WO2017206966A1 - 一种自动光学检测装置及方法 - Google Patents

一种自动光学检测装置及方法 Download PDF

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Publication number
WO2017206966A1
WO2017206966A1 PCT/CN2017/095222 CN2017095222W WO2017206966A1 WO 2017206966 A1 WO2017206966 A1 WO 2017206966A1 CN 2017095222 W CN2017095222 W CN 2017095222W WO 2017206966 A1 WO2017206966 A1 WO 2017206966A1
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Prior art keywords
detector
light source
detectors
tested
synchronization controller
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PCT/CN2017/095222
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English (en)
French (fr)
Inventor
陆海亮
贾俊伟
张鹏黎
周红吉
徐文
王帆
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上海微电子装备（集团）股份有限公司
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Priority to KR1020187037087A priority Critical patent/KR102244254B1/ko
Priority to US16/306,433 priority patent/US11549891B2/en
Publication of WO2017206966A1 publication Critical patent/WO2017206966A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0162—Arrangements or apparatus for facilitating the optical investigation using microprocessors for control of a sequence of operations, e.g. test, powering, switching, processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8838—Stroboscopic illumination; synchronised illumination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896—Circuits specially adapted for system specific signal conditioning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/062—LED's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/069—Supply of sources
    • G01N2201/0694—Microprocessor controlled supply
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/069—Supply of sources
    • G01N2201/0696—Pulsed

Definitions

  • the present invention relates to the field of semiconductor detection, and in particular to an automatic optical detection apparatus and method.
  • Automated optical inspection (AOI, English full name: Automatic Optical Inspection) technology enables fast, high-precision, and damage-free detection of wafers, chips, or other objects to be tested.
  • This technology is widely used in PCBs, IC wafers, LEDs, and TFTs. And many fields such as solar panels.
  • the automatic optical detection technology generally uses a high-precision optical imaging system to image the object to be measured, and the workpiece stage carries the object to be tested for high-speed scanning to achieve high-speed measurement; the system compares the scanned image with the ideal reference image, or through feature extraction, etc. The surface defects of the object to be tested are identified.
  • the system first performs photo training on the surface image of the silicon wafer to generate an ideal image for defect detection to compare with the image actually captured during the scanning detection process to identify the defect.
  • the workpiece table drives the silicon wafer to move at high speed.
  • the detector scans the silicon wafer.
  • the screen is switched to the dark field illumination, and the detector scans the silicon wafer again.
  • the same detector is used for both scans.
  • the timing diagram is shown in Figure 1, so that each The silicon chip needs to be scanned twice, right For the entire silicon wafer, it is bound to cause a decrease in the detection speed, which increases the detection time, resulting in a decrease in detection efficiency.
  • the performance of the current detector (mainly the frame rate) In other words, continuous double exposure cannot be performed in a very short period of time, further limiting the detection efficiency.
  • the invention provides an automatic optical detecting device and method to solve the above technical problems.
  • an automatic optical detecting device for detecting an object to be tested carried on a workpiece table, including:
  • a synchronization controller connected to the plurality of detectors and the plurality of light source signals, wherein the synchronization controller is configured to directly or indirectly control the plurality of detectors and the plurality of light sources according to the position of the object to be tested Turning on and off according to a certain timing, so that each detector can perform image acquisition on the object to be measured in the illumination mode provided by the corresponding light source, and only one corresponding to the light source during the period in which each light source is illuminated. The detector is on.
  • the synchronization controller is further connected to the workpiece table signal, and the position of the object to be tested is obtained according to a first signal sent from the workpiece table to the synchronization controller.
  • the automatic optical detecting device further comprises a main control computer, wherein the main control computer is respectively connected with the plurality of detectors, the plurality of light sources, the workpiece table and the synchronization controller.
  • the synchronization controller is configured to send a plurality of second signals to the plurality of detectors to control the opening and closing of each of the detectors, respectively.
  • the synchronization controller is further configured to send the plurality of third signals to the plurality of light sources to Control the opening of each light source separately.
  • the detector can send a fourth signal to the synchronization controller, and the synchronization controller receives the fourth signal and sends a third signal to the corresponding light source to trigger the light source to be turned on.
  • the detector can emit a fourth signal to the corresponding light source to trigger the light source to turn on.
  • the plurality of light sources comprise at least two of a bright field illumination source, a dark field illumination source, and an infrared source.
  • the light source is a pulsed light generating device, such as a flashing LED or a flashing Xe lamp.
  • the infrared light source uses an infrared LED with a wavelength of 780 nm or more.
  • the object to be tested is a silicon wafer, an LED substrate or a TFT panel.
  • the number of the plurality of detectors is the same as the number of the plurality of light sources.
  • the invention also provides an automatic optical detecting method for detecting an object to be tested carried on a workpiece table, comprising:
  • the synchronization controller Directly or indirectly controlling, by the synchronization controller, the plurality of detectors and the plurality of light sources to be turned on and off according to a certain timing according to the position of the object to be tested, so that each detector can be provided at a corresponding light source.
  • the image to be measured is imaged, and during the period in which each of the light sources is illuminated, only one detector corresponding to the light source is turned on.
  • the automatic optical detection method comprises the following steps:
  • the synchronization controller sends a second signal to the first detector of the plurality of detectors, triggering the first detector to be turned on;
  • the synchronization controller sends a third signal to the first one of the plurality of light sources, the first light source emits a first pulse light in an open state of the first detector, and the first detector obtains the object to be tested An image illuminated by the first source;
  • the synchronization controller sends another second signal to the second detector of the plurality of detectors to trigger the second detector to be turned on;
  • the synchronization controller sends another third signal to the second one of the plurality of light sources, and the second light source emits the second pulse light in the open state of the second detector, the second The detector obtains an image of the object to be tested under illumination of the second light source;
  • the workpiece table carries the object to be tested to move to the next measurement position and sends another first signal to the synchronization controller, and repeats the above steps S2-S6 until the plurality of detectors are collected at all measurement positions.
