WO2017193761A1 - 一种封装材料、封装盖板、烧结设备、烧结方法及显示装置 - Google Patents

一种封装材料、封装盖板、烧结设备、烧结方法及显示装置 Download PDF

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Publication number
WO2017193761A1
WO2017193761A1 PCT/CN2017/080394 CN2017080394W WO2017193761A1 WO 2017193761 A1 WO2017193761 A1 WO 2017193761A1 CN 2017080394 W CN2017080394 W CN 2017080394W WO 2017193761 A1 WO2017193761 A1 WO 2017193761A1
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WIPO (PCT)
Prior art keywords
encapsulating material
electromagnetic wave
package
encapsulating
base
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PCT/CN2017/080394
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English (en)
French (fr)
Inventor
陈静静
张亮
崔富毅
王利娜
李旭伟
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/565,901 priority Critical patent/US10033011B1/en
Publication of WO2017193761A1 publication Critical patent/WO2017193761A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a packaging material, a package cover, a sintering device, a sintering method, and a display device.
  • the display device in order to avoid the influence of water and air on the display device, the display device is often packaged using a packaging technique.
  • the OLED includes: a cover to be packaged, an organic electroluminescent structure on the cover to be packaged, and a package cover.
  • the cover plate and the package cover plate to be packaged are packaged by using an encapsulating material such as epoxy resin or glass glue. Since glass glue has much greater barrier to water and oxygen than epoxy resin, OLEDs are currently typically encapsulated using glass glue.
  • the glass glue packaging method is to first put the glass cover plate coated with the glass glue into a heating device to be sintered to make the glass glue in a molten state, reduce the temperature of the heating device after the glass glue is melted, and take out the package coated with the glass glue.
  • the cover plate and the package cover plate and the cover plate to be packaged are sealed by a laser.
  • the organic matter in the glass glue will burn first, and when the organic matter burns, the glass glue will generate internal pores.
  • the external water vapor is easy. Erosion of the glass glue with holes, which invalidates the package.
  • the presence of a large number of holes in the glass glue affects the mechanical properties of the display device.
  • the existing glass glue is generally applied by screen printing, and the surface of the glass glue coated by the method has many burrs.
  • too high burrs may hold the cover plate to be packaged, so that a large area of the glass glue cannot contact the cover plate to be packaged, so that The laser sealing ratio is lowered, and the reduction in the laser sealing ratio is liable to cause package failure.
  • Embodiments of the present disclosure provide a packaging material, a package cover plate, a sintering device, a sintering method, and a display device, which can improve burrs on the surface of the package material and reduce holes in the package material, thereby improving the laser sealing ratio of the package material. To improve the sealing of packaging materials Install the effect.
  • an encapsulating material comprising a leveling auxiliary material, wherein when the encapsulating material is sintered, the leveling auxiliary material moves upon excitation to level the encapsulating material.
  • the leveling auxiliary material is a magnetic material.
  • the Curie temperature of the magnetic material is greater than the melting temperature of the encapsulating material.
  • the magnetic material is iron, cobalt or nickel.
  • the magnetic material is iron.
  • the magnetic material is iron encapsulated by iron oxide.
  • the leveling auxiliary material is contained in an amount of 5 to 10% by weight based on the total weight of the encapsulating material.
  • a package cover is provided, the package area being coated with the package material described above.
  • a sintering apparatus for sintering the above-described package cover, the sintering apparatus comprising an excitation device, a heating device, and a base, wherein: the base is provided with a conveying zone; the heating device is for Heating the package cover; the base is configured to place the package cover, the package area of the package cover corresponds to the delivery area; and the excitation device is configured to excite the package through the delivery area The leveling aid in the material moves the material.
  • the excitation device is an electromagnetic wave emitting device.
  • the shape and size of the transport zone are consistent with the shape and size of the package zone.
  • the conveying zone is a closed groove.
  • a sintering method comprising: placing the above-mentioned package cover plate on a base of the sintering device, and corresponding the package area with a conveying area on the base; controlling the temperature of the heating device
  • the encapsulating material is in a molten state; the excitation device is turned on, and the leveling auxiliary material in the encapsulating material is excited by the conveying region on the abutment.
  • the leveling auxiliary material is a magnetic material
  • the excitation device is an electromagnetic wave emitting device
  • the excitation device is turned on to excite the leveling auxiliary material movement in the encapsulating material through the conveying region on the base, including: turning on electromagnetic wave emission And a device for causing electromagnetic waves emitted from the electromagnetic wave transmitting device to excite the magnetic material to move through the conveying region on the base.
  • the conveying zone is a closed groove; the electromagnetic wave emitting device is turned on to cause the electromagnetic wave emitted by the electromagnetic wave emitting device to excite the magnetic material to move through the conveying region on the base, including: turning on the electromagnetic wave emitting device, so that the electromagnetic wave emitting device The emitted electromagnetic waves excite the movement of the magnetic material through the closed grooves on the abutment.
  • a display device comprising a cover plate to be packaged, and a package cover plate sintered by the sintering method described above.
  • an organic electroluminescent structure is disposed on the cover plate to be packaged.
  • FIG. 1 is a schematic structural view of an iron-containing iron oxide according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of a package cover plate according to an embodiment of the present disclosure
  • FIG. 3(a) is a schematic structural view of a sintering apparatus according to an embodiment of the present disclosure
  • Figure 3 (b) is a cross-sectional view taken along line A-A' of Figure 3 (a);
  • FIG. 4 is a schematic flow chart of a sintering method according to an embodiment of the present disclosure.
