TW202141185A - Photosensitive resin composition for forming organic electroluminescent element partition wall, partition wall, organic electroluminescent element, image display device and lighting - Google Patents

Abstract

The present invention addresses the problem of providing a photosensitive resin composition for forming a partition wall of an organic electroluminescent element, said partition wall having high reliability due to less outgas generation during the operation of the electroluminescent element, while having a large taper angle. A photosensitive resin composition for forming an organic electroluminescent element partition wall according to the present invention contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin; and the alkali-soluble resin (C) contains an alkali-soluble resin (c) that has a partial structure represented by general formula (1). This photosensitive resin composition for forming an organic electroluminescent element partition wall additionally contains (E) a chain transfer agent. (In formula (1), R1 represents an optionally substituted divalent hydrocarbon group having 1-4 carbon atoms; and * represents a bonding hand.).

Description

Photosensitive resin composition for forming barrier ribs of organic electroluminescence element, barrier ribs, organic electroluminescence element, image display device and lighting

The present invention relates to a photosensitive resin composition for forming barrier ribs of organic electroluminescent elements, and more particularly to a barrier rib composed of a photosensitive resin composition for forming barrier ribs of organic electroluminescent elements, or with The organic electroluminescence element of the barrier wall, the image display device and the lighting including the organic electroluminescence element.

Previously, organic electroluminescence elements contained in organic electroluminescence displays or organic electroluminescence were manufactured by forming barrier ribs (barrier walls) on a substrate and laminating various functional layers in an area surrounded by barrier ribs. As a method of easily forming such a barrier rib, a method of forming by a photolithography method using a photosensitive resin composition is known. In addition, as a method of laminating various functional layers in the area surrounded by the barrier wall, the following method is known: firstly, an ink containing the material constituting the functional layer is prepared, and then the prepared ink is injected into the area surrounded by the barrier wall Inside. In this method, the inkjet method is mostly used in terms of easy to accurately inject a specific amount of ink into a specific location. Furthermore, when a functional layer is formed using ink, it is sometimes required to impart ink repellency to the barrier wall in order to prevent the ink from adhering to the barrier wall, or to prevent the ink injected between adjacent regions from mixing with each other. In addition, in recent years, the industry has also required various characteristics for barrier ribs in addition to ink repellency, and various photosensitive resin compositions have been developed. For example, Patent Document 1 describes that by using a specific alkali-soluble resin, a specific liquid repellent, and a specific surfactant, the electrode does not break and can correspond to a high-resolution image. On the other hand, Patent Document 2 describes a resin obtained by adding (meth)acrylic acid to bisphenol A epoxy resin, then adding succinic anhydride, and then adding bisphenol A epoxy resin. , And obtain a coating film with excellent heat resistance and colorability. Prior art literature Patent literature Patent Document 1: Japanese Patent Laid-Open No. 2010-061093 Patent Document 2: Japanese Patent Laid-Open No. 2010-150397

(式(1)中，R¹ 表示可具有取代基之碳數1〜4之2價烴基。﹡表示鍵結位置)。 ＜2＞如＜1＞記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其中上述鹼溶性樹脂(c)為具有乙烯性不飽和基之樹脂。 ＜3＞如＜1＞或＜2＞記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其中上述鹼溶性樹脂(c)含有(c1)環氧(甲基)丙烯酸酯樹脂。 ＜4＞如＜3＞記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其中上述(c1)環氧(甲基)丙烯酸酯樹脂含有選自由包含下述式(i)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂、包含下述式(ii)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂、及包含下述式(iii)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂所組成之群中之至少1種。 [化2]

(式(i)中，R^a 表示氫原子或甲基，R^b 表示可具有取代基之2價烴基。式(i)中之苯環可進而經任意之取代基取代。﹡表示鍵結位置)。 [化3]

(式(ii)中，R^c 分別獨立地表示氫原子或甲基。R^d 表示具有環狀烴基作為側鏈之2價烴基。﹡表示鍵結位置)。 [化4]

(式(iii)中，R^e 表示氫原子或甲基，γ表示單鍵、-CO-、可具有取代基之伸烷基、或可具有取代基之2價環狀烴基。式(iii)中之苯環可進而經任意之取代基取代。﹡表示鍵結位置)。 ＜5＞如＜3＞或＜4＞記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其中上述(c1)環氧(甲基)丙烯酸酯樹脂為對環氧樹脂加成具有乙烯性不飽和鍵之酸或酯化合物，進而加成多元酸或其酸酐而成之樹脂。 ＜6＞如＜1＞至＜5＞中任一項記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其進而含有(D)撥液劑。 ＜7＞如＜6＞記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其中上述(D)撥液劑含有具有交聯基之撥液劑。 ＜8＞如＜1＞至＜7＞中任一項記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其進而含有紫外線吸收劑。 ＜9＞如＜1＞至＜8＞中任一項記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物，其中上述有機電致發光元件阻隔壁形成用感光性樹脂組合物之酸值相對於全部固形物成分為20 mgKOH/g以上。 ＜10＞一種阻隔壁，其係由如＜1＞至＜9＞中任一項記載之有機電致發光元件阻隔壁形成用感光性樹脂組合物所構成。 ＜11＞一種有機電致發光元件，其具備如＜10＞記載之阻隔壁。 ＜12＞一種圖像顯示裝置，其包含如＜11＞記載之有機電致發光元件。 ＜13＞一種照明，其包含如＜11＞記載之有機電致發光元件。 [發明之效果] 根據本發明，可提供一種用以形成發光元件運轉時之釋氣產生量較少，可靠性較高且傾斜角較大之有機電致發光元件阻隔壁的感光性樹脂組合物。[Problem to be Solved by the Invention] In recent years, in order to improve the driving life of the device, it is urgently desired to reduce the amount of outgassing generated from the barrier wall when the barrier wall and the device after the device are formed emit light. In addition, it is strongly desired to suppress the decrease in brightness accompanying the overlap between the lower part of the barrier rib and the light-emitting portion, or the decrease in light-emitting characteristics caused by the contact portion of the barrier rib and the light-emitting portion, and to ensure coating when forming the light-emitting portion by the inkjet method. The fabric is adaptable, and it is urgent to increase the inclination angle of the barrier wall. As a result of studies conducted by the inventors of the present invention, if the photosensitive resin composition for forming barrier ribs described in Patent Document 1 is used, it is difficult to sufficiently reduce the amount of outgassing during operation of the light-emitting element. In addition, the oblique angle of the obtained barrier wall is relatively small. Patent Document 2 does not describe barrier ribs. In addition, the inventors conducted research on applying the photosensitive resin composition described in Patent Document 2 to barrier ribs. As a result, if the photosensitive resin composition described in Patent Document 2 is used The resin composition has a smaller inclination angle of the barrier wall obtained. Therefore, the object of the present invention is to provide a photosensitive resin composition for forming a barrier rib for organic electroluminescent elements with less outgassing during operation of the light-emitting element, high reliability, and large inclination angle. In addition, the object of the present invention is to provide a barrier rib formed using the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element, an organic electroluminescence element provided with the barrier rib, and an organic electroluminescence element containing the organic electroluminescence element Image display device and lighting. [Technical Means to Solve the Problem] The inventors conducted diligent studies and found that by using a resin having a specific partial structure as an alkali-soluble resin, and then using a chain transfer agent, the above-mentioned problems can be solved, thereby completing the present invention . That is, the gist of the present invention is as follows. <1> A photosensitive resin composition for forming barrier ribs of organic electroluminescence elements, characterized in that it contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin The above-mentioned (C) alkali-soluble resin contains an alkali-soluble resin (c) having a partial structure represented by the following general formula (1), and the photosensitive resin composition for forming barrier ribs of an organic electroluminescent element further contains ( E) Chain transfer agent. [化1]

(In formula (1), R ¹ represents a divalent hydrocarbon group with a carbon number of 1 to 4 that may have a substituent. * represents a bonding position). <2> The photosensitive resin composition for forming a barrier rib for an organic electroluminescent element as described in <1>, wherein the alkali-soluble resin (c) is a resin having an ethylenically unsaturated group. <3> The photosensitive resin composition for forming an organic electroluminescent element barrier rib as described in <1> or <2>, wherein the alkali-soluble resin (c) contains (c1) epoxy (meth)acrylate resin. <4> The photosensitive resin composition for forming barrier ribs of organic electroluminescent elements as described in <3>, wherein the (c1) epoxy (meth)acrylate resin is selected from among those represented by the following formula (i) The epoxy (meth)acrylate resin of the repeating unit structure, the epoxy (meth)acrylate resin containing the partial structure represented by the following formula (ii), and the part represented by the following formula (iii) At least one of the epoxy (meth)acrylate resins of the structure. [化2]

(In formula (i), R ^a represents a hydrogen atom or a methyl group, and R ^b represents a divalent hydrocarbon group that may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bonding position ). [化3]

(In formula (ii), R ^c each independently represents a hydrogen atom or a methyl ^{group. Rd} represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * represents a bonding position). [化4]

(In the formula (iii), R ^e represents a hydrogen atom or a methyl group, gamma] represents a single bond, CO-, may have a substituent group of the alkylene group, or a divalent cyclic hydrocarbon substituent of the formula (iii) The benzene ring in can be further substituted with any substituent. * indicates the bonding position). <5> The photosensitive resin composition for forming barrier ribs of organic electroluminescent elements as described in <3> or <4>, wherein the above-mentioned (c1) epoxy (meth)acrylate resin is an addition to epoxy resin Ethylene unsaturated bond acid or ester compound is further added with polybasic acid or its anhydride to form a resin. <6> The photosensitive resin composition for forming an organic electroluminescent element barrier rib as described in any one of <1> to <5>, which further contains (D) a liquid repellent. <7> The photosensitive resin composition for forming a barrier rib for an organic electroluminescence element as described in <6>, wherein the (D) liquid repellent contains a liquid repellent having a crosslinking group. <8> The photosensitive resin composition for forming a barrier rib of an organic electroluminescence element as described in any one of <1> to <7>, which further contains an ultraviolet absorber. <9> The photosensitive resin composition for forming barrier ribs of organic electroluminescent elements as described in any one of <1> to <8>, wherein the acid of the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements The value is 20 mgKOH/g or more with respect to the total solid content. <10> A barrier rib composed of the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element as described in any one of <1> to <9>. <11> An organic electroluminescence element provided with the barrier rib as described in <10>. <12> An image display device comprising the organic electroluminescence element as described in <11>. <13> A lighting comprising the organic electroluminescence element as described in <11>. [Effects of the Invention] According to the present invention, it is possible to provide a photosensitive resin composition for forming a barrier rib for organic electroluminescent elements with less outgassing during operation of light-emitting elements, high reliability, and large inclination angles. .

上述式(a1)中，R^a1 表示氫原子或甲基。R^a2 、R^a3 、R^{a 5} 及R^{a 6} 分別獨立地表示可具有取代基之伸烷基。 R^a4 表示n＋1價之連結基。 R^a7 表示可具有取代基之伸烷基、可具有取代基之伸烯基或可具有取代基之2價之芳香族環基。 l及m分別獨立地表示0〜12之整數。 n表示1以上之整數。 (R^a2 、R^a3 、R^a5 及R^a6 ) 上述通式(a1)中，R^a2 、R^a3 、R^a5 及R^a6 分別獨立地表示可具有取代基之伸烷基。 伸烷基可為直鏈，亦可為支鏈狀，亦可為環狀，亦可為其等之組合。其碳數量並無特別限定，通常為1以上，又，通常為4以下，較佳為2以下。藉由設為上述上限值以下，而有殘膜率提高之傾向。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸丁基、伸環己基等，就硬化性之觀點而言，較佳為亞甲基或伸乙基，更佳為亞甲基。 作為伸烷基可具有之取代基，可列舉：烷氧基、鹵素原子(-F、-Cl、-Br、-I)、羥基、羧基等，就硬化性之觀點而言，較佳為未經取代。 (R^a4 ) 上述通式(a1)中，R^a4 表示n＋1價之連結基。n＋1價之連結基之化學結構並無特別限定，可列舉：可具有取代基之n＋1價烴基。烴基可為脂肪族烴基，亦可為芳香族烴基，就顯影性之觀點而言，較佳為脂肪族烴基。又，烴基中之碳-碳單鍵亦可被選自由-O-、-CO-及-NH-所組成之群中之至少1種切斷。 作為n＋1價之連結基之具體例，可列舉以下者。 [化6]

(R^a7 ) 上述通式(a1)中，表示可具有取代基之伸烷基、可具有取代基之伸烯基或可具有取代基之2價之芳香族環基。 R^a7 中之伸烷基可為直鏈，亦可為支鏈狀，亦可為環狀，亦可為其等之組合。其碳數量並無特別限定，通常為1以上，較佳為2以上，又，通常為8以下，較佳為6以下，更佳為4以下，進而較佳為3以下。藉由設為上述下限值以上，而有殘膜率提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向或釋氣產生量減少之傾向。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸己基、伸環己基等，就顯影性之觀點而言，較佳為亞甲基或伸乙基，更佳為伸乙基。 作為伸烷基可具有之取代基，可列舉：烷氧基、鹵素原子(-F、-Cl、-Br、-I)、羥基、羧基等，就硬化性之觀點而言，較佳為未經取代。 R^a7 中之伸烯基可為直鏈，亦可為支鏈狀，亦可為環狀，亦可為其等之組合。其碳數量並無特別限定，通常為2以上，較佳為4以上，又，通常為8以下，較佳為6以下。藉由設為上述下限值以上，而有殘膜率提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為伸烯基之具體例，可列舉：伸乙烯基、伸丙烯基、伸丁烯基、伸環己烯基等，就顯影性與硬化性之觀點而言，較佳為伸乙烯基或伸環己烯基，更佳為伸乙烯基。 作為伸烯基可具有之取代基，可列舉：烷氧基、鹵素原子(-F、-Cl、-Br、-I)、羥基、羧基等，就硬化性之觀點而言，較佳為未經取代。 作為R^a7 中之2價之芳香族環基，可列舉：2價之芳香族烴環基及2價之芳香族雜環基。其碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，進而更佳為15以下，尤佳為10以下。藉由設為上述下限值以上，而有殘膜率提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為2價之芳香族烴環基中之芳香族烴環，可為單環，亦可為縮合環。作為2價之芳香族烴環基，例如可列舉：具有2個自由原子價之苯環、萘環、蒽環、菲環、苝環、稠四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、苊環、螢蒽環、茀環等基。 又，作為2價之芳香族雜環基中之芳香族雜環，可為單環，亦可為縮合環。作為2價之芳香族雜環基，例如可列舉：具有2個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、

啶環、喹唑啉環、喹唑啉酮環、薁環等基。 該等之中，就硬化性之觀點而言，較佳為具有2個自由原子價之苯或萘環，更佳為具有2個自由原子價之苯環。 作為2價之芳香族環基可具有之取代基，可列舉：烷基、烷氧基、鹵素原子(-F、-Cl、-Br、-I)、羥基、羧基等。該等之中，就硬化性之觀點而言，較佳為未經取代。 該等之中，就確保顯影性及減少釋氣產生量之觀點而言，R^a7 較佳為可具有取代基之伸烷基，更佳為未經取代之伸烷基，進而較佳為伸乙基。 (l及m) 上述通式(a1)中，l及m分別獨立地表示0〜12之整數。就顯影性之觀點而言，較佳為1以上，更佳為2以上，又，就硬化性之觀點而言，較佳為8以下，更佳為6以下，進而較佳為4以下，尤佳為2以下。另一方面，就釋氣產生量減少之觀點而言，較佳為0。 (n) 上述通式(a1)中，n表示1以上之整數。n較佳為2以上，更佳為3以上，進而較佳為4以上，尤佳為5以上，又，較佳為6以下。藉由設為上述下限值以上，而有殘膜率變高，伴隨著硬化性變高而釋氣產生量減少之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，作為(A1)具有酸基之乙烯性不飽和化合物之例，可列舉：藉由脂肪族多羥基化合物、芳香族多羥基化合物等多羥基化合物、與不飽和羧酸及多元羧酸之酯化反應而獲得之酯，未必為單一物，若列舉具代表性之具體例，則可列舉：丙烯酸、鄰苯二甲酸、及季戊四醇之縮合物；丙烯酸、琥珀酸、及季戊四醇之縮合物；丙烯酸、琥珀酸及二季戊四醇之縮合物等。 第2態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，(A1)具有酸基之乙烯性不飽和化合物之含有比例只要於全部固形物成分中為30質量%以下，則無特別限定，較佳為27質量%以下，更佳為25質量%以下，進而較佳為22質量%以下，進而更佳為20質量%以下，尤佳為15質量%以下，又，較佳為1質量%以上，更佳為5質量%以上，進而較佳為10質量%以上。藉由設為上述上限值以下，而有釋氣產生量減少之傾向，又，藉由設為上述下限值以上，而有噴墨塗佈適應性提高之傾向。 又，(A)乙烯性不飽和化合物中之(A1)具有酸基之乙烯性不飽和化合物之含有比例並無特別限定，較佳為50質量%以下，更佳為45質量%以下，進而較佳為40質量%以下，進而更佳為35質量%以下，尤佳為30質量%以下，又，較佳為1質量%以上，更佳為10質量%以上，進而較佳為25質量%以上。藉由設為上述上限值以下，而有釋氣產生量減少之傾向，又，藉由設為上述下限值以上，而有噴墨塗佈適應性提高之傾向。 ＜(A2)不具有酸基之乙烯性不飽和化合物＞ 第2態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中之(A)乙烯性不飽和化合物除(A1)具有酸基之乙烯性不飽和化合物以外，亦可含有(A2)不具有酸基之乙烯性不飽和化合物。(A2)不具有酸基之乙烯性不飽和化合物係指(A)乙烯性不飽和化合物中，(A1)具有酸基之乙烯性不飽和化合物以外者。藉由含有(A2)不具有酸基之乙烯性不飽和化合物，而有硬化性提高，為產生撥液性所必需之最小曝光量變小，又，釋氣產生量減少之傾向。 (A2)不具有酸基之乙烯性不飽和化合物於1分子中所具有之乙烯性不飽和鍵之數只要為1個以上，則無特別限定，就聚合性、交聯性、及可擴大伴隨其之曝光部與非曝光部之顯影液溶解性之差異等觀點而言，較佳為2個以上，更佳為3個以上，進而較佳為4個以上，進而更佳為5個以上，尤佳為6個以上，又，通常為15個以下，較佳為12個以下，更佳為10個以下，進而較佳為8個以下。藉由設為上述下限值以上，而有聚合性提高而成為高感度，伴隨著硬化性變高而釋氣產生量減少之傾向，藉由設為上述上限值以下，而有顯影性變得更良好之傾向。 (A2)不具有酸基之乙烯性不飽和化合物之分子量並無特別限定，較佳為200以上，更佳為250以上，進而較佳為300以上，又，較佳為1,000以下，更佳為800以下，進而較佳為600以下。藉由設為上述下限值以上，而有殘膜率變高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 就聚合性、交聯性、及可擴大伴隨其之曝光部與非曝光部之顯影液溶解性之差異等方面而言，(A2)不具有酸基之乙烯性不飽和化合物較佳為具有(甲基)丙烯醯氧基之化合物、即(甲基)丙烯酸酯化合物。 作為(A2)不具有酸基之乙烯性不飽和化合物之具體例，可列舉：脂肪族多羥基化合物與不飽和羧酸之酯；芳香族多羥基化合物與不飽和羧酸之酯等。 作為上述脂肪族多羥基化合物與不飽和羧酸之酯，可列舉：乙二醇二丙烯酸酯、三乙二醇二丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基乙烷三丙烯酸酯、季戊四醇二丙烯酸酯、季戊四醇三丙烯酸酯、季戊四醇四丙烯酸酯、二季戊四醇四丙烯酸酯、二季戊四醇五丙烯酸酯、二季戊四醇六丙烯酸酯、丙烯酸甘油酯等脂肪族多羥基化合物之丙烯酸酯、將該等例示化合物之丙烯酸酯換為甲基丙烯酸酯而成之甲基丙烯酸酯、同樣地將該等例示化合物之丙烯酸酯換為伊康酸酯而成之伊康酸酯、將該等例示化合物之丙烯酸酯換為丁烯酸酯而成之丁烯酸酯或將該等例示化合物之丙烯酸酯換為順丁烯二酸酯而成之順丁烯二酸酯等。 作為芳香族多羥基化合物與不飽和羧酸之酯，可列舉：對苯二酚二丙烯酸酯、對苯二酚二甲基丙烯酸酯、間苯二酚二丙烯酸酯、間苯二酚二甲基丙烯酸酯、鄰苯三酚三丙烯酸酯等芳香族多羥基化合物之丙烯酸酯及甲基丙烯酸酯等。 除此以外，如使多異氰酸酯化合物與含羥基之(甲基)丙烯酸酯或者使多異氰酸酯化合物與多元醇及含羥基之(甲基)丙烯酸酯進行反應而獲得之(甲基)丙烯酸胺基甲酸酯類；如多元環氧化合物與(甲基)丙烯酸羥酯或(甲基)丙烯酸之加成反應物之環氧丙烯酸酯類；伸乙基雙丙烯醯胺等丙烯醯胺類；鄰苯二甲酸二烯丙酯等烯丙酯類；鄰苯二甲酸二乙烯酯等含乙烯基之化合物等有用。 作為上述(甲基)丙烯酸胺基甲酸酯類，例如可列舉：DPHA-40H、UX-5000、UX-5002D-P20、UX-5003D、UX-5005(日本化藥公司製造)；U-2PPA、U-6LPA、U-10PA、U-33H、UA-53H、UA-32P、UA-1100H(新中村化學工業公司製造)；UA-306H、UA-510H、UF-8001G(協榮社化學公司製造)；UV-1700B、UV-7600B、UV-7605B、UV-7630B、UV7640B(日本合成化學公司製造)等。 該等之中，就硬化性之觀點而言，作為(A2)不具有酸基之乙烯性不飽和化合物，較佳為使用(甲基)丙烯酸酯類或(甲基)丙烯酸胺基甲酸酯類，更佳為使用二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯。 其等可單獨使用1種，亦可將2種以上併用。 第2態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，(A2)不具有酸基之乙烯性不飽和化合物之含有比例並無特別限定，於全部固形物成分中較佳為50質量%以下，更佳為45質量%以下，進而較佳為40質量%以下，又，較佳為20質量%以上，更佳為25質量%以上，進而較佳為30質量%以上，尤佳為35質量%以上。藉由設為上述上限值以下，而有噴墨塗佈適應性提高之傾向，又，藉由設為上述下限值以上，而有釋氣產生量減少之傾向。 又，(A)乙烯性不飽和化合物中之(A2)不具有酸基之乙烯性不飽和化合物之含有比例並無特別限定，較佳為90質量%以下，更佳為80質量%以下，進而較佳為75質量%以下，又，較佳為50質量%以上，更佳為55質量%以上，進而較佳為60質量%以上，進而更佳為65質量%以上，尤佳為70質量%以上。藉由設為上述上限值以下，而有噴墨塗佈適應性提高之傾向，又，藉由設為上述下限值以上，而有釋氣產生量減少之傾向。 [1-1-2](B)成分；光聚合起始劑 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物含有(B)光聚合起始劑。(B)光聚合起始劑只要為藉由活性光線而使上述(A)乙烯性不飽和化合物所具有之乙烯性不飽和鍵進行聚合之化合物，則無特別限定，可使用公知之光聚合起始劑。 本發明之感光性樹脂組合物可使用該領域中通常所使用之光聚合起始劑作為(B)光聚合起始劑。作為此種光聚合起始劑，例如可列舉：六芳基聯咪唑系光聚合起始劑、醯基氧化膦系光聚合起始劑、肟系光聚合起始劑、苯乙酮系光聚合起始劑、二苯甲酮系光聚合起始劑、羥基苯系光聚合起始劑、9-氧硫𠮿

系光聚合起始劑、蒽醌系光聚合起始劑、縮酮系光聚合起始劑、二茂鈦系光聚合起始劑、鹵化烴衍生物系光聚合起始劑、有機硼酸鹽系光聚合起始劑、鎓鹽系光聚合起始劑、碸化合物系光聚合起始劑、胺基甲酸衍生物系光聚合起始劑、磺醯胺系光聚合起始劑、三芳基甲醇系光聚合起始劑。 作為六芳基聯咪唑系光聚合起始劑，就吸光度及感度、與紫外線吸收劑之吸收波長之匹配性之觀點而言，較佳為下述通式(1-1)及/或下述通式(1-2)所表示之六芳基聯咪唑系化合物。 [化7]

上述式中，R¹¹ 〜R¹³ 分別獨立地表示可具有取代基之碳數1〜4之烷基、可具有取代基之碳數1〜4之烷氧基、或鹵素原子，m、n及l分別獨立地表示0〜5之整數。 R¹¹ 〜R¹³ 之烷基之碳數只要為1〜4之範圍內，則無特別限定，就感度之觀點而言，較佳為3以下，更佳為2以下。烷基可為鏈狀者，亦可為環狀者。作為烷基之具體例，例如可列舉：甲基、乙基、丙基、異丙基，其中，較佳為甲基、乙基。作為R¹¹ 〜R¹³ 之碳數1〜4之烷基可具有之取代基，除氫以外，可使用1價之非金屬原子團之基，作為較佳之例，可列舉：鹵素原子(-F、-Br、-Cl、-I)、羥基、烷氧基。 又，R^{1 1} 〜R¹³ 之烷氧基之碳數只要為1〜4之範圍內，則無特別限定，就感度之觀點而言，較佳為3以下，更佳為2以下。烷氧基之烷基部分可為鏈狀者，亦可為環狀者。所謂烷氧基之具體例，例如可列舉：甲氧基、乙氧基、丙氧基、異丙氧基、丁氧基，其中，較佳為甲氧基、乙氧基。作為R^{1 1} 〜R¹³ 之碳數1〜4之烷氧基可具有之取代基，可列舉：烷基、烷氧基，較佳為烷基。 又，所謂R^{1 1} 〜R¹³ 之鹵素原子，例如可列舉：氯原子、碘原子、溴原子、氟原子，其中，就合成容易性之觀點而言，較佳為氯原子或氟原子，更佳為氯原子。 該等之中，就感度或合成容易性之觀點而言，R^{1 1} 〜R¹³ 較佳為分別獨立地為鹵素原子，更佳為氯原子。 m、n及l分別獨立地表示0〜5之整數，就合成容易性之觀點而言，較佳為m、n及l之至少1個為1以上之整數，更佳為m、n及l中之任一個為1，且剩餘之2個為0。 作為通式(1-1)及/或通式(1-2)所表示之六芳基聯咪唑系化合物，例如可列舉：2,2'-雙(鄰氯苯基)-4,5,4',5'-四苯基聯咪唑、2,2'-雙(鄰甲基苯基)-4,5,4',5'-四苯基聯咪唑、2,2'-雙(鄰氯苯基)-4,4',5,5'-四(鄰,對二氯苯基)聯咪唑、2,2'-雙(鄰,對二氯苯基)-4,4',5,5'-四(鄰,對二氯苯基)聯咪唑、2,2'-雙(鄰氯苯基)-4,4',5,5'-四(對氟苯基)聯咪唑、2,2'-雙(鄰氯苯基)-4,4',5,5'-四(鄰,對二溴苯基)聯咪唑、2,2'-雙(鄰溴苯基)-4,4',5,5'-四(鄰,對二氯苯基)聯咪唑、2,2'-雙(鄰氯苯基)-4,4',5,5'-四(對氯萘基)聯咪唑等。其中，較佳為六苯基聯咪唑化合物，進而較佳為其咪唑環上之2,2'-位所鍵結之苯環之鄰位經甲基、甲氧基、或鹵素原子取代者，較佳為其咪唑環上之4,4',5,5'-位所鍵結之苯環未經取代、或者經鹵素原子或甲氧基取代者等。 作為(B)光聚合起始劑，可使用通式(1-1)所表示之六芳基聯咪唑系化合物與通式(1-2)所表示之六芳基聯咪唑系化合物中之任一者，亦可併用兩者。於併用兩者之情形時，關於其比率，並無特別限定。再者，實施例中所使用之b-1具有滿足通式(1-1)之結構。 又，作為醯基氧化膦系光聚合起始劑，可列舉：2,4,6-三甲基苯甲醯基二苯基氧化膦、雙(2,4,6-三甲基苯甲醯基)苯基氧化膦等作為較佳者。 作為肟系光聚合起始劑，可列舉：日本專利特表2004-534797號公報、日本專利特開2000-80068號公報、日本專利特開2006-36750號公報、日本專利特開2008-179611號公報、日本專利特表2012-526185號公報、日本專利特表2012-519191號公報等所記載之肟酯化合物。其中，就感度之觀點而言，可列舉：N-乙醯氧基-N-{4-乙醯氧基亞胺基-4-[9-乙基-6-(鄰甲苯醯基)-9H-咔唑-3-基]丁烷-2-基}乙醯胺、N-乙醯氧基-N-{3-(乙醯氧基亞胺基)-3-[9-乙基-6-(1-萘甲醯基)-9H-咔唑-3-基]-1-甲基丙基}乙醯胺、4-乙醯氧基亞胺基-5-[9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基]-5-側氧戊酸甲酯作為較佳者，又，可列舉作為製品名之OXE-01、OXE-02、OXE-03(BASF公司製造)；TR-PBG-304、TR-PBG-305(常州強力公司製造)；NCI-831、NCI-930(ADEKA公司製造)等作為較佳者。 作為苯乙酮系光聚合起始劑，例如可列舉：2,2-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、1-羥基環己基苯基酮、1-羥基-1-(對十二烷基苯基)酮、1-羥基-1-甲基乙基-(對異丙基苯基)酮、1-三氯甲基-(對丁基苯基)酮、α-羥基-2-甲基苯基丙酮、2-甲基-1-[4-(甲硫基)苯基]-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)丁烷-1-酮、2-苄基-2-二甲胺基-1-(4-嗎啉基苯基)丁烷-1-酮、苯甲酸4-二甲胺基乙酯、苯甲酸4-二甲胺基異戊酯、4-二乙基胺基苯乙酮、4-二甲胺基苯丙酮、苯甲酸2-乙基己基-1,4-二甲胺酯、2,5-雙(4-二乙基胺基苯亞甲基)環己酮、4-(二乙基胺基)查耳酮等。 作為二苯甲酮系光聚合起始劑，例如可列舉：二苯甲酮、2-甲基二苯甲酮、3-甲基二苯甲酮、4-甲基二苯甲酮、2-羧基二苯甲酮、2-氯二苯甲酮、4-溴二苯甲酮、米其勒酮等。 作為羥基苯系光聚合起始劑，例如可列舉：2-羥基-4-正辛氧基二苯甲酮、2-羥基-4-苄基二苯甲酮、2-(2-羥基-5-甲基苯基)苯并三唑、4-二-第三丁基苯基-3,5-二-第三丁基-4-羥基苯甲酸酯等。 作為9-氧硫𠮿

系光聚合起始劑，例如可列舉：9-氧硫𠮿

、2-乙基9-氧硫𠮿

、2-異丙基9-氧硫𠮿

、2,4-二甲基9-氧硫𠮿

、2,4-二乙基9-氧硫𠮿

、2,4-二異丙基9-氧硫𠮿

、2-氯9-氧硫𠮿

等。 作為蒽醌系光聚合起始劑，例如可列舉2-甲基蒽醌等，又，作為縮酮系光聚合起始劑，例如可列舉苯偶醯二甲基縮酮等。 作為二茂鈦系光聚合起始劑，例如可列舉：二氯化二環戊二烯基鈦、聯苯二環戊二烯基鈦、雙(2,4-二氟苯基)二環戊二烯基鈦、雙(2,6-二氟苯基)二環戊二烯基鈦、雙(2,4,6-三氟苯基)二環戊二烯基鈦、雙(2,3,5,6-四氟苯基)二環戊二烯基鈦、雙(2,3,4,5,6-五氟苯基)二環戊二烯基鈦、雙(2,6-二氟苯基)二(甲基環戊二烯基)鈦、雙(2,3,4,5,6-五氟苯基)二(甲基環戊二烯基)鈦、雙[2,6-二氟-3-(1-吡咯基)苯基]二環戊二烯基鈦等。其中，就感度之觀點而言，較佳為具有二環戊二烯基結構與聯苯結構之鈦化合物，尤佳為聯苯環之鄰位經鹵素原子取代者。 作為鹵化烴衍生物系光聚合起始劑，可列舉：鹵甲基化均三𠯤衍生物類，例如可列舉：2,4,6-三(單氯甲基)-均三𠯤、2,4,6-三(二氯甲基)-均三𠯤、2,4,6-三(三氯甲基)-均三𠯤、2-甲基-4,6-雙(三氯甲基)-均三𠯤、2-正丙基-4,6-雙(三氯甲基)-均三𠯤、2-(α,α,β-二氯乙基)-4,6-雙(三氯甲基)-均三𠯤、2-苯基-4,6-雙(三氯甲基)-均三𠯤、2-(對甲氧基苯基)-4,6-雙(三氯甲基)-均三𠯤、2-(3,4-環氧基苯基)-4,6-雙(三氯甲基)-均三𠯤、2-(對氯苯基)-4,6-雙(三氯甲基)-均三𠯤、2-[1-(對甲氧基苯基)-2,4-丁二烯基]-4,6-雙(三氯甲基)-均三𠯤、2-苯乙烯基-4,6-雙(三氯甲基)-均三𠯤、2-(對甲氧基苯乙烯基)-4,6-雙(三氯甲基)-均三𠯤、2-(對甲氧基-間羥基苯乙烯基)-4,6-雙(三氯甲基)-均三𠯤、2-(對異丙氧基苯乙烯基)-4,6-雙(三氯甲基)-均三𠯤、2-(對甲苯基)-4,6-雙(三氯甲基)-均三𠯤、2-(對甲氧基萘)-4,6-雙(三氯甲基)-均三𠯤、2-(對乙氧基萘)-4,6-雙(三氯甲基)-均三𠯤、2-(對乙氧基羰基萘)-4,6-雙(三氯甲基)-均三𠯤、2-苯硫基-4,6-雙(三氯甲基)-均三𠯤、2-苄硫基-4,6-雙(三氯甲基)-均三𠯤、2,4,6-三(二溴甲基)-均三𠯤、2,4,6-三(三溴甲基)-均三𠯤、2-甲基-4,6-雙(三溴甲基)-均三𠯤、2-甲氧基-4,6-雙(三溴甲基)-均三𠯤、2-(4-甲氧基苯基)-4,6-雙(三氯甲基)-均三𠯤等鹵甲基化均三𠯤衍生物類，其中，就感度之觀點而言，較佳為雙(三鹵甲基)-均三𠯤類。 作為有機硼酸鹽系光聚合起始劑，例如可列舉：有機硼銨錯合物、有機硼鏻錯合物、有機硼鋶錯合物、有機硼氧鋶錯合物、有機硼錪錯合物、有機硼過渡金屬配位錯合物等，作為其有機硼陰離子，就感度之觀點而言，例如較佳為正丁基-三苯基硼陰離子、正丁基-三(2,4,6-三甲基苯基)硼陰離子、正丁基-三(對甲氧基苯基)硼陰離子、正丁基-三(對氟苯基)硼陰離子、正丁基-三(間氟苯基)硼陰離子、正丁基-三(3-氟-4-甲基苯基)硼陰離子、正丁基-三(2,6-二氟苯基)硼陰離子、正丁基-三(2,4,6-三氟苯基)硼陰離子、正丁基-三(2,3,4,5,6-五氟苯基)硼陰離子、正丁基-三(對氯苯基)硼陰離子、正丁基-三(2,6-二氟-3-吡咯基苯基)硼陰離子等烷基-三苯基硼陰離子，又，作為抗衡陽離子，就感度之觀點而言，較佳為銨陽離子、鏻陽離子、鋶陽離子、錪陽離子等鎓化合物，就感度之觀點而言，尤佳為四烷基銨等有機銨陽離子。 作為鎓鹽系光聚合起始劑，例如可列舉：四甲基溴化銨、四乙基溴化銨等銨鹽；二苯基錪六氟砷酸鹽、二苯基錪四氟硼酸鹽、二苯基錪對甲苯磺酸鹽、二苯基錪樟腦磺酸鹽、二環己基錪六氟砷酸鹽、二環己基錪四氟硼酸鹽、二環己基錪對甲苯磺酸鹽、二環己基錪樟腦磺酸鹽等錪鹽；三苯基鋶六氟砷酸鹽、三苯基鋶四氟硼酸鹽、三苯基鋶對甲苯磺酸鹽、三苯基鋶樟腦磺酸鹽、三環己基鋶六氟砷酸鹽、三環己基鋶四氟硼酸鹽、三環己基鋶對甲苯磺酸鹽、三環己基鋶樟腦磺酸鹽等鋶鹽等。 作為碸化合物系光聚合起始劑，例如可列舉：雙(苯基磺醯基)甲烷、雙(對羥基苯基磺醯基)甲烷、雙(對甲氧基苯基磺醯基)甲烷、雙(α-萘磺醯基)甲烷、雙(β-萘磺醯基)甲烷、雙(環己基磺醯基)甲烷、雙(第三丁基磺醯基)甲烷、苯基磺醯基(環己基磺醯基)甲烷等雙(磺醯基)甲烷化合物、苯基羰基(苯基磺醯基)甲烷、萘基羰基(苯基磺醯基)甲烷、苯基羰基(萘磺醯基)甲烷、環己基羰基(苯基磺醯基)甲烷、第三丁基羰基(苯基磺醯基)甲烷、苯基羰基(環己基磺醯基)甲烷、苯基羰基(第三丁基羰基)甲烷等羰基(磺醯基)甲烷化合物、雙(苯基磺醯基)重氮甲烷、雙(對羥基苯基磺醯基)重氮甲烷、雙(對甲氧基苯基磺醯基)重氮甲烷、雙(α-萘磺醯基)重氮甲烷、雙(β-萘磺醯基)重氮甲烷、雙(環己基磺醯基)重氮甲烷、雙(第三丁基磺醯基)重氮甲烷、苯基磺醯基(環己基磺醯基)重氮甲烷、雙(磺醯基)重氮甲烷、苯基羰基(苯基磺醯基)重氮甲烷、萘基羰基(苯基磺醯基)重氮甲烷、苯基羰基(萘磺醯基)重氮甲烷、環己基羰基(苯基磺醯基)重氮甲烷、第三丁基羰基(苯基磺醯基)重氮甲烷、苯基羰基(環己基磺醯基)重氮甲烷、苯基羰基(第三丁基羰基)重氮甲烷等羰基(磺醯基)重氮甲烷化合物等。 作為胺基甲酸衍生物系光聚合起始劑，例如可列舉：胺基甲酸苯甲醯基環己酯、胺基甲酸2-硝基苄基環己酯、胺基甲酸3,5-二甲氧基苄基環己酯、胺基甲酸3-硝基苄基環己酯等。 作為磺醯胺系光聚合起始劑，例如可列舉：N-環己基-4-甲基苯基磺醯胺、N-環己基-2-萘磺醯胺等，又，作為三芳基甲醇系光聚合起始劑，例如可列舉：三苯基甲醇、三(4-氯苯基)甲醇等。 關於該等光聚合起始劑，於感光性樹脂組合物中可單獨地含有其1種，亦可含有2種以上。該等光聚合起始劑之中，六芳基聯咪唑系化合物由於吸光度較高，故而表面硬化性較高，又，於可獲得較高之撥液性與較大之傾斜角之方面上尤佳。 作為本發明之感光性樹脂組合物中之(B)光聚合起始劑之含有比例，相對於感光性樹脂組合物之全部固形物成分，通常為0.01質量%以上，較佳為0.1質量%以上，更佳為0.5質量%以上，進而較佳為1質量%以上，尤佳為1.5質量%以上，且通常為25質量%以下，較佳為10質量%以下，更佳為8質量%以下，進而較佳為5質量%以下，尤佳為3質量%以下。藉由設為上述下限值以上，而有於顯影時不會產生膜減少而形成塗膜，又，產生充分之撥液性之傾向，又，藉由設為上述上限值以下，而有變得容易形成所需之圖案形狀之傾向。 又，作為本發明之感光性樹脂組合物中之(B)光聚合起始劑相對於(A)乙烯性不飽和化合物之調配比，相對於(A)乙烯性不飽和化合物100質量份，(B)光聚合起始劑較佳為1質量份以上，更佳為2質量份以上，進而較佳為3質量份以上，又，較佳為200質量份以下，更佳為100質量份以下，進而較佳為50質量份以下，進而更佳為20質量份以下，尤佳為10質量份以下，最佳為5質量份以下。藉由設為上述下限值以上，而有成為適當之感度之傾向，又，藉由設為上述上限值以下，而有變得容易形成所需之圖案形狀之傾向。 又，亦可與(B)光聚合起始劑一併使用增感劑。藉由增感劑而感度提高，與此同時，藉由減少向感光性樹脂組合物內部之透光率，而有傾斜角變大之傾向。 作為增感劑，可使用該領域中通常所使用之增感劑。增感劑有如下特徵：將吸收所得之能量向光聚合起始劑轉移、或者引起與光聚合起始劑之電子之授受，而高效率地促進反應自由基聚合反應。 作為此種增感劑，例如可列舉：以查耳酮衍生物或二亞苄丙酮等為代表之不飽和酮類、以苯偶醯或樟腦醌等為代表之1,2-二酮系化合物、安息香系化合物、茀系化合物、萘醌系化合物、蒽醌系化合物、𠮿

系化合物、硫𠮿

系化合物、𠮿酮系化合物、9-氧硫𠮿

系化合物、香豆素系化合物、酮香豆素系化合物、花青系化合物、部花青系化合物、氧喏衍生物等聚次甲基色素、吖啶系化合物、吖𠯤系化合物、噻𠯤系化合物、㗁𠯤系化合物、吲哚啉系化合物、薁系化合物、薁鎓系化合物、方酸鎓系化合物、卟啉系化合物、四苯基卟啉系化合物、三芳基甲烷系化合物、四苯并卟啉系化合物、四吡嗪并四氮雜卟啉系化合物、酞花青系化合物、四氮雜卟啉系化合物、四喹喏啉并四氮雜卟啉系化合物、萘酞菁系化合物、亞酞菁系化合物、吡喃鎓系化合物、噻喃鎓系化合物、新西蘭雞蛋果青苷系化合物、輪烯系化合物、螺吡喃系化合物、螺㗁𠯤系化合物、硫代螺吡喃系化合物、金屬芳香烴錯合物、有機釕錯合物、二苯甲酮系化合物等。 其等可單獨使用1種，亦可將2種以上併用。 該等之中，就感度提高與傾斜角增大之觀點而言，較佳為9-氧硫𠮿

系化合物、二苯甲酮系化合物。 作為9-氧硫𠮿

系化合物，可列舉：9-氧硫𠮿

、2-甲基9-氧硫𠮿

、4-甲基9-氧硫𠮿

、2,4-二甲基9-氧硫𠮿

、2-乙基9-氧硫𠮿

、4-乙基9-氧硫𠮿

、2,4-二乙基9-氧硫𠮿

、2-異丙基9-氧硫𠮿

、4-異丙基9-氧硫𠮿

、2,4-二異丙基9-氧硫𠮿

、2-氯9-氧硫𠮿

、4-氯9-氧硫𠮿

、2,4-二氯9-氧硫𠮿

等。該等之中，就感度提高與傾斜角增大之觀點而言，較佳為2,4-二乙基9-氧硫𠮿

。 作為二苯甲酮系化合物，可列舉：二苯甲酮、4,4'-雙(二甲胺基)二苯甲酮、4,4'-雙(二乙基胺基)二苯甲酮、4,4'-雙(乙基甲基胺基)二苯甲酮等。該等之中，就感度提高與傾斜角增大之觀點而言，較佳為4,4'-雙(二乙基胺基)二苯甲酮。 關於感光性樹脂組合物中之增感劑之含有比例，相對於感光性樹脂組合物之全部固形物成分，通常為0.1質量%以上，較佳為0.3質量%以上，更佳為0.5質量%以上，進而較佳為0.8質量%以上，進而更佳為1質量%以上，尤佳為1.2質量%以上，又，通常為10質量%以下，較佳為7質量%以下，更佳為5質量%以下，進而較佳為3質量%以下。藉由設為上述下限值以上，而有可使感度提高，使傾斜角變大之傾向，又，藉由設為上述上限值以下，而有變得容易形成所需之圖案之傾向。 [1-1-3](E)成分；鏈轉移劑 第1態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物包含(E)鏈轉移劑。藉由包含(E)鏈轉移劑，而有改善由氧抑制等引起之於表面附近之自由基失活而提高表面硬化性，藉此傾斜角變大之傾向。 又，於包含撥液劑之情形時，有可藉由提高表面硬化性而抑制撥液劑之流出，而容易將撥液劑固定在表面附近從而使接觸角變高之傾向。 第2態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，(E)鏈轉移劑並非必需，但就使傾斜角變大之觀點而言，較佳為包含(E)鏈轉移劑。 作為(E)鏈轉移劑，可列舉：含巰基化合物、或四氯化碳等，就有鏈轉移效果較高之傾向之方面而言，更佳為使用含巰基化合物。含巰基化合物因S-H鍵結能較小而容易產生斷鍵，從而容易引起鏈轉移反應，因此有能夠提高表面硬化性之傾向。 (E)鏈轉移劑之中，就傾斜角、表面硬化性之觀點而言，較佳為具有芳香族環之含巰基化合物與脂肪族系之含巰基化合物。 作為具有芳香族環之含巰基化合物，就傾斜角之觀點而言，可較佳地使用下述通式(1-3)所表示之化合物。 [化8]

式(1-3)中，Z表示-O-、-S-或-NH-，R⁶¹ 、R⁶² 、R⁶³ 、及R⁶⁴ 分別獨立地表示氫原子或1價之取代基。 該等之中，就傾斜角之觀點而言，Z較佳為-S-或-NH-，更佳為-NH-。 又，就傾斜角之觀點而言，R⁶¹ 、R⁶² 、R⁶³ 、及R⁶⁴ 較佳為分別獨立為氫原子、碳數1〜4之烷基或碳數1〜4之烷氧基，更佳為氫原子。 具體而言，可列舉：2-巰基苯并噻唑、2-巰基苯并咪唑、2-巰基苯并㗁唑、3-巰基-1,2,4-三唑、2-巰基-4(3H)-喹唑啉、β-巰基萘、1,4-二甲基-巰基苯等具有芳香族環之含巰基化合物，就傾斜角之觀點而言，較佳為2-巰基苯并噻唑、2-巰基苯并咪唑。 另一方面，作為脂肪族系之含巰基化合物，就表面硬化性之觀點而言，可較佳地使用己二硫醇、癸二硫醇、或下述通式(1-4)所表示之化合物。 [化9]

式(1-4)中，m表示0〜4之整數，n表示2〜4之整數。R⁷¹ 及R⁷² 分別獨立地表示氫原子或碳數1〜4之烷基。X表示n價之基。 上述通式(1-4)中，就合成容易性之觀點而言，m較佳為1或2。又，就表面硬化性之觀點而言，n較佳為3或4，更佳為4。 又，作為R⁷¹ 及R⁷² 之烷基，就表面硬化性之觀點而言，較佳為碳數1〜3者。就表面硬化性之觀點而言，較佳為R⁷¹ 及R⁷² 中之至少一者、例如R^{7 2} 為氫原子，於該情形時，R⁷¹ 較佳為氫原子或碳數1〜3之烷基。 於n為2之情形時，就表面硬化性之觀點而言，X較佳為可具有醚鍵及/或分支部之碳數1〜6之伸烷基。就表面硬化性、合成容易性之觀點而言，其中，更佳為碳數1〜6之伸烷基，進而較佳為碳數4之伸烷基。 於n為3之情形時，就表面硬化性、合成容易性之觀點而言，X較佳為下述通式(1-5)或(1-6)所表示之結構。 [化10]

式(1-5)中，R⁷³ 表示氫原子、碳數1〜6之烷基、或羥甲基。R⁷³ 之中，就傾斜角之觀點而言，較佳為乙基。 [化11]

式(1-6)中，R⁷⁴ 表示碳數1〜4之伸烷基。R⁷⁴ 之中，就傾斜角之觀點而言，較佳為伸乙基。 另一方面，於n為4之情形時，X較佳為下述通式(1-7)所表示之結構。 [化12]

具體而言，可列舉：丁二醇雙(3-巰基丙酸酯)、丁二醇雙巰基乙酸酯、乙二醇雙(3-巰基丙酸酯)、乙二醇雙巰基乙酸酯、三羥甲基丙烷三(3-巰基丙酸酯)、三羥甲基丙烷三巰基乙酸酯、三羥基乙基三巰基丙酸酯、季戊四醇四(3-巰基丙酸酯)、季戊四醇三(3-巰基丙酸酯)、丁二醇雙(3-巰基丁酸酯)、乙二醇雙(3-巰基丁酸酯)、三羥甲基丙烷三(3-巰基丁酸酯)、季戊四醇四(3-巰基丁酸酯)、季戊四醇三(3-巰基丁酸酯)、1,3,5-三(3-巰基丁氧基乙基)-1,3,5-三𠯤-2,4,6(1H,3H,5H)-三酮等。 其中，較佳為三羥甲基丙烷三(3-巰基丙酸酯)、季戊四醇四(3-巰基丙酸酯)、季戊四醇三(3-巰基丙酸酯)、三羥甲基丙烷三(3-巰基丁酸酯)、季戊四醇四(3-巰基丁酸酯)、季戊四醇三(3-巰基丁酸酯)、1,3,5-三(3-巰基丁氧基乙基)-1,3,5-三𠯤-2,4,6(1H,3H,5H)-三酮，更佳為季戊四醇四(3-巰基丙酸酯)、季戊四醇四(3-巰基丁酸酯)。 其等各種者可單獨使用1種，或者亦可混合2種以上使用。 該等之中，就使傾斜角變大之觀點而言，較佳為將選自由2-巰基苯并噻唑、2-巰基苯并咪唑、及2-巰基苯并㗁唑所組成之群中之1種以上、與光聚合起始劑組合而用作光聚合起始劑系。例如，可使用2-巰基苯并噻唑，亦可使用2-巰基苯并咪唑，亦可將2-巰基苯并噻唑與2-巰基苯并咪唑一併使用。 又，就表面硬化性之觀點而言，較佳為使用選自由季戊四醇四(3-巰基丙酸酯)、及季戊四醇四(3-巰基丁酸酯)所組成之群中之1種以上。 進而，特別是就即便為線寬較細之阻隔壁，亦使傾斜角變大之觀點而言，較佳為將具有芳香族環之含巰基化合物與脂肪族系之含巰基化合物一併使用。其原因在於：為了形成線寬較細之阻隔壁，而使用開口部之寬度較窄之遮罩，因此由於曝光時之繞射而每單位面積之照度變低，而與線寬較粗之情形相比，有容易受到氧抑制之影響，而表面硬化性變低之傾向。 特別是於使用六芳基聯咪唑系光聚合起始劑作為(B)光聚合起始劑之情形時，較佳為將具有芳香族環之含巰基化合物與脂肪族系之含巰基化合物一併使用。另一方面，於使用苯乙酮系光聚合起始劑之情形時，有即便單獨使用脂肪族系之含巰基化合物，亦可充分地獲得效果之傾向。 例如，較佳為將選自由2-巰基苯并噻唑、2-巰基苯并咪唑、及2-巰基苯并㗁唑所組成之群中之1種以上；選自由季戊四醇四(3-巰基丙酸酯)、季戊四醇四(3-巰基丁酸酯)所組成之群中之1種以上；及光聚合起始劑組合而使用。 作為本發明之感光性樹脂組合物中之(E)鏈轉移劑之含有比例，相對於感光性樹脂組合物之全部固形物成分，通常為0.01質量%以上，較佳為0.025質量%以上，更佳為0.05質量%以上，進而較佳為0.1質量%以上，尤佳為1質量%以上，且通常為5質量%以下，較佳為4質量%以下，更佳為3質量%以下。藉由設為上述下限值以上，而有傾斜角變大，表面硬化性變高之傾向，又，藉由設為上述上限值以下，而有變得容易形成所需之圖案之傾向。 又，將具有芳香族環之含巰基化合物與脂肪族系之含巰基化合物一併使用以作為(E)鏈轉移劑時，作為具有芳香族環之含巰基化合物與脂肪族系之含巰基化合物之含有比例，相對於具有芳香族環之含巰基化合物100質量份，脂肪族系之含巰基化合物通常為10質量份以上，較佳為50質量份以上，更佳為80質量份以上，且通常為400質量份以下，較佳為300質量份以下，更佳為200質量份以下，進而較佳為150質量份以下。藉由設為上述下限值以上，而有傾斜角變大之傾向，又，藉由設為上述上限值以下，而有表面硬化性較高，接觸角變高之傾向。 又，作為感光性樹脂組合物中之(E)鏈轉移劑相對於(B)光聚合起始劑之調配比，相對於(B)光聚合起始劑100質量份，(E)鏈轉移劑較佳為10質量份以上，更佳為25質量份以上，進而較佳為50質量份以上，尤佳為80質量份以上，又，較佳為500質量份以下，更佳為400質量份以下，進而較佳為300質量份以下，進而更佳為200質量份以下，尤佳為150質量份以下。藉由設為上述下限值以上，而有傾斜角較大，表面硬化性變高之傾向，又，藉由設為上述上限值以下，而有變得容易形成所需之圖案之傾向。 [1-1-4](C)成分；鹼溶性樹脂 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物含有(C)鹼溶性樹脂。本發明中，作為(C)鹼溶性樹脂，只要為可利用顯影液進行顯影者，則無特別限定，作為顯影液，較佳為鹼性顯影液，因此於本發明中，使用(C)鹼溶性樹脂。 作為(C)鹼溶性樹脂，可列舉含羧基或羥基之各種樹脂等。其中，就獲得適度之傾斜角之阻隔壁及抑制於後烘烤時由阻隔壁表面之熱熔融引起之撥液劑之流出而能夠保持撥液性等方面而言，較佳為具有羧基者，更佳為具有乙烯性不飽和基者。 (具有通式(1)所表示之部分結構之鹼溶性樹脂(c)) 第1態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，(C)鹼溶性樹脂含有具有下述通式(1)所表示之部分結構之鹼溶性樹脂(c)(以下，有簡寫為「樹脂(c)」之情形)。 再者，樹脂(c)亦與(C)鹼溶性樹脂同樣地，較佳為具有乙烯性不飽和基者。 藉由如上述般使用具有通式(1)所表示之部分結構、即具有碳數較短而容易熱分解之酸成分之部分結構的鹼溶性樹脂，而於形成阻隔壁時之熱硬化時該酸成分之大部分以氣體之形式被去除，因此認為有機電致發光元件驅動時之釋氣產生量較少而可靠性變高。 [化13]