  • the image of the object under illumination of the corresponding source is the workpiece table carries the object to be tested to move to the next measurement position and sends another first signal to the synchronization controller, and repeats the above steps S2-S6 until the plurality of detectors are collected at all measurement positions. The image of the object under illumination of the corresponding source.
  • the automatic optical detection method further includes providing a main control computer separately connected to the plurality of detectors, the plurality of light sources, the workpiece stage, and the synchronization controller; and setting the synchronization by the main control computer The parameters of the controller, the parameters of the plurality of detectors, the brightness of the plurality of light sources, and the movement of the workpiece table.
  • the automatic optical detection method comprises the following steps:
  • the synchronization controller sends a second signal to the first detector of the plurality of detectors, triggering the first detector to be turned on;
  • the first detector sends a third signal to the first light source, triggering the first light source to emit the first pulse light in the open state of the first detector, and the first detector obtains the object to be tested in the first light source.
  • the image under the light
  • the synchronization controller sends another second signal to the second detector of the plurality of detectors to trigger the second detector to be turned on;
  • the workpiece table carries the object to be tested to move to the next measurement position and sends another first signal to the synchronization controller, and repeats the above steps S2-S6 until the plurality of detectors are collected at all measurement positions.
  • the image of the object under illumination of the corresponding source is the workpiece table carries the object to be tested to move to the next measurement position and sends another first signal to the synchronization controller, and repeats the above steps S2-S6 until the plurality of detectors are collected at all measurement positions. The image of the object under illumination of the corresponding source.
  • the automatic optical detecting apparatus and method provided by the present invention directly or indirectly control a plurality of detectors and a plurality of light sources to be turned on and off according to a certain timing according to the position of the object to be tested by using a synchronization controller, so that Each detector is capable of image acquisition of the object to be measured in an illumination mode provided by the corresponding light source, and during which each of the light sources is illuminated, only one detector corresponding to the light source is turned on.
  • detection under a plurality of different measurement configuration conditions can be realized in one scan measurement process, thereby greatly improving the detection efficiency.
  • 1 is a timing diagram of a conventional automatic optical detection method
  • FIG. 3 is a schematic structural view of an automatic optical detecting device according to Embodiment 1 of the present invention.
  • FIG. 4 is a structural diagram of a synchronous control system according to Embodiment 1 of the present invention.
  • FIG. 5 is a timing diagram of an automatic optical detection method according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic structural diagram of an automatic optical detecting device according to Embodiment 2 of the present invention.
  • FIG. 7 is a schematic structural diagram of an automatic optical detecting device according to Embodiment 3 of the present invention.
  • FIG. 8 is a timing diagram of an automatic optical detection method according to Embodiment 3 of the present invention.
  • Figure 3-7 101-workpiece table, 102-object to be tested, 103-beam splitter, 104-relay objective, 111, 112, 113-detector, 121, 122, 123-flashing light source, 131-ming Field illuminator, 132-dark field illuminator, 140-synchronous controller, 141-master computer.
  • the automatic optical detecting device provided by the present invention includes:
  • the workpiece table 101 can reach a predetermined position after the first synchronization signal S0 can be issued;
  • the number of the detectors is two, which are respectively a first detector 111 and a second detector 112.
  • the detectors 111 and 112 can respectively receive the second synchronization signal S1. S2 and perform image acquisition;
  • the number of light sources is the same as the number of detectors, and the light source emits a light beam having a predetermined illumination duration under the control of the control signal.
  • a scintillation light source may be employed in the present embodiment for emitting pulsed light under the control of a control signal.
  • the two light sources are the first light source 121 and the second light source 122, wherein the first light source 121 is a bright field illumination source, and is matched with the bright field illuminator 131. Illumination in bright field configuration, second light The source 122 is a dark field illumination source, and the dark field illuminator 132 is configured to perform illumination in a dark field configuration.
  • the light sources 121 and 122 can receive the third synchronization signals S3 and S4 and emit pulsed light respectively.
  • the embodiment adopts The plurality of beam splitting mirrors 103 combine and separate the two light sources.
  • a relay objective lens 104 may be disposed between the plurality of beam splitting mirrors 103.
  • the arrangement of the beam splitting mirror and the relay objective lens and the effect on changing the direction of beam propagation are common technologies in the art, and do not involve the core content of the present invention, so they are not developed one by one;
  • the synchronization controller 140 receives the first synchronization signal S0 sent by the workpiece table 101, and sends second synchronization signals S1, S2 to the detectors 111, 112, and to the light sources 121, 122
  • the third synchronization signals S3, S4 are issued to control the above-mentioned light sources 121, 122 and the detectors 111, 112 to achieve synchronous measurement, so that each detector corresponds to the image of the corresponding light source illumination.
  • the invention uses at least two sets of light sources and detectors, and each set of light sources and detectors are simultaneously used for imaging detection under different measurement configuration conditions.
  • the scan timing diagram is as shown in FIG. 2 It is shown that the first detector 111 is first turned on for image detection, during which the first light source 121 is turned on to realize exposure measurement in the first measurement configuration. After the first light source 121 is exposed, the delay is extremely short, and the second detector 112 is turned on to perform image detection. After the image integration of the first detector 111 is completed, that is, after the first detector 111 enters the off state, the second light source is turned on. 122. Exposure measurement under the second configuration condition is achieved by the second detector 112.
  • the first detector 111 measures an image illuminated when the first light source 121 is turned on; the second detector 112 measures an image illuminated when the second light source 122 is turned on.
  • the two light sources 121, 122 respectively correspond to different optical measurement configurations, so that with the present invention, images in two different measurement configurations can be measured with minimal delay.
