic electroluminescent element can be used for assembly according to a conventional method. For example, the image display device of the present invention is formed by a method as described in “Organic EL Display” (Ohm, published on August 20, 2004, by Shizushi Tokito, Chiba Adachi, and Hideyuki Murata). can do. For example, an organic electroluminescent element that emits white light and a color filter may be combined to display an image, or organic electroluminescent elements having different emission colors such as RGB may be combined to display an image.

[5] Illumination The illumination of the present invention includes the above-described organic electroluminescent element. There is no restriction | limiting in particular about a model or a structure, It can assemble in accordance with a conventional method using the organic electroluminescent element of this invention. The organic electroluminescence element may be a simple matrix driving method or an active matrix driving method.
In order for the illumination of the present invention to emit white light, an organic electroluminescent element that emits white light may be used. In addition, organic electroluminescent elements having different emission colors may be combined so that each color is mixed to become white, or the color mixing ratio can be adjusted to provide a color adjustment function.

Hereinafter, although the specific example is given and demonstrated about the photosensitive resin composition for organic electroluminescent element partition formation of this invention which concerns on a 1st aspect, this invention is the following implementation, unless the summary is exceeded. It is not limited to examples.

[1] Preparation and Evaluation of Photosensitive Resin Composition for Forming Organic Electroluminescent Device Partition Wall Each component is used in a blending ratio (parts by mass) shown in Table 1, and the total solid content is 25% by mass. Thus, using propylene glycol monomethyl ether acetate, each component was stirred until it became uniform, and the photosensitive resin composition for organic electroluminescent element partition formation of an Example and a comparative example was prepared. In addition, the numerical value in Table 1 means the value of solid content.
In addition, the symbol in a table | surface represents the following.

a-1: Dipentaerythritol hexaacrylate (DPHA) (manufactured by Nippon Kayaku Co., Ltd.)
b-1: 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole (manufactured by Hodogaya Chemical Co., Ltd.)
b-2: Irgacure 369 (manufactured by BASF, compound having the following chemical structure)

d-1: Megafax RS-72-K (manufactured by DIC, fluorine-based oligomer having an ethylenic double bond)
e-1: 2-mercaptobenzimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.)
e-2: Pentaerythritol tetrakis (3-mercaptopropionate) (manufactured by Sakai Chemical Co., Ltd.)
f-1: TINUVIN 384-2 (manufactured by BASF, UV absorber)
g-1: KAYAMER PM-21 (Nippon Kayaku Co., Ltd.)

c-1: The following ethylenically unsaturated group-containing alkali-soluble resin (corresponding to epoxy (meth) acrylate resin (c1-1))
100 parts by weight of a bisphenol A type epoxy compound represented by the following formula (epoxy equivalent 186 g / eq, a mixture of n in the formula of 1 to 20), 40 parts by weight of acrylic acid, 0.06 parts by weight of p-methoxyphenol, The reaction vessel was charged with 2.4 parts by mass of triphenylphosphine and 126 parts by mass of propylene glycol monomethyl ether acetate, and stirred at 95 ° C. until the acid value became 5 mgKOH / g or less. Subsequently, 12 parts by mass of propylene glycol monomethyl ether acetate was added to 80 parts by mass of the reaction solution obtained by the above reaction, 4.5 parts by mass of succinic anhydride was added, and the mixture was reacted at 95 ° C. for 3 hours. An alkali-soluble resin (c-1) solution having a polystyrene equivalent weight average molecular weight (Mw) of 8,000 measured by GPC / g was obtained.

c-2: The following acrylic copolymer resin (corresponding to (c2) acrylic copolymer resin)
A copolymer resin having tricyclodecane methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.032 / 0.069 / 0.899) as a constituent monomer is subjected to an addition reaction with an equal amount of acrylic acid and glycidyl methacrylate, and further succinic anhydride is added. An alkali-soluble acrylic copolymer resin (c-2) solution in which an acid is added in a molar ratio of 0.24 to 1 mol of the above copolymer resin. The solvent is propylene glycol monomethyl ether acetate. The weight average molecular weight (Mw) in terms of polystyrene measured by GPC was 4,800, and the solid content acid value was 62.1 mgKOH / g.

c-3: The following acrylic copolymer resin A copolymer resin containing tricyclodecane methacrylate / styrene / glycidyl methacrylate (molar ratio: 0.3 / 0.1 / 0.6) as a constituent monomer and acrylic acid as glycidyl methacrylate An alkali-soluble acrylic copolymer resin (c-3) solution in which tetrahydrophthalic anhydride was further added in an equivalent amount to a molar ratio of 0.39 with respect to 1 mol of the copolymer resin. The solvent is propylene glycol monomethyl ether acetate. The weight average molecular weight (Mw) in terms of polystyrene measured by GPC was 8,400, and the solid content acid value was 81.4 mgKOH / g.

