WO2017204100A1 - Dispositif d'exposition par projection et procédé d'exposition par projection associé - Google Patents

Dispositif d'exposition par projection et procédé d'exposition par projection associé Download PDF

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Publication number
WO2017204100A1
WO2017204100A1 PCT/JP2017/018780 JP2017018780W WO2017204100A1 WO 2017204100 A1 WO2017204100 A1 WO 2017204100A1 JP 2017018780 W JP2017018780 W JP 2017018780W WO 2017204100 A1 WO2017204100 A1 WO 2017204100A1
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WO
WIPO (PCT)
Prior art keywords
area
workpiece
turntable
projection exposure
region
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PCT/JP2017/018780
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English (en)
Japanese (ja)
Inventor
秀人 小谷
田中　良和
隆正 大庭
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株式会社サーマプレシジョン
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Publication of WO2017204100A1 publication Critical patent/WO2017204100A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to a technique for improving the throughput of a projection exposure apparatus, and more particularly to a technique for improving the throughput by reducing the total projection exposure time.
  • a projection exposure apparatus that uses a photolithography technique to transfer a pattern on a photomask (reticle) onto a work such as a wafer or a substrate is disclosed in, for example, Reference 1 or Reference 2.
  • Cited Document 1 a pattern on an original plate (reticle: photomask) is placed on a table (or stage) that can move in the X (horizontal) -Y (vertical) - ⁇ (rotation) direction via a projection lens. It is projected onto a single exposed object (work). The position of the object to be exposed (work) in each XY direction is detected by a position detection device using a laser interferometer.
  • the cited document 1 discloses a step moving direction for highly accurately aligning the reticle and wafer in step exposure, and a moving direction of the wafer with respect to the laser interferometer of the position detection device.
  • Cited Document 2 a table (or stage) on which a single workpiece is placed is not only movable in the X (horizontal) -Y (vertical) - ⁇ (rotating) direction, but also on a photomask (reticle).
  • the table to be placed is movable in the X (horizontal) -Y (vertical) - ⁇ (rotation) direction.
  • Citation 2 discloses that the scan direction and scan speed of both tables can be individually set.
  • JP 2001-203161 A Japanese Patent Laid-Open No. 11-260697
  • a brittle material such as a crystal material or a brittle material such as glass even if it is amorphous may be used. It is necessary to take a slow time. For this reason, the time required for loading and unloading the workpiece into the exposure possible area on the stage requires a very long time such as 70 seconds.
  • a work is first loaded at a predetermined position on the stage, then the position of the work on the stage is detected, and then the position detected next.
  • exposure is performed after adjusting the position of the stage or photomask in each direction. That is, in the conventional projection exposure apparatus and the projection exposure method thereof, each process is performed individually one by one, and in order to reduce the total processing time, the time required for each individual process is reduced. Alternatively, there was no other way but to shorten the switching time between each process.
  • the present invention has been made in view of the above-mentioned problems, and loads / unloads workpieces in the projection exposure process, detects the position of a workpiece placed on the stage, and corresponds to the position of the workpiece. It is an object of the present invention to provide a projection exposure apparatus and a projection exposure method thereof that can reduce the total processing time compared to the prior art by enabling parallel execution of at least two projection exposure processes.
  • one embodiment of a projection exposure apparatus projects a projection exposure with light from a light source on a workpiece by aligning a predetermined pattern of a photomask with a predetermined position on the workpiece.
  • the projection exposure apparatus for forming the predetermined pattern a plurality of regions are formed on the uppermost surface of a part on which the work is placed so that the work can be placed at the same time without overlapping.
  • a turntable configured to be capable of being temporarily stopped at a plurality of predetermined stop positions; a loader capable of loading and unloading the workpiece into the plurality of regions of the turntable; and a plurality of regions of the turntable.
  • the first area of the turntable is When one of the first areas is temporarily stopped at one of the predetermined stop positions, the first area of the turntable is When the position detection device arranged to detect the placement position of the workpiece placed in the first area and the first area of the turntable are temporarily stopped at the first stop position Further, a light source, a photo, which is arranged so as to project and expose a work placed in the second region, directly above a second region different from the first region among the plurality of regions in the turntable.
