WO2018014500A1 - 扬声器振膜及其成型方法 - Google Patents

扬声器振膜及其成型方法 Download PDF

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Publication number
WO2018014500A1
WO2018014500A1 PCT/CN2016/111115 CN2016111115W WO2018014500A1 WO 2018014500 A1 WO2018014500 A1 WO 2018014500A1 CN 2016111115 W CN2016111115 W CN 2016111115W WO 2018014500 A1 WO2018014500 A1 WO 2018014500A1
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WO
WIPO (PCT)
Prior art keywords
lead
diaphragm
speaker
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/111115
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English (en)
French (fr)
Inventor
郭晓冬
田光涛
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Goertek Inc
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Goertek Inc
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Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US16/319,005 priority Critical patent/US11317215B2/en
Publication of WO2018014500A1 publication Critical patent/WO2018014500A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/14—Non-planar diaphragms or cones corrugated, pleated or ribbed
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/20—Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001—Moulding aspects of diaphragm or surround
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00—Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/003—Manufacturing aspects of the outer suspension of loudspeaker or microphone diaphragms or of their connecting aspects to said diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/207—Shape aspects of the outer suspension of loudspeaker diaphragms

Definitions

  • the invention belongs to the technical field of electronic product processing, and in particular relates to a structure of a speaker diaphragm and a molding method thereof.
  • Micro-speakers are important devices in electronic products, and are widely used in earpieces and earphones of electronic devices such as mobile phones and tablet computers.
  • Conventional micro-speakers usually adopt a moving coil structure or a moving iron structure, and a speaker with a moving coil structure is more widely used.
  • the sound performance of micro-speakers also needs to be improved.
  • the moving coil speaker has a voice coil and a diaphragm, and the voice coil receives a sound signal transmitted from an external device through a lead wire and generates vibration under the action of a magnetic field.
  • the voice coil is connected to the diaphragm, and when the voice coil vibrates, it will drive the diaphragm to vibrate and produce sound.
  • the lead wire usually extends from the outer casing of the speaker unit to the voice coil suspended in the middle of the speaker unit, when the voice coil vibrates, the lead wire may cause a phenomenon in which the voice coil and the vibrating portion of the diaphragm are pulled.
  • the vibration of the voice coil also causes the wire to vibrate, causing it to collide with the outer casing of the speaker, generating noise. In both cases, on the one hand, it will affect the vibration degree of vibration of the diaphragm, on the other hand, noise will be generated, and the overall sound effect of the speaker will be affected by the lead.
  • a speaker diaphragm comprising:
  • a lead encapsulation portion having a film portion and a support bump, the support bump being distributed on a surface of the film portion, the film portion having a thickness greater than or equal to a diameter of the lead wire, The thickness of the entire lead encapsulation portion is larger than the diameter of the lead wire, and a part of the lead wire is injection molded in the lead encapsulation portion;
  • the diaphragm layer is configured to constitute an overall structure of a speaker diaphragm, a thickness of the diaphragm layer is greater than or equal to a thickness of the entire lead encapsulation portion, and the lead encapsulation portion is injection molded on the vibrating layer In the film layer.
  • the diaphragm layer has a folded loop
  • the membrane portion has an arcuate portion corresponding to the folded loop
  • the lead extends through the arcuate face
  • the portion of the lead in the arcuate portion has a bent structure.
  • the diaphragm layer has a fixing portion at a periphery of the folding ring and a center portion surrounded by the folding ring, and the film portion of the wire enclosing portion has a first plane corresponding to the fixing portion and A second plane corresponding to the central portion, the lead extending through the first plane and the second plane.
  • the lead is at an intermediate position in the thickness direction of the diaphragm layer.
  • the ends of the leads are electrically connected to pads on the speaker housing and/or to the voice coil of the speaker, respectively.
  • the speaker diaphragm comprises a composite layer, the composite layer is disposed on the central portion, and one end of the lead is electrically connected to the composite layer.
  • the number of leads in the speaker diaphragm is greater than or equal to two.
  • the invention also provides a processing method for a speaker diaphragm, which comprises:
  • a lead encapsulation portion is injection molded on a portion of the lead structure, the lead encapsulation portion having a film portion and a support bump, the film portion having a thickness greater than or equal to a diameter of the lead wire, the overall thickness of the lead encapsulation portion being greater than The diameter of the lead;
  • the entire shape of the speaker diaphragm is formed in the lead encapsulation portion and the lead injection molding diaphragm layer, and the thickness of the diaphragm layer is larger than the entire thickness of the lead encapsulation portion.
  • the film portion is injection molded into a planar structure
  • a folding ring is formed on the diaphragm layer, and a film corresponding to the position of the folding ring is formed.