  • FIG. 5( a ) is a schematic structural view showing a coating material applied to a package cover plate according to an embodiment of the present disclosure
  • FIG. 5(b) is a schematic structural diagram of a package material during a combustion process according to an embodiment of the present disclosure
  • Figure 5 (c) is a package material provided in an embodiment of the present disclosure burned in a sintering apparatus Schematic diagram of the morphology after the junction;
  • FIG. 6 is a schematic structural diagram of a cover to be packaged according to an embodiment of the present disclosure.
  • Embodiments of the present disclosure provide an encapsulating material including a leveling auxiliary material that, when sintered encapsulating material, is used to move upon excitation to level the encapsulating material.
  • the packaging material includes a leveling auxiliary material, that is, the packaging material in the embodiment of the present disclosure further includes a leveling auxiliary material, relative to the usual packaging material.
  • the glass glue in the prior art is generally exemplified, which generally includes a binder, a solvent, etc., and the encapsulating material provided by the present disclosure only needs to add a leveling auxiliary material to the existing glass glue.
  • the encapsulating material may be a glass paste incorporating a leveling auxiliary material.
  • the leveling auxiliary material in the encapsulating material can be a magnetic leveling auxiliary material, that is, when the leveling auxiliary material in the encapsulating material is excited by electromagnetic waves, Will move; of course, it can be, photo-leveling auxiliary materials or electro-leveling auxiliary materials.
  • the specific content of the leveling auxiliary material in the encapsulating material is not particularly limited as long as the leveling auxiliary material can move when excited.
  • the leveling auxiliary material is present in an amount of from 5 to 10% by weight, more preferably from 5 to 8% by weight, and most preferably from 5 to 6 based on the total weight of the encapsulating material. weight%.
  • the encapsulating material comprises a glass glue and a leveling auxiliary material, wherein the leveling auxiliary material is based on the total weight of the encapsulating material The content is 5 to 10% by weight.
  • Embodiments of the present disclosure provide an encapsulating material. Since the encapsulating material includes a leveling auxiliary material, when the encapsulating material is sintered and the encapsulating material is in a molten state, if the encapsulating material is excited, the leveling in the encapsulating material is The auxiliary material will move, so that the flowing material of the packaging material will accelerate the leveling after the movement of the leveling auxiliary material, especially the burrs and internal holes of the surface of the packaging material, and the burrs of the surface of the packaging material during the flow of the packaging material It will level and the internal holes will be filled.
  • the encapsulating material is coated on the package cover for laser sealing the package cover and the cover to be packaged, the laser encapsulation ratio of the encapsulation material can be improved, so that the encapsulation effect of the encapsulation material is better.
  • the photo-leveling auxiliary material needs to ensure that the encapsulating material is transparent, and the electro-leveling auxiliary material needs to ensure that the encapsulating material is electrically conductive, and thus the implementation of the present disclosure
  • the leveling auxiliary material is a magnetic material.
  • the encapsulating material when the encapsulating material is sintered, since the temperature is high, in order to avoid the magnetic material losing magnetic properties at a high temperature, it is necessary to ensure that the Curie temperature (magnetic transition temperature) of the magnetic material in the encapsulating material is larger than the encapsulating material.
  • the melting temperature when the encapsulating material is sintered, since the temperature is high, in order to avoid the magnetic material losing magnetic properties at a high temperature, it is necessary to ensure that the Curie temperature (magnetic transition temperature) of the magnetic material in the encapsulating material is larger than the encapsulating material.
  • the melting temperature when the encapsulating material is sintered, since the temperature is high, in order to avoid the magnetic material losing magnetic properties at a high temperature, it is necessary to ensure that the Curie temperature (magnetic transition temperature) of the magnetic material in the encapsulating material is larger than the encapsulating material. The melting temperature.
  • the magnetic material may be, for example, iron (Fe), cobalt (Co), nickel (Ni), or the like.
  • the shape of the magnetic material is not particularly limited as long as it can achieve the effects according to the present application.
  • the magnetic material is spherical particles having a diameter of 4.5 to 6 ⁇ m.
  • the sintering temperature of the encapsulating material such as glass glue is lower than the Curie temperature of the iron, that is, the iron element is in the encapsulating material. Magnetization may still be carried out during the sintering process, and thus embodiments of the present disclosure preferably have a magnetic material of iron.
  • the magnetic material iron 10 in the encapsulating material is wrapped by the iron oxide 20.
  • the iron 10 by protecting the iron 10 by the iron oxide 20, it is possible to prevent the iron 10 from being deactivated by oxidation reaction at a high temperature without affecting the encapsulation of the encapsulating material.
  • a package cover 30 is provided, as shown in FIG. 2, A package area 301 is included, and the package area 301 is coated with the above-described package material.
  • the shape and size of the package area 301 of the package cover 30 can be reasonably set according to the package cover 30 and the package needs of the cover to be packaged.
  • Embodiments of the present disclosure provide a package cover 30 that includes a leveling auxiliary material in a package material coated by a package region 301 of the package cover 30, when the package material is sintered and the package material is in a molten state If the encapsulation material of the encapsulation area 301 is excited, the leveling auxiliary material in the encapsulation material will move, so that the encapsulation material in the flowing state accelerates the leveling after the movement of the leveling auxiliary material, especially the surface of the encapsulation material.
