WO2018040638A1 - Module de puissance intelligent et son procédé de fabrication - Google Patents

Module de puissance intelligent et son procédé de fabrication Download PDF

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Publication number
WO2018040638A1
WO2018040638A1 PCT/CN2017/086430 CN2017086430W WO2018040638A1 WO 2018040638 A1 WO2018040638 A1 WO 2018040638A1 CN 2017086430 W CN2017086430 W CN 2017086430W WO 2018040638 A1 WO2018040638 A1 WO 2018040638A1
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WO
WIPO (PCT)
Prior art keywords
circuit wiring
power module
circuit
component
module according
Prior art date
Application number
PCT/CN2017/086430
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English (en)
Chinese (zh)
Inventor
冯宇翔
Original Assignee
广东美的制冷设备有限公司
美的集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201621015447.7U external-priority patent/CN206116377U/zh
Priority claimed from CN201610783777.9A external-priority patent/CN106298698A/zh
Priority claimed from CN201611036146.7A external-priority patent/CN106409787A/zh
Priority claimed from CN201611035256.1A external-priority patent/CN106409800A/zh
Priority claimed from CN201621247120.2U external-priority patent/CN206412333U/zh
Priority claimed from CN201621257328.2U external-priority patent/CN206163476U/zh
Priority claimed from CN201611036147.1A external-priority patent/CN106409778A/zh
Priority claimed from CN201621256408.6U external-priority patent/CN206282847U/zh
Priority claimed from CN201621257329.7U external-priority patent/CN206163481U/zh
Priority claimed from CN201611014960.9A external-priority patent/CN106409747A/zh
Application filed by 广东美的制冷设备有限公司, 美的集团股份有限公司 filed Critical 广东美的制冷设备有限公司
Publication of WO2018040638A1 publication Critical patent/WO2018040638A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions

Definitions

  • the present invention relates to the field of electronic device technologies, and in particular, to an intelligent power module and a method of fabricating the same.
  • the smart power module is provided with a pin for electrically connecting with an external circuit.
  • the intelligent power module is generally used in a harsh working condition, such as an outdoor unit of an inverter air conditioner, and the intelligent power module is usually at a high temperature and high humidity. Working under the condition, the exposed pins are prone to condensation in a humid environment, causing short circuits between the pins. In severe cases, the intelligent power module may explode, causing damage to its application environment and causing significant economic losses.
  • the smart power module is large in size, large in space and high in cost.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, it is an object of the present invention to provide an intelligent power module that is highly reliable, small in size, and low in cost.
  • Another object of the present invention is to provide a method of manufacturing an intelligent power module.
  • An intelligent power module comprising: circuit wiring, at least one end of the circuit wiring is provided with a pad for electrically connecting to an external circuit; a plurality of circuit elements, a plurality of the circuit elements being disposed in the circuit On the upper surface of the wiring, a part of the plurality of circuit elements is a power element, and another part is a driving element corresponding to the power element, and at least one of the driving elements is disposed on the power element corresponding thereto.
  • the power element and the driving element are respectively electrically connected to the circuit wiring; a sealing resin, and the sealing resin is provided on the circuit wiring.
  • the smart power module of the present invention by arranging the driving component on the power component, the occupied area of the power component and the driving component is effectively saved, the area of the smart power module is reduced, and the volume of the smart power module is reduced. Reduce the cost of intelligent power modules.
  • the outwardly extending pin on the smart power module in the related art is omitted, and the condensation on the pin is avoided.
  • the short circuit caused by the exposure improves the reliability of the intelligent power module, prolongs the service life of the intelligent power module, and reduces the use cost.
  • the intelligent power module according to the invention can also have the following additional technical features:
  • each of the circuit elements is a planar circuit element, each of the circuit elements
  • the device has electrodes, each of which is electrically connected directly to the circuit wiring by an electrode.
  • the driving component is soldered on the circuit wiring by a first ball
  • the power component is soldered to the circuit wiring by the second ball
  • the height of the first ball is A
  • the height of the second ball is B
  • the A and B satisfy: 400 ⁇ m ⁇ BA ⁇ 500 ⁇ m.
  • the driving element has a temperature sensing device for detecting a temperature of the corresponding power element.
  • the smart power module further includes: a heat sink connected to the upper surface of the power component.
  • the sealing resin covers an upper portion of a side surface of the circuit wiring and an upper surface of the circuit wiring, and a lower portion of the side surface of the circuit wiring and a lower surface of the circuit wiring are exposed at The sealing resin is outside.