  • the inventors of the present invention have found that in the prior art, the technology of the moving coil type speaker is relatively mature, and the leads of the conventional moving coil type speaker are all outside the diaphragm. Since this basic structure is relatively mature, those skilled in the art will not modify these basic structures when using the moving coil structure. For collision noise generated by the leads, those skilled in the art will generally make improvements in other structures to reduce the effects of noise.
  • the present invention has been improved over the conventional basic structure. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • Figure 1 is a partial side cross-sectional view of a speaker diaphragm provided by the present invention
  • FIG. 2 is a schematic view showing the overall structure of a speaker diaphragm provided by the present invention
  • FIG. 3 is a schematic structural view of a lead encapsulation portion and a lead wire provided by the present invention.
  • FIG. 4 is a schematic structural view of a lead wire provided by the present invention.
  • the present invention provides an improved speaker diaphragm that encloses a lead inside, and the lead does not collide with the outer casing of the speaker when the diaphragm vibrates, thereby eliminating noise generated by the collision of the lead.
  • the speaker diaphragm provided by the present invention includes at least a lead, a lead encapsulation portion and a diaphragm layer.
  • the lead encapsulation portion 2 has a film portion 21 and a support bump 22, and the film portion 21 is a film layer formed of a soft rubber material, and may have a bend or a curved surface matching the overall shape of the speaker diaphragm. .
  • the support bumps 22 are evenly distributed on the surface of the film portion 21, and the support bumps 22 have a certain height. Preferably, support bumps 22 are distributed on both the front and back surfaces of the film portion 21.
  • a partial structure of the lead 1 is injection molded in the lead encapsulation portion 2, that is, a length of the lead 1 extends in the film portion 21 or the surface of the film portion 21. As shown in FIG.
  • the thickness of the film portion 21 is greater than or equal to the diameter of the lead wire 1, and the support bump 22 protrudes upward from the surface of the film portion 21, so that the wire encapsulation portion 2 as a whole
  • the thickness is larger than the diameter of the lead 1, that is, the thickness of the film portion 21 plus the protrusion height of the support bump 22 is larger than the lead diameter.
  • the thickness limitation of the lead encapsulation described above is to ensure that the leads can be injection molded into the lead encapsulation.
  • the lead encapsulation portion is injection molded around the lead, since the thickness of the film portion is equal to or larger than the lead diameter, the lead may be completely buried in the film portion, or the lead may be exposed from one surface of the film portion. However, no matter what happens during injection molding, the portion of the lead exposed from the film portion will not be higher than the support bump.
  • the speaker diaphragm provided by the present invention further includes a diaphragm layer for forming an overall structure and shape of the speaker diaphragm.
  • a diaphragm of a moving coil type speaker is generally annular, has a folded ring thereon, and the diaphragm layer as a whole may have an annular structure having a folded ring.
  • the thickness of the diaphragm layer 3 should be greater than or equal to the lead encapsulation portion. 2
  • the overall thickness, the lead encapsulation 2 is injection molded into the diaphragm layer 3.
  • the diaphragm layer 3 is injection molded outside the lead encapsulation portion 2.
  • the film portion 21 of the lead encapsulation portion 2 and the lead wires 1 therein are completely buried inside the diaphragm layer 3, and are not exposed from the surface of the diaphragm layer 3.
  • the support bumps may also be completely buried in the diaphragm layer, or only the top end of the support bump may be exposed from the surface of the diaphragm layer, but it does not affect the performance of the speaker diaphragm.
  • the structure of the supporting bump may be a hemispherical or cylindrical body, and the hemispherical supporting bump is not easily exposed from the diaphragm layer, and the supporting bump of the cylinder can provide a more stable supporting effect.
  • Supporting bumps of different structures have different manifestations in terms of support effect, prevention of exposure, etc., and those skilled in the art can select according to actual conditions.
  • the invention realizes the technical effect that the speaker lead is completely buried in the diaphragm by improving the structure of the speaker diaphragm, and can prevent the collision between the lead and the outer casing of the speaker, and eliminate the noise generated by the collision. If the lead structure is not encapsulated by the structure designed by the present invention, the entire structure of the diaphragm is directly injected around the lead. Due to the limitation of the injection molding process and the possible undulation of the lead, the lead is likely to be even from one side surface of the diaphragm. The surfaces on both sides are exposed.
  • the speaker diaphragm of the present invention adopts a two-part structure, and the lead encapsulation portion firstly encapsulates the lead, and the lead may be exposed from one surface of the film portion. Further, the supporting bumps on the film portion cooperate with the injection mold to play the role of overhead and elevation on the film portion, so that the diaphragm layer completely encloses the film portion, and the lead wires in the film portion are completely buried in the diaphragm layer. It is not exposed from the surface of the diaphragm layer.
