WO2017215320A1 - 一种用于制备金属掩膜板的方法及金属掩膜板 - Google Patents

一种用于制备金属掩膜板的方法及金属掩膜板 Download PDF

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Publication number
WO2017215320A1
WO2017215320A1 PCT/CN2017/079318 CN2017079318W WO2017215320A1 WO 2017215320 A1 WO2017215320 A1 WO 2017215320A1 CN 2017079318 W CN2017079318 W CN 2017079318W WO 2017215320 A1 WO2017215320 A1 WO 2017215320A1
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Prior art keywords
frame
support plate
metal mask
metal
extending direction
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PCT/CN2017/079318
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English (en)
French (fr)
Inventor
吕守华
黄俊杰
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Priority to US15/575,774 priority Critical patent/US10784443B2/en
Publication of WO2017215320A1 publication Critical patent/WO2017215320A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a method for preparing a metal mask and a metal mask.
  • OLED Organic Light-Emitting Diode
  • OLED uses a high-precision metal mask as a mold, and the organic material is volatilized at a high temperature and then passes through a predetermined opening of the metal mask in a molecular state. It is evaporated into the pixel region on the back sheet glass to form an organic light emitting layer of the OLED.
  • a pixel defining layer having a plurality of openings is formed on the back sheet glass, and the pixel regions are defined by the opening regions of the pixel defining layers.
  • the red, green and blue organic materials need to be separately evaporated through the metal mask into respective pixel regions defined by the pixel defining layer, that is, in the corresponding openings of the pixel defining layer.
  • the present disclosure provides a method for preparing a metal mask and a metal mask, which can reduce the diffusion of organic materials during the evaporation process, thereby reducing the possibility of color mixing and improving product yield. .
  • a method for preparing a metal mask comprising: forming a frame, wherein the frame has first and second sides that are oppositely disposed and parallel, and for supporting the a support member of the first side edge and the second side edge, the frame being parallel to a center line extending parallel to the first side edge and located between the first side edge and the second side edge Projecting toward the first side such that the support member forms an arcuate structure that is convex toward the first side of the frame; Latheing the plurality of metal masks on the first side of the frame, each of the metal masks extending in a direction perpendicular to a direction in which the first side edges extend; and each of the Two ends of the metal mask are respectively fixed to the first side and the second side, so that the support is deformed under the surface tension of the plurality of metal masks to form a planar structure.
  • the support of the frame is formed to have a convex toward the first side of the frame before the metal mask is fixed (for example, by soldering).
  • the curved structure, and then the metal mask is tensioned and fixed on the first side of the frame, so that the support member is deformed under the surface tension of the plurality of metal masks to form a planar structure. Therefore, the periphery of the frame of the metal mask prepared by the embodiment of the present disclosure is a planar structure, and when the organic material is vapor-deposited, the frame and the back sheet glass can be completely fitted, and there is no gap between the frame and the back sheet glass.
  • the metal mask prepared by the above preparation method can prevent the diffusion of the organic material during the evaporation process, thereby reducing the possibility of color mixing and improving the product yield.
  • the support member includes a first support plate and a second support plate, and two ends of each of the first support plate and the second support plate are fixedly coupled to the first side, respectively An edge and the second side.
  • the extending direction of the first support plate is perpendicular to the extending direction of the first side edge, and the extending direction of the second support plate is opposite to the The extension direction of the first side is vertical.
  • first support plate, the second support plate, the first side, and the second side are formed as a unitary structure.
  • forming the frame includes: stamping a metal sheet to form a frame having a first side, a second side, a first support plate, and a second support plate; and bending the formed frame Operating to cause the frame to project toward the first side along the centerline such that the first and second support plates form the curved structure having a protrusion toward a first side of the frame .
  • a metal mask prepared using any of the embodiments described herein relating to a method for preparing a metal mask, the metal mask comprising a frame And a plurality of metal masks, wherein the frame has opposite and parallel first and second sides, and supports for supporting the first and second sides, the plurality a metal mask is disposed on the first side of the frame, each of the metal masks extending in a direction perpendicular to the extending direction of the first side, and the two ends of each of the metal masks are respectively fixedly connected to The first side and the second side form a planar structure by deforming the support under the surface tension of the plurality of metal masks.
  • the support member includes a first support plate and a second support plate, and two ends of each of the first support plate and the second support plate are fixedly coupled to the first side, respectively An edge and the second side.
