WO2018033248A2 - Procédé de montage de puces semi-conductrices et dispositif de transfert de puces semi-conductrices - Google Patents

Procédé de montage de puces semi-conductrices et dispositif de transfert de puces semi-conductrices Download PDF

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Publication number
WO2018033248A2
WO2018033248A2 PCT/EP2017/000990 EP2017000990W WO2018033248A2 WO 2018033248 A2 WO2018033248 A2 WO 2018033248A2 EP 2017000990 W EP2017000990 W EP 2017000990W WO 2018033248 A2 WO2018033248 A2 WO 2018033248A2
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WIPO (PCT)
Prior art keywords
transfer unit
semiconductor chips
carrier
sections
portions
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PCT/EP2017/000990
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German (de)
English (en)
Other versions
WO2018033248A3 (fr
Inventor
Juergen Moosburger
Frank Singer
Nikolaus Gmeinwieser
Original Assignee
Osram Opto Semconductors Gmbh
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Application filed by Osram Opto Semconductors Gmbh filed Critical Osram Opto Semconductors Gmbh
Publication of WO2018033248A2 publication Critical patent/WO2018033248A2/fr
Publication of WO2018033248A3 publication Critical patent/WO2018033248A3/fr

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    • H—ELECTRICITY
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Definitions

  • the invention relates to a method for mounting semiconductor chips and a device for transmitting semiconductor chips.
  • Semiconductor chips are generally arranged in aferverbund on a support after their production. For various end products, it is necessary for the semiconductor chips arranged on the carrier to be transferred to another carrier.
  • methods are known in which the semiconductor chips are detached from the carrier by means of a gripper and placed on the further carrier (so-called pick-and-place method). In this case, a single semiconductor chip is always transmitted simultaneously.
  • pick-and-place method When the number of semiconductor chips to be transferred is very large, for example for outdoor display devices, the prior art method is too lengthy. A method is needed in which a large number of semiconductor chips can be transferred quickly from one carrier to another carrier.
  • An object of the invention is to provide such a faster method for transferring semiconductor chips and a device for transferring semiconductor chips. This object is achieved with the method for mounting semiconductor chips and the device for transmitting semiconductor chips of the independent patent claims.
  • the semiconductor chips are transferred from a first carrier to a first carrier Transferred transfer unit.
  • the transfer unit has a receiving area.
  • the transfer of the semiconductor chip from the first carrier to the transfer unit is carried out by rolling the receiving area of the transfer unit on the first carrier.
  • the transfer unit and the first carrier are arranged there, that during the rolling of the receiving area of the transfer unit on the first carrier a plurality of semiconductor chips can be transferred simultaneously from the first carrier to the transfer unit.
  • the semiconductor chips picked up by the transfer unit are transported from the receiving area to a delivery area of the transfer unit.
  • the semiconductor chips are transferred from the transfer unit to a second carrier.
  • the transfer of the semiconductor chips from the transfer unit to the second carrier takes place by means of a rolling of the delivery area of the transfer unit on the second carrier.
  • the transfer unit and the second carrier are each arranged such that a plurality of semiconductor chips can be simultaneously transferred from the transfer unit to the second carrier by the rolling of the delivery area of the transfer unit on the second carrier.
  • the transfer unit may comprise a roller and / or a guided over rollers belt, wherein the roller or the belt on the first and second carrier rolled who can.
  • the transfer unit has a first partial transfer unit. and a second partial transfer unit.
  • the recording area is on the ers formed partial transfer unit
  • the delivery area is formed on the second partial transfer unit.
  • the method includes the step of transferring the semiconductor chips from the first partial transfer unit to the second partial transfer unit. This transfer takes place in turn by a rolling, in this case the first partial transfer unit on the second partial transfer unit or vice versa. This is advantageous if the rolling on the first carrier for receiving the semiconductor chips requires a different material of the transfer unit than the rolling of the transfer unit for discharging the semiconductor chips on the second carrier.
  • the two partial transfer units can be made of different or the same materials. The material selection for the
  • Part transfer units can be adapted to the receiving or dispensing step.
  • the semiconductor chips are turned over from the first partial transfer unit to the second partial transfer unit during transfer.
  • the use of partial transfer units additionally makes it possible for the semiconductor chips to be turned and thus to be present on the second carrier after the transfer process in a different orientation than the first carrier.
  • the semiconductor chips on the first carrier with the side facing away from the carrier, which adjoins the second carrier after transfer.
  • adhesive or solder can be applied to the semiconductor chips when they are arranged on the first carrier. After transfer, the adhesive or solder is arranged between the semiconductor chips and the second carrier and can enable a mechanical fixation between the second carrier and the semiconductor chips.
  • first sections and second sections of the transfer unit are prepared differently.
  • the semiconductor chips are only transferred to the first sections of the transfer unit.
  • the preparation In this case, the first sections and the second sections are formed in such a way that the semiconductor chips adhere to the transfer unit only in the first sections.
  • a semiconductor chip is transmitted per first section. It is also possible that the sections are prepared so that a plurality of semiconductor chips are transmitted per first section.
  • the preparation of the sections of the transfer unit comprises applying a surface charge to the transfer unit and removing the surface charge by irradiation with electromagnetic radiation in the first sections or in the second sections.
  • the semiconductor chips adhere either to the areas of the transfer unit charged with the surface charge or to the points of the transfer unit which are not charged with the surface charge. Depending on which of these locations the semiconductor chips adhere, the selective removal of the surface charge by means of electromagnetic radiation in the first or in the second sections is to be carried out.
  • the method comprises the refparie- "rung of the portions of the transfer unit applying an adhesive layer on the transfer unit and the change in
  • Stickiness of the adhesive layer in the first sections or in the second sections by irradiation with electromagnetic radiation may be either enhancement or reduction in tack, depending on whether the irradiation is in the first sections or in the second sections and which adhesive is used for the adhesive layer.
  • the preparation of the sections of the transfer unit comprises a change in a thickness of a material layer of the transfer unit by irradiation of the first sections or the second sections of the transfer unit with electromagnetic radiation.
  • the irradiation of the first sections or the second sections takes place sequentially one after the other.
  • the other sections are not irradiated.
  • the irradiation of the first or the second portions takes place before the transfer unit is rolled on the first carrier.
  • the irradiation is carried out by means of a laser.
  • the laser is directed by means of a scanner mirror, that is a rotating or oscillating mirror on the first sections or the second sections.
  • a plurality of first sections or a plurality of second sections are irradiated simultaneously. This can be done for example by a pixel-shaped array of radiation sources, whereby a reduction of the mechanically movable components can be achieved. The fact that fewer mechanically movable components are provided, the process is simplified. The preparation of the first or second sections can now be done at the speed with which the radiation sources can be switched.
  • a surface of the transfer unit is displaced in the first sections or the second sections such that the first sections are raised in the receiving area relative to the second sections.
  • the preparation of the sections of the transfer unit comprises a change in a thickness of a material layer of the transfer unit by a mechanical action in the first or second sections.
  • the preparation of the sections of the transfer unit comprises a mechanical action on the transfer unit, whereby the first sections of the transfer unit have a different position relative to the normals of the receiving area than the second sections of the transfer unit.
  • semiconductor chips are transmitted only in the first sections of the transfer unit from the first carrier to the transfer unit.
  • the preparation of the sections of the transfer unit comprises applying an adhesive layer to the transfer unit and changing the tackiness of the adhesive layer by heating the first sections or the second sections of the transfer unit.
  • a selective transfer of semiconductor chips can be achieved only in the first sections.
  • the selective heating can be done, for example, with heating elements, whereby a simple construction of the transfer unit is achieved.
  • the selective heating can be done by irradiation with light or infrared radiation, for example by a laser.
  • the preparation of the sections of the transfer unit comprises applying an adhesive layer in the first sections of the transfer unit by means of a movable nozzle.
  • the adhesive layer can be made in the first sections by means of a plurality of immovable nozzles.
  • the immovable nozzles can, for example, be arranged next to each other in such a way that the transfer unit can be prepared with first and second sections.
  • the method comprises the additional steps of preselecting the semiconductor chips to be mounted on the first carrier and preparing the first and second sections of the transfer unit based on this pre-selection of the semiconductor chips to be mounted.
  • the pre-selection of the semiconductor chips to be mounted can take place on the basis of properties of the semiconductor chips.
  • the preselection of the semiconductor chips is made on the basis of a quality of the semiconductor chips determined by means of a sensor.
  • the quality of the semiconductor chips relates to technical data of the semiconductor chips, such as a wavelength, an at least existing emission power, a power consumption of the semiconductor chip for a given emission power, or other technical parameters of the semiconductor chips.
  • the quality may include a quality state of the semiconductor chip determined by means of an optical sensor. For example, semiconductor chips with mechanical defects (cracks, scratches) can be detected by the optical sensor.
  • the quality of the semiconductor chips is already determined in the wafer composite of the semiconductor chips, that is to say before the production wafer is singulated into individual chips.
  • the quality of the semiconductor chips can be stored in a memory. The subsequent preparation of the first and second sections of the transfer unit can then take place on the basis of the stored qualities in the memory of the semiconductor chips.
