WO2018028305A1 - 一种印刷方法 - Google Patents

一种印刷方法 Download PDF

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Publication number
WO2018028305A1
WO2018028305A1 PCT/CN2017/088679 CN2017088679W WO2018028305A1 WO 2018028305 A1 WO2018028305 A1 WO 2018028305A1 CN 2017088679 W CN2017088679 W CN 2017088679W WO 2018028305 A1 WO2018028305 A1 WO 2018028305A1
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Prior art keywords
material layer
organic material
printing
substrate
printing method
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PCT/CN2017/088679
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English (en)
French (fr)
Inventor
陈静静
王利娜
张亮
张得福
崔富毅
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Priority to US15/736,730 priority Critical patent/US20180354286A1/en
Publication of WO2018028305A1 publication Critical patent/WO2018028305A1/zh
Anticipated expiration legal-status Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/12—Stencil printing; Silk-screen printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M2205/00—Printing methods or features related to printing methods; Location or type of the layers
    • B41M2205/14—Production or use of a mask

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a printing method.
  • the printing process is an important part of the glass plastic packaging process, and the effect of the printing process directly affects the packaging effect.
  • Screen printing has become a widely used printing method due to its advantages such as simple equipment, convenient operation, simple plate making, low cost and strong adaptability.
  • the material of the screen and the manufacturing process cannot ensure the same tension at each point, thus causing the offset direction and offset of the glass glue at different points in the printing process.
  • the difference is that the printed glass glue is offset at different positions.
  • the pattern printed by the screen may be burred.
  • the print offset has an impact on subsequent laser sealing processes and cutting processes.
  • the present invention provides a printing method that can at least partially address the problems of print offset and burr present in prior art printing processes.
  • a printing method comprising: forming an organic material layer in a non-printing area of a substrate, the burning point of the organic material layer being lower than a pre-curing temperature of the glass paste; and printing the substrate Forming a glass paste on the printed area of the substrate; and subjecting the organic material layer to a combustion treatment to separate the organic material layer from the substrate.
  • the printing method according to the present invention forms an organic material layer on the substrate such that the organic material layer completely blocks the non-printing area when printing the glass paste, and then removes or removes excess glass glue which causes printing offset and burr by the burning process. Thereby effectively avoiding the occurrence of printing offset and burrs, and greatly reducing the defective product rate.
  • the step of subjecting the organic material layer to a combustion treatment may include pre-curing the glass paste. Since the burning point of the organic material layer is lower than the pre-curing temperature of the glass glue, when the glass glue is pre-cured, it is ensured that the organic material layer can be subjected to combustion treatment, and thus the combustion treatment of the organic material layer can pass through the glass. The pre-curing treatment of the glue is completed.
  • the pre-cure temperature of the glass paste may range from 100 °C to 120 °C.
  • the burning point of the organic material layer may range from 85 ° C to 115 ° C.
  • the pre-curing temperature of the glass glue is 100 ° C, and the burning point of the organic material layer ranges from 85 ° C to 95 ° C; or, the pre-curing temperature of the glass glue is 120 ° C, and the burning point of the organic material layer ranges from 105 ° C to 115 ° C; alternatively, the pre-cure temperature is 110 ° C, and the burning point ranges from 95 ° C to 105 ° C; or the pre-cure temperature is 110 ° C, and the burning point is 100 ° C.
  • the printing method before the step of subjecting the organic material layer to a combustion treatment, may include placing the substrate in a flowing gas having a fixed flow direction. Therefore, when the organic material layer is burned, the glass glue adhered to the organic material layer is driven and taken away along with the hot air, thereby effectively avoiding the occurrence of printing offset and burrs, and greatly reducing the defective product rate.
  • the flowing gas may be compressed air.
  • the organic material layer and the glass paste may have the same thickness, and/or the organic material layer may be made of a material that cannot chemically react with the glass paste 104, thereby avoiding the glass. Glue and thus damage to the printing process.