  • the sealing resin completely covers the circuit component on the upper surface of the circuit wiring, and a side surface of the heat sink away from the power component is exposed outside the sealing resin.
  • the side of the circuit wiring is exposed to a height h outside the sealing resin, and the h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the heat sink is a copper sheet, the heat sink has a thickness of t1, and the t1 satisfies: 1.0 mm ⁇ t1 ⁇ 1.5 mm.
  • the outer surface of the heat sink has an electroplated silver layer.
  • the thickness of the electroplated silver layer is t2, and the t2 satisfies: 22 ⁇ m ⁇ t2 ⁇ 30 ⁇ m.
  • the circuit wiring is machined from a copper plate having a thickness t3, the t3 satisfying: t3 ⁇ 5 ounces.
  • a method of manufacturing an intelligent power module according to the present invention includes the following steps:
  • S2 fabricating a base, and digging a groove on the base according to the shape of the circuit wiring, and placing a lower portion of the circuit wiring in the groove;
  • S5 The circuit wiring is taken out from the base to obtain an intelligent power module.
  • the manufacturing method of the intelligent power module of the present invention by placing the circuit wiring in a recess on the reusable base, positioning the circuit wiring through the base greatly reduces the manufacturing difficulty of the intelligent power module.
  • the manufacturing yield is improved, the cost of the intelligent power module is reduced, and the popularity and application of the intelligent power module are facilitated.
  • the driving component is disposed on the corresponding power component, which effectively reduces the area and volume of the smart power module, thereby reducing the cost of the smart power module and facilitating miniaturization of the terminal product using the smart power module.
  • the method before the electrodes of the circuit component are connected to the circuit wiring, the method further includes the step of attaching a heat sink to the power component.
  • step S1 specifically includes the following steps:
  • step S3 specifically includes the following steps:
  • solder paste is applied to the position of the circuit wiring where the driving component is to be mounted, and a first ball is implanted, and the circuit wiring is to be mounted.
  • the position of the power component is coated with solder paste and implanted with a second ball;
  • the method further includes the following steps:
  • the depth of the groove is H, and the H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the base is a stainless steel piece.
  • FIG. 1 is a top plan view of an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • FIG. 3 is a top plan view of an intelligent power module in which an intelligent power module is removed, in accordance with an embodiment of the present invention Surface sealing resin;
  • FIG. 4 is a bottom view of an intelligent power module in accordance with an embodiment of the present invention.
  • FIG. 5 is a top plan view of circuit wiring of an intelligent power module in accordance with an embodiment of the present invention.
  • Figure 6 is a cross-sectional view taken along line B-B of Figure 5;
  • FIG. 7 is a schematic structural diagram of a heat sink, a power element, and a driving element of an intelligent power module according to an embodiment of the present invention
  • FIG. 8 is a top plan view of a base in a method of manufacturing an intelligent power module according to an embodiment of the present invention.
  • FIG. 9 is a top plan view of a mating of a base and a carrier in accordance with an embodiment of the present invention.
  • Figure 10 is a cross-sectional view taken along line C-C of Figure 9;
  • FIG. 11 is a schematic view of a package sealing resin of an intelligent power module according to an embodiment of the present invention.
  • FIG. 12 is a bottom view of the smart power module after encapsulating the sealing resin according to an embodiment of the present invention.
  • FIG. 13 is a top plan view of a smart power module packaged with a sealing resin in accordance with an embodiment of the present invention
  • FIG. 14 is a flow chart of a method of fabricating an intelligent power module in accordance with an embodiment of the present invention.
  • Circuit component 2 power component 21, drive component 22, sealing resin 3, heat sink 4,
  • first means two or more unless otherwise stated.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • Connected, or integrally connected can be mechanical or electrical; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of the two components.
  • the specific meaning of the above terms in the present invention can be understood in a specific case by those skilled in the art.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • An intelligent power module 100 in accordance with an embodiment of the present invention is described below with reference to FIGS.
  • the intelligent power module 100 includes: a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3. Wherein at least one end of the circuit wiring 1 is provided with a pad 11 for electrical connection with an external circuit; a plurality of circuit elements 2 are provided on the upper surface of the circuit wiring 1, and a part of the plurality of circuit elements 2 is a power element 21 The other part is a driving element 22 corresponding to the power element 21, at least one driving element 22 is disposed on the corresponding power element 21, and the power element 21 and the driving element 22 are electrically connected to the circuit wiring 1, respectively, and the sealing resin 3 is disposed in the circuit. On wiring 1.
