JP7236209B2 - Photosensitive resin composition for forming partition, partition, organic electroluminescence device, image display device and lighting - Google Patents

Description

TECHNICAL FIELD The present invention relates to a partition-forming photosensitive resin composition used for forming partitions for partitioning a light-emitting portion, and particularly to a partition formed of the partition-forming photosensitive resin composition and an organic polymer comprising the partition. The present invention relates to an electroluminescent device, an image display device including the organic electroluminescent device, and lighting.

Conventionally, organic electroluminescence elements included in organic electric field displays and organic electric field lighting have been formed by forming partitions (banks) on a substrate and then laminating various functional layers in the region surrounded by the partitions. It is manufactured by forming a light emitting part. As a method for easily forming such partition walls, a method of forming them by a photolithography method using a photosensitive resin composition is known (see Patent Document 1).

In addition, as a method of laminating various functional layers in the region surrounded by the partition walls, first, an ink containing the materials constituting the functional layers is prepared, and then the prepared ink is injected into the region surrounded by the partition walls. It is known how to Among these methods, the inkjet method is often adopted because it is easy to accurately inject a predetermined amount of ink into a predetermined location.

Furthermore, when the functional layer is formed using ink, ink repellency is added to the partition walls for the purpose of preventing the ink from adhering to the partition walls and preventing the inks injected between adjacent regions from being mixed with each other. may be required to provide.
In recent years, partition walls are required to have various properties other than ink repellency, and various photosensitive resin compositions have been developed. For example, Patent Document 2 describes that by using a specific alkali-soluble resin, a specific liquid-repellent agent, and a specific surfactant, there is no disconnection of electrodes, and high-resolution images can be produced.
On the other hand, Patent Document 3 describes that in a method for manufacturing a substrate with black resin partitions for an electronic paper display, a desired tapered shape can be obtained by setting the development time within a predetermined range. there is

JP 2010-262940 A JP 2011-165396 A JP 2010-237327 A

In recent years, in order to improve the driving life of the device, there is a demand for reducing the outgassing generated from the partition wall and the partition wall when the device emits light after the device is formed.
As a result of studies by the present inventors, it was difficult to achieve both reduction in outgassing and suitability for inkjet application with the photosensitive resin composition for forming partition walls described in Patent Document 2. In addition, the photosensitive resin composition described in Patent Document 3 is for forming partition walls of a reflective display device such as an electronic paper display, and is used for forming partition walls for partitioning the light emitting portion of the organic electroluminescence element. It was unclear what kind of characteristics would be produced when applied as a flexible resin composition.
Accordingly, the present invention provides a photosensitive resin composition for forming partition walls for partitioning a light-emitting portion, which has a small amount of outgas during operation of the light-emitting element, high reliability, little residue, and good coatability in the inkjet method. intended to provide
Another object of the present invention is to provide a barrier rib formed using the barrier rib-forming photosensitive resin composition, an organic electroluminescence device comprising the barrier rib, an image display device including the organic electroluminescence device, and an illumination device. and

As a result of intensive studies by the present inventors, they have found that the above problems can be solved by containing a predetermined amount of a specific compound as the ethylenically unsaturated compound, and have completed the present invention.
That is, the gist of the present invention is as follows.

[1] A photosensitive resin composition for forming partition walls for partitioning a light emitting portion, comprising (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin,
The (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the content of the (A1) ethylenically unsaturated compound having an acid group is 30% by mass in the total solid content. The following photosensitive resin composition for forming partition walls.
[2] The photosensitive resin composition for forming partition walls according to [1], wherein the (A) ethylenically unsaturated compound further contains (A2) an ethylenically unsaturated compound having no acid group.
[3] The partition wall formation according to [1] or [2], wherein the content of (A1) the ethylenically unsaturated compound having an acid group is 50% by mass or less in the (A) ethylenically unsaturated compound. Photosensitive resin composition for
[4] The photosensitive resin composition for forming partition walls according to any one of [1] to [3], further comprising (D) a liquid-repellent agent.

[5] The photosensitive resin composition for forming partition walls according to any one of [1] to [4], further comprising a chain transfer agent.
[6] The photosensitive resin composition for forming partition walls according to any one of [1] to [5], which further contains an ultraviolet absorber.
[7] A partition made of the partition-forming photosensitive resin composition according to any one of [1] to [6].
[8] An organic electroluminescence device comprising the partition according to [7].
[9] An image display device comprising the organic electroluminescence device according to [8].
[10] Lighting including the organic electroluminescence device according to [8].

INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a photosensitive resin composition for forming partition walls, which has a small amount of outgas during operation of a light-emitting element, is highly reliable, leaves little residue, and exhibits good applicability in an inkjet method.

The present invention will be described in detail below. It should be noted that the following description is an example of the embodiment of the present invention, and the present invention is not specified as long as it does not exceed the gist thereof.
In the present invention, "(meth)acrylic" means "acrylic and/or methacrylic", and "(meth)acrylate" means "acrylate and/or methacrylate". Moreover, "total solid content" shall mean all components other than the solvent in the photosensitive resin composition. Furthermore, in the present invention, a numerical range represented by "-" means a range including the numerical values before and after "-" as lower and upper limits.
Further, in the present invention, the term "(co)polymer" means including both a single polymer (homopolymer) and a copolymer (copolymer), and "(acid) anhydride", "(anhydrous)...acid" is meant to include both acids and their anhydrides. In the present invention, "polybasic acid (anhydride)" means "polybasic acid and/or polybasic acid anhydride".
In the present invention, the weight average molecular weight refers to the polystyrene equivalent weight average molecular weight (Mw) by GPC (gel permeation chromatography).

In the present invention, a partition wall material means a bank material, a wall material, and a wall material, and similarly, a partition wall means a bank, a wall, and a wall.
In the present invention, the light-emitting portion means a portion that emits light when electrical energy is applied.
In the present invention, "mass" is synonymous with "weight". In the present invention, * in the chemical formula represents a bond.

[1] Partition-forming photosensitive resin composition for partitioning light-emitting portions The partition-forming photosensitive resin composition of the present invention comprises (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator and (C) ) A partition-forming photosensitive resin composition for partitioning the light-emitting portion containing an alkali-soluble resin, wherein the (A) ethylenically unsaturated compound is (A1) an ethylenically unsaturated compound having an acid group; The content of the (A1) ethylenically unsaturated compound having an acid group is 30% by mass or less in the total solid content. If necessary, it may further contain other components such as (D) a liquid repellent agent, a chain transfer agent, and an ultraviolet absorber.

In the present invention, the partition walls include, for example, partition walls for partitioning the functional layers (organic layer, light-emitting portion) in the active drive type organic electroluminescent device, and the partitioned regions (pixel regions) constitute the functional layers. By ejecting and drying the ink, which is the material for the layer, it can be used to form pixels and the like composed of the functional layer and the partition wall.

[1-1] Components and Composition of Photosensitive Resin Composition for Forming Barrier Ribs Components constituting the photosensitive resin composition for forming barrier ribs of the present invention and their compositions will be described.
The photosensitive resin composition for forming partition walls of the present invention (hereinafter sometimes simply referred to as "photosensitive resin composition") comprises (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator and (C) an alkali. It contains a soluble resin and usually also a solvent. In addition, the photosensitive resin composition for forming partition walls of the present invention is preferably used for forming liquid-repellent partition walls, and from such a viewpoint, it preferably contains (D) a liquid-repellent agent. As components A) to (C), those exhibiting an action as a liquid-repellent agent may be used.

[1-1-1] Component (A): Ethylenically Unsaturated Compound The photosensitive resin composition for forming partition walls of the present invention contains (A) an ethylenically unsaturated compound. (A) Inclusion of the ethylenically unsaturated compound is considered to result in high sensitivity.

<(A1) Ethylenically unsaturated compound having an acid group>
The (A) ethylenically unsaturated compound in the present invention contains (A1) an ethylenically unsaturated compound having an acid group, and the content of the (A1) ethylenically unsaturated compound having an acid group is in the total solid content It is 30% by mass or less. By containing (A1) an ethylenically unsaturated compound having an acid group in this way, the compound has excellent solubility in a developer, thereby suppressing the generation of residues in the pixel portion (light-emitting portion) and improving the inkjet coating properties. This is considered to be an improvement. Furthermore, by setting the content ratio of the compound to be equal to or less than the above upper limit, the generation of outgassing derived from the acid groups contained in the compound is reduced, and the amount of outgassing generated from the partition walls after formation can be made practically sufficient. Conceivable.

An ethylenically unsaturated compound means a compound having one or more ethylenically unsaturated bonds in the molecule. (A1) The number of ethylenically unsaturated bonds in one molecule of the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 1 or more. From the viewpoint of being able to expand the difference in developer solubility in the exposed area, the number is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and 5 or more. It is particularly preferable to have one, and usually 15 or less, preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less. By setting it to the lower limit or more, the polymerizability is improved and the sensitivity becomes high, and as the curability increases, the amount of outgas tends to decrease. Tend.

Further, the number of acid groups in one molecule of the ethylenically unsaturated compound (A1) having an acid group is not particularly limited as long as it is 1 or more, but from the viewpoint of curability, it is preferably 4 or less, and 2 The following are more preferred, and one is even more preferred. When the content is equal to or less than the above upper limit, there is a tendency for the residual film rate to increase.

In addition, although the type of acid group possessed by the ethylenically unsaturated compound having an acid group (A1) is not particularly limited, examples include a carboxyl group, a phosphoric acid group, a sulfone group, etc. From the viewpoint of developability, a carboxyl group is preferred. . When it has two or more acid groups, the acid groups may be the same or different.

(A1) The molecular weight of the ethylenically unsaturated compound having an acid group is not particularly limited, but is preferably 100 or more, more preferably 200 or more, still more preferably 300 or more, particularly preferably 350 or more, and 1,000 or less. It is preferably 800 or less, more preferably 700 or less. When it is equal to or higher than the lower limit, the residual film rate tends to increase, and when it is equal to or lower than the upper limit, the residue tends to be reduced.

Although the chemical structure of the ethylenically unsaturated compound (A1) having an acid group is not particularly limited, it is preferably a compound represented by the following general formula (I) from the viewpoint of developability.

In formula (I), R ¹ represents a hydrogen atom or a methyl group. R ² , R ³ , R ⁵ and R ⁶ each independently represent an optionally substituted alkylene group.
R ⁴ represents an n+1-valent linking group.
R ⁷ represents an optionally substituted alkylene group, an optionally substituted alkenylene group or an optionally substituted divalent aromatic ring group.
l and m each independently represent an integer of 0 to 12;
n represents an integer of 1 or more.

( ^R2 , ^R3 , ^R5 and ^R6 )
In general formula (I), R ² , R ³ , R ⁵ and R ⁶ each independently represent an optionally substituted alkylene group.
Alkylene groups may be linear, branched, cyclic, or combinations thereof. Although the number of carbon atoms is not particularly limited, it is usually 1 or more, and usually 4 or less, preferably 2 or less. When the content is equal to or less than the above upper limit, there is a tendency that the residual film rate is improved.

Specific examples of the alkylene group include methylene group, ethylene group, propylene group, butylene group, cyclohexylene group, etc. From the viewpoint of curability, methylene group or ethylene group is preferable, and methylene is more preferable.

Examples of the substituent that the alkylene group may have include an alkoxy group, a halogen atom (-F, -Cl, -Br, -I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

( ^R4 )
In the general formula (I), R ⁴ represents an n+1-valent linking group. Although the chemical structure of the n+1-valent linking group is not particularly limited, examples thereof include an optionally substituted n+1-valent hydrocarbon group. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and is preferably an aliphatic hydrocarbon group from the viewpoint of developability. Further, a carbon-carbon single bond in the hydrocarbon group may be interrupted by at least one selected from the group consisting of -O-, -CO- and -NH-.

Specific examples of the n+1-valent linking group include the following.

( ^R7 )
In the general formula (I), an optionally substituted alkylene group, an optionally substituted alkenylene group or an optionally substituted divalent aromatic ring group .

The alkylene group for ^R7 may be linear, branched, cyclic, or a combination thereof. Although the number of carbon atoms is not particularly limited, it is usually 1 or more, preferably 2 or more, and usually 8 or less, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less. When the content is equal to or higher than the lower limit, there is a tendency for the residual film rate to improve, and when the content is equal to or lower than the upper limit, there is a tendency for residue to decrease and outgassing to decrease.

Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a hexylene group, a cyclohexylene group, etc. From the viewpoint of developability, a methylene group or an ethylene group is preferred, and an ethylene group is more preferred.

Examples of the substituent that the alkylene group may have include an alkoxy group, a halogen atom (-F, -Cl, -Br, -I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

The alkenylene group at ^R7 may be linear, branched, cyclic, or a combination thereof. Although the number of carbon atoms is not particularly limited, it is usually 2 or more, preferably 4 or more, and usually 8 or less, preferably 6 or less. When the concentration is equal to or higher than the lower limit, the residual film ratio tends to be improved, and when the concentration is equal to or lower than the upper limit, the amount of residue tends to be reduced.

Specific examples of the alkenylene group include an ethenylene group, a propenylene group, a butyleneylene group, a cyclohexenylene group, and the like. From the viewpoint of developability and curability, an ethenylene group or a cyclohexenylene group is preferred, and an ethenylene group is more preferred.

Examples of the substituent that the alkenylene group may have include an alkoxy group, a halogen atom (-F, -Cl, -Br, -I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

The divalent aromatic ring group for R ⁷ includes a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, preferably 40 or less, more preferably 30 or less, further preferably 20 or less, even more preferably 15 or less, and 10 or less. Especially preferred. When the concentration is equal to or higher than the lower limit, the residual film ratio tends to be improved, and when the concentration is equal to or lower than the upper limit, the amount of residue tends to be reduced.

The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. The divalent aromatic hydrocarbon ring group includes, for example, benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, tetracene ring, pyrene ring, benzpyrene ring, chrysene ring having two free valences, Groups such as triphenylene ring, acenaphthene ring, fluoranthene ring, and fluorene ring can be mentioned. In addition, the aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of divalent aromatic heterocyclic groups include furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, oxadiazole ring, and indole ring having two free valences. ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, groups such as pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, shinoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolinone ring and azulene ring; . Among these, from the viewpoint of curability, a benzene or naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

Examples of substituents that the divalent aromatic ring group may have include alkyl groups, alkoxy groups, halogen atoms (-F, -Cl, -Br, -I), hydroxy groups, carboxyl groups, and the like. . Among these, unsubstituted is preferred from the viewpoint of curability.

Among these, from the viewpoint of ensuring developability and reducing the amount of outgassing, R ⁷ is preferably an optionally substituted alkylene group, more preferably an unsubstituted alkylene group, and an ethylene group. is more preferred.

(l and m)
In the general formula (I), l and m each independently represent an integer of 0-12. From the viewpoint of developability, it is preferably 1 or more, more preferably 2 or more, and from the viewpoint of curability, it is preferably 8 or less, more preferably 6 or less, and 4 or less. is more preferred, and 2 or less is particularly preferred. On the other hand, it is preferably 0 from the viewpoint of outgassing.

(n)
In the general formula (I), n represents an integer of 1 or more. n is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, particularly preferably 5 or more, and preferably 6 or less. When the content is equal to or higher than the lower limit, the residual film ratio tends to increase, and the amount of outgas tends to decrease as the curability increases.

Further, (A1) examples of the ethylenically unsaturated compound having an acid group include polyvalent hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds, and unsaturated carboxylic acids and polybasic carboxylic acids. Examples include esters obtained by esterification reaction, not necessarily single substances, but typical examples include condensates of acrylic acid, phthalic acid and pentaerythritol, acrylic acid, succinic acid and pentaerythritol. and condensates of acrylic acid, succinic acid and dipentaerythritol.

