WO2018040792A1 - 一种触控基板及其制造方法、触控装置 - Google Patents

一种触控基板及其制造方法、触控装置 Download PDF

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Publication number
WO2018040792A1
WO2018040792A1 PCT/CN2017/094035 CN2017094035W WO2018040792A1 WO 2018040792 A1 WO2018040792 A1 WO 2018040792A1 CN 2017094035 W CN2017094035 W CN 2017094035W WO 2018040792 A1 WO2018040792 A1 WO 2018040792A1
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WIPO (PCT)
Prior art keywords
touch
signal line
substrate
pattern
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/094035
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English (en)
French (fr)
Inventor
谢晓冬
胡明
张明
王静
朱雨
王钰雷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/752,643 priority Critical patent/US20190034012A1/en
Publication of WO2018040792A1 publication Critical patent/WO2018040792A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present disclosure relates to the field of touch technologies, and in particular, to a touch substrate, a method of manufacturing the same, and a touch device.
  • the touch panel realizes simple and flexible human-computer interaction by calculating the coordinates of the contacts in the touch area and processing information.
  • Embodiments of the present disclosure provide a touch substrate, a method of manufacturing the same, and a touch device.
  • An embodiment of the present disclosure provides a touch substrate including a plurality of horizontally and vertically intersecting first touch electrodes and second touch electrodes disposed on a base substrate in a touch area, and is disposed on the touch a plurality of first binding patterns and a plurality of second binding patterns on one side of the area, and a first signal line connecting the first touch electrodes and the first binding patterns, and connecting the second touch a second signal line of the electrode and the second binding pattern, the first signal line and the second signal line are disposed in different layers, and a projection of the region where the first signal line is located on the substrate The projection of the region where the second signal line is located on the substrate substrate has a partially overlapping region.
  • the partially overlapping area is located at a side of the touch area where the first binding pattern and the second binding pattern are disposed.
  • the first touch electrode is an integrated structure
  • the second touch electrode includes a row of touch sub-electrodes and a bridge pattern connecting adjacent touch sub-electrodes, the touch sub-electrode and The first touch electrodes are disposed in the same layer, and the bridge patterns are disposed in different layers from the first touch electrodes.
  • the second signal line is disposed in the same layer as the bridge pattern, and the bridge pattern and the second signal line are made of a metal material or a transparent conductive material.
  • the first signal line is disposed in the same layer as the first touch electrode; or the first signal line is disposed in a different layer from the first touch electrode, and the first signal line is made of a metal material Composition.
  • first signal line and the first touch electrode overlap at a connection position.
  • the second signal line is disposed in the same layer as the bridge point pattern, and the bridge point pattern is formed of a transparent conductive material; the first signal line and the first touch electrode are disposed in different layers, When the first signal line is made of a metal material, the bridge pattern is closer to the base substrate than the first touch electrode.
  • first touch electrode and the second touch electrode are all integrated; the first signal line is disposed in the same layer as the first touch electrode, and the second signal line is The second touch electrode is disposed in a different layer, and the second signal line is made of a metal material; or the second signal line is disposed in the same layer as the second touch electrode, the first signal line is The first touch electrodes are disposed in different layers, and the first signal lines are made of a metal material.
  • the second signal line is made of a metal material
  • the first signal line is made of a transparent conductive material
  • the second signal line is farther from the substrate than the first signal line.
  • the first signal line is made of a metal material
  • the second signal line is made of a transparent conductive material
  • the first signal line is away from the base substrate than the second signal line.
  • Another aspect of the disclosure further provides a touch device, including the touch substrate of any of the above.
  • the touch device includes a display panel, the touch substrate and the The display panel is an integrated structure, the touch substrate is located inside or outside the display panel, and the display panel and the touch substrate share the same base substrate; or the touch substrate and the display The panel is two independent structures, and the touch substrate is located outside the display panel.
  • a further aspect of the disclosure further provides a method for fabricating a touch substrate, comprising: forming a first conductive layer on a substrate, forming a bridge pattern and a second signal line by a patterning process; forming the bridge Forming an insulating layer on the base substrate of the dot pattern and the second signal line, forming an insulating pattern by a patterning process; forming a first touch electrode and a touch sub-electrode on the base substrate on which the insulating pattern is formed, wherein The adjacent ones of the touch sub-electrodes are connected by the bridge pattern, and constitute a second touch electrode, and the second touch electrode and the second signal line Connecting a first signal line, a first binding pattern, and a second binding pattern formed of a metal material on the base substrate on which the first touch electrode is formed, wherein the first signal line has one end The first touch electrode is connected, the other end is connected to the first binding pattern, and the second binding pattern is connected to one end of the second signal line not connected to the second touch electrode;
  • FIG. 1 is a schematic structural view of a touch substrate according to a comparative example
  • FIG. 2 is a schematic structural diagram of a touch substrate according to an embodiment of the present disclosure
  • FIG. 3 is a schematic structural diagram of another touch substrate according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of still another touch substrate according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of a touch device including a touch substrate according to an embodiment of the present disclosure
  • FIG. 6 is a schematic structural diagram of another touch device including a touch substrate according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of still another touch device including a touch substrate according to an embodiment of the present disclosure.
  • FIG. 8 is a flowchart of a method for preparing a touch substrate according to an embodiment of the present disclosure
  • FIG. 9 is a schematic diagram of a structure for preparing a touch substrate according to an embodiment of the present disclosure.
  • 9b is a schematic structural diagram of a touch substrate prepared according to an embodiment of the present disclosure.
  • 9c is a schematic structural diagram of a touch substrate prepared according to an embodiment of the present disclosure.
  • FIG. 9 is a schematic structural diagram of a touch substrate prepared according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram of an inter-layer structure for preparing a touch substrate according to an embodiment of the present disclosure.
  • the terms “upper” and “lower” are defined relative to the orientation in which the touch substrate is schematically placed in the drawing, and it should be understood that these directional terms are relative concepts. They are used for relative description and clarification, which may vary accordingly depending on the orientation in which the touch substrate is placed.
  • the patterning process may include a photolithography process, or include a photolithography process and an etching process, and may also include other processes for forming a predetermined pattern, such as printing, inkjet, etc.; It refers to a process of forming a pattern by using a photoresist, a mask, an exposure machine, etc., including a film forming, exposure, and developing process.