  • the smart power module 100 of the embodiment of the present invention by arranging the driving component 22 on the power component 21, the occupied area of the power component 21 and the driving component 22 is effectively saved, and the area of the smart power module 100 is reduced, thereby reducing The size of the smart power module 100 is reduced, reducing the cost of the smart power module 100. Further, by providing the pad 11 at at least one end of the circuit wiring 1 and electrically connecting to the external circuit through the pad 11, the outwardly extending pins of the smart power module 100 in the related art are omitted, thereby avoiding the introduction. The short circuit caused by the condensation on the foot improves the reliability of the intelligent power module 100, prolongs the service life of the intelligent power module 100, and reduces the use cost.
  • the smart power module 100 includes: a circuit wiring 1, a plurality of circuit elements 2, and a sealing resin 3.
  • At least one end portion of the circuit wiring 1 (for example, the front end in FIG. 3) is provided with a pad 11 for electrical connection with an external circuit.
  • a pad 11 for electrical connection with an external circuit.
  • the pads 11 are electrically connected to the external circuit, thereby eliminating the outwardly extending pins on the smart power module 100 in the related art, thereby avoiding short circuits caused by condensation on the pins, and improving the smart power module 100.
  • the reliability of the smart power module 100 extends the service life and reduces the cost of use.
  • the pad 11 may be formed in a square structure, and the longitudinal sectional area of the pad 11 is preferably larger than the longitudinal sectional area of the end portion of the circuit wiring 1. Thereby, the contact area of the pad 11 with the external circuit can be increased, and the reliability of the connection of the smart power module 100 to the external circuit is improved.
  • a plurality of circuit elements 2 are provided on the upper surface of the circuit wiring 1, and a part of the plurality of circuit elements 2 is the power element 21, and the other part is the driving element 22 corresponding to the power element 21.
  • the power component 21 may be a component having a large amount of heat such as an IGBT transistor or a MOS transistor
  • the driving component 22 may be a driving circuit of the power component 21 (for example, an IGBT transistor, a MOS transistor, or the like) corresponding thereto, and the driving component 22 is generally a high voltage. integrated circuit.
  • each circuit element 2 is a planar type circuit element 2, for example, when the circuit element 2 is an IGBT, an L-type IGBT may be selected.
  • Each circuit element 2 has electrodes, and each circuit element 2 is electrically connected directly to the circuit wiring 1 through an electrode.
  • the planar type circuit element 2 refers to the circuit element 2 in which all the electrodes are located on the same side surface (for example, the lower surface in FIG. 2) of the circuit element 2.
  • the side surface on which the electrode of the circuit component 2 is located is connected to the upper surface of the circuit wiring 1, so that the electrode of the circuit component 2 can be directly connected to the circuit wiring 1, and the electrical connection between the circuit component 2 and the circuit wiring 1 can be realized.
  • the process of realizing the metal wire and the bonding metal wire for electrically connecting the circuit component 2 and the circuit wiring 1 in the related art is omitted, the processing technology of the intelligent power module 100 is simplified, the production efficiency and the production yield are improved, and the saving is achieved.
  • the material cost, equipment cost, and processing cost of the smart power module 100 reduce the overall cost of the smart power module 100.
  • the surface on which the electrodes of the planar type circuit component 2 are located may be referred to as "front side” (for example, the lower surface in FIG. 2), and accordingly, the side surface of the planar type circuit component 2 opposite to the electrode It is called “reverse surface” (for example, the upper surface in Figure 2).
  • front side for example, the lower surface in FIG. 2
  • reverse surface for example, the upper surface in Figure 2.
  • At least one driving element 22 is provided on the corresponding power element 21, and the power element 21 and the driving element 22 are electrically connected to the circuit wiring 1, respectively.
  • the driving element 22 may be disposed on the lower surface of the power element 21, and the driving element 22 may be directly electrically connected to the circuit wiring 1 through the electrode, and the power element 21 may also be electrically connected directly to the circuit wiring 1 through the electrode.
  • the non-conductive gel may be applied on the lower surface of the power element 21 by dispensing or dispensing, and the coated area of the non-conductive gel is slightly larger than the area of the driving element 22.
  • the driving element 22 is then placed on the surface of the non-conductive gel by a DA machine, and the upper surface of the driving element 22 is prevented from coming into contact with the electrodes of the power element 21, and then the non-conductive gel is baked, and the baking temperature can be based on non-conductive
  • the specific material of the gel is adjusted.