  • Figure 1 shows a flow chart of a printing method in accordance with one embodiment of the present invention
  • FIG. 2 is a schematic view showing a step 1001 of the printing method shown in FIG. 1 - forming an organic material layer in a non-printing region of a substrate;
  • FIG. 3 is a schematic view showing a step 1002 of the printing method shown in FIG. 1 - forming a glass paste in a printing area of a substrate;
  • FIG. 4 is a cross-sectional view showing the printing offset of the glass paste during the printing process of the substrate in the printing method shown in FIG. 1;
  • Figure 5 is a cross-sectional view showing the printing offset offset glass paste shown in Figure 4 after leveling
  • Fig. 6 is a view showing the separation of the offset glass paste and the normally printed glass paste during the burning process of the organic material layer in the printing method shown in Fig. 1.
  • Fig. 1 schematically shows a flow chart of a printing method in accordance with one embodiment of the present invention. As shown in FIG. 1, the printing method includes:
  • Step 1001 forming an organic material layer in a non-printing area of the substrate, wherein the burning point of the organic material layer is lower than the pre-curing temperature of the glass glue;
  • Step 1002 performing a printing process on the substrate to form a glass paste on the printed area of the substrate;
  • step 1003 the organic material layer is subjected to a combustion treatment to separate the organic material layer from the substrate.
  • the printing method according to the embodiment of the present invention shown in FIG. 1 forms an organic material layer on a substrate such that the organic material layer completely blocks the non-printing area when the glass paste is printed, and is removed or taken away by the burning process to produce a printing offset.
  • Excess glass glue for moving and burring thus effectively avoiding the occurrence of printing offset and burrs, and greatly reducing the defective rate.
  • step 1001 of the printing method shown in FIG. 1 shows a schematic diagram of a step 1001 of the printing method shown in FIG. 1 in which an organic material layer 102- is formed in a non-printing region 101 of a substrate.
  • the substrate includes a printed area 103 and a non-printed area 102.
  • step 1001 of the printing method according to the embodiment of the present invention shown in FIG. 1 as shown in FIG. 1, as shown in FIG. 2, an organic material layer 101 is formed on the non-printing area 102 of the substrate, that is, the organic material layer 101 will be a non-printing area of the substrate. 102 is completely occluded while exposing the printed area 103 of the substrate.
  • FIG. 3 shows a schematic diagram of a step 1002 of the printing method shown in FIG. 1 for performing a printing process on a substrate to form a glass paste 104- in the printing region 103.
  • the printing area 103 is completely covered by the glass paste 104 by the printing process on the substrate.
  • the organic material layer 101 shown in FIGS. 2 and 3 can have the following features.
  • the organic material layer 101 formed on the non-printing area 102 has the same thickness as the glass paste 104 formed on the printing area 103. In this way, it is ensured that the printing height of the glass paste 104 reaches the desired height of the process, while avoiding the glass glue 104 from overflowing into the non-printing area 102 during the printing process.
  • the constituent material of the organic material layer 101 does not chemically react with the glass paste 104. Specifically, when the temperature is at a pre-curing temperature or lower, the metal element contained in the glass paste 104 in contact with the organic material layer 101 does not An oxidation reaction occurs with the organic material in the organic material layer 101. Thus, the oxidation reaction is effectively prevented from causing damage to the glass paste 104 for printing and, in turn, to the printing process.
  • the burning point of the constituent material of the organic material layer 101 is lower than the pre-curing temperature of the glass paste 104, thereby pre-curing the glass paste 104 in a subsequent step.
  • the organic material layer 101 can be subjected to the combustion treatment, and finally the excess glass glue 104 which generates the printing offset and the burr is taken away by the burning process, thereby effectively avoiding the occurrence of printing offset and burrs, and greatly reducing Bad product rate.
  • the pre-curing treatment of the glass paste 104 and the combustion treatment of the organic material layer 101 will be specifically described below with reference to FIG.
  • the pre-curing temperature of the glass paste 104 may range from 100 ° C to 120 ° C, and the burning point of the organic material layer 101 may range from 85 ° C to 115 ° C.
