WO2018010229A1 - 有机薄膜晶体管制备方法及设备 - Google Patents

有机薄膜晶体管制备方法及设备 Download PDF

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Publication number
WO2018010229A1
WO2018010229A1 PCT/CN2016/093077 CN2016093077W WO2018010229A1 WO 2018010229 A1 WO2018010229 A1 WO 2018010229A1 CN 2016093077 W CN2016093077 W CN 2016093077W WO 2018010229 A1 WO2018010229 A1 WO 2018010229A1
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Prior art keywords
photosensitive
charge
film transistor
thin film
roller
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English (en)
French (fr)
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刘哲
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/126,488 priority Critical patent/US9899615B1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F31/00—Inking arrangements or devices
    • B41F31/28—Spray apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
    • H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/484—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
    • H10K10/486—Insulated gate field-effect transistors [IGFETs] characterised by the channel regions the channel region comprising two or more active layers, e.g. forming pn heterojunctions

Definitions

  • the present invention relates to the field of display panel manufacturing technology, and in particular, to a method and a device for preparing an organic thin film transistor.
  • Solution thin film transistors have gained wide attention due to their low cost, low temperature preparation, easy flexibility and large area integration. They have been obtained in the fields of sensing unit, radio frequency identification label, electronic paper display back sheet, medical and health care, etc. The actual application. With the increasing demand for low cost and portability of electronic products, the development of solution-based thin film transistors is bound to be more promoted and valued.
  • the organic thin film transistor (OTFT)-based flexible display driver substrate is still in the development stage, and the patterning of the organic conductive channel layer (organic semiconductor layer, ie, OSC) in the OTFT generally uses an "exposure-development-etch” process. Or use a direct “mask-vapor deposition” process, but both methods typically require high-specification vacuum evaporation, exposure equipment, or fine metal evaporation templates. This requires a variety of equipment, which consumes a lot of energy and increases manufacturing costs.
  • the invention provides a method and a device for preparing an organic thin film transistor, which can efficiently prepare a pattern of an organic layer of a thin film transistor, and saves equipment cost and reduces cost compared with a conventional patterning method.
  • the invention provides an organic thin film transistor manufacturing device, comprising a photosensitive roller, an exposure component, a developing component and a driven roller,
  • the photosensitive roller includes a photosensitive outer surface with a first electric charge and a photosensitive inner surface with a second electric charge, and the first electric charge is opposite in polarity to the second electric charge.
  • the exposure assembly irradiates laser light with graphic information on the photosensitive outer surface and forms an uncharged pattern region on the photosensitive outer surface.
  • the developing assembly includes an output organic material solution pump and a nozzle having an electrode pair, the organic material solution ejected from the nozzle has a third electric charge with a first electric charge and the same polarity, and the ejected organic material is adsorbed to the pattern region,
  • the outer peripheral surface of the driven roller is tangent to the photosensitive outer surface of the photosensitive roller and turned opposite.
  • the manufacturing device further includes a power supply component, and the power supply component includes a charging electrode and a power supply source for supplying current to the charging electrode.
  • the exposure assembly comprises a laser tube, a mirror group, a laser modulator and a collimating lens, the mirror group adjusting a laser propagation path emitted by the laser tube to enter the laser modulator and driving the pulse through the laser modulator
  • a laser light with graphic information is modulated and incident on the photosensitive outer surface via a collimating lens to form the pattern region.
  • the developing assembly further comprises an organic material solution reservoir connected to the pump, and the organic material solution is pumped into the nozzle for charging and atomization and then ejected.
  • the surface of the driven roller is provided with a fourth electric charge opposite to the polarity of the third electric charge for loading the thin film transistor flexible substrate wound around the outer peripheral surface of the driven roller.
  • the invention provides a method for preparing an organic thin film transistor, and the preparation method comprises
  • Step 1 forming a source and a drain on the substrate
  • Step two irradiating the photosensitive roller with the first charge of the photosensitive outer surface through the laser of the exposure component to pattern the photosensitive outer surface, and forming an uncharged channel pattern region on the photosensitive outer surface;
  • Step 3 the developing unit applies a solution of the atomized organic material having the third charge having the same polarity as the first charge to the channel pattern region of the photosensitive outer surface of the photosensitive roller, so that the organic material solution is adsorbed on the a channel pattern region and forming a channel region layer;
  • Step four attaching a fourth charge having a polarity opposite to the third charge on a surface layer of the substrate provided with a source and a drain;
  • Step 5 transferring a channel pattern in the channel region layer on the photosensitive outer surface of the photosensitive roller to the substrate and connecting the source and the drain to form a channel region.