In the photosensitive resin composition for forming partition walls of the present invention, the content of (A1) the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 30% by mass or less in the total solid content, but is 27% by mass or less. is preferable, 25% by mass or less is more preferable, 22% by mass or less is more preferable, 20% by mass or less is even more preferable, 15% by mass or less is particularly preferable, and 1% by mass or more is preferable, and 5% by mass or more is More preferably, 10% by mass or more is even more preferable. When the content is equal to or less than the upper limit, outgassing tends to be reduced, and when the content is equal to or greater than the lower limit, the suitability for inkjet application tends to be improved.

In addition, the content of (A1) the ethylenically unsaturated compound having an acid group in (A) the ethylenically unsaturated compound is not particularly limited, but is preferably 50% by mass or less, more preferably 45% by mass or less, and 40% by mass. % or less is more preferable, 35 mass % or less is more preferable, 30 mass % or less is particularly preferable, 1 mass % or more is preferable, 10 mass % or more is more preferable, and 25 mass % or more is even more preferable. When the content is equal to or less than the upper limit, outgassing tends to be reduced, and when the content is equal to or greater than the lower limit, the suitability for inkjet application tends to be improved.

<(A2) Ethylenically unsaturated compound having no acid group>
The (A) ethylenically unsaturated compound in the present invention may contain (A2) an ethylenically unsaturated compound having no acid group in addition to (A1) the ethylenically unsaturated compound having an acid group. (A2) Ethylenically unsaturated compounds having no acid group refer to (A) ethylenically unsaturated compounds other than (A1) ethylenically unsaturated compounds having an acid group. (A2) Containing an ethylenically unsaturated compound having no acid group tends to improve curability, reduce the minimum exposure required for liquid repellency, and reduce the amount of outgassing. There is

(A2) The number of ethylenically unsaturated bonds in one molecule of the ethylenically unsaturated compound having no acid group is not particularly limited as long as it is 1 or more. From the viewpoint of being able to expand the difference in developer solubility between the non-exposed area and the like, it is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and 5 more preferably 6 or more, and usually 15 or less, preferably 12 or less, more preferably 10 or less, and 8 or less. is more preferred. By setting it to the lower limit or more, the polymerizability is improved and the sensitivity becomes high, and as the curability increases, the amount of outgas tends to decrease. Tend.

(A2) The molecular weight of the ethylenically unsaturated compound having no acid group is not particularly limited, but is preferably 200 or more, more preferably 250 or more, still more preferably 300 or more, and preferably 1,000 or less, and 800 or less. is more preferable, and 600 or less is even more preferable. When the concentration is equal to or higher than the lower limit, the residual film ratio tends to increase, and when the concentration is equal to or lower than the upper limit, the amount of residue tends to decrease.

(A2) The ethylenically unsaturated compound having no acid group is polymerizable, crosslinkable, and can enlarge the difference in developer solubility between the exposed area and the non-exposed area. A compound having an oxy group, that is, a (meth)acrylate compound is preferred.
(A2) Specific examples of ethylenically unsaturated compounds having no acid group include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; and esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids. be done.

Esters of the aliphatic polyhydroxy compounds and unsaturated carboxylic acids include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, Acrylic acid esters of aliphatic polyhydroxy compounds such as pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate, and methacrylic acid esters obtained by replacing the acrylates of these exemplary compounds with methacrylates Similarly, itaconate instead of itaconate, crotonate instead of clonate, maleate instead of maleate, and the like.

Esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcin diacrylate, resorcin dimethacrylate, and pyrogallol triacrylate. etc.

In addition, urethane (meth)acrylates such as obtained by reacting a polyisocyanate compound and a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; polyepoxy compounds and epoxy acrylates such as addition reaction products with hydroxy (meth) acrylate or (meth) acrylic acid; acrylamides such as ethylenebisacrylamide; allyl esters such as diallyl phthalate; vinyl group-containing compounds such as divinyl phthalate, etc. is useful.
Examples of the urethane (meth)acrylates include, for example, DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U -10PA, U-33H, UA-53H, UA-32P, UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), UV-1700B , UV-7600B, UV-7605B, UV-7630B, UV7640B (manufactured by Nippon Synthetic Chemical Co., Ltd.) and the like.

Among these, from the viewpoint of curability, it is preferable to use ester (meth)acrylates or urethane (meth)acrylates as the ethylenically unsaturated compound (A2) having no acid group, and dipentaerythritol hexa(meth) More preferably, acrylates, dipentaerythritol penta(meth)acrylate, pentaerythritol tetra(meth)acrylate, and pentaerythritol tri(meth)acrylate are used.
These may be used individually by 1 type, and may use 2 or more types together.

In the photosensitive resin composition for forming partition walls of the present invention, the content of (A2) the ethylenically unsaturated compound having no acid group is not particularly limited, but is preferably 50% by mass or less, more preferably 45% by mass, based on the total solid content. % or less, more preferably 40 mass % or less, preferably 20 mass % or more, more preferably 25 mass % or more, still more preferably 30 mass % or more, and even more preferably 35 mass % or more. When the content is equal to or less than the upper limit, there is a tendency for the ink-jet applicability to be improved, and when the content is equal to or more than the above lower limit, outgassing tends to be reduced.

Further, the content of (A2) the ethylenically unsaturated compound having no acid group in the (A) ethylenically unsaturated compound is not particularly limited, but is preferably 90% by mass or less, more preferably 80% by mass or less, More preferably 75% by mass or less, more preferably 50% by mass or more, more preferably 55% by mass or more, even more preferably 60% by mass or more, even more preferably 65% by mass or more, and particularly preferably 70% by mass or more. When the content is equal to or less than the upper limit, there is a tendency that the ink-jet applicability is improved, and when it is equal to or more than the above lower limit, outgassing tends to be reduced.

[1-1-2] Component (B): Photopolymerization Initiator The photosensitive resin composition for forming partition walls of the present invention contains (B) a photopolymerization initiator. (B) the photopolymerization initiator is not particularly limited as long as it is a compound that polymerizes the ethylenically unsaturated bond of the (A) ethylenically unsaturated compound by actinic rays, and a known photopolymerization initiator can be used.

In the photosensitive resin composition of the present invention, a photopolymerization initiator commonly used in this field can be used as (B) the photopolymerization initiator. Examples of such photopolymerization initiators include hexaarylbiimidazole-based photopolymerization initiators, acylphosphine oxide-based photopolymerization initiators, oxime-based photopolymerization initiators, acetophenone-based photopolymerization initiators, and benzophenone-based photopolymerization initiators. hydroxybenzene-based photopolymerization initiator, thioxanthone-based photopolymerization initiator, anthraquinone-based photopolymerization initiator, ketal-based photopolymerization initiator, titanocene-based photopolymerization initiator, halogenated hydrocarbon derivative-based photopolymerization initiator, organic Borate-based photopolymerization initiator, onium salt-based photopolymerization initiator, sulfone compound-based photopolymerization initiator, carbamic acid derivative-based photopolymerization initiator, sulfonamide-based photopolymerization initiator, triarylmethanol-based photopolymerization initiator are mentioned.

The hexaarylbiimidazole-based photopolymerization initiator is represented by the following general formula (1-1) and/or the following general formula (1-2) from the viewpoint of absorbance and sensitivity, and matching with the absorption wavelength of the ultraviolet absorber. The represented hexaarylbiimidazole-based optical compounds are preferred.

In the above formula, R ¹¹ to R ¹³ each independently represent an optionally substituted alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms which may have a substituent, or halogen. represents an atom, and m, n and l each independently represents an integer of 0 to 5;

The number of carbon atoms in the alkyl group of R ¹¹ to R ¹³ is not particularly limited as long as it is within the range of 1 to 4, but from the viewpoint of sensitivity, it is preferably 3 or less, more preferably 2 or less. Alkyl groups may be chain or cyclic. Specific examples of the alkyl group include, for example, a methyl group, an ethyl group, a propyl group and an isopropyl group, of which a methyl group and an ethyl group are preferred. As the substituent which the alkyl group having 1 to 4 carbon atoms represented by R ¹¹ to R ¹³ may have, a monovalent non-metallic atomic group group excluding hydrogen is used, and a preferred example is a halogen atom (- F, —Br, —Cl, —I), hydroxyl groups, and alkoxy groups.

The number of carbon atoms in the alkoxy groups of R ¹¹ to R ¹³ is not particularly limited as long as it is within the range of 1 to 4, but from the viewpoint of sensitivity, it is preferably 3 or less, more preferably 2 or less. The alkyl group portion of the alkoxy group may be chain or cyclic. Specific examples of alkoxy groups include methoxy, ethoxy, propoxy, isopropyloxy, and butoxy groups, with methoxy and ethoxy groups being preferred. Examples of the substituent which the alkoxy group having 1 to 4 carbon atoms represented by R ¹¹ to R ¹³ may have include an alkyl group and an alkoxy group, preferably an alkyl group.

Further, the halogen atoms represented by R ¹¹ to R ¹³ include, for example, a chlorine atom, an iodine atom, a bromine atom, and a fluorine atom. Among them, from the viewpoint of ease of synthesis, a chlorine atom or a fluorine atom is preferable, and a chlorine atom is more preferable. preferable.
Among these, from the viewpoint of sensitivity and ease of synthesis, each of R ¹¹ to R ¹³ is preferably independently a halogen atom, more preferably a chlorine atom.

m, n and l each independently represent an integer of 0 to 5, but from the viewpoint of ease of synthesis, at least one of m, n and l is preferably an integer of 1 or more, m, n and l It is more preferable that any one of is 1 and the remaining two are 0.

Examples of hexaarylbiimidazole compounds represented by general formula (1-1) and/or general formula (1-2) include 2,2'-bis(o-chlorophenyl)-4,5,4' ,5′-tetraphenylbiimidazole, 2,2′-bis(o-methylphenyl)-4,5,4′,5′-tetraphenylbiimidazole, 2,2′-bis(o-chlorophenyl)-4 ,4′,5,5′-tetra(o,p-dichlorophenyl)biimidazole, 2,2′-bis(o,p-dichlorophenyl)-4,4′,5,5′-tetra(o,p- dichlorophenyl)biimidazole, 2,2′-bis(o-chlorophenyl)-4,4′,5,5′-tetra(p-fluorophenyl)biimidazole, 2,2′-bis(o-chlorophenyl)-4 ,4′,5,5′-tetra(o,p-dibromophenyl)biimidazole, 2,2′-bis(o-bromophenyl)-4,4′,5,5′-tetra(o,p- dichlorophenyl)biimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(p-chloronaphthyl)biimidazole and the like. Among them, hexaphenylbiimidazole compounds are preferred, and those in which the o-position of the benzene ring bonded to the 2,2'-position on the imidazole ring is substituted with a methyl group, a methoxy group, or a halogen atom are more preferred. Preferred are those in which the benzene rings bonded to the 4,4',5,5'-positions on the imidazole ring are unsubstituted or substituted with halogen atoms or methoxy groups.

(B) As a photopolymerization initiator, using either a hexaarylbiimidazole compound represented by general formula (1-1) or a hexaarylbiimidazole compound represented by general formula (1-2) or both may be used in combination. When used in combination, the ratio is not particularly limited. Incidentally, b-1 used in the examples has a structure satisfying general formula (1-1).

Preferable acylphosphine oxide photopolymerization initiators include 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide. .

As the oxime-based photopolymerization initiator, JP 2004-534797, JP 2000-80068, JP 2006-36750, JP 2008-179611, JP 2012-526185, JP Examples thereof include oxime ester compounds described in Table 2012-519191 and the like. Among them, from the viewpoint of sensitivity, N-acetoxy-N-{4-acetoxyimino-4-[9-ethyl-6-(o-toluoyl)-9H-carbazol-3-yl]butan-2-yl}acetamide, N- Acetoxy-N-{3-(acetoxyimino)-3-[9-ethyl-6-(1-naphthoyl)-9H-carbazol-3-yl]-1-methylpropyl}acetamide, 4-acetoxyimino-5- Methyl [9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-5-oxopentanoate, and as product names, OXE-01, OXE-02, OXE-03 (BASF Corp.) ), TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Tenryu Co., Ltd.), NCI-831, NCI-930 (manufactured by ADEKA Co., Ltd.) and the like.

Acetophenone-based photopolymerization initiators include, for example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 1-hydroxy-1-(p-dodecylphenyl)ketone. , 1-hydroxy-1-methylethyl-(p-isopropylphenyl)ketone, 1-trichloromethyl-(p-butylphenyl)ketone, α-hydroxy-2-methylphenylpropanone, 2-methyl-1-[4 -(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1-one, 2-benzyl-2-dimethylamino- 1-(4-morpholinophenyl)butan-1-one, 4-dimethylaminoethylbenzoate, 4-dimethylaminoisoamylbenzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4- dimethylaminobenzoate, 2,5-bis(4-diethylaminobenzal)cyclohexanone, 4-(diethylamino)chalcone and the like.
Examples of benzophenone-based photopolymerization initiators include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-carboxybenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone, and Michler's ketone.

Examples of hydroxybenzene-based photopolymerization initiators include 2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-benzylbenzophenone, 2-(2-hydroxy-5-methylphenyl)benzotriazole, 4- di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate and the like.
Thioxanthone-based photopolymerization initiators include, for example, thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone. mentioned.
Examples of the anthraquinone-based photopolymerization initiator include 2-methylanthraquinone, and examples of the ketal-based photopolymerization initiator include benzyldimethylketal.

Examples of titanocene-based photopolymerization initiators include dicyclopentadienyl titanium dichloride, dicyclopentadienyl titanium bisphenyl, dicyclopentadienyl titanium bis(2,4-difluorophenyl), dicyclopentadienyl titanium. bis(2,6-difluorophenyl), dicyclopentadienyl titanium bis(2,4,6-trifluorophenyl), dicyclopentadienyl titanium bis(2,3,5,6-tetrafluorophenyl), Dicyclopentadienyl titanium bis(2,3,4,5,6-pentafluorophenyl), di(methylcyclopentadienyl) titanium bis(2,6-difluorophenyl), di(methylcyclopentadienyl) titanium bis(2,3,4,5,6-pentafluorophenyl), dicyclopentadienyl titanium bis[2,6-difluoro-3-(1-pyrrolyl)phenyl] and the like. Among them, from the viewpoint of sensitivity, a titanium compound having a dicyclopentadienyl structure and a biphenyl structure is preferred, and a compound in which the o-position of the biphenyl ring is substituted with a halogen atom is particularly preferred.

Halogenated hydrocarbon derivative-based photopolymerization initiators include halomethylated s-triazine derivatives such as 2,4,6-tris(monochloromethyl)-s-triazine, 2,4,6-tris( dichloromethyl)-s-triazine, 2,4,6-tris(trichloromethyl)-s-triazine, 2-methyl-4,6-bis(trichloromethyl)-s-triazine, 2-n-propyl-4, 6-bis(trichloromethyl)-s-triazine, 2-(α,α,β-trichloroethyl)-4,6-bis(trichloromethyl)-s-triazine, 2-phenyl-4,6-bis(trichloro methyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(3,4-epoxyphenyl)-4,6-bis(trichloromethyl) -s-triazine, 2-(p-chlorophenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-[1-(p-methoxyphenyl)-2,4-butadienyl]-4,6- Bis(trichloromethyl)-s-triazine, 2-styryl-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxystyryl)-4,6-bis(trichloromethyl)-s-triazine , 2-(p-methoxy-m-hydroxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(pi-propyloxystyryl)-4,6-bis(trichloromethyl)- s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2 -(p-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-phenylthio- 4,6-bis(trichloromethyl)-s-triazine, 2-benzylthio-4,6-bis(trichloromethyl)-s-triazine, 2,4,6-tris(dibromomethyl)-s-triazine, 2, 4,6-tris(tribromomethyl)-s-triazine, 2-methyl-4,6-bis(tribromomethyl)-s-triazine, 2-methoxy-4,6-bis(tribromomethyl)-s -triazine, 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazide bis(trihalomethyl)-s-triazines are preferred from the viewpoint of sensitivity.