  • the corresponding patterning process can be selected in accordance with the structure formed in the present disclosure.
  • FIG. 1 is a schematic structural diagram of a touch substrate according to a comparative example.
  • the touch screen includes a touch electrode disposed horizontally and vertically, and the horizontal touch electrode 01 and the vertical touch electrode 02 are in an edge region.
  • Signal lines are connected, and all the signal lines 03 are located in the same layer, and are formed by one manufacturing process. Due to the limitation of the manufacturing process, the width of the signal line 03 cannot be further reduced, so that the width of the routing area is the above two.
  • the sum of the widths of the routing areas of the signal lines that is, the width of the overall routing area is large, which is disadvantageous for the narrow bezel design of the touch display device.
  • the touch substrate 10 includes a plurality of horizontally and vertically intersecting first touch electrodes 101 and a plurality of horizontally and vertically disposed on the base substrate.
  • the projection on the substrate substrate and the projection of the region where the second signal line 12 is located on the substrate substrate have a partially overlapping region B.
  • "provided on the side of the touch area A" refers to a side disposed outside the touch area A and adjacent to the touch area A (for example, as shown in FIG. 2) Lower side).
  • the first touch electrodes 101 and the second touch electrodes 102 are horizontally touched. As shown in FIG. 2, the first touch electrodes 101 are laterally touched.
  • the second touch electrode 102 is a vertical touch electrode; the second touch electrode 101 is a vertical touch electrode, and the second touch electrode 102 is a horizontal touch electrode, which is not limited in the disclosure.
  • the first touch electrode 101 is laterally touched.
  • the control electrode and the second touch electrode 102 are longitudinal touch electrodes as an example, and the present disclosure is further described.
  • the area where the first signal line 11 is located refers to an area surrounded by the outermost first signal line 11 in all the first signal lines 11; the second signal line 12 is located at the outermost side.
  • the signal line 11 is an area surrounded by the outline.
  • the routing area of the first signal line and the routing area of the second signal line are two independent areas, on the basis of which, the first The projection of the region where the signal line is located on the substrate substrate and the projection of the region where the second signal line is located on the substrate substrate partially overlap, that is, the routing region of the first signal line and the routing region of the second signal line are independently disposed.
  • the width of the oppositely disposed trace area is only the width of the trace area of the first signal line or the trace area of the second signal line.
  • the width of the trace can be significantly reduced compared to the sum of the width of the trace area of the first signal line and the width of the trace area of the second signal line at the position in the prior art. The width of the area, which facilitates the narrow bezel design.
  • the first touch electrode 101 adopts a double-side routing mode
  • the second touch electrode 102 adopts a single-side routing mode
  • the partial overlapping area B is located in the touch area A to set a first binding pattern. 1011 and one side of the second binding pattern 1021.
  • the first touch electrode 101 and the second touch electrode 102 are both in a bilateral routing manner, and the partial overlapping region B is located in the direction of the touch region A along the first touch electrode 101.
  • the side and the side of the first binding pattern 1011 and the second binding pattern 1021 are disposed.
  • the present disclosure does not limit the specific position of the partial overlapping area B.
  • the position may be specifically set according to the specific routing manner and the first binding pattern 1011 and the second binding pattern 1021.
  • the first signal line 11 and the second signal line 12 of the first touch electrode 101 and the second touch electrode 102 in different manners are described below by using specific embodiments.
  • “same layer setting” means that different structures are formed by the same deposited film, and the material composition thereof is uniform.
  • the first touch electrode 101 of the touch panel 10 is an integrated structure
  • the second touch electrode 102 includes a row of touch sub-electrodes 1020 and a bridge pattern 1022 connecting adjacent touch sub-electrodes 1020 .
  • the touch sub-electrode 1020 is disposed in the same layer as the first touch electrode 101, and the bridge pattern 1022 and the first touch electrode 101 are disposed in different layers.
  • the second signal line 12 may be disposed in the same layer as the bridge pattern 1022, and the bridge pattern 1022 and the second signal line 12 are made of a metal material, so that the bridge pattern 1022 and the first portion are simultaneously formed by the same patterning process.
  • the two signal lines 12 can simplify the manufacturing process and reduce the manufacturing cost.
  • the second signal line 12 may be disposed in the same layer as the bridge pattern 1022, and the bridge pattern 1022 and the second signal line 12 are formed of a transparent conductive material, so that the bridge pattern 1022 is simultaneously formed by the same patterning process. And the second signal line 12 can simplify the manufacturing process and reduce the manufacturing cost.
  • the second signal line 12 and the bridge point pattern 1022 pass the same patterning process, and are composed of a metal material, and the second signal line 12 and the bridge point pattern 1022 pass the same patterning process, compared with the transparent conductive material.
  • the resistivity of the metal material is small relative to the resistivity of the transparent conductive material, the signal line composed of the metal material has less influence on the signal applied to the signal line, and the signal line of the transparent conductive material, Since the resistivity is large, it affects the signal applied to the signal line, for example, signal attenuation. Therefore, the signal line width of a generally transparent conductive material is larger than the signal line width of the metal material, and the transparency is increased.
  • the width of the signal line formed by the conductive material to reduce the resistance of the signal line, thereby reducing the influence on the signal applied to the signal line, thereby causing the width of the trace area of the signal line formed of the transparent conductive material to be compared with The width of the wiring area of the signal line made of metal material is increased.
  • the bridge pattern 1022 made of a metal material has an influence on the display effect compared to the bridge pattern 1022 formed by using a transparent conductive material, for example, The transmittance of light is reduced. Therefore, in the actual application process, the second signal line 12 and the bridge point pattern 1022 can be selected as a metal material or a transparent conductive material according to actual needs.
  • the first signal line 11 is disposed in the same layer as the first touch electrode 101, that is, the first signal line 11 and the first touch electrode 101 are both formed of a transparent conductive material, and are formed by the same patterning process, thereby achieving a simplified manufacturing process. Reduce the cost of production.
  • the first signal line 11 is disposed in a different layer from the first touch electrode 101, and the first signal line 11 is made of a metal material.
  • the signal formed by the metal material has less influence on the signal applied to the signal line, and the metal
  • the signal line width of the material is narrower, which is conducive to narrow frame design.
  • the first signal line 11 and the first touch electrode 101 may be connected through a via hole, or may be the first signal line 11 and The first touch electrodes 101 are adjacent layers and are connected by direct bonding.