  • the laser irradiation by the exposure component is used to pattern the photosensitive outer surface of the photosensitive roller with a first charge, so that an area of the channel pattern on the photosensitive outer surface that is not charged is included:
  • An electrical component charges the photosensitive outer surface of the photosensitive roller such that a uniform first charge is attached to the photosensitive outer surface.
  • the laser irradiation by the exposure assembly is used to pattern the photosensitive outer surface of the photosensitive roller with a first charge, so that an uncharged channel pattern region is formed on the photosensitive outer surface including: The laser irradiates the photosensitive outer surface with the first electric charge, and the irradiated portion of the second electric charge inside the photosensitive roller is turned on to cause the electric charge of the irradiated portion to disappear, thereby forming an uncharged channel pattern region.
  • the channel pattern region of the photosensitive outer surface of the photosensitive roller is sprayed with a sprayed organic material solution having the same third charge polarity as the first charge by the developing assembly, so that the organic material solution is adsorbed on the
  • the channel pattern region and forming the channel region layer include: atomizing the organic material solution by a pump and a nozzle, and applying a third charge to the channel pattern region.
  • transferring a channel region layer on the photosensitive outer surface of the photosensitive roller to the substrate and connecting the source and the drain to form a channel region comprises: clamping the substrate to the photosensitive The roller and the driven roller are carried by the driven roller to rotate the photosensitive roller and the driven roller, and the organic material solution on the channel region layer of the photosensitive outer surface is printed on the substrate.
  • the method further comprises the step of forming other organic material layers on the organic thin film transistor on the substrate through steps 2 to 5.
  • the method for preparing an organic thin film transistor according to the present invention adopts a technique similar to "electrophotographic", and the method for defining an organic layer pattern based on a solution method is to rapidly "project" a digitized pattern onto a surface of a uniformly charged photosensitive roller by using a laser beam. At the position hit by the laser beam, a pattern region where the charge digestion phenomenon is formed is formed. Small droplets of the misty charged organic material solution are adsorbed in the pattern region area and transferred onto the substrate to form a patterned channel region.
  • This approach can define a finer organic channel region while avoiding mutual contamination between the organic solution of the organic material and the organic photoresist in the "exposure-develop-etch” process.
  • the ultimate goal is to effectively reduce the complexity of using the vacuum process to prepare the same functional layer tiles, while reducing the material cost of each layer of the organic thin film transistor substrate.
  • FIG. 1 is a schematic view of a photosensitive roller and a power supply assembly of an organic thin film transistor fabrication apparatus in a preferred embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a photosensitive roller of the organic thin film transistor fabrication apparatus of FIG. 1.
  • FIG. 3 is a schematic view of a photosensitive roller and an exposure assembly of the organic thin film transistor fabrication apparatus of FIG. 1.
  • FIG. 4 is a schematic view of a photosensitive roller and a developing assembly of the organic thin film transistor manufacturing apparatus of FIG. 1.
  • FIG. 5 is a schematic view of a photosensitive roller and a driven roller of the organic thin film transistor manufacturing apparatus of FIG. 1.
  • FIG. 5 is a schematic view of a photosensitive roller and a driven roller of the organic thin film transistor manufacturing apparatus of FIG. 1.
  • FIG. 6 is a schematic view of a photosensitive roller of the organic thin film transistor fabrication apparatus of FIG. 1 and a power supply assembly having an exposure light source.
  • FIG. 7 is a flow chart of a method of fabricating an organic thin film transistor in accordance with a preferred embodiment of the present invention.
  • Figure 8 is a partial cross-sectional view showing a thin film transistor formed by the method of Figure 7.
  • a preferred embodiment of the present invention provides an organic thin film transistor fabrication apparatus for preparing an organic layer of an organic thin film transistor, such as a channel layer, an organic gate dielectric layer, or an organic layer, using a process different from that commonly used for "exposure-development-etching". Passivation layer.
  • the thin film transistor fabrication apparatus forms a channel layer as an example for description.
  • the apparatus includes a photosensitive roller 10, an exposure assembly 20, a developing assembly 30, and a driven roller 40.
  • the photosensitive roller 10 includes a photosensitive outer surface 11 having a first electric charge and a photosensitive inner surface 12 having a second electric charge, and the first electric charge is opposite in polarity to the second electric charge.
  • the photosensitive roller 10 is a cylinder, which includes a conductive inner shaft 101, an insulating layer 102 surrounding the outer layer of the conductive inner shaft 101, and an outer layer surrounding the insulating layer 102 from the axial center to the outer surface.
  • the photosensitive layer 103 of the surface is a cylinder, which includes a conductive inner shaft 101, an insulating layer 102 surrounding the outer layer of the conductive inner shaft 101, and an outer layer surrounding the insulating layer 102 from the axial center to the outer surface.
  • the photosensitive outer surface 11 is a portion of the outer surface of the photosensitive layer 103, and the first charge is uniformly attached to On the photosensitive outer surface 11.