  • the burrs and the internal holes, the burrs on the surface of the encapsulating material will level during the flow process, and the internal holes will be filled, so that the package cover 30 coated with the encapsulating material and the cover to be packaged are laser-sealed.
  • the laser packaging ratio of the packaging material is increased, so that the packaging material has a better packaging effect.
  • Embodiments of the present disclosure provide a sintering apparatus for sintering the above-described package cover 30, as shown in FIGS. 3(a) and 3(b), the sintering apparatus includes: an excitation device 40, and a heating device (Fig. The heating device and the base 50 are not illustrated in both 3 (a) and FIG. 3 (b).
  • the base 50 is provided with a transport zone 501.
  • the heating device is used for heating the package cover 30; the base 50 is for placing the package cover 30, the package area 301 of the package cover 30 is corresponding to the delivery area 501; and the excitation device 40 is used for the delivery area 501 excites the leveling aid material movement in the encapsulating material.
  • the packaging material coated on the package cover 30 can be sintered and the temperature can be adjusted.
  • the heating device heats the package cover 30, during the process of increasing the temperature of the encapsulating material, since the organic matter has a low ignition point, the organic matter in the encapsulating material is first burned, and the temperature is further increased, and the encapsulating material is In a molten state.
  • the excitation device 40 it should be set according to the leveling auxiliary material in the packaging material.
  • the excitation device 50 may be an electromagnetic wave emitting device capable of emitting electromagnetic waves;
  • the excitation device may be a light-emitting device.
  • the transport area 501 it may be provided on the entire base 50, or As shown in FIG. 3(a) or FIG. 3(b), on the base 50, only the area corresponding to the package area 301 is provided. Further, the transport zone 501 may be separately disposed above the base 50 or may be embedded inside the base 50.
  • the transporting zone 501 provides a channel for the excitation device 40 to move the leveling auxiliary material in the encapsulating material, so that the transporting zone 501 should ensure that electromagnetic waves emitted by the excitation device 40, such as an electromagnetic wave emitting device, can be conducted and It is held in the transporting zone 501. Since the encapsulating area 20 of the encapsulating material corresponds to the transporting zone 501, when there is electromagnetic waves in the transporting zone 501, the magnetic material in the encapsulating material moves under the action of electromagnetic waves.
  • the electromagnetic waves emitted from the excitation device 40 for example, the electromagnetic wave transmitting device, is conducted into the transporting region 501 is not limited.
  • Embodiments of the present disclosure provide a sintering apparatus for sintering the above-described package cover 30, since the heating device in the sintering apparatus can provide a temperature environment for melting the packaging material, the package cover 30 to be coated with the packaging material Placed on the base 50 and the encapsulation area 301 of the encapsulation cover 30 corresponds to the delivery area 501 of the base 50.
  • the delivery area 301 can cause the leveling auxiliary material in the encapsulation material to move.
  • Such a flowing packaging material accelerates the leveling after being subjected to the movement of the leveling auxiliary material, especially the burrs on the surface of the packaging material and the internal holes, and the burrs on the surface of the packaging material during the flow process will level, the internal The holes are filled, so that when the package cover 30 coated with the encapsulating material and the cover to be packaged are laser-sealed, the laser encapsulation ratio of the encapsulation material is increased, so that the encapsulation effect of the encapsulation material is better.
  • the encapsulating material of the encapsulating cover 30 includes a magnetic material
  • the excitation device 40 is an electromagnetic wave emitting device, and the electromagnetic wave emitted by the electromagnetic wave emitting device can move the magnetic material in the encapsulating material.
  • the frequency of the electromagnetic wave emitted by the electromagnetic wave emitting device is such that the magnetic material can move.
  • the shape and size of the transport zone 501 is consistent with the shape and size of the package zone 301.
  • Embodiments of the present disclosure provide a sintering apparatus in which the shape and size of the transport zone 501 are consistent with the shape and size of the package zone 301.
  • the transport zone 501 if the transport zone 501 is too small, the package cover placed on the base 50 may be caused. Leveling auxiliary material in the encapsulating material of the board 30 Some of the parts are unexcited without movement, resulting in burrs and holes in the encapsulating material of the package cover 30.
  • the conveying area 501 is too large, for example, the excitation device 40 is an electromagnetic wave emitting device, the conveying area The material for conducting electromagnetic waves set in 501 is more or the material of the transporting zone 501 for conducting electromagnetic waves is increased, resulting in waste.
  • the transport zone 501 is a closed trench.
  • the closed groove is directly formed on the base 50, and it is not necessary to separately provide the conveying portion 501 on the base 50, so that the manufacturing process of the sintering apparatus can be simplified.
  • Embodiments of the present disclosure provide a sintering method, as shown in FIG. 4, comprising:
  • the package cover 30 described above is placed on the base 50 of the sintering apparatus described above, and the package area 301 is corresponding to the transfer area 501 on the base 50.
  • the surface of the encapsulation material 60 has burrs.
  • the temperature of the heating device can be controlled according to the melting point of the encapsulating material 60 coated on the package cover 30.
  • the temperature of the heating device is controlled to sinter the encapsulating material 60.
  • the temperature increase since the melting point of the organic substance is low, the organic substance is first burned, and the shape of the encapsulating material 60 is as shown in FIG. 5(b). Holes will appear in the interior of the material 60, the temperature will continue to rise, and the encapsulating material 60 will be in a molten state.