Examples of organic borate-based photopolymerization initiators include organic boron ammonium complexes, organic boron phosphonium complexes, organic boron sulfonium complexes, organic boron oxosulfonium complexes, organic boron iodonium complexes, organic boron transition metal coordination complexes, and the like. Examples of the organic boron anion include n-butyl-triphenyl boron anion, n-butyl-tris(2,4,6-trimethylphenyl) boron anion, n-butyl-tris(p-methoxyphenyl ) boron anion, n-butyl-tris(p-fluorophenyl)boron anion, n-butyl-tris(m-fluorophenyl)boron anion, n-butyl-tris(3-fluoro-4-methylphenyl)boron anion, n-butyl-tris(2,6-difluorophenyl)boron anion, n-butyl-tris(2,4,6-trifluorophenyl)boron anion, n-butyl-tris(2,3,4,5,6 -pentafluorophenyl) boron anion, n-butyl-tris(p-chlorophenyl) boron anion, n-butyl-tris(2,6-difluoro-3-pyrrolylphenyl) boron anion, etc. From the viewpoint of sensitivity, onium compounds such as ammonium cations, phosphonium cations, sulfonium cations and iodonium cations are preferred as counter cations from the viewpoint of sensitivity, and organic ammonium cations such as tetraalkylammonium are particularly preferred from the viewpoint of sensitivity. .

Examples of onium salt photopolymerization initiators include ammonium salts such as tetramethylammonium bromide and tetraethylammonium bromide, diphenyliodonium hexafluoroarsenate, diphenyliodonium tetrafluoroborate, diphenyliodonium p-toluenesulfonate, and diphenyliodonium camphor. Iodonium salts such as sulfonates, dicyclohexyliodonium hexafluoroarsenate, dicyclohexyliodonium tetrafluoroborate, dicyclohexyliodonium p-toluenesulfonate, dicyclohexyliodonium camphorsulfonate, triphenylsulfonium hexafluoroarsenate, triphenylsulfonium tetrafluoroborate, triphenylsulfonium p - sulfonium salts such as toluenesulfonate, triphenylsulfonium camphorsulfonate, tricyclohexylsulfonium hexafluoroarsenate, tricyclohexylsulfonium tetrafluoroborate, tricyclohexylsulfonium p-toluenesulfonate and tricyclohexylsulfonium camphorsulfonate.

Examples of sulfone compound-based photopolymerization initiators include bis(phenylsulfonyl)methane, bis(p-hydroxyphenylsulfonyl)methane, bis(p-methoxyphenylsulfonyl)methane, bis(α-naphthylsulfonyl)methane, bis(β-naphthylsulfonyl)methane, bis(cyclohexylsulfonyl)methane, bis(tert-butylsulfonyl)methane, bis(sulfonyl)methane compounds such as phenylsulfonyl(cyclohexylsulfonyl)methane, phenylcarbonyl(phenylsulfonyl)methane, naphthyl carbonyl(phenylsulfonyl)methane, phenylcarbonyl(naphthylsulfonyl)methane, cyclohexylcarbonyl(phenylsulfonyl)methane, tert-butylcarbonyl(phenylsulfonyl)methane, phenylcarbonyl(cyclohexylsulfonyl)methane, phenylcarbonyl(tert-butylcarbonyl)methane carbonyl (sulfonyl) methane compounds such as bis (phenylsulfonyl) diazomethane, bis (p-hydroxyphenylsulfonyl) diazomethane, bis (p-methoxyphenylsulfonyl) diazomethane, bis (α-naphthylsulfonyl) diazomethane, bis (β-naphthyl) sulfonyl)diazomethane, bis(cyclohexylsulfonyl)diazomethane, bis(tert-butylsulfonyl)diazomethane, phenylsulfonyl(cyclohexylsulfonyl)diazomethane, bis(sulfonyl)diazomethane, phenylcarbonyl(phenylsulfonyl)diazomethane, naphthylcarbonyl(phenylsulfonyl)diazomethane, carbonyl(sulfonyl)diazomethane such as phenylcarbonyl(naphthylsulfonyl)diazomethane, cyclohexylcarbonyl(phenylsulfonyl)diazomethane, tert-butylcarbonyl(phenylsulfonyl)diazomethane, phenylcarbonyl(cyclohexylsulfonyl)diazomethane, phenylcarbonyl(tert-butylcarbonyl)diazomethane; compounds and the like.

Examples of carbamic acid derivative-based photopolymerization initiators include benzoylcyclohexylcarbamate, 2-nitrobenzylcyclohexylcarbamate, 3,5-dimethoxybenzylcyclohexylcarbamate, and 3-nitrophenylcyclohexylcarbamate.
Examples of sulfonamide-based photopolymerization initiators include N-cyclohexyl-4-methylphenylsulfonamide and N-cyclohexyl-2-naphthylsulfonamide, and triarylmethanol-based photopolymerization initiators include, for example, Examples include triphenylmethanol, tri(4-chlorophenyl)methanol and the like.

One of these photopolymerization initiators may be contained alone in the photosensitive resin composition, or two or more thereof may be contained. Among these photopolymerization initiators, hexaarylbiimidazole-based compounds are particularly preferable because they have high absorbance and thus high surface curability, and high liquid repellency and high taper angle can be obtained.

The content of the photopolymerization initiator (B) in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.1% by mass, based on the total solid content of the photosensitive resin composition. % or more, more preferably 0.5 mass % or more, more preferably 1 mass % or more, particularly preferably 1.5 mass % or more, usually 25 mass % or less, preferably 10 mass % or less, more preferably 8 % by mass or less, more preferably 5% by mass or less, particularly preferably 3% by mass or less. When the content is at least the above lower limit, a coating film is formed without causing film reduction during development, and there is a tendency for sufficient liquid repellency to occur. tends to be easier.

Further, the blending ratio of (B) the photopolymerization initiator to (A) the ethylenically unsaturated compound in the photosensitive resin composition is 1 part by mass or more with respect to 100 parts by mass of the (A) ethylenically unsaturated compound. is preferable, 2 parts by mass or more is more preferable, 3 parts by mass or more is more preferable, 200 parts by mass or less is preferable, 100 parts by mass or less is more preferable, 50 parts by mass or less is more preferable, and 20 parts by mass or less is more preferable. More preferably, 10 parts by mass or less is particularly preferable, and 5 parts by mass or less is most preferable. Setting it to the above lower limit or more tends to provide an appropriate sensitivity, and setting it to the above upper limit or less tends to facilitate formation of a desired pattern shape.

Moreover, it is preferable to use a chain transfer agent in combination with the photopolymerization initiator. Examples of chain transfer agents include mercapto group-containing compounds, carbon tetrachloride, and the like, and it is more preferable to use compounds having a mercapto group because they tend to have a high chain transfer effect. This is probably because bond cleavage is likely to occur due to the small SH bond energy, and hydrogen abstraction reaction and chain transfer reaction are likely to occur. Effective in improving sensitivity and surface curability.

Mercapto group-containing compounds include 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4(3H)-quinazoline, β- Mercapto group-containing compounds having an aromatic ring such as mercaptonaphthalene and 1,4-dimethylmercaptobenzene; hexanedithiol, decanedithiol, butanediol bis(3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol Bis(3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris(3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyethyl tristhiopropionate, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), butanediol bis (3-mercaptobutyrate), ethylene glycol bis (3-mercaptobutyrate), trimethylolpropane tris (3- mercaptobutyrate), pentaerythritol tetrakis(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine Aliphatic mercapto group-containing compounds such as -2,4,6(1H,3H,5H)-trione, particularly compounds having a plurality of mercapto groups.

Among these, 2-mercaptobenzothiazole and 2-mercaptobenzimidazole are preferred among mercapto group-containing compounds having an aromatic ring, and among aliphatic mercapto group-containing compounds, trimethylolpropane tris (3- mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate) rate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H) - Trione is preferred.

In terms of sensitivity, aliphatic mercapto group-containing compounds are preferred, and specifically, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), and pentaerythritol. tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5- Tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione is preferred, pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutyrate) is more preferred.
These various things can be used individually by 1 type, or in mixture of 2 or more types.

Among these, from the viewpoint of increasing the taper angle, 1 or 2 or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole are combined with a photopolymerization initiator. , is suitable for use as a photoinitiator system. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzimidazole may be used, or 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination.
From the viewpoint of sensitivity, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate). Furthermore, from the viewpoint of sensitivity, one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole, and pentaerythritol tetrakis (3-mercaptopropionate), It is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis(3-mercaptobutyrate) in combination with a photopolymerization initiator.

The content of the chain transfer agent in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.025% by mass or more, based on the total solid content of the photosensitive resin composition. More preferably 0.05% by mass or more, still more preferably 0.1% by mass or more, particularly preferably 1% by mass or more, usually 5% by mass or less, preferably 4% by mass or less, more preferably 3% by mass or less is. When the lower limit value or more is used, sensitivity tends to increase, and when the upper limit value or less is used, a desired pattern tends to be easily formed.

Further, the compounding ratio of the chain transfer agent to the photopolymerization initiator (B) in the photosensitive resin composition is preferably 10 parts by weight or more, and 25 parts by weight with respect to 100 parts by weight of the photopolymerization initiator (B). More preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, preferably 500 parts by mass or less, more preferably 400 parts by mass or less, further preferably 300 parts by mass or less, 200 parts by mass The following are particularly preferred. The lower limit value or more tends to increase the sensitivity, and the upper limit value or less tends to facilitate formation of a desired pattern.

A sensitizer may be used in combination with the photopolymerization initiator. The sensitizer improves the sensitivity and at the same time decreases the light transmittance into the photosensitive resin composition, which tends to increase the taper angle.

As a sensitizer, a sensitizer commonly used in this field can be used. Examples of such sensitizers include unsaturated ketones such as chalcone derivatives and dibenzalacetone; 1,2-diketone compounds such as benzyl and camphorquinone; benzoin compounds; compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, oxonol derivatives, etc. Polymethine dyes, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, azulenium compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds , tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalyloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds, pyrylium compounds, thiopyrylium tetraphyllin-based compounds, annulene-based compounds, spiropyran-based compounds, spirooxazine-based compounds, thiospiropyran-based compounds, metal arene complexes, organic ruthenium complexes, benzophenone-based compounds, and the like.
These may be used individually by 1 type, and may use 2 or more types together.

Among these, thioxanthone-based compounds and benzophenone-based compounds are preferred from the viewpoint of improving sensitivity and increasing the taper angle.

Thioxanthone compounds include thioxanthone, 2-methylthioxanthone, 4-methylthioxanthone, 2,4-dimethylthioxanthone, 2-ethylthioxanthone, 4-ethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, and 4-isopropyl thioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, 2,4-dichlorothioxanthone and the like. Among these, 2,4-diethylthioxanthone is preferable from the viewpoint of improving sensitivity and increasing taper angle.

Benzophenone compounds include benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-bis(ethylmethylamino)benzophenone and the like. Among these, 4,4'-bis(diethylamino)benzophenone is preferable from the viewpoint of improving sensitivity and increasing taper angle.

The content of the sensitizer in the photosensitive resin composition is usually 0.1% by mass or more, preferably 0.3% by mass or more, more preferably 0.3% by mass or more, based on the total solid content of the photosensitive resin composition. 5% by mass or more, more preferably 0.8% by mass or more, still more preferably 1% by mass or more, particularly preferably 1.2% by mass or more, and usually 10% by mass or less, preferably 7% by mass or less, It is more preferably 5% by mass or less, still more preferably 3% by mass or less. When it is equal to or higher than the lower limit, there is a tendency that the sensitivity can be improved and the taper angle can be increased.

[1-1-3] Component (C): Alkali-Soluble Resin The photosensitive resin composition for forming partition walls of the present invention contains (C) an alkali-soluble resin. In the present invention, the alkali-soluble resin is not particularly limited as long as it can be developed with a developer, but the developer is preferably an alkali developer, so an alkali-soluble resin is used in the present invention. Examples of alkali-soluble resins include various resins containing carboxyl groups or hydroxyl groups. Among them, it is preferable to have a carboxyl group from the viewpoint of obtaining partition walls with an appropriate taper angle, suppressing outflow due to thermal melting of the partition walls and maintaining liquid repellency, and furthermore having an ethylenically unsaturated group. It is more preferable to have
(C-1) carboxyl group-containing (co)polymer, (C-2) carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain, (C-3) carboxyl group and ethylene The polyunsaturated group-containing resin will be described in detail.

[1-1-3-a] (C-1) carboxyl group-containing (co)polymer [1-1-3-a-1] carboxyl group-containing (co)polymer (1)
Typical examples of carboxyl group-containing (co)polymers include, specifically, (meth)acrylic acid, crotonic acid, isocrotonic acid, maleic acid, maleic anhydride, itaconic acid and citraconic acid. Saturated carboxylic acid, styrenes such as styrene, α-methylstyrene, hydroxystyrene, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth) acrylate, dodecyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, isobornyl (meth) acrylate, hydroxymethyl (meth) acrylate, hydroxyethyl ( (Meth)acrylates, glycidyl (meth)acrylate, benzyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N-(meth)acrylic acid esters such as acryloylmorpholine, (meth)acrylonitrile, etc. (meth)acrylonitrile, (meth)acrylamide, N-methylol (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-dimethylaminoethyl (meth)acrylamide (meth)acrylamides, acetic acid Examples thereof include copolymers with vinyl compounds such as vinyl.

Among these, (meth)acrylate-(meth)acrylic acid copolymers and styrene-(meth)acrylate-(meth)acrylic acid copolymers are preferred from the viewpoint of sensitivity. In the (meth)acrylate-(meth)acrylic acid copolymer, a copolymer composed of 5 to 80 mol% (meth)acrylate and 20 to 95 mol% (meth)acrylic acid is more preferable. Copolymers of 10 to 70 mol % of meth)acrylate and 30 to 90 mol % of (meth)acrylic acid are particularly preferred. In the styrene-(meth)acrylate-(meth)acrylic acid copolymer, a copolymer containing 3 to 60 mol% of styrene, 10 to 70 mol% of (meth)acrylate, and 10 to 60 mol% of (meth)acrylic acid A polymer is more preferred, and a copolymer consisting of 5 to 50 mol % styrene, 20 to 60 mol % (meth)acrylate, and 15 to 55 mol % (meth)acrylic acid is particularly preferred.

[1-1-3-a-2] carboxyl group-containing (co)polymer (2)
Further, instead of the unsaturated carboxylic acid, a compound obtained by adding a polybasic acid (anhydride) to a hydroxyalkyl (meth)acrylate, the styrenes, (meth)acrylic acid esters, and (meth)acrylonitrile , (meth)acrylamides, vinyl compounds, and the like.

Examples of hydroxyalkyl (meth)acrylates include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, and hydroxybutyl (meth)acrylate. Polybasic acids (anhydrides) include succinic acid ( anhydride), adipic acid (anhydride), phthalic acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), maleic acid (anhydride), etc., and reaction compounds of both Examples include succinic acid [2-(meth)acryloylethyl] ester, adipic acid [2-(meth)acryloylethyl] ester, phthalic acid [2-(meth)acryloylethyl] ester, hexahydrophthalic acid [2-( meth)acryloylethyl] ester, maleic acid [2-(meth)acryloylethyl]ester, succinic acid [2-(meth)acryloylpropyl]ester, adipic acid [2-(meth)acryloylpropyl]ester, phthalic acid [2 -(meth)acryloylpropyl] ester, hexahydrophthalic acid [2-(meth)acryloylpropyl] ester, maleic acid [2-(meth)acryloylpropyl] ester, succinic acid [2-(meth)acryloylbutyl] ester, adipic acid [2-(meth)acryloylbutyl] ester, phthalic acid [2-(meth)acryloylbutyl] ester, hexahydrophthalic acid [2-(meth)acryloylbutyl] ester, maleic acid [2-(meth)acryloylbutyl] butyl] ester and the like.

