JP2018041077A - Photosensitive resin composition for forming partition wall, partition wall, organic electroluminescent element, image display device and illumination - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming a partition wall, which has little outgas amount and gives high reliability when a light-emitting element using the resin composition is operated, and which gives good coating property in an inkjet method with little residue.SOLUTION: A photosensitive resin composition for forming a partition wall for partitioning a light-emitting part is provided, which comprises (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin. The (A) ethylenically unsaturated compound comprises (A1) an ethylenically unsaturated compound having an acid group, in which the content percentage of the (A1) ethylenically unsaturated compound having an acid group is 30 mass% or less in the whole solid content.SELECTED DRAWING: None

Description

  The present invention relates to a photosensitive resin composition for forming a partition used to form a partition for partitioning a light-emitting portion, and more particularly, a partition composed of a photosensitive resin composition for forming a partition and an organic including the partition. The present invention relates to an electroluminescent element, an image display device including the organic electroluminescent element, and illumination.

  Conventionally, an organic electroluminescent device included in an organic electric field display or organic electric field illumination has a barrier rib (bank) formed on a substrate, and various functional layers are laminated in a region surrounded by the barrier rib. It is manufactured by forming a light emitting part. As a method for forming such a partition easily, a method of forming by a photolithography method using a photosensitive resin composition is known (see Patent Document 1).

  In addition, as a method for laminating various functional layers in the region surrounded by the partition walls, first, an ink containing a material constituting the functional layer is prepared, and then the prepared ink is injected into the region surrounded by the partition walls. How to do is known. Among these methods, an ink jet method is often employed because a predetermined amount of ink is easily injected accurately into a predetermined location.

Furthermore, when the functional layer is formed using ink, the partition wall has ink repellency for the purpose of preventing the ink from adhering to the partition wall or preventing the ink injected between adjacent regions from being mixed together. It may be required to grant.
In recent years, various properties in addition to ink repellency are required for the partition walls, and various photosensitive resin compositions have been developed. For example, Patent Document 2 describes that by using a specific alkali-soluble resin, a specific liquid repellent, and a specific surfactant, there is no disconnection of the electrode, and it can cope with a high-resolution image.
On the other hand, Patent Document 3 describes that, in the method for manufacturing a substrate with a black resin partition for an electronic paper display, a desired taper shape can be obtained by setting the development time within a predetermined range. Yes.

JP 2010-262940 A JP 2011-165396 A JP 2010-237327 A

In recent years, in order to improve the driving life of an element, there is a demand for reducing outgas generated from the partition during light emission after the partition and element formation.
When the present inventors examined, it was difficult for the photosensitive resin composition for partition formation described in Patent Document 2 to achieve both reduction of outgas and suitability for inkjet coating. Further, the photosensitive resin composition described in Patent Document 3 is for forming a partition wall of a reflective display device such as an electronic paper display, and for forming a light-emitting portion of an organic electroluminescent element. It was unclear what characteristics would be produced when applied as an adhesive resin composition.
Accordingly, the present invention provides a photosensitive resin composition for partition wall formation for partitioning a light emitting part, which has a small amount of outgas during operation of a light emitting element, high reliability, little residue, and good applicability in an ink jet method. The purpose is to provide.
Another object of the present invention is to provide a partition formed using the photosensitive resin composition for forming a partition, an organic electroluminescent element including the partition, an image display apparatus including the organic electroluminescent element, and illumination. And

As a result of intensive studies by the present inventors, it has been found that the above-mentioned problems can be solved by containing a predetermined amount of a specific compound as an ethylenically unsaturated compound, and the present invention has been completed.
That is, the gist of the present invention is as follows.

[1] A photosensitive resin composition for forming a partition wall for partitioning a light emitting part, comprising (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin,
The (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the content ratio of the (A1) acid group having an ethylenic unsaturated compound is 30% by mass in the total solid content. The photosensitive resin composition for partition formation which is the following.
[2] The partition wall forming photosensitive resin composition according to [1], wherein the (A) ethylenically unsaturated compound further contains (A2) an ethylenically unsaturated compound having no acid group.
[3] Partition formation according to [1] or [2], wherein the content ratio of the (A1) ethylenically unsaturated compound having an acid group is 50% by mass or less in the (A) ethylenically unsaturated compound. Photosensitive resin composition.
[4] The partition-forming photosensitive resin composition according to any one of [1] to [3], further comprising (D) a liquid repellent.

[5] The photosensitive resin composition for forming a partition wall according to any one of [1] to [4], further containing a chain transfer agent.
[6] The photosensitive resin composition for forming a partition wall according to any one of [1] to [5], further comprising an ultraviolet absorber.
[7] A partition composed of the photosensitive resin composition for forming a partition according to any one of [1] to [6].
[8] An organic electroluminescence device comprising the partition wall according to [7].
[9] An image display device comprising the organic electroluminescent element according to [8].
[10] Illumination including the organic electroluminescent element according to [8].

  According to the present invention, it is possible to provide a photosensitive resin composition for forming a partition wall, which has a small amount of outgas when operating a light emitting device, high reliability, little residue, and good coating properties in an inkjet method.

Hereinafter, the present invention will be described in detail. In addition, the following description is an example of embodiment of this invention, and this invention is not specified to these, unless the summary is exceeded.
In the present invention, “(meth) acryl” means “acryl and / or methacryl”, “(meth) acrylate” means “acrylate and / or methacrylate”, Further, “total solid content” means all components other than the solvent in the photosensitive resin composition. Furthermore, the numerical range represented using “to” in the present invention means a range including numerical values described before and after “to” as a lower limit value and an upper limit value.
In the present invention, the term “(co) polymer” means that both a single polymer (homopolymer) and a copolymer (copolymer) are included, and “(acid) anhydride”, “ The term “(anhydrous)... Acid” means to include both an acid and its anhydride. In the present invention, “polybasic acid (anhydride)” means “polybasic acid and / or polybasic acid anhydride”.
In the present invention, the weight average molecular weight refers to a polystyrene equivalent weight average molecular weight (Mw) by GPC (gel permeation chromatography).

In the present invention, the partition material refers to bank material, wall material, and wall material, and similarly, the partition material refers to bank, wall, and wall.
In the present invention, the light emitting portion refers to a portion that emits light when electric energy is applied.
In the present invention, “mass” is synonymous with “weight”. In the present invention, * in the chemical formula represents a bond.

[1] Photosensitive resin composition for forming a partition for partitioning a light emitting portion The photosensitive resin composition for forming a partition of the present invention comprises (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C ) A photosensitive resin composition for forming a partition wall for partitioning a light emitting part, which contains an alkali-soluble resin, wherein (A) the ethylenically unsaturated compound is (A1) an ethylenically unsaturated compound having an acid group. The content ratio of the ethylenically unsaturated compound containing (A1) acid group is 30% by mass or less based on the total solid content. If necessary, it may further contain other components. For example, (D) a liquid repellent, a chain transfer agent, or an ultraviolet absorber may be included.

  In the present invention, examples of the partition include a partition for partitioning a functional layer (organic layer, light-emitting portion) in the active drive organic electroluminescence device, and the functional layer is configured in the partitioned region (pixel region). By discharging and drying ink, which is a material for this purpose, it can be used to form pixels or the like including functional layers and partition walls.

[1-1] Components and composition of the photosensitive resin composition for forming a partition The components and the composition of the photosensitive resin composition for forming a partition of the present invention will be described.
The photosensitive resin composition for forming a partition wall of the present invention (hereinafter sometimes simply referred to as “photosensitive resin composition”) includes (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali. It contains a soluble resin and usually further contains a solvent. Moreover, it is preferable to use the photosensitive resin composition for partition formation of this invention in order to form a liquid-repellent partition, It is preferable to contain (D) liquid repellent from the viewpoint which concerns, and the said ( You may use what shows the effect | action as a liquid repellent as A)-(C) component.

[1-1-1] (A) component; ethylenically unsaturated compound The photosensitive resin composition for partition formation of the present invention contains (A) an ethylenically unsaturated compound. (A) It is thought that it becomes high sensitivity by including an ethylenically unsaturated compound.

<(A1) ethylenically unsaturated compound having an acid group>
The (A) ethylenically unsaturated compound in the present invention contains (A1) an ethylenically unsaturated compound having an acid group, and the content ratio of the (A1) ethylenically unsaturated compound having an acid group is in the total solid content. 30% by mass or less. Thus, by containing the ethylenically unsaturated compound (A1) having an acid group, the compound is excellent in solubility in a developer, so that the generation of a residue in the pixel portion (light emitting portion) is suppressed, and the inkjet coating characteristics are improved. It is thought to improve. Furthermore, when the content ratio of the compound is equal to or less than the upper limit value, the outgas generation derived from the acid group contained in the compound is reduced, and the amount of outgas generated from the partition after the formation can be made practically sufficient. Conceivable.

  An ethylenically unsaturated compound means a compound having one or more ethylenically unsaturated bonds in the molecule. (A1) The number of ethylenically unsaturated bonds in one molecule of the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 1 or more. From the viewpoint that the difference in developer solubility in the exposed portion can be expanded, it is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, and 5 or more. It is particularly preferred that it is usually 15 or less, preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less. When the amount is not less than the lower limit, the polymerizability is improved and the sensitivity becomes high, and as the curability is increased, the amount of outgas tends to decrease, and when the amount is not more than the upper limit, the developability becomes better. Tend.

  In addition, the number of acid groups (A1) in the molecule of the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 1 or more, but from the viewpoint of curability, 4 or less is preferable, and 2 The following is more preferable, and one is more preferable. There exists a tendency for a remaining-film rate to become high by setting it as the said upper limit or less.

  In addition, the type of acid group (A1) that the ethylenically unsaturated compound having an acid group has is not particularly limited, and examples thereof include a carboxyl group, a phosphoric acid group, and a sulfone group. From the viewpoint of developability, a carboxyl group is preferable. . In the case of having two or more acid groups, the acid groups may be the same or different.

  (A1) The molecular weight of the ethylenically unsaturated compound having an acid group is not particularly limited, but is preferably 100 or more, more preferably 200 or more, further preferably 300 or more, particularly preferably 350 or more, and 1,000 or less. Preferably, 800 or less is more preferable, and 700 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to become high, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

  (A1) The chemical structure of the ethylenically unsaturated compound having an acid group is not particularly limited, but from the viewpoint of developability, for example, a compound represented by the following general formula (I) is preferable.

In the formula (I), R ¹ represents a hydrogen atom or a methyl group. R ² , R ³ , R ⁵ and R ⁶ each independently represents an alkylene group which may have a substituent.
R ⁴ represents an n + 1 valent linking group.
R ⁷ represents an alkylene group that may have a substituent, an alkenylene group that may have a substituent, or a divalent aromatic ring group that may have a substituent.
l and m each independently represents an integer of 0 to 12.
n represents an integer of 1 or more.

^{(R 2, R 3, R} 5 and R ⁶⁾
In the general formula (I), R ² , R ³ , R ⁵ and R ⁶ each independently represents an alkylene group which may have a substituent.
The alkylene group may be linear, branched, cyclic, or a combination thereof. The number of carbon atoms is not particularly limited, but is usually 1 or more, usually 4 or less, preferably 2 or less. There exists a tendency for a remaining-film rate to improve by setting it as the said upper limit or less.

  Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, and a cyclohexylene group. From the viewpoint of curability, a methylene group or an ethylene group is preferable, and methylene is more preferable.

  Examples of the substituent that the alkylene group may have include an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

(R ⁴ )
In the general formula (I), R ⁴ represents an n + 1 valent linking group. The chemical structure of the n + 1 valent linking group is not particularly limited, and examples thereof include an n + 1 valent hydrocarbon group which may have a substituent. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and is preferably an aliphatic hydrocarbon group from the viewpoint of developability. Moreover, the carbon-carbon single bond in the hydrocarbon group may be interrupted with at least one selected from the group consisting of —O—, —CO— and —NH—.

  Specific examples of the n + 1 valent linking group include the following.

(R ⁷⁾
In the general formula (I), an alkylene group that may have a substituent, an alkenylene group that may have a substituent, or a divalent aromatic ring group that may have a substituent. .

The alkylene group for R ⁷ may be linear, branched, cyclic, or a combination thereof. Although the carbon number is not particularly limited, it is usually 1 or more, preferably 2 or more, and usually 8 or less, preferably 6 or less, more preferably 4 or less, and further preferably 3 or less. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to improve, and there exists a tendency for a residue to reduce or a tendency to reduce outgas by setting it as the said upper limit or less.

  Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a hexylene group, and a cyclohexylene group. From the viewpoint of developability, a methylene group or an ethylene group is preferable, and an ethylene group is more preferable.

  Examples of the substituent that the alkylene group may have include an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

The alkenylene group in R ⁷ may be linear, branched, cyclic, or a combination thereof. Although the carbon number is not particularly limited, it is usually 2 or more, preferably 4 or more, and usually 8 or less, preferably 6 or less. There exists a tendency for a remaining-film rate to improve by setting it as the said lower limit or more, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

  Specific examples of the alkenylene group include an ethenylene group, a propenylene group, a butyleneylene group, a cyclohexenylene group, and the like. From the viewpoint of developability and curability, an ethenylene group or a cyclohexenylene group is preferable, and an ethenylene group is more preferable.

  Examples of the substituent that the alkenylene group may have include an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. Substitution is preferred.

Examples of the divalent aromatic ring group for R ⁷ include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, more preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, still more preferably 15 or less, and more preferably 10 or less. Particularly preferred. There exists a tendency for a remaining-film rate to improve by setting it as the said lower limit or more, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

  The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. As the divalent aromatic hydrocarbon ring group, for example, a benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, tetracene ring, pyrene ring, benzpyrene ring, chrysene ring having two free valences, Examples include a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. The aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, and an indole having two free valences. Ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, Examples include pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, sinoline ring, quinoxaline ring, phenanthridine ring, benzimidazole ring, perimidine ring, quinazoline ring, quinazolinone ring, and azulene ring. That. Among these, from the viewpoint of curability, a benzene or naphthalene ring having two free valences is preferable, and a benzene ring having two free valences is more preferable.

  Examples of the substituent that the divalent aromatic ring group may have include an alkyl group, an alkoxy group, a halogen atom (—F, —Cl, —Br, —I), a hydroxy group, a carboxyl group, and the like. . Among these, unsubstituted is preferable from the viewpoint of curability.

Among these, from the viewpoint of ensuring developability and reducing the outgas amount, R ⁷ is preferably an alkylene group which may have a substituent, more preferably an unsubstituted alkylene group, and an ethylene group. More preferably.

(L and m)
In the said general formula (I), l and m represent the integer of 0-12 each independently. From the viewpoint of developability, it is preferably 1 or more, more preferably 2 or more, and from the viewpoint of curability, it is preferably 8 or less, more preferably 6 or less, and 4 or less. Is more preferable, and 2 or less is particularly preferable. On the other hand, it is preferably 0 from the viewpoint of outgassing.

(N)
In the general formula (I), n represents an integer of 1 or more. n is preferably 2 or more, more preferably 3 or more, further preferably 4 or more, particularly preferably 5 or more, and preferably 6 or less. When the amount is not less than the lower limit, the residual film ratio is increased, and the amount of outgas tends to decrease as the curability increases, and when the amount is not more than the upper limit, the residue tends to decrease.

  Examples of (A1) an ethylenically unsaturated compound having an acid group include polyvalent hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds, and unsaturated carboxylic acids and polybasic carboxylic acids. The ester obtained by esterification reaction is mentioned, and it is not necessarily a single substance, but representative examples include condensates of acrylic acid, phthalic acid, and pentaerythritol, acrylic acid, succinic acid, and pentaerythritol. And the condensates of acrylic acid, succinic acid and dipentaerythritol.

  In the photosensitive resin composition for forming a partition wall of the present invention, the content of the (A1) ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 30% by mass or less in the total solid content, but is 27% by mass or less. Is preferably 25% by mass or less, more preferably 22% by mass or less, still more preferably 20% by mass or less, particularly preferably 15% by mass or less, more preferably 1% by mass or more, and preferably 5% by mass or more. More preferred is 10% by mass or more. By setting it to the upper limit value or less, outgas tends to be reduced, and by setting it to the lower limit value or more, ink jet coating suitability tends to be improved.