  • Mask and projection optical system rotation of the turntable and stop at each predetermined stop position, loading and unloading of a plurality of workpieces into each area by a loader, and in each area by the position detection device
  • a control unit for controlling each processing of detection of a placement position of each placed workpiece and projection exposure to each workpiece placed in each region by the light source, the photomask, and the projection optical system. And When the control unit projects and exposes the work placed in the second area with the light source, the photomask, and the projection optical system, at least the placement position of the work placed in the first area Is performed by the position detection device.
  • one embodiment of the projection exposure method according to the present invention is directed to projecting and exposing a predetermined pattern of a photomask to a predetermined position on the workpiece by light from a light source.
  • a plurality of regions are formed on the uppermost surface of the part on which the predetermined pattern is formed so that a plurality of workpieces can be placed at the same time without overlapping, and are rotated and predetermined a plurality of stop positions.
  • a step of ending the cycle (G) the first region of the first cycle of (A) to (F) is replaced with the second region, and the third region or the two regions only when there are three or more regions If you have a first area If the second cycle is processed and the subsequent cycles are replaced in the ascending order when there are three or more areas, and the process returns to the first area at the end, or if there are only two areas The first region and the second region are alternately replaced with each other.
  • (A), (b) is a figure which shows schematic structure when the turntable of the exposure apparatus of the 1st Embodiment of this invention stops in a 1st stop position, (a) is a side view, (b) Is a top view.
  • 3 is an operation flowchart of the exposure apparatus according to the first embodiment of the present invention.
  • (A), (b) is a figure which shows schematic structure when the turntable of the exposure apparatus of the 2nd Embodiment of this invention stops in a 1st stop position, (a) is a side view, (b) Is a top view. It is the first half of the operation
  • the projection exposure apparatus of the present invention projects a photomask with light from a light source in accordance with a predetermined pattern on a workpiece.
  • a projection exposure apparatus that forms a predetermined pattern on a workpiece by exposure, and a plurality of regions are formed on a top surface of a portion on which the workpiece is placed so that a plurality of workpieces can be placed simultaneously without overlapping.
  • a turntable configured to be able to rotate and temporarily stop to a plurality of predetermined stop positions, a loader capable of loading and unloading work into a plurality of areas of the turntable, and a plurality of areas in the turntable When one of the first areas is temporarily stopped at one of the predetermined stop positions, the first area is directly above the first area of the turntable.
  • a position detection device arranged to detect the placement position of the workpiece placed on the turntable, and when the first area of the turntable is temporarily stopped at the first stop position,
  • a light source, a photomask and a projection optical system arranged so as to project and expose a workpiece placed in the second area directly above a second area different from the first area, Stop at each predetermined stop position, load and unload multiple works into each area by loader, detect placement position of each work placed in each area by position detection device, light source, photo
  • a control unit that controls each process of projection exposure to each workpiece placed in each region by the mask and the projection optical system, and the control unit is attached to the workpiece placed in the second region.
  • For light source photo When projection exposure by disk and the projection optical system, is to implement the parallel processing of detecting the position detection device of the placing position of the workpiece placed on at least the first region.
  • the turntable has a third area different from the first area and the second area in one of the plurality of areas, and the loader is the turntable.
  • the first area is temporarily stopped at the first stop position, it is arranged so that the work can be unloaded and / or loaded into the third area of the turntable, and the control unit is placed in the first area.
  • the workpiece after placing the projection exposure placed in the third area is unloaded after unloading. Parallel processing is performed so as to load an exposure work.
  • the turntable has n regions (n is an integer of n ⁇ 4) as the plurality of regions, and the position detection device is the first of the turntable.
  • the placement position of the workpiece placed in the first area is detected immediately above one of the n areas of the turntable.
  • the light source, the photomask, and the projection optical system are arranged so that the first region is one of n regions on the turntable when the first region of the turntable is temporarily stopped at the first stop position.
  • a workpiece is loaded and unloaded in a fourth region to an nth region which is one of n regions on the turntable and different from the first region to the third region.
  • a plurality of loaders are arranged so that the control unit can perform parallel processing so as to load an unexposed workpiece after unloading a workpiece that has been subjected to projection exposure and is placed in the fourth to nth regions.
  • Another embodiment of the projection exposure apparatus according to the present invention is an exposure apparatus in which the projection exposure apparatus exposes a pattern to be projected and exposed to one workpiece in one shot.
  • the device for aligning the position of the pattern to be projected and exposed to the position of the workpiece whose position has been detected has a photomask of vertical (Y), horizontal (X), and height (Z ) And a drive device that moves in at least one of the rotational ( ⁇ ) directions.