  • the photosensitive inner surface 12 is provided on a surface of the conductive inner shaft 101 and insulated from the photosensitive layer 103 by an insulating layer 102.
  • the first charge is a negative charge and the second charge is a positive charge.
  • the manufacturing apparatus further includes a power supply component (not shown), and the power supply component includes a charging electrode 151 and a power supply 152 that supplies current to the charging electrode 151.
  • the charging electrode 151 is located at a side of the photosensitive roller 10 for attaching a first electric charge to the photosensitive outer surface.
  • the charging electrode 151 generates a corona discharge under the action of the DC high-voltage power supply 152, and the non-conductive air around the charging electrode 151 is ionized, so that the photosensitive roller 10 uniformly carries the first electric charge during the rotation.
  • the exposure assembly 20 irradiates laser light with graphic information on the photosensitive outer surface 11 and forms an uncharged pattern region 13 on the photosensitive outer surface 11.
  • the exposure assembly 20 includes a laser tube 21, a mirror group 22, a laser modulator 23, a laser modulator driving pulse 24, and a collimating lens 25.
  • the mirror group 22 adjusts the laser beam emitted from the laser tube 21.
  • the optical path enters the laser modulator 23 and is modulated by the laser modulator drive pulse 24 into laser light with graphic information, which is then incident on the photosensitive outer surface 11 via the collimating lens 25 to form the pattern region 13 .
  • the mirror group 22 includes two mirrors, one mirror facing the laser tube 21 for reflecting the laser light of the laser tube 21 to the other mirror, and the other mirror facing the laser modulator 23, The received laser light is reflected to the laser modulator 23.
  • the laser modulator 23 is driven by the laser modulator driving pulse 24, extracts graphic information in the electrical signal and modulates the laser light with the printed graphic information and passes through the collimating lens 25 to be incident on the photosensitive outer surface 11, and further A desired pattern area 13 is formed on the photosensitive outer surface 11.
  • the developing assembly 30 includes a pump 31 for outputting an organic material solution and a high pressure nozzle 33 having an electrode pair 331.
  • the organic material solution ejected by the high pressure nozzle 33 carries a third charge and a third polarity of the same polarity.
  • the charge and the ejected organic material are adsorbed to the pattern region 13.
  • the developing assembly 30 further includes an organic material solution 60 reservoir 32 connected to the pump 31 and a valve 34 connected between the reservoir 32 and the pump 31, the pump 31 being provided opposite to the nozzle Nozzle 311. It should be noted that the organic material solution 60 is a mixed liquid, and the polymer or small molecule OSC material is uniformly dispersed in the organic solvent.
  • the organic material solution enters the high pressure nozzle 33 through the nozzle 31 through the pump 31, and the organic material solution 60 is charged with a third charge (negative charge in this embodiment) via the electrode pair 331, and is ejected by the high pressure nozzle 33.
  • the organic material solution is atomized to form a plurality of small droplets, and then ejected on the pattern region 13 to form an organic pattern region 16, such as a channel region. area.
  • the outer peripheral surface of the driven roller 40 is tangent to the photosensitive outer surface 11 of the photosensitive roller 40 and turned opposite.
  • the surface of the driven roller 40 has a fourth electric charge opposite to the polarity of the third electric charge for loading a thin film transistor flexible substrate wound around the outer peripheral surface of the driven roller.
  • the organic pattern region 16 is formed on the pattern region 13 and transferred onto the substrate 50 to form a channel region 55.
  • the power supply assembly 15 further includes an exposure light source 154. After the photosensitive roller 10 is finished, the photosensitive outer surface 11 of the photosensitive roller 10 is irradiated by the exposure light source 154 to remove the residual first electric charge.
  • the present invention further provides a method for preparing an organic thin film transistor, the preparation method comprising:
  • step one referring to FIG. 8, a source 52 and a drain 53 are formed on the substrate 50.
  • This step further includes coating and curing on the glass substrate 51 to form the substrate 50, which is a flexible substrate.
  • Step 2 the photosensitive outer surface 11 with the first charge of the photosensitive roller 10 is patterned by laser irradiation of the exposure assembly 20, so that the channel pattern region 16 having no charge is formed on the photosensitive outer surface 11. .
  • the unirradiated portion still carries the first charge.
  • This step can be repeated to effect patterning of different regions on the same layer, or to form a plurality of channel region patterns of a plurality of transistors.
  • the second step further comprises: charging the photosensitive outer surface of the photosensitive roller 10 by the power supply assembly 15 to attach a uniform first electric charge to the photosensitive outer surface.