  • the diaphragm layer 3 may have a folded ring 31. Accordingly, the film portion 21 of the lead encapsulation portion 2 may have a fold
  • the structure of the ring 31 corresponds to the arcuate portion 201.
  • the lead 1 may extend through the arcuate portion 201 or may extend only in a region other than the arcuate portion 201 without passing through the arcuate portion 201. Do not limit this. In the embodiment shown in FIGS.
  • the lead wire 1 can be used for electrical connection with the voice coil of the speaker, so that the lead wire 1 penetrates from the periphery of the diaphragm layer 3, passes through the folding ring 31 and the arc surface portion 201, And it is pierced from the central region of the diaphragm layer 3.
  • the folding ring of the diaphragm When the diaphragm of the loudspeaker is actually working, the folding ring of the diaphragm will produce tension and contraction during the vibration process and the deformation of the bending curvature will be changed.
  • the deformation of the folding ring is to make the part of the central area of the diaphragm better. Free vibration.
  • the lead may have a limitation on the deformation, so that the fold ring and the arc face cannot be vibrated with the voice coil. Shape variable.
  • the force of the deformation is large, it is also possible to cause damage to the leads in the arc face.
  • the portion of the lead 1 in the arcuate portion 201 preferably has a bent structure 11.
  • the lead 1 having the bent structure 11 does not extend in a straight line, but may be bent toward the extending direction of the folded ring 31 and the curved surface portion 201 to form an S-shaped or other form of bent extension. After the lead 1 extends out of the arcuate portion 201, it can be restored to extend in a straight line.
  • the bending structure 11 increases the length of the lead 1 in the arcuate portion 201 and increases the deformability of the lead 1 in the arcuate portion 201. When the curved portion 201 and the folded ring 31 are deformed, the bent structure 11 is formed.
  • the lead wires 1 can be deformed together, reducing the influence on the arcuate portion 201 and the folded ring 31, and also avoiding the occurrence of the lead wires 1 being pulled apart.
  • the diaphragm layer 3 may have a fixing portion 32 located at the periphery of the folding ring 31 and a center portion 33 surrounded by the folding ring 31.
  • the fixing portion 32 is for fixed connection with the outer casing of the speaker, and the central portion 33 is for generating vibration during operation.
  • the film portion 21 of the lead encapsulation portion 2 may also have a first plane 202 corresponding to the fixing portion 32, and the center
  • the second plane 203 corresponding to the portion 33 is as shown in FIG.
  • the lead 1 penetrates into the lead encapsulation 2 from the first plane 202. After passing through the arcuate portion 201, the lead 1 passes through the second plane 203.
  • the present invention does not limit that the lead enveloping portion 2 must have an arc surface portion 201.
  • the lead wire 1 needs to pass through the folding ring 31 of the diaphragm layer 3 to further It extends to the central area of the diaphragm layer 3, so the lead enveloping portion 2 needs to have the arcuate portion 201.
  • the leads configured for other application functions may not need to pass through the folded ring 31 of the diaphragm layer 3, and accordingly, the lead portion of the lead envelope does not need to have an arc face corresponding to the folded ring 31. 201.
  • the speaker diaphragm may include a composite layer disposed on the central portion, and the composite layer as a weight can improve the vibration stability of the central portion of the diaphragm layer, and on the other hand, the composite layer Other electronics or electrical connection points can be set up for other electrical functions.
  • the leads may be electrically connected to the composite layer for transmitting associated electrical signals to the composite layer to achieve functions associated with the composite layer.
  • the lead 1 and the lead encapsulation portion 2 may be located at an intermediate position in the thickness direction of the diaphragm layer 3, that is, the lead 1 is located at the diaphragm layer.
  • the intermediate thickness position of 3 is shown in Figure 4.
  • Both ends of the lead are electrically connected to different devices to realize signal conduction.
  • one end of the lead may be soldered to a pad on the speaker housing to introduce an external electrical signal into the speaker, and the other end of the lead may also be coupled to the voice coil of the speaker to provide an acoustic signal to the voice coil.
  • the present invention does not specifically limit the electrical connection of the leads to which devices.
  • those skilled in the art can connect the leads to specific components according to the functions of the leads.
  • the leads may be electrically connected to the electrical components prior to injection molding the leads into the lead encapsulation.
  • the lead wire may be welded to the elastic piece and the composite layer, and then the lead wire and the elastic piece may be The composite layer is placed together in an injection mold of the lead encapsulation portion.
  • the number of leads buried in the speaker diaphragm is greater than or equal to two.
  • the two leads may form a signal loop with the voice coil of the speaker, but in some embodiments of the present invention, the composite layer on the diaphragm and the like are also configured to have other functions, so that it can be on the speaker diaphragm
  • More leads and corresponding lead packages are provided for electrical connection to other devices.