  Further, the content ratio of the (A1) ethylenically unsaturated compound having an acid group in the ethylenically unsaturated compound is not particularly limited, but is preferably 50% by mass or less, more preferably 45% by mass or less, and 40% by mass. % Or less is more preferable, 35% by mass or less is more preferable, 30% by mass or less is particularly preferable, 1% by mass or more is preferable, 10% by mass or more is more preferable, and 25% by mass or more is more preferable. By setting it to the upper limit value or less, outgas tends to be reduced, and by setting it to the lower limit value or more, ink jet coating suitability tends to be improved.

<(A2) ethylenically unsaturated compound having no acid group>
The (A) ethylenically unsaturated compound in the present invention may contain (A2) an ethylenically unsaturated compound having no acid group in addition to the (A1) ethylenically unsaturated compound having an acid group. The (A2) ethylenically unsaturated compound having no acid group refers to a compound other than the (A1) ethylenically unsaturated compound having an acid group among the (A) ethylenically unsaturated compounds. (A2) By containing an ethylenically unsaturated compound having no acid group, the curability is improved, the minimum exposure required for producing liquid repellency is reduced, and the outgas amount tends to be reduced. There is.

  (A2) The number of ethylenically unsaturated bonds in one molecule of the ethylenically unsaturated compound having no acid group is not particularly limited as long as it is 1 or more. Is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, from the viewpoint that the difference in developer solubility between the unexposed portion and the developer can be expanded. More preferably, it is more preferably 6 or more, and usually 15 or less, preferably 12 or less, more preferably 10 or less, more preferably 8 or less. Is more preferable. When the amount is not less than the lower limit, the polymerizability is improved and the sensitivity becomes high, and as the curability is increased, the amount of outgas tends to decrease, and when the amount is not more than the upper limit, the developability becomes better. Tend.

  (A2) The molecular weight of the ethylenically unsaturated compound having no acid group is not particularly limited, but is preferably 200 or more, more preferably 250 or more, further preferably 300 or more, and preferably 1,000 or less, 800 or less. Is more preferable, and 600 or less is more preferable. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to become high, and there exists a tendency for a residue to reduce by setting it as the said upper limit or less.

(A2) An ethylenically unsaturated compound having no acid group is (meth) acryloyl from the viewpoints of polymerizability, crosslinkability, and the difference in the developer solubility between the exposed and non-exposed areas accompanying it. A compound having an oxy group, that is, a (meth) acrylate compound is preferable.
(A2) Specific examples of the ethylenically unsaturated compound having no acid group include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids, and the like. It is done.

  Examples of the ester of the aliphatic polyhydroxy compound and the unsaturated carboxylic acid include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, Acrylic acid esters of aliphatic polyhydroxy compounds such as pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate, etc. In the same way, itaconic acid ester instead of itaconate, Maleic acid esters in which instead of the crotonic acid ester or maleate was changed to and the like.

  Examples of the ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcin diacrylate, resorcin dimethacrylate, pyrogallol triacrylate and the like. Etc.

In addition, urethane (meth) acrylates obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth) acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth) acrylic acid ester; a polyvalent epoxy compound Acrylates such as addition reaction product of styrene and hydroxy (meth) acrylate or (meth) acrylic acid; acrylamides such as ethylene bisacrylamide; allyl esters such as diallyl phthalate; vinyl group-containing compounds such as divinyl phthalate Is useful.
Examples of the urethane (meth) acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U -10PA, U-33H, UA-53H, UA-32P, UA-1100H (made by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, UF-8001G (made by Kyoeisha Chemical Co., Ltd.), UV-1700B , UV-7600B, UV-7605B, UV-7630B, UV7640B (manufactured by Nippon Synthetic Chemical).

Among these, it is preferable to use ester (meth) acrylates or urethane (meth) acrylates as the ethylenically unsaturated compound having no acid group (A2) from the viewpoint of curability, and dipentaerythritol hexa (meth). It is more preferable to use acrylate, dipentaerythritol penta (meth) acrylate, pentaerythritol tetra (meth) acrylate, or pentaerythritol tri (meth) acrylate.
These may be used alone or in combination of two or more.

  In the photosensitive resin composition for forming a partition wall of the present invention, the content ratio of the (A2) ethylenically unsaturated compound having no acid group is not particularly limited, but is preferably 50% by mass or less in the total solid content, and 45% by mass. % Or less is more preferable, 40 mass% or less is more preferable, 20 mass% or more is preferable, 25 mass% or more is more preferable, 30 mass% or more is further preferable, and 35 mass% or more is further preferable. There exists a tendency for inkjet applicability | paintability to improve by setting it as the said upper limit or less, and there exists a tendency for an outgas reducing by setting it as the said lower limit or more.

  Further, the content ratio of the (A) ethylenically unsaturated compound (A2) having no acid group is not particularly limited, but is preferably 90% by mass or less, more preferably 80% by mass or less, 75 mass% or less is further more preferable, 50 mass% or more is preferable, 55 mass% or more is more preferable, 60 mass% or more is further more preferable, 65 mass% or more is further more preferable, 70 mass% or more is especially preferable. There exists a tendency for inkjet applicability | paintability to improve by setting it as the said upper limit or less, and there exists a tendency for an outgas reducing by setting it as the said lower limit or more.

[1-1-2] Component (B): Photopolymerization Initiator The photosensitive resin composition for forming a partition wall of the present invention contains (B) a photopolymerization initiator. (B) A photoinitiator will not be specifically limited if it is a compound which superposes | polymerizes the ethylenically unsaturated bond which the said (A) ethylenically unsaturated compound has by an active light, A well-known photoinitiator Can be used.

  In the photosensitive resin composition of the present invention, a photopolymerization initiator that is usually used in this field can be used as the photopolymerization initiator (B). Examples of such photopolymerization initiators include hexaarylbiimidazole photopolymerization initiators, acylphosphine oxide photopolymerization initiators, oxime photopolymerization initiators, acetophenone photopolymerization initiators, and benzophenone photopolymerization initiators. Agent, hydroxybenzene photopolymerization initiator, thioxanthone photopolymerization initiator, anthraquinone photopolymerization initiator, ketal photopolymerization initiator, titanocene photopolymerization initiator, halogenated hydrocarbon derivative photopolymerization initiator, organic Boronate photopolymerization initiator, onium salt photopolymerization initiator, sulfone compound photopolymerization initiator, carbamic acid derivative photopolymerization initiator, sulfonamide photopolymerization initiator, triarylmethanol photopolymerization initiator Is mentioned.

  The hexaarylbiimidazole-based photopolymerization initiator is represented by the following general formula (1-1) and / or the following general formula (1-2) from the viewpoint of absorbance and sensitivity, and matching properties with the absorption wavelength of the ultraviolet absorber. The represented hexaarylbiimidazole photocompound is preferred.

In the above formulas, R ^{11 to} R ¹³ are each independently an alkyl group having 1 to 4 carbon atoms that may have a substituent, an alkoxy group having 1 to 4 carbon atoms that may have a substituent, or a halogen. Represents an atom, and m, n and l each independently represents an integer of 0 to 5;

Although it will not specifically limit if carbon number of the alkyl group of R < ¹¹ > -R < ¹³ > exists in the range of 1-4, Preferably it is 3 or less from a viewpoint of a sensitivity, More preferably, it is 2 or less. The alkyl group may be linear or cyclic. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, and an isopropyl group. Among them, a methyl group and an ethyl group are preferable. As the substituent that the alkyl group having 1 to 4 carbon atoms of R ^{11 to} R ¹³ may have, a monovalent non-metallic atomic group other than hydrogen is used. As a preferable example, a halogen atom (— F, -Br, -Cl, -I), a hydroxyl group, and an alkoxy group.

The number of carbon atoms of the alkoxy group of R ^{11 to} R ¹³ is not particularly limited as long as it is within the range of 1 to 4, but is preferably 3 or less, more preferably 2 or less from the viewpoint of sensitivity. The alkyl group part of the alkoxy group may be a chain or a ring. Specific examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, an isopropyloxy group, and a butoxy group, and among them, a methoxy group and an ethoxy group are preferable. Examples of the substituent that the alkoxy group having 1 to 4 carbon atoms of R ^{11 to} R ¹³ may have include an alkyl group and an alkoxy group, and an alkyl group is preferable.

Examples of the halogen atom of R ^{11 to} R ¹³ include a chlorine atom, an iodine atom, a bromine atom, and a fluorine atom. Among these, from the viewpoint of ease of synthesis, a chlorine atom or a fluorine atom is preferable, and a chlorine atom is more preferable. preferable.
Among these, from the viewpoints of sensitivity and ease of synthesis, R ^{11 to} R ¹³ are preferably each independently a halogen atom, and more preferably a chlorine atom.

  m, n and l each independently represent an integer of 0 to 5, but from the viewpoint of ease of synthesis, at least one of m, n and l is preferably an integer of 1 or more, and m, n and l More preferably, one of them is 1 and the other two are 0.

  Examples of the hexaarylbiimidazole compound represented by the general formula (1-1) and / or the general formula (1-2) include 2,2′-bis (o-chlorophenyl) -4,5,4 ′. , 5′-tetraphenylbiimidazole, 2,2′-bis (o-methylphenyl) -4,5,4 ′, 5′-tetraphenylbiimidazole, 2,2′-bis (o-chlorophenyl) -4 , 4 ′, 5,5′-tetra (o, p-dichlorophenyl) biimidazole, 2,2′-bis (o, p-dichlorophenyl) -4,4 ′, 5,5′-tetra (o, p- Dichlorophenyl) biimidazole, 2,2′-bis (o-chlorophenyl) -4,4 ′, 5,5′-tetra (p-fluorophenyl) biimidazole, 2,2′-bis (o-chlorophenyl) -4 , 4 ', 5, 5'- Tora (o, p-dibromophenyl) biimidazole, 2,2′-bis (o-bromophenyl) -4,4 ′, 5,5′-tetra (o, p-dichlorophenyl) biimidazole, 2,2 ′ -Bis (o-chlorophenyl) -4,4 ′, 5,5′-tetra (p-chloronaphthyl) biimidazole and the like. Among them, a hexaphenylbiimidazole compound is preferable, and a compound in which the o-position of the benzene ring bonded to the 2,2′-position on the imidazole ring is substituted with a methyl group, a methoxy group, or a halogen atom is more preferable. The benzene ring bonded to the 4,4 ′, 5,5′-position on the imidazole ring is preferably unsubstituted or substituted with a halogen atom or a methoxy group.

  (B) As a photopolymerization initiator, either a hexaarylbiimidazole compound represented by general formula (1-1) or a hexaarylbiimidazole compound represented by general formula (1-2) is used. It is also possible to use both in combination. When used in combination, the ratio is not particularly limited. In addition, b-1 used in the Example has a structure that satisfies the general formula (1-1).

  Examples of the acylphosphine oxide photopolymerization initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, and the like. .

  Examples of the oxime photopolymerization initiator include JP-T 2004-534797, JP-A 2000-80068, JP-A 2006-36750, JP-A 2008-179611, JP-A 2012-526185, Examples include oxime ester compounds described in Table 2012-519191. Among these, from the viewpoint of sensitivity, N-acetoxy-N- {4-acetoxyimino-4- [9-ethyl-6- (o-toluoyl) -9H-carbazol-3-yl] butan-2-yl} acetamide, N- Acetoxy-N- {3- (acetoxyimino) -3- [9-ethyl-6- (1-naphthoyl) -9H-carbazol-3-yl] -1-methylpropyl} acetamide, 4-acetoxyimino-5 [9-Ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -5-oxopentanoic acid methyl has the product names OXE-01, OXE-02, OXE-03 (BASF Corporation). ), TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Strong Company), NCI-831, NCI-930 (manufactured by ADEKA), etc. It is possible.

Examples of the acetophenone photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, and 1-hydroxy-1- (p-dodecylphenyl) ketone. 1-hydroxy-1-methylethyl- (p-isopropylphenyl) ketone, 1-trichloromethyl- (p-butylphenyl) ketone, α-hydroxy-2-methylphenylpropanone, 2-methyl-1- [4 -(Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1-one, 2-benzyl-2-dimethylamino- 1- (4-morpholinophenyl) butan-1-one, 4-dimethylamino ester Rubenzoate, 4-dimethylaminoisoamylbenzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4-dimethylaminobenzoate, 2,5-bis (4-diethylaminobenzal) cyclohexanone, 4 -(Diethylamino) chalcone and the like can be mentioned.
Examples of the benzophenone photopolymerization initiator include benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2-carboxybenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone, Michler's ketone, and the like.

Examples of the hydroxybenzene photopolymerization initiator include 2-hydroxy-4-n-octoxybenzophenone, 2-hydroxy-4-benzylbenzophenone, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 4- Examples include di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate.
Examples of the thioxanthone photopolymerization initiator include thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like. Can be mentioned.
Examples of the anthraquinone photopolymerization initiator include 2-methylanthraquinone, and examples of the ketal photopolymerization initiator include benzyldimethyl ketal.

  Examples of titanocene photopolymerization initiators include dicyclopentadienyl titanium dichloride, dicyclopentadienyl titanium bisphenyl, dicyclopentadienyl titanium bis (2,4-difluorophenyl), and dicyclopentadienyl titanium. Bis (2,6-difluorophenyl), dicyclopentadienyl titanium bis (2,4,6-trifluorophenyl), dicyclopentadienyl titanium bis (2,3,5,6-tetrafluorophenyl), Dicyclopentadienyl titanium bis (2,3,4,5,6-pentafluorophenyl), di (methylcyclopentadienyl) titanium bis (2,6-difluorophenyl), di (methylcyclopentadienyl) Titanium bis (2,3,4,5,6-pentafluoro Phenyl), dicyclopentadienyl titanium bis [2,6-difluoro-3- (1-pyrrolyl) phenyl], and the like. Of these, titanium compounds having a dicyclopentadienyl structure and a bisphenyl structure are preferable from the viewpoint of sensitivity, and those in which the o-position of the bisphenyl ring is substituted with a halogen atom are particularly preferable.

  Examples of the halogenated hydrocarbon derivative-based photopolymerization initiator include halomethylated s-triazine derivatives, such as 2,4,6-tris (monochloromethyl) -s-triazine, 2,4,6-tris ( Dichloromethyl) -s-triazine, 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl) -s-triazine, 2-n-propyl-4, 6-bis (trichloromethyl) -s-triazine, 2- (α, α, β-trichloroethyl) -4,6-bis (trichloromethyl) -s-triazine, 2-phenyl-4,6-bis (trichloro Methyl) -s-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (3,4-epoxyphenyl) -4, -Bis (trichloromethyl) -s-triazine, 2- (p-chlorophenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- [1- (p-methoxyphenyl) -2,4-butadienyl ] -4,6-bis (trichloromethyl) -s-triazine, 2-styryl-4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxystyryl) -4,6-bis (trichloro) Methyl) -s-triazine, 2- (p-methoxy-m-hydroxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (pi-propyloxystyryl) -4,6- Bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-methoxynaphthyl) -4 6-bis (trichloromethyl) -s-triazine, 2- (p-ethoxynaphthyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-ethoxycarbonylnaphthyl) -4,6-bis (Trichloromethyl) -s-triazine, 2-phenylthio-4,6-bis (trichloromethyl) -s-triazine, 2-benzylthio-4,6-bis (trichloromethyl) -s-triazine, 2,4,6 -Tris (dibromomethyl) -s-triazine, 2,4,6-tris (tribromomethyl) -s-triazine, 2-methyl-4,6-bis (tribromomethyl) -s-triazine, 2-methoxy -4,6-bis (tribromomethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine Halomethylated s-triazine derivatives such as bis (trihalomethyl) -s-triazines are preferable from the viewpoint of sensitivity.