  • the excitation device 40 is turned on, and the movement of the leveling auxiliary material in the encapsulating material is excited by the conveying area 501 on the base 50.
  • the excitation device 50 is turned on, for example, an electromagnetic wave emitting device. Since the electromagnetic wave emitted by the electromagnetic wave emitting device can attract or repel the leveling auxiliary material such as a magnetic material, the magnetic material starts to move under the excitation of the electromagnetic wave, and is in a flowing state at this time.
  • the encapsulating material 60 is accelerated by the movement of the magnetic material to accelerate the leveling, especially the burrs on the surface of the encapsulating material 60 and the internal holes. As shown in FIG. 5(c), the encapsulating material 60 is flowing. During the process, the burrs on the surface of the encapsulating material will level and the internal holes will be filled.
  • the excitation device 40 is turned off, the temperature of the heating device is lowered, and the package cover 30 is taken out to perform encapsulation of the package cover 30 and the cover to be packaged.
  • Embodiments of the present disclosure provide a sintering method in which a package cover 30 coated with a package material is placed on a base 50 because a heating device in the sintering apparatus can provide a temperature environment in which a package material is melted
  • the encapsulation area 301 of the package cover 30 corresponds to the delivery area 501 of the base 50.
  • the delivery area 301 can cause the leveling auxiliary material in the encapsulation material 60 to move, such that the encapsulation material 60 in the flowing state.
  • the leveling is accelerated, especially the burrs on the surface of the encapsulating material 60 and the internal holes.
  • the burr on the surface of the encapsulating material 60 during the flow of the encapsulating material 60 will level, and the internal holes will be filled. Therefore, when the package cover 30 coated with the encapsulation material 60 and the cover plate to be packaged are laser-sealed, the laser encapsulation ratio of the encapsulation material is improved, so that the encapsulation effect of the encapsulation material is better.
  • the leveling auxiliary material is a magnetic material
  • the excitation device 40 is an electromagnetic wave emitting device
  • the excitation device 40 is turned on, and the leveling auxiliary material in the encapsulating material is excited by the conveying region 501 on the base 5(), including: opening the electromagnetic wave
  • the transmitting device causes the electromagnetic wave emitted from the electromagnetic wave transmitting device to excite the magnetic material to move through the transporting region 501 on the base 50.
  • Embodiments of the disclosure preferably have a leveling auxiliary material that is a magnetic material.
  • the excitation device 40 is an electromagnetic wave emitting device, and electromagnetic waves emitted from the electromagnetic wave transmitting device can excite the magnetic material in the encapsulating material 60 through the transporting region 501 on the base 50.
  • the transporting area 501 is a closed trench; the electromagnetic wave emitting device is turned on to cause the electromagnetic wave emitted by the electromagnetic wave emitting device to excite the magnetic material through the transporting area 501 on the base 50, including: turning on the electromagnetic wave emitting device to emit the electromagnetic wave The electromagnetic waves emitted by the device excite the movement of the magnetic material through the closed grooves on the base 50.
  • the closed groove is directly formed on the base 50 without separately providing the conveying portion 501 on the base 50, so that the manufacturing process of the sintering apparatus can be simplified.
  • Embodiments of the present disclosure provide a display device including a cover to be packaged and passed
  • the above-described sintering apparatus is sintered with a package cover plate 10.
  • the burrs on the surface of the encapsulating material 70 of the package cover 10 sintered by the sintering apparatus described above are leveled, the internal holes are filled, and thus the package cover 10 and the cover to be packaged are subjected to laser processing.
  • the packaging effect is better, so that the formed display device has good mechanical properties.
  • an organic electro-emitting structure is disposed on the cover plate 70 to be packaged.
  • the organic electroluminescent structure includes a thin film transistor 80, an anode 90, an organic electroluminescent layer 100, and a cathode 110.
  • the thin film transistor 80 includes a source 801, a drain 802, an active layer 803, a gate insulating layer 804, and a gate 805.
  • the drain 802 of the thin film transistor 80 is electrically connected to the anode 90.
  • the cover plate 70 to be packaged may further include a color film structure, which is specifically set according to the implementation, and details are not described herein again.
  • Embodiments of the present disclosure provide an encapsulating material, a package cover, a sintering apparatus, a sintering method, and a display device.
  • a packaging auxiliary material is included in the encapsulating material
  • the leveling auxiliary material in the encapsulating material will move, so that the flowing encapsulating material will accelerate the leveling after the movement of the leveling auxiliary material, especially the burr and inner surface of the encapsulating material surface. Holes, the burrs on the surface of the encapsulating material will level during the flow of the encapsulating material, and the internal holes will be filled.
  • the encapsulating material is coated on the package cover for laser sealing the package cover and the cover to be packaged, the laser encapsulation ratio of the encapsulation material can be improved, so that the encapsulation effect of the encapsulation material is better.