  • the extending direction of the first supporting plate is perpendicular to the extending direction of the first side edge
  • the extending direction of the second supporting plate is perpendicular to the extending direction of the first side edge
  • first support plate, the second support plate, the first side, and the second side are formed as a unitary structure.
  • the fixed connection is a weld.
  • FIG. 1 is a flow chart of a method of fabricating a metal mask provided by an embodiment of the present disclosure
  • Figure 2 is a flow chart showing the steps of forming the frame in Figure 1;
  • FIG. 3 is a schematic structural view of a metal mask provided by an embodiment of the present disclosure.
  • FIG. 4 is a top plan view of a frame of a metal mask provided by an embodiment of the present disclosure
  • Figure 5 is a side elevational view of the frame of Figure 4 in the A direction.
  • a metal mask used for organic vapor deposition is formed by fixing a metal mask on a frame.
  • the metal mask is stretched and fixed (e.g., by soldering) to the frame.
  • the frame is easily deformed, for example, the side of the frame parallel to the metal mask is bent.
  • the organic material is vapor-deposited using the metal mask of this modification, the frame of the mask cannot be well fitted to the back glass, resulting in a gap between them.
  • the organic material is easily diffused to the periphery during the vapor deposition process, so that a shadow effect occurs, and color mixing occurs, which reduces product defects.
  • Embodiments of the present disclosure provide a method for fabricating a metal mask and a metal mask.
  • the metal mask can reduce the diffusion of the organic material during the vapor deposition of the organic material for the OLED, thereby reducing the possibility of color mixing and improving the yield of the product.
  • a method for preparing a metal mask 1 according to an embodiment of the present disclosure includes steps S11 to S13 shown in FIG.
  • the frame 2 is formed. As shown in FIGS. 3 and 4, the formed frame 2 has a first side 21 and a second side 22 that are oppositely disposed and parallel, and a support for supporting the first side 21 and the second side 22.
  • the support may be the first support plate 23 and the second support plate 24 of FIGS. 3 and 4.
  • the frame 2 is convex toward the first side B along a center line O parallel to the extending direction of the first side edge 21 and between the first side edge 21 and the second side edge 22 to form a support member An arcuate structure that is convex toward the first side B of the frame 2.
  • step S12 a plurality of metal masks 3 are pulled and placed on the first side B of the frame 2, and each metal mask 3 extends in a direction perpendicular to the extending direction of the first side edges 21.
  • the plurality of metal masks 3 may include a first metal mask 31 and a second metal mask 32, an extending direction of the first metal mask 31, and a second metal mask.
  • the extending direction of the film 32 is perpendicular to the extending direction of the first side edge 21. It can be understood that in the embodiment of the present disclosure, the number of metal masks is not limited to two as shown in FIG. 3, and may have more metal masks.
  • step S13 the two ends of each metal mask 3 are respectively fixed to the first side 21 and the second side 22, so that the support is deformed under the surface tension of the plurality of metal masks 3 to form a plane. structure.
  • both ends of each metal mask may be welded to the first side 21 and the second side 22. It can be understood that the fixed connection of the metal mask to the first side and the second side is not limited to the manner of welding, and may also include other connection methods such as riveting, bolting, and the like.
  • the support of the frame 2 is formed to have an arc-shaped structure protruding toward the first side of the frame 2 before the metal mask 3 is fixedly attached to the frame.
  • the first support plate 23 of the frame 2 as shown in FIG. 5 is convex toward the first side B of the frame; the metal mask 3 is then tensioned, and fixed to the first side B of the frame 2 (for example, by welding).
  • the support member may be deformed under the surface tension of the plurality of metal masks 3 to form a planar structure. Therefore, the periphery of the frame 2 of the prepared metal mask 1 is a planar structure.
  • the metal mask 1 When the metal mask 1 is used for vapor deposition of the organic material, the periphery of the frame 2 and the back glass can be completely fitted, and the frame 2 and the back glass are completely adhered. There is no gap between them.
  • the metal mask 1 prepared by the above preparation method can prevent the diffusion of the organic material during the evaporation process, thereby reducing the possibility of color mixing and improving the yield of the product.
  • the structure of the metal mask 1 prepared by the above preparation method is as shown in FIG.
  • the metal mask 1 includes a frame 2 and a plurality of metal masks 3.
  • the frame 2 has a first side 21 and a second side 22 that are oppositely disposed and parallel, and a support for supporting the first side 21 and the second side 22.
