WO2017212035A1 - Procédé et appareil de métrologie pour un procédé de fabrication de semi-conducteurs - Google Patents

Procédé et appareil de métrologie pour un procédé de fabrication de semi-conducteurs Download PDF

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Publication number
WO2017212035A1
WO2017212035A1 PCT/EP2017/064145 EP2017064145W WO2017212035A1 WO 2017212035 A1 WO2017212035 A1 WO 2017212035A1 EP 2017064145 W EP2017064145 W EP 2017064145W WO 2017212035 A1 WO2017212035 A1 WO 2017212035A1
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WO
WIPO (PCT)
Prior art keywords
mark
marks
features
lithographic
overlay
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Application number
PCT/EP2017/064145
Other languages
English (en)
Inventor
Christopher Ausschnitt
Vincent Truffert
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Imec Vzw
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec Vzw filed Critical Imec Vzw
Priority to KR1020187035656A priority Critical patent/KR102201794B1/ko
Priority to US16/308,363 priority patent/US10481504B2/en
Priority to CN201780035477.5A priority patent/CN109313392B/zh
Priority to JP2018563524A priority patent/JP6753958B2/ja
Publication of WO2017212035A1 publication Critical patent/WO2017212035A1/fr
Priority to US16/659,034 priority patent/US20200050112A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus

Definitions

  • the present invention is related to semiconductor processing, in particular to a metrology method for monitoring lithographic and/or etch processes during the fabrication of a semiconductor chip.
  • Semiconductor processing includes many lithography and etch steps, wherein a pattern defined in a lithographic mask is exposed to a light source, resulting in the printing of the pattern on a photoresist film deposited on a layer stack that is built up layer by layer on a semiconductor wafer. After development of the resist, etching reproduces the pattern in a layer of the stack, for example for realizing a metal conductor pattern in a level of the back-end-of-line stack of an integrated circuit chip.
  • Feature dimensions of the printed and etched patterns in present day processing technology are of the order of nanometers, and the monitoring of the printed/etched features requires specific metrology tools.
  • the invention is related to a method as disclosed in the appended claims.
  • the invention is thus related to a method for determining dimensions of features in a patterned layer of a chip produced on a semiconductor production wafer, i.e. a wafer used in a manufacturing process for producing multiple chips on the wafer.
  • the term 'production wafer' is distinct from a 'test wafer' used in the calibration steps included in the method of the invention.
  • the production of the patterned layer includes a lithography step and an etching step, wherein the lithographic mask applied for producing the patterned layer is provided with one or more asymmetric marks which are design rule compatible, i.e. which are reproduced in the resist layer including fine elements of the marks.
  • the position of printed and etched mark features is sensitive to lithographic and etch parameters.
  • changes in these positions are measured by overlay measurements, i.e. the measurement of the change in position of one mark relative to another.
  • optical overlay measurement is fast, non-destructive and, since overlay is intrinsically a differential, isolation from variation in the layers underlying the patterns of interest can be achieved.
  • Current overlay measurement capability routinely exhibits single-Angstrom level precision.
  • the obtained 'pseudo' overlay data obtained on a Focus Exposure Matrix (FEM) wafer, possibly also including modulation of etch parameters, are fitted to a parametric model, while characteristic feature dimensions are measured on the FEM.
  • the inverted model allows determination of feature dimensions on a production wafer.
  • Application of the method on two different layers allows determination of edge placement errors between features of the two layers.
  • a method for determining dimensions of features in a patterned layer of a chip produced on a semiconductor wafer the production of the layer including a lithography step and an etching step, the lithography step including :
  • the preceding steps are the calibration steps of the method.
  • the following steps may be referred to as the 'production steps' of the method.
  • the calibration steps are performed once and result in the first and second parametric model and the inverted first model.
  • the production steps may be applied at a plurality of locations on a plurality of chips produced on one or more production wafers :
  • the position of a printed or etched asymmetric mark feature or a value representative thereof is preferably determined by determining the position of the centroid of the printed or etched mark pattern in the direction of asymmetry, or a position that is representative of said centroid position.
  • a value representative of the centroid position is for example a distance of the centroid to an offset position, which may be the position of the centroid of a symmetric or asymmetric offset mark pattern equally included in the litho mask.
  • a position representative of the centroid position for an asymmetric printed or etched mark pattern may be determined based on an intensity profile of an image of the mark pattern, in the direction of asymmetry.
  • the centroid-representative position may be obtained by integrating the intensity profile with respect to a reference intensity value and determining the centroid of the area between the reference intensity and the profile.
  • the marks comprise at least one pair of a symmetric mark and an asymmetric mark or at least one pair of oppositely oriented asymmetric marks, and wherein in the method step 'determining on one or more test wafers, the position or a value representative thereof, of the printed and/or etched mark features, for a plurality of different 'set' values of said lithographic and/or etch parameters', a value is determined that is representative of the position of the resulting pair of printed or etched mark features, said value being a function of the distance between said pair of printed or etched features, obtained by an overlay measurement, said value being termed a 'pseudo overlay response'.
  • said distance is determined as the distance between the centroids of the pair of oppositely oriented asymmetric marks or of the pair of a symmetric mark and an asymmetric mark.
  • the pseudo-overlay response may be a shift of the distance with respect to a reference value, or it may be distance itself.
  • said overlay measurement is an image based overlay (IBO) measurement.