  • the workpiece table 101 is in a scanning motion state. If the scanning speed of the workpiece table 101 is vs, and the illumination time interval of the two light sources 121 and 122 is t, the time interval for measurement under two measurement configurations is to be tested.
  • the measured field of view is typically on the order of a few millimeters to a dozen millimeters, so the positional change of the image measured in different measurement configurations is only on the order of 1/100 to 1/1000 relative to the field of view size. Therefore, the present invention uses the synchronization controller 140 to control the timing of the plurality of sets of light sources and detectors, so that the plurality of detectors respectively capture images of different illumination modes at a certain timing, so that the workpiece stage 101 can be scanned in one time.
  • the detection of the measurement configuration greatly improves the detection efficiency.
  • the automatic optical detecting device further includes a main control computer 141, and the main control computer 141 and the respective detectors (including the first detector 111, the second detector 112, ..
  • the nth detector, the respective light sources (including the first light source 121, the second light source 122, ..., the nth light source), the workpiece stage 101 and the synchronization controller 140 are signally connected, in other words, the main control computer 141
  • Each of the detectors, each of the light sources, the workpiece stage 101, and the synchronization controller 140 constitute a synchronous control system through a synchronization signal and an electrical control signal, and the synchronous control system ensures that each light source is illuminated during the period in which the object to be measured is illuminated. Only one detector corresponding to the light source is on, so it does not affect the detection of other detectors.
  • the light sources 121, 122 are provided with a flashing LED or a flashing Xe lamp having a wavelength range of visible light, infrared or ultraviolet light for respectively providing light sources in bright field and dark field conditions.
  • the object to be tested 102 is a silicon wafer, an LED substrate or a TFT panel.
  • the example of the present invention is directed to silicon wafer detection, the technology is not limited to the field of silicon wafer detection technology, and the technology can also be applied to LED, TFT, solar panel, PCB, and the like. field.
  • the invention also provides an automatic optical detection method.
  • the specific timing diagram is shown in FIG. 5, and in conjunction with FIG. 3, the following steps are included:
  • the workpiece stage 101 carries the object to be tested 102 to the first measurement position and sends a first synchronization signal S0 to the synchronization controller 140 (pulse 0 in FIG. 5);
  • the synchronization controller 140 sends a second synchronization signal S1 (pulse 1 in FIG. 5) to the first detector 111 according to its own delay condition, and the first detector 111 turns on and starts integral measurement (pulse 1 in FIG. 5). -);
  • the synchronization controller sends a third synchronization signal S3 (pulse 2 in FIG. 5) to the first light source 121, and the integral of the first light source 121 at the first detector 111 During the measurement period, pulsed light (pulse 2 in Fig. 5) is emitted, and illumination under the first configuration condition is performed, that is, bright field illumination, and the first detector 111 obtains illumination of the first light source 121 (under bright field illumination configuration) An image of the object to be tested 102;
  • the delay is extremely short, that is, the first detector 111 can be sent to the off state without the first detector 111 entering the off state, and the synchronization controller 140 sends the second synchronization signal S2 to the second detector 112 ( Pulse 3) in Fig. 5, the second detector 112 is turned on and starts the integral measurement (pulse 3 in Fig. 5); since the second detector 112 starts the integral measurement after the first light source 121 has finished emitting light, it will not The image under the first measurement configuration is accidentally acquired.
  • the synchronization controller 140 issues a third synchronization to the second source 122.
  • Signal S4 pulse 4 in Fig. 5
  • the second light source 122 emits pulsed light (pulse 4 in Fig. 5) during the integral measurement of the second detector 112, and performs illumination under the second configuration condition, that is, dark
  • the second detector 112 obtains an image illuminated by the second source 122, i.e., an image in dark field conditions. Since the second light source 122 is turned on after the integration measurement of the first detector 111 is completed, the first detector 111 does not erroneously acquire an image in the second measurement configuration.
  • the workpiece table 101 carries the object to be tested 102 to the next measurement position and sends a first synchronization signal S0 to the synchronization controller 140, and repeats the above steps S2-S6 until the object to be tested 102 is collected at all measurement positions. Measure the image under configuration conditions.
  • the measurement timing diagram shows that the time interval for acquiring images by different detectors at the same measurement position is t, which is mainly constrained by the pulse width of the scintillation source.
  • the pulse width of mainstream flashing light sources such as flashing LEDs, Xe lamps, etc.
  • the scanning speed of the workpiece table 101 is 200 mm/s, and the positional deviation between images collected by different detectors at the same measuring position is about 10 ⁇ m to 20 ⁇ m.
  • the measured field of view is typically on the order of a few millimeters to a dozen millimeters, so that the positional change of the image measured under different measurement configuration conditions is only on the order of 1/100 to 1/1000 relative to the field of view size.
  • the defect recognition algorithm is used to perform defect recognition processing on the two measured images, the same region (about 99% to 99.9%) in the two images can be selected for processing, so that the object to be tested 102 is in the scanning situation.
  • the same measurement position is simultaneously performed under two different measurement configuration conditions.
  • the automatic optical detection method further includes a main control computer 141 separately connected to each of the detectors, each of the light source, the workpiece stage 101 and the synchronization controller 140, and the main control computer 141 is configured to set The parameters of the synchronization controller 140, the parameters of each of the detectors, the brightness of each of the light sources, and the movement of the workpiece table 101 are controlled.
  • the present invention is not limited to two types of bright field illumination detection and dark field illumination detection which are generally used in optical automatic defect detection processes.
  • the present invention can also be easily extended to the detection of two or more different illumination modes, and the number of the light source and the detector can be increased correspondingly, and the detector can be applied even when conditions permit.
  • more measurement configurations can be realized in a range with extremely small delay, that is, basic synchronization realizes detection under various measurement configuration conditions.
  • the difference between the embodiment and the embodiment 1 is that the three light sources 121 , 122 , and 123 are respectively a bright field illumination source, a dark field illumination source, and an infrared illumination source, that is, the embodiment.