  • the first signal line 11 and the first touch electrode 101 are adjacent layers and overlapped.
  • the first signal line 11 can be formed first, and then the first touch electrode 101 is formed, and the two are directly in the touch area A.
  • the edge position is overlapped; the first touch electrode 101 is first formed, and the first signal line 11 is formed, and the two are directly overlapped at the edge position of the touch area A.
  • the present disclosure preferably uses the first signal line 11 and the first touch electrode 101 to be connected in a overlapping manner at the connection position, which can simplify the process and reduce the manufacturing cost.
  • the second signal line 12 is disposed in the same layer as the bridge point pattern 1022, and the bridge point pattern is formed of a transparent conductive material, the first signal line 11 is disposed in a different layer from the first touch electrode 101, and the first signal line 11 is In the case of a metal material, as shown in FIG. 4, the bridge pattern 1022 and the touch sub-electrode 1020 and the first touch electrode 101 in the touch substrate are both transparent conductive materials.
  • the bridge pattern 1022 is disclosed in the present disclosure. Compared to the first touch electrode 101, it is close to the substrate.
  • the touch sub-electrode 1020 and the first touch electrode 101 are first formed.
  • the bridge pattern 1022 is smaller than the pattern of the touch sub-electrode 1020 and the first touch electrode 101, and a large-area transparent conductive film needs to be etched to form the bridge pattern 1022.
  • Thus During the etching process, the degree of etching is not easy to be accurately controlled, and the etching of the touch sub-electrode 1020 and the first touch electrode 101 is easily caused.
  • the bridge pattern 1022 is disposed on the side closer to the substrate substrate than the touch sub-electrode 1020 and the first touch electrode 101, a bridge pattern 1022 having a smaller area is first formed, and a touch sensor is fabricated.
  • the etching process will not The bridge pattern 1022 causes damage. Therefore, preferably, the bridge pattern 1022 is closer to the substrate than the first touch electrode 101.
  • the first touch electrode 101 and the second touch electrode 102 are all integrated.
  • the first signal line 11 is disposed in the same layer as the first touch electrode 101, that is, the first signal line 11 and the first touch electrode 101 are both transparent conductive materials, and the second signal line 12 and the second touch line are The electrode 102 is disposed in a different layer, and the second signal line 12 is made of a metal material.
  • the second signal line 12 is disposed in the same layer as the second touch electrode 101, that is, the second signal line 12 and the second touch electrode 101 are both transparent conductive materials, and the first signal line 11 is different from the first touch electrode 101.
  • the layers are disposed, and the first signal line 11 is made of a metal material.
  • the process can be simplified, the manufacturing cost can be reduced, and the metal signal line disposed in a different layer from the touch electrode can be fabricated.
  • the signal line has good electrical conductivity and does not affect the signal. Compared with the prior art, the design of the narrow bezel can be realized without increasing the manufacturing process.
  • the metal signal line is compared.
  • the signal line of the transparent conductive material is away from the substrate, so that the first bonding pattern 1011 and the second binding pattern 1021 can be formed by the same patterning process while the metal signal line is being formed, thereby simplifying the manufacturing process. , to reduce the cost of production.
  • the first signal line 11 is composed of
  • the second signal line 12 can be disposed on a side farther from the substrate than the first signal line 11, so that the second signal line 12 can be formed by the same patterning process.
  • the first signal line 11 when the first signal line 11 is made of a metal material and the second signal line 12 is made of a transparent conductive material, the first signal line 11 can be disposed on a side of the second signal line 12 away from the substrate.
  • the first binding pattern 1011 and the second binding pattern 1021 can be formed simultaneously with the formation of the first signal line 11 by the same patterning process, wherein the first binding pattern 1011 is directly connected to the first signal line 11
  • the second binding pattern 1021 is connected to the lower second signal line 12 through the via hole.
  • the first touch electrode 101 and the second touch electrode 102 are touched in the first embodiment.
  • the sub-electrode 1020 is disposed in the same layer, and the bridge pattern 1022 is separately disposed in a layer.
  • the transparent insulating pattern needs to be disposed at a position corresponding to the bridge pattern 1022 so that the first touch electrode 101 is at the bridge connection position.
  • the first touch electrode 101 and the second touch electrode 102 are separately arranged in the second embodiment, and the first touch electrode 101 and the second touch are generally used.
  • the control electrode 102 is provided with a transparent insulating layer of the entire layer.
  • the arrangement in the first embodiment is better than that in the second embodiment, so that the light transmittance is better.
  • the touch sub-electrode 1020 of the first touch electrode 101 and the second touch electrode 102 are disposed in the same layer, and the bridge pattern 1022 is separately disposed in a layer.
  • the embodiment of the present disclosure further provides a touch device, including the touch substrate as described above, having the same structure and advantageous effects as the touch substrate provided in the foregoing embodiments.
  • the structure and beneficial effects of the touch substrate have been described in detail in the foregoing embodiments, and are not described herein again.
  • the display device may specifically include at least a liquid crystal display panel and an organic light emitting diode display panel, for example, the display panel may be applied to any of a liquid crystal display, a liquid crystal television, a digital photo frame, a mobile phone, or a tablet computer. Have The product or part of the display function.
  • the touch device includes the display panel 20
  • the specific arrangement of the touch substrate 10 in the touch device will be further described below.
  • the touch panel 10 can be integrated with the display panel 20 , and the touch substrate 10 is located inside the display panel 20 , and the display panel 20 and the touch substrate 10 share the same base substrate 201 . .
  • the touch panel 10 can be integrated with the display panel 20 , and the touch substrate 10 is located outside the display panel 20 , and the display panel 20 and the touch substrate 10 share the same base substrate. 201.
  • the touch substrate 10 and the display panel 20 are two independent structures, that is, the touch substrate 10 and the display panel 20 are formed on two different base substrates 201 and a substrate 201 ′.
  • the touch substrate 10 is located outside the display panel 20.
  • the touch substrate 10 and the display panel 20 are independent structures (ie, an external touch substrate).
  • a light shielding layer 110 is disposed on a side of the corresponding wiring region near the substrate 201.
  • the material of the light shielding layer may be a black matrix material to prevent external light from directly entering the wiring region and generating reflection, thereby causing display of the display device. The effect has an adverse effect.