  • the overlay measurement may be based on the determination of the centroid of an image of the asymmetric mark, for example obtained by determining the edges of an intensity profile across the mark in the direction of asymmetry.
  • the marks are arranged in one or more IBO targets, located within or in the vicinity of the patterned layer, and wherein one
  • IBO target comprises a plurality of different asymmetric marks and/or a plurality of reproductions of the same asymmetric mark in different orientations, allowing to obtain multiple pseudo-overlay responses as a function of the lithographic and/or etch parameters.
  • one or more of said IBO targets comprises one or more cross-shaped or wind-mill shaped clusters of reproductions of the same mark arranged around a central point.
  • said overlay measurement is a diffraction based overlay (DBO) measurement.
  • the marks are arranged in one or more DBO targets, located within or in the vicinity of the patterned layer, and wherein one DBO target comprises a pair of interleaved gratings, each grating formed of two marks (A,B) arranged adjacently and in a repeated manner, at least one of the marks (A,B) being an asymmetric mark, and wherein the distance between two adjacent marks A and B is different in the first grating compared to the second grating, the difference between said distances being pre-defined.
  • a DBO target comprises two of said pairs of interleaved gratings, the first pair being oriented perpendicularly to the second pair.
  • additional feature dimensions in the patterned layer of the production wafer are determined by interpolation of a plurality of the characteristic feature dimensions.
  • At least some of the asymmetric marks comprise mark features, which are dimensioned and/or arranged in a manner to optimize the type of response of the mark pattern's position or position-representative value to a change in one or more lithographic and/or etch parameters, so that at least one response exhibits a monotonic change as a function of one of the lithographic and/or etch parameters
  • the chip is produced multiple times on one or more semiconductor production wafers, and :
  • the determination of the characteristic feature dimensions is done on a chip produced on the one or more production wafers
  • the verification results are used to calculate updated values of the lithographic and/or etch parameters, the updated values being configured to maintain the characteristic feature dimensions within said tolerance,
  • the updated values are applied in the production of one or more subsequent chips.
  • the invention is furthermore related to a method for determining an edge placement error (EPE) between two features of two respective patterned layers of a semiconductor chip, comprising the steps of :
  • the lithographic masks for producing the two layers comprise respective parts of a hybrid target, the first part comprising marks provided in the first mask, the second part comprising marks provided in the second mask, and wherein the measurement of the overlay error between the first and second layer is obtained from an overlay value measured between printed and/or etched mark features resulting from the first and second parts.
  • the overlay error can be determined using either the relative layer-to-layer placement of symmetric marks on each layer or the relative layer-to-layer placement among the sum of the opposing asymmetric marks on each layer.
  • the chip is produced multiple times on one or more semiconductor production wafers, and :
  • the determination of the EPE is done on a chip produced on the one or more production wafers, based on the first and second parametric models determined by the calibration steps of the method,
  • the verification results are used to calculate updated values of the lithographic and/or etch parameters, the updated values being configured to maintain the EPE within said tolerance,
  • the updated values are applied in the production of one or more subsequent chips.
  • the lithographic parameters are the dose and defocus values and wherein the etch parameter is the etch bias.
  • the lithographic mask comprises one or more I BO targets as described in any of figures 4 to 10 and 16a, and any combination thereof, as well as any obvious variations thereof in terms of the number of marks, the number of mark types, the relative location of the marks with respect to each other, etc.
  • the invention is equally related to any I BO target applicable in the method of the invention, and in particular to the IBO targets described in this specification.
  • the invention is thus related to an IBO target comprising one or more cross-shaped or wind-mill shaped clusters of reproductions of the same mark arranged around a central point.
  • the invention is furthermore related to IBO targets as described in any of figures 4 to 10 and 16a, and any combination thereof, as well as any obvious variations thereof in terms of the number of marks, the number of mark types, the relative location of the marks with respect to each other, etc.
  • At least one of the I BO targets comprises a first group of asymmetric marks of which the uniform and periodic portions are arranged in a first direction, and a second group of the same asymmetric marks, of which the uniform and periodic portion are arranged in a second direction perpendicular to the first.
  • the invention is equally related to a DBO target applicable in the method of the invention, and in particular to the DBO targets described in this specification.
  • the invention is thus related to DBO targets as described in Figures 1 1 b, 1 1 c and Figures 12a and 12b, as well as any obvious variations thereof in terms of the number of marks, the number of mark types, the relative location of the marks with respect to each other, etc.
  • a DBO target according to the invention comprises a pair of interleaved gratings, each grating formed of two marks (A,B) arranged adjacently and in a repeated manner, at least one of the marks (A,B) being an asymmetric mark, and wherein the distance between two adjacent marks A and B is different in the first grating compared to the second grating, the difference between said distances being pre-defined.
  • a DBO target according to the invention comprises two of said pairs of interleaved gratings, the first pair being oriented perpendicularly to the second pair.
  • the invention is equally related to an apparatus for lithography and etching of features on a semiconductor wafer, wherein the apparatus comprises :
  • a metrology tool configured to determine the position of a printed mark pattern and an etched mark pattern obtained from an asymmetric metrology mark included in a lithography mask applied in the apparatus
  • a computer-implemented verification unit comprising a memory provided with a computer program for executing at least the following steps, when run on the verification unit :
  • o acquiring through the metrology tool a plurality of position-representative values associated respectively to a plurality of asymmetric marks, o calculating values of lithographic and/or etch parameters based on a first parametric model that links the position-representative values to said parameters,
  • the verification unit may furthermore be configured to update one or more of said lithographic and/or etch parameters, as required by the evaluation result.