From the viewpoint of development solubility, these carboxyl group-containing (co)polymers preferably have an acid value of 50 to 500 mgKOH/g, and from the viewpoint of development solubility, the weight average molecular weight (Mw) in terms of polystyrene is It is preferably between 1,000 and 300,000.

[1-1-3-b] (C-2) a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain [1-1-3-b-1] unsaturated carboxylic acid and two Copolymer with a compound having an ethylenically unsaturated group above As a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain, for example, allyl (meth) acrylate, 3-allyloxy-2-hydroxy Compounds having two or more ethylenically unsaturated groups such as propyl (meth)acrylate, cinnamyl (meth)acrylate, crotonyl (meth)acrylate, methallyl (meth)acrylate, N,N-diallyl (meth)acrylamide, or Two or more ethylenic polymers such as vinyl (meth)acrylate, 1-chlorovinyl (meth)acrylate, 2-phenylvinyl (meth)acrylate, 1-propenyl (meth)acrylate, vinyl crotonate, vinyl (meth)acrylamide, etc. A compound having a saturated group, an unsaturated carboxylic acid such as (meth)acrylic acid, or an unsaturated carboxylic acid ester, etc., and the ratio of the former compound having an ethylenically unsaturated group to the total is 10 to 90 mol. %, preferably about 30 to 80 mol %.

The acid value of the copolymer of this unsaturated carboxylic acid and a compound having two or more ethylenically unsaturated groups is preferably 30 to 250 mgKOH/g from the viewpoint of developing solubility, and the weight average molecular weight (Mw) is preferably 1,000 to 300,000 from the viewpoint of development solubility.

[1-1-3-b-2] Epoxy group-containing unsaturated compound-modified carboxyl group-containing (co)polymer Further, as a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in a side chain, for example, A carboxyl group-containing (co)polymer is reacted with an epoxy group-containing unsaturated compound, and modified by adding the epoxy group of the epoxy group-containing unsaturated compound to a part of the carboxyl groups of the carboxyl group-containing (co)polymer. and modified carboxyl group-containing (co)polymers.
As the carboxyl group-containing (co)polymer, from the viewpoint of sensitivity, the above-mentioned carboxyl group-containing (co)polymer (meth)acrylate-(meth)acrylic acid copolymer, and styrene-(meth)acrylate -(Meth)acrylic acid copolymers and the like are preferred.
In addition, the epoxy group-containing unsaturated compounds include allyl glycidyl ether, glycidyl (meth)acrylate, α-ethylglycidyl (meth)acrylate, glycidyl crotonate, glycidyl isocrotonate, crotonyl glycidyl ether, monoalkyl mono itaconate, Aliphatic epoxy group-containing unsaturated compounds such as glycidyl esters, monoalkyl monoglycidyl fumarate, monoalkyl monoglycidyl maleate, and 3,4-epoxycyclohexylmethyl (meth)acrylate, 2,3-epoxycyclopentylmethyl Alicyclic epoxy group-containing unsaturated compounds such as (meth)acrylate and 7,8-epoxy[tricyclo[5.2.1.0]dec-2-yl]oxyethyl (meth)acrylate can be mentioned.
These epoxy group-containing unsaturated compounds can be obtained by reacting 5 to 90 mol %, preferably about 30 to 70 mol %, of the carboxyl groups of the carboxyl group-containing (co)polymer. In addition, reaction can be implemented by a well-known method.

The acid value of this epoxy group-containing unsaturated compound-modified carboxyl group-containing (co)polymer is preferably 30 to 250 mgKOH/g from the viewpoint of developability, and the weight average molecular weight (Mw ) is preferably between 1,000 and 300,000.

[1-1-3-b-3] Unsaturated carboxylic acid-modified epoxy group- and carboxyl group-containing (co)polymer Further, as a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in a side chain, for example , Unsaturated carboxylic acid such as (meth)acrylic acid and the above-mentioned aliphatic epoxy group-containing unsaturated compound or alicyclic epoxy group-containing unsaturated compound, or further unsaturated carboxylic acid ester, styrene, etc. An unsaturated compound such as (meth)acrylic acid is added to a copolymer obtained by copolymerizing such that the ratio of the carboxyl group-containing unsaturated compound to the total is 10 to 90 mol%, preferably about 30 to 80 mol%. Modified epoxy groups and carboxyl group-containing (co)polymers modified by reacting saturated carboxylic acid to add carboxyl groups of unsaturated carboxylic acid to the epoxy groups of the copolymer are exemplified.

The acid value of this unsaturated carboxylic acid-modified epoxy group- and carboxyl group-containing (co)polymer is preferably 30 to 250 mgKOH/g from the viewpoint of developability, and the weight average molecular weight ( Mw) is preferably between 1,000 and 300,000.

[1-1-3-b-4] Acid-modified epoxy group-containing (co)polymer Further, as a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain, an epoxy group-containing (meth)acrylate and an ethylenically unsaturated compound, an ethylenically unsaturated monocarboxylic acid is added to at least a portion of the epoxy groups of the copolymer, and at least a portion of the hydroxyl groups generated by the addition are multiplied Examples thereof include acid-modified epoxy group-containing (co)polymers obtained by addition of basic acids (anhydrides).
Specifically, a copolymer of 5 to 99 mol% of an epoxy group-containing (meth)acrylate such as glycidyl (meth)acrylate and usually 2 to 95 mol% of an ethylenically unsaturated compound such as (meth)acrylic acid ester. To usually 10 to 100 mol% of the epoxy groups contained in the copolymer, an ethylenically unsaturated monocarboxylic acid is added, and usually 10 to 100 mol% of the hydroxyl groups generated when further added, a polybasic acid Acid-modified epoxy group-containing (co)polymers obtained by adding (anhydrides) can be mentioned.

Here, the copolymerization ratio of the epoxy group-containing (meth)acrylate in the copolymer is not particularly limited, but is usually 5 mol% or more, preferably 20 mol% or more, more preferably 40 mol% or more, further preferably 60 mol% or more. mol % or more, more preferably 80 mol % or more, particularly preferably 90 mol % or more, and usually 99 mol % or less, preferably 98 mol % or less, more preferably 95 mol % or less. When the content is at least the lower limit, the sensitivity tends to be high.
On the other hand, the copolymerization ratio of the ethylenically unsaturated compound in the copolymer is not particularly limited, but is usually 1 mol% or more, preferably 3 mol% or more, more preferably 5 mol% or more, and usually 90 mol% or less. , preferably 70 mol % or less, more preferably 50 mol % or less, still more preferably 30 mol % or less, and particularly preferably 10 mol % or less. When the content is at least the lower limit, the sensitivity tends to be high.

Epoxy group-containing (meth)acrylates include aliphatic epoxy group-containing (meth)acrylates such as glycidyl (meth)acrylate and α-ethylglycidyl (meth)acrylate; 3,4-epoxycyclohexylmethyl (meth)acrylate; Alicyclic epoxy group-containing (meth)acrylates such as 3-epoxycyclopentylmethyl (meth)acrylate and 7,8-epoxy[tricyclo[5.2.1.0]dec-2-yl]oxyethyl (meth)acrylate mentioned.

Here, as the ethylenically unsaturated compound, for example, one or more mono(meth)acrylates having a partial structure represented by the following formula (II) are preferably used.

In formula (II), R ^1d to R ^4d each independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R ^5d and R ^6d each independently represent a hydrogen atom or a C 1 to 10 represents an alkyl group of Also, R ^5d and R ^6d may be linked to form a ring. The ring formed by connecting R ^5d and R ^6d is preferably an aliphatic ring, may be saturated or unsaturated, and preferably has 5 to 6 carbon atoms.

The number of carbon atoms in the alkyl groups in R ^1d to R ^4d is usually 1 or more and usually 10 or less, preferably 8 or less, more preferably 5 or less. When the amount is not more than the above upper limit, there is a tendency that appropriate development solubility can be obtained.
Among these, from the viewpoint of solubility, R ^1d to R ^4d are preferably hydrogen atoms.

The number of carbon atoms in the alkyl groups in R ^5d and R ^6d is preferably 8 or less, more preferably 5 or less. When it is at least the above lower limit, there is a tendency to exhibit appropriate solubility, and when it is at most the above upper limit, hydrophilicity tends to be maintained.
Among these, from the viewpoint of developing solubility, it is preferable that R ^5d and R ^6d are hydrogen atoms, or R ^5d and R ^6d are linked to form an aliphatic ring having 5 to 6 carbon atoms. .

Of the above formula (II), mono(meth)acrylates having a structure represented by the following formula (IIa), (IIb), or (IIc) are preferred. By introducing these partial structures, it is possible to increase the heat resistance and strength of the mono(meth)acrylate. One of these mono(meth)acrylates may be used, or two or more of them may be used in any combination and ratio.

As the mono(meth)acrylate having a partial structure represented by the formula (II), various known ones can be used, but from the viewpoint of curability, especially those represented by the following formula (III) is preferred.

In formula (III), R ^9d represents a hydrogen atom or a methyl group, and R ^10d represents the partial structure of formula (II).
When a mono(meth)acrylate having a partial structure represented by the formula (II) is contained, the copolymerization ratio thereof is usually 1 mol% or more, preferably 2 mol% or more, and usually 70 mol% or less. , preferably 50 mol % or less, more preferably 30 mol % or less, still more preferably 10 mol % or less, and particularly preferably 5 mol % or less. When it is equal to or higher than the lower limit, the residual film rate tends to increase, and when it is equal to or lower than the upper limit, the residue tends to be reduced.

On the other hand, as the ethylenically unsaturated compound, an ethylenically unsaturated compound other than the mono (meth) acrylate having the partial structure represented by the above formula (II) (hereinafter referred to as "other ethylenically unsaturated compound" styrenes such as α-, o-, m-, p-alkyl, nitro, cyano, amide and ester derivatives of styrene, butadiene, 2,3-dimethylbutadiene, isoprene, chloroprene, etc. Dienes, methyl (meth) acrylate, ethyl (meth) acrylate, -n-propyl (meth) acrylate, -iso-propyl (meth) acrylate, -n-butyl (meth) acrylate, (meth) ) sec-butyl acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, neopentyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, (meth) acrylic 2-ethylhexyl acid, lauryl (meth)acrylate, dodecyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, dicyclohexyl (meth)acrylate, Isobornyl (meth) acrylate, adamantyl (meth) acrylate, allyl (meth) acrylate, propargyl (meth) acrylate, phenyl (meth) acrylate, naphthyl (meth) acrylate, anthracenyl (meth) acrylate, ( meth)anthraninonyl acrylate, piperonyl (meth)acrylate, salicyl (meth)acrylate, furyl (meth)acrylate, furfuryl (meth)acrylate, tetrahydrofuryl (meth)acrylate, pyranyl (meth)acrylate , benzyl (meth) acrylate, phenethyl (meth) acrylate, cresyl (meth) acrylate, 1,1,1-trifluoroethyl (meth) acrylate, perfluoroethyl (meth) acrylate, (meth) ) perfluoro-n-propyl acrylate, perfluoro-iso-propyl (meth)acrylate, triphenylmethyl (meth)acrylate, cumyl (meth)acrylate, 3-(N,N-(meth)acrylate) (meth)acrylic acid esters such as dimethylamino)propyl, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, (meth)acrylic acid amide, (meth)acrylic acid N, N-dimethylamide, (meth)acrylic (meth)acrylic acid N,N-diethylamide, (meth)acrylic acid N,N-dipropylamide, (meth)acrylic acid N,N-di-iso-propylamide, (meth)acrylic acid anthracenylamide, etc. ) Acrylic acid amides, (meth)acrylic acid anilide, (meth)acryloylnitrile, acrolein, vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinylpyrrolidone, vinylpyridine, vinyl compounds such as vinyl acetate , unsaturated dicarboxylic acid diesters such as diethyl citraconate, diethyl maleate, diethyl fumarate, and diethyl itaconate, N-phenylmaleimide, N-cyclohexylmaleimide, N-laurylmaleimide, N-(4-hydroxyphenyl)maleimide, etc. and radically polymerizable compounds such as monomaleimides, N-(meth)acryloylphthalimide, and the like.

Among these, at least one selected from styrene, benzyl (meth)acrylate and monomaleimide can be used as other ethylenically unsaturated compounds in order to impart better heat resistance and strength. It is valid. In this case, from the viewpoint of heat resistance, the copolymerization ratio of at least one selected from styrene, benzyl (meth)acrylate and monomaleimide is usually 1 mol% or more, preferably 3 mol% or more, and usually 70 mol. % or less, preferably 50 mol % or less, more preferably 30 mol % or less, still more preferably 10 mol % or less.

As the ethylenically unsaturated monocarboxylic acid to be added to the epoxy group contained in the copolymer of the epoxy group-containing (meth)acrylate and the ethylenically unsaturated compound, a known one can be used. Therefore, (meth)acrylic acid is preferred. The amount of the ethylenically unsaturated monocarboxylic acid added to the epoxy groups contained in the copolymer is usually 10 mol% or more, preferably 30 mol% or more, more preferably 50 mol% or more of the epoxy groups contained in the copolymer. It is mol % or more, more preferably 70 mol % or more, and usually 100 mol % or less. By setting the addition ratio of the ethylenically unsaturated monocarboxylic acid to the above lower limit or more, there is a tendency that the curability can be enhanced. In addition, a well-known method can be employ|adopted as a method of adding an ethylenically unsaturated monocarboxylic acid to the said copolymer.

The polybasic acid (anhydride) to be added to the hydroxyl group produced when the ethylenically unsaturated monocarboxylic acid is added to the copolymer is not particularly limited, and known ones can be used. acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), succinic acid (anhydride), trimellitic acid (anhydride) and the like. Succinic acid (anhydride) is preferred from the viewpoint of reducing outgassing, while tetrahydrophthalic acid (anhydride) is preferred from the viewpoint of improving the film retention rate and reducing residue. One type of polybasic acid (anhydride) may be used alone, or two or more types may be used together in any combination and ratio. By adding such a component, alkali solubility can be imparted to the copolymer.

The amount of polybasic acid (anhydride) to be added is usually 5 mol% or more, preferably 10 mol% or more of the hydroxyl groups generated when the ethylenically unsaturated monocarboxylic acid is added to the copolymer. . Also, it is usually 100 mol % or less, preferably 90 mol % or less, more preferably 80 mol % or less. When the amount is at least the above lower limit, there is a tendency to impart developability, and when the amount is at most the above upper limit, there is a tendency to suppress excessive development and dissolution of the film. As a method for adding a polybasic acid (anhydride) to a hydroxyl group generated when an ethylenically unsaturated monocarboxylic acid is added to the copolymer, a known method can be arbitrarily adopted.

Modified products of the above epoxy group-containing (co)polymers with ethylenically unsaturated monocarboxylic acids and polybasic acids (anhydrides) include: Photosensitivity can be further improved by adding a glycidyl (meth)acrylate or a glycidyl ether compound having an ethylenically unsaturated group. Developability can also be improved by adding a glycidyl ether compound having no ethylenically unsaturated groups to some of the carboxyl groups formed after addition of the polybasic acid (anhydride). Furthermore, both of these may be added after polybasic acid (anhydride) addition.

Examples of the modified epoxy group-containing (co)polymer with ethylenically unsaturated monocarboxylic acid and polybasic acid (anhydride) include, for example, JP-A-8-297366 and JP-A-2001-89533. Examples thereof include resins described in publications.