  • the device for aligning the position of the pattern to be projected and exposed to the position of the workpiece whose position has been detected is tilt drive that changes the angle of the photomask from the plane orthogonal to the exposure light Includes devices.
  • the device for aligning the position of the pattern to be projected and exposed to the position of the workpiece whose position has been detected has a stage (Y), It includes a drive device that moves in at least one of (X), height (Z), and rotation ( ⁇ ) directions.
  • the device for aligning the position of the pattern to be projected and exposed to the position of the workpiece whose position has been detected includes a projection optical system having a vertical (Y), horizontal (X), and height. It includes a drive device that moves in at least one of the (Z) and rotation ( ⁇ ) directions.
  • One embodiment of a projection exposure method using a projection exposure apparatus is to form a predetermined pattern on a workpiece by aligning a predetermined pattern on a photomask with a predetermined position on the workpiece and performing projection exposure with light from a light source.
  • a plurality of areas are formed on the uppermost surface of the part where the work is placed so that a plurality of works can be placed simultaneously without being overlapped, and can be rotated and temporarily stopped at a plurality of predetermined stop positions.
  • a projection exposure method using a projection exposure apparatus having a turntable configured in (A), a step of loading a work in one first area of a plurality of areas of a turntable, and (B) a turn Rotating the table to temporarily stop the first area at one of the predetermined stop positions; and (C) detecting the placement position of the workpiece in the first area.
  • a plurality of regions are formed on the uppermost surface of a part on which a workpiece is placed so that the plurality of workpieces can be placed simultaneously without being overlapped.
  • a revolver type turntable configured to be capable of being temporarily stopped at a plurality of predetermined stop positions, and a work loader, a work position detecting device on the turntable, and a projection for projecting a pattern on a photomask onto the work
  • FIGS. 1A and 1B show a schematic configuration of the exposure apparatus 1 according to the first embodiment of the present invention.
  • a work turntable shaft 130 is disposed on a work Z stage 140.
  • a work turntable 120 is installed.
  • two work placement first areas 110 and work placement second areas 111 are arranged at both ends of one diameter of the turntable 120.
  • the opposite ends of the diameter are, for example, a straight line drawn from the center of the turntable 120 toward the region of one end, and a continuous straight line drawn 180 degrees away from the straight line.
  • the other region is arranged at the end on the side.
  • the first work placement area 110 and the second work placement area 111 are larger than the surface areas of the first work 510 and the second work 511, and each has a sufficient area for placing each work.
  • a position recognition mark (ID) or a marker (not shown) indicating a reference point for position measurement may be provided at a place where each workpiece does not interfere.
  • the work turntable shaft 130 is provided at the center of the lower part of the work turntable 120 and is connected to a control unit 410 including a microcomputer and a central processing unit (CPU) via a work turntable driving unit 150. .
  • a driving signal is sent from the work turntable driving unit 150 to the work turntable shaft 130.
  • the work turntable shaft 130 can precisely control the rotation angle of the turntable and the stop position on the plane by a stepping motor (not shown) or the like.
  • the work turntable shaft 130 is connected to a power source (not shown) and supplied with electric power necessary for rotation.
  • the work Z stage 140 is connected to a control unit 410 including a microcomputer and a central processing unit (CPU) via a work Z stage driving unit 160. In response to a command from the control unit 410, a driving signal is sent from the work Z stage driving unit 160 to the work Z stage 140.
  • the workpiece Z stage 140 can precisely control the Z (vertical) direction and the vertical stop position by an unillustrated vertical movement mechanism (such as a hydraulic mechanism or an electric mechanism).
  • the work Z stage 140 is also connected to a power source (not shown) and supplied with electric power necessary for rotation.
  • the work placement first area 110 can move to the first stop position 610 or the second stop position 611 by rotating the work turntable 120 controlled by the control unit 410, and stop at that position. it can.
  • a position detection unit 210 is disposed immediately above the first stop position 610.
  • the loader 310 is disposed on or near the area stopped at the first stop position 610. The loader 310 can unload an exposed workpiece from the workpiece placement first area 110 or the workpiece placement second area 111 that is temporarily stopped at the first stop position 610, and loads an unexposed workpiece from that area. be able to.
  • a conveyor (not shown) or the like can be used to send the exposed workpiece lowered from the workpiece turntable 120 to the next step or move the unexposed workpiece to the vicinity of the loader 310.