上述式(1)中，R¹ 表示可具有取代基之碳數1〜4之2價烴基。﹡表示鍵結位置。 (R¹ ) 上述通式(1)中，R¹ 表示可具有取代基之碳數1〜4之2價烴基。作為2價烴基，可列舉：伸烷基、伸烯基。 伸烷基可為直鏈，亦可為支鏈，就顯影溶解性之觀點而言，較佳為直鏈。伸烷基之碳數較佳為2以上，又，較佳為3以下。藉由設為上述下限值以上，而有殘膜率變高之傾向，又，藉由設為上述上限值以下，而有元件發光時之釋氣產生量變少之傾向。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸丁基，就釋氣產生量減少之觀點而言，較佳為亞甲基或伸乙基，更佳為伸乙基。 又，伸烯基可為直鏈，亦可為支鏈，就顯影溶解性之觀點而言，較佳為直鏈。伸烯基之碳數較佳為2以上，又，較佳為3以下。藉由設為上述下限值以上，而有殘膜率變高之傾向，又，藉由設為上述上限值以下，而有元件發光時之釋氣產生量變少之傾向。 作為伸烯基之具體例，可列舉：伸乙烯基、伸丙烯基、伸丁烯基，就釋氣產生量減少之觀點而言，較佳為伸乙烯基。 碳數1〜4之2價烴基可具有之取代基並無特別限定，例如可列舉：鹵素原子、烷氧基、苯甲醯基、羥基等，就合成容易性之觀點而言，較佳為未經取代。 該等之中，就釋氣產生量減少之觀點而言，較佳為R¹ 為碳數1〜4之2價伸烷基，更佳為亞甲基或伸乙基，進而較佳為伸乙基。 作為鹼溶性樹脂(c)，只要為具有上述通式(1)所表示之部分結構者，則其具體之結構並無特別限定，就顯影溶解性之觀點而言，較佳為含有(c1)環氧(甲基)丙烯酸酯樹脂及/或(c2)丙烯酸系共聚合樹脂，就釋氣產生量減少之觀點而言，更佳為含有(c1)環氧(甲基)丙烯酸酯樹脂。 於以下對(c1)環氧(甲基)丙烯酸酯樹脂進行詳述。 [(c1)環氧(甲基)丙烯酸酯樹脂] (c1)環氧(甲基)丙烯酸酯樹脂係對環氧樹脂加成具有乙烯性不飽和鍵之酸或酯化合物，進而加成多元酸或其酸酐而成之樹脂。例如可列舉：藉由於環氧樹脂之環氧基上開環加成不飽和單羧酸之羧基，而對環氧樹脂經由酯鍵(-COO-)而加成乙烯性不飽和鍵，並且於此時所產生之羥基上加成多元酸或其酸酐之一羧基而成者。又，亦可列舉於加成多元酸或其酸酐時，同時添加多元醇進行加成而獲得者。進而，於上述(c1)環氧(甲基)丙烯酸酯樹脂中亦包含如下樹脂，該樹脂係使上述反應中所獲得之樹脂之羧基進而與具有可進行反應之官能基之化合物進行反應而獲得。 如上所述，(c1)環氧(甲基)丙烯酸酯樹脂於化學結構上實質上不具有環氧基，且並不限定於「(甲基)丙烯酸酯」，但由於環氧化合物(環氧樹脂)為原料，且「(甲基)丙烯酸酯」為代表例，故而依據慣例以上述方式進行命名。 此處，所謂環氧樹脂係指亦包括藉由熱硬化而形成樹脂以前之原料化合物在內，作為該環氧樹脂，可自公知之環氧樹脂中適當選擇以使用。又，環氧樹脂可使用使苯酚性化合物與表鹵醇進行反應而獲得之化合物。作為苯酚性化合物，較佳為具有2價或2價以上之苯酚性羥基之化合物，可為單體亦可為聚合物。 具體而言，例如可列舉：雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、酚系酚醛清漆環氧樹脂、甲酚酚醛清漆環氧樹脂、聯苯酚醛清漆環氧樹脂、三苯酚環氧樹脂、苯酚與二環戊烷之聚合環氧樹脂、二羥基茀型環氧樹脂、二羥基伸烷基氧基茀型環氧樹脂、9,9-雙(4'-羥基苯基)茀之二縮水甘油醚化物、1,1-雙(4'-羥基苯基)金剛烷之二縮水甘油醚化物等，如上所述，可較佳地使用於主鏈具有芳香族環者。 其中，就較高之硬化膜強度之觀點而言，較佳為雙酚A型環氧樹脂、酚系酚醛清漆環氧樹脂、甲酚酚醛清漆環氧樹脂、苯酚與二環戊二烯之聚合環氧樹脂、9,9-雙(4'-羥基苯基)茀之二縮水甘油醚化物等，進而較佳為雙酚A型環氧樹脂。 作為具有乙烯性不飽和鍵之酸，較佳為乙烯性不飽和單羧酸，例如可列舉：(甲基)丙烯酸、丁烯酸、順丁烯二酸、富馬酸、檸康酸等、及季戊四醇三(甲基)丙烯酸酯琥珀酸酐加成物、季戊四醇三(甲基)丙烯酸酯四氫鄰苯二甲酸酐加成物、二季戊四醇五(甲基)丙烯酸酯琥珀酸酐加成物、二季戊四醇五(甲基)丙烯酸酯鄰苯二甲酸酐加成物、二季戊四醇五(甲基)丙烯酸酯四氫鄰苯二甲酸酐加成物、(甲基)丙烯酸與ε-己內酯之反應生成物等。其中，就感度之觀點而言，較佳為(甲基)丙烯酸。 作為多元酸或其酸酐，例如可列舉：琥珀酸、順丁烯二酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、3-甲基四氫鄰苯二甲酸、4-甲基四氫鄰苯二甲酸、3-乙基四氫鄰苯二甲酸、4-乙基四氫鄰苯二甲酸、六氫鄰苯二甲酸、3-甲基六氫鄰苯二甲酸、4-甲基六氫鄰苯二甲酸、3-乙基六氫鄰苯二甲酸、4-乙基六氫鄰苯二甲酸、偏苯三甲酸、均苯四甲酸、二苯甲酮四羧酸、聯苯四羧酸、及其等之酸酐等。其等可單獨使用1種，亦可將2種以上併用。該等之中，就將上述通式(1)所表示之部分結構導入樹脂中之觀點而言，較佳為琥珀酸酐、順丁烯二酸酐、伊康酸酐，更佳為琥珀酸酐。 又，藉由於加成多元酸或其酸酐時使用多元醇，而有使(c1)環氧(甲基)丙烯酸酯樹脂之分子量增大，可將分支導入分子中，可取得分子量與黏度之平衡性之傾向。又，有可增加酸基向分子中之導入率，容易取得感度或密接性等之平衡性之傾向。 作為多元醇，例如，較佳為選自三羥甲基丙烷、二-三羥甲基丙烷、季戊四醇、二季戊四醇、三羥甲基乙烷、1,2,3-丙三醇之中之1種或2種以上之多元醇。 (c1)環氧(甲基)丙烯酸酯樹脂之酸值並無特別限定，較佳為10 mgKOH/g以上，更佳為20 mgKOH/g以上，進而較佳為40 mgKOH/g以上，進而更佳為60 mgKOH/g以上，尤佳為80 mgKOH/g以上，又，較佳為200 mgKOH/g以下，更佳為180 mgKOH/g以下，進而較佳為150 mgKOH/g以下，進而更佳為120 mgKOH/g以下，尤佳為100 mgKOH/g以下。藉由設為上述下限值以上，而有殘渣減少，傾斜角變大之傾向，又，藉由設為上述上限值以下，而有元件發光時之釋氣產生量減少之傾向。 (c1)環氧(甲基)丙烯酸酯樹脂之重量平均分子量(Mw)並無特別限定，通常為1,000以上，較佳為2,000以上，更佳為3,000以上，進而較佳為4,000以上，進而更佳為5,000以上，尤佳為6,000以上，最佳為7,000以上，又，通常為30,000以下，較佳為20,000以下，更佳為15,000以下，進而較佳為10,000以下。藉由設為上述下限值以上，而有元件發光時之釋氣產生量減少之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 (C)鹼溶性樹脂所含之(c1)環氧(甲基)丙烯酸酯樹脂之含有比例並無特別限定，較佳為30質量%以上，更佳為50質量%以上，進而較佳為70質量%以上，進而更佳為80質量%以上，尤佳為90質量%以上，又，通常為100質量%以下。藉由設為上述下限值以上，而有釋氣產生量減少之傾向。 (c1)環氧(甲基)丙烯酸酯樹脂可藉由先前公知之方法而合成。具體而言，可使用如下方法：使上述環氧樹脂溶解於有機溶劑中，於觸媒與熱聚合抑制劑之共存下，添加上述具有乙烯性不飽和鍵之酸或酯化合物而進行加成反應，進而添加多元酸或其酸酐而繼續反應。 此處，作為反應所使用之有機溶劑，可列舉：甲基乙基酮、環己酮、二乙二醇乙基醚乙酸酯、丙二醇單甲醚乙酸酯等有機溶劑之1種或2種以上。 又，作為上述觸媒，可列舉：三乙胺、苄基二甲胺、三苄胺等三級胺類；四甲基氯化銨、甲基三乙基氯化銨、四乙基氯化銨、四丁基氯化銨、三甲基苄基氯化銨等四級銨鹽類；三苯基膦等磷化合物；三苯基銻等銻類等之1種或2種以上。 進而，作為熱聚合抑制劑，可列舉：對苯二酚、對苯二酚單甲醚、甲基對苯二酚等之1種或2種以上。 又，作為具有乙烯性不飽和鍵之酸或酯化合物，相對於環氧樹脂之環氧基之1化學當量，可設為成為通常0.7〜1.3化學當量、較佳為0.9〜1.1化學當量之量。又，作為加成反應時之溫度，可設為通常60〜150℃、較佳為80〜120℃之溫度。進而，作為多元酸或其酸酐之使用量，相對於上述加成反應中所產生之羥基之1化學當量，可設為成為通常0.1〜1.2化學當量、較佳為0.2〜1.1化學當量之量。 (c1)環氧(甲基)丙烯酸酯樹脂亦可為包含上述通式(1)所表示之部分結構以外之部分結構者，就減少元件發光時之釋氣產生量之觀點而言，較佳為含有選自由包含下述式(i)所表示之重複單元結構之環氧(甲基)丙烯酸酯樹脂、包含下述式(ii)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂、及包含下述式(iii)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂所組成之群中之至少1種。 (c1)環氧(甲基)丙烯酸酯樹脂就減少元件發光時之釋氣產生量之觀點而言，較佳為包含下述式(i)所表示之重複單元之環氧(甲基)丙烯酸酯樹脂(c1-1)。作為原因之一，推斷如下：由於具有剛直之主骨架，故而對於熱，難以進行分解等。 [化14]

式(i)中，R^a 表示氫原子或甲基，R^b 表示可具有取代基之2價烴基。式(i)中之苯環可被任意之取代基取代。﹡表示鍵結位置。 (R^b ) 上述式(i)中，R^b 表示可具有取代基之2價烴基。 作為2價烴基，可列舉：2價之脂肪族基、2價之芳香族環基、將1個以上之2價之脂肪族基與1個以上之2價之芳香族環基連結而成之基。 2價之脂肪族基可列舉直鏈狀者、支鏈狀者、環狀者。該等之中，就顯影溶解性之觀點而言，較佳為直鏈狀者，另一方面，就減少顯影液向曝光部滲透之觀點而言，較佳為環狀者。其碳數通常為1以上，較佳為3以上，更佳為6以上，又，較佳為20以下，更佳為15以下，進而較佳為10以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為2價之直鏈狀脂肪族基之具體例，可列舉：亞甲基、伸乙基、正伸丙基、正伸丁基、正伸己基、正伸庚基等。該等之中，就殘渣減少之觀點而言，較佳為亞甲基。 作為2價之支鏈狀脂肪族基之具體例，可列舉：於上述2價之直鏈狀脂肪族基上具有甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基等作為側鏈之結構。 2價之環狀脂肪族基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，又，通常為10以下，較佳為5以下。藉由設為上述下限值以上，而有殘膜率提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。作為2價之環狀脂肪族基之具體例，可列舉：自環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等環去除2個氫原子而成之基。該等之中，就顯影密接性之觀點而言，較佳為自金剛烷環去除2個氫原子而成之基。 作為2價之脂肪族基可具有之取代基，可列舉：甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就合成容易性之觀點而言，較佳為未經取代。 又，作為2價之芳香族環基，可列舉：2價之芳香族烴環基及2價之芳香族雜環基。其碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為20以下，更佳為15以下，進而較佳為10以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為2價之芳香族烴環基中之芳香族烴環，可為單環亦可為縮合環。作為2價之芳香族烴環基，例如可列舉：具有2個自由原子價之苯環、萘環、蒽環、菲環、苝環、稠四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、苊環、螢蒽環、茀環等基。 又，作為芳香族雜環基中之芳香族雜環，可為單環亦可為縮合環。作為2價之芳香族雜環基，例如可列舉：具有2個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、

啶環、喹唑啉環、喹唑啉酮環、薁環等基。該等之中，就光硬化性之觀點而言，較佳為具有2個自由原子價之苯環或萘環，更佳為具有2個自由原子價之苯環。 作為2價之芳香族環基可具有之取代基，可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。該等之中，就硬化性之觀點而言，較佳為未經取代。 又，作為將1個以上之2價之脂肪族基與1個以上之2價之芳香族環基連結而成之基，可列舉：將上述2價之脂肪族基1個以上、與上述2價之芳香族環基1個以上連結而成之基。 2價之脂肪族基之數量並無特別限定，通常為1以上，較佳為2以上，通常為10以下，較佳為5以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 2價之芳香族環基之數量並無特別限定，通常為1以上，較佳為2以上，通常為10以下，較佳為5以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為將1個以上之2價之脂肪族基與1個以上之2價之芳香族環基連結而成之基的具體例，可列舉：下述式(i-A)〜(i-E)所表示之基等。該等之中，就骨架之剛直性與膜之疏水化之觀點而言，較佳為下述式(i-A)所表示之基。 [化15]

如上所述，式(i)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數亦無特別限定，可為1個，亦可為2個以上。 該等之中，就硬化性之觀點而言，較佳為未經取代。 又，關於上述式(i)所表示之重複單元結構，就顯影溶解性之觀點而言，較佳為下述式(i-1)所表示之重複單元結構。再者，式(i-1)所表示之重複單元結構於式中包含上述通式(1)所表示之部分結構。 [化16]

式(i-1)中，R^a 及R^b 係與上述式(i)者含義相同。R¹ 係與上述式(1)者含義相同。﹡表示鍵結位置。式(i-1)中之苯環可進而經任意之取代基取代。 環氧(甲基)丙烯酸酯樹脂(c1-1)1分子中所含之上述式(i-1)所表示之重複單元結構可為1種，亦可為2種以上。 又，環氧(甲基)丙烯酸酯樹脂(c1-1)1分子中所含之上述式(i)所表示之重複單元結構之數量並無特別限定，較佳為1以上，更佳為2以上，進而較佳為3以上，又，較佳為10以下，進而較佳為8以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，環氧(甲基)丙烯酸酯樹脂(c1-1)1分子中所含之上述式(i-1)所表示之重複單元結構之數量並無特別限定，較佳為1以上，更佳為2以上，進而較佳為3以上，又，較佳為10以下，進而較佳為8以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 於以下列舉環氧(甲基)丙烯酸酯樹脂(c1-1)之具體例。 [化17]

[化18]

[化19]

[化20]

又，另一方面，(c1)環氧(甲基)丙烯酸酯樹脂就顯影密接性之觀點而言，較佳為包含下述式(ii)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂(c1-2)。 [化21]

式(ii)中，R^c 分別獨立地表示氫原子或甲基。R^d 表示具有環狀烴基作為側鏈之2價烴基。﹡表示鍵結位置。 (R^d ) 上述式(ii)中，R^d 表示具有環狀烴基作為側鏈之2價烴基。 作為環狀烴基，可列舉：脂肪族環基或芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，又，通常為10以下，較佳為5以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就顯影密接性之觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，又，通常為10以下，較佳為5以下，更佳為4以下。藉由設為上述下限值以上，而有殘渣減少之傾向，又，藉由設為上述上限值以下，而有顯影密接性提高之傾向。 作為芳香族環基，可列舉：芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，進而更佳為10以上，尤佳為12以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，而有殘渣減少之傾向，又，藉由設為上述上限值以下，而有顯影密接性提高之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉：苯環、萘環、蒽環、菲環、苝環、稠四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、苊環、螢蒽環、茀環等。該等之中，就圖案化特性之觀點而言，較佳為茀環。 又，具有環狀烴基作為側鏈之2價烴基中之2價烴基並無特別限定，例如可列舉：可列舉：2價之脂肪族基、2價之芳香族環基、將1個以上之2價之脂肪族基與1個以上之2價之芳香族環基連結而成之基。 2價之脂肪族基可列舉：直鏈狀者、支鏈狀者、環狀者。該等之中，就顯影溶解性之觀點而言，較佳為直鏈狀者，另一方面，就減少顯影液向曝光部滲透之觀點而言，較佳為環狀者。其碳數通常為1以上，較佳為3以上，更佳為6以上，又，較佳為25以下，更佳為20以下，進而較佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為2價之直鏈狀脂肪族基之具體例，可列舉：亞甲基、伸乙基、正伸丙基、正伸丁基、正伸己基、正伸庚基等。該等之中，就殘渣之觀點而言，較佳為亞甲基。 作為2價之支鏈狀脂肪族基之具體例，可列舉：於上述2價之直鏈狀脂肪族基上具有甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基等作為支鏈之結構。 2價之環狀脂肪族基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，又，通常為10以下，較佳為5以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為2價之環狀脂肪族基之具體例，可列舉：自環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等環去除2個氫原子而成之基。該等之中，就顯影密接性之觀點而言，較佳為自金剛烷環去除2個氫原子而成之基。 作為2價之脂肪族基可具有之取代基，可列舉：甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就合成容易性之觀點而言，較佳為未經取代。 又，作為2價之芳香族環基，可列舉：2價之芳香族烴環基及2價之芳香族雜環基。其碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為30以下，更佳為20以下，進而較佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為2價之芳香族烴環基中之芳香族烴環，可為單環亦可為縮合環。作為2價之芳香族烴環基，例如可列舉：具有2個自由原子價之苯環、萘環、蒽環、菲環、苝環、稠四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、苊環、螢蒽環、茀環等基。 又，作為芳香族雜環基中之芳香族雜環，可為單環亦可為縮合環。作為2價之芳香族雜環基，例如可列舉：具有2個自由原子價之呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、

啶環、喹唑啉環、喹唑啉酮環、薁環等基。該等之中，就光硬化性之觀點而言，較佳為具有2個自由原子價之苯環或萘環，更佳為具有2個自由原子價之苯環。 作為2價之芳香族環基可具有之取代基，可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。該等之中，就硬化性之觀點而言，較佳為未經取代。 又，作為將1個以上之2價之脂肪族基與1個以上之2價之芳香族環基連結而成之基，可列舉：將上述2價之脂肪族基1個以上、與上述2價之芳香族環基1個以上連結而成之基。 2價之脂肪族基之數量並無特別限定，通常為1以上，較佳為2以上，通常為10以下，較佳為5以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 2價之芳香族環基之數量並無特別限定，通常為1以上，較佳為2以上，通常為10以下，較佳為5以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為將1個以上之2價之脂肪族基與1個以上之2價之芳香族環基連結而成之基的具體例，可列舉：上述式(i-A)〜(i-E)所表示之基等。該等之中，就殘渣減少之觀點而言，較佳為上述式(i-C)所表示之基。 對於該等2價烴基，作為側鏈之環狀烴基之鍵結態樣並無特別限定，例如可列舉：脂肪族基或芳香族環基之1個氫原子經該側鏈取代之態樣、或包括脂肪族基之1個碳原子而構成作為側鏈之環狀烴基之態樣。 又，上述式(ii)所表示之部分結構就顯影密接性之觀點而言，較佳為下述式(ii-1)所表示之部分結構。 [化22]

式(ii-1)中，R^c 係與上述式(ii)含義相同。R^α 表示可具有取代基之1價環狀烴基。n為1以上之整數。式(ii-1)中之苯環可進而經任意之取代基取代。 (R^α ) 上述式(ii-1)中，R^α 表示可具有取代基之1價環狀烴基。 作為環狀烴基，可列舉：脂肪族環基或芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，又，通常為6以下，較佳為4以下，更佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就顯影密接性之觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，又，通常為10以下，較佳為5以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族環基，可列舉：芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為4以上，較佳為5以上，更佳為6以上，又，較佳為30以下，更佳為20以下，進而較佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉苯環、萘環、蒽環、菲環、茀環等。該等之中，就顯影密接性之觀點而言，較佳為茀環。 作為環狀烴基可具有之取代基，可列舉：羥基、甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、戊基、異戊基等碳數1〜5之烷基；甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就合成容易性之觀點而言，較佳為未經取代。 n表示1以上之整數，較佳為2以上，又，較佳為3以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 該等之中，就牢固之膜硬化度與電特性之觀點而言，較佳為R^α 為1價之脂肪族環基，更佳為金剛烷基。 如上所述，式(ii-1)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數亦無特別限定，可為1個，亦可為2個以上。該等之中，就硬化性之觀點而言，較佳為未經取代。 於以下列舉上述式(ii-1)所表示之部分結構之具體例。 [化23]

[化24]

[化25]

[化26]

[化27]

又，上述式(ii)所表示之部分結構就顯影密接性之觀點而言，較佳為下述式(ii-2)所表示之部分結構。 [化28]

式(ii-2)中，R^c 係與上述式(ii)含義相同。R^β 表示可具有取代基之2價環狀烴基。式(ii-2)中之苯環可進而經任意之取代基取代。 (R^β ) 上述式(ii-2)中，R^β 表示可具有取代基之2價環狀烴基。 作為環狀烴基，可列舉：脂肪族環基或芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，又，通常為10以下，較佳為5以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為35以下，進而較佳為30以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就顯影密接性之觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，又，通常為10以下，較佳為5以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族環基，可列舉：芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，進而較佳為10以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉：苯環、萘環、蒽環、菲環、茀環等。該等之中，就顯影密接性之觀點而言，較佳為茀環。 作為環狀烴基可具有之取代基，可列舉：羥基、甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、戊基、異戊基等碳數1〜5之烷基；甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就合成之簡易性之觀點而言，較佳為未經取代。 該等之中，就硬化性之觀點而言，R^β 較佳為2價之脂肪族環基，更佳為2價之金剛烷環基。 另一方面，就顯影密接性之觀點而言，R^β 較佳為2價之芳香族環基，更佳為2價之茀環基。 如上所述，式(ii-2)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數亦無特別限定，可為1個，亦可為2個以上。該等之中，就硬化性之觀點而言，較佳為未經取代。 於以下列舉上述式(ii-2)所表示之部分結構之具體例。 [化29]

[化30]

[化31]

[化32]

另一方面，上述式(ii)所表示之部分結構就硬化性之觀點而言，較佳為下述式(ii-3)所表示之部分結構。再者，式(ii-3)所表示之部分結構於式中包含上述通式(1)所表示之部分結構。 [化33]

式(ii-3)中，R^c 及R^d 係與上述式(ii)含義相同。R¹ 係與上述式(1)含義相同。 環氧(甲基)丙烯酸酯樹脂(c1-2)1分子中所含之上述式(ii-3)所表示之部分結構可為1種，亦可為2種以上。 又，環氧(甲基)丙烯酸酯樹脂(c1-2)1分子中所含之上述式(ii)所表示之部分結構之數量並無特別限定，較佳為1以上，更佳為3以上，又，較佳為20以下，更佳為15以下，進而較佳為10以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，另一方面，(c1)環氧(甲基)丙烯酸酯樹脂就減少元件發光時之釋氣產生量之觀點而言，較佳為包含下述式(iii)所表示之部分結構之環氧(甲基)丙烯酸酯樹脂(c1-3)。 [化34]

式(iii)中，R^e 表示氫原子或甲基，γ表示單鍵、-CO-、可具有取代基之伸烷基、或可具有取代基之2價環狀烴基。式(iii)中之苯環可進而經任意之取代基取代。﹡表示鍵結位置。 (γ) 上述式(iii)中，γ表示單鍵、-CO-、可具有取代基之伸烷基、或可具有取代基之2價環狀烴基。 伸烷基可為直鏈，亦可為支鏈，就顯影溶解性之觀點而言，較佳為直鏈，就顯影密接性之觀點而言，較佳為支鏈。其碳數量並無特別限定，通常為1以上，較佳為2以上，又，通常為6以下，較佳為4以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸丁基、伸己基、伸庚基，就兼顧顯影密接性與顯影溶解性之觀點而言，較佳為伸乙基或伸丙基，更佳為伸丙基。 作為伸烷基可具有之取代基，可列舉：甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就合成容易性之觀點而言，較佳為未經取代。 作為2價環狀烴基，可列舉：2價之脂肪族環基或2價之芳香族環基。 脂肪族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，又，通常為10以下，較佳為5以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，脂肪族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，又，較佳為40以下，更佳為35以下，進而較佳為30以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為脂肪族環基中之脂肪族環之具體例，可列舉：環己烷環、環庚烷環、環癸烷環、環十二烷環、降𦯉烷環、異𦯉烷環、金剛烷環、環十二烷環等。該等之中，就顯影密接性之觀點而言，較佳為金剛烷環。 另一方面，芳香族環基所具有之環之數量並無特別限定，通常為1以上，較佳為2以上，更佳為3以上，又，通常為10以下，較佳為5以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族環基，可列舉：芳香族烴環基、芳香族雜環基。又，芳香族環基之碳數通常為4以上，較佳為6以上，更佳為8以上，進而較佳為10以上，又，較佳為40以下，更佳為30以下，進而較佳為20以下，尤佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族環基中之芳香族環之具體例，可列舉：苯環、萘環、蒽環、菲環、茀環等。該等之中，就顯影密接性之觀點而言，較佳為茀環。 作為環狀烴基可具有之取代基，可列舉：羥基、甲基、乙基、正丙基、異丙基、正丁基、第二丁基、第三丁基、戊基、異戊基等碳數1〜5之烷基；甲氧基、乙氧基等碳數1〜5之烷氧基；羥基；硝基；氰基；羧基等。該等之中，就合成之簡易性之觀點而言，較佳為未經取代。 又，該等之中，就殘渣減少之觀點而言，較佳為γ為可具有取代基之伸烷基，更佳為二甲基亞甲基。 如上所述，式(iii)中之苯環可進而經任意之取代基取代。作為該取代基，例如可列舉：羥基、甲基、甲氧基、乙基、乙氧基、丙基、丙氧基等。取代基之數亦無特別限定，可為1個，亦可為2個以上。該等之中，就硬化性之觀點而言，較佳為未經取代。 另一方面，上述式(iii)所表示之部分結構就顯影溶解性之觀點而言，較佳為下述式(iii-1)所表示之部分結構。再者，式(iii-1)所表示之部分結構於式中包含上述通式(1)所表示之部分結構。 [化35]

式(iii-1)中，R^e 及γ係與上述式(iii)含義相同。R¹ 係與上述式(1)者含義相同。﹡表示鍵結位置。式(iii-1)中之苯環可進而經任意之取代基取代。 又，環氧(甲基)丙烯酸酯樹脂(c1-3)1分子中所含之上述式(iii)所表示之重複單元結構之數量並無特別限定，較佳為1以上，更佳為5以上，進而較佳為10以上，又，較佳為18以下，進而較佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，環氧(甲基)丙烯酸酯樹脂(c1-3)1分子中所含之上述式(iii-1)所表示之重複單元結構之數量並無特別限定，較佳為1以上，更佳為3以上，進而較佳為5以上，又，較佳為18以下，進而較佳為15以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 於以下列舉環氧(甲基)丙烯酸酯樹脂(c1-3)之具體例。 [化36]

[化37]

[(c2)丙烯酸系共聚合樹脂] 繼而，對(c2)丙烯酸系共聚合樹脂進行詳述。(c2)丙烯酸系共聚合樹脂只要為具有上述通式(1)所表示之部分結構者，則無特別限定，就硬化性之觀點而言，較佳為於側鏈具有乙烯性不飽和基者。 (c2)丙烯酸系共聚合樹脂所含之包含具有乙烯性不飽和基之側鏈之部分結構並無特別限定，就顯影溶解性之觀點而言，例如較佳為下述通式(I)所表示之部分結構。 [化38]

式(I)中，R^A 表示氫原子或甲基。R^B 表示可具有取代基之烯基或下述通式(II)所表示之基。﹡表示鍵結位置。 [化39]

式(II)中，R^C 表示可具有取代基之烯基。α表示可具有取代基之伸烷基、可具有取代基之伸芳基、或可具有取代基之伸烯基。﹡表示與羰基碳之鍵結鍵。 (R^B ) 上述式(I)中，R^B 表示可具有取代基之烯基或上述通式(II)所表示之基。 作為R^B 中之烯基，可列舉直鏈狀、支鏈狀或環狀之烯基。其碳數較佳為2以上，又，較佳為20以下，更佳為16以下，進而較佳為12以下，進而更佳為8以下，尤佳為6以下，最佳為4以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有硬化性提高之傾向。 作為烯基之具體例，可列舉：乙烯基、丙烯基、丁烯基、環己烯基等。該等之中，就硬化性之觀點而言，較佳為乙烯基或丙烯基，更佳為乙烯基。 又，作為烯基可具有之取代基，可列舉：烷基、烯基、炔基、羥基、羧基、氯基、溴基、氟基、烷氧基、羥烷基、硫醇基、碸基等。該等之中，就顯影性之觀點而言，較佳為烷基或烯基，更佳為烷基。於具有2個以上之取代基之情形時，取代基亦可彼此連結而形成環。 作為R^B ，該等之中，就顯影性與硬化性之觀點而言，較佳為乙烯基或丙烯基，更佳為乙烯基。 (R^C ) 上述式(II)中，R^C 表示可具有取代基之烯基。 作為R^C 中之烯基，可列舉直鏈狀、支鏈狀或環狀之烯基。其碳數較佳為2以上，又，較佳為20以下，更佳為16以下，進而較佳為12以下，進而更佳為8以下，尤佳為6以下，最佳為4以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有硬化性提高之傾向。 作為烯基之具體例，可列舉乙烯基、丙烯基、丁烯基、環己烯基等。該等之中，就硬化性之觀點而言，較佳為乙烯基或丙烯基，更佳為乙烯基。 又，作為烯基可具有之取代基，可列舉：烷基、烯基、炔基、羥基、羧基、氯基、溴基、氟基、烷氧基、羥烷基、硫醇基、碸基等。該等之中，就顯影性之觀點而言，較佳為烷基或烯基，更佳為烷基。於具有2個以上之取代基之情形時，取代基亦可彼此連結而形成環。 如上所述，R^C 表示可具有取代基之烯基，該等之中，就顯影性之觀點而言，較佳為乙烯基或丙烯基，更佳為乙烯基。 (α) 上述式(II)中，α表示可具有取代基之伸烷基、可具有取代基之伸芳基、或可具有取代基之伸烯基。 作為α中之伸烷基，可列舉直鏈狀、支鏈狀或環狀之伸烷基。其碳數較佳為1以上，更佳為2以上，又，較佳為22以下，更佳為20以下，進而較佳為18以下，進而更佳為16以下，尤佳為14以下，最佳為12以下。藉由設為上述下限值以上，而有密接性提高之傾向，又，藉由設為上述上限值以下，而有硬化性提高之傾向。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸環己基、甲基伸環己基、二環[2.2.1]庚基、甲基二環[2.2.1]庚基等。該等之中，就硬化性之觀點而言，較佳為伸乙基、伸環己基或甲基伸環己基，更佳為伸乙基。 又，作為伸烷基可具有之取代基，可列舉：烯基、炔基、羥基、羧基、氯基、溴基、氟基、烷氧基、羥烷基、硫醇基、硫基等。該等之中，就顯影密接性之觀點而言，較佳為烯基。又，於具有2個以上之取代基之情形時，取代基亦可彼此連結而形成環。 又，作為α中之伸芳基，可列舉：2價之芳香族烴環基及2價之芳香族雜環基。其碳數較佳為6以上，又，較佳為24以下，更佳為22以下，進而較佳為20以下，進而更佳為18以下，尤佳為16以下，最佳為14以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環亦可為縮合環，例如可列舉：苯環、萘環、蒽環、菲環、苝環、稠四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、苊環、螢蒽環、茀環等。 又，作為芳香族雜環基中之芳香族雜環，可為單環亦可為縮合環，例如可列舉：呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、

啶環、喹唑啉環、喹唑啉酮環、薁環等。該等之中，就顯影性之觀點而言，較佳為苯環、或萘環，更佳為苯環。 又，作為伸芳基可具有之取代基，可列舉：烷基、烯基、炔基、羥基、羧基、氯基、溴基、氟基、烷氧基、羥烷基、硫醇基、碸基等。該等之中，就顯影性之觀點而言，較佳為羥基或羧基，更佳為羧基。又，於具有2個以上之取代基之情形時，取代基亦可彼此連結而形成環。 作為具有取代基之伸芳基之具體例，可列舉羧基苯環基等。 又，作為α中之伸烯基，可列舉直鏈狀、支鏈狀或環狀之伸烯基。其碳數較佳為2以上，又，較佳為22以下，更佳為20以下，進而較佳為18以下，進而更佳為16以下，尤佳為14以下，最佳為12以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為伸烯基之具體例，可列舉：伸乙烯基、伸丙烯基、伸環己烯基、甲基伸乙烯基等。該等之中，就顯影性之觀點而言，較佳為伸乙烯基、伸環己烯基，更佳為伸乙烯基。 又，作為伸烯基可具有之取代基，可列舉：烷基、烯基、炔基、羥基、羧基、氯基、溴基、氟基、烷氧基、羥烷基、硫醇基、硫基等。該等之中，就顯影性之觀點而言，較佳為烷基或烯基，更佳為烷基。又，於具有2個以上之取代基之情形時，取代基亦可彼此連結而形成環。 如上所述，α表示可具有取代基之伸烷基、可具有取代基之伸芳基、或可具有取代基之伸烯基，該等之中，就顯影性之觀點而言，較佳為伸烷基或伸烯基，更佳為伸烷基。 又，上述式(I)所表示之重複單元結構就顯影性之觀點而言，較佳為下述式(I-1)所表示之重複單元結構。再者，式(I-1)所表示之重複單元結構於式中包含上述通式(1)所表示之部分結構。 [化40]

式(I-1)中，R^A 及R^B 係與上述式(I)者含義相同。R¹ 係與上述式(1)者含義相同。 又，上述式(I)所表示之重複單元結構就感度之觀點而言，較佳為下述式(I-2)所表示之重複單元結構。 [化41]

式(I-2)中，R^A 及R^B 係與上述式(I)者含義相同。 (c2)丙烯酸系共聚合樹脂所含之上述通式(I)所表示之部分結構之含有比例並無特別限定，較佳為5莫耳%以上，更佳為20莫耳%以上，進而較佳為30莫耳%以上，進而更佳為50莫耳%以上，尤佳為70莫耳%以上，最佳為80莫耳%以上，又，較佳為99莫耳%以下，更佳為97莫耳%以下，進而較佳為95莫耳%以下。藉由設為上述下限值以上，而有殘渣減少之傾向，又，藉由設為上述上限值以下，而有顯影密接性提高之傾向。 (c2)丙烯酸系共聚合樹脂所含之上述通式(I-1)所表示之部分結構之含有比例並無特別限定，較佳為1莫耳%以上，更佳為5莫耳%以上，進而較佳為10莫耳%以上，進而更佳為15莫耳%以上，尤佳為20莫耳%以上，又，較佳為99莫耳%以下，更佳為60莫耳%以下，進而較佳為40莫耳%以下，尤佳為30莫耳%以下。藉由設為上述下限值以上，而有感度變高，殘渣減少之傾向，又，藉由設為上述上限值以下，而有顯影密接性提高之傾向。 (c2)丙烯酸系共聚合樹脂所含之上述通式(I-2)所表示之部分結構之含有比例並無特別限定，較佳為5莫耳%以上，更佳為10莫耳%以上，進而較佳為20莫耳%以上，進而更佳為30莫耳%以上，尤佳為40莫耳%以上，最佳為50莫耳%以上，又，較佳為99莫耳%以下，更佳為90莫耳%以下，進而較佳為80莫耳%以下，尤佳為70莫耳%以下。藉由設為上述下限值以上，而有感度變高之傾向，又，藉由設為上述上限值以下，而有顯影性提高之傾向。 (通式(I')所表示之部分結構) 於(c2)丙烯酸系共聚合樹脂包含上述通式(I)所表示之部分結構之情形時，所含之其他部分結構並無特別限定，就顯影密接性之觀點而言，例如較佳為包含下述通式(I')所表示之部分結構。 [化42]

上述式(I')中，R^D 表示氫原子或甲基，R^E 表示可具有取代基之烷基、可具有取代基之芳基、或可具有取代基之烯基。 (R^E ) 上述式(I')中，R^E 表示可具有取代基之烷基、可具有取代基之芳基、或可具有取代基之烯基。 作為R^E 中之烷基，可列舉直鏈狀、支鏈狀或環狀之烷基。其碳數較佳為1以上，更佳為3以上，進而較佳為5以上，又，較佳為20以下，更佳為18以下，進而較佳為16以下，進而更佳為14以下，尤佳為12以下。藉由設為上述下限值以上，而有膜強度變高，顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為烷基之具體例，可列舉：甲基、乙基、環己基、雙環戊基、十二烷基等。該等之中，就膜強度之觀點而言，較佳為雙環戊基或十二烷基，更佳為雙環戊基。 又，作為烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 作為R^E 中之芳基，可列舉1價之芳香族烴環基及1價之芳香族雜環基。其碳數較佳為6以上，又，較佳為24以下，更佳為22以下，進而較佳為20以下，尤佳為18以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為芳香族烴環基中之芳香族烴環，可為單環亦可為縮合環，例如可列舉：苯環、萘環、蒽環、菲環、苝環、稠四苯環、芘環、苯并芘環、䓛環、聯三伸苯環、苊環、螢蒽環、茀環等。 又，作為芳香族雜環基中之芳香族雜環，可為單環亦可為縮合環，例如可列舉：呋喃環、苯并呋喃環、噻吩環、苯并噻吩環、吡咯環、吡唑環、咪唑環、㗁二唑環、吲哚環、咔唑環、吡咯并咪唑環、吡咯并吡唑環、吡咯并吡咯環、噻吩并吡咯環、噻吩并噻吩環、呋喃并吡咯環、呋喃并呋喃環、噻吩并呋喃環、苯并異㗁唑環、苯并異噻唑環、苯并咪唑環、吡啶環、吡𠯤環、嗒𠯤環、嘧啶環、三𠯤環、喹啉環、異喹啉環、㖕啉環、喹㗁啉環、啡啶環、苯并咪唑環、

啶環、喹唑啉環、喹唑啉酮環、薁環等。該等之中，就硬化性之觀點而言，較佳為苯環、或萘環，更佳為苯環。 又，作為芳基可具有之取代基，可列舉：甲基、乙基、丙基、甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 作為R^E 中之烯基，可列舉直鏈狀、支鏈狀或環狀之烯基。其碳數較佳為2以上，又，較佳為22以下，更佳為20以下，進而較佳為18以下，進而更佳為16以下，尤佳為14以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為烯基之具體例，可列舉：乙烯基、丙烯基、丁烯基、環己烯基等。該等之中，就硬化性之觀點而言，較佳為乙烯基或丙烯基，更佳為乙烯基。 又，作為烯基可具有之取代基，可列舉：甲基、乙基、丙基、甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 如上所述，R^E 表示可具有取代基之烷基、可具有取代基之芳基、或可具有取代基之烯基，該等之中，就顯影性之觀點而言，較佳為烷基或烯基，更佳為烷基。 (c2)丙烯酸系共聚合樹脂所含之上述通式(I')所表示之部分結構之含有比例並無特別限定，較佳為0.5莫耳%以上，更佳為1莫耳%以上，進而較佳為1.5莫耳%以上，尤佳為2莫耳%以上，又，較佳為90莫耳%以下，更佳為70莫耳%以下，進而較佳為50莫耳%以下，進而更佳為30莫耳%以下，尤佳為10莫耳%以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 (通式(I'')所表示之部分結構) 於(c2)丙烯酸系共聚合樹脂包含上述通式(I)所表示之部分結構之情形時，作為所含之其他部分結構，就耐熱性、膜強度之觀點而言，較佳為包含下述通式(I'')所表示之部分結構。 [化43]

上述式(I'')中，R^F 表示氫原子或甲基，R^G 表示可具有取代基之烷基、可具有取代基之烯基、羥基、羧基、鹵素原子、可具有取代基之烷氧基、硫醇基、或可具有取代基之烷基硫基。t表示0〜5之整數。 (R^G ) 上述式(I'')中，R^G 表示可具有取代基之烷基、可具有取代基之烯基、羥基、羧基、鹵素原子、可具有取代基之烷氧基、硫醇基、或可具有取代基之烷基硫基。 作為R^G 中之烷基，可列舉直鏈狀、支鏈狀或環狀之烷基。其碳數較佳為1以上，更佳為3以上，進而較佳為5以上，又，較佳為20以下，更佳為18以下，進而較佳為16以下，進而更佳為14以下，尤佳為12以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為烷基之具體例，可列舉甲基、乙基、環己基、雙環戊基、十二烷基等。該等之中，就顯影密接性之觀點而言，較佳為雙環戊基或十二烷基，更佳為雙環戊基。 又，作為烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 作為R^G 中之烯基，可列舉直鏈狀、支鏈狀或環狀之烯基。其碳數較佳為2以上，又，較佳為22以下，更佳為20以下，進而較佳為18以下，進而更佳為16以下，尤佳為14以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為烯基之具體例，可列舉：乙烯基、丙烯基、丁烯基、環己烯基等。該等之中，就硬化性之觀點而言，較佳為乙烯基或丙烯基，更佳為乙烯基。 又，作為烯基可具有之取代基，可列舉：甲基、乙基、丙基、甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 作為R^G 中之鹵素原子，可列舉氟原子、氯原子、溴原子、碘原子，該等之中，就撥液性之觀點而言，較佳為氟原子。 作為R^G 中之烷氧基，可列舉直鏈狀、支鏈狀或環狀之烷氧基。其碳數較佳為1以上，又，較佳為20以下，更佳為18以下，進而較佳為16以下，進而更佳為14以下，尤佳為12以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 又，作為烷氧基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 作為R^G 中之烷基硫基，可列舉直鏈狀、支鏈狀或環狀之烷基硫基。其碳數較佳為1以上，又，較佳為20以下，更佳為18以下，進而較佳為16以下，進而更佳為14以下，尤佳為12以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 作為烷基硫基之具體例，可列舉：甲基硫基、乙基硫基、丙基硫基、丁基硫基等。該等之中，就顯影性之觀點而言，較佳為甲基硫基或乙基硫基。 又，作為烷基硫基中之烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等，就顯影性之觀點而言，較佳為羥基、低聚乙二醇基。 如上所述，R^G 表示可具有取代基之烷基、可具有取代基之烯基、羥基、羧基、鹵素原子、烷氧基、羥烷基、硫醇基、或可具有取代基之烷基硫基，該等之中，就顯影性之觀點而言，較佳為羥基或羧基，更佳為羧基。 (t) 上述式(I'')中t表示0〜5之整數。t就顯影性之觀點而言，較佳為2以下，更佳為1以下，進而較佳為0。 (c2)丙烯酸系共聚合樹脂所含之上述通式(I'')所表示之部分結構之含有比例並無特別限定，較佳為1莫耳%以上，更佳為2莫耳%以上，進而較佳為3莫耳%以上，尤佳為5莫耳%以上，又，較佳為90莫耳%以下，更佳為70莫耳%以下，進而較佳為50莫耳%以下，進而更佳為30莫耳%以下，尤佳為20莫耳%以下，最佳為10莫耳%以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 (通式(I''')所表示之部分結構) 於(c2)丙烯酸系共聚合樹脂包含上述通式(I)所表示之部分結構之情形時，作為所含之其他部分結構，就顯影性之觀點而言，較佳為下述通式(I''')所表示之部分結構。 [化44]