  • a plurality of metal masks 3 are disposed on the first side B of the frame 2, and an extension of each of the metal masks 3 The direction is perpendicular to the extending direction of the first side edge 21, and the two ends of each metal mask 3 are fixedly connected to the first side edge 21 and the second side edge 22, respectively, so that the support member is in the plurality of metal masks 3 Deformation under surface tension forms a planar structure.
  • the support of the frame 2 may include a first support plate 23 and a second support plate 24, a first support plate 23 and a second support plate. Both ends of each of the 24 are fixedly coupled to the first side 21 and the second side 22, respectively.
  • the extending direction of the first support plate 23 is perpendicular to the extending direction of the first side edge 21, and the second The extending direction of the support plate 24 is perpendicular to the extending direction of the first side edge 21.
  • the first support plate 23, the second support plate 24, the first side edge 21, and the second side edge 22 are formed in a unitary structure.
  • the frame 2 is of a unitary structure, which is advantageous for improving the structural stability of the frame 2.
  • the frame 2 can be formed by the following method:
  • Step S111 stamping a metal plate to form a frame 2 having a first side 21, a second side 22, a first support plate 23 and a second support plate 24, the frame 2 formed as shown in FIG. 4;
  • step S112 the formed frame 2 is bent such that the frame 2 is convex toward the first side B along the center line O such that the first support plate 23 and the second support plate 24 have an arc convex toward the first side B of the frame 2.
  • the arcuate structure formed by the first support plate 23 is exemplarily shown in FIG.
  • the frame 2 is formed by punching the metal plate required to satisfy the use of the metal mask 1, and the frame 2 is bent so that the first support plate 23 and the second support plate 24 are provided.