  Examples of the organic boronate photopolymerization initiator include organic boron ammonium complexes, organic boron phosphonium complexes, organic boron sulfonium complexes, organic boron oxosulfonium complexes, organic boron iodonium complexes, and organic boron transition metal coordination complexes. Examples of the organic boron anion include n-butyl-triphenyl boron anion, n-butyl-tris (2,4,6-trimethylphenyl) boron anion, and n-butyl-tris (p-methoxyphenyl). ) Boron anion, n-butyl-tris (p-fluorophenyl) boron anion, n-butyl-tris (m-fluorophenyl) boron anion, n-butyl-tris (3-fluoro-4-methylphenyl) boron anion, n-butyl-tris (2,6-difluorophenyl) boron anion, n Butyl-tris (2,4,6-trifluorophenyl) boron anion, n-butyl-tris (2,3,4,5,6-pentafluorophenyl) boron anion, n-butyl-tris (p-chlorophenyl) Alkyl-triphenyl boron anions such as boron anion and n-butyl-tris (2,6-difluoro-3-pyrrolylphenyl) boron anion are preferred from the viewpoint of sensitivity, and the counter cation includes ammonium cation and phosphonium cation. In addition, onium compounds such as sulfonium cation and iodonium cation are preferable from the viewpoint of sensitivity, and organic ammonium cations such as tetraalkylammonium are particularly preferable from the viewpoint of sensitivity.

  Examples of the onium salt photopolymerization initiator include ammonium salts such as tetramethylammonium bromide and tetraethylammonium bromide, diphenyliodonium hexafluoroarsenate, diphenyliodonium tetrafluoroborate, diphenyliodonium p-toluenesulfonate, and diphenyliodonium camphor. Iodonium salts such as sulfonate, dicyclohexyliodonium hexafluoroarsenate, dicyclohexyliodonium tetrafluoroborate, dicyclohexyliodonium p-toluenesulfonate, dicyclohexyliodonium camphorsulfonate, triphenylsulfonium hexafluoroarsenate, triphenylsulfonium tetrafluoroborate, triflate Sulfonyl sulfonium p- toluenesulfonate, triphenylsulfonium camphorsulfonate, tri-cyclohexyl hexafluoroarsenate, tri-cyclohexyl sulfonium tetrafluoroborate, tri-cyclohexyl sulfonium p- toluenesulfonate, sulfonium salts such as tri-cyclohexyl sulfonium camphorsulfonate, and the like.

  Examples of the sulfone compound photopolymerization initiator include bis (phenylsulfonyl) methane, bis (p-hydroxyphenylsulfonyl) methane, bis (p-methoxyphenylsulfonyl) methane, bis (α-naphthylsulfonyl) methane, Bis (sulfonyl) methane compounds such as bis (β-naphthylsulfonyl) methane, bis (cyclohexylsulfonyl) methane, bis (tert-butylsulfonyl) methane, phenylsulfonyl (cyclohexylsulfonyl) methane, phenylcarbonyl (phenylsulfonyl) methane, naphthyl Carbonyl (phenylsulfonyl) methane, phenylcarbonyl (naphthylsulfonyl) methane, cyclohexylcarbonyl (phenylsulfonyl) methane, tert-butylcarbonyl (phenylsulfonyl) ) Carbonyl (sulfonyl) methane compounds such as methane, phenylcarbonyl (cyclohexylsulfonyl) methane, phenylcarbonyl (tert-butylcarbonyl) methane, bis (phenylsulfonyl) diazomethane, bis (p-hydroxyphenylsulfonyl) diazomethane, bis (p -Methoxyphenylsulfonyl) diazomethane, bis (α-naphthylsulfonyl) diazomethane, bis (β-naphthylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (tert-butylsulfonyl) diazomethane, phenylsulfonyl (cyclohexylsulfonyl) diazomethane, bis (Sulfonyl) diazomethane, phenylcarbonyl (phenylsulfonyl) diazomethane, naphthylcarbonyl (phenylsulfur) Carbonyl such as phonyl) diazomethane, phenylcarbonyl (naphthylsulfonyl) diazomethane, cyclohexylcarbonyl (phenylsulfonyl) diazomethane, tert-butylcarbonyl (phenylsulfonyl) diazomethane, phenylcarbonyl (cyclohexylsulfonyl) diazomethane, phenylcarbonyl (tert-butylcarbonyl) diazomethane And (sulfonyl) diazomethane compounds.

Examples of the carbamic acid derivative-based photopolymerization initiator include benzoyl cyclohexyl carbamate, 2-nitrobenzyl cyclohexyl carbamate, 3,5-dimethoxybenzyl cyclohexyl carbamate, and 3-nitrophenyl cyclohexyl carbamate.
Examples of the sulfonamide photopolymerization initiator include N-cyclohexyl-4-methylphenylsulfonamide, N-cyclohexyl-2-naphthylsulfonamide and the like, and examples of the triarylmethanol photopolymerization initiator include Examples thereof include triphenylmethanol and tri (4-chlorophenyl) methanol.

  One of these photopolymerization initiators may be included alone in the photosensitive resin composition, or two or more thereof may be included. Among these photopolymerization initiators, hexaarylbiimidazole compounds are particularly preferable because of their high absorbance, high surface curability, and high liquid repellency and high taper angle.

  As a content rate of (B) photoinitiator in the photosensitive resin composition of this invention, it is 0.01 mass% or more normally with respect to the total solid of the photosensitive resin composition, Preferably it is 0.1 mass. % Or more, more preferably 0.5% by weight or more, further preferably 1% by weight or more, particularly preferably 1.5% by weight or more, and usually 25% by weight or less, preferably 10% by weight or less, more preferably 8% by weight. It is at most 5% by mass, more preferably at most 5% by mass, particularly preferably at most 3% by mass. When the amount is not less than the lower limit, there is a tendency that a coating film is formed without causing film reduction during development and sufficient liquid repellency tends to occur. It tends to be easier.

  The blending ratio of (B) photopolymerization initiator to (A) ethylenically unsaturated compound in the photosensitive resin composition is 1 part by mass or more with respect to 100 parts by mass of (A) ethylenically unsaturated compound. Is preferably 2 parts by mass or more, more preferably 3 parts by mass or more, more preferably 200 parts by mass or less, more preferably 100 parts by mass or less, further preferably 50 parts by mass or less, and more preferably 20 parts by mass or less. More preferred is 10 parts by mass or less, and most preferred is 5 parts by mass or less. There exists a tendency for it to become suitable sensitivity by setting it as the said lower limit or more, and there exists a tendency for a desired pattern shape to become easy to form by setting it as the said upper limit or less.

  Moreover, it is preferable to use a chain transfer agent in combination with the photopolymerization initiator. Examples of the chain transfer agent include mercapto group-containing compounds, carbon tetrachloride, and the like, and since a chain transfer effect tends to be high, it is more preferable to use a compound having a mercapto group. This is probably because bond cleavage is likely to occur due to the small S—H bond energy, and hydrogen pulling reaction and chain transfer reaction are likely to occur. Effective for improving sensitivity and surface curability.

  Examples of the mercapto group-containing compound include 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4 (3H) -quinazoline, β- Mercapto group-containing compounds having an aromatic ring such as mercaptonaphthalene and 1,4-dimethylmercaptobenzene; hexanedithiol, decanedithiol, butanediol bis (3-mercaptopropionate), butanediol bisthioglycolate, ethylene glycol Bis (3-mercaptopropionate), ethylene glycol bisthioglycolate, trimethylolpropane tris (3-mercaptopropionate), trimethylolpropane tristhioglycolate, trishydroxyl Lutristhiopropionate, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), butanediol bis (3-mercaptobutyrate), ethylene glycol bis (3-mercaptobutyrate) Rate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyloxy) Examples thereof include aliphatic mercapto group-containing compounds such as ethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, particularly compounds having a plurality of mercapto groups.

  Of these, 2-mercaptobenzothiazole and 2-mercaptobenzimidazole are preferable among the mercapto group-containing compounds having an aromatic ring, and trimethylolpropane tris (3- Mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate) Rate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -Trion is Masui.

In terms of sensitivity, an aliphatic mercapto group-containing compound is preferable, and specifically, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol. Tris (3-mercaptopropionate), trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tris (3-mercaptobutyrate), 1,3,5- Tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione is preferred, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakis (3 Mercaptobutylate) is more preferable.
Various types of these can be used alone or in combination of two or more.

Among these, from the viewpoint of increasing the taper angle, one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole, and a photopolymerization initiator are combined. It is preferred to use as a photopolymerization initiator system. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzoimidazole may be used, and 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used in combination.
From the viewpoint of sensitivity, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate). Furthermore, from the viewpoint of sensitivity, 1 or 2 or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzoimidazole, and 2-mercaptobenzoxazole, pentaerythritol tetrakis (3-mercaptopropionate), It is preferable to use one or two or more selected from the group consisting of pentaerythritol tetrakis (3-mercaptobutyrate) and a photopolymerization initiator in combination.

  The content of the chain transfer agent in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.025% by mass or more, based on the total solid content of the photosensitive resin composition. More preferably 0.05% by mass or more, further preferably 0.1% by mass or more, particularly preferably 1% by mass or more, and usually 5% by mass or less, preferably 4% by mass or less, more preferably 3% by mass or less. It is. The sensitivity tends to be increased by setting it to the lower limit value or more, and the desired pattern tends to be easily formed by setting the upper limit value or less.

  Moreover, as a compounding ratio of the chain transfer agent to the (B) photopolymerization initiator in the photosensitive resin composition, 10 parts by mass or more is preferable with respect to 100 parts by mass of the (B) photopolymerization initiator, and 25 masses. Is more preferably 50 parts by mass or more, more preferably 80 parts by mass or more, particularly preferably 500 parts by mass or less, more preferably 400 parts by mass or less, further preferably 300 parts by mass or less, and 200 parts by mass. The following are particularly preferred: When the value is not less than the lower limit value, the sensitivity tends to be high. When the value is not more than the upper limit value, a desired pattern tends to be easily formed.

  A sensitizer may be used in combination with the photopolymerization initiator. Sensitivity is improved by the sensitizer, and at the same time, the light transmittance to the inside of the photosensitive resin composition is decreased, so that the taper angle tends to be increased.

As the sensitizer, a sensitizer usually used in this field can be used. Examples of such sensitizers include unsaturated ketones represented by chalcone derivatives and dibenzalacetone, 1,2-diketone compounds represented by benzyl and camphorquinone, benzoin compounds, fluorenes, and the like. Compounds, naphthoquinone compounds, anthraquinone compounds, xanthene compounds, thioxanthene compounds, xanthone compounds, thioxanthone compounds, coumarin compounds, ketocoumarin compounds, cyanine compounds, merocyanine compounds, oxonol derivatives, etc. Polymethine dyes, acridine compounds, azine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, azurenium compounds, squarylium compounds, porphyrin compounds, tetraphenylporphyrin compounds Products, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalyloporphyrazine compounds, naphthalocyanine compounds, subphthalocyanine compounds Examples thereof include compounds, pyrylium compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spirooxazine compounds, thiospiropyran compounds, metal arene complexes, organic ruthenium complexes, and benzophenone compounds.
These may be used alone or in combination of two or more.

  Among these, thioxanthone compounds and benzophenone compounds are preferable from the viewpoint of improving sensitivity and increasing the taper angle.

  Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, 4-methylthioxanthone, 2,4-dimethylthioxanthone, 2-ethylthioxanthone, 4-ethylthioxanthone, 2,4-diethylthioxanthone, 2-isopropylthioxanthone, 4-isopropyl. Examples include thioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, 4-chlorothioxanthone, and 2,4-dichlorothioxanthone. Among these, 2,4-diethylthioxanthone is preferable from the viewpoint of improving sensitivity and increasing the taper angle.

  Examples of the benzophenone compounds include benzophenone, 4,4'-bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) benzophenone, 4,4'-bis (ethylmethylamino) benzophenone. Among these, 4,4′-bis (diethylamino) benzophenone is preferable from the viewpoint of improving sensitivity and increasing the taper angle.

  The content of the sensitizer in the photosensitive resin composition is usually 0.1% by mass or more, preferably 0.3% by mass or more, more preferably 0.00% by mass, based on the total solid content of the photosensitive resin composition. 5% by mass or more, more preferably 0.8% by mass or more, still more preferably 1% by mass or more, particularly preferably 1.2% by mass or more, and usually 10% by mass or less, preferably 7% by mass or less, More preferably, it is 5 mass% or less, More preferably, it is 3 mass% or less. When the value is not less than the lower limit value, the sensitivity tends to be improved and the taper angle tends to be increased. When the value is not more than the upper limit value, a desired pattern tends to be easily formed.

[1-1-3] Component (C); alkali-soluble resin The photosensitive resin composition for forming a partition wall of the present invention contains (C) an alkali-soluble resin. In the present invention, the alkali-soluble resin is not particularly limited as long as it can be developed with a developer, but an alkali developer is preferable as the developer, and therefore an alkali-soluble resin is used in the present invention. Examples of the alkali-soluble resin include various resins containing a carboxyl group or a hydroxyl group. Among them, from the viewpoints of obtaining a partition wall having an appropriate taper angle and suppressing the outflow due to thermal melting of the partition wall and maintaining liquid repellency, it is preferable to have a carboxyl group, and further, an ethylenically unsaturated group. It is more preferable that it has.
(C-1) carboxyl group-containing (co) polymer, (C-2) carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, (C-3) carboxyl group and ethylene The unsaturated unsaturated group-containing resin will be described in detail.

[1-1-3-a] (C-1) Carboxy group-containing (co) polymer [1-1-1-a-1] Carboxyl group-containing (co) polymer (1)
Specific examples of carboxyl group-containing (co) polymers include, for example, (meth) acrylic acid, crotonic acid, isocrotonic acid, maleic acid, maleic anhydride, itaconic acid, citraconic acid and the like. Saturated carboxylic acids and styrenes such as styrene, α-methylstyrene, hydroxystyrene, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (Meth) acrylate, dodecyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, isobornyl (meth) acrylate, hydroxymethyl (meth) acrylate, hydroxy (Meth) acrylic acid esters such as til (meth) acrylate, glycidyl (meth) acrylate, benzyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, N- (meth) acryloylmorpholine, (meth) (Meth) acrylonitriles such as acrylonitrile, (meth) acrylamides such as (meth) acrylamide, N-methylol (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N, N-dimethylaminoethyl (meth) acrylamide And copolymers with vinyl compounds such as vinyl acetate.

  Among these, a (meth) acrylate- (meth) acrylic acid copolymer and a styrene- (meth) acrylate- (meth) acrylic acid copolymer are preferable from the viewpoint of sensitivity. In the (meth) acrylate- (meth) acrylic acid copolymer, a copolymer composed of 5 to 80 mol% (meth) acrylate and 20 to 95 mol% (meth) acrylic acid is more preferable. A copolymer comprising 10 to 70 mol% of (meth) acrylate and 30 to 90 mol% of (meth) acrylic acid is particularly preferable. In the styrene- (meth) acrylate- (meth) acrylic acid copolymer, a copolymer comprising 3 to 60 mol% styrene, 10 to 70 mol% (meth) acrylate, and 10 to 60 mol% (meth) acrylic acid. A polymer is more preferable, and a copolymer composed of 5 to 50 mol% of styrene, 20 to 60 mol% of (meth) acrylate, and 15 to 55 mol% of (meth) acrylic acid is particularly preferable.

[1-1-3-a-2] carboxyl group-containing (co) polymer (2)
Moreover, it replaces with the said unsaturated carboxylic acid, the compound which added the polybasic acid (anhydride) to hydroxyalkyl (meth) acrylate, the said styrene, (meth) acrylic acid ester, (meth) acrylonitrile. And copolymers with (meth) acrylamides, vinyl compounds, and the like.

  Examples of the hydroxyalkyl (meth) acrylate include hydroxymethyl (meth) acrylate, hydroxyethyl (meth) acrylate, and hydroxybutyl (meth) acrylate, and examples of the polybasic acid (anhydride) include succinic acid ( Anhydride), adipic acid (anhydride), phthalic acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), maleic acid (anhydride), etc. As succinic acid [2- (meth) acryloylethyl] ester, adipic acid [2- (meth) acryloylethyl] ester, phthalic acid [2- (meth) acryloylethyl] ester, hexahydrophthalic acid [2- ( (Meth) acryloylethyl] ester, maleic acid [2- (meth) acryloylethyl Esters, succinic acid [2- (meth) acryloylpropyl] ester, adipic acid [2- (meth) acryloylpropyl] ester, phthalic acid [2- (meth) acryloylpropyl] ester, hexahydrophthalic acid [2- (meta ) Acryloylpropyl] ester, maleic acid [2- (meth) acryloylpropyl] ester, succinic acid [2- (meth) acryloylbutyl] ester, adipic acid [2- (meth) acryloylbutyl] ester, phthalic acid [2- (Meth) acryloylbutyl] ester, hexahydrophthalic acid [2- (meth) acryloylbutyl] ester, maleic acid [2- (meth) acryloylbutyl] ester and the like.