上述式(I''')中，R^H 表示氫原子或甲基。 (c2)丙烯酸系共聚合樹脂所含之上述通式(I''')所表示之部分結構之含有比例並無特別限定，較佳為5莫耳%以上，更佳為10莫耳%以上，進而較佳為30莫耳%以上，又，較佳為90莫耳%以下，更佳為80莫耳%以下，進而較佳為70莫耳%以下，尤佳為50莫耳%以下。藉由設為上述下限值以上，而有殘渣減少之傾向，又，藉由設為上述上限值以下，而有顯影密接性提高之傾向。另一方面，就釋氣產生量減少之觀點而言，較佳為0莫耳%，即不包含上述通式(I''')所表示之部分結構。 (c2)丙烯酸系共聚合樹脂之酸值並無特別限定，較佳為5 mgKOH/g以上，更佳為10 mgKOH/g以上，進而較佳為30 mgKOH/g以上，進而更佳為40 mgKOH/g以上，尤佳為50 mgKOH/g以上，又，較佳為100 mgKOH/g以下，更佳為90 mgKOH/g以下，進而較佳為70 mgKOH/g以下，進而更佳為60 mgKOH/g以下。藉由設為上述下限值以上，而有殘渣減少之傾向，又，藉由設為上述上限值以下，而有顯影密接性提高之傾向。 (c2)丙烯酸系共聚合樹脂之重量平均分子量(Mw)並無特別限定，較佳為1,000以上，更佳為2,000以上，進而較佳為3,000以上，進而更佳為4,000以上，尤佳為5,000以上，又，通常為30,000以下，較佳為20,000以下，更佳為15,000以下，進而較佳為10,000以下。尤佳為7,000以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有殘渣減少之傾向。 (C)鹼溶性樹脂所含之(c2)丙烯酸系共聚合樹脂之含有比例並無特別限定，就顯影性之觀點而言，較佳為5質量%以上，更佳為10質量%以上，進而較佳為15質量%以上，尤佳為20質量%以上，又，較佳為100質量%以下，更佳為80質量%以下，進而較佳為50質量%以下。藉由設為上述下限值以上，而有顯影溶解性變良好之傾向，藉由設為上述上限值以下，而有傾斜角變大之傾向。 於(C)鹼溶性樹脂中，可單獨地包含(c1)環氧(甲基)丙烯酸酯樹脂或(c2)丙烯酸系共聚合樹脂之任一種，亦可包含兩者。進而，亦可包含(c1)及(c2)以外之樹脂。例如亦可藉由包含具有含氟原子之官能基之鹼溶性樹脂，而對(C)鹼溶性樹脂本身賦予撥液性。 第1態樣之本發明之感光性樹脂組合物中之(C)鹼溶性樹脂的含有比例相對於全部固形物成分，通常為5質量%以上，較佳為10質量%以上，更佳為20質量%以上，進而較佳為30質量%以上，尤佳為40質量%以上，又，通常為90質量%以下，較佳為70質量%以下，更佳為60質量%以下，尤佳為50質量%以下。藉由設為上述下限值以上，而有顯影性提高之傾向，又，藉由設為上述上限值以下，而有減少元件發光時之釋氣產生量之傾向。 又，全部固形物成分中之(A)乙烯性不飽和化合物及(C)鹼溶性樹脂之含有比例相對於全部固形物成分，通常為5質量%以上，較佳為10質量%以上，更佳為30質量%以上，進而較佳為50質量%以上，進而更佳為70質量%以上，尤佳為80質量%以上，最佳為85質量%以上，又，通常為99質量%以下，較佳為97質量%以下，更佳為95質量%以下。藉由設為上述下限值以上，而有硬化性提高之傾向，又，藉由設為上述上限值以下，而有減少元件發光時之釋氣產生量之傾向。 又，作為感光性樹脂組合物中之(C)鹼溶性樹脂相對於(A)乙烯性不飽和化合物之調配比，相對於(A)乙烯性不飽和化合物100質量份，(C)鹼溶性樹脂較佳為50質量份以上，更佳為60質量份以上，進而較佳為70質量份以上，尤佳為80質量份以上，又，較佳為400質量份以下，更佳為300質量份以下，進而較佳為200質量份以下，尤佳為100質量份以下。藉由設為上述下限值以上，而有顯影密接性提高之傾向，又，藉由設為上述上限值以下，而有硬化性提高之傾向。 另一方面，對於可較佳地用作第2態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中之(C)鹼溶性樹脂的(C-1)含羧基之(共)聚合物、(C-2)於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物、(C-3)含羧基及乙烯性不飽和基之樹脂進行詳述。 [1-1-4-a](C-1)含羧基之(共)聚合物 [1-1-4-a-1]含羧基之(共)聚合物(1) 作為含羧基之(共)聚合物之具代表性者，具體而言，例如可列舉：(甲基)丙烯酸、丁烯酸、異丁烯酸、順丁烯二酸、順丁烯二酸酐、伊康酸、檸康酸等不飽和羧酸、與苯乙烯、α-甲基苯乙烯、羥基苯乙烯等苯乙烯類；(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸金剛烷基酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸羥基甲酯、(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸N,N-二甲胺基乙酯、N-(甲基)丙烯醯嗎啉等(甲基)丙烯酸酯類；(甲基)丙烯腈等(甲基)丙烯腈類；(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二甲胺基乙基(甲基)丙烯醯胺等(甲基)丙烯醯胺類；乙酸乙烯酯等乙烯系化合物類等之共聚物。 該等之中，就感度之觀點而言，較佳為(甲基)丙烯酸酯-(甲基)丙烯酸共聚物、苯乙烯-(甲基)丙烯酸酯-(甲基)丙烯酸共聚物。並且，於(甲基)丙烯酸酯-(甲基)丙烯酸共聚物中，進而較佳為包含(甲基)丙烯酸酯5〜80莫耳%、與(甲基)丙烯酸20〜95莫耳%之共聚物，尤佳為包含(甲基)丙烯酸酯10〜70莫耳%、與(甲基)丙烯酸30〜90莫耳%之共聚物。又，於苯乙烯-(甲基)丙烯酸酯-(甲基)丙烯酸共聚物中，進而較佳為包含苯乙烯3〜60莫耳%、(甲基)丙烯酸酯10〜70莫耳%、(甲基)丙烯酸10〜60莫耳%之共聚物，尤佳為包含苯乙烯5〜50莫耳%、(甲基)丙烯酸酯20〜60莫耳%、(甲基)丙烯酸15〜55莫耳%之共聚物。 [1-1-4-a-2]含羧基之(共)聚合物(2) 又，可列舉：代替上述不飽和羧酸而對(甲基)丙烯酸羥基烷基酯加成多元酸(酐)而成之化合物、與上述苯乙烯類、(甲基)丙烯酸酯類、(甲基)丙烯腈類、(甲基)丙烯醯胺類、乙烯系化合物類等之共聚物。 作為該(甲基)丙烯酸羥基烷基酯，可列舉：(甲基)丙烯酸羥基甲酯、(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丁酯等，又，作為多元酸(酐)，可列舉：琥珀酸(酐)、己二酸(酐)、鄰苯二甲酸(酐)、四氫鄰苯二甲酸(酐)、六氫鄰苯二甲酸(酐)、順丁烯二酸(酐)等，作為兩者之反應化合物，可列舉：琥珀酸[2-(甲基)丙烯醯基乙基]酯、己二酸[2-(甲基)丙烯醯基乙基]酯、鄰苯二甲酸[2-(甲基)丙烯醯基乙基]酯、六氫鄰苯二甲酸[2-(甲基)丙烯醯基乙基]酯、順丁烯二酸[2-(甲基)丙烯醯基乙基]酯、琥珀酸[2-(甲基)丙烯醯基丙基]酯、己二酸[2-(甲基)丙烯醯基丙基]酯、鄰苯二甲酸[2-(甲基)丙烯醯基丙基]酯、六氫鄰苯二甲酸[2-(甲基)丙烯醯基丙基]酯、順丁烯二酸[2-(甲基)丙烯醯基丙基]酯、琥珀酸[2-(甲基)丙烯醯基丁基]酯、己二酸[2-(甲基)丙烯醯基丁基]酯、鄰苯二甲酸[2-(甲基)丙烯醯基丁基]酯、六氫鄰苯二甲酸[2-(甲基)丙烯醯基丁基]酯、順丁烯二酸[2-(甲基)丙烯醯基丁基]酯等。 該等含羧基之(共)聚合物就顯影溶解性之觀點而言，較佳為酸值為50〜500 mgKOH/g，且就顯影溶解性之觀點而言，較佳為聚苯乙烯換算之重量平均分子量(Mw)為1,000〜300,000。 [1-1-4-b](C-2)於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物 [1-1-4-b-1]不飽和羧酸與2種以上之具有乙烯性不飽和基之化合物之共聚物 作為於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物，例如可列舉：使(甲基)丙烯酸烯丙酯、(甲基)丙烯酸3-烯丙氧基-2-羥基丙酯、(甲基)丙烯酸苯烯丙酯、(甲基)丙烯酸丁烯醯酯、(甲基)丙烯酸甲基烯丙酯、N,N-二烯丙基(甲基)丙烯醯胺等2種以上之具有乙烯性不飽和基之化合物、或者(甲基)丙烯酸乙烯酯、(甲基)丙烯酸1-氯乙烯酯、(甲基)丙烯酸2-苯基乙烯酯、(甲基)丙烯酸1-丙烯酯、巴豆酸乙烯酯、乙烯基(甲基)丙烯醯胺等2種以上之具有乙烯性不飽和基之化合物、與(甲基)丙烯酸等不飽和羧酸、或者進而與不飽和羧酸酯等以前者之具有乙烯性不飽和基之化合物占整體的比例成為10〜90莫耳%、較佳為30〜80莫耳%左右之方式進行共聚合而獲得之共聚物等。 再者，關於該不飽和羧酸與2種以上之具有乙烯性不飽和基之化合物之共聚物的酸值，就顯影溶解性之觀點而言，較佳為30〜250 mgKOH/g，重量平均分子量(Mw)就顯影溶解性之觀點而言，較佳為1,000〜300,000。 [1-1-4-b-2]含環氧基之不飽和化合物改性含羧基之(共)聚合物 又，作為於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物，例如可列舉：使含羧基之(共)聚合物與含環氧基之不飽和化合物進行反應，於含羧基之(共)聚合物之羧基之一部分上加成含環氧基之不飽和化合物的環氧基以進行改性而獲得之改性含羧基之(共)聚合物。 作為該含羧基之(共)聚合物，就感度之觀點而言，較佳為上述之含羧基之(共)聚合物之(甲基)丙烯酸酯-(甲基)丙烯酸共聚物、及苯乙烯-(甲基)丙烯酸酯-(甲基)丙烯酸共聚物等。 又，作為該含環氧基之不飽和化合物，可列舉：烯丙基縮水甘油醚、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸α-乙基縮水甘油酯、巴豆酸縮水甘油酯、異巴豆酸縮水甘油酯、丁烯醯基縮水甘油醚、伊康酸單烷基單縮水甘油酯、富馬酸單烷基單縮水甘油酯、順丁烯二酸單烷基單縮水甘油酯等脂肪族含環氧基之不飽和化合物、及(甲基)丙烯酸3,4-環氧基環己基甲酯、(甲基)丙烯酸2,3-環氧基環戊基甲酯、(甲基)丙烯酸7,8-環氧基[三環[5.2.1.0]癸-2-基]氧基乙酯等脂環式含環氧基之不飽和化合物。 然後，藉由使含羧基之(共)聚合物所具有之羧基之5〜90莫耳%、較佳為30〜70莫耳%左右進行反應而獲得該等含環氧基之不飽和化合物。再者，反應可藉由公知之方法實施。 再者，關於該含環氧基之不飽和化合物改性含羧基之(共)聚合物之酸值，就顯影性之觀點而言，較佳為30〜250 mgKOH/g，且就顯影性之觀點而言，重量平均分子量(Mw)較佳為1,000〜300,000。 [1-1-4-b-3]不飽和羧酸改性含環氧基及羧基之(共)聚合物 又，作為於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物，例如可列舉如下改性含環氧基及羧基之(共)聚合物，該改性含環氧基及羧基之(共)聚合物係使如下共聚物與(甲基)丙烯酸等不飽和羧酸進行反應，於該共聚物之環氧基上加成不飽和羧酸之羧基以進行改性而獲得，上述共聚物係使(甲基)丙烯酸等不飽和羧酸、與上述脂肪族含環氧基之不飽和化合物或脂環式含環氧基之不飽和化合物、或者進而與不飽和羧酸酯或苯乙烯等以前者含羧基之不飽和化合物占整體的比例成為10〜90莫耳%、較佳為30〜80莫耳%左右之方式進行共聚合而獲得。 再者，關於該不飽和羧酸改性含環氧基及羧基之(共)聚合物之酸值，就顯影性之觀點而言，較佳為30〜250 mgKOH/g，且就顯影性之觀點而言，重量平均分子量(Mw)較佳為1,000〜300,000。 [1-1-4-b-4]酸改性含環氧基之(共)聚合物 又，作為於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物，可列舉如下酸改性含環氧基之(共)聚合物，該酸改性含環氧基之(共)聚合物係對於含環氧基之(甲基)丙烯酸酯與乙烯性不飽和化合物之共聚物，於該共聚物所具有之環氧基之至少一部分上加成乙烯性不飽和單羧酸，進而於藉由加成而產生之羥基之至少一部分上加成多元酸(酐)而獲得。 具體而言，可列舉如下酸改性含環氧基之(共)聚合物，該酸改性含環氧基之(共)聚合物係對於(甲基)丙烯酸縮水甘油酯等含環氧基之(甲基)丙烯酸酯5〜99莫耳%、與(甲基)丙烯酸酯等乙烯性不飽和化合物通常2〜95莫耳%之共聚物，向共聚物所含之環氧基之通常10〜100莫耳%加成乙烯性不飽和單羧酸，進而向加成時所產生之羥基之通常10〜100莫耳%加成多元酸(酐)而獲得。 此處，上述共聚物中之含環氧基之(甲基)丙烯酸酯之共聚合比例並無特別限定，通常為5莫耳%以上，較佳為20莫耳%以上，更佳為40莫耳%以上，進而較佳為60莫耳%以上，進而更佳為80莫耳%以上，尤佳為90莫耳%以上，且通常為99莫耳%以下，較佳為98莫耳%以下，更佳為95莫耳%以下。藉由設為上述下限值以上，而有成為高感度之傾向，又，藉由設為上述上限值以下，而有成為適當之顯影溶解性之傾向。 另一方面，上述共聚物中之乙烯性不飽和化合物之共聚合比例並無特別限定，通常為1莫耳%以上，較佳為3莫耳%以上，更佳為5莫耳%以上，且通常為90莫耳%以下，較佳為70莫耳%以下，更佳為50莫耳%以下，進而較佳為30莫耳%以下，尤佳為10莫耳%以下。藉由設為上述下限值以上，而有成為高感度之傾向，又，藉由設為上述上限值以下，而有成為適當之顯影溶解性之傾向。 作為含環氧基之(甲基)丙烯酸酯，可列舉：(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸α-乙基縮水甘油酯等脂肪族含環氧基之(甲基)丙烯酸酯；(甲基)丙烯酸3,4-環氧基環己基甲酯、(甲基)丙烯酸2,3-環氧基環戊基甲酯、(甲基)丙烯酸7,8-環氧基[三環[5.2.1.0]癸-2-基]氧基乙酯等脂環式含環氧基之(甲基)丙烯酸酯。 此處，作為乙烯性不飽和化合物，例如較佳為使用具有下述式(α)所表示之部分結構之單(甲基)丙烯酸酯之1種或2種以上。 [化45]

式(α)中，R^1d 〜R^4d 分別獨立地表示氫原子或碳數1〜10之烷基，R^5d 及R^6d 分別獨立地表示氫原子或碳數1〜10之烷基。又，R^5d 與R^6d 亦可連結而形成環。R^5d 與R^6d 連結所形成之環較佳為脂肪族環，可為飽和或不飽和之任一種，該環之碳數較佳為5〜6。 R^{1 d} 〜R^{4 d} 中之烷基之碳數較佳為8以下，更佳為5以下。藉由設為上述上限值以下，而有成為適當之顯影溶解性之傾向。 該等之中，就溶解性之觀點而言，R^1d 〜R^4d 較佳為氫原子。 R^{5 d} 及R^{6 d} 中之烷基之碳數較佳為8以下，更佳為5以下。藉由設為上述下限值以上，而有表現出適當之溶解性之傾向，又，藉由設為上述上限值以下，而有保持親水性之傾向。 該等之中，就顯影溶解性之觀點而言，較佳為R^5d 及R^6d 為氫原子，或者R^5d 與R^6d 連結而形成碳數5〜6之脂肪族環。 上述式(α)之中，較佳為具有下述式(α-a)、(α-b)、或(α-c)所表示之結構之單(甲基)丙烯酸酯。藉由導入該等部分結構，而可增加單(甲基)丙烯酸酯之耐熱性或強度。再者，該等單(甲基)丙烯酸酯可使用1種，亦可以任意之組合及比率併用2種以上。 [化46]

作為上述具有式(α)所表示之部分結構之單(甲基)丙烯酸酯，可使用公知之各種者，就硬化性之觀點而言，尤佳為以下之式(β)所表示者。 [化47]

式(β)中，R^{9 d} 表示氫原子或甲基，R^10d 表示上述式(α)之部分結構。 於含有具有上述式(α)所表示之部分結構之單(甲基)丙烯酸酯之情形時，其共聚合比例通常為1莫耳%以上，較佳為2莫耳%以上，又，通常為70莫耳%以下，較佳為50莫耳%以下，更佳為30莫耳%以下，進而較佳為10莫耳%以下，尤佳為5莫耳%以下。藉由設為上述下限值以上，而有殘膜率變高之傾向，又，藉由設為上述上限值以下，而有殘渣變少之傾向。 另一方面，作為乙烯性不飽和化合物，亦可列舉具有上述式(α)所表示之部分結構之單(甲基)丙烯酸酯以外的乙烯性不飽和化合物(以下，有稱為「其他乙烯性不飽和化合物」之情況)，例如：苯乙烯之α-、鄰、間、對烷基、硝基、氰基、醯胺基、酯衍生物等苯乙烯類；丁二烯、2,3-二甲基丁二烯、異戊二烯、氯丁二烯等二烯類；(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸2-甲基環己酯、(甲基)丙烯酸二環己酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸金剛烷酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸丙炔酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸萘酯、(甲基)丙烯酸蒽酯、(甲基)丙烯酸蒽醌酯、(甲基)丙烯酸向日葵酯、(甲基)丙烯酸水楊酯、(甲基)丙烯酸呋喃酯、(甲基)丙烯酸糠酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸吡喃酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯乙酯、(甲基)丙烯酸甲苯酯、(甲基)丙烯酸-1,1,1-三氟乙酯、(甲基)丙烯酸全氟乙酯、(甲基)丙烯酸全氟正丙酯、(甲基)丙烯酸全氟異丙酯、(甲基)丙烯酸三苯基甲酯、(甲基)丙烯酸異丙苯酯、(甲基)丙烯酸3-(N,N-二甲胺基)丙酯、(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯等(甲基)丙烯酸酯類；(甲基)丙烯酸醯胺、(甲基)丙烯酸N,N-二甲基醯胺、(甲基)丙烯酸N,N-二乙基醯胺、(甲基)丙烯酸N,N-二丙基醯胺、(甲基)丙烯酸N,N-二-異丙基醯胺、(甲基)丙烯酸蒽基醯胺等(甲基)丙烯酸醯胺類；(甲基)丙烯酸醯替苯胺、(甲基)丙烯醯基腈、丙烯醛、氯乙烯、偏二氯乙烯、氟乙烯、偏二氟乙烯、N-乙烯基吡咯啶酮、乙烯基吡啶、乙酸乙烯酯等乙烯系化合物類；檸康酸二乙酯、順丁烯二酸二乙酯、富馬酸二乙酯、伊康酸二乙酯等不飽和二羧酸二酯類；N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、N-月桂基馬來醯亞胺、N-(4-羥基苯基)馬來醯亞胺等單馬來醯亞胺類；N-(甲基)丙烯醯基鄰苯二甲醯亞胺等之類之自由基聚合性化合物。 該等之中，為了賦予更優異之耐熱性及強度，有效的是使用選自苯乙烯、(甲基)丙烯酸苄酯及單馬來醯亞胺中之至少1種作為其他乙烯性不飽和化合物。於該情形時，就耐熱性之觀點而言，選自苯乙烯、(甲基)丙烯酸苄酯及單馬來醯亞胺中之至少1種之共聚合比例通常為1莫耳%以上，較佳為3莫耳%以上，又，通常為70莫耳%以下，較佳為50莫耳%以下，更佳為30莫耳%以下，進而較佳為10莫耳%以下。 作為加成於含環氧基之(甲基)丙烯酸酯與乙烯性不飽和化合物之共聚物所含之環氧基上之乙烯性不飽和單羧酸，可使用公知者，就硬化性之觀點而言，較佳為(甲基)丙烯酸。關於在上述共聚物所含之環氧基上加成乙烯性不飽和單羧酸之量，為該共聚物所含之環氧基之通常10莫耳%以上，較佳為30莫耳%以上，更佳為50莫耳%以上，進而較佳為70莫耳%以上，且通常為100莫耳%以下。藉由將乙烯性不飽和單羧酸之加成比例設為上述下限值以上，而有可提高硬化性之傾向。再者，作為對上述共聚物加成乙烯性不飽和單羧酸之方法，可採用公知之方法。 作為加成於在上述共聚物上加成有乙烯性不飽和單羧酸時所產生之羥基上的多元酸(酐)，並無特別限定，可使用公知者，例如可列舉：鄰苯二甲酸(酐)、四氫鄰苯二甲酸(酐)、六氫鄰苯二甲酸(酐)、琥珀酸(酐)、偏苯三甲酸(酐)等。就釋氣產生量減少之觀點而言，較佳為琥珀酸(酐)，另一方面，就殘膜率提高與殘渣減少之觀點而言，較佳為四氫鄰苯二甲酸(酐)。多元酸(酐)可單獨使用1種，亦可以任意之組合及比率併用2種以上。藉由加成此種成分，而可對共聚物賦予鹼溶性。 關於加成多元酸(酐)之量，係在上述共聚物上加成有乙烯性不飽和單羧酸時所產生之羥基的通常5莫耳%以上、較佳為10莫耳%以上。又，通常為100莫耳%以下，較佳為90莫耳%以下，更佳為80莫耳%以下。藉由設為上述下限值以上，而有可賦予顯影性之傾向，又，藉由設為上述上限值以下，而有抑制顯影過度進行而膜溶解之傾向。再者，作為於在上述共聚物上加成有乙烯性不飽和單羧酸時所產生之羥基上加成多元酸(酐)的方法，可任意地採用公知之方法。 對於以上含環氧基之(共)聚合物之利用乙烯性不飽和單羧酸及多元酸(酐)之改性物，可藉由於加成多元酸(酐)後所產生之羧基之一部分上加成(甲基)丙烯酸縮水甘油酯或具有乙烯性不飽和基之縮水甘油醚化合物，而進一步提高光感度。又，亦可藉由於加成多元酸(酐)後所產生之羧基之一部分上加成不具有乙烯性不飽和基之縮水甘油醚化合物，而提高顯影性。進而，亦可於加成多元酸(酐)後加成上述兩者。 再者，作為上述含環氧基之(共)聚合物之利用乙烯性不飽和單羧酸及多元酸(酐)之改性物，例如可列舉：日本專利特開平8-297366號公報或日本專利特開2001-89533號公報所記載之樹脂。 又，酸改性含環氧基之(共)聚合物之重量平均分子量(Mw)並無特別限定，通常為3,000以上，較佳為5,000以上，又，通常為100,000以下，較佳為50,000以下，更佳為30,000以下，進而較佳為20,000以下，進而更佳為15,000以下，尤佳為10,000以下。藉由設為上述下限值以上，而有可提高相溶性之傾向，又，藉由設為上述上限值以下，而有可確保溶解性之傾向。又，分子量分佈[重量平均分子量(Mw)/數量平均分子量(Mn)]就硬化性之觀點而言，較佳為2.0〜5.0。 又，酸改性含環氧基之(共)聚合物之酸值並無特別限定，較佳為5 mgKOH/g以上，更佳為10 mgKOH/g以上，進而較佳為20 mgKOH/g以上，又，較佳為150 mgKOH/g以下，更佳為100 mgKOH/g以下，進而較佳為50 mgKOH/g以下。藉由設為上述下限值以上，而有可保證溶解性之傾向，又，藉由設為上述上限值以下，而有可提高減膜之傾向。 [1-1-4-c](C-3)含羧基及乙烯性不飽和基之樹脂 [1-1-4-c-1]酸改性環氧樹脂 作為含羧基及乙烯性不飽和基之樹脂，例如可列舉：對環氧樹脂之乙烯性不飽和基單羧酸加成體加成多元酸(酐)而成之含有羧基及乙烯性不飽和基之環氧樹脂、即所謂環氧(甲基)丙烯酸酯樹脂。即，可列舉：藉由於環氧樹脂之環氧基上開環加成乙烯性不飽和單羧酸之羧基，而對環氧樹脂經由酯鍵(-COO-)而加成乙烯性不飽和鍵，並且於此時所產生之羥基上加成多元酸(酐)之一羧基而成者。 此處，所謂環氧樹脂係指亦包括藉由熱硬化而形成樹脂以前之原料化合物在內，作為該環氧樹脂，可自公知之環氧樹脂中適當選擇而使用。具體而言，例如可列舉：雙酚A環氧樹脂、雙酚F環氧樹脂、雙酚S環氧樹脂、酚系酚醛清漆環氧樹脂、甲酚酚醛清漆環氧樹脂、聯苯酚醛清漆環氧樹脂、三苯酚環氧樹脂、苯酚與二環戊烷之聚合環氧樹脂、二羥基茀型環氧樹脂、二羥基伸烷基氧基茀型環氧樹脂、9,9-雙(4'-羥基苯基)茀之二縮水甘油醚化物、1,1-雙(4'-羥基苯基)金剛烷之二縮水甘油醚化物等。其中，就較高之硬化膜強度之觀點而言，較佳為雙酚A環氧樹脂、酚系酚醛清漆環氧樹脂、甲酚酚醛清漆環氧樹脂、苯酚與二環戊二烯之聚合環氧樹脂、9,9-雙(4'-羥基苯基)茀之二縮水甘油醚化物等，進而較佳為雙酚A環氧樹脂。 又，作為乙烯性不飽和單羧酸，例如可列舉：(甲基)丙烯酸、丁烯酸、順丁烯二酸、富馬酸、伊康酸、檸康酸等、及季戊四醇三(甲基)丙烯酸酯琥珀酸酐加成物、季戊四醇三(甲基)丙烯酸酯四氫鄰苯二甲酸酐加成物、二季戊四醇五(甲基)丙烯酸酯琥珀酸酐加成物、二季戊四醇五(甲基)丙烯酸酯鄰苯二甲酸酐加成物、二季戊四醇五(甲基)丙烯酸酯四氫鄰苯二甲酸酐加成物、(甲基)丙烯酸與ε-己內酯之反應生成物等。其中，就感度之觀點而言，較佳為(甲基)丙烯酸。 又，作為多元酸(酐)，例如可列舉：琥珀酸、順丁烯二酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、3-甲基四氫鄰苯二甲酸、4-甲基四氫鄰苯二甲酸、3-乙基四氫鄰苯二甲酸、4-乙基四氫鄰苯二甲酸、六氫鄰苯二甲酸、3-甲基六氫鄰苯二甲酸、4-甲基六氫鄰苯二甲酸、3-乙基六氫鄰苯二甲酸、4-乙基六氫鄰苯二甲酸、偏苯三甲酸、均苯四甲酸、二苯甲酮四羧酸、聯苯四羧酸、及其等之酸酐等。其中，就圖像再現性、顯影性、釋氣產生量減少之觀點而言，較佳為琥珀酸酐、順丁烯二酸酐、四氫鄰苯二甲酸酐、或六氫鄰苯二甲酸酐，更佳為琥珀酸酐或四氫鄰苯二甲酸酐，進而較佳為琥珀酸酐。 本發明中之酸改性環氧樹脂之酸值並無特別限定，較佳為10 mgKOH/g以上，更佳為20 mgKOH/g以上，進而較佳為30 mgKOH/g以上，又，較佳為200 mgKOH/g以下，更佳為180 mgKOH/g以下，進而較佳為150 mgKOH/g以下，進而更佳為100 mgKOH/g以下，尤佳為80 mgKOH/g以下。藉由設為上述下限值以上，而有可提高密接性之傾向，又，藉由設為上述上限值以下，而有可提高溶解性之傾向。 又，酸改性環氧樹脂之重量平均分子量(Mw)並無特別限定，通常為1,000以上，較佳為2,000以上，更佳為3,000以上，進而較佳為4,000以上，進而更佳為5,000以上，尤佳為6,000以上，又，通常為30,000以下，較佳為20,000以下，更佳為15,000以下，進而較佳為10,000以下。藉由設為上述下限值以上，而有可提高密接性之傾向，又，藉由設為上述上限值以下，而有可維持適當之溶解性之傾向。 上述酸改性環氧樹脂可藉由先前公知之方法進行合成。具體而言，可使用如下方法：使上述環氧樹脂溶解於有機溶劑中，於觸媒與熱聚合抑制劑之共存下，添加上述乙烯性不飽和單羧酸而進行加成反應，進而添加多元酸(酐)而繼續反應。 此處，作為反應所使用之有機溶劑，可列舉：甲基乙基酮、環己酮、二乙二醇乙基醚乙酸酯、丙二醇單甲醚乙酸酯等有機溶劑之1種或2種以上。又，作為上述觸媒，可列舉：三乙胺、苯偶醯二甲基胺、三苄胺等三級胺類；四甲基氯化銨、甲基三乙基氯化銨、四乙基氯化銨、四丁基氯化銨、三甲基苄基氯化銨等四級銨鹽類；三苯基膦等磷化合物；三苯基銻等銻類等之1種或2種以上。進而，作為熱聚合抑制劑，可列舉：對苯二酚、對苯二酚單甲醚、甲基對苯二酚等之1種或2種以上。 又，作為乙烯性不飽和單羧酸之使用量，相對於環氧樹脂之環氧基之1化學當暈，可設為成為通常0.7〜1.3化學當量、較佳為0.9〜1.1化學當量之量。又，作為加成反應時之溫度，可設為通常60〜150℃、較佳為80〜120℃之溫度。進而，作為多元酸(酐)之使用量，相對於上述加成反應中所產生之羥基之1化學當量，可設為成為通常0.1〜1.2化學當量、較佳為0.2〜1.1化學當量之量。 關於本發明中之上述酸改性環氧樹脂，將具體例示於以下。酸改性環氧樹脂可為包含1種樹脂者，亦可為包含2種以上之樹脂者。 [化48]

式(C1-1)中，R¹¹¹ 分別獨立地表示氫原子、鹵素原子、烷基或芳基，n¹¹¹ 表示0〜20之整數。 [化49]

式(C1-2)中，R¹²¹ 分別獨立地表示氫原子、鹵素原子、烷基或芳基，n¹²¹ 表示0〜20之整數。 [化50]

式(C1-3)中，R¹³¹ 分別獨立地表示氫原子、鹵素原子、烷基或芳基，m¹³¹ 及n¹³¹ 分別獨立地表示0〜20之整數。再者，m¹³¹ 及n¹³¹ 意指重複單元之數，並非表示為嵌段共聚物。γ表示單鍵、-CO-、-CH₂ -、-C(CH₃ )₂ -、下述式(γ)所示之基、或下述式(δ)所示之基。δ表示氫原子或多元酸殘基。 [化51]

[化52]

[化53]

式(C1-4)中，R¹⁴¹ 分別獨立地表示烷基或鹵素原子，p分別獨立地表示0〜4之整數。 [化54]

[化55]

式(C1-6)中，R¹⁶¹ 分別獨立地表示氫原子、鹵素原子、烷基或芳基，n¹⁶¹ 表示0〜20之整數。 又，式(C1-1)〜式(C1-6)中，A表示下述通式(ε)所表示之基。 [化56]

式(ε)中，R¹⁷¹ 表示氫原子或甲基，R¹⁷² 表示伸烷基，m¹⁷¹ 表示0〜10之整數。又，δ表示氫原子或多元酸殘基。 [1-1-4-c-2]改性苯酚樹脂 作為含羧基及乙烯性不飽和基之樹脂，例如可列舉：對苯酚樹脂之含乙烯性不飽和基之環氧化合物加成體加成多元酸(酐)而成之含羧基及乙烯性不飽和基之苯酚樹脂。即，可列舉：藉由於苯酚樹脂之苯酚性羥基上開環加成含乙烯性不飽和基之環氧化合物之環氧基，而對苯酚樹脂經由酯鍵(-COO-)而加成乙烯性不飽和鍵，並且於此時所產生之羥基上加成多元酸(酐)之一羧基而成者。 此處，作為苯酚樹脂，使例如苯酚、鄰甲酚、間甲酚、對甲酚、2,5-二甲苯酚、3,5-二甲苯酚、鄰乙基苯酚、間乙基苯酚、對乙基苯酚、丙基苯酚、正丁基苯酚、第三丁基苯酚、1-萘酚、2-萘酚、4,4'-聯苯二醇、雙酚A、鄰苯二酚、間苯二酚、對苯二酚、鄰苯三酚、1,2,4-苯三醇、苯甲酸、4-羥基苯基乙酸、水楊酸、間苯三酚等苯酚類之至少1種於酸觸媒下，與例如甲醛、對甲醛、乙醛、三聚乙醛、丙醛、苯甲醛、水楊醛、糠醛等醛類、或者丙酮、甲基乙基酮、甲基異丁基酮等酮類之至少1種進行縮聚而成之酚醛清漆樹脂、及除使用鹼觸媒代替該縮聚中之酸觸媒以外以相同方式進行縮聚而成之可溶酚醛樹脂等。此處，上述苯酚類與醛類之縮合反應係於無溶劑下或溶劑中進行。 該等酚醛清漆樹脂、可溶酚醛樹脂之重量平均分子量(Mw)通常為1,000〜20,000，較佳為1,000〜10,000，進而較佳為1,000〜8,000。藉由將重量平均分子量設為上述下限值以上，而有容易確保圖像強度之傾向，藉由設為上述上限值以下，而有容易確保顯影性之傾向。 又，作為含乙烯性不飽和基之環氧化合物，可列舉：(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸(3,4-環氧基環己基)甲酯、(聚)伸烷基二醇(甲基)丙烯酸縮水甘油氧酯、(甲基)丙烯酸甲基縮水甘油酯、(3,4-環氧基環己基)乙烯等。該等之中，尤佳為(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸(3,4-環氧基環己基)甲酯。 於酚醛清漆樹脂、可溶酚醛樹脂等與含乙烯性不飽和基之環氧化合物之反應時可使用公知之方法。例如，將三乙胺、苄基甲胺等三級胺；十二烷基三甲基氯化銨、四甲基氯化銨、四乙基氯化銨、苄基三乙基氯化銨等四級銨鹽；吡啶、三苯基膦等之1種或2種以上作為觸媒，於有機溶劑中，於反應溫度50〜150℃下進行數小時〜數十小時反應，藉此可對酚醛清漆樹脂、可溶酚醛樹脂等加成含乙烯性不飽和基之環氧化合物。 關於該觸媒之使用量，相對於反應原料混合物(酚醛清漆樹脂、可溶酚醛樹脂與含乙烯性不飽和基之環氧化合物之合計)，較佳為0.01〜10質量%，尤佳為0.3〜5質量%。又，為了防止反應中之聚合，較佳為使用聚合抑制劑(例如，對甲氧基苯酚、對苯二酚、甲基對苯二酚、對甲氧基苯酚、鄰苯三酚、第三丁基鄰苯二酚、二丁基羥基甲苯、啡噻𠯤等之1種或2種以上)，其使用量相對於反應原料混合物，較佳為0.01〜10質量%，尤佳為0.03〜5質量%。 再者，在酚醛清漆樹脂、可溶酚醛樹脂等之苯酚性羥基上加成含乙烯性不飽和基之環氧化合物的較佳比例為1〜99莫耳%。該比例可以相對於苯酚性羥基，所添加之含乙烯性不飽和基之環氧化合物之量進行調整。 又，作為多元酸(酐)，例如可使用公知者，可列舉：順丁烯二酸、琥珀酸、伊康酸、鄰苯二甲酸、四氫鄰苯二甲酸、六氫鄰苯二甲酸、甲基內亞甲基四氫鄰苯二甲酸、氯菌酸、甲基四氫鄰苯二甲酸、5-降𦯉烯-2,3-二羧酸、甲基-5-降𦯉烯-2,3-二羧酸等二元羧酸或其酸酐；偏苯三甲酸、均苯四甲酸、二苯甲酮四羧酸、聯苯四羧酸等多元羧酸或其酸酐等。其中，較佳為可列舉：四氫鄰苯二甲酸酐或琥珀酸酐。其等可單獨使用1種，亦可混合2種以上使用。 多元酸(酐)之加成率係酚醛清漆樹脂、可溶酚醛樹脂等與含乙烯性不飽和基之環氧化合物之反應物之羥基的通常10〜100莫耳%、較佳為20〜100莫耳%、更佳為30〜100莫耳%。藉由將該加成率設為上述範圍內，而有容易確保顯影性之傾向。 [1-1-4-d]其他鹼溶性樹脂 此外，於欲在對於鹼性顯影液容易劣化之基板之有機電致元件設置阻隔壁之情形，且使用弱鹼性之鹼性化合物之顯影液、或不含有鹼性化合物之顯影液之情形時，可較佳地使用聚乙烯醇；或使上述[1-1-4-a-1]含羧基之(共)聚合物(1)中所列舉之共聚物(作為較佳例，乙酸乙烯酯等)0.1〜40莫耳%、較佳為1〜30莫耳%進行共聚合所得之乙烯醇共聚物；或藉由酯化反應導入上述[1-1-4-a-1]含羧基之(共)聚合物(1)中所列舉之共聚物0.1〜40莫耳%、較佳為1〜30莫耳%所得之改性聚乙烯醇作為鹼溶性樹脂。 又，進而，為了形成適度之傾斜角及保持撥液性，可較佳地使用：藉由酯化反應導入上述[1-1-4-c-1]酸改性環氧樹脂中所列舉之乙烯性不飽和單羧酸(作為較佳例，(甲基)丙烯酸、(甲基)丙烯酸與ε-己內酯之反應物等)、或進而導入多元酸(酐)(作為較佳例，四氫鄰苯二甲酸酐等)0.1〜30莫耳%、較佳為0.5〜20莫耳%所得之改性聚乙烯醇；或者藉由formal反應導入日本專利特開2008-45047號公報所記載之具有(甲基)丙烯醯(氧)基或(甲基)丙烯醯胺基且具有醛基之化合物(作為較佳例，4-丙烯醯氧基丁醛等)、或具有二烷基縮醛基之化合物(作為較佳例，N-(2,2-二甲氧基乙基)甲基丙烯醯胺等)0.1〜30莫耳%、較佳為0.5〜20莫耳%所得之改性聚乙烯醇等。 作為(C)鹼溶性樹脂，上述者之中，就釋氣產生量減少與硬化性之觀點而言，較佳為(C-2)於側鏈具有乙烯性不飽和基之含羧基之(共)聚合物或(C-3)含羧基及乙烯性不飽和基之樹脂，更佳為(C-3)含羧基及乙烯性不飽和基之樹脂，進而較佳為酸改性環氧樹脂。又，亦可使用第1態樣中之作為(C)鹼溶性樹脂所列舉者。 以上之(C)鹼溶性樹脂之重量平均分子量(Mw)並無特別限定，較佳為2,000以上，更佳為3,000以上，進而較佳為5,000以上，尤佳為7,000以上，又，較佳為50,000以下，更佳為30,000以下，進而較佳為20,000以下，尤佳為10,000以下。藉由設為上述下限值以上，而有抑制顯影過度進行而膜溶解之傾向，藉由設為上述上限值以下，而有表現出適度之顯影溶解性之傾向。 又，(C)鹼溶性樹脂之酸值並無特別限定，較佳為10 mgKOH/g以上，更佳為20 mgKOH/g以上，進而更佳為30 mgKOH/g以上，又，較佳為200 mgKOH/g以下，更佳為150 mgKOH/g以下，進而較佳為100 mgKOH/g以下，進而更佳為70 mgKOH/g以下，尤佳為50 mgKOH/g以下。藉由設為上述下限值以上，而有可抑制殘渣之傾向，又，藉由設為上述上限值以下，而有獲得較高之殘膜率之傾向。 第2態樣之本發明之感光性樹脂組合物中之(C)鹼溶性樹脂的含有比例相對於全部固形物成分，通常為5質量%以上，較佳為10質量%以上，更佳為20質量%以上，進而較佳為30質量%以上，尤佳為40質量%以上，又，通常為90質量%以下，較佳為70質量%以下，更佳為60質量%以下，尤佳為50質量%以下。藉由設為上述下限值以上，而有獲得適度之顯影溶解性及感度之傾向，又，藉由設為上述上限值以下，而有獲得適度之顯影溶解性及感度之傾向。 又，全部固形物成分中之(A)乙烯性不飽和化合物及(C)鹼溶性樹脂之含有比例相對於全部固形物成分，通常為5質量%以上，較佳為10質量%以上，更佳為30質量%以上，進而較佳為50質量%以上，進而更佳為70質量%以上，尤佳為80質量%以上，最佳為85質量%以上，又，通常為99質量%以下，較佳為97質量%以下，更佳為95質量%以下。藉由設為上述下限值以上，而有獲得適度之顯影溶解性及感度之傾向，又，藉由設為上述上限值以下，而有獲得適度之顯影溶解性及感度之傾向。 又，作為感光性樹脂組合物中之(C)鹼溶性樹脂相對於(A)乙烯性不飽和化合物之調配比，相對於(A)乙烯性不飽和化合物100質量份，較佳為(C)鹼溶性樹脂50質量份以上，更佳為60質量份以上，進而較佳為70質量份以上，尤佳為80質量份以上，又，較佳為400質量份以下，更佳為300質量份以下，進而較佳為200質量份以下，尤佳為100質量份以下。藉由設為上述下限值以上，而有基板密接性變強之傾向，又，藉由設為上述上限值以下，而有硬化性變高，為產生撥液性所必需之最小曝光量變低之傾向。 [1-1-5](D)成分；撥液劑 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物亦可含有(D)撥液劑。尤其是於利用噴墨法製作有機電致發光元件之情形時，較佳為含有(D)撥液劑，藉由含有(D)撥液劑，而(D)撥液劑可對阻隔壁之表面賦予撥液性，因此認為可使所獲得之阻隔壁為防止連帶有機層之發光部(像素)之混色者。 作為撥液劑，可列舉含聚矽氧化合物或氟系化合物，較佳為可列舉：具有交聯基之撥液劑(以下，有稱為「含交聯基之撥液劑」之情形)。作為交聯基，可列舉環氧基或乙烯性不飽和基，就顯影液之撥液成分之流出抑制之觀點而言，較佳為乙烯性不飽和基。 於使用含交聯基之撥液劑之情形時，可於對所形成之塗佈膜進行曝光時加速於其表面之交聯反應，撥液劑於顯影處理中變得難以流出，其結果為，認為可使所獲得之阻隔壁為表現出較高之撥液性者。 於使用氟系化合物作為撥液劑之情形時，有具有如下作用之傾向，即該氟化合物於阻隔壁之表面進行配向而防止墨水之滲入或混色。進一步詳細而言，有具有如下作用之傾向，即防止墨水之滲入或混色，該墨水之滲入或混色係由具有氟原子之基排斥墨水，從而墨水越過阻隔壁而進入鄰接之區域中之情況引起。 作為含交聯基之撥液劑、尤其是含乙烯性不飽和基之氟系化合物之具體例，例如可列舉：全氟烷基磺酸、全氟烷基羧酸、全氟烷基環氧烷加成物、全氟烷基三烷基銨鹽、包含全氟烷基與親水基之低聚物、包含全氟烷基與親油基之低聚物、包含全氟烷基、親水基、及親油基之低聚物、包含全氟烷基與親水基之胺基甲酸酯、全氟烷基酯、全氟烷基磷酸酯等含氟有機化合物。作為該等含氟化合物之市售品，可使用：以DIC公司製造之「MEGAFAC F116」、「MEGAFAC F120」、「MEGAFAC F142D」、「MEGAFAC F144D」、「MEGAFAC F150」、「MEGAFAC F160」、「MEGAFAC F171」、「MEGAFAC F172」、「MEGAFAC F173」、「MEGAFAC F177」、「MEGAFAC F178A」、「MEGAFAC F178K」、「MEGAFAC F179」、「MEGAFAC F183」、「MEGAFAC F184」、「MEGAFAC F191」、「MEGAFAC F812」、「MEGAFAC F815」、「MEGAFAC F824」、「MEGAFAC F833」、「MEGAFAC RS101」、「MEGAFAC RS102」「MEGAFAC RS105」、「MEGAFAC RS201」、「MEGAFAC RS202」、「MEGAFAC RS301」、「MEGAFAC RS303」「MEGAFAC RS304」、「MEGAFAC RS401」、「MEGAFAC RS402」、「MEGAFAC RS501」、「MEGAFAC RS502」、「MEGAFAC RS-72-K」、「DEFENSA MCF300」、「DEFENSA MCF310」、「DEFENSA MCF312」、「DEFENSA MCF323」、3M Japan公司製造之「Fluorad FC430」、「Fluorad FC431」、「FC-4430」、「FC4432」；旭硝子公司製造之「AsahiGuard AG710」、「Surflon S-382」、「Surflon SC-101」、「Surflon SC-102」、「Surflon SC-103」、「Surflon SC-104」、「Surflon SC-105」、「Surflon SC-106」；Daikin工業公司製造之「OPTOOL DAC-HP」等商品名市售之含氟有機化合物。 如上所述，於使用氟系化合物作為撥液劑之情形時，撥液劑中之氟原子含量並無特別限制，較佳為1質量%以上，更佳為5質量%以上，又，較佳為50質量%以下，更佳為25質量%以下。藉由設為上述下限值以上，而有可抑制向像素部流出之傾向，又，藉由設為上述上限值以下，而有顯示出較高之接觸角之傾向。 撥液劑之分子量並無特別限制，可為低分子量之化合物，亦可為高分子量體。高分子量體之撥液劑可抑制由後烘烤引起之撥液劑之流動性，因此可抑制撥液劑自障壁流出，故而較佳，就此種觀點而言，撥液劑之數量平均分子量較佳為100以上，更佳為500以上，且較佳為100,000以下，更佳為10,000以下。 本發明之感光性樹脂組合物中之(D)撥液劑之含有比例相對於全部固形物成分，通常為0.01質量%以上，較佳為0.1質量%以上，又，通常為1質量%以下，較佳為0.5質量%以下，更佳為0.3質量%以下。藉由設為上述下限值以上，而有表現出較高之撥液性之傾向，又，藉由設為上述上限值以下，而有可抑制向像素部流出之傾向。 另一方面，本發明之阻隔壁形成用感光性樹脂組合物亦可將(D)撥液劑與界面活性劑一併使用，又，亦可使用界面活性劑代替(D)撥液劑。界面活性劑可用以提高作為阻隔壁形成用感光性樹脂組合物之塗佈液之塗佈性、及塗佈膜之顯影性等，其中，較佳為氟系或聚矽氧系之界面活性劑。 尤其是有於顯影時將感光性樹脂組合物之殘渣自未曝光部去除之作用，又，就具有表現出潤濕性之功能之方面而言，較佳為聚矽氧系界面活性劑，進而較佳為聚醚改性聚矽氧系界面活性劑。 作為氟系界面活性劑，較佳為於末端、主鏈及側鏈之至少任一部位具有氟烷基或氟伸烷基之化合物。具體而言，可列舉：1,1,2,2-四氟辛基(1,1,2,2-四氟丙基)醚、1,1,2,2-四氟辛基己基醚、八乙二醇二(1,1,2,2-四氟丁基)醚、六乙二醇二(1,1,2,2,3,3-六氟戊基)醚、八丙二醇二(1,1,2,2-四氟丁基)醚、六丙二醇二(1,1,2,2,3,3-六氟戊基)醚、全氟十二烷基磺酸鈉、1,1,2,2,8,8,9,9,10,10-十氟十二烷、1,1,2,2,3,3-六氟癸烷等。作為其等之市售品，例如可列舉：BM Chemie公司製造之「BM-1000」、「BM-1100」；DIC公司製造之「MEGAFAC F142D」、「MEGAFAC F172」、「MEGAFAC F173」、「MEGAFAC F183」、「MEGAFAC F470」、「MEGAFAC F475」；3M Japan公司製造之「FC430」；NEOS公司製造之「DFX-18」等。 又，作為聚矽氧系界面活性劑，例如可列舉：東麗道康寧公司製造之「DC3PA」、「SH7PA」、「DC11PA」、「SH21PA」、「SH28PA」、「SH29PA」、「8032Additive」、「SH8400」；BYK-Chemie公司製造之「BYK323」、「BYK330」等市售品。 亦可包含氟系界面活性劑及聚矽氧系界面活性劑以外者作為界面活性劑，此外，作為界面活性劑，可列舉非離子性、陰離子性、陽離子性、兩性界面活性劑等。 作為上述非離子性界面活性劑，例如可列舉：聚氧乙烯烷基醚類、聚氧乙烯聚氧丙烯烷基醚類、聚氧乙烯烷基苯基醚類、聚氧乙烯烷基酯類、聚氧乙烯脂肪酸酯類、甘油脂肪酸酯類、聚氧乙烯甘油脂肪酸酯類、季戊四醇脂肪酸酯類、聚氧乙烯季戊四醇脂肪酸酯類、山梨醇酐脂肪酸酯類、聚氧乙烯山梨醇酐脂肪酸酯類、山梨糖醇脂肪酸酯類、聚氧乙烯山梨糖醇脂肪酸酯類等。作為其等之市售品，例如可列舉：花王公司製造之「Emulgen104P」、「EmulgenA60」等聚氧乙烯系界面活性劑等。 又，作為上述陰離子性界面活性劑，例如可列舉：烷磺酸鹽類、烷基苯磺酸鹽類、烷基萘磺酸鹽類、聚氧乙烯烷基醚磺酸鹽類、烷基硫酸鹽類、烷基硫酸酯鹽類、高級醇硫酸酯鹽類、脂肪族醇硫酸酯鹽類、聚氧乙烯烷基醚硫酸鹽類、聚氧乙烯烷基苯基醚硫酸鹽類、烷基磷酸酯鹽類、聚氧乙烯烷基醚磷酸鹽類、聚氧乙烯烷基苯基醚磷酸鹽類、特殊高分子系界面活性劑等。其中，較佳為特殊高分子系界面活性劑，進而較佳為特殊多羧酸型高分子系界面活性劑。作為此種陰離子性界面活性劑，可使用市售品，例如關於烷基硫酸酯鹽類，可列舉花王公司製造之「Emal 10」等；關於烷基萘磺酸鹽類，可列舉花王公司製造之「Pelex NB-L」等；關於特殊高分子系界面活性劑，可列舉花王公司製造之「Homogenol L-18」、「Homogenol L-100」等。 進而，作為上述陽離子性界面活性劑，可列舉四級銨鹽類、咪唑啉衍生物類、烷基胺鹽類等，又，作為兩性界面活性劑，可列舉甜菜鹼型化合物類、咪唑鎓鹽類、咪唑啉類、胺基酸類等。該等之中，較佳為四級銨鹽類，進而較佳為硬脂基三甲基銨鹽類。作為市售者，例如關於烷基胺鹽類，可列舉花王公司製造之「Acetamin 24」等；關於四級銨鹽類，可列舉花王公司製造之「Quartamin 24P」、「Quartamin 86W」等。 又，界面活性劑可以2種以上之組合使用，例如可列舉：聚矽氧系界面活性劑/氟系界面活性劑、聚矽氧系界面活性劑/特殊高分子系界面活性劑、氟系界面活性劑/特殊高分子系界面活性劑之組合等。其中，較佳為聚矽氧系界面活性劑/氟系界面活性劑之組合。關於該聚矽氧系界面活性劑/氟系界面活性劑之組合，例如可列舉：NEOS公司製造之「DFX-18」、BYK-Chemie公司製造之「BYK-300」或「BYK-330」/AGC Seimi Chemical公司製造之「S-393」、信越聚矽氧公司製造之「KP340」/DIC公司製造之「F-478」或「F-475」、東麗道康寧公司製造之「SH7PA」/Daikin公司製造之「DS-401」、NUC公司製造之「L-77」/3M Japan公司製造之「FC4430」等。 [1-1-6]聚合抑制劑 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物亦可含有聚合抑制劑。藉由含有聚合抑制劑，而聚合抑制劑抑制自由基聚合，因此認為可使所獲得之阻隔壁之傾斜角變大。 作為聚合抑制劑，可列舉：對苯二酚、對苯二酚單甲醚、甲基對苯二酚、甲氧基苯酚、2,6-二-第三丁基-4-甲酚(BHT)等。該等之中，就聚合抑制能力之觀點而言，較佳為對苯二酚或甲氧基苯酚，更佳為甲基對苯二酚。 聚合抑制劑較佳為含有1種或2種以上。通常於製造(C)鹼溶性樹脂時，存在於該樹脂中含有聚合抑制劑之情況，可使用該聚合抑制劑作為本發明之聚合抑制劑，除樹脂中之聚合抑制劑以外，亦可於感光性樹脂組合物製造時添加與樹脂中之聚合抑制劑相同或不同之聚合抑制劑。 關於感光性樹脂組合物中之聚合抑制劑之含有比例，相對於感光性樹脂組合物之全部固形物成分，通常為0.0005質量%以上，較佳為0.001質量%以上，更佳為0.01質量%以上，又，通常為0.3質量%以下，較佳為0.2質量%以下，更佳為0.1質量%以下。藉由設為上述下限值以上，而有可使傾斜角變大之傾向，又，藉由設為上述上限值以下，而有可保持高感度之傾向。 [1-1-7]紫外線吸收劑 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物含有紫外線吸收劑。紫外線吸收劑係以藉由利用紫外線吸收劑吸收用於曝光之光源之特定波長而控制光硬化分佈為目的而添加者。藉由紫外線吸收劑之添加，而獲得改善顯影後之傾斜角形狀，或將顯影後殘留於非曝光部之殘渣去除等效果。作為紫外線吸收劑，就抑制起始劑之光吸收之觀點而言，例如可使用於波長250 nm至400 nm之間具有吸收極大值之化合物。 作為紫外線吸收劑之例，可列舉：苯并三唑系化合物、三𠯤系化合物、二苯甲酮化合物、苯甲酸酯化合物、肉桂酸衍生物、萘衍生物、蒽及其衍生物、二萘化合物、啡啉化合物、染料等。 該等紫外線吸收劑可單獨使用或者組合2種以上使用。 該等之中，就使傾斜角變大之觀點而言，較佳為苯并三唑系化合物及/或羥基苯基三𠯤系化合物，尤佳為苯并三唑系化合物。 苯并三唑系化合物之中，就傾斜形狀之方面而言，較佳為下述之通式(Z1)所記載之苯并三唑化合物。 [化57]

上述式(Z1)中，R^1e 及R^2e 分別獨立地表示氫原子、可具有取代基之烷基、下述通式(Z2)所表示之基、或下述通式(Z3)所表示之基。R^3e 表示氫原子或鹵素原子。 [化58]

上述式(Z2)中，R^4e 表示可具有取代基之伸烷基，R^{5 e} 表示可具有取代基之烷基。 [化59]

