WO2018006754A1 - 表面贴石英晶体谐振器生产中非接触式喷胶系统及方法 - Google Patents
表面贴石英晶体谐振器生产中非接触式喷胶系统及方法 Download PDFInfo
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- WO2018006754A1 WO2018006754A1 PCT/CN2017/091024 CN2017091024W WO2018006754A1 WO 2018006754 A1 WO2018006754 A1 WO 2018006754A1 CN 2017091024 W CN2017091024 W CN 2017091024W WO 2018006754 A1 WO2018006754 A1 WO 2018006754A1
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- base
- glue
- spraying
- whole plate
- plate
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 63
- 239000007921 spray Substances 0.000 title claims abstract description 43
- 239000010453 quartz Substances 0.000 title claims abstract description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000013078 crystal Substances 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 21
- 238000005507 spraying Methods 0.000 claims abstract description 115
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims description 167
- 235000012431 wafers Nutrition 0.000 claims description 78
- 238000002347 injection Methods 0.000 claims description 34
- 239000007924 injection Substances 0.000 claims description 34
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 20
- 239000000178 monomer Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
Definitions
- the invention belongs to the field of electronic components, and particularly relates to a non-contact glue spraying system and method for producing a surface-attached quartz crystal resonator.
- Quartz crystal resonator also known as quartz crystal, commonly known as crystal oscillator, is a resonant element made by utilizing the piezoelectric effect of quartz crystal. It can be used together with semiconductor devices and RC components to form a quartz crystal oscillator.
- a quartz wafer hereinafter referred to as a wafer, which may be square, rectangular or circular, etc., is coated with a silver layer as an electrode on its two corresponding faces, and a surface-attached quartz crystal resonator is an electrode on a quartz wafer through a conductive paste.
- the base is electrically connected, the quartz wafer is fixed on the susceptor through the conductive paste, and the secondary electrode on the quartz wafer is also coated by the conductive paste.
- the glue quantity control of the contact type dispensing is determined by the air pressure and time, and a stable air pressure is required for dispensing.
- the whole plate of the pedestal is made of sintered ceramic slab.
- the technical specification of warpage is the maximum value of 0.05mm for a single pedestal forming the whole plate; the maximum value of the whole plate is 0.35mm; The height difference of the glue platform exceeds 0.05 mm.
- the whole board tool for loading a single base the maximum technical specification of warpage is 0.05mm, plus the warpage of a single base, the height difference of each base dispensing platform on the whole board exceeds 0.05mm .
- the non-contact glue spraying system for surface-attached quartz crystal resonators provided by the present invention.
- the method solves the problem that the traditional contact type dispensing is poorly dispensed on the whole plate of the base, and the glue is sprayed through the movement of the base, without adjusting the dispensing height, and ensuring the diameter of the coating glue point on the left and right dispensing platforms of each base. Consistent, qualified conductive adhesive to fix the wafer and the pedestal, the efficiency of the glue is higher than the efficiency of dispensing.
- the present invention provides a non-contact glue dispensing system for surface-attached quartz crystal resonator production, which is special in that it comprises a base plate 1, a wafer 4, and a glue dispensing system, wherein the base plate is completed. 1 and the wafers 4 mounted on the entire substrate 1 are located below the nozzles 7 in the dispensing system.
- the base plate 1 is a ceramic plate, and the ceramic plates are provided with structural units connected in a matrix, each of which is a separate unit base 1-1.
- the base plate 1 is a full-plate tooling, and the whole plate tool is provided with vacancies arranged in a matrix, and a single base 1-1 is placed in each vacancy.
- a vision system I for detecting the position of each of the unit bases and the state of the single base of the base in the entire plate of the base is included, and a vision system II for detecting the positive position of the wafer.
- the invention also provides a non-contact glue spraying method in the production of a surface-attached quartz crystal resonator, which is special in that a plurality of single bases are formed on the whole plate of the base, and the left and right platforms of the single base are attached to The secondary electrode of the wafer on the unitary susceptor is sprayed in a non-contact manner.
- the first specific processing method comprises the following steps:
- upper film the nozzle sucks the wafer, and the wafer position angle is corrected by the rotating motor and the vision system of the nozzle; and is placed in the single base of the base plate which has been sprayed and glued;
- spraying glue spraying the whole plate back to the injection valve to spray the glue, and spraying the conductive glue on the wafer secondary electrode of the single base in step S2 in the whole plate of the base;
- step S4 According to the spraying method of step S1 to step S3, the glue of the remaining unit bases on the whole plate of the base is completed in a preset order.
- the second specific processing method comprises the following steps:
- each of the unit bases on the whole plate of the base is sequentially sprayed according to the step of spraying:
- the whole plate of the base is moved to the injection valve to spray the glue, and the conductive glue is sprayed on the left and right platforms of each unit base in the whole plate of the base;
- the nozzle sucks the wafer in turn, and the wafer position angle is corrected by the rotating motor of the nozzle and the vision system;
- the entire plate has been sprayed into each of the unit bases of the glue;
- the entire plate is returned to the injection valve, and the conductive adhesive is sprayed onto the wafer secondary electrode of each of the unit bases completed in step S2 in the entire plate of the base.
- the third specific processing method comprises the following steps:
- the whole plate of the base is moved to the injection valve to spray the glue.
- the conductive adhesive is sequentially sprayed on the plurality of single bases by spraying.
- the suction nozzle sequentially sucks the wafer, and the wafer position angle is corrected by the rotary motor and the vision system of the suction nozzle, and is sequentially placed on the base plate to be sprayed.
- the whole plate is returned to the injection valve, and the conductive adhesive is sequentially sprayed into the whole plate of the base in step S2.
- the pedestal is on the wafer secondary electrode.
- the fourth specific processing method comprises the following steps:
- step of S1 the entire spraying process is sequentially performed on each of the unit bases on the remaining rows of the base plate.
- the fifth specific processing method comprises the following steps:
- Step S13 Spraying the glue: returning the whole plate of the base to the injection valve, and spraying the conductive glue into the whole plate of the base according to the spraying method.