  • some of the leads may be electrically connected to the composite layer, or to the centering tab of the speaker diaphragm, or the like.
  • the present invention also provides a method of processing a speaker diaphragm capable of processing the speaker diaphragm provided by the present invention.
  • the method comprises: first, placing the lead into the first injection mold, the first injection mold A lead encapsulation is formed by injection molding on a portion of the structure of the lead, wherein a portion of the structure of the lead refers to a lead located inside the diaphragm layer.
  • the height of the space in the first injection mold for injection molding the film portion should be greater than or equal to the diameter of the lead in which the lead is placed.
  • the lead wire has a certain float during the injection molding, it can be substantially covered by the film portion. It is possible that the lead is exposed from the upper surface or the lower surface of the film portion.
  • a pit is provided in the mold, and the support bump is formed by filling the plastic into the pit.
  • the depth of the pit plus the height of the space should be greater than the diameter of the lead, such that the overall thickness of the injection molded lead envelope is greater than the diameter of the lead, and the exposed portion of the lead from the film portion is not higher than the support The top of the bump.
  • the lead and the injection molded lead envelope are placed in a second injection mold, and the second injection mold is used to form the overall structure of the diaphragm layer.
  • the height of the space for injection molding the diaphragm layer should be greater than or equal to the thickness of the entire lead encapsulation portion, so that the injection plastic can be filled between the upper and lower surfaces of the lead encapsulation portion and the support bumps. The region completely covers the film portion and even the support bumps.
  • the lead encapsulation may have a certain float, which may cause the support bumps not to be completely covered by the diaphragm layer, but this situation does not affect the performance of the diaphragm.
  • the lead sealed by the lead encapsulation portion can be completely buried in the diaphragm layer, ensuring that the lead is not exposed.
  • a fold ring may be formed on the diaphragm layer to make the speaker diaphragm have good vibration conditions as a whole.
  • the film portion of the lead enveloping portion needs to have an arc surface portion matching the structure of the folding ring.
  • the film portion can be directly injection molded into a form having an arcuate portion through which the lead wire extends.
  • the lead encapsulation portion and the lead are placed in the second injection mold.
  • the position of the arcuate portion should correspond to the position of the curved portion of the second injection mold for the injection molding ring, such that a folding ring of the diaphragm layer is formed on the surface of the arc surface during injection molding.
  • the molding material of the lead encapsulation portion and the diaphragm layer may be selected from a silicone material, and the lead encapsulation portion is required to be subjected to the second injection molding in the second injection mold, thereby forming a lead encapsulation portion.
  • the hardness of the material is preferably lower than the material of the diaphragm layer for secondary injection molding.
  • the hardness of the material of the diaphragm layer is relatively high, which can better support and shape the speaker diaphragm as a whole.
  • the processing method of the present invention also provides another method of processing the curved face and the folded ring.
  • the arcuate portion may be formed on the film portion in advance, but if there is an error in the structure of the arcuate portion and the structure of the second injection mold, there is a possibility that the final formed loop and the curved portion are offset, inclined, and the like. Defects, on the contrary, reduce the acoustic performance of the product. Therefore, preferably, when the lead encapsulation portion is injection molded, the film portion may be first injection molded into a planar structure, and then the lead encapsulation portion is directly placed in the second injection mold.
  • the second injection mold has a curved portion for forming a folded ring, and when the lead envelop is pressed into the second injection mold, the bent portion in the mold directly presses a portion of the film portion into an arc portion.
  • the injection molding of the diaphragm layer is performed under the compression limit of the mold, and in the finally formed speaker diaphragm, the film portion can form a shaped arc surface, and the surface of the arc surface is formed with a fold matching the shape of the curved surface portion. ring. In this way, the arc surface and the shape and structure of the folding ring are completely matched, and the defects of inclination and offset do not occur.