Evaluation of physical properties of the photosensitive resin composition for forming an organic electroluminescent element partition was carried out by the method described below.

(Measurement of acid value)
The acid value can be measured by the method described in JIS K 0070-1992. In addition to directly measuring the photosensitive resin composition, the acid value of the photosensitive resin composition may be calculated from the acid value and content of an acid group-containing component such as a resin.

(Measurement of gas amount)
Each partition wall-forming photosensitive resin composition was applied on a glass substrate using a spinner so as to have a thickness of 1.7 μm after heat curing. Thereafter, it was dried by heating on a hot plate at 95 ° C. for 2 minutes, and the resulting coating film was exposed at an exposure amount of 100 mJ / cm ² without using a mask. At this time, the intensity at a wavelength of 365 nm was 7.5 mW / cm ² . Subsequently, after spray development for 60 seconds with 2.38 mass% TMAH (tetramethylammonium hydroxide) aqueous solution of 24 degreeC, it wash | cleaned for 10 second with the pure water. This substrate was cured by heating at 230 ° C. for 30 minutes in an oven, and a gas amount measurement substrate with a cured product was obtained.

The produced gas amount measurement substrate (40 mm × 8 mm, 4 pieces) was analyzed with GC / MS (manufactured by Agilent Technologies, trade name “5973N”) when the outgas was heated in a heating furnace at 230 ° C. for 20 minutes. The total area of all detected peak components was calculated. However, the calculation was performed excluding the peak corresponding to tetramethylammonium derived from the aqueous solution of TMAH (tetramethylammonium hydroxide). Next, it converted into the amount of toluene using the analytical curve from the sum total of the detected peak area, and remove | divided by the measured board | substrate area, and calculated the outgas amount (ng / cm < ² >) of toluene conversion per unit area. The results are shown in Table 1. The calibration curve was prepared by measuring GC / MS using toluene having a known concentration and plotting the amount of toluene and the peak area value of the detected gas.

(Measurement of contact angle)
Each partition wall-forming photosensitive resin composition was applied on a glass substrate using a spinner so as to have a thickness of 1.7 μm after heat curing. Thereafter, it was dried by heating on a hot plate at 95 ° C. for 2 minutes, and the resulting coating film was exposed at an exposure amount of 100 mJ / cm ² without using a mask. At this time, the intensity at a wavelength of 365 nm was 7.5 mW / cm ² . Subsequently, after spray development for 60 seconds with 2.38 mass% TMAH (tetramethylammonium hydroxide) aqueous solution of 24 degreeC, it wash | cleaned for 10 second with the pure water. This substrate was cured by heating at 230 ° C. for 30 minutes in an oven to obtain a contact angle measurement substrate with a cured product.

The contact angle was measured with a Drop Master 500 contact angle measuring device manufactured by Kyowa Interface Science Co., Ltd. under conditions of 23 ° C. and 50% humidity. 0.7 μL of propylene glycol methyl ether acetate was dropped on the cured product of the substrate for contact angle measurement, and the contact angle after 1 second was measured. The measurement results are shown in Table 1. A larger contact angle represents higher liquid repellency.

[2] Formation and Evaluation of Partition Walls Partition wall formation and performance evaluation were performed by the methods described below.
(Formation of partition walls)
Using a spinner, a photosensitive resin composition for forming each partition wall was applied on the ITO film of a glass substrate having an ITO film formed on the surface so as to have a thickness of 1.7 μm after heat curing. Thereafter, the film was dried by heating on a hot plate at 95 ° C. for 2 minutes. A photomask (a mask having a plurality of covering portions of 80 μm × 280 μm at intervals of 10 μm) was used for the obtained coating film at an exposure gap of 16 μm at a wavelength of 365 nm. Exposure was performed using ultraviolet rays having an intensity of 7.5 mW / cm ² so that the exposure amount was 100 mJ / cm ² . The ultraviolet irradiation at this time was performed under air. Next, the film was spray-developed with a 2.38 mass% TMAH (tetramethylammonium hydroxide) aqueous solution at 24 ° C. for 60 seconds, and then washed with pure water for 1 minute. By these operations, unnecessary portions were removed and the substrate on which the pattern was formed was heat-cured in an oven at 230 ° C. for 30 minutes to form lattice-like partition walls.