- Step S12 Finished on the wafer sub-electrode of the same column of monomer pedestals;
- step of S1 the entire dispensing process is sequentially performed on each of the unit bases on the remaining columns of the base plate.
- the present invention is advantageous in comparison with the prior art in that the present invention is applied to the entire board processing of a surface-attached quartz crystal resonator. Because the relative height error of each single base pedestal platform in the whole board is large, the non-contact glue spraying process is used to replace the traditional contact type dispensing process, which solves the problem that the traditional dispensing process aligns the pedestal glue point diameter consistency of the whole board. The problem.
- the entire plate is processed by a glue-on process, eliminating the need for Z-axis motion necessary for traditional needle dispensing processes.
- the glue spraying efficiency is more than 3 times higher than the dispensing efficiency.
- the invention utilizes non-contact glue spraying, and the production process of fixing the quartz crystal resonator of the surface of the wafer and the pedestal is simple, and the cost performance is far superior to the traditional contact type dispensing equipment, mainly embodied in the following points:
- the non-contact glue is used to solve the problem that the traditional contact type glue is poorly dispensed on the whole plate of the base.
- the glue spraying process saves the up and down movement time of the traditional contact type dispensing needle and improves the efficiency of the glue application.
- Figure 1 is a schematic view of a whole plate of the susceptor of the present invention
- Figure 2 is a second schematic view of the susceptor of the present invention.
- Figure 3 is a schematic view of a monomer base of the present invention.
- Figure 4 is a schematic view showing the state of the monomer base of the present invention after being sprayed.
- Figure 5 is a schematic view showing the structure of the glue dispensing system of the present invention.
- Marking instructions 1, base plate, 1-1, single base, 2, left platform, 3, right platform, 4, wafer, 5, secondary electrode, 6, conductive adhesive, 7, nozzle.
- the glue dispensing device of the present invention comprises a base plate 1, a wafer 4, and a glue dispensing system, wherein the base plate 1 and the wafer 4 mounted on the base plate 1 are all located in the nozzle 7 of the glue dispensing system.
- the susceptor whole plate includes two forms: 1. A structural unit that is processed in a matrix arrangement on a ceramic slab, each structure The unit serves as a stand-alone unit base, and the ceramic slab thus formed serves as the susceptor plate of the present invention; 2. The unit base code is placed in a full-plate tool as the susceptor plate of the present invention.
- two sets of vision systems are provided, and the vision system I is used to correct the position of the wafer, the vision system II is used for the identification and correction of the whole plate of the pedestal. It is also possible to identify and correct the whole wafer and the pedestal by setting a set of vision system. In the present invention, two sets of vision systems are used to illustrate the specific glue spraying process. .
- the invention describes the spraying process of the single base connected by the M*N matrix on the whole plate of the base.
- the initial values of M and N are all 1, M and N are non-zero natural numbers, and M is a line.
- the maximum value of M and the number of rows of the matrix, N is the number of columns and the maximum value of N is the number of columns of the matrix, that is, 1 ⁇ M ⁇ the number of rows, 1 ⁇ N ⁇ the number of columns, for each of the pedestal
- the single cell pedestal is expressed by a MN
- a MN is a single pedestal located in the Nth column of the Mth row of the whole substrate of the susceptor.
- the left and right platforms of each of the unit bases in the base plate are sequentially located directly below the nozzles.
- the wafer secondary electrodes above each of the unit bases are located directly below the nozzles.
- the wafer in the present invention is a quartz crystal resonator.
- the glue dispensing system is a commonly used device in the prior art, and the present invention does not describe the structure of the glue dispensing system.
- the wafer sub-electrodes above the current unit base and the left and right stages of the next unit base are sequentially located directly below the nozzle.
- the wafer when the vision system I and the vision system II are in use, the wafer is moved directly below the vision system I for correcting the position of the wafer, and the entire plate is moved directly below the vision system II for the base. Identification, correction and detection of the glued plate.
- Step 1 Place the whole plate of the base that has not been sprayed in the whole plate of the base for waiting for extraction;
- Step 2 The wafer is placed in the wafer cage for extraction
- Step 3 Inject the stirred silver glue into the spray valve to confirm whether the spray valve can normally discharge the glue
- Step 4 adjusting the height of the wafer according to the position of the wafer, and adjusting the spraying time and the spraying position according to the position of the glue point;
- Step 5 picking up the wafer, visual system I recognizes and corrects the angle, and the qualified product is displaced to wait for the position of the whole plate of the base;
- Step 6 Simultaneously with step 5, the base plate is moved to the vision system II to identify the positions of the individual cells in the entire panel.
- the entire plate of the pedestal is sprayed, which specifically includes the following steps:
- step S4 According to the spraying method of step S1 to step S3, the glue of the remaining unit bases on the whole plate of the base is completed in a preset order.
- the preset sequence in the step S4 is that the one-shot completion process of the single base on the whole plate of the base is performed, and the current single base is first sprayed and loaded, and then, During the spraying process, the next unit base is sprayed and the current unit base is sprayed.
- step S1 the unit base a MN is selected as the current injection target, the unit base a MN completes the step S1 to spray the glue, the step S2 is applied to the sheet, and then the unit base a MN is completed in step S3. Spray the glue, the monomer base a M, N+1 to complete the spray;
- step S42 the steps S1 to S3 are repeated in sequence, and the cycle is alternated until the value of N is the number of columns of the matrix.
- step S1 is performed on the unit base a M, N+1 , and the film is removed in step S2.
- the seat a M, N+1 is the last position of the line
- step S3 the single base a M, N+1 is sprayed, and the glue is completed on the single base a M+1, N
- step S3 the monomer base a M+1 of the glue is sprayed , and M has a value of M+1, and the N value is sequentially taken from 1 to the number of columns of the matrix;
- Step S43 When the current N value is a column of the matrix, after the steps S1 to S2 are completed for the current single base, the current M value is automatically incremented by 1, and the N value is sequentially taken from the value of the matrix to the number of columns of the matrix. Steps S41 to S43 are sequentially repeated, and the cycle is alternately performed until the value of M is larger than the number of rows, and the ejection process on the entire substrate is completed.