  • the burning point of the organic material layer 101 may range from 85 ° C to 95 ° C; when the pre-curing temperature of the glass frit 104 is 120 ° C, the organic material layer 101 The burning point may range from 105 ° C to 115 ° C; when the pre-curing temperature of the glass frit 104 is 110 ° C, the burning point of the organic material layer 101 may range from 95 ° C to 105 ° C.
  • the pre-curing temperature of the glass paste 104 may be 110 ° C, and the burning point of the organic material layer 101 may be 100 ° C.
  • FIG. 4 shows a cross-sectional view of the printing offset occurring during the printing process of step 1002 of the printing method shown in FIG. 1.
  • the glass paste 104 formed in the groove 105 of the printing area is shifted to the right, that is, the left side of the groove 105 is not glass glue.
  • 104 fills up, while the right glass glue 104 is beyond the printing area and is higher than the organic material layer 101 (also exceeds the glass glue 104 The predetermined thickness).
  • Fig. 5 is a cross-sectional view showing the printing offset-applied glass paste 104 shown in Fig. 4 after leveling. As shown in FIG.
  • the glass glue 104 after leveling fills the groove 105 of the printing area of the substrate 100, leaving only a portion of the glass glue 104 having a very thin thickness to remain on the organic material layer 101, thereby being significantly reduced. Excess glass glue 104 that produces print offsets and burrs, thereby effectively avoiding print offsets and burrs, greatly reducing the rate of defective products.
  • step 1003 of the printing method shown in FIG. 1 the burning treatment of the organic material material layer can be completed by placing the substrate which has been subjected to the printing process to form the glass paste 104 into the pre-curing device, and the glass paste 104. Pre-curing treatment is carried out. Since, as described in step 1001, the burning point of the organic material layer 101 is lower than the pre-curing temperature of the glass paste 104, the organic material layer 101 starts to burn to be separated from the substrate 100.