  • the first electric charge is a negative electric charge
  • the second electric charge inside the photosensitive roller 10 is a positive electric charge
  • the photosensitive outer surface with the first electric charge is irradiated by the laser with graphic information, and the first portion of the irradiated portion is irradiated
  • the electric charge is electrically connected to the second electric charge inside the photosensitive roller to cause the electric charge of the irradiated portion to disappear, and constitutes a pattern region having no electric charge, which is the channel pattern region 16 in this embodiment.
  • Step 3 (S3) the channel pattern region 16 of the photosensitive outer surface of the photosensitive roller 10 is sprayed with the atomized organic material solution having the same third charge polarity as the first charge by the developing unit 30, so that The organic material solution is adsorbed to the channel pattern region 16 and constitutes a channel region layer.
  • the thickness of the channel region layer 17 is in nanometer units.
  • the organic material solution enters the high pressure nozzle 33 through the nozzle 31 through the pump 31, and the organic material solution is charged with a third charge (negative charge in this embodiment) through the electrode pair 331, and is sprayed at a high pressure by the high pressure nozzle 33.
  • the organic material solution is atomized to form a plurality of small droplets and ejected, due to the principle of homosexual repelling, the organic material solution with the third charge and the photosensitive outer surface The first charge on 11 is repelled, so that small droplets of the organic material solution adhere only to the uncharged channel pattern region 16 to form a channel region layer having an organic material.
  • step four a fourth charge having a polarity opposite to the third charge is attached to the surface of the substrate 50 where the source and the drain are provided.
  • a fourth charge can be applied to the driven roller by the power supply assembly, and then the substrate 50 is wound onto the driven roller 40.
  • step five the channel region layer on the photosensitive outer surface of the photosensitive roller 10 is transferred onto the substrate 50 and the source and drain electrodes are connected to form a channel region 55.
  • the method mainly includes: clamping a substrate between the photosensitive roller and the driven roller through a driven roller, rotating the photosensitive roller and the driven roller, and the photosensitive outer surface of the channel region layer An organic material solution is printed on the substrate. It can be understood that in the transfer process, it can be transferred to the substrate at one time, or can be sequentially transferred onto the substrate according to different patterns or adjacent pattern regions, so that the photosensitive roller can be flexibly used to perform multiple patterns. Printing, provided that the corresponding pattern has been produced during development and exposure.
  • the method further includes the step of eliminating residual charge of the surface pair of the photosensitive roller by exposure.
  • the exposure light source 154 of the power supply unit 15 irradiates the photosensitive outer surface 11 of the photosensitive roller 10 after the photosensitive roller 10 is operated to remove the residual first electric charge.
  • the method also includes the step of forming other layers of organic material on the organic thin film transistor on the substrate by steps one through five.
  • the organic gate dielectric layer 56 or the organic passivation layer 57 on the channel region 55 on the substrate in FIG. The specific steps are repeated steps 2 to 5 and will not be repeated.
  • a metal layer 58 is disposed between the organic gate dielectric layer 56 and the channel region 55.
  • the organic passivation layer 57 is covered with an electrode layer 59.
  • the method for preparing an organic thin film transistor according to the present invention adopts a technique similar to "electrophotographic", and the method for defining an organic layer pattern based on a solution method is to rapidly "project" a digitized pattern onto a surface of a uniformly charged photosensitive roller by using a laser beam. At the position hit by the laser beam, a pattern region where the charge digestion phenomenon is formed is formed. Small droplets of the misty charged organic material solution are adsorbed in the pattern area and transferred onto the substrate to form a patterned channel region.
  • This approach can define a finer organic channel region while avoiding mutual contamination between the organic solution of the organic material and the organic photoresist in the "exposure-develop-etch” process.
  • the ultimate goal is to effectively reduce the complexity of using the vacuum process to prepare the same functional layer tiles, while reducing the material cost of each layer of the organic thin film transistor substrate.