上述式(Z3)中，R^6e 表示可具有取代基之伸烷基，R^7e 表示氫原子或甲基。 (R^1e 及R^{2 e} ) 上述式(Z1)中，R^1e 及R^2e 分別獨立地表示氫原子、可具有取代基之烷基、通式(Z2)所表示之基、或通式(Z3)所表示之基。 作為烷基，可列舉直鏈狀、支鏈狀或環狀之烷基。其碳數較佳為1以上，更佳為2以上，進而較佳為4以上，又，較佳為10以下，更佳為6以下，進而較佳為4以下。 作為烷基之具體例，可列舉：甲基、乙基、丙基、異丙基、丁基、異丁基、第三丁基等。該等之中，較佳為第三丁基。 又，作為烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等。 (R^3e ) 上述式(Z1)中，R^3e 表示氫原子或鹵素原子。 作為鹵素原子，可列舉氟原子、氯原子、溴原子、碘原子等。 該等之中，就合成之觀點而言，較佳為R^3e 為氫原子。 (R^4e ) 上述式(Z2)中，R^4e 表示可具有取代基之伸烷基。 作為伸烷基，可列舉直鏈狀、支鏈狀或環狀之伸烷基。其碳數通常為1以上，較佳為2以上，又，較佳為6以下，更佳為4以下，進而較佳為3以下。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸丙基、伸丁基等。該等之中，較佳為伸乙基。 又，作為伸烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等。 該等之中，較佳為R^{4 e} 為伸乙基。 (R^5e ) 上述式(Z2)中，表示可具有取代基之烷基。 作為烷基，可列舉直鏈狀、支鏈狀或環狀之烷基。其碳數較佳為4以上，更佳為5以上，進而較佳為7以上，又，較佳為15以下，更佳為10以下，進而較佳為9以下。 作為烷基之具體例，可列舉：甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基等。 又，作為烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等。 該等之中，就傾斜形狀之觀點而言，較佳為R^5e 為庚基、辛基、壬基。 (R^6e ) 上述式(Z3)中，R^6e 表示可具有取代基之伸烷基。 作為伸烷基，可列舉直鏈狀、支鏈狀或環狀之伸烷基。其碳數通常為1以上，較佳為2以上，又，較佳為6以下，更佳為4以下，進而較佳為3以下。 作為伸烷基之具體例，可列舉：亞甲基、伸乙基、伸丙基、伸丙基、伸丁基等。該等之中，較佳為伸乙基。 又，作為伸烷基可具有之取代基，可列舉：甲氧基、乙氧基、氯基、溴基、氟基、羥基、胺基、環氧基、低聚乙二醇基、苯基、羧基、丙烯醯基、甲基丙烯醯基等。 該等之中，就傾斜形狀之觀點而言，較佳為如下化合物，即R^1e 為第三丁基，R^2e 為上述式(Z2)所表示之基(其中，R^4e 為伸乙基，R^5e 為碳數7〜9之烷基)，R^3e 為氫原子之化合物；或者R^1e 為氫原子，R^2e 為上述式(Z3)所表示之基(其中，R^6e 為伸乙基，R^7e 為甲基)，R^3e 為氫原子之化合物；更佳為R^1e 為第三丁基，R^2e 為上述式(Z2)所表示之基(其中，R^4e 為伸乙基，R^5e 為碳數7〜9之烷基)，R^3e 為氫原子。 作為苯并三唑系化合物之具體例，可列舉：2-(5-甲基-2-羥基苯基)苯并三唑、2-(2-羥基-5-第三丁基苯基)-2H-苯并三唑、3[3-第三丁基-4-羥基-5-(5-氯-2H-苯并三唑-2-基)苯基]丙酸辛酯與3-[3-第三丁基-4-羥基-5-(5-氯-2H-苯并三唑-2-基)苯基]丙酸2-乙基己酯之混合物、2-[2-羥基-3,5-雙(α,α-二甲基苄基)苯基]-2H-苯并三唑、2-(3-第三丁基-5-甲基-2-羥基苯基)-5-氯苯并三唑、2-(3,5-二-第三戊基-2-羥基苯基)苯并三唑、2-(2'-羥基-5'-第三辛基苯基)苯并三唑、苯丙酸、3-(2H-苯并三唑-2-基)-5-(1,1-二甲基乙基)-4-羥基、C7-9側鏈及直鏈烷基酯之化合物、2-(2H-苯并三唑-2-基)-4,6-雙(1-甲基-1-苯基乙基)苯酚、2-(2H-苯并三唑-2-基)-6-(1-甲基-1-苯基乙基)-4-(1,1,3,3-四甲基丁基)苯酚。該等之中，就傾斜角與曝光感度之觀點，較佳為3-(2H-苯并三唑-2-基)-5-(1,1-二甲基乙基)-4-羥基、C7-9側鏈及直鏈烷基酯之化合物。 作為所市售之苯并三唑系化合物，例如可列舉：SUMISORB 200、SUMISORB 250、SUMISORB300、SUMISORB 340、SUMISORB 350(住友化學製造)、JF 77、JF 78、JF 79、JF 80、JF 83(城北化學工業製造)、TINUVIN PS、TINUVIN 99-2、TINUVIN 109、TINUVIN 384-2、TINUVIN326、TINUVIN900、TINUVIN928、TINUVIN 1130(BASF製造)、EVERSORB 70、EVERSORB 71、EVERSORB 72、EVERSORB 73、EVERSORB 74、EVERSORB 75、EVERSORB 76、EVERSORB 234、EVERSORB 77、EVERSORB 78、EVERSORB 80、EVERSORB 81(臺灣永光化學工業製造)、Tomisoap 100、Tomisoap 600(API Corporation製造)、SEESORB 701、SEESORB 702、SEESORB 703、SEESORB 704、SEESORB 706、SEESORB 707、SEESORB 709(Shipro Kasei製造)、RUVA-93(大塚化學股份有限公司製造)等。 作為三𠯤系化合物，可列舉：2-[4,6-二(2,4-二甲苯基)-1,3,5-三𠯤-2-基]-5-辛氧基苯酚、2-[4,6-雙(2,4-二甲基苯基)-1,3,5-三𠯤-2-基]-5-[3-(十二烷氧基)-2-羥基丙氧基]苯酚、2-(2,4-二羥基苯基)-4,6-雙(2,4-二甲基苯基)-1,3,5-三𠯤與環氧丙烯酸2-乙基己酯之反應生成物、2,4-雙[2-羥基-4-丁氧基苯基]-6-(2,4-二丁氧基苯基)-1,3-5-三𠯤等。該等之中，就傾斜角與曝光感度之觀點而言，較佳為羥基苯基三𠯤化合物。 作為所市售之三𠯤系化合物，例如可列舉：TINUVIN 400、TINUVIN 405、TINUVIN 460、TINUVIN 477、TINUVIN 479(BASF製造)等。 作為其他紫外線吸收劑，例如可列舉：SUMISORB 130(住友化學製造)、EVERSORB 10、EVERSORB 11、EVERSORB 12(臺灣永光化學工業製造)、Tomisoap 800(API Corporation製造)、SEESORB 100、SEESORB 101、SEES0RB 101S、SEESORB 102、SEESORB 103、SEES0RB 105、SEESORB 106、SEESORB 107、SEESORB 151(Shipro Kasei製造)等二苯甲酮化合物；SUMISORB400(住友化學製造)、水楊酸苯酯等苯甲酸酯化合物；肉桂酸2-乙基己酯、對甲氧基肉桂酸2-乙基己酯、甲氧基肉桂酸異丙酯、甲氧基肉桂酸異戊酯等肉桂酸衍生物；α-萘酚、β-萘酚、α-萘酚甲基醚、α-萘酚乙基醚、1,2-二羥基萘、1,3-二羥基萘、1,4-二羥基萘、1,5-二羥基萘、1,6-二羥基萘、1,7-二羥基萘、1,8-二羥基萘、2,3-二羥基萘、2,6-二羥基萘、2,7-二羥基萘等萘衍生物；蒽、9,10-二羥基蒽等蒽及其衍生物；偶氮系染料、二苯甲酮系染料、胺基酮系染料、喹啉系染料、蒽醌系染料、丙烯酸二苯基氰酯系染料、三𠯤系染料、對胺基苯甲酸系染料等染料；等。該等之中，就曝光感度之觀點而言，較佳為使用肉桂酸衍生物、萘衍生物，尤佳為使用肉桂酸衍生物。 本發明之感光性樹脂組合物中之紫外線吸收劑之含有比例相對於全部固形物成分，通常為0.01質量%以上，較佳為0.05質量%以上，更佳為0.1質量%以上，進而較佳為0.5質量%以上，尤佳為1質量%以上，又，通常為15質量%以下，較佳為10質量%以下，更佳為5質量%以下，進而較佳為3質量%以下。藉由設為上述下限值以上，而有傾斜角變大之傾向，又，藉由設為上述上限值以下，而有成為高感度之傾向。 又，關於相對於(B)光聚合起始劑之調配比，作為紫外線吸收劑相對於(B)光聚合起始劑100質量份之調配量，通常為1質量份以上，較佳為10質量份以上，更佳為30質量份以上，進而較佳為50質量份以上，尤佳為80質量份以上，且通常為500質量份以下，較佳為300質量份以下，更佳為200質量份以下，進而較佳為150質量份以下。藉由設為上述下限值以上，而有傾斜角變大之傾向，又，藉由設為上述上限值以下，而有成為高感度之傾向。 [1-1-8]熱聚合起始劑 進而，於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中亦可含有熱聚合起始劑。藉由含有熱聚合起始劑，而有可使膜之交聯度變高之傾向。作為此種熱聚合起始劑之具體例，例如可列舉：偶氮系化合物、有機過氧化物及過氧化氫等。其等可單獨使用1種，亦可將2種以上併用。 再者，於光聚合起始劑中期待感度提高或膜之交聯密度增大而併用熱聚合起始劑之情形時，較佳為使其等之含有比例之合計成為上述感光性樹脂組合物中之光聚合起始劑之含有比例，又，作為光聚合起始劑與熱聚合起始劑之併用比例，就感度之觀點而言，相對於光聚合起始劑100質量份，較佳為將熱聚合起始劑設為5〜300質量份。 [1-1-9]胺基化合物 於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，為了促進熱硬化而亦可含有胺基化合物。於該情形時，作為感光性樹脂組合物中之胺基化合物之含有比例，相對於感光性樹脂組合物之全部固形物成分，通常為40質量%以下，較佳為30質量%以下。又，通常為0.5質量%以上，較佳為1質量%以上。藉由設為上述上限值以下，而有可維持保存穩定性之傾向，藉由設為上述下限值以上，而有可確保充分之熱硬化性之傾向。 作為胺基化合物，例如可列舉：具有至少2個作為官能基之羥甲基經碳數1〜8之醇縮合改性而成之烷氧基甲基的胺基化合物。具體而言，例如可列舉：使三聚氰胺與甲醛進行縮聚而成之三聚氰胺樹脂；使苯胍胺與甲醛進行縮聚而成之苯胍胺樹脂；使甘脲與甲醛進行縮聚而成之甘脲樹脂；使脲與甲醛進行縮聚而成之脲樹脂；使三聚氰胺、苯胍胺、甘脲、或脲等之2種以上與甲醛進行共縮聚而成之樹脂；上述樹脂之羥甲基經醇縮合改性而成之改性樹脂等。其等可單獨使用1種，亦可將2種以上併用。作為胺基化合物，其中，較佳為三聚氰胺樹脂及其改性樹脂，進而較佳為羥甲基之改性比例為70%以上之改性樹脂，尤佳為80%以上之改性樹脂。 作為上述胺基化合物之具體例，作為三聚氰胺樹脂及其改性樹脂，例如可列舉：Cytec公司製造之「Cymel」(註冊商標)300、301、303、350、736、738、370、771、325、327、703、701、266、267、285、232、235、238、1141、272、254、202、1156、1158、及三和化學公司製造之「NIKALAC」(註冊商標)MW-390、MW-100LM、MX-750LM、MW-30M、MX-45、MX-302等。又，作為上述苯胍胺樹脂及其改性樹脂，例如可列舉：Cytec公司製造之「Cymel」(註冊商標)1123、1125、1128等。又，作為上述甘脲樹脂及其改性樹脂，例如可列舉：Cytec公司製造之「Cymel」(註冊商標)1170、1171、1174、1172、及三和化學公司製造之「NIKALAC」(註冊商標)MX-270等。又，作為上述脲樹脂及其改性樹脂，例如可列舉：Cytec公司製造之「UFR」(註冊商標)65、300、及三和化學公司製造之「NIKALAC」(註冊商標)MX-290等。 [1-1-10]著色劑 於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，為了使阻隔壁著色，亦可含有著色劑。作為著色劑，可使用顏料、染料等公知之著色劑。又，例如於使用顏料時，亦可併用公知之分散劑或分散助劑，以使該顏料不會凝集而能夠穩定地存在於感光性樹脂組合物中。尤其是藉由將撥液性阻隔壁著色為黑色，而有獲得清晰之像素顯示之效果。作為黑色著色劑，除黑色染料或黑色顏料、碳黑、鈦黑等以外，作為保持低導電性之效果，混合有機顏料而著色為黑色之情況亦有效。作為著色劑之含有比例，就製版性與顏色特性之觀點而言，相對於感光性樹脂組合物之全部固形物成分，通常為60質量%以下，較佳為40質量%以下。 另一方面，為了減少來自阻隔壁之釋氣產生量，較理想為將阻隔壁設為透明，關於該情形時之著色劑之含有比例，相對於感光性樹脂組合物之全部固形物成分，較佳為10質量%以下，更佳為5質量%以下，尤佳為0質量%。 [1-1-11]塗佈性提高劑、顯影改良劑 於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，為了提高塗佈性或顯影溶解性，而亦可含有塗佈性提高劑或顯影改良劑。作為塗佈性提高劑或顯影改良劑，例如可使用公知之陽離子性、陰離子性、非離子性、氟系、聚矽氧系界面活性劑。又，亦可使用有機羧酸或其酸酐等公知者作為顯影改良劑。又，關於其含有比例，就感度之觀點而言，相對於感光性樹脂組合物之全部固形物成分，通常為20質量%以下，較佳為10質量%以下。 [1-1-12]矽烷偶合劑 於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，為了改善與基板之密接性，亦較佳為添加矽烷偶合劑。作為矽烷偶合劑之種類，可使用環氧系、甲基丙烯酸系、胺基系、咪唑系等各種者，就密接性提高之觀點而言，尤佳為環氧系、咪唑系之矽烷偶合劑。關於其含有比例，就密接性之觀點而言，相對於感光性樹脂組合物之全部固形物成分，通常為20質量%以下，較佳為15質量%以下。 [1-1-13]磷酸系密接提高劑 於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物中，為了改善與基板之密接性，亦較佳為添加磷酸系密接提高劑。作為磷酸系密接提高劑，較佳為含(甲基)丙烯醯氧基之磷酸酯類，其中，較佳為下述通式(Va)、(Vb)、(Vc)所表示者。 [化60]

上述通式(Va)、(Vb)、(Vc)中，R⁸ 表示氫原子或甲基，r及r'分別獨立為1〜10之整數，s為1、2或3。 [1-1-14]無機填充劑 又，本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物亦可進而含有無機填充劑，其目的在於：提高作為硬化物之強度，並且提高因與鹼溶性樹脂之適度相互作用(形成基質結構)而產生之塗佈膜之優異平坦性、及提高傾斜角等。作為此種無機填充劑，例如可列舉：滑石、二氧化矽、氧化鋁、硫酸鋇、氧化鎂、或者利用各種矽烷偶合劑對該等進行表面處理而成者等。 作為該等無機填充劑之平均粒徑，通常為0.005〜20 μm，較佳為0.01〜10 μm。此處，本實施形態中所謂平均粒徑係利用Beckman Coulter公司製造等之雷射繞射散射粒度分佈測定裝置所測得之值。該等無機填充劑中，尤其是矽溶膠及矽溶膠改性物有分散穩定性與傾斜角提高效果均優異之傾向，故而較佳地調配。於本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物包含該等無機填充劑之情形時，作為其含量，就感度之觀點而言，相對於全部固形物成分，通常為5質量%以上，較佳為10質量%以上，通常為80質量%以下，較佳為70質量%以下。 [1-1-15]溶劑 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物通常含有溶劑，且係於使上述各成分溶解或分散於溶劑中之狀態下使用(以下，有將包含溶劑之感光性樹脂組合物記載為「感光性樹脂組合物溶液」之情況)。作為該溶劑，並無特別限制，例如可列舉以下所記載之有機溶劑。 即，可列舉：乙二醇單甲醚、乙二醇單乙醚、乙二醇單丙醚、乙二醇單丁醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單正丁醚、丙二醇第三丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇單正丁醚、甲氧基乙基戊醇、二丙二醇單乙醚、二丙二醇單甲醚、3-甲基-3-甲氧基丁醇、3-甲氧基-1-丁醇、三乙二醇單甲醚、三乙二醇單乙醚、三丙二醇甲醚等二醇單烷基醚類；乙二醇二甲醚、乙二醇二乙醚、二乙二醇二甲醚、二乙二醇二乙醚、二乙二醇二丙醚、二乙二醇二丁醚、二丙二醇二甲醚等二醇二烷基醚類；乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、乙二醇單正丁醚乙酸酯、丙二醇單甲醚乙酸酯、丙二醇單乙醚乙酸酯、丙二醇單丙醚乙酸酯、丙二醇單丁醚乙酸酯、乙酸甲氧基丁酯、乙酸3-甲氧基丁酯、乙酸甲氧基戊酯、二乙二醇單甲醚乙酸酯、二乙二醇單乙醚乙酸酯、二乙二醇單正丁醚乙酸酯、二丙二醇單甲醚乙酸酯、三乙二醇單甲醚乙酸酯、三乙二醇單乙醚乙酸酯、乙酸3-甲基-3-甲氧基丁酯、乙酸3-甲氧基-1-丁酯等二醇烷基醚乙酸酯類；乙二醇二乙酸酯、1,3-丁二醇二乙酸酯、1,6-己醇二乙酸酯等二醇二乙酸酯類；環己醇乙酸酯等乙酸烷基酯類；戊醚、二乙醚、二丙醚、二異丙醚、二丁醚、二戊醚、乙基異丁醚、二己醚等醚類；丙酮、甲基乙基酮、甲基戊基酮、甲基異丙基酮、甲基異戊基酮、二異丙基酮、二異丁基酮、甲基異丁基酮、環己酮、乙基戊基酮、甲基丁基酮、甲基己基酮、甲基壬基酮、甲氧基甲基戊酮等酮類；甲醇、乙醇、丙醇、丁醇、己醇、環己醇、乙二醇、丙二醇、丁二醇、二乙二醇、二丙二醇、三乙二醇、甲氧基甲基戊醇、甘油、苄醇等一元或多元醇類；正戊烷、正辛烷、二異丁烯、正己烷、己烯、異戊二烯、雙戊烯、十二烷等脂肪族烴類；環己烷、甲基環己烷、甲基環己烯、雙環己基等脂環式烴類；苯、甲苯、二甲苯、異丙苯等芳香族烴類；甲酸戊酯、甲酸乙酯、乙酸乙酯、乙酸丁酯、乙酸丙酯、乙酸戊酯、異丁酸甲酯、乙二醇乙酸酯、丙酸乙酯、丙酸丙酯、丁酸丁酯、丁酸異丁酯、異丁酸甲酯、辛酸乙酯、硬脂酸丁酯、苯甲酸乙酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸乙酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-甲氧基丙酸丙酯、3-甲氧基丙酸丁酯、γ-丁內酯等鏈狀或環狀醚類；3-甲氧基丙酸、3-乙氧基丙酸等烷氧基羧酸類；丁基氯、戊基氯等鹵化烴類；甲氧基甲基戊酮等醚酮類；乙腈、苯甲腈等腈類；四氫呋喃、二甲基四氫呋喃、二甲氧基四氫呋喃等四氫呋喃類等。 作為符合上述例示之市售溶劑，可列舉：礦油精、BARSOL#2、Apco#18溶劑、Apco稀釋劑、Socal溶劑No.1及No.2、Solvesso#150、Shell TS28溶劑、卡必醇、乙基卡必醇、丁基卡必醇、甲基溶纖劑、乙基溶纖劑、乙基溶纖劑乙酸酯、甲基溶纖劑乙酸酯、二乙二醇二甲醚(均為商品名)等。 上述溶劑係可使感光性樹脂組合物中之各成分溶解或分散者，且係根據本發明之感光性樹脂組合物之使用方法而選擇，就塗佈性之觀點而言，較佳為選擇大氣壓下(1013.25 hPa)之沸點為60〜280℃之範圍者。更佳為具有70℃以上且260℃以下之沸點者，例如較佳為丙二醇單甲醚、3-甲氧基-1-丁醇、丙二醇單甲醚乙酸酯、乙酸3-甲氧基-1-丁酯。 該等溶劑可單獨使用1種或者將2種以上混合而使用。又，該等溶劑較佳為以感光性樹脂組合物溶液中之全部固形物成分之比例成為通常10質量%以上、較佳為15質量%以上、更佳為20質量%以上，且通常90質量%以下、較佳為50質量%以下、更佳為40質量%以下、進而較佳為30質量%以下之方式使用。藉由設為上述下限值以上，而有即便對於較高之膜厚亦可獲得塗膜之傾向，又，藉由設為上述上限值以下，而有獲得適度之塗佈均一性之傾向。 [1-2]有機電致發光元件阻隔壁形成用感光性樹脂組合物之物性 作為本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物之物性，例如可列舉酸值。有機電致發光元件阻隔壁形成用感光性樹脂組合物之相對於全部固形物成分之酸值並無特別限定，較佳為20 mgKOH/g以上，更佳為22 mgKOH/g以上，進而較佳為24 mgKOH/g以上，進而更佳為26 mgKOH/g以上，尤佳為28 mgKOH/g以上，又，通常為60 mgKOH/g以下，較佳為55 mgKOH/g以下，更佳為50 mgKOH/g以下，進而較佳為40 mgKOH/g以下，尤佳為35 mgKOH/g以下。藉由設為上述下限值以上，有於顯影液中之溶解性較高而可將未曝光部充分地溶解、去除，藉此傾斜角變大之傾向，又，藉由設為上述上限值以下，而有顯影密接性變良好之傾向。 [1-3]有機電致發光元件阻隔壁形成用感光性樹脂組合物之製備方法 本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物係藉由利用攪拌機將上述各成分進行混合而製備。再者，亦可使用膜濾器等進行過濾以使所製備之感光性樹脂組合物成為均一者。 [2]阻隔壁及阻隔壁之形成方法 本發明之感光性樹脂組合物可用以形成阻隔壁、尤其是用以劃分有機電致發光元件之有機層(發光部)之阻隔壁。 使用以上所說明之有機電致發光元件阻隔壁形成用感光性樹脂組合物而形成阻隔壁(障壁)之方法並無特別限定，可採用先前公知之方法。作為阻隔壁之形成方法，例如可列舉：包含將有機電致發光元件阻隔壁形成用感光性樹脂組合物塗佈於基板上而形成感光性樹脂組合物層之塗佈步驟；與對感光性樹脂組合物層進行曝光之曝光步驟的方法。作為此種阻隔壁之形成方法之具體例，可列舉光微影法。 光微影法中，將有機電致發光元件阻隔壁形成用感光性樹脂組合物塗佈於基板之供形成阻隔壁之區域整面而形成感光性樹脂組合物層。視特定之阻隔壁之圖案而對所形成之感光性樹脂組合物層曝光後，將被曝光之感光性樹脂組合物層進行顯影，而於基板上形成阻隔壁。 於光微影法中之將感光性樹脂組合物塗佈於基板上之塗佈步驟中，於應形成阻隔壁之基板上，使用輥式塗佈機、反向塗佈機、棒式塗佈機等接觸轉印型塗佈裝置或旋轉塗佈機(旋轉式塗佈裝置)、淋幕式平面塗裝機等非接觸型塗佈裝置塗佈感光性樹脂組合物，視需要藉由乾燥將溶劑去除，而形成感光性樹脂組合物層。 繼而，於曝光步驟中，利用負型之遮罩，對感光性樹脂組合物照射紫外線、準分子雷射光等活性能量線，視阻隔壁之圖案而對感光性樹脂組合物層進行局部曝光。曝光中，可使用高壓水銀燈、超高壓水銀燈、氙氣燈、碳弧燈等發出紫外線之光源。曝光量係根據感光性樹脂組合物之組成而亦有不同，例如較佳為10〜400 mJ/cm² 左右。 繼而，於顯影步驟中，藉由利用顯影液將視阻隔壁之圖案進行曝光所得之感光性樹脂組合物層進行顯影而形成阻隔壁。顯影方法並無特別限定，可使用浸漬法、噴霧法等。作為顯影液之具體例，可列舉：二甲基苄胺、單乙醇胺、二乙醇胺、三乙醇胺等有機系者、或者氫氧化鈉、氫氧化鉀、碳酸鈉、氨、四級銨鹽等之水溶液。又、亦可於顯影液中添加消泡劑或界面活性劑。 其後，對於顯影後之阻隔壁實施後烘烤而進行加熱硬化。後烘烤較佳為於150〜250℃下進行15〜60分鐘。 阻隔壁之形成所使用之基板並無特別限定，係根據使用形成有阻隔壁之基板而製造之有機電致發光元件之種類而適當選擇。作為較佳之基板之材料，可列舉玻璃、或各種樹脂材料。作為樹脂材料之具體例，可列舉：聚對苯二甲酸乙二酯等聚酯；聚乙烯、及聚丙烯等聚烯烴；聚碳酸酯；聚(甲基)甲基丙烯酸樹脂；聚碸；聚醯亞胺。其等基板之材料中，就耐熱性優異之方面而言，較佳為玻璃、及聚醯亞胺。又，亦可視所製造之有機電致發光元件之種類，而預先於供形成阻隔壁之基板之表面設置ITO或ZnO等透明電極層。 [3]有機電致發光元件 本發明之有機電致發光元件具備由上述之有機電致發光元件阻隔壁形成用感光性樹脂組合物所構成之阻隔壁。 使用具備藉由以上說明之方法而製造之阻隔壁圖案之基板，而製造各種光學元件。形成有機電致發光元件之方法並無特別限定，較佳為：藉由上述方法而於基板上形成阻隔壁圖案後，向基板上之由阻隔壁包圍之區域內注入墨水而形成像素等有機層，藉此製造有機電致發光元件。 作為有機電致發光元件之類型，可列舉：底部發光型或頂部發光型。 關於底部發光型，係例如於積層有透明電極之玻璃基板上形成阻隔壁，於由阻隔壁包圍之開口部積層電洞傳輸層、發光層、電子傳輸層、金屬電極層而進行製造。另一方面，關於頂部發光型，係例如於積層有金屬電極層之玻璃基板上形成阻隔壁，於由阻隔壁包圍之開口部積層電子傳輸層、發光層、電洞傳輸層、透明電極層而進行製造。 再者，作為發光層，可列舉：如日本專利特開2009-146691號公報或日本專利第5734681號公報所記載之有機電致發光層。又，亦可使用如日本專利第5653387號公報或日本專利第5653101號公報所記載之量子點。 於阻隔壁之傾斜角較小且阻隔壁之下部為如圖1之裙狀底部形狀之情形時，即便於該部分之上部製作蒸鍍層亦不會發光，因此發光面積變低。又，於以噴墨方式製作發光層之情形時，有機層形成用墨水會被阻隔壁之裙狀部分排斥，因此有由阻隔壁包圍之區域內不會被有機層形成用墨水均一地被覆之情形。相對於此，藉由製成傾斜角較大且無裙狀底部之良好形狀，而可使由阻隔壁包圍之區域內發光，又，於噴墨方式中，可藉由有機層形成用墨水而均一地被覆。藉此，例如可解決有機EL顯示元件中之暈光問題。 作為形成有機層形成用墨水時所使用之溶劑，可使用水、有機溶劑、及其等之混合溶劑。有機溶劑只要能夠自注入墨水後所形成之皮膜去除，則無特別限定。作為有機溶劑之具體例，可列舉：甲苯、二甲苯、苯甲醚、均三甲苯、四氫萘、環己基苯、丙酮、甲基乙基酮、甲基異丁基酮、環己酮、甲醇、乙醇、異丙醇、乙酸乙酯、及乙酸丁酯、3-苯氧基甲苯等。又，於墨水中，可添加界面活性劑、抗氧化劑、黏度調整劑、紫外線吸收劑等。 作為向由阻隔壁包圍之區域內注入墨水之方法，就能夠容易地將少量之墨水向特定部位注入之方面而言，較佳為噴墨法。有機層之形成所使用之墨水係視所製造之有機電致發光元件之種類而適當選擇。於藉由噴墨法注入墨水之情形時，關於墨水之黏度，只要能夠自噴墨頭良好地噴出墨水，則無特別限定，較佳為4〜20 mPa·s，更佳為5〜10 mPa·s。墨水之黏度可藉由墨水中之固形物成分含量之調整、溶劑之變更、及黏度調整劑之添加等而進行調整。 [4]圖像顯示裝置 本發明之圖像顯示裝置係包含上述有機電致發光元件者。只要為包含有機電致發光元件者，則圖像顯示裝置之外形或結構並無特別限制，例如可使用主動驅動型有機電致發光元件，依據常規方法而進行組裝。例如可利用如「有機EL顯示器」(歐姆社，2004年8月20日發行，時任靜士、安達千波矢、村田英幸著)所記載之方法而形成本發明之圖像顯示裝置。例如，可將發出白色光之有機電致發光元件與彩色濾光片組合而進行圖像顯示，亦可將RGB等發光色不同之有機電致發光元件組合而進行圖像顯示。 [5]照明 本發明之照明係包含上述之有機電致發光元件者。關於外形或結構，並無特別限制，可使用本發明之有機電致發光元件，依據常規方法而進行組裝。作為有機電致發光元件，可設為單純矩陣驅動方式，亦可設為主動矩陣驅動方式。 為了使本發明之照明為發出白色光者，而亦可使用發出白色光之有機電致發光元件。又，可將發光色不同之有機電致發光元件組合，以各色進行混色而成為白色之方式進行構成，亦可以能夠調整混色比率之方式進行構成而賦予調色功能。 實施例 以下，針對第1態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物，列舉具體之實施例進行說明，但本發明只要不超出其主旨，則並不限定於以下之實施例。 [1]有機電致發光元件阻隔壁形成用感光性樹脂組合物之製備及評價 以表1所記載之調配比例(質量份)使用各成分，且以全部固形物成分之含有比例成為25質量%之方式使用丙二醇單甲醚乙酸酯，將各成分進行攪拌直至變得均一，而製備實施例及比較例之有機電致發光元件阻隔壁形成用感光性樹脂組合物。再者，表1中之數值意指固形物成分之值。 再者，表中之符號係表示以下者。 a-1：二季戊四醇六丙烯酸酯(DPHA)(日本化藥公司製造) b-1：2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑(保土谷化學公司製造) b-2：Irgacure 369(BASF公司製造，下述之化學結構之化合物) [化61]

d-1：MEGAFAC RS-72-K(DIC公司製造，氟系，具有乙烯性雙鍵之低聚物) e-1：2-巰基苯并咪唑(東京化成公司製造) e-2：季戊四醇四(3-巰基丙酸酯)(澱化學公司製造) f-1：TINUVIN 384-2(BASF公司製造，紫外線吸收劑) g-1：KAYAMER PM-21(日本化藥公司製造) c-1：以下之含有乙烯性不飽和基之鹼溶性樹脂(相當於環氧(甲基)丙烯酸酯樹脂(c1-1)) 將下述式所表示之雙酚A型環氧化合物(環氧當量186 g/eq，式中之n為1〜20者之混合物)100質量份、丙烯酸40質量份、對甲氧基苯酚0.06質量份、三苯基膦2.4質量份、及丙二醇單甲醚乙酸酯126質量份添加於反應容器中，於95℃下進行攪拌直至酸值成為5 mgKOH/g以下。繼而，向藉由上述反應而獲得之反應液80質量份添加丙二醇單甲醚乙酸酯12質量份，添加琥珀酸酐4.5質量份，於95℃下反應3小時，而獲得固形物成分酸值為60 mgKOH/g且利用GPC所測得之聚苯乙烯換算之重量平均分子量(Mw)為8,000之鹼溶性樹脂(c-1)溶液。 [化62]

c-2：以下之丙烯酸系共聚合樹脂(相當於(c2)丙烯酸系共聚合樹脂) 使以三環癸烷甲基丙烯酸酯/苯乙烯/甲基丙烯酸縮水甘油酯(莫耳比：0.032/0.069/0.899)作為構成單體之共聚合樹脂與同甲基丙烯酸縮水甘油酯等量之丙烯酸進行加成反應，進而以相對於上述共聚合樹脂1莫耳成為莫耳比0.24之方式加成琥珀酸酐，而獲得鹼溶性之丙烯酸系共聚合樹脂(c-2)溶液。溶劑係丙二醇單甲醚乙酸酯。利用GPC所測得之聚苯乙烯換算之重量平均分子量(Mw)為4,800，固形物成分酸值為62.1 mgKOH/g。 c-3：以下之丙烯酸系共聚合樹脂 使以三環癸烷甲基丙烯酸酯/苯乙烯/甲基丙烯酸縮水甘油酯(莫耳比：0.3/0.1/0.6)作為構成單體之共聚合樹脂與同甲基丙烯酸縮水甘油酯等量之丙烯酸進行加成反應，進而以相對於上述共聚合樹脂1莫耳成為莫耳比0.39之方式加成四氫鄰苯二甲酸酐，而獲得鹼溶性之丙烯酸系共聚合樹脂(c-3)溶液。溶劑係丙二醇單甲醚乙酸酯。利用GPC所測得之聚苯乙烯換算之重量平均分子量(Mw)為8,400，固形物成分酸值為81.4 mgKOH/g。 有機電致發光元件阻隔壁形成用感光性樹脂組合物之物性評價係利用以下所記載之方法進行。 (酸值之測定) 酸值可利用JIS K0070-1992所記載之方法進行測定。感光性樹脂組合物之酸值除直接測定感光性樹脂組合物以外，亦可自樹脂等含酸基之成分之酸值與含量算出。 (氣體量之測定) 使用旋轉塗佈機，將各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.7 μm之厚度之方式塗佈於玻璃基板上。其後於加熱板上以95℃加熱乾燥2分鐘，針對所獲得之塗膜，不使用遮罩而以曝光量100 mJ/cm² 進行整面曝光。此時之波長365 nm下之強度為7.5 mW/cm² 。進而，利用24℃之2.38質量%TMAH(氫氧化四甲基銨)水溶液進行60秒鐘噴射顯影後，利用純水進行10秒鐘洗淨。使該基板於烘箱中以230℃加熱硬化30分鐘，而獲得附帶硬化物之氣體量測定用基板。 利用GC/MS(Agilent Technologies公司製造，商品名「5973N」)，對將所製作之氣體量測定用基板(40 mm×8 mm，4片)於加熱爐內以230℃進行過20分鐘加熱時之釋氣進行分析，計算出所檢測到之波峰全部成分之面積之總和。但是，將源自TMAH(氫氧化四甲基銨)水溶液之對應於四甲基銨之波峰除外以進行計算。繼而，根據所檢測到之峰面積之總和，使用校準曲線換算為甲苯量，除以所測得之基板面積，而算出每單位面積之甲苯換算之釋氣量(ng/cm² )。將結果示於表1中。再者，校準曲線係使用濃度已知之甲苯，測定GC/MS，繪製甲苯量與檢測到之氣體之峰面積值，從而製作校準曲線。 (接觸角之測定) 使用旋轉塗佈機，將各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.7 μm之厚度之方式塗佈於玻璃基板上。其後，於加熱板上以95℃加熱乾燥2分鐘，針對所獲得之塗膜，不使用遮罩而以曝光量100 mJ/cm² 進行整面曝光。此時之波長365 nm下之強度為7.5 mW/cm² 。繼而，利用24℃之2.38質量%TMAH(氫氧化四甲基銨)水溶液進行60秒鐘噴射顯影後，利用純水進行10秒鐘洗淨。使該基板於烘箱中以230℃進行30分鐘加熱硬化，而獲得附帶硬化物之接觸角測定用基板。 接觸角之測定係藉由協和界面科學股份有限公司製造之Drop Master500接觸角測定裝置，於23℃濕度50%之條件下進行。於接觸角測定用基板之硬化物上滴下丙二醇甲醚乙酸酯0.7 μL，測定1秒鐘後之接觸角。將測定結果記載於表1中。接觸角較大係表示撥液性較高。 [2]阻隔壁之形成及評價 利用以下所記載之方法進行阻隔壁之形成與性能評價。 (阻隔壁之形成) 使用旋轉塗佈機，將各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.7 μm之厚度之方式塗佈於在表面形成有ITO膜之玻璃基板之該ITO膜上。其後，於加熱板上以95℃加熱乾燥2分鐘，使用光罩(以10 μm間隔具有複數個80 μm×280 μm之被覆部之遮罩)，於曝光間隙16 μm下，使用波長365 nm下之強度為7.5 mW/cm² 之紫外線，以曝光量成為100 mJ/cm² 之方式對所獲得之塗膜進行曝光。此時之紫外線照射係於空氣下進行。繼而，利用24℃之2.38質量%TMAH(氫氧化四甲基銨)水溶液進行60秒鐘噴射顯影後，利用純水進行1分鐘洗淨。將藉由其等操作將不需要之部分去除而形成有圖案之基板於烘箱中以230℃進行30分鐘加熱硬化，而形成格子狀之阻隔壁。 (阻隔壁之傾斜角及線寬之評價) 將上述格子狀之阻隔壁進行切割而製作剖面觀察用之樣品，使用掃描式電子顯微鏡(SEM，基恩士公司製造)觀察阻隔壁之剖面形狀，測定其傾斜角。將測定結果記載於表1中。關於阻隔壁之剖面形狀，觀察到呈大致台形狀。 於該剖面圖中，如圖1般將阻隔壁1與ITO膜2之交界面設為S，將阻隔壁之高度設為H。於阻隔壁之斜邊上，將交界面S與和其相接之斜邊之切線設為T，測定切線T與交界面S所成之角度，而設為傾斜角。有傾斜角越大，顯影性越良好且殘渣越難以產生之傾向，於噴墨塗佈中，有更容易潤濕擴散之傾向。 (阻隔壁之噴墨塗佈適應性評價) 於具有上述格子狀之阻隔壁之基板上，對於由格子狀之阻隔壁包圍之像素部分，利用Fuji Film公司製造之DMP-2831進行噴墨塗佈。作為墨水，單獨地使用溶劑(苯甲酸異戊酯)，且每1像素塗佈80 pL，而評價有無潰決(墨水越過阻隔壁而混入相鄰之像素部分之現象)。將評價結果記載於表1中。越不會潰決，則表示撥液性越高。 [潰決評價] 〇：可將墨水塗佈於像素內，且不會向阻隔壁外溢出。 △：墨水之一部分漫至阻隔壁之上表面，但基本上不會向阻隔壁外溢出。 ×：墨水自像素內於阻隔壁之上表面整面溢出而混入至相鄰之像素部分。(潰決) (阻隔壁之傾斜角及線寬之評價-2) 使用旋轉塗佈機，將實施例1、2之各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.7 μm之厚度之方式塗佈於在表面形成有ITO膜之玻璃基板之該ITO膜上。其後，於與上述相同之條件下，於加熱板上進行加熱乾燥而獲得塗膜，對於該塗膜，使用光罩(以40 μm間隔具有複數個80 μm×280 μm之被覆部之遮罩)，除此以外，進行同樣之曝光、顯影、加熱硬化，而形成格子狀之阻隔壁。 以與上述相同之方式，使用掃描式電子顯微鏡(SEM，基恩士公司製造)觀察阻隔壁之剖面形狀，測定其傾斜角及線寬，結果為，實施例1、2之傾斜角分別為29°、20°，線寬係實施例1、2均為40 μm。又，測定阻隔壁之下部之開口寬度(橫寬、縱寬)，將其等相乘，藉此算出開口部之面積，結果為，實施例1、2均為100%。再者，開口部之面積係相對於所對應之遮罩遮蔽部之面積之相對值。傾斜角越小，阻隔壁之線寬變得越大，而開口部之面積變得越小。 [表1] 表1    (質量份)    實施例 1 實施例 2 實施例 3 實施例 4 實施例 5 比較例 1 比較例 2 組成物調配比例(質量份)※ (A)乙烯性不飽和化合物 a-1 46.7 46.7 47.2 47.2 47.2 46.7 47.7 (B)光聚合起始劑 b-1 2.0 2.0 2.0 2.0    2.0    b-2             2.0    2.0 (C)鹼溶性樹脂 c-1    46.7 47.2 47.2 47.2    47.7 c-2 46.7                   c-3                46.7    (D)撥液劑 d-1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 (E)鏈轉移劑 e-1 1.0 1.0 1.0       1.0    e-2 1.0 1.0    1.0 1.0 1.0    紫外線吸收劑 f-1 2.0 2.0 2.0 2.0 2.0 2.0 2.0 添加劑 g-1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 評價結果 釋氣量(ng/cm² ) 42.2 1.3 0.7 1.1 9.7 195.7 1.1 傾斜角度(°) 17 47 37 20 27 20 11 接觸角(°) 35 46 47 43 43 4 4 噴墨塗佈評價 〇 〇 △ △ 〇 × × ※調配比例係表示各成分之固形物成分相對於全部固形物成分之調配比。 根據表1可知，如實施例1〜5般使用包含加成有琥珀酸之鹼溶性樹脂(c-1)及(c-2)之阻隔壁形成用感光性樹脂組合物而獲得之基板的釋氣量大幅地少於如比較例1般使用包含加成有四氫鄰苯二甲酸之鹼溶性樹脂(c-3)之阻隔壁形成用感光性樹脂組合物而獲得之基板的釋氣量。 據此確認到如下情況：包含加成有如琥珀酸般碳鏈較短之酸之鹼溶性樹脂之阻隔壁形成用感光性樹脂組合物與包含加成有如四氫鄰苯二甲酸般碳鏈較長之酸之鹼溶性樹脂的阻隔壁形成用感光性樹脂組合物相比，由230℃30分鐘之後烘烤引起之加熱硬化後之釋氣量變少，進而於230℃加熱之氣體測定條件下釋氣量變少。認為其原因在於：如琥珀酸之碳鏈較短之酸於後烘烤時基本上被分解去除，即便其後進而進行230℃加熱，源自酸之氣體亦不會產生。 又，根據表1可知，如實施例5般包含鏈轉移劑之感光性樹脂組合物與如比較例2般不包含鏈轉移劑之感光性樹脂組合物相比，傾斜角充分地變大。認為藉由包含鏈轉移劑，而改善由氧抑制等引起之於表面附近之自由基失活而表面硬化性變高，而傾斜角變大。 又，可知即便於亦使接觸角充分變大之噴墨塗佈中，亦不會引起潰決而能夠塗佈。認為其原因在於：藉由包含鏈轉移劑，而提高表面硬化性，藉此可抑制撥液劑之流出，而將撥液劑固定在表面附近。 進而，根據實施例2〜4之比較可知，於即便接觸角同等傾斜角亦更大之情形時，於阻隔壁側面墨水欲向阻隔壁外擴散之力(表面能量)變小，又，即便為經細線化之阻隔壁，阻隔壁上部之表面硬化性亦更高，撥液劑亦可更加固定於表面附近，作為其結果，噴墨塗佈適應性變得更良好。 根據實施例1與2之比較，相對於(c2)丙烯酸系共聚合樹脂，鹼性顯影液更難以滲透(c1)環氧(甲基)丙烯酸酯樹脂，因此認為與實施例1相比，實施例2之傾斜角較大。 以下，針對第2態樣之本發明之有機電致發光元件阻隔壁形成用感光性樹脂組合物，列舉具體之實施例進行說明，但本發明只要不超出其主旨，則並不限定於以下之實施例。 [I]阻隔壁形成用感光性樹脂組合物之製備 以表2所記載之調配比例(質量份)使用各成分，且以全部固形物成分之含有比例成為25質量%之方式使用丙二醇單甲醚乙酸酯，將各成分進行攪拌直至變得均一，而製備實施例及比較實施例之阻隔壁形成用感光性樹脂組合物。 再者，表中之符號係表示以下者。 a-11：以下之乙烯性不飽和化合物之混合物[(A1)具有酸基之乙烯性不飽和化合物與(A2)不具有酸基之乙烯性不飽和化合物之混合物] 使季戊四醇三丙烯酸酯與季戊四醇四丙烯酸酯之混合物(羥值113 mgKOH/g)490質量份於鄰苯二甲酸酐148質量份、三乙胺2.5質量份、及對苯二酚0.25質量份之存在下以100℃進行5小時反應，而獲得下述所示之將季戊四醇三丙烯酸酯之鄰苯二甲酸酐改性物與季戊四醇四丙烯酸酯以70：30(質量比)含有之混合物a-11。 [化63]

a-12：以下之乙烯性不飽和化合物之混合物[(A1)具有酸基之乙烯性不飽和化合物與(A2)不具有酸基之乙烯性不飽和化合物之混合物] 使季戊四醇三丙烯酸酯與季戊四醇四丙烯酸酯之混合物(羥值100 mgKOH/g)561質量份於琥珀酸酐100質量份、三乙胺2.5質量份、及對苯二酚0.25質量份之存在下以100℃進行5小時反應，而獲得下述所示之將季戊四醇三丙烯酸酯之琥珀酸酐改性物與季戊四醇四丙烯酸酯以60：40(質量比)含有之混合物a-12。 [化64]

a-13：以下之乙烯性不飽和化合物之混合物[(A1)具有酸基之乙烯性不飽和化合物與(A2)不具有酸基之乙烯性不飽和化合物之混合物] 使二季戊四醇五丙烯酸酯與二季戊四醇六丙烯酸酯之混合物(羥值51 mgKOH/g)1,000質量份於琥珀酸酐49質量份、三乙胺2.5質量份、及對苯二酚0.25質量份之存在下以100℃進行5小時反應，而獲得下述所示之將二季戊四醇五丙烯酸酯之琥珀酸酐改性物與二季戊四醇五丙烯酸酯與二季戊四醇六丙烯酸酯以25：25：50(質量比)含有之混合物a-13。 [化65]

a-14：季戊四醇四丙烯酸酯(PE-4A)(共榮社化學公司製造) b-1：2,2'-雙(2-氯苯基)-4,4',5,5'-四苯基-1,2'-聯咪唑(保土谷化學工業公司製造) c-4：以下之含有乙烯性不飽和基之樹脂(環氧丙烯酸酯樹脂) 將下述式所表示之雙酚A型環氧化合物(環氧當量186 g/eq，式中之n為1〜20者之混合物)100質量份、丙烯酸40質量份、對甲氧基苯酚0.06質量份、三苯基膦2.4質量份、丙二醇單甲醚乙酸酯126質量份添加於反應容器中，於95℃下進行攪拌直至酸值成為5 mgKOH/g以下。繼而，向藉由上述反應而獲得之反應液80質量份添加丙二醇單甲醚乙酸酯3質量份，添加琥珀酸酐3質量份，於95℃下反應3小時，而獲得固形物成分酸值為40 mgKOH/g且利用GPC所測得之聚苯乙烯換算之重量平均分子量(Mw)為8,000之鹼溶性樹脂(c-4)溶液。 [化66]

d-1：MEGAFAC RS-72-K(DIC公司製造，氟系，具有乙烯性雙鍵之低聚物) e-1：2-巰基苯并咪唑(東京化成公司製造) e-2：季戊四醇四(3-巰基丙酸酯)(澱化學公司製造) f-1：TINUVIN384-2(BASF公司製造，紫外線吸收劑) g-1：KAYAMER PM-21(日本化藥公司製造) [表2] 表2                                                                                                                                     (質量份)    實施例1 實施例2 實施例3 實施例4 比較 實驗例1 比較 實驗例2    (A)乙烯性不飽和化合物 a-11 30 19       52    a-12       22          a-13          52       a-14 22 33 30       52 (B)光聚合起始劑 b-1 2 2 2 2 2 2 (C)鹼溶性樹脂 c-4 42 42 42 42 42 42 (D)撥液劑 d-1 0.1 0.1 0.1 0.1 0.1 0.1 鏈轉移劑 e-1 1 1 1 1 1 1 e-2 1 1 1 1 1 1 紫外線吸收劑 f-1 2 2 2 2 2 2 添加劑 g-1 0.5 0.5 0.5 0.5 0.5 0.5 全部固形物成分中之具有酸基之乙烯性不飽和化合物之比例 21% 13% 13% 13% 36% 0% 乙烯性不飽和化合物中之具有酸基之乙烯性不飽和化合物之比例 40% 26% 25% 25% 70% 0% 評價結果 最小曝光量(mJ/cm² ) 100 100 100 100 200 100 釋氣量(ng/cm² ) 49 49 40 33 100 58 噴墨塗佈適應性評價 〇 〇 〇 〇 〇 × [II]硬化物及阻隔壁之形成、以及其等之評價 於以下對各感光性樹脂組合物之性能評價之方法進行說明。 (接觸角測定用基板之製作) 每種阻隔壁形成用感光性樹脂組合物準備10片基板，該等基板係使用旋轉塗佈機，將各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.5 μm之厚度之方式塗佈於在表面形成有ITO膜之玻璃基板之該ITO膜上而獲得。其後於加熱板上以100℃加熱乾燥2分鐘，針對所獲得之塗膜，不使用遮罩，並每種基板將曝光量於50〜500 mJ/cm² 之範圍內每隔50 mJ/cm² 進行變更以進行曝光。此時之波長365 nm下之強度為40 mW/cm² 。繼而，利用24℃之2.38質量%TMAH(氫氧化四甲基銨)水溶液進行60秒鐘噴射顯影後，利用純水進行10秒鐘洗淨。使該基板於烘箱中以230℃進行30分鐘加熱硬化，而獲得形成有硬化物之接觸角測定用基板。 (接觸角之評價) 根據組成物之感度而硬化性不同，因此產生撥液性之曝光量視組成而不同。此處所謂產生撥液性之曝光量，係表示所獲得之硬化物之接觸角成為10度以上之曝光量。使用上述接觸角測定用基板，對相對於丙二醇單甲醚乙酸酯之接觸角進行測定，特定出接觸角為10度以上之基板。將該等基板之製作時之曝光量中最小值以最小曝光量之形式記載於表2中。再者，接觸角係藉由協和界面科學股份有限公司製造之Drop Master 500接觸角測定裝置，於23℃且濕度50%之條件下測得。 (阻隔壁之製作) 使用旋轉塗佈機，將各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.5 μm之厚度之方式塗佈於在表面上形成有ITO膜之玻璃基板的該ITO膜上。其後，於加熱板上以100℃加熱乾燥2分鐘。對於所獲得之塗膜，使用光罩進行曝光。曝光量係產生撥液性之最小曝光量，且曝光間隙係設為16 μm。光罩係使用具有格子狀之開口部之遮罩(以40 μm間隔具有複數個80 μm×280 μm之被覆部之遮罩)。繼而，以與接觸角測定用基板製作相同之方式，利用TMAH水溶液進行顯影後，進行加熱硬化，而獲得格子狀之阻隔壁。 (噴墨塗佈適應性評價) 於具有上述格子狀之阻隔壁之基板上，對於由格子狀之阻隔壁包圍之發光部(像素部)，利用Fuji Film公司製造之DMP-2831進行噴墨塗佈。作為墨水，單獨地使用溶劑(苯甲酸異戊酯)，且每1像素塗佈40 pL，而評價潤濕擴散性。於像素部內全部區域越潤濕擴散，則表示阻隔壁製作時之殘渣等越少而顯影性越良好。 〇：墨水擴散至像素部內全部區域。 ×：未擴散有墨水之部分於像素部內局部產生。 (氣體量測定用基板之製作) 使用旋轉塗佈機，將各阻隔壁形成用感光性樹脂組合物以加熱硬化後成為1.5 μm之厚度之方式塗佈於在表面上形成有ITO膜之玻璃基板的該ITO膜上。其後，於加熱板上以100℃加熱乾燥2分鐘。對於所獲得之塗膜，不使用遮罩，以上述產生撥液性之最小曝光量進行曝光。此時之波長365 nm下之強度為40 mW/cm² 。繼而，以與接觸角測定用基板製作相同之方式，利用TMAH水溶液進行顯影後，於烘箱中以230℃進行30分鐘加熱硬化，而獲得形成有硬化物之氣體量測定用基板。 (氣體量之測定) 利用GC/MS(Agilent Technologies公司製造，商品名「5973N」)，對將所製作之氣體量測定用基板(40 mm×8 mm，4片)於加熱爐內以230℃進行過20分鐘加熱時之釋氣進行分析，計算出所檢測到之波峰全部成分之面積之總和。繼而，根據所檢測到之峰面積之總和，使用校準曲線換算為甲苯量，除以所測得之基板面積，而算出每單位面積之甲苯換算之釋氣量(ng/cm² )。再者，校準曲線係使用濃度已知之甲苯，測定GC/MS，繪製甲苯量與檢測到之氣體之峰面積值，從而製作校準曲線。 根據表2，自將具有酸基之乙烯性不飽和化合物以特定比率含有之各實施例之感光性樹脂組合物獲得的阻隔壁係噴墨塗佈適應性良好，且釋氣量較低。認為其原因在於：藉由使用溶解性優異之具有酸基之乙烯性不飽和化合物，而抑制像素部之殘渣產生從而噴墨特性提高，並且藉由將其調配量設為特定量以下，而可抑制源自酸基之釋氣產生。 另一方面，自包含大量具有酸基之乙烯性不飽和化合物之比較實施例1之感光性樹脂組合物獲得的阻隔壁雖噴墨塗佈適應性良好，但釋氣量較多，認為其原因在於：源自酸基之釋氣量較多。又，自不包含具有酸基之乙烯性不飽和化合物之比較實施例2之感光性樹脂組合物獲得之阻隔壁的噴墨塗佈適應性並不充分，認為其原因在於：於像素部產生了殘渣。 再者，關於噴墨塗佈適應性，墨水是否於像素部內全部區域擴散係起因於源自殘渣之撥液性是否於像素部內產生。因此，認為即便於使用苯甲酸異戊酯以外之溶劑之情形時，亦可獲得與上述實施例、比較實施例相同之結果。 已使用特定態樣對本發明詳細地進行了說明，但業者明確能夠不脫離本發明之意圖與範圍而進行各種變更及變化。再者，本申請案係基於在2016年9月5日提出申請之日本專利申請案(日本專利特願2016-172875)及在2017年2月17日提出申請之日本專利申請案(日本專利特願2017-028181)，藉由引用而援用其整體。Hereinafter, the present invention will be described in detail. In addition, the following description is an example of the embodiment of the present invention, and the present invention is not limited to them as long as it does not exceed the gist. Furthermore, in the present invention, the so-called "(meth)acrylic acid" means "acrylic acid and/or methacrylic acid", and the so-called "(meth)acrylate" means "acrylate and/or methacrylate" In addition, the term "all solid components" means all components in the photosensitive resin composition for forming barrier ribs of organic electroluminescence elements except for the solvent. Furthermore, in the present invention, the numerical range expressed using "~" means a range that includes the numerical values described before and after "~" as the lower limit and the upper limit. In addition, in the present invention, the so-called "(co)polymer" means to include both homopolymer and copolymer, and the so-called "(acid) anhydride" and "acid (anhydride)" mean It means to include both acid and its anhydride. In the present invention, "polybasic acid (anhydride)" means "polybasic acid and/or polybasic acid anhydride". In the present invention, the weight average molecular weight refers to the weight average molecular weight (Mw) converted from polystyrene by GPC (gel permeation chromatography). In the present invention, the term "barrier wall material" refers to a barrier rib material or wall material, and similarly, the term "barrier wall material" refers to a barrier rib or wall. In the present invention, the so-called light-emitting part refers to the part that emits light when electric energy is supplied. In the present invention, "mass" and "weight" have the same meaning. In the present invention, * in the chemical formula represents the bonding position. In the present invention, "larger inclination angle" has the same meaning as "higher inclination angle", and "smaller inclination angle" has the same meaning as "lower inclination angle". [1] Photosensitive resin composition for forming barrier ribs of organic electroluminescence element The first aspect of the photosensitive resin composition for forming organic electroluminescent element barrier ribs of the present invention is characterized in that it contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) Alkali-soluble resin, and the above-mentioned (C) alkali-soluble resin contains an alkali-soluble resin (c) having a partial structure represented by the following general formula (1), which is a photosensitive resin combination for forming barrier ribs of organic electroluminescence elements The product further contains (E) a chain transfer agent. Other components may be further contained as needed, for example, (D) liquid repellent or ultraviolet absorber may be contained. The second aspect of the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention is characterized in that it contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) a base Soluble resin, and the above-mentioned (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound with an acid group, and the content ratio of the above-mentioned (A1) an ethylenically unsaturated compound with an acid group in the total solid content is 30% by mass or less. Other components may be further contained as needed, for example, (D) liquid repellent, or (E) chain transfer agent, or ultraviolet absorber may be contained. Hereinafter, unless otherwise specified, the "photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention" refers to the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the first aspect described above , And the photosensitive resin composition for forming barrier ribs of organic electroluminescent element of the second aspect. The so-called barrier ribs in the present invention are, for example, those used to divide functional layers (organic layers, light-emitting parts) in active-drive organic electroluminescence devices, and are used to inject ink as a material for constituting the functional layer. Go to the divided area (pixel area) and dry it to form pixels including functional layers and barrier ribs. [1-1] Component and composition of photosensitive resin composition for forming barrier ribs of organic electroluminescence element The components and composition of the photosensitive resin composition for forming a barrier rib of an organic electroluminescent element of the present invention will be described. The photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention of the first aspect of the present invention (hereinafter, sometimes referred to as "the photosensitive resin composition of the first aspect") contains (A) an ethylenic compound The saturated compound, (B) photopolymerization initiator, and (C) alkali-soluble resin further contain (E) a chain transfer agent, and usually also contain a solvent. In addition, the photosensitive resin composition for forming barrier ribs for organic electroluminescence elements of the present invention of the first aspect is preferably used to form barrier ribs having liquid repellency, and from this viewpoint, it is preferable to contain (D) As the liquid repellent, as the above-mentioned components (A) to (C) and (E), it is also possible to use those exhibiting an effect as a liquid repellent. The second aspect of the photosensitive resin composition of the present invention for forming organic electroluminescent element barrier ribs (hereinafter, sometimes referred to simply as "the photosensitive resin composition of the second aspect") contains (A) an ethylenic compound A saturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin, and the above-mentioned (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the above (A1) has an acid group The content of the ethylenically unsaturated compound is 30% by mass or less in the total solid content, and it usually also contains a solvent. In addition, the photosensitive resin composition for forming barrier ribs for organic electroluminescent elements of the present invention of the second aspect is preferably used to form barrier ribs with liquid repellency. From this viewpoint, it is preferable to contain (D) As the liquid repellent, as the above-mentioned components (A) to (C), it is also possible to use those exhibiting an effect as a liquid repellent. [1-1-1] (A) component; ethylenically unsaturated compound The photosensitive resin composition for forming an organic electroluminescent element barrier rib of the present invention of the first aspect contains (A) an ethylenically unsaturated compound. It is thought that by containing (A) an ethylenically unsaturated compound, it will become high sensitivity. As used herein, the ethylenically unsaturated compound means a compound having one or more ethylenically unsaturated bonds in the molecule, and it is possible to expand the development of the exposed and non-exposed parts in terms of polymerizability, crosslinking properties, and In terms of the difference in liquid solubility, etc., a compound having two or more ethylenic unsaturated bonds in the molecule is preferred, and the unsaturated bond is more preferably derived from (meth)acryloyloxy , Namely (meth)acrylate compound. In the photosensitive resin composition for forming an organic electroluminescence element barrier rib of the first aspect of the present invention, it is particularly desirable to use a multifunctional ethylenic monomer having two or more ethylenic unsaturated bonds in one molecule. The number of ethylenically unsaturated groups possessed by the multifunctional ethylenic monomer is not particularly limited, and is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, particularly preferably 5 or more, and more preferably It is 15 or less, more preferably 10 or less, still more preferably 8 or less, and particularly preferably 7 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for polymerizability to improve and it becomes high sensitivity, and by setting it as below the said upper limit value, there exists a tendency for developability to become more favorable. Specific examples of ethylenically unsaturated compounds include: esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; Polyhydroxy compounds such as hydroxy compounds, esters obtained by esterification reaction with unsaturated carboxylic acids and polycarboxylic acids, etc. Examples of the esters of the above-mentioned aliphatic polyhydroxy compounds and unsaturated carboxylic acids include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, and trimethylolethane triacrylate. Acrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate and other aliphatic polyhydroxy compound acrylates, the The methacrylate obtained by replacing the acrylate of the exemplified compound with the methacrylate, the acrylate of the exemplified compound is replaced by the iconate of the exemplified compound, and the exemplified compound Acrylic acid ester is replaced by crotonic acid ester, or the acrylate of the exemplified compound is replaced by maleic acid ester, etc. Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include: hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethyl Acrylate and methacrylate of aromatic polyhydroxy compounds such as acrylate and pyrogallol triacrylate. The ester obtained by the esterification reaction of polyhydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polycarboxylic acids is not necessarily a single product. As a representative specific example, Examples: condensation products of acrylic acid, phthalic acid, and ethylene glycol; condensation products of acrylic acid, maleic acid, and diethylene glycol; condensation products of methacrylic acid, terephthalic acid, and pentaerythritol; acrylic acid, Condensates of adipic acid, butanediol and glycerin, etc. In addition, as an example of the polyfunctional ethylenic monomer used in the photosensitive resin composition for forming the barrier rib of the organic electroluminescence element of the present invention of the first aspect, it is useful to combine a polyisocyanate compound with a hydroxyl group-containing (Meth)acrylates or (meth)acrylate urethanes obtained by reacting polyisocyanate compounds with polyols and hydroxyl-containing (meth)acrylates; such as polyisocyanate compounds and (meth)acrylate urethanes; ) Epoxy acrylates which are the addition reactants of hydroxy acrylate or (meth)acrylic acid; acrylamides such as ethylenebisacrylamide; allyl esters such as diallyl phthalate; o- Vinyl-containing compounds such as divinyl phthalate. As the aforementioned (meth)acrylate urethanes, for example, DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.); U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, UA-1100H (manufactured by Shinnakamura Chemical Industry Co., Ltd.); UA-306H, UA-510H, UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.) ); UV-1700B, UV-7600B, UV-7605B, UV-7630B, UV7640B (manufactured by Nippon Synthetic Chemical Corporation), etc. Among them, from the viewpoint of appropriate tilt angle and sensitivity, (A) ethylenically unsaturated compounds are preferably (meth)acrylates or (meth)acrylate urethanes, It is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, 2-tri(meth)acryloyloxymethyl phthalate, and pentaerythritol tetra(meth) Acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate dibasic anhydride adduct, pentaerythritol tri(meth)acrylate dibasic anhydride adduct, etc. In addition, from the viewpoint of suppressing the generation of residues, as the second aspect, it is also preferable to use the following. These may be used individually by 1 type, and may use 2 or more types together. In the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention of the first aspect, the molecular weight of (A) ethylenically unsaturated compound is not particularly limited, and is from the viewpoints of sensitivity, liquid repellency, and tilt angle In particular, it is preferably 100 or more, more preferably 150 or more, still more preferably 200 or more, still more preferably 300 or more, particularly preferably 400 or more, most preferably 500 or more, and preferably 1,000 or less, more preferably Below 700. In addition, the number of carbons in the (A) ethylenically unsaturated compound is not particularly limited, but from the viewpoints of sensitivity, liquid repellency, and tilt angle, it is preferably 7 or more, more preferably 10 or more, and still more preferably 15 or more , Still more preferably 20 or more, particularly preferably 25 or more, and preferably 50 or less, more preferably 40 or less, still more preferably 35 or less, and particularly preferably 30 or less. In addition, from the viewpoints of sensitivity, liquid repellency, and tilt angle, (meth)acrylates, epoxy (meth)acrylates, and (meth)acrylate urethanes are preferred, among them From the viewpoints of sensitivity, liquid repellency, and tilt angle, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol pentaerythritol five (Meth)acrylates and other trifunctional or more (meth)acrylates; 2,2,2-tris(meth)acryloyloxymethyl phthalate, dipentaerythritol penta(meth) The adduct of dibasic acid anhydride of acrylate, etc. to the adduct of acid anhydride of trifunctional or more (meth)acrylates. Regarding the content ratio of (A) ethylenically unsaturated compound in the photosensitive resin composition of the present invention of the first aspect, relative to the total solid content, it is usually 5% by mass or more, preferably 10% by mass or more, It is more preferably 20% by mass or more, still more preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 80% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, and further It is preferably 55% by mass or less, and particularly preferably 50% by mass or less. By setting it as the above-mentioned lower limit value or more, the sensitivity or tilt angle at the time of exposure tends to become good, and by setting it as the above-mentioned upper limit value or less, developability tends to become favorable. In addition, the content ratio of (A) ethylenically unsaturated compound relative to 100 parts by mass of (C) alkali-soluble resin is usually 15 parts by mass or more, preferably 30 parts by mass or more, more preferably 50 parts by mass or more, and more preferably It is 80 parts by mass or more, particularly preferably 90 parts by mass or more, and usually 150 parts by mass or less, preferably 130 parts by mass or less, more preferably 120 parts by mass or less, and still more preferably 110 parts by mass or less. By setting it as the above-mentioned lower limit or more, the sensitivity at the time of exposure becomes good, and the inclination angle tends to become favorable, and by setting it as the above-mentioned upper limit or less, there exists a tendency for developability to become favorable. On the other hand, the photosensitive resin composition for forming an organic electroluminescent element barrier rib of the present invention of the second aspect contains (A) an ethylenically unsaturated compound. It is thought that it will become high sensitivity by containing (A) an ethylenically unsaturated compound. ＜(A1) Ethylene unsaturated compound with acid group＞ (A) The ethylenically unsaturated compound in the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element of the present invention of the second aspect contains (A1) an ethylenically unsaturated compound having an acid group, and the above (A1) The content of the ethylenically unsaturated compound having an acid group is 30% by mass or less in the total solid content. It is believed that by containing (A1) an ethylenically unsaturated compound having an acid group as described above, the compound has excellent solubility in the developer, thereby suppressing the generation of residues in the pixel portion (light emitting portion), and inkjet coating characteristics improve. Furthermore, it is considered that by setting the content ratio of the compound to be less than the above upper limit, the generation of outgassing from the acid groups contained in the compound is reduced, and the generation of outgassing from the barrier wall after formation can be sufficiently suppressed. . The ethylenically unsaturated compound means a compound having one or more ethylenically unsaturated bonds in the molecule. (A1) The number of ethylenically unsaturated bonds in a molecule of an ethylenically unsaturated compound having an acid group is not particularly limited as long as it is one or more, and the polymerizability, crosslinkability, and expandability are accompanied by it. From the viewpoint of the difference in the solubility of the developer between the exposed part and the non-exposed part, it is preferably 2 or more, more preferably 3 or more, more preferably 4 or more, and particularly preferably 5 or more, and, It is usually 15 or less, preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting it above the above lower limit value, the polymerizability is improved and the sensitivity becomes high, and the amount of outgas generation tends to decrease as the curability becomes higher. By setting it below the above upper limit value, the developability becomes better. Good tendency. In addition, (A1) the number of acid groups in a molecule of the ethylenically unsaturated compound having an acid group is not particularly limited as long as it is 1 or more, but from the viewpoint of curability, it is preferably 4 or less , More preferably two or less, still more preferably one. By setting it below the above upper limit value, the residual film rate tends to increase. In addition, (A1) the type of acid group possessed by the ethylenically unsaturated compound having an acid group is not particularly limited, and examples thereof include carboxyl group, phosphoric acid group, and sulfonium group. From the viewpoint of developability, carboxyl group is preferred. . In the case of having two or more acid groups, the acid groups may be the same or different. (A1) The molecular weight of the ethylenically unsaturated compound having an acid group is not particularly limited, but is preferably 100 or more, more preferably 200 or more, still more preferably 300 or more, particularly preferably 350 or more, and more preferably 1,000 Hereinafter, it is more preferably 800 or less, and even more preferably 700 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for residue to decrease. (A1) The chemical structure of the ethylenically unsaturated compound having an acid group is not particularly limited. From the viewpoint of developability, for example, a compound represented by the following general formula (a1) is preferred. [化5]