  • the metrology tool may be an IBO tool or a DBO tool.
  • the verification unit may comprise a memory provided with a computer program for executing said steps, when the program is run on the verification unit.
  • the invention is also related to a computer program product applicable in the verification unit of the invention, and configured to execute said steps, when the program is run on the verification unit.
  • Figure 1 shows examples of symmetric and asymmetric marks that can be used in the method of the invention.
  • Figures 2a and 2b illustrate how a pair of a symmetric and an asymmetric mark or a pair of mirrored asymmetric marks can be used to measure a 'pseudo-overlay' value in the method of the invention.
  • Figures 3a and 3b illustrate how the centroid of a symmetric and an asymmetric mark may be determined by an image based overlay (IBO) tool.
  • IBO image based overlay
  • Figures 4 to 10 show various examples of IBO targets applicable in the invention.
  • Figure 1 1 a shows the known concept of a DBO target for the measurement of overlay errors.
  • Figures 1 1 b and 1 1 c show examples of the structure of gratings of a diffraction based overlay (DBO) target applicable in the method of the invention.
  • DBO diffraction based overlay
  • Figure 12a shows the layout of a DBO target adapted to determine a pseudo-overlay response.
  • Figure 12b shows an example of a DBO target designed for obtaining a response in 2 orthogonal directions.
  • Figure 13 shows pseudo-overlay data points as a function of dose and defocus for two different asymmetric marks, as well as the best fit of a parametric model based on the data points.
  • Figure 14 illustrates the duty cycle parameter on a comb-type metrology mark applicable in the invention.
  • Figure 15 illustrates an embodiment of the invention wherein the method is applied in two layers and the overlay between the layers is taken into account to determine an edge placement error between features in the two layers.
  • Figure 16a shows an IBO target according to the invention having marks on two different layers.
  • Figure 16b shows a DBO target according to the invention having marks on two different layers.
  • the lithographic mask used for the production of a patterned layer is provided with one or more metrology targets, each target comprising at least one asymmetric mark.
  • the target comprises at least one pair of a symmetric mark and an asymmetric mark, and/or one or more pairs of oppositely oriented, possibly mirrored asymmetric marks.
  • a 'mark' is defined as a predefined pattern designed for metrology purposes.
  • a target comprises one or more marks and is included inside or in the vicinity of the area of the mask that contains the actual pattern that is to be printed. Typical examples of symmetric and asymmetric marks are shown in Figure 1 , which illustrates marks of the comb type, both symmetric (fig.
  • asymmetric marks of this type are known as such, as well as the fact that features printed by lithography according to these patterns are sensitive to modulations of various lithography parameters.
  • the present invention applies this characteristic in a method that is applicable for monitoring lithographically printed features in a semiconductor chip production line, and also for monitoring features obtained after etching.
  • the symmetric and asymmetric marks applied in the method of the invention are required to be design rule compatible, meaning that the marks are dimensioned and designed so that fine-pitched features of the patterns, such as the fine-pitched teeth of the comb-type marks, can be transferred to a resist layer, so that the fine-pitched pattern can further be transferred to an underlying layer, by an etch process.
  • the asymmetric marks can be further segmented in the direction transverse to the comb or rail to maintain design rule compatibility on layers comprised of two-dimensional patterns; e.g., contact or block layers.
  • the two lithographic parameters that are used in the present patent specification for describing the invention are the dose and defocus values, de-focus being the deviation from a pre-defined zero-defocus setting on the exposure tool, expressed for example in nm. Dose is defined as the energy applied through the mask during exposure, expressed for example in mJ/cm 2 . Both defocus and dose are values that can be set on the lithography tool. These dose and defocus 'set' values are hereafter referred to as 'E se t' and 'F se t' respectively, or simply 'E' and 'F'.
  • the etch parameter used in the present description is the etch bias, which refers to the difference in the lateral dimension between the etched image and the lithographically printed image.
  • the determination of the etch bias E requires a well-defined lithographically printed feature.
  • a 'set' value of the etch bias is referred to in the present description as 'B se t' or 'B', expressed for example in nm.
  • the etch bias can be set by applying specific settings to control parameters during the etch process, like etch time, etch rate, voltage, chamber pressure etc. It is pointed out that other parameters may be used instead of or in addition to dose, defocus and etch bias.
  • the 'position of printed or etched mark features' obtained from an asymmetric mark is to be understood as the position of the centroid of the mark pattern obtained after litho or etch respectively, in the direction of asymmetry (i.e. the direction perpendicular to the longitudinal direction of the mark in the case of elongated marks as shown in the drawings).
  • the centroid is the center line of the integrated area of a mark pattern (either symmetric or asymmetric), i.e. the area covered by the printed or etched mark pattern is the same to the left and to the right of the centroid.
  • the position of a printed and/or etched asymmetric mark pattern is expressed in terms of the distance from the centroid of the mark pattern to an offset position that is either independent from the litho and etch parameters or that itself changes in a similar way as the mark pattern, as a function of said parameters.
  • the offset position is itself defined by a symmetric or an asymmetric mark included in the litho-mask.