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Abstract

一种有机薄膜晶体管制备方法，包括在基板（50）上形成源极（52）及漏极（53）；通过曝光组件（20）的激光照射感光辊轮（10）带有第一电荷的感光外表面（11），以图案化感光外表面（11），在感光外表面（11）上形成未带有电荷的沟道图案区域（16）；显影组件（30）对该感光辊轮（10）的感光外表面（11）的沟道图案区域（16）喷涂带有与第一电荷极性相同的第三电荷的雾化的有机材料溶液（60），使有机材料溶液（60）吸附于该沟道图案区域（16）并构成沟道区域层（17）；在该基板（50）设有源极（52）和漏极（53）的表层附上与该第三电荷极性相反的第四电荷；将该感光辊轮（10）的感光外表面（11）上的沟道区域层（17）内的沟道图案转印到该基板（50）上并连接该源极（52）与漏极（53），以构成沟道区域（55）。以及一种有机薄膜晶体管制备设备。

Description

有机薄膜晶体管制备方法及设备
本发明要求2016年7月12日递交的发明名称为“有机薄膜晶体管制备方法及设备”的申请号201610548174.0的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及显示面板制造技术领域，特别涉及一种有机薄膜晶体管制备方法及设备。
背景技术
溶液法薄膜晶体管由于具有低成本、可低温制备、易于柔性和大面积集成等优点取得了广泛的关注，其在传感单元、射频标志识别标签、电子纸显示背板、医疗卫生等领域已经取得了实际应用。随着人们对于电子产品低成本和便携性不断增长的要求，溶液法薄膜晶体管的发展势必会得到更大的推动和重视。
基于有机薄膜晶体管(OTFT)的柔性显示驱动基板目前仍处于开发阶段，OTFT中的有机导电沟道层(有机半导体层，即OSC)的图案化通常使用“曝光-显影-刻蚀”的工艺，或者使用直接的“掩膜-蒸镀”的工艺，但这两种方法通常都需要用到高规格的真空蒸镀、曝光设备或者精细的金属蒸镀模板。如此需要多种设备，耗能较大，增加制造成本。
发明内容
本发明提供一种有机薄膜晶体管制备方法及设备，可以高效的制备出薄膜晶体管有机物层图案，相比于传统的图案化方法，更加节省设备费用降低成本。
本发明提供的有机薄膜晶体管制作设备，包括感光辊轮、曝光组件、显影组件及从动辊轮，
所述感光辊轮包括带有第一电荷的感光外表面及带有第二电荷的感光内表面，且第一电荷与第二电荷极性相反，
所述曝光组件将带有图形信息的激光照射于所述感光外表面上并在所述感光外表面上形成无电荷的图案区域，
所述显影组件包括输出有机材料溶液泵及具有电极对的喷嘴，喷嘴喷出的有机材料溶液带有与第一电荷和相同极性的第三电荷，并且喷出的有机材料吸附于所述图案区域，
所述从动辊轮外周表面与所述感光辊轮感光外表面相切且转向相反。
其中，所述制作设备还包括供电组件，所述供电组件包括充电电极及为充电电极提供电流的供电电源。
其中，所述曝光组件包括激光管、反光镜组、激光调制器及准直透镜，所述反光镜组调节激光管射出的激光传播路径使之进入所述激光调制器并通过激光调制器驱动脉冲调制成带有图形信息的激光，再经准直透镜射入到所述感光外表面上以形成所述图案区域。
其中，所述显影组件还包括与所述泵连接的有机材料溶液储蓄池，所述有机材料溶液经过泵进入喷嘴进行加电荷及雾化后喷出。
其中，所述从动辊轮表面设有与所述第三电荷极性相反的第四电荷，用于负荷给绕于从动辊轮外周表面的薄膜晶体管柔性基板。
本发明提供一种有机薄膜晶体管制备方法，所述制备方法包括
步骤一，在基板上形成源极及漏极；
步骤二，通过曝光组件的激光照射所述感光辊轮带有第一电荷的感光外表面，以图案化感光外表面，在感光外表面上形成未带有电荷的沟道图案区域；
步骤三，显影组件对所述感光辊轮的感光外表面的沟道图案区域喷涂带有与第一电荷极性相同的第三电荷的雾化的有机材料溶液，使有机材料溶液吸附于所述沟道图案区域并构成沟道区域层；
步骤四，在所述基板设有源极和漏极的表层附上与所述第三电荷极性相反的第四电荷；
步骤五，将所述感光辊轮的感光外表面上的沟道区域层内的沟道图案转印到所述基板上并连接所述源极与漏极，以构成沟道区域。
其中，所述通过曝光组件的激光照射以图案化所述感光辊轮带有第一电荷的感光外表面，使感光外表面上形成未带有电荷的沟道图案区域包括：通过供 电组件对所述感光辊轮的感光外表面进行充电，以使所述感光外表面上附有均匀的第一电荷。