In the above formula (a1), R^a1 Represents a hydrogen atom or a methyl group. R^a2 , R^a3 , R^{a 5} And R^{a 6} Each independently represents an alkylene group which may have a substituent. R^a4 Represents the linking base of n+1 valence. R^a7 It represents an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or a divalent aromatic ring group which may have a substituent. l and m each independently represent an integer of 0-12. n represents an integer of 1 or more. (R^a2 , R^a3 , R^a5 And R^a6 ) In the above general formula (a1), R^a2 , R^a3 , R^a5 And R^a6 Each independently represents an alkylene group which may have a substituent. The alkylene group may be linear, branched, cyclic, or a combination thereof. The number of carbons is not particularly limited, and is usually 1 or more, and usually 4 or less, and preferably 2 or less. By setting it below the above upper limit value, the residual film rate tends to increase. Specific examples of the alkylene group include: methylene group, ethylene group, propylene group, butylene group, cyclohexylene group, etc., and from the viewpoint of curability, methylene group or ethylene group is preferred. , More preferably methylene. Examples of the substituents that the alkylene group may have include alkoxy groups, halogen atoms (-F, -Cl, -Br, -I), hydroxyl groups, carboxyl groups, etc., and from the viewpoint of curability, non- Replaced. (R^a4 ) In the above general formula (a1), R^a4 Represents the linking base of n+1 valence. The chemical structure of the n+1 valent linking group is not particularly limited, and examples include n+1 valent hydrocarbon groups that may have a substituent. The hydrocarbon group may be an aliphatic hydrocarbon group or an aromatic hydrocarbon group, and from the viewpoint of developability, an aliphatic hydrocarbon group is preferred. In addition, the carbon-carbon single bond in the hydrocarbon group may be cut by at least one selected from the group consisting of -O-, -CO-, and -NH-. As a specific example of the linking group of n+1 valence, the following can be mentioned. [化6]

(R^a7 ) In the above general formula (a1), it represents an alkylene group which may have a substituent, an alkenylene group which may have a substituent, or a divalent aromatic cyclic group which may have a substituent. R^a7 The alkylene group may be linear, branched, cyclic, or a combination thereof. The number of carbons is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 8 or less, preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for residue to decrease or outgas generation tends to decrease. Specific examples of the alkylene group include methylene, ethylene, propylene, hexylene, cyclohexylene, etc., and from the viewpoint of developability, methylene or ethylene is preferred. More preferably, it is ethylene group. Examples of the substituents that the alkylene group may have include alkoxy groups, halogen atoms (-F, -Cl, -Br, -I), hydroxyl groups, carboxyl groups, etc., and from the viewpoint of curability, non- Replaced. R^a7 The alkenylene group may be linear, branched, cyclic, or a combination thereof. The number of carbons is not particularly limited, and is usually 2 or more, preferably 4 or more, and usually 8 or less, preferably 6 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for residue to decrease. Specific examples of vinylene groups include vinylene groups, vinylene groups, butylene groups, cyclohexenylene groups, and the like. From the viewpoint of developability and curability, vinylene groups or vinylene groups are preferred. The cyclohexenyl group is more preferably an vinylene group. Examples of the substituents that the alkenylene group may have include alkoxy groups, halogen atoms (-F, -Cl, -Br, -I), hydroxyl groups, carboxyl groups, etc., and from the viewpoint of curability, it is preferably Replaced. As R^a7 Examples of the divalent aromatic ring group include: a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, more preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, still more preferably 15 or less, especially It is 10 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for residue to decrease. The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include: benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, fused tetrabenzene ring, pyrene ring, benzopyrene ring, and benzene ring having two free valences. Ring, terphenylene ring, acenaphthene ring, fluoranthene ring, stilbene ring and other groups. In addition, the aromatic heterocyclic ring in the divalent aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of the bivalent aromatic heterocyclic group include: furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, and oxadiazole having 2 free valences. Ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring , Benzisothiazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyridine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, oxoline ring, Quinoline ring, phenanthridine ring, benzimidazole ring,

Pyridine ring, quinazoline ring, quinazolinone ring, azulene ring and other groups. Among them, from the viewpoint of hardening properties, a benzene or naphthalene ring having 2 free valences is preferred, and a benzene ring having 2 free valences is more preferred. Examples of the substituent that the divalent aromatic ring group may have include an alkyl group, an alkoxy group, a halogen atom (-F, -Cl, -Br, -I), a hydroxyl group, and a carboxyl group. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. Among them, in terms of ensuring developability and reducing the amount of outgassing, R^a7 It is preferably an alkylene group which may have a substituent, more preferably an unsubstituted alkylene group, and still more preferably an ethylene group. (l and m) In the above general formula (a1), l and m each independently represent an integer of 0-12. From the viewpoint of developability, it is preferably 1 or more, more preferably 2 or more, and from the viewpoint of curability, it is preferably 8 or less, more preferably 6 or less, and still more preferably 4 or less, especially Preferably, it is 2 or less. On the other hand, from the viewpoint of reducing the amount of outgassing generation, 0 is preferred. (n) In the above general formula (a1), n represents an integer of 1 or more. n is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, particularly preferably 5 or more, and more preferably 6 or less. By setting it above the above lower limit value, the residual film rate becomes higher, and the amount of outgas generation tends to decrease as the curability becomes higher, and by setting it below the above upper limit value, there is a tendency for the residue to decrease tendency. In addition, examples of (A1) ethylenically unsaturated compounds having an acid group include polyhydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds, esters with unsaturated carboxylic acids and polycarboxylic acids The ester obtained by the chemical reaction is not necessarily a singular substance. If representative specific examples are cited, the condensates of acrylic acid, phthalic acid, and pentaerythritol; the condensates of acrylic acid, succinic acid, and pentaerythritol; acrylic acid , Succinic acid and dipentaerythritol condensate, etc. In the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the second aspect of the present invention, the content of (A1) the ethylenically unsaturated compound having an acid group should be 30% by mass in the total solid content The following is not particularly limited, and it is preferably 27% by mass or less, more preferably 25% by mass or less, still more preferably 22% by mass or less, still more preferably 20% by mass or less, particularly preferably 15% by mass or less, and , Preferably 1% by mass or more, more preferably 5% by mass or more, and still more preferably 10% by mass or more. By setting it below the above upper limit value, the amount of outgas generation tends to decrease, and by setting it above the above lower limit value, there is a tendency for inkjet coating adaptability to be improved. In addition, the content of (A1) the ethylenically unsaturated compound having an acid group in the (A) ethylenically unsaturated compound is not particularly limited, but is preferably 50% by mass or less, more preferably 45% by mass or less, and more It is preferably 40% by mass or less, more preferably 35% by mass or less, particularly preferably 30% by mass or less, more preferably 1% by mass or more, more preferably 10% by mass or more, and still more preferably 25% by mass or more . By setting it below the above upper limit value, the amount of outgas generation tends to decrease, and by setting it above the above lower limit value, there is a tendency for inkjet coating adaptability to be improved. ＜(A2) Ethylene unsaturated compound without acid group＞ The (A) ethylenically unsaturated compound in the photosensitive resin composition for forming barrier ribs of organic electroluminescence element of the present invention of the second aspect of the present invention may contain (A1) the ethylenically unsaturated compound having an acid group (A2) An ethylenically unsaturated compound that does not have an acid group. (A2) The ethylenically unsaturated compound not having an acid group refers to (A) ethylenically unsaturated compounds other than (A1) the ethylenically unsaturated compound having an acid group. By containing (A2) an ethylenically unsaturated compound that does not have an acid group, the curability is improved, the minimum exposure required for liquid repellency is reduced, and the amount of outgassing generation tends to be reduced. (A2) The number of ethylenically unsaturated bonds in a molecule of an ethylenically unsaturated compound that does not have an acid group is not particularly limited as long as it is one or more, and it is polymerizable, crosslinkable, and expandable. From the viewpoints of the difference in the solubility of the developer between the exposed part and the non-exposed part, it is preferably 2 or more, more preferably 3 or more, still more preferably 4 or more, and even more preferably 5 or more, It is particularly preferably 6 or more, and usually 15 or less, preferably 12 or less, more preferably 10 or less, and still more preferably 8 or less. By setting it above the above lower limit value, the polymerizability is improved and the sensitivity becomes high, and the amount of outgas generation tends to decrease as the curability becomes higher. By setting it below the above upper limit value, the developability is reduced. The tendency to be better. (A2) The molecular weight of the ethylenically unsaturated compound that does not have an acid group is not particularly limited, but is preferably 200 or more, more preferably 250 or more, still more preferably 300 or more, more preferably 1,000 or less, more preferably 800 or less, more preferably 600 or less. By setting it as above the above lower limit value, the residual film rate tends to increase, and by setting it as below the above upper limit value, there is a tendency for residue to decrease. In terms of polymerizability, crosslinking properties, and the ability to expand the difference in developer solubility between the exposed part and the non-exposed part that accompany it, (A2) the ethylenically unsaturated compound that does not have an acid group preferably has ( A compound of meth)acryloyloxy group, that is, a (meth)acrylate compound. (A2) Specific examples of ethylenically unsaturated compounds having no acid group include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids, and the like. Examples of the esters of the above-mentioned aliphatic polyhydroxy compounds and unsaturated carboxylic acids include ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, and trimethylolethane triacrylate. Acrylate of aliphatic polyhydroxy compounds such as ester, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, glycerol acrylate, etc. The methacrylate obtained by replacing the acrylate of the exemplified compound with the methacrylate, the acrylate of the exemplified compound is replaced by the iconate of the exemplified compound, and the exemplified compound Acrylate is replaced by crotonate, or the acrylate of these exemplary compounds is replaced by maleate, etc. Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include: hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethyl Acrylate and methacrylate of aromatic polyhydroxy compounds such as acrylate and pyrogallol triacrylate. In addition, for example, the (meth)acrylic urethane formic acid obtained by reacting a polyisocyanate compound with a hydroxyl-containing (meth)acrylate or a polyisocyanate compound with a polyol and a hydroxyl-containing (meth)acrylate Esters; such as epoxy acrylates which are the addition reactants of polyepoxy compounds and hydroxy (meth)acrylate or (meth)acrylic acid; acrylamides such as ethylenebisacrylamide; phthalic acid Allyl esters such as diallyl formate; vinyl-containing compounds such as divinyl phthalate are useful. As the aforementioned (meth)acrylate urethanes, for example, DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, UX-5005 (manufactured by Nippon Kayaku Co., Ltd.); U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., Ltd.); UA-306H, UA-510H, UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.) ); UV-1700B, UV-7600B, UV-7605B, UV-7630B, UV7640B (manufactured by Nippon Synthetic Chemical Corporation), etc. Among them, from the viewpoint of curability, as (A2) the ethylenically unsaturated compound having no acid group, it is preferable to use (meth)acrylates or (meth)acrylate urethanes It is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol tetra(meth)acrylate, and pentaerythritol tri(meth)acrylate. These may be used individually by 1 type, and may use 2 or more types together. In the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention of the second aspect, the content of (A2) ethylenically unsaturated compound not having an acid group is not particularly limited, and is based on the total solid content Among them, it is preferably 50% by mass or less, more preferably 45% by mass or less, still more preferably 40% by mass or less, more preferably 20% by mass or more, more preferably 25% by mass or more, and still more preferably 30% by mass % Or more, particularly preferably 35% by mass or more. By setting it below the above upper limit value, there is a tendency for inkjet coating suitability to improve, and by setting it above the above lower limit value, there is a tendency for the amount of outgas generation to decrease. In addition, the content of (A2) the ethylenic unsaturated compound not having an acid group in the (A) ethylenically unsaturated compound is not particularly limited, but is preferably 90% by mass or less, more preferably 80% by mass or less, and further It is preferably 75% by mass or less, more preferably 50% by mass or more, more preferably 55% by mass or more, still more preferably 60% by mass or more, still more preferably 65% by mass or more, and particularly preferably 70% by mass above. By setting it below the above upper limit value, there is a tendency for inkjet coating suitability to improve, and by setting it above the above lower limit value, there is a tendency for the amount of outgas generation to decrease. [1-1-2] (B) component; photopolymerization initiator The photosensitive resin composition for forming a barrier rib for an organic electroluminescence element of the present invention contains (B) a photopolymerization initiator. (B) The photopolymerization initiator is not particularly limited as long as it is a compound that polymerizes the ethylenically unsaturated bond of the ethylenically unsaturated compound (A) with active light, and a known photopolymerization agent can be used. Beginner. The photosensitive resin composition of the present invention can use a photopolymerization initiator generally used in this field as the (B) photopolymerization initiator. Examples of such photopolymerization initiators include: hexaarylbiimidazole-based photopolymerization initiators, phosphine oxide-based photopolymerization initiators, oxime-based photopolymerization initiators, and acetophenone-based photopolymerization initiators. Initiator, benzophenone-based photopolymerization initiator, hydroxybenzene-based photopolymerization initiator, 9-oxysulfur 𠮿

Photopolymerization initiator, anthraquinone-based photopolymerization initiator, ketal-based photopolymerization initiator, titanocene-based photopolymerization initiator, halogenated hydrocarbon derivative-based photopolymerization initiator, organoborate-based Photopolymerization initiator, onium salt-based photopolymerization initiator, sulfide compound-based photopolymerization initiator, urethane formic acid derivative-based photopolymerization initiator, sulfonamide-based photopolymerization initiator, triarylmethanol-based Photopolymerization initiator. The hexaarylbiimidazole-based photopolymerization initiator is preferably the following general formula (1-1) and/or the following from the viewpoint of absorbance and sensitivity, and compatibility with the absorption wavelength of the ultraviolet absorber The hexaarylbiimidazole compound represented by the general formula (1-2). [化7]

In the above formula, R¹¹ ~R¹³ Each independently represents an alkyl group having 1 to 4 carbon atoms that may have a substituent, an alkoxy group having 1 to 4 carbon atoms that may have a substituent, or a halogen atom, and m, n, and l each independently represent 0 to 5 Integer. R¹¹ ~R¹³ The carbon number of the alkyl group is not particularly limited as long as it is in the range of 1 to 4. From the viewpoint of sensitivity, it is preferably 3 or less, and more preferably 2 or less. The alkyl group may be chain-like or cyclic. Specific examples of the alkyl group include, for example, a methyl group, an ethyl group, a propyl group, and an isopropyl group. Among them, a methyl group and an ethyl group are preferred. As R¹¹ ~R¹³ The alkyl group having 1 to 4 carbon atoms may have substituents. In addition to hydrogen, monovalent non-metal atomic groups may be used. Preferred examples include halogen atoms (-F, -Br, -Cl, -I), hydroxyl, alkoxy. Again, R^{1 1} ~R¹³ The carbon number of the alkoxy group is not particularly limited as long as it is in the range of 1 to 4. From the viewpoint of sensitivity, it is preferably 3 or less, and more preferably 2 or less. The alkyl part of the alkoxy group may be chain-like or cyclic. Specific examples of the alkoxy group include, for example, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, and a butoxy group. Among them, a methoxy group and an ethoxy group are preferred. As R^{1 1} ~R¹³ Examples of the substituent that the alkoxy group having 1 to 4 carbons may have include an alkyl group and an alkoxy group, and an alkyl group is preferred. Also, the so-called R^{1 1} ~R¹³ The halogen atom includes, for example, a chlorine atom, an iodine atom, a bromine atom, and a fluorine atom. Among them, from the viewpoint of ease of synthesis, a chlorine atom or a fluorine atom is preferable, and a chlorine atom is more preferable. Among these, in terms of sensitivity or ease of synthesis, R^{1 1} ~R¹³ Preferably, each independently is a halogen atom, and more preferably is a chlorine atom. m, n, and l each independently represent an integer of 0 to 5. From the viewpoint of ease of synthesis, at least one of m, n, and l is preferably an integer of 1 or more, more preferably m, n, and l Any one of them is 1, and the remaining 2 are 0. As the hexaarylbiimidazole compound represented by the general formula (1-1) and/or the general formula (1-2), for example, 2,2'-bis(o-chlorophenyl)-4,5, 4',5'-tetraphenylbiimidazole, 2,2'-bis(o-methylphenyl)-4,5,4',5'-tetraphenylbiimidazole, 2,2'-bis(o Chlorophenyl)-4,4',5,5'-tetra(o,p-dichlorophenyl)biimidazole, 2,2'-bis(o,p-dichlorophenyl)-4,4',5 ,5'-Tetra(o,p-dichlorophenyl)biimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(p-fluorophenyl)biimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(o,p-dibromophenyl)biimidazole, 2,2'-bis(o-bromophenyl)-4 ,4',5,5'-tetra(o,p-dichlorophenyl)biimidazole, 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetra(p-chloronaphthalene) Base) Biimidazole and the like. Among them, a hexaphenylbiimidazole compound is preferred, and it is more preferred that the ortho position of the benzene ring bonded to the 2,2'-position on the imidazole ring is substituted with a methyl group, a methoxy group, or a halogen atom, Preferably, the benzene ring bonded to the 4,4',5,5'-position on the imidazole ring is unsubstituted, or substituted with a halogen atom or a methoxy group. As the (B) photopolymerization initiator, any of the hexaarylbiimidazole-based compound represented by the general formula (1-1) and the hexaarylbiimidazole-based compound represented by the general formula (1-2) can be used One or both can be used together. When the two are used together, the ratio is not particularly limited. Furthermore, b-1 used in the examples has a structure that satisfies the general formula (1-1). In addition, as an acylphosphine oxide-based photopolymerization initiator, 2,4,6-trimethylbenzyldiphenylphosphine oxide, bis(2,4,6-trimethylbenzyl) Group) phenyl phosphine oxide and the like are preferable. Examples of the oxime-based photopolymerization initiator include: Japanese Patent Publication No. 2004-534797, Japanese Patent Application Publication No. 2000-80068, Japanese Patent Application Publication No. 2006-36750, Japanese Patent Application Publication No. 2008-179611 An oxime ester compound described in the gazette, Japanese Patent Publication No. 2012-526185, and Japanese Patent Publication No. 2012-519191. Among them, from the viewpoint of sensitivity, N-acetoxy-N-{4-acetoxyimino-4-[9-ethyl-6-(o-tolyl)-9H -Carbazol-3-yl]butan-2-yl}acetamide, N-acetoxy-N-{3-(acetoxyimino)-3-[9-ethyl-6 -(1-Naphthomethanyl)-9H-carbazol-3-yl]-1-methylpropyl}acetamide, 4-acetoxyimino-5-[9-ethyl-6 -(2-Methylbenzyl)-9H-carbazol-3-yl]-5-oxovaleric acid methyl ester is preferred. In addition, OXE-01 and OXE-02 as product names can be cited OXE-03 (manufactured by BASF Corporation); TR-PBG-304, TR-PBG-305 (manufactured by Changzhou Qiangli Company); NCI-831, NCI-930 (manufactured by ADEKA Company), etc. are preferred. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, and 1-hydroxycyclohexylbenzene. Ketone, 1-hydroxy-1-(p-dodecylphenyl) ketone, 1-hydroxy-1-methylethyl-(p-isopropylphenyl) ketone, 1-trichloromethyl-(p- Butyl phenyl) ketone, α-hydroxy-2-methyl phenyl acetone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2 -Benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinylbenzene) Yl)butane-1-one, 4-dimethylaminoethyl benzoate, 4-dimethylaminoisopentyl benzoate, 4-diethylaminoacetophenone, 4-dimethylaminobenzene Acetone, 2-ethylhexyl-1,4-dimethylamino benzoate, 2,5-bis(4-diethylaminobenzylidene)cyclohexanone, 4-(diethylamino) Chalcone etc. As a benzophenone-based photopolymerization initiator, for example, benzophenone, 2-methylbenzophenone, 3-methylbenzophenone, 4-methylbenzophenone, 2- Carboxybenzophenone, 2-chlorobenzophenone, 4-bromobenzophenone, Michele ketone, etc. Examples of hydroxybenzene-based photopolymerization initiators include 2-hydroxy-4-n-octyloxybenzophenone, 2-hydroxy-4-benzylbenzophenone, 2-(2-hydroxy-5 -Methylphenyl)benzotriazole, 4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate and the like. As 9-oxysulfur 𠮿

It is a photopolymerization initiator, for example: 9-oxysulfur 𠮿

, 2-ethyl 9-oxysulfur 𠮿

, 2-isopropyl 9-oxysulfur 𠮿

, 2,4-Dimethyl 9-oxysulfur 𠮿

, 2,4-Diethyl 9-oxysulfur 𠮿

, 2,4-Diisopropyl 9-oxysulfur 𠮿

, 2-chloro-9-oxysulfur 𠮿

Wait. Examples of the anthraquinone-based photopolymerization initiator include 2-methylanthraquinone, and examples of the ketal-based photopolymerization initiator include benzyl dimethyl ketal. As the titanocene-based photopolymerization initiator, for example, dicyclopentadienyl titanium dichloride, biphenyl dicyclopentadienyl titanium, bis(2,4-difluorophenyl)dicyclopenta Dienyl titanium, bis(2,6-difluorophenyl) dicyclopentadienyl titanium, bis(2,4,6-trifluorophenyl) dicyclopentadienyl titanium, bis(2,3 ,5,6-Tetrafluorophenyl)dicyclopentadienyl titanium, bis(2,3,4,5,6-pentafluorophenyl)dicyclopentadienyl titanium, bis(2,6-di Fluorophenyl)bis(methylcyclopentadienyl)titanium, bis(2,3,4,5,6-pentafluorophenyl)bis(methylcyclopentadienyl)titanium, bis(2,6 -Difluoro-3-(1-pyrrolyl)phenyl]dicyclopentadienyl titanium and the like. Among them, from the viewpoint of sensitivity, a titanium compound having a dicyclopentadienyl structure and a biphenyl structure is preferred, and a halogen atom substituted at the ortho position of the biphenyl ring is particularly preferred. Examples of halogenated hydrocarbon derivative-based photopolymerization initiators include: halomethylated serotris derivatives, for example: 2,4,6-tris(monochloromethyl)-sserotris, 2, 4,6-tris(dichloromethyl)-s-trichloromethyl, 2,4,6-tris(trichloromethyl)-ss-tris, 2-methyl-4,6-bis(trichloromethyl) -Same three 𠯤, 2-n-propyl-4,6-bis(trichloromethyl)-same three 𠯤, 2-(α,α,β-dichloroethyl)-4,6-bis(trichloro) (Methyl)-s-tris, 2-phenyl-4,6-bis(trichloromethyl)-ss-tris, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl) )-Same three 𠯤, 2-(3,4-epoxyphenyl)-4,6-bis(trichloromethyl)-same three 𠯤, 2-(p-chlorophenyl)-4,6-bis (Trichloromethyl)-s-tris, 2-[1-(p-methoxyphenyl)-2,4-butadienyl]-4,6-bis(trichloromethyl)-ss-tris , 2-Styryl-4,6-bis(trichloromethyl)-same three 𠯤, 2-(p-methoxystyryl)-4,6-bis(trichloromethyl)-same three 𠯤 , 2-(p-Methoxy-m-hydroxystyryl)-4,6-bis(trichloromethyl)-tris, 2-(p-isopropoxystyryl)-4,6-bis (Trichloromethyl)-same-tris, 2-(p-tolyl)-4,6-bis(trichloromethyl)-ss-tris, 2-(p-methoxynaphthalene)-4,6-bis (Trichloromethyl)-same three 𠯤, 2-(p-ethoxynaphthalene)-4,6-bis(trichloromethyl)-same three 𠯤, 2-(p-ethoxycarbonyl naphthalene)-4, 6-Bis(trichloromethyl)-s-tris, 2-phenylthio-4,6-bis(trichloromethyl)-ss-tris, 2-benzylthio-4,6-bis(trichloro Methyl)-same tris, 2,4,6-tris(dibromomethyl)-sstris, 2,4,6-tris(tribromomethyl)ssss, 2-methyl-4 ,6-Bis(tribromomethyl)-s-tris, 2-methoxy-4,6-bis(tribromomethyl)-ss-tris, 2-(4-methoxyphenyl)-4 ,6-bis(trichloromethyl)-s-tris-tris derivatives such as halomethylated derivatives, among which, from the viewpoint of sensitivity, bis(trihalomethyl)-ss-triss derivatives are preferred . Examples of the organoborate-based photopolymerization initiator include organoboron ammonium complexes, organoboron phosphonium complexes, organoboron phosphonium complexes, organoboroxyporonium complexes, and organoboron phosphonium complexes. , Organoboron transition metal coordination complexes, etc. As the organoboron anion, from the viewpoint of sensitivity, for example, n-butyl-triphenylboron anion, n-butyl-tris(2,4,6 -Trimethylphenyl) boron anion, n-butyl-tris(p-methoxyphenyl) boron anion, n-butyl-tris(p-fluorophenyl) boron anion, n-butyl-tris(m-fluorophenyl) ) Boron anion, n-butyl-tris(3-fluoro-4-methylphenyl) boron anion, n-butyl-tris(2,6-difluorophenyl) boron anion, n-butyl-tris(2, 4,6-trifluorophenyl) boron anion, n-butyl-tris(2,3,4,5,6-pentafluorophenyl) boron anion, n-butyl-tris(p-chlorophenyl) boron anion, Alkyl-triphenyl boron anions such as n-butyl-tris(2,6-difluoro-3-pyrrolylphenyl) boron anion, and as a counter cation, ammonium cation is preferred from the viewpoint of sensitivity From the viewpoint of sensitivity, onium compounds such as phosphonium cations, sulfonium cations, and iodo cations are particularly preferably organic ammonium cations such as tetraalkylammonium. Examples of onium salt-based photopolymerization initiators include ammonium salts such as tetramethylammonium bromide and tetraethylammonium bromide; diphenyliodonium hexafluoroarsenate, diphenyliodonium tetrafluoroborate, Diphenyl iodonium p-toluenesulfonate, diphenyl iodonium camphorsulfonate, dicyclohexyl iodonium hexafluoroarsenate, dicyclohexyl iodonium tetrafluoroborate, dicyclohexyl iodonium p-toluenesulfonate, bicyclic Ignium salts such as hexyl iodophor camphor sulfonate; triphenyl alumium hexafluoroarsenate, triphenyl alumium tetrafluoroborate, triphenyl alumium p-toluenesulfonate, triphenyl alumium camphor sulfonate, tricyclic Hexyl acumin hexafluoroarsenate, tricyclohexyl acuminium tetrafluoroborate, tricyclohexyl acuminium p-toluene sulfonate, tricyclohexyl acuminium camphor sulfonate and other sulphur salts, etc. Examples of the photopolymerization initiator of the chalcogen compound system include bis(phenylsulfonyl)methane, bis(p-hydroxyphenylsulfonyl)methane, bis(p-methoxyphenylsulfonyl)methane, Bis(α-naphthalenesulfonyl)methane, bis(β-naphthalenesulfonyl)methane, bis(cyclohexylsulfonyl)methane, bis(tertiary butylsulfonyl)methane, phenylsulfonyl( Bis(sulfonyl) methane compounds such as cyclohexylsulfonyl) methane, phenylcarbonyl (phenylsulfonyl)methane, naphthylcarbonyl (phenylsulfonyl)methane, phenylcarbonyl (naphthalenesulfonyl) Methane, cyclohexylcarbonyl (phenylsulfonyl) methane, tertiary butylcarbonyl (phenylsulfonyl) methane, phenylcarbonyl (cyclohexylsulfonyl) methane, phenylcarbonyl (tertiary butylcarbonyl) Carbonyl (sulfonyl) methane compounds such as methane, bis(phenylsulfonyl) diazomethane, bis(p-hydroxyphenylsulfonyl) diazomethane, bis(p-methoxyphenylsulfonyl) heavy Nitrogen, bis(α-naphthalenesulfonyl) diazomethane, bis(β-naphthalenesulfonyl) diazomethane, bis(cyclohexylsulfonyl) diazomethane, bis(tertiary butylsulfonyl) ) Diazomethane, phenylsulfonyl (cyclohexylsulfonyl) diazomethane, bis(sulfonyl) diazomethane, phenylcarbonyl (phenylsulfonyl) diazomethane, naphthylcarbonyl (benzene Sulfonyl) diazomethane, phenylcarbonyl (naphthalenesulfonyl) diazomethane, cyclohexylcarbonyl (phenylsulfonyl) diazomethane, tertiary butylcarbonyl (phenylsulfonyl) diazonium Carbonyl (sulfonyl) diazomethane compounds such as methane, phenylcarbonyl (cyclohexylsulfonyl) diazomethane, and phenylcarbonyl (tertiary butylcarbonyl) diazomethane. Examples of the photopolymerization initiator of the carbamate derivative system include: carbamate benzylcyclohexyl, carbamate 2-nitrobenzylcyclohexyl, carbamate 3,5-dimethyl Oxybenzylcyclohexyl, 3-nitrobenzylcyclohexyl carbamate, etc. Examples of the sulfonamide-based photopolymerization initiator include N-cyclohexyl-4-methylphenylsulfonamide, N-cyclohexyl-2-naphthalenesulfonamide, etc., and as triarylmethanol-based The photopolymerization initiator includes, for example, triphenylmethanol, tris(4-chlorophenyl)methanol, and the like. Regarding these photopolymerization initiators, one kind of them may be contained in the photosensitive resin composition alone, or two or more kinds thereof may be contained. Among the photopolymerization initiators, the hexaarylbiimidazole-based compound has a higher surface hardening property due to its higher absorbance, and is particularly effective in obtaining higher liquid repellency and a larger tilt angle. good. The content of the (B) photopolymerization initiator in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.1% by mass or more with respect to the total solid content of the photosensitive resin composition , More preferably 0.5% by mass or more, still more preferably 1% by mass or more, particularly preferably 1.5% by mass or more, and usually 25% by mass or less, preferably 10% by mass or less, more preferably 8% by mass or less, It is more preferably 5% by mass or less, and particularly preferably 3% by mass or less. By setting it above the above lower limit value, there is a tendency for a coating film to be formed without film reduction during development, and sufficient liquid repellency is produced, and by setting it below the above upper limit value, there is a tendency The tendency to become easy to form the desired pattern shape. In addition, as a compounding ratio of (B) photopolymerization initiator to (A) ethylenically unsaturated compound in the photosensitive resin composition of the present invention, relative to 100 parts by mass of (A) ethylenically unsaturated compound, ( B) The photopolymerization initiator is preferably 1 part by mass or more, more preferably 2 parts by mass or more, still more preferably 3 parts by mass or more, more preferably 200 parts by mass or less, more preferably 100 parts by mass or less, More preferably, it is 50 parts by mass or less, still more preferably 20 parts by mass or less, particularly preferably 10 parts by mass or less, and most preferably 5 parts by mass or less. By setting it as above the lower limit value, there is a tendency for appropriate sensitivity, and by setting it as below the upper limit value, there is a tendency that it becomes easier to form a desired pattern shape. Moreover, you may use a sensitizer together with (B) a photoinitiator. The sensitivity is improved by the sensitizer, and at the same time, by reducing the light transmittance to the inside of the photosensitive resin composition, the tilt angle tends to increase. As the sensitizer, a sensitizer generally used in this field can be used. The sensitizer has the following characteristics: it transfers the energy obtained by absorption to the photopolymerization initiator, or causes electrons to be exchanged with the photopolymerization initiator, and efficiently promotes the reactive radical polymerization reaction. As such sensitizers, for example, unsaturated ketones represented by chalcone derivatives or dibenzylidene acetone, 1,2-diketone compounds represented by benzil or camphorquinone, etc. , Benzoin-based compounds, 茀-based compounds, naphthoquinone-based compounds, anthraquinone-based compounds, 𠮿

Series compounds, sulfur 𠮿

Series compounds, ketone series compounds, 9-oxysulfur𠮿

Polymethine pigments such as acridine-based compounds, coumarin-based compounds, keto-coumarin-based compounds, cyanine-based compounds, merocyanine-based compounds, and oxygen derivatives, acridine-based compounds, acridine-based compounds, and thiocyanates -Based compounds, indoline-based compounds, indoline-based compounds, azulene-based compounds, azulonium-based compounds, squaraine-based compounds, porphyrin-based compounds, tetraphenylporphyrin-based compounds, triarylmethane-based compounds, tetraphenyl Paraporphyrin-based compounds, tetrapyrazine-tetraazaporphyrin-based compounds, phthalocyanine-based compounds, tetraazaporphyrin-based compounds, tetraquinolaporphyrin-based compounds, naphthalocyanine-based compounds , Subphthalocyanine-based compounds, pyrylium-based compounds, thiopyranium-based compounds, New Zealand egg fruit cyanin-based compounds, rothene-based compounds, spiropyran-based compounds, spiropyran-based compounds, thiospiropyran-based compounds Compounds, metal aromatic hydrocarbon complexes, organic ruthenium complexes, benzophenone-based compounds, etc. These may be used individually by 1 type, and may use 2 or more types together. Among these, from the viewpoint of increased sensitivity and increased tilt angle, 9-oxysulfur 𠮿

Series compounds, benzophenone series compounds. As 9-oxysulfur 𠮿

Series compounds, including: 9-oxysulfur 𠮿

, 2-Methyl 9-oxysulfur 𠮿

, 4-Methyl 9-oxysulfur 𠮿

, 2,4-Dimethyl 9-oxysulfur 𠮿

, 2-ethyl 9-oxysulfur 𠮿

, 4-ethyl 9-oxysulfur 𠮿

, 2,4-Diethyl 9-oxysulfur 𠮿

, 2-isopropyl 9-oxysulfur 𠮿

, 4-isopropyl 9-oxysulfur 𠮿

, 2,4-Diisopropyl 9-oxysulfur 𠮿

, 2-chloro-9-oxysulfur 𠮿

, 4-Chloro 9-oxysulfur 𠮿

, 2,4-Dichloro 9-oxysulfur 𠮿

Wait. Among these, 2,4-diethyl 9-oxysulfur 𠮿 is preferable in terms of sensitivity improvement and tilt angle increase.

. Examples of benzophenone compounds include benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone , 4,4'-bis(ethylmethylamino)benzophenone, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferable from the viewpoint of sensitivity improvement and tilt angle increase. Regarding the content of the sensitizer in the photosensitive resin composition, it is usually 0.1% by mass or more, preferably 0.3% by mass or more, and more preferably 0.5% by mass or more with respect to the total solid content of the photosensitive resin composition , More preferably 0.8 mass% or more, still more preferably 1 mass% or more, particularly preferably 1.2 mass% or more, and usually 10 mass% or less, preferably 7 mass% or less, more preferably 5 mass% Hereinafter, it is more preferably 3% by mass or less. By setting it above the above lower limit value, there is a tendency that the sensitivity can be improved and the tilt angle becomes larger, and by setting it below the above upper limit value, there is a tendency that it becomes easier to form a desired pattern. [1-1-3] (E) component; chain transfer agent The photosensitive resin composition for forming an organic electroluminescent element barrier rib of the present invention of the first aspect includes (E) a chain transfer agent. By including the (E) chain transfer agent, there is a tendency to improve the deactivation of free radicals near the surface caused by oxygen inhibition, etc., and to increase the surface hardenability, thereby increasing the inclination angle. In addition, when the liquid repellent is included, the outflow of the liquid repellent can be suppressed by improving the surface hardenability, and the liquid repellent tends to be easily fixed near the surface to increase the contact angle. In the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the second aspect of the present invention, the (E) chain transfer agent is not essential, but from the viewpoint of increasing the tilt angle, it is preferable to include ( E) Chain transfer agent. (E) The chain transfer agent includes a mercapto group-containing compound, carbon tetrachloride, and the like. In terms of a tendency to have a higher chain transfer effect, it is more preferable to use a mercapto group-containing compound. Sulfhydryl-containing compounds tend to break bonds due to their low S-H bonding energy, which tends to cause chain transfer reactions, and therefore has a tendency to improve surface hardenability. (E) Among the chain transfer agents, from the viewpoints of inclination angle and surface hardening properties, a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound are preferred. As the mercapto group-containing compound having an aromatic ring, from the viewpoint of the tilt angle, a compound represented by the following general formula (1-3) can be preferably used. [化8]

In formula (1-3), Z represents -O-, -S- or -NH-, R⁶¹ , R⁶² , R⁶³ , And R⁶⁴ Each independently represents a hydrogen atom or a monovalent substituent. Among them, from the viewpoint of the tilt angle, Z is preferably -S- or -NH-, and more preferably -NH-. Also, in terms of the angle of inclination, R⁶¹ , R⁶² , R⁶³ , And R⁶⁴ Preferably, each independently is a hydrogen atom, an alkyl group having 1 to 4 carbons, or an alkoxy group having 1 to 4 carbons, and more preferably a hydrogen atom. Specifically, examples include: 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 3-mercapto-1,2,4-triazole, 2-mercapto-4(3H) -Quinazoline, β-mercaptonaphthalene, 1,4-dimethyl-mercaptobenzene, and other mercapto group-containing compounds having an aromatic ring, from the viewpoint of tilt angle, 2-mercaptobenzothiazole, 2- Mercaptobenzimidazole. On the other hand, as an aliphatic mercapto group-containing compound, from the viewpoint of surface hardening properties, hexamethylene dithiol, decandithiol, or those represented by the following general formula (1-4) can be preferably used Compound. [化9]

In formula (1-4), m represents an integer from 0 to 4, and n represents an integer from 2 to 4. R⁷¹ And R⁷² Each independently represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. X represents the base of n valence. In the above general formula (1-4), m is preferably 1 or 2 from the viewpoint of ease of synthesis. In addition, from the viewpoint of surface hardenability, n is preferably 3 or 4, and more preferably 4. Also, as R⁷¹ And R⁷² The alkyl group is preferably one with 1 to 3 carbon atoms from the viewpoint of surface hardening. From the viewpoint of surface hardenability, R is preferred⁷¹ And R⁷² At least one of them, such as R^{7 2} Is a hydrogen atom, in this case, R⁷¹ Preferably, it is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. When n is 2, from the viewpoint of surface hardenability, X is preferably an alkylene group having 1 to 6 carbon atoms which may have an ether bond and/or a branch. From the viewpoint of surface hardenability and ease of synthesis, the alkylene group having 1 to 6 carbon atoms is more preferable, and the alkylene group having 4 carbon atoms is more preferable. When n is 3, X is preferably a structure represented by the following general formula (1-5) or (1-6) from the viewpoint of surface hardenability and ease of synthesis. [化10]

In formula (1-5), R⁷³ It represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a hydroxymethyl group. R⁷³ Among them, from the viewpoint of the tilt angle, an ethyl group is preferred. [化11]

In formula (1-6), R⁷⁴ Represents an alkylene group having 1 to 4 carbon atoms. R⁷⁴ Among them, from the viewpoint of the angle of inclination, an ethylene group is preferred. On the other hand, when n is 4, X is preferably a structure represented by the following general formula (1-7). [化12]

Specifically, examples include: butanediol bis(3-mercaptopropionate), butanediol bismercaptoacetate, ethylene glycol bis(3-mercaptopropionate), ethylene glycol bismercaptoacetate , Trimethylolpropane three (3-mercaptopropionate), trimethylolpropane trimercaptoacetate, trihydroxyethyl trimercaptopropionate, pentaerythritol tetra(3-mercaptopropionate), pentaerythritol three (3-mercaptopropionate), butanediol bis(3-mercaptobutyrate), ethylene glycol bis(3-mercaptobutyrate), trimethylolpropane tris(3-mercaptobutyrate), Pentaerythritol tetra(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutoxyethyl)-1,3,5-tris-2 ,4,6(1H,3H,5H)-triketone etc. Among them, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tris (3-mercaptopropionate), trimethylolpropane tris (3 -Mercaptobutyrate), pentaerythritol tetra(3-mercaptobutyrate), pentaerythritol tris(3-mercaptobutyrate), 1,3,5-tris(3-mercaptobutoxyethyl)-1,3 ,5-Tris-2,4,6(1H,3H,5H)-trione, more preferably pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutyrate). These various types may be used individually by 1 type, or 2 or more types may be mixed and used for it. Among them, from the viewpoint of increasing the tilt angle, it is preferable to select from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole. One or more types are used as a photopolymerization initiator system in combination with a photopolymerization initiator. For example, 2-mercaptobenzothiazole may be used, 2-mercaptobenzimidazole may also be used, or 2-mercaptobenzothiazole and 2-mercaptobenzimidazole may be used together. Moreover, from the viewpoint of surface hardening properties, it is preferable to use one or more selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate). Furthermore, it is preferable to use together the mercapto group-containing compound having an aromatic ring and the aliphatic mercapto group-containing compound, particularly from the viewpoint of increasing the inclination angle even with a barrier rib with a thin line width. The reason is that in order to form a barrier wall with a thin line width, a mask with a narrow opening width is used. Therefore, the illuminance per unit area becomes low due to the diffraction during exposure, which is different from the case where the line width is thicker. In contrast, it is susceptible to the influence of oxygen inhibition, and the surface hardenability tends to become lower. Especially in the case of using a hexaarylbiimidazole-based photopolymerization initiator as the (B) photopolymerization initiator, it is preferable to combine a mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound use. On the other hand, when an acetophenone-based photopolymerization initiator is used, even if an aliphatic-based mercapto group-containing compound is used alone, there is a tendency that a sufficient effect can be obtained. For example, preferably one or more selected from the group consisting of 2-mercaptobenzothiazole, 2-mercaptobenzimidazole, and 2-mercaptobenzoxazole; selected from the group consisting of pentaerythritol tetrakis (3-mercaptopropionic acid Ester), one or more of the group consisting of pentaerythritol tetrakis (3-mercaptobutyrate); and a photopolymerization initiator for use in combination. The content of the (E) chain transfer agent in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.025% by mass or more, with respect to the total solid content of the photosensitive resin composition. It is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, particularly preferably 1% by mass or more, and usually 5% by mass or less, preferably 4% by mass or less, and more preferably 3% by mass or less. By setting it to above the lower limit value, the inclination angle tends to increase and the surface hardenability tends to increase, and by setting it below the above upper limit value, it tends to be easier to form a desired pattern. In addition, when the mercapto group-containing compound having an aromatic ring and an aliphatic mercapto group-containing compound are used together as the (E) chain transfer agent, it is used as a combination of the mercapto group-containing compound having an aromatic ring and the aliphatic mercapto group-containing compound The content ratio, relative to 100 parts by mass of the mercapto group-containing compound having an aromatic ring, the aliphatic mercapto group-containing compound is usually 10 parts by mass or more, preferably 50 parts by mass or more, more preferably 80 parts by mass or more, and usually 400 parts by mass or less, preferably 300 parts by mass or less, more preferably 200 parts by mass or less, and still more preferably 150 parts by mass or less. By setting it above the above lower limit value, the inclination angle tends to increase, and by setting it below the above upper limit value, the surface hardenability tends to be higher and the contact angle tends to increase. In addition, as a compounding ratio of the (E) chain transfer agent to the (B) photopolymerization initiator in the photosensitive resin composition, relative to 100 parts by mass of the (B) photopolymerization initiator, (E) chain transfer agent Preferably it is 10 parts by mass or more, more preferably 25 parts by mass or more, still more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, more preferably 500 parts by mass or less, more preferably 400 parts by mass or less , More preferably 300 parts by mass or less, still more preferably 200 parts by mass or less, and particularly preferably 150 parts by mass or less. By setting it above the above lower limit value, the inclination angle tends to be larger and the surface hardenability tends to increase, and by setting it below the above upper limit value, it tends to be easier to form a desired pattern. [1-1-4] (C) component; alkali-soluble resin The photosensitive resin composition for forming a barrier rib for an organic electroluminescence element of the present invention contains (C) an alkali-soluble resin. In the present invention, the (C) alkali-soluble resin is not particularly limited as long as it can be developed with a developer. The developer is preferably an alkaline developer. Therefore, in the present invention, (C) alkali is used Soluble resin. (C) Alkali-soluble resins include various resins containing carboxyl groups or hydroxyl groups. Among them, in terms of obtaining the barrier wall with a moderate inclination angle and suppressing the outflow of the liquid repellent caused by the thermal melting of the barrier wall surface during post-baking, and being able to maintain the liquid repellency, those having a carboxyl group are preferred, More preferably, it has an ethylenically unsaturated group. (Alkali-soluble resin (c) with partial structure represented by general formula (1)) In the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention of the first aspect, (C) the alkali-soluble resin contains an alkali-soluble resin (c) having a partial structure represented by the following general formula (1) ) (Hereinafter, it may be abbreviated as "resin (c)"). In addition, resin (c) is the same as (C) alkali-soluble resin, and it is preferable that it has an ethylenic unsaturated group. By using an alkali-soluble resin having a partial structure represented by the general formula (1), that is, a partial structure of an acid component that has a short carbon number and is easily thermally decomposed, as described above, the barrier ribs are formed during thermal curing. Most of the acid components are removed in the form of gas. Therefore, it is considered that the amount of outgassing generated when the organic electroluminescence device is driven is small and the reliability becomes higher. [化13]