  • An exposure projection optical system 50 is disposed immediately above the second stop position 611.
  • the work placement second area 111 can also move to the first stop position 610 or the second stop position 611 by rotating the work turntable 120 controlled by the control unit 410, and stop at that position. it can. Since the first stop position 610 and the second stop position 611 are disposed at both ends of one diameter of the work turntable 120, the work placement first area 110 is temporarily stopped at the first stop position 610. The second area 111 for placing the workpiece is temporarily stopped at the second stop position 611. Conversely, when the workpiece placement second area 111 is temporarily stopped at the first stop position 610, the workpiece placement first area 110 is temporarily stopped in the projection optical system 50.
  • the light source unit 10, the photomask 20, the mask XY ⁇ stage 30, and the mask tilt stage 40 are disposed further above the projection optical system 50 for exposure.
  • exposure light from the light source unit 10 passes through the photomask 20 and the projection optical system 50 and is placed on the workpiece placement second region 111 on the second stop position 611. Then, the second workpiece 511 is exposed, whereby a predetermined pattern on the photomask 20 is transferred onto the second workpiece 511.
  • the mask XY ⁇ stage 30 is connected to a control unit 410 including a microcomputer and a central processing unit (CPU) via a mask XY ⁇ stage driving unit 60.
  • a driving signal is sent from the masking XY ⁇ stage driving unit 60 to the masking XY ⁇ stage 30.
  • the mask XY ⁇ stage 30 is precisely controlled by a mask XY ⁇ stage driving unit 60 that can be moved in the X direction (lateral direction), Y direction (vertical direction), and ⁇ (rotation) direction on a stage plane (not shown). Furthermore, the stop position in the XY ⁇ (vertical, horizontal, rotational) direction on the stage plane can be controlled.
  • the mask XY ⁇ stage 30 is also connected to a power supply (not shown) and is supplied with electric power necessary for movement in the XY ⁇ (vertical, horizontal, rotational) direction.
  • the mask tilt stage 40 is connected to a control unit 410 including a microcomputer and a central processing unit (CPU) via a mask tilt stage driving unit 70.
  • a driving signal is sent from the mask tilt stage driving unit 70 to the mask tilt stage 40.
  • the mask tilt stage 40 is in a state where the stage plane is precisely tilted (tilted) by the mask tilt stage driving unit 70 that can tilt the stage plane (not shown) from an angle perpendicular to the optical axis.
  • the stop position can be controlled.
  • the mask tilt stage 40 is also connected to a power source (not shown) and supplied with power necessary for tilting the stage plane.
  • the control unit 410 controls the work turntable shaft 130, the work Z stage 140, and the mask XY ⁇ stage 30 so that the predetermined pattern on the photomask 20 is accurately transferred to a predetermined position on the second work 511. Further, the position of the tilt stage for mask 40 on the plane, the angle on the plane and the tilt angle are controlled. In that case, for example, using a photomask microscope (not shown), a workpiece microscope, or the like, control is performed so that the mask alignment mark on the photomask (not shown) matches the workpiece alignment mark on the workpiece. be able to.
  • the projection optical system 50 can also be provided with a drive unit and used for control for projecting a predetermined pattern on the photomask to a predetermined position on the work.
  • the control unit 410 confirms whether or not the work placement first area 110 on the turntable 120 is temporarily stopped at the first stop position 610 (S1). If the work placement first area 110 is temporarily stopped at the first stop position 610 (S1: Yes), whether or not an unexposed work is placed in the work placement first area 110 is determined. Confirm (S2). If the work placement first area 110 is not temporarily stopped at the first stop position 610 (S1: No), the work placement first area 110 is temporarily stopped at the second stop position 611. The process proceeds to step S7.
  • the control unit 410 loads the unexposed workpiece into the workpiece placement first area 110 on the loader 310.
  • An instruction is output as follows (S3). If an unexposed workpiece is placed in the workpiece placement first area 110 (S2: No), it is not necessary to load the unexposed workpiece, so the process proceeds to step S4, where the position is determined by a command from the control unit 41.
  • the detection unit 210 detects the position of the first work 510 in the work placement first area 110 (S4). In that case, for example, a stage alignment mark on the stage and a work alignment mark on the work may be detected by a work microscope.
  • the control unit 410 When the position of the first workpiece 510 in the first workpiece placement area 110 is detected, the control unit 410 outputs a command to rotate the turntable driving unit 150 (S5), and the workpiece placement on the turntable 120 is performed. When the first area 110 reaches the second stop position 611, a command to pause is output (S6).