  • the implementation of the method for mounting the semiconductor chips does not have to take place immediately after the production of the semiconductor chips and the determination of the quality of the semiconductor chips.
  • a spatial orientation of the semiconductor chips is detected by means of a sensor.
  • the first and second sections of the transfer unit are prepared on the basis of the determined spatial orientation of the semiconductor chips. This makes it possible, for example, for the semiconductor chips to be sprinkled onto the first carrier and then the first and second sections of the transfer unit to be prepared such that only semiconductor chips which are in the correct orientation on the first carrier are transferred to the second carrier by the method , This simplifies the provision of the semiconductor chips on the first carrier since they do not have to be placed in a specific orientation on the first carrier.
  • the method is carried out several times in succession. It is possible to transmit both identical to the first embodiment of the method identical semiconductor chips as well as different semiconductor chips. For example, for the manufacture of display devices, three different semiconductor chips with three different embodiments of the method could be transferred to provide red, green and blue pixels on the display device. It will then be transmitted red, green and blue radiating optoelectronic semiconductor chips.
  • gaps between existing semiconductor chips are filled on the second carrier in further embodiments of the method. This is advantageous, for example, if in the first embodiment of the method semiconductor chips were not transmitted due to their reduced quality. The resulting gaps on the second carrier can now be filled in a second embodiment of the method selectively with the semiconductor chips.
  • semiconductor chips are transferred from further first carriers to the second carrier.
  • the further first carriers may contain identical or different semiconductor chips.
  • the transfer unit is regenerated after mounting the semiconductor chips. This means that the steps necessary for the preparation of the first or second sections of the transfer unit are reversed and the transfer unit is returned to its original state. This transferred back to the initial state transfer unit is now available for a further application of the method.
  • the method comprises the additional steps of recognizing a first marking on the first carrier, recognizing a second marking on the transfer unit and aligning the first carrier and the transfer unit to each other using the first and the second mark. This is advantageous if exact positions of the semiconductor chips on the transfer unit are necessary in order subsequently to transfer the semiconductor chips to exact positions of the second carrier.
  • the method comprises the additional step of recognizing a third mark on the second carrier and aligning the second Carrier and the transfer unit to each other based on the second and the third mark.
  • the positional safety of the transferred semiconductor chips is increased by these method steps, whereby the semiconductor chips can be placed on exact positions on the second carrier. This is particularly advantageous if the method is to be performed multiple times and can thus be ensured that the semiconductor chips are placed in gaps between already transferred semiconductor chips.
  • this method is advantageous if on the second carrier already tracks or other electrical contacting possibilities are provided, and the semiconductor chips are to be aligned with these contacting possibilities.
  • the transfer unit is stopped during the execution of the method.
  • the first carrier is replaced by another first carrier.
  • the transfer block is stopped and the first carrier is changed in its position during the stop. This can be used, for example, if the semiconductor chips are arranged on the first carrier with a smaller spacing than should be the distance of the semiconductor chips on the second carrier.
  • the transfer unit is at least partially moved backwards after the stop. This can be used, for example, to remove semiconductor chips by means of a first dividing unit from the first carrier and to transfer them to a second partial transfer unit. Subsequently, the second part transfer unit is moved backward. Subsequently, further semiconductor chips can be picked up by the same or a further first carrier by means of the first partial transfer unit, and be placed between the already present on the second sub-transfer unit semiconductor chips. After optional further stops and returns of the second partial transfer unit, all the semiconductor chips which are located on the second partial transfer unit are then transferred to the second carrier.
  • An apparatus for transferring semiconductor chips has a transfer unit.
  • the transfer unit has a receiving area and a delivery area.
  • the transfer unit is adapted to be rolled on a carrier to receive and deliver semiconductor chips.
  • the transfer unit is moved in a receiving area on a support to receive semiconductor chips and rolled in a delivery area on a support to deliver semiconductor chips.
  • a plurality of semiconductor chips can be transferred simultaneously from a first to a second carrier.
  • the transfer unit has a cylindrical roller.
  • the receiving area and the discharge area are arranged on a lateral surface of the roller.
  • Such a roller represents a simple transfer unit for a device for transferring semiconductor chips, since only this roller has to be mechanically moved in order to transfer semiconductor chips which are picked up onto the roller in the receiving area and released from the roller in the delivery area from a first carrier second carrier to transfer.
  • the transfer unit has a belt guided over several rollers.
  • the receiving area and the delivery area are arranged on the band. This is advantageous if the receiving area and the delivery area should be arranged further apart from each other than would be possible with a simple roller.
  • the transfer unit has two partial transfer units.
  • the subtransfer units in turn comprise a cylindrical roller and / or a belt guided over a plurality of rollers.
  • the subtransfer units can therefore comprise both two rollers, two belts guided over several rollers or one roller and one belt each.
  • the device additionally has a preparation unit.
  • This preparation unit is set up to structure a surface of the transfer unit. This structuring is particularly advantageous if, as a result, the adhesion of semiconductor chips to the transfer unit is configured differently in different sections of the transfer unit such that semiconductor chips adhere to the transfer unit in first sections of the transfer unit and do not adhere to the transfer unit in second sections of the transfer unit. As a result, semiconductor chips can be selectively transferred from the first to the second carrier by means of this device.
  • the preparation unit has a device for applying a surface charge and a device for selectively removing the surface charge.
  • the preparation unit has a device for applying an adhesive layer. Furthermore, the preparation unit has a device for selectively changing the stickiness of the adhesive layer. Due to the selectively altered stickiness can In turn, it can be achieved that individual semiconductor chips can be transmitted selectively by means of the transfer unit and that no semiconductor chips are transferred at other locations.
  • the preparation unit has a radiation source and optics for selectively irradiating the transfer unit. This is particularly advantageous if the removal of the surface charge or the change in tack can be achieved by means of electromagnetic radiation.
  • the preparation unit has a movable nozzle for applying adhesive.
  • This nozzle can be operated pulsed to either apply an adhesive layer in different sections of the transfer unit or apply no adhesive layer. As a result, in turn, a selective selection of the semiconductor chips to be transmitted can be achieved.
  • the preparation unit has a device for spatially displacing a surface of the transfer unit.
  • the surface of the transfer unit can be spatially displaced in individual sections, whereby, as the transfer unit rolls on a carrier, the transfer unit in these displaced or in the non-shifted sections is in mechanical contact with the semiconductor chips arranged on the carrier and in the other sections each not in contact with the semiconductor chips. This results in a selective selection of the semiconductor chips to be transmitted.
  • the device for spatially displacing the surface comprises a piezoelectric crystal and / or a hydraulic stamp and / or a pneumatic stamp and / or an electric stamp and / or an electromagnetic stamp.
  • the device additionally has a sensor, wherein this sensor is set up to determine a quality of the semiconductor chips. The operation of the pre paration unit can then take place on the basis of this quality of the semiconductor chips determined by the sensor, wherein the transfer unit can be prepared in such a way that semiconductor chips whose determined quality is sufficient are selected by the transfer.
  • the device has a further sensor with which an orientation of semiconductor chips can be determined.
  • the preparation unit is then set up to prepare the transfer unit based on the determined orientation of semiconductor chips.
  • the device has a further transfer unit. This further transfer unit has a further receiving region and a further delivery region and is likewise set up, rolled on a carrier and thereby picking up and delivering semiconductor chips.
  • the second sub-transfer unit is identical for each transfer unit.
  • the semiconductor chips are then transferred to the respective first sub-transfer units, then transferred from this respective first sub-transfer unit to a common second sub-transfer unit and transferred from the second sub-transfer unit to a second carrier.
  • FIG. 2 shows a further apparatus for transferring semiconductor chips with partial transfer units
  • FIG. 6 shows a device for transferring semiconductor chips with a belt guided by rollers
  • FIG. 10 shows a device for transferring semiconductor chips with a movable nozzle for adhesive
  • Fig. 11 is a receiving area of a device for
  • FIG. 13 shows an apparatus for transmitting semiconductor chips with two source carriers
  • FIG. 15 shows a delivery region of a device for transferring semiconductor chips
  • 16 is a plan view of a portion of an apparatus for transferring semiconductor chips.
  • FIG. 1 shows a cross section through a device 100 for transmitting semiconductor chips 110.
  • the semiconductor chips 110 are arranged on a first carrier 120.
  • the semiconductor Chips 110 are to be transmitted from the first carrier 120 to a second carrier 130.
  • the semiconductor chips 110 may be arranged in the wafer composite or already isolated on the first carrier 120. If the semiconductor chips 110 are present in the wafer composite on the first carrier, it may be provided that predetermined breaking points for the individual semiconductor chips 110 are present in the wafer composite. If the semiconductor chips 110 are already arranged in isolated fashion on the first carrier 120, the semiconductor chips 110 may be arranged with or without gaps on the first carrier 120. It can be provided that the semiconductor chips 110 are already arranged on the first carrier 120 at the intervals with which they are subsequently to be transferred to the second carrier 130.
  • the semiconductor chips 110 may be fixed on the first carrier by an adhesion force.