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Abstract

一种封装材料、封装盖板、烧结设备、烧结方法及显示装置，涉及显示技术领域，可改善封装材料表面的毛刺，并减少封装材料内部的孔洞，从而提高封装材料的激光封接比例，改善封装材料的封装效果。该封装材料包括流平辅助材料，在烧结封装材料时，所述流平辅助材料用于在受到激发时运动，以使封装材料流平，用于封装盖板和待封装盖板的封装。

Description

一种封装材料、封装盖板、烧结设备、烧结方法及显示装置 技术领域
本公开内容涉及显示技术领域，尤其涉及一种封装材料、封装盖板、烧结设备、烧结方法及显示装置。
背景技术
在现有的显示装置中，为了避免水和空气对显示器件的影响，经常会利用封装技术对显示装置进行封装。以OLED(Organic Light-Emitting Diode，有机电致发光二极管)显示装置为例，OLED包括：待封装盖板、位于待封装盖板上的有机电致发光结构以及封装盖板。其中，待封装盖板和封装盖板利用封装材料，例如环氧树脂或玻璃胶进行封装。由于玻璃胶对水和氧气的阻隔性远大于环氧树脂，因而，目前通常使用玻璃胶对OLED进行封装。
目前，玻璃胶封装方式是先将涂布有玻璃胶的封装盖板放入加热装置中烧结以使玻璃胶处于熔融状态，在玻璃胶熔融后降低加热装置温度，取出涂布有玻璃胶的封装盖板，并将封装盖板与所述待封装盖板对盒，利用激光进行封接。其中，玻璃胶在烧结过程中，随着温度的升高，玻璃胶中的有机物会先燃烧，而有机物燃烧时会使玻璃胶产生内部孔洞，当玻璃胶内部有很多孔洞时，外界的水汽容易侵蚀带有孔洞的玻璃胶，从而使得封装失效。同时，玻璃胶内部存在大量的孔洞会影响显示装置的机械性能。
此外，现有的玻璃胶一般采用丝网印刷的方法进行涂布，而该方法涂布的玻璃胶的表面存在很多毛刺。当所述待封装盖板与封装盖板进行激光封接时，过高的毛刺会撑住所述待封装盖板，从而导致大面积的玻璃胶无法与所述待封装盖板接触，这样便会降低激光封接比例，而激光封接比例的降低容易引起封装失效。
发明内容
本公开内容的实施例提供一种封装材料、封装盖板、烧结设备、烧结方法及显示装置，可改善封装材料表面的毛刺，并减少封装材料内部的孔洞，从而提高封装材料的激光封接比例，改善封装材料的封 装效果。
为达到上述目的，本公开内容的实施例采用如下技术方案：
第一方面，提供一种封装材料，所述封装材料包括流平辅助材料，其中在烧结封装材料时，所述流平辅助材料在受到激发时运动，以使封装材料流平。
优选的，所述流平辅助材料为磁性材料。
进一步优选的，所述磁性材料的居里温度大于所述封装材料的熔融温度。
进一步优选的，所述磁性材料为铁、钴或镍。
进一步优选的，所述磁性材料为铁。
进一步优选的，所述磁性材料为被氧化铁包裹的铁。
进一步优选的，基于所述封装材料的总重量，所述流平辅助材料的含量为5-10重量％。
第二方面，提供一种封装盖板，所述封装区涂布有上述的封装材料。
第三方面，提供一种烧结设备，用于烧结上述的封装盖板，所述烧结设备包括激发装置、加热装置以及基台，其中：所述基台设置有输送区；所述加热装置用于对所述封装盖板进行加热；所述基台用于放置所述封装盖板，所述封装盖板的封装区与所述输送区对应；所述激发装置用于通过所述输送区激发封装材料中的流平辅助材料运动。
优选的，所述激发装置为电磁波发射装置。
优选的，所述输送区的形状和尺寸与所述封装区的形状和尺寸一致。
优选的，所述输送区为密闭沟槽。
第四方面，提供一种烧结方法，包括：将上述的封装盖板放置于上述的烧结设备的基台上，并使所述封装区与所述基台上的输送区对应；控制加热装置温度以使所述封装材料处于熔融状态；开启激发装置，通过基台上的输送区激发封装材料中的流平辅助材料运动。
优选的，所述流平辅助材料为磁性材料；所述激发装置为电磁波发射装置；并且开启激发装置，通过基台上的输送区激发封装材料中的流平辅助材料运动，包括：开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台上的输送区激发磁性材料运动。
进一步优选的，所述输送区为密闭沟槽；开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台上的输送区激发磁性材料运动，包括：开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台上的密闭沟槽激发磁性材料运动。
第五方面，提供一种显示装置，包括待封装盖板、以及通过上述的烧结方法烧结的封装盖板。
优选的，所述待封装盖板上设置有机电致发光结构。
附图说明
为了更清楚地说明本公开内容的实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开内容的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开内容的实施例提供的一种铁被氧化铁包括的结构示意图；
图2为本公开内容的实施例提供的一种封装盖板的结构示意图；
图3(a)为本公开内容的实施例提供的一种烧结设备的结构示意图；
图3(b)为图3(a)中A-A`向的剖视示意图；
图4为本公开内容的实施例提供的一种烧结方法的流程示意图；
图5(a)为本公开内容的实施例提供的封装材料涂布到封装盖板的形貌结构示意图；
图5(b)为本公开内容的实施例提供的封装材料在燃烧过程中的形貌结构示意图；