  • the baking temperature should be set at about 125 ° C, and the baking time is 1 to 2 hours to completely solidify the non-conductive gel.
  • the die bond flatness of the drive element 22 can be less than 0.1 mm.
  • the driving element 22 is positioned on the power element 21 corresponding thereto, the occupied area of the driving element 22 and the power element 21 is effectively reduced, thereby effectively reducing the area and volume of the smart power module 100, and reducing The cost of the smart power module 100.
  • the area and volume of the terminal product using the power module can be reduced, which is advantageous for miniaturization of the terminal product.
  • the driving element 22 may be soldered to the circuit wiring 1 by the first ball 91, and the power element 21 may be soldered to the circuit wiring 1 by the second ball 92, wherein the height of the first ball 91
  • the height of the second ball 92 is B
  • a and B satisfy: 400 ⁇ m ⁇ BA ⁇ 500 ⁇ m.
  • the power element 21 and the driving element 22 can be easily electrically connected to the circuit wiring 1.
  • the specific heights of the first ball 91 and the second ball 92 can be adjusted according to the specific specifications of the power component 21 and the driving component 22, as long as the power component 21 and the driving component 22 can be electrically connected to the circuit wiring 1.
  • the present invention does not specifically limit this.
  • first ball 91 and the second ball 92 may each be a solder ball, but are not limited thereto.
  • the drive element 22 has a temperature sensing device for detecting the temperature of the power element 21 corresponding to the drive element 22.
  • the temperature sensing device can be integrated on the driving component 22, and has a simple structure and convenient processing. Therefore, the temperature of the surface of the power component 21 can be monitored in real time by the temperature sensing device, so that when the abnormal power generation phenomenon occurs in the smart power module 100, measures can be taken to respond in time, thereby effectively preventing the intelligent power module 100 from being burnt due to overheating, thereby reducing the The probability of damage of the smart power module 100 improves the reliability of the smart power module 100.
  • the smart power module 100 further includes a heat sink 4 that is coupled to the upper surface of the power component 21.
  • the heat generation of the power component 21 is large, and the heat sink 4 is connected to the upper surface of the power component 21 to effectively improve the heat dissipation performance of the smart power module 100, thereby improving the reliability of the smart power module 100.
  • the heat sink 4 is a copper piece, which has good heat dissipation effect and low material cost.
  • the thickness of the fin 4 is t1, and t1 satisfies: 1.0 mm ⁇ t1 ⁇ 1.5 mm.
  • the specific value can be adjusted according to the specific specification and type of the power component 21 to ensure the heat dissipation effect of the heat sink 4.
  • the outer surface of the heat sink 4 has an electroplated silver layer. Specifically, it can be used for heat dissipation The outer surface of the sheet 4 is subjected to an electroplating silver treatment to form an electroplated silver layer on the outer surface of the fin 4. Thereby, the wettability of the heat sink 4 can be improved, and the heat radiation effect of the heat sink 4 can be further improved.
  • the thickness of the electroplated silver layer is t2, and t2 satisfies: 22 ⁇ m ⁇ t2 ⁇ 30 ⁇ m.
  • the specific value can be adjusted according to the specific specification and model of the intelligent power module 100.
  • the sealing resin 3 is provided on the circuit wiring 1, and the sealing resin 3 is used to encapsulate the circuit wiring 1 to protect the circuit wiring 1 and the circuit component 2 on the circuit wiring 1, thereby improving the reliability of the smart power module 100.
  • the sealing resin 3 may be molded by a transfer mold using a thermosetting resin, or may be molded using a thermoplastic resin using an injection mold.
  • the sealing resin 3 covers the upper portion of the side surface of the circuit wiring 1 and the upper surface of the circuit wiring 1, and the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3. 1 and 4, the sealing resin 3 completely covers the circuit component 2 on the upper surface of the circuit wiring 1, and the surface of the heat sink 4 away from the power component 21 is exposed outside the sealing resin 3. Further, the sealing resin 3 covers most of the height of the side surface of the circuit wiring 1, and the small portion of the lower portion of the side surface of the circuit wiring 1 and the lower surface of the circuit wiring 1 are exposed outside the sealing resin 3.
  • the heat dissipation performance of the smart power module 100 can be effectively improved, the heat accumulation inside the smart power module 100 can be avoided, and the gap between the circuit wires 1 can be completely exposed, thereby making it difficult for moisture to adhere to the circuit wiring 1
  • the ions inside the intelligent power module 100 in a high-temperature and high-humidity environment are effectively avoided, for example, chloride ions, bromide ions, etc., which are caused by the migration of water vapor to cause corrosion to the circuit, and the circuit and circuit components of the circuit wiring 1 are avoided.