The weight average molecular weight (Mw) of the acid-modified epoxy group-containing (co)polymer is not particularly limited, but is usually 3,000 or more, preferably 5,000 or more, and usually 100,000 or less, preferably 50. ,000 or less, more preferably 30,000 or less, still more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. When the content is at least the lower limit, the compatibility tends to be improved, and when the content is at the upper limit or less, the solubility tends to be ensured. Further, the molecular weight distribution [weight average molecular weight (Mw)/number average molecular weight (Mn)] is preferably 2.0 to 5.0 from the viewpoint of curability.
The acid value of the acid-modified epoxy group-containing (co)polymer is not particularly limited, but is preferably 5 mgKOH/g or more, more preferably 10 mgKOH/g or more, still more preferably 20 mgKOH/g or more, and 150 mgKOH/g or less. is preferred, 100 mgKOH/g or less is more preferred, and 50 mgKOH/g or less is even more preferred. The lower limit value or more tends to ensure the solubility, and the upper limit value or less tends to improve film reduction.

[1-1-3-c] (C-3) Carboxyl group- and ethylenically unsaturated group-containing resin [1-1-3-c-1] Acid-modified epoxy resin As a carboxyl group- and ethylenically unsaturated group-containing resin , For example, a carboxyl group- and ethylenically unsaturated group-containing epoxy resin obtained by adding a polybasic acid (anhydride) to an ethylenically unsaturated group monocarboxylic acid adduct of an epoxy resin, that is, a so-called epoxy (meth)acrylate resin is mentioned. That is, ring-opening addition of the carboxy group of the ethylenically unsaturated monocarboxylic acid to the epoxy group of the epoxy resin results in the addition of an ethylenically unsaturated bond to the epoxy resin via an ester bond (-COO-). In addition, one carboxyl group of the polybasic acid (anhydride) is added to the hydroxyl group generated at that time.

Here, the term "epoxy resin" includes a raw material compound before forming a resin by thermosetting, and the epoxy resin can be appropriately selected from known epoxy resins and used. Specifically, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolak epoxy resin, cresol novolac epoxy resin, biphenyl novolak epoxy resin, trisphenol epoxy resin, polymerization of phenol and dicyclopentane. Epoxy resin, dihydroxylfluorene-type epoxy resin, dihydroxylalkyleneoxylfluorene-type epoxy resin, 9,9-bis(4′-hydroxyphenyl)diglycidyl ether of fluorene, 1,1-bis(4′-hydroxy phenyl)adamantane diglycidyl ether, and the like. Among them, from the viewpoint of high cured film strength, bisphenol A epoxy resin, phenol novolak epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, 9,9-bis(4'-hydroxyphenyl) fluorene. A diglycidyl etherate is preferred, and a bisphenol A epoxy resin is more preferred.

Examples of ethylenically unsaturated monocarboxylic acids include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and pentaerythritol tri(meth)acrylate succinic anhydride adducts. , pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth) Examples include acrylate tetrahydrophthalic anhydride adducts and reaction products of (meth)acrylic acid and ε-caprolactone. Among them, (meth)acrylic acid is preferable from the viewpoint of sensitivity.

Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, and 3-ethyltetrahydrophthalic acid. , 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyro mellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof; Among them, succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride is preferable from the viewpoint of image reproducibility, developability, and outgassing, and succinic anhydride or tetrahydrophthalic anhydride is more preferred, and succinic anhydride is even more preferred.

The acid value of the acid-modified epoxy resin in the present invention is not particularly limited, but is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, still more preferably 30 mgKOH/g or more, and preferably 200 mgKOH/g or less, and 180 mgKOH/g. g or less is more preferable, 150 mgKOH/g or less is more preferable, 100 mgKOH/g or less is even more preferable, and 80 mgKOH/g or less is particularly preferable. Adhesion tends to be improved by making it equal to or higher than the lower limit, and solubility tends to be improved by making it equal to or lower than the upper limit.
In addition, the weight average molecular weight (Mw) of the acid-modified epoxy resin is not particularly limited, but is usually 1,000 or more, preferably 2,000 or more, more preferably 3,000 or more, still more preferably 4,000 or more, and more preferably 4,000 or more. It is preferably 5,000 or more, particularly preferably 6,000 or more, and is usually 30,000 or less, preferably 20,000 or less, more preferably 15,000 or less, further preferably 10,000 or less. Adhesion tends to be improved by making it equal to or higher than the lower limit, and appropriate solubility tends to be maintained by making it equal to or lower than the upper limit.

The acid-modified epoxy resin can be synthesized by a conventionally known method. Specifically, the epoxy resin is dissolved in an organic solvent, the ethylenically unsaturated monocarboxylic acid is added in the presence of a catalyst and a thermal polymerization inhibitor for an addition reaction, and a polybasic acid (anhydride) is added. can be used to continue the reaction.

Here, the organic solvent used for the reaction includes one or more organic solvents such as methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of the catalyst include tertiary amines such as triethylamine, benzyldimethylamine and tribenzylamine; One or more of quaternary ammonium salts, phosphorus compounds such as triphenylphosphine, stibines such as triphenylstibine, and the like can be used. Furthermore, the thermal polymerization inhibitor includes one or more of hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, and the like.

The amount of the ethylenically unsaturated monocarboxylic acid to be used is usually 0.7 to 1.3 chemical equivalents, preferably 0.9 to 1.1 chemical equivalents, per one chemical equivalent of the epoxy group of the epoxy resin. can be any amount. The temperature during the addition reaction is usually 60 to 150°C, preferably 80 to 120°C. Furthermore, the amount of polybasic acid (anhydride) used is usually 0.1 to 1.2 chemical equivalents, preferably 0.2 to 1.1 chemical equivalents, relative to 1 chemical equivalent of the hydroxyl groups generated in the addition reaction. It can be an amount that provides a chemical equivalent.

Specific examples of the acid-modified epoxy resin in the present invention are shown below. The acid-modified epoxy resin may contain one resin or two or more resins.

In formula (C1-1), each R ¹¹¹ independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹¹¹ represents an integer of 0-20.

In formula (C1-2), each R ¹²¹ independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹²¹ represents an integer of 0-20.

In formula (C1-3), each R ¹³¹ independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and each m ¹³¹ and n ¹³¹ independently represents an integer of 0-20. Note that m ¹³¹ and n ¹³¹ mean the number of repeating units and do not indicate that it is a block copolymer. Each γ independently represents a single bond, --CO--, --CH ₂ --, --C(CH ₃ ) ₂ --, a group represented by the following formula (IV), or a group represented by the following formula (V). δ represents a hydrogen atom or a polybasic acid residue.

In formula (C1-4), each R ¹⁴¹ independently represents an alkyl group or a halogen atom, and each p independently represents an integer of 0-4.

In formula (C1-6), each R ¹⁶¹ independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹⁶¹ represents an integer of 0-20.

In formulas (C1-1) to (C1-6), A represents a group represented by general formula (VI) below.

In formula (VI), R ¹⁷¹ represents a hydrogen atom or a methyl group, R ¹⁷² represents an alkylene group, and m ¹⁷¹ represents an integer of 0-10. δ represents a hydrogen atom or a polybasic acid residue.

[1-1-3-c-2] Modified phenolic resin As a carboxyl group- and ethylenically unsaturated group-containing resin, for example, an ethylenically unsaturated group-containing epoxy compound adduct of a phenol resin, a polybasic acid (anhydride) is added, carboxyl group- and ethylenically unsaturated group-containing phenolic resins. That is, the epoxy group of the ethylenically unsaturated group-containing epoxy compound is ring-opening added to the phenolic hydroxyl group of the phenolic resin, so that the ethylenically unsaturated bond is added to the phenolic resin via an ester bond (-COO-). and one carboxyl group of a polybasic acid (anhydride) added to the hydroxyl group generated at that time.

Examples of phenolic resins include phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, o-ethylphenol, m-ethylphenol and p-ethylphenol. , propylphenol, n-butylphenol, tert-butylphenol, 1-naphthol, 2-naphthol, 4,4'-biphenyldiol, bisphenol-A, pyrocatechol, resorcinol, hydroquinone, pyrogallol, 1,2,4-benzenetriol, At least one of phenols such as benzoic acid, 4-hydroxyphenylacetic acid, salicylic acid, phloroglucinol, etc., under an acid catalyst, for example, formaldehyde, paraformaldehyde, acetaldehyde, paraldehyde, propionaldehyde, benzaldehyde, salicylaldehyde, furfural, etc. or ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone, and a novolac resin that is polycondensed with at least one of acetone, methyl ethyl ketone, methyl isobutyl ketone, etc., and an alkali catalyst instead of the acid catalyst in the polycondensation. Polycondensed resole resins and the like can be mentioned. Here, the condensation reaction between the phenols and the aldehydes is carried out without solvent or in a solvent.

The weight average molecular weight (Mw) of these novolak resins and resole resins is usually 1,000 to 20,000, preferably 1,000 to 10,000, more preferably 1,000 to 8,000. . Setting the weight-average molecular weight to the lower limit or more tends to ensure image strength, and setting the weight-average molecular weight to the upper limit or less tends to ensure developability.

Examples of ethylenically unsaturated group-containing epoxy compounds include glycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, glycidyloxy (poly)alkylene glycol (meth)acrylate, and methylglycidyl (meth)acrylate. Acrylate, (3,4-epoxycyclohexyl)vinyl and the like. Among these, glycidyl (meth)acrylate and (3,4-epoxycyclohexyl)methyl (meth)acrylate are particularly preferred.

A known method can be used for the reaction of a novolac resin, a resole resin, or the like with an ethylenically unsaturated group-containing epoxy compound. For example, one or more of tertiary amines such as triethylamine and benzylmethylamine, quaternary ammonium salts such as dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride and benzyltriethylammonium chloride, pyridine and triphenylphosphine is used as a catalyst in an organic solvent at a reaction temperature of 50 to 150° C. for several to several tens of hours to add an ethylenically unsaturated group-containing epoxy compound to a novolak resin, a resole resin, or the like.

The amount of the catalyst used is preferably 0.01 to 10% by mass, particularly preferably 0.3 to 5%, based on the reaction raw material mixture (the total of novolac resin, resole resin and ethylenically unsaturated group-containing epoxy compound). % by mass. In order to prevent polymerization during the reaction, a polymerization inhibitor (eg, one or more of methoquinone, hydroquinone, methylhydroquinone, p-methoxyphenol, pyrogallol, tert-butylcatechol, dibutylhydroxytoluene, phenothiazine, etc.) is added. It is preferably used, and the amount used is preferably 0.01 to 10% by mass, particularly preferably 0.03 to 5% by mass, based on the reaction raw material mixture.
The preferred ratio of addition of the ethylenically unsaturated group-containing epoxy compound to the phenolic hydroxyl groups of novolac resins, resol resins, etc. is 1 to 99 mol %. This ratio can be adjusted by adjusting the amount of the ethylenically unsaturated group-containing epoxy compound added to the phenolic hydroxyl group.

As the polybasic acid (anhydride), for example, known ones can be used, and maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylendomethylenetetrahydrophthalic acid, chlorend acids, dibasic carboxylic acids such as methyltetrahydrophthalic acid, 5-norbornene-2,3-dicarboxylic acid, methyl-5-norbornene-2,3-dicarboxylic acid or their anhydrides, trimellitic acid, pyromellitic acid, Examples include polybasic carboxylic acids such as benzophenonetetracarboxylic acid and biphenyltetracarboxylic acid, and anhydrides thereof. Among them, tetrahydrophthalic anhydride and succinic anhydride are preferred. These may be used individually by 1 type, and may be used in mixture of 2 or more types.

The addition rate of the polybasic acid (anhydride) is usually 10 to 100 mol%, preferably 20 to 100 mol%, more than 10 to 100 mol% of the hydroxyl groups of the reaction product of the novolac resin, resole resin, etc. and the ethylenically unsaturated group-containing epoxy compound. It is preferably 30 to 100 mol %. By setting the addition rate within the above range, there is a tendency to easily ensure developability.

[1-1-3-d] Other alkali-soluble resins In addition, in the case of providing a partition wall to an organic electric field element on a substrate that is easily deteriorated by an alkaline developer, the developer of a weakly alkaline alkaline compound , or in the case of using a developer that does not contain an alkaline compound, the alkali-soluble resin, polyvinyl alcohol, or the [1-1-3-a-1] carboxyl group-containing (co)polymer (1) listed A vinyl alcohol copolymer obtained by copolymerizing 0.1 to 40 mol%, preferably 1 to 30 mol%, of a comonomer (a preferred example is vinyl acetate, etc.), or the above [1-1-3-a -1] Carboxyl group-containing (co)polymer A modified polyvinyl alcohol obtained by introducing 0.1 to 40 mol %, preferably 1 to 30 mol %, of the copolymer mentioned in (1) by an esterification reaction is preferably used.
Further, for the purpose of forming an appropriate taper angle and maintaining liquid repellency, the ethylenically unsaturated monocarboxylic acid mentioned in the above [1-1-3-c-1] acid-modified epoxy resin (a preferred example is , (meth)acrylic acid, a reaction product of (meth)acrylic acid and ε-caprolactone, etc.), or further a polybasic acid (anhydride) (a preferred example is tetrahydrophthalic anhydride, etc.) by an esterification reaction. 0.1 to 30 mol%, preferably 0.5 to 20 mol% introduced modified polyvinyl alcohol, or a (meth)acryloyl (oxy) group or (meth)acrylamide group described in JP-A-2008-45047 A compound having an aldehyde group (preferred examples include 4-acryloyloxybutanal), or a compound having a dialkylacetal group (preferred examples include N-(2,2-dimethoxyethyl) methacrylamide, etc.) Modified polyvinyl alcohol into which 0.1 to 30 mol %, preferably 0.5 to 20 mol % of is introduced by formal reaction is preferably used.

(C) As the alkali-soluble resin, among the above-mentioned ones, from the viewpoint of outgas reduction and curability, (C-2) a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain or (C-3 ) carboxyl group- and ethylenically unsaturated group-containing resins are preferred, (C-3) carboxyl group- and ethylenically unsaturated group-containing resins are more preferred, and acid-modified epoxy resins are still more preferred.

The weight average molecular weight (Mw) of the (C) alkali-soluble resin is not particularly limited, but is preferably 2,000 or more, more preferably 3,000 or more, further preferably 5,000 or more, and particularly 7,000 or more. It is preferably 50,000 or less, more preferably 30,000 or less, even more preferably 20,000 or less, and particularly preferably 10,000 or less. When the content is at least the above lower limit, excessive development tends to be prevented from dissolving the film, and when the content is at most the above upper limit, moderate development solubility tends to be exhibited.
The acid value of (C) the alkali-soluble resin is not particularly limited, but is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, more preferably 30 mgKOH/g or more, and preferably 200 mgKOH/g or less, and 150 mgKOH/g. The following is more preferable, 100 mgKOH/g or less is more preferable, 70 mgKOH/g or less is even more preferable, and 50 mgKOH/g or less is particularly preferable. When the concentration is equal to or higher than the lower limit, there is a tendency that the residue can be suppressed, and when the concentration is equal to or lower than the upper limit, there is a tendency that a high residual film rate can be obtained.

The content of the (C) alkali-soluble resin in the photosensitive resin composition of the present invention is usually 5% by mass or more, preferably 10% by mass or more, more preferably 20% by mass or more, and further It is preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. When the content is at least the above lower limit, there is a tendency to obtain appropriate development solubility and sensitivity, and when the content is at most the above upper limit, there is a tendency to obtain appropriate development solubility and sensitivity.

In addition, the content of (A) the ethylenically unsaturated compound and (C) the alkali-soluble resin in the total solid content is usually 5% by mass or more, preferably 10% by mass or more, and more preferably 30% by mass or more, more preferably 50% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 85% by mass or more, and usually 99% by mass or less, It is preferably 97% by mass or less, more preferably 95% by mass or less. When the content is at least the above lower limit, there is a tendency to obtain appropriate development solubility and sensitivity, and when the content is at most the above upper limit, there is a tendency to obtain appropriate development solubility and sensitivity.