- the method of spraying in step S1 specifically refers to a point in which the conventional contact type is sprayed by a non-contact method.
- the dispensing needle tube, the dispensing needle head and the laser ranging system used in the traditional contact dispensing process are replaced by a glue dispensing system.
- the composition of the glue dispensing system mainly includes: 1. Using a multilayer stacked piezoelectric ceramic. The micro-actuator acts as a spray valve for the control device; 2. The nozzle base; 3. The striker; 4. The feed overflow washer; 5. The stop screw and the retaining ring.
- the striker can complete a complete cycle with 0.25ms, and then the ultra-micro conductive adhesive is sprayed onto the left and right platforms of each unit base of the whole plate of the base. Because the glue quantity is consistent, the diameter of the glue point is minimally affected by the glue height, so Good consistency; 1000Hz can be injected in 1 second, and has the ability of instantaneous acceleration to achieve ultra-high speed impact, thus ensuring the contour consistency and bonding strength of the glue point; the injection time is much smaller than the whole plate is controlled by the program pulse X, Y exercise time, and no up and down movement Time, so the non-contact dispensing efficiency is much higher than the contact dispensing efficiency.
- the spraying process of this embodiment is similar to that of Embodiment 1, the work to be performed in the preparation stage, and the glue spraying position and the glue spraying process of the spray valve are the same as those of Embodiment 1, and only the spraying sequence is different.
- each of the unit bases on the base plate is first subjected to step S1 to spray the glue, and then each of the unit bases is further subjected to step S2, and finally to each of the unit bases.
- Step S3 is sprayed with glue, specifically:
- each of the unit bases on the whole plate of the base is sequentially sprayed according to the step of spraying:
- the whole plate of the base is moved to the injection valve to spray the glue, and the conductive glue is sprayed on the left and right platforms of each unit base in the whole plate of the base;
- the nozzle sequentially sucks the wafer, and the wafer position angle is corrected by the rotating motor of the nozzle and the vision system; and is placed in each of the unit bases on which the entire plate of the base has been sprayed;
- the entire plate is returned to the injection valve, and the conductive adhesive is sprayed onto the wafer secondary electrode of each of the unit bases completed in step S2 in the entire plate of the base.
- the actions in each step are performed in sequence on the unit base of the base plate in a predetermined order.
- the order of selecting the unit base is the same when the glue is applied, the upper sheet is sprayed, and the glue is sprayed, and the preset sequence is sprayed in step S1.
- the pre-set sequence of the sprayed glue is a one-step completion of the spray-off process on the single base of the base plate, which is represented by a matrix, specifically:
- step S1 the unit base a MN is selected as the current injection target, and the unit base a MN completes the step S1 to spray the glue, then M takes the current value, N automatically adds 1 to the unit base a M , N+1 is performed to spray the glue until N is the number of columns of the matrix, and at this time, the single base of the Mth row is completely sprayed;
- M is M+1
- N is sequentially taken from the value of 1 to the number of columns of the matrix, and the glue is completed for the single base a M+1, N ;
- the order of the patches and the glue applied to the entire plate of the base is the same as the order of spraying the glue, and different sequences may be used. However, it must be regular, and these rules are all program control. This embodiment will not be enumerated one by one, and the exemplary description will be made only by the order provided by this embodiment.
- the spraying process of this embodiment is similar to that of Embodiment 1, the work to be performed in the preparation stage, and the glue spraying position and the glue spraying process of the spray valve are the same as those of Embodiment 1, and only the spraying sequence is different.
- a plurality of unit bases on the whole plate of the base are selected, and the plurality of unit bases may be divided into regions on the whole plate of the base or may be scattered on the whole plate of the base, but For the use of the area to achieve control, it is described in the form of area division.
- the plurality of single bases of the currently selected area on the whole plate of the base are first subjected to the step S1 to spray the glue, and then the plurality of single bases of the currently selected area are further subjected to the step S2, and finally the current selection is performed.
- the plurality of single bases in the area are sprayed with the glue in step S3, specifically:
- the whole plate of the base is moved to the injection valve to spray the glue.
- the conductive adhesive is sequentially sprayed on the plurality of single bases by spraying.
- the suction nozzle sequentially sucks the wafer, and the wafer position angle is corrected by the rotary motor and the vision system of the suction nozzle, and is sequentially placed on the base plate to be sprayed.
- the whole plate is returned to the injection valve, and the conductive adhesive is sequentially sprayed into the whole plate of the base in step S2.
- the pedestal is on the wafer secondary electrode.
- steps S1 to S2 are repeated to complete the entire dispensing process of the currently selected area, and are sequentially alternated until all the single bases on the entire plate of the base complete the glue spraying process.
- the order of selecting the unit bases in the spraying, the topping, and the spraying of the plurality of unit bases of the currently selected area is similar to the order rule in Embodiment 2, in this embodiment.
- the values of M and N are all performed in the currently selected area. For detailed operations, refer to Embodiment 2.
- the spraying process of this embodiment is similar to that of Embodiment 1, the work to be performed in the preparation stage, and the glue spraying position and the glue spraying process of the spray valve are the same as those of Embodiment 1, and only the spraying sequence is different.
- all the single bases of a row on the entire plate of the base are selected, for each of the single bases on the current row, for example, each of the M rows and the Nth columns of the entire plate of the base.
- the monomer base is first subjected to the step S1 to spray the glue, and then the step S2 is performed on each of the unit bases, and finally the step S3 is sprayed on each of the unit bases, specifically:
- each monomer base of the Mth row and the Nth column of the whole plate of the base is sequentially sprayed according to the step of spraying:
- step of S1 the entire dispensing process is sequentially performed on each of the unit bases on the remaining rows of the base plate.
- the order of selecting the unit bases for each of the unit bases of the Mth row and the Nth column is similar to that of the embodiment 2, in this embodiment.
- the details are not described in detail in the examples. For details, see Example 2.
- the last single susceptor in the first embodiment is sprayed with glue.