  • the offset asymmetric mark may be the mirror image of the mark of which the position is being determined.
  • the target then comprises one or more mark pairs, designed for metrology purposes.
  • Figure 2a shows a target comprising a pair of a symmetric mark and an asymmetric comb-type mark.
  • Figure 2b shows a target comprising a pair of two mirrored asymmetric comb-type marks.
  • a view is shown at the top of the figures, of the as-designed shape of the marks, i.e. the distance S re f between the centroids of the two marks is the distance obtained when the marks are reproduced in an essentially perfect way by litho or etch : the width w of the mark, the pitch p, and the shape and dimensions of the comb features is exactly according to the design of the mark.
  • These 'perfect' process conditions are hereafter also referred to as the nominal process conditions.
  • these marks result in printed reproductions of the marks in a resist layer, i.e. printed mark features.
  • the marks are design rule compatible, they are equally reproduced after etching, for example in the form of trenches in a layer underneath the resist ('etched mark features').
  • the printed and etched reproductions depend on the process parameters such as E, F and B. When these parameters differ from the 'perfect' set of parameters, the dimensions of the reproduced mark patterns differ from the as- designed values, as is illustrated in Figure 2b.
  • the position of the centroid of a printed or etched symmetric mark pattern is nevertheless insensitive to changes in E, F and B, as a consequence of the symmetry.
  • the position of asymmetric marks is determined by detecting and measuring the shift ⁇ or 2 ⁇ by metrology tools known as such in the art for measuring overlay errors, i.e. measurements for determining the shift between two different layers produced by different lithographic masks and caused by an overlay error between the masks applied for printing the two layers.
  • overlay errors i.e. measurements for determining the shift between two different layers produced by different lithographic masks and caused by an overlay error between the masks applied for printing the two layers.
  • the measured shift is referred to in the present context as a 'pseudo-overlay value' or 'pseudo-overlay response', as the value responds to (is sensitive to) the litho and etch parameters used for printing and etching the mark features.
  • the pseudo-overlay response will hereafter be expressed by the letter ' ⁇ '. Instead of the shift ⁇ or 2 ⁇ , the distance S itself can be measured and used as a 'pseudo-overlay response'.
  • the pseudo-overlay response is a value 'representative of the position' of a printed and/or etched asymmetric mark pattern, in the words of the appended claims.
  • the pseudo overlay response can be measured by image based overlay (I BO) tools or diffraction based overlay (DBO) tools. These tools are known per se for the measurement of overlay errors. The layout of the marks will be different in each case as will be explained hereafter.
  • An IBO target applicable in the method and apparatus of the invention consists of a plurality of marks of the types as shown in Figures 2a and 2b, distributed across the field of view (FOV) of the IBO tool.
  • the printed features have an overall width "w" that is resolvable by the IBO tool.
  • "w” may be of the order of 500nm.
  • the fine comb structure has a pitch "p" that is not resolvable by the I BO tool, e.g., "p" is in the order of 100nm.
  • the IBO tool is thus able to determine the relative distance between the centroids of the target features, as illustrated in Figures 3a and 3b which illustrate the image as seen by the IBO tool of a symmetric mark pattern and an asymmetric comb-type mark pattern, as well as the intensity profile as a function of the position in the direction perpendicular to the mark pattern.
  • a more accurate way of determining the centroid position is by integrating the intensity profile with respect to a reference value l re f, i.e. calculating the area between l re f and the intensity profiles, and determining the centroid of the profiles, i.e. the location of the centroid line so that the calculated areas to the left and right of the line are the same.
  • the centroid position is based on the image, it may differ from the mathematical centroid position of the printed or etched mark pattern as defined above in relation to Figures 2a and 2b.
  • the measured shift ⁇ or 2 ⁇ of the image centroid will however be proportional to the mathematical centroid shift when measured by the IBO tool.
  • Metrology targets comprising at least one pair of oppositely oriented asymmetric marks or a pair of a symmetric mark and an asymmetric mark, as shown in Figures 2a and 2b, are hereafter referred to as IBO targets.
  • Figure 4 shows an IBO target that takes up a minimal portion of the printed or etched area.
  • the area of the printed target may be about 2 square microns.
  • the target comprises two marks 1 and 1 ' of the same asymmetric design and rotated 180° one with respect to the other.
  • the marks may be any of the asymmetric types shown in Figure 1 .
  • the asymmetry of the marks is illustrated in a symbolic way by a distinct hatching type of portions 2 and 3 to indicate a pattern density gradient across the two regions. For example, for a comb type mark, portion 2 is a full rectangle and portion 3 is an array of comb features.
  • the marks are positioned side by side along their longitudinal direction (i.e. the direction of the dividing line between the differing pattern densities of portions 2 and 3).
  • Figure 4a shows the as-designed printed or etched marks
  • the distance between the centroids is S re f.
  • a shift 2 ⁇ between the centroids can be detected by an optical IBO tool (see Figure 4b).
  • IBO targets are illustrated in Figures 5 and 6. They comprise two pairs of mutually oppositely oriented asymmetric marks 4/4' and 5/5', arranged in a windmill pattern (Fig. 5) or a cross pattern (Fig. 6). The four marks are all reproductions of the same mark design. The centroid shift 2 ⁇ can thereby be measured in two orthogonal directions x and y. It is seen that the four centroids of the four marks form a rectangle with a fixed center Oc, regardless of whether the nominal process conditions (Fig. 5a and 6a) or perturbed process conditions (Fig. 5b and 6b) are applied.