  These carboxyl group-containing (co) polymers preferably have an acid value of 50 to 500 mgKOH / g from the viewpoint of development solubility, and have a weight average molecular weight (Mw) in terms of polystyrene from the viewpoint of development solubility. It is preferably 1,000 to 300,000.

[1-1-3-b] (C-2) carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain [1-1-3-b-1] unsaturated carboxylic acid and two kinds Copolymer with the above compound having an ethylenically unsaturated group As the carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, for example, allyl (meth) acrylate, 3-allyloxy-2-hydroxy A compound having two or more ethylenically unsaturated groups such as propyl (meth) acrylate, cinnamyl (meth) acrylate, crotonyl (meth) acrylate, methallyl (meth) acrylate, N, N-diallyl (meth) acrylamide, or Vinyl (meth) acrylate, 1-chlorovinyl (meth) acrylate, 2-phenylvinyl (meth) acrylate, 1-propenyl (meth A) a compound having two or more ethylenically unsaturated groups such as acrylate, vinyl crotonate, vinyl (meth) acrylamide, and an unsaturated carboxylic acid such as (meth) acrylic acid, or an unsaturated carboxylic acid ester Of the former compound having an ethylenically unsaturated group is 10 to 90 mol%, preferably 30 to 80 mol%, and the like. .

  In addition, the acid value of the copolymer of the unsaturated carboxylic acid and the compound having two or more kinds of ethylenically unsaturated groups is preferably 30 to 250 mgKOH / g from the viewpoint of development solubility, and has a weight average molecular weight. (Mw) is preferably 1,000 to 300,000 from the viewpoint of development solubility.

[1-1-3-b-2] Epoxy group-containing unsaturated compound-modified carboxyl group-containing (co) polymer Further, as a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, for example, Modification by reacting a carboxyl group-containing (co) polymer with an epoxy group-containing unsaturated compound and adding an epoxy group of the epoxy group-containing unsaturated compound to a part of the carboxyl group of the carboxyl group-containing (co) polymer. Modified carboxyl group-containing (co) polymers.
As the carboxyl group-containing (co) polymer, from the viewpoint of sensitivity, the above-described carboxyl group-containing (co) polymer (meth) acrylate- (meth) acrylic acid copolymer and styrene- (meth) acrylate are used. -(Meth) acrylic acid copolymers are preferred.
The epoxy group-containing unsaturated compounds include allyl glycidyl ether, glycidyl (meth) acrylate, α-ethyl glycidyl (meth) acrylate, glycidyl crotonate, glycidyl isocrotonate, crotonyl glycidyl ether, monoalkyl itaconate Aliphatic epoxy group-containing unsaturated compounds such as glycidyl esters, monoalkyl monoglycidyl esters of fumaric acid, and maleic acid alkyl monoglycidyl esters, and 3,4-epoxycyclohexylmethyl (meth) acrylate, 2,3-epoxycyclopentylmethyl And alicyclic epoxy group-containing unsaturated compounds such as (meth) acrylate and 7,8-epoxy [tricyclo [5.2.1.0] dec-2-yl] oxyethyl (meth) acrylate. That.
These epoxy group-containing unsaturated compounds can be obtained by reacting 5 to 90 mol%, preferably about 30 to 70 mol%, of the carboxyl groups of the carboxyl group-containing (co) polymer. In addition, reaction can be implemented by a well-known method.

  The acid value of the epoxy group-containing unsaturated compound-modified carboxyl group-containing (co) polymer is preferably 30 to 250 mgKOH / g from the viewpoint of developability, and from the viewpoint of developability, the weight average molecular weight (Mw ) Is preferably 1,000 to 300,000.

[1-1-3-b-3] Unsaturated carboxylic acid-modified epoxy group and carboxyl group-containing (co) polymer Further, as a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, for example, , Unsaturated carboxylic acid such as (meth) acrylic acid, the above-mentioned aliphatic epoxy group-containing unsaturated compound or alicyclic epoxy group-containing unsaturated compound, or further unsaturated carboxylic acid ester or styrene, etc. A copolymer obtained by copolymerizing the carboxyl group-containing unsaturated compound to a proportion of 10 to 90 mol%, preferably about 30 to 80 mol%, is added to a copolymer such as (meth) acrylic acid. Modified epoxy group and carboxyl group modified by reacting saturated carboxylic acid and adding carboxyl group of unsaturated carboxylic acid to epoxy group of the copolymer (Co) polymer is mentioned.

  The acid value of the unsaturated carboxylic acid-modified epoxy group and carboxyl group-containing (co) polymer is preferably from 30 to 250 mgKOH / g from the viewpoint of developability, and from the viewpoint of developability, the weight average molecular weight ( Mw) is preferably from 1,000 to 300,000.

[1-1-3-b-4] Acid-modified epoxy group-containing (co) polymer In addition, as a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain, an epoxy group-containing (meth) acrylate And an ethylenically unsaturated compound, an ethylenically unsaturated monocarboxylic acid is added to at least a part of the epoxy group of the copolymer, and at least a part of the hydroxyl groups generated by the addition are added. Examples include acid-modified epoxy group-containing (co) polymers obtained by adding a basic acid (anhydride).
Specifically, a copolymer of 5 to 99 mol% of an epoxy group-containing (meth) acrylate such as glycidyl (meth) acrylate and usually 2 to 95 mol% of an ethylenically unsaturated compound such as (meth) acrylic acid ester. Is added to an ethylenically unsaturated monocarboxylic acid to usually 10 to 100 mol% of the epoxy group contained in the copolymer, and a polybasic acid is added to usually 10 to 100 mol% of the hydroxyl group produced when the addition is added. An acid-modified epoxy group-containing (co) polymer obtained by adding (anhydride) is exemplified.

Here, the copolymerization ratio of the epoxy group-containing (meth) acrylate in the copolymer is not particularly limited, but is usually 5 mol% or more, preferably 20 mol% or more, more preferably 40 mol% or more, and still more preferably 60 mol%. It is at least mol%, more preferably at least 80 mol%, particularly preferably at least 90 mol%, and usually at most 99 mol%, preferably at most 98 mol%, more preferably at most 95 mol%. When the amount is not less than the lower limit value, the sensitivity tends to be high, and when the value is not more than the upper limit value, there is a tendency that appropriate development solubility is obtained.
On the other hand, the copolymerization ratio of the ethylenically unsaturated compound in the copolymer is not particularly limited, but is usually 1 mol% or more, preferably 3 mol% or more, more preferably 5 mol% or more, and usually 90 mol% or less. , Preferably 70 mol% or less, more preferably 50 mol% or less, still more preferably 30 mol% or less, and particularly preferably 10 mol% or less. When the amount is not less than the lower limit value, the sensitivity tends to be high, and when the value is not more than the upper limit value, there is a tendency that appropriate development solubility is obtained.

  Examples of the epoxy group-containing (meth) acrylate include aliphatic epoxy group-containing (meth) acrylates such as glycidyl (meth) acrylate and α-ethylglycidyl (meth) acrylate; 3,4-epoxycyclohexylmethyl (meth) acrylate, 2, Alicyclic epoxy group-containing (meth) acrylates such as 3-epoxycyclopentylmethyl (meth) acrylate and 7,8-epoxy [tricyclo [5.2.1.0] dec-2-yl] oxyethyl (meth) acrylate Can be mentioned.

  Here, as an ethylenically unsaturated compound, it is preferable to use 1 type (s) or 2 or more types of the mono (meth) acrylate which has a partial structure represented by following formula (II), for example.

In formula (II), R ^{1d to} R ^4d each independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R ^5d and R ^6d each independently represent a hydrogen atom or carbon number 1 to 10 Represents an alkyl group. R ^5d and R ^6d may be linked to form a ring. The ring formed by connecting R ^5d and R ^6d is preferably an aliphatic ring, which may be saturated or unsaturated, and the ring preferably has 5 to 6 carbon atoms.

The carbon number of the alkyl group in R ^{1d to} R ^4d is usually 1 or more, usually 10 or less, preferably 8 or less, and more preferably 5 or less. There exists a tendency for it to become suitable image development solubility by setting it as the said upper limit or less.
Among these, from the viewpoint of solubility, R ^{1d to} R ^4d are preferably hydrogen atoms.

The carbon number of the alkyl group in R ^5d and R ^6d is preferably 8 or less, more preferably 5 or less. There exists a tendency which shows appropriate solubility by setting it as the said lower limit or more, and there exists a tendency for hydrophilicity to be hold | maintained by setting it as the said upper limit or less.
Among these, from the viewpoint of development solubility, it is preferable that R ^5d and R ^6d are hydrogen atoms, or R ^5d and R ^6d are connected to form an aliphatic ring having 5 to 6 carbon atoms. .

  Among the above formulas (II), mono (meth) acrylates having a structure represented by the following formula (IIa), (IIb), or (IIc) are preferable. By introducing these partial structures, it is possible to increase the heat resistance and strength of mono (meth) acrylate. In addition, 1 type may be used for these mono (meth) acrylates and it may use 2 or more types together by arbitrary combinations and a ratio.

  As the mono (meth) acrylate having a partial structure represented by the above formula (II), various known ones can be used, but those represented by the following formula (III) are particularly preferable from the viewpoint of curability. Is preferred.

In the formula (III), R ^9d represents a hydrogen atom or a methyl group, and R ^10d represents a partial structure of the formula (II).
When the mono (meth) acrylate having a partial structure represented by the formula (II) is contained, the copolymerization ratio is usually 1 mol% or more, preferably 2 mol% or more, and usually 70 mol% or less. , Preferably 50 mol% or less, more preferably 30 mol% or less, still more preferably 10 mol% or less, particularly preferably 5 mol% or less. By setting it as the said lower limit or more, there exists a tendency for a remaining film rate to become high, and there exists a tendency for a residue to decrease by setting it as the said upper limit or less.

  On the other hand, as the ethylenically unsaturated compound, an ethylenically unsaturated compound other than the mono (meth) acrylate having the partial structure represented by the above-described formula (II) (hereinafter referred to as “other ethylenically unsaturated compound”) For example, styrenes such as α-, o-, m-, p-alkyl, nitro, cyano, amide, ester derivatives of styrene, butadiene, 2,3-dimethylbutadiene, isoprene, chloroprene, etc. Dienes of (meth) acrylic acid methyl, (meth) acrylic acid ethyl, (meth) acrylic acid-n-propyl, (meth) acrylic acid-iso-propyl, (meth) acrylic acid-n-butyl, (meth ) Acrylic acid-sec-butyl, (meth) acrylic acid-tert-butyl, (meth) acrylic acid pentyl, (meth) acrylic acid Pentyl, isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, dodecyl (meth) acrylate, cyclopentyl (meth) acrylate, (meth) acryl Cyclohexyl acid, 2-methylcyclohexyl (meth) acrylate, dicyclohexyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, allyl (meth) acrylate, propargyl (meth) acrylate, (meta ) Phenyl acrylate, naphthyl (meth) acrylate, anthracenyl (meth) acrylate, anthraninonyl (meth) acrylate, piperonyl (meth) acrylate, salicyl (meth) acrylate, furyl (meth) acrylate, ( (Meth) acrylic acid full free , Tetrahydrofuryl (meth) acrylate, pyranyl (meth) acrylate, benzyl (meth) acrylate, phenethyl (meth) acrylate, cresyl (meth) acrylate, (meth) acrylic acid-1,1,1- Trifluoroethyl, perfluoroethyl (meth) acrylate, perfluoro-n-propyl (meth) acrylate, perfluoro-iso-propyl (meth) acrylate, triphenylmethyl (meth) acrylate, (meth) (Meth) acrylic acid esters such as cumyl acrylate, (meth) acrylic acid 3- (N, N-dimethylamino) propyl, (meth) acrylic acid-2-hydroxyethyl, (meth) acrylic acid-2-hydroxypropyl , (Meth) acrylic acid amide, (meth) acrylic acid N, N-dimethylamide, (meth) acrylic acid (Meth) such as acid N, N-diethylamide, (meth) acrylic acid N, N-dipropylamide, (meth) acrylic acid N, N-di-iso-propylamide, (meth) acrylic acid anthracenylamide Acrylic amides, (meth) acrylic acid anilide, (meth) acryloylnitrile, acrolein, vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, vinyl compounds such as N-vinylpyrrolidone, vinylpyridine, vinyl acetate, Unsaturated dicarboxylic acid diesters such as diethyl citraconic acid, diethyl maleate, diethyl fumarate, diethyl itaconate, N-phenylmaleimide, N-cyclohexylmaleimide, N-laurylmaleimide, N- (4-hydroxyphenyl) maleimide, etc. Monomaleimides, N- (me ) Radical polymerizable compound such as acryloyl phthalimide can also be mentioned.

  Among these, in order to impart more excellent heat resistance and strength, it is possible to use at least one selected from styrene, benzyl (meth) acrylate and monomaleimide as the other ethylenically unsaturated compound. It is valid. In this case, from the viewpoint of heat resistance, the copolymerization ratio of at least one selected from styrene, benzyl (meth) acrylate and monomaleimide is usually 1 mol% or more, preferably 3 mol% or more, and usually 70 mol. % Or less, preferably 50 mol% or less, more preferably 30 mol% or less, still more preferably 10 mol% or less.

  As an ethylenically unsaturated monocarboxylic acid to be added to an epoxy group contained in a copolymer of an epoxy group-containing (meth) acrylate and an ethylenically unsaturated compound, a known one can be used, and a curable viewpoint Therefore, (meth) acrylic acid is preferable. The amount of the ethylenically unsaturated monocarboxylic acid added to the epoxy group contained in the copolymer is usually 10 mol% or more, preferably 30 mol% or more, more preferably 50 mol% of the epoxy group contained in the copolymer. It is at least mol%, more preferably at least 70 mol%, and usually at most 100 mol%. There exists a tendency which can improve sclerosis | hardenability by making the addition ratio of ethylenically unsaturated monocarboxylic acid more than the said lower limit. In addition, a well-known method can be employ | adopted as a method of adding ethylenically unsaturated monocarboxylic acid to the said copolymer.

  The polybasic acid (anhydride) to be added to the hydroxyl group produced when ethylenically unsaturated monocarboxylic acid is added to the copolymer is not particularly limited, and known ones can be used. Examples include acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), succinic acid (anhydride), trimellitic acid (anhydride), and the like. Succinic acid (anhydride) is preferable from the viewpoint of reducing outgas, while tetrahydrophthalic acid (anhydride) is preferable from the viewpoint of improving the remaining film ratio and reducing the residue. A polybasic acid (anhydride) may be used individually by 1 type, and may use 2 or more types together by arbitrary combinations and a ratio. By adding such a component, alkali solubility can be imparted to the copolymer.

  The amount of polybasic acid (anhydride) added is usually 5 mol% or more, preferably 10 mol% or more of the hydroxyl group produced when ethylenically unsaturated monocarboxylic acid is added to the copolymer. . Moreover, it is 100 mol% or less normally, Preferably it is 90 mol% or less, More preferably, it is 80 mol% or less. There exists a tendency which can provide developability by setting it as the said lower limit or more, and there exists a tendency to suppress that a development advances too much and film | membrane dissolution by setting it as the said upper limit or less. In addition, a well-known method can be arbitrarily employ | adopted as a method of adding a polybasic acid (anhydride) to the hydroxyl group produced | generated when an ethylenically unsaturated monocarboxylic acid is added to the said copolymer.

  In the modified product of the above epoxy group-containing (co) polymer with ethylenically unsaturated monocarboxylic acid and polybasic acid (anhydride), some of the carboxyl groups generated after addition of polybasic acid (anhydride) Photosensitivity can be further improved by adding glycidyl (meth) acrylate or a glycidyl ether compound having an ethylenically unsaturated group. Moreover, developability can also be improved by adding the glycidyl ether compound which does not have an ethylenically unsaturated group to some carboxyl groups produced | generated after polybasic acid (anhydride) addition. Further, both of these may be added after the addition of the polybasic acid (anhydride).

  Examples of modified products of the above-mentioned epoxy group-containing (co) polymers with ethylenically unsaturated monocarboxylic acids and polybasic acids (anhydrides) include, for example, JP-A-8-297366 and JP-A-2001-89533. Examples of the resin described in the publication.