- the next monomer base is ready to be sprayed.
- Embodiment 2 for the operational rules of the Mth row and the Nth column.
- the spraying process of this embodiment is similar to that of Embodiment 1, the work to be performed in the preparation stage, and the glue spraying position and the glue spraying process of the spray valve are the same as those of Embodiment 1, and only the spraying sequence is different.
- the spraying process for all the unit susceptors of each row in the embodiment is first replaced with the spraying process for all the unit susceptors of each column.
- step S1 Select all the single bases of a column on the whole plate of the base, for each single base on the current column, for example, each single base on the Mth column and the Nth column of the whole plate of the base
- step S2 the glue is sprayed, and then the step S2 is performed on each of the unit bases, and finally, the step S3 is sprayed on each of the unit bases, specifically:
- step of S1 the entire dispensing process is sequentially performed on each of the unit bases on the remaining columns of the base plate.
- the order of selecting the unit bases for each of the unit bases of the Mth row and the Nth column is similar to that of the embodiment 2, in this embodiment.
- the details are not described in detail in the examples. For details, see Example 2.
- the last single pedestal in the first embodiment is sprayed with glue.
- the next monomer base is ready to be sprayed.
- Embodiment 2 for the operation rule of the (N+1)th column of the Mth row.
- the spraying process used in the different spraying sequences in the present invention is similar to that in Embodiment 1, and the spraying sequence is implemented by a program according to an artificial rule, such as a diagonal line, an angle, a center of a circle, etc., in the present invention. It is impossible to exhaustively, and only the entire spraying is explained by the above embodiment.
- the entire spraying process of the present invention can also be applied to multiple unit pedestals into the whole board tooling, and then placed in the pedestal cage to be sprayed, and the entire spraying process
- the process is also the same, except that the form of the entire plate of the susceptor is changed, but the unit pedestals of the pedestal of the pedestal are also arranged in a matrix, and the specific spraying sequence and process are referred to the embodiment of the present invention.
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Abstract
一种表面贴石英晶体谐振器生产中非接触式喷胶系统，包括基座整板（1）、晶片（4）、喷胶系统，其中，基座整板（1）以及贴装在基座整板（1）上的晶片（4）均位于喷胶系统中喷嘴（7）的下方。还提供了一种表面贴石英晶体谐振器生产中非接触式喷胶方法，包括：在基座整板（1）上形成多个单体基座（1-1），对单体基座（1-1）的左平台（2）和右平台（3）以及贴在单体基座（1-1）上的晶片（4）的副电极（5）采用非接触式方式进行喷胶。无需传统针头点胶工艺所必须的Z轴运动。喷胶效率比点胶效率提高3倍以上。
Description
本发明属于电子元器件领域，尤其涉及表面贴石英晶体谐振器生产中非接触式喷胶系统及方法。
石英晶体谐振器又称为石英晶体，俗称晶振，是利用石英晶体的压电效应而制成的谐振元，与半导体器件和阻容元件一起使用,便可构成石英晶体振荡器。