(Evaluation of taper angle and line width of partition wall)
A sample for cross-sectional observation was prepared by cutting the above-described grid-like barrier ribs, and the cross-sectional shape of the barrier ribs was observed using a scanning electron microscope (SEM, manufactured by Keyence Corporation), and the taper angle was measured. The measurement results are shown in Table 1. The cross-sectional shape of the partition walls was observed in a substantially trapezoidal shape.
In this sectional view, the boundary surface between the partition wall 1 and the ITO film 2 is S and the height of the partition wall is H as shown in FIG. In the hypotenuse of the partition wall, a tangent line between the hypotenuse and the boundary surface S is defined as T, and an angle formed by the tangent line T and the boundary surface S is measured to obtain a taper angle. The larger the taper angle, the better the developability and the less likely the residue is generated.

(Evaluation of suitability of barrier ribs for inkjet application)
In the substrate having the above-described grid-shaped partition walls, inkjet coating was performed on the pixel portion surrounded by the grid-shaped partition walls using DMP-2831 manufactured by Fuji Film. As the ink, a solvent (isoamyl benzoate) was used alone, application was performed at 80 pL per pixel, and the presence or absence of breakage (a phenomenon in which the ink crosses the partition wall and enters the adjacent pixel portion) was evaluated. The evaluation results are shown in Table 1. The liquid repellency is so high that it does not break.

[Failure evaluation]
◯: Ink could be applied in the pixel, and there was no overflow to the outside of the partition wall.
Δ: A part of the ink climbed on the upper surface of the partition wall, but there was almost no overflow to the outside of the partition wall.
X: Ink overflowed from the inside of the pixel to the entire upper surface of the partition wall and mixed into the adjacent pixel portion. (Breakdown)

(Evaluation of taper angle and line width of partition walls-2)
Using the spinner on the ITO film of the glass substrate having the ITO film formed on the surface, each partition wall forming photosensitive resin composition of Examples 1 and 2 was applied so as to have a thickness of 1.7 μm after heat curing. . Thereafter, the same exposure except that a photomask (a mask having a plurality of covering portions of 80 μm × 280 μm at intervals of 40 μm) was used for the coating film obtained by heating and drying on a hot plate under the same conditions as described above. Then, development and heat curing were performed to form a lattice-like partition wall.

In the same manner as described above, the cross-sectional shape of the partition walls was observed using a scanning electron microscope (SEM, manufactured by Keyence Corporation), and the taper angle and line width were measured. The line width was 40 μm in both Examples 1 and 2. Moreover, when the opening width (horizontal width, vertical width) of the lower part of a partition was measured and the area of the opening part was computed by multiplying them, Example 1 and 2 were 100%. The area of the opening is a relative value with respect to the area of the corresponding mask shielding part. The smaller the taper angle, the larger the line width of the partition wall and the smaller the area of the opening.

From Table 1, the outgas amount of the substrate obtained by using the photosensitive resin composition for forming partition walls containing alkali-soluble resins (c-1) and (c-2) to which succinic acid was added as in Examples 1 to 5 Is significantly less than that of the substrate obtained using the photosensitive resin composition for forming a partition wall containing the alkali-soluble resin (c-3) to which tetrahydrophthalic acid is added as in Comparative Example 1. all right.

From this, the photosensitive resin composition for barrier rib formation containing the alkali-soluble resin added with an acid having a short carbon chain such as succinic acid is more alkali-soluble resin added with an acid having a long carbon chain such as tetrahydrophthalic acid. It was confirmed that the amount of outgas was smaller in the gas measurement conditions of heating at 230 ° C. after the heat curing by post baking at 230 ° C. for 30 minutes than the photosensitive resin composition for forming a partition wall. This is presumably because an acid having a short carbon chain such as succinic acid is decomposed and removed at the time of post-baking, and no acid-derived gas is generated even when heated at 230 ° C. after that.

Further, from Table 1, the photosensitive resin composition containing the chain transfer agent as in Example 5 has a sufficient taper angle compared to the photosensitive resin composition not containing the chain transfer agent as in Comparative Example 2. It turned out to be bigger. By including a chain transfer agent, radical deactivation in the vicinity of the surface due to oxygen inhibition or the like is improved, surface curability is increased, and the taper angle is increased.
It was also found that the contact angle was sufficiently large so that the ink can be applied without breaking even in the ink jet application. By including the chain transfer agent, it is considered that the outflow of the liquid repellent could be suppressed by increasing the surface curability and the liquid repellent could be fixed near the surface.