  • the adhesive force can be caused by an adhesive.
  • an adhesion force due to an electrical charge of the semiconductor chips 110 and / or the first carrier 120 is conceivable.
  • the first carrier 120 may be rigid and comprise, for example, a wafer or a wafer.
  • the first carrier 120 may also include a foil.
  • the semiconductor chips 110 can then be arranged on the foil.
  • the film can be an adhesive film.
  • the second carrier 130 may include a panel to be populated, a lead frame, a wafer, a metal core board, a benefit, a PCB carrier, a circuit board, or a foil.
  • the semiconductor chips 120 may be, for example, optoelectronic semiconductor chips, in particular, for example LED chips.
  • the semiconductor chips 120 can be light-emitting diode chips which are suitable for producing a display device, in particular a video wall module, a display or an electronic traffic sign.
  • the semiconductor chips 110 are formed such that the semiconductor chips 110 are thin and have a low weight compared to other semiconductor chips suitable for the intended use.
  • the device 100 for transferring the semiconductor chips 110 comprises a transfer unit 140, which comprises a cylindrical roller 143 with a lateral surface 148.
  • the transfer unit 140 is set up to receive the semiconductor chips 110 from the first carrier 120 and to transfer them to the second carrier 130.
  • the roller 143 rotates about its axis of symmetry.
  • the first carrier 120 moves in a lateral direction relative to the roller 143.
  • FIG. 1 it is illustrated in FIG. 1 how the said components move during the transfer of the semiconductor chips 110.
  • the first carrier 120 moves relative to the roller 143 so that the movement speed of the bezel surface 148 coincides with the speed of the first carrier 120.
  • An upright portion 146 of the cylindrical roller 143 is rolled on the first carrier 120, whereby the semiconductor chips 110 are received on the cylindrical roller 143 and then on the lateral surface 148 of the roller 143 are.
  • the semiconductor chips 110 arranged on the first carrier 120 come into mechanical contact with the lateral surface 148 of the roller 143.
  • the semiconductor chips 110 arranged on the first carrier 120 come into mechanical contact with the lateral surface 148 of the roller 143.
  • Dissolved semiconductor chips 110 from the first carrier 120 and transferred to the roller 143 By the rotation of the roller 143, the semiconductor chips 110 received by the first carrier 120 are conveyed from the receiving area 146 to a discharge area 147 of the roller 143.
  • the second carrier 130 On a side of the roller 143 opposite the first carrier 120, the second carrier 130 is arranged, which moves relative to the lateral surface 148 at a speed corresponding to the speed of movement of the lateral surface 148.
  • the movement of the second carrier 130 is again indicated in Fig. 1 by an arrow.
  • the semiconductor chips 110 are released from the lateral surface 148 and transferred to the second carrier 130.
  • the semiconductor chips 110 arranged on the lateral surface 148 of the roller 143 come into mechanical contact with the second carrier 130. In this case, the semiconductor chips 110 are released from the roller 143 and onto the second carrier 130 transfer.
  • the device 100 thus makes it possible to carry out a method for mounting semiconductor chips 110, in which semiconductor chips 110 are transferred from the first carrier 120 to the transfer unit 140 by passing the receiving region 146 of the roller 143 of the transfer unit 140 on the first carrier 120. Subsequently, the semiconductor chips 110 received by the transfer unit 140 are transported by the rotation of the roller 143 from the receiving region 146 to the delivery region 147. Then, the semiconductor chips 110 are transferred from the transfer unit 140 to the second carrier 130 by rolling the delivery area 147 of the roller 143 of the transfer unit 140 on the second carrier 130.
  • the receiving region 146 is formed at any time by the part of the lateral surface 148, which is being rolled on the first carrier 120.
  • the delivery area 147 is to each Time of the part of the lateral surface 148, which is being rolled on the second carrier 130.
  • the lateral surface 148 is guided past the first carrier 120 and the second carrier 130 at the speed of the first carrier 120 and the second carrier 130, respectively.
  • the adhesive force of the semiconductor chips 110 on the first carrier 120 is smaller than the adhesion force of the semiconductor chips 110 on the lateral surface 148 of the cylindrical roller 143
  • the adhesive force of the semiconductor chips 110 on the second carrier 130 is greater than the adhesion force of the semiconductor chips 110 on the lateral surface 148 of the cylindrical roller 143.
  • the semiconductor chips 110 arranged on the first carrier 120 already have a solder material or an adhesive or another bonding material with which they can subsequently be attached to the second carrier 130.
  • the solder material, the adhesive or the other bonding material it is expedient for the solder material, the adhesive or the other bonding material to be arranged on the side of the semiconductor chips 110 which, after the transfer of the semiconductor chips 110 to the second carrier 130, faces the second carrier 130.
  • the second carrier 130 is formed as a foil, it may be provided that the foil with the semiconductor chips 110 is placed on a printed circuit board or another carrier after the semiconductor chips 110 have been transferred to the foil such that the semiconductor chips 110 are arranged between the film and the circuit board or the other carrier. The film can then be removed from the semiconductor chips 110, the semiconductor chips 110 remaining on the printed circuit board or the other carrier.
  • FIG. 2 shows a cross section through a further device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130.
  • the first carrier 120 and the second carrier 130 correspond to the carriers of FIG. 1.
  • a transfer unit 140 of the other Device 100 of FIG. 2 is constructed of a first part transfer unit 141 and a second part transfer unit 142.
  • the first partial transfer unit 141 corresponds to the transfer unit 140 of FIG. 1, since it likewise comprises a cylindrical roller 143 with a lateral surface 148.
  • the roller 143 rotates about its axis of symmetry.
  • the first carrier 120 moves in a lateral direction relative to the roller 143. Arrows indicate the movement of said components during the transfer of the semiconductor chips 110.
  • the first carrier 120 moves relative to the roller 143 so that the movement speed of the lateral surface 148 coincides with the speed of the first carrier 120.
  • the second part transfer unit 142 comprises a belt 144 guided over rollers 145 in a closed path.
  • the directions of movement of the first carrier 120, the roller 143, the belt 144, the rollers 145 and the second carrier 130 are indicated by arrows in FIG.
  • the belt 144 moves at a speed relative to the roller 143 of the first part transfer unit 141, which corresponds to the speed of the lateral surface 148 of the roller 143.
  • the moving speed of the tape 144 coincides with the moving speed of the second carrier 130.
  • the receiving region 146 of the lateral surface 148 of the roller 143 is rolled on the first carrier 120, whereby the semiconductor chips 110 are transferred from the first carrier 120 to the lateral surface 148 and are then located on the lateral surface 148.
  • the semiconductor chips 110 arranged on the first carrier 120 come into mechanical contact with the lateral surface 148 of the roller 143. In this case, the semiconductor chips 110 are detached from the first carrier 120 and transferred to the roller 143 ,
  • the semiconductor chips 110 received by the first carrier 120 are conveyed from the receiving region 146 to a transfer region 149 of the roller 143.
  • the transfer region 149 of the roller 143 is rolled on the belt 144.
  • the semiconductor chips 110 are transferred from the roller 143 to the belt 144 and thus from the first partial transfer unit 141 to the second partial transfer unit 142.
  • the semiconductor chips 110 received on the belt 144 are conveyed to a discharge area 147.
  • the delivery region 147 is rolled on the second carrier 130, the semiconductor chips 110 being transferred to the second carrier 130.
  • the semiconductor chips 110 are thus transferred from the first carrier 120 to the first partial transfer unit 141, from there to the second partial transfer unit 142 and from there to the second carrier 130.
  • the device 100 illustrated in FIG. 2 thus makes it possible to carry out a method for mounting semiconductor chips 110, in which semiconductor chips 110 are produced from the first carrier.
  • ger 120 are transferred to the transfer unit 140 by the receiving portion 146 of the roller 143 of the first part transfer unit 141 on the first carrier 120 is passed.
  • the semiconductor chips 110 are transferred from the first sub-transfer unit 141 to the second sub-transfer unit 142 by passing a transfer area 149 of the roller 143 of the first sub-transfer unit 141 on the belt 144 of the second sub-transfer unit 142.
  • the roller 143 By the rotation of the roller 143, the transfer of the semiconductor chips 110 from the first part transfer unit 141 to the second part transfer unit 142, and the movement of the belt 144, the semiconductor chips 110 are transported from the receiving area 146 to the discharge area 147 of the transfer unit 140. Then, the semiconductor chips 110 are transferred from the transfer unit 140 to the second carrier 130 by passing the delivery area 147 of the belt 144 of the second transfer unit 142 on the second carrier 130.
  • the semiconductor chips 110 may also be provided that only a few semiconductor chips 110 are removed from the first carrier 120. In this case, the reception of the semiconductor chips 110 by the first partial transfer unit 141 may be completed before the first semiconductor chips 110 reach the delivery area 147 of the second partial transfer unit 142.
  • the semiconductor chips 110 are in the method described with reference to FIG. 2 when transmitting from the first
  • Part transfer unit 141 is turned to the second part transfer unit 142.