  • the touch substrate 10 and the display panel 20 are integrated (ie, the in-cell touch substrate), and the outer surface of the touch substrate 10 and the display panel 20 are packaged.
  • a light shielding layer (not shown) is disposed on the substrate or the package film in the corresponding wiring area to prevent direct sunlight from directly entering the wiring area, and adversely affecting the display effect.
  • the embodiment of the present disclosure further provides a method for preparing a touch substrate, as shown in FIG. 8 , including:
  • Step S101 as shown in FIG. 9a, a first conductive layer is formed on the base substrate 201, and a bridge pattern 1022 and a second signal line 12 are formed by a patterning process.
  • the first conductive layer may be a metal material or a transparent conductive material.
  • Step S102 as shown in FIG. 9b, forming an insulating layer on the base substrate 201 on which the bridge pattern 1022 and the second signal line 12 are formed, and forming an insulating pattern by a patterning process 1023.
  • the above-described insulation pattern 1023 includes an insulation pattern at a position corresponding to the bridge pattern 1022 and an insulation pattern (not shown) located in a region of the second signal line 12.
  • Step S103 as shown in FIG. 9c, forming a first touch electrode 101 and a touch sub-electrode 1020 on the base substrate 201 on which the insulating pattern 1023 is formed, wherein adjacent touches in the row of touch sub-electrodes 1020
  • the sub-electrode 1020 is connected through the bridge pattern 1022 and constitutes the second touch electrode 102, and the second touch electrode 102 is connected to the second signal line 12.
  • Step S104 as shown in FIG. 9d, a first signal line 11, a first binding pattern 1011, and a second binding pattern 1021 made of a metal material are formed on the base substrate 201 on which the first touch electrode 101 is formed.
  • the first signal line 11 is connected to the first touch electrode 101, the other end is connected to the first binding pattern 1011, and the second binding pattern 1021 is connected to the second signal line 12 that is not connected to the second touch electrode 102.
  • the projection of the region where the first signal line 11 is located on the substrate substrate 201 and the projection of the region where the second signal line 12 is located on the substrate substrate 201 have a partially overlapping region B.
  • the partially overlapping area B may be located on a side where the first binding pattern 1011 and the second binding pattern 1021 are disposed in the touch area A.
  • the touch substrate 10 is the external touch substrate in FIG. 7, as shown in FIG. 10, before the step S101, the first signal line 11 and the second signal may be pre-formed.
  • the wiring area of the line 12 forms a light shielding layer 110 made of a black matrix material, so that when the touch substrate 10 is applied to a display device, external light can be directly incident on the wiring area, and the display effect is adversely affected.
  • 10 is only schematically illustrated in the order in which the layers are formed, and does not represent an actual cross-sectional view of a certain position of the touch substrate 10.