其中，所述通过曝光组件的激光照射以图案化所述感光辊轮带有第一电荷的感光外表面，使感光外表面上形成未带有电荷的沟道图案区域包括：通过带有图形信息的激光照射带有第一电荷的感光外表面，被照射的部分于所述感光辊轮内部的第二电荷导通以使被照射的部分的电荷消失，构成未带有电荷的沟道图案区域。
其中，通过显影组件对所述感光辊轮的感光外表面的沟道图案区域喷涂带有与第一电荷极性相同的第三电荷的雾化的有机材料溶液，使有机材料溶液吸附于所述沟道图案区域并构成沟道区域层包括：通过泵和喷嘴将有机材料溶液雾化后带上第三电荷后喷涂到所述沟道图案区域上。
其中，将所述感光辊轮的感光外表面上的沟道区域层转印到所述基板上并连接所述源极与漏极，以构成沟道区域包括：将基板夹持于所述感光辊轮与所述从动辊轮之间通过从动滚轮承载，转动感光辊轮与从动辊轮，所述感光外表面的沟道区域层上的有机材料溶液印到所述基板上。
其中，所述方法还包括通过步骤二至五在所述基板上形成有机薄膜晶体管上的其它有机材料层的步骤。
本发明所述的有机薄膜晶体管制备方法采用类似“静电照相”的技术，基于溶液法定义有机层图案方法，是利用激光束将数字化图形快速“投影”到一个均匀带电的感光辊轮的表面。被激光束命中的位置会发生电荷消解现象形成需要的图案区域。雾状的带电有机材料溶液的小液滴吸附在图案区域区域，并转印到基板上形成图案化的沟道区域。这种方式可以定义更精细的有机沟道区域，同时，避免了“曝光-显影-刻蚀”制程中有机材料的有机溶液和有机光阻之间的相互污染。最终目的是有效减少使用真空程制备相同功能层图块的复杂度，同时可以减少有机薄膜晶体管基板各层的材料成本。
附图说明
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施 方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本发明较佳实施方式中的有机薄膜晶体管制作设备的感光辊轮及供电组件示意图。
图2是图1所述的有机薄膜晶体管制作设备的感光辊轮横截面示意图。
图3是图1所述的有机薄膜晶体管制作设备的感光辊轮与曝光组件示意图。
图4是图1所述的有机薄膜晶体管制作设备的感光辊轮与显影组件示意图。
图5是图1所述的有机薄膜晶体管制作设备的感光辊轮与从动辊轮示意图。
图6是图1所述的有机薄膜晶体管制作设备的感光辊轮与具有曝光光源的供电组件示意图。
图7是本发明较佳实施方式的有机薄膜晶体管制作方法的流程图。
图8是图7方法形成的薄膜晶体管的部分截面示意图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
本发明较佳实施例提供一种有机薄膜晶体管制作设备，用不同于通常使用“曝光-显影-刻蚀”的工艺制备有机薄膜晶体管的有机层，如沟道层、有机栅极电介质层或者有机钝化层。本实施例中，所述机薄膜晶体管制作设备形成沟道层为例进行说明。
请参阅图1至图5，所述设备包括感光辊轮10、曝光组件20、显影组件30及从动辊轮40。所述感光辊轮10包括带有第一电荷的感光外表面11及带有第二电荷的感光内表面12，且第一电荷与第二电荷极性相反。如图1与图2，所述感光辊轮10为圆柱体，其由轴心到外表面依次包括导电内轴101、围绕导电内轴101外层的绝缘层102及围绕所述绝缘层102外表面的感光层103。所述感光外表面11为所述感光层103的部分外表面，所述第一电荷均匀附于 所述感光外表面11上。所述感光内表面12设于所述导电内轴101的表面上并通过绝缘层102与所述感光层103绝缘。本实施例中，第一电荷为负电荷，第二电荷为正电荷。所述制作设备还包括供电组件(图未标)，所述供电组件包括充电电极151及为充电电极151提供电流的供电电源152。所述充电电极151位于所述感光辊轮10的侧部，用于给感光外表面附上第一电荷。充电电极151在直流高压的供电电源152的作用下，产生电晕放电，充电电极151周围不导电的空气被电离，使得感光辊轮10在转动的过程中均匀带上第一电荷。
请参阅图3，所述曝光组件20将带有图形信息的激光照射于所述感光外表面11上并在所述感光外表面11上形成无电荷的图案区域13。本实施例中，所述曝光组件20包括激光管21、反光镜组22、激光调制器23、激光调制器驱动脉冲24及准直透镜25，所述反光镜组22调节激光管21射出的激光光路使之进入所述激光调制器23并通过激光调制器驱动脉冲24调制成带有图形信息的激光，再经准直透镜25射入到所述感光外表面11上以形成所述图案区域13。具体的，反光镜组22包括两个反光镜，一个反光镜朝向所述激光管21，用于将激光管21的激光反射至另一个反光镜，另一个反光镜朝向所述激光调制器23，并将接收到的激光反射至激光调制器23。所述激光调制器23由激光调制器驱动脉冲24驱动，提取电信号中的图形信息并调制形成带有打印图形信息的激光并经过准直透镜25后射入所述感光外表面11上，进而在感光外表面11上形成需要的图案区域13。