  • the side of the semiconductor chips 110 originally facing away from the first carrier 120 forms the side of the semiconductor chips 110 facing the second carrier 130 after the transfer of the semiconductor chips 110 to the second carrier 130.
  • an intended adhesive or a possibly provided solder is to be applied to the semiconductor chips 110 on the first carrier 120 this can be done on the exposed side of the semiconductor chips 110.
  • an adhesive force of the semiconductor chips 110 on the first carrier 120 is reduced before the rolling of the transfer unit 140 on the first carrier 120, for example by heating the first carrier 120 or by irradiating the first carrier 120 Carrier 120 with visible light or UV radiation.
  • the semiconductor chips 110 are better adhered to the transfer unit 140 than to the first carrier 120, whereby the transfer of the semiconductor chips 110 from the first carrier 120 to the transfer unit 140 is improved.
  • Transfer unit 140 on the second carrier 130 an adhesive force of the semiconductor chips 110 is reduced to the transfer unit 140, for example by heating the transfer unit 140 or by irradiating the transfer unit 140 with visible light or UV radiation.
  • the semiconductor chips 110 adhere better to the second carrier 130 than to the transfer unit 140, thereby improving the transfer of the semiconductor chips 110 from the transfer unit 140 to the second carrier 130.
  • a reduction in adhesive force between the first sub-transfer unit 141 and the semiconductor chips 110 may also be achieved, for example, by heating the first sub-transfer unit 141 or by irradiating the first sub-transfer unit 141 with visible light or UV radiation, thereby transferring the semiconductor chips 110 are improved from the first part transfer unit 141 to the second part transfer unit 142 during the rolling of the first part transfer unit 141 at the second part transfer unit 142.
  • FIG 3 shows a plan view of a section of the lateral surface 148 of the cylindrical roller 143 of the preceding FIGS. Ren.
  • first portions 151 and second portions 152 are formed on the lateral surface.
  • the first sections 151 and the second sections 152 of the lateral surface 148 of the transfer unit 140 are prepared differently. Examples of various methods for preparing sections 151, 152 are explained in the following examples. The preparation is performed in such a way that semiconductor chips 110 can be transferred only to the first sections 151 and not to the second sections 152. This can be achieved by the adhesion force of the semiconductor chips 110 at the first sections 151 and the second sections 152 being different. Such different adhesive forces may occur, for example, due to charges, adhesive layers or mechanical displacement of a surface of the transfer unit 140.
  • FIG. 3 Shown in Fig. 3 are square first and second portions 151, 152 which are not adjacent to each other.
  • Other geometric shapes of the first and second sections 151, 152 are conceivable, for example, rectangles, diamonds, circles, ovals, triangles, hexagons and hexagons.
  • Fig. 4 shows the section of the lateral surface 148 of the roller
  • the first sections 151 and the second sections 152 can also be prepared on a belt 144 guided over rollers 145, which forms part of a transfer unit 140.
  • the different preparation of the first sections 151 and the second sections 152 of FIGS. 3 and 4 can take place on the basis of a preselection of the semiconductor chips 110 on the first carrier 120.
  • the pickup area 146 on the first carrier rolls only the preselected semiconductor chips 110 are transferred to the transfer unit 140, since the semiconductor chips 110 only adhere to the pre-selected first sections 151 of the transfer unit 140.
  • the adhesion between the semiconductor chips 110 and the second sections 152 is so small that no semiconductor chips 110 are transferred to the second sections 152 prepared on the basis of the preselection of the semiconductor chips 110 during the wiping of the receiving area 146 on the first carrier 120.
  • the pre-selection of the semiconductor chips 110 which are transmitted from the first carrier 120 to the first sections 151, can be carried out on the basis of a quality of the semiconductor chips 110 determined in a preceding method step, as will be described below.
  • an adhesive force with which the semiconductor chips 110 adhere to the first carrier 120 is selectively changed, for example by selectively heating the first carrier 120 or by selectively irradiating the first carrier 120 with visible light or UV radiation.
  • the change can be a reduction or an increase in the adhesive force.
  • different semiconductor chips 110 adhere differently to the first carrier 120.
  • the semiconductor chips 110 adhere less strongly to the first carrier 120 than to second locations of the first carrier 120.
  • the adhesion force of the semiconductor chips 110 at the first locations of the first carrier 120 is less than the adhesion force between semiconductor chips 110 and Transfer unit 140.
  • the adhesive force of the semiconductor chips 110 at the second locations of the first carrier 120 is greater than the adhesion between the semiconductor chips 110 and the transfer unit 140.
  • the semiconductor chips 110 are transferred from the first locations of the first carrier 120 to the transfer unit 140 due to the greater adhesive force between the semiconductor chips 110 and the transfer unit 140, while the semiconductor chips 110, are arranged at the second locations of the first carrier 120, remain on the first carrier 120 due to the greater adhesive force between the semiconductor chip 110 and the first carrier 120.
  • a selective transmission of the semiconductor chip 110 to the transfer unit is made possible.
  • first locations of the first carrier 120 and first portions 151 of the transfer unit 140 which were produced analogously to FIGS. 3 and 4, to oppose each other during the rolling of the transfer unit 140 on the first carrier 120, thereby selectively transferring the transfer unit 140
  • Semiconductor chips 110 on the transfer unit 140 is further improved.
  • FIG. 5 shows a cross section through a device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130, which in principle corresponds in construction and function to the device 100 of FIG.
  • the device 100 comprises a preparation unit 160, which is provided to prepare first sections 151 and second sections 152, as shown in FIGS. 3 and 4.
  • the preparation unit 160 comprises a device 161 for applying a surface charge and a device 162 for selectively removing the surface charge.
  • the surface charge selective removal device 162 is formed as a laser and a laser beam 167 may be directed by the surface charge selective removal device 162 onto the shell surface 148 of the roller.
  • the laser beam 167 can be directed to different locations of the lateral surface 148. In this case, the laser beam 167 does not impinge on the entire lateral surface 148, but is directed only to partial regions of the lateral surface 148.
  • the semiconductor chips 110 may adhere to the transfer unit 140 either in partial areas with surface charge or partial areas without surface charge. Depending on which partial areas the semiconductor chips 110 adhere, these are the first sections 151, which are set up for the transmission of the semiconductor chips 110.
  • the semiconductor chips 110 can adhere to the subregions of the transfer unit 140, which furthermore have surface charge.
  • the laser beam 167 is directed to the second portions 152 to remove the surface charge in the second portions 152.
  • the semiconductor chips 110 adhere in the subregions of the transfer unit 140 in which there is no surface charge.
  • the laser beam 167 is directed to the first portions 151 to remove the surface charge in the first portions 151.
  • the semiconductor chips 110 then adhere to the first sections 151 of the transfer unit 140.
  • the selective removal of the surface charge by means of the laser beam 167 thus results in an arrangement of first and second sections 151, 152 analogous to FIGS. 3 and 4.
  • gaps in the first carrier 120 on the second carrier 130 result during the transfer process of the semiconductor chips 110 Locations where the lateral surface 148 has exhibited a second portion 152 during the transfer process.
  • Some semiconductor chips 110 disposed on the first carrier 120 may be omitted and left on the first carrier 120.
  • the semiconductor chips 110 have a layer or a region that can be electrostatically charged.
  • the adhesion of the semiconductor chips 110 to the transfer unit 140 can be improved, in particular if the surface charge on the transfer unit 140 in the first sections 151 and the electrostatic charge of the semiconductor chips 110 have different signs.
  • Between first portions 151 of the transfer unit 140 without surface charge and the semiconductor chips 110 then exists an electrical attraction between the first portions 151 of the transfer unit 140 and the semiconductor chips 110, so that the semiconductor chips 110 adhere to the first portions 151 of the transfer unit 140.
  • Cases are the semiconductor chips 110 selectively on the first portions 151 of the transfer unit 140 when passing the Aufauminzen receiving portion 146 of the transfer unit 140 on the first carrier 120.
  • FIG. 6 shows a cross section through a further exemplary embodiment of a device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130.
  • the transfer unit 140 in this case has a belt 144 guided over a plurality of rollers 145.
  • the belt 144 is not guided on a closed track. Instead, a supply roll 153, the tape 144 as consumables for the over-. transfer process available. After the tape 144 the
  • Transfer unit 140 has passed through, the tape 144 is wound on a take-up reel 154.
  • Arrows indicate the directions of rotation of the rollers 145 and the direction of movement of the belt 144, the relative speeds of belt 144, first carrier 120 and second carrier 130 again coinciding.
  • the use of a guided on a closed loop belt is possible.
  • a receiving region 146 of the belt 144 is rolled on a first carrier 120.
  • the receiving region 146 is thus at any time the part of the belt 144, which is being rolled on the first carrier 120.
  • the belt 144 is moved past the first carrier 120 at the speed of the first carrier 120.
  • semiconductor chips 110 are transferred from the first carrier 120 to the band 144, the band 144 being part of the transfer unit 140. Subsequently, the semiconductor chips 110 are transported by a movement of the tape 144 from the receiving area 146 to a delivery area.
  • the delivery area 147 of the belt 144 is rolled on a second carrier 130.