  • Fig. 6 is a view showing the separation of the offset glass paste 104 and the normally printed glass paste 104 during the burning process of the organic material layer in the printing method shown in Fig. 1. As shown in FIG.
  • the substrate 100 can be placed in a flowing gas having a fixed flow direction, and the direction of the arrow shown in FIG. 6 is a fixed flow direction of the flowing gas.
  • the flowing gas may be clean dry compressed air (CDA).
  • the combustion treatment of the organic material layer can also be carried out separately, as long as the process temperature reaches the burning point of the organic material layer and does not exceed the glass glue 104.
  • the pre-curing temperature is sufficient.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Printing Methods (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种印刷方法，包括：在基板的非印刷区域（102）形成有机材料层（101），有机材料层（101）的构成材料的燃烧点低于玻璃胶（104）的预固化温度；对基板进行印刷处理，以在该基板的印刷区域（103）形成玻璃胶（104）；对有机材料层（101）进行燃烧处理，以使该有机材料层（101）与基板分离。通过在基板上形成有机材料层，该有机材料层在印刷玻璃胶时将非印刷区域全部遮挡，再通过燃烧处理带走产生印刷偏移和毛刺的多余玻璃胶，从而有效避免印刷偏移和毛刺的出现，大大降低不良品的生产。

Description

一种印刷方法 技术领域
本发明涉及显示技术领域，尤其涉及一种印刷方法。
背景技术
印刷工艺是玻璃胶封装工艺的一个重要环节，而印刷工艺效果的好坏直接影响封装效果。由于设备简单、操作方便、制版简易且成本低廉、适应性强等优点，丝网印刷已经成为是一种广泛应用的印刷方法。但是由于丝网印刷的网版具有一定的张力，网版的材料以及制作工艺不能确保各个点的张力相同，因此造成了在印刷过程中不同点处的玻璃胶的偏移方向和偏移量的不同，即印刷出来的玻璃胶在各个位置处偏移程度不同。另外，由于玻璃胶具有一定的流动性，导致通过网版印刷出来的图形会出现毛刺现象。
印刷偏移对后续的激光密封工艺与切割工艺都会产生影响。首先，当印刷偏移过大时，由于激光密封工艺的激光路线是固定的，导致玻璃不能被有效地进行激光烧结，进而容易导致封装失效。其次，由于印刷偏移过大，可能产生玻璃覆盖切割线的情况，从而容易造成切割不良。同理，玻璃毛刺过大也容易造成切割不良。
发明内容
针对现有技术中存在的问题，本发明提供了一种印刷方法，可以至少部分解决现有技术的印刷工艺存在的印刷偏移和毛刺的问题。
根据本发明的一个方面，提供一种印刷方法，包括：在基板的非印刷区域形成有机材料层，所述有机材料层的燃烧点低于玻璃胶的预固化温度；对所述基板进行印刷处理，以在所述基板的印刷区域形成玻璃胶；以及，对所述有机材料层进行燃烧处理，以使所述有机材料层与所述基板分离。
根据本发明的印刷方法通过在基板上形成有机材料层，使得有机材料层在印刷玻璃胶时将非印刷区域全部遮挡，再通过燃烧处理去除或带走造成印刷偏移和毛刺的多余玻璃胶，从而有效避免印刷偏移和毛刺的出现，大大降低不良品率。
在根据本发明的印刷方法的一个实施例中，所述对所述有机材料层进行燃烧处理的步骤可以包括所述玻璃胶进行预固化处理。由于有机材料层的燃烧点低于玻璃胶的预固化温度，从而在对所述玻璃胶进行预固化处理时，保证了有机材料层必然可以进行燃烧处理，因而有机材料层的燃烧处理可以通过玻璃胶的预固化处理完成。