  • An infrared illumination source is added to the embodiment 1.
  • the infrared illumination source uses an infrared LED with a wavelength of about 780 nm or more.
  • the number of detectors is also increased to three, represented by 111, 112, 113, respectively, for detecting images in brightfield illumination, darkfield illumination, and infrared illumination, respectively.
  • two beam splitters are added to the optical path for combining and separating infrared and visible light.
  • the detectors 111 and 112 can issue fourth synchronization signals S1 ′, S2 ′ to the synchronization controller 140, and the synchronization controller 140 receives the first After the four synchronization signals S1', S2', the third synchronization signals S3, S4 are sent to the corresponding light sources 121, 122, and the corresponding light sources 121, 122 are triggered to be turned on.
  • the automatic optical detection method corresponding to this embodiment is as follows:
  • the workpiece stage 101 carries the first synchronization signal S0 after the object to be tested 102 moves to the measurement position, and the synchronization board or synchronization controller 140 receives the signal S0, and thereby generates the second synchronization signals S1 and S2 to the first detector 111 and The time delay between the second detector 112, S1 and S2 is set by the synchronization controller 140.
  • the first detector 111 and the second detector 112 respectively start integration measurement after receiving the signals S1 and S2, while feeding back the fourth synchronization signals S1' and S2' to the synchronization controller 140.
  • the synchronization controller 140 receives the signals S1' and S2', and generates third synchronization signals S3 and S4 according to S1' and S2' to the first light source 121 and the second light source 122, respectively, the first light source 121 and the second light source 122 are receiving After the signals S3 and S4 are turned on, the first detector 111 measures the image illuminated by the first light source 121, and the second detector 112 measures the image illuminated by the second light source 122.
  • the fourth synchronization signals S1', S2' can also be directly received by the corresponding light sources 121, 122, triggering the light sources 121, 122 to be turned on to achieve synchronous measurement.
  • Embodiment 1 and Embodiment 3 can also be employed, that is, a group of detectors and light sources are controlled by the synchronization controller 140, and the light sources of the other group of detectors and light sources are directly controlled by the detectors.
  • the timing control of each detector and each light source by the synchronization controller 140 ensures that only one detector corresponding to the light source is turned on during the period in which each light source is illuminated. The other detectors are not affected, so that a plurality of detectors respectively capture images of the object to be tested 102 in different illumination modes in a substantially synchronized manner.