Further, the mixing ratio of (C) alkali-soluble resin to (A) ethylenically unsaturated compound in the photosensitive resin composition is 50 parts by mass or more with respect to 100 parts by mass of (A) ethylenically unsaturated compound. Preferably, it is 60 parts by mass or more, more preferably 70 parts by mass or more, particularly preferably 80 parts by mass or more, and preferably 400 parts by mass or less, more preferably 300 parts by mass or less, and even more preferably 200 parts by mass or less. , 100 parts by mass or less is particularly preferred. When it is at least the above lower limit, there is a tendency for substrate adhesion to become stronger, and when it is at most the above upper limit, the curability increases, and the minimum exposure amount required for liquid repellency to occur becomes low. Tend.

[1-1-4] Component (D): Liquid Repellent The photosensitive resin composition for forming partition walls of the present invention may contain (D) a liquid repellent. In particular, when an organic electroluminescent element is produced by an inkjet method, it is preferable to contain (D) a liquid-repellent agent. It is thought that the obtained partition can prevent color mixture in each light-emitting portion (pixel portion) of the organic layer.
Examples of liquid repellent agents include silicone-containing compounds and fluorine compounds, and preferably liquid repellent agents having a cross-linking group (hereinafter sometimes referred to as "cross-linking group-containing liquid repellent agent"). Examples of the cross-linking group include an epoxy group and an ethylenically unsaturated group, preferably an ethylenically unsaturated group from the viewpoint of suppressing the outflow of the liquid-repellent component of the developer.
When a cross-linking group-containing liquid-repellent agent is used, the cross-linking reaction on the surface of the formed coating film can be accelerated when exposed to light, making it difficult for the liquid-repellent agent to flow out during development. can be made to exhibit high liquid repellency.

When a fluorine-based compound is used as the liquid-repellent agent, the fluorine-based compound tends to be oriented on the surfaces of the partition walls and work to prevent ink bleeding and color mixing. More specifically, groups containing fluorine atoms tend to repel ink and prevent ink bleeding and color mixing due to ink crossing the partition walls and entering adjacent regions.

Specific examples of crosslinking group-containing liquid repellents, particularly ethylenically unsaturated group-containing fluorine compounds include perfluoroalkylsulfonic acids, perfluoroalkylcarboxylic acids, perfluoroalkylalkylene oxide adducts, and perfluoroalkyltrialkylammonium salts. , an oligomer containing a perfluoroalkyl group and a hydrophilic group, an oligomer containing a perfluoroalkyl group and a lipophilic group, an oligomer containing a perfluoroalkyl group, a hydrophilic group and a new oil group, a urethane containing a perfluoroalkyl group and a hydrophilic group, and a perfluoroalkyl group. Fluorine-containing organic compounds such as fluoroalkyl esters and perfluoroalkyl phosphates can be mentioned. Commercial products of these fluorine-containing compounds include DIC's "Megafac F116", "Megafac F120", "Megafac F142D", "Megafac F144D", "Megafac F150", "Megafac F160", "Megafuck F171", "Megafuck F172", "Megafuck F173", "Megafuck F177", "Megafuck F178A", "Megafuck F178K", "Megafuck F179", "Megafuck F183", "Megafuck F183" Fuck F184", "Megafuck F191", "Megafuck F812", "Megafuck F815", "Megafuck F824", "Megafuck F833", "Megafuck RS101", "Megafuck RS102", "Megafuck RS105" , “Megafuck RS201”, “Megafuck RS202”, “Megafuck RS301”, “Megafuck RS303”, “Megafuck RS304”, “Megafuck RS401”, “Megafuck RS402”, “Megafuck RS501”, “Mega Fac RS502", "Megafac RS-72-K", "DEFENSA MCF300", "DEFENSA MCF310", "DEFENSA MCF312", "DEFENSA MCF323", 3M Japan's "Florado FC430", "Florado FC431", "FC -4430", "FC4432", "Asahi Guard AG710" manufactured by Asahi Glass Co., Ltd., "Surfron S-382", "Surfron SC-101", "Surfron SC-102", "Surfron SC-103", "Surfron SC-104" , ``Surflon SC-105'', ``Surflon SC-106'', and ``Optool DAC-HP'' manufactured by Daikin Industries, Ltd., and the like.

Thus, when a fluorine-based compound is used as the liquid repellent agent, the fluorine atom content in the liquid repellent agent is not particularly limited, but the fluorine atom content is preferably 1% by mass or more, more preferably 5% by mass or more. , Moreover, 50 mass % or less is preferable, and 25 mass % or less is more preferable. When the content is equal to or higher than the lower limit, there is a tendency to suppress outflow to the pixel portion, and when the content is equal to or lower than the upper limit, a high contact angle tends to be exhibited.

The molecular weight of the liquid-repellent agent is not particularly limited, and it may be a low-molecular-weight compound or a high-molecular-weight compound. A high-molecular-weight liquid-repellent agent is preferable because the fluidity of the liquid-repellent agent due to post-baking can be suppressed, and the outflow of the liquid-repellent agent from the bank can be suppressed. From this viewpoint, the number average molecular weight of the liquid-repellent agent is 100 or more. is preferred, 500 or more is more preferred, 100,000 or less is preferred, and 10,000 or less is more preferred.

The content of (D) the liquid repellent agent in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.1% by mass or more, and usually 1% by mass or less, preferably 0.1% by mass or more, based on the total solid content. is 0.5% by mass or less, more preferably 0.3% by mass or less. When the concentration is equal to or higher than the lower limit, high liquid repellency tends to be exhibited, and when the concentration is equal to or lower than the upper limit, the outflow of the liquid repellent agent to the pixel portion tends to be suppressed.

On the other hand, in the photosensitive resin composition for forming partition walls of the present invention, a surfactant may be used together with (D) the liquid-repellent agent, or a surfactant may be used instead of the (D) liquid-repellent agent. Surfactants can be used for the purpose of improving the applicability of the photosensitive resin composition for forming partition walls as a coating liquid and the developability of the coating film. Among them, fluorine-based or silicone-based surfactants are preferred. .
In particular, during development, there is an action to remove the residue of the photosensitive resin composition from the unexposed area, also, since it has a function to express the wettability, silicone-based surfactants are preferable, polyether-modified silicone-based Surfactants are more preferred.

Compounds having a fluoroalkyl or fluoroalkylene group on at least one of the terminal, main chain and side chain are suitable as the fluorosurfactant. Specifically, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di( 1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di(1,1,2,2- tetrafluorobutyl) ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecylsulfonate, 1,1,2,2,8,8,9, 9,10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane and the like can be mentioned. These commercial products include, for example, BM Chemie "BM-1000", "BM-1100", DIC "Megafac F142D", "Megafac F172", "Megafac F173", "Megafac F183" , ``Megafac F470'', ``Megafac F475'', ``FC430'' manufactured by 3M Japan, and ``DFX-18'' manufactured by Neos.

Examples of silicone surfactants include "DC3PA", "SH7PA", "DC11PA", "SH21PA", "SH28PA", "SH29PA", "8032Additive" and "SH8400" manufactured by Dow Corning Toray Co., Ltd. Commercial products such as "BYK323" and "BYK330" manufactured by BYK-Chemie can be mentioned.
Surfactants other than fluorine-based surfactants and silicone-based surfactants may be included, and other surfactants include nonionic, anionic, cationic, and amphoteric surfactants. be done.

Examples of the nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, Glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythrityl fatty acid esters, polyoxyethylene pentaerythritic fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbit fatty acid esters, polyoxy Ethylene sorbite fatty acid esters and the like can be mentioned. Examples of these commercially available products include polyoxyethylene-based surfactants such as "Emulgen 104P" and "Emulgen A60" manufactured by Kao Corporation.

Examples of the anionic surfactant include alkylsulfonates, alkylbenzenesulfonates, alkylnaphthalenesulfonates, polyoxyethylene alkylethersulfonates, alkylsulfates, alkylsulfates, and higher alcohol sulfuric acid. Ester salts, fatty alcohol sulfate ester salts, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, special Examples include polymeric surfactants. Among them, a special polymeric surfactant is preferable, and a special polycarboxylic acid type polymeric surfactant is more preferable. As such anionic surfactants, commercially available products can be used. For example, for alkyl sulfate ester salts, "Emal 10" manufactured by Kao Corporation, etc., and for alkylnaphthalene sulfonates, "Pelex NB-L" manufactured by Kao Corporation. For example, special polymeric surfactants such as "Homogenol L-18" and "Homogenol L-100" manufactured by Kao Corporation can be mentioned.

Furthermore, examples of cationic surfactants include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts, and examples of amphoteric surfactants include betaine compounds, imidazolium salts, imidazolines, and amino acids. etc. Among these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Commercially available alkylamine salts include, for example, "Acetamine 24" manufactured by Kao Corporation, and quaternary ammonium salts such as "Cortamine 24P" and "Cortamine 86W" manufactured by Kao Corporation.
In addition, two or more surfactants may be used in combination. For example, silicone surfactant/fluorosurfactant, silicone surfactant/special polymer surfactant, fluorine surfactant / A combination of special polymeric surfactants. Among them, a combination of silicone surfactant/fluorosurfactant is preferable. In this combination of silicone-based surfactant / fluorine-based surfactant, for example, / "DFX-18" manufactured by Neos, "BYK-300" or "BYK-330" manufactured by BYK Chemie / "S -393", "KP340" manufactured by Shin-Etsu Silicone Co., Ltd. / "F-478" or "F-475" manufactured by DIC, "SH7PA" manufactured by Dow Corning Toray / "DS-401" manufactured by Daikin, NUC "L-77"/"FC4430" manufactured by 3M Japan.

[1-1-5] Polymerization Inhibitor The partition-forming photosensitive resin composition of the present invention may contain a polymerization inhibitor. It is thought that the inclusion of a polymerization inhibitor inhibits radical polymerization, and thus the taper angle of the obtained partition walls can be increased.
Polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, 2,6-di-tert-butyl-4-cresol (BHT) and the like. Among these, hydroquinone or methoxyphenol is preferable, and methylhydroquinone is more preferable, from the viewpoint of the ability to inhibit polymerization.

It is preferable to contain one or more polymerization inhibitors. Normally, when producing the (C) alkali-soluble resin, the resin may contain a polymerization inhibitor, which may be used as the polymerization inhibitor of the present invention. In addition, the same or different polymerization inhibitor may be added during the production of the photosensitive resin composition.

The content of the polymerization inhibitor in the photosensitive resin composition is generally 0.0005% by mass or more, preferably 0.001% by mass or more, more preferably 0.001% by mass or more, based on the total solid content of the photosensitive resin composition. 01% by mass or more, and usually 0.3% by mass or less, preferably 0.2% by mass or less, more preferably 0.1% by mass or less. The taper angle tends to be increased by making it equal to or greater than the lower limit, and the high sensitivity tends to be maintained by making it equal to or less than the upper limit.

[1-1-6] Ultraviolet Absorber The partition-forming photosensitive resin composition of the present invention may contain an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing a specific wavelength of the light source used for exposure by the ultraviolet absorber. Addition of an ultraviolet absorber provides effects such as improving the taper angle and shape after development and eliminating residues remaining in non-exposed areas after development. From the viewpoint of inhibiting the light absorption of the initiator, for example, a compound having an absorption maximum between 250 nm and 400 nm in wavelength can be used as the ultraviolet absorber.
Examples of UV absorbers include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes.
These ultraviolet absorbers can be used singly or in combination of two or more.

Among these, from the viewpoint of increasing the taper angle, benzotriazole compounds and/or hydroxyphenyltriazine compounds are preferred, and benzotriazole compounds are particularly preferred.

Among the benzotriazole-based compounds, a benzotriazole compound represented by the following general formula (Z1) is preferable from the point of tapered shape.

In the above formula (Z1), R ^1e and R ^2e are each independently a hydrogen atom, an optionally substituted alkyl group, a group represented by the following general formula (Z2), or a group represented by the following general formula (Z3 ) represents a group represented by R ^3e represents a hydrogen atom or a halogen atom.

In formula (Z2) above, R ^4e represents an optionally substituted alkylene group, and R ^5e represents an optionally substituted alkyl group.

In formula (Z3) above, R ^6e represents an optionally substituted alkylene group, and R ^7e represents a hydrogen atom or a methyl group.

(R ^1e and R ^2e )
In formula (Z1), R ^1e and R ^2e are each independently a hydrogen atom, an optionally substituted alkyl group, a group represented by general formula (Z2), or a group represented by general formula (Z3) represents the group represented.
Alkyl groups include linear, branched or cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, further preferably 4 or more, preferably 10 or less, more preferably 6 or less, It is more preferably 4 or less.

Specific examples of alkyl groups include methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl groups. Among these, a tert-butyl group is preferred.
Examples of substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, and carboxyl group. , an acryloyl group, a methacryloyl group, and the like.

( ^R3e )
In formula (Z1), R ^3e represents a hydrogen atom or a halogen atom.
Halogen atoms include fluorine, chlorine, bromine, and iodine atoms.
Among these, from the viewpoint of synthesis, R ^3e is preferably a hydrogen atom.

( ^R4e )
In formula (Z2) above, R ^4e represents an optionally substituted alkylene group.
Alkylene groups include linear, branched and cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less.

Specific examples of the alkylene group include methylene group, ethylene group, propylene group, propylene group, and butylene group. Among these, an ethylene group is preferred.
Examples of substituents that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxyl group. , an acryloyl group, a methacryloyl group, and the like.

Among these, R ^4e is preferably an ethylene group.

( ^R5e )
In the formula (Z2), represents an optionally substituted alkyl group.
Alkyl groups include linear, branched or cyclic alkyl groups. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, further preferably 7 or more, preferably 15 or less, more preferably 10 or less, It is more preferably 9 or less.

Specific examples of alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl and nonyl groups.
Examples of substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, and carboxyl group. , an acryloyl group, a methacryloyl group, and the like.
Among these, R ^5e is preferably a heptyl group, an octyl group, or a nonyl group from the viewpoint of a tapered shape.

( ^R6e )
In formula (Z3), R ^6e represents an optionally substituted alkylene group.
Alkylene groups include linear, branched and cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less.

Specific examples of the alkylene group include methylene group, ethylene group, propylene group, propylene group, and butylene group. Among these, an ethylene group is preferred.
Examples of substituents that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxyl group. , an acryloyl group, a methacryloyl group, and the like.

Among these, from the viewpoint of a tapered shape, R ^1e is a tert-butyl group and R ^2e is a group represented by the formula (Z2) (provided that R ^4e is an ethylene group and R ^5e is an alkyl group having 7 to 9 carbon atoms). , a compound in which R ^3e is a hydrogen atom, or R ^1e is a hydrogen atom, R ^2e is a group represented by the formula (Z3) (provided that R ^6e is an ethylene group and R ^7e is a methyl group), R ^3e is a hydrogen atom R ^1e is a tert-butyl group, R ^2e is a group represented by the above formula (Z2) (provided that R ^4e is an ethylene group, R ^5e is an alkyl group having 7 to 9 carbon atoms), R ^3e is a hydrogen atom is more preferred.

Specific examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, octyl-3-[ 3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-( 5-chloro-2H-benzotriazol-2-yl)phenyl]propionate mixture, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-( 3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(3,5-di-tert-amyl-2-hydroxyphenyl)benzotriazole, 2-(2'-hydroxy -5′-tert-octylphenyl)benzotriazole, benzenepropanoic acid, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, C7-9 side chain and Linear alkyl ester compound, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)- 6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, and the like. Among these, from the viewpoint of taper angle and exposure sensitivity, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, C7-9 side chain and linear alkyl Ester compounds are preferred.