  • the arcuate portion and the folded ring are formed directly on the lead encapsulation portion and the diaphragm layer by a single injection molding process, thereby improving the quality of the speaker diaphragm.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

本发明公开了一种扬声器振膜及其成型方法。该扬声器振膜包括：引线；引线包封部，所述引线包封部具有膜部和支撑凸点，所述支撑凸点分布在所述膜部的表面上，所述膜部的厚度大于或等于所述引线的直径，所述引线包封部整体的厚度大于所述引线的直径，所述引线的一部分注塑在所述引线包封部中；振膜层，所述振膜层配置为构成扬声器振膜的整体结构，所述振膜层的厚度大于或等于所述引线包封部整体的厚度，所述引线包封部注塑在所述振膜层中。本发明的一个技术效果在于可以防止引线与扬声器的壳体发生碰撞。

Description

扬声器振膜及其成型方法 技术领域
本发明属于电子产品加工技术领域，具体地，涉及一种扬声器振膜的结构及其成型方法。
背景技术
微型扬声器是电子产品中的重要器件，其广泛应用于手机、平板电脑等电子设备的听筒、耳机。传统的微型扬声器通常采用动圈式结构或动铁式结构，其中，具有动圈式结构的扬声器应用更为广泛。随着电子产品的逐渐发展，微型扬声器的声音性能也需要得到改进。
动圈式扬声器具有音圈和振膜，音圈通过引线接收从外部设备传送的声音信号，并在磁场的作用下产生振动。音圈与振膜相连接，音圈振动时会带动振膜振动，并产生声音。但是，由于引线通常是从扬声器单体的外壳延伸到悬于扬声器单体中间的音圈上，所以当音圈产生振动时，引线会产生拉扯音圈和振膜的振动部的现象。而且，音圈的振动也会带动引线振动，使其与扬声器的外壳发生碰撞，产生噪音。上述两种情况，一方面会影响振膜的振动自由度，另一方面会产生噪音，扬声器的整体音效会受到引线的影响。
所以，有必要对动圈式扬声器的结构进行改进，减少引线与外壳碰撞产生的噪音，或者，减少引线对振膜的拉扯作用。
发明内容
本发明的一个目的是提供一种扬声器振膜的新技术方案。
根据本发明的第一方面，提供了一种扬声器振膜，其中包括：
引线；
引线包封部，所述引线包封部具有膜部和支撑凸点，所述支撑凸点分布在所述膜部的表面上，所述膜部的厚度大于或等于所述引线的直径，所述引线包封部整体的厚度大于所述引线的直径，所述引线的一部分注塑在所述引线包封部中；
振膜层，所述振膜层配置为构成扬声器振膜的整体结构，所述振膜层的厚度大于或等于所述引线包封部整体的厚度，所述引线包封部注塑在所述振膜层中。
可选地，所述振膜层具有折环，所述膜部具有与所述折环相对应的弧面部，所述引线延伸经过所述弧面部。
可选地，所述引线在所述弧面部中的部分具有弯折结构。
可选地，所述振膜层具有位于折环外围的固定部和被所述折环包围的中心部，所述引线包封部的膜部具有与所述固定部相对应的第一平面和与所述中心部相对应的第二平面，所述引线延伸经过所述第一平面和第二平面。
可选地，所述引线处在所述振膜层的厚度方向上的中间位置。
可选地，所述引线的端部分别与扬声器外壳上的焊盘和/或扬声器的音圈电连接。
可选地，所述扬声器振膜包括复合层，所述复合层设置在所述中心部上，所述引线的一端与所述复合层电连接。
可选地，所述扬声器振膜中的引线数量大于或等于2条。
本发明还提供了一种扬声器振膜的加工方法，其中包括：
在引线的部分结构上注塑引线包封部，所述引线包封部上具有膜部和支撑凸点，所述膜部的厚度大于或等于引线的直径，所述引线包封部的整体厚度大于引线的直径；
在引线包封部以及引线外注塑振膜层，形成扬声器振膜的整体外形，所述振膜层的厚度大于引线包封部的整体厚度。
可选地，在注塑引线包封部时，将所述膜部注塑成平面结构，在注塑振膜层时，在所述振膜层上形成折环，与所述折环位置相对应的膜部形 成与所述折环的结构相匹配的弧面部。
本发明的发明人发现，在现有技术中，动圈式扬声器的技术相对成熟，传统的动圈式扬声器的引线均在振膜之外。由于这种基本结构比较成熟，所以本领域技术人员使用动圈式结构时不会改动这些基本结构。对于引线产生的碰撞噪音，本领域技术人员通常会在其它结构方面进行改进，减少噪音造成的影响。而本发明对传统的基本结构作出了改进。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明提供的扬声器振膜局部侧面剖视图；