图5(c)为本公开内容的实施例提供的封装材料在烧结设备中烧 结后的形貌结构示意图；
图6为本公开内容的实施例提供的一种待封装盖板的结构示意图。
具体实施方式
下面将结合本公开内容的实施例中的附图，对本公开内容的实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开内容一部分实施例，而不是全部的实施例。基于本公开内容中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开内容保护的范围。
本公开内容的实施例提供一种封装材料，所述封装材料中包括流平辅助材料，在烧结封装材料时，流平辅助材料用于在受到激发时运动，以使封装材料流平。
需要说明的是，第一，封装材料中包括流平辅助材料，即为，相对通常的封装材料，本公开内容的实施例中的封装材料，还进一步的包括流平辅助材料。
其中，以现有技术中的玻璃胶为例，其一般包括粘合剂、溶剂等，本公开内容提供的封装材料只需在现有的玻璃胶中加入流平辅助材料。
考虑到玻璃胶对水和氧气的阻隔性较好，因而本公开内容的实施例优选封装材料可以是加入流平辅助材料的玻璃胶。
第二，对于封装材料中的流平辅助材料，只要在受到激发时能够运动即可，例如可以是磁性流平辅助材料，即，封装材料中的流平辅助材料在受到电磁波的激发时，便会运动；当然也可以是，光致流平辅助材料或电致流平辅助材料等。
对封装材料中的流平辅助材料的具体含量没有特别限制，只要所述流平辅助材料在受到激发时能够运动即可。然而，为了达到更好的辅助流平效果，基于所述封装材料的总重量，所述流平辅助材料的含量为5-10重量％，更优选5-8重量％，并且最优选5-6重量％。
根据本公开内容的优选实施方案，所述封装材料包含玻璃胶和流平辅助材料，其中基于所述封装材料的总重量，所述流平辅助材料的 含量为5-10重量％。
本公开内容的实施例提供一种封装材料，由于封装材料中包括流平辅助材料，当对封装材料进行烧结并使封装材料处于熔融状态时，若对封装材料进行激发，封装材料中的流平辅助材料便会运动，这样处于流动状态的封装材料受到流平辅助材料的运动作用后会加速流平，尤其是封装材料表面的毛刺和内部的孔洞，封装材料在流动过程中封装材料表面的毛刺会流平，内部的孔洞会被填充。当将该封装材料涂布在封装盖板上，用于使封装盖板和待封装盖板激光封接时，可以提高封装材料的激光封装比例，使得封装材料的封装效果更好。
由于磁性材料在受到激发时，不太容易受封装材料的影响，例如光致流平辅助材料需确保封装材料是透明的，电致流平辅助材料需确保封装材料导电，因而本公开内容的实施例优选流平辅助材料为磁性材料。
此处，需要说明的是，封装材料在烧结时，由于温度较高，为了避免磁性材料在高温时失去磁性，因而需确保封装材料中的磁性材料的居里温度(磁性转变温度)大于封装材料的熔融温度。
其中，磁性材料例如可以是铁(Fe)、钴(Co)、镍(Ni)等。
对磁性材料的形状没有特别限制，只要其可以实现根据本申请的效果即可。然而，优选地，所述磁性材料为直径为4.5至6μm的球形颗粒。
由于铁价格便宜，且铁元素的居里温度较高(铁元素的居里温度较高为770℃)，封装材料例如玻璃胶的烧结温度低于铁的居里温度，即铁元素在封装材料烧结过程中仍可以带有磁性，因而，本公开内容的实施例优选磁性材料为铁。
根据本公开内容的实施例，为了避免铁在高温下发生氧化反应，而失去磁性，因而进一步优选的，如图1所示，封装材料中的磁性材料铁10被氧化铁20包裹。
根据本公开内容的实施例，通过氧化铁20保护铁10，可以防止铁10在高温下发生氧化反应失去磁性，且不会影响封装材料的封装。
根据本公开内容的实施例提供一种封装盖板30，如图2所示， 包括封装区301，封装区301涂布有上述的封装材料。
其中，对于封装盖板30的封装区301的形状和大小，可以根据封装盖板30和待封装盖板的封装需要进行合理设置。
本公开内容的实施例提供一种封装盖板30，由于该封装盖板30的封装区301涂布的封装材料中包括流平辅助材料，当对封装材料进行烧结并使封装材料处于熔融状态时，若对封装区301的封装材料进行激发，封装材料中的流平辅助材料便会运动，这样处于流动状态的封装材料受到流平辅助材料的运动作用后会加速流平，尤其是封装材料表面的毛刺和内部的孔洞，封装材料在流动过程中封装材料表面的毛刺会流平，内部的孔洞会被填充，从而使得涂布有封装材料的封装盖板30与待封装盖板在进行激光封接时，提高了封装材料的激光封装比例，使得封装材料的封装效果更好。
本公开内容的实施例提供一种烧结设备，用于烧结上述的封装盖板30，如图3(a)和图3(b)所示，该烧结设备包括：激发装置40、加热装置(图3(a)和图3(b)中均未示意出加热装置)以及基台50。基台50设置有输送区501。
其中，加热装置，用于对封装盖板30进行加热；基台50，用于放置封装盖板30，封装盖板30的封装区301与输送区501对应；激发装置40，用于通过输送区501激发封装材料中的流平辅助材料运动。
需要说明的是，第一，对于加热装置，以能对封装盖板30上涂布的封装材料进行烧结且温度可以调节为准。
此处，加热装置在对封装盖板30进行加热时，封装材料在温度升高的过程中，由于有机物的燃点较低，因此封装材料中的有机物会先燃烧，继续升高温度，封装材料会处于熔融状态。
第二，对于激发装置40，应根据封装材料中的流平辅助材料进行设置，例如封装材料中的流平辅助材料为磁性材料时，激发装置50可以是能发出电磁波的电磁波发射装置；当封装材料中的流平辅助材料为光致流平辅助材料时，激发装置可以是发光装置。