  • This characteristic namely the fact that the point Oc is fixed in a particular layer, can be used to detect an overlay error between two layers applied in the process.
  • the I BO tool can detect the shift of the point Oc between the two layers, and thereby detect an overlay error in two orthogonal directions.
  • the midpoint (line) between the centroids in the target of Figure 4 is a fixed line, and can thus be used to determine overlay errors in one direction.
  • the area of printed/etched surface taken up by the targets of Figures 5 and 6 may be about 4 square microns.
  • Figure 7a shows yet another IBO target formed by a mark cluster as printed under nominal conditions.
  • the design is a windmill cluster of asymmetric marks of the same design, but this time each of the two pairs of marks 6/6' and 7/7' extending in x and y direction respectively are formed of 2 marks (6 and 6' for one pair and 7 and 7' for the second pair) which have the same orientation.
  • Figure 7b when the process is perturbed ( Figure 7b), the center Oc of the rectangle formed by the centroids shifts to a new position Oc'.
  • a 180° oriented version of the windmill cluster of Figure 7a is required.
  • Figure 8a shows a target design comprising the cluster 10 of Figure 7a repeated in the upper right and lower left quadrant of the target layout, and a 180° rotated version 10' of said cluster in the two remaining quadrants (upper left and lower right).
  • This target allows to measure the centroid shifts in two directions by measuring the relative movement of the center points Oci with respect to the center points Oc2.
  • the center point of the four clusters OD however remains fixed regardless of perturbations from the nominal process, and can thus be used for actual overlay measurements between printed/etched layers in the manner described above.
  • Figure 9 finally shows a similar target design as in Figure 8, but wherein two different mark types M1 and M2 are applied, for example a comb type and a rail type, thereby allowing to distinguish two different E,F,B responses in x and y (so in fact four pseudo-overlay responses in total).
  • the center point OD is again usable for overlay measurements.
  • Figure 10 shows a further example of an I BO target applicable in the method of the invention.
  • the marks included in the IBO target shown are arranged in a matrix of 24 x- and y-directed crosses that fits within the field-of-view (FOV) of the IBO tool, where the FOV center is denoted by a unique pattern recognition mark 15.
  • FOV field-of-view
  • Asymmetric mark-crosses A1 , A2, A3 and A4 are identified in Figure 10, as well as symmetric mark-crosses S1 and S2.
  • Each of the asymmetric mark-crosses A1 -A4 comprises 4 identical marks (i.e. reproductions of the same mark design) oriented so that the center point of the cross shifts as a function of the process parameters (as in Figure 7). But the marks in the four crosses A1 -A4 are all distinct. It is seen that the asymmetry of the asymmetric marks A1 -A4 in the upper right (UR) and lower left (LL) target quadrants is opposite to that of the marks in the upper left (UL) and lower right (LR) target quadrants.
  • a set of 4 crosses consisting of marks of a particular asymmetric design (for example the 4 A1 crosses in the four quadrants) then defines a specific (E, F, B) response in both x and y.
  • An advantage of the IBO target is that it enables the simultaneous capture of multiple (E, F, B) responses within one target.
  • the two sets of symmetric marks S1 and S2 are usable as a reference. This leaves the 4 sets of 4 asymmetric marks A1 -A4, usable to differentiate 4 different (E, F, B) responses in both x and y direction (i.e. 8 pseudo-overlay responses).
  • FIG. 1 a shows the layout of a DBO overlay target as known in the art, formed of an arrangement of optically distinct elements (A,B) in an interlaced diffraction grating configuration with a pitch "P", typically on the order of 500-1 OOOnm.
  • a first grating consisting of elements A is interlaced with a second grating consisting of elements B.
  • P typically on the order of 500-1 OOOnm.
  • a DBO target applicable in the invention comprises a similar interlaced grating configuration, but with elements A and B included in the same lithographic mask.
  • elements A and B are referred to hereafter as 'marks'.
  • at least one of the marks A or B is asymmetric in the sense described above.
  • Figures 1 1 b and 1 1 c show two examples of the layout of a DBO target applicable in the invention. In the first example (Fig.
  • mark A is symmetric and mark B is asymmetric : it is a comb mark comprising a fine structure arranged at a maximum pitch p « P that precludes diffraction induced by the fine structure itself, which could confound or detract from the diffraction from the grating elements at the coarse pitch P.
  • Figure 1 1 c shows an example where both A and B are asymmetric.
  • a and B cannot be mirror images however : they must have dimensions sufficiently different to cause a measurable difference in the plus and minus first order diffracted intensity.
  • the marks applied in at least one grating must be asymmetric in order for patterning process conditions (E, F, B) to induce a relative movement of the centroids C of the asymmetric marks B of one printed and/or etched grating with respect to the centroids C of the marks A of the symmetric grating (Fig. 1 1 b) or with respect to the centroids C of the marks A of the opposing asymmetric grating (Fig. 1 1 c).
  • Such relative movements cause a proportional change in the relative intensity of the plus and minus first order diffraction from the gratings.
  • a DBO tool can measure an (E, F, B) response by measuring that intensity difference on a printed or etched version of the DBO target, formed of the gratings comprising the printed or etched marks A and B.