The weight average molecular weight (Mw) of the acid-modified epoxy group-containing (co) polymer is not particularly limited, but is usually 3,000 or more, preferably 5,000 or more, and usually 100,000 or less, preferably 50. 5,000 or less, more preferably 30,000 or less, even more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. There exists a tendency which can improve compatibility by setting it as the said lower limit or more, and there exists a tendency which can ensure solubility by setting it as the said upper limit or less. The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] is preferably 2.0 to 5.0 from the viewpoint of curability.
The acid value of the acid-modified epoxy group-containing (co) polymer is not particularly limited, but is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, further preferably 20 mgKOH / g or more, and 150 mgKOH / g or less. Is preferable, 100 mgKOH / g or less is more preferable, and 50 mgKOH / g or less is more preferable. There exists a tendency which can ensure solubility by setting it as the said lower limit or more, and there exists a tendency which can improve a film reduction by setting it as the said upper limit or less.

[1-1-3-c] (C-3) Carboxyl group and ethylenically unsaturated group-containing resin [1-1-3-c-1] acid-modified epoxy resin Carboxyl group and ethylenically unsaturated group-containing resin For example, a carboxyl group- and ethylenically unsaturated group-containing epoxy resin obtained by adding a polybasic acid (anhydride) to an ethylenically unsaturated group monocarboxylic acid adduct of an epoxy resin, that is, a so-called epoxy (meth) acrylate resin Is mentioned. That is, an ethylenically unsaturated bond is added to the epoxy resin via an ester bond (—COO—) by ring-opening addition of the carboxy group of the ethylenically unsaturated monocarboxylic acid to the epoxy group of the epoxy resin. In addition, one in which one carboxy group of a polybasic acid (anhydride) is added to the hydroxyl group generated at that time.

  Here, the epoxy resin includes the raw material compound before the resin is formed by thermosetting, and the epoxy resin can be appropriately selected from known epoxy resins. Specifically, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, biphenyl novolac epoxy resin, trisphenol epoxy resin, polymerization of phenol and dicyclopentane Epoxy resin, dihydroxyoxyfluorene type epoxy resin, dihydroxyalkyleneoxyl fluorene type epoxy resin, diglycidyl etherified product of 9,9-bis (4′-hydroxyphenyl) fluorene, 1,1-bis (4′-hydroxy) Phenyl) adamantane diglycidyl etherified product, and the like. Among them, from the viewpoint of high cured film strength, bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized epoxy resin of phenol and dicyclopentadiene, 9,9-bis (4′-hydroxyphenyl) fluorene Diglycidyl etherified compounds are preferable, and bisphenol A epoxy resin is more preferable.

  Examples of the ethylenically unsaturated monocarboxylic acid include (meth) acrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, and the like, and pentaerythritol tri (meth) acrylate succinic anhydride adduct , Pentaerythritol tri (meth) acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta (meth) acrylate succinic anhydride adduct, dipentaerythritol penta (meth) acrylate phthalic anhydride adduct, dipentaerythritol penta (meth) Examples include an acrylate tetrahydrophthalic anhydride adduct, a reaction product of (meth) acrylic acid and ε-caprolactone, and the like. Among these, (meth) acrylic acid is preferable from the viewpoint of sensitivity.

  Examples of the polybasic acid (anhydride) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, and 3-ethyltetrahydrophthalic acid. 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyro Examples include merit acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid, and anhydrides thereof. Among these, succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride is preferable from the viewpoint of image reproducibility, developability, and outgas, and succinic anhydride or tetrahydrophthalic anhydride. Is more preferable, and succinic anhydride is still more preferable.

The acid value of the acid-modified epoxy resin in the present invention is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, further preferably 30 mgKOH / g or more, and preferably 200 mgKOH / g or less, 180 mgKOH / g g or less is more preferred, 150 mgKOH / g or less is more preferred, 100 mgKOH / g or less is more preferred, and 80 mgKOH / g or less is particularly preferred. There exists a tendency which can improve adhesiveness by setting it as the said lower limit or more, and there exists a tendency which can improve solubility by setting it as the said upper limit or less.
Further, the weight average molecular weight (Mw) of the acid-modified epoxy resin is not particularly limited, but is usually 1,000 or more, preferably 2,000 or more, more preferably 3,000 or more, further preferably 4,000 or more, and more Preferably it is 5,000 or more, Especially preferably, it is 6,000 or more, Usually, 30,000 or less, Preferably it is 20,000 or less, More preferably, it is 15,000 or less, More preferably, it is 10,000 or less. There exists a tendency which can improve adhesiveness by setting it as the said lower limit or more, and there exists a tendency which can maintain appropriate solubility by setting it as the said upper limit or less.

  The acid-modified epoxy resin can be synthesized by a conventionally known method. Specifically, the epoxy resin is dissolved in an organic solvent, and in the presence of a catalyst and a thermal polymerization inhibitor, the ethylenically unsaturated monocarboxylic acid is added to cause addition reaction, and further a polybasic acid (anhydride) is added. The method of continuing the reaction can be used.

  Here, examples of the organic solvent used in the reaction include one or more organic solvents such as methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of the catalyst include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine, and tertiary amines such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride. 1 type or 2 types or more, such as quaternary ammonium salts, phosphorus compounds, such as a triphenylphosphine, and stibines, such as a triphenylstibine, are mentioned. Furthermore, examples of the thermal polymerization inhibitor include one or more of hydroquinone, hydroquinone monomethyl ether, methyl hydroquinone and the like.

  The amount of the ethylenically unsaturated monocarboxylic acid used is usually 0.7 to 1.3 chemical equivalents, preferably 0.9 to 1.1 chemical equivalents, relative to one chemical equivalent of the epoxy group of the epoxy resin. The amount can be. Moreover, as temperature at the time of addition reaction, it is 60-150 degreeC normally, Preferably it can be set as the temperature of 80-120 degreeC. Further, the polybasic acid (anhydride) is used in an amount of usually 0.1 to 1.2 chemical equivalents, preferably 0.2 to 1.1 based on 1 chemical equivalent of the hydroxyl group generated in the addition reaction. The amount can be a chemical equivalent.

  Specific examples of the acid-modified epoxy resin in the present invention are shown below. The acid-modified epoxy resin may include one type of resin, or may include two or more types of resins.

In formula (C1-1), R ¹¹¹ each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹¹¹ represents an integer of 0 to 20.

In formula (C1-2), R ¹²¹ each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹²¹ represents an integer of 0 to 20.

In formula (C1-3), R ¹³¹ independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and m ¹³¹ and n ¹³¹ each independently represents an integer of 0 to 20. In addition, ^m131 and ⁿ¹³¹ mean the number of repeating units, and do not indicate that it is a block copolymer. Each γ independently represents a single bond, —CO—, —CH ₂ —, —C (CH ₃ ) ₂ —, a group represented by the following formula (IV), or a group represented by the following formula (V). δ represents a hydrogen atom or a polybasic acid residue.

In formula (C1-4), R ¹⁴¹ each independently represents an alkyl group or a halogen atom, and p independently represents an integer of 0 to 4.

In formula (C1-6), R ¹⁶¹ each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, and n ¹⁶¹ represents an integer of 0 to 20.

  In formulas (C1-1) to (C1-6), A represents a group represented by the following general formula (VI).

In formula (VI), R ¹⁷¹ represents a hydrogen atom or a methyl group, R ¹⁷² represents an alkylene group, and m ¹⁷¹ represents an integer of 0 to 10. Δ represents a hydrogen atom or a polybasic acid residue.

[1-1-3-c-2] Modified Phenolic Resin As a carboxyl group- and ethylenically unsaturated group-containing resin, for example, an ethylenically unsaturated group-containing epoxy compound adduct of a phenol resin, a polybasic acid (anhydride) And a phenol resin containing a carboxyl group and an ethylenically unsaturated group. That is, the epoxy group of an epoxy compound containing an ethylenically unsaturated group is ring-opened and added to the phenolic hydroxyl group of the phenol resin, thereby adding an ethylenically unsaturated bond to the phenol resin via an ester bond (—COO—). In addition, one in which one carboxy group of a polybasic acid (anhydride) is added to the hydroxyl group generated at that time.

  Here, as the phenol resin, for example, phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, o-ethylphenol, m-ethylphenol, p-ethylphenol Propylphenol, n-butylphenol, tert-butylphenol, 1-naphthol, 2-naphthol, 4,4′-biphenyldiol, bisphenol-A, pyrocatechol, resorcinol, hydroquinone, pyrogallol, 1,2,4-benzenetriol, At least one of phenols such as benzoic acid, 4-hydroxyphenylacetic acid, salicylic acid, phloroglucinol and the like is reacted with an acid catalyst, for example, formaldehyde, paraformaldehyde, acetaldehyde, paraaldehyde, propiona. Instead of an aldehyde such as dehydr, benzaldehyde, salicylaldehyde, furfural, or a novolak resin polycondensed with at least one of ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and the acid catalyst in the polycondensation Resole resins and the like that are polycondensed in the same manner except that an alkali catalyst is used are included. Here, the condensation reaction of the phenols and aldehydes is carried out in the absence of a solvent or in a solvent.

  The weight average molecular weight (Mw) of these novolak resins and resol resins is usually 1,000 to 20,000, preferably 1,000 to 10,000, and more preferably 1,000 to 8,000. . When the weight average molecular weight is at least the lower limit value, the image strength tends to be ensured, and when the weight average molecular weight is at the upper limit value or less, developability tends to be ensured.

  Examples of the ethylenically unsaturated group-containing epoxy compound include glycidyl (meth) acrylate, (3,4-epoxycyclohexyl) methyl (meth) acrylate, glycidyloxy (poly) alkylene glycol (meth) acrylate, and methyl glycidyl (meth). Examples thereof include acrylate and (3,4-epoxycyclohexyl) vinyl. Of these, glycidyl (meth) acrylate and (3,4-epoxycyclohexyl) methyl (meth) acrylate are particularly preferable.

  A well-known method can be used for reaction of a novolak resin, a resole resin, etc. with an ethylenically unsaturated group containing epoxy compound. For example, tertiary amines such as triethylamine and benzylmethylamine, quaternary ammonium salts such as dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride and benzyltriethylammonium chloride, one or more of pyridine and triphenylphosphine Is used as a catalyst in an organic solvent at a reaction temperature of 50 to 150 ° C. for several to several tens of hours, whereby an ethylenically unsaturated group-containing epoxy compound can be added to a novolak resin, a resole resin or the like.

The amount of the catalyst used is preferably 0.01 to 10% by mass, particularly preferably 0.3 to 5%, based on the reaction raw material mixture (total of novolac resin, resol resin and ethylenically unsaturated group-containing epoxy compound). % By mass. In order to prevent polymerization during the reaction, a polymerization inhibitor (for example, one or more of methoquinone, hydroquinone, methylhydroquinone, p-methoxyphenol, pyrogallol, tert-butylcatechol, dibutylhydroxytoluene, phenothiazine) is added. The amount used is preferably 0.01 to 10% by mass, particularly preferably 0.03 to 5% by mass, based on the reaction raw material mixture.
In addition, the preferable ratio which adds an ethylenically unsaturated group containing epoxy compound to phenolic hydroxyl groups, such as a novolak resin and a resole resin, is 1-99 mol%. This ratio can be adjusted by the amount of the ethylenically unsaturated group-containing epoxy compound added to the phenolic hydroxyl group.

  As the polybasic acid (anhydride), for example, known ones can be used, such as maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylendomethylenetetrahydrophthalic acid, chlorend Acids, dibasic carboxylic acids such as methyltetrahydrophthalic acid, 5-norbornene-2,3-dicarboxylic acid, methyl-5-norbornene-2,3-dicarboxylic acid or anhydrides thereof, trimellitic acid, pyromellitic acid, Examples thereof include polybasic carboxylic acids such as benzophenone tetracarboxylic acid and biphenyl tetracarboxylic acid or anhydrides thereof. Among these, tetrahydrophthalic anhydride or succinic anhydride is preferable. These may be used alone or in combination of two or more.

  The addition rate of the polybasic acid (anhydride) is usually 10 to 100 mol%, preferably 20 to 100 mol%, of the hydroxyl group of the reaction product of the novolak resin, resol resin or the like and the ethylenically unsaturated group-containing epoxy compound. Preferably it is 30-100 mol%. By making this addition rate within the above range, developability tends to be easily secured.

[1-1-3-d] Other alkali-soluble resin In addition, it is a case where a partition is provided in an organic electric field element of a substrate which is easily deteriorated with respect to an alkali developer, and a developer of a weak alkali alkaline compound In the case of using a developer not containing an alkaline compound, the alkali-soluble resin is exemplified by polyvinyl alcohol or the [1-1-3-a-1] carboxyl group-containing (co) polymer (1). A vinyl alcohol copolymer obtained by copolymerizing 0.1 to 40 mol%, preferably 1 to 30 mol% of a comonomer (preferably vinyl acetate or the like), or the above [1-1-3-a -1] Modified polymer in which 0.1 to 40 mol%, preferably 1 to 30 mol% of the copolymer mentioned in the carboxyl group-containing (co) polymer (1) is introduced by an esterification reaction. Livinyl alcohol is preferably used.
Further, for the purpose of forming an appropriate taper angle and maintaining liquid repellency, the ethylenically unsaturated monocarboxylic acid (preferred examples) mentioned in the above [1-1-3-c-1] acid-modified epoxy resin , (Meth) acrylic acid, a reaction product of (meth) acrylic acid and ε-caprolactone, etc.) or a polybasic acid (anhydride) (preferably, tetrahydrophthalic anhydride, etc.) by esterification reaction Modified polyvinyl alcohol introduced in an amount of 0.1 to 30 mol%, preferably 0.5 to 20 mol%, or a (meth) acryloyl (oxy) group or (meth) acrylamide group described in JP-A-2008-45047 And a compound having an aldehyde group (preferred examples include 4-acryloyloxybutanal) or a dialkyl acetal Modified polyvinyl alcohol in which 0.1 to 30 mol%, preferably 0.5 to 20 mol%, of a compound having a thiophene compound (for example, N- (2,2-dimethoxyethyl) methacrylamide) is introduced by a formal reaction , Etc. are preferably used.

  (C) Among the above-mentioned ones as the alkali-soluble resin, (C-2) a carboxyl group-containing (co) polymer having an ethylenically unsaturated group in the side chain or (C-3) from the viewpoint of outgas reduction and curability ) A carboxyl group and an ethylenically unsaturated group-containing resin are preferred, (C-3) a carboxyl group and an ethylenically unsaturated group-containing resin are more preferred, and an acid-modified epoxy resin is more preferred.

The weight average molecular weight (Mw) of the above (C) alkali-soluble resin is not particularly limited, but is preferably 2,000 or more, more preferably 3,000 or more, further preferably 5,000 or more, and particularly preferably 7,000 or more. Preferably, 50,000 or less is preferable, 30,000 or less is more preferable, 20,000 or less is more preferable, and 10,000 or less is particularly preferable. By setting it to the lower limit value or more, there is a tendency to suppress excessive development and dissolution of the film, and by setting it to the upper limit value or less, there is a tendency to exhibit appropriate development solubility.
The acid value of the (C) alkali-soluble resin is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, more preferably 30 mgKOH / g or more, and preferably 200 mgKOH / g or less, 150 mgKOH / g. The following is more preferable, 100 mgKOH / g or less is further preferable, 70 mgKOH / g or less is further more preferable, and 50 mgKOH / g or less is particularly preferable. There exists a tendency which can suppress a residue by setting it as the said lower limit or more, and there exists a tendency for a high remaining film rate to be obtained by setting it as the said upper limit or less.

  The content ratio of the (C) alkali-soluble resin in the photosensitive resin composition of the present invention is usually 5% by mass or more, preferably 10% by mass or more, more preferably 20% by mass or more, based on the total solid content. It is preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. When it is at least the lower limit, moderate development solubility and sensitivity tend to be obtained, and when it is at most the upper limit, moderate development solubility and sensitivity tend to be obtained.