Further, from the comparison of Examples 2 to 4, when the taper angle is larger even if the contact angle is the same, the force (surface energy) for the ink to spread out of the partition wall on the side surface of the partition wall becomes small, and the fine line It was also found that the hardened partition walls also had higher surface curability at the upper part of the partition walls, and the liquid repellent could be fixed near the surface, resulting in better ink jet coating suitability.

From the comparison of Examples 1 and 2, since (c2) the acrylic (co) acrylic resin, (c1) epoxy (meth) acrylate resin is less likely to penetrate the alkali developer, Example 2 is more preferable than Example 1. It is thought that the taper angle has increased.

Hereinafter, the photosensitive resin composition for forming an organic electroluminescent element partition wall of the present invention according to the second embodiment will be described with reference to specific experimental examples. It is not limited to examples.

[I] Preparation of Photosensitive Resin Composition for Forming Partition Wall Propylene glycol monomethyl ether was used so that each component was used in the blending ratio (parts by mass) shown in Table 2 and the total solid content was 25% by mass. Each component was stirred until it became uniform using acetate, and the photosensitive resin composition for partition formation of an experiment example and a comparative experiment example was prepared.
In addition, the symbol in a table | surface represents the following.

a-11: Mixture of the following ethylenically unsaturated compounds [(A1) ethylenically unsaturated compound having an acid group and (A2) ethylenically unsaturated compound having no acid group]
In the presence of 490 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value 113 mg KOH / g), 148 parts by mass of phthalic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone at 100 ° C. And a mixture a-11 containing pentaerythritol triacrylate modified with phthalic anhydride and pentaerythritol tetraacrylate shown in the following at 70:30 (mass ratio) was obtained.

a-12: Mixture of the following ethylenically unsaturated compounds [(A1) ethylenically unsaturated compound having an acid group and (A2) ethylenically unsaturated compound having no acid group]
In the presence of 561 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value 100 mg KOH / g), 100 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone, 100 ° C. And a mixture a-12 containing succinic anhydride-modified pentaerythritol triacrylate and pentaerythritol tetraacrylate shown below at 60:40 (mass ratio) was obtained.

a-13: Mixture of the following ethylenically unsaturated compounds [(A1) ethylenically unsaturated compound having an acid group and (A2) ethylenically unsaturated compound having no acid group]
Existence of 1,000 parts by mass of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (hydroxyl value 51 mg KOH / g), 49 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone A mixture containing succinic anhydride-modified dipentaerythritol pentaacrylate, dipentaerythritol pentaacrylate, and dipentaerythritol hexaacrylate shown below at 25:25:50 (mass ratio). a-13 was obtained.

A-14: Pentaerythritol tetraacrylate (PE-4A) (manufactured by Kyoeisha Chemical Co., Ltd.)

B-1: 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole (Hodogaya Chemical Co., Ltd.)

c-4: The following ethylenically unsaturated group-containing resin (epoxy acrylate resin)
100 parts by weight of a bisphenol A type epoxy compound represented by the following formula (epoxy equivalent 186 g / eq, a mixture of n in the formula of 1 to 20), 40 parts by weight of acrylic acid, 0.06 parts by weight of p-methoxyphenol, The reaction vessel was charged with 2.4 parts by mass of triphenylphosphine and 126 parts by mass of propylene glycol monomethyl ether acetate, and stirred at 95 ° C. until the acid value became 5 mgKOH / g or less. Next, 3 parts by mass of propylene glycol monomethyl ether acetate was added to 80 parts by mass of the reaction solution obtained by the above reaction, 3 parts by mass of succinic anhydride was added, and the mixture was reacted at 95 ° C. for 3 hours to obtain a solid content acid value of 40 mg KOH / g. Then, an alkali-soluble resin (c-4) solution having a polystyrene-reduced weight average molecular weight (Mw) of 8,000 measured by GPC was obtained.

[II] Formation of cured product and partition and evaluation thereof The following is a description of a method for evaluating the performance of each photosensitive resin composition.