  • An arcuate structure having a projection toward the first side B of the frame 2 is formed. In this way, the frame 2 can be integrally formed, and therefore, the manufacture of the frame 2 is simple and fast, which is advantageous for improving the production efficiency of the frame 2.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

一种用于制备金属掩膜板（1）的方法及一种金属掩膜板（1）。制备方法包括：形成框架（2），其中，框架（2）具有相对设置且平行的第一侧边（21）和第二侧边（22）、以及用于支撑第一侧边（21）和第二侧边（22）的支撑件，框架（2）沿与第一侧边（21）延伸方向平行且位于第一侧边（21）和第二侧边（22）之间的中心线（O）向第一侧（B）凸起，以使支撑件形成朝向框架（2）的第一侧（B）凸起的弧形结构；将多个金属掩膜（3）拉紧放置于框架（2）的第一侧（B），每一个金属掩膜（3）的延伸方向与第一侧边（21）的延伸方向垂直；以及将每一个金属掩膜（3）的两端分别固定于第一侧边（21）和第二侧边（22），以使支撑件在多个金属掩膜（3）的表面张力作用下发生形变而形成平面结构。

Description

一种用于制备金属掩膜板的方法及金属掩膜板
相关申请的交叉引用
本申请要求于2016年06月12日递交的中国专利申请第201610413078.5号的优先权和权益，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开涉及显示技术领域，特别涉及一种用于制备金属掩膜板的方法及金属掩膜板。
背景技术
目前，OLED(Organic Light-Emitting Diode，有机发光二极管)在有机蒸镀镀膜的过程中，利用高精度金属掩膜板作为模具，有机材料高温挥发后以分子状态透过金属掩膜板的既定开口蒸镀到背板玻璃上的像素区域中，以形成OLED的有机发光层。通常，为了将各个像素区域分开，在背板玻璃上形成具有多个开口的像素限定层，由像素限定层的开口区域来限定像素区域。在蒸镀中，需要将红绿蓝有机材料通过金属掩膜板分别蒸镀到由像素限定层限定的各个像素区域中，即像素限定层的相应开口中。
发明内容
本公开提供了一种金属掩膜板的制备方法及金属掩膜板，该金属掩膜板能够减少有机材料在蒸镀过程中的扩散现象，进而能够减少混色的可能性并且能够提高产品良率。
在本公开的一个方面，提供一种用于制备金属掩膜板的方法，包括：形成框架，其中所述框架具有相对设置且平行的第一侧边和第二侧边、以及用于支撑所述第一侧边和所述第二侧边的支撑件，所述框架沿与所述第一侧边延伸方向平行且位于所述第一侧边和所述第二侧边之间的中心线向第一侧凸起，以使所述支撑件形成朝向所述框架第一侧凸起的弧形结构； 将所述多个金属掩膜拉紧放置于所述框架的所述第一侧，每一个所述金属掩膜的延伸方向与所述第一侧边的延伸方向垂直；以及将每一个所述金属掩膜的两端分别固定于所述第一侧边和所述第二侧边，以使所述支撑件在多个所述金属掩膜的表面张力作用下发生形变而形成平面结构。
在采用本公开的实施例提供的方法制备金属掩膜板的过程中，在(例如，通过焊接)固定金属掩膜之前，先将框架的支撑件形成为具有朝向框架的第一侧凸起的弧形结构，再将金属掩膜拉紧、固定于框架的第一侧，可以使得支撑件在多个金属掩膜的表面张力作用下发生形变而形成平面结构。因此，通过本公开的实施例制备的金属掩膜板的框架周边为平面结构，在进行有机材料的蒸镀时，框架与背板玻璃能够完全贴合，框架与背板玻璃之间没有缝隙。采用上述制备方法制备的金属掩膜板能够防止有机材料在蒸镀过程中的扩散现象，进而能够减少发生混色的可能性且能够提高产品良率。
在一个实施例中，所述支撑件包括第一支撑板和第二支撑板，所述第一支撑板和所述第二支撑板中的每一个的两端分别固定连接到所述第一侧边和所述第二侧边。
在一个实施例中，当所述支撑件形成平面结构后，所述第一支撑板的延伸方向与所述第一侧边的延伸方向垂直，并且所述第二支撑板的延伸方向与所述第一侧边的延伸方向垂直。
在一个实施例中，所述第一支撑板、所述第二支撑板、所述第一侧边和所述第二侧边被形成为一体结构。
在一个实施例中，形成所述框架包括：对一块金属板进行冲压以形成具有第一侧边、第二侧边、第一支撑板和第二支撑板的框架；以及对形成的框架进行弯曲操作，以使所述框架沿所述中心线向第一侧凸起，以使所述第一支撑板和第二支撑板形成具有朝向所述框架的第一侧凸起的所述弧形结构。