  • the control unit 410 unloads the exposed workpiece from the workpiece placement second region 111 to the loader 310.
  • Load (S8) and output an instruction to load the unexposed workpiece into the workpiece placement second area 111 (S9). If there is no exposed workpiece in the workpiece placement second area 111 (S7: No), there is no need to unload the workpiece, so the process proceeds to step S9, where the unexposed workpiece is placed on the workpiece placement second.
  • the area 111 is loaded (S9).
  • the first workpiece 510 whose position has been detected in the workpiece placement first region 110 is At the second stop position 611, transfer onto the first work 510 by projection exposure of a predetermined pattern of the photomask 20 is performed (S10).
  • the control unit 410 outputs a command to rotate the turntable driving unit 150 again (S11), and the work placement first area 110 on the turntable 120 is in the first stop position 610.
  • a command to pause is output (S12).
  • the control unit 410 unloads the exposed work from the work placement first area 110 to the loader 310.
  • a command is output so as to load (S14), and the process proceeds to step S16 to check whether there is any remaining unexposed workpiece (S16). If there is no exposed workpiece in the workpiece placement first area 110 (S13: No), it is not necessary to unload the workpiece, so the process proceeds to step S16 to determine whether there is no remaining unexposed workpiece. Is confirmed (S16).
  • the position in the workpiece placement second region 111 is simultaneously established.
  • transfer onto the second workpiece 511 by projection exposure of a predetermined pattern of the photomask 20 is performed at the second stop position 611 (S15), and the process proceeds to step S16 to control the second workpiece 511.
  • the unit 410 confirms whether there is no unexposed workpiece remaining (S16).
  • step S16: Yes If there is no remaining unexposed workpiece (S16: Yes), the process is terminated. If there is any remaining unexposed workpiece (S16: No), the process returns to step S1 and the first workpiece placement is performed. It is confirmed whether or not the area 110 is temporarily stopped at the first stop position 610 (S1), and the subsequent processing is repeated.
  • the projection exposure apparatus 1 of the present embodiment aligns a predetermined pattern of the photomask 20 with a predetermined position on the workpieces 510 and 511, and projects and exposes the predetermined pattern on the workpieces 510 and 511 by light from the light source 10.
  • a plurality of regions 110 and 111 are formed on the uppermost surface of a part on which the workpieces 510 and 511 are placed so that the plurality of workpieces 510 and 511 can be placed simultaneously without overlapping.
  • the turntable 120 configured to be able to rotate and temporarily stop at a plurality of predetermined stop positions 610 and 611, and to load and unload the workpieces 510 and 511 into the plurality of regions 110 and 111 of the turntable 120.
  • Loader 310 and turntable 120 can be connected to a first stop at one of predetermined stop positions 610 and 611.
  • the placement position of the work 510 placed in the first area 110 directly above the first area 110 of the plurality of areas 110 and 111 of the turntable 120 When temporarily stopped at the position 610, the placement position of the work 510 placed in the first area 110 directly above the first area 110 of the plurality of areas 110 and 111 of the turntable 120. And the first region 110 and 111 of the turntable 120 when the first region 110 of the turntable 120 and the first region 110 of the turntable 120 are temporarily stopped at the first stop position 610.
  • the table 120 is rotated and stopped at predetermined stop positions 610 and 611, and into the areas 110 and 111 by the loader 310.
  • the control unit 410 is mounted in the second region 111.
  • the position detection device 210 detects at least the placement position of the work 510 placed in the first region 110. Parallel processing can be performed.
  • the projection exposure apparatus 1 of the present embodiment can be an exposure apparatus that exposes a pattern to be projected and exposed with one shot to one workpiece.
  • a device for aligning the position of the pattern to be projected and exposed to the position of the workpiece whose position has been detected includes the photomask 20 in the vertical (Y), horizontal (X), and height ( Z) and a drive device that moves in at least one of the rotation ( ⁇ ) directions and / or a tilt drive device that changes the angle of the photomask 20 from a plane orthogonal to the exposure light.
  • the projection exposure method of the projection exposure apparatus 1 performs projection exposure on the workpieces 510 and 511 by aligning a predetermined pattern of the photomask 20 with a predetermined position on the workpieces 510 and 511 and performing light exposure from the light source 10.