  • the present invention provides an automatic optical detecting apparatus and method, the apparatus comprising: a plurality of detectors for performing image acquisition on the object to be tested; and a plurality of light sources for using different illumination modes
  • the synchronization controller 140 is connected to the plurality of detectors and the plurality of light source signals, and the synchronization controller 140 is configured to directly or indirectly control the location according to the position of the object to be tested 102.
  • the plurality of detectors and the plurality of light sources are respectively turned on and off according to a certain timing, so that each detector can perform image collection on the object to be measured in the illumination mode provided by the corresponding light source, and illuminate each object to be measured. Only one detector corresponding to the light source is turned on during the period.
  • the invention adopts a synchronous control system for controlling the measurement timing of two or more light sources and detectors, so that detection under a plurality of different measurement configuration conditions can be realized by one scan measurement.
  • Synchronous control system The timing control makes the two-dimensional image acquisition speed of the original frame rate on the order of only about 100 Hz can be instantaneously reached to the order of 10,000 Hz, which is increased by two orders of magnitude and the detection efficiency is approximately doubled.

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Abstract

一种自动光学检测装置及方法，该装置用于对承载于工件台（101）上的待测对象（102）进行检测，包括多个探测器（111，112），用于对待测对象（102）进行图像采集；多个光源（121，122），用于以不同的照明模式对待测对象（102）进行照明；以及同步控制器（140），与多个探测器（111，112）以及多个光源（121，122）信号连接，同步控制器（140）用于根据待测对象（102）的位置来直接或间接控制多个探测器（111，112）和多个光源（121，122）各自按照一定的时序开启和关闭，使得每个探测器（111，112）能够在对应的光源（121，122）提供的照明模式下对待测对象（102）进行图像采集，以及使得每个光源（121，122）对待测对象（102）进行照明的期间内只有与该光源（121，122）对应的一个探测器（111，112）处于开启状态。采用同步控制器（140），对多组光源（121，122）与探测器（111，112）的时序进行控制，可通过一次扫描实现多种测量配置的检测，从而大大提升了检测效率。

Description

一种自动光学检测装置及方法 技术领域
本发明涉及半导体检测领域，特别涉及一种自动光学检测装置及方法。
背景技术
自动光学检测(AOI，英文全称：Automatic Optical Inspection)技术可实现晶圆、芯片或其他待测对象的快速、高精度、无损伤检测，该技术广泛地应用于PCB、IC晶圆、LED、TFT以及太阳能面板等多个领域。自动光学检测技术一般采用高精度光学成像系统对待测对象进行成像，工件台承载待测对象进行高速扫描以实现高速测量；系统将扫描的图像和理想参考图像进行比较，或通过特征提取等方式，识别出待测对象的表面缺陷。
由于待测对象缺陷的多样性，不同的缺陷具有不同的光学特性，因此一般自动光学检测设备需配备多种测量配置以应对不同的缺陷类型，例如：对于灰度变化比较明显的缺陷，如污染、刮伤等，可以采用明场照明的测量配置进行测量；对于微小颗粒，则可以使用暗场照明的方式进行测量，以提高探测的灵敏度。因此，在硅片缺陷检测技术领域，采用多种测量配置对同一硅片进行测量是一种提高缺陷检测灵敏度和检出率的较为常用的方法。
如一种自动光学检测系统，系统首先对硅片表面图像进行拍照训练，产生一个缺陷检测用的理想图像，以便与扫描检测过程中实际拍到的图像进行对比，以识别缺陷。在扫描过程中，工件台带动硅片高速运动，在明场照明模式下，探测器对硅片进行扫描检测。等明场配置下硅片扫描完毕，切换到暗场照明，探测器对硅片再一次进行扫描检测，两次扫描检测均使用同一个探测器，时序图如图1所示，这样每一张硅片需要扫描两次，对 整个硅片来说，势必造成检测速度下降，增加了检测的时间，从而导致检测效率下降；另外，由于两次曝光使用的是同一个探测器，以目前探测器的性能(主要指帧频)来讲，无法在极短的时间内进行连续的两次曝光，进一步限制了检测效率。
发明内容
本发明提供一种自动光学检测装置及方法，以解决上述技术问题。
为解决上述技术问题，本发明提供一种自动光学检测装置，用于对承载于工件台上的待测对象进行检测，包括：
多个探测器，用于对所述待测对象进行图像采集；
多个光源，用于以不同的照明模式对所述待测对象进行照明；以及
同步控制器，与所述多个探测器以及所述多个光源信号连接，所述同步控制器用于根据所述待测对象的位置来直接或间接控制所述多个探测器和多个光源各自按照一定的时序开启和关闭，使得每个探测器能够在对应的光源提供的照明模式下对待测对象进行图像采集，以及使得每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态。
较佳地，所述同步控制器还与所述工件台信号连接，所述待测对象的位置根据工件台向同步控制器发出的第一信号获得。
较佳地，所述自动光学检测装置还包括主控计算机，所述主控计算机与所述多个探测器、多个光源、工件台以及同步控制器分别信号连接。