(Preparation of substrate for contact angle measurement)
Using a spinner on the ITO film of the glass substrate on which the ITO film is formed on the surface, the substrate coated with the photosensitive resin composition for forming each partition so as to have a thickness of 1.5 μm after heat curing is used for forming the partition. Ten sheets were prepared for each photosensitive resin composition. Then heated and dried for 2 minutes on a hot plate at 100 ° C., the resulting coating film without using a mask, the exposure amount for each substrate instead of 50 mJ / cm ² every range of 50 ~ 500 mJ / cm ² Exposed. At this time, the intensity at a wavelength of 365 nm was 40 mW / cm ² . Subsequently, after spray development for 60 seconds with 2.38 mass% TMAH (tetramethylammonium hydroxide) aqueous solution of 24 degreeC, it wash | cleaned for 10 second with the pure water. This substrate was cured by heating at 230 ° C. for 30 minutes in an oven to obtain a contact angle measurement substrate on which a cured product was formed.

(Evaluation of contact angle)
Since the curability varies depending on the sensitivity of the composition, the exposure amount at which liquid repellency occurs varies depending on the composition. Here, the exposure amount at which the liquid repellency is generated represents an exposure amount at which the contact angle of the obtained cured product is 10 degrees or more. The contact angle with respect to propylene glycol monomethyl ether acetate was measured using the above-mentioned contact angle measurement substrate, and a substrate having a contact angle of 10 degrees or more was specified. Table 2 shows the minimum exposure value among the exposure doses during the production of these substrates. The contact angle was measured with a Drop Master 500 contact angle measuring device manufactured by Kyowa Interface Science Co., Ltd. under conditions of 23 ° C. and 50% humidity.

(Production of partition walls)
Using a spinner, a photosensitive resin composition for forming each partition wall was applied on the ITO film of a glass substrate having an ITO film formed on the surface so as to have a thickness of 1.5 μm after heat curing. Thereafter, it was dried by heating on a hot plate at 100 ° C. for 2 minutes. The obtained coating film was exposed using a photomask. The exposure amount was the minimum exposure amount that caused liquid repellency, and the exposure gap was 16 μm. As the photomask, a mask having a lattice-like opening (a mask having a plurality of covering portions of 80 μm × 280 μm at intervals of 40 μm) was used. Next, in the same manner as in the production of the contact angle measurement substrate, development was performed with a TMAH aqueous solution, followed by heat curing to obtain a lattice-like partition wall.

(Inkjet application suitability evaluation)
In the substrate having the lattice-like partition walls described above, inkjet coating was applied to the light emitting portion (pixel portion) surrounded by the grid-like partition walls using DMP-2831 manufactured by Fuji Film. As the ink, a solvent (isoamyl benzoate) was used alone and applied at 40 pL per pixel portion to evaluate the wettability. As the entire area of the pixel portion gets wet and spreads, there are fewer residues at the time of manufacturing the partition walls, and the developability is better.

◯: Ink spread throughout the pixel area.
X: A part where the ink did not spread partially occurred in the pixel portion.

(Production of gas quantity measurement substrate)
Using a spinner, each partition wall-forming photosensitive resin composition was applied to a thickness of 1.5 μm after heat curing on the ITO film of a glass substrate having an ITO film formed on the surface. Thereafter, the film was heated and dried on a hot plate at 100 ° C. for 2 minutes, and the obtained coating film was exposed without using a mask at the minimum exposure amount at which the liquid repellency described above was generated. At this time, the intensity at a wavelength of 365 nm was 40 mW / cm ² . Next, as with the contact angle measurement substrate preparation, development was performed with a TMAH aqueous solution, followed by heat curing in an oven at 230 ° C. for 30 minutes to obtain a gas amount measurement substrate on which a cured product was formed.

(Measurement of gas amount)
Analyze the outgas amount when the produced gas amount measurement substrate (40 mm × 8 mm, 4 pieces) is heated in a heating furnace at 230 ° C. for 20 minutes with GC / MS (manufactured by Agilent Technologies, trade name “5973N”). The total area of all detected peak components was calculated. Next, it converted into the amount of toluene using the analytical curve from the sum total of the detected peak area, and remove | divided by the measured board | substrate area, and calculated the outgas amount (ng / cm < ² >) of toluene conversion per unit area. The calibration curve was prepared by measuring GC / MS using toluene having a known concentration, and plotting the amount of toluene and the peak area value of the detected gas.

From Table 2, the partition walls obtained from the photosensitive resin composition of each experimental example containing an ethylenically unsaturated compound having an acid group in a specific ratio have good ink jet coating suitability and a low outgas amount. It was. This is because, by using an ethylenically unsaturated compound having an acid group with excellent solubility, the occurrence of residue in the pixel portion is suppressed and the ink jet characteristics are improved, and the amount of the acid group is reduced to a specific amount or less. This is considered to be because the outgas generation derived from the origin was suppressed.