在根据本发明的印刷方法的一个实施例中，玻璃胶的预固化温度的范围可以为100℃至120℃。此时，有机材料层的燃烧点的范围可以为85℃至115℃。例如，玻璃胶的预固化温度为100℃，且有机材料层的燃烧点的范围为85℃至95℃；或者，玻璃胶的预固化温度为120℃，且有机材料层的燃烧点的范围为105℃至115℃；或者，所述预固化温度为110℃，且所述燃烧点的范围为95℃至105℃；或者所述预固化温度为110℃，且所述燃烧点为100℃。
在根据本发明的印刷方法的一个实施例中，在对所述有机材料层进行燃烧处理的步骤之前，该印刷方法可以包括：将所述基板放置在具有固定流向的流动气体之中。于是在有机材料层燃烧时，粘在有机材料层上的玻璃胶就会被带动起来，随着热气一起被带走，从而有效避免印刷偏移和毛刺的出现，大大降低不良品率。
在根据本发明的印刷方法的一个实施例中，所述流动气体可以为压缩空气。
在根据本发明的印刷方法的一个实施例中，有机材料层与玻璃胶可以具有相同的厚度，并且/或者有机材料层可以由无法与玻璃胶104发生化学反应的材料制成，从而避免对玻璃胶以及因而对印刷工艺的破坏。
附图说明
图1示出根据本发明的一个实施例的印刷方法的流程图；
图2示出图1所示的印刷方法的步骤1001--在基板的非印刷区域形成有机材料层--的示意图；
图3示出图1所示的印刷方法的步骤1002--在基板的印刷区域形成玻璃胶--的示意图；
图4示出在图1所示的印刷方法中对基板印刷处理的过程中玻璃胶出现印刷偏移的截面图；
图5示出图4所示的出现印刷偏移的玻璃胶经过流平之后的截面图；以及
图6示出图1所示的印刷方法中的对有机材料层的燃烧处理过程中印刷偏移的玻璃胶与印刷正常的玻璃胶的分离示意图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面将结合附图对本发明的技术方案进行详细描述。
图1示意性示出根据本发明的一个实施例的印刷方法的流程图。如图1所示，该印刷方法包括：
步骤1001，在基板的非印刷区域形成有机材料层，其中有机材料层的燃烧点低于玻璃胶的预固化温度；
步骤1002，对基板进行印刷处理，以在基板的印刷区域形成玻璃胶；以及
步骤1003，对有机材料层进行燃烧处理，以使有机材料层与基板分离。
图1所示的根据本发明实施例的印刷方法通过在基板上形成有机材料层，使得在印刷玻璃胶时该有机材料层将非印刷区域全部遮挡，并且通过燃烧处理去除或带走产生印刷偏移和毛刺的多余玻璃胶，从而有效避免印刷偏移和毛刺的出现，大大降低不良品率。
下面分别结合图2-6具体说明图1所示的根据本发明实施例的印刷方法的各个步骤。
图2示出图1所示的印刷方法的步骤1001-在基板的非印刷区域101形成有机材料层102-的示意图。如图2所示，基板包括印刷区域103和非印刷区域102。依照图1所示的根据本发明实施例的印刷方法的步骤1001，如图2所示，在基板的非印刷区域102上形成有机材料层101，即该有机材料层101将基板的非印刷区域102全部遮挡，同时使得基板的印刷区域103曝露。
图3示出图1所示的印刷方法的步骤1002-对基板进行印刷处理以在印刷区域103形成玻璃胶104-的示意图。如图3所示，通过对基板的印刷处理，印刷区域103被玻璃胶104完全覆盖。
由于在进行印刷工艺之前，如图2和3所示，有机材料层101将 基板的非印刷区域102全部遮挡，因此偏移出印刷区域103以外的玻璃胶104都会粘在有机材料层101上，从而有效杜绝了印刷偏移和毛刺的产生。
进一步地，图2和图3所示的有机材料层101可以具有如下特点。首先，形成在非印刷区域102上的有机材料层101与形成在印刷区域103上的玻璃胶104具有相同的厚度。这样，可以保证玻璃胶104的印刷高度达到工艺要求的预期高度，同时避免玻璃胶104在印刷过程中外溢至非印刷区域102。其次，有机材料层101的构成材料不会与玻璃胶104发生化学反应，具体而言，当温度在预固化温度及以下时，与有机材料层101接触的玻璃胶104中含有的金属元素不会与有机材料层101中的有机材料发生氧化反应。因而，有效避免了氧化反应对印刷用的玻璃胶104以及进而对印刷工艺造成破坏。
另外，如图1所示的印刷方法的步骤1001所述，有机材料层101的构成材料的燃烧点低于玻璃胶104的预固化温度，从而在后续步骤中对所述玻璃胶104进行预固化处理时，有效保证了有机材料层101必然可以进行燃烧处理，于是最终通过燃烧处理带走或去除产生印刷偏移和毛刺的多余玻璃胶104，从而有效避免印刷偏移和毛刺的出现，大大降低不良品率。关于玻璃胶104的预固化处理和有机材料层101的燃烧处理，将在下文中参照图6进行具体描述。一般地，玻璃胶104的预固化温度的范围可以为100℃至120℃，而有机材料层101的燃烧点的范围可以为85℃至115℃。例如，当玻璃胶104的预固化温度为100℃时，有机材料层101的燃烧点的范围可以为85℃至95℃；当玻璃胶104的预固化温度为120℃时，有机材料层101的燃烧点的范围可以为105℃至115℃；当玻璃胶104的预固化温度为110℃时，有机材料层101的燃烧点的范围可以为95℃至105℃。特别地，玻璃胶104的预固化温度可以为110℃，此时有机材料层101的燃烧点可以为100℃。