  The content ratio of (A) ethylenically unsaturated compound and (C) alkali-soluble resin in the total solid content is usually 5% by mass or more, preferably 10% by mass or more, more preferably, based on the total solid content. 30% by mass or more, more preferably 50% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 85% by mass or more, and usually 99% by mass or less. Preferably it is 97 mass% or less, More preferably, it is 95 mass% or less. When it is at least the lower limit, moderate development solubility and sensitivity tend to be obtained, and when it is at most the upper limit, moderate development solubility and sensitivity tend to be obtained.

  Moreover, as a compounding ratio of (C) alkali-soluble resin with respect to (A) ethylenically unsaturated compound in the photosensitive resin composition, 50 mass parts or more with respect to 100 mass parts of (A) ethylenically unsaturated compound. Preferably, 60 parts by mass or more is more preferable, 70 parts by mass or more is more preferable, 80 parts by mass or more is particularly preferable, 400 parts by mass or less is preferable, 300 parts by mass or less is more preferable, and 200 parts by mass or less is more preferable. 100 parts by mass or less is particularly preferable. When the amount is not less than the lower limit value, the substrate adhesion tends to be strong, and when the value is not more than the upper limit value, the curability becomes high and the minimum exposure amount required for producing liquid repellency becomes low. Tend.

[1-1-4] Component (D); Liquid Repellent Agent The photosensitive resin composition for forming a partition wall of the present invention may contain (D) a liquid repellent agent. In particular, when an organic electroluminescent device is produced by an ink jet method, it is preferable to contain (D) a liquid repellent, and (D) it can impart liquid repellency to the surface of the partition wall by containing the liquid repellent. It is considered that the obtained partition wall can prevent color mixing for each light emitting portion (pixel portion) of the organic layer.
Examples of the liquid repellent include a silicone-containing compound and a fluorine-based compound, and preferably include a liquid repellent having a crosslinking group (hereinafter sometimes referred to as “crosslinking group-containing liquid repellent”). Examples of the crosslinking group include an epoxy group or an ethylenically unsaturated group, and an ethylenically unsaturated group is preferable from the viewpoint of suppressing the outflow of the liquid repellent component of the developer.
When the crosslinkable group-containing liquid repellent is used, when the formed coating film is exposed, the cross-linking reaction on the surface can be accelerated, and the liquid repellent is less likely to flow out during the development process. Can be considered to exhibit high liquid repellency.

  When a fluorine-based compound is used as the liquid repellent, the fluorine compound tends to be oriented on the surface of the partition wall and function to prevent ink bleeding and color mixing. More specifically, the group having a fluorine atom tends to function to repel ink and prevent ink bleeding and color mixing due to the ink entering the adjacent region beyond the partition wall.

  Specific examples of the crosslinkable group-containing liquid repellent, particularly the ethylenically unsaturated group-containing fluorine-based compound include, for example, perfluoroalkylsulfonic acid, perfluoroalkylcarboxylic acid, perfluoroalkylalkylene oxide adduct, perfluoroalkyltrialkylammonium salt. Oligomers containing perfluoroalkyl groups and hydrophilic groups, oligomers containing perfluoroalkyl groups and lipophilic groups, oligomers containing perfluoroalkyl groups, hydrophilic groups and new oil groups, urethanes containing perfluoroalkyl groups and hydrophilic groups, Mention may be made of fluorine-containing organic compounds such as fluoroalkyl esters and perfluoroalkyl phosphate esters. Commercially available products of these fluorine-containing compounds include “Megafuck F116”, “Megafuck F120”, “Megafuck F142D”, “Megafuck F144D”, “Megafuck F150”, “Megafuck F160”, manufactured by DIC, “Mega Fuck F171”, “Mega Fuck F172”, “Mega Fuck F173”, “Mega Fuck F177”, “Mega Fuck F178A”, “Mega Fuck F178K”, “Mega Fuck F179”, “Mega Fuck F183”, “Mega Fuck F183” Fuck F184, Mega Fuck F191, Mega Fuck F812, Mega Fuck F815, Mega Fuck F824, Mega Fuck F833, Mega Fuck RS101, Mega Fuck RS102, Mega Fuck RS105 , "Me “Fuck RS201”, “Megafuck RS202”, “Megafuck RS301”, “Megafuck RS303” “Megafuck RS304”, “Megafuck RS401”, “Megafuck RS402”, “Megafuck RS501”, “Megafuck RS502” , “Megafuck RS-72-K”, “DEFENSA MCF300”, “DEFENSA MCF310”, “DEFENSA MCF312”, “DEFENSA MCF323”, “Florard FC430”, “Florard FC431”, “FC-4430” manufactured by 3M Japan , “FC4432”, “Asahi Guard AG710”, “Surflon S-382”, “Surflon SC-101”, “Surflon SC-102”, “Surflon SC-103” manufactured by Asahi Glass Co., Ltd. ”,“ Surflon SC-104 ”,“ Surflon SC-105 ”,“ Surflon SC-106 ”,“ Optool DAC-HP ”manufactured by Daikin Industries, Ltd. Can do.

  Thus, in the case of using a fluorine-based compound as the liquid repellent, the fluorine atom content in the liquid repellent is not particularly limited, but preferably the fluorine atom content is preferably 1% by mass or more, more preferably 5% by mass or more. Moreover, 50 mass% or less is preferable, and 25 mass% or less is more preferable. By setting it to the lower limit value or more, there is a tendency that the outflow to the pixel portion can be suppressed, and by setting the upper limit value or less, there is a tendency to show a high contact angle.

  The molecular weight of the liquid repellent is not particularly limited, and may be a low molecular weight compound or a high molecular weight substance. The liquid repellent of high molecular weight is preferable because the flow of the liquid repellent by post-baking is suppressed, so that the outflow of the liquid repellent from the bank can be suppressed. From this viewpoint, the number average molecular weight of the liquid repellent is 100 or more. Is preferable, 500 or more is more preferable, 100,000 or less is preferable, and 10,000 or less is more preferable.

  The content ratio of the liquid repellent (D) in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.1% by mass or more, usually 1% by mass or less, preferably based on the total solid content. Is 0.5% by mass or less, more preferably 0.3% by mass or less. When it is at least the lower limit, there is a tendency to exhibit high liquid repellency, and when it is at most the upper limit, there is a tendency that outflow of the liquid repellent to the pixel portion can be suppressed.

On the other hand, in the photosensitive resin composition for forming a partition wall of the present invention, a surfactant may be used together with (D) the liquid repellent, and a surfactant may be used instead of (D) the liquid repellent. The surfactant can be used for the purpose of improving the coating property of the photosensitive resin composition for forming a partition wall as a coating solution and the developing property of the coating film, among which a fluorine-based or silicone-based surfactant is preferable. .
In particular, at the time of development, a silicone-based surfactant is preferable because it has an action of removing the residue of the photosensitive resin composition from the unexposed area and also has a function of expressing wettability. A surfactant is more preferred.

  As the fluorosurfactant, a compound having a fluoroalkyl or fluoroalkylene group in at least one of the terminal, main chain and side chain is suitable. Specifically, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctyl hexyl ether, octaethylene glycol di ( 1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,2,2- Tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecyl sulfonate, 1,1,2,2,8,8,9, Examples include 9,10,10-decafluorododecane and 1,1,2,2,3,3-hexafluorodecane. Examples of these commercially available products include “BM-1000” and “BM-1100” manufactured by BM Chemie, “Megafuck F142D”, “Megafuck F172”, “Megafuck F173”, and “Megafuck F183” manufactured by DIC. ”,“ Megafuck F470 ”,“ Megafuck F475 ”,“ FC430 ”manufactured by 3M Japan,“ DFX-18 ”manufactured by Neos, and the like.

Examples of the silicone surfactant include “DC3PA”, “SH7PA”, “DC11PA”, “SH21PA”, “SH28PA”, “SH29PA”, “8032Additive”, “SH8400” manufactured by Toray Dow Corning, Commercial products such as “BYK323” and “BYK330” manufactured by Big Chemie may be mentioned.
Surfactants may include those other than fluorosurfactants and silicone surfactants, and other surfactants include nonionic, anionic, cationic, and amphoteric surfactants. It is done.

  Examples of the nonionic surfactant include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, Glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbit fatty acid esters, polyoxy And ethylene sorbite fatty acid esters. Examples of these commercially available products include polyoxyethylene surfactants such as “Emulgen 104P” and “Emulgen A60” manufactured by Kao Corporation.

  Examples of the anionic surfactant include alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate esters, and higher alcohol sulfates. Ester salts, aliphatic alcohol sulfates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate esters, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, special Examples thereof include polymer surfactants. Among these, special polymer surfactants are preferable, and special polycarboxylic acid type polymer surfactants are more preferable. Commercially available products can be used as such anionic surfactants, such as “Emar 10” manufactured by Kao Corporation for alkyl sulfate esters, and “Perex NB-L” manufactured by Kao Corporation for alkylnaphthalene sulfonates. Examples of special polymer surfactants include “Homogenol L-18” and “Homogenol L-100” manufactured by Kao Corporation.

Further, the cationic surfactants include quaternary ammonium salts, imidazoline derivatives, alkylamine salts and the like, and the amphoteric surfactants include betaine type compounds, imidazolium salts, imidazolines, amino acids. Etc. Of these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Examples of commercially available products include “Acetamine 24” manufactured by Kao Corporation for alkylamine salts, and “Cotamine 24P” and “Cotamine 86W” manufactured by Kao Corporation for quaternary ammonium salts.
Further, the surfactant may be used in combination of two or more kinds, for example, silicone surfactant / fluorine surfactant, silicone surfactant / special polymer surfactant, fluorine surfactant. / Special polymer surfactant combinations and the like. Of these, a combination of silicone surfactant / fluorine surfactant is preferable. In this silicone surfactant / fluorine surfactant combination, for example, “DFX-18” manufactured by Neos, “BYK-300” or “BYK-330” manufactured by Big Chemie, and “S” manufactured by AGC Seimi Chemical Co., Ltd. -393 ", Shin-Etsu Silicone" KP340 "/ DIC" F-478 "or" F-475 ", Toray Dow Corning" SH7PA "/ Daikin" DS-401 ", NUC" L-77 "/" FC4430 "manufactured by 3M Japan.

[1-1-5] Polymerization inhibitor The photosensitive resin composition for forming a partition wall of the present invention may contain a polymerization inhibitor. It is considered that the taper angle of the obtained partition wall can be increased because it contains a polymerization inhibitor and inhibits radical polymerization.
Examples of the polymerization inhibitor include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, 2,6-di-tert-butyl-4-cresol (BHT) and the like. Among these, hydroquinone or methoxyphenol is preferable from the viewpoint of the ability to inhibit polymerization, and methylhydroquinone is more preferable.

  It is preferable that a polymerization inhibitor contains 1 type (s) or 2 or more types. Usually, when the (C) alkali-soluble resin is produced, a polymerization inhibitor may be contained in the resin, which may be used as the polymerization inhibitor of the present invention, or the polymerization inhibitor in the resin. In addition, the same or different polymerization inhibitor may be added during the production of the photosensitive resin composition.

  The content of the polymerization inhibitor in the photosensitive resin composition is usually 0.0005% by mass or more, preferably 0.001% by mass or more, more preferably 0.005% by mass or more with respect to the total solid content of the photosensitive resin composition. It is 01 mass% or more, and is 0.3 mass% or less normally, Preferably it is 0.2 mass% or less, More preferably, it is 0.1 mass% or less. There exists a tendency which can make a taper angle high by setting it as the said lower limit or more, and there exists a tendency which can maintain a high sensitivity by setting it as the said upper limit or less.

[1-1-6] Ultraviolet Absorber The photosensitive resin composition for forming a partition wall of the present invention may contain an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the photocuring distribution by absorbing a specific wavelength of a light source used for exposure by the ultraviolet absorber. By adding an ultraviolet absorber, it is possible to improve the taper angle and shape after development, and to eliminate residues remaining in the non-exposed area after development. As the ultraviolet absorber, from the viewpoint of inhibiting the light absorption of the initiator, for example, a compound having an absorption maximum between wavelengths of 250 nm to 400 nm can be used.
Examples of the ultraviolet absorber include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and derivatives thereof, dinaphthalene compounds, phenanthroline compounds, dyes, and the like.
These ultraviolet absorbers can be used alone or in combination of two or more.

  Among these, from the viewpoint of increasing the taper angle, benzotriazole compounds and / or hydroxyphenyltriazine compounds are preferable, and benzotriazole compounds are particularly preferable.

  Among the benzotriazole compounds, a benzotriazole compound described by the following general formula (Z1) is preferable from the point of taper shape.

In the above formula (Z1), R ^1e and R ^2e each independently represent a hydrogen atom, an alkyl group which may have a substituent, a group represented by the following general formula (Z2), or the following general formula (Z3 ) Represents a group represented by R ^3e represents a hydrogen atom or a halogen atom.

In the above formula (Z2), R ^4e represents an alkylene group which may have a substituent, and R ^5e represents an alkyl group which may have a substituent.

In the above formula (Z3), R ^6e represents an alkylene group which may have a substituent, and R ^7e represents a hydrogen atom or a methyl group.

(R ^1e and R ^2e )
In Formula (Z1), R ^1e and R ^2e are each independently a hydrogen atom, an alkyl group which may have a substituent, a group represented by General Formula (Z2), or General Formula (Z3). Represents the group represented.
Examples of the alkyl group include linear, branched or cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, further preferably 4 or more, preferably 10 or less, more preferably 6 or less, More preferably, it is 4 or less.

Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group. Among these, a tert-butyl group is preferable.
The substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.

(R ^3e )
In the formula (Z1), R ^3e represents a hydrogen atom or a halogen atom.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
Among these, from the viewpoint of synthesis, R ^3e is preferably a hydrogen atom.

(R ^4e )
In the formula (Z2), R ^4e represents an alkylene group which may have a substituent.
Examples of the alkylene group include linear, branched or cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less.

Specific examples of the alkylene group include methylene group, ethylene group, propylene group, propylene group, butylene group and the like. Among these, an ethylene group is preferable.
In addition, as the substituent that the alkylene group may have, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.

Among these, R ^4e is preferably an ethylene group.

(R ^5e )
In the formula (Z2), an alkyl group which may have a substituent is represented.
Examples of the alkyl group include linear, branched or cyclic alkyl groups. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, still more preferably 7 or more, and is preferably 15 or less, more preferably 10 or less, More preferably, it is 9 or less.

Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, and a nonyl group.
The substituents that the alkyl group may have include methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.
Among these, from the viewpoint of a tapered shape, R ^5e is preferably a heptyl group, an octyl group, or a nonyl group.

(R ^6e )
In the formula (Z3), R ^6e represents an alkylene group which may have a substituent.
Examples of the alkylene group include linear, branched or cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less.

Specific examples of the alkylene group include methylene group, ethylene group, propylene group, propylene group, butylene group and the like. Among these, an ethylene group is preferable.
In addition, as the substituent that the alkylene group may have, methoxy group, ethoxy group, chloro group, bromo group, fluoro group, hydroxy group, amino group, epoxy group, oligoethylene glycol group, phenyl group, carboxyl group , Acryloyl group, methacryloyl group and the like.

Among these, from the viewpoint of a tapered shape, R ^1e is a tert-butyl group, R ^2e is a group represented by the formula (Z2) (where R ^4e is an ethylene group, and R ^5e is an alkyl group having 7 to 9 carbon atoms). R ^3e is a hydrogen atom, or R ^1e is a hydrogen atom, R ^2e is a group represented by the above formula (Z3) (where R ^6e is an ethylene group, R ^7e is a methyl group), and R ^3e is a hydrogen atom Wherein R ^1e is a tert-butyl group, R ^2e is a group represented by the above formula (Z2) (where R ^4e is an ethylene group, R ^5e is an alkyl group having 7 to 9 carbon atoms), R ^3e A compound in which is a hydrogen atom is more preferred.