较佳地，所述同步控制器用于向所述多个探测器发送多个第二信号以分别控制每个探测器的开启和关闭。
较佳地，所述同步控制器还用于向所述多个光源发送多个第三信号以 分别控制每个光源的开启。
较佳地，所述探测器可向所述同步控制器发出第四信号，所述同步控制器接收所述第四信号后向对应的光源发出第三信号，以触发该光源开启。
较佳地，所述探测器可向对应的光源发出第四信号，以触发该光源开启。
较佳地，所述多个光源包括明场照明光源、暗场照明光源以及红外光源中的至少两种。
较佳地，所述光源为脉冲光发生装置，例如为闪烁LED或闪烁Xe灯。
较佳地，所述红外光源采用红外LED，波长为780nm或以上。
较佳地，所述待测对象为硅片、LED基底或TFT面板。
较佳地，所述多个探测器的数目与所述多个光源的数目相同。
本发明还提供了一种自动光学检测方法，用于对承载于工件台上的待测对象进行检测，包括：
提供用于对所述待测对象进行图像采集的多个探测器，用于以不同的照明模式对所述待测对象进行照明的多个光源，以及与所述多个探测器以及所述多个光源信号连接的同步控制器；以及
由所述同步控制器根据所述待测对象的位置来直接或间接控制所述多个探测器和多个光源各自按照一定的时序开启和关闭，使得每个探测器能够在对应的光源提供的照明模式下对待测对象进行图像采集，以及使得每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态。
可选地，所述自动光学检测方法包括如下步骤：
S1：工件台承载待测对象运动至测量位置并向同步控制器发出第一信号；
S2：所述同步控制器向所述多个探测器中的第一探测器发出第二信号，触发所述第一探测器开启；
S3：所述同步控制器向所述多个光源中的第一光源发出第三信号，第一光源在第一探测器的开启状态下发出第一脉冲光，第一探测器获得待测对象在第一光源照明下的图像；
S4：第一光源发光结束后，所述同步控制器向所述多个探测器中的第二探测器发出另一第二信号，触发第二探测器开启；
S5：第一探测器关闭后，同步控制器向所述多个光源中的第二光源发出另一第三信号，第二光源在第二探测器的开启状态下发出第二脉冲光，第二探测器获得待测对象在第二光源照明下的图像；
S6：工件台承载待测对象运动至下一测量位置并向同步控制器发出另一第一信号，重复上述步骤S2-S6，直至所述多个探测器在所有的测量位置下均采集到待测对象在对应的光源照明下的图像。
较佳地，所述自动光学检测方法还包括提供与所述多个探测器、多个光源、工件台以及同步控制器分别信号连接的主控计算机；以及通过所述主控计算机设置所述同步控制器的参数、所述多个探测器的参数、所述多个光源的亮度，以及控制工件台运动。
可选地，所述自动光学检测方法包括如下步骤：
S1：工件台承载待测对象运动至测量位置并向同步控制器发出第一信号；
S2：所述同步控制器向所述多个探测器中的第一探测器发出第二信号，触发所述第一探测器开启；
S3：第一探测器向第一光源发出第三信号，触发第一光源在第一探测器的开启状态下发出第一脉冲光，第一探测器获得待测对象在第一光源照 明下的图像；
S4：第一光源发光结束后，所述同步控制器向所述多个探测器中的第二探测器发出另一第二信号，触发第二探测器开启；
S5：第一探测器关闭后，第二探测器向第二光源发出另一第三信号，触发第二光源在第二探测器的开启状态下发出第二脉冲光，第二探测器获得待测对象在第二光源照明下的图像；
S6：工件台承载待测对象运动至下一测量位置并向同步控制器发出另一第一信号，重复上述步骤S2-S6，直至所述多个探测器在所有的测量位置下均采集到待测对象在对应的光源照明下的图像。
与现有技术相比，本发明提供的自动光学检测装置和方法利用同步控制器根据待测对象的位置来直接或间接控制多个探测器和多个光源各自按照一定的时序开启和关闭，使得每个探测器能够在对应的光源提供的照明模式下对待测对象进行图像采集，以及使得每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态。通过本发明的装置和方法，可在一次扫描测量过程中实现多种不同测量配置条件下的检测，从而大大提升了检测效率。
附图说明
图1为现有的自动光学检测方法的时序图；
图2为本发明中自动光学检测方法的时序图；
图3为本发明实施例一中自动光学检测装置的结构示意图；
图4为本发明实施例一中同步控制系统的架构图；
图5为本发明实施例一中自动光学检测方法的时序图；
图6为本发明实施例二中自动光学检测装置的结构示意图；
图7为本发明实施例三中自动光学检测装置的结构示意图；
图8为本发明实施例三中自动光学检测方法的时序图。
图3-7中：101-工件台，102-待测对象，103-分束镜，104-中继物镜，111、112、113-探测器，121、122、123-闪烁光源，131-明场照明器、132-暗场照明器，140-同步控制器，141-主控计算机。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
实施例1
本发明提供的自动光学检测装置，如图3所示，包括：
一工件台101，用于承载并携带待测对象102实现扫描运动，所述工件台101到达预定位置后可发出第一同步信号S0；
多个探测器，本实施例中，所述探测器的数量为两个，分别为第一探测器111和第二探测器112，所述探测器111、112可分别接收第二同步信号S1、S2并进行图像采集；
优选与所述探测器数量相同的光源，所述光源可在控制信号的控制下发出具有预设照明时长的光束。例如，在本实施例中可采用闪烁光源，用于在控制信号的控制下发出脉冲光。与探测器的数量对应，本实施例中，所述光源为两个，分别为第一光源121和第二光源122，其中，第一光源121为明场照明光源，配合明场照明器131进行明场配置下的照明，第二光 源122为暗场照明光源，配合暗场照明器132进行暗场配置下的照明，所述光源121、122可分别接收第三同步信号S3、S4并发出脉冲光，具体地，本实施例采用多个分束镜103合并和分离两种光源，可选的，在多个分束镜103之间还可设置中继物镜104。关于分束镜及中继物镜的设置方式以及对改变光束传播方向所起的作用属于本领域的通用技术，且不涉及到本发明的核心内容，故在此不一一展开；以及
一同步控制器140，所述同步控制器140接收所述工件台101发出的第一同步信号S0，并向所述探测器111、112发出第二同步信号S1、S2，并向光源121、122发出第三同步信号S3、S4，控制上述光源121、122与探测器111、112实现同步测量，使每个探测器对应测得相应的光源照明的图像。
本发明使用至少两组光源和探测器，各组光源和探测器同时分别用于在不同测量配置条件下进行成像检测，当对一待测对象102进行检测时，其扫描时序图如图2所示，首先开启第一探测器111进行图像探测，在此期间打开第一光源121，实现第一种测量配置下的曝光测量。第一光源121曝光结束后，延迟极短的时间，开启第二探测器112执行图像探测，待第一探测器111图像积分结束后，即第一探测器111进入关闭状态后，开启第二光源122，通过第二探测器112实现第二种配置条件下的曝光测量。通过上述方式，第一探测器111测量得到第一光源121开启时照亮的图像；第二探测器112测量得到第二光源122开启时照亮的图像。两个光源121、122分别对应不同的光学测量配置，因此利用本发明可在延时极小的情况下测得两种不同测量配置下的图像。整个过程中，工件台101处于扫描运动状态，若工件台101扫描速度为vs，两个光源121、122的发光时间间隔为t，则在两种测量配置下进行测量的时间间隔内，待测对象102沿工件台101 扫描方向平移了ΔS＝vs×t，典型地，t＝50μs，vs＝200m/s，ΔS＝10μm。测量视场大小一般为几毫米到十几毫米量级，因此，在不同测量配置下测得的图像的位置变化相对于视场大小而言仅有1/100到1/1000的量级。因此，本发明采用同步控制器140，对多组光源与探测器的时序进行控制，使得多个探测器以一定的时序分别捕获不同照明模式的图像，使得工件台101一次扫描即可实现多种测量配置的检测，从而大大提升了检测效率。