  • the delivery area 147 is thus at any time the part of the belt 144, which is currently on the second Carrier 130 is passed.
  • the belt 144 is guided past the second carrier 130 at the speed of the second carrier 130.
  • semiconductor chips 110 are transferred from the belt 144 to the second carrier 130.
  • the device 100 of FIG. 6 also has a preparation unit 160, which is set up to selectively charge the band 144. This can be done, for example, analogously to FIG. 5 by means of a device 161 for applying a surface charge and a subsequent selective removal of the surface charge by means of illumination. All components necessary for this purpose can be integrated into the preparation unit 160.
  • the preparation unit 160 again prepares first and second sections 151, 152 on the belt 144, with the semiconductor chips 110 being transmitted exclusively in the first sections 151.
  • the preparation of the sections 151, 152 takes place analogously to FIGS. 3 and 4 and can take place on the first carrier 120 on the basis of a preselection of the semiconductor chips 110.
  • the pickup area 146 on the first carrier rolls only the preselected semiconductor chips 110 are transferred to the transfer unit 140, since the semiconductor chips 110 only adhere to the pre-selected first sections 151 of the transfer unit 140.
  • the adhesion between the semiconductor chips 110 and the second sections 152 is so small that, during the rolling of the receiving region 146 on the first carrier 120, no semiconductor chips 110 are transferred to the second sections 152 prepared on the basis of the preselection of the semiconductor chips 110.
  • the pre-selection of the semiconductor chips 110 which are transmitted from the first carrier 120 to the first sections 151, can be carried out on the basis of a quality of the semiconductor chips 110 determined in a preceding method step, as will be described below.
  • the device 100 shown in FIG. 6 makes it possible to carry out a method for mounting semiconductor chips 110, in which semiconductor chips 110 are transferred from the first carrier 120 to the transfer unit 140 by rolling the receiving region 146 of the belt 144 of the transfer unit 140 on the first carrier 120 , Subsequently, the semiconductor chips 110 received by the transfer unit 140 are transported by the movement of the belt 144 from the receiving region 146 to the delivery region 147. Then, the semiconductor chips 110 are transferred from the transfer unit 140 to the second carrier 130 by rolling the delivery area 147 of the belt 144 of the transfer unit 140 on the second carrier 130.
  • the preparation unit 160 is set up to apply an adhesive layer to the transfer unit 140 and subsequently to change a stickiness of the adhesive layer in the first or in the second sections 151, 152 by irradiation with electromagnetic radiation relative to one another. This is done in such a way that the tackiness in the first sections 151 is greater than the tackiness in the second sections 152.
  • an adhesive layer is applied to the transfer unit 140 and then the tackiness of this adhesive layer is selectively changed.
  • the preparation unit 160 is set up to change a thickness of a material layer of the transfer unit 140 by electromagnetic radiation. This can occur, for example, in that a material layer of the transfer unit 140 swells and only the swollen areas of the material layer in the receiving area 146 come into mechanical contact with the semiconductor chips 110 on the first carrier 120. Swollen areas thus form the first sections 151. Thus, only the semiconductor chips adjacent to the swollen material layer are transmitted. In the places where the material layer is not swollen is the transfer unit 140 does not come into mechanical contact with the semiconductor chips 110 so that no semiconductor chips 110 are received. Thus, the non-swollen areas form the second sections 152.
  • the preparation unit 160 is configured to sequentially prepare the individual first portions 151 and the individual second portions 152, respectively. This can be done for example by means of a laser and a rotating or tilting mirror, wherein the laser is switched on and off and can be selected by the movement of the mirror and the switching on and off of the laser on which portions 151, 152 of the laser beam impinges.
  • multiple first sections 151 and multiple second sections 152 are prepared simultaneously. This can be done, for example, in that a plurality of light sources are arranged in an array, and a plurality of light sources are operated in parallel at the same time in order to irradiate the transfer unit 140 with electromagnetic radiation.
  • a surface of the transfer unit 140 in the first sections 151 and the second sections 152 is displaced by the preparation in such a way that the first sections 151 in the receiving area 146 are raised relative to the second sections 152.
  • This can be done, for example, by means of a mechanical displacement respectively.
  • only the raised first portions 151 mechanically contact the semiconductor chips 110 on the first carrier 120.
  • a thickness of a material layer of the transfer unit 140 during the preparation is changed by a mechanical action in the first sections 151 or in the second sections 152, whereby in turn only the first sections in the receiving area 146 with the semiconductor chips 110 on the first Carrier 120 come into mechanical contact.
  • This can be done for example by a mechanical forming process such as forging, pressing or upsetting, or by a mechanical separation process such as milling or planing.
  • FIGS. 7 and 8 show cross sections through a further exemplary embodiment for a subregion of a transfer unit 140 in the region of the receiving region 146.
  • the transfer unit 140 comprises a belt 144 guided over rollers 145. Only a partial region of the belt 144 is shown in FIGS.
  • the band 144 is guided over two rollers 145. In the area of the rollers, the band 145 is curved, between the rollers 145, the band 144 is linear.
  • the remaining region of the band 144 can have a delivery region 147, analogous to FIGS. 2 or 6, which can be passed on a second carrier 130, not shown, in order to transfer semiconductor chips 110 from the band 144 to the second carrier 130.
  • the belt 144 guided over the rollers 145 forms the transfer unit 140 in this case.
  • the belt 144 can have a transfer region 149, at which the belt 144 can be rolled on a further belt, not shown, or on a roller (not shown) Transfer semiconductor chips 110 on the other band or the roller.
  • the guided over the rollers 145 belt 144, the portion of which is shown in Figures 7 and 8, in this case is part of a first part transfer unit 141, which is part of the transfer unit 140 is.
  • the further band or the roller are then part of a second partial transfer unit 142, which is likewise assigned to the transfer unit 140.
  • Semiconductor chips 110 are arranged on a first carrier 120, which is arranged parallel to the portion of the belt 144 extending between the rollers 145.
  • a receiving region 146 of the belt 144 is rolled on the first carrier 120 between the two rollers 145 shown in FIGS. 7 and 8.
  • the band 144 is guided between the rollers 145 parallel to the first carrier 120.
  • the first carrier 120 thereby moves in the lateral direction at the same speed as the belt 144.
  • the direction of movement is shown in FIGS. 7 and 8 by means of arrows.
  • a preparation unit 160 is arranged with a punch 164.
  • the punch 164 can be moved in the direction of the semiconductor chips 110 in order to press first sections 151 of the band 144, which are arranged above preselected semiconductor chips 110, locally against one or more semiconductor chips 110 arranged on the first carrier 120.
  • the first sections 151 of the band 144 are brought into contact with the preselected semiconductor chips 110 and remain attached to these semiconductor chips 110.
  • the second portions 152 of the band 144 arranged over non-preselected semiconductor chips 110 are not pressed against the semiconductor chip 110 by the punch 164.
  • the punch 164 thus spatially displaces a surface of the band 144 facing the semiconductor chips 110 by mechanical action so that the first portions 151 of the band 144 are raised relative to the normal portions of the receiving portion 146 with respect to the second portions 152.
  • the preselected semiconductor chips 110 are lifted off the first carrier 120. This will make the preselected ones Semiconductor chips 110 from the first carrier 120 on the tape
  • the pre-selection of the semiconductor chips 110 which are transmitted from the first carrier 120 to the belt 144 of the transfer unit 140, can be carried out on the basis of a quality of the semiconductor chips 110 determined in a preceding method step, as will be described below.
  • the stamp 164 may for example comprise a piezo-crystal or be designed as a hydraulic stamp, as a pneumatic stamp, as an electric stamp or as an electromagnetic stamp.
  • the band 144 may be elastically or inelastically deformed by the punch 164. In the case of an elastic deformation of the band 144, unlike in FIG. 8, the first portions 151 ' of the band 144 can return elastically to their initial position even before reaching the rear roller 145 in the direction of the band 144, and thereby the preselected ones Lift semiconductor chips 110 from the first carrier 120.
  • the partial region of the device 100 shown in FIGS. 7 and 8 makes it possible to transfer semiconductor chips 110 from the first carrier 120 to the belt 144 of the transfer unit 140 by rolling the receiving region 146 of the belt 144 of the transfer unit 140 on the first carrier 120. Subsequently, the semiconductor chips 110 picked up by the transfer unit 140 are transported by the movement of the belt 144 from the receiving area 146 to the delivery area 147, not shown, or to the transfer area 149, where they can either be transferred to the second carrier 130 or another band
  • the band 144 between the rollers 145 is in mechanical contact with all the semiconductor chips 110. Initially, there is no sufficient adhesion for transferring the semiconductor chips 110 from the first carrier 120 to the band 144 of the transfer unit 140.
  • the punch 164 may locally press one of the first portions 151 of the band 144 disposed over preselected semiconductor chips 110 to one or more semiconductor chips 110 disposed on the first carrier 120 to increase the adhesion between the band 144 and the preselected semiconductor chips 110 to one for transmission , necessary value increase.