石英晶片，以下简称为晶片，它可以是正方形、矩形或圆形等，在它的两个对应面上涂敷银层作为电极，表面贴石英晶体谐振器是通过导电胶将石英晶片上的电极和基座进行电连接，通过导电胶，石英晶片固定在基座上，并且石英晶片上的副电极也通过导电胶进行涂覆。
但是目前，表面贴装石英晶体谐振器一直采用接触式点胶工艺。具体采用的是：利用气压将点胶针管内的导电胶推出；将单一基座吸在同一高度的平台上进行点胶；点胶设备必须加装校准平台和激光测距装置，保证点胶针管安装位置一致和针头点胶高度一致性。
不论是接触式点胶工艺还是表面贴石英晶体谐振器的整板加工都存在很多不足。
接触式点胶工艺存在的问题：
1、对点胶高度敏感度高，针头距离点胶平台过高，胶点出胶尖，胶点偏小；针头距离点胶平台过低，胶点摊开，胶点偏大；影响产品电参数不良，严重会导致产品失效。
2、接触式点胶的胶量控制由气压和时间决定，点胶时需要稳定的气压。
3、基座腔体边缘与基座点胶平台距离小，如胶点靠近腔体边缘，会碰撞针头。
4、接触式点胶，点胶针管、针头由气缸或电机控制，点胶时间主要为Z方向上下运动时间，针头上下移动导致喷胶效率过低。
表面贴石英晶体谐振器的整板加工存在问题：
1、基座整板是由陶瓷大板烧结而成，翘曲度技术规格为构成整板的单只基座最大值为0.05mm；整板最大值为0.35mm；整板上各基座点胶平台的高度差超过0.05mm。
2、用于装载单个基座的整板工装，翘曲度技术规格最大值为0.05mm，加上单只基座的翘曲度，整板上各基座点胶平台的高度差超过0.05mm。
由以上论述可知，如果用传统接触式点胶工艺点基座整板或装载在工装上的单只基座，无法保证平台上的胶点直径，个别基座甚至无胶点。
发明内容
针对现有技术的不足，本发明提供的表面贴石英晶体谐振器生产中非接触式喷胶系统及
方法，解决了传统接触式点胶在基座整板点胶不良的问题，通过基座的移动进行喷胶，无需调整点胶高度，保证每个基座左右点胶平台上涂布胶点直径一致、外观合格的导电胶，以固定晶片与基座，喷胶效率高于点胶的效率。
为解决上述技术问题，本发明提供表面贴石英晶体谐振器生产中非接触式喷胶系统，其特殊之处在于：包括基座整板1、晶片4、喷胶系统，其中，基座整板1以及贴装在基座整板1上的晶片4均位于喷胶系统中喷嘴7的下方。
进一步地，基座整板1为陶瓷大板，在陶瓷大板上设置有按矩阵排布连接的结构单元，每个结构单元为一个独立的单体基座1-1。
进一步地，基座整板1为整板工装，整板工装上设有按矩阵排布的空位，每个空位内放置有一个单体基座1-1。
进一步地，还包括用于检测基座整板内各个单体基座位置及单体基座喷胶状态的视觉系统I、用于检测晶片正位的视觉系统II。
本发明还提供表面贴石英晶体谐振器生产中非接触式喷胶方法，其特殊之处在于，在基座整板上形成多个单体基座，对单体基座的左右平台以及贴在单体基座上的晶片的副电极采用非接触式方式进行喷胶。
在本发明提供的喷胶方法技术方案基础上，第一种具体加工方法包括有以下步骤：
S1、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中一个单体基座的左右平台上；
S2、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正；放置在基座整板已喷射下胶的单体基座内；
S3、喷上胶：将基座整板返回喷射阀处喷射上胶，导电胶按喷胶方式喷射在基座整板内步骤S2中单体基座的晶片副电极上；
S4、根据步骤S1至步骤S3喷涂方法，按预先设定的顺序完成基座整板上其余单体基座的喷胶。
在本发明提供的喷胶方法技术方案基础上，第二种具体加工方法包括有以下步骤：
S1、分别对基座整板上的每个单体基座依序按照喷下胶步骤完成喷下胶：
将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中每个单体基座的左右平台上；
S2、分别对基座整板上的每个单体基座依序完成上片：
吸嘴依次吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正；放置在基
座整板已喷射下胶的每个单体基座内；
S3、分别对基座整板上的每个单体基座依序完成喷上胶：
将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S2完成的每个单体基座的晶片副电极上。
在本发明提供的喷胶方法技术方案基础上，第三种具体加工方法包括有以下步骤：
S1、分别对基座整板上选定的多个单体基座依序按照喷下胶步骤完成喷下胶：
将基座整板移动至喷射阀处喷射下胶，对于在基座整板中选定的多个单体基座，导电胶按喷胶方式依序喷射在多个单体基座中每个单体基座的左右平台上；
S2、分别对基座整板上选定的多个单体基座依序完成上片：
对于在基座整板中选定的多个单体基座，吸嘴依序吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正，依序放置在基座整板已喷射下胶的多个单体基座内；
S3、分别对基座整板上选定的多个单体基座依序完成喷上胶：
对于在基座整板中选定的多个单体基座，将基座整板返回喷射阀处，导电胶按喷胶方式依序喷射在基座整板内步骤S2完成的多个单体基座的晶片副电极上。
在本发明提供的喷胶方法技术方案基础上，第四种具体加工方法包括有以下步骤：
S1、对基座整板中位于同一行的单体基座依序按照喷下胶步骤完成喷下胶：
S11、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中同一行单体基座的左右平台上；
S12、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统1进行晶片位置角度矫正；放置在基座整板已喷射下胶的同一行单体基座内；
S13、喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S12完成的同一行单体基座的晶片副电极上；
S2、按照S1的步骤对基座整板其余行上的每个单体基座依序完成整个喷胶过程。
在本发明提供的喷胶方法技术方案基础上，第五种具体加工方法包括有以下步骤：
S1、对基座整板中位于同一列的单体基座依序按照喷下胶步骤完成喷下胶：
S11、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中同一列单体基座的左右平台上；
S12、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统1进行晶片位置角度矫正；放置在基座整板已喷射下胶的同一列单体基座内；
S13、喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S12
完成的同一列单体基座的晶片副电极上；
S2、按照S1的步骤对基座整板其余列上的每个单体基座依序完成整个喷胶过程。