Examples of commercially available benzotriazole compounds include Sumisorb 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry), TINUVIN PS. 、ＴＩＮＵＶＩＮ９９－２、ＴＩＮＵＶＩＮ１０９、ＴＩＮＵＶＩＮ３８４－２、ＴＩＮＵＶＩＮ ３２６、ＴＩＮＵＶＩＮ９００、ＴＩＮＵＶＩＮ９２８、ＴＩＮＵＶＩＮ１１３０（ＢＡＳＦ製）、ＥＶＥＲＳＯＲＢ７０、ＥＶＥＲＳＯＲＢ７１、ＥＶＥＲＳＯＲＢ７２、ＥＶＥＲＳＯＲＢ７３、ＥＶＥＲＳＯＲＢ７４、ＥＶＥＲＳＯＲＢ７５、ＥＶＥＲＳＯＲＢ７６、ＥＶＥＲＳＯＲＢ２３４、ＥＶＥＲＳＯＲＢ７７、ＥＶＥＲＳＯＲＢ７８、ＥＶＥＲＳＯＲＢ８０、ＥＶＥＲＳＯＲＢ８１（台湾永Hikari Kagaku Kogyo), Tomisorb 100, Tomisorb 600 (manufactured by API Corporation), SEESORB701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, SEESORB709 (manufactured by Sipro Kasei), RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.), and the like. .

Triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazin-2-yl]-5-octyloxyphenol, 2-[4,6-bis( 2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, 2-(2,4-dihydroxyphenyl)-4 2,4-bis "2-hydroxy-4-butoxyphenyl"- 6-(2,4-dibutoxyphenyl)-1,3-5-triazine, etc. Among these, hydroxyphenyltriazine compounds are preferred from the viewpoint of taper angle and exposure sensitivity.
Examples of commercially available triazine-based compounds include TINUVIN400, TINUVIN405, TINUVIN460, TINUVIN477, and TINUVIN479 (manufactured by BASF).

Other ultraviolet absorbers include, for example, Sumisorb 130 (manufactured by Sumitomo Chemical), EVERSORB10, EVERSORB11, EVERSORB12 (manufactured by Taiwan Eikoh Chemical Co., Ltd.), Tomisorb 800 (manufactured by API Corporation), SEESORB100, SEESORB101, SEESORB101S, SEESORB102, SEESORB103, Benzophenone compounds such as SEESORB105, SEESORB106, SEESORB107, SEESORB151 (manufactured by Cipro Kasei); Benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical) and phenyl salicylate; 2-ethylhexyl cinnamate, 2-ethylhexyl paramethoxycinnamate, isopropyl methoxycinnamate , cinnamic acid derivatives such as isoamyl methoxycinnamate; Dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxy Naphthalene derivatives such as naphthalene; anthracene and its derivatives such as anthracene and 9,10-dihydroxyanthracene; azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes , dyes such as p-aminobenzoic acid dyes; Among these, from the viewpoint of exposure sensitivity, cinnamic acid derivatives and naphthalene derivatives are preferred, and cinnamic acid derivatives are particularly preferred.

The content of the ultraviolet absorber in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.05% by mass or more, more preferably 0.1% by mass, relative to the total solid content. Above, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, and usually 15% by mass or less, preferably 10% by mass or less, more preferably 5% by mass or less, further preferably 3% by mass % or less. The taper angle tends to increase when it is equal to or higher than the lower limit, and the sensitivity tends to be high when it is equal to or lower than the upper limit.

In addition, the compounding ratio of (B) to the photopolymerization initiator is usually 1 part by mass or more, preferably 10 parts by mass or more, more preferably 10 parts by mass or more, as a compounding amount of the ultraviolet absorber with respect to 100 parts by mass of the photopolymerization initiator (B). 30 parts by mass or more, more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, usually 500 parts by mass or less, preferably 300 parts by mass or less, more preferably 200 parts by mass or less, further preferably 150 parts by mass It is below. The taper angle tends to increase when the lower limit value or more is used, and the sensitivity tends to be high when the upper limit value or less is used.

[1-1-7] Thermal polymerization initiator Further, the photosensitive resin composition for forming partition walls of the present invention may contain a thermal polymerization initiator. Inclusion of a thermal polymerization initiator tends to increase the degree of cross-linking of the film. Specific examples of such thermal polymerization initiators include azo compounds, organic peroxides and hydrogen peroxide. These may be used individually by 1 type, and may use 2 or more types together.

In addition, when a thermal polymerization initiator is used in combination with the expectation of improving the sensitivity of the photopolymerization initiator and increasing the crosslink density of the film, the total content of these is the photopolymerization initiator in the photosensitive resin composition described above. It is preferable to make the content ratio of the photopolymerization initiator and the thermal polymerization initiator used together. It is preferably 5 to 300 parts by mass.

[1-1-8] Amino Compound The photosensitive resin composition for forming partition walls of the present invention may contain an amino compound in order to accelerate thermosetting. In this case, the content of the amino compound in the photosensitive resin composition is usually 40% by mass or less, preferably 30% by mass or less, relative to the total solid content of the photosensitive resin composition. Moreover, it is usually 0.5% by mass or more, preferably 1% by mass or more. When the content is equal to or less than the upper limit, storage stability tends to be maintained, and when the content is equal to or greater than the lower limit, sufficient thermosetting property tends to be ensured.

Examples of amino compounds include amino compounds having a methylol group as a functional group and at least two alkoxymethyl groups obtained by subjecting the methylol group to condensation-denaturation with an alcohol having 1 to 8 carbon atoms. Specifically, for example, melamine resin obtained by polycondensation of melamine and formaldehyde; benzoguanamine resin obtained by polycondensation of benzoguanamine and formaldehyde; glycoluril resin obtained by polycondensation of glycoluril and formaldehyde; Examples include polycondensed urea resins; resins obtained by co-polycondensing two or more of melamine, benzoguanamine, glycoluril, or urea with formaldehyde; and modified resins obtained by modifying the methylol groups of the above resins by alcohol condensation. These may be used individually by 1 type, and may use 2 or more types together. Of these amino compounds, melamine resins and modified resins thereof are preferred, modified resins having a modified ratio of methylol groups of 70% or more are more preferred, and modified resins having a modified ratio of methylol groups of 80% or more are particularly preferred.

Specific examples of the amino compounds include melamine resins and modified resins thereof; 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, 1158, and "Nikalac" (registered trademark) MW-390, MW-100LM manufactured by Sanwa Chemical Co., Ltd. , MX-750LM, MW-30M, MX-45, MX-302 and the like. Examples of the benzoguanamine resin and its modified resin include Cymel (registered trademark) 1123, 1125 and 1128 manufactured by Cytech. Examples of the glycoluril resin and modified resin thereof include "Cymel" (registered trademark) 1170, 1171, 1174, and 1172 manufactured by Cytec Co., Ltd., and "Nikalac" (registered trademark) MX manufactured by Sanwa Chemical Co., Ltd. -270 and the like. Examples of the urea resin and its modified resin include "UFR" (registered trademark) 65, 300 manufactured by Cytec Co., Ltd., and "Nikalac" (registered trademark) MX-290 manufactured by Sanwa Chemical Co., Ltd. be done.

[1-1-9] Colorant The photosensitive resin composition for forming partition walls of the present invention may contain a colorant for the purpose of coloring the partition walls. As the coloring agent, known coloring agents such as pigments and dyes can be used. Further, for example, when a pigment is used, a known dispersant or dispersing aid may be used in combination so that the pigment can stably exist in the photosensitive resin composition without aggregating. In particular, by coloring the liquid-repellent partition walls black, there is an effect that clear pixel display can be obtained. As a black coloring agent, in addition to black dyes, black pigments, carbon black, titanium black, etc., it is also effective to mix organic pigments for black coloring as an effect of imparting low conductivity. The content of the colorant is usually 60% by mass or less, preferably 40% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoint of plate-making properties and color characteristics.
On the other hand, for the purpose of reducing outgassing from the partition walls, it is desirable to make the partition walls transparent. % or less, more preferably 5 mass % or less, and particularly preferably 0 mass %.

[1-1-10] Coatability improver and development improver The photosensitive resin composition for forming partition walls of the present invention contains a coatability improver and a development improver to improve the coatability and development solubility. It may be Known cationic, anionic, nonionic, fluorine-based and silicone-based surfactants can be used as coatability improvers or development improvers. Further, as a development modifier, a known one such as an organic carboxylic acid or its anhydride can be used. From the viewpoint of sensitivity, the content is usually 20% by mass or less, preferably 10% by mass or less, relative to the total solid content of the photosensitive resin composition.

[1-1-11] Silane Coupling Agent It is also preferable to add a silane coupling agent to the photosensitive resin composition for forming partition walls of the present invention in order to improve adhesion to the substrate. Various types of silane coupling agents such as epoxy, methacrylic, amino, and imidazole can be used. From the viewpoint of improving adhesion, epoxy and imidazole silane coupling agents are particularly preferred. From the viewpoint of adhesion, the content is usually 20% by mass or less, preferably 15% by mass or less, relative to the total solid content of the photosensitive resin composition.

[1-1-12] Phosphoric acid-based adhesion improver It is also preferable to add a phosphoric acid-based adhesion improver to the photosensitive resin composition for forming partition walls of the present invention in order to improve the adhesion to the substrate. (Meth)acryloyloxy group-containing phosphates are preferable as the phosphoric acid-based adhesion improver, and among them, those represented by the following general formulas (Va), (Vb), and (Vc) are preferable.

In general formulas (Va), (Vb) and (Vc) above, R ⁸ represents a hydrogen atom or a methyl group, r and r' are integers of 1 to 10, and s is 1, 2 or 3.

[1-1-13] Inorganic filler In addition, the photosensitive resin composition for forming partition walls of the present invention further has improved strength as a cured product and moderate interaction with an alkali-soluble resin (formation of a matrix structure). ) may contain an inorganic filler for the purpose of improving the flatness of the coating film and improving the taper angle. Examples of such inorganic fillers include talc, silica, alumina, barium sulfate, magnesium oxide, and those surface-treated with various silane coupling agents.

The average particle size of these inorganic fillers is usually 0.005 to 20 μm, preferably 0.01 to 10 μm. Here, the average particle size referred to in the present embodiment is a value measured with a laser diffraction scattering particle size distribution analyzer manufactured by Beckman Coulter. Among these inorganic fillers, silica sol and silica sol-modified products tend to be excellent in the effect of improving the taper angle as well as the dispersion stability, so they are preferably blended. When the photosensitive resin composition for forming partition walls of the present invention contains these inorganic fillers, the content thereof is usually 5% by mass or more, preferably 10% by mass, based on the total solid content, from the viewpoint of sensitivity. or more, and usually 80% by mass or less, preferably 70% by mass or less.

[1-1-14] Solvent The photosensitive resin composition for forming partition walls of the present invention usually contains a solvent, and each component described above is used in a state of being dissolved or dispersed in the solvent (hereinafter, solvent is included). A photosensitive resin composition may be referred to as a “photosensitive resin composition solution”). The solvent is not particularly limited, but includes, for example, the organic solvents described below.

Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-tert-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethylpentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, tri Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, Glycol dialkyl ethers such as dipropylene glycol dimethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, tri Glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, 3-methoxy-1-butyl acetate; ethylene glycol diacetate, 1 ,3-butylene glycol diacetate, 1,6-hexanol diacetate and other glycol diacetates; cyclohexanol acetate and other alkyl acetates; amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether Ethers such as , ethyl isobutyl ether, dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methylhexyl Ketones such as ketone, methyl nonyl ketone, methoxymethylpentanone; methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethyl pen monohydric or polyhydric alcohols such as tanol, glycerin, and benzyl alcohol; aliphatic hydrocarbons such as n-pentane, n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane; cyclohexane, methylcyclohexane , methylcyclohexene, bicyclohexyl and other alicyclic hydrocarbons; benzene, toluene, xylene, cumene and other aromatic hydrocarbons; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate , methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, 3- Linear or cyclic esters such as ethyl ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, γ-butyrolactone; 3-methoxypropionic acid , Alkoxycarboxylic acids such as 3-ethoxypropionic acid; Halogenated hydrocarbons such as butyl chloride and amyl chloride; Ether ketones such as methoxymethylpentanone; Nitriles such as acetonitrile and benzonitrile: Tet and tetrahydrofurans such as lahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran.

Commercially available solvents corresponding to the above include Mineral Spirit, Valsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and no. 2. Solvesso #150, Shell TS28 solvent, carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, diglyme (all trade names), and the like.

The solvent is capable of dissolving or dispersing each component in the photosensitive resin composition, and is selected according to the usage of the photosensitive resin composition of the present invention. It is preferable to select one having a boiling point in the range of 60 to 280° C. under atmospheric pressure (1013.25 hPa). More preferably, it has a boiling point of 70° C. or higher and 260° C. or lower, such as propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate and 3-methoxy-1-butyl acetate.

These solvents can be used singly or in combination of two or more. In addition, these solvents have a ratio of the total solid content in the photosensitive resin composition solution that is usually 10% by mass or more, preferably 15% by mass or more, more preferably 20% by mass or more, and usually 90% by mass or less, preferably is preferably 50% by mass or less, more preferably 40% by mass or less, and still more preferably 30% by mass or less. When it is at least the above lower limit, there is a tendency that a coating film can be obtained even with a high film thickness, and when it is at most the above upper limit, there is a tendency that moderate coating uniformity can be obtained.

[1-2] Method for Preparing Partition Wall-Forming Photosensitive Resin Composition The partition wall-forming photosensitive resin composition of the present invention is prepared by mixing the components described above with a stirrer. In addition, you may filter using a membrane filter etc. so that the prepared photosensitive resin composition may be uniform.

[2] Partitions and Method for Forming Partitions The photosensitive resin composition of the present invention can be suitably used for forming partitions, particularly partitions for partitioning the organic layers (light-emitting portions) of organic electroluminescence elements.
The method for forming the partition walls (banks) using the partition-forming photosensitive resin composition described above is not particularly limited, and conventionally known methods can be employed. The method for forming the partition walls includes, for example, a coating step of applying a partition-forming photosensitive resin composition onto a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer. , and the like. Specific examples of the method for forming such partition walls include an inkjet method and a photolithography method.

In the inkjet method, a photosensitive resin composition for forming barrier ribs whose viscosity has been adjusted by dilution with a solvent or the like is used as ink, and ink droplets are discharged onto a substrate along a predetermined pattern of barrier ribs by an inkjet method. A resin composition is applied onto a substrate to form a pattern of uncured barrier ribs. The pattern of uncured barrier ribs is then exposed to form cured barrier ribs on the substrate. The exposure of the uncured barrier rib pattern is performed in the same manner as the exposure step in the photolithography method described later, except that no mask is used.

In the photolithography method, a photosensitive resin composition for forming partition walls is applied to the entire area of the substrate where the partition walls are to be formed to form a photosensitive resin composition layer. After the formed photosensitive resin composition layer is exposed according to a predetermined pattern of barrier ribs, the exposed photosensitive resin composition layer is developed to form barrier ribs on the substrate.

In the coating step of applying a photosensitive resin composition onto a substrate in the photolithography method, a contact transfer type coating device such as a roll coater, reverse coater, bar coater, etc. or a spinner (rotary A photosensitive resin composition is applied using a non-contact type coating device such as a coating device) or a curtain flow coater, and if necessary, the solvent is removed by drying to form a photosensitive resin composition layer.

Next, in the exposure step, a negative mask is used to irradiate the photosensitive resin composition with active energy rays such as ultraviolet light and excimer laser light, and the photosensitive resin composition layer is partially exposed according to the partition wall pattern. exposed to For exposure, a light source that emits ultraviolet rays, such as a high-pressure mercury lamp, an extra-high pressure mercury lamp, a xenon lamp, or a carbon arc lamp, can be used. Although the amount of exposure varies depending on the composition of the photosensitive resin composition, it is preferably about 10 to 400 mJ/cm ² , for example.

Next, in the developing step, the partition walls are formed by developing the exposed photosensitive resin composition layer according to the pattern of the partition walls with a developer. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Specific examples of the developer include organic ones such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. mentioned. Moreover, an antifoaming agent or a surfactant can be added to the developer.

After that, the barrier ribs after development are post-baked and cured by heating. Post-baking is preferably performed at 150 to 250° C. for 15 to 60 minutes.