In the above formula (1), R¹ It represents a divalent hydrocarbon group with 1 to 4 carbon atoms which may have a substituent. ﹡Indicates the position of the bond. (R¹ ) In the above general formula (1), R¹ It represents a divalent hydrocarbon group with 1 to 4 carbon atoms which may have a substituent. Examples of the divalent hydrocarbon group include an alkylene group and an alkenylene group. The alkylene group may be a straight chain or a branched chain, and from the viewpoint of development solubility, a straight chain is preferred. The carbon number of the alkylene group is preferably 2 or more, and more preferably 3 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for the amount of outgassing generated when the device emits light to decrease. Specific examples of the alkylene group include: methylene group, ethylene group, propylene group, and butylene group. From the viewpoint of reducing the amount of outgassing generation, methylene group or ethylene group is more preferable. Preferably it is ethylene group. In addition, the alkenylene group may be linear or branched, and from the viewpoint of development solubility, a linear chain is preferred. The carbon number of the alkenylene group is preferably 2 or more, and more preferably 3 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for the amount of outgassing generated when the device emits light to decrease. Specific examples of the vinylene group include vinylene group, propenylene group, and butylene group. From the viewpoint of reducing the amount of outgassing generation, vinylene group is preferred. The substituents that a divalent hydrocarbon group having 1 to 4 carbons may have are not particularly limited, and examples include halogen atoms, alkoxy groups, benzyl groups, and hydroxyl groups. From the viewpoint of ease of synthesis, preferred are Not replaced. Among them, from the viewpoint of reducing the amount of outgassing generation, R is preferred¹ It is a divalent alkylene group having 1 to 4 carbon atoms, more preferably a methylene group or an ethylene group, and still more preferably an ethylene group. As the alkali-soluble resin (c), as long as it has a partial structure represented by the general formula (1), its specific structure is not particularly limited. From the viewpoint of development solubility, it is preferable to contain (c1) The epoxy (meth)acrylate resin and/or (c2) acrylic copolymer resin preferably contains (c1) epoxy (meth)acrylate resin from the viewpoint of reducing the amount of outgassing generation. The (c1) epoxy (meth)acrylate resin will be described in detail below. [(c1) Epoxy (meth)acrylate resin] (c1) Epoxy (meth)acrylate resin is a resin obtained by adding an acid or an ester compound having an ethylenically unsaturated bond to an epoxy resin, and then adding a polybasic acid or its anhydride. For example, the carboxyl group of the unsaturated monocarboxylic acid is added to the epoxy group of the epoxy resin by ring opening, and the ethylenic unsaturated bond is added to the epoxy resin via the ester bond (-COO-), and The hydroxyl group produced at this time is formed by adding a polybasic acid or one of its acid anhydrides to the carboxyl group. Moreover, when adding a polybasic acid or its anhydride, the polyhydric alcohol is added at the same time, and the thing obtained by addition can also be mentioned. Furthermore, the above-mentioned (c1) epoxy (meth)acrylate resin also contains a resin obtained by reacting the carboxyl group of the resin obtained in the above-mentioned reaction with a compound having a reactive functional group . As mentioned above, (c1) epoxy (meth)acrylate resin does not substantially have epoxy groups in its chemical structure, and is not limited to "(meth)acrylate", but due to epoxy compounds (epoxy Resin) is the raw material, and "(meth)acrylate" is a representative example, so it is named in the above-mentioned way according to convention. Here, the term “epoxy resin” also includes the raw material compound before the resin is formed by thermal curing. As the epoxy resin, it can be appropriately selected from known epoxy resins and used. In addition, as the epoxy resin, a compound obtained by reacting a phenolic compound with epihalohydrin can be used. The phenolic compound is preferably a compound having a phenolic hydroxyl group having a valence of 2 or higher, and it may be a monomer or a polymer. Specifically, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, biphenol Aldehydic varnish epoxy resin, triphenol epoxy resin, phenol and dicyclopentane polymerized epoxy resin, dihydroxy sulfonate type epoxy resin, dihydroxy alkylene oxide sulfide type epoxy resin, 9,9-bis (4'-Hydroxyphenyl) diglycidyl etherate of stilbene, 1,1-bis(4'-hydroxyphenyl) adamantane diglycidyl etherate, etc., as mentioned above, can be preferably used in the main The chain has an aromatic ring. Among them, from the viewpoint of higher cured film strength, bisphenol A type epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, polymerization of phenol and dicyclopentadiene are preferred The epoxy resin, the diglycidyl etherate of 9,9-bis(4'-hydroxyphenyl) pyrene, etc., is more preferably a bisphenol A type epoxy resin. The acid having an ethylenically unsaturated bond is preferably an ethylenically unsaturated monocarboxylic acid, for example, (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, etc., And pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, two Reaction of pentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, (meth)acrylic acid and ε-caprolactone Products, etc. Among them, from the viewpoint of sensitivity, (meth)acrylic acid is preferred. Examples of polybasic acids or their anhydrides include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyl Tetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4- Methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenone tetracarboxylic acid, biphenyl Phenyltetracarboxylic acid, and its anhydrides, etc. These may be used individually by 1 type, and may use 2 or more types together. Among these, from the viewpoint of introducing the partial structure represented by the general formula (1) into the resin, succinic anhydride, maleic anhydride, and itaconic anhydride are preferred, and succinic anhydride is more preferred. In addition, the molecular weight of (c1) epoxy (meth)acrylate resin is increased due to the use of polyhydric alcohol when adding polybasic acid or its anhydride, and branches can be introduced into the molecule to achieve a balance between molecular weight and viscosity Sexual orientation. In addition, there is a tendency that the introduction rate of acid groups into the molecule can be increased, and the balance of sensitivity, adhesion, etc., tends to be easily achieved. As the polyol, for example, one selected from the group consisting of trimethylolpropane, di-trimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol is preferred. One or more polyols. (c1) The acid value of the epoxy (meth)acrylate resin is not particularly limited. It is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, still more preferably 40 mgKOH/g or more, and still more It is preferably 60 mgKOH/g or more, more preferably 80 mgKOH/g or more, more preferably 200 mgKOH/g or less, more preferably 180 mgKOH/g or less, still more preferably 150 mgKOH/g or less, and still more preferably It is 120 mgKOH/g or less, particularly preferably 100 mgKOH/g or less. By setting it above the above lower limit value, there is a tendency that residues are reduced and the inclination angle becomes larger, and by setting it below the above upper limit value, there is a tendency that the amount of outgassing generated when the device emits light is reduced. (c1) The weight average molecular weight (Mw) of the epoxy (meth)acrylate resin is not particularly limited, but is usually 1,000 or more, preferably 2,000 or more, more preferably 3,000 or more, still more preferably 4,000 or more, and still more It is preferably 5,000 or more, particularly preferably 6,000 or more, most preferably 7,000 or more, and usually 30,000 or less, preferably 20,000 or less, more preferably 15,000 or less, and still more preferably 10,000 or less. By setting it above the above lower limit value, the amount of outgass generated when the device emits light tends to decrease, and by setting it below the above upper limit value, there is a tendency for residue to decrease. (C) The content of (c1) epoxy (meth)acrylate resin contained in the alkali-soluble resin is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, and still more preferably 70 Mass% or more, more preferably 80% by mass or more, particularly preferably 90% by mass or more, and usually 100% by mass or less. By setting it above the above lower limit value, the amount of outgas generation tends to decrease. (c1) The epoxy (meth)acrylate resin can be synthesized by a previously known method. Specifically, the following method can be used: the above epoxy resin is dissolved in an organic solvent, and the above-mentioned acid or ester compound having an ethylenically unsaturated bond is added in the coexistence of a catalyst and a thermal polymerization inhibitor to perform an addition reaction , And then add a polybasic acid or its anhydride to continue the reaction. Here, as the organic solvent used in the reaction, one or two of organic solvents such as methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate can be cited. More than species. In addition, as the above-mentioned catalysts, tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine; tetramethylammonium chloride, methyltriethylammonium chloride, and tetraethyl chloride Quaternary ammonium salts such as ammonium, tetrabutylammonium chloride, and trimethylbenzylammonium chloride; phosphorus compounds such as triphenylphosphine; antimony such as triphenyl antimony; one or more than two types. Furthermore, as a thermal polymerization inhibitor, 1 type, or 2 or more types of hydroquinone, hydroquinone monomethyl ether, methyl hydroquinone, etc. are mentioned. In addition, as an acid or ester compound having an ethylenically unsaturated bond, the stoichiometric amount relative to 1 stoichiometric weight of the epoxy group of the epoxy resin can be set to be usually 0.7 to 1.3 stoichiometric equivalent, preferably 0.9 to 1.1 stoichiometric equivalent . In addition, the temperature during the addition reaction can be usually set to a temperature of 60 to 150°C, preferably 80 to 120°C. Furthermore, the usage amount of the polybasic acid or its anhydride can be usually 0.1 to 1.2 stoichiometry, preferably 0.2 to 1.1 stoichiometry relative to 1 stoichiometric weight of the hydroxyl group generated in the addition reaction. (c1) The epoxy (meth)acrylate resin may also include a partial structure other than the partial structure represented by the general formula (1). From the viewpoint of reducing the amount of outgassing when the device emits light, it is preferable An epoxy (meth)acrylate resin containing a repeating unit structure represented by the following formula (i) and an epoxy (meth)acrylate resin containing a partial structure represented by the following formula (ii) , And at least one of the group consisting of epoxy (meth)acrylate resin containing the partial structure represented by the following formula (iii). (c1) The epoxy (meth)acrylate resin is preferably epoxy (meth)acrylic acid containing a repeating unit represented by the following formula (i) from the viewpoint of reducing the amount of outgassing generated when the device emits light Ester resin (c1-1). As one of the reasons, it is inferred as follows: due to the rigid main skeleton, it is difficult to decompose with heat. [化14]

In formula (i), R^a Represents a hydrogen atom or a methyl group, R^b Represents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) can be substituted by any substituent. ﹡Indicates the position of the bond. (R^b ) In the above formula (i), R^b Represents a divalent hydrocarbon group which may have a substituent. Examples of the divalent hydrocarbon group include: a divalent aliphatic group, a divalent aromatic ring group, and a combination of one or more divalent aliphatic groups and one or more divalent aromatic ring groups. base. Examples of the divalent aliphatic group include linear ones, branched ones, and cyclic ones. Among these, from the viewpoint of development solubility, the linear one is preferable, and on the other hand, from the viewpoint of reducing the penetration of the developer into the exposed portion, the cyclic one is preferable. The carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, more preferably 20 or less, more preferably 15 or less, and still more preferably 10 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the bivalent linear aliphatic group include methylene, ethylene, n-propyl, n-butyl, n-hexyl, n-heptyl, and the like. Among these, the methylene group is more preferable from the viewpoint of residue reduction. Specific examples of the bivalent branched aliphatic group include: the above-mentioned bivalent linear aliphatic group has a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, and an isobutyl group. Group, second butyl, tertiary butyl, etc. as the side chain structure. The number of rings possessed by the divalent cycloaliphatic group is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less. By setting it above the above lower limit value, the residual film rate tends to increase, and by setting it below the above upper limit value, there is a tendency for residue to decrease. Specific examples of the bivalent cyclic aliphatic group include: cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norethane ring, isotane ring, adamantane Ring, cyclododecane ring and other rings are formed by removing two hydrogen atoms. Among these, from the viewpoint of development adhesiveness, a group obtained by removing two hydrogen atoms from an adamantane ring is preferable. Examples of the substituents that the divalent aliphatic group may have include: alkoxy groups having 1 to 5 carbon atoms such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; carboxyl groups and the like. Among these, from the viewpoint of ease of synthesis, it is preferable to be unsubstituted. Moreover, as a divalent aromatic ring group, a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group can be mentioned. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, more preferably 20 or less, more preferably 15 or less, and still more preferably 10 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include: benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, fused tetrabenzene ring, pyrene ring, benzopyrene ring, and benzene ring having two free valences. Ring, terphenylene ring, acenaphthene ring, fluoranthene ring, stilbene ring and other groups. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of the bivalent aromatic heterocyclic group include: furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, and oxadiazole having 2 free valences. Ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring , Benzisothiazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyridine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, oxoline ring, Quinoline ring, phenanthridine ring, benzimidazole ring,

Pyridine ring, quinazoline ring, quinazolinone ring, azulene ring and other groups. Among them, from the viewpoint of photocurability, a benzene ring or a naphthalene ring having 2 free valences is preferable, and a benzene ring having 2 free valences is more preferable. Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. In addition, as a group formed by connecting one or more divalent aliphatic groups with one or more divalent aromatic ring groups, there may be mentioned: combining one or more divalent aliphatic groups with the above 2 One or more valence aromatic ring groups are connected together. The number of divalent aliphatic groups is not particularly limited, and is usually 1 or more, preferably 2 or more, usually 10 or less, preferably 5 or less, more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. The number of divalent aromatic ring groups is not particularly limited, and is usually 1 or more, preferably 2 or more, usually 10 or less, preferably 5 or less, more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. As a specific example of a group formed by linking one or more divalent aliphatic groups and one or more divalent aromatic ring groups, examples include groups represented by the following formulas (iA)~(iE) Wait. Among these, from the viewpoint of the rigidity of the skeleton and the hydrophobization of the film, the group represented by the following formula (i-A) is preferred. [化15]

As mentioned above, the benzene ring in formula (i) can be further substituted with arbitrary substituents. As this substituent, a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group, etc. are mentioned, for example. The number of substituents is also not particularly limited, and it may be one or two or more. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. In addition, the repeating unit structure represented by the above formula (i) is preferably a repeating unit structure represented by the following formula (i-1) from the viewpoint of development solubility. Furthermore, the repeating unit structure represented by the formula (i-1) includes the partial structure represented by the above general formula (1) in the formula. [化16]

In formula (i-1), R^a And R^b It has the same meaning as the above formula (i). R¹ It has the same meaning as the above formula (1). ﹡Indicates the position of the bond. The benzene ring in formula (i-1) may be further substituted with any substituent. The repeating unit structure represented by the above formula (i-1) contained in 1 molecule of the epoxy (meth)acrylate resin (c1-1) may be one type or two or more types. In addition, the number of the repeating unit structure represented by the above formula (i) contained in 1 molecule of the epoxy (meth)acrylate resin (c1-1) is not particularly limited, and it is preferably 1 or more, more preferably 2 The above is more preferably 3 or more, more preferably 10 or less, and still more preferably 8 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, the number of the repeating unit structure represented by the above formula (i-1) contained in 1 molecule of the epoxy (meth)acrylate resin (c1-1) is not particularly limited, but it is preferably 1 or more, more preferably It is 2 or more, more preferably 3 or more, more preferably 10 or less, and still more preferably 8 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of epoxy (meth)acrylate resin (c1-1) are listed below. [化17]

[化18]

[化19]

[化20]

On the other hand, (c1) epoxy (meth)acrylate resin is preferably epoxy (meth)acrylic acid containing a partial structure represented by the following formula (ii) from the viewpoint of developing adhesiveness Ester resin (c1-2). [化21]

In formula (ii), R^c Each independently represents a hydrogen atom or a methyl group. R^d Represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. ﹡Indicates the position of the bond. (R^d ) In the above formula (ii), R^d Represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. Examples of the cyclic hydrocarbon group include an aliphatic ring group or an aromatic ring group. The number of rings possessed by the aliphatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, the carbon number of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, more preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aliphatic ring in the aliphatic ring group include: cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norethane ring, isotane ring, adamantane Ring, cyclododecane ring, etc. Among these, an adamantane ring is preferable from the viewpoint of development adhesiveness. On the other hand, the number of rings possessed by the aromatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less, more Preferably, it is 4 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for a residue to decrease, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for development adhesiveness to improve. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. In addition, the carbon number of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 10 or more, particularly preferably 12 or more, more preferably 40 or less, more preferably 30 or less, more preferably 20 or less, and particularly preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for a residue to decrease, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for development adhesiveness to improve. Specific examples of the aromatic ring in the aromatic ring group include: a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a fused tetrabenzene ring, a pyrene ring, a benzopyrene ring, a tricyclic ring, and a combination of three Benzene ring, acenaphthene ring, fluoranthene ring, stilbene ring, etc. Among them, from the viewpoint of patterning characteristics, the chrysanthemum ring is preferable. In addition, the divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, and examples thereof include: a divalent aliphatic group, a divalent aromatic ring group, and one or more A group formed by connecting a divalent aliphatic group and one or more divalent aromatic ring groups. Examples of divalent aliphatic groups include linear ones, branched ones, and cyclic ones. Among these, from the viewpoint of development solubility, the linear one is preferable, and on the other hand, from the viewpoint of reducing the penetration of the developer into the exposed portion, the cyclic one is preferable. The carbon number is usually 1 or more, preferably 3 or more, more preferably 6 or more, more preferably 25 or less, more preferably 20 or less, and still more preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the bivalent linear aliphatic group include methylene, ethylene, n-propyl, n-butyl, n-hexyl, n-heptyl, and the like. Among these, from the viewpoint of residue, methylene is preferred. Specific examples of the bivalent branched aliphatic group include: the above-mentioned bivalent linear aliphatic group has a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, and an isobutyl group. Group, second butyl, tertiary butyl, etc. as branched structures. The number of rings possessed by the divalent cycloaliphatic group is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less, and more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the bivalent cyclic aliphatic group include: cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norethane ring, isotane ring, adamantane Ring, cyclododecane ring and other rings are formed by removing two hydrogen atoms. Among these, from the viewpoint of development adhesiveness, a group obtained by removing two hydrogen atoms from an adamantane ring is preferable. Examples of the substituents that the divalent aliphatic group may have include: alkoxy groups having 1 to 5 carbon atoms such as methoxy and ethoxy groups; hydroxyl groups; nitro groups; cyano groups; carboxyl groups and the like. Among these, from the viewpoint of ease of synthesis, it is preferable to be unsubstituted. Moreover, as a divalent aromatic ring group, a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group can be mentioned. The carbon number is usually 4 or more, preferably 5 or more, more preferably 6 or more, more preferably 30 or less, more preferably 20 or less, and still more preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a monocyclic ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include: benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, fused tetrabenzene ring, pyrene ring, benzopyrene ring, and benzene ring having two free valences. Ring, terphenylene ring, acenaphthene ring, fluoranthene ring, stilbene ring and other groups. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a monocyclic ring or a condensed ring. Examples of the bivalent aromatic heterocyclic group include: furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, and oxadiazole having 2 free valences. Ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring , Benzisothiazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyridine ring, pyrimidine ring, tricyclic ring, quinoline ring, isoquinoline ring, oxoline ring, Quinoline ring, phenanthridine ring, benzimidazole ring,

Pyridine ring, quinazoline ring, quinazolinone ring, azulene ring and other groups. Among them, from the viewpoint of photocurability, a benzene ring or a naphthalene ring having 2 free valences is preferable, and a benzene ring having 2 free valences is more preferable. Examples of the substituent that the divalent aromatic ring group may have include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. In addition, as a group formed by connecting one or more divalent aliphatic groups with one or more divalent aromatic ring groups, there may be mentioned: combining one or more divalent aliphatic groups with the above 2 One or more valence aromatic ring groups are connected together. The number of divalent aliphatic groups is not particularly limited, and is usually 1 or more, preferably 2 or more, usually 10 or less, preferably 5 or less, more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. The number of divalent aromatic ring groups is not particularly limited, and is usually 1 or more, preferably 2 or more, usually 10 or less, preferably 5 or less, more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of groups formed by linking one or more divalent aliphatic groups and one or more divalent aromatic ring groups include: groups represented by the above formulas (iA)~(iE), etc. . Among these, the base represented by the above formula (i-C) is preferable from the viewpoint of residue reduction. For these divalent hydrocarbon groups, the bonding state of the cyclic hydrocarbon group as the side chain is not particularly limited, and examples include the state in which one hydrogen atom of an aliphatic group or an aromatic cyclic group is substituted by the side chain, Or it includes one carbon atom of the aliphatic group to form a cyclic hydrocarbon group as a side chain. In addition, the partial structure represented by the above formula (ii) is preferably a partial structure represented by the following formula (ii-1) from the viewpoint of development adhesion. [化22]

In formula (ii-1), R^c It has the same meaning as the above formula (ii). R^α Represents a monovalent cyclic hydrocarbon group which may have a substituent. n is an integer of 1 or more. The benzene ring in formula (ii-1) may be further substituted with any substituent. (R^α ) In the above formula (ii-1), R^α Represents a monovalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic ring group or an aromatic ring group. The number of rings possessed by the aliphatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 6 or less, preferably 4 or less, and more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, the carbon number of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, more preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aliphatic ring in the aliphatic ring group include: cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norethane ring, isotane ring, adamantane Ring, cyclododecane ring, etc. Among these, an adamantane ring is preferable from the viewpoint of development adhesiveness. On the other hand, the number of rings possessed by the aromatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. In addition, the carbon number of the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, more preferably 30 or less, more preferably 20 or less, and still more preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a sulphur ring. Among them, from the viewpoint of developing adhesiveness, the ring is preferable. Examples of substituents that the cyclic hydrocarbon group may have include hydroxyl, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, t-butyl, pentyl, isopentyl, etc. Alkyl groups with 1 to 5 carbons; alkoxy groups with 1 to 5 carbons such as methoxy and ethoxy; hydroxyl groups; nitro groups; cyano groups; carboxyl groups and the like. Among these, from the viewpoint of ease of synthesis, it is preferable to be unsubstituted. n represents an integer of 1 or more, preferably 2 or more, and more preferably 3 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Among them, from the viewpoint of firm film hardening and electrical properties, R is preferred^α It is a monovalent aliphatic ring group, more preferably an adamantyl group. As mentioned above, the benzene ring in formula (ii-1) can be further substituted with any substituent. As this substituent, a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group, etc. are mentioned, for example. The number of substituents is also not particularly limited, and it may be one or two or more. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. Specific examples of the partial structure represented by the above formula (ii-1) are listed below. [化23]

[化24]

[化25]

[化26]

[化27]

In addition, the partial structure represented by the above formula (ii) is preferably the partial structure represented by the following formula (ii-2) from the viewpoint of development adhesion. [化28]

In formula (ii-2), R^c It has the same meaning as the above formula (ii). R^β Represents a bivalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (ii-2) may be further substituted with any substituent. (R^β ) In the above formula (ii-2), R^β Represents a bivalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic ring group or an aromatic ring group. The number of rings possessed by the aliphatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, the carbon number of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, more preferably 40 or less, more preferably 35 or less, and still more preferably 30 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aliphatic ring in the aliphatic ring group include: cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norethane ring, isotane ring, adamantane Ring, cyclododecane ring, etc. Among these, an adamantane ring is preferable from the viewpoint of development adhesiveness. On the other hand, the number of rings possessed by the aromatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. In addition, the carbon number of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 10 or more, more preferably 40 or less, more preferably 30 or less, and more preferably It is 20 or less, particularly preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a sulphur ring. Among them, from the viewpoint of developing adhesiveness, the ring is preferable. Examples of substituents that the cyclic hydrocarbon group may have include hydroxyl, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, t-butyl, pentyl, isopentyl, etc. Alkyl groups with 1 to 5 carbons; alkoxy groups with 1 to 5 carbons such as methoxy and ethoxy; hydroxyl groups; nitro groups; cyano groups; carboxyl groups and the like. Among them, from the viewpoint of ease of synthesis, it is preferable to be unsubstituted. Among them, in terms of hardening, R^β Preferably it is a divalent aliphatic ring group, More preferably, it is a divalent adamantane ring group. On the other hand, from the viewpoint of developing adhesion, R^β Preferably, it is a divalent aromatic ring group, and more preferably a divalent fluorine ring group. As mentioned above, the benzene ring in formula (ii-2) can be further substituted with any substituent. As this substituent, a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group, etc. are mentioned, for example. The number of substituents is also not particularly limited, and it may be one or two or more. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. Specific examples of the partial structure represented by the above formula (ii-2) are listed below. [化29]

[化30]

[化31]

[化32]

On the other hand, the partial structure represented by the above formula (ii) is preferably the partial structure represented by the following formula (ii-3) from the viewpoint of curability. Furthermore, the partial structure represented by the formula (ii-3) includes the partial structure represented by the above general formula (1) in the formula. [化33]

In formula (ii-3), R^c And R^d It has the same meaning as the above formula (ii). R¹ It has the same meaning as the above formula (1). The partial structure represented by the above formula (ii-3) contained in 1 molecule of the epoxy (meth)acrylate resin (c1-2) may be one type or two or more types. In addition, the number of the partial structures represented by the above formula (ii) contained in 1 molecule of the epoxy (meth)acrylate resin (c1-2) is not particularly limited, and is preferably 1 or more, more preferably 3 or more Moreover, it is preferably 20 or less, more preferably 15 or less, and still more preferably 10 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. On the other hand, (c1) epoxy (meth)acrylate resin is preferably a ring containing a partial structure represented by the following formula (iii) from the viewpoint of reducing the amount of outgassing generated when the device emits light Oxygen (meth)acrylate resin (c1-3). [化34]

In formula (iii), R^e It represents a hydrogen atom or a methyl group, and γ represents a single bond, -CO-, an alkylene group which may have a substituent, or a bivalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (iii) can be further substituted with any substituent. ﹡Indicates the position of the bond. (γ) In the above formula (iii), γ represents a single bond, -CO-, an alkylene group which may have a substituent, or a bivalent cyclic hydrocarbon group which may have a substituent. The alkylene group may be a straight chain or a branched chain. From the viewpoint of developing solubility, it is preferably a straight chain, and from the viewpoint of developing adhesiveness, it is preferably a branched chain. The number of carbons is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 6 or less, preferably 4 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of alkylene include methylene, ethylene, propylene, butylene, hexylene, and heptylene. From the viewpoint of compatibility of development adhesion and development solubility, it is preferred It is ethylene or propylene, more preferably propylene. Examples of substituents that the alkylene group may have include alkoxy groups having 1 to 5 carbon atoms such as methoxy and ethoxy; hydroxyl groups; nitro groups; cyano groups; carboxyl groups and the like. Among these, from the viewpoint of ease of synthesis, it is preferable to be unsubstituted. Examples of the divalent cyclic hydrocarbon group include a divalent aliphatic ring group or a divalent aromatic ring group. The number of rings possessed by the aliphatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, and usually 10 or less, preferably 5 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, the carbon number of the aliphatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, more preferably 40 or less, more preferably 35 or less, and still more preferably 30 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aliphatic ring in the aliphatic ring group include: cyclohexane ring, cycloheptane ring, cyclodecane ring, cyclododecane ring, norethane ring, isotane ring, adamantane Ring, cyclododecane ring, etc. Among these, an adamantane ring is preferable from the viewpoint of development adhesiveness. On the other hand, the number of rings possessed by the aromatic ring group is not particularly limited, and is usually 1 or more, preferably 2 or more, more preferably 3 or more, and usually 10 or less, preferably 5 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. In addition, the carbon number of the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, still more preferably 10 or more, more preferably 40 or less, more preferably 30 or less, and more preferably It is 20 or less, particularly preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a sulphur ring. Among them, from the viewpoint of developing adhesiveness, the ring is preferable. Examples of substituents that the cyclic hydrocarbon group may have include hydroxyl, methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, t-butyl, pentyl, isopentyl, etc. Alkyl groups with 1 to 5 carbons; alkoxy groups with 1 to 5 carbons such as methoxy and ethoxy; hydroxyl groups; nitro groups; cyano groups; carboxyl groups and the like. Among them, from the viewpoint of ease of synthesis, it is preferable to be unsubstituted. In addition, from the viewpoint of reducing residues, γ is preferably an alkylene group which may have a substituent, and more preferably dimethylmethylene. As mentioned above, the benzene ring in formula (iii) can be further substituted with arbitrary substituents. As this substituent, a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, a propoxy group, etc. are mentioned, for example. The number of substituents is also not particularly limited, and it may be one or two or more. Among them, from the viewpoint of hardening, it is preferable to be unsubstituted. On the other hand, the partial structure represented by the above formula (iii) is preferably the partial structure represented by the following formula (iii-1) from the viewpoint of developing solubility. Furthermore, the partial structure represented by the formula (iii-1) includes the partial structure represented by the above general formula (1) in the formula. [化35]

In formula (iii-1), R^e And γ has the same meaning as the above formula (iii). R¹ It has the same meaning as the above formula (1). ﹡Indicates the position of the bond. The benzene ring in formula (iii-1) may be further substituted with any substituent. In addition, the number of the repeating unit structure represented by the above formula (iii) contained in one molecule of the epoxy (meth)acrylate resin (c1-3) is not particularly limited, and it is preferably 1 or more, more preferably 5 The above is more preferably 10 or more, more preferably 18 or less, and still more preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, the number of the repeating unit structure represented by the above formula (iii-1) contained in 1 molecule of the epoxy (meth)acrylate resin (c1-3) is not particularly limited, and it is preferably 1 or more, more preferably It is 3 or more, more preferably 5 or more, more preferably 18 or less, and still more preferably 15 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of epoxy (meth)acrylate resin (c1-3) are listed below. [化36]

[化37]

[(c2) Acrylic copolymer resin] Next, (c2) acrylic copolymer resin will be described in detail. (c2) The acrylic copolymer resin is not particularly limited as long as it has a partial structure represented by the general formula (1). From the viewpoint of curability, it is preferably one having an ethylenically unsaturated group in the side chain . (c2) The partial structure containing a side chain having an ethylenically unsaturated group contained in the acrylic copolymer resin is not particularly limited. From the viewpoint of development solubility, for example, it is preferably represented by the following general formula (I) Represents part of the structure. [化38]

In formula (I), R^A Represents a hydrogen atom or a methyl group. R^B It represents an alkenyl group which may have a substituent or a group represented by the following general formula (II). ﹡Indicates the position of the bond. [化39]

In formula (II), R^C Represents an alkenyl group which may have a substituent. α represents an alkylene group which may have a substituent, an arylene group which may have a substituent, or an alkenylene group which may have a substituent. ﹡Represents the bond with the carbonyl carbon. (R^B ) In the above formula (I), R^B It represents an alkenyl group which may have a substituent or a group represented by the above general formula (II). As R^B Among the alkenyl groups, linear, branched or cyclic alkenyl groups can be mentioned. The carbon number is preferably 2 or more, more preferably 20 or less, more preferably 16 or less, still more preferably 12 or less, still more preferably 8 or less, particularly preferably 6 or less, and most preferably 4 or less. By setting it as the above-mentioned lower limit value or more, development adhesion tends to improve, and by setting it as the above-mentioned upper limit value or less, hardenability tends to improve. Specific examples of alkenyl groups include vinyl groups, propenyl groups, butenyl groups, cyclohexenyl groups, and the like. Among them, from the viewpoint of curability, a vinyl group or an acrylic group is preferred, and a vinyl group is more preferred. In addition, examples of substituents that the alkenyl group may have include alkyl groups, alkenyl groups, alkynyl groups, hydroxyl groups, carboxyl groups, chloro groups, bromo groups, fluoro groups, alkoxy groups, hydroxyalkyl groups, thiol groups, and sulfonyl groups. Wait. Among these, from the viewpoint of developability, an alkyl group or an alkenyl group is preferable, and an alkyl group is more preferable. In the case of having two or more substituents, the substituents may be connected to each other to form a ring. As R^B Among these, from the viewpoint of developability and curability, vinyl or acrylic is preferred, and vinyl is more preferred. (R^C ) In the above formula (II), R^C Represents an alkenyl group which may have a substituent. As R^C Among the alkenyl groups, linear, branched or cyclic alkenyl groups can be mentioned. The carbon number is preferably 2 or more, more preferably 20 or less, more preferably 16 or less, still more preferably 12 or less, still more preferably 8 or less, particularly preferably 6 or less, and most preferably 4 or less. By setting it as the above-mentioned lower limit value or more, development adhesion tends to improve, and by setting it as the above-mentioned upper limit value or less, hardenability tends to improve. Specific examples of alkenyl groups include vinyl, propenyl, butenyl, cyclohexenyl, and the like. Among them, from the viewpoint of curability, a vinyl group or an acrylic group is preferred, and a vinyl group is more preferred. In addition, examples of substituents that the alkenyl group may have include alkyl groups, alkenyl groups, alkynyl groups, hydroxyl groups, carboxyl groups, chloro groups, bromo groups, fluoro groups, alkoxy groups, hydroxyalkyl groups, thiol groups, and sulfonyl groups. Wait. Among these, from the viewpoint of developability, an alkyl group or an alkenyl group is preferable, and an alkyl group is more preferable. In the case of having two or more substituents, the substituents may be connected to each other to form a ring. As mentioned above, R^C It represents an alkenyl group which may have a substituent. Among these, from the viewpoint of developability, a vinyl group or an acrylic group is preferred, and a vinyl group is more preferred. (α) In the above formula (II), α represents an alkylene group which may have a substituent, an arylene group which may have a substituent, or an alkenylene group which may have a substituent. Examples of the alkylene group in α include linear, branched, or cyclic alkylene groups. The carbon number is preferably 1 or more, more preferably 2 or more, more preferably 22 or less, more preferably 20 or less, still more preferably 18 or less, still more preferably 16 or less, particularly preferably 14 or less, most Preferably, it is 12 or less. By setting it as the above-mentioned lower limit value or more, adhesiveness tends to improve, and by setting it as the above-mentioned upper limit value or less, the hardenability tends to improve. Specific examples of alkylene include: methylene, ethylene, propylene, cyclohexylene, methylcyclohexylene, bicyclo[2.2.1]heptyl, methylbicyclo[2.2. 1] Heptyl et al. Among these, from the viewpoint of curability, ethylene, cyclohexylene, or methylcyclohexylene is preferred, and ethylene is more preferred. In addition, examples of substituents that the alkylene group may have include alkenyl, alkynyl, hydroxy, carboxy, chloro, bromo, fluoro, alkoxy, hydroxyalkyl, thiol, and thio. Among these, the alkenyl group is preferred from the viewpoint of development adhesiveness. In addition, when it has two or more substituents, the substituents may be connected to each other to form a ring. In addition, examples of the arylene group in α include a divalent aromatic hydrocarbon ring group and a divalent aromatic heterocyclic group. The carbon number is preferably 6 or more, more preferably 24 or less, more preferably 22 or less, still more preferably 20 or less, still more preferably 18 or less, particularly preferably 16 or less, most preferably 14 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. As the aromatic hydrocarbon ring in the aromatic hydrocarbon ring group, it may be a single ring or a condensed ring. Examples include: benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, fused tetraphenyl ring, pyrene ring, Benzopyrene ring, chrysene ring, terphenylene ring, acenaphthene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a single ring or a condensed ring. Examples include furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, and pyrazole. Ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furan Bifuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, iso Quinoline ring, oxoline ring, quinoline ring, phenanthridine ring, benzimidazole ring,

Pyridine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among these, from the viewpoint of developability, a benzene ring or a naphthalene ring is preferable, and a benzene ring is more preferable. In addition, examples of substituents that the arylene group may have include alkyl groups, alkenyl groups, alkynyl groups, hydroxyl groups, carboxyl groups, chloro groups, bromo groups, fluoro groups, alkoxy groups, hydroxyalkyl groups, thiol groups, and sulfide groups. Base etc. Among them, from the viewpoint of developability, a hydroxyl group or a carboxyl group is preferred, and a carboxyl group is more preferred. In addition, when it has two or more substituents, the substituents may be connected to each other to form a ring. As a specific example of the arylene group which has a substituent, a carboxybenzene ring group etc. are mentioned. In addition, examples of the alkenylene group in α include linear, branched, or cyclic alkenylene groups. The carbon number is preferably 2 or more, more preferably 22 or less, more preferably 20 or less, still more preferably 18 or less, still more preferably 16 or less, particularly preferably 14 or less, and most preferably 12 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the alkenylene group include vinylene group, propenylene group, cyclohexenylene group, methylvinylene group, and the like. Among them, from the viewpoint of developability, vinylene and cyclohexenylene are preferred, and vinylene is more preferred. In addition, examples of substituents that the alkenylene group may have include alkyl groups, alkenyl groups, alkynyl groups, hydroxyl groups, carboxyl groups, chloro groups, bromo groups, fluoro groups, alkoxy groups, hydroxyalkyl groups, thiol groups, and sulfur groups. Base etc. Among these, from the viewpoint of developability, an alkyl group or an alkenyl group is preferable, and an alkyl group is more preferable. In addition, when it has two or more substituents, the substituents may be connected to each other to form a ring. As described above, α represents an alkylene group which may have a substituent, an arylene group which may have a substituent, or an alkenylene group which may have a substituent. Among these, from the viewpoint of developability, preferred is An alkylene group or an alkenylene group, more preferably an alkylene group. In addition, the repeating unit structure represented by the above formula (I) is preferably a repeating unit structure represented by the following formula (I-1) from the viewpoint of developability. Furthermore, the repeating unit structure represented by the formula (I-1) includes the partial structure represented by the above general formula (1) in the formula. [化40]

In formula (I-1), R^A And R^B It has the same meaning as the above formula (I). R¹ It has the same meaning as the above formula (1). In addition, the repeating unit structure represented by the above formula (I) is preferably the repeating unit structure represented by the following formula (I-2) from the viewpoint of sensitivity. [化41]

In formula (I-2), R^A And R^B It has the same meaning as the above formula (I). (c2) The content ratio of the partial structure represented by the general formula (I) contained in the acrylic copolymer resin is not particularly limited, and is preferably 5 mol% or more, more preferably 20 mol% or more, and more Preferably it is 30 mol% or more, further more preferably 50 mol% or more, particularly preferably 70 mol% or more, most preferably 80 mol% or more, more preferably 99 mol% or less, more preferably 97 mol% or less, more preferably 95 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for a residue to decrease, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for development adhesiveness to improve. (c2) The content ratio of the partial structure represented by the general formula (I-1) contained in the acrylic copolymer resin is not particularly limited, and is preferably 1 mol% or more, more preferably 5 mol% or more, It is more preferably 10 mol% or more, still more preferably 15 mol% or more, particularly preferably 20 mol% or more, more preferably 99 mol% or less, more preferably 60 mol% or less, and further It is preferably 40 mol% or less, and particularly preferably 30 mol% or less. By setting it to be higher than the above lower limit value, the sensitivity increases and residues tend to decrease, and by setting it to be lower than the above upper limit value, the development adhesion tends to be improved. (c2) The content ratio of the partial structure represented by the general formula (I-2) contained in the acrylic copolymer resin is not particularly limited, and is preferably 5 mol% or more, more preferably 10 mol% or more, More preferably, it is 20 mol% or more, still more preferably 30 mol% or more, particularly preferably 40 mol% or more, most preferably 50 mol% or more, more preferably 99 mol% or less, and more It is preferably 90 mol% or less, more preferably 80 mol% or less, and particularly preferably 70 mol% or less. By setting it as above the lower limit value, the sensitivity tends to increase, and by setting it as the upper limit value or less, the developability tends to be improved. (Partial structure represented by general formula (I')) When (c2) the acrylic copolymer resin contains the partial structure represented by the above general formula (I), the other partial structure contained is not particularly limited. From the viewpoint of development adhesion, for example, it is preferable to contain The partial structure represented by the following general formula (I'). [化42]

In the above formula (I'), R^D Represents a hydrogen atom or a methyl group, R^E It represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or an alkenyl group which may have a substituent. (R^E ) In the above formula (I'), R^E It represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or an alkenyl group which may have a substituent. As R^E Among the alkyl groups, linear, branched or cyclic alkyl groups can be mentioned. The carbon number is preferably 1 or more, more preferably 3 or more, still more preferably 5 or more, more preferably 20 or less, more preferably 18 or less, still more preferably 16 or less, and still more preferably 14 or less, Particularly preferably, it is 12 or less. By setting it as above the above lower limit value, the film strength tends to increase and the development adhesion tends to improve, and by setting it below the above upper limit value, there is a tendency for residue to decrease. Specific examples of the alkyl group include methyl, ethyl, cyclohexyl, dicyclopentyl, dodecyl and the like. Among them, from the viewpoint of film strength, dicyclopentyl or dodecyl is preferred, and dicyclopentyl is more preferred. In addition, examples of substituents that the alkyl group may have include: methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, phenyl, From the viewpoint of developability, a carboxyl group, an acryl group, a methacryl group, etc. are preferably a hydroxyl group or an oligoethylene glycol group. As R^E Examples of the aryl group include a monovalent aromatic hydrocarbon ring group and a monovalent aromatic heterocyclic group. The carbon number is preferably 6 or more, more preferably 24 or less, more preferably 22 or less, still more preferably 20 or less, and particularly preferably 18 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. As the aromatic hydrocarbon ring in the aromatic hydrocarbon ring group, it may be a single ring or a condensed ring. Examples include: benzene ring, naphthalene ring, anthracene ring, phenanthrene ring, perylene ring, fused tetraphenyl ring, pyrene ring, Benzopyrene ring, chrysene ring, terphenylene ring, acenaphthene ring, fluoranthene ring, stilbene ring, etc. In addition, the aromatic heterocyclic ring in the aromatic heterocyclic group may be a single ring or a condensed ring. Examples include furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, and pyrazole. Ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furan Bifuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrimidine ring, pyrimidine ring, pyrimidine ring, tricyclic ring, quinoline ring, iso Quinoline ring, oxoline ring, quinoline ring, phenanthridine ring, benzimidazole ring,

Pyridine ring, quinazoline ring, quinazolinone ring, azulene ring, etc. Among these, from the viewpoint of hardenability, a benzene ring or a naphthalene ring is preferable, and a benzene ring is more preferable. In addition, examples of substituents that the aryl group may have include methyl, ethyl, propyl, methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, low From the viewpoint of developability, polyethylene glycol group, phenyl group, carboxyl group and the like are preferably hydroxyl group or oligoethylene glycol group. As R^E Among the alkenyl groups, linear, branched or cyclic alkenyl groups can be mentioned. The carbon number is preferably 2 or more, more preferably 22 or less, more preferably 20 or less, still more preferably 18 or less, still more preferably 16 or less, and particularly preferably 14 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of alkenyl groups include vinyl groups, propenyl groups, butenyl groups, cyclohexenyl groups, and the like. Among them, from the viewpoint of curability, a vinyl group or an acrylic group is preferred, and a vinyl group is more preferred. In addition, examples of substituents that the alkenyl group may have include methyl, ethyl, propyl, methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, and low From the viewpoint of developability, polyethylene glycol group, phenyl group, carboxyl group and the like are preferably hydroxyl group or oligoethylene glycol group. As mentioned above, R^E Represents an alkyl group that may have a substituent, an aryl group that may have a substituent, or an alkenyl group that may have a substituent. Among these, from the viewpoint of developability, an alkyl group or an alkenyl group is preferred, and more preferred Is an alkyl group. (c2) The content ratio of the partial structure represented by the general formula (I') contained in the acrylic copolymer resin is not particularly limited, and is preferably 0.5 mol% or more, more preferably 1 mol% or more, and further Preferably it is 1.5 mol% or more, more preferably 2 mol% or more, more preferably 90 mol% or less, more preferably 70 mol% or less, still more preferably 50 mol% or less, and still more It is preferably 30 mol% or less, and particularly preferably 10 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. (Partial structure represented by general formula (I'')) When (c2) the acrylic copolymer resin contains the partial structure represented by the general formula (I), as the other partial structure contained, it is preferable to include the following from the viewpoint of heat resistance and film strength Part of the structure represented by the general formula (I''). [化43]

In the above formula (I''), R^F Represents a hydrogen atom or a methyl group, R^G It represents an optionally substituted alkyl group, an optionally substituted alkenyl group, a hydroxyl group, a carboxyl group, a halogen atom, an optionally substituted alkoxy group, a thiol group, or an optionally substituted alkylthio group. t represents an integer from 0 to 5. (R^G ) In the above formula (I''), R^G It represents an optionally substituted alkyl group, an optionally substituted alkenyl group, a hydroxyl group, a carboxyl group, a halogen atom, an optionally substituted alkoxy group, a thiol group, or an optionally substituted alkylthio group. As R^G Among the alkyl groups, linear, branched or cyclic alkyl groups can be mentioned. The carbon number is preferably 1 or more, more preferably 3 or more, still more preferably 5 or more, more preferably 20 or less, more preferably 18 or less, still more preferably 16 or less, and still more preferably 14 or less, Particularly preferably, it is 12 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the alkyl group include methyl, ethyl, cyclohexyl, dicyclopentyl, dodecyl and the like. Among these, from the viewpoint of development adhesiveness, dicyclopentyl or dodecyl is preferred, and dicyclopentyl is more preferred. In addition, examples of substituents that the alkyl group may have include: methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, phenyl, From the viewpoint of developability, a carboxyl group, an acryl group, a methacryl group, etc. are preferably a hydroxyl group or an oligoethylene glycol group. As R^G Among the alkenyl groups, linear, branched or cyclic alkenyl groups can be mentioned. The carbon number is preferably 2 or more, more preferably 22 or less, more preferably 20 or less, still more preferably 18 or less, still more preferably 16 or less, and particularly preferably 14 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of alkenyl groups include vinyl groups, propenyl groups, butenyl groups, cyclohexenyl groups, and the like. Among them, from the viewpoint of curability, a vinyl group or an acrylic group is preferred, and a vinyl group is more preferred. In addition, examples of substituents that the alkenyl group may have include methyl, ethyl, propyl, methoxy, ethoxy, chloro, bromo, fluoro, hydroxy, amino, epoxy, and low From the viewpoint of developability, polyethylene glycol group, phenyl group, carboxyl group and the like are preferably hydroxyl group or oligoethylene glycol group. As R^G Among the halogen atoms, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom are exemplified. Among them, a fluorine atom is preferred from the viewpoint of liquid repellency. As R^G Among the alkoxy groups, linear, branched or cyclic alkoxy groups can be mentioned. The carbon number is preferably 1 or more, more preferably 20 or less, more preferably 18 or less, still more preferably 16 or less, still more preferably 14 or less, and particularly preferably 12 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. In addition, examples of substituents that the alkoxy group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, and phenyl groups. From the viewpoint of developability, carboxyl group, acryloyl group, methacryloyl group, etc. are preferably hydroxyl group or oligoethylene glycol group. As R^G Among the alkylthio groups, linear, branched or cyclic alkylthio groups can be mentioned. The carbon number is preferably 1 or more, more preferably 20 or less, more preferably 18 or less, still more preferably 16 or less, still more preferably 14 or less, and particularly preferably 12 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. Specific examples of the alkylthio group include methylthio, ethylthio, propylthio, butylthio, and the like. Among these, from the viewpoint of developability, a methylthio group or an ethylthio group is preferred. In addition, examples of substituents that the alkyl group in the alkylthio group may have include: methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, and oligoethylene groups. Alcohol group, phenyl group, carboxyl group, acryl group, methacryl group, etc., from the viewpoint of developability, a hydroxyl group and an oligoethylene glycol group are preferred. As mentioned above, R^G Represents an optionally substituted alkyl group, an optionally substituted alkenyl group, a hydroxyl group, a carboxyl group, a halogen atom, an alkoxy group, a hydroxyalkyl group, a thiol group, or an optionally substituted alkylthio group. Among them, from the viewpoint of developability, a hydroxyl group or a carboxyl group is preferred, and a carboxyl group is more preferred. (t) In the above formula (I''), t represents an integer from 0 to 5. From the viewpoint of developability, t is preferably 2 or less, more preferably 1 or less, and still more preferably 0. (c2) The content ratio of the partial structure represented by the general formula (I'') contained in the acrylic copolymer resin is not particularly limited, and is preferably 1 mol% or more, more preferably 2 mol% or more, More preferably, it is 3 mol% or more, more preferably 5 mol% or more, more preferably 90 mol% or less, more preferably 70 mol% or less, and still more preferably 50 mol% or less, and further It is more preferably 30 mol% or less, particularly preferably 20 mol% or less, and most preferably 10 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. (Partial structure represented by general formula (I''')) When (c2) the acrylic copolymer resin contains the partial structure represented by the above general formula (I), the other partial structure contained is preferably the following general formula (I) from the viewpoint of developability ''') part of the structure. [化44]