  • a plurality of regions 110 and 111 are formed on the uppermost surface of the portion where the workpieces 510 and 511 are placed so that the plurality of workpieces 510 and 511 can be placed simultaneously without overlapping.
  • the workpiece 511 for which the projection exposure has been completed from within the second region 111 is performed in parallel with the projection exposure processing of (E).
  • the process of the second cycle is performed in place of the one area 110, and the subsequent cycles include the steps of alternately exchanging the first area 110 and the second area 111 when only two areas are provided.
  • the first or second workpiece placement is performed.
  • Different processes on different areas can be simultaneously performed in parallel with different processes such as workpiece loading / unloading and position detection, or projection exposure. Therefore, in comparison with the conventional case in which each process is continuously performed in series at the same place, parallel processing is possible in this embodiment, so that the processing time can be shortened.
  • Second Embodiment In the second embodiment shown in FIGS. 3 to 5, compared with the first embodiment shown in FIGS. 1 to 2, there are two to three stop positions (first stop position 610 to third stop position). 612), the number of work placement areas on the work turntable 120 is increased from two to three (work placement first area 110 to work placement third area 112). At the same time, three works (first work 510 to third work 512) can be placed on the work turntable 120 without overlapping. Since other configurations are the same as those in the first embodiment, the overlapping description is omitted.
  • Each area for placing a work on the work turntable 120 is arranged so that the angle from the center of the work turntable 120 is 120 degrees which is 1/3 of 360 degrees. Accordingly, when the first work 510 is placed on the work placement first area 110 and temporarily stopped at the first stop position 610, the second work 511 on the work placement second area 111 is moved to the second stop position. The third workpiece 512 on the workpiece placement third area 112 is temporarily stopped at the third stop position 612.
  • the loader 310 is disposed not above or near the area stopped at the first stop position 610 but above or near the area stopped at the third stop position 612. It is arranged at a stop position different from the position detection unit 210 provided in the upper part of the area stopped at 610. Further, the loader 310 can unload an exposed workpiece from the first workpiece placement area 110 to the third workpiece placement region 112 temporarily stopped at the third stop position 612, and unloads the workpiece. Can be loaded into that region.
  • the control unit 410 confirms whether or not the work placement first area 110 on the turntable 120 is temporarily stopped at the third stop position 612 (S21). If the work placement first area 110 is temporarily stopped at the third stop position 612 (S21: Yes), it is determined whether or not an unexposed work is placed in the work placement first area 110. Confirm (S22). If the work placement first area 110 is not temporarily stopped at the third stop position 612 (S21: No), the work placement first area 110 is temporarily stopped at the first stop position 610 or the second stop position 611. Since it is medium, the process proceeds to step S40.
  • the control unit 410 loads the unexposed workpiece into the workpiece placement first area 110 in the loader 310.
  • the command is output as follows (S23). If an unexposed workpiece is placed in the workpiece placement first area 110 (S22: No), it is not necessary to load the unexposed workpiece, so the process proceeds to step S24, where the turntable is rotated ( S24). When the work placement first area 110 on the turntable 120 reaches the first stop position 610, a command to pause is output (S25).
  • the control unit 410 compares the position detected workpiece in the workpiece placement second area 111. 2.
  • the pattern on the photomask 20 is transferred onto the workpiece by projection exposure (S27), and the process proceeds to step S32 (S32). If there is no workpiece whose position has been detected in the workpiece placement second area 111 (S26: No), the process proceeds to step S32 (S32).
  • the workpiece placement third area 112 at the third stop position 612 is performed in parallel. It is confirmed whether or not there is an exposed workpiece (S28).
  • the control unit 410 unloads the exposed workpiece from the workpiece placement third area 112 to the loader 310.
  • An instruction is output to load the unexposed workpiece into the workpiece placement third area 112 (S30).
  • step S30 If there is no exposed workpiece in the workpiece placement third area 112 (S28: No), there is no need to unload the workpiece, so the process proceeds to step S30 and the unexposed workpiece is placed on the workpiece placement third.
  • the area 112 is loaded (S30), and the process proceeds to step S32 (S32).
  • step S26 the workpiece placement first at the first stop position 610 is performed.
  • An unexposed workpiece placement position in the area 110 is detected, and the process proceeds to step S32 (S32).
  • the control unit 410 rotates the turntable 120 again (S32).
  • a command to pause is output (S33).