The substrate used for forming the partition is not particularly limited, and is appropriately selected according to the type of the organic electroluminescence device manufactured using the substrate on which the partition is formed. Suitable substrate materials include glass and various resin materials. Specific examples of the resin material include polyester such as polyethylene terephthalate; polyolefin such as polyethylene and polypropylene; polycarbonate; poly(meth)methacrylic resin; polysulfone; and polyimide. Among these substrate materials, glass and polyimide are preferable because of their excellent heat resistance. A transparent electrode layer such as ITO or ZnO may be provided in advance on the surface of the substrate on which the barrier ribs are formed, depending on the type of organic electroluminescence element to be manufactured.

[3] Organic electroluminescence device The organic electroluminescence device of the present invention includes partition walls made of the above-described partition-forming photosensitive resin composition.
Various optical elements are manufactured using the substrate provided with the partition pattern manufactured by the method described above. The method for forming the organic electroluminescence device is not particularly limited, but preferably, after forming the partition pattern on the substrate by the above method, ink is injected into the region surrounded by the partition on the substrate to form pixels and the like. An organic electroluminescence device is manufactured by forming an organic layer.
Types of organic electroluminescence devices include bottom emission type and top emission type.
In the bottom emission type, for example, partition walls are formed on a glass substrate laminated with transparent electrodes, and a hole transport layer, a light-emitting layer, an electron transport layer, and a metal electrode layer are laminated in an opening surrounded by the partition walls. be. On the other hand, in the top emission type, for example, barrier ribs are formed on a glass substrate laminated with a metal electrode layer, and an electron transport layer, a light emitting layer, a hole transport layer, and a transparent electrode layer are stacked in an opening surrounded by the barrier ribs. made by
Examples of the light-emitting layer include organic electroluminescent layers as described in JP-A-2009-146691 and Japanese Patent No. 5734681. Quantum dots as described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may also be used.

If the taper angle of the partition wall is low and the lower part of the partition wall has a trailing shape, no light is emitted even if a vapor deposition layer is formed on the upper part of the part, so the light emitting area is reduced. Also, when the light-emitting layer is produced by the inkjet method, the ink for forming the organic layer is repelled by the base of the partition, so the area surrounded by the partition may not be uniformly coated with the ink for forming the organic layer. be. On the other hand, by having a high taper angle and a good shape without tailing, it is possible to emit light in the area surrounded by the partition wall, and in the inkjet method, it is uniformly coated with the ink for forming the organic layer. can do. As a result, for example, the problem of halation in the organic EL display element can be resolved.

Water, an organic solvent, and a mixed solvent thereof can be used as the solvent used when forming the ink for forming the organic layer. The organic solvent is not particularly limited as long as it can be removed from the film formed after injecting the ink. Specific examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate and butyl acetate, 3-phenoxytoluene, etc. In addition, surfactants, antioxidants, viscosity modifiers, ultraviolet absorbers, and the like can be added to the ink.

As a method for injecting the ink into the region surrounded by the partition wall, the inkjet method is preferable because a small amount of the ink can be easily injected into a predetermined location. The ink used for forming the organic layer is appropriately selected according to the type of organic electroluminescence element to be manufactured. When the ink is injected by an inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be discharged well from the inkjet head. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, and the like.

[4] Image Display Device The image display device of the present invention includes the organic electroluminescence device described above. There are no particular restrictions on the type or structure of the image display device as long as it contains an organic electroluminescence element, and for example, it can be assembled according to a conventional method using an active drive type organic electroluminescence element. For example, the image display device of the present invention is formed by the method described in "Organic EL Display" (Ohmsha, August 20, 2004, Shizuo Tokito, Chihaya Adachi, Hideyuki Murata). can do. For example, an image may be displayed by combining an organic electroluminescent element that emits white light and a color filter, or an image may be displayed by combining organic electroluminescent elements emitting different colors such as RGB.

[5] Lighting Lighting of the present invention includes the organic electroluminescence device described above. There are no particular restrictions on the type and structure, and the organic electroluminescence device of the present invention can be assembled according to a conventional method. The organic electroluminescence element may be of a simple matrix drive system or an active matrix drive system.
In order for the illumination of the present invention to emit white light, an organic electroluminescent element that emits white light may be used. Alternatively, organic electroluminescence elements emitting different colors may be combined to form a white color by mixing the colors, or a color mixing ratio may be adjusted to provide a toning function.

Hereinafter, the photosensitive resin composition for forming partition walls of the present invention will be described with reference to specific examples, but the present invention is not limited to the following examples as long as the gist thereof is not exceeded.

[1] Preparation of photosensitive resin composition for forming partition walls Each component was used at the blending ratio (parts by mass) shown in Table 1, and propylene glycol monomethyl ether was used so that the total solid content was 25% by mass. Using acetate, each component was stirred until uniform to prepare partition wall-forming photosensitive resin compositions of Examples and Comparative Examples.
The symbols in the table represent the following.

a-1: a mixture of the following ethylenically unsaturated compounds [a mixture of (A1) an ethylenically unsaturated compound having an acid group and (A2) an ethylenically unsaturated compound having no acid group]
In the presence of 148 parts by weight of phthalic anhydride, 2.5 parts by weight of triethylamine, and 0.25 parts by weight of hydroquinone in 490 parts by weight of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value: 113 mgKOH/g) for 5 hours to obtain a mixture a-1 containing a phthalic anhydride-modified pentaerythritol triacrylate and pentaerythritol tetraacrylate at a ratio of 70:30 (mass ratio).

a-2: A mixture of the following ethylenically unsaturated compounds [a mixture of (A1) an ethylenically unsaturated compound having an acid group and (A2) an ethylenically unsaturated compound having no acid group]
561 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value: 100 mgKOH/g), 100 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone. for 5 hours to obtain a mixture a-2 containing pentaerythritol triacrylate modified with succinic anhydride and pentaerythritol tetraacrylate at a ratio of 60:40 (mass ratio).

a-3: A mixture of the following ethylenically unsaturated compounds [a mixture of (A1) an ethylenically unsaturated compound having an acid group and (A2) an ethylenically unsaturated compound having no acid group]
In the presence of 1000 parts by mass of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (hydroxyl value of 51 mgKOH/g), 49 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone Mixture a- containing succinic anhydride-modified dipentaerythritol pentaacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate at a ratio of 25:25:50 (mass ratio), which is reacted at 100° C. for 5 hours. got 3.

a-4: Pentaerythritol tetraacrylate (PE-4A) (manufactured by Kyoeisha Chemical Co., Ltd.)

b-1: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Hodogaya Chemical Industry Co., Ltd.)

c-1: the following ethylenically unsaturated group-containing resin (epoxy acrylate resin)
100 parts by mass of a bisphenol A-type epoxy compound represented by the following formula (epoxy equivalent: 186 g/eq, n in the formula is a mixture of 1 to 20), 40 parts by mass of acrylic acid, 0.06 parts by mass of p-methoxyphenol, 2.4 parts by mass of triphenylphosphine and 126 parts by mass of propylene glycol monomethyl ether acetate were charged into a reaction vessel and stirred at 95° C. until the acid value became 5 mgKOH/g or less. Next, 3 parts by mass of propylene glycol monomethyl ether acetate was added to 80 parts by mass of the reaction solution obtained by the above reaction, 3 parts by mass of succinic anhydride was added, and the mixture was reacted at 95°C for 3 hours to obtain a solid content acid value of 40 mgKOH/g. , to obtain an alkali-soluble resin (c-1) solution having a polystyrene-equivalent weight average molecular weight (Mw) of 8,000 as measured by GPC.

d-1: Megafac RS-72-K (manufactured by DIC, fluorine-based oligomer having an ethylenic double bond)
e-1: 2-mercaptobenzimidazole (manufactured by Tokyo Kasei Co., Ltd.)
e-2: Pentaerythritol tetrakis (3-mercaptopropionate) (manufactured by Yodo Chemical Co., Ltd.)
f-1: TINUVIN384-2 (manufactured by BASF, UV absorber)
g-1: KAYAMER PM-21 (manufactured by Nippon Kayaku Co., Ltd.)

[2] Formation of Cured Product and Partition Walls, and Their Evaluation Methods for evaluating the performance of each photosensitive resin composition will be described below.

(Preparation of substrate for contact angle measurement)
A glass substrate having an ITO film formed on its surface was coated with each partition-forming photosensitive resin composition using a spinner on the ITO film so as to have a thickness of 1.5 μm after heat curing. Ten sheets were prepared for each flexible resin composition. After that, it was dried by heating on a hot plate at 100° C. for 2 minutes, and the obtained coating film was exposed to light in the range of 50 to 500 mJ/cm ² at intervals of 50 mJ/cm ² for each substrate without using a mask. exposed. At this time, the intensity at a wavelength of 365 nm was 40 mW/cm ² . Next, after spray development with a 2.38% by mass TMAH (tetramethylammonium hydroxide) aqueous solution at 24° C. for 60 seconds, it was washed with pure water for 10 seconds. This substrate was heat-cured in an oven at 230° C. for 30 minutes to obtain a substrate for contact angle measurement in which a cured product was formed.

(Evaluation of contact angle)
Since the curability varies depending on the sensitivity of the composition, the amount of light exposure that produces liquid repellency varies depending on the composition. Here, the amount of exposure that causes liquid repellency means the amount of exposure that causes the contact angle of the resulting cured product to be 10 degrees or more. The contact angle with respect to propylene glycol monomethyl ether acetate was measured using the aforementioned contact angle measuring substrate, and substrates with a contact angle of 10 degrees or more were identified. Table 1 shows the minimum exposure amount among the exposure amounts during the preparation of these substrates. The contact angle was measured using a Drop Master 500 contact angle measurement device manufactured by Kyowa Interface Science Co., Ltd. under the conditions of 23° C. and 50% humidity.

(Creation of partition wall)
Using a spinner, each photosensitive resin composition for partition wall formation was applied onto the ITO film of a glass substrate having an ITO film formed thereon so as to have a thickness of 1.5 μm after heat curing. After that, it was dried by heating on a hot plate at 100° C. for 2 minutes. The obtained coating film was exposed using a photomask. The amount of exposure was the minimum amount of exposure to produce liquid repellency, and the exposure gap was set to 16 μm. The photomask used was a mask having grid-shaped openings (a mask having a plurality of covering portions of 80 μm×280 μm at intervals of 40 μm). Subsequently, in the same manner as in the preparation of the substrate for contact angle measurement, development was performed with an aqueous TMAH solution, and heat curing was performed to obtain grid-like partition walls.

(Evaluation of suitability for inkjet application)
Inkjet coating was applied to the light-emitting portion (pixel portion) surrounded by the grid-like partition wall using DMP-2831 manufactured by Fuji Film Co., Ltd. on the substrate having the grid-like partition wall. As the ink, a solvent (isoamyl benzoate) was used alone, and was applied at 40 pL per pixel portion to evaluate the wetting and spreading property. The more wet and spreads the entire area of the pixel portion, the less the residue, etc. at the time of forming the partition, and the better the developability.
◯: Ink spread over the entire pixel portion.
x: A portion where the ink does not spread is partially generated in the pixel portion.

(Preparation of substrate for gas amount measurement)
Using a spinner, each photosensitive resin composition for forming partition walls was applied onto the ITO film of a glass substrate having an ITO film formed thereon so as to have a thickness of 1.5 μm after curing by heating. After that, the film was dried by heating on a hot plate at 100° C. for 2 minutes, and the obtained coating film was exposed without using a mask at the above-mentioned minimum exposure amount that causes liquid repellency. At this time, the intensity at a wavelength of 365 nm was 40 mW/cm ² . Then, in the same manner as in the preparation of the substrate for measuring the contact angle, the substrate was developed with an aqueous TMAH solution, and then heat-cured in an oven at 230° C. for 30 minutes to obtain a substrate for measuring the amount of gas in which a cured product was formed.

(Measurement of gas amount)
The gas amount measurement substrates (40 mm × 8 mm, 4 sheets) were heated in a heating furnace at 230 ° C. for 20 minutes, and outgassing was analyzed by GC / MS (manufactured by Agilent Technologies, trade name "5973N"). , the sum of the areas of all detected peak components was calculated. Next, the sum of the detected peak areas was converted to the amount of toluene using a calibration curve, and divided by the measured substrate area to calculate the outgassing amount (ng/cm ² ) converted to toluene per unit area. The calibration curve was prepared by measuring GC/MS using toluene with a known concentration and plotting the amount of toluene and the peak area value of the detected gas.

From Table 1, the partition walls obtained from the photosensitive resin composition of each example containing an ethylenically unsaturated compound having an acid group in a specific ratio had good inkjet applicability and low outgassing. rice field. This is because by using an ethylenically unsaturated compound having an acid group with excellent solubility, the generation of residues in the pixel area is suppressed and the inkjet properties are improved. It is considered that this is because the generation of outgassing from the heat source could be suppressed.
On the other hand, the partition wall obtained from the photosensitive resin composition of Comparative Example 1, which contains a large amount of an ethylenically unsaturated compound having an acid group, has good inkjet applicability, but has a large amount of outgas, which is derived from the acid group. This is thought to be because the amount of outgassing from In addition, the partition walls obtained from the photosensitive resin composition of Comparative Example 2, which did not contain an ethylenically unsaturated compound having an acid group, did not have sufficient ink-jet applicability, and this was due to the generation of residues in the pixel areas. Conceivable.
Regarding the inkjet applicability, whether or not the ink spreads throughout the pixel portion depends on whether liquid repellency derived from the residue is generated in the pixel portion. Therefore, even when a solvent other than isoamyl benzoate is used, it is considered that results similar to those of the above Examples and Comparative Examples can be obtained.

Claims (10)

(A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin, a photosensitive resin composition for forming partition walls for partitioning a light-emitting portion,
The (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the content of the (A1) ethylenically unsaturated compound having an acid group is 13% by mass in the total solid content. 21% by mass or less,
(A1) the ethylenically unsaturated compound having an acid group has 1 or more and 8 or less ethylenically unsaturated bonds in one molecule;
(A1) the ethylenically unsaturated compound having an acid group has 1 or more and 4 or less acid groups in one molecule;
The (A1) ethylenically unsaturated compound having an acid group is a compound represented by the following general formula (I),

[(In formula (I), R ¹ represents a hydrogen atom or a methyl group. ^{R 2} , R ³ , R ⁵ and R ⁶ each independently represent an optionally substituted alkylene group.
R ⁴ represents an n+1 valent linking group.
^R7 represents an optionally substituted alkylene group, an optionally substituted alkenylene group or an optionally substituted divalent aromatic ring group.
l and m each independently represent an integer of 0 to 12;
n represents an integer of 1 or more and 6 or less. ]
(D) A photosensitive resin composition for partition wall formation containing a liquid-repellent agent having a cross-linking group. 2. The photosensitive resin composition for forming partition walls according to claim 1, wherein the (A1) ethylenically unsaturated compound having an acid group has a molecular weight of 100 or more and 1,000 or less. 3. The photosensitive resin composition for forming partition walls according to claim 1, wherein the (A) ethylenically unsaturated compound further contains (A2) an ethylenically unsaturated compound having no acid group. The barrier rib formation according to any one of claims 1 to 3, wherein the content of (A1) the ethylenically unsaturated compound having an acid group is 50% by mass or less in the (A) ethylenically unsaturated compound. Photosensitive resin composition for 5. The photosensitive resin composition for forming partition walls according to claim 1, further comprising a chain transfer agent. 6. The photosensitive resin composition for forming partition walls according to any one of claims 1 to 5, further comprising an ultraviolet absorber. A partition made of the partition-forming photosensitive resin composition according to any one of claims 1 to 6. An organic electroluminescence device comprising the partition according to claim 7 . An image display device comprising the organic electroluminescence device according to claim 8 . A lighting comprising the organic electroluminescent device according to claim 8 .