较佳地，请重点参考图4，所述自动光学检测装置还包括主控计算机141，所述主控计算机141分别与各个探测器(包括第一探测器111、第二探测器112、...、第n探测器)，各个光源(包括第一光源121、第二光源122、...、第n光源)，工件台101以及同步控制器140信号连接，换句话说，主控计算机141，各所述探测器，各所述光源，工件台101以及同步控制器140通过同步信号及电气控制信号组成同步控制系统，所述同步控制系统可确保每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态，因而不会影响到其他探测器的检测。
较佳地，所述光源121、122采用闪烁LED或闪烁Xe灯，波长范围为可见光、红外或紫外，分别用于在明场和暗场条件下提供光源。
较佳地，所述待测对象102为硅片、LED基底或TFT面板。需要说明的是，虽然本发明所举实例以硅片检测为对象，但该技术并不限于硅片检测技术领域，该技术同样可以应用于LED、TFT、太阳能电池板以及PCB等等相似的应用领域。
本发明还提供了一种自动光学检测方法，具体时序图如图5所示，同时结合图3，包括如下步骤：
S1：工件台101承载待测对象102运动至第一测量位置并向同步控制器140发出第一同步信号S0(图5中的脉冲0)；
S2：同步控制器140根据自身的延迟条件，向第一探测器111发出第二同步信号S1(图5中的脉冲1)，第一探测器111开启并开始积分测量(图5中的脉冲1-)；
S3：在第一探测器111进行积分测量期间，所述同步控制器向第一光源121发出第三同步信号S3(图5中的脉冲2)，第一光源121在第一探测器111的积分测量期间内发出脉冲光(图5中的脉冲2-)，执行第一种配置条件下的照明，即明场照明，第一探测器111获得第一光源121照明下(明场照明配置下)的待测对象102的图像；
S4：第一光源121发光结束后，延迟极短的时间，也就是说可以不用等到第一探测器111进入关闭状态，所述同步控制器140向第二探测器112发出第二同步信号S2(图5中的脉冲3)，第二探测器112开启并开始积分测量(图5中的脉冲3-)；由于第二探测器112在第一光源121发光结束后才开始积分测量，因此不会误采集到第一种测量配置下的图像。
S5：第一探测器111积分测量结束后(即第一探测器111进入关闭状态后)，且在第二探测器112的积分测量期间内，同步控制器140向第二光源122发出第三同步信号S4(图5中的脉冲4)，第二光源122在第二探测器112积分测量期间内发出脉冲光(图5中的脉冲4-)，执行第二种配置条件下的照明，即暗场照明，第二探测器112获得第二光源122照明下的图像，即暗场条件下的图像。由于第二光源122是在第一探测器111积分测量结束后才被开启，因此，第一探测器111不会误采集到第二种测量配置下的图像。
S6：工件台101承载待测对象102运动至下一个测量位置并向同步控制器140发出第一同步信号S0，重复上述步骤S2-S6，直至在所有测量位置都采集到待测对象102在不同测量配置条件下的图像。
测量时序图显示，在同一测量位置由不同探测器获取图像的时间间隔大小为t，该时间主要受闪烁光源脉冲宽度约束。目前，主流的闪烁光源，如闪烁LED、Xe灯等的脉冲宽度一般都不大于100μs或者50μs。一般情况下，光学检测设备中工件台101扫描速度为200mm/s，则在同一测量位置由不同探测器采集到的图像之间的位置偏差约10μm～20μm。测量视场大小一般为几毫米到十几毫米量级，因此，在不同测量配置条件下测得的图像的位置变化相对于视场大小而言仅有1/100到1/1000的量级。当使用缺陷识别算法对两幅测得的图像进行缺陷识别处理时，可选取两幅图中的相同区域(约占99％～99.9％)进行处理，这样实现了扫描情况下待测对象102在同一测量位置同时进行两种不同测量配置条件下测量的方案。
较佳地，所述自动光学检测方法还包括与各所述探测器，各所述光源，工件台101以及同步控制器140分别信号连接的主控计算机141，所述主控计算机141用于设置所述同步控制器140的参数，各所述探测器的参数，各所述光源的亮度，以及控制工件台101运动。
另外，本发明不局限于光学自动缺陷检测过程中一般用到的明场照明检测和暗场照明检测的两种检测。由本发明的同步控制的原理可知，本发明也可以很容易的扩展到两种以上不同照明模式下的检测，只需相应增加光源和探测器的数量，甚至在条件允许的情况下可对探测器进行复用，并对各组探测器和光源进行时序控制，确保每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态，从而不会影响到其他探测器的检测。通过上述方式可以使更多的测量配置在延时极小的范围内实现，即基本同步实现多种测量配置条件下的检测。
实施例2
请重点参考图6，本实施例与实施例1的区别在于：包括三个光源121、122、123，分别为明场照明光源、暗场照明光源以及红外照明光源，也就是说，本实施例在实施例1基础上增加了红外照明光源，较佳地，所述红外照明光源采用红外LED，波长为780nm左右或以上。与此对应地，探测器的数量也增加至三个，图中分别以111、112、113表示，用于分别探测明场照明、暗场照明和红外照明条件下的图像。对应的，光路中增加了两个分束镜，用于合并与分离红外光与可见光。其余配置与实施例1相似，在此不再赘述。通过时序控制，保证每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态，从而不会影响其他探测器。本实施例可在一次扫描测量过程中同时实现可见光明场照明、暗场照明以及红外照明三种不同条件下的图像采集，适应待测对象102更多的工艺变化。
实施例3
请重点参考图7，本实施例与实施例1的区别在于：所述探测器111、112可向同步控制器140发出第四同步信号S1’、S2’，所述同步控制器140接收到第四同步信号S1’、S2’后，向对应的所述光源121、122发出第三同步信号S3、S4，触发对应的光源121、122开启。
请参考图8，本实施例对应的自动光学检测方法如下：
工件台101承载待测对象102运动到测量位置后发出第一同步信号S0，同步板卡或同步控制器140接收信号S0，并以此产生第二同步信号S1和S2给第一探测器111和第二探测器112，S1和S2之间的时间延迟由同步控制器140设定。第一探测器111和第二探测器112分别在接收到信号S1和S2后开始积分测量，同时反馈第四同步信号S1’和S2’给同步控制器140。 同步控制器140接收信号S1’和S2’，并根据S1’和S2’产生第三同步信号S3和S4给第一光源121和第二光源122，第一光源121和第二光源122分别在接收到信号S3和S4后开启，使第一探测器111测得第一光源121照明的图像，第二探测器112测得第二光源122照明的图像。