  • a DBO target is provided (see Figure 12a) that comprises two gratings 30 and 31 formed by the same marks A and B but with a well-defined difference in the distance between two adjacent marks A and B.
  • the period P is the same for both gratings 30 and 31 .
  • the 'as designed' distance between the centroids of two adjacent marks A and B is 0.5P + AD.
  • this distance is 0.5P - AD.
  • ⁇ ⁇ ( ⁇ + ⁇ 2 )/( ⁇ - ⁇ 2)
  • a typical DBO target layout is shown in Figure 12.
  • the target comprises two pairs of gratings.
  • the first pair 35,36 has marks A and B with the direction of asymmetry of the asymmetric mark B in the x -direction and with the shifts +AD and - AD applied between the positions of marks A and B (i.e. identical to the gratings 30 and 31 of Figure 12a).
  • the second pair 37,38 are the same as 35,36 but rotated over 90°.
  • the set of 4 gratings is therefore designed to measure one (E,F,B) response in x and y direction (i.e. two pseudo-overlay responses ⁇ , one in x and one in y direction).
  • DBO targets therefore have the disadvantage compared to IBO targets that they require a larger area of the mask if multiple responses in multiple orientations are required.
  • a lithographic mask for producing a given pattern is provided with one or more IBO and/or DBO targets as described above, each target providing one or more (E,F,B) responses in the form of pseudo-overlay values O1 to O n . .
  • E,F,B pseudo-overlay values
  • a calibration procedure is performed. The procedure will be described in detail for the calibration with regard to dose and defocus only, but the method is analogous when the etch bias is included.
  • an I BO target may be provided that permits the measurement of a total of n pseudo overlay values Oi...O n (for example 4 in x direction and 4 in y direction in the case of the target of Figure 10), which are a function of dose and defocus settings.
  • n pseudo overlay values Oi...O n for example 4 in x direction and 4 in y direction in the case of the target of Figure 10
  • FEM Focus Exposure Matrix
  • the de-focus value may be incremented in constant steps for a number of constant dose settings, the latter equally being incremented in constant steps.
  • the ranges for the dose and defocus settings may be based on preliminary simulations for example.
  • the values of Oi...O n are measured in an overlay measurement tool as described above. This results in a data set wherein Oi...O n can be set out as data points in a graph, as a function of E and F.
  • the dimensions of a number of features within the printed pattern are equally measured in each print on the FEM wafer. These features are selected within the pattern, preferably in the vicinity of the target or targets. Features are selected which determine the functionality of the chip, i.e. when these features are not produced according to a predefined manufacturing specification, the chip will or is very likely to malfunction. In the present specification, these selected features are referred to as 'characteristic features'. Alternatively or in addition to the measurement of characteristic feature dimensions on the printed pattern, the dimensions may be measured after etching the pattern at a given value of the etch bias. These dimensions may be measured by any suitable technique, such as SEM, AFM or the like. A total of m of these measurements yields a set of data CDi...CD m , as a function of E and F.
  • a first parametric model is then fitted to the pseudo overlay data Oi...O n .
  • the dose and defocus values are labeled 'E ge t' and 'F ge t' in order to distinguish them from the 'set' values applied initially.
  • the 'get' values are the dose and focus values derived from overlay measurements on a particular target.
  • E ge t and F ge t may differ from the set values due to the model approximation and due to other factors such as measurement noise, process variation on the FEM wafer that maps onto effective dose/focus or errors in the dose/focus settings.
  • the inverted first model and the second model are subsequently used for determining dimensions of the characteristic features on a production wafer, i.e. during the production of a chip comprising a layer that is printed and etched using the same mask, including the same targets used in the calibration.
  • the n overlay values Oi...O n are measured by an overlay tool. These values are used for calculating E g et and F ge t using the inverted first parametric model, which are subsequently entered in the second parametric model to calculate the characteristic feature dimensions CDi(Eget,Fget)...CD m (Eget,Fget) on the production chip.
  • the feature dimensions are thereby determined without requiring potentially destructive measurements such as SEM and AFM on the production chip.
  • the etch bias B is taken into account as a parameter in the model, the above-described methodology is the same.
  • the calibration data as a function of B will need to be gathered on the same or further FEM wafers, onto which the previously produced resist patterns are transferred by etching into an underlying layer.
  • the settings of the etch tools are configured so that each die or each group of dies is etched with a different etch bias B.
  • Measurement of the pseudo-overlay of the FEM wafer(s) after etching now yields a data set of Oi...O n as a function E,F and B.
  • a parametric model can be fitted to these data in an analogue manner as described above.
  • a 'first parametric model' can then be built as a function of dose and defocus based on the pre-etch pseudo overlay and another 'first parametric model' can be built based on the post-etch data, as a function of dose, defocus and etch bias.
  • Another embodiment would entail basing the calibration on the etch bias B only, and not on E and F.
  • the characteristic feature dimensions CDi...CD m may be measured on the printed pattern or on the etched pattern or on both. When measured on both, the second parametric model will in fact be determined both for the printed features and for the etched features.
  • any number of other lithography and etch parameters can be used in the method.
  • systematic conditions that affect imaging in resist such as aberration of lens systems and scan stability in the litho tool, resist thickness and bake plate temperature in the resist processing tool, as well as systematic conditions that affect the transfer of the resist image by etch, such as the pressure, voltage, gas mix of the etch reactor and pattern loading effects on the wafer.