  • the protective layer 1024 may also be formed to prevent external factors from affecting the interior of the touch substrate 10, such as oxidation of air or corrosion of acid and alkali, etc., to the touch substrate 10 Play a protective role.
  • the touch panel includes a plurality of horizontally and vertically intersecting first touch electrodes and a second layer disposed on the base substrate in the touch area.
  • a touch electrode, a plurality of first binding patterns and a plurality of second binding patterns disposed on one side of the touch area, and a first connection of the first touch electrode and the first binding pattern a signal line, a second signal line connecting the second touch electrode and the second binding pattern, the first signal line and the second signal line are disposed in different layers, because the first signal line and the second signal line are located at different layers a structure such that a trace area of the first signal line and a trace area of the second signal line are two independent areas, and based on the projection of the area of the first signal line on the base substrate and the second signal
  • the projection of the region where the line is located on the substrate substrate has a partial overlap, that is, at least one of the trace region of the first signal line and the trace region of the second signal line that are independently disposed in the direction perpendicular to the substrate substrate in the touch region

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)

Abstract

本公开实施例提供一种触控基板及其制造方法、触控装置,涉及触控技术领域,通过将分别与横纵交叉设置的触控电极连接的信号线异层设置,能够减小走线区域的宽度。该一种触控基板,包括在触控区域内设置于衬底基板上的多个横纵交叉的第一触控电极和第二触控电极,设置在触控区域一侧的多个第一绑定图案和多个第二绑定图案,以及连接第一触控电极和第一绑定图案的第一信号线、连接第二触控电极和第二绑定图案的第二信号线,第一信号线与第二信号线异层设置,且第一信号线所在区域在衬底基板上的投影与第二信号线所在区域在衬底基板上的投影具有部分重叠区域。

Description

一种触控基板及其制造方法、触控装置
相关申请的交叉引用
本申请要求于2016年08月31日递交的中国专利申请第201610791932.1号的优先权,在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及触控技术领域,尤其涉及一种触控基板及其制造方法、触控装置。
背景技术
触控屏(Touch Panel)是通过对触控区域内触点坐标的计算以及信息处理等,实现简易灵活的人机交互。随着电子产品的发展,人们对触控显示装置的视觉效果的要求不断提高,窄边框设计越来越受到人们的推崇。
发明内容
本公开的实施例提供一种触控基板及其制造方法、触控装置。
为达到上述目的,本公开的实施例采用如下技术方案:
本公开实施例一方面提供一种触控基板,包括在触控区域内设置于衬底基板上的多个横纵交叉的第一触控电极和第二触控电极,设置在所述触控区域一侧的多个第一绑定图案和多个第二绑定图案,以及连接所述第一触控电极和所述第一绑定图案的第一信号线、连接所述第二触控电极和所述第二绑定图案的第二信号线,所述第一信号线与所述第二信号线异层设置,且所述第一信号线所在区域在衬底基板上的投影与所述第二信号线所在区域在衬底基板上的投影具有部分重叠区域。
进一步的,所述部分重叠区域位于所述触控区域设置第一绑定图案和第二绑定图案的一侧。
进一步的,所述第一触控电极为一体结构,所述第二触控电极包括一排触控子电极和连接相邻所述触控子电极的桥点图案,所述触控子电极与所述第一触控电极同层设置,所述桥点图案与所述第一触控电极异层设置。
进一步的,所述第二信号线与所述桥点图案同层设置,所述桥点图案与所述第二信号线由金属材质或透明导电材料构成。
进一步的,所述第一信号线与所述第一触控电极同层设置;或者,所述第一信号线与所述第一触控电极异层设置,所述第一信号线由金属材质构成。
进一步的,所述第一信号线与所述第一触控电极在连接位置处搭接。
进一步的,在所述第二信号线与所述桥点图案同层设置,且所述桥点图案由透明导电材料构成;所述第一信号线与所述第一触控电极异层设置,且所述第一信号线由金属材质构成的情况下,所述桥点图案相较于所述第一触控电极靠近所述衬底基板。
进一步的,所述第一触控电极和所述第二触控电极均为一体结构;所述第一信号线与所述第一触控电极同层设置,所述第二信号线与所述第二触控电极异层设置,且所述第二信号线由金属材质构成;或者,所述第二信号线与所述第二触控电极同层设置,所述第一信号线与所述第一触控电极异层设置,且所述第一信号线由金属材质构成。
进一步的,在所述第二信号线由金属材质构成,所述第一信号线由透明导电材料构成的情况下,所述第二信号线相较于所述第一信号线远离所述衬底基板。
进一步的,所述第一信号线由金属材质构成,所述第二信号线由透明导电材料构成,所述第一信号线相较于所述第二信号线远离所述衬底基板。
本公开实施例另一方面还提供一种触控装置,其特征在于,包括上述任一种的触控基板。
进一步的,所述触控装置包括显示面板,所述触控基板与所述 显示面板为一体结构,所述触控基板位于所述显示面板的内侧或者外侧,且所述显示面板与所述触控基板共用同一个衬底基板;或者,所述触控基板和所述显示面板为两个独立结构,且所述触控基板位于所述显示面板的外侧。