本发明与现有技术相比，其有益之处在于：本发明用于表面贴石英晶体谐振器的整板加工。由于整板内的每个单体基座点胶平台高度相对误差大，采用非接触式喷胶工艺替代传统接触式点胶工艺，解决了传统点胶工艺加工整板基座胶点直径一致性差的问题。采用喷胶工艺加工整板，无需传统针头点胶工艺所必须的Z轴运动。喷胶效率比点胶效率提高3倍以上。
本发明利用非接触式喷胶，固定晶片与基座的表面贴石英晶体谐振器的生产工艺操作简单，性价比远优于传统的接触式点胶设备，主要体现在如下几点：
1、利用非接触式喷胶，解决了传统接触式点胶在基座整板点胶不良的问题。
2、由于喷胶工艺中，无需调整点胶高度，因此对员工的操作技能要求低，易于操作。
3、喷胶过程节省了传统接触式点胶针头上下运动时间，提高了上胶的效率。
4、直接对基座整板进行喷胶，相对于传统对单个基座逐一点胶，喷胶设备体积变小，性价比远优于传统的接触式点胶设备。
图1是本发明基座整板示意图一；
图2是本发明基座整板示意图二；
图3是本发明单体基座示意图；
图4是本发明单体基座喷胶后状态示意图，
图5是本发明喷胶系统的结构示意图。
标记说明：1、基座整板，1-1、单体基座，2、左平台，3、右平台，4、晶片，5、副电极，6、导电胶，7、喷嘴。
以下参照附图1至附图5，给出本发明的具体实施方式，用来对本发明做进一步说明。
本发明中的喷胶装置包括基座整板1、晶片4、喷胶系统，其中，基座整板1以及贴装在基座整板1上的晶片4均位于喷胶系统中喷嘴7的下方。
关于用于表面贴石英晶体谐振器的基座整板，在本发明中基座整板包括两种形式：1、在陶瓷大板上通过加工成按矩阵排布连接的结构单元，每个结构单元作为一个独立的单体基座，由此形成的陶瓷大板作为本发明的基座整板；2、由单体基座码放在一个整板工装内作为本发明的基座整板。
喷胶工艺中，设置有两套视觉系统，视觉系统I用于对晶片位置角度矫正，视觉系统
II用于对基座整板的识别和矫正，也可以通过设置一套视觉系统同时对晶片和基座整板进行识别和矫正，在本发明中利用两套视觉系统进行说明具体的喷胶工艺。
本发明对基座整板上按M*N矩阵排布连接的单体基座的喷胶工艺进行说明，M、N的初始值均为1，M、N均为非零自然数，M为行数且M的最大值为矩阵的行数，N为列数且N的最大值为矩阵的列数，即1≤M≤行数，1≤N≤列数，对于基座整板上的每个单体基座采用aMN表达，aMN是位于基座整板第M行第N列的单体基座。
在喷下胶时，基座整板中的每个单体基座的左右平台依次位于喷嘴正下方，在喷上胶时，每个单体基座上方的晶片副电极位于喷嘴正下方，在本发明中晶片即为石英晶体谐振器。喷胶系统为现有技术中的常用装置，本发明不对喷胶系统结构的描述。在本发明中，还可以在喷上胶时，当前单体基座上方的晶片副电极以及下一个单体基座的左右平台依次位于喷嘴正下方。在本发明中视觉系统I、视觉系统II在使用时，将晶片移动至视觉系统I正下方，用于对晶片位置角度矫正，将基座整板移动至视觉系统II正下方，用于对基座整板的识别、矫正以及喷胶状态检测。
实施例1
在本实施例中，选择基座整板上位于第1行第1列的单体基座完成喷下胶、上片、喷上胶的过程后，再对基座整板上剩下的全部单体基座完成同样的过程，最终基座整板完成喷胶过程。
在整个喷胶工艺进行之前，先进行以下准备步骤：
步骤1、将未进行喷胶的基座整板放置在基座整板提笼内等待提取；
步骤2、晶片放置在晶片提笼内等待提取；
步骤3、把搅好的银胶注入喷胶阀中，确认喷胶阀是否能正常吐胶；
步骤4、根据晶片位置调整放晶片的高度，根据胶点大小位置调整喷胶时间和喷胶位置；
步骤5、吸取晶片，视觉系统I识别并角度矫正，合格品移置等待基座整板位置；
步骤6、与步骤5同时，基座整板移动到视觉系统II识别整板内各个单体基座位置。
待准备阶段完毕后，对基座整板进行喷胶，具体包括有以下步骤：
S1、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中位于第1行第1列的单体基座a11的左右平台上；
S2、上片：吸嘴从晶片提笼内吸取晶片，通过吸嘴的旋转电机和视觉系统I进行晶片位置角度矫正；同时，将基座整板移至视觉系统II识别喷胶状态，喷胶合格后，将吸嘴吸取
的晶片放置在位于基座整板第1行第1列已喷射下胶的单体基座a11内；
S3、喷上胶：将基座整板返回喷射阀处喷射上胶，导电胶按喷胶方式喷射在基座整板上单体基座a12的左右平台以及已放置晶片的单体基座a11的晶片副电极上；
S4、根据步骤S1至步骤S3喷涂方法，按预先设定的顺序完成基座整板上其余单体基座的喷胶。
在本实施例中步骤S4中预先设定的顺序为，对基座整板上的单体基座一个一个的完成喷射工艺，先对当前单体基座执行喷下胶、上片，之后，在喷上胶过程中对下一个单体基座执行喷下胶及当前单体基座喷上胶。
利用矩阵来表示，具体为：
S41、在步骤S1中选取单体基座aMN作为当前喷射目标，对单体基座aMN完成步骤S1喷下胶、步骤S2上片，之后在步骤S3中对单体基座aMN完成喷上胶、单体基座aM，N+1完成喷下胶；
S42、依次重复步骤S1至S3，交替循环，直到N取值为矩阵的列数，此时对单体基座aM，N+1完成步骤S1喷下胶、步骤S2上片，单体基座aM，N+1为该行最后一个位置，在步骤S3中对单体基座aM，N+1完成喷上胶，在对单体基座aM+1，N完成喷下胶；此时步骤S3中喷下胶的单体基座aM+1，N中M取值为M+1，N值从1开始依次取值至矩阵的列数；
S43、每次当前N取值为矩阵的列时，对当前单体基座完成步骤S1至S2后，当前M取值自动执行加1，N值从1开始依次取值至矩阵的列数，依次重复步骤S41至S43，交替循环，直到M取值大于行数时，完成整个基座整板上的喷射过程。
在步骤S1中的喷胶方式具体是指通过非接触式的方式进行喷胶取代传统接触式的点。在本发明中将传统接触式点胶工艺中使用的点胶针管、点胶针头以及激光测距系统由喷胶系统替代，喷胶系统的构成主要有：1、利用多层堆叠式压电陶瓷微动器作为控制装置的喷胶阀门；2、喷嘴底座；3、撞针；4、入料防溢垫圈；5、止付螺丝以及固定环。
撞针0.25ms可完成一个完整周期，进而达到超微量导电胶喷射到基座整板的每个单体基座左右平台上，由于胶量一致，胶点的直径受喷胶高度影响极小，所以一致性好；1秒钟可喷射1000Hz，且具有瞬间加速度的能力，以达到超高速度的撞击，从而保证了胶点轮廓一致性和粘接强度；喷射时间远小于整板由程序脉冲控制做X、Y运动时间，且无上下运动
时间，因此非接触式喷胶效率远高于接触式点胶效率。
实施例2
本实施例的喷涂工艺类似于实施例1，待准备阶段所做的工作，以及喷胶阀的喷胶位置、喷胶工艺均和实施例1一致，仅仅在喷涂顺序上有所区别。
在本实施例中，对基座整板上的每个单体基座先进行步骤S1喷下胶，之后对每个单体基座再进行步骤S2上片，最后对每个单体基座进行步骤S3喷上胶，具体为：
S1、分别对基座整板上的每个单体基座依序按照喷下胶步骤完成喷下胶：