  • the characteristic feature dimensions obtained on the production chip by the method of the invention may be fed back to a control unit incorporated in or connected to the lithographic and/or etching tools applied in the production process, where they are verified on the basis of a given manufacturing tolerance with respect to theoretical values.
  • the verification allows the calculation of updated values of the processing parameters used in the first and second parametric models (E,F,B preferably). These updated values allow to ensure that the characteristic dimensions on subsequent production chips stay within the manufacturing tolerance.
  • Any know control algorithm and control hardware may be applied for realizing the above-described control strategy.
  • the control strategy is preferably applied by performing the feedback and update of the processing parameters on the basis of sample measurements rather than on measurements taken on each chip on the production wafer, i.e. the characteristic dimensions are determined by the method of the invention on a limited number of chips, each determination allowing updating the processing parameters applied in producing one or more subsequent chips.
  • Figure 13 shows a data set obtained from an
  • I BO target having two different asymmetric marks, a comb pattern as shown in Figure 1 (b) and a dagger pattern as shown in Figure 1 (c).
  • overlay measurements Oc and OD are obtained by measuring the pseudo overlay between mirrored comb patterns and mirrored dagger patterns respectively.
  • the data in Figure 13 are shown as a function of normalized 'set' dose and defocus values E and F.
  • the dots show the overlay data measured on a FEM wafer, the upper data sets being obtained from the comb-type marks and the lower data sets being obtained from the dagger-type marks.
  • the curves show the best fit for a arametric model of the following form :
  • the calibration procedure is preferably done for a plurality of targets distributed across the area of a printed pattern, i.e. each target allows to determine a set of overlay measurements Oi ...O n which are fitted to the set E/F and/or B values to yield a parametric model.
  • Characteristic feature measurements CDi ...CD m are made in the vicinity of each target.
  • the model parameters the parameters a mn , b mn and Fo in the above example
  • the characteristic feature dimensions derived from overlay measurements on the production wafer can then be used to determine feature dimensions of any number of pattern features by linear interpolation between feature dimensions determined by the method of the invention.
  • the invention requires that the measured shifts over the lithography energy-focus process window be sufficiently distinct and continuous (low-order) to enable unique inversion using analytical or numerical techniques; i.e., the responses of two or more marks must be transformable to physically meaningful dose and focus values. Meeting this condition requires the identification of an appropriate set of marks during process setup. Marks typically exhibit a monotonic, substantially linear response to dose, but a more complex an variable focus response. Thus, mark selection usually devolves to the evaluation and identification of distinguishable focus response.
  • the inventors have studied the influence of the mark shape and dimensions on the quality of the parametric model that links the pseudo-overlay values to dose and focus (E and F).
  • the pseudo-overlay response of the dagger-type mark in the X-direction is a parabolic function.
  • the peak of the parabola indicates an optimum focus for the dagger mark.
  • the comb-type mark exhibits a monotonic response to focus, however the data points show deviations from the linear model.
  • the response of both the dagger and comb marks as a function of dose is monotonic and substantially linear.
  • a monotonic response is not required for all responses, but it can make the inversion task more straightforward and ensure uniqueness. What is required are two distinct realizable responses that enable unique inversion. This requirement is satisfied by a monotonic dose response and a parabolic focus response paired with a monotonic dose response and a monotonic focus response (as illustrated above). It could also be satisfied by a monotonic dose response and a parabolic focus response having one vertex focus paired with a monotonic dose response and a parabolic focus response having a substantially different vertex focus.
  • the set of marks needed to realize the inventive method must be optimized for the lithography exposure conditions.
  • a preferred embodiment applies at least one target comprised of comb and dagger marks that cover a range of duty cycle and pitch tailored to the lithographic exposure condition.
  • I BO targets are well suited to this optimization method because multiple marks can be evaluated simultaneously in a single target.
  • the asymmetric marks comprise mark features (for example legs of the comb), which are dimensioned and/or arranged in a manner to optimize the type of response of the mark pattern's position to a change in one or more process parameters, so that at least one response exhibits a monotonic change as a function of one of the process parameters.
  • the invention is equally related to a method for estimating edge placement errors between pattern features of two different layers in a layered structure of a semiconductor chip, for example between consecutive layers applied in the back end of line process.
  • Figure 15 shows a detail of two superimposed patterns, each having a line feature 16 and 16' respectively.
  • the line features are shown with respect to the as-designed features 17 and 17'.
  • Each of these features 16/16' is produced using a separate litho and etch step, i.e. with two different masks and with a potential overlay error between the two.
  • the dimensions CDi and CD2 are determined in each layer by the above-described method, i.e. after lithography and/or after etching.
  • a target comprising one or more asymmetric marks is provided allowing the measurement of Oi ...O n after the litho and/or etching steps, the calculation of E g et Fget Bg e t, and the subsequent calculation of CDi and CD2 as a function of the respective E g et Fget B g et values. Then a 'real' overlay measurement is done between a symmetric mark in the first layer and a symmetric mark in the second layer. A pair or a cluster of mirrored asymmetric marks can thereby be used as a symmetric mark, as mentioned in relation to Figures 4-9 (the measurement of the position of Oc or OD in the two layers yields the overlay value).
  • Figure 16a shows a hybrid I BO target arranged in a matrix of 48 x- and y-directed crosses that fits within the field-of-view (FOV) of the I BO tool.