本公开实施例再一方面还提供一种触控基板的制备方法,包括:在衬底基板上形成第一导电层,通过构图工艺形成桥点图案以及第二信号线;在形成有所述桥点图案和所述第二信号线的衬底基板上形成绝缘层,通过构图工艺形成绝缘图案;在形成有所述绝缘图案的衬底基板上形成第一触控电极和触控子电极,其中,一排所述触控子电极中相邻的所述触控子电极通过所述桥点图案连接,并构成第二触控电极,且所述第二触控电极与所述第二信号线连接;在形成有所述第一触控电极的衬底基板上形成由金属材质构成的第一信号线、第一绑定图案和第二绑定图案,其中,所述第一信号线一端与所述第一触控电极连接,另一端连接所述第一绑定图案,所述第二绑定图案与所述第二信号线未连接所述第二触控电极的一端连接;且所述第一信号线所在的区域在衬底基板上的投影与所述第二信号线所在的区域在衬底基板上的投影具有部分重叠区域。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为根据对比示例的一种触控基板的结构示意图;
图2为本公开实施例提供的一种触控基板的结构示意图;
图3为本公开实施例提供的另一种触控基板的结构示意图;
图4为本公开实施例提供的又一种触控基板的结构示意图;
图5为本公开实施例提供的一种包括触控基板的触控装置的结构示意图;
图6为本公开实施例提供的另一种包括触控基板的触控装置的结构示意图;
图7为本公开实施例提供的又一种包括触控基板的触控装置的结构示意图;
图8为本公开实施例提供的一种触控基板的制备方法流程图;
图9a为本公开实施例提供的一种制备触控基板结构示意图之一;
图9b为本公开实施例提供的一种制备触控基板结构示意图之一;
图9c为本公开实施例提供的一种制备触控基板结构示意图之一;
图9d为本公开实施例提供的一种制备触控基板结构示意图之一;
图10为本公开实施例提供的一种制备触控基板的层间结构示意图。
附图标记:
01-横向触控电极;02-纵向触控电极;03-信号线;10-触控基板;101-第一触控电极;1011-第一绑定图案;110-遮光层;102-第二触控电极;1020-触控子电极;1021-第二绑定图案;1022-桥点图案;1023-绝缘图案;1024-保护层;11-第一信号线;12-第二信号线;20-显示面板;201-衬底基板;A-触控区域;B-部分重叠区域。
具体实施方式
下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。
本文中,“上”、“下”等方位术语是相对于附图中的触控基板示意置放的方位来定义的,应当理解到,这些方向性术语是相对的概念, 它们用于相对于的描述和澄清,其可以根据触控基板所放置的方位的变化而相应地发生变化。
另外,在本公开中,构图工艺,可指包括光刻工艺,或,包括光刻工艺以及刻蚀步骤,同时还可以包括打印、喷墨等其他用于形成预定图形的工艺;光刻工艺,是指包括成膜、曝光、显影等工艺过程的利用光刻胶、掩模板、曝光机等形成图形的工艺。可根据本公开中所形成的结构选择相应的构图工艺。
图1为根据对比示例的一种触控基板的结构示意图,如图1所示,触控屏中包括横纵交叉设置的触控电极,横向触控电极01和纵向触控电极02在边缘区域均连接有信号线,且所有信号线03位于同层,并通过一次制造工艺形成,由于受制造工艺的限制,信号线03的宽度无法进一步的减小,从而使得走线区域的宽度为上述两种信号线的走线区域的宽度之和,即整体的走线区域宽度较大,进而不利于触控显示装置的窄边框设计。
本公开实施例提供一种触控基板,如图2所示,该触控基板10包括在触控区域A内设置于衬底基板上的多个横纵交叉的第一触控电极101和第二触控电极102,设置在触控区域A一侧的多个第一绑定图案1011和多个第二绑定图案1021,以及连接第一触控电极101和第一绑定图案1011的第一信号线11、连接第二触控电极102和第二绑定图案1021的第二信号线12,第一信号线11与第二信号线12异层设置,且第一信号线11所在区域在衬底基板上的投影与第二信号线12所在区域在衬底基板上的投影具有部分重叠区域B。在本公开中,如图2所示,“设置在触控区域A一侧”指的是设置在触控区域A之外并且紧邻触控区域A的一个侧部(例如图2中所示的下侧)。
此处需要说明的是,第一,上述多个横纵交叉的第一触控电极101和第二触控电极102是指,可以如图2所示,第一触控电极101为横向触控电极,第二触控电极102为纵向触控电极;也可以是第一触控电极101为纵向触控电极,第二触控电极102为横向触控电极,本公开对此不作限定。以下实施例均是以第一触控电极101为横向触 控电极,第二触控电极102为纵向触控电极为例,对本公开做进一步说明。
第二,上述第一信号线11所在区域是指,在所有第一信号线11中以最外侧第一信号线11为轮廓线所围成区域;第二信号线12所在区域以最外侧第二信号线11为轮廓线所围成区域。
由于第一信号线与第二信号线位于不同的层间结构,从而使得第一信号线的走线区域与第二信号线的走线区域为两个独立的区域,在此基础上,第一信号线所在区域在衬底基板上的投影与第二信号线所在区域在衬底基板上的投影具有部分重叠,即独立设置的第一信号线的走线区域与第二信号线的走线区域在垂直与衬底基板方向上在触控区域的至少一侧相对设置,从而使得该相对设置的走线区域宽度仅为第一信号线的走线区域的宽度或者第二信号线的走线区域的宽度,相比于现有技术中,该位置处走线区域为第一信号线的走线区域的宽度与第二信号线的走线区域的宽度的总和相比,能够显著减小走线区域的宽度,从而利于窄边框设计。
以下对上述部分重叠区域B做进一步解释说明。
例如,可以如图2所示,第一触控电极101采用双边走线方式,第二触控电极102采用单边走线方式,该部分重叠区域B位于触控区域A设置第一绑定图案1011和第二绑定图案1021的一侧。
又例如,可以如图3所示,第一触控电极101和第二触控电极102均采用双边走线方式,该部分重叠区域B位于触控区域A沿第一触控电极101方向的两侧以及设置第一绑定图案1011和第二绑定图案1021的一侧。
本公开对上述部分重叠区域B的具体的位置不作限定,在实际的应用中,可以根据具体的走线方式以及第一绑定图案1011和第二绑定图案1021具体设置位置而定。
以下通过具体实施例对不同设置方式的第一触控电极101和第二触控电极102中第一信号线11和第二信号线12进行说明。
需要说明的是,本文中,“同层设置”是指不同结构通过同一次沉积的薄膜形成,其材料组分一致。
实施例一
如图4所示,该触控基板10中第一触控电极101为一体结构,第二触控电极102包括一排触控子电极1020和连接相邻触控子电极1020的桥点图案1022,触控子电极1020与第一触控电极101同层设置,桥点图案1022与第一触控电极101异层设置。
以下对第二信号线12的具体设置方式进行说明。
例如,第二信号线12可以与桥点图案1022同层设置,且桥点图案1022与第二信号线12由金属材质构成,这样一来,通过同一次构图工艺同时形成桥点图案1022和第二信号线12,能够简化制作工艺降低制作成本。
又例如,第二信号线12可以与桥点图案1022同层设置,且桥点图案1022与第二信号线12由透明导电材料构成,这样一来,通过同一次构图工艺同时形成桥点图案1022和第二信号线12,能够简化制作工艺降低制作成本。