在本公开的另一方面，还提供了一种采用本文描述的涉及用于制备金属掩膜板的方法的任一实施例制备的金属掩膜板，该金属掩膜板包括框架 和多个金属掩膜，其中所述框架具有相对设置且平行的第一侧边和第二侧边、以及用于支撑所述第一侧边和第二侧边的支撑件，所述多个金属掩膜设置于所述框架的第一侧，每一个所述金属掩膜的延伸方向与所述第一侧边的延伸方向垂直，且每一个所述金属掩膜的两端分别固定连接于所述第一侧边和所述第二侧边，以使所述支撑件在多个所述金属掩膜的表面张力作用下发生形变而形成平面结构。
在一个实施例中，所述支撑件包括第一支撑板和第二支撑板，所述第一支撑板和所述第二支撑板中的每一个的两端分别固定连接到所述第一侧边和所述第二侧边。
在一个实施例中，所述第一支撑板的延伸方向与所述第一侧边的延伸方向垂直，所述第二支撑板的延伸方向与所述第一侧边的延伸方向垂直。
在一个实施例中，所述第一支撑板、所述第二支撑板、所述第一侧边和所述第二侧边被形成为一体结构。
在一个实施例中，所述固定连接为焊接。
附图说明
本文中描述的附图用于仅对所选择的实施例的说明的目的，并不是所有可能的实施方式，并且不旨在限制本申请的范围，其中，
图1为本公开的实施例提供的金属掩膜板的制备方法的流程图；
图2为图1中形成框架的步骤的一种流程图；
图3为本公开的实施例提供的金属掩膜板的结构示意图；
图4为本公开的实施例提供的金属掩膜板的框架的俯视图；以及
图5为图4中框架的在A方向中的侧视图。
贯穿这些附图的各个视图，相应的参考编号指示相应的部件或特征。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例， 而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文中另外明确地指出，否则在本文和所附权利要求中所使用的词语的单数形式包括复数，反之亦然。因而，当提及单数时，通常包括相应术语的复数。相似地，措辞“包含”和“包括”将解释为包含在内而不是独占性地。同样地，术语“包括”和“或”应当解释为包括在内的，除非本文中明确禁止这样的解释。在本文中使用术语“实例”之处，特别是当其位于一组术语之后时，所述“实例”仅仅是示例性的和阐述性的，且不应当被认为是独占性的或广泛性的。
在相关技术中，有机蒸镀使用的金属掩膜板是通过将金属掩膜固定在框架上制成的。在固定金属掩膜时，将金属掩膜拉伸并(例如，通过焊接)固定到框架上。然而，由于金属掩膜的表面张力的作用，框架容易发生变形，例如框架的与金属掩膜平行的侧边发生弯曲。当使用这种变型的金属掩膜板进行有机材料的蒸镀时，掩膜板的框架不能与背板玻璃很好地贴合，导致他们之间有缝隙。在这种情况下，由于缝隙的存在，使得在进行蒸镀的过程中，有机材料容易向周边扩散，因此出现Shadow(阴影)效应，并会发生混色的现象，降低产品不良。
本公开实施例提供了一种用于制备金属掩膜板的方法及金属掩膜板。该金属掩膜板在用于OLED的有机材料的蒸镀的过程中，能够减少有机材料的扩散现象，进而能够减少发生混色的可能性且能够提高产品良率。
参考图1、图3、图4以及图5，本公开一种实施例提供的用于制备金属掩膜板1的方法，包括图1中所示的步骤S11-步骤S13。
在步骤S11，形成框架2。如图3和图4所示，形成的框架2具有相对设置且平行的第一侧边21和第二侧边22、以及用于支撑第一侧边21和第二侧边22的支撑件。在一个示例中，支撑件可为图3以及图4中的第一支撑板23和第二支撑板24。框架2沿与第一侧边21延伸方向平行且位于第一侧边21和第二侧边22之间的中心线O向第一侧B凸起，以使支撑件形 成朝向框架2的第一侧B凸起的弧形结构。
在步骤S12，将多个金属掩膜3拉紧放置于框架2的第一侧B，每一个金属掩膜3的延伸方向与第一侧边21的延伸方向垂直。
在一个示例性实施例中，如图3所示，多个金属掩膜3可包括第一金属掩膜31和第二金属掩膜32，第一金属掩膜31的延伸方向、第二金属掩膜32的延伸方向均与第一侧边21的延伸方向垂直。可以理解，在本公开的实施例中，金属掩膜的数量不限于图3中所示的2个，也可以具有更多的金属掩膜。
在步骤S13，将每一个金属掩膜3的两端分别固定于第一侧边21和第二侧边22，以使支撑件在多个金属掩膜3的表面张力作用下发生形变而形成平面结构。
在一个示例性实施例中，可以将每个金属掩膜的两端焊接到第一侧边21和第二侧边22。可以理解，金属掩膜与第一侧边和第二侧边的固定连接不限于焊接的方式，还可以包括例如铆接、螺栓连接等其他连接方式。
在采用上述方法制备金属掩膜板1的过程中，在将金属掩膜3固定连接到框架之前，先将框架2的支撑件形成为具有朝向框架2的第一侧凸起的弧形结构，如图5所示的框架2的第一支撑板23朝向框架的第一侧B的方向凸起；再将金属掩膜3拉紧、(例如，通过焊接)固定于框架2的第一侧B，可以使得支撑件在多个金属掩膜3的表面张力作用下发生形变而形成平面结构。因此，制备的金属掩膜板1的框架2周边为平面结构，在采用金属掩膜板1进行有机材料的蒸镀时，框架2周边与背板玻璃能够完全贴合，框架2与背板玻璃之间没有缝隙。采用上述制备方法制备的金属掩膜板1能够防止有机材料在蒸镀过程中的扩散现象，进而能够减少发生混色的可能性且提高产品良率。