第三，对于输送区501，可以在整个基台50上均设置，也可以 是如图3(a)或图3(b)所示，在基台50上，仅在与封装区301对应的区域设置。此外，输送区501可以单独地设置在基台50的上方，也可以嵌入基台50内部。
需要说明的是，输送区501是为激发装置40提供通道以使激发封装材料中的流平辅助材料运动，因而输送区501应确保能够对激发装置40例如电磁波发射装置发出的电磁波进行传导并使其保持在输送区501中，由于封装材料的封装区20与输送区501对应，因而当输送区501中有电磁波时，封装材料中的磁性材料在电磁波的作用下便会运动。
进一步地，对于激发装置40例如电磁波发射装置发出的电磁波如何传导到输送区501中不进行限定。
本公开内容的实施例提供一种用于烧结上述封装盖板30的烧结设备，由于该烧结设备中的加热装置可以提供使封装材料熔融的温度环境，将涂布有封装材料的封装盖板30放在基台50上，并使封装盖板30的封装区301与基台50的输送区501对应，当开启激发装置40时，输送区301可以使激发封装材料中的流平辅助材料运动，这样处于流动状态的封装材料受到流平辅助材料的运动作用后会加速流平，尤其是封装材料表面的毛刺和内部的孔洞，封装材料在流动过程中封装材料表面的毛刺会流平，内部的孔洞会被填充，从而使得涂布有封装材料的封装盖板30与待封装盖板在进行激光封接时，提高了封装材料的激光封装比例，使得封装材料的封装效果更好。
优选的，封装盖板30的封装材料中包括磁性材料，激发装置40为电磁波发射装置，电磁波发射装置发射出的电磁波可以使封装材料中的磁性材料运动。
其中，对于电磁波发射装置发射的电磁波的频率，以能使磁性材料进行运动为准。
优选的，输送区501的形状和尺寸与封装区301的形状和尺寸一致。
本公开内容的实施例提供一种烧结设备，输送区501的形状和尺寸与封装区301的形状和尺寸一致，一方面若输送区501过小，可能会导致放置在基台50上的封装盖板30的封装材料中的流平辅助材料 有一部分未受到激发而没有运动，从而导致封装盖板30的封装材料中还存在毛刺和孔洞，另一方面，若输送区501过大，示例的，激发装置40为电磁波发射装置，则输送区501中设置的用于传导电磁波的物质会更多或者用于传导电磁波的输送区501的材料会增加，从而造成浪费。
优选的，如图3(a)和图3(b)所示，输送区501为密闭沟槽。
根据本公开内容的实施例，在基台50上直接形成密闭沟槽，无需在基台50上单独设置输送区501，从而可以简化烧结设备的制作工艺。
本公开内容的实施例提供一种烧结方法，如图4所示，包括：
S100、将上述的封装盖板30放置于上述的烧结设备的基台50上，并使封装区301与基台50上的输送区501对应。
当通过丝网印刷工艺将包括有流平辅助材料例如磁性材料的封装材料60涂布到封装盖板30上时，如图5(a)所示，封装材料60的表面存在毛刺。
S101、控制加热装置温度以使封装盖板30上涂布的封装材料处于熔融状态。
其中，可以根据封装盖板30上涂布的封装材料60熔融点控制加热装置的温度。
控制加热装置温度以对封装材料60进行烧结，在温度升高过程中，由于有机物的熔点较低，因此有机物会先燃烧，此时封装材料60的形貌如图5(b)所示，封装材料60的内部会出现孔洞，继续升高温度，封装材料60会处于熔融状态。
S102、开启激发装置40，通过基台50上的输送区501激发封装材料中的流平辅助材料运动。
开启激发装置50例如电磁波发射装置，由于电磁波发射装置发出的电磁波可以对流平辅助材料例如磁性材料产生相吸或相斥的作用，磁性材料在电磁波的激发作用下开始运动，此时处于流动状态的封装材料60受到磁性材料的运动的作用后可加速流平，尤其是封装60料表面的毛刺和内部的孔洞，如图5(c)所示，封装材料60在流动 过程中封装材料表面的毛刺会流平，内部的孔洞会被填充。
完成封装材料60的熔融后，关闭激发装置40，将加热装置温度降低，取出封装盖板30，以进行封装盖板30和待封装盖板的封装。
本公开内容的实施例提供一种烧结方法，由于该烧结设备中的加热装置可以提供使封装材料熔融的温度环境，将涂布有封装材料的封装盖板30放在基台50上，并使封装盖板30的封装区301与基台50的输送区501对应，当开启激发装置40时，输送区301可以使激发封装材料60中的流平辅助材料运动，这样处于流动状态的封装材料60受到流平辅助材料的运动作用后会加速流平，尤其是封装材料60表面的毛刺和内部的孔洞，封装材料60在流动过程中封装材料60表面的毛刺会流平，内部的孔洞会被填充，从而使得涂布有封装材料60的封装盖板30与待封装盖板在进行激光封接时，提高了封装材料的激光封装比例，使得封装材料的封装效果更好。
优选的，流平辅助材料为磁性材料；激发装置40为电磁波发射装置；开启激发装置40，通过基台5()上的输送区501激发封装材料中的流平辅助材料运动，包括：开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台50上的输送区501激发磁性材料运动。
由于磁性材料在受到激发时，不太容易受封装材料60的材料的影响例如光致流平辅助材料需确保封装材料60是透明的，电致流平辅助材料需确保封装材料60导电，因而本公开内容的实施例优选流平辅助材料为磁性材料。当封装盖板30的封装材料60中包括磁性材料时，激发装置40为电磁波发射装置，电磁波发射装置发出的电磁波通过基台50上输送区501可以激发封装材料60中的磁性材料运动。