  • the band 144 or the semiconductor chips 110 can have an adhesive coating whose adhesive force can be increased by pressing.
  • the preparation unit 160 may also be made for the preparation unit 160 to be arranged with the punch 164 below the first carrier 120, that is to say on the side of the first carrier 120 facing away from the band 144, and pre-selected semiconductor chip 110 in the direction of the tape 144 and thus enables the transfer of the preselected semiconductor chips 110 from the first carrier 120 onto the belt 144. It is likewise conceivable to provide a preparation unit 160, each with a punch 164, both above and below the band 144.
  • the preparation unit 160 may include a device for locally heating the band 144 instead of the stamp 164.
  • the band 144 between the rollers 145 may be in mechanical contact with all the semiconductor chips 110. Initially, there is no sufficient adhesion for transferring the semiconductor chips 110 from the first carrier 120 to the band 144 of the transfer unit 140.
  • the preparation unit 160 locally heats first portions 151 of the belt 144 disposed over preselected semiconductor chips 110 to enhance the adhesion between the belt 144 and the belt preselected semiconductor chips 110 from a value necessary for the transmission. If necessary, the band 144 or the semiconductor chips 110 can have an adhesive coating whose adhesive force can be increased by the heating.
  • the local heating of the band 144 can be done for example by irradiation with electromagnetic radiation. It is also possible to increase the adhesion between the first portions 151 of the tape 144 and the preselected semiconductor chips 110 other than by heating, for example, by exposure to visible light or UV radiation.
  • the adhesive force with which the semiconductor chips 110 adhere to the first carrier 120 is selectively changed, for example by heating or by irradiation with radiation, for example visible light or UV radiation. Radiation to facilitate transfer of the semiconductor chips 110 to the transfer unit 140 during rolling.
  • the adhesive force of the semiconductor chips 110 on the first carrier 120 is reduced such that the semiconductor chips 110 adhere better to the first portions 151 of the tape than to the first carrier 120.
  • Adhesive force is reduced for example by selective heating or by selective irradiation, for example, in partial areas of the first carrier, which are opposite to the first portions 151 of the belt 144 during the rolling process.
  • FIG. 9 shows a cross section through a further exemplary embodiment of a device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130.
  • a transfer unit 140 in turn has a roller 143.
  • the arrangement of the first and second carriers 120, 130 and roller 143 corresponds to FIG. 1.
  • the roller 143 is provided on its lateral surface 148 with various punches 164, which can be extended and retracted in the radial direction.
  • the punches 164 can each occupy a first position away from the lateral surface 148 of the roller and a second position closer to the lateral surface 148 of the roller 143.
  • a surface of the punches 164 associated with the transfer unit 140 can be displaced in the direction of the normal of the lateral surface 148 such that the surface of the punches 164 in first sections 151 is raised relative to the surface of the punches 164 in second sections 152.
  • stamp 164 When extended, the punches 164 mechanically contact the semiconductor chips 110 on the first carrier 120 during rolling of the receiving region 146 on the first carrier 120 and remove them from the first carrier 120 due to the mechanical contact. Stamp 164, which are brought closer to the lateral surface 148 in the second position, do not come into mechanical contact with the semiconductor chips 110 during rolling of the receiving region 146 on the first carrier 120, whereby these punches 164 during the rolling of the receiving region 146 on the first carrier 120 record no semiconductor chips 110. As a result, a selective picking up of the semiconductor chips 110 onto the transfer unit 140 and thus a selective transfer of the semiconductor chips 110 from the first carrier 120 to the second carrier 130 can be achieved.
  • the preparation of the first and second sections 151, 152 takes place in this imple mentation example thus by moving the punch 164 on the lateral surface 148 of the roller 143.
  • the apparatus 100 shown in FIG. 9 makes it possible to carry out a method for mounting semiconductor chips 110, in which semiconductor chips 110 are transferred from the first carrier 120 to the transfer unit 140, by the receiving area 146 of the roller 143 of the transfer unit 140 on the first carrier 120 is passed on.
  • the semiconductor chips 110 received by the transfer unit 140 are transported by the movement of the roller 143 from the receiving area 146 to the discharge area 147. Then, the semiconductor chips 110 are transferred from the transfer unit 140 to the second carrier 130 by rolling the delivery area 147 of the roller 143 of the transfer unit 140 on the second carrier 130. First and second sections 151, 152 are thereby prepared by the punches 164, wherein the semiconductor chips 110 adhere only to the first sections 151 and thus a selective transmission of the semiconductor chips 110 is made possible.
  • the roller 143 is formed as part of a first partial transfer unit 141 and has, instead of the delivery area 147, a transfer area 149 which is rolled on a second partial transfer unit 142 analogously to FIG. By rolling over the transfer area 149 on the second subtrans unit 142, the semiconductor chips 110 are transferred to the second subtransfer unit 142 and can be transferred from there analogously to FIG. 2 onto the second carrier 130.
  • the punches 164 may comprise a piezoelectric crystal or may be hydraulic punches, pneumatic punches, electric punches or electromagnetic punches.
  • FIG. 10 shows a cross-section through a device for transferring semiconductor chips 100, which, analogously to FIG. 2, comprises a first partial transfer unit 141 and a second sub-transfer unit 142, which form a transfer unit 140.
  • the first part transfer unit 141 is again a cylindrical roller 143 and the second sub-transfer unit 142 again a closed belt 144 guided over rollers 145.
  • the transfer unit 140 has a movable nozzle 165 and a removal unit 166 on the first sub-transfer unit 141, that is to say on the cylindrical roller 143, which are part of a preparation unit 160.
  • the movable nozzle 165 may be moved perpendicular to the plane of the drawing and is configured to selectively apply an adhesive layer to the cylindrical roller 143 and thereby to prepare the first and second portions 151, 152.
  • the adhesive layer is applied by means of the movable nozzle 165 in the first sections 151 of the roller 143. No adhesive layer is applied in the second sections 152.
  • the semiconductor chips 110 adhere to the selectively applied adhesive layer and thus to the first portions 151 of the roller 143 of the transfer unit 140. At the second portions 152, no semiconductor chips 110 adhere.
  • the removal unit 166 is arranged to strip excess adhesive from the cylindrical roller 143 after the semiconductor chips 110 have been transferred to the belt 144 by rolling the transfer region 149 on the belt 144 of the second transfer unit 142. The removal unit 166 thus returns the cylindrical roller 143 back to the initial state. Subsequently, an adhesive layer can again be applied to the roller 143 by means of the movable nozzle 165 in order to enable a further selective transmission of semiconductor chips 110.
  • the device 100 shown in FIG. 10 makes it possible to carry out a method for mounting semiconductor chips 110, in which semiconductor chips 110 are transferred from the first carrier 120 to the transfer unit 140 by the receiving area 146 of the roller 143 of the first subtrans unit 141 at the first Carrier 120 is rolled off. Then be the semiconductor chips 110 are transferred from the first partial transfer unit 141 to the second partial transfer unit 142 by rolling off a transfer area 149 of the roller 143 of the first partial transfer unit 141 on the belt 144 of the second partial transfer unit 142. As a result, the semiconductor chips 110 are transported from the receiving region 146 to the delivery region 147 of the transfer unit 140.
  • the semiconductor chips 110 are transferred from the transfer unit 140 to the second carrier 130 by rolling the delivery area 147 of the belt 144 of the second transfer unit 142 on the second carrier 130.
  • First and second sections 151, 152 are thereby prepared by the movable nozzle 165, wherein the semiconductor chips 110 adhere only to the first sections 151 and thus a selective transmission of the semiconductor chips 110 is made possible.
  • a delivery region 147 which corresponds to the transfer region 149 of FIG. 10, to be passed on a second carrier 130, and the semiconductor chips 110 being transferred to the second carrier.
  • first and second portions 151, 152 can be prepared on the roller 143 by selectively applying adhesive to the first portions 151.
  • the preparation of the first and second sections 151, 152 can take place on the basis of a preselection of the semiconductor chips 110 on the first carrier 120. Possible methods for pre-selection will be described below.
  • the preparation unit 160 has a device for applying an adhesive layer to the transfer unit 140.
  • the preparation 160 a device for selectively heating the transfer unit 140 such that the adhesive layer has a higher tackiness in the first sections 151 after the selective heating than in the second sections 152.
  • the selective heating device may be disposed near the roller 143 or the belt 144.
  • the selective heating device may also be disposed within a roller 143 or roller 145 of the transfer unit 140.
  • the selective heating device may comprise heating elements or comprise a laser.
  • the apparatus for transferring semiconductor chips 100 in this embodiment is formed as in FIG. 10.
  • tackiness in the first sections 151 of the transfer unit 140 instead of increasing the tackiness in the first sections 151 of the transfer unit 140, provision may also be made for tackiness in the second sections 152 of the transfer unit 140 to be reduced, for example by selective heating of the transfer unit 140 or by selective irradiation of the transfer unit 140.
  • FIG. 11 shows part of a device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130 according to another exemplary embodiment. Shown is a cross section through the first carrier 120 with semiconductor chips 110 and a portion of a first
  • Part transfer unit 141 which consists of a guided over rollers 145 belt 144. Shown is a portion of the belt 144, which is guided over a roller 145.