  Specific examples of the benzotriazole compound include 2- (5-methyl-2-hydroxyphenyl) benzotriazole, 2- (2-hydroxy-5-tert-butylphenyl) -2H-benzotriazole, octyl-3- [ 3-tert-butyl-4-hydroxy-5- (5-chloro-2H-benzotriazol-2-yl) phenyl] propionate and 2-ethylhexyl-3- [3-tert-butyl-4-hydroxy-5- ( 5-chloro-2H-benzotriazol-2-yl) phenyl] propionate, 2- [2-hydroxy-3,5-bis (α, α-dimethylbenzyl) phenyl] -2H-benzotriazole, 2- ( 3-tert-butyl-5-methyl-2-hydroxyphenyl) -5-chlorobenzotriazole, 2- (3,5-di-tert-amyl-2-hydroxyphenyl) benzotriazole, 2- (2′-hydroxy-5′-tert-octylphenyl) benzotriazole, benzenepropanoic acid, 3- (2H-benzo Triazol-2-yl) -5- (1,1-dimethylethyl) -4-hydroxy, C7-9 side chain and linear alkyl ester compounds, 2- (2H-benzotriazol-2-yl) -4, 6-bis (1-methyl-1-phenylethyl) phenol, 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1-phenylethyl) -4- (1,1,3 3-tetramethylbutyl) phenol. Among these, from the viewpoint of taper angle and exposure sensitivity, 3- (2H-benzotriazol-2-yl) -5- (1,1-dimethylethyl) -4-hydroxy, C7-9 side chain and linear alkyl Ester compounds are preferred.

  Examples of commercially available benzotriazole-based compounds include Sumisorb 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry), TINUVIN PS , TINUVIN99-2, TINUVIN109, TINUVIN384-2, TINUVIN 326, TINUVIN900, TINUVIN928, TINUVIN1130 (manufactured by BASF), EVERSORB70, EVERSORB71, EVERSORB72, EVERSORB74, 75 EVERSORB74, 75 0, EVERSORB81 (manufactured by Yongkou Chemical Industries, Taiwan), Tomissorb 100, Tomisorb 600 (manufactured by API Corporation), SEESORB701, SEESORB702, SEESORB703, SEESORB704, SEESORB707, SEESORB709 (Ryutsuka Chemical-Daisei 93) Manufactured).

Examples of triazine compounds include 2- [4,6-di (2,4-xylyl) -1,3,5-triazin-2-yl] -5-octyloxyphenol, 2- [4,6-bis ( 2,4-Dimethylphenyl) -1,3,5-triazin-2-yl] -5- [3- (dodecyloxy) -2-hydroxypropoxy] phenol, 2- (2,4-dihydroxyphenyl) -4 , 6-Bis (2,4-dimethylphenyl) -1,3,5-triazine and (2-ethylhexyl-glycidic acid ester reaction product, 2,4-bis "2-hydroxy-4-butoxyphenyl"- 6- (2,4-dibutoxyphenyl) -1,3-5-triazine, etc. Among these, a hydroxyphenyl triazine compound is preferable from the viewpoint of taper angle and exposure sensitivity.
Examples of commercially available triazine compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF).

  Other UV absorbers include, for example, Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORB10, EVERSORB11, EVERSORB12 (manufactured by Eikko Chemical Industries, Ltd.), Tomissorb 800 (manufactured by API Corporation), SESORB100, SESORB101, SESORB101S, SEESORB102, SEESORB102, SEESORB102 Benzophenone compounds such as SEESORB105, SEESORB106, SEESORB107, and SEESORB151 (manufactured by Cypro Kasei); Sumitsorb 400 (manufactured by Sumitomo Chemical); benzoate compounds such as phenyl salicylate; 2-ethylhexyl cinnamate, 2-ethylhexyl paramethoxycinnamate, and isopropyl methoxycinnamate Cinnamic acid derivatives such as isoamyl methoxycinnamate; -Naphthol, β-naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6 -Naphthalene derivatives such as dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene; anthracene, 9,10-dihydroxy Anthracene such as anthracene and derivatives thereof; azo dyes, benzophenone dyes, amino ketone dyes, quinoline dyes, anthraquinone dyes, diphenyl cyanoacrylate dyes, triazine dyes, p-amino acid And dyes such as benzoic acid dyes. Among these, from the viewpoint of exposure sensitivity, cinnamic acid derivatives and naphthalene derivatives are preferably used, and cinnamic acid derivatives are particularly preferably used.

  The content ratio of the ultraviolet absorber in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.05% by mass or more, more preferably 0.1% by mass with respect to the total solid content. Or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, and usually 15% by mass or less, preferably 10% by mass or less, more preferably 5% by mass or less, and further preferably 3% by mass. % Or less. The taper angle tends to be increased by setting it to the lower limit value or more, and the sensitivity tends to be increased by setting it to the upper limit value or less.

  Moreover, (B) As a compounding ratio with respect to a photoinitiator, (B) As a compounding quantity of the ultraviolet absorber with respect to 100 mass parts of photoinitiators, it is 1 mass part or more normally, Preferably it is 10 mass parts or more, More preferably 30 parts by mass or more, more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, and usually 500 parts by mass or less, preferably 300 parts by mass or less, more preferably 200 parts by mass or less, still more preferably 150 parts by mass. It is as follows. The taper angle tends to be increased by setting it to the lower limit value or more, and the sensitivity tends to be increased by setting the upper limit value or less.

[1-1-7] Thermal Polymerization Initiator Furthermore, the partition wall-forming photosensitive resin composition of the present invention may contain a thermal polymerization initiator. By containing a thermal polymerization initiator, there is a tendency that the degree of crosslinking of the film can be increased. Specific examples of such a thermal polymerization initiator include azo compounds, organic peroxides and hydrogen peroxide. These may be used alone or in combination of two or more.

  When a thermal polymerization initiator is used in combination with the photopolymerization initiator in the hope of improving sensitivity and increasing the crosslink density of the film, the total content of these is the photopolymerization initiator in the photosensitive resin composition described above. The combined proportion of the photopolymerization initiator and the thermal polymerization initiator is preferably a thermal polymerization initiator with respect to 100 parts by mass of the photopolymerization initiator from the viewpoint of sensitivity. It is preferable to set it as 5-300 mass parts.

[1-1-8] Amino Compound The photosensitive resin composition for forming a partition wall of the present invention may contain an amino compound in order to promote thermosetting. In this case, the content ratio of the amino compound in the photosensitive resin composition is usually 40% by mass or less, preferably 30% by mass or less, based on the total solid content of the photosensitive resin composition. Moreover, it is 0.5 mass% or more normally, Preferably it is 1 mass% or more. There exists a tendency which can maintain storage stability by setting it as the said upper limit or less, and there exists a tendency which can ensure sufficient thermosetting by setting it as the said lower limit or more.

  Examples of the amino compound include an amino compound having at least two methylol groups as functional groups and alkoxymethyl groups obtained by subjecting the methylol group to alcohol condensation modification having 1 to 8 carbon atoms. Specifically, for example, melamine resin obtained by polycondensation of melamine and formaldehyde; benzoguanamine resin obtained by polycondensation of benzoguanamine and formaldehyde; glycoluril resin obtained by polycondensation of glycoluril and formaldehyde; urea and formaldehyde Examples include polycondensed urea resins; resins obtained by copolycondensation of two or more of melamine, benzoguanamine, glycoluril, and urea with formaldehyde; modified resins obtained by alcohol condensation modification of methylol groups of the above-described resins. These may be used alone or in combination of two or more. Among the amino compounds, melamine resins and modified resins thereof are preferable, modified resins having a methylol group modification ratio of 70% or more are more preferable, and modified resins having 80% or more are particularly preferable.

  Specific examples of the amino compound include melamine resins and modified resins thereof, for example, “Cymel” (registered trademark) 300, 301, 303, 350, 736, 738, 370, 771, 325, 327 manufactured by Cytec Corporation, 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, 1158, and “Nikarak” (registered trademark) MW-390, MW-100LM manufactured by Sanwa Chemical Co., Ltd. MX-750LM, MW-30M, MX-45, MX-302 and the like. Examples of the benzoguanamine resin and modified resins thereof include “Cymel” (registered trademark) 1123, 1125, and 1128 manufactured by Cytec Corporation. Examples of the glycoluril resin and the modified resin thereof include “Cymel” (registered trademark) 1170, 1171, 1174, 1172 manufactured by Cytec, and “Nicarak” (registered trademark) MX manufactured by Sanwa Chemical Co., Ltd. -270 and the like. Examples of the urea resin and the modified resin thereof include “UFR” (registered trademark) 65 and 300 manufactured by Cytec, and “Nicarak” (registered trademark) MX-290 manufactured by Sanwa Chemical Co., Ltd. It is done.

[1-1-9] Colorant The photosensitive resin composition for forming a partition wall of the present invention may contain a colorant for the purpose of coloring the partition wall. As the colorant, known colorants such as pigments and dyes can be used. For example, when using a pigment, a known dispersant or dispersion aid may be used in combination so that the pigment can be stably present in the photosensitive resin composition without agglomeration. In particular, by coloring the liquid repellent partition wall black, there is an effect that a clear pixel display can be obtained. In addition to black dyes, black pigments, carbon black, titanium black, and the like as black colorants, mixing with organic pigments to color black is also effective as an effect of imparting low conductivity. The content of the colorant is usually 60% by mass or less, preferably 40% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoints of plate making properties and color characteristics.
On the other hand, for the purpose of reducing the outgas from the partition walls, it is desirable to make the partition walls transparent, and the content ratio of the colorant in that case is preferably 10 mass with respect to the total solid content of the photosensitive resin composition. % Or less, more preferably 5% by mass or less, and particularly preferably 0% by mass.

[1-1-10] Coating property improving agent and development improving agent The photosensitive resin composition for forming a partition wall of the present invention contains a coating property improving agent and a developing improving agent in order to improve coating property and development solubility. It may be. As the coatability improver or development improver, for example, known cationic, anionic, nonionic, fluorine-based, and silicone-based surfactants can be used. Further, as the development improver, known ones such as organic carboxylic acids or anhydrides thereof can be used. Moreover, the content rate is 20 mass% or less normally with respect to the total solid of the photosensitive resin composition from a viewpoint of a sensitivity, Preferably it is 10 mass% or less.

[1-1-11] Silane Coupling Agent It is also preferable to add a silane coupling agent to the photosensitive resin composition for forming a partition wall of the present invention in order to improve adhesion to the substrate. Various types of silane coupling agents such as epoxy, methacrylic, amino, and imidazole can be used, and epoxy and imidazole silane coupling agents are particularly preferable from the viewpoint of improving adhesion. The content is usually 20% by mass or less, preferably 15% by mass or less, based on the total solid content of the photosensitive resin composition, from the viewpoint of adhesion.

[1-1-12] Phosphate-based adhesion improver It is also preferable to add a phosphate-based adhesion improver to the photosensitive resin composition for forming a partition wall of the present invention in order to improve the adhesion to the substrate. As the phosphate-based adhesion improver, (meth) acryloyloxy group-containing phosphates are preferable, and those represented by the following general formulas (Va), (Vb), and (Vc) are particularly preferable.

In the general formulas (Va), (Vb), and (Vc), R ⁸ represents a hydrogen atom or a methyl group, r and r ′ are integers of 1 to 10, and s is 1, 2, or 3.

[1-1-13] Inorganic filler In addition, the photosensitive resin composition for forming a partition wall of the present invention is further improved in strength as a cured product and has a moderate interaction with an alkali-soluble resin (formation of a matrix structure). ) May contain an inorganic filler for the purpose of improving the flatness of the coating film and the taper angle. Examples of such inorganic fillers include talc, silica, alumina, barium sulfate, magnesium oxide, and those obtained by surface treatment with various silane coupling agents.

  The average particle size of these inorganic fillers is usually 0.005 to 20 μm, preferably 0.01 to 10 μm. Here, the average particle diameter referred to in the present embodiment is a value measured with a laser diffraction / scattering particle size distribution measuring device such as manufactured by Beckman Coulter. Among these inorganic fillers, silica sol and silica sol-modified product are particularly preferably blended because they tend to be excellent in the effect of improving the taper angle as well as the dispersion stability. When the photosensitive resin composition for forming a partition wall of the present invention contains these inorganic fillers, the content thereof is usually 5% by mass or more, preferably 10% by mass, based on the total solid content, from the viewpoint of sensitivity. These are usually 80% by mass or less, preferably 70% by mass or less.

[1-1-14] Solvent The photosensitive resin composition for forming a partition wall of the present invention usually contains a solvent and is used in a state where each of the above-mentioned components is dissolved or dispersed in the solvent (hereinafter, including the solvent). The photosensitive resin composition may be referred to as “photosensitive resin composition solution”). Although there is no restriction | limiting in particular as the solvent, For example, the organic solvent described below is mentioned.

  Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol-tert-butyl ether, diethylene glycol monomethyl Ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethylpentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, tri Ethylene glycol monomethyl ester Glycol monoalkyl ethers such as ter, triethylene glycol monoethyl ether, tripropylene glycol methyl ether; ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, dipropylene glycol Glycol dialkyl ethers such as dimethyl ether; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether Acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene Glycol alkyl ether acetates such as glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, 3-methoxy-1-butyl acetate; ethylene glycol diacetate 1 Glycol diacetates such as 1,3-butylene glycol diacetate and 1,6-hexanol diacetate; alkyl acetates such as cyclohexanol acetate; amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether , Ethers such as ethyl isobutyl ether and dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl Ketones such as ketone, methylnonyl ketone, methoxymethylpentanone; methanol, ethanol, Mono- or polyhydric alcohols such as panol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethylpentanol, glycerin, benzyl alcohol; n-pentane , N-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, dodecane and other aliphatic hydrocarbons; cyclohexane, methylcyclohexane, methylcyclohexene, bicyclohexyl and other alicyclic hydrocarbons; benzene, toluene, Aromatic hydrocarbons such as xylene and cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutylene , Ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, Linear or cyclic esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate and γ-butyrolactone; 3-methoxypropionic acid, 3-ethoxypropion Alkoxycarboxylic acids such as acids; Halogenated hydrocarbons such as butyl chloride and amyl chloride; Ether ketones such as methoxymethylpentanone; Nitriles such as acetonitrile and benzonitrile: Tet Hydrofuran, dimethyl tetrahydrofuran, tetrahydrofuran such as dimethoxytetrahydrofuran and the like.

  Commercially available solvents corresponding to the above include mineral spirit, Barsol # 2, Apco # 18 Solvent, Apco thinner, Soal Solvent No. 1 and no. 2, Solvesso # 150, Shell TS28 Solvent, carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, diglyme (all trade names) and the like.

  The solvent is capable of dissolving or dispersing each component in the photosensitive resin composition, and is selected according to the method of using the photosensitive resin composition of the present invention. It is preferable to select one having a boiling point in the range of 60 to 280 ° C. under atmospheric pressure (101.25 hPa). More preferably, it has a boiling point of 70 ° C. or higher and 260 ° C. or lower. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferable.

  These solvents can be used alone or in combination of two or more. These solvents have a total solid content in the photosensitive resin composition solution of usually 10% by mass or more, preferably 15% by mass or more, more preferably 20% by mass or more, and usually 90% by mass or less, preferably Is preferably used in an amount of 50% by mass or less, more preferably 40% by mass or less, and still more preferably 30% by mass or less. When it is at least the lower limit, a coating film tends to be obtained even for a high film thickness, and when it is at most the upper limit, there is a tendency for appropriate coating uniformity to be obtained.

[1-2] Preparation Method of Photosensitive Resin Composition for Partition Formation The photosensitive resin composition for partition formation of the present invention is prepared by mixing the above components with a stirrer. In addition, you may filter using a membrane filter etc. so that the prepared photosensitive resin composition may become uniform.

[2] Partition Wall and Forming Method of Partition Wall The photosensitive resin composition of the present invention can be suitably used for forming a partition wall, particularly a partition wall for partitioning an organic layer (light emitting part) of an organic electroluminescence device.
The method for forming the partition (bank) using the photosensitive resin composition for forming a partition described above is not particularly limited, and a conventionally known method can be employed. Examples of the method of forming the partition include, for example, a coating step of applying a photosensitive resin composition for partition formation on a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer. The method including these is mentioned. Specific examples of the method for forming such a partition include an inkjet method and a photolithography method.

  In the ink jet method, a photosensitive resin composition for forming a partition whose viscosity is adjusted by dilution with a solvent or the like is used as ink, and ink droplets are ejected onto a substrate by an ink jet method along a predetermined partition pattern. The resin composition is applied onto a substrate to form an uncured partition pattern. Then, an uncured partition wall pattern is exposed to form a cured partition wall on the substrate. The exposure of the uncured partition pattern is performed in the same manner as the exposure process in the photolithography method described later, except that a mask is not used.