对于上述,第二信号线12与桥点图案1022通过同一次构图工艺,且由金属材质构成,与第二信号线12与桥点图案1022通过同一次构图工艺,由透明导电材料相比而言,一方面,由于金属材质的电阻率相对于透明导电材料的电阻率小,从而使得由金属材质构成的信号线对施加于该信号线上的信号影响较小,而透明导电材料的信号线,由于自身具有的电阻率较大,从而会对施加于该信号线上的信号造成影响,例如信号衰减,因此,一般透明导电材料构成的信号线宽度大于金属材质构成的信号线宽度,通过增加透明导电材料构成的信号线的宽度,以减小该信号线的电阻,进而减小对施加于该信号线上信号的影响,从而导致透明导电材料构成的信号线的走线区域的宽度相比于金属材质构成的信号线的走线区域的宽度有所增加。另一方面,由于透明导电材料相对于金属材质的透光效果好,从而使得采用金属材质构成的桥点图案1022相比于采用透明导电材料构成桥点图案1022会对显示效果带来影响,例如光的透过率降低。因此,在实际的应用过程中,可以根据实际的需要选择第二信号线12与桥点图案1022为金属材质或者透明导电材料。
以下对第一信号线11的具体设置方式进行说明。
例如,第一信号线11与第一触控电极101同层设置,即第一信号线11与第一触控电极101均采用透明导电材料,通过同一次构图工艺形成,进而达到简化制作工艺,降低制作成本的目的。
又例如,第一信号线11与第一触控电极101异层设置,第一信号线11由金属材质构成,该金属材质构成的信号对施加于该信号线上的信号影响较小,且金属材质构成的信号线宽度较窄,利于窄边框设计。
进一步的,在第一信号线11与第一触控电极101异层设置的情况下,第一信号线11与第一触控电极101可以通过过孔连接,也可以是第一信号线11与第一触控电极101为相邻层,并采用直接搭接的方式进行连接。
具体的,第一信号线11与第一触控电极101为相邻层且搭接,可以先制作第一信号线11,再制作第一触控电极101,且两者直接在触控区域A的边缘位置搭接;还可以先制作第一触控电极101,再制作第一信号线11,且两者直接在触控区域A的边缘位置搭接。与通过过孔的方式连接相比,本公开优选的,采用第一信号线11与第一触控电极101在连接位置处以搭接的方式连接,能够简化工艺,降低制作成本。
此外,在第二信号线12与桥点图案1022同层设置,且桥点图案由透明导电材料构成,第一信号线11与第一触控电极101异层设置,且第一信号线11由金属材质构成的情况下,如图4所示,桥点图案1022与触控基板中的触控子电极1020与第一触控电极101均为透明导电材料,本公开优选的,桥点图案1022相较于第一触控电极101靠近衬底基板。
具体的,如果将桥点图案1022设置与相较于触控子电极1020与第一触控电极101背离衬底基板的一侧,即先制作触控子电极1020与第一触控电极101,后制作桥点图案1022,由于桥点图案1022相对于触控子电极1020与第一触控电极101的图案相比,面积较小,需要刻蚀大面积的透明导电薄膜以形成桥点图案1022,这样一来, 在刻蚀的过程中,刻蚀程度不易精确掌控,容易造成对触控子电极1020与第一触控电极101的刻蚀。
但是,如果将桥点图案1022设置与相较于触控子电极1020与第一触控电极101靠近衬底基板的一侧,先制作面积较小的桥点图案1022,且在制作触控子电极1020与第一触控电极101的过程中,在桥点图案1022与触控子电极1020之间的绝缘图案的保护下,以及触控子电极1020的遮挡下,刻蚀过程并不会对桥点图案1022造成损坏。因此,优选的,桥点图案1022相较于第一触控电极101靠近衬底基板。
实施例二
如图2或3所示,第一触控电极101和第二触控电极102均为一体结构。
在此情况下,第一信号线11与第一触控电极101同层设置,即第一信号线11与第一触控电极101均为透明导电材料,第二信号线12与第二触控电极102异层设置,第二信号线12由金属材质构成。或者,第二信号线12与第二触控电极101同层设置,即第二信号线12与第二触控电极101均为透明导电材料,第一信号线11与第一触控电极101异层设置,且第一信号线11由金属材质构成。
通过在制作触控电极的同时,通过一次构图工艺制作与触控电极同层设置的信号线,能够简化工艺,降低制作成本,同时通过制作与触控电极异层设置的金属信号线,该金属信号线的导电性能好,不会对信号产生影响,与现有技术相比,在不增加制作工艺的前提下,能够实现窄边框的设计。
综合上述,实施例一和实施例二中,当第一信号线11和第二信号线12中一个由金属材质构成,另一个由透明导电材料构成时,优选的,金属材质的信号线相较于透明导电材料的信号线远离衬底基板,这样一来,在制作金属信号线的同时可以通过同一次构图工艺,形成第一绑定图案1011和第二绑定图案1021,从而达到简化制作工艺,降低制作成本的目的。
具体的,当第二信号线12由金属材质构成,第一信号线11由 透明导电材料构成时,可以将第二信号线12设置于相较于第一信号线11远离衬底基板的一侧,这样一来,可以通过同一次制图工艺在形成第二信号线12的同时形成第一绑定图案1011和第二绑定图案1021,其中,第二绑定图案1021与第二信号线12直接连接,第一绑定图案1011通过过孔与下方的第一信号线11连接。
或者,当第一信号线11由金属材质构成,第二信号线12由透明导电材料构成时,可以将第一信号线11设置于相较于第二信号线12远离衬底基板的一侧,这样一来,可以通过同一次制图工艺在形成第一信号线11的同时形成第一绑定图案1011和第二绑定图案1021,其中,第一绑定图案1011与第一信号线11直接连接,第二绑定图案1021通过过孔与下方的第二信号线12连接。
另外,针对实施例一和实施例二中第一触控电极101和第二触控电极102的设置方式而言,实施例一中第一触控电极101和第二触控电极102的触控子电极1020同层设置,桥点图案1022单独设置在一层的设置方式,仅需要在桥点图案1022对应的位置处设置透明的绝缘图案,以使得在桥连接位置处第一触控电极101和第二触控电极102之间互相绝缘;而实施例二中第一触控电极101和第二触控电极102为独立结构的设置方式,一般采用在第一触控电极101和第二触控电极102设置整层的透明绝缘层,由于透明绝缘材料会适当的减小光的透过量从而使得实施例一中的设置方式相对于实施例二而言,光的透过率更优,因此本公开优选的采用实施例中第一触控电极101和第二触控电极102的触控子电极1020同层设置,桥点图案1022单独设置在一层的设置方式。
本公开实施例还提供一种触控装置,包括如上所述的触控基板,具有与前述实施例提供的触控基板相同的结构和有益效果。由于前述实施例已经对触控基板的结构和有益效果进行了详细的描述,此处不再赘述。
需要说明的是,在本公开实施例中,显示装置具体至少可以包括液晶显示面板和有机发光二极管显示面板,例如该显示面板可以应用至液晶显示器、液晶电视、数码相框、手机或平板电脑等任何具有 显示功能的产品或者部件中。
在此基础上,在上述触控装置包括显示面板20的情况下,以下对该触控装置中触控基板10的具体设置方式做进一步说明。
例如,如图5所示,该触控基板10可以与显示面板20为一体结构,且触控基板10位于显示面板20的内侧,且显示面板20与触控基板10共用同一个衬底基板201。
又例如,如图6所示,该触控基板10可以与显示面板20为一体结构,且触控基板10位于显示面板20的外侧,且显示面板20与触控基板10共用同一个衬底基板201。
再例如,如图7所示,该触控基板10和显示面板20为两个独立结构,即触控基板10和显示面板20形成于两个不同的衬底基板201和衬底基板201’上,且触控基板10位于显示面板20的外侧。
需要说明的是,对于图7显示装置中触控基板10和显示面板20为独立结构(即外挂式触控基板),在触控基板10在制作的过程中,如图7所示,可以在对应走线区域靠近衬底基板201的一侧设置遮光层110,该遮光层的材料可以为黑矩阵材料,以避免外界的光线直接入射至走线区域,并产生反射,进而使得显示装置的显示效果造成不良影响。