  • the workpiece placement second area 111 at the third stop position 612 is simultaneously executed. It is checked whether there is an exposed workpiece (S36). If there is an exposed workpiece in the workpiece placement second area 111 (S36: Yes), the control unit 410 unloads the exposed workpiece from the workpiece placement second region 111 to the loader 310. Load (S37), and output an instruction to load the unexposed workpiece into the workpiece placement second area 111 (S38).
  • step S36 If there is no exposed workpiece in the workpiece placement second area 111 (S36: No), there is no need to unload the workpiece, so the process proceeds to step S38, where the unexposed workpiece is placed on the workpiece placement second.
  • the area 111 is loaded (S38), and the process proceeds to step S40 (S40).
  • control unit 410 is in the workpiece placement first area 110. Then, transfer of a predetermined pattern of the photomask 20 onto the work is performed at the second stop position 611 on the work whose position has been detected (S39), and the process proceeds to step S40 (S40).
  • the control unit 410 rotates the turntable 120 again (S40).
  • a command to pause is output (S41).
  • the control unit 410 unloads the exposed workpiece from the workpiece placement first area 110 to the loader 310 (S42), and the control unit 410 confirms whether there is any remaining unexposed workpiece ( S43).
  • the projection exposure apparatus 1 of the present embodiment has the third area 112 on the turntable 120 that is different from the first area 110 and the second area 111 in one of the plurality of areas 110 and 111.
  • the loader 310 is disposed so that the work 512 can be unloaded and / or loaded into the third region 112 of the turntable 120 when the first region 110 of the turntable 120 is temporarily stopped at the first stop position 610.
  • the control unit 410 detects the placement position of the workpiece 510 placed in the first region 110 and projects and exposes the workpiece 511 placed in the second region 111, the third region 112 is used. Parallel processing can be performed so that an unexposed workpiece is loaded after unloading the workpiece 512 that has been subjected to projection exposure and is loaded inside. .
  • the projection exposure method of the projection exposure apparatus 1 performs projection exposure on the workpieces 510 and 511 by aligning a predetermined pattern of the photomask 20 with a predetermined position on the workpieces 510 and 511 and performing light exposure from the light source 10.
  • a plurality of regions 110 and 111 are formed on the uppermost surface of the portion where the workpieces 510 and 511 are placed so that the plurality of workpieces 510 and 511 can be placed simultaneously without overlapping.
  • the projection exposure apparatus 1 of the present embodiment can be an exposure apparatus that exposes a predetermined pattern to be projected and exposed with one shot to one workpiece.
  • the device for aligning the position of the predetermined pattern to be projected and exposed to the position of the workpiece whose position is detected includes the photomask 20 in the vertical (Y), horizontal (X), and height.
  • Tilt drive device that can include a drive device that moves in at least one of the (Z) and rotational ( ⁇ ) directions and / or changes the angle of the photomask 20 from a plane orthogonal to the exposure light And / or a stage disposed under the turntable 120 in at least one of the longitudinal (Y), lateral (X), height (Z) and rotational ( ⁇ ) directions
  • a drive device that can be moved can be included, and a drive device that moves the projection optical system 50 in at least one of the longitudinal (Y), lateral (X), height (Z), and rotational ( ⁇ ) directions can be included. be able to.
  • the load / unload of each work is performed on different works on different areas.
  • Different processes such as loading, workpiece position detection, or projection exposure, can be performed simultaneously in parallel. Therefore, in comparison with the conventional case in which each process is continuously performed in series at the same place, parallel processing is possible in this embodiment, so that the processing time can be shortened.
  • a plurality of work placement areas on the work turntable 120 and their stop positions are set to four or more, and a relatively time-consuming process, for example, a loader 310 is additionally installed.
  • a loader 310 is additionally installed.
  • the projection exposure apparatus 1 of the present embodiment has n regions 110, 111, 112... (N is an integer of n ⁇ 4) as a plurality of regions on the turntable 120, and a position detection device.
  • N is an integer of n ⁇ 4
  • the first area 110 of the turntable 120 is temporarily stopped at the first stop position 610, the first area 110 is located immediately above one of the n areas of the turntable 120.
  • the light source 10, the photomask 20, and the projection optical system 50 are arranged so that the first area 110 of the turntable 120 is temporarily at the first stop position 610. When stopped, it is placed in the second area 111 immediately above the second area 111 that is different from the first area 110 in one of the n areas of the turntable 120.