In the above formula (I'''), R^H Represents a hydrogen atom or a methyl group. (c2) The content ratio of the partial structure represented by the general formula (I''') contained in the acrylic copolymer resin is not particularly limited, and is preferably 5 mol% or more, more preferably 10 mol% or more , More preferably 30 mol% or more, more preferably 90 mol% or less, more preferably 80 mol% or less, still more preferably 70 mol% or less, and particularly preferably 50 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for a residue to decrease, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for development adhesiveness to improve. On the other hand, from the viewpoint of reducing the amount of outgassing generation, it is preferably 0 mol%, that is, it does not include the partial structure represented by the above general formula (I'''). (c2) The acid value of the acrylic copolymer resin is not particularly limited. It is preferably 5 mgKOH/g or more, more preferably 10 mgKOH/g or more, still more preferably 30 mgKOH/g or more, and still more preferably 40 mgKOH /g or more, more preferably 50 mgKOH/g or more, more preferably 100 mgKOH/g or less, more preferably 90 mgKOH/g or less, still more preferably 70 mgKOH/g or less, and still more preferably 60 mgKOH/g g or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for a residue to decrease, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for development adhesiveness to improve. (c2) The weight average molecular weight (Mw) of the acrylic copolymer resin is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, still more preferably 3,000 or more, still more preferably 4,000 or more, and particularly preferably 5,000 Above, it is usually 30,000 or less, preferably 20,000 or less, more preferably 15,000 or less, and still more preferably 10,000 or less. Especially preferably, it is less than 7,000. By setting it as the above-mentioned lower limit value or more, there exists a tendency for the development adhesiveness to improve, and by setting it as the above-mentioned upper limit value or less, there exists a tendency for residue to decrease. (C) The content of (c2) acrylic copolymer resin contained in the alkali-soluble resin is not particularly limited, but from the viewpoint of developability, it is preferably 5 mass% or more, more preferably 10 mass% or more, and further It is preferably 15% by mass or more, particularly preferably 20% by mass or more, more preferably 100% by mass or less, more preferably 80% by mass or less, and still more preferably 50% by mass or less. By setting it as above the lower limit value, the developing solubility tends to become better, and by setting it as the upper limit value or less, the tilt angle tends to become larger. In (C) alkali-soluble resin, either (c1) epoxy (meth)acrylate resin or (c2) acrylic copolymer resin may be contained individually, and both may be contained. Furthermore, resins other than (c1) and (c2) may also be included. For example, by including an alkali-soluble resin having a functional group containing a fluorine atom, the (C) alkali-soluble resin itself may be given liquid repellency. The content ratio of (C) alkali-soluble resin in the photosensitive resin composition of the present invention of the first aspect is usually 5% by mass or more, preferably 10% by mass or more, and more preferably 20 with respect to the total solid content. % By mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50 Less than mass%. By setting it above the above lower limit value, the developability tends to be improved, and by setting it below the above upper limit value, there is a tendency to reduce the amount of outgassing generated when the device emits light. In addition, the content of (A) ethylenically unsaturated compound and (C) alkali-soluble resin in the total solid content is usually 5 mass% or more, preferably 10 mass% or more, more preferably It is 30% by mass or more, more preferably 50% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 85% by mass or more, and usually 99% by mass or less. It is preferably 97% by mass or less, and more preferably 95% by mass or less. By setting it above the above lower limit value, the curability tends to improve, and by setting it below the above upper limit value, there is a tendency to reduce the amount of outgassing generated when the device emits light. In addition, as the blending ratio of (C) alkali-soluble resin to (A) ethylenically unsaturated compound in the photosensitive resin composition, (C) alkali-soluble resin is relative to 100 parts by mass of (A) ethylenically unsaturated compound It is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, still more preferably 70 parts by mass or more, particularly preferably 80 parts by mass or more, more preferably 400 parts by mass or less, more preferably 300 parts by mass or less , More preferably 200 parts by mass or less, and particularly preferably 100 parts by mass or less. By setting it as the above-mentioned lower limit value or more, development adhesion tends to improve, and by setting it as the above-mentioned upper limit value or less, hardenability tends to improve. On the other hand, the (C-1) carboxyl group-containing resin of the (C) alkali-soluble resin in the photosensitive resin composition for forming a barrier rib of an organic electroluminescent element of the present invention, which can be preferably used as the second aspect The (co)polymer, (C-2) a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain, and (C-3) a carboxyl group and ethylenically unsaturated group-containing resin will be described in detail. [1-1-4-a](C-1) Carboxyl-containing (co)polymer [1-1-4-a-1] Carboxyl-containing (co)polymer (1) As a representative of the carboxyl group-containing (co)polymer, specifically, for example, (meth)acrylic acid, crotonic acid, methacrylic acid, maleic acid, maleic anhydride, Ikon Acid, citraconic acid and other unsaturated carboxylic acids, and styrene, α-methylstyrene, hydroxystyrene and other styrenes; methyl (meth)acrylate, ethyl (meth)acrylate, (meth) Propyl acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, dodecyl (meth)acrylate, 2-ethylhexyl (meth)acrylate , Dicyclopentyl (meth)acrylate, adamantyl (meth)acrylate, isopropyl (meth)acrylate, hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, (meth) (Meth)acrylates such as glycidyl acrylate, benzyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and N-(meth)acrylomorpholine; (Meth)acrylonitrile and other (meth)acrylonitriles; (meth)acrylamide, N-methylol(meth)acrylamide, N,N-dimethyl(meth)acrylamide , N,N-Dimethylaminoethyl (meth)acrylamide and other (meth)acrylamides; copolymers of vinyl compounds such as vinyl acetate. Among them, from the viewpoint of sensitivity, a (meth)acrylate-(meth)acrylic acid copolymer and a styrene-(meth)acrylate-(meth)acrylic acid copolymer are preferable. In addition, in the (meth)acrylate-(meth)acrylic acid copolymer, it is more preferable to include 5 to 80 mol% of (meth)acrylate and 20 to 95 mol% of (meth)acrylic acid. The copolymer is particularly preferably a copolymer containing 10 to 70 mol% of (meth)acrylate and 30 to 90 mol% of (meth)acrylic acid. In addition, in the styrene-(meth)acrylate-(meth)acrylic acid copolymer, it is more preferable to contain 3-60 mol% of styrene, 10-70 mol% of (meth)acrylate, ( A copolymer of 10-60 mol% of meth)acrylic acid, particularly preferably containing 5-50 mol% of styrene, 20-60 mol% of (meth)acrylate, and 15-55 mol% of (meth)acrylic acid % Of copolymer. [1-1-4-a-2] Carboxyl-containing (co)polymer (2) In addition, examples include: instead of the above-mentioned unsaturated carboxylic acid, a compound obtained by adding a polybasic acid (anhydride) to a hydroxyalkyl (meth)acrylate, and the above-mentioned styrenes, (meth)acrylates, (formaldehyde) Base) copolymers of acrylonitrile, (meth)acrylamide, vinyl compound, etc. Examples of the hydroxyalkyl (meth)acrylate include: hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxybutyl (meth)acrylate, etc., and as a polybasic acid (anhydride) ), including: succinic acid (anhydride), adipic acid (anhydride), phthalic acid (anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), maleic acid Acid (anhydride), etc., as the reaction compound of the two, succinic acid [2-(meth)acryloylethyl] ester, adipic acid [2-(meth)acryloylethyl] ester , [2-(meth)acryloylethyl] phthalate, [2-(meth)acryloylethyl] hexahydrophthalate, maleic acid [2-( (Meth)acrylic acid ethyl] ester, succinic acid [2-(meth)acrylic acid propyl] ester, adipic acid [2-(meth)acrylic acid propyl] ester, phthalic acid [2-(Meth)acrylic acid propyl] ester, hexahydrophthalic acid [2-(meth)acrylic acid propyl] ester, maleic acid [2-(meth)acrylic acid Propyl] ester, succinic acid [2-(meth)acryloylbutyl] ester, adipic acid [2-(meth)acryloylbutyl] ester, phthalic acid [2-(formyl Yl) acryloyl butyl] ester, hexahydrophthalic acid [2-(meth) acryloyl butyl] ester, maleic acid [2-(meth) acryloyl butyl] ester Wait. The carboxyl group-containing (co)polymers preferably have an acid value of 50 to 500 mgKOH/g from the viewpoint of development solubility, and are preferably polystyrene conversion from the viewpoint of development solubility The weight average molecular weight (Mw) is 1,000 to 300,000. [1-1-4-b](C-2) Carboxyl-containing (co)polymer with ethylenically unsaturated group in the side chain [1-1-4-b-1] Copolymer of unsaturated carboxylic acid and two or more compounds with ethylenically unsaturated groups Examples of the carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain include: allyl (meth)acrylate and 3-allyloxy-2-hydroxypropyl (meth)acrylate Ester, phenylallyl (meth)acrylate, butylene (meth)acrylate, methallyl (meth)acrylate, N,N-diallyl (meth)acrylamide, etc. 2 More than one compound with ethylenically unsaturated groups, or vinyl (meth)acrylate, 1-chlorovinyl (meth)acrylate, 2-phenylvinyl (meth)acrylate, (meth)acrylic acid 1 -Acrylate, vinyl crotonic acid, vinyl (meth)acrylamide and other two or more compounds having ethylenically unsaturated groups, and unsaturated carboxylic acid such as (meth)acrylic acid, or further with unsaturated carboxylic acid A copolymer obtained by copolymerizing the former compound having ethylenically unsaturated groups such as an acid ester to 10 to 90 mol%, preferably about 30 to 80 mol%, in the total. Furthermore, the acid value of the copolymer of the unsaturated carboxylic acid and two or more compounds having ethylenic unsaturated groups is preferably 30 to 250 mgKOH/g from the viewpoint of development solubility, and the weight average The molecular weight (Mw) is preferably 1,000 to 300,000 from the viewpoint of developing solubility. [1-1-4-b-2] Modified carboxyl-containing (co)polymer with epoxy-containing unsaturated compound In addition, as a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain, for example, a carboxyl group-containing (co)polymer and an epoxy group-containing unsaturated compound are reacted to form a carboxyl group-containing (co)polymer. The carboxyl group of the (co)polymer is modified by adding the epoxy group of the epoxy-containing unsaturated compound to a part of the carboxyl group to obtain a modified carboxyl-containing (co)polymer. As the carboxyl group-containing (co)polymer, from the viewpoint of sensitivity, the above-mentioned carboxyl group-containing (co)polymer (meth)acrylate-(meth)acrylic acid copolymer and styrene are preferred -(Meth)acrylate-(meth)acrylic acid copolymer, etc. In addition, examples of the epoxy group-containing unsaturated compound include allyl glycidyl ether, glycidyl (meth)acrylate, α-ethyl glycidyl (meth)acrylate, and glycidyl crotonic acid. , Glycidyl isocrotonic acid, butenyl glycidyl ether, itaconic acid monoalkyl monoglycidyl ester, fumaric acid monoalkyl monoglycidyl ester, maleic acid monoalkyl monoglycidyl ester And other aliphatic epoxy-containing unsaturated compounds, and 3,4-epoxycyclohexyl methyl (meth)acrylate, 2,3-epoxycyclopentyl methyl (meth)acrylate, (meth) Base) Acrylic acid 7,8-epoxy[tricyclo[5.2.1.0]dec-2-yl]oxyethyl and other alicyclic epoxy-containing unsaturated compounds. Then, by reacting about 5 to 90 mol%, preferably 30 to 70 mol% of the carboxyl group of the carboxyl group-containing (co)polymer, the epoxy group-containing unsaturated compounds are obtained. Furthermore, the reaction can be implemented by a known method. Furthermore, regarding the acid value of the epoxy group-containing unsaturated compound modified carboxyl group-containing (co)polymer, from the viewpoint of developability, it is preferably 30~250 mgKOH/g, and it is better in terms of developability. From a viewpoint, the weight average molecular weight (Mw) is preferably 1,000 to 300,000. [1-1-4-b-3] Unsaturated carboxylic acid modified (co)polymer containing epoxy and carboxyl groups In addition, as a carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain, for example, the following modified epoxy group and carboxyl group-containing (co)polymer, the modified epoxy group and carboxyl group The (co)polymer is obtained by reacting the following copolymer with an unsaturated carboxylic acid such as (meth)acrylic acid, and adding the carboxyl group of the unsaturated carboxylic acid to the epoxy group of the copolymer for modification. The copolymer is made of unsaturated carboxylic acid such as (meth)acrylic acid, and the above-mentioned aliphatic epoxy-containing unsaturated compound or alicyclic epoxy-containing unsaturated compound, or further with unsaturated carboxylic acid ester or benzene The former carboxyl group-containing unsaturated compound such as ethylene is obtained by copolymerization so that the ratio of the entire carboxyl group-containing unsaturated compound becomes 10 to 90 mol%, preferably about 30 to 80 mol%. Furthermore, regarding the acid value of the unsaturated carboxylic acid-modified epoxy group and carboxyl group-containing (co)polymer, from the viewpoint of developability, it is preferably 30~250 mgKOH/g, and it is more effective in terms of developability. From a viewpoint, the weight average molecular weight (Mw) is preferably 1,000 to 300,000. [1-1-4-b-4] Acid-modified epoxy-containing (co)polymer In addition, examples of the carboxyl group-containing (co)polymer having an ethylenically unsaturated group in the side chain include the following acid-modified epoxy-containing (co)polymers, the acid-modified epoxy-containing (co)polymer ) The polymer is a copolymer of an epoxy-containing (meth)acrylate and an ethylenically unsaturated compound, and ethylenically unsaturated monocarboxylic acid is added to at least a part of the epoxy group of the copolymer, Furthermore, it is obtained by adding a polybasic acid (anhydride) to at least a part of the hydroxyl group generated by the addition. Specifically, the following acid-modified epoxy-containing (co)polymers can be mentioned. (Meth)acrylate 5~99mol%, and (meth)acrylate and other ethylenically unsaturated compounds usually 2~95mol% copolymer, to the copolymer contained epoxy group usually 10 It can be obtained by adding ethylenically unsaturated monocarboxylic acid to ~100 mol%, and then adding a polybasic acid (anhydride) to usually 10 to 100 mol% of the hydroxyl group generated during the addition. Here, the copolymerization ratio of the epoxy group-containing (meth)acrylate in the above-mentioned copolymer is not particularly limited, and is usually 5 mol% or more, preferably 20 mol% or more, and more preferably 40 mol%. Ear% or more, more preferably 60 mol% or more, still more preferably 80 mol% or more, particularly preferably 90 mol% or more, and usually 99 mol% or less, preferably 98 mol% or less , More preferably 95 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for high sensitivity, and by setting it as below the said upper limit value, there exists a tendency for suitable development solubility. On the other hand, the copolymerization ratio of the ethylenically unsaturated compound in the above copolymer is not particularly limited, and is usually 1 mol% or more, preferably 3 mol% or more, more preferably 5 mol% or more, and Generally, it is 90 mol% or less, preferably 70 mol% or less, more preferably 50 mol% or less, further preferably 30 mol% or less, and particularly preferably 10 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency for high sensitivity, and by setting it as below the said upper limit value, there exists a tendency for suitable development solubility. Examples of epoxy-containing (meth)acrylates include: aliphatic epoxy-containing (meth)acrylic acid such as glycidyl (meth)acrylate and α-ethylglycidyl (meth)acrylate Esters; 3,4-epoxycyclohexyl methyl (meth)acrylate, 2,3-epoxycyclopentyl methyl (meth)acrylate, 7,8-epoxy (meth)acrylate [ Alicyclic epoxy-containing (meth)acrylates such as tricyclic [5.2.1.0]dec-2-yl]oxyethyl ester. Here, as the ethylenically unsaturated compound, it is preferable to use, for example, one or two or more of mono(meth)acrylates having a partial structure represented by the following formula (α). [化45]

In formula (α), R^1d ~R^4d Each independently represents a hydrogen atom or an alkyl group with 1 to 10 carbon atoms, R^5d And R^6d Each independently represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. Again, R^5d With R^6d It can also be connected to form a ring. R^5d With R^6d The ring formed by the connection is preferably an aliphatic ring, which may be either saturated or unsaturated, and the carbon number of the ring is preferably 5-6. R^{1 d} ~R^{4 d} The number of carbon atoms in the alkyl group is preferably 8 or less, more preferably 5 or less. By setting it as the upper limit or less mentioned above, there exists a tendency for suitable development solubility to become. Among these, in terms of solubility, R^1d ~R^4d Preferably it is a hydrogen atom. R^{5 d} And R^{6 d} The number of carbon atoms in the alkyl group is preferably 8 or less, more preferably 5 or less. By setting it as above the above lower limit value, there is a tendency to exhibit appropriate solubility, and by setting it as below the above upper limit value, there is a tendency to maintain hydrophilicity. Among them, from the viewpoint of developing solubility, R is preferred^5d And R^6d Is a hydrogen atom, or R^5d With R^6d Linked to form an aliphatic ring with 5-6 carbon atoms. Among the above formula (α), a mono(meth)acrylate having a structure represented by the following formula (α-a), (α-b), or (α-c) is preferred. By introducing these partial structures, the heat resistance or strength of the mono(meth)acrylate can be increased. In addition, these mono(meth)acrylates may use 1 type, and may use 2 or more types together in arbitrary combinations and ratios. [化46]

As the mono(meth)acrylate having the partial structure represented by the formula (α), various known ones can be used, and from the viewpoint of curability, the one represented by the following formula (β) is particularly preferable. [化47]

In formula (β), R^{9 d} Represents a hydrogen atom or a methyl group, R^10d Represents the partial structure of the above formula (α). In the case of containing a mono(meth)acrylate having a partial structure represented by the above formula (α), the copolymerization ratio is usually 1 mol% or more, preferably 2 mol% or more, and usually 70 mol% or less, preferably 50 mol% or less, more preferably 30 mol% or less, further preferably 10 mol% or less, and particularly preferably 5 mol% or less. By setting it as above the above lower limit value, the residual film rate tends to increase, and by setting it as below the above upper limit value, there is a tendency for residue to decrease. On the other hand, as ethylenically unsaturated compounds, ethylenically unsaturated compounds other than mono(meth)acrylates having a partial structure represented by the above formula (α) (hereinafter referred to as "other ethylenic "Unsaturated compounds"), for example: styrene such as α-, ortho, meta, p-alkyl, nitro, cyano, amide, ester derivatives, etc.; butadiene, 2,3- Dienes such as dimethylbutadiene, isoprene, and chloroprene; methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, (meth) Isopropyl acrylate, n-butyl (meth)acrylate, second butyl (meth)acrylate, tertiary butyl (meth)acrylate, amyl (meth)acrylate, neopentyl (meth)acrylate , Isoamyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, lauryl (meth)acrylate, ( Cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, 2-methylcyclohexyl (meth)acrylate, dicyclohexyl (meth)acrylate, iso(meth)acrylate, Adamantyl (meth)acrylate, allyl (meth)acrylate, propynyl (meth)acrylate, phenyl (meth)acrylate, naphthyl (meth)acrylate, anthracene (meth)acrylate , Anthraquinone (meth)acrylate, sunflower (meth)acrylate, salicyl (meth)acrylate, furan (meth)acrylate, furfuryl (meth)acrylate, tetrahydro (meth)acrylate Furfuryl ester, pyran (meth)acrylate, benzyl (meth)acrylate, phenethyl (meth)acrylate, cresyl (meth)acrylate, (meth)acrylic acid-1,1,1-tri Fluoroethyl, perfluoroethyl (meth)acrylate, perfluoron-propyl (meth)acrylate, perfluoroisopropyl (meth)acrylate, triphenylmethyl (meth)acrylate, (methyl) ) Cumyl acrylate, 3-(N,N-dimethylamino)propyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate (Meth) acrylic acid esters; (meth) acrylic acid amide, (meth) acrylic acid N,N-dimethyl amide, (meth) acrylic acid N,N-diethyl amide, (meth) ) (Meth) acrylic acid amides such as N,N-dipropyl amide acrylate, N,N-di-isopropyl amide (meth)acrylate, anthracenyl amide (meth)acrylate, etc.; (form) Yl)acrylic acid aniline, (meth)acrylonitrile, acrolein, vinyl chloride, vinylidene chloride, vinyl fluoride, vinylidene fluoride, N-vinylpyrrolidone, vinyl pyridine, vinyl acetate Ethylene compounds such as diethyl citraconic acid, diethyl maleate, diethyl fumarate, diethyl iticonate and other unsaturated dicarboxylic acid diesters; N-phenylhormone Monomaleimines such as leximines, N-cyclohexylmaleimines, N-laurylmaleimines, N-(4-hydroxyphenyl)maleimines; N- Radical polymerizable compounds such as (meth)acrylophthalimide. Among them, in order to impart more excellent heat resistance and strength, it is effective to use at least one selected from styrene, benzyl (meth)acrylate and monomaleimide as other ethylenically unsaturated compounds . In this case, from the viewpoint of heat resistance, the copolymerization ratio of at least one selected from styrene, benzyl (meth)acrylate, and monomaleimide is usually 1 mol% or more, which is relatively high. It is preferably 3 mol% or more, and generally 70 mol% or less, preferably 50 mol% or less, more preferably 30 mol% or less, and still more preferably 10 mol% or less. As the ethylenically unsaturated monocarboxylic acid added to the epoxy group contained in the copolymer of epoxy group-containing (meth)acrylate and ethylenically unsaturated compound, known ones can be used, from the viewpoint of curability In particular, (meth)acrylic acid is preferred. Regarding the amount of ethylenically unsaturated monocarboxylic acid added to the epoxy group contained in the above copolymer, it is usually 10 mol% or more of the epoxy group contained in the copolymer, preferably 30 mol% or more , More preferably 50 mol% or more, still more preferably 70 mol% or more, and usually 100 mol% or less. By setting the addition ratio of the ethylenically unsaturated monocarboxylic acid to more than the above lower limit, there is a tendency that the curability can be improved. Furthermore, as a method of adding ethylenically unsaturated monocarboxylic acid to the above-mentioned copolymer, a known method can be adopted. The polybasic acid (anhydride) added to the hydroxyl group generated when ethylenically unsaturated monocarboxylic acid is added to the above copolymer is not particularly limited, and known ones can be used, for example: phthalic acid (Anhydride), tetrahydrophthalic acid (anhydride), hexahydrophthalic acid (anhydride), succinic acid (anhydride), trimellitic acid (anhydride), etc. From the viewpoint of reducing the amount of outgassing generation, succinic acid (anhydride) is preferred. On the other hand, from the viewpoint of increasing the residual film rate and reducing residues, tetrahydrophthalic acid (anhydride) is preferred. A polybasic acid (anhydride) may be used individually by 1 type, and may use 2 or more types together in arbitrary combinations and ratios. By adding such a component, alkali solubility can be imparted to the copolymer. Regarding the amount of the added polybasic acid (anhydride), the hydroxyl group generated when ethylenically unsaturated monocarboxylic acid is added to the copolymer is usually 5 mol% or more, preferably 10 mol% or more. In addition, it is usually 100 mol% or less, preferably 90 mol% or less, and more preferably 80 mol% or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency which can provide developability, and by setting it as below the said upper limit value, there exists a tendency to suppress excessive development and film dissolution. Furthermore, as a method for adding a polybasic acid (anhydride) to the hydroxyl group generated when ethylenically unsaturated monocarboxylic acid is added to the above-mentioned copolymer, a known method can be arbitrarily adopted. For the above-mentioned epoxy-containing (co)polymer modified by ethylenically unsaturated monocarboxylic acid and polybasic acid (anhydride), a part of the carboxyl group generated after the addition of polybasic acid (anhydride) can be added Add glycidyl (meth)acrylate or glycidyl ether compound with ethylenic unsaturated group to further improve light sensitivity. Moreover, it is also possible to improve developability by adding a glycidyl ether compound which does not have an ethylenically unsaturated group to a part of the carboxyl group generated by adding a polybasic acid (anhydride). Furthermore, after adding a polybasic acid (anhydride), both of the above may be added. Furthermore, as a modified product of the above-mentioned epoxy group-containing (co)polymer using ethylenically unsaturated monocarboxylic acid and polybasic acid (anhydride), for example, Japanese Patent Laid-Open No. 8-297366 or Japan The resin described in Patent Publication No. 2001-89533. In addition, the weight average molecular weight (Mw) of the acid-modified epoxy-containing (co)polymer is not particularly limited, and is usually 3,000 or more, preferably 5,000 or more, and usually 100,000 or less, preferably 50,000 or less , More preferably 30,000 or less, still more preferably 20,000 or less, still more preferably 15,000 or less, and particularly preferably 10,000 or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency to improve the compatibility, and by setting it as below the said upper limit value, there exists a tendency for solubility to be ensured. In addition, the molecular weight distribution [weight average molecular weight (Mw)/number average molecular weight (Mn)] is preferably 2.0 to 5.0 from the viewpoint of curability. Furthermore, the acid value of the acid-modified epoxy-containing (co)polymer is not particularly limited, and is preferably 5 mgKOH/g or more, more preferably 10 mgKOH/g or more, and still more preferably 20 mgKOH/g or more In addition, it is preferably 150 mgKOH/g or less, more preferably 100 mgKOH/g or less, and still more preferably 50 mgKOH/g or less. By setting it above the above lower limit value, there is a tendency to ensure solubility, and by setting it below the above upper limit value, there is a tendency to increase film reduction. [1-1-4-c](C-3) Resin containing carboxyl group and ethylenically unsaturated group [1-1-4-c-1] Acid modified epoxy resin Examples of resins containing carboxyl groups and ethylenically unsaturated groups include: carboxyl and ethylenically unsaturated groups containing carboxyl groups and ethylenically unsaturated groups by adding polybasic acids (anhydrides) to the ethylenically unsaturated group monocarboxylic acid adducts of epoxy resins The epoxy resin is the so-called epoxy (meth)acrylate resin. That is, it can be exemplified by the addition of the carboxyl group of the ethylenically unsaturated monocarboxylic acid due to the ring-opening addition of the epoxy group of the epoxy resin, and the addition of the ethylenically unsaturated bond to the epoxy resin via the ester bond (-COO-) , And one carboxyl group of polybasic acid (anhydride) is added to the hydroxyl group generated at this time. Here, the term "epoxy resin" also includes the raw material compound before the resin is formed by thermal curing. As the epoxy resin, it can be appropriately selected from known epoxy resins and used. Specifically, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, and biphenol novolak epoxy resin can be cited. Oxygen resin, triphenol epoxy resin, polymerized epoxy resin of phenol and dicyclopentane, dihydroxy sulfonate epoxy resin, dihydroxy alkylene oxy sulfonate epoxy resin, 9,9-bis(4' -Hydroxyphenyl) diglycidyl etherate of stilbene, 1,1-bis(4'-hydroxyphenyl)adamantane diglycidyl etherate, etc. Among them, from the viewpoint of higher cured film strength, bisphenol A epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, polymerized ring of phenol and dicyclopentadiene are preferred. Oxygen resin, diglycidyl etherate of 9,9-bis(4'-hydroxyphenyl) pyrene, etc., more preferably bisphenol A epoxy resin. In addition, examples of ethylenically unsaturated monocarboxylic acids include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, etc., and pentaerythritol tris(methyl) ) Acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth) Acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, reaction product of (meth)acrylic acid and ε-caprolactone, etc. Among them, from the viewpoint of sensitivity, (meth)acrylic acid is preferred. Moreover, as a polybasic acid (anhydride), for example, succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4 -Methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenone tetracarboxylic acid , Biphenyltetracarboxylic acid, and its anhydrides. Among them, from the viewpoint of image reproducibility, developability, and reduction in outgas generation, succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride is preferred, More preferred is succinic anhydride or tetrahydrophthalic anhydride, and still more preferred is succinic anhydride. The acid value of the acid-modified epoxy resin in the present invention is not particularly limited. It is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, further preferably 30 mgKOH/g or more, and more preferably It is 200 mgKOH/g or less, more preferably 180 mgKOH/g or less, still more preferably 150 mgKOH/g or less, still more preferably 100 mgKOH/g or less, and particularly preferably 80 mgKOH/g or less. By setting it as the above-mentioned lower limit value or more, there exists a tendency to improve adhesiveness, and by setting it as below the said upper limit value, there exists a tendency to improve solubility. In addition, the weight average molecular weight (Mw) of the acid-modified epoxy resin is not particularly limited, and is usually 1,000 or more, preferably 2,000 or more, more preferably 3,000 or more, still more preferably 4,000 or more, and still more preferably 5,000 or more , Particularly preferably 6,000 or more, and usually 30,000 or less, preferably 20,000 or less, more preferably 15,000 or less, and still more preferably 10,000 or less. By setting it as above the lower limit value, there is a tendency to improve the adhesion, and by setting it as below the upper limit value, there is a tendency to maintain proper solubility. The above-mentioned acid-modified epoxy resin can be synthesized by a previously known method. Specifically, the following method can be used: the above-mentioned epoxy resin is dissolved in an organic solvent, in the coexistence of a catalyst and a thermal polymerization inhibitor, the above-mentioned ethylenically unsaturated monocarboxylic acid is added to carry out an addition reaction, and then a multi-component is added. The acid (anhydride) continues to react. Here, as the organic solvent used in the reaction, one or two of organic solvents such as methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate can be cited. More than species. In addition, as the above-mentioned catalysts, tertiary amines such as triethylamine, benzildimethylamine, and tribenzylamine; tetramethylammonium chloride, methyltriethylammonium chloride, and tetraethyl Quaternary ammonium salts such as ammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride; phosphorus compounds such as triphenylphosphine; antimony such as triphenyl antimony; one or more than two types. Furthermore, as a thermal polymerization inhibitor, 1 type, or 2 or more types of hydroquinone, hydroquinone monomethyl ether, methyl hydroquinone, etc. are mentioned. In addition, the amount of ethylenically unsaturated monocarboxylic acid used can be usually 0.7 to 1.3 chemical equivalents, preferably 0.9 to 1.1 chemical equivalents relative to 1 chemical equivalent of the epoxy group of the epoxy resin. . In addition, the temperature during the addition reaction can be usually set to a temperature of 60 to 150°C, preferably 80 to 120°C. Furthermore, the amount of the polybasic acid (anhydride) used can be usually 0.1 to 1.2 stoichiometry, preferably 0.2 to 1.1 stoichiometry relative to 1 stoichiometric weight of the hydroxyl group produced in the above addition reaction. Regarding the above-mentioned acid-modified epoxy resin in the present invention, specific examples are shown below. The acid-modified epoxy resin may include one type of resin, or may include two or more types of resin. [化48]

In formula (C1-1), R¹¹¹ Each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, n¹¹¹ Represents an integer from 0 to 20. [化49]

In formula (C1-2), R¹²¹ Each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, n¹²¹ Represents an integer from 0 to 20. [化50]

In formula (C1-3), R¹³¹ Each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, m¹³¹ And n¹³¹ Each independently represents an integer of 0-20. Furthermore, m¹³¹ And n¹³¹ It means the number of repeating units and is not expressed as a block copolymer. γ means single bond, -CO-, -CH₂ -, -C(CH₃ )₂ -. A group represented by the following formula (γ) or a group represented by the following formula (δ). δ represents a hydrogen atom or a polyacid residue. [化51]

[化52]

[化53]

In formula (C1-4), R¹⁴¹ Each independently represents an alkyl group or a halogen atom, and p each independently represents an integer from 0 to 4. [化54]

[化55]

In formula (C1-6), R¹⁶¹ Each independently represents a hydrogen atom, a halogen atom, an alkyl group or an aryl group, n¹⁶¹ Represents an integer from 0 to 20. In addition, in formulas (C1-1) to (C1-6), A represents a group represented by the following general formula (ε). [化56]

In the formula (ε), R¹⁷¹ Represents a hydrogen atom or a methyl group, R¹⁷² Represents alkylene, m¹⁷¹ Represents an integer from 0 to 10. In addition, δ represents a hydrogen atom or a polybasic acid residue. [1-1-4-c-2] Modified phenol resin Examples of resins containing carboxyl groups and ethylenically unsaturated groups include: carboxyl group-containing and ethylenically unsaturated group-containing and ethylenically unsaturated group-containing resins obtained by adding polybasic acids (anhydrides) to epoxy compound adducts containing ethylenically unsaturated groups of p-phenol resins Based phenol resin. That is, it can be exemplified by ring-opening addition of the epoxy group of the epoxy compound containing the ethylenically unsaturated group to the phenolic hydroxyl group of the phenol resin, and the addition of the ethylenic group to the phenol resin via the ester bond (-COO-) It is formed by adding an unsaturated bond to the hydroxyl group produced at this time by adding a carboxyl group of a polybasic acid (anhydride). Here, as the phenol resin, for example, phenol, o-cresol, m-cresol, p-cresol, 2,5-xylenol, 3,5-xylenol, o-ethylphenol, m-ethylphenol, p-cresol Ethylphenol, propylphenol, n-butylphenol, tertiary butylphenol, 1-naphthol, 2-naphthol, 4,4'-biphenyldiol, bisphenol A, catechol, isobenzene At least one of phenols such as diphenol, hydroquinone, pyrogallol, 1,2,4-benzenetriol, benzoic acid, 4-hydroxyphenylacetic acid, salicylic acid, phloroglucinol, etc. Under the catalyst, it can be combined with aldehydes such as formaldehyde, p-formaldehyde, acetaldehyde, metaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde, furfural, etc., or acetone, methyl ethyl ketone, methyl isobutyl ketone, etc. A novolac resin obtained by polycondensation of at least one of ketones, and a resol resin obtained by polycondensation in the same manner except that an alkali catalyst is used instead of the acid catalyst in the polycondensation. Here, the condensation reaction of the above-mentioned phenols and aldehydes is carried out without a solvent or in a solvent. The weight average molecular weight (Mw) of the novolak resins and resol resins is usually 1,000 to 20,000, preferably 1,000 to 10,000, and more preferably 1,000 to 8,000. By setting the weight average molecular weight to be equal to or higher than the above lower limit value, the image strength tends to be easily ensured, and by setting the weight average molecular weight to be equal to or lower than the above upper limit value, it tends to be easier to ensure the developability. In addition, examples of epoxy compounds containing ethylenically unsaturated groups include glycidyl (meth)acrylate, (3,4-epoxycyclohexyl)methyl (meth)acrylate, and (poly)alkane Glycidyl glycol (meth) glycidyl acrylate, methyl glycidyl (meth) acrylate, (3,4-epoxycyclohexyl) ethylene, etc. Among them, glycidyl (meth)acrylate and (3,4-epoxycyclohexyl)methyl (meth)acrylate are particularly preferred. A known method can be used for the reaction of novolak resin, resol resin, etc., with an epoxy compound containing an ethylenically unsaturated group. For example, tertiary amines such as triethylamine and benzylmethylamine; dodecyltrimethylammonium chloride, tetramethylammonium chloride, tetraethylammonium chloride, benzyltriethylammonium chloride, etc. Quaternary ammonium salt; one or two or more of pyridine, triphenylphosphine, etc. are used as catalysts in an organic solvent at a reaction temperature of 50 to 150°C for several hours to tens of hours to react to phenolic aldehyde Varnish resins, resol resins, etc. are added with epoxy compounds containing ethylenically unsaturated groups. Regarding the amount of the catalyst used, relative to the reaction raw material mixture (the total of novolak resin, resol resin, and ethylenically unsaturated group-containing epoxy compound), it is preferably 0.01-10% by mass, and particularly preferably 0.3 ~5 mass%. In addition, in order to prevent polymerization during the reaction, it is preferable to use a polymerization inhibitor (for example, p-methoxyphenol, hydroquinone, methylhydroquinone, p-methoxyphenol, pyrogallol, tertiary One or more of butylcatechol, dibutylhydroxytoluene, phenanthrene, etc.), the amount used relative to the reaction raw material mixture is preferably 0.01-10% by mass, and particularly preferably 0.03-5 quality%. Furthermore, the preferable ratio of adding an epoxy compound containing an ethylenically unsaturated group to the phenolic hydroxyl group of novolak resin, resol resin, etc. is 1 to 99 mol%. This ratio can be adjusted with respect to the phenolic hydroxyl group and the amount of the ethylenically unsaturated group-containing epoxy compound added. Furthermore, as the polybasic acid (anhydride), for example, known ones can be used, and examples include maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, Methyl endomethylene tetrahydrophthalic acid, chlorosonic acid, methyltetrahydrophthalic acid, 5-norene-2,3-dicarboxylic acid, methyl-5-norene-2 , 3-Dicarboxylic acid and other dicarboxylic acids or their anhydrides; trimellitic acid, pyromellitic acid, benzophenone tetracarboxylic acid, biphenyl tetracarboxylic acid and other polycarboxylic acids or their anhydrides. Among them, preferred examples include tetrahydrophthalic anhydride or succinic anhydride. These may be used individually by 1 type, and may mix and use 2 or more types. The addition rate of polybasic acid (anhydride) is usually 10~100 mole%, preferably 20~100, of the hydroxyl group of the reactant of novolak resin, resol resin, etc. and epoxy compound containing ethylenic unsaturated group. Mole%, more preferably 30-100 mole%. By setting the addition rate within the above-mentioned range, it tends to be easy to ensure developability. [1-1-4-d] Other alkali-soluble resins In addition, when it is desired to provide a barrier wall to the organic electro-elements of the substrate that is easily degraded by the alkaline developer, and when using a weakly alkaline developer solution of an alkaline compound or a developer solution that does not contain an alkaline compound , Can preferably use polyvinyl alcohol; or make the above-mentioned [1-1-4-a-1] carboxyl-containing (co)polymer (1) listed in the copolymer (as a preferred example, vinyl acetate Etc.) 0.1~40 mol%, preferably 1~30 mol% of vinyl alcohol copolymer obtained by copolymerization; or the above-mentioned [1-1-4-a-1] carboxyl-containing copolymer is introduced by esterification reaction (Co)The modified polyvinyl alcohol obtained by the copolymer listed in the polymer (1) at 0.1-40 mol%, preferably 1-30 mol% is used as the alkali-soluble resin. Furthermore, in order to form an appropriate tilt angle and maintain liquid repellency, it can be preferably used: the introduction of the above-mentioned [1-1-4-c-1] acid-modified epoxy resin by esterification reaction Ethylene unsaturated monocarboxylic acid (as a preferred example, (meth)acrylic acid, a reaction product of (meth)acrylic acid and ε-caprolactone, etc.), or further introduction of a polybasic acid (anhydride) (as a preferred example, Tetrahydrophthalic anhydride, etc.) 0.1-30 mol%, preferably 0.5-20 mol% modified polyvinyl alcohol; or introduced by formal reaction as described in Japanese Patent Laid-Open No. 2008-45047 The compound having a (meth)acryloyl (oxy) group or a (meth)acryloylamino group and an aldehyde group (as a preferred example, 4-acryloyloxybutyraldehyde, etc.), or having a dialkyl condensation Aldehyde compounds (as a preferred example, N-(2,2-dimethoxyethyl)methacrylamide, etc.) 0.1-30 mol%, preferably 0.5-20 mol% Polyvinyl alcohol and so on. As (C) alkali-soluble resin, among the above, from the viewpoints of reduction in outgassing generation and curability, (C-2) a carboxyl-containing (co- ) Polymer or (C-3) carboxyl group and ethylenically unsaturated group-containing resin, more preferably (C-3) carboxyl group and ethylenically unsaturated group-containing resin, and more preferably acid-modified epoxy resin. In addition, those listed as (C) alkali-soluble resin in the first aspect can also be used. The weight average molecular weight (Mw) of the above (C) alkali-soluble resin is not particularly limited, and is preferably 2,000 or more, more preferably 3,000 or more, still more preferably 5,000 or more, particularly preferably 7,000 or more, and more preferably 50,000 or less, more preferably 30,000 or less, still more preferably 20,000 or less, and particularly preferably 10,000 or less. By setting it to above the above lower limit value, there is a tendency to suppress excessive development and film dissolution, and by setting it to below the above upper limit value, there is a tendency to exhibit moderate development solubility. In addition, the acid value of (C) alkali-soluble resin is not particularly limited, and is preferably 10 mgKOH/g or more, more preferably 20 mgKOH/g or more, still more preferably 30 mgKOH/g or more, and more preferably 200 mgKOH/g or less, more preferably 150 mgKOH/g or less, still more preferably 100 mgKOH/g or less, still more preferably 70 mgKOH/g or less, particularly preferably 50 mgKOH/g or less. By setting it above the above lower limit value, there is a tendency to suppress residues, and by setting it below the above upper limit value, there is a tendency to obtain a higher residual film rate. The content ratio of (C) alkali-soluble resin in the photosensitive resin composition of the present invention of the second aspect is usually 5% by mass or more, preferably 10% by mass or more, and more preferably 20 with respect to the total solid content. % By mass or more, more preferably 30% by mass or more, particularly preferably 40% by mass or more, and usually 90% by mass or less, preferably 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50 Less than mass%. By setting it as above the lower limit value, there is a tendency to obtain moderate development solubility and sensitivity, and by setting it as the above upper limit value or less, there is a tendency to obtain moderate development solubility and sensitivity. In addition, the content of (A) ethylenically unsaturated compound and (C) alkali-soluble resin in the total solid content is usually 5 mass% or more, preferably 10 mass% or more, more preferably It is 30% by mass or more, more preferably 50% by mass or more, still more preferably 70% by mass or more, particularly preferably 80% by mass or more, most preferably 85% by mass or more, and usually 99% by mass or less. It is preferably 97% by mass or less, and more preferably 95% by mass or less. By setting it as above the lower limit value, there is a tendency to obtain moderate development solubility and sensitivity, and by setting it as the above upper limit value or less, there is a tendency to obtain moderate development solubility and sensitivity. In addition, as a compounding ratio of (C) alkali-soluble resin to (A) ethylenically unsaturated compound in the photosensitive resin composition, relative to (A) 100 parts by mass of ethylenically unsaturated compound, (C) is preferred Alkali-soluble resin is 50 parts by mass or more, more preferably 60 parts by mass or more, more preferably 70 parts by mass or more, particularly preferably 80 parts by mass or more, more preferably 400 parts by mass or less, more preferably 300 parts by mass or less , More preferably 200 parts by mass or less, and particularly preferably 100 parts by mass or less. By setting it above the above lower limit value, the substrate adhesion tends to become stronger, and by setting it below the above upper limit value, the curability becomes higher, and the minimum exposure required for liquid repellency is changed. Low tendency. [1-1-5] (D) component; liquid repellent The photosensitive resin composition for forming an organic electroluminescent element barrier rib of the present invention may also contain (D) a liquid repellent. Especially when the organic electroluminescence element is produced by the inkjet method, it is preferable to contain (D) liquid repellent, and by containing (D) liquid repellent, (D) liquid repellent can be used for the barrier wall The surface imparts liquid repellency, so it is considered that the obtained barrier wall can be one that prevents color mixing of the light-emitting parts (pixels) connected with the organic layer. As the liquid repellent, a polysiloxane-containing compound or a fluorine-based compound may be mentioned, preferably, a liquid repellent having a cross-linking group (hereinafter, it may be referred to as a "cross-linking group-containing liquid repellent") . As the crosslinking group, an epoxy group or an ethylenically unsaturated group may be mentioned, and from the viewpoint of suppression of the outflow of the liquid-repellent component of the developer, an ethylenically unsaturated group is preferred. In the case of using a liquid repellent containing a crosslinking group, the crosslinking reaction on the surface of the formed coating film can be accelerated when the formed coating film is exposed, and the liquid repellent becomes difficult to flow out during the development process. The result is , It is believed that the obtained barrier wall can exhibit higher liquid repellency. When a fluorine-based compound is used as a liquid repellent, there is a tendency that the fluorine compound is aligned on the surface of the barrier wall to prevent ink penetration or color mixing. In further detail, there is a tendency to prevent the penetration or color mixing of ink, which is caused by the fact that the fluorine atom-containing radical repels the ink, so that the ink crosses the barrier wall and enters the adjacent area. . Specific examples of liquid repellents containing crosslinking groups, especially fluorine compounds containing ethylenically unsaturated groups, include, for example, perfluoroalkyl sulfonic acid, perfluoroalkyl carboxylic acid, and perfluoroalkyl epoxy Alkyl adducts, perfluoroalkyl trialkylammonium salts, oligomers containing perfluoroalkyl groups and hydrophilic groups, oligomers containing perfluoroalkyl groups and lipophilic groups, perfluoroalkyl groups, hydrophilic groups , And lipophilic oligomers, urethanes containing perfluoroalkyl groups and hydrophilic groups, perfluoroalkyl esters, perfluoroalkyl phosphate esters and other fluorinated organic compounds. As the commercially available products of these fluorine-containing compounds, you can use: "MEGAFAC F116", "MEGAFAC F120", "MEGAFAC F142D", "MEGAFAC F144D", "MEGAFAC F150", "MEGAFAC F160", " MEGAFAC F171", "MEGAFAC F172", "MEGAFAC F173", "MEGAFAC F177", "MEGAFAC F178A", "MEGAFAC F178K", "MEGAFAC F179", "MEGAFAC F183", "MEGAFAC F184", "MEGAFAC F191", " MEGAFAC F812", "MEGAFAC F815", "MEGAFAC F824", "MEGAFAC F833", "MEGAFAC RS101", "MEGAFAC RS102", "MEGAFAC RS105", "MEGAFAC RS201", "MEGAFAC RS202", "MEGAFAC RS301", "MEGAFAC" RS303" "MEGAFAC RS304", "MEGAFAC RS401", "MEGAFAC RS402", "MEGAFAC RS501", "MEGAFAC RS502", "MEGAFAC RS-72-K", "DEFENSA MCF300", "DEFENSA MCF310", "DEFENSA MCF312" , "DEFENSA MCF323", "Fluorad FC430", "Fluorad FC431", "FC-4430", "FC4432" manufactured by 3M Japan; "AsahiGuard AG710", "Surflon S-382", "Surflon SC" manufactured by Asahi Glass -101", "Surflon SC-102", "Surflon SC-103", "Surflon SC-104", "Surflon SC-105", "Surflon SC-106"; "OPTOOL DAC-HP" manufactured by Daikin Industries Fluorine-containing organic compounds commercially available under the trade names. As described above, when a fluorine-based compound is used as a liquid repellent, the content of fluorine atoms in the liquid repellent is not particularly limited, and it is preferably 1% by mass or more, more preferably 5% by mass or more, and more preferably It is 50% by mass or less, more preferably 25% by mass or less. By setting it to more than the above lower limit value, there is a tendency to suppress the outflow to the pixel portion, and by setting it to be less than the above upper limit value, there is a tendency to show a higher contact angle. The molecular weight of the liquid repellent is not particularly limited, and it may be a low-molecular-weight compound or a high-molecular-weight compound. The high molecular weight liquid repellent can inhibit the fluidity of the liquid repellent caused by post-baking, so it can prevent the liquid repellent from flowing out of the barrier, so it is preferable. From this point of view, the number average molecular weight of the liquid repellent is higher It is preferably 100 or more, more preferably 500 or more, and preferably 100,000 or less, and more preferably 10,000 or less. The content of (D) liquid repellent in the photosensitive resin composition of the present invention is usually 0.01% by mass or more, preferably 0.1% by mass or more, and usually 1% by mass or less with respect to the total solid content. It is preferably 0.5% by mass or less, and more preferably 0.3% by mass or less. By setting it to be higher than the above lower limit value, there is a tendency to exhibit high liquid repellency, and by setting it to be lower than the above upper limit value, there is a tendency to suppress the outflow to the pixel portion. On the other hand, in the photosensitive resin composition for forming a barrier rib of the present invention, the (D) liquid repellent and a surfactant may be used together, and a surfactant may be used instead of the (D) liquid repellent. Surfactants can be used to improve the coatability of the coating liquid of the photosensitive resin composition for forming barrier ribs, and the developability of the coating film. Among them, fluorine-based or silicone-based surfactants are preferred. . In particular, it has the effect of removing the residue of the photosensitive resin composition from the unexposed area during development, and, in terms of having the function of expressing wettability, a polysiloxane-based surfactant is preferred, and further Preferably, it is a polyether modified polysiloxane-based surfactant. The fluorine-based surfactant is preferably a compound having a fluoroalkyl group or a fluoroalkylene group in at least any one of the terminal, main chain, and side chain. Specifically, examples include: 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, Octaethylene glycol bis(1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol bis(1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol bis( 1,1,2,2-tetrafluorobutyl)ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl)ether, sodium perfluorododecyl sulfonate, 1, 1,2,2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexafluorodecane, etc. Examples of commercially available products include: "BM-1000" and "BM-1100" manufactured by BM Chemie; "MEGAFAC F142D", "MEGAFAC F172", "MEGAFAC F173", and "MEGAFAC" manufactured by DIC "F183", "MEGAFAC F470", "MEGAFAC F475"; "FC430" manufactured by 3M Japan; "DFX-18" manufactured by NEOS, etc. In addition, as the silicone-based surfactant, for example, "DC3PA", "SH7PA", "DC11PA", "SH21PA", "SH28PA", "SH29PA", "8032Additive", "Dow Corning" manufactured by Toray Dow Corning SH8400"; commercially available products such as "BYK323" and "BYK330" manufactured by BYK-Chemie. Other than a fluorine-based surfactant and a silicone-based surfactant may be included as a surfactant, and examples of the surfactant include nonionic, anionic, cationic, and amphoteric surfactants. Examples of the nonionic surfactant include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, Polyoxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, Sorbitol fatty acid esters, polyoxyethylene sorbitol fatty acid esters, etc. Examples of commercially available products include polyoxyethylene-based surfactants such as "Emulgen 104P" and "Emulgen A60" manufactured by Kao Corporation. In addition, examples of the above-mentioned anionic surfactants include alkane sulfonates, alkylbenzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, and alkyl sulfuric acid. Salts, alkyl sulfate ester salts, higher alcohol sulfate ester salts, aliphatic alcohol sulfate ester salts, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphoric acid Ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, special polymer surfactants, etc. Among them, a special polymer surfactant is preferred, and a special polycarboxylic acid polymer surfactant is more preferred. As such anionic surfactants, commercially available products can be used. For example, "Emal 10" manufactured by Kao Corporation can be cited for alkyl sulfate ester salts; and "Emal 10" manufactured by Kao Corporation can be cited for alkyl naphthalene sulfonates. "Pelex NB-L", etc.; for special polymer-based surfactants, such as "Homogenol L-18" and "Homogenol L-100" manufactured by Kao Corporation. Furthermore, examples of the cationic surfactant include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts, and examples of amphoteric surfactants include betaine-type compounds and imidazolium salts. Class, imidazoline class, amino acid class, etc. Among them, quaternary ammonium salts are preferred, and stearyl trimethyl ammonium salts are more preferred. As a commercially available one, for example, the alkylamine salts include "Acetamin 24" manufactured by Kao Corporation; and the quaternary ammonium salts include "Quartamin 24P" and "Quartamin 86W" manufactured by Kao Corporation. In addition, surfactants can be used in combination of two or more types. Examples include: silicone-based surfactants/fluorine-based surfactants, silicone-based surfactants/special polymer-based surfactants, fluorine-based interface Combination of active agent/special polymer series surfactant, etc. Among them, a combination of polysiloxane-based surfactant/fluorine-based surfactant is preferred. Regarding the combination of the polysiloxane-based surfactant/fluorine-based surfactant, for example, "DFX-18" manufactured by NEOS, "BYK-300" or "BYK-330" manufactured by BYK-Chemie/ "S-393" manufactured by AGC Seimi Chemical, "KP340" manufactured by Shin-Etsu Polysiloxane, "F-478" or "F-475" manufactured by DIC, and "SH7PA"/Daikin manufactured by Toray Dow Corning "DS-401" manufactured by the company, "L-77" manufactured by NUC company / "FC4430" manufactured by M Japan, etc. [1-1-6] Polymerization inhibitor The photosensitive resin composition for forming a barrier rib for an organic electroluminescence element of the present invention may also contain a polymerization inhibitor. By containing the polymerization inhibitor, the polymerization inhibitor inhibits radical polymerization, and therefore it is considered that the inclination angle of the obtained barrier wall can be increased. Examples of polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, methyl hydroquinone, methoxyphenol, 2,6-di-tert-butyl-4-methylphenol (BHT )Wait. Among them, from the viewpoint of polymerization inhibitory ability, hydroquinone or methoxyphenol is preferred, and methylhydroquinone is more preferred. The polymerization inhibitor preferably contains one kind or two or more kinds. Generally, in the production of (C) alkali-soluble resin, there is a case where the resin contains a polymerization inhibitor. The polymerization inhibitor can be used as the polymerization inhibitor of the present invention. In addition to the polymerization inhibitor in the resin, it can also be used for photosensitization. A polymerization inhibitor that is the same as or different from the polymerization inhibitor in the resin is added during the production of the resin composition. Regarding the content ratio of the polymerization inhibitor in the photosensitive resin composition, it is usually 0.0005% by mass or more, preferably 0.001% by mass or more, and more preferably 0.01% by mass or more with respect to the total solid content of the photosensitive resin composition In addition, it is usually 0.3% by mass or less, preferably 0.2% by mass or less, and more preferably 0.1% by mass or less. By setting it to above the above lower limit value, there is a tendency that the inclination angle can be increased, and by setting it below the above upper limit value, there is a tendency to maintain high sensitivity. [1-1-7]Ultraviolet absorber The photosensitive resin composition for forming a barrier rib for an organic electroluminescence element of the present invention contains an ultraviolet absorber. The ultraviolet absorber is added for the purpose of controlling the light hardening distribution by absorbing the specific wavelength of the light source used for exposure with the ultraviolet absorber. With the addition of ultraviolet absorbers, the effect of improving the oblique angle shape after development, or removing residues remaining in the non-exposed area after development, etc., can be obtained. As the ultraviolet absorber, from the viewpoint of suppressing the light absorption of the initiator, for example, it can be used for a compound having a maximum absorption value between 250 nm and 400 nm. Examples of ultraviolet absorbers include: benzotriazole compounds, triazole compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, two Naphthalene compounds, phenanthroline compounds, dyes, etc. These ultraviolet absorbers can be used individually or in combination of 2 or more types. Among these, from the viewpoint of increasing the tilt angle, benzotriazole-based compounds and/or hydroxyphenyltriazole-based compounds are preferred, and benzotriazole-based compounds are particularly preferred. Among the benzotriazole-based compounds, in terms of the inclined shape, the benzotriazole compound described in the following general formula (Z1) is preferred. [化57]

In the above formula (Z1), R^1e And R^2e Each independently represents a hydrogen atom, an optionally substituted alkyl group, a group represented by the following general formula (Z2), or a group represented by the following general formula (Z3). R^3e Represents a hydrogen atom or a halogen atom. [化58]

In the above formula (Z2), R^4e Represents an alkylene group which may have a substituent, R^{5 e} Represents an alkyl group which may have a substituent. [化59]