  • a receiving region 146 of the first partial transfer unit 141 is rolled off on the first carrier 120, wherein the rolling-through transfers semiconductor chips 110 from the first carrier 120 to the belt 144.
  • the semiconductor chips 110 accommodated on the band 144 are transported away from the receiving region 146 due to the movement of the band 144 and move in the direction of a delivery region 147 (not shown) analogously to FIGS 6, or in the direction of a transfer area 149, which is passed on at a further partial transfer unit 142 analogous to FIG. 2, whereby the semiconductor chips are transferred to the second transfer unit 142.
  • a sensor 170 is disposed above the first carrier 120 and configured to determine a quality of the semiconductor chips 110.
  • the quality can, for example, a wavelength of the emitted radiation, an energy yield, an operating voltage, an operating current or other technical
  • Parameters of the semiconductor chips 110 include.
  • the quality may also be a functional capability or integrity of the semiconductor chips 110.
  • the sensor 170 can be provided, for example, to detect mechanical damage, such as, for example, cracks or chips of the semiconductor chips 110, which influence the quality of the semiconductor chips 110.
  • the first partial transfer unit 141 has a preparation unit 160, which is set up to prepare the band 144 into first and second sections 151, 152 analogously to the exemplary embodiments already described.
  • the operation of the preparation unit 160 is effected on the basis of the quality of the semiconductor chips 110 determined by the sensor 170.
  • the preparation of the transfer unit 140 by means of the
  • the preparation unit 160 thus takes place on the basis of a preselection of the semiconductor chips 110 to be mounted on the first carrier 120.
  • the pre-selection can serve to sort out semiconductor chips 110 which do not have the required quality. For example, damaged semiconductor chips 110 or semiconductor chips 110 that do not emit in a desired wavelength interval can be sorted out.
  • the quality of the semiconductor chips 110 can also be effected much earlier in the processing process, for example directly after the production of the semiconductor chips 110, on a production wafer.
  • Information about the quality and the position of the semiconductor chips 110 are then stored in a memory. lays and serve the preselection of the semiconductor chips 110 and the preparation of the first and second sections 151, 152.
  • the information stored in the memory about the quality and position of the semiconductor chips 110 can be referred to as wafer map.
  • a spatial orientation of the semiconductor chips 110 is determined by means of the sensor 170. This may be useful, for example, when semiconductor chips 110 are to be transferred in the correct orientation from the first carrier 120 to the second carrier 130 and semiconductor chips 110 that are not oriented correctly should be omitted. Thereby, the semiconductor chips 110 can be easily provided on the first carrier 120 by being sprinkled on the first carrier 120.
  • the first carrier 120 may have recesses whose distances correspond to the distances of the semiconductor chips 110 according to the assembly method.
  • FIG. 12 shows a cross section through a device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130, which partially corresponds to the device 100 of FIG. 6. In contrast to FIG.
  • a regeneration unit 168 is set up to return the tape to the original state after the semiconductor chips 110 have been transferred from the first carrier 110 to the second carrier 120. This can be done, for example, by removing the surface charge remaining in the first or second sections 151, 152 by means of irradiation with electromagnetic radiation or by means of electrical contact or by removing the adhesive layer or by heating or irradiation.
  • the transfer unit 140 can be constructed both from a roller 143 or from a belt 144, which is guided over rollers 145.
  • rollers 143 and belts 145 guided over rollers 145 can also be provided, in particular if the rollers 143 or the belts 144 guided via rollers 145 form the partial transfer units 141, 142.
  • both the first partial transfer unit 141 and the second partial transfer unit 142 may include rollers 143, and / or belts 144 and rollers 145.
  • the method is carried out a plurality of times, that is, by means of the transfer unit 140, a plurality of semiconductor chips 110 are transferred from a first carrier 120 to a second carrier 130 several times.
  • the semiconductor chips 110 may in particular be selected according to the quality when passing through the method several times, the semiconductor chips 110 additionally being selected according to whether they are transmitted at a location of the second carrier 130 to which a semiconductor chip 110 due to the second pass of the method would be already present a semiconductor chip 110 due to the first pass of the method.
  • no further semiconductor chip 110 is transmitted in the second pass of the method.
  • the first pass or the second pass of the method correspond to the method described so far.
  • the gaps can be closed, for example, with a conventional pick-and-place method or with a further pass of the method become.
  • 13 shows a cross-section through a further device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130.
  • the transfer unit 140 comprises two first sub-transfer units 141 and a second sub-transfer unit 142.
  • the first partial transfer units 141 in turn comprise in each case a roller 143, a preparation unit 160 and a regeneration unit 168.
  • the second partial transfer unit 142 comprises a belt 144 guided via belt 145.
  • receiving areas 146 of the rollers 143 of the first transfer subunits 141 are each rolled on a first carrier 120 and In this case, semiconductor chips 110 are accommodated, analogously to FIG. 2.
  • Transfer areas 149 of the rollers 143 of the first partial transfer units 141 are fed on the second partial transfer unit 142 in order to transfer the semiconductor chips 110 to the second partial transfer unit 142.
  • a delivery region 147 of the second partial transfer unit 142 is rolled on the second carrier 130, whereby the semiconductor chips 110, analogously to FIG. 2, are transferred to the second carrier.
  • the first partial transfer units 141 are arranged such that the semiconductor chips 110 come to rest on different positions of the band 144 in each case. This arrangement of the first partial transfer units 141 thus corresponds to the result of carrying out the transfer method several times, in which the semiconductor chips 110 are placed in gaps in the first pass of the method during the second pass of the method.
  • the device 100 of FIG. 13 it is possible, for example, to transmit red, green and blue-emitting semiconductor chips 110 from different first carriers 120 to the second carrier 130, so that they form, for example, a display device with colored image output.
  • 14 shows a cross section through a device 100 for transferring semiconductor chips 110 from a first carrier 120 to a second carrier 130 according to a further embodiment.
  • the device 100 corresponds in this case to the device of FIG. 2.
  • first markings 181 are mounted on the side opposite the semiconductor chips 110.
  • second markings 182 on the transfer unit 140.
  • the second carrier 130 has third markings 183.
  • a marking sensor 180 is provided which can read out the first, second and third markings 181, 182, 183.
  • the markers 181, 182, 183 could each be attached to other positions of the respective components, without restricting the operation.
  • the first markers 181 and the second markers 182 are read out from the marking sensors 180.
  • the first carrier 120 and the transfer unit 140 are aligned with each other based on the first marks 181 and the second marks 182.
  • the first carrier 120 can be arranged to be movable relative to the transfer unit 140 and a mechanical controller can move the first carrier 120 relative to the transfer unit 140. This can serve in particular to align semiconductor chips 110 arranged on the first carrier 120 during the rolling of the receiving region 146 of the transfer unit 140 on the first carrier 120 at positions of the first or second sections 151, 152.
  • the third markings 183 of the second carrier 130 are read out with the marking sensor 180 and the second carrier 130 and the
  • Transfer unit 140 to each other by means of the third markers 183 and the second markings 182 are aligned.
  • the second carrier 130 can relative to the transfer unit 140 be designed to be movable.
  • the positions of the semiconductor chips 110 on the second carrier 130 can be adapted to the positions of the semiconductor chips 110 on the transfer unit 140, so that the semiconductor chips, for example, are correctly placed on the second carrier.
  • the reading out of the third markings 183 is advantageous if the method is to be carried out several times in order to align the semiconductor chips 110 transferred in the second pass to the second carrier 130 relative to the semiconductor chips 110 transferred to the second carrier 130 in the first pass.
  • structurings already present on the second carrier 130 can optionally serve, for example already existing electrical conductor tracks.
  • the marking sensor 180 then recognizes the positions of the structuring features of the second carrier 130, the structuring features serving as third markings 183.
  • 15 shows a cross section through a further exemplary embodiment for a partial area of a transfer unit 140 in the area of the delivery area 147.
  • the transfer unit 140 comprises a belt 144 guided via rollers 145. Only a partial area of the belt 144 is shown in FIG. 15.
  • the band 144 is guided over two rollers 145. In the area of the rollers, the band 145 is curved, between the rollers 145, the band 144 is linear.
  • the remaining region (not shown) of the transfer unit 140 can, analogously to FIG. 6, have a receiving region 146, which can be rolled on a first carrier 120, not shown, in order to transfer semiconductor chips 110 from the first carrier 120 to the belt 144.
  • the belt 144 may have a transfer region 149 analogous to FIG. 2, in which another unillustrated belt or roller (not shown) on the belt 144 may be rolled over the semiconductor chips 110 from the further belt or transfer the roller to the belt 144.
  • the belt 144 guided over the rollers 145, the partial region of which is shown in FIG. 15, is in this case part of a second partial transfer unit 142, which is part of the transfer unit 140.
  • the further band or the roller are then part of a first partial transfer unit 141 of the transfer unit 140.
  • the delivery region 147 of the belt 144 is rolled between the two rollers 145 on the second carrier 130.