  • the short circuit of the circuit further improves the reliability of the smart power module 100, prolongs the service life of the smart power module 100, and reduces the use cost of the smart power module 100.
  • the side of the circuit wiring 1 exposed to the outside of the sealing resin 3 has a height h, h satisfies: 0.3 oz ⁇ h ⁇ 0.8 oz.
  • the smart power module 100 facilitates soldering of the solder paste during the subsequent soldering fixing process, so that the circuit wiring 1 exposed outside the sealing resin 3 can be completely wrapped by solder such as solder paste, thereby facilitating assembly of the smart power module 100, The assembly efficiency and assembly reliability of the smart power module 100 are improved.
  • the circuit wiring 1 is formed by using a copper plate having a thickness t3 and t3 satisfying: t3 ⁇ 5 ounces.
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or the high-speed steel may be used as a material by the file.
  • the rotation speed of the control motor is 5000 rpm, so that the boring tool and the plane are formed at right angles to form the shape of the circuit wiring 1.
  • the shape of the circuit wiring 1 can also be etched on the copper plate by a chemical reaction by an etching tool.
  • an oxidation resistant layer is provided on the outer surface of the circuit wiring 1.
  • the oxidation resistant layer may be a gold layer.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the performance of the smart power module 100 is increased to expand the use range of the smart power module 100.
  • the smart power module 100 according to the embodiment of the invention has good heat dissipation performance, small area, simple process, high reliability and low cost.
  • a method of manufacturing the smart power module 100 according to an embodiment of the invention includes the following steps:
  • the lower portion of the side surface of the circuit wiring 1 extends into the recess 51, and the upper portion of the side surface of the circuit wiring 1 is exposed outside the recess 51.
  • the width of the groove 51 on the base 5 may be slightly larger than the width of the circuit wiring 1 corresponding thereto in order to place the lower portion of the circuit wiring 1 in the groove 51.
  • the circuit wiring 1 can be positioned by the base 5 to facilitate encapsulation of the sealing resin 3 on the circuit wiring 1, so that the lower and lower surfaces of the side surface of the circuit wiring 1 that protrude into the recess 51 are exposed outside the sealing resin 3.
  • the difficulty in positioning the sealing resin 3 on the circuit wiring 1 is reduced.
  • the base 5 needs to be taken out, and the base 5 can be reused, thereby eliminating the metal substrate in the smart power module 100 in the related art, thereby further reducing the intelligent power module.
  • the cost of 100 is the cost of 100.
  • the smart power module 100 completely sealed with respect to the conventional sealed resin 3 reduces the difficulty in controlling the parameters of the thickness of the sealing resin 3 on the upper surface and the lower surface of the circuit wiring 1 during the injection molding, thereby greatly reducing the intelligence.
  • the manufacturing difficulty of the power module 100 increases the manufacturing yield, thereby further reducing the smart power The cost of module 100.
  • the driving component 22 is disposed on the corresponding power component 21, which effectively reduces the area and volume of the smart power module 100, thereby reducing the cost of the smart power module 100 and facilitating the use of the terminal product of the smart power module 100. Miniaturization.
  • the manufacturing method of the smart power module 100 by placing the circuit wiring 1 in the recess 51 on the reusable base 5, the circuit wiring 1 is positioned through the base 5, which greatly reduces the smart power.
  • the manufacturing difficulty of the module 100 improves the manufacturing yield, reduces the cost of the smart power module 100, and facilitates the popularization and application of the smart power module 100.
  • the driving component 22 is disposed on the corresponding power component 21, which effectively reduces the area and volume of the smart power module 100, thereby reducing the cost of the smart power module 100 and facilitating the use of the terminal product of the smart power module 100. Miniaturization.
  • the method before the electrodes of the circuit component 2 are connected to the circuit wiring 1, the method further includes the step of attaching the heat sink 4 to the power component 21.
  • the surface of the power element 21 opposite to the surface on which the electrode is located may be attached to the heat sink 4.
  • the electrode of the power element 21 is located on the lower surface of the power element 21, and the upper surface of the power element 21 can be mounted on the heat sink 4.
  • the heat sink 4 may be formed by stamping or etching a copper sheet having a thickness of about 1.5 mm.