请参阅图4，所述显影组件30包括输出有机材料溶液的泵31及具有电极对331的高压喷嘴33，高压喷嘴33喷出的有机材料溶液带有与第一电荷和相同极性的第三电荷，并且喷出的有机材料吸附于所述图案区域13。所述显影组件30还包括与所述泵31连接的有机材料溶液60储蓄池32以及连接于所述储蓄池32与泵31之间的阀门34，所述泵31设有与所述喷嘴相对的喷头311。需要说明的是，所述有机材料溶液60为混合液，为高分子或者小分子的OSC材料均匀分散于有机溶剂中。开启阀门后所述有机材料溶液经过泵31由喷头311进入高压喷嘴33，有机材料溶液60经电极对331后带上第三电荷(本实施例中是负电荷)，在由高压喷嘴33喷出时高压雾化，使有机材料溶液被雾化形成数个小液滴后喷出在所述图案区域13上形成有机图案区域16，如沟道区 域。
请参阅图5，所述从动辊轮40外周表面与所述感光辊轮40感光外表面11相切且转向相反。所述从动辊轮40表面带有与所述第三电荷极性相反的第四电荷，用于负荷给绕于从动辊轮外周表面的薄膜晶体管柔性基板。本实施例中在所述图案区域13上形成有机图案区域16转印到基板50上形成沟道区域55。
请参阅图6，所述供电组件15还包括曝光光源154。在所述感光辊轮10工作完后，通过曝光光源154照射感光辊轮10的感光外表面11，清除残留的第一电荷。
请参阅图7，本发明还提供一种有机薄膜晶体管制备方法，所述制备方法包括：
步骤一(S1)，参照图8，在基板50上形成源52及漏极53。此步骤还包括在玻璃基板51上涂布并固化形成所述的基板50，基板50为柔性基板。
步骤二(S2)，通过曝光组件20的激光照射以图案化所述感光辊轮10带有第一电荷的感光外表面11，使感光外表面11上形成未带有电荷的沟道图案区域16。未被照射的部分仍带有第一电荷。该步骤可以重复动作以实现在同一层上加工出不同区域的图案，或者形成多个晶体管的多个沟道区域图案。进一步地，所述步骤二还包括：通过供电组件15对所述感光辊轮10的感光外表面进行充电，以使所述感光外表面上附有均匀的第一电荷。本实施例中，第一电荷为负电荷，感光辊轮10内部的第二电荷为正电荷；通过带有图形信息的激光照射带有第一电荷的感光外表面，被照射的部分的第一电荷与所述感光辊轮内部的第二电荷导通以使被照射的部分的电荷消失，构成未带有电荷的图案区域，本实施例中为沟道图案区域16。
步骤三(S3)，通过显影组件30对所述感光辊轮10的感光外表面的沟道图案区域16喷涂带有与第一电荷极性相同的第三电荷的雾化的有机材料溶液，使有机材料溶液吸附于所述沟道图案区域16并构成沟道区域层。其中沟道区域层17的厚度为纳米单位。所述有机材料溶液经过泵31由喷头311进入高压喷嘴33，有机材料溶液经电极对331后带上第三电荷(本实施例中是负电荷)，在由高压喷嘴33喷出时高压雾化，使有机材料溶液被雾化形成数个小液滴后喷出，由于同性相斥原则，带有第三电荷的有机材料溶液与感光外表面 11上的第一电荷相斥，因此有机材料溶液的小液滴只粘附于未带电荷的沟道图案区域16进而形成具有有机材料的构成沟道区域层。
步骤四(S4)，在所述基板50设有源极和漏极的表层附上与所述第三电荷极性相反的第四电荷。可以通过供电组件对从动滚轮施加第四电荷，然后将基板50缠绕与所述从动辊轮40上。
步骤五(S5)，将所述感光辊轮10的感光外表面上的沟道区域层转印到所述基板50上并连接所述源极与漏极，以构成沟道区域55。主要包括，将基板夹持于所述感光辊轮与所述从动辊轮之间通过从动滚轮承载，转动感光辊轮与从动辊轮，所述感光外表面的沟道区域层上的有机材料溶液印到所述基板上。可以理解，在转印过程中，可以一次性转印到基板上，也可以根据图案的不同或者相邻图案区域，依次转印到基板上，这样可以灵活运用感光辊轮进行对多种图案转印，前提是在显影及曝光时已经制作好相应的图案。
进一步的，所述方法还包括通过曝光消除所述感光辊轮表面对的残余电荷的步骤。所述供电组件15的曝光光源154在所述感光辊轮10工作完后照射感光辊轮10的感光外表面11，清除残留的第一电荷。当再次重复步骤一至步骤五时，就进入了下一个定义及形成有机材料图层的周期。