On the other hand, the partition walls obtained from the photosensitive resin composition of Comparative Experimental Example 1 containing a large amount of an ethylenically unsaturated compound having an acid group have good outgassing suitability but a large amount of outgas. This is thought to be because the amount of outgas derived was large. Further, the partition walls obtained from the photosensitive resin composition of Comparative Experimental Example 2 that does not contain an ethylenically unsaturated compound having an acid group are not sufficiently suitable for ink jet coating, and this is because a residue is generated in the pixel portion. it is conceivable that.
Regarding ink jet application suitability, whether or not the ink spreads throughout the pixel portion depends on whether or not the liquid repellency derived from the residue is generated in the pixel portion. Therefore, even when a solvent other than isoamyl benzoate is used, it is considered that the same results as in the above experimental examples and comparative experimental examples can be obtained.

Although the present invention has been described in detail using specific embodiments, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the invention. This application is based on a Japanese patent application filed on September 5, 2016 (Japanese Patent Application No. 2016-172875) and a Japanese patent application filed on February 17, 2017 (Japanese Patent Application No. 2017-028181). , Which is incorporated by reference in its entirety.

1: partition wall 2: ITO film 3: glass substrate T: tangent line with oblique side in contact with boundary surface H: height of partition wall S: boundary surface between partition wall and ITO film

Claims

A photosensitive resin composition for forming an organic electroluminescent element partition comprising (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin,
The (C) alkali-soluble resin contains an alkali-soluble resin (c) having a partial structure represented by the following general formula (1),
Furthermore, (E) the photosensitive resin composition for organic electroluminescent element partition formation characterized by containing a chain transfer agent.

(In formula (1), R 1 represents an optionally substituted divalent hydrocarbon group having 1 to 4 carbon atoms. * Represents a bond.)
The photosensitive resin composition for forming an organic electroluminescent element partition according to claim 1, wherein the alkali-soluble resin (c) is a resin having an ethylenically unsaturated group.
The photosensitive resin composition for forming an organic electroluminescent element partition according to claim 1 or 2, wherein the alkali-soluble resin (c) contains (c1) an epoxy (meth) acrylate resin.
The (c1) epoxy (meth) acrylate resin is an epoxy (meth) acrylate resin containing a repeating unit structure represented by the following formula (i), and an epoxy (meth) containing a partial structure represented by the following formula (ii) The photosensitive material for organic electroluminescent element partition formation of Claim 3 containing at least 1 sort (s) chosen from the group which consists of an acrylate resin and the epoxy (meth) acrylate resin containing the partial structure represented by following formula (iii). Resin composition.

(In formula (i), R a represents a hydrogen atom or a methyl group, and R b represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) (It may be substituted with any substituent. * Represents a bond.)

(In formula (ii), each R c independently represents a hydrogen atom or a methyl group. R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * Represents a bond. .)

(In the formula (iii), R e represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or an optionally substituted 2 Represents a valent cyclic hydrocarbon group, and the benzene ring in formula (iii) may be further substituted with an arbitrary substituent. * Represents a bond.)
The (c1) epoxy (meth) acrylate resin is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond to an epoxy resin and further adding a polybasic acid or an anhydride thereof. 5. The photosensitive resin composition for forming an organic electroluminescent element partition according to 4.
6. The photosensitive resin composition for forming an organic electroluminescent element partition according to any one of claims 1 to 5, further comprising (D) a liquid repellent.
The photosensitive resin composition for forming an organic electroluminescent element partition according to claim 6, wherein the liquid repellent (D) contains a liquid repellent having a crosslinking group.
The photosensitive resin composition for forming an organic electroluminescent element partition according to any one of claims 1 to 7, further comprising an ultraviolet absorber.
The organic electroluminescent element partition wall forming according to any one of claims 1 to 8, wherein an acid value of the organic electroluminescent element partition wall forming photosensitive resin composition is 20 mgKOH / g or more based on a total solid content. Photosensitive resin composition.
A partition comprising the photosensitive resin composition for forming an organic electroluminescent element partition according to any one of claims 1 to 9.
An organic electroluminescent device comprising the partition wall according to claim 10.
An image display device comprising the organic electroluminescent element according to claim 11.
Lighting including the organic electroluminescent element according to claim 11.