将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中每个单体基座的左右平台上；
S2、分别对基座整板上的每个单体基座依序完成上片：
吸嘴依次吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正；放置在基座整板已喷射下胶的每个单体基座内；
S3、分别对基座整板上的每个单体基座依序完成喷上胶：
将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S2完成的每个单体基座的晶片副电极上。
在本实施例中，每个步骤中的动作都是对基座整板上的单体基座按照预定的顺序，依序进行。喷下胶、上片、喷上胶时选取单体基座的顺序均相同，以步骤S1喷下胶说明预先设定的顺序。
在本实施例中喷下胶预先设定的顺序为，对基座整板上的单体基座一个一个的完成喷射下胶工艺，利用矩阵来表示，具体为：
1、在步骤S1中选取单体基座aMN作为当前喷射目标，对单体基座aMN完成步骤S1喷下胶，之后M取当前值，N自动加1，对单体基座aM，N+1执行喷下胶，直到N取值为矩阵的列数，此时第M行的单体基座均完成喷下胶；
2、对当前的M值自动加1，此时，M为M+1，N值从1开始依次取值至矩阵的列数，对单体基座aM+1，N完成喷下胶；
3、每次当前N取值为矩阵的列时，对当前第M行的单体基座完成喷下胶，当前M取值自动执行加1，N值从1开始依次取值至矩阵的列数，依次重复步骤1至3，交替循环，直到M取值大于行数时，完成整个基座整板上的喷下胶过程。
对基座整板上的贴片、喷上胶的顺序均和喷下胶的顺序一致，也可以采用不同的顺序，
但一定要有规律性，而这些规律均属于编程控制，本实施例不再一一列举，仅通过本实施例提供的顺序做一下示例性的说明。
实施例3
本实施例的喷涂工艺类似于实施例1，待准备阶段所做的工作，以及喷胶阀的喷胶位置、喷胶工艺均和实施例1一致，仅仅在喷涂顺序上有所区别。
在本实施例中，选定基座整板上多个单体基座，这些多个单体基座可以在基座整板上呈区域划分，也可以在基座整板上零散分布，但是对于呈区域的有利用实现控制，因此采用呈区域划分的方式进行说明。
对基座整板上当前选定区域的多个单体基座先进行步骤S1喷下胶，之后对当前选定区域的多个单体基座再进行步骤S2上片，最后对当前选定区域的多个单体基座进行步骤S3喷上胶，具体为：
S1、分别对基座整板上当前选定区域的多个单体基座依序按照喷下胶步骤完成喷下胶：
将基座整板移动至喷射阀处喷射下胶，对于在基座整板中选定的多个单体基座，导电胶按喷胶方式依序喷射在多个单体基座中每个单体基座的左右平台上；
S2、分别对基座整板上当前选定区域的多个单体基座依序完成上片：
对于在基座整板中选定的多个单体基座，吸嘴依序吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正，依序放置在基座整板已喷射下胶的多个单体基座内；
S3、分别对基座整板上当前选定区域的多个单体基座依序完成喷上胶：
对于在基座整板中选定的多个单体基座，将基座整板返回喷射阀处，导电胶按喷胶方式依序喷射在基座整板内步骤S2完成的多个单体基座的晶片副电极上。
之后，换至下一个选定区域，重复步骤S1至步骤S2完成当前选定区域的整个喷胶过程，依次交替，直到基座整板上的全部单体基座都完成喷胶过程。
在本实施例中，在当前选定区域的多个单体基座的喷下胶、上片、喷上胶时选取单体基座的顺序类似实施例2中的顺序规则，在本实施例中M、N的取值均在当前选定区域内进行，详细的操作参见实施例2。
关于本实施例中不同区域的切换，即完成上一个区域的整个喷胶过程后，换至下一个区域的时候，也是通过M、N的取值来切换，切换的时间点为当前区域的最后一个单体基座完成喷上胶，下一个区域的第一个单体基座准备喷下胶，具体切换顺序参见实施例1中上一个单体基座完成喷上胶，下一个单体基座准备喷下胶的规则。
实施例4
本实施例的喷涂工艺类似于实施例1，待准备阶段所做的工作，以及喷胶阀的喷胶位置、喷胶工艺均和实施例1一致，仅仅在喷涂顺序上有所区别。
在本实施例中，选定基座整板上某一行的所有单体基座，对于当前行上的每个单体基座，例如对基座整板第M行第N列上的每个单体基座先进行步骤S1喷下胶，之后对每个单体基座再进行步骤S2上片，最后对每个单体基座进行步骤S3喷上胶，具体为：
S1、对基座整板中第M行第N列的每个单体基座依序按照喷下胶步骤完成喷下胶：
S11、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中第M行第N列每个单体基座的左右平台上；
S12、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统1进行晶片位置角度矫正；放置在基座整板已喷射下胶的第M行第N列每个单体基座内；
S13、喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S12完成的第M行第N列每个单体基座的晶片副电极上；
S2、按照S1的步骤对基座整板上的其余行上的每个单体基座依序完成整个喷胶过程。
关于本实施例中对于第M行第N列的每个单体基座的喷下胶、上片、喷上胶时选取单体基座的顺序类似实施例2中的顺序规则，在本实施例中不再详细叙述，详细的操作参见实施例2。
关于本实施例中对于不同行之间的切换，即从第M行第N列切换至第M+1行第N列的规则，参考实施例1中上一个单体基座完成喷上胶，下一个单体基座准备喷下胶的规则。之后对于第M+1行第N列的操作规则参考实施例2。
实施例5
本实施例的喷涂工艺类似于实施例1，待准备阶段所做的工作，以及喷胶阀的喷胶位置、喷胶工艺均和实施例1一致，仅仅在喷涂顺序上有所区别。
在本实施例中，对于喷涂顺序类似于实施例4，将实施例中的先对每行的所有单体基座进行喷涂工艺替换为先对每列的所有单体基座进行喷涂工艺。
选定基座整板上某一列的所有单体基座，对于当前列上的每个单体基座，例如对基座整板第M行第N列上的每个单体基座先进行步骤S1喷下胶，之后对每个单体基座再进行步骤S2上片，最后对每个单体基座进行步骤S3喷上胶，具体为：
S1、对基座整板中位于同一列的单体基座依序按照喷下胶步骤完成喷下胶：
S11、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中同一列单体基座的左右平台上；
S12、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统1进行晶片位置角度矫正；放置在基座整板已喷射下胶的同一列单体基座内；
S13、喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S12完成的同一列单体基座的晶片副电极上；
S2、按照S1的步骤对基座整板其余列上的每个单体基座依序完成整个喷胶过程。