  • the loader 310 When the first area 110 is temporarily stopped at the first stop position 610, the loader 310 is one of n areas on the turntable 120 and the first area 110 and the workpiece 511 are projected and exposed. Arranged so that the workpiece 512 can be loaded and unloaded in the third region 112 different from the second region 111, the control unit 410 detects the placement position of the workpiece 510 placed in the first region 110. At the same time, when projection exposure is performed on the workpiece 511 placed in the second area 111, the unexposed workpiece 512 loaded after unloading the workpiece 512 placed in the third area 112 after projection exposure is loaded. Parallel processing can be implemented as described.
  • the projection exposure apparatus 1 of the present embodiment loads and unloads a workpiece in a fourth area to an nth area, which is one of n areas on the turntable 120 and is different from the first area 110 to the third area 112.
  • a plurality of loaders 310 are arranged so that they can be loaded, and the control unit 410 loads an unexposed workpiece after unloading a workpiece that has been subjected to projection exposure and is placed in the fourth to nth regions. Parallel processing can be performed.
  • the projection exposure apparatus 1 of the present embodiment can be an exposure apparatus that exposes a predetermined pattern to be projected and exposed with one shot to one workpiece.
  • the device for aligning the position of the predetermined pattern to be projected and exposed to the position of the workpiece whose position is detected includes the photomask 20 in the vertical (Y), horizontal (X), and height.
  • Tilt drive device that can include a drive device that moves in at least one of the (Z) and rotational ( ⁇ ) directions and / or changes the angle of the photomask 20 from a plane orthogonal to the exposure light And / or a stage disposed under the turntable 120 in at least one of the longitudinal (Y), lateral (X), height (Z) and rotational ( ⁇ ) directions
  • a drive device that can be moved can be included, and a drive device that moves the projection optical system 50 in at least one of the longitudinal (Y), lateral (X), height (Z), and rotational ( ⁇ ) directions can be included. be able to.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

La présente invention comporte : un plateau tournant (120) sur lequel est formée une pluralité de zones (110, 111) dans lesquelles sont placées des pièces, ledit plateau tournant étant conçu de façon à pouvoir tourner et à être temporairement arrêté dans une pluralité de positions d'arrêt prescrites ; un chargeur qui est capable de charger et de décharger les pièces (510, 511) dans la pluralité de zones (110, 111) ; un dispositif de détection de position (210) qui est positionné directement au-dessus de la première zone (110) ; une source de lumière (10), un photomasque (20), et un système optique de projection (50) qui est situé de manière à effectuer une exposition par projection directement au-dessus de la seconde zone (111) ; et une unité de commande (410) qui commande le plateau tournant (120) et chaque unité. Lorsque la pièce (511) placée dans la seconde zone (111) est soumise à une exposition par projection, l'unité de commande (410) exécute un traitement parallèle dans lequel la position de placement de la pièce (510) placée dans la première zone (110) est détectée par le dispositif de détection de position (210).
PCT/JP2017/018780 2016-05-26 2017-05-19 Dispositif d'exposition par projection et procédé d'exposition par projection associé WO2017204100A1 (fr)

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JP2016-105089 2016-05-26
JP2016105089A JP2017211533A (ja) 2016-05-26 2016-05-26 投影露光装置及びその投影露光方法

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001235507A (ja) * 1999-12-14 2001-08-31 Ibiden Co Ltd プリント配線板の導通検査装置及び導通検査方法
JP2013002962A (ja) * 2011-06-16 2013-01-07 Hioki Ee Corp 検査装置および検査システム
WO2013151146A1 (fr) * 2012-04-06 2013-10-10 Ｎｓｋテクノロジー株式会社 Dispositif d'exposition et procédé d'exposition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10223519A (ja) * 1997-02-04 1998-08-21 Nikon Corp 投影露光装置
JP2011049285A (ja) * 2009-08-26 2011-03-10 Nikon Corp マスク形状計測方法及び装置、並びに露光方法及び装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001235507A (ja) * 1999-12-14 2001-08-31 Ibiden Co Ltd プリント配線板の導通検査装置及び導通検査方法
JP2013002962A (ja) * 2011-06-16 2013-01-07 Hioki Ee Corp 検査装置および検査システム
WO2013151146A1 (fr) * 2012-04-06 2013-10-10 Ｎｓｋテクノロジー株式会社 Dispositif d'exposition et procédé d'exposition

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