  • 24 crosses are in the central area 18 and 24 are in the surrounding area 19.
  • the central area 18 may for example have the layout shown in Figure 10.
  • Preferably the same marks are used in the two areas.
  • the crosses in the central area are included in the litho-mask for producing a first layer, and the crosses in the surrounding area are included in the litho-mask for producing a second layer.
  • Each mask thus has 4 sets of asymmetric marks, allowing the determination of ⁇ 1... ⁇ 4 in each layer and in each direction x and y.
  • the shift can be measured of one symmetric mark in the first layer with respect to the same symmetric mark in the second layer, or the shift can be measured of one pair of mirrored symmetric marks in the first layer to the same pair of mirrored asymmetric marks in the second layer.
  • Figure 16b shows a DBO target distributed over two layers, i.e. distributed over two litho-masks for producing the two layers.
  • the targets 20/21 on the left yield two different E/F/B responses in layer 1 in both x and y.
  • These targets are each formed of four gratings, in the same way as shown in Figure 12b, i.e. two pairs of gratings formed of the same marks A and B, one pair oriented in x and the other pair oriented in y, each pair comprising two gratings with the same marks A and B but with the distance between adjacent marks A and B shifted respectively over +AD and -AD.
  • the marks A and B used in target 20 are different than the ones used in target 21 , for example target 20 is formed of symmetric marks A and asymmetric comb marks B, while target 21 is formed of symmetric marks A and asymmetric rail marks B. So in total, the marks 20 and 21 allow to determine four pseudo-overlay responses ⁇ 1... ⁇ 4 in the form of ⁇ -values as defined with respect to Figure 12a : 2 overlay values in x direction (respectively the ⁇ -values of the x-oriented gratings in marks 20 and 21 ) and 2 in y direction (respectively the ⁇ -values of the y-oriented gratings in marks 20 and 21 .
  • the targets 22/23 on the right yield two different E/F/B responses in layer 2 in both x and y, i.e. four pseudo overlay responses ⁇ 1 . . . ⁇ 4.
  • Targets 22 and 23 are preferably identical to the targets 20 and 21.
  • the central target 24 comprises gratings with elements A and B which are symmetric but which are partially in the first layer and partially in the second layer (as in Figure 1 1 a). An overlay measurement between the two layers based on this target 24 thereby allows to measure the overlay error OVL between the layers.
  • the edge placement error determined in the above-described way may equally be used in a control strategy for determining updated values of the litho and/or etch parameters based on a manufacturing tolerance, configured to maintain the edge placement error within said tolerance.
  • the EPE determination according to the invention is preferably done on a sample number of chips produced on a production wafer, allowing an update of processing parameters in the process for producing one or more subsequent chips.
  • the method is not limited to the use of the pseudo-overlay values as such a parameter. Any parameter that is sensitive to the position of a printed or etched asymmetric mark can be used in the method of the invention, as long as it allows to determine invertible first and second parametric models in the manner described above.
  • the invention is equally related to an apparatus for lithography and etching of features on a semiconductor wafer, wherein the apparatus comprises a metrology tool configured to determine the position of a printed mark pattern and an etched mark pattern obtained from an asymmetric metrology mark included in a lithography mask applied in the apparatus.
  • the metrology tool may comprise an I BO or DBO based overlay tool as described above, configured to measure a 'pseudo-overlay' value or a value equivalent thereto, that is representative of the position of the asymmetric mark pattern.
  • the apparatus furthermore comprises a computer- implemented verification unit comprising a memory provided with a computer program for executing at least the following steps, when run on the verification unit :
  • the verification unit is furthermore configured to update one or more of said lithographic and/or etch parameters, as required by the evaluation result.

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Abstract

L'invention concerne un procédé et un appareil permettant de déterminer les dimensions de caractéristiques dans une couche à motifs d'une puce produite sur une tranche de production de semi-conducteurs, c'est-à-dire une tranche utilisée dans un processus de fabrication pour produire des puces multiples sur la tranche. La production de la couche à motifs comprend une étape de lithographie et une étape de gravure, le masque lithographique appliqué pour produire la couche à motifs étant pourvu d'une ou de plusieurs marques asymétriques. La position des marques imprimées et gravées est sensible aux paramètres de lithographie et de gravure. Selon des modes de réalisation préférés, les changements de ces positions sont mesurés par des mesures de superposition, c'est-à-dire la mesure du changement de position d'un repère par rapport à un autre. Les 'pseudo' données de superposition obtenues sont adaptées à un modèle paramétrique, tandis que les dimensions caractéristiques sont mesurées sur une tranche de test. Le modèle inversé permet de déterminer les dimensions des caractéristiques sur une tranche de production. L'application du procédé sur deux couches différentes permet de déterminer les erreurs de positionnement des bords entre les caractéristiques des deux couches.
PCT/EP2017/064145 2016-06-10 2017-06-09 Procédé et appareil de métrologie pour un procédé de fabrication de semi-conducteurs WO2017212035A1 (fr)

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US16/308,363 US10481504B2 (en) 2016-06-10 2017-06-09 Method and apparatus for semiconductor manufacturing
CN201780035477.5A CN109313392B (zh) 2016-06-10 2017-06-09 用于半导体制造工艺的计量方法和装置
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JP6753958B2 (ja) 2020-09-09
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US20200050112A1 (en) 2020-02-13
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US10481504B2 (en) 2019-11-19
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