关于本实施例中对于第M行第N列的每个单体基座的喷下胶、上片、喷上胶时选取单体基座的顺序类似实施例2中的顺序规则，在本实施例中不再详细叙述，详细的操作参见实施例2。
关于本实施例中对于不同列之间的切换，即从第M行第N列切换至第M行第N+1列的规则，参考实施例1中上一个单体基座完成喷上胶，下一个单体基座准备喷下胶的规则。之后对于第M行第N+1列的操作规则参考实施例2。
对于本发明中的不同的喷涂顺序中采用的喷涂工艺均类似于实施例1，而喷涂顺序都是根据人为的规则通过程序来实现，比如按斜线、角度、圆心环绕等方式，在本发明中不可能穷举，仅通过以上实施例来多整个喷涂进行说明。除了以上实施例中采用的基座整板，本发明的整个喷涂工艺，还可以应用在多个单体基座码入整板工装内，再放置到基座提笼内待喷胶，整个喷涂工艺也是相同的，只是基座整板的形式发生变化，但是基座整板上单体基座也是呈矩阵式排列，具体喷涂顺序及过程参见本发明的实施例。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
Claims (10)
- 表面贴石英晶体谐振器生产中非接触式喷胶系统，其特征在于：包括基座整板(1)、晶片(4)、喷胶系统，其中，基座整板(1)以及贴装在基座整板(1)上的晶片(4)均位于喷胶系统中喷嘴(7)的下方。
- 如权利要求1所述的表面贴石英晶体谐振器生产中非接触式喷胶系统，其特征在于：基座整板(1)为陶瓷大板，在陶瓷大板上设置有按矩阵排布连接的结构单元，每个结构单元为一个独立的单体基座(1-1)。
- 如权利要求2所述的表面贴石英晶体谐振器生产中非接触式喷胶系统，其特征在于：基座整板(1)为整板工装，整板工装上设有按矩阵排布的空位，每个空位内放置有一个单体基座(1-1)。
- 如权利要求2或3所述的表面贴石英晶体谐振器生产中非接触式喷胶系统，其特征在于：还包括用于检测基座整板内各个单体基座位置及单体基座喷胶状态的视觉系统I、用于检测晶片正位的视觉系统II。
- 表面贴石英晶体谐振器生产中非接触式喷胶方法，其特征在于：在基座整板上形成多个单体基座，对单体基座的左右平台以及贴在单体基座上的晶片的副电极采用非接触式方式进行喷胶。
- 如权利要求5所述的表面贴石英晶体谐振器生产中非接触式喷胶方法，其特征在于，包括有以下步骤：S1、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中一个单体基座的左右平台上；S2、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正；放置在基座整板已喷射下胶的单体基座内；S3、喷上胶：将基座整板返回喷射阀处喷射上胶，导电胶按喷胶方式喷射在基座整板内步骤S2中单体基座的晶片副电极上；S4、根据步骤S1至步骤S3喷涂方法，按预先设定的顺序完成基座整板上其余单体基座的喷胶。
- 如权利要求5所述的表面贴石英晶体谐振器生产中非接触式喷胶方法，其特征在于：包括有以下步骤：S1、分别对基座整板上的每个单体基座依序按照喷下胶步骤完成喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中每个单体基座的左右平台上；S2、分别对基座整板上的每个单体基座依序完成上片：吸嘴依次吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正；放置在基座整板已喷射下胶的每个单体基座内；S3、分别对基座整板上的每个单体基座依序完成喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S2完成的每个单体基座的晶片副电极上。
- 如权利要求5所述的表面贴石英晶体谐振器生产中非接触式喷胶方法，其特征在于：包括有以下步骤：S1、分别对基座整板上选定的多个单体基座依序按照喷下胶步骤完成喷下胶：将基座整板移动至喷射阀处喷射下胶，对于在基座整板中选定的多个单体基座，导电胶按喷胶方式依序喷射在多个单体基座中每个单体基座的左右平台上；S2、分别对基座整板上选定的多个单体基座依序完成上片：对于在基座整板中选定的多个单体基座，吸嘴依序吸取晶片，通过吸嘴的旋转电机和视觉系统进行晶片位置角度矫正，依序放置在基座整板已喷射下胶的多个单体基座内；S3、分别对基座整板上选定的多个单体基座依序完成喷上胶：对于在基座整板中选定的多个单体基座，将基座整板返回喷射阀处，导电胶按喷胶方式依序喷射在基座整板内步骤S2完成的多个单体基座的晶片副电极上。
- 如权利要求5所述的表面贴石英晶体谐振器生产中非接触式喷胶方法，其特征在于：包括有以下步骤：S1、对基座整板中位于同一行的每个单体基座依序按照喷下胶步骤完成喷下胶：S11、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中同一行单体基座的左右平台上；S12、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统1进行晶片位置角度矫正；放置在基座整板已喷射下胶的同一行单体基座内；S13、喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S12完成的同一行单体基座的晶片副电极上；S2、按照S1的步骤对基座整板其余行上的每个单体基座依序完成整个喷胶过程。
- 如权利要求5所述的表面贴石英晶体谐振器生产中非接触式喷胶方法，其特征在于：包括有以下步骤：S1、对基座整板中位于同一列的单体基座依序按照喷下胶步骤完成喷下胶：S11、喷下胶：将基座整板移动至喷射阀处喷射下胶，导电胶按喷胶方式喷射在基座整板中同一列单体基座的左右平台上；S12、上片：吸嘴吸取晶片，通过吸嘴的旋转电机和视觉系统1进行晶片位置角度矫正；放置在基座整板已喷射下胶的同一列单体基座内；S13、喷上胶：将基座整板返回喷射阀处，导电胶按喷胶方式喷射在基座整板内步骤S12完成的同一列单体基座的晶片副电极上；S2、按照S1的步骤对基座整板其余列上的每个单体基座依序完成整个喷胶过程。
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| Publication number | Publication date |
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| TW201803265A (zh) | 2018-01-16 |
| CN106067776B (zh) | 2018-10-02 |
| CN106067776A (zh) | 2016-11-02 |
| TWI674749B (zh) | 2019-10-11 |
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