  In the photolithography method, a photosensitive resin composition for forming a partition wall is applied to the entire surface of a substrate where a partition wall is formed to form a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate.

  In the coating process in which a photosensitive resin composition is applied onto a substrate in a photolithography method, a contact transfer type coating device such as a roll coater, a reverse coater, a bar coater, or a spinner (rotary type) is formed on the substrate on which a partition wall is to be formed. The photosensitive resin composition is applied using a non-contact coating apparatus such as a coating apparatus) or a curtain flow coater, and the solvent is removed by drying as necessary to form a photosensitive resin composition layer.

Next, in the exposure step, using a negative mask, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light, and the photosensitive resin composition layer is partially coated according to the pattern of the partition walls. To expose. For the exposure, a light source that emits ultraviolet rays such as a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a xenon lamp, or a carbon arc lamp can be used. The amount of exposure varies depending on the composition of the photosensitive resin composition, but is preferably about 10 to 400 mJ / cm ² , for example.

  Next, in the developing step, the barrier ribs are formed by developing the exposed photosensitive resin composition layer with a developer according to the pattern of the barrier ribs. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Specific examples of the developer include organic ones such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, and aqueous solutions such as sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. Can be mentioned. An antifoaming agent or a surfactant can also be added to the developer.

  Thereafter, the partition walls after development are post-baked and cured by heating. The post-bake is preferably performed at 150 to 250 ° C. for 15 to 60 minutes.

  The substrate used for forming the partition wall is not particularly limited, and is appropriately selected according to the type of the organic electroluminescence element manufactured using the substrate on which the partition wall is formed. Suitable materials for the substrate include glass and various resin materials. Specific examples of the resin material include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonates; poly (meth) methacrylic resins; polysulfones; Among these substrate materials, glass and polyimide are preferable because of excellent heat resistance. Moreover, according to the kind of organic electroluminescent element manufactured, you may provide transparent electrode layers, such as ITO and ZnO, in advance on the surface of the board | substrate with which a partition is formed.

[3] Organic electroluminescent element The organic electroluminescent element of the present invention includes a partition composed of the above-described photosensitive resin composition for forming a partition.
Various optical elements are manufactured using a substrate having a partition pattern manufactured by the method described above. The method of forming the organic electroluminescent element is not particularly limited, but preferably, after forming a partition pattern on the substrate by the above method, ink is injected into a region surrounded by the partition on the substrate to form pixels or the like. An organic electroluminescent element is manufactured by forming an organic layer.
Examples of the type of organic electroluminescent element include a bottom emission type and a top emission type.
In the bottom emission type, for example, a partition is formed on a glass substrate on which transparent electrodes are stacked, and a hole transport layer, a light emitting layer, an electron transport layer, and a metal electrode layer are stacked in an opening surrounded by the partition. The On the other hand, in the top emission type, for example, a partition is formed on a glass substrate on which a metal electrode layer is stacked, and an electron transport layer, a light emitting layer, a hole transport layer, and a transparent electrode layer are stacked in an opening surrounded by the partition. Produced.
In addition, as a light emitting layer, the organic electroluminescent layer as described in Unexamined-Japanese-Patent No. 2009-146691 and patent 5734681 is mentioned. Further, quantum dots as described in Japanese Patent No. 5653387 and Japanese Patent No. 5653101 may be used.

  When the taper angle of the partition wall is low and the lower part of the partition wall has a trailing shape, no light is emitted even if a vapor deposition layer is formed on the upper part of the partition wall. In addition, when the light emitting layer is manufactured by the ink jet method, the organic layer forming ink is repelled by the skirt portion of the partition wall, so that the region surrounded by the partition wall may not be uniformly covered with the organic layer forming ink. is there. On the other hand, it has a high taper angle and a good shape without skirting, so that the area surrounded by the partition can emit light, and in the inkjet method, it is uniformly covered with the ink for forming the organic layer. can do. Thereby, for example, the problem of halation in the organic EL display element can be solved.

  As the solvent used when forming the ink for forming the organic layer, water, an organic solvent, and a mixed solvent thereof can be used. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Specific examples of the organic solvent include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, and butyl acetate, 3-phenoxytoluene, Etc. In addition, a surfactant, an antioxidant, a viscosity modifier, an ultraviolet absorber, and the like can be added to the ink.

  As a method for injecting ink into the region surrounded by the partition walls, an inkjet method is preferable because a small amount of ink can be easily injected into a predetermined portion. The ink used for forming the organic layer is appropriately selected according to the type of the organic electroluminescent element to be produced. When the ink is injected by an ink jet method, the viscosity of the ink is not particularly limited as long as the ink can be discharged well from the ink jet head, but is preferably 4 to 20 mPa · s, and more preferably 5 to 10 mPa · s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, or the like.

[4] Image display device The image display device of the present invention includes the organic electroluminescence device described above. As long as it includes an organic electroluminescent element, the type and structure of the image display device are not particularly limited, and for example, it can be assembled according to a conventional method using an active drive type organic electroluminescent element. For example, the image display device of the present invention is formed by a method as described in “Organic EL Display” (Ohm, published on August 20, 2004, by Shizushi Tokito, Chiba Adachi, and Hideyuki Murata). can do. For example, an organic electroluminescent element that emits white light and a color filter may be combined to display an image, or organic electroluminescent elements having different emission colors such as RGB may be combined to display an image.

[5] Illumination The illumination of the present invention includes the above-described organic electroluminescent element. There is no restriction | limiting in particular about a model or a structure, It can assemble in accordance with a conventional method using the organic electroluminescent element of this invention. The organic electroluminescence element may be a simple matrix driving method or an active matrix driving method.
In order for the illumination of the present invention to emit white light, an organic electroluminescent element that emits white light may be used. In addition, organic electroluminescent elements having different emission colors may be combined so that each color is mixed to become white, or the color mixing ratio can be adjusted to provide a color adjustment function.

  Hereinafter, although the specific example is given and demonstrated about the photosensitive resin composition for partition formation of this invention, this invention is not limited to a following example, unless the summary is exceeded.

[1] Preparation of barrier rib-forming photosensitive resin composition Propylene glycol monomethyl ether was used so that each component was used in the blending ratio (parts by mass) shown in Table 1 and the total solid content was 25% by mass. Each component was stirred until it became uniform using acetate, and the photosensitive resin composition for partition formation of an Example and a comparative example was prepared.
In addition, the symbol in a table | surface represents the following.

a-1: Mixture of the following ethylenically unsaturated compounds [(A1) ethylenically unsaturated compound having an acid group and (A2) ethylenically unsaturated compound having no acid group]
100 ° C. in the presence of 490 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value 113 mg KOH / g), 148 parts by mass of phthalic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone To obtain a mixture a-1 containing pentaerythritol triacrylate modified with phthalic anhydride and pentaerythritol tetraacrylate shown below at 70:30 (mass ratio).

a-2: Mixture of the following ethylenically unsaturated compounds [(A1) ethylenically unsaturated compound having an acid group and (A2) ethylenically unsaturated compound having no acid group]
In the presence of 561 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value 100 mg KOH / g), 100 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone, 100 ° C. The mixture a-2 containing the succinic anhydride modified product of pentaerythritol triacrylate and pentaerythritol tetraacrylate shown below at 60:40 (mass ratio) was obtained.

a-3: Mixture of the following ethylenically unsaturated compounds [(A1) ethylenically unsaturated compound having an acid group and (A2) ethylenically unsaturated compound having no acid group]
In the presence of 1000 parts by mass of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (hydroxyl value 51 mg KOH / g), 49 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone A mixture containing dipentaerythritol pentaacrylate modified with succinic anhydride, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate shown in the following at 25:25:50 (mass ratio) 3 was obtained.

  a-4: Pentaerythritol tetraacrylate (PE-4A) (manufactured by Kyoeisha Chemical Co., Ltd.)

  b-1: 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Hodogaya Chemical Co., Ltd.)

c-1: The following ethylenically unsaturated group-containing resin (epoxy acrylate resin)
100 parts by mass of a bisphenol A type epoxy compound represented by the following formula (epoxy equivalent 186 g / eq, a mixture of those in which n is 1 to 20), 40 parts by mass of acrylic acid, 0.06 parts by mass of p-methoxyphenol, The reaction vessel was charged with 2.4 parts by mass of triphenylphosphine and 126 parts by mass of propylene glycol monomethyl ether acetate, and stirred at 95 ° C. until the acid value became 5 mgKOH / g or less. Next, 3 parts by mass of propylene glycol monomethyl ether acetate was added to 80 parts by mass of the reaction solution obtained by the above reaction, 3 parts by mass of succinic anhydride was added, and the mixture was reacted at 95 ° C. for 3 hours to obtain a solid content acid value of 40 mg KOH / g. An alkali-soluble resin (c-1) solution having a weight average molecular weight (Mw) in terms of polystyrene measured by GPC of 8000 was obtained.

d-1: Megafax RS-72-K (manufactured by DIC, fluorine-based oligomer having an ethylenic double bond)
e-1: 2-mercaptobenzimidazole (manufactured by Tokyo Chemical Industry Co., Ltd.)
e-2: Pentaerythritol tetrakis (3-mercaptopropionate) (manufactured by Sakai Chemical Co., Ltd.)
f-1: TINUVIN 384-2 (manufactured by BASF, ultraviolet absorber)
g-1: KAYAMER PM-21 (manufactured by Nippon Kayaku Co., Ltd.)

[2] Formation of cured product and partition, and evaluation thereof The method for evaluating the performance of each photosensitive resin composition will be described below.

(Creation of contact angle measurement board)
Using a spinner on the ITO film of the glass substrate on which the ITO film is formed on the surface, the substrate on which each partition wall-forming photosensitive resin composition is applied so as to have a thickness of 1.5 μm after heating and curing is used as the partition wall-forming photosensitive material. Ten sheets were prepared for each functional resin composition. Then heated and dried for 2 minutes on a hot plate at 100 ° C., without a mask the resulting coating film, in place of the 50 mJ / cm ² every exposure amount for each substrate in the range of 50 to 500 mJ / cm ² Exposed. At this time, the intensity at a wavelength of 365 nm was 40 mW / cm ² . Subsequently, after spray development for 60 seconds with 2.38 mass% TMAH (tetramethylammonium hydroxide) aqueous solution of 24 degreeC, it wash | cleaned for 10 second with the pure water. This substrate was cured by heating at 230 ° C. for 30 minutes in an oven to obtain a contact angle measurement substrate on which a cured product was formed.

(Evaluation of contact angle)
Since the curability varies depending on the sensitivity of the composition, the exposure amount at which liquid repellency occurs varies depending on the composition. Here, the exposure amount at which the liquid repellency is generated represents an exposure amount at which the contact angle of the obtained cured product is 10 degrees or more. The contact angle with respect to propylene glycol monomethyl ether acetate was measured using the above-mentioned contact angle measurement substrate, and a substrate having a contact angle of 10 degrees or more was specified. Table 1 shows the minimum value of the exposure values at the time of producing these substrates as the minimum exposure value. The contact angle was measured with a Drop Master 500 contact angle measuring device manufactured by Kyowa Interface Science Co., Ltd. under conditions of 23 ° C. and 50% humidity.

(Create partition walls)
Using a spinner, a photosensitive resin composition for forming each partition wall was applied on the ITO film of a glass substrate having an ITO film formed on the surface so as to have a thickness of 1.5 μm after heat curing. Thereafter, it was dried by heating on a hot plate at 100 ° C. for 2 minutes. The obtained coating film was exposed using a photomask. The exposure amount was the minimum exposure amount that caused liquid repellency, and the exposure gap was 16 μm. As the photomask, a mask having a lattice-like opening (a mask having a plurality of covering portions of 80 μm × 280 μm at intervals of 40 μm) was used. Next, in the same manner as in the preparation of the contact angle measurement substrate, development was performed with a TMAH aqueous solution, followed by heat curing to obtain a lattice-like partition wall.

(Inkjet application suitability evaluation)
In the substrate having the grid-like partition walls described above, inkjet coating was performed with DMP-2831 manufactured by Fuji Film Co., Ltd. on the light emitting part (pixel part) surrounded by the grid-like partition walls. As the ink, a solvent (isoamyl benzoate) was used alone and applied at 40 pL per pixel portion to evaluate the wettability. As the entire area of the pixel portion gets wet and spreads, there are fewer residues at the time of creating the partition wall, and the developability is better.
◯: Ink spread throughout the pixel area.
X: A part where the ink did not spread partially occurred in the pixel portion

(Creation of gas amount measurement substrate)
Using a spinner, each partition wall-forming photosensitive resin composition was applied to a thickness of 1.5 μm after heat curing on the ITO film of a glass substrate having an ITO film formed on the surface. Thereafter, the film was heated and dried on a hot plate at 100 ° C. for 2 minutes, and the obtained coating film was exposed without using a mask at the minimum exposure amount at which the liquid repellency described above was generated. At this time, the intensity at a wavelength of 365 nm was 40 mW / cm ² . Next, as with the contact angle measurement substrate preparation, development was performed with a TMAH aqueous solution, followed by heat curing in an oven at 230 ° C. for 30 minutes to obtain a gas amount measurement substrate on which a cured product was formed.

(Measurement of gas amount)
The gas out measurement substrate (40 mm x 8 mm, 4 sheets) was analyzed by GC / MS (Agilent Technologies, product name "5973N") when heated at 230 ° C for 20 minutes in a heating furnace. The total area of all detected peak components was calculated. Next, it converted into the amount of toluene using the calibration curve from the sum total of the detected peak area, and remove | divided by the measured board | substrate area, and calculated the outgas amount (ng / cm < ² >) of toluene conversion per unit area. The calibration curve was prepared by measuring GC / MS using toluene having a known concentration, and plotting the amount of toluene and the peak area value of the detected gas.

From Table 1, the partition walls obtained from the photosensitive resin composition of each Example containing an ethylenically unsaturated compound having an acid group in a specific ratio have good ink jet coatability and a low outgas amount. It was. This is because, by using an ethylenically unsaturated compound having an acid group with excellent solubility, the occurrence of residue in the pixel portion is suppressed and the ink jet characteristics are improved, and the amount of the acid group is reduced to a specific amount or less. This is thought to be because the generation of outgas derived from the origin was suppressed.
On the other hand, the partition wall obtained from the photosensitive resin composition of Comparative Example 1 containing a large amount of an ethylenically unsaturated compound having an acid group has a good ink jet coatability but a large amount of outgas, which is derived from an acid group. This is thought to be because the amount of outgas increased. In addition, the partition wall obtained from the photosensitive resin composition of Comparative Example 2 that does not contain an ethylenically unsaturated compound having an acid group is not sufficiently inkjet coated, and this is because a residue is generated in the pixel portion. Conceivable.
In addition, regarding the ink jet coating property, whether or not the ink spreads throughout the pixel portion is caused by whether or not the liquid repellency derived from the residue is generated in the pixel portion. Therefore, even when a solvent other than isoamyl benzoate is used, it is considered that the same result as in the above-mentioned Examples and Comparative Examples can be obtained.

Claims (10)

(A) An ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) a photosensitive resin composition for partition wall formation for partitioning a light-emitting portion, comprising an alkali-soluble resin,
The (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the content ratio of the (A1) acid group having an ethylenic unsaturated compound is 30% by mass in the total solid content. The photosensitive resin composition for partition formation which is the following.   The photosensitive resin composition for partition formation according to claim 1, wherein the (A) ethylenically unsaturated compound further contains (A2) an ethylenically unsaturated compound having no acid group.   The photosensitive resin composition for partition formation according to claim 1 or 2, wherein a content ratio of the (A1) ethylenically unsaturated compound having an acid group is 50% by mass or less in the (A) ethylenically unsaturated compound. object.   Furthermore, (D) The photosensitive resin composition for partition formation of any one of Claims 1-3 containing a liquid repellent.   Furthermore, the photosensitive resin composition for partition formation of any one of Claims 1-4 containing a chain transfer agent.   Furthermore, the photosensitive resin composition for partition formation of any one of Claims 1-5 containing a ultraviolet absorber.   The partition comprised with the photosensitive resin composition for partition formation of any one of Claims 1-6.   An organic electroluminescent device comprising the partition wall according to claim 7.   The image display apparatus containing the organic electroluminescent element of Claim 8.   The illumination containing the organic electroluminescent element of Claim 8.