图4示出在图1所示的印刷方法的步骤1002的印刷处理的过程中出现的印刷偏移的截面图。如图4所示，在本发明的印刷方法的步骤1002中的印刷处理的过程中，印刷区域的凹槽105内形成的玻璃胶104向右出现偏移，即凹槽105左边未被玻璃胶104填满，而右边玻璃胶104却超出了印刷区域且高度超过有机材料层101(也超过了玻璃胶104 的预定厚度)。
由于有机材料层101将基板100的非印刷区域103全部遮挡而且玻璃胶104具有一定的粘性，因此印刷偏移出现时，印刷区域的凹槽105内的玻璃胶104对偏移出印刷区域且粘在有机层101上方的玻璃胶104具有一定的拉力，使得出现印刷偏移的玻璃胶104向凹槽105内进行流平。图5示出图4所示的出现印刷偏移的玻璃胶104经过流平之后的截面图。如图5所示，流平之后的玻璃胶104填满基板100的印刷区域的凹槽105，只剩下厚度很薄的一部分玻璃胶104留在有机材料层101之上，从而可以明显减少了产生印刷偏移和毛刺的多余玻璃胶104，从而有效避免印刷偏移和毛刺的出现，大大降低不良品率。
在图1所示的印刷方法的步骤1003中，对有机材料材料层的燃烧处理可以通过下述操作完成：将经过印刷处理而形成了玻璃胶104的基板放入预固化设备，对玻璃胶104进行预固化处理。由于，如步骤1001中所述，有机材料层101的燃烧点低于玻璃胶104的预固化温度，因此有机材料层101开始燃烧，从而与基板100分离。图6示出图1所示的印刷方法中在对有机材料层的燃烧处理过程中印刷偏移的玻璃胶104与印刷正常的玻璃胶104的分离示意图。如图6所示，在对玻璃胶104进行预固化处理之前，可以将基板100放置在具有固定流向的流动气体之中，图6中所示箭头方向为流动气体的固定流向。一般地，所述流动气体可以为洁净干燥的压缩空气(CDA)。一旦有机材料层开始燃烧，粘在有机材料层上的少量玻璃胶104就会被带动起来，随着热气一起被排出预固化设备(未示出)，从而有效避免印刷偏移和毛刺的出现，大大降低不良品率。当然，除了上述与在对玻璃胶104的预固化处理过程同时进行之外，对有机材料层的燃烧处理过程也可以单独进行，只要工艺温度达到有机材料层的燃烧点且不超过玻璃胶104的预固化温度即可。
在本发明的描述中，需要说明的是，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个......”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (12)

  1. 一种印刷方法，包括：
    在基板的非印刷区域形成有机材料层，所述有机材料层的燃烧点低于玻璃胶的预固化温度；
    对所述基板进行印刷处理，以在所述基板的印刷区域形成所述玻璃胶；
    对所述有机材料层进行燃烧处理，以使所述有机材料层与所述基板分离。
  2. 根据权利要求1所述的印刷方法，其中所述对所述有机材料层进行燃烧处理的步骤包括对所述玻璃胶进行预固化处理。
  3. 根据权利要求2所述的印刷方法，进一步包括：在对所述玻璃胶进行预固化处理之前，将所述基板放置在具有固定流向的流动气体之中。
  4. 根据权利要求1所述的印刷方法，其中所述玻璃胶的预固化温度的范围为100℃至120℃，且所述有机材料层的燃烧点的范围为85℃至115℃。
  5. 根据权利要求4所述的印刷方法，其中所述玻璃胶的预固化温度为100℃，且所述有机材料层的燃烧点的范围为85℃至95℃。
  6. 根据权利要求4所述的印刷方法，其中所述玻璃胶的预固化温度为120℃，所述有机材料层的燃烧点的范围为105℃至115℃。
  7. 根据权利要求4所述的印刷方法，其中所述玻璃胶的预固化温度为110℃，且所述有机材料层的燃烧点的范围为95℃至105℃。
  8. 根据权利要求4所述的印刷方法，其中所述玻璃胶的预固化温度为110℃，且所述有机材料层的燃烧点为100℃。
  9. 根据权利要求1所述的印刷方法，进一步包括：在所述对所述有机材料层进行燃烧处理的步骤之前，将所述基板放置在具有固定流向的流动气体之中。
  10. 根据权利要求9所述的印刷方法，其中所述流动气体为压缩空气。
  11. 根据权利要求1所述的印刷方法，其中所述有机材料层与所述玻璃胶具有相同的厚度。
  12. 根据权利要求1所述的印刷方法，其中所述有机材料层由无法与所述玻璃胶发生化学反应的材料制成。
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