  • the band 144 is guided between the rollers 145 parallel to the second carrier 130.
  • the second carrier 130 thereby moves in the lateral direction at the same speed as the band 144.
  • the direction of movement is shown in FIG. 15 by means of arrows.
  • the band 144 is transparent to a portion of the electromagnetic spectrum, such as visible
  • An optical sensor 184 is disposed above the belt 144 and operates in the portion of the electromagnetic spectrum for which the belt 144 is transparent.
  • the optical sensor 184 may include an electromagnetic radiation source of radiation of the portion of the electromagnetic spectrum for which the tape 144 is transparent.
  • the positions of the semiconductor chips 110 on the belt 144 relative to the second carrier 130 can be determined. As a result, it is possible to check whether or not the semiconductor chips 110 are transferred to nominal positions on the second carrier 130 before or during the deceleration of the delivery region 147 on the second carrier 130. Should not the position of band 144 and second carrier 130 relative to each other a transfer of the semiconductor chips 110 to the desired positions on the second carrier 130, the relative position of the band 144 and the second carrier 130 may first be changed such that by rolling the delivery region 147 on the second carrier 130, the semiconductor chips 110 to the desired positions on the second Carrier 130 are transmitted.
  • markings analogous to the markers 181, 182, 183 of FIG. 14 are arranged on the band 144 and / or the second carrier 130, that of the optical sensor 184 can be detected.
  • the semiconductor chips 110 are not transparent to the portion of the electromagnetic spectrum for which the band 144 is transparent.
  • Sensor can be used, for example, a camera.
  • An image of the camera can be evaluated by means of image processing to determine whether the semiconductor chips 110 are arranged above conductor tracks on the second carrier 130. If so, the rolling is performed, otherwise the belt 144 and second carrier 130 are moved relative to each other.
  • the transfer unit 140 is stopped during execution of the method.
  • the first carrier 120 is changed in position or replaced by another first carrier 120. This may serve to further conductor chips 110 on another first carrier 120 to provide.
  • semiconductor chips 110 present on first carrier 120 can thereby be arranged at a smaller spacing than the spacing of semiconductor chips 110 on second carrier 130 should be.
  • each second semiconductor chip 110 is then removed from the first carrier 120 and transferred to the second carrier 130.
  • the first carrier 120 can then be moved such that subsequently the semiconductor chips 110 remaining on the first carrier 120 are removed and mounted on the second carrier 130.
  • the first carrier 120 is moved to half the distance between two semiconductor chips 110 on the second carrier 130. Other multiples and distances can be taken into account.
  • spacings of the semiconductor chips 110 are taken into account in two dimensions, that is to say, for example, every tenth semiconductor chip 110 of a row and every eighth row, with which one eightieth of the semiconductor chips 110 of the first carrier 120 are transmitted per stop.
  • the entire area of the first carrier 120 can be transmitted by means of eighty stops.
  • the transfer unit 140 is at least partially moved backwards after the stop. In the case of the embodiment of the device 100 shown in FIG. 2, this can be used, for example, for semiconductor chips 110 by means of the first partial transfer unit 141 from the first
  • Sub-transfer unit 142 are then all semiconductor chips 110, which are on the second sub-transfer unit 142, so the band 144, transferred to the second carrier 130 by the tape 144 is rolled on the second carrier 130.
  • Fig. 16 shows a plan view of a portion of a
  • Bands 144 of a transfer unit 140 First portions 151 and second portions 152 in a matrix arrangement with rows 155 and rows 156, 157, 158 have been prepared on the tape 144 by one of the described methods, for example on the basis of a chip quality pre-selection. By one of the methods already described, semiconductor chips 110 have been transferred to the first portions 151 of the tape 144. No semiconductor chips 110 have been transferred to the second portions 152 of the tape. The semiconductor chips 110 are provided for by rolling the
  • Bands 144 are transferred to a second carrier 130.
  • the rows 155 each have a spacing from each other which already corresponds to the distance that the semiconductor chips 110 should have after their transfer to the second carrier 130.
  • the distances between the semiconductor chips 110 within the rows 155 that is, the distances between the rows 156, 157, 158, are in this For example, less than the distances that the semiconductor chips 110 are to have after the transfer to the second carrier 130.
  • the distances between the lines 156, 157, 158 of semiconductor chips 110 are therefore to be increased when transferred to the second carrier 130.
  • the band 144 and the second carrier 130 are moved relative to one another and readjusted such that semiconductor chips 110 of a second row 157 are subsequently set to desired positions can be transmitted on the second carrier 130.
  • the delivery region 147 of the band 144 is again shifted on the second carrier 130 and thereby the second line 157 of semiconductor chips 110 is transferred to the second carrier 130. Accordingly, each row 156, 157, 158 is moved after transmission.
  • one of the methods described with reference to FIGS. 14 and 15 can be used.
  • rows 155 and rows 156, 157, 158 are second sections 152 without semiconductor chips 110, ie gaps.
  • the lines 156, 157, 158 are transferred by rolling the delivery area 147 of the belt 144 on the second carrier 130, the gaps between the semiconductor chips 110 are also transmitted. It can be provided to close the gaps on the second carrier 130 by a further pass of one of the described methods or by a pick-and-place method.
  • the method described below may be used to transfer the semiconductor chip 110 from the tape 144 to the second carrier 130 without gaps.
  • the band 144 and the second carrier 130 are aligned relative to each other so that the semiconductor chips 110 of the first row 156 at the rolling of the delivery region 147 of the band 144 on second carrier 130 are transmitted to desired positions on the second carrier 130. Since the first row 156 contains a semiconductor chip 110 in each row 155, there is no gap between the semiconductor chips 110 on the second carrier 130. Thereafter, the band 144 and the second carrier are repositioned and the delivery area 147 of the band 144 on the second carrier 130 in order to transfer the semiconductor chips 110 of the second row 157 from the band 144 to the second carrier 130. Since the second row 157 has a gap on the band 144, a gap also arises in the second row on the second carrier 130.
  • the band 144 and the second carrier 130 are relatively moved relative to each other such that a semiconductor chip 110 of the third row 158 of the band is positioned over the gap. Subsequently, the semiconductor chip 110 positioned over the gap is transferred from the band 144 to the second carrier 130 by means of a punch and thus the resulting gap between the semiconductor chips 110 on the second carrier 130 is filled up. This creates a gap in the third line 158 of the tape 144.
  • band 144 and second carrier 130 are moved relative to each other such that the third row 158 can be transferred to nominal positions of a third row of the second carrier 130. Again, a gap is transmitted, which can subsequently be closed with a semiconductor chip 110 from a fourth row of the band 144, analogously to the described method.
  • a transfer unit 140 could include a preparation unit 160 as shown in Figs. 6 or 10, a quality sensor 170 as shown in Fig. 11, a plurality of sub-transfer units 141, 142 as shown in Fig. 13, and both the carriers 120, 130 and the transfer unit 140 markers 181, 182, 183 as shown in FIG. 14.
  • the positions of the elements shown in the figures relative to each other, in particular of the first carrier 120, the second carrier 130, the transfer unit 140, the first partial transfer unit 141 and the second partial transfer unit 142 can be changed and the elements can be arranged differently from one another.
  • the adhesion force of the semiconductor chips 110 to the first carrier 120 is lower than to the transfer unit 140.
  • the semiconductor chips 110 adhere better to the second carrier 130 than to the transfer unit 140.
  • the transfer unit 140 is constructed of sub-transfer units 141, 142 , the adhesion increases with each sub-transfer unit 141, 142 passed through.
  • the adhesion of the semiconductor chips 110 to the carrier 120, 130 or to the transfer unit 140 by changing the temperature, applying or removing a charge or radiation with electromagnetic radiation changed and thereby the transfer of the semiconductor chips 110 is facilitated.

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  • Manufacturing & Machinery (AREA)
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Abstract

L'invention concerne un procédé de montage de puces semi-conductrices, selon lequel les puces semi-conductrices sont tout d'abord transférées d'un premier support sur une unité de transfert. L'unité de transfert présente une partie réception. Le transfert des puces semi-conductrices du premier support sur l'unité de transfert se fait par roulement de la partie réception de l'unité de transfert contre le premier support. Dans une autre étape du procédé, les puces semi-conductrices reçues par l'unité de transfert sont transportées de la partie réception à une partie dépôt de l'unité de transfert. Dans une étape suivante du procédé, les puces semi-conductrices sont transférées de l'unité de transfert sur un second support. Le transfert des puces semi-conductrices de l'unité de transfert sur le second support se fait par roulement de la partie dépôt de l'unité de transfert contre le second support.
PCT/EP2017/000990 2016-08-16 2017-08-16 Procédé de montage de puces semi-conductrices et dispositif de transfert de puces semi-conductrices WO2018033248A2 (fr)

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DE102016115186.6A DE102016115186A1 (de) 2016-08-16 2016-08-16 Verfahren zum Montieren von Halbleiterchips und Vorrichtung zum Übertragen von Halbleiterchips
DE102016115186.6 2016-08-16

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WO2018033248A3 WO2018033248A3 (fr) 2018-05-03

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