图2是本发明提供的扬声器振膜的整体结构示意图；
图3是本发明提供的引线包封部及引线的结构示意图；
图4是本发明提供的引线的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明提供了一种改进的扬声器振膜，这种扬声器振膜将引线包封在内部，振膜在振动时引线不会与扬声器的外壳发生碰撞，从而消除了因引线碰撞产生的噪音。本发明提供的扬声器振膜至少包括引线、引线包封部和振膜层。如图1所示，所述引线包封部2具有膜部21和支撑凸点22，所述膜部21为软胶材料形成的膜层，可以具有配合扬声器振膜整体形状的弯折或曲面。所述支撑凸点22均匀分布在所述膜部21的表面上，支撑凸点22具有一定的高度。优选地，在所述膜部21的正反两个表面上都分布有支撑凸点22。特别地，所述引线1的部分结构注塑在所述引线包封部2中，即一段引线1在膜部21中或膜部21的表面延伸。如图1所示，所述膜部21的厚度大于或等于所述引线1的直径，而支撑凸点22的从膜部21表面向上凸出一定高度，这样，所述引线包封部2整体的厚度大于所述引线1的直径，即，膜部21的厚度加上支撑凸点22的凸出高度大于引线直径。
上述对引线包封部的厚度限制是为了保证引线能够注塑在引线包封部中。在引线周围注塑引线包封部时，由于膜部的厚度大于等于引线直径，所以，引线有可能完全埋于所述膜部中，或者引线有可能从膜部的一个表面上暴露出来。但无论注塑时出现何种情况，所述引线从膜部中暴露出来的部分都不会高过所述支撑凸点。
进一步地，本发明提供的所述扬声器振膜还包括振膜层，所述振膜层用于构成扬声器振膜的整体结构、形状。例如，通常动圈式扬声器的振膜呈环形，其上具有折环，所述振膜层整体可以呈具有折环的环形结构。特别地，如图1所示，所述振膜层3的厚度应大于或等于所述引线包封部 2整体的厚度，所述引线包封部2注塑在所述振膜层3中。由于存在上述对振膜层3的厚度限制，且所述支撑凸点22会对所述膜部21起到支撑、抬高的作用，所以，在引线包封部2外注塑成型振膜层3时，引线包封部2的膜部21以及其中的引线1会完全埋在振膜层3的内部，不会从振膜层3的表面露出。所述支撑凸点也可以完全埋在振膜层中，或者，只有支撑凸点的顶端有可能从振膜层的表面露出，但是并不会对扬声器振膜的性能产生影响。
可选地，所述支撑凸点的结构可以呈半球形或圆柱体，半球形的支撑凸点不易从振膜层中露出，圆柱体的支撑凸点能够提供更稳定的支撑作用。不同结构的支撑凸点在支撑效果、防止暴露等性能方面有不同的体现，本领域技术人员可以根据实际情况进行选择。
本发明通过对扬声器振膜的结构改进，实现了扬声器引线完全埋于振膜内的技术效果，能够防止引线与扬声器的外壳之间发生碰撞，消除碰撞产生的噪音。如果不采用本发明设计的结构对引线进行包封，而是直接在引线周围注塑振膜整体结构，由于注塑工艺的限制以及引线可能存在的起伏，引线很有可能从振膜的一侧表面甚至是两侧表面露出。而本发明的扬声器振膜采用两部分结构，引线包封部先对引线进行初步的包封，引线有可能从所述膜部的一个表面露出。进一步地，膜部上的支撑凸点与注塑模具配合能够对膜部起到架空、抬高的作用，使振膜层完全包封所述膜部，膜部中的引线完全埋在振膜层中，不会从振膜层的表面露出。
具体地，如图2、3所示，为适应扬声器振膜的振动性能，所述振膜层3可以具有折环31，相应地，所述引线包封部2的膜部21可以具有与折环31的结构相对应的弧面部201。根据所述引线1在扬声器振膜中所起到的功能不同，所述引线1可以延伸经过所述弧面部201，也可以仅在弧面部201以外的区域延伸，不经过弧面部201，本发明不对此进行限制。在图2、3所示的实施方式中，所述引线1可以用于与扬声器的音圈电连接，所以，引线1从振膜层3的外围穿入，经过折环31及弧面部201，并从振膜层3的中心区域穿出。
扬声器振膜在实际工作时，振膜的折环会在振动过程中产生拉伸、收缩以及使弯曲曲率发生改变的形变，折环产生这种形变是为了使振膜中心区域的部分能够更好的自由振动。在本发明中，对于引线延伸经过所述弧面部的实施方式，当折环以及弧面部发生形变时，引线有可能对这种形变造成限制，使得折环和弧面部无法随音圈振动达到理想的形变量。而且，如果形变的作用力较大，也有可能对弧面部中的引线造成破坏。为了防止上述现象，优选地，如图4所示，在本发明的一种实施方式中，所述引线1在所述弧面部201中的部分优选具有弯折结构11。具有弯折结构11的引线1不沿直线延伸，而是可以向折环31和弧面部201的延伸方向弯折，形成S型或其它形式的弯折延伸形式。引线1延伸出弧面部201后可以再恢复为沿直线延伸。所述弯折结构11增大了引线1在弧面部201中的长度且增加了引线1在弧面部201中的形变能力，当弧面部201及折环31产生形变时，具有弯折结构11的引线1可以一同产生形变，减小其对弧面部201及折环31的影响，也避免引线1自身被拉断的情况出现。