In the above formula (Z3), R^6e Represents an alkylene group which may have a substituent, R^7e Represents a hydrogen atom or a methyl group. (R^1e And R^{2 e} ) In the above formula (Z1), R^1e And R^2e Each independently represents a hydrogen atom, an optionally substituted alkyl group, a group represented by the general formula (Z2), or a group represented by the general formula (Z3). Examples of the alkyl group include linear, branched, or cyclic alkyl groups. The carbon number is preferably 1 or more, more preferably 2 or more, still more preferably 4 or more, more preferably 10 or less, more preferably 6 or less, and still more preferably 4 or less. Specific examples of the alkyl group include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tertiary butyl, and the like. Among them, the tertiary butyl group is preferred. In addition, examples of substituents that the alkyl group may have include: methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, phenyl, Carboxylic, acrylic, methacrylic, etc. (R^3e ) In the above formula (Z1), R^3e Represents a hydrogen atom or a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among them, from the viewpoint of synthesis, R is preferred^3e Is a hydrogen atom. (R^4e ) In the above formula (Z2), R^4e Represents an alkylene group which may have a substituent. Examples of the alkylene group include linear, branched, or cyclic alkylene groups. The carbon number is usually 1 or more, preferably 2 or more, more preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less. Specific examples of alkylene include methylene, ethylene, propylene, propylene, and butylene. Among these, ethylene group is preferred. In addition, examples of substituents that the alkylene group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, and phenyl groups. , Carboxyl, acrylic, methacrylic, etc. Among them, R is preferred^{4 e} For ethylene. (R^5e ) In the above formula (Z2), it represents an alkyl group which may have a substituent. Examples of the alkyl group include linear, branched, or cyclic alkyl groups. The carbon number is preferably 4 or more, more preferably 5 or more, still more preferably 7 or more, more preferably 15 or less, more preferably 10 or less, and still more preferably 9 or less. Specific examples of the alkyl group include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and the like. In addition, examples of substituents that the alkyl group may have include: methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, phenyl, Carboxylic, acrylic, methacrylic, etc. Among them, from the viewpoint of the oblique shape, R is preferred^5e It is heptyl, octyl, and nonyl. (R^6e ) In the above formula (Z3), R^6e Represents an alkylene group which may have a substituent. Examples of the alkylene group include linear, branched, or cyclic alkylene groups. The carbon number is usually 1 or more, preferably 2 or more, more preferably 6 or less, more preferably 4 or less, and still more preferably 3 or less. Specific examples of alkylene include methylene, ethylene, propylene, propylene, and butylene. Among these, ethylene group is preferred. In addition, examples of substituents that the alkylene group may have include methoxy, ethoxy, chloro, bromo, fluoro, hydroxyl, amino, epoxy, oligoethylene glycol, and phenyl groups. , Carboxyl, acrylic, methacrylic, etc. Among them, from the viewpoint of the inclined shape, the following compound is preferred, namely R^1e Is the tertiary butyl group, R^2e Is the base represented by the above formula (Z2) (where R^4e Ethylene, R^5e Is an alkyl group with 7 to 9 carbons), R^3e Compounds that are hydrogen atoms; or R^1e Is a hydrogen atom, R^2e Is the group represented by the above formula (Z3) (where R^6e Ethylene, R^7e Is methyl), R^3e A compound of hydrogen atom; more preferably R^1e Is the tertiary butyl group, R^2e Is the base represented by the above formula (Z2) (where R^4e Ethylene, R^5e Is an alkyl group with 7 to 9 carbons), R^3e Is a hydrogen atom. Specific examples of benzotriazole-based compounds include: 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)- 2H-benzotriazole, 3[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl] octyl propionate and 3-[3- A mixture of tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionic acid 2-ethylhexyl ester, 2-[2-hydroxy-3, 5-bis(α,α-dimethylbenzyl)phenyl)-2H-benzotriazole, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chloro Benzotriazole, 2-(3,5-di-tertiary pentyl-2-hydroxyphenyl)benzotriazole, 2-(2'-hydroxy-5'-tertiary octylphenyl)benzo Triazole, phenylpropionic acid, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, C7-9 side chain and straight chain alkyl Ester compound, 2-(2H-benzotriazole-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazole-2 -Yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol. Among them, in terms of tilt angle and exposure sensitivity, 3-(2H-benzotriazol-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy, C7-9 side chain and linear alkyl ester compounds. As commercially available benzotriazole compounds, for example, SUMISORB 200, SUMISORB 250, SUMISORB 300, SUMISORB 340, SUMISORB 350 (manufactured by Sumitomo Chemical), JF 77, JF 78, JF 79, JF 80, JF 83 ( Seonghoku Chemical Industry Manufacturing), TINUVIN PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN326, TINUVIN900, TINUVIN928, TINUVIN 1130 (made by BASF), EVERSORB 70, EVERSORB 71, EVERSORB 72, EVERSORB 73, EVERSORB 74, EVERSORB 75, EVERSORB 76, EVERSORB 234, EVERSORB 77, EVERSORB 78, EVERSORB 80, EVERSORB 81 (manufactured by Everlight Chemical Industry, Taiwan), Tomisoap 100, Tomisoap 600 (manufactured by API Corporation), SEESORB 701, SEESORB 702, SEESORB 703, SEESORB 704 , SEESORB 706, SEESORB 707, SEESORB 709 (manufactured by Shipro Kasei), RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.), etc. Examples of tris-based compounds include: 2-[4,6-bis(2,4-xylyl)-1,3,5-tris-2-yl]-5-octyloxyphenol, 2- [4,6-bis(2,4-dimethylphenyl)-1,3,5-tris-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy Yl)phenol, 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-tris 𠯤 and epoxy acrylate 2-ethyl The reaction product of hexyl ester, 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3-5-tris, etc. . Among them, from the viewpoint of tilt angle and exposure sensitivity, a hydroxyphenyl triphenyl compound is preferred. Examples of commercially available tri-based compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, TINUVIN 479 (manufactured by BASF), and the like. As other ultraviolet absorbers, for example, SUMISORB 130 (manufactured by Sumitomo Chemical), EVERSORB 10, EVERSORB 11, EVERSORB 12 (manufactured by Taiwan Everlight Chemical Industry), Tomisoap 800 (manufactured by API Corporation), SEESORB 100, SEESORB 101, SEESORB 101S , SEESORB 102, SEESORB 103, SEESORB 105, SEESORB 106, SEESORB 107, SEESORB 151 (manufactured by Shipro Kasei) and other benzophenone compounds; SUMISORB400 (manufactured by Sumitomo Chemical), phenyl salicylate and other benzoate compounds; cinnamon 2-ethylhexyl methacrylate, 2-ethylhexyl p-methoxycinnamate, isopropyl methoxycinnamate, isoamyl methoxycinnamate and other cinnamic acid derivatives; α-naphthol, β -Naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxyl Naphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, etc. Naphthalene derivatives; anthracene and its derivatives such as anthracene and 9,10-dihydroxyanthracene; azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, acrylic acid Dyes such as phenyl cyanide ester dyes, tri-amino benzoic acid dyes, and p-aminobenzoic acid dyes; etc. Among them, from the viewpoint of exposure sensitivity, it is preferable to use a cinnamic acid derivative and a naphthalene derivative, and it is particularly preferable to use a cinnamic acid derivative. The content ratio of the ultraviolet absorber in the photosensitive resin composition of the present invention relative to the total solid content is usually 0.01% by mass or more, preferably 0.05% by mass or more, more preferably 0.1% by mass or more, and still more preferably 0.5% by mass or more, more preferably 1% by mass or more, and usually 15% by mass or less, preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less. By setting it as above the above lower limit value, the inclination angle tends to increase, and by setting it as below the above upper limit value, there is a tendency for high sensitivity. In addition, with regard to the blending ratio of the (B) photopolymerization initiator, the blending amount of the ultraviolet absorber relative to 100 parts by mass of the (B) photopolymerization initiator is usually 1 part by mass or more, preferably 10 parts by mass Parts by mass or more, more preferably 30 parts by mass or more, more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, and usually 500 parts by mass or less, preferably 300 parts by mass or less, more preferably 200 parts by mass Hereinafter, it is more preferably 150 parts by mass or less. By setting it as above the above lower limit value, the inclination angle tends to increase, and by setting it as below the above upper limit value, there is a tendency for high sensitivity. [1-1-8] Thermal polymerization initiator Furthermore, the photosensitive resin composition for forming a barrier rib for an organic electroluminescence element of the present invention may contain a thermal polymerization initiator. By containing a thermal polymerization initiator, there is a tendency to increase the degree of crosslinking of the film. As a specific example of such a thermal polymerization initiator, an azo compound, an organic peroxide, hydrogen peroxide, etc. are mentioned, for example. These may be used individually by 1 type, and may use 2 or more types together. In addition, when a thermal polymerization initiator is used in combination with a photopolymerization initiator that is expected to increase sensitivity or the crosslinking density of the film, it is preferable that the total content ratio of the photopolymerization initiator is the above-mentioned photosensitive resin composition The content ratio of the photopolymerization initiator, and the combined use ratio of the photopolymerization initiator and the thermal polymerization initiator, from the viewpoint of sensitivity, is preferably relative to 100 parts by mass of the photopolymerization initiator The thermal polymerization initiator is set to 5 to 300 parts by mass. [1-1-9] Amino compound The photosensitive resin composition for forming a barrier rib for an organic electroluminescent element of the present invention may contain an amino compound in order to promote thermal curing. In this case, the content ratio of the amine compound in the photosensitive resin composition is usually 40% by mass or less, preferably 30% by mass or less with respect to the total solid content of the photosensitive resin composition. Also, it is usually 0.5% by mass or more, preferably 1% by mass or more. By setting it below the above upper limit value, storage stability tends to be maintained, and by setting it above the above lower limit value, there is a tendency to ensure sufficient thermosetting properties. As the amino compound, for example, an alkoxymethyl amino compound having at least two hydroxymethyl groups as functional groups is modified by condensation of an alcohol having 1 to 8 carbon atoms. Specifically, for example, melamine resin obtained by condensation polymerization of melamine and formaldehyde; benzoguanamine resin obtained by condensation polymerization of benzoguanamine and formaldehyde; and glycoluril resin obtained by condensation polymerization of glycoluril and formaldehyde; Urea resin obtained by polycondensation of urea and formaldehyde; resin obtained by co-condensation of two or more of melamine, benzoguanamine, glycoluril, or urea with formaldehyde; the methylol of the above resin is modified by alcohol condensation Modified resin and so on. These may be used individually by 1 type, and may use 2 or more types together. As the amine-based compound, among them, melamine resin and its modified resins are preferred, modified resins with a methylol modification ratio of 70% or more are more preferred, and 80% or more modified resins are particularly preferred. As a specific example of the above-mentioned amino compound, as melamine resin and its modified resin, for example, "Cymel" (registered trademark) 300, 301, 303, 350, 736, 738, 370, 771, 325 manufactured by Cytec Corporation can be cited , 327, 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, 1158, and "NIKALAC" (registered trademark) manufactured by Sanwa Chemical Company MW-390, MW -100LM, MX-750LM, MW-30M, MX-45, MX-302, etc. Moreover, as said benzoguanamine resin and its modified resin, "Cymel" (registered trademark) 1123, 1125, 1128, etc. manufactured by Cytec Corporation can be mentioned, for example. In addition, examples of the glycoluril resin and its modified resin include: "Cymel" (registered trademark) 1170, 1171, 1174, 1172, manufactured by Cytec Corporation, and "NIKALAC" (registered trademark) manufactured by Sanwa Chemical Co., Ltd. MX-270 and so on. In addition, examples of the urea resin and its modified resin include "UFR" (registered trademark) 65 and 300 manufactured by Cytec, and "NIKALAC" (registered trademark) MX-290 manufactured by Sanwa Chemical Co., Ltd., and the like. [1-1-10] Coloring agent In the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element of the present invention, a coloring agent may be contained in order to color the barrier ribs. As the coloring agent, well-known coloring agents such as pigments and dyes can be used. In addition, for example, when a pigment is used, a known dispersant or dispersion aid may be used in combination so that the pigment does not aggregate and can stably exist in the photosensitive resin composition. In particular, by coloring the liquid-repellent barrier wall into black, it has the effect of obtaining a clear pixel display. As a black coloring agent, in addition to black dyes, black pigments, carbon black, titanium black, etc., as an effect of maintaining low electrical conductivity, it is also effective to mix organic pigments to color black. The content ratio of the coloring agent is usually 60% by mass or less, preferably 40% by mass or less, relative to the total solid content of the photosensitive resin composition from the viewpoint of plate-making properties and color characteristics. On the other hand, in order to reduce the amount of outgassing from the barrier ribs, it is preferable to make the barrier ribs transparent. In this case, the content of the coloring agent is higher than the total solid content of the photosensitive resin composition. It is preferably 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 0% by mass. [1-1-11] Coatability improver, development improver In the photosensitive resin composition for forming a barrier rib of an organic electroluminescent element of the present invention, in order to improve coatability or development solubility, a coatability improver or development improver may be contained. As the coatability improver or development improver, for example, well-known cationic, anionic, nonionic, fluorine-based, and silicone-based surfactants can be used. Moreover, well-known ones, such as an organic carboxylic acid or its anhydride, can also be used as a development improving agent. In addition, the content ratio is usually 20% by mass or less, and preferably 10% by mass or less from the viewpoint of sensitivity with respect to the total solid components of the photosensitive resin composition. [1-1-12] Silane coupling agent In the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element of the present invention, in order to improve the adhesion to the substrate, it is also preferable to add a silane coupling agent. As the type of silane coupling agent, epoxy-based, methacrylic-based, amino-based, imidazole-based, etc. can be used. From the viewpoint of improving adhesion, epoxy-based and imidazole-based silane coupling agents are particularly preferred. . The content ratio is usually 20% by mass or less, preferably 15% by mass or less from the viewpoint of adhesiveness with respect to the total solid content of the photosensitive resin composition. [1-1-13] Phosphoric acid-based adhesion improver In the photosensitive resin composition for forming a barrier rib of an organic electroluminescent element of the present invention, in order to improve the adhesion to the substrate, it is also preferable to add a phosphoric acid-based adhesion enhancer. The phosphoric acid-based adhesion improving agent is preferably a (meth)acryloxy group-containing phosphoric acid ester, and among them, those represented by the following general formulas (Va), (Vb), and (Vc) are preferred. [化60]

In the above general formulas (Va), (Vb), (Vc), R⁸ Represents a hydrogen atom or a methyl group, r and r'are each independently an integer of 1-10, and s is 1, 2 or 3. [1-1-14] Inorganic filler In addition, the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention may further contain an inorganic filler, and its purpose is to increase the strength as a cured product and to increase the moderate interaction with alkali-soluble resin ( Forming a matrix structure) to produce excellent flatness of the coating film, and increase the inclination angle. As such an inorganic filler, for example, talc, silica, alumina, barium sulfate, magnesium oxide, or those obtained by surface-treating these with various silane coupling agents, etc. can be mentioned. The average particle size of the inorganic fillers is usually 0.005-20 μm, preferably 0.01-10 μm. Here, the average particle size in this embodiment is a value measured by a laser diffraction scattering particle size distribution measuring device manufactured by Beckman Coulter, etc. Among these inorganic fillers, silica sol and modified silica sol tend to have excellent dispersion stability and tilt angle improvement effects, so they are preferably formulated. When the photosensitive resin composition for forming a barrier rib of an organic electroluminescent element of the present invention contains these inorganic fillers, the content is usually 5 mass relative to all solid components from the viewpoint of sensitivity. % Or more, preferably 10% by mass or more, usually 80% by mass or less, preferably 70% by mass or less. [1-1-15] Solvent The photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention usually contains a solvent, and is used in a state where the above-mentioned components are dissolved or dispersed in a solvent (hereinafter, a photosensitive resin composition containing a solvent is used) It is described as the case of "photosensitive resin composition solution"). The solvent is not particularly limited, and examples thereof include the organic solvents described below. That is, examples include: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol third Butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxyethyl pentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl Glycol monoalkyl ethers such as -3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; ethylene two Diethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, dipropylene glycol dimethyl ether and other glycols Dialkyl ethers; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate , Propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate , Diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether ethyl Ester, 3-methyl-3-methoxybutyl acetate, 3-methoxy-1-butyl acetate and other glycol alkyl ether acetates; ethylene glycol diacetate, 1,3- Glycol diacetates such as butanediol diacetate and 1,6-hexanol diacetate; alkyl acetates such as cyclohexanol acetate; pentyl ether, diethyl ether, dipropyl ether, two Isopropyl ether, dibutyl ether, dipentyl ether, ethyl isobutyl ether, dihexyl ether and other ethers; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl Methyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketone, methyl nonyl ketone, methyl Ketones such as oxymethylpentanone; methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, Methoxymethylpentanol, glycerin, benzyl alcohol and other monohydric or polyhydric alcohols; n-pentane, n-octane, diisobutene, n-hexane, hexene, isoprene, dipentene, dodecane and other fats Group hydrocarbons; cyclohexane, methylcyclohexane, methylcyclohexene, dicyclohexyl and other alicyclic hydrocarbons; benzene, toluene, xylene, cumene and other aromatic hydrocarbons; pentyl formate, formic acid Ethyl acetate, ethyl acetate, butyl acetate, propyl acetate, pentyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyrate Butyl ester, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3-methoxypropionate Chain or cyclic ethers such as methyl ester, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; 3- Alkoxy carboxylic acids such as methoxypropionic acid and 3-ethoxypropionic acid; halogenated hydrocarbons such as butyl chloride and pentyl chloride; ether ketones such as methoxymethylpentanone; acetonitrile, benzonitrile, etc. Nitriles; tetrahydrofuran, dimethyltetrahydrofuran, dimethoxytetrahydro Tetrahydrofurans such as furan, etc. Examples of commercially available solvents that meet the above-mentioned examples include mineral spirits, BARSOL#2, Apco#18 solvent, Apco thinner, Socal solvent No.1 and No.2, Solvesso#150, Shell TS28 solvent, carbitol , Ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, diethylene glycol dimethyl ether (All product names) and so on. The above-mentioned solvent is one that can dissolve or disperse the components in the photosensitive resin composition, and is selected according to the method of using the photosensitive resin composition of the present invention. From the viewpoint of coatability, it is preferable to select atmospheric pressure The boiling point of the lower (1013.25 hPa) is in the range of 60~280℃. More preferably, it has a boiling point of 70°C or higher and 260°C or lower. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-acetate are preferred. 1-Butyl ester. These solvents can be used individually by 1 type or in mixture of 2 or more types. In addition, the solvents are preferably such that the ratio of the total solid components in the photosensitive resin composition solution is usually 10% by mass or more, preferably 15% by mass or more, more preferably 20% by mass or more, and usually 90% by mass % Or less, preferably 50% by mass or less, more preferably 40% by mass or less, and still more preferably 30% by mass or less. By setting it above the above lower limit value, there is a tendency to obtain a coating film even for a higher film thickness, and by setting it below the above upper limit value, there is a tendency to obtain moderate coating uniformity . [1-2] Physical properties of photosensitive resin composition for forming barrier ribs of organic electroluminescence element Examples of the physical properties of the photosensitive resin composition for forming barrier ribs of organic electroluminescent elements of the present invention include acid value. The acid value of the photosensitive resin composition for forming barrier ribs of organic electroluminescence elements with respect to all solid components is not particularly limited, but is preferably 20 mgKOH/g or more, more preferably 22 mgKOH/g or more, and still more preferably 24 mgKOH/g or more, more preferably 26 mgKOH/g or more, particularly preferably 28 mgKOH/g or more, and usually 60 mgKOH/g or less, preferably 55 mgKOH/g or less, more preferably 50 mgKOH /g or less, more preferably 40 mgKOH/g or less, and particularly preferably 35 mgKOH/g or less. By setting it to above the above lower limit, the solubility in the developer is high and the unexposed part can be sufficiently dissolved and removed, thereby tending to increase the inclination angle. In addition, by setting the above upper limit Value below, the development adhesion tends to become better. [1-3] Preparation method of photosensitive resin composition for forming barrier ribs of organic electroluminescence element The photosensitive resin composition for forming a barrier rib for an organic electroluminescence element of the present invention is prepared by mixing the above-mentioned components with a stirrer. Furthermore, it is also possible to perform filtration using a membrane filter etc. so that the prepared photosensitive resin composition may become uniform. [2] The barrier wall and the formation method of the barrier wall The photosensitive resin composition of the present invention can be used to form barrier ribs, especially barrier ribs for dividing the organic layer (light-emitting part) of an organic electroluminescence element. The method of forming a barrier rib (barrier) using the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element described above is not particularly limited, and a conventionally known method can be used. As a method of forming the barrier ribs, for example, there may be mentioned: a coating step including coating a photosensitive resin composition for forming a barrier rib of an organic electroluminescence element on a substrate to form a photosensitive resin composition layer; The composition layer is exposed to the exposure step method. As a specific example of the method of forming such barrier ribs, photolithography can be cited. In the photolithography method, a photosensitive resin composition for forming a barrier rib of an organic electroluminescent element is applied to the entire surface of a region of a substrate for forming a barrier rib to form a photosensitive resin composition layer. After exposing the formed photosensitive resin composition layer according to the pattern of the specific barrier rib, the exposed photosensitive resin composition layer is developed to form the barrier rib on the substrate. In the coating step of applying the photosensitive resin composition on the substrate in the photolithography method, use a roll coater, a reverse coater, and a bar coater on the substrate where the barrier wall should be formed Contact transfer type coating equipment such as machine, spin coater (rotary coating equipment), curtain-type flat coater and other non-contact coating equipment to coat the photosensitive resin composition, if necessary, dry it The solvent is removed to form a photosensitive resin composition layer. Then, in the exposure step, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light using a negative mask, and the photosensitive resin composition layer is partially exposed depending on the pattern of the barrier ribs. In the exposure, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, carbon arc lamps and other light sources that emit ultraviolet light can be used. The amount of exposure varies depending on the composition of the photosensitive resin composition, for example, it is preferably 10~400 mJ/cm² about. Then, in the development step, the barrier ribs are formed by developing the photosensitive resin composition layer obtained by exposing the pattern of the visual barrier ribs with a developer. The development method is not particularly limited, and a dipping method, spray method, etc. can be used. Specific examples of the developer include: dimethylbenzylamine, monoethanolamine, diethanolamine, triethanolamine and other organic compounds, or aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, quaternary ammonium salts, etc. . In addition, a defoamer or a surfactant may be added to the developer. After that, the barrier ribs after development are post-baked and heat-cured. The post-baking is preferably performed at 150-250°C for 15-60 minutes. The substrate used for the formation of the barrier ribs is not particularly limited, and is appropriately selected according to the type of organic electroluminescence element manufactured using the substrate on which the barrier ribs are formed. As a preferable substrate material, glass or various resin materials can be cited. Specific examples of resin materials include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonate; poly(meth)methacrylic resin; Imine. Among the materials for these substrates, glass and polyimide are preferred in terms of excellent heat resistance. In addition, depending on the type of organic electroluminescence element to be manufactured, a transparent electrode layer such as ITO or ZnO can be pre-arranged on the surface of the substrate for forming the barrier wall. [3] Organic electroluminescence element The organic electroluminescence element of the present invention includes a barrier wall composed of the photosensitive resin composition for forming a barrier rib for an organic electroluminescence element described above. Various optical elements are manufactured using the substrate provided with the barrier rib pattern manufactured by the method described above. The method of forming the organic electroluminescence element is not particularly limited. Preferably, after forming the barrier rib pattern on the substrate by the above method, inject ink into the area surrounded by the barrier rib on the substrate to form an organic layer such as pixels , Thereby manufacturing an organic electroluminescence element. As the type of the organic electroluminescence element, a bottom emission type or a top emission type can be cited. For the bottom emission type, for example, a barrier wall is formed on a glass substrate laminated with transparent electrodes, and a hole transport layer, a light emitting layer, an electron transport layer, and a metal electrode layer are laminated in an opening surrounded by the barrier wall. On the other hand, with regard to the top emission type, for example, barrier ribs are formed on a glass substrate on which metal electrode layers are laminated, and an electron transport layer, a light emitting layer, a hole transport layer, and a transparent electrode layer are laminated in an opening surrounded by the barrier ribs. Make it. Furthermore, as the light-emitting layer, an organic electroluminescent layer as described in Japanese Patent Laid-Open No. 2009-146691 or Japanese Patent No. 5736681 can be cited. In addition, quantum dots as described in Japanese Patent No. 5653387 or Japanese Patent No. 5653101 may also be used. When the inclination angle of the barrier wall is small and the lower part of the barrier wall has a skirt-like bottom shape as shown in Fig. 1, even if the vapor deposition layer is formed on the upper part of the part, no light will be emitted, so the light emitting area will be reduced. In addition, when the light-emitting layer is produced by the inkjet method, the ink for forming the organic layer is repelled by the skirt portion of the barrier wall, so the area surrounded by the barrier wall is not uniformly covered by the ink for forming the organic layer. situation. In contrast, by making a good shape with a large inclination angle and no skirt-like bottom, it can emit light in the area surrounded by the barrier ribs. In addition, in the inkjet method, the organic layer forming ink can be used. Cover uniformly. In this way, for example, the problem of halation in organic EL display devices can be solved. As the solvent used when forming the ink for forming an organic layer, water, organic solvents, and mixed solvents thereof can be used. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Specific examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, Methanol, ethanol, isopropanol, ethyl acetate, butyl acetate, 3-phenoxy toluene, etc. In addition, surfactants, antioxidants, viscosity modifiers, ultraviolet absorbers, etc. can be added to the ink. As a method of injecting ink into the area surrounded by the barrier wall, in terms of being able to easily inject a small amount of ink into a specific location, an inkjet method is preferred. The ink used in the formation of the organic layer is appropriately selected according to the type of organic electroluminescence element to be manufactured. When the ink is injected by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be ejected from the inkjet head well, and it is preferably 4-20 mPa·s, more preferably 5-10 mPa ·S. The viscosity of the ink can be adjusted by adjusting the solid content of the ink, changing the solvent, and adding viscosity modifiers. [4] Image display device The image display device of the present invention includes the above-mentioned organic electroluminescence element. As long as it contains organic electroluminescent elements, there is no particular limitation on the external shape or structure of the image display device. For example, active driving organic electroluminescent elements can be used and assembled according to conventional methods. For example, the image display device of the present invention can be formed by the method described in "Organic EL Display" (Omsha, published on August 20, 2004, by Shishishi, Adachi Chinami, Hideyuki Murata). For example, an organic electroluminescence element emitting white light can be combined with a color filter for image display, or an organic electroluminescence element having different luminescence colors such as RGB can be combined for image display. [5] Lighting The lighting of the present invention includes the above-mentioned organic electroluminescence element. Regarding the shape or structure, there is no particular limitation. The organic electroluminescent device of the present invention can be used and assembled according to conventional methods. As the organic electroluminescence element, it can be set to a simple matrix drive method or an active matrix drive method. In order to make the illumination of the present invention emit white light, organic electroluminescence elements emitting white light can also be used. Furthermore, it is possible to combine organic electroluminescent elements with different luminous colors and to mix the colors to form a white structure, or it may be configured to adjust the color mixing ratio to give a toning function. Example Hereinafter, the photosensitive resin composition for forming barrier ribs for organic electroluminescent elements of the first aspect of the present invention will be described with specific examples, but the present invention is not limited to the following as long as it does not exceed the gist of the present invention Examples. [1] Preparation and evaluation of photosensitive resin composition for forming barrier ribs of organic electroluminescence element Each component was used in the blending ratio (parts by mass) described in Table 1, and propylene glycol monomethyl ether acetate was used so that the content ratio of all solid components became 25% by mass, and the components were stirred until they became uniform. The photosensitive resin compositions for forming barrier ribs of organic electroluminescent elements of Examples and Comparative Examples were prepared. Furthermore, the values in Table 1 mean the values of solid components. In addition, the symbols in the table indicate the following. a-1: Dipentaerythritol hexaacrylate (DPHA) (manufactured by Nippon Kayaku Co., Ltd.) b-1: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Hodogaya Chemical Co., Ltd.) b-2: Irgacure 369 (manufactured by BASF, the compound with the following chemical structure) [化61]

d-1: MEGAFAC RS-72-K (manufactured by DIC, fluorine series, oligomer with ethylenic double bond) e-1: 2-Mercaptobenzimidazole (manufactured by Tokyo Kasei Corporation) e-2: Pentaerythritol tetrakis (3-mercaptopropionate) (manufactured by Yide Chemical Company) f-1: TINUVIN 384-2 (manufactured by BASF, UV absorber) g-1: KAYAMER PM-21 (manufactured by Nippon Kayaku Corporation) c-1: The following alkali-soluble resins containing ethylenically unsaturated groups (equivalent to epoxy (meth)acrylate resin (c1-1)) 100 parts by mass of bisphenol A epoxy compound represented by the following formula (epoxy equivalent of 186 g/eq, where n is a mixture of 1-20), 40 parts by mass of acrylic acid, and 0.06 of p-methoxyphenol Parts by mass, 2.4 parts by mass of triphenylphosphine, and 126 parts by mass of propylene glycol monomethyl ether acetate were added to the reaction vessel, and stirred at 95°C until the acid value became 5 mgKOH/g or less. Then, 12 parts by mass of propylene glycol monomethyl ether acetate and 4.5 parts by mass of succinic anhydride were added to 80 parts by mass of the reaction liquid obtained by the above reaction, and reacted at 95°C for 3 hours to obtain a solid content acid value An alkali-soluble resin (c-1) solution with 60 mgKOH/g and a weight average molecular weight (Mw) of 8,000 in terms of polystyrene measured by GPC. [化62]

c-2: The following acrylic copolymer resin (equivalent to (c2) acrylic copolymer resin) Make the copolymer resin with tricyclodecane methacrylate/styrene/glycidyl methacrylate (molar ratio: 0.032/0.069/0.899) as the constituent monomers and the same amount as glycidyl methacrylate Acrylic acid undergoes an addition reaction, and succinic anhydride is further added so that a molar ratio of 0.24 with respect to 1 mol of the above-mentioned copolymerized resin is added to obtain an alkali-soluble acrylic copolymer resin (c-2) solution. The solvent is propylene glycol monomethyl ether acetate. The polystyrene conversion weight average molecular weight (Mw) measured by GPC is 4,800, and the solid content acid value is 62.1 mgKOH/g. c-3: The following acrylic copolymer resins Make the copolymer resin with tricyclodecane methacrylate/styrene/glycidyl methacrylate (molar ratio: 0.3/0.1/0.6) as the constituent monomers and the same amount as glycidyl methacrylate Acrylic acid undergoes an addition reaction, and tetrahydrophthalic anhydride is added to obtain a solution of alkali-soluble acrylic copolymer resin (c-3) by adding tetrahydrophthalic anhydride in a molar ratio of 0.39 relative to 1 mol of the above-mentioned copolymerized resin. . The solvent is propylene glycol monomethyl ether acetate. The polystyrene conversion weight average molecular weight (Mw) measured by GPC is 8,400, and the solid content acid value is 81.4 mgKOH/g. The evaluation of the physical properties of the photosensitive resin composition for forming a barrier rib of an organic electroluminescence element was performed by the method described below. (Determination of acid value) The acid value can be measured by the method described in JIS K0070-1992. In addition to directly measuring the photosensitive resin composition, the acid value of the photosensitive resin composition can also be calculated from the acid value and content of acid group-containing components such as resins. (Determination of gas quantity) Using a spin coater, the photosensitive resin composition for forming each barrier rib was applied on the glass substrate so that it had a thickness of 1.7 μm after heat curing. Then heat and dry it on a hot plate at 95°C for 2 minutes. For the obtained coating film, use an exposure amount of 100 mJ/cm without using a mask.² Perform full-surface exposure. The intensity at the wavelength of 365 nm at this time is 7.5 mW/cm² . Furthermore, after performing spray development for 60 seconds with a 2.38% by mass TMAH (tetramethylammonium hydroxide) aqueous solution at 24° C., it was washed with pure water for 10 seconds. The substrate was heat-cured in an oven at 230°C for 30 minutes to obtain a substrate for gas quantity measurement with a cured product. Using GC/MS (manufactured by Agilent Technologies, trade name "5973N"), the prepared substrate for gas quantity measurement (40 mm×8 mm, 4 pieces) was heated in a heating furnace at 230°C for 20 minutes Analyze the outgassing and calculate the sum of the area of all the components of the detected wave crest. However, the peak corresponding to tetramethylammonium derived from the TMAH (tetramethylammonium hydroxide) aqueous solution was excluded for calculation. Then, based on the sum of the detected peak areas, use the calibration curve to convert to toluene, divide by the measured substrate area, and calculate the outgassed amount per unit area converted to toluene (ng/cm² ). The results are shown in Table 1. Furthermore, the calibration curve is to use toluene with a known concentration, measure GC/MS, and plot the amount of toluene and the peak area value of the detected gas to create the calibration curve. (Measurement of contact angle) Using a spin coater, the photosensitive resin composition for forming each barrier rib was applied on the glass substrate so that it had a thickness of 1.7 μm after heat curing. After that, heat and dry on a hot plate at 95°C for 2 minutes. For the obtained coating film, use an exposure amount of 100 mJ/cm without using a mask.² Perform full-surface exposure. The intensity at the wavelength of 365 nm at this time is 7.5 mW/cm² . Then, after performing spray development for 60 seconds with a 2.38% by mass TMAH (tetramethylammonium hydroxide) aqueous solution at 24° C., it was washed with pure water for 10 seconds. The substrate was heat-cured in an oven at 230°C for 30 minutes to obtain a substrate for contact angle measurement with a cured product. The contact angle is measured by the Drop Master500 contact angle measuring device manufactured by Concord Interface Science Co., Ltd., under the condition of 23°C and 50% humidity. 0.7 μL of propylene glycol methyl ether acetate was dropped on the hardened material of the substrate for contact angle measurement, and the contact angle after 1 second was measured. The measurement results are shown in Table 1. A larger contact angle indicates a higher liquid repellency. [2] Formation and evaluation of barriers The formation and performance evaluation of barrier ribs were carried out using the methods described below. (The formation of barriers) Using a spin coater, the photosensitive resin composition for forming each barrier rib was coated on the ITO film of the glass substrate with the ITO film formed on the surface so as to have a thickness of 1.7 μm after heat curing. After that, heat and dry on a hot plate at 95°C for 2 minutes, using a photomask (a mask with multiple coverings of 80 μm×280 μm at 10 μm intervals), with an exposure gap of 16 μm, using a wavelength of 365 nm The strength below is 7.5 mW/cm² The ultraviolet rays, the exposure amount becomes 100 mJ/cm² The method is to expose the obtained coating film. The ultraviolet irradiation at this time is carried out under the air. Then, after performing jet development for 60 seconds with a 2.38% by mass TMAH (tetramethylammonium hydroxide) aqueous solution at 24°C, it was washed with pure water for 1 minute. The unneeded part is removed by such operations and the patterned substrate is heated and cured in an oven at 230°C for 30 minutes to form a grid-shaped barrier wall. (Evaluation of the inclination angle and line width of the barrier wall) The grid-shaped barrier ribs were cut to prepare samples for cross-sectional observation, and the cross-sectional shape of the barrier ribs was observed using a scanning electron microscope (SEM, manufactured by Keyence Corporation), and the inclination angle was measured. The measurement results are shown in Table 1. Regarding the cross-sectional shape of the barrier wall, it was observed that it was substantially in the shape of a trapezoid. In this cross-sectional view, as shown in FIG. 1, the interface between the barrier rib 1 and the ITO film 2 is set to S, and the height of the barrier rib is set to H. On the oblique side of the barrier wall, the tangent line between the interface S and the oblique side connected to it is set to T, and the angle formed by the tangent T and the interface S is measured and set as the inclination angle. The larger the inclination angle, the better the developability and the more difficult it is to generate residue. In inkjet coating, there is a tendency to wet and spread more easily. (Evaluation of the suitability of inkjet coating for barrier ribs) On the substrate with the grid-shaped barrier ribs, the pixel portion surrounded by the grid-shaped barrier ribs was ink-jet coated with DMP-2831 manufactured by Fuji Film. As the ink, a solvent (isoamyl benzoate) was used alone, and 80 pL was applied per pixel, and the presence or absence of collapse (a phenomenon that the ink crossed the barrier wall and mixed into the adjacent pixel portion) was evaluated. The evaluation results are described in Table 1. The less ruptured, the higher the liquid repellency. [Routh Evaluation] ○: The ink can be applied to the pixel without overflowing outside the barrier wall. △: A part of the ink spreads to the upper surface of the barrier wall, but basically does not overflow to the outside of the barrier wall. ×: The ink overflows from the entire surface of the upper surface of the barrier wall in the pixel and is mixed into the adjacent pixel portion. (Outbreak) (Evaluation of the inclination angle and line width of the barrier wall-2) Using a spin coater, the photosensitive resin composition for forming the barrier ribs of Examples 1 and 2 was applied to the ITO film of the glass substrate with the ITO film formed on the surface so that the photosensitive resin composition for forming the barrier ribs of Examples 1 and 2 was heated and hardened to a thickness of 1.7 μm. superior. After that, under the same conditions as above, heat and dry on a hot plate to obtain a coating film. For the coating film, a mask (a mask with a plurality of covering parts of 80 μm×280 μm at 40 μm intervals is used ), other than that, perform the same exposure, development, and heat curing to form grid-shaped barrier walls. In the same manner as above, the cross-sectional shape of the barrier wall was observed with a scanning electron microscope (SEM, manufactured by Keyence Corporation), and the inclination angle and line width were measured. The result is that the inclination angles of Examples 1 and 2 are 29 respectively. °, 20°, the line widths of Examples 1 and 2 are both 40 μm. In addition, the opening width (horizontal width, vertical width) of the lower part of the barrier wall was measured, and these were multiplied to calculate the area of the opening. As a result, both Examples 1 and 2 were 100%. Furthermore, the area of the opening is a relative value relative to the area of the corresponding shielding portion. The smaller the inclination angle, the larger the line width of the barrier wall and the smaller the area of the opening. [Table 1] Table 1 (Parts by mass) Example 1 Example 2 Example 3 Example 4 Example 5 Comparative example 1 Comparative example 2 Composition ratio (parts by mass)※ (A) Ethylene unsaturated compound a-1 46.7 46.7 47.2 47.2 47.2 46.7 47.7 (B) Photopolymerization initiator b-1 2.0 2.0 2.0 2.0 2.0 b-2 2.0 2.0 (C) Alkali-soluble resin c-1 46.7 47.2 47.2 47.2 47.7 c-2 46.7 c-3 46.7 (D) Liquid repellent d-1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 (E) Chain transfer agent e-1 1.0 1.0 1.0 1.0 e-2 1.0 1.0 1.0 1.0 1.0 UV absorber f-1 2.0 2.0 2.0 2.0 2.0 2.0 2.0 additive g-1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Evaluation results Outgassing amount (ng/cm ² ) 42.2 1.3 0.7 1.1 9.7 195.7 1.1 Tilt angle (°) 17 47 37 20 27 20 11 Contact angle (°) 35 46 47 43 43 4 4 Inkjet coating evaluation 〇 〇 △ △ 〇 X X ※The blending ratio refers to the blending ratio of the solid components of each component relative to the total solid components. According to Table 1, the release of the substrate obtained by using the photosensitive resin composition for forming barrier ribs containing alkali-soluble resins (c-1) and (c-2) added with succinic acid as in Examples 1 to 5 The amount of gas is significantly less than the amount of outgassing of the substrate obtained by using the photosensitive resin composition for forming barrier ribs containing the alkali-soluble resin (c-3) added with tetrahydrophthalic acid as in Comparative Example 1. Based on this, it was confirmed that the photosensitive resin composition for barrier rib formation containing an alkali-soluble resin with a short carbon chain like succinic acid and a photosensitive resin composition containing a long carbon chain like tetrahydrophthalic acid Compared with the photosensitive resin composition for forming barrier ribs of acid-base soluble resin, the outgassing amount after heating and curing caused by baking at 230°C for 30 minutes becomes less, and the outgassing amount is measured under the conditions of the gas heated at 230°C. Fewer. It is believed that the reason is that the acid with a shorter carbon chain such as succinic acid is basically decomposed and removed during post-baking, and even if it is heated at 230°C afterwards, the gas derived from the acid will not be generated. In addition, from Table 1, it can be seen that the photosensitive resin composition containing a chain transfer agent as in Example 5 has a sufficiently large inclination angle compared to the photosensitive resin composition not containing a chain transfer agent as in Comparative Example 2. It is considered that the inclusion of a chain transfer agent improves the deactivation of free radicals near the surface caused by oxygen suppression or the like, and the surface hardenability becomes higher and the tilt angle becomes larger. In addition, it can be seen that even in inkjet coating that sufficiently increases the contact angle, the coating can be applied without causing collapse. It is thought that this is because the inclusion of the chain transfer agent improves the surface hardening property, thereby suppressing the outflow of the liquid repellent and fixes the liquid repellent near the surface. Furthermore, from the comparison of Examples 2 to 4, it can be seen that even when the contact angle is the same and the inclination angle is larger, the force (surface energy) of the ink on the side of the barrier wall that the ink intends to diffuse outside the barrier wall becomes smaller, and even if it is With the thinned barrier wall, the surface hardenability of the upper part of the barrier wall is also higher, and the liquid repellent can be more fixed near the surface. As a result, the inkjet coating adaptability becomes better. According to the comparison of Examples 1 and 2, compared with (c2) acrylic copolymer resin, alkaline developer is more difficult to penetrate (c1) epoxy (meth)acrylate resin. Therefore, it is considered that compared with Example 1, implementation Example 2 has a larger tilt angle. Hereinafter, the photosensitive resin composition for forming barrier ribs for organic electroluminescent elements of the second aspect of the present invention will be described with specific examples, but the present invention is not limited to the following as long as it does not exceed the gist of the present invention Examples. [I] Preparation of photosensitive resin composition for forming barrier ribs Each component was used in the blending ratio (parts by mass) described in Table 2, and propylene glycol monomethyl ether acetate was used so that the content ratio of all solid components became 25% by mass, and the components were stirred until they became uniform. And the photosensitive resin composition for barrier rib formation of the Example and the comparative example were prepared. In addition, the symbols in the table indicate the following. a-11: The following mixture of ethylenically unsaturated compounds [(A1) The mixture of ethylenically unsaturated compounds with acid groups and (A2) the mixture of ethylenically unsaturated compounds without acid groups] The presence of 490 parts by mass of a mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value 113 mgKOH/g) in 148 parts by mass of phthalic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone The reaction was carried out at 100°C for 5 hours to obtain the following mixture a-11 containing the phthalic anhydride modified product of pentaerythritol triacrylate and pentaerythritol tetraacrylate at 70:30 (mass ratio). [化63]

a-12: The following mixture of ethylenically unsaturated compounds [(A1) a mixture of ethylenically unsaturated compounds with acid groups and (A2) a mixture of ethylenically unsaturated compounds without acid groups] Make the mixture of pentaerythritol triacrylate and pentaerythritol tetraacrylate (hydroxyl value 100 mgKOH/g) 561 parts by mass in the presence of 100 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone. The reaction was carried out at °C for 5 hours to obtain the following mixture a-12 containing the succinic anhydride modified product of pentaerythritol triacrylate and pentaerythritol tetraacrylate at 60:40 (mass ratio). [化64]

a-13: The mixture of the following ethylenically unsaturated compounds [(A1) The mixture of ethylenically unsaturated compounds with acid groups and (A2) the ethylenically unsaturated compounds without acid groups] Make 1,000 parts by mass of a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (hydroxyl value 51 mgKOH/g) in the presence of 49 parts by mass of succinic anhydride, 2.5 parts by mass of triethylamine, and 0.25 parts by mass of hydroquinone The reaction was carried out at 100°C for 5 hours, and the succinic anhydride modified product of dipentaerythritol pentaacrylate, dipentaerythritol pentaacrylate, and dipentaerythritol hexaacrylate containing 25:25:50 (mass ratio) were obtained as shown below The mixture a-13. [化65]

a-14: Pentaerythritol tetraacrylate (PE-4A) (manufactured by Kyoeisha Chemical Co., Ltd.) b-1: 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole (manufactured by Hodogaya Chemical Industry Co., Ltd.) c-4: The following resins containing ethylenically unsaturated groups (epoxy acrylate resins) 100 parts by mass of bisphenol A epoxy compound represented by the following formula (epoxy equivalent of 186 g/eq, where n is a mixture of 1-20), 40 parts by mass of acrylic acid, and 0.06 of p-methoxyphenol Parts by mass, 2.4 parts by mass of triphenylphosphine, and 126 parts by mass of propylene glycol monomethyl ether acetate were added to the reaction vessel, and stirred at 95°C until the acid value became 5 mgKOH/g or less. Then, to 80 parts by mass of the reaction liquid obtained by the above reaction, 3 parts by mass of propylene glycol monomethyl ether acetate and 3 parts by mass of succinic anhydride were added, and the reaction was carried out at 95°C for 3 hours to obtain the solid content acid value An alkali-soluble resin (c-4) solution with 40 mgKOH/g and a weight average molecular weight (Mw) of 8,000 in terms of polystyrene measured by GPC. [化66]

d-1: MEGAFAC RS-72-K (manufactured by DIC, fluorine series, oligomer with ethylenic double bond) e-1: 2-Mercaptobenzimidazole (manufactured by Tokyo Kasei Corporation) e-2: Pentaerythritol tetrakis (3-mercaptopropionate) (manufactured by Yide Chemical Company) f-1: TINUVIN384-2 (manufactured by BASF, ultraviolet absorber) g-1: KAYAMER PM-21 (manufactured by Nippon Kayaku Corporation) [Table 2] Table 2 (parts by mass) Example 1 Example 2 Example 3 Example 4 Comparative experiment example 1 Comparative experiment example 2 (A) Ethylene unsaturated compound a-11 30 19 52 a-12 twenty two a-13 52 a-14 twenty two 33 30 52 (B) Photopolymerization initiator b-1 2 2 2 2 2 2 (C) Alkali-soluble resin c-4 42 42 42 42 42 42 (D) Liquid repellent d-1 0.1 0.1 0.1 0.1 0.1 0.1 Chain transfer agent e-1 1 1 1 1 1 1 e-2 1 1 1 1 1 1 UV absorber f-1 2 2 2 2 2 2 additive g-1 0.5 0.5 0.5 0.5 0.5 0.5 Proportion of ethylenically unsaturated compounds with acid groups in all solid components twenty one% 13% 13% 13% 36% 0% The ratio of ethylenically unsaturated compounds with acid groups in ethylenically unsaturated compounds 40% 26% 25% 25% 70% 0% Evaluation results Minimum exposure (mJ/cm ² ) 100 100 100 100 200 100 Outgassing amount (ng/cm ² ) 49 49 40 33 100 58 Inkjet coating adaptability evaluation 〇 〇 〇 〇 〇 X [II] The formation of hardened products and barriers, and their evaluation The method of performance evaluation of each photosensitive resin composition is demonstrated below. (Production of substrate for contact angle measurement) Prepare 10 substrates for each photosensitive resin composition for forming barrier ribs. These substrates are coated with a spin coater so that the photosensitive resin composition for forming barrier ribs becomes 1.5 μm thick after being cured by heating Obtained on the ITO film of a glass substrate with an ITO film formed on the surface. Then heat and dry on a hot plate at 100°C for 2 minutes. For the obtained coating film, no mask is used, and the exposure amount for each substrate is 50~500 mJ/cm² Every 50 mJ/cm within the range² Make changes for exposure. The intensity at the wavelength of 365 nm at this time is 40 mW/cm² . Then, after performing spray development for 60 seconds with a 2.38% by mass TMAH (tetramethylammonium hydroxide) aqueous solution at 24° C., it was washed with pure water for 10 seconds. The substrate was heat-cured in an oven at 230°C for 30 minutes to obtain a substrate for contact angle measurement on which a cured product was formed. (Evaluation of contact angle) The curability is different according to the sensitivity of the composition, so the amount of exposure to produce liquid repellency varies depending on the composition. The amount of exposure that produces liquid repellency here means the amount of exposure at which the contact angle of the obtained cured product becomes 10 degrees or more. Using the above-mentioned substrate for contact angle measurement, the contact angle with respect to propylene glycol monomethyl ether acetate was measured, and a substrate having a contact angle of 10 degrees or more was identified. The minimum exposure amount during the production of these substrates is recorded in Table 2 in the form of the minimum exposure amount. Furthermore, the contact angle was measured with the Drop Master 500 contact angle measuring device manufactured by Concord Interface Science Co., Ltd. at 23°C and 50% humidity. (Making of the barrier wall) Using a spin coater, the photosensitive resin composition for forming each barrier rib was applied to the ITO film of the glass substrate having the ITO film formed on the surface so as to have a thickness of 1.5 μm after heat curing. After that, it was heated and dried on a hot plate at 100°C for 2 minutes. For the obtained coating film, a photomask is used for exposure. The exposure amount is the minimum exposure amount that produces liquid repellency, and the exposure gap is set to 16 μm. The mask is a mask with grid-shaped openings (a mask with multiple coverings of 80 μm×280 μm at 40 μm intervals). Then, in the same manner as the production of the substrate for contact angle measurement, after developing with a TMAH aqueous solution, it was heated and hardened to obtain a grid-shaped barrier rib. (Evaluation of suitability for inkjet coating) On the substrate with the grid-shaped barrier ribs, the light-emitting portion (pixel portion) surrounded by the grid-shaped barrier ribs was ink-jet coated with DMP-2831 manufactured by Fuji Film. As the ink, a solvent (isoamyl benzoate) was used alone, and 40 pL was applied per pixel to evaluate the wetness and spreadability. The more wetting and spreading of the entire area in the pixel portion, the less residue and the like during the production of the barrier ribs, and the better the developability. ○: The ink spreads to the entire area in the pixel portion. ×: The portion where the ink is not diffused is locally generated in the pixel portion. (Production of substrate for gas quantity measurement) Using a spin coater, the photosensitive resin composition for forming each barrier rib was applied to the ITO film of the glass substrate having the ITO film formed on the surface so as to have a thickness of 1.5 μm after heat curing. After that, it was heated and dried on a hot plate at 100°C for 2 minutes. For the obtained coating film, no mask is used, and exposure is carried out at the minimum exposure amount that produces liquid repellency as described above. The intensity at the wavelength of 365 nm at this time is 40 mW/cm² . Then, in the same manner as the production of the substrate for contact angle measurement, after developing with a TMAH aqueous solution, it was heated and cured in an oven at 230°C for 30 minutes to obtain a substrate for gas quantity measurement on which a cured product was formed. (Determination of gas quantity) Using GC/MS (manufactured by Agilent Technologies, trade name "5973N"), the prepared substrate for gas quantity measurement (40 mm×8 mm, 4 pieces) was heated in a heating furnace at 230°C for 20 minutes Analyze the outgassing and calculate the sum of the area of all the components of the detected wave crest. Then, based on the sum of the detected peak areas, use the calibration curve to convert to toluene, divide by the measured substrate area, and calculate the outgassed amount per unit area converted to toluene (ng/cm² ). Furthermore, the calibration curve is to use toluene with a known concentration, measure GC/MS, and plot the amount of toluene and the peak area value of the detected gas to create the calibration curve. According to Table 2, the barrier rib system obtained from the photosensitive resin composition of each example containing the ethylenically unsaturated compound having an acid group at a specific ratio has good inkjet coating adaptability and low outgassing. It is considered that the reason is that by using an ethylenically unsaturated compound having an acid group with excellent solubility, the generation of residues in the pixel portion is suppressed to improve the inkjet characteristics, and the blending amount is set to a specific amount or less, and the inkjet characteristics can be improved. Inhibit outgassing from acid groups. On the other hand, the barrier wall obtained from the photosensitive resin composition of Comparative Example 1 containing a large amount of ethylenically unsaturated compounds having acid groups has good ink-jet coating adaptability, but has a large amount of outgassing, which is believed to be due to : The amount of outgassing derived from acid groups is higher. In addition, the barrier ribs obtained from the photosensitive resin composition of Comparative Example 2 which does not contain an ethylenically unsaturated compound having an acid group are not sufficient in inkjet coating adaptability. Residue. Furthermore, regarding inkjet coating adaptability, whether the ink spreads over the entire area in the pixel portion is due to whether the liquid repellency derived from the residue is generated in the pixel portion. Therefore, even when a solvent other than isoamyl benzoate is used, the same results as the above-mentioned Examples and Comparative Examples can be obtained. The present invention has been described in detail using specific aspects, but it is clear to the industry that various changes and changes can be made without departing from the intent and scope of the present invention. Furthermore, this application is based on a Japanese patent application filed on September 5, 2016 (Japanese Patent Application No. 2016-172875) and a Japanese patent application filed on February 17, 2017 (Japanese Patent Application May 2017-028181), use its entirety by quoting.

1: barrier wall 2: ITO film 3: Glass substrate H: The height of the barrier wall S: The interface between the barrier wall and the ITO film T: Tangent line between interface S and the hypotenuse connected to it

Figure 1 is an explanatory diagram of the evaluation method of the inclination angle of the barrier wall.

1: barrier wall

2: ITO film

3: Glass substrate

H: The height of the barrier wall

S: The interface between the barrier wall and the ITO film

T: Tangent line between interface S and the hypotenuse connected to it

Claims (10)

A photosensitive resin composition which is used to divide the light-emitting part and contains (A) an ethylenically unsaturated compound, (B) a photopolymerization initiator, and (C) an alkali-soluble resin, and The above-mentioned (A) ethylenically unsaturated compound contains (A1) an ethylenically unsaturated compound having an acid group, and the content of the above-mentioned (A1) an ethylenically unsaturated compound having an acid group is 30% by mass or less in the total solid content . The photosensitive resin composition according to claim 1, wherein the above-mentioned (A) ethylenically unsaturated compound further contains (A2) an ethylenically unsaturated compound which does not have an acid group. The photosensitive resin composition of claim 1 or 2, wherein the content of (A1) the ethylenically unsaturated compound having an acid group is 50% by mass or less in the (A) ethylenic unsaturated compound. The photosensitive resin composition according to any one of claims 1 to 3, which further contains (D) a liquid repellent. The photosensitive resin composition according to any one of claims 1 to 4, which further contains a chain transfer agent. The photosensitive resin composition according to any one of claims 1 to 5, which further contains an ultraviolet absorber. A barrier wall composed of the photosensitive resin composition according to any one of claims 1 to 6. An organic electroluminescence element, which is provided with a barrier wall as claimed in claim 7. An image display device comprising the organic electroluminescence element as claimed in claim 8. A lighting comprising the organic electroluminescence element according to claim 8.

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