另外,对于图5和图6显示装置中触控基板10与显示面板20为一体结构(即内嵌式触控基板)而言,在一体结构的触控基板10与显示面板20的外侧的封装基板或者封装薄膜上在对应走线区域设置遮光层(图中未示出),以避免外界的光线直接入射至走线区域,并对显示效果造成不良影响。
本公开实施例还提供一种触控基板的制备方法,如图8所示,包括:
步骤S101、如图9a所示,在衬底基板201上形成第一导电层,通过构图工艺形成桥点图案1022以及第二信号线12。
其中,该第一导电层可以为金属材质,也可以为透明导电材料。
步骤S102、如图9b所示,在形成有桥点图案1022和第二信号线12的衬底基板201上形成绝缘层,通过构图工艺形成绝缘图案 1023。
具体的,上述绝缘图案1023包括对应桥点图案1022位置处的绝缘图形以及位于第二信号线12区域的绝缘图形(图中未示出)。
步骤S103、如图9c所示,在形成有绝缘图案1023的衬底基板201上形成第一触控电极101和触控子电极1020,其中,一排触控子电极1020中相邻的触控子电极1020通过桥点图案1022连接,并构成第二触控电极102,且第二触控电极102与第二信号线12连接。
步骤S104、如图9d所示,在形成有第一触控电极101的衬底基板201上形成由金属材质构成的第一信号线11、第一绑定图案1011和第二绑定图案1021,其中,第一信号线11一端与第一触控电极101连接,另一端连接第一绑定图案1011,第二绑定图案1021与第二信号线12未连接第二触控电极102的一端连接;且第一信号线11所在的区域在衬底基板201上的投影与第二信号线12所在的区域在衬底基板201上的投影具有部分重叠区域B。
具体的,如图9d所示,上述部分重叠区域B可以位于触控区域A设置第一绑定图案1011和第二绑定图案1021的一侧。
此处需要说明的是,当该触控基板10为图7中的外挂式触控基板时,如图10所示,在步骤S101之前,还可以在预形成第一信号线11和第二信号线12的走线区域形成由黑矩阵材料构成的遮光层110,以使得当触控基板10应用于显示装置时,能够避免外界的光线直接入射至走线区域,并对显示效果造成不良影响。其中,图10仅是以各结构所在层的制作顺序进行示意的,并不代表该触控基板10的某位置的实际剖面图。
另外,在步骤S104之后,如图10所示,还可形成保护层1024,以避免外界因素对触控基板10内部造成影响,例如空气的氧化或者酸碱的腐蚀等,以对触控基板10起到保护作用。
本公开实施例提供一种触控基板及其制造方法、触控装置,该触控基板包括在触控区域内设置于衬底基板上的多个横纵交叉的第一触控电极和第二触控电极,设置在触控区域一侧的多个第一绑定图案和多个第二绑定图案,以及连接第一触控电极和第一绑定图案的第 一信号线、连接第二触控电极和第二绑定图案的第二信号线,第一信号线与第二信号线异层设置,由于第一信号线与第二信号线位于不同的层间结构,从而使得第一信号线的走线区域与第二信号线的走线区域为两个独立的区域,在此基础上,第一信号线所在区域在衬底基板上的投影与第二信号线所在区域在衬底基板上的投影具有部分重叠,即独立设置的第一信号线的走线区域与第二信号线的走线区域在垂直与衬底基板方向上在触控区域的至少一侧相对设置,从而使得该相对设置的走线区域宽度仅为第一信号线的走线区域的宽度或者第二信号线的走线区域的宽度,相比于现有技术中,该位置处走线区域为第一信号线的走线区域的宽度与第二信号线的走线区域的宽度的总和相比,能够显著减小走线区域的宽度,从而利于窄边框设计。
以上所述,仅为本公开的具体实施方式,但本公开的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本公开的保护范围之内。因此,本公开的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种触控基板,包括在触控区域内设置于衬底基板上的多个横纵交叉的第一触控电极和第二触控电极,设置在所述触控区域一侧的多个第一绑定图案和多个第二绑定图案,以及连接所述第一触控电极和所述第一绑定图案的第一信号线、连接所述第二触控电极和所述第二绑定图案的第二信号线,其中,所述第一信号线与所述第二信号线异层设置,且所述第一信号线所在区域在衬底基板上的投影与所述第二信号线所在区域在衬底基板上的投影具有部分重叠区域。
  2. 根据权利要求1所述的触控基板,其中,所述部分重叠区域位于所述触控区域设置第一绑定图案和第二绑定图案的一侧。
  3. 根据权利要求1所述的触控基板,其中,所述第一触控电极为一体结构,所述第二触控电极包括一排触控子电极和连接相邻所述触控子电极的桥点图案,所述触控子电极与所述第一触控电极同层设置,所述桥点图案与所述第一触控电极异层设置。
  4. 根据权利要求3所述的触控基板,其中,所述第二信号线与所述桥点图案同层设置,所述桥点图案与所述第二信号线由金属材质或透明导电材料构成。
  5. 根据权利要求3所述的触控基板,其中,所述第一信号线与所述第一触控电极同层设置;或者,所述第一信号线与所述第一触控电极异层设置,所述第一信号线由金属材质构成。
  6. 根据权利要求5所述的触控基板,其中,所述第一信号线与所述第一触控电极在连接位置处搭接。
  7. 根据权利要求3所述的触控基板,其中,在所述第二信号线与所述桥点图案同层设置,且所述桥点图案由透明导电材料构成;所述第一信号线与所述第一触控电极异层设置,且所述第一信号线由金属材质构成的情况下,所述桥点图案相较于所述第一触控电极靠近所述衬底基板。
  8. 根据权利要求1所述的触控基板,其中,所述第一触控电极和所述第二触控电极均为一体结构;
    所述第一信号线与所述第一触控电极同层设置,所述第二信号 线与所述第二触控电极异层设置,且所述第二信号线由金属材质构成;
    或者,所述第二信号线与所述第二触控电极同层设置,所述第一信号线与所述第一触控电极异层设置,且所述第一信号线由金属材质构成。
  9. 根据权利要求1-8任一项所述的触控基板,其中,在所述第二信号线由金属材质构成,所述第一信号线由透明导电材料构成的情况下,所述第二信号线相较于所述第一信号线远离所述衬底基板。
  10. 根据权利要求1-8任一项所述的触控基板,其中,所述第一信号线由金属材质构成,所述第二信号线由透明导电材料构成,所述第一信号线相较于所述第二信号线远离所述衬底基板。
  11. 一种触控装置,包括权利要求1-10任一项所述的触控基板。
  12. 根据权利要求11所述的触控装置,其中,所述触控装置包括显示面板,所述触控基板与所述显示面板为一体结构,所述触控基板位于所述显示面板的内侧或者外侧,且所述显示面板与所述触控基板共用同一个衬底基板;
    或者,所述触控基板和所述显示面板为两个独立结构,且所述触控基板位于所述显示面板的外侧。
  13. 一种触控基板的制备方法,包括:
    在衬底基板上形成第一导电层,通过构图工艺形成桥点图案以及第二信号线;
    在形成有所述桥点图案和所述第二信号线的衬底基板上形成绝缘层,通过构图工艺形成绝缘图案;
    在形成有所述绝缘图案的衬底基板上形成第一触控电极和触控子电极,其中,一排所述触控子电极中相邻的所述触控子电极通过所述桥点图案连接,并构成第二触控电极,且所述第二触控电极与所述第二信号线连接;
    在形成有所述第一触控电极的衬底基板上形成由金属材质构成的第一信号线、第一绑定图案和第二绑定图案,其中,所述第一信号线一端与所述第一触控电极连接,另一端连接所述第一绑定图案,所 述第二绑定图案与所述第二信号线未连接所述第二触控电极的一端连接;且所述第一信号线所在的区域在衬底基板上的投影与所述第二信号线所在的区域在衬底基板上的投影具有部分重叠区域。
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