  • the outer surface of the heat sink 4 may be plated by silver to form an electroplated silver layer, and then passed through a eutectic.
  • the power element 21 is mounted on the heat sink 4 with a high temperature solder paste having a melting point of 300 ° C or higher.
  • the eutectic flatness of the power device can be controlled within 0.1 mm.
  • step S1 specifically includes the following steps:
  • a copper plate having a cross-sectional area of less than 64 mm ⁇ 30 mm and a thickness of not less than 5 ounces may be selected, and the shape of the circuit wiring 1 is punched out on the copper plate by a stamping die to form the circuit wiring 1; or by etching a chemical reaction The shape of the circuit wiring 1 is etched on the copper plate.
  • the high speed steel can be used as a material by the boring tool, and the rotation speed of the motor is controlled to be 5000 rpm, so that the boring tool and the aluminum plane are formed at right angles to form the shape of the circuit wiring 1. Then, the outer surface of the circuit wiring 1 is subjected to an oxidation treatment.
  • a gold layer may be formed on the outer surface of the circuit wiring 1 by means of electroplating gold or chemical immersion gold to improve the oxidation resistance of the circuit wiring 1, so that the smart power module 100 can be applied to a place where the oxidation resistance is high. Thereby, the use range of the smart power module 100 is expanded.
  • step S12 can be omitted to simplify the processing process of the smart power module 100 and reduce the processing cost.
  • step S3 specifically includes the following steps:
  • solder paste is applied to the position of the circuit wiring 1 where the driving component 22 is to be mounted, and the first ball 91 is implanted on the power component 21 of the circuit wiring 1 to be mounted. Position the solder paste and implant the second ball 92;
  • a non-conductive gel may be applied on the lower surface of the power component 21 by dispensing or dispensing, a non-conductive gel.
  • the coated area is slightly larger than the area of the driving element 22, and then the driving element 22 is placed on the surface of the non-conductive gel by a DA machine, and the upper surface of the driving element 22 is prevented from coming into contact with the electrode of the power element 21, and then the non-conductive condensation is performed.
  • the glue is baked, and the baking temperature can be adjusted according to the specific material of the non-conductive gel. Generally, the baking temperature should be set at about 125 ° C, and the baking time is 1 to 2 hours, so that the non-conductive gel is completely solidified. .
  • the die bond flatness of the drive element 22 can be less than 0.1 mm.
  • the fabricated circuit wiring 1 is placed in the corresponding groove 51 of the base 5 (as shown in FIG. 8), and the position of the circuit component 1 to be mounted with the driving member 22 is spliced by a solder paste using a steel mesh. Solder paste is applied to the position of the power component 21 to be mounted, respectively.
  • the position of the circuit wiring 1 on which the driving element 22 is to be mounted is referred to as a "first position”
  • the position of the circuit wiring 1 on which the power element 21 is to be mounted is referred to as " Second position”.
  • the thickness of the steel mesh may be 0.13 mm to 0.20 mm.
  • the first ball 91 is implanted in the first position and the second ball 92 is implanted in the second position. That is, the driving element 22 and the power element 21 are connected to the circuit wiring 1 by attaching a solder paste to the ball.
  • the first ball 91 and the second ball 92 are both solder balls.
  • a stepped steel mesh may be used, and the same thickness of solder paste may be applied to the first position and the second position, and tin balls of different sizes may be implanted, or solder pastes of different thicknesses may be applied in the first position and the second position.
  • solder pastes of different thicknesses and solder balls of different sizes may be coated on the first position and the second position to connect the driving component 22 and the power component 21 to the first of the circuit wiring 1, respectively.
  • Position and second position may be coated on the first position and the second position to connect the driving component 22 and the power component 21 to the first of the circuit wiring 1, respectively.
  • solder paste of the same thickness may be applied at the first location and the second location, and then the first height of the implant A at the first location Ball placement 91, in the second position A second ball 92 having a height of B.
  • the height A of the first ball 91 and the height B of the second ball 92 satisfy: 400 ⁇ m ⁇ B-A ⁇ 500 ⁇ m.
  • the electrode of the driving element 22 is placed on the first ball 91 by means of an SMT machine or a DA machine, the electrode of the power element 21 is placed on the second ball 92, and the bottom of the base 5 is placed on the carrier. 6 above, at least one edge of the base 5 is fixed in contact with the carrier 6 (as shown in FIGS. 9 and 10), and the first ball 91 and the second ball 92 are cured by reflow to drive the driving member 22
  • the power element 21 is fixed to the circuit wiring 1.