所述方法还包括通过步骤一至五在所述基板上形成有机薄膜晶体管上的其它有机材料层的步骤。比如附图8中的基板上的沟道区域55上的有机栅极介电层56或者有机钝化层57。具体步骤为重复步骤二至五再次不做赘述。其中，有机栅极介电层56与沟道区域55之间设置有金属层58。所述有机钝化层57上覆盖有电极层59。
本发明所述的有机薄膜晶体管制备方法采用类似“静电照相”的技术，基于溶液法定义有机层图案方法，是利用激光束将数字化图形快速“投影”到一个均匀带电的感光辊轮的表面。被激光束命中的位置会发生电荷消解现象形成需要的图案区域。雾状的带电有机材料溶液的小液滴吸附在图案区域，并转印到基板上形成图案化的沟道区域。这种方式可以定义更精细的有机沟道区域，同时，避免了“曝光-显影-刻蚀”制程中有机材料的有机溶液和有机光阻之间的相互污染。最终目的是有效减少使用真空制程制备相同功能层图块的复杂度，同时可以减少有机薄膜晶体管基板各层的材料成本。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (12)

  1. 一种有机薄膜晶体管制作设备，其中，所述设备包括感光辊轮、曝光组件、显影组件及从动辊轮，
    所述感光辊轮包括带有第一电荷的感光外表面及带有第二电荷的感光内表面，且第一电荷与第二电荷极性相反，
    所述曝光组件将带有图形信息的激光照射于所述感光外表面上并在所述感光外表面上形成无电荷的图案区域，
    所述显影组件包括输出有机材料溶液泵及具有电极对的高压喷嘴，高压喷嘴喷出的有机材料溶液带有与第一电荷相同极性的第三电荷，并且喷出的有机材料吸附于所述图案区域，
    所述从动辊轮外周表面与所述感光辊轮感光外表面相切且转向相反。
  2. 如权利要求1所述的有机薄膜晶体管制作设备，其中，所述制作设备还包括供电组件，所述供电组件包括充电电极及为充电电极提供电流的供电电源。
  3. 如权利要求2所述的有机薄膜晶体管制作设备，其中，所述曝光组件包括激光管、反光镜组、激光调制器及准直透镜，所述反光镜组调节激光管射出的激光光路，使之进入所述激光调制器并通过激光调制器驱动脉冲调制成带有图形信息的激光，再经准直透镜射入到所述感光外表面上以形成所述图案区域。
  4. 如权利要求2所述的有机薄膜晶体管制作设备，其中，所述显影组件还包括与所述泵连接的有机材料溶液储蓄池，所述有机材料溶液经过泵进入喷嘴进行加电荷及雾化后喷出。
  5. 如权利要求2所述的有机薄膜晶体管制作设备，其中，所述从动辊轮表面设有与所述第三电荷极性相反的第四电荷，用于负荷给绕于从动辊轮外周表面的薄膜晶体管柔性基板。
  6. 一种有机薄膜晶体管制备方法，其中，所述制备方法包括：
    步骤一，在基板上形成源极及漏极；
    步骤二，通过曝光组件的激光照射所述感光辊轮带有第一电荷的感光外表 面，以图案化感光外表面，在感光外表面上形成未带有电荷的沟道图案区域；
    步骤三，显影组件对所述感光辊轮的感光外表面的沟道图案区域喷涂带有与第一电荷极性相同的第三电荷的雾化的有机材料溶液，使有机材料溶液吸附于所述沟道图案区域并构成沟道区域层；
    步骤四，在所述基板设有源极和漏极的表层附上与所述第三电荷极性相反的第四电荷；
    步骤五，将所述感光辊轮的感光外表面上的沟道区域层内的沟道图案转印到所述基板上并连接所述源极与漏极，以构成沟道区域。
  7. 如权利要求6所述的有机薄膜晶体管制备方法，其中，所述步骤二还包括：通过供电组件对所述感光辊轮的感光外表面进行充电，以使所述感光外表面上附有均匀的第一电荷。
  8. 如权利要求6所述的有机薄膜晶体管制备方法，其中，所述步骤二还包括：通过带有图形信息的激光照射带有第一电荷的感光外表面，被照射的部分的第一电荷与所述感光辊轮内部的第二电荷导通以使被照射的部分的电荷消失，构成未带有电荷的沟道图案区域。
  9. 如权利要求6所述的有机薄膜晶体管制备方法，其中，所述步骤三包括：通过泵和喷嘴将有机材料溶液雾化后带上第三电荷后喷涂到所述沟道图案区域上。
  10. 如权利要求6所述的有机薄膜晶体管制备方法，其中，所述步骤五包括：将基板夹持于所述感光辊轮与所述从动辊轮之间通过从动滚轮承载，转动感光辊轮与从动辊轮，所述感光外表面的沟道区域层上的有机材料溶液印到所述基板上。
  11. 如权利要求6所述的有机薄膜晶体管制备方法，其中，所述方法还包括通过曝光消除所述感光辊轮表面残余电荷的步骤。
  12. 如权利要求6所述的有机薄膜晶体管制备方法，其中，所述方法还包括通过步骤二至五在所述基板上形成有机薄膜晶体管上的其它有机材料层的步骤。
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