进一步地，在本发明的实施方式中，如图2所示，所述振膜层3可以具有位于折环31外围的固定部32以及被所述折环31包围的中心部33。所述固定部32用于与扬声器的外壳固定连接，所述中心部33则用于在工作时产生振动。相应地，为了保证引线1能够完全埋在振膜层3中，所述引线包封部2的膜部21也可以具有与所述固定部32相对应的第一平面202，以及与所述中心部33相对应的第二平面203，如图3所示。所述引线1则从第一平面202穿入引线包封部2中，经过弧面部201后，引线1从第二平面203穿出。
另外，本发明并不限制所述引线包封部2上必须具有弧面部201，在如图2、3所示的实施方式中，所述引线1需要穿过振膜层3的折环31进而延伸到振膜层3的中心区域，所以，所述引线包封部2需要具有弧面部201。在其它实施方式中，被配置为其它应用功能的引线可能不需要穿过振膜层3的折环31，相应的，引线包封部上也就不需要具有与折环31相对应的弧面部201。
优选地，所述扬声器振膜可以包括复合层，所述复合层设置在上述中心部上，复合层作为配重能够提高振膜层的中心部的振动稳定性，另一方面，复合层上也可以设置其它电子器件或配置电连接点，用于实现其它电气功能。可选地，所述引线可以与所述复合层电连接，用于将相关的电信号传输到复合层上，以实现与复合层有关的功能。
优选地，为了提高扬声器振膜的结构稳定性和振动平衡性能，所述引线1以及引线包封部2可以位于所述振膜层3厚度方向的中间位置，也即，引线1位于振膜层3的中间厚度位置，如图4所示。这样，所述扬声器振膜的重心居中，不易出现向上或向下的偏振现象。
所述引线的两端分别与不同的器件电连接，实现信号的传导。可选地，所述引线的一端可以与扬声器外壳上的焊盘焊接，以将外部的电信号引入扬声器中，引线的另一端也可以与扬声器的音圈连接，为音圈提供声音信号。本发明并不对引线与何种器件电连接进行具体的限制，在本发明的具体实施方式中，本领域技术人员可以根据引线所配置的功能不同，将引线与特定的部件连接。特别地，在将引线注塑到引线包封部之前，可以先引线与电气部件进行电连接。例如，引线的两端需要分别与设置在扬声器壳体中的弹片以及设置在扬声器振膜上的复合层电连接，则可以先将引线与弹片、复合层进行焊接，之后再将引线、弹片以及复合层一同放入引线包封部的注塑模具中。
可选地，扬声器振膜中埋入的引线数量大于或等于两条。一般地，两支引线可以与扬声器的音圈形成信号回路，但是在本实用新型的一些实施方式中，振膜上的复合层等结构还配置为具有其它功能，所以，可以在扬声器振膜上设置更多条引线及相应的引线包封部，用于与其它器件电连接。例如，一些引线还可以与所述复合层电连接，或者与扬声器振膜的定心支片电连接等。
本发明还提供了一种扬声器振膜的加工方法，这种加工方法能够加工本发明提供的扬声器振膜。
该方法包括：首先，将引线放入第一次注塑模具，第一次注塑模具 用于在引线的部分结构上注塑形成引线包封部，其中，所述引线的部分结构指位于振膜层内部的引线。特别地，第一注塑模具中用于注塑所述膜部的空间的高度应大于或等于引线的直径，所述引线放置在该空间中。这样，即使注塑过程中引线有一定浮动，也能够基本被所述膜部包覆。引线有可能从膜部的上表面或下表面露出。另外，模具中设置有凹点，注塑料充入凹点中可以形成所述支撑凸点。所述凹点的深度加上上述空间的高度应大于引线的直径，这样，注塑成型的引线包封部的整体厚度大于引线的直径，引线从所述膜部中露出的部分不会高过支撑凸点的顶端。
进一步地，将引线以及注塑成型的引线包封部放入第二次注塑模具中，第二次注塑模具用于形成振膜层的整体结构。在第二注塑模具中，用于注塑振膜层的空间的高度应大于或等于引线包封部整体的厚度，这样，注塑料能够填充到引线包封部的上下表面以及支撑凸点之间的区域，将所述膜部甚至支撑凸点完全覆盖。在注塑过程中，引线包封部可能具有一定浮动，可能造成支撑凸点无法完全被振膜层包覆，但是这种情况不会对振膜的性能造成影响。经过这种加工方法的处理，被引线包封部封住的引线能够完全埋在振膜层中，确保了引线不会露出。
可选地，所述振膜层上可以形成有折环，以使扬声器振膜整体具有良好的振动条件。相应的，如果引线穿过折环的区域，则所述引线包封部的膜部上需要具有与所述折环的结构相匹配的弧面部。为此，在注塑引线包封部时，可以直接将膜部注塑为具有弧面部的形式，引线从所述弧面部中延伸经过。之后，再将引线包封部及引线放入第二注塑模具中。特别地，所述弧面部的位置应与第二注塑模具中用于注塑折环的弯曲部分位置相对应，这样，注塑时会在弧面部表面形成振膜层的折环。