进一步优选的，输送区501为密闭沟槽；开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台50上的输送区501激发磁性材料运动，包括：开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台50上的密闭沟槽激发磁性材料运动。
根据本公开内容的实施例，在基台50上直接形成密闭沟槽，而无需在基台50上单独设置输送区501，从而可以简化烧结设备的制作工艺。
本公开内容的实施例提供一种显示装置，包括待封装盖板和通过 上述的烧结设备烧结的封装盖板10。
本公开内容的实施例中，由于通过上述烧结设备烧结的封装盖板10的封装材料70表面的毛刺会流平，内部的孔洞会被填充，因而封装盖板10和待封装盖板在进行激光封接时，封装效果更好，从而使得形成的显示装置具有良好的机械性能。
优选的，如图6所示，待封装盖板70上设置有机电致发结构。
其中，有机电致发光结构包括薄膜晶体管80、阳极90、有机电致发光层100、阴极110，薄膜晶体管80包括源极801、漏极802、有源层803、栅绝缘层804和栅极805，薄膜晶体管80的漏极802与阳极90电连接。
当有机电致发光层100发出的光为白光的情况下，待封装盖板70还可以包括彩膜结构，具体根据实行情况进行设定，在此不再赘述。
本公开内容的实施例提供一种封装材料、封装盖板、烧结设备、烧结方法及显示装置，由于封装材料中包括流平辅助材料，当对封装材料进行烧结并使封装材料处于熔融状态时，若对封装材料进行激发，封装材料中的流平辅助材料便会运动，这样处于流动状态的封装材料受到流平辅助材料的运动作用后会加速流平，尤其是封装材料表面的毛刺和内部的孔洞，封装材料在流动过程中封装材料表面的毛刺会流平，内部的孔洞会被填充。当将该封装材料涂布在封装盖板上，用于使封装盖板和待封装盖板激光封接时，可以提高封装材料的激光封装比例，使得封装材料的封装效果更好。
以上所述，仅为本公开内容的具体实施方式，但本公开内容的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开内容揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开内容的保护范围之内。因此，本公开内容的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种封装材料，所述封装材料包括流平辅助材料，其中在烧结封装材料时，所述流平辅助材料在受到激发时运动，以使封装材料流平。
  2. 根据权利要求1所述的封装材料，其中所述流平辅助材料为磁性材料。
  3. 根据权利要求2所述的封装材料，其中所述磁性材料的居里温度大于所述封装材料的熔融温度。
  4. 根据权利要求2所述的封装材料，其中所述磁性材料为铁、钴或镍。
  5. 根据权利要求4所述的封装材料，其中所述磁性材料为铁。
  6. 根据权利要求2所述的封装材料，其中所述磁性材料为被氧化铁包裹的铁。
  7. 根据权利要求1所述的封装材料，其中基于所述封装材料的总重量，所述流平辅助材料的含量为5-10重量％。
  8. 一种封装盖板，所述封装盖板包括封装区，所述封装区涂布有权利要求1-7任一项所述的封装材料。
  9. 一种烧结设备，用于烧结权利要求8所述的封装盖板，所述烧结设备包括激发装置、加热装置以及基台，其中：
    所述基台设置有输送区；
    所述加热装置用于对所述封装盖板进行加热；
    所述基台用于放置所述封装盖板，所述封装盖板的封装区与所述输送区对应；
    所述激发装置用于通过所述输送区激发封装材料中的流平辅助材料运动。
  10. 根据权利要求9所述的烧结设备，其中所述激发装置为电磁波发射装置。
  11. 根据权利要求9所述的烧结设备，其中所述输送区的形状和尺寸与所述封装区的形状和尺寸一致。
  12. 根据权利要求9所述的烧结设备，其中所述输送区为密闭沟 槽。
  13. 一种烧结方法，所述烧结方法包括：
    将权利要求8所述的封装盖板放置于权利要求9-12任一项所述的烧结设备的基台上，并使所述封装区与所述基台上的输送区对应；
    控制加热装置温度以使所述封装盖板上涂布的封装材料处于熔融状态；和
    开启激发装置，通过基台上的输送区激发封装材料中的流平辅助材料运动。
  14. 根据权利要求13所述的烧结方法，其中所述流平辅助材料为磁性材料；所述激发装置为电磁波发射装置；并且
    开启激发装置，通过基台上的输送区激发封装材料中的流平辅助材料运动，包括：开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台上的输送区激发磁性材料运动。
  15. 根据权利要求14所述的烧结方法，其中所述输送区为密闭沟槽；并且
    开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台上的输送区激发磁性材料运动，包括：开启电磁波发射装置，以使电磁波发射装置发出的电磁波通过基台上的密闭沟槽激发磁性材料运动。
  16. 一种显示装置，所述显示装置包括待封装盖板、以及通过权利要求13-15任一项所述的烧结方法烧结的封装盖板。
  17. 根据权利要求16所述的显示装置，其中所述待封装盖板上设置有机电致发光结构。
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