  • the base 5 can be positioned by the carrier 6 to prevent the base 5 from moving, thereby facilitating the fixing of the circuit component 2 (i.e., the power component 21 and the driving component 22) to the circuit wiring 1 by reflow soldering.
  • the carrier 6 may be formed in a rectangular shape, and at least one edge of the carrier 6 is provided with a fixing strip 61 which can be pushed from the side edge of the carrier 6 without the fixing strip 61 to the carrier. 6 on. At least one edge of the base 5 is in contact with the carrier 6.
  • the carrier 6 can be made of a material such as synthetic stone, which has high structural strength and low cost.
  • the three edges of the carrier 6 are provided with fixing strips 61 that can be pushed from the edges of the carrier 6 without the fixing strips 61 to the carrier 6.
  • SMT Surface Mount Technology
  • DA Die Attach
  • Chip bonding Chinese can be translated as “chip bonding”
  • DA machine refers to chip bonding machine.
  • the reflow time during the reflow process generally does not exceed 10 minutes to prevent the non-conductive gel from melting due to excessive reflow time.
  • the reflow time during the reflow process due to the presence of the base 5, even if the non-conductive gel softens, the relative position of the driving element 22 and the power element 21 does not change, and after the reflow process is finished, the non-conductive gel re-hardens to fix the driving element 22 at On the power element 21, the drive element 22 and the power element 21 are not separated.
  • the circuit wiring 1 fixed to the chassis 5 can be placed in a cleaning machine for cleaning, and the flux such as rosin remaining during reflow and the aluminum wire remaining during the pressing can be washed. .
  • cleaning may be performed according to the arrangement density of the circuit component 2 at the arrangement density of the circuit wiring 1, by spraying or ultrasonic or by a combination of spraying and ultrasonic.
  • the base 5 can be held by the robot arm, and the base 5 can be placed in the cleaning tank for cleaning.
  • the method further includes the step of removing the overflow glue 7 formed during the process of sealing the circuit wiring 1.
  • the grease 3 may be molded by a transfer mold using a thermosetting resin, or may be molded using a thermoplastic resin using an injection mold.
  • the circuit wiring 1 When encapsulating the sealing resin 3, the circuit wiring 1 can be first baked in an oxygen-free environment, the baking time should not be less than 2 hours, and the baking temperature can be selected to be about 125 °C.
  • the package mold includes an upper mold 81 and a lower mold 82, and a cavity is defined between the upper mold 81 and the lower mold 82.
  • the mold cavity has a gate 83 and an exhaust port 84.
  • the sealing resin 3 In the process of encapsulating the circuit wiring 1 using the sealing resin 3, the portion of the side of the circuit wiring 1 where the groove 51 is exposed, the upper surface of the circuit wiring 1, the circuit component 2 on the upper surface of the circuit wiring 1, and the metal wire are covered with the sealing resin 3. . Due to the action of the pressure, part of the resin enters the recess 51 of the base 5, and an overflow glue 7 is formed on the circuit wiring 1, as shown in FIG. Part of the sealing resin 3 also enters between the fins 4 and the upper mold 81 due to pressure, and adheres to the upper surface of the fins 4 to form an overflow gel 7, as shown in FIG.
  • the thickness of the overflow glue 7 is very thin, generally does not exceed 0.1 mm, and can be removed by using a wind knife or the like, or can be removed by chemical means. Thereby, it is possible to prevent the overflow rubber 7 from affecting the heat dissipation performance of the heat sink 4, and it is possible to prevent the overflow glue 7 from affecting the input and output connection of the circuit wiring 1, and improving the performance of the smart power module 100.
  • the smart power module 100 can be placed in the test equipment for routine electrical parameter testing. Specifically, the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the contact test can be performed by the thimble and the test point. If the contact test does not pass, the thimble needs to be trimmed until the contact test passes, and then the electrical characteristics test, including the insulation withstand voltage, static power consumption, delay time and other test items, the test is qualified.
  • the depth of the groove 51 is H, H satisfies: 0.3 oz ⁇ H ⁇ 0.8 oz.
  • the base 5 is a stainless steel piece.
  • the base 5 can be machined from a high temperature resistant steel having a smooth surface. Thereby, the structural strength and high temperature resistance of the base 5 can be improved, the service life of the base 5 can be prolonged, and the cost of the stainless steel is low, and the material cost can be reduced.