可选地，所述引线包封部和振膜层的成型材料均可以选用硅胶材料，由于引线包封部需要在第二注塑模具中进行二次注塑成型，所以，用于形成引线包封部的材料的硬度优选低于振膜层的材料，以便进行二次注塑。振膜层的材料的硬度相对较高，能够更好的为扬声器振膜整体提供支撑、定型的作用。
本发明的加工方法还提供了另一种弧面部以及折环的加工方法。如上所述，可以预先在膜部上形成弧面部，但是，如果弧面部的结构与第二注塑模具的结构存在误差，则有可能造成最终形成的折环与弧面部存在偏移、倾斜等结构缺陷，反而降低了产品的声学性能。所以优选地，在注塑引线包封部时，可以先将所述膜部注塑为平面结构，之后直接将引线包封部放入第二注塑模具中。第二注塑模具中具有用于形成折环的弯曲部分，当引线包封部被压合在第二注塑模具中时，模具中的弯曲部分会将所述膜部的一部分直接压成弧面部。在模具的压合限制下进行振膜层的注塑，在最后形成的扬声器振膜中，所述膜部能够形成定型的弧面部，所述弧面部表面形成有与弧面部的形状完全匹配的折环。这样，所述弧面部与折环的形状结构完全匹配，不会出现倾斜、偏移的缺陷。本发明提供的上述加工方法，直接通过一次注塑工序对引线包封部和振膜层形成弧面部和折环，提高了扬声器振膜的质量。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器振膜，其特征在于，包括：
    引线(1)；
    引线包封部(2)，所述引线包封部(2)具有膜部(21)和支撑凸点(22)，所述支撑凸点(22)分布在所述膜部(21)的表面上，所述膜部(21)的厚度大于或等于所述引线(1)的直径，所述引线包封部(2)整体的厚度大于所述引线(1)的直径，所述引线(1)的一部分注塑在所述引线包封部(2)中；
    振膜层(3)，所述振膜层(3)配置为构成扬声器振膜的整体结构，所述振膜层(3)的厚度大于或等于所述引线包封部(2)整体的厚度，所述引线包封部(2)注塑在所述振膜层(3)中。
  2. 根据权利要求1所述的扬声器振膜，其特征在于，所述振膜层(3)具有折环(31)，所述膜部(21)具有与所述折环(31)相对应的弧面部(201)，所述引线(1)延伸经过所述弧面部(201)。
  3. 根据权利要求1或2所述的扬声器振膜，其特征在于，所述引线(1)在所述弧面部(201)中的部分具有弯折结构(11)。
  4. 根据权利要求1-3任意之一所述的扬声器振膜，其特征在于，所述振膜层(3)具有位于折环(31)外围的固定部(32)和被所述折环(31)包围的中心部(33)，所述引线包封部(2)的膜部(21)具有与所述固定部(32)相对应的第一平面(202)和与所述中心部(33)相对应的第二平面(203)，所述引线(1)延伸经过所述第一平面(202)和第二平面(203)。
  5. 根据权利要求1-4任意之一所述的扬声器振膜，其特征在于，所述引线(1)处在所述振膜层(3)的厚度方向上的中间位置。
  6. 根据权利要求1-5任意之一所述的扬声器振膜，其特征在于，所述引线(1)的端部分别与扬声器外壳上的焊盘和/或扬声器的音圈电连接。
  7. 根据权利要求1-6任意之一所述的扬声器振膜，其特征在于，所述扬声器振膜包括复合层，所述复合层设置在所述中心部(33)上，所述 引线(1)的一端与所述复合层电连接。
  8. 根据权利要求1-7任意之一所述的扬声器振膜，其特征在于，所述扬声器振膜中的引线(1)数量大于或等于2条。
  9. 一种扬声器振膜的加工方法，其特征在于，包括：
    在引线(1)的部分结构上注塑引线包封部(2)，所述引线包封部(2)上具有膜部(21)和支撑凸点(22)，所述膜部(21)的厚度大于或等于引线(1)的直径，所述引线包封部(2)的整体厚度大于引线(1)的直径；
    在引线包封部(2)以及引线(1)外注塑振膜层(3)，形成扬声器振膜的整体外形，所述振膜层(3)的厚度大于引线包封部(2)的整体厚度。
  10. 根据权利要求9所述的加工方法，其特征在于，在注塑引线包封部(2)时，将所述膜部(21)注塑成平面结构，在注塑振膜层(3)时，在所述振膜层(3)上形成折环(31)，与所述折环(31)位置相对应的膜部(21)形成与所述折环(31)的结构相匹配的弧面部(201)。
PCT/CN2016/111115 2016-07-19 2016-12-20 扬声器振膜及其成型方法 Ceased WO2018014500A1 (zh)

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