WO2018033248A3 - Procédé de montage de puces semi-conductrices et dispositif de transfert de puces semi-conductrices - Google Patents
Procédé de montage de puces semi-conductrices et dispositif de transfert de puces semi-conductrices Download PDFInfo
- Publication number
- WO2018033248A3 WO2018033248A3 PCT/EP2017/000990 EP2017000990W WO2018033248A3 WO 2018033248 A3 WO2018033248 A3 WO 2018033248A3 EP 2017000990 W EP2017000990 W EP 2017000990W WO 2018033248 A3 WO2018033248 A3 WO 2018033248A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor chips
- transfer unit
- carrier
- assembling
- transferring
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
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- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L2224/838—Bonding techniques
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Abstract
L'invention concerne un procédé de montage de puces semi-conductrices, selon lequel les puces semi-conductrices sont tout d'abord transférées d'un premier support sur une unité de transfert. L'unité de transfert présente une partie réception. Le transfert des puces semi-conductrices du premier support sur l'unité de transfert se fait par roulement de la partie réception de l'unité de transfert contre le premier support. Dans une autre étape du procédé, les puces semi-conductrices reçues par l'unité de transfert sont transportées de la partie réception à une partie dépôt de l'unité de transfert. Dans une étape suivante du procédé, les puces semi-conductrices sont transférées de l'unité de transfert sur un second support. Le transfert des puces semi-conductrices de l'unité de transfert sur le second support se fait par roulement de la partie dépôt de l'unité de transfert contre le second support.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016115186.6A DE102016115186A1 (de) | 2016-08-16 | 2016-08-16 | Verfahren zum Montieren von Halbleiterchips und Vorrichtung zum Übertragen von Halbleiterchips |
DE102016115186.6 | 2016-08-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2018033248A2 WO2018033248A2 (fr) | 2018-02-22 |
WO2018033248A3 true WO2018033248A3 (fr) | 2018-05-03 |
Family
ID=59772584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2017/000990 WO2018033248A2 (fr) | 2016-08-16 | 2017-08-16 | Procédé de montage de puces semi-conductrices et dispositif de transfert de puces semi-conductrices |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102016115186A1 (fr) |
WO (1) | WO2018033248A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109219342A (zh) * | 2018-10-25 | 2019-01-15 | 浙江大学 | 连续滚动式磁控转印印章、转印系统及方法 |
DE102018127123A1 (de) * | 2018-10-30 | 2020-04-30 | Osram Opto Semiconductors Gmbh | Transferwerkzeug und Verfahren zum Transferieren von Halbleiterchips |
CN110349897B (zh) * | 2019-08-12 | 2024-03-29 | 深圳市思坦科技有限公司 | 芯片转移装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050214963A1 (en) * | 2004-03-29 | 2005-09-29 | Daniels John J | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
US20070020801A1 (en) * | 2005-07-20 | 2007-01-25 | Fujitsu Limited | IC chip mounting method |
US20070077730A1 (en) * | 2005-09-30 | 2007-04-05 | Christophe Halope | Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device |
US20070183184A1 (en) * | 2006-02-03 | 2007-08-09 | Semiconductor Energy Laboratory Ltd. | Apparatus and method for manufacturing semiconductor device |
US20090297300A1 (en) * | 2006-01-17 | 2009-12-03 | Muehlbauer Ag | Apparatus and method for transferring a plurality of chips from a wafer to a sub strate |
US20140259633A1 (en) * | 2013-03-15 | 2014-09-18 | Sandia Corporation | Printed crystalline microelectronic devices |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3739752B2 (ja) * | 2003-02-07 | 2006-01-25 | 株式会社 ハリーズ | ランダム周期変速可能な小片移載装置 |
US7861405B2 (en) * | 2008-03-03 | 2011-01-04 | Palo Alto Research Center Incorporated | System for forming a micro-assembler |
KR101022017B1 (ko) * | 2008-10-01 | 2011-03-16 | 한국기계연구원 | 계층화 구조물 제조 장치 |
DE102014110285A1 (de) * | 2014-07-22 | 2016-01-28 | Thyssenkrupp Ag | Einrichtung und Verfahren zum Strukturieren einer Walze durch Laserabtrag |
-
2016
- 2016-08-16 DE DE102016115186.6A patent/DE102016115186A1/de not_active Withdrawn
-
2017
- 2017-08-16 WO PCT/EP2017/000990 patent/WO2018033248A2/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050214963A1 (en) * | 2004-03-29 | 2005-09-29 | Daniels John J | Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices |
US20070020801A1 (en) * | 2005-07-20 | 2007-01-25 | Fujitsu Limited | IC chip mounting method |
US20070077730A1 (en) * | 2005-09-30 | 2007-04-05 | Christophe Halope | Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device |
US20090297300A1 (en) * | 2006-01-17 | 2009-12-03 | Muehlbauer Ag | Apparatus and method for transferring a plurality of chips from a wafer to a sub strate |
US20070183184A1 (en) * | 2006-02-03 | 2007-08-09 | Semiconductor Energy Laboratory Ltd. | Apparatus and method for manufacturing semiconductor device |
US20140259633A1 (en) * | 2013-03-15 | 2014-09-18 | Sandia Corporation | Printed crystalline microelectronic devices |
Also Published As
Publication number | Publication date |
---|---|
WO2018033248A2 (fr) | 2018-02-22 |
DE102016115186A1 (de) | 2018-02-22 |
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