采用上述制备方法制备的金属掩膜板1的结构如图3所示。该金属掩膜板1包括框架2和多个金属掩膜3。框架2具有相对设置且平行的第一侧边21和第二侧边22、以及用于支撑第一侧边21和第二侧边22的支撑件。多个金属掩膜3设置于框架2的第一侧B，每一个金属掩膜3的延伸 方向与第一侧边21的延伸方向垂直，且每一个金属掩膜3的两端分别固定连接于第一侧边21和第二侧边22，以使支撑件在多个金属掩膜3的表面张力作用下发生形变而形成平面结构。
在本公开的一个具体的实施例中，如图3以及图4所示，框架2的支撑件可以包括第一支撑板23和第二支撑板24，第一支撑板23的和第二支撑板24中的每一个的两端分别固定连接到第一侧边21和第二侧边22。
在本公开的示例性的实施例中，如图3以及图4所示，当支撑件形成平面结构后，第一支撑板23的延伸方向与第一侧边21的延伸方向垂直，并且第二支撑板24的延伸方向与第一侧边21的延伸方向垂直。
在本公开的示例性实施例中，，第一支撑板23、第二支撑板24、第一侧边21以及第二侧边22被形成为一体式结构。在这种配置中，框架2为一体式结构，有利于提高框架2的结构稳定性。
在本公开的示例性实施例中，如图2所示，可以通过如下方法形成框架2：
步骤S111，对一块金属板进行冲压以形成具有第一侧边21、第二侧边22、第一支撑板23和第二支撑板24的框架2，所形成的框架2如图4所示；
步骤S112，将形成的框架2弯曲，使得框架2沿中心线O向第一侧B凸起，以使第一支撑板23和第二支撑板24具有朝向框架2第一侧B凸起的弧形结构，第一支撑板23形成的弧形结构在图5中示例性示出。
在根据在图2中所示的方法形成框架的过程中，通过冲压满足金属掩膜板1使用要求的金属板形成框架2，并弯曲框架2以使第一支撑板23和第二支撑板24形成具有朝向框架2第一侧B凸起的弧形结构。通过这种方法，框架2可以一体成型，因此，框架2的制造简单且快速，有利于提高框架2的生产效率。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和 变型在内。

Claims (10)

  1. 一种用于制备金属掩膜板的方法，包括：
    形成框架，其中，所述框架具有相对设置且平行的第一侧边和第二侧边、以及用于支撑所述第一侧边和所述第二侧边的支撑件，所述框架沿与所述第一侧边延伸方向平行且位于所述第一侧边和所述第二侧边之间的中心线向第一侧凸起，以使所述支撑件形成朝向所述框架的第一侧凸起的弧形结构；
    将所述多个金属掩膜拉紧放置于所述框架的所述第一侧，每一个所述金属掩膜的延伸方向与所述第一侧边的延伸方向垂直；以及
    将每一个所述金属掩膜的两端分别固定于所述第一侧边和所述第二侧边，以使所述支撑件在多个所述金属掩膜的表面张力作用下发生形变而形成平面结构。
  2. 根据权利要求1所述的方法，其中，所述支撑件包括第一支撑板和第二支撑板，所述第一支撑板和所述第二支撑板中的每一个的两端分别固定连接到所述第一侧边和所述第二侧边。
  3. 根据权利要求2所述的方法，其中，当所述支撑件形成平面结构后，所述第一支撑板的延伸方向与所述第一侧边的延伸方向垂直，并且所述第二支撑板的延伸方向与所述第一侧边的延伸方向垂直。
  4. 根据权利要求2所述的方法，其中，所述第一支撑板、所述第二支撑板、所述第一侧边和所述第二侧边被形成为一体结构。
  5. 根据权利要求2至4中任一项所述的方法，其中，形成所述框架包括：
    对一块金属板进行冲压以形成具有第一侧边、第二侧边、第一支撑板和第二支撑板的框架；
    对形成的框架进行弯曲操作，以使所述框架沿所述中心线向第一侧凸起，以使所述第一支撑板和第二支撑板具有朝向所述框架的第一侧凸起的所述弧形结构。
  6. 一种金属掩膜板，包括框架和多个金属掩膜，其中，所述框架具有 相对设置且平行的第一侧边和第二侧边、以及用于支撑所述第一侧边和第二侧边的支撑件，所述多个金属掩膜设置于所述框架的第一侧，每一个所述金属掩膜的延伸方向与所述第一侧边的延伸方向垂直，且每一个所述金属掩膜的两端分别固定连接于所述第一侧边和所述第二侧边，以使所述支撑件在多个所述金属掩膜的表面张力作用下发生形变而形成平面结构。
  7. 根据权利要求6所述的金属掩膜板，其中，所述支撑件包括第一支撑板和第二支撑板，所述第一支撑板和所述第二支撑板中的每一个的两端分别固定连接到所述第一侧边和所述第二侧边。
  8. 根据权利要求7所述的金属掩膜板，其中，所述第一支撑板的延伸方向与所述第一侧边的延伸方向垂直，所述第二支撑板的延伸方向与所述第一侧边的延伸方向垂直。
  9. 根据权利要求7所述的金属掩膜板，其中，所述第一支撑板、所述第二支撑板、所述第一侧边和所述第二侧边被形成为一体结构。
  10. 根据权利要求6-9任一项所述的金属掩膜板，其中，所述固定连接为焊接。
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