  • the circuit wiring 1 is positioned by using the reusable base 5, which reduces the difficulty of positioning when encapsulating the sealing resin 3, and greatly reduces the intelligent power module.
  • the manufacturing difficulty of 100 improves the manufacturing yield, reduces the cost of the smart power module 100, and facilitates the popularization and application of the smart power module 100.
  • the driving component 22 is connected to the power component 21
  • the electrode of the driving component 22 and the electrode of the power component 21 are directly connected to the circuit wiring 1, which reduces the area of the smart power module 100, and the related art is omitted.
  • the process of bonding metal wires further saves costs and improves production efficiency.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module de puissance intelligent (100) et son procédé de fabrication. Le module de puissance intelligent (100) comprend : un câblage de circuit (1), une pluralité d'éléments de circuit (2) et une résine d'étanchéité (3), au moins une partie d'extrémité du câblage de circuit (1) étant pourvue d'un plot de soudure (11) utilisé pour être connecté électriquement à un circuit externe; la pluralité d'éléments de circuit (2) sont agencés sur une surface supérieure du câblage de circuit (1), une partie de la pluralité d'éléments de circuit (2) sont des éléments de puissance (21), et l'autre partie constitue des éléments d'entraînement (22) correspondant aux éléments de puissance (21), au moins un élément d'entraînement (22) est disposé sur l'élément de puissance (21) correspondant à celui-ci, et l'élément de puissance (21) et l'élément d'entraînement (22) sont électriquement connectés au câblage de circuit (1) respectivement; et la résine d'étanchéité (3) est disposée sur le câblage de circuit (1).
PCT/CN2017/086430 2016-08-31 2017-05-27 Module de puissance intelligent et son procédé de fabrication WO2018040638A1 (fr)

Applications Claiming Priority (20)

Application Number Priority Date Filing Date Title
CN201621015447.7 2016-08-31
CN201621015447.7U CN206116377U (zh) 2016-08-31 2016-08-31 一种智能功率模块
CN201610783777.9A CN106298698A (zh) 2016-08-31 2016-08-31 一种智能功率模块及其制造方法
CN201610783777.9 2016-08-31
CN201611036146.7A CN106409787A (zh) 2016-11-15 2016-11-15 智能功率模块及其制造方法
CN201611036146.7 2016-11-15
CN201621257329.7 2016-11-15
CN201611035256.1A CN106409800A (zh) 2016-11-15 2016-11-15 智能功率模块及其制造方法
CN201611036147.1 2016-11-15
CN201621247120.2U CN206412333U (zh) 2016-11-15 2016-11-15 智能功率模块
CN201621257328.2U CN206163476U (zh) 2016-11-15 2016-11-15 智能功率模块
CN201611036147.1A CN106409778A (zh) 2016-11-15 2016-11-15 智能功率模块及其制造方法
CN201621256408.6U CN206282847U (zh) 2016-11-15 2016-11-15 智能功率模块
CN201611035256.1 2016-11-15
CN201621256408.6 2016-11-15
CN201621257329.7U CN206163481U (zh) 2016-11-15 2016-11-15 智能功率模块
CN201621247120.2 2016-11-15
CN201611014960.9 2016-11-15
CN201611014960.9A CN106409747A (zh) 2016-11-15 2016-11-15 智能功率模块及其制造方法
CN201621257328.2 2016-11-15

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WO2018040638A1 true WO2018040638A1 (fr) 2018-03-08

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CN106409778A (zh) * 2016-11-15 2017-02-15 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN106409787A (zh) * 2016-11-15 2017-02-15 广东美的制冷设备有限公司 智能功率模块及其制造方法
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CN106409800A (zh) * 2016-11-15 2017-02-15 广东美的制冷设备有限公司 智能功率模块及其制造方法
CN206116377U (zh) * 2016-08-31 2017-04-19 广东美的制冷设备有限公司 一种智能功率模块
CN206163481U (zh) * 2016-11-15 2017-05-10 广东美的制冷设备有限公司 智能功率模块
CN206163476U (zh) * 2016-11-15 2017-05-10 广东美的制冷设备有限公司 智能功率模块

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CN1270702A (zh) * 1997-10-20 2000-10-18 株式会社日立制作所 半导体模块及使用该半导体模块的电力变换装置
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CN106298698A (zh) * 2016-08-31 2017-01-04 广东美的制冷设备有限公司 一种智能功率模块及其制造方法
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CN106409747A (zh) * 2016-11-15 2017-02-15 广东美的制冷设备有限公司 智能功率模块及其制造方法
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