当然，所述第四同步信号S1’、S2’也可被对应的光源121、122直接接收，触发该光源121、122开启，实现同步测量。
另外，也可以采用实施例1与实施例3的混合方案，即一组探测器和光源由同步控制器140控制，另一组探测器和光源中的光源直接由探测器控制。
同样的，在上述实施例中，通过同步控制器140对各探测器及各光源的时序控制，保证每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态，而不会影响到其他探测器，从而实现多个探测器以基本同步的方式分别捕获待测对象102在不同照明模式下的图像。
综上所述，本发明提供的自动光学检测装置及方法，该装置包括：多个探测器，用于对所述待测对象进行图像采集；多个光源，用于以不同的照明模式对所述待测对象进行照明；以及与所述多个探测器以及所述多个光源信号连接的同步控制器140，所述同步控制器140用于根据待测对象102的位置来直接或间接控制所述多个探测器和多个光源各自按照一定的时序开启和关闭，使得每个探测器能够在对应的光源提供的照明模式下对待测对象进行图像采集，以及使得每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态。本发明采用了同步控制系统，用于对两组或以上光源与探测器的测量时序进行控制，使得通过一次扫描测量即可实现多种不同的测量配置条件下的检测。通过同步控制系统 的时序控制，使原先帧频仅约百赫兹量级的二维图像采集速度可在瞬时达到万赫兹的量级，提升了两个数量级，检测效率提升约一倍。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (17)

  1. 一种自动光学检测装置，用于对承载于工件台上的待测对象进行检测，其特征在于，包括：
    多个探测器，用于对所述待测对象进行图像采集；
    多个光源，用于以不同的照明模式对所述待测对象进行照明；以及
    同步控制器，与所述多个探测器以及所述多个光源信号连接，所述同步控制器用于根据所述待测对象的位置来直接或间接控制所述多个探测器和多个光源各自按照一定的时序开启和关闭，使得每个探测器能够在对应的光源提供的照明模式下对待测对象进行图像采集，以及使得每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态。
  2. 如权利要求1所述的自动光学检测装置，其特征在于，所述同步控制器还与所述工件台信号连接，所述待测对象的位置根据工件台向同步控制器发出的第一信号获得。
  3. 如权利要求1所述的自动光学检测装置，其特征在于，还包括主控计算机，所述主控计算机与所述多个探测器、多个光源、工件台以及同步控制器分别信号连接。
  4. 如权利要求1所述的自动光学检测装置，其特征在于，所述同步控制器用于向所述多个探测器发送多个第二信号以分别控制每个探测器的开启和关闭。
  5. 如权利要求1或4所述的自动光学检测装置，其特征在于，所述同步控制器还用于向所述多个光源发送多个第三信号以分别控制每个光源的开启。
  6. 如权利要求5所述的自动光学检测装置，其特征在于，所述探测器可向所述同步控制器发出第四信号，所述同步控制器接收所述第四信号后向对应的光源发出第三信号，以触发该光源开启。
  7. 如权利要求1或4所述的自动光学检测装置，其特征在于，所述探测器可向对应的光源发出第四信号，以触发该光源开启。
  8. 如权利要求1所述的自动光学检测装置，其特征在于，所述多个光源包括明场照明光源、暗场照明光源以及红外光源中的至少两种。
  9. 如权利要求1所述的自动光学检测装置，其特征在于，所述光源为脉冲光发生装置。
  10. 如权利要求9所述的自动光学检测装置，其特征在于，所述脉冲光发生装置为闪烁LED或闪烁Xe灯。
  11. 如权利要求8所述的自动光学检测装置，其特征在于，所述红外光源采用红外LED，波长为780nm或以上。
  12. 如权利要求1所述的自动光学检测装置，其特征在于，所述待测对象为硅片、LED基底或TFT面板。
  13. 如权利要求1所述的自动光学检测装置，其特征在于，所述多个探测器的数目与所述多个光源的数目相同。
  14. 一种自动光学检测方法，用于对承载于工件台上的待测对象进行检测，其特征在于，包括：
    提供用于对所述待测对象进行图像采集的多个探测器，用于以不同的照明模式对所述待测对象进行照明的多个光源，以及与所述多个探测器以及所述多个光源信号连接的同步控制器；以及
    由所述同步控制器根据所述待测对象的位置来直接或间接控制所述多个探测器和多个光源各自按照一定的时序开启和关闭，使得每个探测器能 够在对应的光源提供的照明模式下对待测对象进行图像采集，以及使得每个光源对待测对象进行照明的期间内只有与该光源对应的一个探测器处于开启状态。
  15. 如权利要求14所述的自动光学检测方法，其特征在于，包括如下步骤：
    S1：工件台承载待测对象运动至测量位置并向同步控制器发出第一信号；
    S2：所述同步控制器向所述多个探测器中的第一探测器发出第二信号，触发所述第一探测器开启；
    S3：所述同步控制器向所述多个光源中的第一光源发出第三信号，第一光源在第一探测器的开启状态下发出第一脉冲光，第一探测器获得待测对象在第一光源照明下的图像；
    S4：第一光源发光结束后，所述同步控制器向所述多个探测器中的第二探测器发出另一第二信号，触发第二探测器开启；
    S5：第一探测器关闭后，同步控制器向所述多个光源中的第二光源发出另一第三信号，第二光源在第二探测器的开启状态下发出第二脉冲光，第二探测器获得待测对象在第二光源照明下的图像；
    S6：工件台承载待测对象运动至下一测量位置并向同步控制器发出另一第一信号，重复上述步骤S2-S6，直至所述多个探测器在所有的测量位置下均采集到待测对象在对应的光源照明下的图像。
  16. 如权利要求14所述的自动光学检测方法，其特征在于，还包括：提供与所述多个探测器、多个光源、工件台以及同步控制器分别信号连接的主控计算机；以及通过所述主控计算机设置所述同步控制器的参数、所述多个探测器的参数、所述多个光源的亮度，以及控制工件台运动。
  17. 如权利要求14所述的自动光学检测方法，其特征在于，包括如下步骤：
    S1：工件台承载待测对象运动至测量位置并向同步控制器发出第一信号；
    S2：所述同步控制器向所述多个探测器中的第一探测器发出第二信号，触发所述第一探测器开启；
    S3：第一探测器向第一光源发出第三信号，触发第一光源在第一探测器的开启状态下发出第一脉冲光，第一探测器获得待测对象在第一光源照明下的图像；
    S4：第一光源发光结束后，所述同步控制器向所述多个探测器中的第二探测器发出另一第二信号，触发第二探测器开启；
    S5：第一探测器关闭后，第二探测器向第二光源发出另一第三信号，触发第二光源在第二探测器的开启状态下发出第二脉冲光，第二探测器获得待测对象在第二光源照明下的图像；
    S6：工件台承载待测对象运动至下一测量位置并向同步控制器发出另一第一信号，重复上述步骤S2-S6，直至所述多个探测器在所有的测量位置下均采集到待测对象在对应的光源照明下的图像。
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